TWI721859B - Fluoropolymer high-frequency substrate, cover film, bondply and preparation method thereof - Google Patents

Abstract

The present invention provides a fluoropolymer high-frequency substrate, a cover film and a bondply. The substrate is, for example, a single-sided copper-clad substrate, a FRCC or a double-sided copper-clad substrate. The substrate comprises a copper foil layer, a low-dielectric adhesive layer, a fluoropolymer layer and a polyimide layer. The cover film and bondply comprise a low-dielectric adhesive layer, a fluoropolymer layer, and a polyimide layer. The present invention utilizes the low Dk / Df characteristics of the fluorine-based polymer, and is combined with a low dielectric adhesive layer with a low Dk / Df and a low-roughness copper foil, so that the finished product has low dielectric loss and is beneficial to high-frequency and high-speed transmission. In addition, a low-dielectric adhesive layer is used to bond the copper foil and the fluoropolymer layer, and a polyimide film is used as a support, so that the substrate has good adhesion strength, low thermal expansion coefficient, and high dimensional stability.

Description

Fluorine polymer high-frequency substrate, covering film, bonding sheet and preparation method thereof

The present invention relates to the technical field of flexible circuit boards (FPC), especially low-Dk/Df high-frequency single-sided copper foil substrates, flexible back adhesive copper foil substrates (FRCC), double-sided copper foil substrates, Cover film and bonding sheet (Bondply), provide 5G and millimeter wave application solutions.

Printed circuit boards are an indispensable material in electronic products. As the demand for consumer electronic products grows, the demand for printed circuit boards is also increasing day by day. Because flexible printed circuit boards have the characteristics of flexibility and three-dimensional wiring, under the development trend of scientific and technological electronic products emphasizing lightness, thinness, shortness, and flexibility, they have been widely used in computers and their peripherals and communication products. And consumer electronics and other fields.

Furthermore, due to the development of electronic products toward high-frequency and high-speed applications, today's electronic products need to use flexible printed circuit substrates for high-frequency circuits to enable electronic products to operate at high frequencies and high speeds. Among the many materials used as printed circuit boards for high-frequency circuits, in addition to ceramics and foam materials, fluorine-based resins are mostly used. The reason is that fluorine-based resins have excellent electrical properties such as low dielectric constant and low dielectric loss. Characteristics, such as the dielectric constant of polytetrafluoroethylene (PTFE) fluorine-based substrates at a frequency of 10GHz (Dielectric constant, Dk) is about 2.1, and dielectric loss factor (Df) is about 0.0004. It also has excellent properties of low water absorption of about 0.03%.

However, the surface properties of fluorine-based resins have extremely low surface energy, so they are not easy to adhere to metals and easily cause delamination, which makes the yield of fluorine-based substrates low, requires surface treatment, and has fewer choices of copper foils. Use low-roughness copper foil with low transmission loss, or need to be adhered by other adhesive layers. In addition, its high thermal expansion coefficient (approximately 200ppm/℃) is likely to cause poor dimensional stability, and dimensional changes will directly affect the production of conductor lines and alignment problems, especially for high-density requirements. Lines are becoming more and more demanding. Under subtle conditions, the degree of influence is even more obvious. In addition, fluorine-based resins are also limited by process technology, require high manufacturing equipment and need to be operated in a higher temperature environment (>280°C), which also causes the problem of uneven film thickness. Uneven film thickness will make it difficult to control the impedance value of the circuit board, and the high-temperature pressing process will cause the PTFE extrusion to affect the continuity of the copper plating and form an open circuit, which will result in poor reliability and reduced reliability; in addition, it is facing PTFE is mostly in the form of sheets and cannot use the roll-to-roll lamination process, resulting in processing difficulties, low mass production, and more consumables. In addition, in surface mount (SMT) high temperature manufacturing processes or other FPC manufacturing processes, such as bending, strong acid and strong alkali chemical solutions, the bonding strength is insufficient, resulting in a decrease in yield.

For example, US Patent No. US 3676566 A proposes a composite layered structure of polyimide and fluorocarbon polymer, Taiwan Patent No. TW M531056 U, Chinese Patent No. CN 103096612 B, Chinese Patent No. CN 202276545 U, and Chinese Patent No. TW Taiwan Patent No. M422159 U1, Taiwan Patent No. TW M436933 U1, Chinese Patent No. CN 202773176 U, etc. propose high-frequency substrate structures, and Chinese patent No. CN 105269884 B proposes a composite high-frequency double-sided copper foil substrate and its manufacturing method. Taiwan Patent No. TW I645977 B proposes PI-type double-sided copper foil substrate for high-frequency and high-speed transmission and its preparation method. Chinese Patent No. CN 207772540 U proposes LCP or fluorine-based polymer high-frequency and high-transmission double-sided copper foil substrate. CN 207744230 No. U Chinese patent proposes a composite fluorine-based polymer high-frequency and high-transmission double-sided copper foil substrate And the preparation method, the Chinese patent No. CN 105295753 B proposes the structure of the high-frequency adhesive layer and the preparation method thereof, and the Chinese patent No. CN 105282959 B proposes a high-frequency cover film with low Dk and Df characteristics and the preparation method thereof. The patent does not disclose the fluorine-based polymer substrate, cover film and adhesive sheet with the same structure and properties as the present invention.

The main technical problem to be solved by the present invention is to provide a fluorine-based polymer high-frequency substrate, cover film, adhesive sheet and preparation method thereof, which has extremely low Dk/Df characteristics, can greatly reduce the loss of signal transmission, and has high adhesion. Strength, low thermal expansion coefficient and high dimensional stability, and can use low-temperature compression and fast press equipment.

In order to solve the above technical problems, the present invention provides a fluorine-based polymer high-frequency substrate, which is a single-sided copper-clad substrate, including a copper foil layer, a first low-dielectric adhesive layer, a fluorine-based polymer layer, The structure of the second low dielectric adhesive layer and the polyimide layer, and the total thickness of the single-sided copper-clad substrate is 41 μm to 385 μm.

In a specific embodiment, the fluorine-based polymer high-frequency substrate includes a third low-dielectric adhesive layer to become a flexible back adhesive copper foil substrate (FRCC), and the third low-dielectric adhesive layer is formed On the polyimide layer, the polyimide layer is positioned between the second low-dielectric glue layer and the third low-dielectric glue layer, and the total thickness of the fluorine-based polymer high-frequency substrate is 46 μm To 435μm.

In a specific embodiment, the fluorine-based polymer high-frequency substrate includes another copper foil layer formed on the third low-dielectric adhesive layer to become a double-sided copper-clad substrate, and the fluorine-based polymer The total thickness of the high-frequency substrate is 47 μm to 470 μm.

The present invention also provides a fluorine-based polymer high-frequency substrate, which is a single-sided copper-clad substrate, including a copper foil layer, a first low-dielectric adhesive layer, a first polyimide layer, and a second low-dielectric layer laminated in sequence. Dielectric glue layer, The structure of the fluorine-based polymer layer, the third low dielectric adhesive layer and the second polyimide layer, and the total thickness of the single-sided copper-clad substrate is 51 μm to 485 μm.

In a specific embodiment, the fluorine-based polymer high-frequency substrate includes a fourth low-dielectric adhesive layer to become a flexible back adhesive copper foil substrate (FRCC), and the fourth low-dielectric adhesive layer is formed On the second polyimide layer, the second polyimide layer is located between the third low-dielectric glue layer and the fourth low-dielectric glue layer, and the fluorine-based polymer high-frequency substrate The total thickness is 56 μm to 535 μm.

In a specific embodiment, the fluorine-based polymer high-frequency substrate includes another copper foil layer formed on the fourth low-dielectric adhesive layer to become a double-sided copper-clad substrate, and the fluorine-based polymer The total thickness of the high-frequency substrate is 57 μm to 570 μm.

In a specific embodiment, the dielectric constant (Dk) of the fluorine-based polymer layer used is 1.0 to 3.0 (10GHz), the dielectric loss factor (Df) is 0.0001 to 0.002 (10GHz), and the water absorption is It is 0.001 to 0.1% of insulating polymer layer.

In a specific embodiment, the thickness of the copper foil layer used is 1 μm to 35 μm, and the thickness of each of the first, second, third, and fourth low-dielectric adhesive layers used is 5 μm to 50 μm. The thickness of the fluorine-based polymer layer used is 25 μm to 200 μm, and the thickness of each of the polyimide layer and the first and second polyimide layers used is 5 μm to 50 μm.

In a specific embodiment, the copper foil layer used is a low-profile copper foil layer with an Rz value of 0 μm to 1.2 μm and an Ra value of 0 μm to 0.4 μm, and the copper foil layer is a rolled copper foil layer or electrolytic copper Foil layer.

In a specific implementation aspect, each of the first, second, third, and fourth low-k layer used has a Dk value of 2.0 to 3.5 (10GHz) and a Df value of 0.001 to 0.010 (10GHz) Adhesive layer, and the polyimide layer, the first and second polyimide layers used are each an insulating polymer layer with a Dk value of 2.0 to 3.5 (10GHz) and a Df value of 0.002 to 0.010 (10GHz) .

In a specific embodiment, the fluorine-based polymer layer used includes a fluorine-based polymer resin selected from the group consisting of polytetrafluoroethylene, polyvinylidene fluoride, vinyl fluoride and vinyl ether. Polymers, copolymers of tetrafluoroethylene and ethylene, copolymers of polychlorotrifluoroethylene and ethylene, copolymers of hexafluoropropylene and vinylidene fluoride, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, polytrifluoroethylene At least one of chlorofluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer, ethylene-fluoroethylene copolymer, and tetrafluoroethylene-hexafluoropropylene-trifluoroethylene copolymer.

In a specific embodiment, each of the first, second, third, and fourth low-dielectric adhesive layers used includes a resin selected from the group consisting of fluorine resins, epoxy resins, acrylic resins, and amines. At least one of carbamate-based resin, silicone rubber-based resin, parylene-based resin, bismaleimide-based resin, and polyimide-based resin.

In addition to the fluorine-based polymer high-frequency substrate, the present invention also provides a fluorine-based polymer cover film, which includes a first low-dielectric adhesive layer, a fluorine-based polymer layer, and a second low-dielectric adhesive layer laminated in sequence And the structure of the polyimide layer, and the total thickness of the fluorine-based polymer cover film is 40 μm to 350 μm.

The present invention also provides a fluorine-based polymer cover film, including a first low-dielectric adhesive layer, a first polyimide layer, a second low-dielectric adhesive layer, a fluorine-based polymer layer, and a third The structure of the low dielectric adhesive layer and the second polyimide layer, and the total thickness of the fluorine-based polymer covering film is 50 μm to 450 μm.

In addition to the above products, the present invention also provides a fluorine-based polymer adhesive sheet, which includes a first low-dielectric adhesive layer, a fluorine-based polymer layer, a second low-dielectric adhesive layer, and a polyimide layer laminated in sequence. And the structure of the third low-dielectric adhesive layer, and the total thickness of the fluorine-based polymer bonding sheet is 45 μm to 400 μm.

The present invention also provides a fluorine-based polymer adhesive sheet, which includes a first low-dielectric adhesive layer, a first polyimide layer, a second low-dielectric adhesive layer, a fluorine-based polymer layer, and a third The structure of the low dielectric adhesive layer, the second polyimide layer and the fourth low dielectric adhesive layer, and the total thickness of the fluorine-based polymer bonding sheet is 55 μm to 500 μm.

The preparation method of the fluorine-based polymer high-frequency substrate (fluorine-based polymer single-sided copper-clad substrate) of the present invention includes:

Coat the first low-dielectric adhesive layer on the surface of the fluoropolymer layer, remove the solvent at a temperature range of 60°C to 180°C, and then laminate the first low-dielectric adhesive layer with the copper foil , Get semi-finished product A;

The second low-dielectric adhesive layer is coated on the surface of the polyimide layer, the solvent is removed at a temperature range of 60°C to 180°C, and then the second low-dielectric adhesive layer and the fluorine-based layer of the semi-finished product A The polymer is laminated to obtain semi-finished product B; and

The semi-finished product B is cured at 160°C to 200°C for more than 5 hours to obtain a finished fluorine-based polymer single-sided copper-clad substrate.

The preparation method of the fluorine-based polymer high-frequency substrate (fluorine-based polymer FRCC) of the present invention includes:

Coat the first low-dielectric adhesive layer on the surface of the fluoropolymer layer, remove the solvent at a temperature range of 60°C to 180°C, and then laminate the first low-dielectric adhesive layer with the copper foil , Get semi-finished product A;

The second low-dielectric adhesive layer is coated on the surface of the polyimide layer, the solvent is removed at a temperature range of 60°C to 180°C, and then the second low-dielectric adhesive layer and the fluorine-based layer of the semi-finished product A The polymer is laminated to obtain semi-finished product B;

Curing the semi-finished product B at 160°C to 200°C for more than 5 hours to obtain the semi-finished product C; and

The third low-dielectric adhesive layer is coated on the other surface of the polyimide layer of the semi-finished product C, the solvent is removed in the temperature range of 60°C to 180°C, and the third low-dielectric adhesive layer is separated from the Type lamination to obtain a finished fluorine-based polymer flexible back adhesive copper foil substrate.

The preparation method of the fluorine-based polymer high-frequency substrate (fluorine-based polymer double-sided copper-clad substrate) of the present invention includes:

Coat the first low-dielectric adhesive layer on the surface of the fluoropolymer layer, remove the solvent at a temperature range of 60°C to 180°C, and then laminate the first low-dielectric adhesive layer with the copper foil , Get semi-finished product A;

The third low-dielectric adhesive layer is coated on the surface of the polyimide layer, and the solvent is removed in a temperature range of 60°C to 180°C, and then the third low-dielectric adhesive layer and the other copper foil layer Press to obtain semi-finished product B;

The second low-dielectric adhesive layer is coated on the other surface of the fluorine-based polymer layer of the semi-finished product A, and the solvent is removed within a temperature range of 60°C to 180°C, and then the second low-dielectric adhesive layer and the The polyimide of semi-finished product B is laminated to obtain semi-finished product C; and

The semi-finished product C is cured at 160°C to 200°C for more than 5 hours to obtain a finished fluoropolymer double-sided copper-clad substrate.

The preparation method of the fluorine-based polymer covering film of the present invention includes:

The second low-dielectric adhesive layer is coated on the surface of the polyimide layer, the solvent is removed at a temperature range of 60°C to 180°C, and then the second low-dielectric adhesive layer and the fluorine-based polymer layer Pressing; and

The first low-dielectric adhesive layer is coated on the other surface of the fluorine-based polymer layer, the solvent is removed in a temperature range of 60°C to 180°C, and then the first low-dielectric adhesive layer is laminated with a release Together, the finished fluoropolymer covering film is obtained.

The preparation method of the fluorine-based polymer adhesive sheet of the present invention includes:

The second low-dielectric adhesive layer is coated on the surface of the polyimide layer, the solvent is removed at a temperature range of 60°C to 180°C, and then the second low-dielectric adhesive layer and the fluorine-based polymer layer Lamination;

The first low-dielectric adhesive layer is coated on the other surface of the fluorine-based polymer layer, the solvent is removed in a temperature range of 60°C to 180°C, and then the first low-dielectric adhesive layer is laminated with a release合; and

The third low-dielectric adhesive layer is coated on the other surface of the polyimide layer, the solvent is removed in a temperature range of 60°C to 180°C, and the third low-dielectric adhesive layer is laminated with release Combined to obtain the finished fluorine-based polymer bonding sheet.

The present invention has at least the following beneficial effects:

The high-frequency substrate, cover film and adhesive sheet of the present invention all use the low Dk/Df characteristics of the fluoropolymer itself, combined with a low-dielectric adhesive layer with low Dk/Df, and a copper foil with low roughness, so that the finished product has a low Dk/Df characteristic. Dielectric loss is conducive to high-frequency and high-speed transmission. In addition, the copper foil and the fluorine-based polymer layer are bonded by a low-dielectric adhesive layer, And use polyimide (PI) film as a support, so that the substrate has good bonding strength, low thermal expansion coefficient and high dimensional stability.

The low-dielectric adhesive layer in the present invention makes FRCC and double-sided copper foil substrate suitable for low temperature (less than 180°C), and can be quickly laminated to make the FPC of the present invention, which has strong processability and low requirements for manufacturing equipment. Furthermore, the production cost is reduced, and the equipment operability, processability, and mass production are better than the existing PTFE fiberboard; better yet, because it is suitable for low-temperature compression, the risk of circuit oxidation during the preparation of FPC is greatly reduced.

The fluorine-based polymer high-frequency substrate/covering film of the present invention has extremely low Dk/Df compared to PI and polyether ether ketone (PEEK) substrates/covering films, which is conducive to high-frequency and high-speed transmission; and compared with PTFE The substrate, the fluorine-based polymer high-frequency substrate of the present invention has good bonding strength, low thermal expansion coefficient and high dimensional stability.

In addition, the preparation method of the present invention can not only manufacture single-sided and double-sided copper foil substrates of suitable thickness, but also can easily obtain substrates of 100 μm or more, which can be applied to millimeter wave radar, 5G smart phones, Apple watches and other equipment.

100,200: Single-sided copper clad substrate

101, 201, 301, 401: copper foil layer

102, 202, 302, 402, 502, 602, 701, 801, 901, 1001: the first low dielectric adhesive layer

103,205,303,405,503,605,702,804,902,1004: Fluorine-based polymer layer

104,204,304,404,504,604,703,803,903,1003: the second low dielectric layer

105,305,505,704,904: Polyimide layer

203, 403, 603, 802, 1002: the first polyimide layer

206,306,406,506,606,805,905,1005: the third low dielectric layer

207,407,607,806,1006: the second polyimide layer

300, 400: Flexible back adhesive copper foil substrate

307,409,705,807,906,1008: Release layer

408,608,1007: the fourth low-dielectric adhesive layer

500, 600: Double-sided copper clad substrate

501,601: Copper foil layer

507,609: Another copper foil layer

700,800: Cover film

900, 1000: adhesive sheet

Figure 1 is a schematic structural diagram of a specific implementation aspect of the single-sided copper clad substrate of the present invention.

Figure 2 is a schematic structural view of another specific embodiment of the single-sided copper clad substrate of the present invention.

Figure 3 is a schematic structural diagram of a specific implementation aspect of the flexible back adhesive copper foil substrate (FRCC) of the present invention.

Figure 4 is a schematic structural diagram of another specific embodiment of the FRCC of the present invention.

Fig. 5 is a schematic structural diagram of a specific implementation aspect of the double-sided copper clad substrate of the present invention.

FIG. 6 is a schematic structural diagram of another embodiment of the double-sided copper clad substrate of the present invention.

Figure 7 is a schematic structural diagram of a specific implementation aspect of the cover film of the present invention.

Figure 8 is a schematic structural diagram of another specific embodiment of the cover film of the present invention.

Figure 9 is a schematic structural view of a specific implementation aspect of the adhesive sheet of the present invention.

Figure 10 is a schematic structural view of another specific embodiment of the adhesive sheet of the present invention.

The following specific examples illustrate the implementation of the present invention. Those familiar with the art can easily understand the other advantages and effects of the present invention from the content disclosed in this specification.

It should be noted that the structure, ratio, size, etc. shown in the drawings in this manual are only used to match the content disclosed in the manual for the understanding and reading of those who are familiar with the art, and are not intended to limit the implementation of the present invention. Therefore, it does not have any technical significance. Any structural modification, proportional relationship change or size adjustment, without affecting the effects and objectives that can be achieved by the present invention, should still fall within the scope of the present invention. The technical content disclosed by the invention can be covered. At the same time, terms such as "on", "first", "second", "third", "fourth", "semi-finished product A", "semi-finished product B", "semi-finished product C", etc. are quoted in this manual It is also only for ease of description, not to limit the scope of implementation of the present invention. The change or adjustment of the relative relationship should be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

As shown in Figure 1, it is a schematic structural diagram of a specific implementation aspect of a fluorine-based polymer high-frequency substrate. Specifically, it is a single-sided copper-clad substrate 100. The structure from top to bottom is a copper foil layer. 101, a first low-dielectric adhesive layer 102, a fluorine-based polymer layer 103, a second low-dielectric adhesive layer 104, and a polyimide layer 105. The total thickness of the single-sided copper clad substrate 100 of the present invention may be 41 μm to 385 μm.

As shown in Figure 2, it is another specific embodiment of the fluorine-based polymer high-frequency substrate of the present invention, which is a single-sided copper-clad substrate 200. The structure from top to bottom is the copper foil layer 201, the first The low dielectric glue layer 202, the first polyimide layer 203, the second low dielectric glue layer 204, the fluorine-based polymer layer 205, the third low dielectric glue layer 206, and the second polyimide layer 207. The total thickness of the single-sided copper clad substrate 200 of the present invention may be 51 μm to 485 μm.

Referring to Figure 3, it is another embodiment of the fluorine-based polymer high-frequency substrate of the present invention, which is a flexible back adhesive copper foil substrate (FRCC) 300, and the structure from top to bottom is the copper foil layer. 301, the first low-k adhesive layer 302, the fluorine-based polymer layer 303, the second low-k adhesive layer 304, the polyimide layer 305, and the third low-k adhesive layer 306, and the third low-k adhesive layer A release layer 307 is attached to the surface of the layer 306. The total thickness of the flexible back adhesive copper foil substrate 300 of the present invention may be 46 μm to 435 μm.

Referring to Figure 4, it is another specific embodiment of the fluorine-based polymer high-frequency substrate of the present invention, which is also a FRCC 400. The structure from top to bottom is a copper foil layer 401 and a first low-dielectric adhesive layer. 402, the first polyimide layer 403, the second low-dielectric adhesive layer 404, the fluorine-based polymer layer 405, the third low-dielectric glue layer 406, the second polyimide layer 407, and the fourth low-dielectric layer A release layer 409 is attached to the surface of the adhesive layer 408 and the fourth low dielectric adhesive layer 408. The total thickness of the FRCC 400 of the present invention may be 56 μm to 535 μm.

Referring again to Figure 5, it is another embodiment of the fluorine-based polymer high-frequency substrate of the present invention, which is a double-sided copper-clad substrate 500. The structure from top to bottom is copper foil layer 501, first low The dielectric glue layer 502, the fluorine-based polymer layer 503, the second low dielectric glue layer 504, the polyimide layer 505, the third low dielectric glue layer 506, and another copper foil layer 507. The total thickness of the double-sided copper clad substrate 500 of the present invention may be 47 μm to 470 μm.

Referring again to Figure 6, it is another specific implementation of the fluorine-based polymer high-frequency substrate of the present invention, which is also a double-sided copper-clad substrate 600. The structure from top to bottom is the copper foil layer 601 and the first Low dielectric adhesive layer 602, first polyimide layer 603, second low dielectric adhesive layer 604, fluorine-based polymer layer 605, third The low dielectric glue layer 606, the second polyimide layer 607, the fourth low dielectric glue layer 608, and another copper foil layer 609. The total thickness of the double-sided copper clad substrate 600 of the present invention may be 57 μm to 570 μm.

Figure 7 shows the specific implementation of the fluorine-based polymer covering film 700 of the present invention. Except for the release layer 705, its structure from top to bottom is the first low-dielectric adhesive layer 701 and the fluorine-based polymer layer. 702, a second low-dielectric adhesive layer 703, and a polyimide layer 704, and a release layer 705 is attached to the surface of the first low-dielectric adhesive layer 701. The total thickness of the fluoropolymer cover film 700 of the present invention may be 40 μm to 350 μm.

Figure 8 shows another specific embodiment of the fluorine-based polymer covering film 800 of the present invention. Except for the release layer 807, the structure from top to bottom is the first low-dielectric adhesive layer 801 and the first polymer layer. The imide layer 802, the second low dielectric adhesive layer 803, the fluorine-based polymer layer 804, the third low dielectric adhesive layer 805, and the second polyimide layer 806, and the first low dielectric adhesive layer 801 A release layer 807 is attached to the surface of the product. The total thickness of the fluorine-based polymer cover film 800 of the present invention may be 50 μm to 450 μm.

Figure 9 is a schematic structural diagram of a specific implementation aspect of the fluorine-based polymer adhesive sheet 900 of the present invention. Except for the release layer 906 above, the structure from top to bottom is the first low dielectric adhesive layer 901, The fluorine-based polymer layer 902, the second low-dielectric glue layer 903, the polyimide layer 904, and the third low-dielectric glue layer 905, and the first low-dielectric glue layer 901 and the third low-dielectric glue A release layer 906 is attached to the surface of the layer 905, respectively. The total thickness of the fluorine-based polymer adhesive sheet 900 of the present invention can be 45 μm to 400 μm.

Figure 10 is a schematic structural view of another specific embodiment of the fluorine-based polymer adhesive sheet 1000 of the present invention. Except for the release layer 1008 on the top, the structure from top to bottom is the first low dielectric adhesive layer. 1001, the first polyimide layer 1002, the second low dielectric adhesive layer 1003, the fluorine-based polymer layer 1004, the third low dielectric adhesive layer 1005, the second polyimide layer 1006, and the fourth low dielectric The adhesive layer 1007, and the surface of the first low dielectric adhesive layer 1001 and the fourth low dielectric adhesive layer 1007 are respectively attached with a release layer 1008. The total thickness of the fluorine-based polymer adhesive sheet 1000 of the present invention may be 55 μm to 500 μm.

In a specific embodiment, the dielectric constant (Dk) of the fluorine-based polymer layer in the single-sided copper-clad substrate, FRCC, double-sided copper-clad substrate, cover film, and bonding sheet is 1.0 to 3.0 (10 GHz), an insulating polymer layer with a dielectric loss factor (Df) value of 0.0001 to 0.002 (10 GHz) and a water absorption rate of 0.001 to 0.1%.

In a specific embodiment, the thickness of the copper foil layer in the single-sided copper-clad substrate, FRCC, double-sided copper-clad substrate, cover film, and bonding sheet is 1 μm to 35 μm, and the thickness of the low dielectric adhesive layer is The thickness of the fluoropolymer layer is from 25 μm to 200 μm, and the thickness of the polyimide layer is from 5 μm to 50 μm.

In a specific embodiment, the copper foil layer in the single-sided copper-clad substrate, FRCC, double-sided copper-clad substrate, cover film, and bonding sheet has an Rz value of 0 μm to 1.2 μm, and a Ra value of 0 μm to 0.4 μm. The low profile copper foil layer, and the copper foil layer is a rolled copper foil layer or an electrolytic copper foil layer.

In a specific implementation aspect, the low-dielectric adhesive layer in the single-sided copper-clad substrate, FRCC, double-sided copper-clad substrate, cover film, and bonding sheet has a Dk value of 2.0 to 3.5 (10 GHz) and a Df value of The adhesive layer is 0.001 to 0.010 (10 GHz), and the polyimide layer is an insulating polymer layer with a Dk value of 2.0 to 3.5 (10 GHz) and a Df value of 0.002 to 0.010 (10 GHz).

In a specific embodiment, the fluoropolymer layer in the single-sided copper-clad substrate, FRCC, double-sided copper-clad substrate, cover film, and bonding sheet includes a fluoropolymer resin, and the fluoropolymer resin Selected from polytetrafluoroethylene, polyvinylidene fluoride, copolymers of vinyl fluoride and vinyl ether, copolymers of tetrafluoroethylene and ethylene, copolymers of polychlorotrifluoroethylene and ethylene, copolymers of hexafluoropropylene and vinylidene fluoride Tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, polychlorotrifluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer, ethylene-fluoroethylene copolymer and tetrafluoroethylene-hexafluoropropylene-trifluoroethylene At least one of ethylene copolymers.

In a specific embodiment, the low-dielectric adhesive layer in the single-sided copper-clad substrate, FRCC, double-sided copper-clad substrate, cover film, and bonding sheet includes a resin, and the resin is selected from fluorine-based resins, epoxy resins, etc. At least one of resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, bismaleimide resin, and polyimide resin.

The copper foil layer is the copper foil layer and the other copper foil layer; the low-dielectric adhesive layer is the first low-dielectric adhesive layer, the second low-dielectric adhesive layer, the third low-dielectric adhesive layer, and The fourth low-dielectric adhesive layer; the polyimide layer is the above-mentioned polyimide layer, the first polyimide layer, and the second polyimide layer.

The release layer may be a release film, the material of which is at least one of polypropylene, biaxially oriented polypropylene and polyethylene terephthalate, and may be a release film with double-sided release capability , Or use release paper.

The preparation method of the single-sided copper-clad substrate of the present invention, taking the single-sided copper-clad substrate 100 shown in Figure 1 as an example, includes:

The first low-dielectric adhesive layer 102 is coated on the surface of the fluorine-based polymer layer 103, and the solvent is removed within a temperature range of 60°C to 180°C, and then the first low-dielectric adhesive layer 102 and the copper foil Layer 101 is pressed together to obtain semi-finished product A;

The second low dielectric adhesive layer 104 is coated on the surface of the polyimide layer 105, the solvent is removed at a temperature range of 60°C to 180°C, and then the second low dielectric adhesive layer 104 and the semi-finished product A The fluorine-based polymer layer 103 is pressed together to obtain a semi-finished product B;

The semi-finished product B is cured at 160°C to 200°C for more than 5 hours to obtain a finished fluorine-based polymer single-sided copper-clad substrate 100.

The preparation method of the single-sided copper-clad substrate 200 shown in Figure 2 can also be carried out as described above. The low-dielectric adhesive layers 202, 204, 206 are respectively coated on the fluorine-based polymer layer 205 or the polyimide layer 203, 207, Then press with other layers or semi-finished products.

The preparation method of FRCC of the present invention, taking FRCC 300 shown in Figure 3 as an example, includes:

The first low-dielectric adhesive layer 302 is coated on the surface of the fluorine-based polymer layer 303, and the solvent is removed within a temperature range of 60°C to 180°C, and then the first low-dielectric adhesive layer 302 and the copper foil Layer 301 is pressed together to obtain semi-finished product A;

The second low dielectric adhesive layer 304 is coated on the surface of the polyimide layer 305, the solvent is removed at a temperature range of 60°C to 180°C, and then the second low dielectric adhesive layer 304 and the semi-finished product A The fluorine-based polymer layer 303 is pressed together to obtain a semi-finished product B;

The semi-finished product B is cured at 160°C to 200°C for more than 5 hours to obtain the semi-finished product C;

The third low-dielectric adhesive layer 306 is coated on the other surface of the polyimide layer 305 of the semi-finished product C, and the solvent is removed within a temperature range of 60°C to 180°C, and then the third low-dielectric adhesive layer 306 and the release layer 307 are pressed together to obtain the finished fluoropolymer FRCC 300.

As shown in Figure 4, the preparation method of FRCC 400 can also be carried out as described above. The low dielectric adhesive layers 402, 404, 406, and 408 are respectively coated on the fluorine-based polymer layer 405 or the polyimide layer 403, 407, and then combined with other layers Or semi-finished products are pressed together.

The preparation method of the double-sided copper-clad substrate of the present invention, taking the double-sided copper-clad substrate 500 shown in FIG. 5 as an example, includes:

The first low dielectric adhesive layer 502 is coated on the surface of the fluorine-based polymer layer 503, the solvent is removed in a temperature range of 60°C to 180°C, and then the first low dielectric adhesive layer 502 and the copper foil Layer 501 is pressed together to obtain semi-finished product A;

The third low-dielectric adhesive layer 506 is coated on the surface of the polyimide layer 505, the solvent is removed at a temperature range of 60°C to 180°C, and then the third low-dielectric adhesive layer 506 and the other The copper foil layer 507 is pressed together to obtain a semi-finished product B;

The second low-dielectric adhesive layer 504 is coated on the other surface of the fluorine-based polymer layer 503 of the semi-finished product A, and the solvent is removed within a temperature range of 60°C to 180°C, and then the second low-dielectric adhesive layer 504 is laminated with the polyimide layer 505 of the semi-finished product B to obtain the semi-finished product C;

The semi-finished product C is cured at 160°C to 200°C for more than 5 hours to obtain a finished fluoropolymer double-sided copper-clad substrate 500.

The preparation method of the double-sided copper-clad substrate 600 shown in Figure 6 can also be carried out as described above. The low dielectric adhesive layers 602, 604, 606, and 608 are respectively coated on the fluorine-based polymer layer 605 or the polyimide layer 603, 607, Then press with other layers or semi-finished products.

The method for preparing the cover film of the present invention, taking the cover film 700 shown in FIG. 7 as an example, includes:

The second low-dielectric adhesive layer 703 is coated on the surface of the polyimide layer 704, the solvent is removed in a temperature range of 60°C to 180°C, and then the second low-dielectric adhesive layer 703 is combined with the fluorine-based adhesive layer. The polymer layer 702 is pressed together;

The first low-dielectric adhesive layer 701 is coated on the other surface of the fluorine-based polymer layer 702, the solvent is removed at a temperature ranging from 60°C to 180°C, and then the first low-dielectric adhesive layer 701 and the The release layer 705 is pressed together to obtain the finished fluoropolymer cover film 700.

The method for preparing the cover film 800 shown in Figure 8 can also be carried out as described above. The low dielectric adhesive layers 801, 803, 805 are respectively coated on the fluorine-based polymer layer 804 or the polyimide layer 802, 806, and then combined with other layers. Layers or semi-finished products are laminated.

The preparation method of the adhesive sheet of the present invention, taking the adhesive sheet 900 shown in Fig. 9 as an example, includes:

The second low-dielectric adhesive layer 903 is coated on the surface of the polyimide layer 904, the solvent is removed in a temperature range of 60°C to 180°C, and then the second low-dielectric adhesive layer 903 is combined with the fluorine-based adhesive layer. The polymer layer 902 is pressed together;

The first low-dielectric adhesive layer 901 is coated on the other surface of the fluorine-based polymer layer 902, the solvent is removed at a temperature ranging from 60°C to 180°C, and then the first low-dielectric adhesive layer 901 and the The release layer 906 is pressed together;

The third low-dielectric adhesive layer 905 is coated on the other surface of the polyimide layer 904, the solvent is removed within a temperature range of 60°C to 180°C, and then the third low-dielectric adhesive layer 905 is combined with the polyimide layer 904. The release layer 906 is pressed together to obtain the finished fluoropolymer bonding sheet 900.

The preparation method of the adhesive sheet 1000 as shown in Figure 10 can also be carried out as described above. The low dielectric adhesive layers 1001, 1003, 1005, and 1007 are respectively coated on the fluorine-based polymer layer 1004 or the polyimide layer 1002,1006, and then press with other layers or semi-finished products.

Example

Examples 1 to 7 are examples of single-sided copper-clad substrates, FRCCs and double-sided copper-clad substrates of the present invention. Comparative Example 1 is a double-sided copper-clad substrate without a fluorine-based polymer layer, and Comparative Example 2 is A double-sided copper clad substrate containing no fluorine-based polymer layer and containing PEEK, while Comparative Example 3 is a double-sided copper clad substrate with only a fluorine-based polymer layer. The specific values of each structure are shown in Table 1.

Among them, the fluorine-based polymer layer in Example 1 to Example 7 is a Saint-Gobain PFA double-sided treated film (CHEMFILM), which has a Dk value of 1.98 (10GHz), a Df value of 0.0005 (10GHz), and a thermal expansion coefficient of 293 (ppm/°C), an insulating polymer layer with a water absorption rate of 0.01% and an easy-to-adhesion treatment on the surface. The composition of the low-dielectric adhesive layer includes modified polyimide resin, epoxy resin, filler powder (sintered silica) and flame retardant (manufactured by Asia Electronics Corporation).

Table 1

The Dk value, Df value, adhesive strength, thermal expansion coefficient and dimensional stability of Example 1 to Example 7 and Comparative Example 1 to Comparative Example 3 were tested, and the test results are shown in Table 2.

Table 2

Examples 8 to 12 are examples of covering films and adhesive sheets of the present invention. Comparative Example 4 is a PI covering film, and Comparative Example 5 is a PEEK covering film. The specific values of each structure are shown in Table 3.

Among them, the fluorine-based polymer layer system in Examples 8 to 12 has a Dk value of 1.98 (10GHz), a Df value of 0.0005 (10GHz), a thermal expansion coefficient of 293 (ppm/°C), a water absorption rate of 0.01%, and a surface Insulating polymer layer that is easy to bond.

table 3

The Dk value, Df value, adhesive strength and thermal expansion coefficient of Example 8 to Example 12, Comparative Example 4 and Comparative Example 5 were tested. The test results are shown in Table 4.

Table 4

From the test results in Table 2 and Table 4, it can be seen that the fluoropolymer high-frequency substrate, cover film and adhesive sheet of the present invention have extremely low Dk/Df compared to conventional substrates/cover films using PI and PEEK. Conducive to high-frequency and high-speed transmission; and compared with PTFE substrates, the fluorine-based polymer high-frequency substrate of the present invention has good bonding strength, low thermal expansion coefficient and high dimensional stability.

The above-mentioned embodiments are used to exemplify the principles and effects of the present invention, but not to limit the present invention. Anyone who is familiar with this technique can modify the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application described later.

It should be understood that, within the scope of the technical content disclosed in the present invention, various technical features (such as those disclosed in specific implementations and embodiments) can be freely combined with each other to form new or better technical solutions , For the sake of brevity, I won’t repeat it here. In addition, in the numerical range formed by the end values disclosed in the present invention, as long as the value falls between the upper and lower end values, it shall be included in the range disclosed in the present invention, and it should be combined with the end points or other values. The sub-range should naturally be included in the scope disclosed by the present invention.

500: Double-sided copper clad substrate

501: Copper foil layer

502: The first low dielectric adhesive layer

503: Fluorine-based polymer layer

504: second low dielectric adhesive layer

505: Polyimide layer

506: The third low dielectric adhesive layer

507: Another copper foil layer

Claims (22)

A fluorine-based polymer high-frequency substrate includes a copper foil layer, a first low-dielectric adhesive layer, a fluorine-based polymer layer, a second low-dielectric adhesive layer, and a polyimide layer laminated in sequence, and The total thickness of the fluorine-based polymer high-frequency substrate is 41 μm to 385 μm, wherein the fluorine-based polymer layer has a dielectric constant (Dk) value of 1.0 to 3.0 (10 GHz) and a dielectric loss factor (Df) value of 0.0001 to 0.002 (10GHz). A fluorine-based polymer high-frequency substrate includes a copper foil layer, a first low-dielectric adhesive layer, a first polyimide layer, a second low-dielectric adhesive layer, a fluorine-based polymer layer, which are sequentially laminated The third low-dielectric adhesive layer and the second polyimide layer, and the total thickness of the fluorine-based polymer high-frequency substrate is 51 μm to 485 μm. The fluorine-based polymer high-frequency substrate described in item 1 of the scope of patent application includes a third low-dielectric adhesive layer formed on the polyimide layer so that the polyimide layer is located on the second Between the low-dielectric adhesive layer and the third low-dielectric adhesive layer, and the total thickness of the fluorine-based polymer high-frequency substrate is 46 μm to 435 μm. The fluorine-based polymer high-frequency substrate described in item 2 of the scope of patent application includes a fourth low-dielectric adhesive layer formed on the second polyimide layer so that the second polyimide layer It is located between the third low-dielectric adhesive layer and the fourth low-dielectric adhesive layer, and the total thickness of the fluorine-based polymer high-frequency substrate is 56 μm to 535 μm. The fluorine-based polymer high-frequency substrate described in item 3 of the scope of patent application includes another copper foil layer formed on the third low-dielectric adhesive layer, and the total thickness of the fluorine-based polymer high-frequency substrate It is 47μm to 470μm. The fluorine-based polymer high-frequency substrate described in item 4 of the scope of patent application includes another copper foil layer formed on the fourth low-dielectric adhesive layer, and the total thickness of the fluorine-based polymer high-frequency substrate It is 57μm to 570μm. The fluorine-based polymer high-frequency substrate described in item 2 of the scope of patent application, wherein the fluorine-based polymer layer has a dielectric constant (Dk) value of 1.0 to 3.0 (10GHz) and a dielectric loss factor (Df) value It is an insulating polymer layer of 0.0001 to 0.002 (10GHz) and a water absorption of 0.001 to 0.1%. The fluorine-based polymer high-frequency substrate described in item 1 or 2 of the scope of patent application, wherein: the thickness of the copper foil layer is 1 μm to 35 μm, the thickness of the first low-dielectric adhesive layer is 5 μm to 50 μm, and the The thickness of the second low dielectric adhesive layer is 5 μm to 50 μm, the thickness of the fluoropolymer layer is 25 μm to 200 μm, and the thickness of the polyimide layer or the first polyimide layer is 5 μm to 50 μm; The copper foil layer is a low profile copper foil layer with an Rz value of 0 μm to 1.2 μm and an Ra value of 0 μm to 0.4 μm, and the copper foil layer is a rolled copper foil layer or an electrolytic copper foil layer; the first low dielectric adhesive layer The adhesive layer has a Dk value of 2.0 to 3.5 (10GHz) and a Df value of 0.001 to 0.010 (10GHz); the second low dielectric adhesive layer has a Dk value of 2.0 to 3.5 (10GHz) and a Df value of 0.001 to 0.010 ( 10GHz) adhesive layer; the polyimide layer or the first polyimide layer is an insulating polymer layer with a Dk value of 2.0 to 3.5 (10GHz) and a Df value of 0.002 to 0.010 (10GHz); the fluorine-based polymer The material layer includes a fluorine-based polymer resin selected from the group consisting of polytetrafluoroethylene, polyvinylidene fluoride, copolymers of vinyl fluoride and vinyl ether, copolymers of tetrafluoroethylene and ethylene, and polychlorotrifluorochloride Copolymer of ethylene and ethylene, copolymer of hexafluoropropylene and vinylidene fluoride, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, polytrifluorochloroethylene, tetrafluoroethylene-hexafluoropropylene copolymer, ethylene -At least one of a fluoroethylene copolymer and a tetrafluoroethylene-hexafluoropropylene-trifluoroethylene copolymer; and each of the first low-dielectric adhesive layer and the second low-dielectric adhesive layer includes a resin, and the resin It is selected from fluorine resin, epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, bismaleimide resin and polyimide resin At least one of resins. The fluorine-based polymer high-frequency substrate described in item 2 of the scope of patent application, wherein the thickness of the third low-dielectric adhesive layer is 5 μm to 50 μm, and the thickness of the second polyimide layer is 5 μm to 50 μm; The third low-dielectric adhesive layer includes a resin, and the resin is selected from the group consisting of fluorine resin, epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, At least one of bismaleimide resin and polyimide resin; and the second polyimide layer has a Dk value of 2.0 to 3.5 (10 GHz) and a Df value of 0.002 to 0.010 (10 GHz) Insulating polymer layer. The fluorine-based polymer high-frequency substrate according to the fifth item of the scope of patent application, wherein the thickness of the other copper foil layer is 1 μm to 35 μm, and the thickness of the third low-dielectric adhesive layer is 5 μm to 50 μm; A copper foil layer is a low profile copper foil layer with an Rz value of 0 μm to 1.2 μm and an Ra value of 0 μm to 0.4 μm, and the other copper foil layer is a rolled copper foil layer or an electrolytic copper foil layer; and the third low The dielectric adhesive layer includes a resin, and the resin is selected from the group consisting of fluorine-based resins, epoxy resins, acrylic resins, urethane-based resins, silicone rubber-based resins, parylene-based resins, and bismaleic resins. At least one of imine-based resin and polyimine-based resin. The fluorine-based polymer high-frequency substrate described in item 6 of the scope of patent application, wherein the thickness of the other copper foil layer is 1 μm to 35 μm, and the thickness of the third low-dielectric adhesive layer and the fourth low-dielectric adhesive layer The thickness is 5 μm to 50 μm; the other copper foil layer is a low profile copper foil layer with an Rz value of 0 μm to 1.2 μm and an Ra value of 0 μm to 0.4 μm, and the other copper foil layer is a rolled copper foil layer or electrolytic copper Foil layer; each of the third low-dielectric adhesive layer and the fourth low-dielectric adhesive layer includes a resin, and the resin is selected from the group consisting of fluorine resin, epoxy resin, acrylic resin, urethane resin, At least one of a silicone rubber-based resin, a parylene-based resin, a bismaleimide-based resin, and a polyimide-based resin; the thickness of the second polyimide layer is 5 μm to 50 μm; and the The second polyimide layer is an insulating polymer layer with a Dk value of 2.0 to 3.5 (10 GHz) and a Df value of 0.002 to 0.010 (10 GHz). A fluorine-based polymer covering film includes a first low-dielectric adhesive layer, a fluorine-based polymer layer, a second low-dielectric adhesive layer, and a polyimide layer that are sequentially stacked, and the fluorine-based polymer covering film Total thickness It is 40 μm to 350 μm, wherein the fluorine-based polymer layer has a dielectric constant (Dk) value of 1.0 to 3.0 (10 GHz) and a dielectric loss factor (Df) value of 0.0001 to 0.002 (10 GHz). A fluorine-based polymer cover film, comprising a first low-dielectric adhesive layer, a first polyimide layer, a second low-dielectric adhesive layer, a fluorine-based polymer layer, and a third low-dielectric adhesive layer laminated in sequence And the second polyimide layer, and the total thickness of the fluoropolymer cover film is 50 μm to 450 μm. The fluorine-based polymer cover film described in item 12 or 13 of the scope of patent application, wherein the fluorine-based polymer layer has a thickness of 25 μm to 200 μm, and the fluorine-based polymer layer has a Dk value of 1.0 to 3.0 (10 GHz ), an insulating polymer layer with a Df value of 0.0001 to 0.002 (10GHz) and a water absorption rate of 0.001 to 0.1%. A fluorine-based polymer adhesive sheet, comprising a first low-dielectric adhesive layer, a fluorine-based polymer layer, a second low-dielectric adhesive layer, a polyimide layer, and a third low-dielectric adhesive layer laminated in sequence Structure, and the total thickness of the fluorine-based polymer adhesive sheet is 45 μm to 400 μm. A fluorine-based polymer adhesive sheet, comprising a first low-dielectric adhesive layer, a first polyimide layer, a second low-dielectric adhesive layer, a fluorine-based polymer layer, and a third low-dielectric adhesive layer laminated in sequence The structure of the layer, the second polyimide layer, and the fourth low-dielectric adhesive layer, and the total thickness of the fluorine-based polymer bonding sheet is 55 μm to 500 μm. The fluorine-based polymer adhesive sheet described in item 15 or 16 of the scope of patent application, wherein the fluorine-based polymer layer has a thickness of 25 μm to 200 μm, and the fluorine-based polymer layer has a Dk value of 1.0 to 3.0 (10 GHz ), an insulating polymer layer with a Df value of 0.0001 to 0.002 (10GHz) and a water absorption rate of 0.001 to 0.1%. A method for preparing a fluorine-based polymer high-frequency substrate as described in item 1 of the scope of the patent application includes: coating the first low-dielectric adhesive layer on the surface of the fluorine-based polymer layer at a temperature of 60°C to Remove the solvent within a temperature range of 180°C, and then laminate the first low-dielectric adhesive layer and the copper foil to obtain a semi-finished product A; The second low-dielectric adhesive layer is coated on the surface of the polyimide layer, the solvent is removed at a temperature range of 60°C to 180°C, and then the second low-dielectric adhesive layer and the fluorine-based layer of the semi-finished product A The polymer is laminated to obtain a semi-finished product B; and the semi-finished product B is cured at 160° C. to 200° C. for more than 5 hours to obtain a finished fluorine-based polymer single-sided copper-clad substrate. A method for preparing a fluorine-based polymer high-frequency substrate as described in item 3 of the scope of the patent application includes: coating the first low-dielectric adhesive layer on the surface of the fluorine-based polymer layer at a temperature of 60°C to Remove the solvent within a temperature range of 180°C, and then laminate the first low-dielectric adhesive layer with the copper foil to obtain a semi-finished product A; coat the second low-dielectric adhesive layer on the surface of the polyimide layer , Remove the solvent in the temperature range of 60°C to 180°C, and then laminate the second low-dielectric adhesive layer with the fluorine-based polymer of the semi-finished product A to obtain the semi-finished product B; heat the semi-finished product B at 160°C to 200°C , Curing for more than 5 hours to obtain semi-finished product C; and coating the third low-dielectric adhesive layer on the other surface of the polyimide layer of semi-finished product C, and removing the solvent in the temperature range of 60°C to 180°C, Then the third low-dielectric adhesive layer is laminated with a release layer to obtain a finished fluorine-based polymer flexible back adhesive copper foil substrate. A method for preparing a fluorine-based polymer high-frequency substrate as described in item 5 of the scope of patent application includes: coating the first low-dielectric adhesive layer on the surface of the fluorine-based polymer layer at a temperature of 60°C to Remove the solvent within a temperature range of 180°C, and then laminate the first low-dielectric adhesive layer and the copper foil to obtain a semi-finished product A; coat the third low-dielectric adhesive layer on the surface of the polyimide layer , Remove the solvent in a temperature range of 60°C to 180°C, and then laminate the third low-dielectric adhesive layer with the other copper foil to obtain a semi-finished product B; The second low-dielectric adhesive layer is coated on the other surface of the fluorine-based polymer layer of the semi-finished product A, and the solvent is removed within a temperature range of 60°C to 180°C, and then the second low-dielectric adhesive layer and the The polyimide of the semi-finished product B is laminated to obtain the semi-finished product C; and the semi-finished product C is cured at 160°C to 200°C for more than 5 hours to obtain the finished fluoropolymer double-sided copper-clad substrate. A method for preparing a fluorine-based polymer cover film as described in item 12 of the scope of patent application, which includes: coating the second low-dielectric adhesive layer on the surface of the polyimide layer at a temperature of 60°C to 180°C. Remove the solvent within a temperature range of °C, and then laminate the second low-dielectric adhesive layer with the fluorine-based polymer; and coat the first low-dielectric adhesive layer on the other surface of the fluorine-based polymer layer , The solvent is removed in the temperature range of 60°C to 180°C, and the first low-dielectric adhesive layer is laminated with the release layer to obtain the finished fluorine-based polymer covering film. A method for preparing the fluorine-based polymer adhesive sheet as described in item 15 of the scope of patent application includes: coating the second low-dielectric adhesive layer on the surface of the polyimide layer at a temperature of 60°C to 180°C Remove the solvent within a temperature range of °C, and then laminate the second low-dielectric adhesive layer with the fluorine-based polymer; coat the first low-dielectric adhesive layer on the other surface of the fluorine-based polymer layer, Remove the solvent in the temperature range of 60°C to 180°C, and then laminate the first low-dielectric adhesive layer and release layer; and coat the third low-dielectric adhesive layer on the other of the polyimide layer On the surface, the solvent is removed in the temperature range of 60°C to 180°C, and the third low-dielectric adhesive layer is laminated with the release layer to obtain the finished fluorine-based polymer adhesive sheet.

Images