TWI738353B - Electronic device - Google Patents

Abstract

An electronic device including a support, a motherboard, a heat dissipation base, a heat dissipation pad and a heat sink. Motherboard includes a plate and a heat source. Heat source is disposed on the plate and the plate is disposed on the support. Heat dissipation base is in thermal contact with a side of the heat source located away from the plate. Heat dissipation pad includes a first portion and a second portion. First portion and second portion are disposed on heat dissipation base. Heat sink is stacked on the heat dissipation pad so that first portion and second portion are clamped by heat dissipation base and heat sink so as to be pressed. First portion of heat dissipation pad and second portion of heat dissipation pad are spaced apart from each other by a gap.

Description

Electronic device

The present invention relates to an electronic device, and more particularly to an electronic device including a heat dissipation pad.

Generally speaking, a heat source (such as a central processing unit) on a circuit board generates a lot of waste heat. Therefore, the heat source is often provided with heat dissipation fins, so as to dissipate the waste heat generated by the heat source through the assistance of the heat dissipation fins. In addition, since the height of the heat source relative to the circuit board body is generally lower than that of other electronic components relative to the circuit board body, the heat sink fins are likely to interfere with other electronic components during the process of mounting the heat sink fins on the heat source. The heat sink fins are difficult to install on the heat source.

Therefore, some manufacturers install the heat source and other electronic components on opposite sides of the circuit board body to facilitate the installation of the heat sink fins on the heat source. Of course, this arrangement of the heat source will cause the circuit board to consume more costs in the design of wiring and so on. In view of this, there are still some manufacturers that place the heat source and other electronic components on the same side of the circuit board body, and additionally install heat sinks and heat sinks that connect the heat source and the fins to compensate for the height difference between the heat source and other electronic components. .

However, in the case where the heat sink and the heat sink fins clamp the heat sink in a tighter manner, the heat source needs to bear a greater pound force. In the case that the heat sink and the heat sink fins clamp the heat sink in a less tight manner, although the heat source can withstand the smaller But the heat source is difficult to effectively dissipate heat through the heat sink, heat sink and heat sink fins. In other words, when the heat source and other electronic components are located on the same side of the circuit board body, it is difficult to reduce the pound force that the heat source has to bear while maintaining the efficiency of the heat source to dissipate heat through the heat sink, heat sink and heat sink fins.

The present invention is to provide an electronic device to reduce the pound force of the heat source while maintaining the heat dissipation pad and the heat dissipation fins to assist the heat source to dissipate heat.

The electronic device disclosed in an embodiment of the present invention includes a supporting base, a main circuit board, a heat sink, a heat dissipation pad, and a heat dissipation frame. The main circuit board includes a main circuit board body and a heat source. The heat source is arranged on the main circuit board body and the main circuit board body is arranged on the supporting base. The heat sink is in thermal contact with the side of the heat source away from the main circuit board body. The thermal pad includes a first part and a second part. The first part and the second part are arranged on the heat sink. The heat sink is stacked on the heat sink so that the first part and the second part of the heat sink are sandwiched between the heat sink and the heat sink to be compressed. A gap is maintained between the first part of the heat dissipation pad and the second part of the heat dissipation pad.

An electronic device disclosed in another embodiment of the present invention includes a carrier, a main circuit board, a heat dissipation pad, and a heat dissipation frame. The main circuit board includes a main circuit board body and a heat source. The heat source is arranged on the main circuit board body and the main circuit board body is arranged on the supporting base. The thermal pad includes a first part and a second part. The first part and the second part are arranged on the side of the heat source away from the main circuit board body. The heat dissipation frame is stacked on the heat dissipation pad so that the first part and the second part of the heat dissipation pad are sandwiched between the heat source and the heat dissipation frame to be compressed. A gap is maintained between the first part of the heat dissipation pad and the second part of the heat dissipation pad.

According to the electronic device disclosed in the above embodiment, since a gap is maintained between the first part of the heat dissipation pad and the second part of the heat dissipation pad, the heat dissipation pad can transmit less pound force to the Heat source. In this way, by separating the different parts of the heat dissipation pad with a gap, the pound force of the heat source can be reduced while maintaining the efficiency of the heat dissipation pad assisting the heat source to dissipate heat.

10: Electronic device

100: bearing seat

200: main circuit board

201: main circuit board body

202: heat source

300, 300a, 300b, 300c, 300d: heat sink

301: Bottom

302, 302a, 302b, 302c, 302d: top surface

400, 400a, 400b, 400c, 400d: heat sink

401, 401a, 401b, 401c, 401d: part one

402, 402a, 402b, 402c, 402d: Part Two

403, 403a, 403b, 403c: part three

404, 404a, 404b, 404c: Part Four

405a, 405b, 405c: part five

406a, 406b, 406c: Part 6

407b, 407c: Part 7

408b, 408c: Part 8

409b, 409c: Part Nine

410c: part ten

420d: Connection part

450, 450a, 450b, 450c, 450d: gap

500: heat sink

T1: Compressed thickness

T2: Original thickness

W1: width

P1, P1a, P1b, P1c: the first projection

P2, P2a, P2b, P2c: second projection

P3, P3a, P3b, P3c: third projection

P4, P4a, P4b, P4c: the fourth projection

P5, P5a, P5b, P5c: the fifth projection

P6a, P6b, P6c: sixth projection

P7a, P7b, P7c: the seventh projection

P8b, P8c: Eighth projection

P9b, P9c: Ninth projection

P10b, P10c: Tenth projection

P11c: Eleventh projection

L, La, Lb, Lc: outer contour line

Fig. 1 is a perspective view of an electronic device according to a first embodiment of the invention.

FIG. 2 is a schematic side sectional view of the electronic device in FIG. 1.

Fig. 3 is an exploded view of the electronic device in Fig. 2.

4 is a top view of the heat dissipation base and the heat dissipation pad of the electronic device in FIG. 1.

5 is a top view showing the projection of the heat dissipation pad of the electronic device in FIG. 1 on the top surface of the heat dissipation base.

Fig. 6A is a top view of a heat dissipation seat and a heat dissipation pad according to a second embodiment of the present invention.

FIG. 6B is a top view showing the projection of the heat dissipation pad in FIG. 6A on the top surface of the heat dissipation base.

Fig. 7A is a top view of a heat dissipation seat and a heat dissipation pad according to a third embodiment of the present invention.

FIG. 7B is a top view showing the projection of the heat dissipation pad in FIG. 7A on the top surface of the heat dissipation base.

Fig. 8A is a top view of a heat dissipation seat and a heat dissipation pad according to a fourth embodiment of the present invention.

FIG. 8B is a top view showing the projection of the heat dissipation pad in FIG. 8A on the top surface of the heat dissipation base.

Fig. 9 is a top view of a heat dissipation seat and a heat dissipation pad according to a fifth embodiment of the present invention.

The following describes the detailed features and advantages of the embodiments of the present invention in detail in the implementation manners, and the content is sufficient to enable anyone with ordinary knowledge in the art to understand the technical content of the embodiments of the present invention and implement them accordingly, and is disclosed in accordance with this specification. With the content, scope of patent application and drawings, anyone with ordinary knowledge in the field can easily understand the related purposes and advantages of the present invention. The following examples further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention by any viewpoint.

Please refer to Figure 1 to Figure 2. Fig. 1 is a perspective view of an electronic device according to a first embodiment of the invention. FIG. 2 is a schematic side sectional view of the electronic device in FIG. 1.

In this embodiment, the electronic device 10 includes a supporting base 100, a main circuit board 200, a heat dissipation base 300, a heat dissipation pad 400 and a heat dissipation frame 500.

The main circuit board 200 includes a main circuit board body 201 and a heat source 202. The heat source 202 is disposed on the main circuit board body 201 and the main circuit board body 201 is disposed on the supporting base 100. In this embodiment, the heat source 202 is, for example, a central processing unit (CPU) of the model Intel® Celeron® G4900T, and the heat source 202 is disposed on the main circuit board together with other electronic components such as memory and hard disk. The same side of 201.

The heat sink 300 has a bottom surface 301 and a top surface 302 opposite to each other. The bottom surface 301 is in thermal contact with the side of the heat source 202 away from the main circuit board body 201. In addition, in this embodiment, the heat sink 300 is fixed to the main circuit board body 201, but it is not limited to this. In other embodiments, the heat sink can also be fixed to the carrier.

Please refer to Figure 2, Figure 3 and Figure 4. Fig. 3 is an exploded view of the electronic device in Fig. 2. 4 is a top view of the heat dissipation base and the heat dissipation pad of the electronic device in FIG. 1.

In this embodiment, the thermal pad 400 includes a first part 401, a second part 402, a third part 403, and a fourth part 404. The first part 401, the second part 402, the third part 403 and the fourth part 404 are disposed on the top surface 302 of the heat sink 300. In other words, the first part 401, the second part 402, the third part 403 and the fourth part 404 are arranged on the side of the heat sink 300 away from the heat source 202.

In addition, as shown in FIG. 4, the first part 401, the second part 402, the third part 403, and the fourth part 404 are arranged side by side in a two-by-two array on the top surface 302 of the heat sink 300. Spaced apart from each other through a gap 450. Through the design of the gap 450, the heat dissipation pad 400 can maintain the heat conduction efficiency of the heat dissipation pad 400 while reducing the pound force borne by the heat source 202.

As shown in FIG. 2, the heat dissipation frame 500 is stacked on the heat dissipation pad 400 so that the first part 401, the second part 402, the third part 403 and the fourth part 404 of the heat dissipation mat 400 are sandwiched between the heat dissipation base 300 The top surface 302 and the heat dissipation frame 500 are compressed between the top surface 302 and the heat dissipation frame 500, thereby having a compressed thickness T1. In this embodiment, the heat dissipation frame 500 is made of, for example, aluminum extrusion.

In this embodiment, the heat sink 500 is fixed and thermally contacted with the supporting base 100 to form the housing of the electronic device 10 together with the supporting base 100, but it is not limited to this. In other embodiments, the heat sink does not need to be fixed and is in thermal contact with the supporting base, and the supporting base and other components together constitute the housing of the electronic component, that is, the heat sink may also be accommodated in the housing.

In addition, the height of the heat sink 300 can also be adjusted according to the height of the heat source 202, without the need to spend too much cost to re-fabric the heat sink 500.

As shown in FIGS. 2 and 3, the first part 401, the second part 402, the third part 403, and the fourth part 404 of the heat dissipation pad 400 have an original thickness T2 greater than the compressed thickness T1, and the original thickness T2 The difference between the thickness T1 and the compressed thickness T1 is between 30% and 50% of the original thickness T2, for example, 30% in this embodiment. Through the aforementioned compression mechanism, the heat transfer efficiency of the heat dissipation pad 400 can be improved.

However, in other embodiments, as long as the heat dissipation pad is compressed, that is, as long as the original thickness is greater than the compressed thickness, the difference between the original thickness and the compressed thickness can also be less than 30% of the original thickness or greater than the original thickness. Fifty percent of it.

In addition, as shown in FIG. 3, when the first part 401, the second part 402, the third part 403, and the fourth part 404 of the heat dissipation pad 400 are not compressed, the width W1 of the gap 450 is greater than or equal to 4 mm And it is less than or equal to 8 mm, for example, 4 mm in this embodiment. The width W1 of the gap 450 is set within the range of 4 mm or more and 8 mm or less in order to prevent the first part 401, the second part 402, the third part 403, and the fourth part 404 of the thermal pad 400 After being pressed, the gap 450 disappears by contacting each other, and further preventing the first part 401, the second part 402, the third part 403, and the fourth part 404, which are in contact with each other after being pressed, from increasing the pound force of the heat source 202. Specifically, compared to the case where the parts of the heat dissipation pad are in contact with each other after being pressed, setting the width W1 of the gap 450 to a range greater than or equal to 4 mm and less than or equal to 8 mm can make the heat source 202 less bear about Load of 3 pounds.

However, in other embodiments, the width of the gap can also be less than 4 mm or greater than 8 mm.

Please refer to FIGS. 4 and 5. FIG. 5 is a top view showing the projection of the heat dissipation pad of the electronic device in FIG. 1 on the top surface of the heat dissipation base.

As shown in FIGS. 4 and 5, the first part 401 of the heat dissipation pad 400 has a first projection P1 on the top surface 302 of the heat dissipation base 300. The second part 402 of the heat dissipation pad 400 has a second projection P2 on the top surface 302 of the heat dissipation base 300. The third part 403 of the heat dissipation pad 400 has a third projection P3 on the top surface 302 of the heat dissipation base 300. The fourth part 404 of the heat dissipation pad 400 has a fourth projection P4 on the top surface 302 of the heat dissipation base 300. The gap 450 has a fifth projection P5 on the top surface 302 of the heat sink 300. In addition, the boundaries of the first projection P1, the second projection P2, the third projection P3, the fourth projection P4, and the fifth projection P5 are defined by the outer contour line L. In other words, the total area of the first projection P1, the second projection P2, the third projection P3, the fourth projection P4, and the fifth projection P5, that is, the total projected area of the heat dissipation pad 400 and the gap 450 on the top surface 302 is determined by Defined by the outer contour line L. In addition, the projected area of the thermal pad 400 on the top surface 302 accounts for 75.6 to 87% of the projected area of the thermal pad 400 and the gap 450 on the top surface 302 defined by the outer contour line L Seven, in this embodiment, for example, 87.7%.

In other embodiments, the projected area of the thermal pad on the top surface can also account for less than 75.6 percent or greater than 100% of the projected area of the thermal pad and the gap on the top surface defined by the outer contour line. The ratio of 87.7%.

It should be noted that the projected area of the heat dissipation pad 400 on the top surface 302 is Larger, the heat dissipation pad 400 can receive more heat from the heat source 202, but the heat source 202 will also have to bear more pound force. Therefore, the projected area of the heat dissipation pad 400 on the top surface 302 can be designed according to the heat dissipation requirements of the heat source 202 and the load limitation, thereby designing a balance point that meets actual requirements.

When the system environment temperature is 45 degrees Celsius and the power consumption of the heat source 202 is 35 watts, with the help of the heat dissipation pad 400 of this embodiment, the heat source 202 can be maintained at 81 degrees Celsius under a load of 45.83 pounds, which is consistent with The industry stipulates that the CPU Intel® Celeron® G4900T must be maintained below 88 degrees Celsius and bear a load of 50 pounds or less. It should be noted that different types of central processing units are applicable to different specifications, and the above-mentioned specifications are only for illustrative purposes and not for limitation.

In addition, the heat sink 300 is optional. In the embodiment in which the heat source and other electronic components are arranged on opposite sides of the main circuit board body or the embodiment in which the pound force of the heat source needs to be further reduced, the electronic device may also not need to include the heat sink 300, and the heat sink can directly heat the heat sink. Contact with the heat source and be clamped by the heat source and the heat sink.

It should be noted that the heat dissipation pad 400 of the present invention is not limited to being composed of four parts spaced apart from each other. In other embodiments, the heat dissipation pad can also be composed of two parts separated from each other. Or, please refer to FIGS. 6A and 6B. FIG. 6A is a top view of a heat sink and a heat sink according to a second embodiment of the present invention. FIG. 6B is a top view showing the projection of the heat dissipation pad in FIG. 6A on the top surface of the heat dissipation base.

In this embodiment, the heat dissipation pad 400a is composed of six parts separated from each other. In detail, the heat dissipation pad 400a includes a first part 401a, a second Part 402a, a third part 403a, a fourth part 404a, a fifth part 405a, and a sixth part 406a. The first part 401a, the second part 402a, the third part 403a, the fourth part 404a, the fifth part 405a and the sixth part 406a are arranged side by side on the top surface 302a of the heat sink 300a in three The arrays are multiplied by two and spaced apart from each other through a gap 450a.

In addition, in this embodiment, as shown in FIGS. 6A and 6B, the first portion 401a of the heat dissipation pad 400a has a first projection P1a on the top surface 302a of the heat dissipation base 300a. The second part 402a of the heat sink 400a has a second projection P2a on the top surface 302a of the heat sink 300a. The third portion 403a of the heat dissipation pad 400a has a third projection P3a on the top surface 302a of the heat dissipation base 300a. The fourth portion 404a of the heat dissipation pad 400a has a fourth projection P4a on the top surface 302a of the heat dissipation base 300a. The fifth portion 405a of the heat dissipation pad 400a has a fifth projection P5a on the top surface 302a of the heat dissipation base 300a. The sixth portion 406a of the heat sink 400a has a sixth projection P6a on the top surface 302a of the heat sink 300a. The gap 450a has a seventh projection P7a on the top surface 302a of the heat sink 300a. In addition, the boundaries of the first projection P1a, the second projection P2a, the third projection P3a, the fourth projection P4a, the fifth projection P5a, the sixth projection P6a, and the seventh projection P7a are defined by the outer contour line La. That is, the total area of the first projection P1a, the second projection P2a, the third projection P3a, the fourth projection P4a, the fifth projection P5a, the sixth projection P6a, and the seventh projection P7a, that is, the heat dissipation pad 400a and the gap 450a The total projected area of the top surface 302a is defined by the outer contour line La. In addition, the projection area of the heat dissipation pad 400a on the top surface 302a accounts for 80% of the projection area of the heat dissipation pad 400a and the gap 450a on the top surface 302a defined by the outer contour line La Two point seven.

When the system ambient temperature is 45 degrees Celsius and the heat source power consumption is 35 watts, with the help of the heat dissipation pad 400a of this embodiment, the heat source can be maintained at 81 degrees Celsius under a load of 43.76 pounds force, which is in line with the industry’s requirements for This CPU Intel® Celeron® G4900T must be maintained below 88 degrees Celsius and bear a load of 50 pounds or less.

Or, please refer to FIGS. 7A and 7B. FIG. 7A is a top view of a heat dissipation base and a heat dissipation pad according to a third embodiment of the present invention. FIG. 7B is a top view showing the projection of the heat dissipation pad in FIG. 7A on the top surface of the heat dissipation base.

In this embodiment, the heat dissipation pad 400b is composed of nine parts separated from each other. In detail, the thermal pad 400b includes a first part 401b, a second part 402b, a third part 403b, a fourth part 404b, a fifth part 405b, a sixth part 406b, A seventh part 407b, an eighth part 408b and a ninth part 409b. The first part 401b, the second part 402b, the third part 403b, the fourth part 404b, the fifth part 405b and the sixth part 406b are arranged side by side on the top surface 302b of the heat sink 300b and arranged in three Multiply the array by two. The seventh part 407b and the eighth part 408b are arranged side by side on the top surface 302b of the heat sink 300b and located on one side of the three by two array, and the ninth part 409b is located on the top surface 302b of the heat sink 300b. Multiply the other side of the array by two. The first part 401b, the second part 402b, the third part 403b, the fourth part 404b, the fifth part 405b, the sixth part 406b, the seventh part 407b, the eighth part 408b and the ninth part The portions 409b are spaced apart from each other by a gap 450b.

In addition, in this embodiment, as shown in FIGS. 7A and 7B, the first portion 401b of the heat dissipation pad 400b has a first projection P1b on the top surface 302b of the heat dissipation base 300b. The second portion 402b of the heat dissipation pad 400b has a second projection P2b on the top surface 302b of the heat dissipation base 300b. The third portion 403b of the heat sink 400b has a third projection P3b on the top surface 302b of the heat sink 300b. The fourth portion 404b of the heat dissipation pad 400b has a fourth projection P4b on the top surface 302b of the heat dissipation base 300b. The fifth portion 405b of the heat dissipation pad 400b has a fifth projection P5b on the top surface 302b of the heat dissipation base 300b. The sixth portion 406b of the heat sink 400b has a sixth projection P6b on the top surface 302b of the heat sink 300b. The seventh portion 407b of the heat sink 400b has a seventh projection P7b on the top surface 302b of the heat sink 300b. The eighth part 408b of the heat sink 400b has an eighth projection P8b on the top surface 302b of the heat sink 300b. The ninth portion 409b of the heat sink 400b has a ninth projection P9b on the top surface 302b of the heat sink 300b. The gap 450b has a tenth projection P10b on the top surface 302b of the heat sink 300b. In addition, the first projection P1b, the second projection P2b, the third projection P3b, the fourth projection P4b, the fifth projection P5b, the sixth projection P6b, the seventh projection P7b, the eighth projection P8b, the ninth projection P9b, and the tenth projection The boundary of P10b is defined by the outer contour line Lb. That is, the first projection P1b, the second projection P2b, the third projection P3b, the fourth projection P4b, the fifth projection P5b, the sixth projection P6b, the seventh projection P7b, the eighth projection P8b, the ninth projection P9b, and the The total area of the ten projections P10b, that is, the total projected area of the heat dissipation pad 400b and the gap 450b on the top surface 302b, is defined by the outer contour line Lb. In addition, the projection area of the thermal pad 400b on the top surface 302b occupies the projection area of the thermal pad 400b and the gap 450b on the top surface 302b defined by the outer contour line Lb. 83.8% of the shadow area.

When the system environment temperature is 45 degrees Celsius and the heat source power consumption is 35 watts, with the assistance of the heat dissipation pad 400b of this embodiment, the heat source can be maintained at 81 degrees Celsius under a load of 43.07 pounds, which is in line with the industry’s requirements for This CPU Intel® Celeron® G4900T must be maintained below 88 degrees Celsius and bear a load of 50 pounds or less.

More alternatively, please refer to FIGS. 8A and 8B. FIG. 8A is a top view of a heat dissipation base and a heat dissipation pad according to a fourth embodiment of the present invention. FIG. 8B is a top view showing the projection of the heat dissipation pad in FIG. 8A on the top surface of the heat dissipation base.

In this embodiment, the heat dissipation pad 400c is composed of ten parts separated from each other. In detail, the thermal pad 400c includes a first part 401c, a second part 402c, a third part 403c, a fourth part 404c, a fifth part 405c, a sixth part 406c, A seventh part 407c, an eighth part 408c, a ninth part 409c, and a tenth part 410c. The first part 401c, the second part 402c, the third part 403c, the fourth part 404c, the fifth part 405c and the sixth part 406c are arranged side by side on the top surface 302c of the heat sink 300c and arranged in three Multiply the array by two. The seventh part 407c and the eighth part 408c are arranged side by side on the top surface 302c of the heat sink 300c and located on one side of the above-mentioned three-by-two array, and the ninth part 409c and the tenth part 410c are on the top of the heat sink 300c. The faces 302c are side by side and are located on the other side of the aforementioned three-by-two array. The first part 401c, the second part 402c, the third part 403c, the fourth part 404c, the fifth part 405c, the sixth part 406c, the seventh part 407c, the eighth part 408c, the ninth part The part 409c and the tenth part 410c are alternated with each other through a gap 450c Separated.

In addition, in this embodiment, as shown in FIGS. 8A and 8B, the first portion 401c of the heat dissipation pad 400c has a first projection P1c on the top surface 302c of the heat dissipation base 300c. The second portion 402c of the heat sink 400c has a second projection P2c on the top surface 302c of the heat sink 300c. The third portion 403c of the heat dissipation pad 400c has a third projection P3c on the top surface 302c of the heat dissipation base 300c. The fourth portion 404c of the heat dissipation pad 400c has a fourth projection P4c on the top surface 302c of the heat dissipation base 300c. The fifth portion 405c of the heat sink 400c has a fifth projection P5c on the top surface 302c of the heat sink 300c. The sixth portion 406c of the heat sink 400c has a sixth projection P6c on the top surface 302c of the heat sink 300c. The seventh portion 407c of the heat sink 400c has a seventh projection P7c on the top surface 302c of the heat sink 300c. The eighth part 408c of the heat sink 400c has an eighth projection P8c on the top surface 302c of the heat sink 300c. The ninth part 409c of the heat sink 400c has a ninth projection P9c on the top surface 302c of the heat sink 300c. The tenth part 410c of the heat sink 400c has a tenth projection P10c on the top surface 302c of the heat sink 300c. The gap 450c has an eleventh projection P11c on the top surface 302c of the heat sink 300c. In addition, the first projection P1c, the second projection P2c, the third projection P3c, the fourth projection P4c, the fifth projection P5c, the sixth projection P6c, the seventh projection P7c, the eighth projection P8c, the ninth projection P9c, and the tenth projection The boundary between P10c and the eleventh projection P11c is defined by the outer contour line Lc. That is to say, the first projection P1c, the second projection P2c, the third projection P3c, the fourth projection P4c, the fifth projection P5c, the sixth projection P6c, the seventh projection P7c, the eighth projection P8c, the ninth projection P9c, and the The total area of the tenth projection P10c and the eleventh projection P11c, that is, the heat dissipation pad 400c and the gap The total projected area of 450c on the top surface 302c is defined by the outer contour line Lc. In addition, the projection area of the heat dissipation pad 400c on the top surface 302c accounts for 81.8% of the projection area of the heat dissipation pad 400c and the gap 450c on the top surface 302c defined by the outer contour line Lc.

When the system environment temperature is 45 degrees Celsius and the heat source power consumption is 35 watts, with the help of the heat dissipation pad 400c of this embodiment, the heat source can be maintained at 79 degrees Celsius under a load of 43.44 pounds, which is in line with the industry’s requirements for This CPU Intel® Celeron® G4900T must be maintained below 88 degrees Celsius and bear a load of 50 pounds or less.

In addition, the various parts of the heat dissipation pad of the present invention are not limited to being separated from each other and not connected to each other. Please refer to FIG. 9, which is a top view of a heat dissipation base and a heat dissipation pad according to a fifth embodiment of the present invention.

In this embodiment, the thermal pad 400d includes a first portion 401d, a second portion 402d, and two connecting portions 420d. The first part 401d, the second part 402d and the two connecting parts 420d are disposed on the top surface 302d of the heat sink 300d. The first part 401d and the second part 402d are separated from each other by a gap 450d. The two connecting parts 420d connect the first part 401d and the second part 402d. That is, in this embodiment, the heat dissipation pad 400d is a one-piece structure and the gap 450d can be regarded as an opening formed by removing a part of the heat dissipation pad 400d.

The present invention is not limited to the number of connecting portions 420d. In other embodiments, the first part and the second part of the heat dissipation pad can also be connected by only one connecting portion.

According to the electronic device disclosed in the above embodiment, due to the thermal pad There is a gap between the first part and the second part of the heat dissipation pad, so the heat dissipation pad can transfer less pound force to the heat source while maintaining the pressure. In this way, by separating the different parts of the heat dissipation pad with a gap, the pound force of the heat source can be reduced while maintaining the efficiency of the heat dissipation pad assisting the heat source to dissipate heat.

Although the present invention is disclosed in the foregoing embodiments as above, it is not intended to limit the present invention. Anyone familiar with similar art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of patent protection for inventions shall be determined by the scope of patent applications attached to this specification.

10: Electronic device

100: bearing seat

200: main circuit board

201: main circuit board body

202: heat source

300: heat sink

301: Bottom

302: top surface

400: Thermal pad

450: gap

500: heat sink

T1: Compressed thickness

Claims (10)

An electronic device comprising: a supporting base; a main circuit board, comprising a main circuit board body and a heat source, the heat source is arranged on the main circuit board body and the main circuit board body is arranged on the supporting base; a heat sink, Thermal contact is on the side of the heat source away from the main circuit board; a heat dissipation pad includes a first part and a second part, the first part and the second part are disposed on the heat sink; and A heat dissipation frame is stacked on the heat dissipation pad so that the first part and the second part of the heat dissipation pad are sandwiched between the heat dissipation base and the heat dissipation frame to be compressed; wherein, the heat dissipation pad A gap is maintained between the first part and the second part of the heat dissipation pad. The electronic device according to claim 1, wherein the thermal pad further includes a third part and a fourth part, the first part, the second part, the third part and the fourth part The parts are arranged side by side on the heat sink to form a two-by-two array and are spaced apart from each other through the gap. The electronic device according to claim 1, wherein the thermal pad further includes a third part, a fourth part, a fifth part, a sixth part, a seventh part, and an eighth part Part, a ninth part and a tenth part, the first part, the second part, the third part, the fourth part, the fifth part and the sixth part are in The heat sink is arranged side by side with each other in a three by two array, the seventh part and the eighth part are side by side on the heat sink and located on one side of the three by two array, the ninth part and the The tenth part is side by side on the heat sink and on the other side of the three by two array, the first part, the second part, the third part, the fourth part, and the fifth part The part, the sixth part, the seventh part, the eighth part, the ninth part, and the tenth part are separated from each other by the gap. The electronic device according to claim 1, wherein the heat dissipating pad further includes a connecting portion, and the connecting portion connects the first part and the second part. The electronic device according to claim 1, wherein the first part and the second part of the heat dissipation pad are sandwiched between the heat dissipation base and the heat dissipation frame to have a compressive thickness, and the heat dissipation pad An original thickness of the first part and the second part is greater than the compressed thickness, and the difference between the original thickness and the compressed thickness is 30% to 50% of the original thickness . The electronic device according to claim 1, wherein when the first part of the heat dissipation pad and the second part of the heat dissipation pad are not compressed, the width of the gap is greater than or equal to 4 mm and less than or equal to 8 mm. The electronic device according to claim 1, wherein the first part of the heat dissipation pad and the second part of the heat dissipation pad are disposed on a side of the heat dissipation base away from the heat source. The electronic device according to claim 1, wherein the heat sink has a bottom surface and a top surface opposite to each other, the bottom surface is in thermal contact with the heat source, the heat dissipation pad is disposed on the top surface, and the first surface of the heat dissipation pad One part has a first projection on the top mask, the second part of the heat dissipation pad has a second projection on the top mask, the gap has a third projection on the top mask, the first projection and the The total area of the second projection accounts for 75.6 to 87.7% of the total area of the first projection, the second projection, and the third projection. The electronic device according to claim 1, wherein the heat sink is fixed to the main circuit board body. An electronic device, comprising: a bearing seat; a main circuit board, comprising a main circuit board body and a heat source, the heat source is arranged on the main circuit board body and the main circuit board body is arranged on the bearing seat; a heat dissipation pad, It includes a first part and a second part. The first part and the second part are arranged on the side of the heat source away from the main circuit board body; and a heat dissipation frame is stacked on the heat dissipation pad. The first part and the second part of the heat dissipation pad are sandwiched between the heat source and the heat dissipation frame to be pressed; wherein, the first part of the heat dissipation pad and the second part of the heat dissipation pad Keep a gap between the parts.

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