JP2008182041A - Mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting device in which line length is shortened. <P>SOLUTION: The mounting device which press-fits a component to a side part of a substrate conveyed along a prescribed direction is provided with a table for holding and positioning the substrate and an attaching unit 2 and an actual press-fitting unit 4, which are long along one direction where the component is press-fitted to the side part of the substrate positioned by the table. The attaching unit and the actual press-fitting unit are arranged in such a way that a longitudinal direction crosses a conveyance direction of the substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an anisotropic conductive member and a mounting apparatus for mounting a component such as an electronic component via the anisotropic conductive member on a substrate such as a liquid crystal display panel.

  For example, in the process of assembling a substrate such as a display panel, electronic parts such as TCP (Tape Carrier Package) and FPC (Flexible Printed Circuit) are mounted on the side of the substrate via a tape-like anisotropic conductive member. That is done.

  In the mounting apparatus for mounting the anisotropic conductive member or the electronic component as a component on the side portion of the substrate, a loader unit, a sticking unit, a temporary pressure bonding unit, a main pressure bonding unit, and an unloader unit are sequentially arranged in a line. The

  The loader unit stores a substrate on which the anisotropic conductive member and the electronic component are not mounted, and the sticking unit is attached to the side of the substrate supplied from the loader unit. Stick the member.

  The temporary press-bonding unit temporarily press-bonds the electronic component to the side portion of the substrate on which the anisotropic conductive member is attached, and the main press-bonding unit pressurizes and heats the temporarily pressed electronic component, The anisotropic conductive member is melt-cured and the electronic component is finally pressure-bonded to the side portion of the substrate. Such a mounting apparatus is shown in Patent Document 1.

  The adhering unit, provisional pressure bonding unit and main pressure bonding unit as a mounting unit are a backup tool which receives the lower surface of the side portion of the substrate, and is driven vertically by the backup tool by the backup tool of the substrate. And a pressurizing tool that pressurizes the supported side portion.

  The adhering unit and the main crimping unit are adapted to crimp the anisotropic conductive member over substantially the entire length of the side portion of the substrate, or to simultaneously crimp a plurality of electronic components temporarily crimped to the side portion. It has become.

  Among the mounting units, the adhering unit and the main crimping unit are capable of pressing the entire length of the side portion of the substrate by the backup tool and the pressing tool driven in the vertical direction with respect to the backup tool. It is set to length.

  Therefore, the back-up tool and the pressurizing tool of the adhering unit and the main press-bonding unit need to be long enough to press the entire length of the side part of the substrate at one time. It was unavoidable.

  A table for delivering the substrate from the upstream unit to the downstream unit is arranged on the front side of each unit arranged in a row. In the adhering unit, temporary crimping unit, and final crimping unit, the table that receives the substrate from the upstream unit moves to a position facing the downstream unit, and then moves backward in the front-rear direction approaching each unit. After being driven, the side portion on which the anisotropic conductive member or electronic component of the substrate held on the table is mounted is positioned between the backup tool and the pressure tool.

  Next, after the pressure tool is lowered and an anisotropic conductive member or electronic component is mounted on the side of the substrate, the table is driven forward to receive the substrate on the table of the downstream unit. It is supposed to pass.

That is, the substrate is driven in the arrangement direction of the units arranged in a row by the table and in the front-rear direction orthogonal to the arrangement direction, and the sticking unit, the temporary pressure bonding unit, and the main pressure bonding unit are sequentially conveyed.
JP 2003-59975 A

  When the substrate transported to the position facing each unit is driven in the front-rear direction perpendicular to the arrangement direction of these units and its side is positioned between the backup tool and the pressure tool, the side In order to enable easy positioning of the parts in a short time, the adhering unit and the main crimping unit are arranged along the arrangement direction of each unit in which the longitudinal directions thereof are arranged in a row. I was doing.

  When the longitudinal direction of these units (lines) is arranged along the arrangement direction of each unit, the entire line length becomes long. Therefore, the space required for installing the mounting apparatus may be lengthened. In particular, recently, since the substrate tends to increase in size, the lengthening of the line becomes remarkable.

  Moreover, the substrate must be transported to the downstream unit while being driven not only in the transport direction along the longitudinal direction of the line by the table but also in the front-rear direction perpendicular to the transport direction. In other words, it may be a factor in reducing productivity.

  It is an object of the present invention to provide a mounting apparatus that can shorten the time required for transporting a substrate as well as not increasing the line length.

The present invention is a mounting device for crimping a component to a side portion of a substrate conveyed along a predetermined direction,
A table for holding and positioning the substrate;
A mounting unit having a long shape along one direction for crimping the component on the side portion of the substrate positioned by the table,
The mounting unit is provided in a mounting apparatus, the longitudinal direction of which is arranged along a direction intersecting the transport direction of the substrate.

The mounting unit includes a backup tool that receives a side portion of the substrate, and a pressing tool that is driven in a vertical direction to contact and separate from the backup tool,
It is preferable that the substrate is transported between the backup tool and the pressing tool and supplied to the table.

The present invention is a mounting apparatus for crimping an electronic component to a side portion of a substrate conveyed along a predetermined direction via an anisotropic conductive member,
A sticking unit having a long shape along one direction for crimping the anisotropic conductive member to the side portion of the substrate positioned by the sticking table;
A temporary crimping table for receiving and positioning the substrate on which the anisotropic conductive member is crimped with the bonding unit;
A temporary crimping unit for temporarily crimping the electronic component to the side portion of the substrate positioned by the temporary crimping table;
A main crimping table for receiving and positioning the substrate on which the electronic component is temporarily crimped by the temporary crimping unit;
A main press unit having a long shape along one direction for main press-bonding the electronic component of the substrate positioned by the main press-bonding table,
The adhering unit, the temporary pressure bonding unit, and the main pressure bonding unit are arranged in a line, and the adhering unit and the main pressure bonding unit are arranged with the longitudinal direction crossing the transport direction of the substrate. It is in the mounting apparatus characterized by being performed.

The adhering unit, the temporary crimping unit, and the final crimping unit have a backup tool that receives a side portion of the substrate, and a pressing tool that is driven in a vertical direction to contact and separate from the backup tool,
Among the bonding unit, the temporary pressure bonding unit, and the main pressure bonding unit, at least the bonding unit and the main pressure bonding unit deliver the substrate through the backup tool and the pressure tool of each unit. Means are preferably provided.

  The delivery means is a linear guide provided along the arrangement direction of the units, a movable body provided to be drivable along the linear guide, and held on an upstream table provided on the movable body. It is preferable that the transfer arm is configured to receive a substrate and transfer it to a downstream table.

  According to this invention, since the mounting unit having a long shape along one direction such as the adhering unit or the main pressure bonding unit is arranged along the direction in which the longitudinal direction intersects the transport direction of the substrate, The line length of the mounting apparatus can be shortened.

  In addition, if the substrate is transported between the backup tool and the pressure tool of the mounting unit, it is only necessary to transport the substrate linearly along the line, so that the time required for transportation can be shortened.

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a plan view showing a schematic configuration of a mounting apparatus according to an embodiment of the present invention. The mounting apparatus includes a loader unit 1, a sticking unit 2, a provisional pressure bonding unit 3, a main pressure bonding unit 4, and an unloader unit. 5 are arranged in a row on a rectangular base board 6 shown in FIG.

  In the loader unit 1, a substrate W formed by bonding two glass plates used for a liquid crystal display panel by a bonding apparatus (not shown) in a previous process is transported by a robot (not shown), and is vertically moved. Are stored at predetermined intervals.

  The board | substrate W stored in the said loader unit 1 is supplied to the sticking table 11 of the said sticking unit 2 by the delivery means 9 mentioned later. The sticking table 11 is driven in the X, Y, θ, and Z directions, and the sticking unit 2 is arranged on the upper surface of the one side portion of the substrate W that is positioned. The tape-like anisotropic conductive member 12 is pressure-bonded with a length over the entire length. FIG. 6A shows a state where the anisotropic conductive member 12 is attached to one side of the substrate W. FIG.

  The substrate W to which the anisotropic conductive member 12 is pressure bonded is supplied to the temporary pressure bonding table 13 of the temporary pressure bonding unit 3 by the delivery means 9. The temporary crimping table 13 is driven in the X, Y, θ, and Z directions, and the temporary crimping unit 3 is one in which the anisotropic conductive member 12 of the positioned substrate W is adhered. As shown in FIG. 6B, a plurality of electronic components 14 such as TCP are temporarily bonded to the side portions one by one at a predetermined interval.

  The substrate W on which the electronic component 14 has been temporarily crimped is supplied to the final crimping table 16 of the final crimping unit 4 by the delivery means 9. The main press-bonding table 16 is driven in the X, Y, θ, and Z directions, and the main press-bonding unit 4 includes a plurality of electronic components that are temporarily press-bonded to one side portion of the positioned substrate W. 14 is pressurized and heated so as to be subjected to final pressure bonding at a time.

  The affixing table 11, the temporary crimping table 13 and the final crimping table 16 are formed smaller than the substrate W as shown in FIG. The table 11, 13, 16 protrudes outward from the peripheral edge.

  The adhering unit 2, the provisional pressure bonding unit 3, and the main pressure bonding unit 4 have backup tools 2a, 3a, and 4a, respectively, as shown in FIGS. Above the backup tools 2a, 3a, 4a, a gate-shaped frame 15 is provided across the backup tools 2a, 3a, 4a, and a Z drive such as a cylinder is provided at the center of the upper side of the frame 15. A source 17 is provided.

  Pressurizing tools 2b, 3b, 4b are attached to the drive shaft 17a of the Z drive source 17. As a result, the pressurizing tools 2b, 3b, 4b are driven in the vertical direction by the Z drive source 17.

  The back-up tools 2a and 4a and the pressurizing tools 2b and 4b of the sticking unit 2 and the main crimping unit 4 are substantially equivalent to the side portions of the substrate W on which the electronic component 14 is mounted as shown in FIG. It is formed in a shape having a length, that is, a long shape along one direction, and the longitudinal direction thereof is arranged along the direction intersecting the transport direction of the substrate W transported by the delivery means 9. ing.

  Since the backup tool 3a and the pressing tool 3b of the temporary crimping unit 3 temporarily crimp the plurality of electronic components 14 to the substrate W one by one, as shown in FIG. Is set to a large length dimension.

  The backup tool 3a of the temporary crimping unit 3 is provided with a receiving portion 18a at the lower end, and the receiving portion 18a is movably engaged with a linear guide 18b provided on the base board 6 along the front-rear direction. .

  The linear guide 18b is provided with an electromagnetic coil (not shown), and the receiving portion 18a is formed of a permanent magnet that constitutes a linear motor with the electromagnetic coil. Thereby, the backup tool 3a can be driven along the front-rear direction of the base board 6 as shown by a chain line in FIG.

  A pair of linear guides 19 a are provided on the upper surface of the gantry 15 along the longitudinal direction. A receiving portion 19b is movably engaged with the linear guide 19a. The linear guide 19a is provided with an electromagnetic coil (not shown), and the receiving portion 19b is formed of a permanent magnet that constitutes a linear motor with the electromagnetic coil.

  The receiving portion 19b is provided with the Z drive source 17. The drive shaft 17 a of the Z drive source 17 is passed through an insertion groove 20 formed along the longitudinal direction of the upper side of the gantry 15. Thereby, the Z drive source 17 is driven along the longitudinal direction of the upper surface of the gantry 15. That is, the backup tool 3 a and the pressurizing tool 3 b of the provisional pressure bonding unit 3 are driven along the front-rear direction of the base board 6.

  As shown in FIG. 2, the delivery means 9 has a pair of linear guides 21 laid on the upper surfaces of both end portions in the front-rear direction of the base board 6 over almost the entire length in the longitudinal direction. The linear guide 21 includes a pair of first to fourth movable bodies 22 to 25 that are provided at both ends in the longitudinal direction of the lower end so that the pair of receiving members 26 can be moved to the linear guide 21. It is provided to be engaged.

  The linear guide 21 is provided with an electromagnetic coil (not shown), and the receiving member 26 is provided with a permanent magnet (not shown). The electromagnetic coil and the permanent magnet constitute a linear motor. Thereby, the first to fourth movable bodies 22 to 25 can be driven in the direction along the linear guide 21 independently by a control device (not shown).

  Each of the movable bodies 22 to 25 is formed to have a width dimension substantially the same as the length of a pair of side portions located at both ends of one side portion on which the electronic component 14 of the substrate W is mounted. As shown in FIG. 5, concave portions 27 are formed at both ends in the width direction so as to open to the upper end surfaces. Each recess 27 is provided with a transfer arm 28 having one end rotatably connected by a support shaft 29.

  A rotary actuator 31 is connected to a support shaft 29 on which one end of the transfer arm 28 is supported. The rotary actuator 31 can be rotated between a retraction angle in which the transfer arm 28 is vertically laid down and a transfer angle in which the transfer arm 28 is erected horizontally.

  A suction pad 32 connected to a suction source (not shown) is provided on the upper surface when the transfer arm 28 is erected horizontally. Then, by raising the transfer arm 28 at a horizontal transfer angle, the suction pad 32 causes the lower surface of the both sides of the substrate W stored in the stocker 1 a of the loader unit 1 and the tables 11, 13, 16 to be mounted. The lower surfaces of a pair of opposite side portions of the substrate W held and protruded from the tables 11, 13 and 16 can be sucked and held.

  The pair of first movable bodies 22 holds the substrate W stored in the loader unit 1 by the transfer arm 28 upright at the transfer angle, and the substrate W is added to the backup tool 2 a of the sticking unit 2. It conveys to the said sticking unit 2 through between pressure tools 2b.

  The board | substrate W conveyed by the sticking unit 2 is delivered to the said sticking table 11 from the said 1st movable body 22 because the said sticking table 11 is driven to the raise direction of a Z direction. The sticking table 11 that has received the substrate W is positioned on one side between the backup tool 2a and the pressurizing tool 2a of the sticking unit 2, and is then driven downward in the Z direction to be on one side of the substrate W. The lower surface of the part is supported on the upper end surface of the backup tool 2a.

  An anisotropic conductive member 12 is supplied to the upper surface of one side of the positioned substrate W. Next, the anisotropic conductive member 12 is attached to the upper surface of one side portion of the substrate W as shown in FIG. 6A by driving the pressing tool 2a in the downward direction.

  When the anisotropic conductive member 12 is attached, the second movable body 23 is driven, and the transfer arm 28 erected at the transfer angle of the second movable body 23 is held by the sticking table 11. It is positioned on the lower surface of both sides in the width direction of the substrate W.

  Next, when the sticking table 11 is driven downward in the Z direction, the substrate W to which the anisotropic conductive member 12 is stuck is transferred from the sticking table 11 to the transport arm 28 of the second movable body 23. Is passed on.

  The second movable body 23 that has received the substrate W conveys the substrate W through the space between the backup tool 3 a and the pressurizing tool 3 b of the temporary press-bonding unit 3, and positions it above the temporary press-bonding table 13. Next, the temporary crimping table 13 is driven in the upward direction so that the substrate W is transferred from the second movable body 23 to the temporary crimping table 13.

  The substrate W delivered to the temporary crimping table 13 is positioned between the backup tool 3a and the pressing tool 3b of the temporary crimping unit 3 at one side where the anisotropic conductive member 12 is adhered. When the temporary press-bonding table 13 is driven downward in the Z direction, the lower surface of one side thereof is positioned at substantially the same height as the upper end surface of the backup tool 3a.

  The backup tool 3a and the pressurizing tool 3b of the provisional pressure bonding unit 3 can be driven along the front-rear direction of the base board 6, which is the longitudinal direction of one side of the substrate W, as indicated by a chain line in FIG. Accordingly, the backup tool 3a and the pressing tool 3b are driven on the upper surface of one side portion of the substrate W along the longitudinal direction of the one side portion of the substrate W, and positioned at a predetermined position. As shown in (b), a plurality of electronic components 14 are temporarily pressure-bonded sequentially on the upper surface of the one side portion.

The electronic component 14 is supplied by a supply means (not shown) before being temporarily press-bonded to the substrate W, and is sucked and held by the pressing tool 3b.
The substrate W on which the plurality of electronic components 14 are temporarily press-bonded on the upper surface of one side is transferred from the temporary press-bonding table 13 to the transport arm 28 of the third movable body 24. Upon receipt of the substrate W, the third movable body 24 transports the substrate W through between the backup tool 4a and the pressurizing tool 4b of the main crimping unit 4, and the main crimping table 16 of the main crimping unit 4. To hand.

  Also in this case, the main press-bonding table 16 is driven upward in the Z direction, so that the substrate W held by the transfer arm 28 of the third movable body 24 is transferred to the main press-bonding table 16.

  The main crimping table 16 that has received the substrate W on which the electronic component 14 has been temporarily crimped is positioned at one side between the backup tool 4a and the pressing tool 4b and driven downward in the Z direction. Thereby, the lower surface of one side of the substrate W is supported by the upper end surface of the backup tool 4a.

  Next, the pressing tool 4b is driven in the downward direction. Thereby, the plurality of electronic components 14 temporarily press-bonded to the upper surface of one side of the substrate W are pressurized and heated at once by the pressing tool 4b, so that the anisotropic conductive member 12 is melt-cured and the electronic components are heated. 14 is finally crimped.

  Then, the substrate W on which the electronic component 14 is finally pressure bonded by the main pressure bonding unit 4 is transferred from the main pressure bonding table 16 to the transport arm 28 of the fourth movable body 25. The fourth movable body 25 that has received the substrate W transports the substrate W to the unloader unit 5 and accumulates it in the stocker 5a.

  The first to fourth movable bodies 22 to 25 are controlled in synchronism with each other in order to prevent the adjacent movable bodies 22 and 23 and 23 and 24 and 24 and 25 from colliding with each other on the linear guide 21. It has come to be. That is, the first to fourth movable bodies 22 to 25 are driven in the same direction at the same timing.

  According to the mounting apparatus having such a configuration, the sticking unit 2, the provisional pressure bonding unit 3, and the main pressure bonding unit 4 have the backup tools 2a, 3a, 4a and the pressure tools 2b, 3b, 4b in the longitudinal direction. The first to fourth movable bodies 22 to 25 are arranged along the front-rear direction of the mounting apparatus perpendicular to the transport direction of the substrate W transported by the first to fourth movable bodies 22 to 25.

  Therefore, even if the adhering unit 2, the provisional pressure bonding unit 3 and the main pressure bonding unit 4 are arranged in a line, the longitudinal direction of each of these backup tools 2a, 3a, 4a and pressure tools 2b, 3b, 4b is the same as that of the substrate W. The line length, which is the length dimension of the mounting apparatus, can be sufficiently shortened as compared with the case where it is arranged along the transport direction. As a result, the length of the space required for installing the mounting apparatus can be sufficiently shortened.

  The transfer means 9 for transferring the substrate W from the upstream unit to the downstream unit is provided along a pair of linear guides 21 laid over the entire length in the longitudinal direction at both longitudinal ends of the base board 6, and along the linear guides 21. It is comprised by the 1st thru | or 4th movable body 22-25 driven by this.

  That is, the delivery means 9 is not provided between adjacent units, but is provided using a space in the front-rear direction perpendicular to the longitudinal direction of the base board 6, which is the front-rear direction of each unit. In addition, the line length of the mounting apparatus can be shortened as compared with the case where the transfer means 9 is provided between adjacent units.

  The delivery means 9 transports the substrate W through between the backup tools 2a, 3a, 4a and the pressure tools 2b, 3b, 4b of the adhering unit 2, the temporary crimping unit 3 and the main crimping unit 4. .

  Therefore, the substrate W can be transported between the units only by linearly transporting the substrate W along the arrangement direction of each unit, and transported in the front-rear direction of the base board 6 of the mounting apparatus orthogonal to the transport direction. You don't have to do it.

  Accordingly, when the substrate W is transferred to the downstream unit, the arrangement direction of each unit, which is the longitudinal direction of the line (longitudinal direction of the base board 6) as in the conventional case, and the front-rear direction perpendicular to the arrangement direction Therefore, it is not necessary to carry out positioning while positioning in both directions, so that the time required for carrying and positioning the substrate W can be shortened as compared with the prior art.

  In the above embodiment, the substrate is transferred between the units by driving the movable body having the transfer arm along the longitudinal direction of the base board, but the rail is provided above the base board. A transport arm may be provided along the rail so as to be able to be driven, so that the substrate is sequentially transported to a downstream unit.

  The sticking unit, the temporary pressure bonding unit, and the main pressure bonding unit may each be provided with two sets of backup tools and pressure tools. Then, the two substrates are sequentially supplied from the loader unit to the adhering unit, and the anisotropic conductive member is adhering to these substrates at the same time, and then the two substrates are sequentially supplied to the temporary pressure bonding unit. At the same time, electronic components are temporarily crimped onto the substrate. Next, after the two substrates are sequentially supplied to the main pressure bonding unit, the electronic components of these substrates are simultaneously main pressure bonded, and then the two substrates are sequentially carried out to the unloader unit.

  By doing so, it becomes possible to simultaneously mount anisotropic conductive members and electronic components on two substrates in one line, so that productivity can be improved.

  The backup tool and pressure rule of the temporary crimping unit are shorter in length than the backup tool and pressure rule of the adhering unit and main crimping unit, but the width direction (longitudinal direction) is orthogonal to the substrate transport direction. If it is arranged along the direction, the line length can be slightly reduced.

  However, the degree of placement of the backup tool and the pressure rule in the temporary crimping unit contributes to the reduction of the line length. Therefore, the direction of placement of the backup tool and the pressure rule is always orthogonal to the substrate transport direction. It is not something that must be placed along the direction of the movement.

Explanatory drawing which shows the structure of the mounting apparatus of one embodiment of this invention. The top view which shows schematic structure of the mounting apparatus shown in FIG. The figure which shows the backup tool and pressurization tool of a sticking unit and this crimping | compression-bonding unit. The figure which shows the backup tool and pressurization tool of a temporary crimping | compression-bonding unit. The figure which shows the movable body of each unit, a backup tool, and a pressurization tool. (A) is the figure which affixed the anisotropic conductive member to the one side part of a board | substrate, (b) is the figure which mounted the several electronic component in the one side part of the board | substrate with which the anisotropic conductive member was affixed.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Loader unit, 2 ... Adhesion unit, 3 ... Temporary pressure bonding unit, 4 ... This pressure bonding unit, 5 ... Unloader unit, 9 ... Delivery means, 11 ... Adhesion table, 12 ... Anisotropic conductive member, 13 ... Temporary Crimping table, 14 ... electronic component, 16 ... final crimping table, 22 ... first movable body, 23 ... second movable body, 24 ... third movable body, 25 ... fourth movable body, 28 ... Transfer arm.

Claims (5)

A mounting device for crimping a component to a side portion of a substrate conveyed along a predetermined direction,
A table for holding and positioning the substrate;
A mounting unit having a long shape along one direction for crimping the component on the side portion of the substrate positioned by the table,
The mounting unit is arranged such that a longitudinal direction thereof is arranged along a direction intersecting a transport direction of the substrate. The mounting unit includes a backup tool that receives a side portion of the substrate, and a pressing tool that is driven in a vertical direction to contact and separate from the backup tool,
The mounting apparatus according to claim 1, wherein the substrate is transported between the backup tool and the pressing tool and supplied to the table. A mounting device that crimps an electronic component to the side portion of a substrate conveyed along a predetermined direction via an anisotropic conductive member,
A sticking unit having a long shape along one direction for crimping the anisotropic conductive member to the side portion of the substrate positioned by the sticking table;
A temporary crimping table for receiving and positioning the substrate on which the anisotropic conductive member is crimped with the bonding unit;
A temporary crimping unit for temporarily crimping the electronic component to the side portion of the substrate positioned by the temporary crimping table;
A main crimping table for receiving and positioning the substrate on which the electronic component is temporarily crimped by the temporary crimping unit;
A main press unit having a long shape along one direction for main press-bonding the electronic component of the substrate positioned by the main press-bonding table,
The adhering unit, the temporary pressure bonding unit, and the main pressure bonding unit are arranged in a line, and the adhering unit and the main pressure bonding unit are arranged with the longitudinal direction crossing the transport direction of the substrate. The mounting apparatus characterized by being made. The adhering unit, the temporary crimping unit, and the final crimping unit have a backup tool that receives a side portion of the substrate, and a pressing tool that is driven in a vertical direction to contact and separate from the backup tool,
Among the bonding unit, the temporary pressure bonding unit, and the main pressure bonding unit, at least the bonding unit and the main pressure bonding unit deliver the substrate through the backup tool and the pressure tool of each unit. 5. The mounting apparatus according to claim 4, wherein means are provided.   The delivery means is a linear guide provided along the arrangement direction of the units, a movable body provided to be drivable along the linear guide, and held on an upstream table provided on the movable body. The mounting apparatus according to claim 4, further comprising: a transfer arm that receives the substrate and transfers it to a downstream table.

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