TWI717803B - Testing apparatus and testing method - Google Patents

Abstract

A testing apparatus includes a load board, a socket and a chuck. The load board includes a plurality of pogo pins used for testing a semiconductor device. The socket is disposed on the load board to carry the semiconductor device. The socket defines an alignment hole and a plurality of openings. The openings correspond to the pogo pins of the the load board. The chuck is disposed above the socket to apply a pressure on the semiconductor device. A corner of the chuck corresponds to the alignment hole of the socket.

Description

Test equipment and test methods

The present invention relates to a test equipment and a test method, and more specifically, relates to a test equipment and a test method for electrical testing.

The current electrical testing process of the production line is mainly to first place the device under test (DUT) on the test socket of the test board by pick and place (pick and place), and then perform open-circuit and short-circuit (open-short) )test. In addition, components under test of different sizes need to be used with test boards and test sockets of different specifications, and even other test auxiliary fixtures must be replaced. However, the constant replacement of test equipment and fixtures will not only cause time-consuming testing, but also greatly increase the cost of testing.

In one embodiment, a test equipment includes a test board, a test seat, and an indenter. The test board has a plurality of measurement probes for testing a semiconductor device. The test base is arranged on the test board and used for supporting the semiconductor device. The test base defines a pair of holes and a plurality of openings, and the openings correspond to the measurement probes of the test board. The indenter is arranged above the test seat for applying a pressure on the semiconductor device, and a corner of the indenter corresponds to the alignment hole of the test seat.

In one embodiment, a test equipment includes a test board, a test stand, an indenter, and a test program interface. The test board has a plurality of measurement probes for testing a semiconductor device. The test socket is arranged on the test board and used for accommodating the semiconductor device. The pressure head is arranged above the test base for applying a pressure on the semiconductor device so that the plurality of electrical connections of the semiconductor device respectively contact at least a part of the measurement probes of the test board. The test program interface is electrically connected to the test board to obtain the test data of the at least a part of the measurement probes, and the measurement probes that are not in contact with the electrical connector are disabled.

In one embodiment, a test method includes: providing a test board and a test base, the test board has a plurality of measurement probes, the test base is arranged on the test board, the test base includes a base and a mobile The moving piece is arranged in the base body, and the moving piece defines a pair of holes and a plurality of openings, and the openings correspond to the measuring probes of the test board; a semiconductor device is arranged on the moving piece Up; move an indenter to the top of the test seat, and make a corner of the indenter correspond to the alignment hole of the moving part; and move the indenter down to a top surface of the semiconductor device, and apply a Pressure is placed on the semiconductor device so that the semiconductor device contacts the measurement probes of the test board.

In one embodiment, a test method includes: providing a test board and a test socket, the test board has a plurality of measurement probes, the test socket is arranged on the test board; a semiconductor device is arranged in the test socket ; Move an indenter to the top of the test seat; move the indenter down to a top surface of the semiconductor device, and apply a pressure on the semiconductor device, so that a plurality of electrical connections of the semiconductor device are contacted respectively At least a part of the measurement probe of the test board; and use a test program interface to electrically connect the test board to obtain the test data of the at least a part of the measurement probe without contacting the electrical connection The remaining measurement probes of the component are invalid.

Common reference numbers are used throughout the drawings and embodiments to indicate the same or similar components. It will be easier to understand the embodiments of the present invention from the following detailed description in conjunction with the accompanying drawings.

The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and configurations are described below to clarify specific aspects of the invention. Of course, these components, values, operations, materials, and configurations are only examples and are not intended to be limiting. For example, in the description provided herein, the formation of the first feature on or on the second feature may include an embodiment in which the first feature and the second feature are formed or arranged in direct contact, and may also include additional features An embodiment may be formed or arranged between the first feature and the second feature such that the first feature and the second feature may not directly contact. In addition, the present invention may repeat reference numbers and/or letters in various examples provided herein. This repetition is for the purpose of simplification and clarity, and does not in itself indicate the relationship between the various embodiments and/or configurations discussed.

Refer to FIG. 1, which is a three-dimensional schematic diagram of a testing device 1 according to an embodiment of the present invention. The test equipment 1 of the present invention includes a test board 10, a test stand 20, a moving device 40, a pressure head 30, a support 70, a frame 81 and a data display unit 82. In one embodiment, the supporting member 70 is disposed on the frame 81.

FIG. 2 shows a top view of the arrangement of the test board 10, the test seat 20, the indenter 30 and the semiconductor device 9 of the present invention. 3 shows a cross-sectional view of the configuration of the test board 10, the test base 20, the indenter 30, and the semiconductor device 9 of the present invention. With reference to FIGS. 1, 2 and 3, the test board 10 is set on the support 70, and the test board 10 has a plurality of measurement probes 11 for testing a semiconductor device 9. The measuring probes 11 are electrically connected to the circuit of the test board 10. In one embodiment, the semiconductor device 9 has a top surface 91, a side 92 and a plurality of electrical connections 93. The electrical connections 93 may be solder balls or metal bumps. ).

In one embodiment, the number of the measuring probes 11 of the test board 10 is greater than the number of the electrical connections 93 of the semiconductor device 9, so that the test board 10 can test different electrical connections 93 Number of semiconductor devices 9.

FIG. 4 shows an enlarged view of the partial area E of FIG. 3. With reference to FIG. 2, FIG. 3 and FIG. 4, the test base 20 is disposed on the test board 10 to accommodate and carry the semiconductor device 9. In addition, the test base 20 defines a pair of positioning holes 221 and a plurality of openings 222, and the positioning holes 221 and the openings 222 correspond to the measurement probes 11 of the test board 10, respectively. That is, the measurement probes 11 are located in the alignment hole 221 and the openings 222. In one embodiment, the measuring probes 11 are located in the openings 222 instead of the alignment holes 221. Therefore, only the openings 222 correspond to the measurement probes 11 of the test board 10. In addition, in one embodiment, the electrical connections 93 of the semiconductor device 9 correspond to the openings 222 respectively, and the total number of the alignment holes 221 and the openings 222 is greater than that of the semiconductor device 9 The number of electrical connections 93 is such that the test socket 20 can test semiconductor devices 9 with different numbers of electrical connections 93. In an embodiment, the electrical connection member 93 of the semiconductor device 9 may or may not correspond to the alignment hole 221.

In one embodiment, the test base 20 includes a base 21, a moving part 22 and at least one elastic part 23. The base 21 has a containing groove 211 and an inner side wall 213 therein. The base 21 is fixed on the test board 10.

The moving part 22 is arranged in the base 21 to carry the semiconductor device 9. In one embodiment, the alignment hole 221 and the openings 222 may be located or formed on the moving part 22, that is, the alignment hole 221 and the openings 222 are defined by the moving part 22. In one embodiment, the alignment hole 221 and the openings 222 penetrate the moving part 22 and the base 21, and the size of the alignment hole 221 is substantially the same as the size of the openings 222. In addition, as shown in FIG. 2, the alignment holes 221 and the openings 222 can be arranged in a rectangular array A, and the alignment holes 221 are located at a corner of the rectangular array A.

In one embodiment, as shown in FIGS. 3 and 4, the electrical connection member 93 of the semiconductor device 9 abuts the moving member 22, and the electrical connection member 93 abuts each of the openings 222 respectively. The surrounding part of the top (that is, the opening on the top surface of the movable member 22). Therefore, the maximum width of the electrical connection member 93 is greater than the maximum width of the top of each opening 222 (that is, the opening on the top surface of the movable member 22). In addition, in order to prevent the moving part 22 from damaging the electrical connection part 93, the moving part 22 is a flexible board.

The at least one elastic member 23 is disposed in the receiving groove 211 of the base 21. In addition, the at least one elastic element 23 is disposed under the moving element 22 and abuts against the moving element 22 so that the moving element 22 can move up and down in the base 21.

Figure 5 shows a three-dimensional assembly view of the moving device and the indenter of the present invention. With reference to FIGS. 1 and 5, the moving device 40 is arranged on the frame 81, and the moving device 40 includes a first axis translation table 41, a second axis translation table 42 and a third axis lifting table 43 . The first axis translation stage 41 is connected to the frame body 81. The second axis translation table 42 is connected to the first axis translation table 41. The third axis lifting platform 43 is connected to the second axis translation platform 42. In one embodiment, the first-axis translation stage 41 can be defined as an X-axis translation stage, which is fixed on the frame 81. The second axis translation stage 42 can be defined as a Y axis translation stage, which can move (slide) along the X direction on the first axis translation stage 41. The third-axis lifting platform 43 can be defined as a Z-axis lifting platform, which can move (slide) along the Y direction on the second-axis translation platform 42 and can itself be raised and lowered along the Z axis.

Referring to FIGS. 1, 4, and 5 again, the indenter 30 is disposed above the test base 20 to apply a pressure on the semiconductor device 9 so that the electrical connections 93 of the semiconductor device 9 are respectively The measurement probe 11 contacts at least a part of the test board 10. In one embodiment, the indenter 30 can be set on the third-axis lifting platform 43 of the moving device 40 so as to perform lifting actions by the third-axis lifting platform 43.

2 and 4 again, a corner 31 of the indenter 30 corresponds to the alignment hole 221 of the test base 20, and at least one side 32 of the indenter 30 is aligned with at least one side of the semiconductor device 9 Side 92. In one embodiment, the size of the indenter 30 is greater than or equal to the size of the semiconductor device 9 so that the indenter 30 can test semiconductor devices 9 of different sizes. In addition, since the alignment hole 221 of the test base 20 can be used as a test reference point for each movement of the indenter 30, even if the semiconductor device 9 of different sizes is tested, the test board 10 can be replaced without replacing it. , In the case of the test seat 20 and the indenter 30, the pressure test operation is accurately performed. In one embodiment, the size of the indenter 30 is smaller than the size of the rectangular array A arranged by the alignment holes 221 and the openings 222. For example, the size of the indenter 30 is the rectangle The size of the array A is 50% to 90%, 50% to 70%, 60% to 90%, 60% to 80%, or 70% to 90%.

Fig. 6 shows an enlarged view of the partial area B in Fig. 2. 2 and 6, in order to avoid the indenter 30 hitting the seat body 21 of the test seat 20 during the test, the distance from the center C of the alignment hole 221 to the inner side wall 213 of the seat body 21 D1 is greater than the pitch D2 between two adjacent measuring probes 11 of the test board 10. In one embodiment, the distance D1 is greater than or equal to twice the stitch length D2. Thus, during the test, a corner 31 of the indenter 30 corresponds to the center of the alignment hole 221 of the movable member 22, so that the side 32 of the indenter 30 to the inner side wall of the seat 21 The distance of 213 is also equal to the above-mentioned distance D1; during the downward movement of the indenter 30, it is not easy to strike the seat body 21 of the test seat 20. In addition, as shown in FIG. 6, since the indenter 30 does not completely cover the rectangular array A, half of the openings 222 located in the outermost circle of the rectangular array A will be located on the side 32 of the indenter 305 Within the defined range, the other half is outside the range defined by the side 32 of the indenter 30, so that the risk of the indenter 30 hitting the seat body 21 of the test seat 20 is further reduced.

Referring again to FIG. 1, the data display unit 82 is disposed on the frame 81 to display the test conditions including the pressure of the indenter 30.

FIG. 7 shows a three-dimensional schematic diagram of a testing device 1a according to an embodiment of the invention. The test device 1a of FIG. 7 is substantially the same as the test device 1 of FIGS. 1 to 6, and the difference is that the test device 1a of FIG. 7 further includes a test program interface 60. As shown in FIGS. 7 and 4, the test program interface 60 is electrically connected to the test board 10 and the data display unit 82 to obtain at least a portion of the electrical connection member 93 contacting the semiconductor device 9 The test data of the test probe 11 is used, and the test probe 11 that is not in contact with the electrical connector 93 is invalidated. In one embodiment, the failure of the measurement probe 11 includes not obtaining test data.

In one embodiment, the test program interface 60 includes a test machine 61 and a human-machine interface unit 62. The testing machine 61 is electrically connected to the testing board 10. The man-machine interface unit 62 is electrically connected to the testing machine 61, and uses programming language to control the data acquisition actions of the measurement probes 11 (including but not limited to: controlling the movement of the mobile device 40 and receiving the measurement probes) Test signal data of pin 11). In one embodiment, the human-machine interface unit 62 is a computer on which a test program is installed.

The test method of the present invention is described in detail as follows, but it does not mean that the present invention is limited to the content disclosed in these embodiments.

FIG. 8 shows a cross-sectional view of the configuration of the test board, the test seat and the indenter in the test method of the present invention. FIG. 9 shows an enlarged view of the partial area F of FIG. 8. With reference to Figures 2, 8 and 9, step (a) of the test method of the present invention is to provide a test board 10 and a test seat 20. The test board 10 has a plurality of measurement probes 11, and the measurement The probe 11 is electrically connected to the circuit of the test board 10. The test base 20 is set on the test board 10. In addition, the test base 20 includes a base 21 and a moving part 22. The moving part 22 is arranged in the base 21, and the moving part 22 defines a pair of positioning holes 221 and a plurality of openings 222. The positioning holes 221 and the openings 222 correspond to each of the test board 10 respectively. The measurement probe 11. That is, the measurement probes 11 are located in the alignment hole 221 and the openings 222. In one embodiment, the measuring probes 11 are located in the openings 222 instead of the alignment holes 221. Therefore, only the openings 222 correspond to the measurement probes 11 of the test board 10.

In this step (a), the alignment holes 221 and the openings 222 can be arranged in a rectangular array A, and the alignment holes 221 are located at a corner of the rectangular array A. In addition, as shown in FIGS. 6 and 9, the seat body 21 has an accommodating groove 211 and an inner side wall 213, and the distance D1 from the center C of the alignment hole 221 to the inner side wall 213 of the seat body 21 is greater than The needle distance D2 between two adjacent probes 11 of the test board 10 is measured. In one embodiment, the distance D1 is greater than or equal to twice the stitch length D2.

In one embodiment, the test base 20 further includes at least one elastic element 23, and the at least one elastic element 23 is disposed in the receiving groove 211 of the base 21. In addition, the at least one elastic element 23 is disposed under the moving element 22 and abuts against the moving element 22.

Refer to FIG. 10, which shows a schematic diagram of disposing the semiconductor device on the moving part in the testing method of the present invention. The step (b) of the testing method of the present invention is to install a semiconductor device 9 on the moving part 22. In this step (b), the semiconductor device 9 has a plurality of electrical connectors 93, and the electrical connectors 93 can be solder balls or metal bumps.

In one embodiment, the number of the measuring probes 11 of the test board 10 is greater than the number of the electrical connections 93 of the semiconductor device 9, so that the test board 10 can test different electrical connections 93 Number of semiconductor devices 9.

In addition, the electrical connection member 93 of the semiconductor device 9 corresponds to the openings 222 of the movable member 22, and the total number of the alignment holes 221 and the openings 222 is greater than that of the semiconductor device 9 The number of electrical connections 93 is such that the test socket 20 can test semiconductor devices 9 with different numbers of electrical connections 93. In an embodiment, the electrical connection member 93 of the semiconductor device 9 may or may not correspond to the alignment hole 221 of the movable member 22.

In one embodiment, the electrical connection member 93 of the semiconductor device 9 abuts the surrounding portions of the opening 222 of the moving member 22 respectively. In addition, in order to prevent the moving part 22 from damaging the electrical connection part 93, the moving part 22 is a flexible board.

Refer to FIG. 11, which shows a schematic diagram of moving the indenter above the test seat and making a corner of the indenter correspond to the alignment hole of the moving part in the testing method of the present invention. The step (c) of the testing method of the present invention is to move an indenter 30 to above the test base 20 and make a corner 31 of the indenter 30 correspond to the alignment hole 221 of the movable member 22. In the step (c), at least one side 32 of the indenter 30 is aligned with at least one side 92 of the semiconductor device 9.

As shown in Figures 1 and 5, the indenter 30 can be set on a moving device 40, which includes a first-axis translation table 41, a second-axis translation table 42 and a third-axis lift table 43. The first axis translation table 41 is connected to a frame 81. The second axis translation table 42 is connected to the first axis translation table 41. The third axis lifting platform 43 is connected to the second axis translation platform 42. In one embodiment, the first-axis translation stage 41 may be defined as an X-axis translation stage, the second-axis translation stage 42 may be defined as a Y-axis translation stage, and the third-axis lifting stage 43 may be defined as a Z Axis lifting table.

In one embodiment, the indenter 30 can be set on the third-axis lifting platform 43 of the moving device 40 so as to perform lifting actions by the third-axis lifting platform 43.

Refer to FIG. 12, which shows a schematic diagram of moving the indenter downward to a top surface of the semiconductor device and applying a pressure on the semiconductor device in the testing method of the present invention. The step (d) of the testing method of the present invention is to move the indenter 30 down to a top surface 91 of the semiconductor device 9 and apply a pressure on the semiconductor device 9 so that the semiconductor device 9 contacts the test board 10 of these measuring probes 11. In this step (d), when the pressure head 30 applies the pressure on the semiconductor device 9, the electrical connection member 93 of the semiconductor device 9 will press down the moving member 22 and the at least one elastic member 23. Until the electrical connectors 93 respectively contact at least a part of the measuring probes 11 of the test board 10.

In order to enable the indenter 30 to evenly press the semiconductor device 9 and prevent the electrical connector 93 from being damaged due to excessive force touching the measuring probe 11, the pressure applied by the indenter 30 is 14 to 15.5 Kg .

Refer to FIG. 13, which shows a schematic diagram of electrically connecting the test board with the test program interface in the test method of the present invention. After the step (d), the test method of the present invention further includes: step (e) using a test program interface 60 to electrically connect the test board 10 to obtain the electrical connector 93 contacting the semiconductor device 9 At least a part of the test data of the measuring probe 11 is used, and the remaining measuring probes 11 that are not in contact with the electrical connector 93 are invalidated. In this step (e), failure of the measuring probe 11 includes not obtaining test data.

In one embodiment, the test program interface 60 includes a test machine 61 and a human-machine interface unit 62. The testing machine 61 is electrically connected to the testing board 10. The man-machine interface unit 62 is electrically connected to the testing machine 61, and controls the data acquisition operation of the measurement probes 11 by programming language. In one embodiment, the human-machine interface unit 62 is a computer on which a test program is installed. In the present invention, the number of the measuring probes 11 does not completely correspond to the number of the electrical connection members 93 of the semiconductor device 9. Therefore, when the semiconductor device 9 is placed on the movable member 22 (as shown in FIG. 10), that is, according to the arrangement position of the electrical connection piece 93, it is determined in advance which measuring probes 11 will contact the electrical connection piece 93 in the next step (the measuring probes 11 are called the first quantity The measuring probes 11) and which measuring probes 11 will not contact the electrical connector 93 in the next steps (the measuring probes 11 are referred to as the second measuring probes 11). The above data is first input into the test program of the man-machine interface unit 62 to make the second measurement probes 11 invalid in advance. Then, in step (e) of FIG. 13, the test program of the human-machine interface unit 62 only needs to judge or process the test data of the first measurement probes 11.

After the test is completed, the indenter 30 can be moved upward to separate the indenter 30 from the semiconductor device 9, and the at least one elastic member 23 will push the movable member 22 upward to reset the movable member 22 , And return to the position shown in Figure 11.

In one embodiment, as shown in FIG. 2, the size of the indenter 30 is smaller than the size of the rectangular array A arranged by the alignment holes 221 and the openings 222. For example, the indenter 30 The size is 50% to 90%, 50% to 70%, 60% to 90%, 60% to 80%, or 70% to 90% of the size of the rectangular array A. When the size of the semiconductor device 9 is smaller than the size of the indenter 30, the indenter 30 can completely press the entire top surface 91 of the semiconductor device 9 so that the entire semiconductor device 9 has an even force. However, even if the size of the semiconductor device 9 is larger than the size of the indenter 30 (for example, the size of the semiconductor device 9 is approximately equal to the size of the rectangular array A), because the geometric center of the indenter 30 and the geometric center of the semiconductor device 9 The distance between them is not large. Therefore, even if the indenter 30 cannot completely press the entire top surface 91 of the semiconductor device 9, the force on the entire semiconductor device 9 is still even.

In addition, in step (a) of the testing method of the present invention, as shown in FIG. 2, FIG. 8 and FIG. 9, the relative position of the alignment hole 221 and the indenter 30 on the moving device 40 must be predetermined. For example, the XY coordinate of the corner 31 of the indenter 30 at the original point (or starting point) that has not been tested is (X0, Y0), for example: (0, 0), and the alignment hole 221 The XY coordinate is (X ₁ ,Y ₁ ), for example: (194.340,203.130). After inputting the (X ₁ , Y ₁ ) coordinates of the alignment hole 221 to the test program of the man-machine interface unit 62, regardless of the size of the semiconductor device 9, the mobile device 40 will press The head 30 moves to (X ₁ , Y ₁ ) and then presses it down for testing; after that, after the test is completed, the moving device 40 moves the indenter 30 up and back to (X ₀ , Y ₀ ). Therefore, the above-mentioned coordinate setting only needs to be performed once, and the mobile device 40 can be automatically moved during each subsequent test; even if the size of the semiconductor device 9 is different, it does not need to be reset.

The above-mentioned embodiments only illustrate the principles and effects of the present invention, and do not limit the present invention. Therefore, those skilled in the art can modify and change the above-mentioned embodiments without departing from the spirit of the present invention. The scope of rights of the present invention should be listed in the scope of patent application described later.

1: test equipment 10: Test board 11: Measuring probe 20: Test seat 21: Seat 211: Containment Slot 213: inner wall 22: Moving parts 221: Alignment Hole 222: Opening 23: Elastic 30: pressure head 31: Corner 32: side 40: mobile device 41: The first axis translation stage 42: Second axis translation stage 43: The third axis lifting table 60: Test program interface 61: test machine 62: Human-machine interface unit 70: Support 81: Frame 82: data display unit 9: Semiconductor device 91: top surface 92: side 93: Electrical connection A: Rectangular array B: local area C: Center of counterpoint D1: distance D2: stitch length E: local area F: local area

When read in conjunction with the drawings, it is easy to understand the aspects of some embodiments of the present invention from the following detailed description. It should be noted that various structures may not be drawn to scale, and the size of various structures may be increased or decreased arbitrarily for clarity of discussion.

Fig. 1 shows a three-dimensional schematic diagram of a test device according to an embodiment of the present invention.

Fig. 2 shows a top view of the arrangement of the test board, test base, indenter and semiconductor device of the present invention.

Fig. 3 shows a cross-sectional view of the configuration of the test board, test base, indenter and semiconductor device of the present invention.

FIG. 4 shows an enlarged view of the partial area E of FIG. 3.

Figure 5 shows a three-dimensional assembly view of the moving device and the indenter of the present invention.

Fig. 6 shows an enlarged view of the partial area B in Fig. 2.

FIG. 7 shows a three-dimensional schematic diagram of a testing device according to an embodiment of the present invention.

FIG. 8 shows a cross-sectional view of the configuration of the test board, the test seat and the indenter in the test method of the present invention.

FIG. 9 shows an enlarged view of the partial area F of FIG. 8.

FIG. 10 shows a schematic diagram of disposing a semiconductor device on a moving part in the testing method of the present invention.

Fig. 11 shows a schematic diagram of moving the indenter above the test seat and making a corner of the indenter correspond to the alignment hole of the moving part in the testing method of the present invention.

12 shows a schematic diagram of moving the indenter downward to a top surface of a semiconductor device and applying a pressure on the semiconductor device in the testing method of the present invention.

FIG. 13 shows a schematic diagram of using the test program interface to electrically connect the test board in the test method of the present invention.

1: test equipment

10: Test board

20: Test seat

21: Seat

22: Moving parts

30: pressure head

40: mobile device

41: The first axis translation stage

42: Second axis translation stage

43: The third axis lifting table

70: Support

81: Frame

82: data display unit

9: Semiconductor device

Claims (19)

A test equipment includes: a test board with a plurality of measurement probes for testing a semiconductor device; a test stand arranged on the test board for carrying the semiconductor device, and the test stand defines a pair The positioning hole and a plurality of openings correspond to the measuring probes of the test board. The test base includes a base and a moving part. The moving part is arranged in the base. The positioning hole and the The equal openings are located on the moving part, and the alignment holes and the openings are arranged in a rectangular array, the alignment holes are located at a corner of the rectangular array; and a pressure head is arranged above the test seat, Used to apply a pressure on the semiconductor device, and a corner of the indenter corresponds to the alignment hole of the test base. For example, the test equipment of claim 1 further includes a moving device, and the indenter is arranged on the moving device. For example, the test equipment of claim 2 further includes a frame on which the mobile device is arranged. Such as the test equipment of claim 3, wherein the moving device includes a first-axis translation table, a second-axis translation table, and a third-axis lift table, the first-axis translation table is connected to the frame, and the second-axis translation The table is connected with the first-axis translation table, the third-axis lift table is connected with the second-axis translation table, and the pressure head is arranged on the third-axis lift table. For example, the test equipment of claim 3 further includes a data display unit, which is arranged on the frame and used to display test conditions including the pressure of the indenter. The test equipment of claim 1, wherein at least one side of the indenter is aligned with at least one side of the semiconductor device. Such as the test equipment of claim 1, wherein the size of the indenter is greater than or equal to the size of the semiconductor device. Such as the test equipment of claim 1, wherein the base has an inner side wall, and the distance from the center of the alignment hole to the inner side wall of the base is greater than the needle distance between two adjacent measuring probes of the test board. For example, the test equipment of claim 1 further includes a test program interface, a plurality of electrical connectors of the semiconductor device respectively contact at least a part of the measurement probes of the test board, and the test program interface is electrically connected to the test board , In order to obtain the test data of the at least a part of the measurement probe, and make the measurement probe which is not in contact with the electrical connection part invalid. Such as the test equipment of claim 9, wherein the failure of the measurement probe includes not obtaining test data. Such as the test equipment of claim 9, wherein the test program interface determines in advance which measurement probes will contact the electrical connection and which measurement probes will be in contact with the electrical connection in the next step according to the arrangement position of the electrical connection The next steps will not touch the electrical connector, the above data is input first Enter into a test program of a human-machine interface unit to invalidate the measurement probes in advance, so that the test program interface determines whether to contact the electrical connector by detecting the pressure under the metering probe. A test equipment includes: a test board with a plurality of measurement probes for testing a semiconductor device; a test stand arranged on the test board for carrying the semiconductor device, and the test stand defines a pair Bit holes and a plurality of openings, the openings corresponding to the measurement probes of the test board; and a pressure head arranged above the test seat for applying a pressure on the semiconductor device, and the A corner of the indenter corresponds to the alignment hole of the test base; wherein the number of the measurement probes of the test board is greater than the number of the plurality of electrical connections of the semiconductor device. A test equipment includes: a test board with a plurality of measurement probes for testing a semiconductor device; a test stand arranged on the test board for carrying the semiconductor device, and the test stand defines a pair Bit holes and a plurality of openings, the openings corresponding to the measurement probes of the test board; and a pressure head arranged above the test seat for applying a pressure on the semiconductor device, and the A corner of the indenter corresponds to the alignment hole of the test base; wherein the test base includes a base and a moving part, and the moving part is arranged in the base to carry the semiconductor device, the alignment hole and the The equal openings are located on the moving part, and the total number of the alignment holes and the openings is greater than the number of the plurality of electrical connections of the semiconductor device the amount. A test method includes: (a) providing a test board and a test base, the test board has a plurality of measurement probes, the test base is arranged on the test board, the test base includes a base and a moving part, The moving part is arranged in the base, and the moving part defines a pair of holes and a plurality of openings, and the openings correspond to the measurement probes of the test board; (b) setting a semiconductor device in the moving (C) move an indenter to the top of the test base, and make a corner of the indenter correspond to the alignment hole of the moving part; and (d) move the indenter downward to the semiconductor device A top surface, and applying a pressure on the semiconductor device so that the semiconductor device contacts the measurement probes of the test board. Such as the test method of claim 14, wherein in the step (a), the alignment holes and the openings of the movable member are arranged in a rectangular array, and the alignment holes are located at a corner of the rectangular array. Such as the test method of claim 14, wherein in the step (a), the base has an inner side wall, and the distance from the center of the alignment hole to the inner side wall of the base is greater than two adjacent amounts of the test board Measure the needle distance between the probes. Such as the test method of claim 14, wherein in the step (d), the plurality of electrical connectors of the semiconductor device respectively contact at least a part of the measurement probes of the test board; and the test method further includes: (e) Use a test program interface to electrically connect the test board to obtain the test data of the at least one part of the measurement probes, and disable the remaining measurement probes that are not in contact with the electrical connector. Such as the test method of claim 14, wherein in the step (d), the number of the measurement probes of the test board is greater than the number of the plurality of electrical connections of the semiconductor device. Such as the test method of claim 17, wherein in the step (e), the test program interface pre-determines which measurement probes will contact the electrical connection in the next step according to the arrangement position of the electrical connector And which measuring probes will not touch the electrical connections in the next step. The above data is first input into the test program of a human-machine interface unit to pre-deactivate the measuring probes, causing the The test program interface judges whether it is touching the electrical connector by detecting the pressure under the metering probe.

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