TW202145868A - Electronic device - Google Patents

Abstract

An electronic device including a support, a motherboard, a heat dissipation base, a heat dissipation pad and a heat sink. Motherboard includes a plate and a heat source. Heat source is disposed on the plate and the plate is disposed on the support. Heat dissipation base is in thermal contact with a side of the heat source located away from the plate. Heat dissipation pad includes a first portion and a second portion. First portion and second portion are disposed on heat dissipation base. Heat sink is stacked on the heat dissipation pad so that first portion and second portion are clamped by heat dissipation base and heat sink so as to be pressed. First portion of heat dissipation pad and second portion of heat dissipation pad are spaced apart from each other by a gap.

Description

electronic device

The present invention relates to an electronic device, in particular to an electronic device including a heat dissipation pad.

Generally, a heat source on a circuit board, such as a central processing unit, generates a lot of waste heat. Therefore, heat dissipation fins are often disposed on the heat source, so as to dissipate the waste heat generated by the heat source to the outside through the assistance of the heat dissipation fins. In addition, since the height of the heat source relative to the circuit board body is usually lower than that of other electronic components relative to the circuit board body, during the process of installing the heat dissipation fins on the heat source, the heat dissipation fins are likely to interfere with other electronic components, resulting in Thermal fins are difficult to install at the heat source.

Therefore, some manufacturers dispose the heat source and other electronic components on opposite sides of the circuit board, so as to facilitate the installation of heat dissipation fins on the heat source. Of course, this arrangement of the heat source will cause the circuit board to consume more cost in the design of wiring and the like. In view of this, there are still some manufacturers who set the heat source and other electronic components on the same side of the circuit board body, and additionally set up heat sinks and heat dissipation pads connecting the heat source and heat dissipation fins to compensate for the height difference between the heat source and other electronic components. .

However, in the case where the heat dissipation base and the heat dissipation fins clamp the heat dissipation pad in a tighter manner, the heat source needs to bear a larger pound force. In the case where the heat dissipation seat and the heat dissipation fins clamp the heat dissipation pad in a less tight manner, although the heat source can withstand a small pound force, it is difficult for the heat source to effectively dissipate heat through the heat dissipation seat, the heat dissipation pad and the heat dissipation fin. That is to say, when the heat source and other electronic components are located on the same side of the circuit board, it is difficult to reduce the pound force that the heat source must bear while maintaining the heat dissipation efficiency of the heat source through the heat sink, heat dissipation pad and heat dissipation fins.

The present invention is to provide an electronic device to reduce the pound force of the heat source while maintaining the efficiency of the heat dissipation pad and the heat dissipation fin to assist the heat source to dissipate heat.

An electronic device disclosed in an embodiment of the present invention includes a carrier, a main circuit board, a heat dissipation base, a heat dissipation pad, and a heat dissipation frame. The main circuit board includes a main circuit board body and a heat source. The heat source is arranged on the main circuit board body and the main circuit board body is arranged on the bearing seat. The heat sink is in thermal contact with the side of the heat source away from the main circuit board body. The heat dissipation pad includes a first part and a second part. The first part and the second part are arranged on the heat sink. The heat dissipation frame is stacked on the heat dissipation pad so that the first part and the second part of the heat dissipation pad are sandwiched between the heat dissipation base and the heat dissipation frame to be pressed. A gap is maintained between the first part of the heat dissipation pad and the second part of the heat dissipation pad.

An electronic device disclosed in another embodiment of the present invention includes a carrier, a main circuit board, a heat dissipation pad, and a heat dissipation frame. The main circuit board includes a main circuit board body and a heat source. The heat source is arranged on the main circuit board body and the main circuit board body is arranged on the bearing seat. The heat dissipation pad includes a first part and a second part. The first part and the second part are arranged on the side of the heat source away from the main circuit board body. The heat dissipation frame is stacked on the heat dissipation pad, so that the first part and the second part of the heat dissipation pad are sandwiched between the heat source and the heat dissipation frame to be pressed. A gap is maintained between the first part of the heat dissipation pad and the second part of the heat dissipation pad.

According to the electronic device disclosed in the above embodiments, since a gap is maintained between the first part of the heat dissipation pad and the second part of the heat dissipation pad, the heat dissipation pad can transmit less pounds of force to the heat source. In this way, by separating different parts of the heat dissipation pad with gaps, the pound force on the heat source can be reduced while maintaining the efficiency of the heat dissipation pad in assisting the heat source to dissipate heat.

The detailed features and advantages of the embodiments of the present invention are described in detail below in the embodiments, and the contents are sufficient to enable any person with ordinary knowledge in the art to understand the technical contents of the embodiments of the present invention and implement them accordingly, and according to the disclosure in this specification Any person with ordinary knowledge in the art can easily understand the related objects and advantages of the present invention. The following examples further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention in any viewpoint.

See Figures 1 to 2. FIG. 1 is a perspective view of an electronic device according to a first embodiment of the present invention. FIG. 2 is a schematic side cross-sectional view of the electronic device in FIG. 1 .

In this embodiment, the electronic device 10 includes a carrier 100 , a main circuit board 200 , a heat dissipation base 300 , a heat dissipation pad 400 and a heat dissipation frame 500 .

The main circuit board 200 includes a main circuit board body 201 and a heat source 202 . The heat source 202 is disposed on the main circuit board body 201 and the main circuit board body 201 is disposed on the bearing base 100 . In this embodiment, the heat source 202 is, for example, a central processing unit (CPU) of the model Intel® Celeron® G4900T, and the heat source 202 is disposed on the main circuit board together with other electronic components such as a memory and a hard disk. 201 on the same side.

The heat sink 300 has a bottom surface 301 and a top surface 302 facing away from each other. The bottom surface 301 is in thermal contact with the side of the heat source 202 away from the main circuit board body 201 . In addition, in this embodiment, the heat sink 300 is fixed to the main circuit board body 201 , but it is not limited thereto. In other embodiments, the heat sink can also be fixed on the carrier.

Please refer to Figure 2, Figure 3 and Figure 4. FIG. 3 is an exploded view of the electronic device in FIG. 2 . FIG. 4 is a top view of the heat dissipation base and the heat dissipation pad of the electronic device in FIG. 1 .

In this embodiment, the heat dissipation pad 400 includes a first portion 401 , a second portion 402 , a third portion 403 and a fourth portion 404 . The first part 401 , the second part 402 , the third part 403 and the fourth part 404 are disposed on the top surface 302 of the heat sink 300 . That is to say, the first portion 401 , the second portion 402 , the third portion 403 and the fourth portion 404 are disposed on the side of the heat sink 300 away from the heat source 202 , but not limited thereto. In other embodiments, the first part, the second part, the third part and the fourth part can also be disposed on the side surfaces of the heat sink adjacent to the top surface and the bottom surface.

In addition, as shown in FIG. 4 , the first part 401 , the second part 402 , the third part 403 and the fourth part 404 are arranged side by side on the top surface 302 of the heat sink 300 to form a two-by-two array. They are spaced apart from each other through a gap 450 . Through the design of the gap 450 , the heat dissipation pad 400 can maintain the heat conduction efficiency of the heat dissipation pad 400 while reducing the pound force on the heat source 202 .

As shown in FIG. 2 , the heat dissipation frame 500 is stacked on the heat dissipation pad 400 so that the first part 401 , the second part 402 , the third part 403 and the fourth part 404 of the heat dissipation pad 400 are sandwiched between the heat dissipation base 300 It is compressed between the top surface 302 and the heat dissipation frame 500, and thus has a compressed thickness T1. In this embodiment, the heat dissipation frame 500 is made by, for example, aluminum extrusion.

In this embodiment, the heat dissipation frame 500 is fixed to and thermally contacted with the carrier 100 to form the casing of the electronic device 10 together with the carrier 100 , but not limited thereto. In other embodiments, the heat dissipation frame does not need to be fixed and is in thermal contact with the support base, and the support base and other components together form a casing of the electronic device, that is, the heat dissipation frame can also be accommodated in the casing.

In addition, the height of the heat dissipation base 300 can also be adjusted according to the height of the heat source 202 , and the heat dissipation frame 500 does not need to be remanufactured at a high cost.

As shown in FIG. 2 and FIG. 3 , the first part 401 , the second part 402 , the third part 403 and the fourth part 404 of the heat dissipation pad 400 have an original thickness T2 greater than the compression thickness T1 , and the original thickness T2 The difference between the thickness T1 and the compressed thickness T1 is between 30% and 50% of the original thickness T2, for example, 30% in this embodiment. Through the above-mentioned pressing mechanism, the thermal conduction efficiency of the heat dissipation pad 400 can be improved.

However, in other embodiments, as long as the heat dissipation pad is compressed, that is, as long as the original thickness is greater than the compressed thickness, the difference between the original thickness and the compressed thickness can also be less than 30% of the original thickness or greater than the original thickness. fifty percent.

In addition, as shown in FIG. 3 , when the first part 401 , the second part 402 , the third part 403 and the fourth part 404 of the heat dissipation pad 400 are not pressed, the width W1 of the gap 450 is greater than or equal to 4 mm and less than or equal to 8 mm, for example, 4 mm in this embodiment. Setting the width W1 of the gap 450 in the range of 4 mm or more and 8 mm or less is to prevent the parts of the heat dissipation pad 400 from contacting each other after being pressed, which increases the pound force that the heat source 202 must bear. Specifically, compared to the case where the various parts of the heat dissipation pad are in contact with each other after being pressed, setting the width W1 of the gap 450 in the range of 4 mm or more and 8 mm or less can reduce the heat source 202 to withstand about 3 lbs. load.

Of course, in other embodiments, the width of the gap may also be less than 4 mm or greater than 8 mm.

Please refer to FIGS. 4 and 5 . FIG. 5 is a top view showing the projection of the heat dissipation pad of the electronic device in FIG. 1 on the top surface of the heat dissipation base.

As shown in FIG. 4 and FIG. 5 , the first portion 401 of the heat dissipation pad 400 has a first projection P1 on the top surface 302 of the heat dissipation base 300 . The second portion 402 of the heat dissipation pad 400 has a second projection P2 on the top surface 302 of the heat dissipation base 300 . The third portion 403 of the heat dissipation pad 400 has a third projection P3 on the top surface 302 of the heat dissipation base 300 . The fourth portion 404 of the heat dissipation pad 400 has a fourth projection P4 on the top surface 302 of the heat dissipation base 300 . The gap 450 has a fifth projection P5 on the top surface 302 of the heat sink 300 . In addition, the boundaries of the first projection P1 , the second projection P2 , the third projection P3 , the fourth projection P4 and the fifth projection P5 are defined by the outer contour line L. That is to say, the total area of the first projection P1, the second projection P2, the third projection P3, the fourth projection P4 and the fifth projection P5, that is, the total projected area of the heat dissipation pad 400 and the gap 450 on the top surface 302, is determined by Defined by the outer contour line L. In addition, the projected area of the heat dissipation pad 400 on the top surface 302 accounts for 75.6% to 87% of the projected area of the heat dissipation pad 400 and the gap 450 on the top surface 302 defined by the outer contour line L Seven, in this embodiment, for example, it is 87.7 percent.

In other embodiments, the projected area of the heat dissipation pad on the top surface may also account for less than 75.6% or more than 75.6% of the projected area of the heat dissipation pad and the gap on the top surface defined by the outer contour line. of eighty-seven point seven.

It should be noted that the larger the projected area of the heat dissipation pad 400 on the top surface 302 is, the more heat the heat dissipation pad 400 can receive from the heat source 202 , but the heat source 202 has to bear a larger pound force. Therefore, the projected area of the heat dissipation pad 400 on the top surface 302 can be designed according to the heat dissipation requirement of the heat source 202 and the load limitation, and then a balance point that meets the actual requirement can be designed.

When the system ambient temperature is 45 degrees Celsius and the power consumption of the heat source 202 is 35 watts, with the help of the heat dissipation pad 400 of this embodiment, the heat source 202 can be maintained at 81 degrees Celsius under a load of 45.83 lbs. The industry standard for this CPU, Intel® Celeron® G4900T, is to maintain a temperature below 88 degrees Celsius and withstand a load of less than 50 lbs. It should be noted that different models of central processing units are applicable to different specifications, and the above-mentioned specifications are only used for illustration and not for limitation.

In addition, the heat sink 300 is optional. In the embodiment in which the heat source and other electronic components are disposed on opposite sides of the main circuit board body or in the embodiment in which the pound force on the heat source needs to be further reduced, the electronic device does not need to include the heat sink 300, so that the heat dissipation pad directly heats It is in contact with the heat source and is clamped by the heat source and the heat sink.

It should be noted that the heat dissipation pad 400 of the present invention is not limited to be composed of four parts spaced apart from each other. In other embodiments, the heat dissipation pad can also be composed of two parts separated from each other. Alternatively, please refer to FIG. 6 , which is a top view of a heat dissipation seat and a heat dissipation pad according to a second embodiment of the present invention.

In this embodiment, the heat dissipation pad 400a is composed of six parts separated from each other. Specifically, the heat dissipation pad 400a includes a first portion 401a, a second portion 402a, a third portion 403a, a fourth portion 404a, a fifth portion 405a and a sixth portion 406a. The first part 401a, the second part 402a, the third part 403a, the fourth part 404a, the fifth part 405a and the sixth part 406a are arranged side by side on the top surface 302a of the heat sink 300a and arranged in three The arrays are multiplied by two and spaced apart from each other by a gap 450a.

In addition, in this embodiment, the projected area of the heat dissipation pad 400a on the top surface 302a accounts for 82.7% of the projected area of the heat dissipation pad 400a and the gap 450a on the top surface 302a defined by the outer contour lines.

When the system ambient temperature is 45 degrees Celsius and the power consumption of the heat source is 35 watts, with the help of the heat dissipation pad 400a of this embodiment, the heat source can be maintained at 81 degrees Celsius under a load of 43.76 pounds of force, which is in line with the industry's requirements for The CPU Intel® Celeron® G4900T is required to maintain below 88 degrees Celsius and withstand a load of less than 50 lbs.

Alternatively, please refer to FIG. 7 , which is a top view of a heat sink and a heat dissipation pad according to a third embodiment of the present invention.

In this embodiment, the heat dissipation pad 400b is composed of nine parts separated from each other. In detail, the heat dissipation pad 400b includes a first part 401b, a second part 402b, a third part 403b, a fourth part 404b, a fifth part 405b, a sixth part 406b, A seventh portion 407b, an eighth portion 408b, and a ninth portion 409b. The first part 401b, the second part 402b, the third part 403b, the fourth part 404b, the fifth part 405b and the sixth part 406b are arranged side by side with each other on the top surface 302b of the heat sink 300b and arranged in three Multiply array by two. The seventh portion 407b and the eighth portion 408b are side by side on the top surface 302b of the heat sink 300b and are located on one side of the above-mentioned three-by-two array, and the ninth portion 409b is located on the top surface 302b of the heat sink 300b in the three-by-two array. Multiply the other side of the array by two. The first part 401b, the second part 402b, the third part 403b, the fourth part 404b, the fifth part 405b, the sixth part 406b, the seventh part 407b, the eighth part 408b and the ninth part Portions 409b are spaced apart from each other by a gap 450b.

In addition, in this embodiment, the projected area of the heat dissipation pad 400b on the top surface 302b accounts for 83.8% of the projected area of the heat dissipation pad 400b and the gap 450b on the top surface 302b defined by the outer contour lines.

When the system ambient temperature is 45 degrees Celsius and the power consumption of the heat source is 35 watts, with the help of the heat dissipation pad 400b of this embodiment, the heat source can be maintained at 81 degrees Celsius under a load of 43.07 pounds of force, which is in line with the industry's requirements for The CPU Intel® Celeron® G4900T is required to maintain below 88 degrees Celsius and withstand a load of less than 50 lbs.

Or, please refer to FIG. 8 , which is a top view of a heat dissipation seat and a heat dissipation pad according to a fourth embodiment of the present invention.

In this embodiment, the heat dissipation pad 400c is composed of ten parts separated from each other. In detail, the heat dissipation pad 400c includes a first portion 401c, a second portion 402c, a third portion 403c, a fourth portion 404c, a fifth portion 405c, a sixth portion 406c, A seventh portion 407c, an eighth portion 408c, a ninth portion 409c, and a tenth portion 410c. The first part 401c, the second part 402c, the third part 403c, the fourth part 404c, the fifth part 405c and the sixth part 406c are arranged side by side on the top surface 302c of the heat sink 300c in three Multiply array by two. The seventh portion 407c and the eighth portion 408c are side by side on the top surface 302c of the heat sink 300c and are located on one side of the above-mentioned three-by-two array, and the ninth portion 409c and the tenth portion 410c are on the top of the heat sink 300c. Side-by-side on face 302c and on the other side of the three-by-two array described above. The first part 401c, the second part 402c, the third part 403c, the fourth part 404c, the fifth part 405c, the sixth part 406c, the seventh part 407c, the eighth part 408c, the ninth part The portion 409c and the tenth portion 410c are spaced apart from each other by a gap 450c.

In addition, in this embodiment, the projected area of the heat dissipation pad 400c on the top surface 302c accounts for 81.8% of the projected area of the heat dissipation pad 400c and the gap 450c on the top surface 302c defined by the outer contour lines.

Under the condition that the system ambient temperature is 45 degrees Celsius and the power consumption of the heat source is 35 watts, with the help of the heat dissipation pad 400c of this embodiment, the heat source can be maintained at 79 degrees Celsius under a load of 43.44 pounds of force, which is in line with industry standards for The CPU Intel® Celeron® G4900T is required to maintain below 88 degrees Celsius and withstand a load of less than 50 lbs.

In addition, the various parts of the heat dissipation pad of the present invention are not limited to be separated from each other and not connected to each other. Please refer to FIG. 9 , which is a top view of the heat dissipation seat and the heat dissipation pad according to the fifth embodiment of the present invention.

In this embodiment, the heat dissipation pad 400d includes a first portion 401d, a second portion 402d and two connecting portions 420d. The first portion 401d, the second portion 402d and the two connecting portions 420d are disposed on the top surface 302d of the heat sink 300d. The first portion 401d and the second portion 402d are spaced apart from each other through a gap 450d. The two connecting portions 420d connect the first portion 401d and the second portion 402d. That is, in this embodiment, the heat dissipation pad 400d is a single-piece structure and the gap 450d can be regarded as an opening formed by removing a part of the heat dissipation pad 400d.

The present invention is not limited by the number of the connecting portions 420d. In other embodiments, the first part and the second part of the heat dissipation pad can also be connected through only one connecting part.

According to the electronic device disclosed in the above embodiments, since a gap is maintained between the first part of the heat dissipation pad and the second part of the heat dissipation pad, the heat dissipation pad can transmit less pounds of force to the heat source. In this way, by separating different parts of the heat dissipation pad with gaps, the pound force on the heat source can be reduced while maintaining the efficiency of the heat dissipation pad assisting the heat source to dissipate heat.

Although the present invention is disclosed above by the aforementioned embodiments, it is not intended to limit the present invention. Anyone who is familiar with similar techniques can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection of the invention shall be determined by the scope of the patent application attached to this specification.

10: Electronics 100: Bearing seat 200: Main circuit board 201: Main circuit board body 202: Heat Source 300, 300a, 300b, 300c, 300d: heat sink 301: Underside 302, 302a, 302b, 302c, 302d: Top surface 400, 400a, 400b, 400c, 400d: Thermal pads 401, 401a, 401b, 401c, 401d: Part 1 402, 402a, 402b, 402c, 402d: Part II 403, 403a, 403b, 403c: Part III 404, 404a, 404b, 404c: Part Four 405a, 405b, 405c: Part V 406a, 406b, 406c: Part VI 407b, 407c: Part VII 408b, 408c: Part VIII 409b, 409c: Part IX 410c: Part Ten 420d: Connection Department 450, 450a, 450b, 450c, 450d: Clearance 500: cooling rack T1: Compression thickness T2: Original thickness W1: width P1: First projection P2: Second projection P3: Third projection P4: Fourth projection P5: Fifth projection L: outer contour

FIG. 1 is a perspective view of an electronic device according to a first embodiment of the present invention. FIG. 2 is a schematic side cross-sectional view of the electronic device in FIG. 1 . FIG. 3 is an exploded view of the electronic device in FIG. 2 . FIG. 4 is a top view of the heat dissipation base and the heat dissipation pad of the electronic device in FIG. 1 . FIG. 5 is a top view showing a projection of the heat dissipation pad of the electronic device in FIG. 1 on the top surface of the heat dissipation base. 6 is a top view of a heat dissipation base and a heat dissipation pad according to a second embodiment of the present invention. 7 is a top view of a heat dissipation base and a heat dissipation pad according to a third embodiment of the present invention. 8 is a top view of a heat dissipation base and a heat dissipation pad according to a fourth embodiment of the present invention. 9 is a top view of a heat dissipation base and a heat dissipation pad according to a fifth embodiment of the present invention.

10: Electronics

100: Bearing seat

200: Main circuit board

201: Main circuit board body

202: Heat Source

300: heat sink

301: Underside

302: top surface

400: cooling pad

450: Clearance

500: cooling rack

T1: Compression thickness

Claims (10)

An electronic device, comprising: a bearing seat; a main circuit board, comprising a main circuit board body and a heat source, the heat source is arranged on the main circuit board body and the main circuit board body is arranged on the bearing seat; a heat dissipation seat, thermally contacting a side of the heat source away from the main circuit board body; a heat dissipation pad including a first part and a second part, the first part and the second part are disposed on the heat dissipation seat; and A heat dissipation frame is stacked on the heat dissipation pad so that the first part and the second part of the heat dissipation pad are sandwiched between the heat dissipation base and the heat dissipation frame to be compressed; wherein, the heat dissipation pad A gap is maintained between the first part and the second part of the heat dissipation pad. The electronic device of claim 1, wherein the heat dissipation pad further comprises a third part and a fourth part, the first part, the second part, the third part and the fourth part The parts are arranged side by side on the heat sink to form a two-by-two array and are spaced apart from each other through the gap. The electronic device of claim 1, wherein the heat dissipation pad further comprises a third part, a fourth part, a fifth part, a sixth part, a seventh part, and an eighth part Part 1, Part 9, Part 10, Part 1, Part 2, Part 3, Part 4, Part 5 and Part 6 in The heat sink is arranged side by side with each other in a three-by-two array, the seventh part and the eighth part are side by side on the heat sink and are located on one side of the three-by-two array, the ninth part and the eighth part are side by side on the heat sink. The tenth part is side by side on the heat sink and is located on the other side of the three-by-two array, the first part, the second part, the third part, the fourth part, the fifth part The part, the sixth part, the seventh part, the eighth part, the ninth part and the tenth part are separated from each other by the gap. The electronic device as claimed in claim 1, wherein the heat dissipation pad further comprises a connecting portion, and the connecting portion connects the first portion and the second portion. The electronic device as claimed in claim 1, wherein the first part and the second part of the heat dissipation pad are sandwiched between the heat dissipation base and the heat dissipation frame to have a compressed thickness; An original thickness of the first part and the second part is greater than the compressed thickness, and the difference between the original thickness and the compressed thickness is 30% to 50% of the original thickness . The electronic device of claim 1, wherein when the first portion of the heat dissipation pad and the second portion of the heat dissipation pad are not pressed, the width of the gap is greater than or equal to 4 mm and less than or equal to 8 mm. The electronic device of claim 1, wherein the first portion of the heat dissipation pad and the second portion of the heat dissipation pad are disposed on a side of the heat dissipation base away from the heat source. The electronic device of claim 1, wherein the heat dissipation base has a bottom surface and a top surface opposite to each other, the bottom surface is in thermal contact with the heat source, the heat dissipation pad is disposed on the top surface, and the first surface of the heat dissipation pad is disposed on the top surface. A part has a first projection on the top surface, the second part of the heat dissipation pad has a second projection on the top surface, the gap has a third projection on the top surface, the first projection and the The total area of the second projection accounts for 75.6% to 87.7% of the total area of the first projection, the second projection and the third projection. The electronic device as claimed in claim 1, wherein the heat sink is fixed to the main circuit board body. An electronic device, comprising: a bearing seat; a main circuit board, comprising a main circuit board body and a heat source, the heat source is arranged on the main circuit board body and the main circuit board body is arranged on the bearing seat; a heat dissipation pad, It includes a first part and a second part, the first part and the second part are arranged on the side of the heat source away from the main circuit board body; and a heat dissipation frame is stacked on the heat dissipation pad to The first part and the second part of the heat dissipation pad are sandwiched between the heat source and the heat dissipation frame to be pressed; wherein, the first part of the heat dissipation pad and the second part of the heat dissipation pad There is a gap between the parts.

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