TWI722209B - Display device and manufacturing method thereof - Google Patents

Abstract

[Problem] To provide a display device, a manufacturing method thereof, and a manufacturing device capable of suppressing the degradation of display quality caused by bright spot defects. [Solution] In the display device, in the interior of at least one of the first glass substrate and the second glass substrate, the dimming portion that covers the defect portion of the bright spot when viewed from the display surface side includes: the transmittance of visible light is The first colored layer whose center part is higher than the outer periphery part, and the second colored layer whose visible light transmittance is higher at the outer periphery part than the center part, the first colored layer and the second colored layer are arranged at different positions in the thickness direction, In addition, they are arranged so that their central parts overlap each other when viewed from the display surface side.

Description

Display device and manufacturing method thereof

FIELD OF THE INVENTION The present invention relates to a display device and its manufacturing method.

BACKGROUND OF THE INVENTION Among various display devices, for example, a liquid crystal display device applies an electric field generated between a pixel electrode and a common electrode to a liquid crystal layer sandwiched by a pair of substrates to drive the liquid crystal, thereby adjusting the penetration of the pixel electrode and the common electrode. The amount of light in the area between the electrodes is used for image display.

Conventionally, in, for example, liquid crystal display devices, it is known that the display brightness of pixels becomes higher than desired brightness, that is, the problem of so-called bright spot defects (also called pixel defects). The bright spot defect occurs because, for example, foreign matter is mixed between a pair of substrates during the manufacturing process of the liquid crystal display device, the alignment of the liquid crystal is disturbed by the foreign matter, or the pixel electrode and the common electrode are short-circuited.

The method of correcting the aforementioned bright spot defect has been disclosed in Patent Document 1, for example. In the method of Patent Document 1, laser light is irradiated to the inside of the glass substrate to form a colored layer that covers the luminance defect generation area in plan view, and the colored layer is used to reduce the amount of light penetration. Prior art literature

Patent Document Patent Document 1: Japanese Patent Laid-Open No. 2015-175857

SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION However, in the prior art, when the colored part is formed by laser surface scanning, the final scanning part becomes thinner, causing light leakage and insufficient correction of bright spot defects.

The present invention is an invention made in view of the foregoing facts, and its object is to provide a display device and a manufacturing method thereof that can suppress the degradation of the display quality caused by the bright spot defect. Means to solve the problem

In order to achieve the foregoing object, a display device of one aspect of the present invention is a display device including a first glass substrate and a second glass substrate opposite to the first glass substrate and located on the display surface side. The inside of at least one of the glass substrate and the second glass substrate has a dimming portion that covers the defect of the bright spot when viewed from the display surface side, and the dimming portion includes: the transmittance of visible light at the center portion is higher than the outer periphery A first colored layer with a high portion and a second colored layer with a higher transmittance of visible light in the outer peripheral portion than in the center portion, the first colored layer and the second colored layer are arranged at different positions in the thickness direction, and, It is arrange|positioned so that the center part of each other may overlap from the said display surface side.

In order to achieve the foregoing object, a method of manufacturing a display device of one aspect of the present invention is the manufacturing of a display device including a first glass substrate and a second glass substrate opposite to the first glass substrate and located on the display surface side The method includes: an inspection and inspection step of performing a light-on inspection of the display device to detect a bright spot defect portion of the pixel; and an irradiation step of irradiating the first or second glass substrate with laser light in order to cover the bright spot defect portion. The inside of at least one of the first glass substrate and the second glass substrate constitutes a dimming part that covers the bright spot defect part when viewed from the display surface side, and the visible light transmittance is higher than the outer periphery at the center part. The first colored layer with a high portion and the second colored layer with a higher visible light transmittance in the outer peripheral portion than in the center portion. These colored layers are arranged so that the light leakage of each final scanning portion becomes different from the display surface. When viewed from the side, the centers of each other overlap and are arranged at different positions in the thickness direction. The laser light irradiated in the irradiation step has a wavelength of 100nm or more and 10000nm or less, and a pulse width of 1 femtosecond. Above and below 100 picoseconds, the pulse energy is above 1 μJ and below 20 μJ, and the light is collected by a lens with an NA of 0.3 or more and 0.9 or less. Invention effect

As described above, according to the aforementioned aspect of the display device and the manufacturing method of the present invention, the dimming part is provided with: the first colored layer whose central part has a higher transmittance of visible light than the outer peripheral part, and the transparent part of visible light The second colored layer having a higher rate in the outer peripheral portion than the center portion. The first colored layer and the second colored layer are arranged at different positions in the thickness direction, and are arranged at the center of each other when viewed from the display surface side Since it overlaps, it is possible to provide a display device that suppresses the degradation of display quality caused by bright spot defects.

Modes for Carrying Out the Invention Hereinafter, embodiments of the present invention will be described with reference to the drawings.

In the following embodiments, although a liquid crystal display device is taken as an example, the display device of the present invention is not limited to a liquid crystal display device, and may be, for example, an organic EL display device or a plasma display panel. (First Embodiment)

FIG. 1 is a plan view showing the overall structure of a liquid crystal display device LCD as an example of the display device according to the first embodiment of the present invention.

The liquid crystal display device LCD includes: a display panel DP that displays images, a display panel drive circuit (data line drive circuit 30, gate line drive circuit 31) that drives the display panel DP, and a control circuit ( Not shown), and the backlight 134 that irradiates the back light from the back side to the display panel DP.

FIG. 2 is a plan view showing the structure of a part of the display panel DP. Fig. 3 is an end view of a cut portion cut along the line A1-A2 in Fig. 2; Furthermore, in FIGS. 2 and 3, one pixel P in the display panel DP is shown.

As shown in FIG. 3, the display panel DP includes a thin film transistor substrate SUB1 (hereinafter referred to as TFT substrate SUB1.) arranged on the back side, and a color filter substrate SUB2 (hereinafter referred to as TFT substrate SUB1) arranged on the display surface side and facing the TFT substrate SUB1. Hereinafter, it is referred to as the CF substrate SUB2.), and the liquid crystal layer LC sandwiched between the TFT substrate SUB1 and the CF substrate SUB2. The thin film transistor substrate SUB1 functions as an example of the first substrate. The color filter substrate SUB2 functions as an example of the second substrate.

A plurality of data lines DL extending in the column direction and a plurality of gate lines GL extending in the row direction are formed on the TFT substrate SUB1, and each of the plurality of data lines DL and the plurality of gate lines GL intersects A thin film transistor TFT is formed near the part. In addition, a rectangular area surrounded by two adjacent data lines DL and two adjacent gate lines GL is defined as one pixel P. The pixels P are plurally arranged in a matrix on the TFT substrate SUB1.

A pixel electrode (display electrode) PIT made of a transparent (or light-transmitting) conductive film such as indium tin oxide (ITO) is formed on the pixel P. As shown in FIG. 2, the pixel electrode PIT has an opening 32 (for example, a slit), and is formed in a stripe shape. Thin film transistor TFT has a semiconductor layer SEM made of amorphous silicon (aSi) formed on the gate insulating film GSN (refer to FIG. 3), and a drain electrode DM and a source electrode SM are formed on the semiconductor layer SEM (Refer to Figure 2). The drain electrode DM is electrically connected to the data line DL. The source electrode SM and the pixel electrode PIT are electrically connected to each other through the contact hole CONT.

The layered structure of each part constituting the pixel P is not limited to the structure of the structure shown in FIG. 3, and a known structure can be applied. For example, in the configuration shown in FIG. 3, in the TFT substrate SUB1, a gate line GL (refer to FIG. 2) is formed on the first glass substrate GB1, and a gate insulating film GSN is formed to cover the gate line GL. In addition, a data line DL is formed on the gate insulating film GSN, and an insulating film PAS is formed to cover the data line DL. In addition, a common electrode CIT (display electrode) is formed on the insulating film PAS, and an upper insulating film UPAS is formed to cover the common electrode CIT. In addition, a pixel electrode PIT is formed on the upper insulating film UPAS, and an alignment film AF is formed to cover the pixel electrode PIT. A polarizing plate POL1 (first polarizing plate) is formed on the back side of the first glass substrate GB1.

In addition, in the CF substrate SUB2, a black matrix BM (an example of a light-shielding part) and a color filter CF (for example, the red part) are formed on the second glass substrate GB2 (the lower surface side of the second glass substrate GB2 in FIG. 3). , Green part, blue part) (an example of the light-transmitting part), and a coating layer OC is formed to cover these members. A polarizing plate POL2 (second polarizing plate) is formed on the display surface side of the second glass substrate GB2. Accordingly, the second glass substrate GB2 faces the first glass substrate GB1 and is located on the display surface side, and the liquid crystal layer LC is arranged between the first glass substrate GB1 and the second glass substrate GB2.

According to the structure shown in FIG. 3, although the liquid crystal display device LCD has a structure of a so-called lateral electric field effect display technology (IPS (In Plane Switching)), the liquid crystal display device LCD of the first embodiment is not limited to this.

Next, the driving method of the liquid crystal display device LCD will be briefly described. The gate voltage for scanning output from the gate line driving circuit 31 is supplied to the gate line GL, and the data voltage for imaging output from the data line driving circuit 30 is supplied to the data line DL. When the gate-on voltage is supplied to the gate line GL, the semiconductor layer SEM of the thin film transistor TFT becomes low resistance, and the data voltage supplied to the data line DL is supplied to the pixel electrode PIT through the source electrode SM. In addition, a common voltage output from a common electrode drive circuit (not shown) is supplied to the common electrode CIT. Thereby, an electric field (driving electric field) is generated between the pixel electrode PIT and the common electrode CIT, and the liquid crystal layer LC is driven by the electric field to display an image.

Here, in the manufacturing process of the liquid crystal display device LCD, a bright point defect (pixel defect) in which the display brightness of the pixel becomes higher than the desired brightness may occur. FIG. 4 shows an example of a case where the pixel P becomes the bright point defect 133. FIG. 4 illustrates a situation in which foreign matter 33 such as organic matter or metal is mixed between the TFT substrate SUB1 and the CF substrate SUB2 in the manufacturing process of the liquid crystal display device LCD. In the pixel P shown in FIG. 4, the alignment of the liquid crystal is disturbed by the foreign matter (mixed matter) 33, which causes light leakage of the backlight light 34 and becomes a bright spot defect 133 with a bright spot defect.

The liquid crystal display device LCD of the first embodiment has a structure for suppressing the aforementioned bright spot defect. Specifically, as shown in FIG. 5, a dimming section 1 that reduces the amount of penetration of the backlight light 34 is formed inside the second glass substrate GB2 of the CF substrate SUB2. The dimming parts 1 are arranged in a plane, and are formed to cover the bright spot defect part 133 caused by the foreign matter 33 when viewed from the display surface side of the second glass substrate GB2. That is, in the inside of at least one of the first glass substrate GB1 and the second glass substrate GB2, the dimming portion 1 that covers the bright spot defect portion 133 when viewed from the display surface side is arranged. The light-reducing part 1 is formed by a colored layer 2 whose colors are different from those of the first glass substrate GB1 and the second glass substrate GB2, and a void layer 3 in which plural or multiple voids are formed under the colored layer 2 . In addition, when the colored layer 2 is composed of plural layers as described later, it means that plural colored layers 2-1 and 2-2 are arranged on the void layer 3.

Fig. 6 is a schematic diagram of the vicinity of the focal point (condensing point) F during glass internal processing. Fig. 7 is a diagram showing an image of a person who has performed a straight line processing inside the glass viewed from a plane. Fig. 8 is a view showing an image of a cross section of the straight line processing of Fig. 7 viewed.

As shown in Fig. 6, after the ultra-short pulse laser light 4 is condensed inside the glass substrate GB by the high condensing lens 8, the energy density becomes very high near the focal point F, resulting in a diameter of 1 nm or more and 50 μm or less The tiny holes (voids) are formed (refer to the area 70 in FIG. 6). At this time, where the glass substrate GB is closer to the surface than the focal point F (refer to area 71 in FIG. 6), the glass will melt, and its surroundings will be colored brown under the influence of heat (refer to area 72 in FIG. 6). This coloration 92 is caused by a non-bridging oxygen hole center. By moving the ultrashort pulse laser light 4 and the position of the glass substrate GB linearly relative to each other, as shown in FIG. 7, there will be a kind of color that is lighter at the scanning point of the focal point, and the coloration on both sides of the focus is lighter as shown in FIG. The processing marks. Observe the processed section at this time, as shown in Figure 8, a void will be formed at the surface away from the glass substrate GB (near the bottom of the ellipse in Figure 8), and the color will be lighter at the surface closer than the void, and the edge ( The upper part of the ellipse in Fig. 8 is colored densely.

By moving the position of the ultrashort pulse laser light 4 and the glass substrate GB in the surface direction relative to each other, the area where the gap is formed and the coloring area are expanded in the surface direction inside the glass substrate GB to form a gap Layer 3 and coloring layer 2. For the dimming part 1 composed of the colored layer 2 and the gap layer 3, the backlight light 34 irradiated from the back of the glass substrate GB is absorbed by the colored layer 2 and dimmed, so that the dimmed light exits the glass substrate The surface of the GB can suppress the deterioration of the display quality caused by the defect of the bright spot. The ultra-short pulse laser light 4 must have the pulse width, wavelength, and pulse energy like the colored area and the void formation area in the glass substrate GB. The wavelength is 100 or more and 10000nm or less, and the pulse width is 1fs or more to 100ps or less It is ideal that the pulse energy is 1μJ or more and 20μJ or less. In addition, it is preferable that the NA (Numerical Aperture) of the high condensing lens is 0.3 or more and 0.9 or less, and it is even more ideal if it has an aberration correction function. By irradiating the laser light 4 of this condition to the glass substrate GB, a void layer 3 containing a large number of holes as shown in Fig. 8 will be formed at the position of the focus F, and will be closer to the glass substrate than the position of the focus F A colored layer 2 is formed on the surface of the GB.

Fig. 9 (a) and (b) are respectively a diagram showing the scanning direction when a square surface is processed by arranging straight lines, and a diagram showing an image in which the processing marks are viewed in a plane after the processing.

As shown in FIG. 9, the positions of the ultrashort pulse laser light 4 and the glass substrate GB are relatively moved in the surface direction, and after the colored layer 2 is formed by surface processing, a lightly colored area will remain in the final scan. , Light leakage will occur from this place (refer to Figure 9(b) for the light leakage area of the final scanning part enclosed by an ellipse.). This is because when performing ultrashort pulse laser scanning, a non-bridging oxygen hole center is once formed and the ultrashort pulse laser is irradiated from above the heavily colored area, and then when the heavily colored area melts, the non-bridging oxygen The structure in the center of the cavity will disintegrate and cause discoloration. By scanning repeatedly, the faded area can also be colored again, but only the final scanned area will still have a lighter area that remains faded, and light leakage will occur from there. At this time, the visible light transmittance is 0% or more and 50% or less in the densely colored area, but the visible light transmittance in the light leakage area is as high as 60% or more. In addition, even in the corner portion of the surface processing, light leakage occurs due to stress generated between the processed area and the unprocessed area (refer to the light leakage area of the corner portion of FIG. 9(b)).

Regarding this problem, (a) to (c) of FIG. 10 are respectively a schematic exploded perspective view showing the plural colored layers 2-1, 2-2, and 2-3 of the light-reducing portion 1 of the first embodiment of the present invention, and The image of the colored layers viewed from a plane.

When forming a plurality of colored layers 2-1 and 2-2 of the light-reducing part 1, they are processed in order from the surface away from the glass substrate GB. Thereby, the light-reducing part 1 formed at the time of processing does not block the light.

In the following example, as an example, a case where three colored layers 2 are formed will be described. In addition, as another example, when two colored layers 2 are formed, it is only necessary to form the following first colored layer 2-1 and second colored layer 2-2.

First, the first colored layer 2-1 of the first layer forms a colored layer in a spiral shape from the outer periphery to the center. Although the first colored layer 2-1 depends on the pixel size or the distance from the back surface of the glass substrate GB, the outer diameter of the first colored layer 2-1, that is, the diameter is 10 μm or more and 500 μm or less. In addition, the first colored layer 2-1 of the first layer is arranged at a position of 5 μm or more and 250 μm or less from the bottom surface of the glass substrate GB. When the distance is less than 5 μm from the bottom surface, since it is not the internal processing of the glass but the back processing, there is a possibility that the color filter CF, the black matrix BM, etc. may be surely damaged. In addition, when the distance from the bottom surface is more than 250μm, the colored layer must be used to cover the bright spots when viewing the panel from an oblique direction. Therefore, the diameter of the colored layer must be larger than 500μm, so that 3 or more pixels will definitely lose its function. Can't be called a good product. In addition, if the diameter of the first colored layer 2-1 is smaller than 10 μm, when the panel is viewed from an oblique direction, it becomes impossible to cover the bright point defect with the colored layer. On the other hand, when the diameter of the colored layer 2-1 exceeds 500 μm, the pixels of the LCD panel where the colored layer is formed will damage the pixels of the LCD panel, so that more than 3 pixels do not function and become undesirable.

At this time, light leakage on the first colored layer 2-1 may occur in the central part. That is, the transmittance of visible light of the first colored layer 2-1 of the first layer is higher in the central part than in the outer peripheral part. Specifically, when the first colored layer 2-1 is viewed in plan, the light leakage portion 9-1 is located at the center portion thereof, and the light shielding portion 10-1 is arranged on the outer peripheral portion so as to surround the light leakage portion 9-1. The visible light transmittance of the light leakage portion 9-1 is 60% or more, and the visible light transmittance of the light shielding portion 10-1 is 0% or more and 50% or less.

Next, the second colored layer 2-2 of the second layer is formed in the thickness direction of the glass substrate GB, and is closer to the surface of the glass substrate GB than the first colored layer 2-1 of the first layer is equivalent to 10 μm or more, In the position below 200μm. The second colored layer 2-2 of the second layer is a colored layer formed in a spiral shape from the center to the outer periphery. The diameter of the second colored layer 2-2 of the second layer is set to 10% or more and 90% or less of the diameter of the first colored layer 2-1 of the first layer. When the diameter of the second colored layer 2-2 is less than 10% of the diameter of the first colored layer 2-1, the first colored layer 2-1 and the third layer The central part of the third colored layer 2-3 leaks light to reduce light. In addition, when the diameter of the second colored layer 2-2 exceeds 90% of the diameter of the first colored layer 2-1, the light leakage portion 9-2 of the outer peripheral portion of the second colored layer 2-2 of the second layer is exposed When the light is scattered toward the outside, it can also be reduced by the light-shielding portion 10-1 of the first colored layer 2-1 of the first layer and the light-shielding portion 10-3 of the third colored layer 2-3 of the third layer. Light. Thereby, the coloring layer 2-2 of the second layer will be colored densely in the center part, and light leakage will occur in the outer peripheral part. That is, the visible light transmittance of the second colored layer 2-2 of the second layer is higher in the outer peripheral part than in the central part. Specifically, when the second colored layer 2-2 is viewed in plan, the light-shielding portion 10-2 is located at the center portion thereof, and the light leakage portion 9-2 is arranged on the outer peripheral portion so as to surround the light-shielding portion 10-2. The visible light transmittance of the light leakage portion 9-2 is 60% or more, and the visible light transmittance of the light shielding portion 10-2 is 0% or more and 50% or less. Furthermore, in the first colored layer 2-1 of the first layer and the second colored layer 2-2 of the second layer, the arrangement of the light leakage portions 9-1, 9-2 and the light shielding portions 10-1, 10-2 It is the opposite relationship. In addition, the first colored layer 2-1 of the first layer and the second colored layer 2-2 of the second layer are arranged so that their central portions overlap in a plane orthogonal to the thickness direction of the glass substrate GB. That is, the light leakage portion 9-1 of the first colored layer 2-1 of the first layer and the light shielding portion 10-2 of the second colored layer 2-2 of the second layer are viewed in plan (that is, from the display surface side). Look at) overlapping.

Next, the third colored layer 2-3 of the third layer is formed in the thickness direction of the glass substrate GB and is closer to the surface of the glass substrate GB than the second colored layer 2-2 of the second layer is equivalent to 10 μm or more, In the position below 200μm. The third colored layer 2-3 of the third layer has the same size as the first colored layer 2-1 of the first layer, and the colored layer is spirally formed from the outer periphery to the center. The light leakage portion 9-3 and the light shielding portion 10-3 of the third colored layer 2-3 of the third layer are arranged in a plane orthogonal to the thickness direction of the glass substrate GB to be aligned with the first colored layer 2 of the first layer. The positional relationship between the light leakage portion 9-1 of -1 and the light shielding portion 10-1 is the same.

By forming three layers of the first, second, and third colored layers 2-1, 2-2, and 2-3 as described above, the light leakage in the center part will be blocked by the light-shielding part 10- of the second colored layer 2-2. 2 Suppression, the light leakage of the outer peripheral portion is suppressed by the light shielding portion 10-1 of the first colored layer 2-1 and the light shielding portion 10-3 of the third colored layer 2-3.

Here, it is preferable that the location of the light-shielding portion 10-1 of the first colored layer 2-1 of the first layer is arranged at the outer peripheral portion. This is because when the display panel DP is viewed from an oblique direction, only the outer peripheral portion of the first colored layer 2-1 of the first layer can reduce the brightness of the bright spot defect. When light leakage occurs in the outer peripheral portion of the first colored layer 2-1 of the first layer, in order to reduce the light leakage during oblique viewing by the second colored layer 2-2 of the second layer, it is necessary to reduce the light leakage of the second colored layer 2-2 of the second layer. 2 The colored layer 2-2 is processed with a larger size than the first colored layer 2-1 of the first layer. As a result, since the processing size when viewed from the front becomes larger, it becomes less desirable to dim the periphery of the bright spot defect in a wide range. Therefore, the first colored layer 2-1 of the first layer is processed so that the light leakage part (that is, the light leakage portion 9-1) will be formed in the center part, and the center will be formed on the second colored layer 2-2 of the second layer. The part is colored densely as the light-shielding part 10-2, and it is more desirable to reduce the light leakage on the first colored layer 2-1 of the first layer.

In addition, by making the planar shape of the colored layer 2 into a circular shape, the stress originally generated in the corner portion is alleviated, and the light leakage of the corner portion as shown in FIG. 9 is suppressed. At this time, the shape of the processing marks of the colored layer 2 may be a shape that can relax the stress of the corner portion, and may be a polygon with an octagon or more, a polygon with rounded corners, or the like. For example, when the foreign matter caused by the bright spot defect is a slender shape like shavings, by matching its shape and processed into an ellipse or egg shape, the light-reducing portion 1 of the colored layer 2 having a shape corresponding to the bright spot defect can be formed.

The size of the second colored layer 2-2 of the second layer is made smaller than the size of the first colored layer 2-1 of the first layer and the size of the third colored layer 2-3 of the third layer. When the light leaking from the outer periphery of the second colored layer 2-2 of the second layer is scattered toward the outside, it can also be used by the first colored layer 2-1 of the first layer and the third colored layer of the third layer. 2-3 to dimming. However, if the size of the second colored layer 2-2 is too small, the light leakage at the center of the first colored layer 2-1 and the third colored layer 2-3 of the third layer cannot be sufficiently reduced to reduce light. , So the size of the second colored layer 2-2 of the second layer is 10% or more and 90% of the size of the first colored layer 2-1 of the first layer or the size of the third colored layer 2-3 of the third layer The following are more expected.

According to the first embodiment, in the inside of at least one of the first glass substrate GB1 and the second glass substrate GB2, there are a plurality of layers overlapping and the coloring of the light-reducing portion 1 that covers the bright spot defect portion 133 when viewed from the display surface side Layers 2-1, 2-2, 2-3, and the final scanning part of the laser light 4 formed into the colored layers 2-1, 2-2, 2-3 will be different, and they will be formed as a circle when viewed from a plane shape. With this configuration, it is possible to suppress the degradation of the display quality caused by the bright spot defect. (Second Embodiment)

Next, as a second embodiment of the present invention, a method of manufacturing the liquid crystal display device LCD of the first embodiment will be described. This method demonstrates the manufacturing method of the display device provided with the 1st glass substrate GB1, and the 2nd glass substrate GB2 which opposes the said 1st glass substrate GB1, and is located on the display surface side.

The manufacturing method of this display device has: an inspection step of performing a light-on inspection of the display device to detect the bright spot defect portion 133 of the pixel; and an irradiation step, in order to cover the bright spot defect portion 133, on the first or second glass substrate The GB1 or GB2 is irradiated with laser light 4 to form a plurality of colored layers 2 and void layers 3. The laser light 4 irradiated in the foregoing irradiation step has a wavelength of 100 nm or more and 10000 nm or less, a pulse width of 1 femtosecond or more and 100 picoseconds or less, a pulse energy of 1 μJ or more and 20 μJ or less, and the NA is 0.3 or more and 0.9 Condensed by the following lens. It would be more ideal if the lens has aberration correction function.

In more detail, this manufacturing method includes the manufacturing process of the TFT substrate SUB1, the manufacturing process of the CF substrate SUB2, the bonding process of the TFT substrate SUB1 and the CF substrate SUB2, the liquid crystal injection process, the lighting inspection process of the display panel DP, and Bright spot defect correction process.

Among the aforementioned steps, the TFT substrate SUB1 manufacturing process, the CF substrate SUB2 manufacturing process, the bonding process of the TFT substrate SUB1 and the CF substrate SUB2, the liquid crystal injection process, and the lighting inspection process can all apply well-known methods.

For example, the manufacturing process of the TFT substrate SUB1 includes a process of forming a gate line GL, a data line DL, a pixel electrode PIT, a common electrode CIT, various insulating films, and a polarizing plate POL1 on the first glass substrate GB1. The pixel P defined on the TFT substrate SUB1 may also include a red pixel Pr corresponding to red, a green pixel Pg corresponding to green, and a blue pixel Pb corresponding to blue. In addition, the manufacturing process of the CF substrate SUB2 includes a process of forming the black matrix BM, the color filter CF, and the polarizing plate POL2 on the second glass substrate GB2.

Hereinafter, the lighting inspection process and the bright point defect correction process in this manufacturing method will be described.

FIG. 11A is a flowchart showing a method of correcting a bright spot defect. FIG. 11B is a block diagram showing a manufacturing apparatus 95 of a display device capable of implementing a method for correcting a bright spot defect.

The manufacturing device 95 of the display device includes at least an inspection device 90 that performs a light-on inspection of the display device to detect bright point defects of pixels, and a bright point defect correction device 6. The manufacturing device 95 may further include a control device 93 and a computing unit 91. The control device 93 controls the operation of the inspection device 90, the computing unit 91, and the bright spot defect correction device 6 respectively. The calculation unit 91 performs predetermined calculations as described later.

First, in the light-on inspection process, the inspection device 90 detects bright spot defects. For example, the inspection device 90 may turn on all the display panels DP or turn them on in a row to measure the brightness of each pixel (step S001).

Next, the inspection device 90 detects the pixel whose brightness is measured to exceed the threshold value as the bright point defect portion 133 (pixel defect portion) (step S002). The inspection device 90 outputs the position information of the pixels detected as the bright spot defect portion 133 to the bright spot defect correction device 6 described later. The detection of the bright spot defect portion 133 can also be performed by the operator's visual inspection. When the bright spot defect part 133 is detected, it transfers to the bright spot defect correction process (step S030). When the bright spot defect 133 is not detected, this flow is ended.

In FIG. 13, the outline structure of the bright spot defect correction apparatus 6 for performing the bright point defect correction process (step S030) is shown. The bright spot defect correction device 6 includes an ultra-short pulse laser oscillation mechanism 7 and a high-condensing lens 8 and other optical systems.

In the second embodiment, as an example, as the ultrashort pulse laser oscillation mechanism 7, a laser light with a wavelength of 1552 nm and a laser light with a pulse width of 800 fs is used.

The bright spot defect correction process (step S030) includes the processes from step S003 to step S006.

In the bright spot defect correcting process (step S030), first, the bright spot defect correcting device 6 obtains the position information and shape information (for example, position, size, shape) of the pixel of the bright spot defect from the inspection device 90 (step S003).

Next, based on the obtained shape information, the calculation unit 91 calculates the shape and position information (for example, position, size, shape) of the dimming unit 1 formed by irradiating the ultrashort pulse laser light 4 (step S004).

Next, under the control of the control device 93, based on the position information of the dimming unit 1 calculated by the calculation unit 91, optical systems such as the high condensing lens 8 of the bright point defect correction device 6 are aligned.

Next, under the control of the control device 93, the bright spot defect correction device 6 adjusts the position of the focal point F of the ultrashort pulse laser light 4 to a desired position inside the second glass substrate GB2. The position of the focal point F is adjusted based on, for example, the size of a foreign object that causes a bright spot defect or the measured brightness value. For example, as shown in FIG. 13, in the inside of the second glass substrate GB2, the focal point F of the ultrashort pulse laser light 4 is adjusted to be on the side near the foreign object 33.

Next, under the control of the control device 93, the bright spot defect correction device 6 emits the ultrashort pulse laser light 4 from the ultrashort pulse laser oscillation mechanism 7. Thereby, the ultrashort pulse laser light 4 emitted from the ultrashort pulse laser oscillation mechanism 7 is condensed by the high condensing lens 8 to the focal point F inside the second glass substrate GB2 and irradiated.

Then, under the control of the control device 93, the irradiation position of the ultra-short pulse laser light 4 is moved by the moving device 92, and the ultra-short pulse laser light 4 is continuously irradiated, thereby forming different dimming at the final scanning position The plural colored layers 2-1, 2-2, 2-3 of the part 1 (step S005), and the bright point defect trimming process (step S030) is completed (step S006). In step S005, the positions of the final scanning portion of the laser light 4 formed into the colored layers 2-1, 2-2, and 2-3 are different from each other.

According to the manufacturing method of the liquid crystal display device LCD of the second embodiment of the present invention, the inspection using the existing inspection device is feasible. Since only the devices found to be defective in the inspection process are sent to the correction process, there is no problem. The advantage of the overall process production distance. (Modification)

Fig. 12 is a flowchart showing another method of correcting a bright spot defect as a modification of the second embodiment.

First, in the inspection device 90, the display device is turned on (step S007), and a bright spot defect is detected (step S008). In the same manner as in step S002, the inspection device 90 detects a pixel whose brightness is measured to exceed the threshold value as a bright point defect 133 (pixel defect). The inspection device outputs the position information of the pixels detected as the bright spot defect portion 133 to the bright spot defect correction device 6. The detection of the bright spot defect portion 133 can also be performed by the operator's visual inspection. When the bright spot defect part 133 is detected, it transfers to the bright spot defect correction process (step S040). When the bright spot defect 133 is not detected, this flow is ended.

The bright spot defect correction process (step S040) includes step S009 to step S013.

In the bright spot defect correction process (step S040), first, the bright spot defect correction device 6 obtains the position information and shape information (for example, position, size, shape) of the pixel of the bright spot defect from the inspection device (step S009).

Next, based on the obtained shape information, the calculation section 91 calculates the shape and position information (for example, position, size, shape) of the dimming section 1 formed by irradiating the ultrashort pulse laser light 4 (step S010).

Next, under the control of the control device 93, based on the position information of the dimming unit 1 calculated by the calculation unit 91, optical systems such as the high condensing lens 8 of the bright point defect correction device 6 are aligned.

Next, under the control of the control device 93, the bright spot defect correction device 6 adjusts the position of the focal point F of the ultrashort pulse laser light 4 to a desired position inside the second glass substrate GB2. The position of the focal point F is adjusted based on, for example, the size of a foreign object that causes a bright spot defect or the measured brightness value. For example, as shown in FIG. 13, in the interior of the second glass substrate GB2, the focal point F of the ultrashort pulse laser light 4 adjusted to a high-energy beam is aimed at the vicinity of the foreign object 33.

Next, under the control of the control device 93, the bright spot defect correction device 6 emits the ultrashort pulse laser light 4 from the ultrashort pulse laser oscillation mechanism 7. Thereby, the ultrashort pulse laser light 4 emitted from the ultrashort pulse laser oscillation mechanism 7 is condensed by the high condensing lens 8 to the focal point F inside the second glass substrate GB2 and irradiated.

Next, under the control of the control device 93, the irradiation position of the ultra-short pulse laser light 4 is moved by the moving device 92, and the ultra-short pulse laser light 4 is continuously irradiated, thereby forming a plurality of different final scanning positions. Layer colored layers 2-1, 2-2, 2-3 (step S011).

After forming a plurality of colored layers 2-1, 2-2, and 2-3, under the control of the control device 93, the lighting inspection is performed again (step S012), it is confirmed that the bright spot defect has disappeared, and the bright spot defect correction process is completed ( Step S040) (Step S013).

Under the control of the control device 93, if a bright spot defect is detected in the second and subsequent lighting inspection steps, the process returns to step S009, and the bright spot defect correction is performed again (from steps S009 to S011). In the correction of the bright spot defect after the second time, the shape, size, or number of layers may be different from the dimming portion 1-1 formed in the first time.

According to this modified example, it is possible to confirm whether the correction has been sufficiently performed and whether the black spots are defective due to coloring by performing a re-inspection after the correction.

In this way, in the bright point defect correction step (step S030 or S040) of the second embodiment or its modified example, the glass material is colored by focusing the focus on the glass substrate GB to irradiate the high-energy light beam. This causes the shape of the glass substrate itself to change. For example, there will not be a situation where the inside or surface of the glass substrate GB is destroyed and the shape is changed. Therefore, the aforementioned bright spot defect correction process (step S030 or S040) can be performed in a state where, for example, the polarizing plates POL1 and POL2 have been formed on the TFT substrate SUB1 and the CF substrate SUB2, that is, after the display panel DP is completed. In addition, since the dimming part 1 and the glass substrate GB are made of the same material, there is no possibility that the refractive index changes.

As mentioned above, although a plurality of embodiments of the present invention have been described, the present invention is not limited to the foregoing embodiments, and within the scope not departing from the spirit of the present invention, those with ordinary knowledge in the technical field to which the present invention belongs will learn from the foregoing embodiments. The form suitably changed in is also included in the technical scope of this invention.

In addition, by appropriately combining any of the aforementioned various embodiments or modifications, the effects possessed by each can be exhibited. In addition, the combination of the embodiments or the combination of the embodiments or the combination of the embodiment and the embodiment is possible, and the combination of the features in different embodiments or the embodiments is also possible. Industrial availability

The display device of the aforementioned aspect of the present invention and the manufacturing method thereof can suppress the degradation of the display quality caused by the defect of the bright spot, and is particularly useful for a liquid crystal display or an organic EL flat panel display with a built-in display device, and can be widely used in There are display devices and manufacturing methods and manufacturing devices for displays that require high brightness, high definition, and image quality uniformity, and electrical equipment or devices with display devices.

AF‧‧‧Alignment film BM‧‧‧Black matrix CF‧‧‧Color filter CIT‧‧‧Common electrode CONT‧‧‧Contact hole DL‧‧‧Data line DM‧‧‧Drain electrode DP‧‧‧Display panel GB, GB1, GB2‧‧‧Gate insulating film GL‧‧‧Gate line LC‧‧‧Liquid crystal layer LCD‧‧‧Liquid crystal display device OC‧‧‧Coating PAS‧‧‧Insulation Film PIT‧‧‧Pixel electrode POL1, POL2‧‧‧Polarizing plate SEM‧‧‧Semiconductor layer SM‧‧‧Source electrode SUB1‧‧‧TFT substrate SUB2‧‧‧CF substrate TFT‧‧‧Thin film transistor UPAS‧‧ ‧Upper insulating film1‧‧‧Light-reducing part2‧‧‧Colored layers 2-1, 2-2, 2-3‧‧‧The first, second and third colored layers 3‧‧‧Void layer 4‧‧ ‧Ultrashort pulse laser light 5‧‧‧Refractive index change layer6‧‧‧Bright spot defect correction device7‧‧‧Ultrashort pulse laser oscillation mechanism8‧‧High condensing lens 9,9-1,9-2,9 -3‧‧‧Light leakage part 10, 10-1, 10-2, 10-3‧‧‧Light shielding part 30‧‧‧Data line driving circuit 31‧‧‧Gate line driving circuit 32‧‧‧Opening part 33‧ ‧‧Foreign objects (mixed objects) 34‧‧‧Backlight light 70‧‧‧(void) forming area 71‧‧‧Melt area 72‧‧‧Coloring area 90‧‧‧Inspection device 91‧‧‧Calculating unit 92‧‧‧ Mobile device 93‧‧‧Control device 95‧‧‧Display device manufacturing device 133‧‧‧Bright spot defect part 134‧‧‧Backlighting F‧‧‧Focus P‧‧‧Pixels S001~S013, S030, S040‧‧‧ step

Fig. 1 is a diagram showing the overall configuration of a liquid crystal display device according to a first embodiment of the present invention. FIG. 2 is a plan view showing the structure of a part of a display panel of the liquid crystal display device of FIG. 1. FIG. Fig. 3 is an end view of a cut portion cut along the line A1-A2 in Fig. 2; 4 is a cross-sectional view schematically showing an example of a bright spot defect in the liquid crystal display device of FIG. 1. 5 is a cross-sectional view showing the structure of a pixel having a dimming portion in the liquid crystal display device of the first embodiment. Fig. 6 is a schematic diagram of the vicinity of the focal point during glass internal processing. Fig. 7 is a diagram showing an image of a person who has performed a straight line processing inside the glass viewed from a plane. Fig. 8 is a view showing an image of a cross section of the straight line processing of Fig. 7 viewed. Fig. 9 (a) and (b) are respectively a diagram showing the scanning direction when a square surface is processed by arranging straight lines and a diagram showing an image in which the processing marks are viewed in a plane. Fig. 10 is a diagram showing an example of the formation pattern of the light-reducing portion in the first embodiment of the present invention, and a plan view of an image of processing marks when vortex processing is performed in a different scanning direction. 11A is a flowchart showing a method of correcting a bright spot defect in the liquid crystal display device of the second embodiment. FIG. 11B is a block diagram of a manufacturing apparatus of a display device capable of implementing a method for correcting a bright spot defect. 12 is a flowchart showing a method of correcting a bright spot defect in a liquid crystal display device according to a modification of the second embodiment. Fig. 13 is a schematic diagram showing the structure of a manufacturing apparatus of a liquid crystal display device according to a second embodiment.

2-1, 2-2, 2-3‧‧‧The first, second, and third colored layers

9-1, 9-2, 9-3‧‧‧Light leakage part

10-1、10-2、10-3‧‧‧Shading part

Claims (6)

A display device is provided with a first glass substrate and a second glass substrate opposite to the first glass substrate and located on the display surface side, and only on at least one of the first glass substrate and the second glass substrate The interior of the device has a dimming portion that covers the defect of the bright spot when viewed from the display surface side, and the dimming portion includes a first colored layer with a higher transmittance of visible light at the center than at the outer periphery, and a visible light The second colored layer having a higher transmittance at the outer peripheral portion than the center portion. The first colored layer and the second colored layer are arranged at different positions in the thickness direction, and are arranged so as to be mutually different when viewed from the display surface side. The center will overlap. The display device of claim 1, wherein the first colored layer and the second colored layer are each circular, elliptical, rounded polygonal, oval, or octagonal or more polygonal in plan view . The display device of claim 1, wherein the second colored layer is located closer to the display surface side than the first colored layer. The display device of claim 1, wherein the outer shape of the second colored layer is smaller in size than the outer shape of the first colored layer. The display device according to any one of claims 1 to 4, wherein the visible light transmittance of the central portion of the first colored layer is 60% or more, and the visible light transmittance of the outer peripheral portion is 0% or more and 50% or less . A method of manufacturing a display device is provided with the first glass A method for manufacturing a display device of a glass substrate and a second glass substrate facing the first glass substrate and located on the display surface side includes: an inspection and inspection step of performing lighting inspection of the display device to detect the bright spot defect of the pixel ; And the irradiation step, irradiating laser light to focus on the inside of the first or second glass substrate, covering the bright spot defect portion, so that only at least one of the first glass substrate and the second glass substrate In the interior, a first colored layer with a higher transmittance of visible light at the center than at the outer peripheral portion and a second colored layer with a higher transmittance of visible light at the outer peripheral portion than at the center are formed to form the structure viewed from the display surface side. Cover the light-reducing part of the bright spot defect part, and the colored layers are arranged so that the light leakage of each final scanning part becomes different positions and the central part of each other when viewed from the display surface side overlaps, and is arranged in the thickness Positions that are different from each other in the directions, the laser light irradiated in the irradiation step has a wavelength of 100 nm or more and 10000 nm or less, a pulse width of 1 femtosecond or more and 100 picoseconds or less, and a pulse energy of 1 μJ or more and 20 μJ or less, and , Is condensed by a lens with NA of 0.3 or more and 0.9 or less.

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