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TW200517043A - Cooling structure of chipset in data processing device - Google Patents

Cooling structure of chipset in data processing device

Info

Publication number
TW200517043A
TW200517043A TW092131316A TW92131316A TW200517043A TW 200517043 A TW200517043 A TW 200517043A TW 092131316 A TW092131316 A TW 092131316A TW 92131316 A TW92131316 A TW 92131316A TW 200517043 A TW200517043 A TW 200517043A
Authority
TW
Taiwan
Prior art keywords
chipset
heat conduction
conduction pad
heat
data processing
Prior art date
Application number
TW092131316A
Other languages
Chinese (zh)
Other versions
TWI237544B (en
Inventor
Chui-Ru Cai
Original Assignee
First Internation Computer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by First Internation Computer Inc filed Critical First Internation Computer Inc
Priority to TW92131316A priority Critical patent/TWI237544B/en
Publication of TW200517043A publication Critical patent/TW200517043A/en
Application granted granted Critical
Publication of TWI237544B publication Critical patent/TWI237544B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A cooling structure of chipset in data processing device includes a first heat conduction pad and a second heat conduction pad disposed on opposite sides of a circuit board. When a chipset on the circuit board generates great heat due to the operation of the chipset, the heat can be transferred in opposite directions by the first heat conduction pad and the second heat conduction pad to a case so that the heat dissipation area can be expanded to be the entire case to provide an excellent cooling performance. Besides, the structure requires no cooling fan so as to effectively save the limited electrical energy inside the device and significantly enhance operation time of system.
TW92131316A 2003-11-07 2003-11-07 Chip set heat dissipation structure for data processing apparatus TWI237544B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92131316A TWI237544B (en) 2003-11-07 2003-11-07 Chip set heat dissipation structure for data processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92131316A TWI237544B (en) 2003-11-07 2003-11-07 Chip set heat dissipation structure for data processing apparatus

Publications (2)

Publication Number Publication Date
TW200517043A true TW200517043A (en) 2005-05-16
TWI237544B TWI237544B (en) 2005-08-01

Family

ID=36821486

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92131316A TWI237544B (en) 2003-11-07 2003-11-07 Chip set heat dissipation structure for data processing apparatus

Country Status (1)

Country Link
TW (1) TWI237544B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI738353B (en) * 2020-05-22 2021-09-01 微星科技股份有限公司 Electronic device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI738353B (en) * 2020-05-22 2021-09-01 微星科技股份有限公司 Electronic device
CN113707622A (en) * 2020-05-22 2021-11-26 恩斯迈电子(深圳)有限公司 Electronic device
CN113707622B (en) * 2020-05-22 2023-08-04 恩斯迈电子(深圳)有限公司 electronic device

Also Published As

Publication number Publication date
TWI237544B (en) 2005-08-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees