TWM587274U - Testing apparatus - Google Patents

Abstract

A testing apparatus includes a load board, a socket and a chuck. The load board includes a plurality of pogo pins used for testing a semiconductor device. The socket is disposed on the load board to carry the semiconductor device. The socket defines an alignment hole and a plurality of openings. The openings correspond to the pogo pins of the the load board. The chuck is disposed above the socket to apply a pressure on the semiconductor device. A corner of the chuck corresponds to the alignment hole of the socket.

Description

Test Equipment

The present invention relates to a test device, and more specifically, to a test device for electrical testing.

In the current electrical testing process of production lines, the device under test (DUT) is first placed on the test board of the test board by pick and place, and then open-shorted. )test. In addition, different sizes of test components need to be used with different specifications of test boards and test bases, and even other test auxiliary fixtures must be replaced. However, the continuous replacement of test equipment and fixtures will not only cause time-consuming tests, but also increase test costs significantly.

In one embodiment, a test device includes a test board, a test base, and an indenter. The test board has a plurality of measurement probes for testing a semiconductor device. The test socket is disposed on the test board and is used to carry the semiconductor device. The test base defines a pair of position holes and a plurality of openings, and the openings correspond to the measurement probes of the test board. The indenter is disposed above the test base for applying a pressure on the semiconductor device, and an angle of the indenter corresponds to the alignment hole of the test base.

In one embodiment, a test device includes a test board, a test base, an indenter, and a test program interface. The test board has a plurality of measurement probes for testing a semiconductor device. The test socket is disposed on the test board and is used for accommodating the semiconductor device. The indenter is disposed above the test base, and is used to apply a pressure on the semiconductor device, so that the plurality of electrical connecting members of the semiconductor device respectively contact at least a part of the measurement probe of the test board. The test program interface is electrically connected to the test board to obtain test data of the at least part of the measurement probes, and to disable the measurement probes that are not in contact with the electrical connector.

Common reference numbers are used throughout the drawings and the embodiments to indicate the same or similar components. Embodiments of the present invention will be more readily understood from the following detailed description taken in conjunction with the accompanying drawings.

The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and configurations are described below to illustrate specific aspects of the new model. Of course, these components, values, operations, materials, and configurations are examples only and are not intended to be limiting. For example, in the description provided herein, the formation of the first feature above or on the second feature may include embodiments in which the first feature and the second feature are formed or placed in direct contact, and may also include additional features Embodiments in which the first feature and the second feature may not be in direct contact may be formed or disposed between the first feature and the second feature. In addition, the present invention may repeat reference numbers and / or letters in the various examples provided herein. This repetition is for simplicity and clarity, and does not in itself indicate the relationship between the various embodiments and / or configurations discussed.

Refer to FIG. 1, which is a schematic perspective view of a testing device 1 according to an embodiment of the present invention. The new test equipment 1 includes a test board 10, a test base 20, a moving device 40, an indenter 30, a support 70, a frame 81, and a data display unit 82. In one embodiment, the support member 70 is disposed on the frame body 81.

FIG. 2 shows a top view of the configuration of the novel test board 10, the test base 20, the indenter 30, and the semiconductor device 9. FIG. 3 is a cross-sectional view showing the configuration of the novel test board 10, the test base 20, the indenter 30, and the semiconductor device 9. With reference to FIG. 1, FIG. 2, and FIG. 3, the test board 10 is disposed on the support 70, and the test board 10 has a plurality of measurement probes 11 for testing a semiconductor device 9. The measurement probes 11 are circuits electrically connected to the test board 10. In one embodiment, the semiconductor device 9 has a top surface 91, a side edge 92, and a plurality of electrical connecting members 93. The electrical connecting members 93 may be solder balls or metal bumps. ).

In one embodiment, the number of the measurement probes 11 of the test board 10 is greater than the number of the electrical connectors 93 of the semiconductor device 9, so that the test board 10 can test different electrical connectors 93. Number of semiconductor devices 9.

FIG. 4 shows an enlarged view of the partial area E of FIG. 3. With reference to FIG. 2, FIG. 3, and FIG. 4, the test base 20 is disposed on the test board 10 for receiving and carrying the semiconductor device 9. In addition, the test base 20 defines a pair of positioning holes 221 and a plurality of openings 222. The positioning holes 221 and the openings 222 correspond to the measurement probes 11 of the test board 10, respectively. That is, the measurement probes 11 are located in the alignment holes 221 and the openings 222. In one embodiment, the measurement probes 11 are located in the openings 222 but not in the alignment holes 221. Therefore, only the openings 222 correspond to the measurement probes 11 of the test board 10. In addition, in an embodiment, the electrical connections 93 of the semiconductor device 9 correspond to the openings 222, respectively, and the total number of the alignment holes 221 and the openings 222 is greater than the semiconductor device 9 The number of the electrical connections 93 is such that the test base 20 can test semiconductor devices 9 with different numbers of electrical connections 93. In an embodiment, the electrical connection member 93 of the semiconductor device 9 may or may not correspond to the alignment hole 221.

In one embodiment, the test base 20 includes a base 21, a moving member 22 and at least one elastic member 23. The base 21 includes a receiving groove 211 and an inner side wall 213. The base 21 is fixed on the test board 10.

The moving member 22 is disposed in the base 21 and is used to carry the semiconductor device 9. In one embodiment, the positioning holes 221 and the openings 222 can be located or formed on the moving member 22, that is, the positioning holes 221 and the openings 222 are defined by the moving member 22. In an embodiment, the alignment holes 221 and the openings 222 pass through the moving member 22 and the base body 21, and the size of the alignment holes 221 are substantially the same as the sizes of the openings 222. In addition, as shown in FIG. 2, the alignment holes 221 and the openings 222 can be arranged in a rectangular array A, and the alignment holes 221 are located at a corner of the rectangular array A.

In an embodiment, as shown in FIG. 3 and FIG. 4, the electrical connecting members 93 of the semiconductor device 9 abut the moving members 22, and the electrical connecting members 93 abut each of the openings 222. Around the top of the moving member 22 (ie, the opening on the top surface of the moving member 22). Therefore, the maximum width of the electrical connection member 93 is larger than the maximum width of the top of each of the openings 222 (that is, the opening on the top surface of the moving member 22). In addition, in order to prevent the moving member 22 from damaging the electrical connection member 93, the moving member 22 is a flexible board.

The at least one elastic member 23 is disposed in the receiving groove 211 of the base 21. In addition, the at least one elastic member 23 is disposed below the moving member 22 and abuts the moving member 22 so that the moving member 22 can move up and down within the base 21.

FIG. 5 shows a three-dimensional assembled view of the novel mobile device and the indenter. With reference to FIGS. 1 and 5, the moving device 40 is disposed on the frame 81, and the moving device 40 includes a first-axis translation stage 41, a second-axis translation stage 42, and a third-axis lifting stage 43. . The first shaft translation stage 41 is connected to the frame 81. The second axis translation stage 42 is connected to the first axis translation stage 41. The third shaft lifting platform 43 is connected to the second shaft translation platform 42. In one embodiment, the first-axis translation stage 41 can be defined as an X-axis translation stage, which is fixed on the frame 81. The second-axis translation stage 42 can be defined as a Y-axis translation stage, and it can move (slide) in the X direction on the first-axis translation stage 41. The third-axis lifting platform 43 can be defined as a Z-axis lifting platform, which can be moved (slided) in the Y direction on the second-axis translation platform 42, and can be lifted and lowered along the Z-axis itself.

Referring again to FIG. 1, FIG. 4, and FIG. 5, the indenter 30 is disposed above the test base 20 to apply a pressure on the semiconductor device 9 so that the electrical connections 93 of the semiconductor device 9 are respectively The measurement probe 11 is in contact with at least a part of the test board 10. In one embodiment, the indenter 30 is disposed on the third-axis lifting platform 43 of the moving device 40 to perform the lifting operation by the third-axis lifting platform 43.

Referring again to FIG. 2 and FIG. 4, a corner 31 of the indenter 30 corresponds to the alignment hole 221 of the test base 20, and at least one side 32 of the indenter 30 is aligned with at least one side of the semiconductor device 9. Edge 92. In one embodiment, the size of the indenter 30 is greater than or equal to the size of the semiconductor device 9, so that the indenter 30 can test a plurality of semiconductor devices 9 with different sizes. In addition, since the positioning hole 221 of the test base 20 can be used as a test reference point for each movement of the indenter 30, even when testing semiconductor devices 9 of different sizes, the test board 10 can be replaced without testing. In the case of the test base 20 and the indenter 30, the pressure test operation is accurately performed. In an embodiment, the size of the indenter 30 is smaller than the size of the rectangular array A in which the alignment holes 221 and the openings 222 are arranged. For example, the size of the indenter 30 is the rectangle. Array A is 50% to 90%, 50% to 70%, 60% to 90%, 60% to 80%, or 70% to 90% in size.

FIG. 6 shows an enlarged view of the local area B of FIG. 2. With reference to FIG. 2 and FIG. 6, in order to prevent the indenter 30 from hitting the base 21 of the test base 20 during the test, the distance between the center C of the alignment hole 221 and the inner side wall 213 of the base 21 D1 is greater than the pitch D2 between two adjacent measuring probes 11 of the test board 10. In one embodiment, the distance D1 is greater than or equal to twice the stitch distance D2. Therefore, during the test, a corner 31 of the indenter 30 corresponds to the center of the positioning hole 221 of the moving member 22. Therefore, the side 32 of the indenter 30 to the inner side wall of the base 21 The distance of 213 is also equal to the above-mentioned distance D1; during the downward movement of the indenter 30, it is not easy to hit the base 21 of the test base 20. In addition, as shown in FIG. 6, since the indenter 30 does not completely cover the rectangular array A, a part of the opening 222 located on the outermost circle of the rectangular array A will be located on the side 32 of the indenter 305. Within the defined range, and the other half is outside the range defined by the side 32 of the indenter 30, so that the risk of the indenter 30 hitting the base 21 of the test base 20 is further reduced.

Referring again to FIG. 1, the data display unit 82 is disposed on the frame 81 to display the test conditions including the pressure of the indenter 30.

FIG. 7 is a schematic perspective view of a testing device 1a according to an embodiment of the present invention. The test equipment 1 a of FIG. 7 is substantially the same as the test equipment 1 of FIGS. 1 to 6, except that the test equipment 1 a of FIG. 7 further includes a test program interface 60. As shown in FIG. 7 and FIG. 4, the test program interface 60 is electrically connected to the test board 10 and the data display unit 82 to obtain at least a part of the electrical connection member 93 in contact with the semiconductor device 9. The test data of the measuring probe 11 makes the measuring probe 11 not in contact with the electrical connector 93 invalid. In one embodiment, the failure of the measurement probe 11 includes not obtaining test data.

In one embodiment, the test program interface 60 includes a test machine 61 and a human-machine interface unit 62. The testing machine 61 is electrically connected to the testing board 10. The human-machine interface unit 62 is electrically connected to the testing machine 61 and controls the data acquisition actions of the measurement probes 11 in a programming language (including but not limited to: controlling the movement of the mobile device 40 and receiving the measurement probes) Pin 11 test signal information). In one embodiment, the human-machine interface unit 62 is a computer on which a test program is installed.

The test method of the present invention is described in detail below, but it does not mean that the present invention is limited to the content disclosed in these embodiments.

FIG. 8 is a cross-sectional view showing a configuration of a test board, a test base and an indenter in the novel test method. FIG. 9 shows an enlarged view of the partial area F of FIG. 8. With reference to FIG. 2, FIG. 8, and FIG. 9, step (a) of the novel testing method is to provide a test board 10 and a test base 20. The test board 10 has a plurality of measurement probes 11. The probe 11 is a circuit electrically connected to the test board 10. The test base 20 is disposed on the test board 10. In addition, the test base 20 includes a body 21 and a moving member 22. The moving member 22 is disposed in the base 21, and the moving member 22 defines a pair of positioning holes 221 and a plurality of openings 222. The positioning holes 221 and the openings 222 correspond to each of the test boards 10. This measurement probe 11. That is, the measurement probes 11 are located in the alignment holes 221 and the openings 222. In one embodiment, the measurement probes 11 are located in the openings 222 but not in the alignment holes 221. Therefore, only the openings 222 correspond to the measurement probes 11 of the test board 10.

In step (a), the alignment holes 221 and the openings 222 can be arranged in a rectangular array A, and the alignment holes 221 are located at a corner of the rectangular array A. In addition, as shown in FIGS. 6 and 9, the base body 21 has a receiving groove 211 and an inner side wall 213, and a distance D1 between the center C of the positioning hole 221 and the inner side wall 213 of the base body 21 is greater than The pitch D2 between two adjacent measuring probes 11 of the test board 10. In one embodiment, the distance D1 is greater than or equal to twice the stitch distance D2.

In one embodiment, the test base 20 further includes at least one elastic member 23. The at least one elastic member 23 is disposed in the receiving slot 211 of the base 21. In addition, the at least one elastic member 23 is disposed below the moving member 22 and abuts the moving member 22.

Referring to FIG. 10, it is a schematic diagram showing the arrangement of a semiconductor device on a moving part in the novel test method. Step (b) of the novel testing method is to set a semiconductor device 9 on the moving member 22. In this step (b), the semiconductor device 9 has a plurality of electrical connectors 93. The electrical connectors 93 may be solder balls or metal bumps.

In one embodiment, the number of the measurement probes 11 of the test board 10 is greater than the number of the electrical connectors 93 of the semiconductor device 9, so that the test board 10 can test different electrical connectors 93. Number of semiconductor devices 9.

In addition, the electrical connecting members 93 of the semiconductor device 9 correspond to the openings 222 of the moving member 22, respectively, and the total number of the positioning holes 221 and the openings 222 is greater than that of the semiconductor device 9. The number of the electrical connections 93 is such that the test base 20 can test semiconductor devices 9 having different numbers of electrical connections 93. In one embodiment, the electrical connection member 93 of the semiconductor device 9 may or may not correspond to the alignment hole 221 of the moving member 22.

In one embodiment, the electrical connecting members 93 of the semiconductor device 9 respectively abut the surrounding portions of the openings 222 of the moving member 22. In addition, in order to prevent the moving member 22 from damaging the electrical connection member 93, the moving member 22 is a flexible board.

Referring to FIG. 11, it is a schematic diagram showing moving the indenter to the top of the test base and making an angle of the indenter correspond to the positioning hole of the moving part in the new testing method. Step (c) of the novel testing method is to move an indenter 30 above the test base 20 and make an angle 31 of the indenter 30 correspond to the positioning hole 221 of the moving member 22. In step (c), at least one side edge 32 of the indenter 30 is aligned with at least one side edge 92 of the semiconductor device 9.

As shown in FIGS. 1 and 5, the indenter 30 is disposed on a moving device 40. The moving device 40 includes a first-axis translation stage 41, a second-axis translation stage 42, and a third-axis lifting stage. 43. The first axis translation stage 41 is connected to a frame 81. The second axis translation stage 42 is connected to the first axis translation stage 41. The third shaft lifting platform 43 is connected to the second shaft translation platform 42. In an embodiment, the first-axis translation stage 41 may be defined as an X-axis translation stage, the second-axis translation stage 42 may be defined as a Y-axis translation stage, and the third-axis lifting stage 43 may be defined as Z Shaft lifting platform.

In one embodiment, the indenter 30 is disposed on the third-axis lifting platform 43 of the moving device 40 to perform the lifting operation by the third-axis lifting platform 43.

Referring to FIG. 12, it is a schematic diagram of moving the indenter down to a top surface of a semiconductor device and applying a pressure on the semiconductor device in the novel test method. Step (d) of the novel testing method is to move the indenter 30 down to a top surface 91 of the semiconductor device 9 and apply a pressure on the semiconductor device 9 so that the semiconductor device 9 contacts the test board. 10 of these measurement probes 11. In step (d), when the pressure head 30 applies the pressure on the semiconductor device 9, the electrical connection member 93 of the semiconductor device 9 will press down the moving member 22 and the at least one elastic member. 23 until the electrical connecting members 93 contact at least a part of the measuring probe 11 of the test board 10 respectively.

In order to enable the indenter 30 to evenly press the semiconductor device 9 and prevent the electrical connection member 93 from being damaged due to excessive force against the measuring probe 11, the pressure applied by the indenter 30 is 14 to 15.5 Kg .

Please refer to FIG. 13, which is a schematic diagram showing a test program interface for electrically connecting a test board in the novel test method. After step (d), the new testing method further includes: step (e) using a test program interface 60 to electrically connect the test board 10 to obtain the electrical connector 93 contacting the semiconductor device 9 At least a part of the measurement data of the measuring probe 11 makes the remaining measuring probes 11 that have not touched the electrical connection member 93 invalid. In step (e), the failure of the measurement probe 11 includes not obtaining test data.

In one embodiment, the test program interface 60 includes a test machine 61 and a human-machine interface unit 62. The testing machine 61 is electrically connected to the testing board 10. The human-machine interface unit 62 is electrically connected to the testing machine 61, and controls the data acquisition actions of the measuring probes 11 in a programming language. In one embodiment, the human-machine interface unit 62 is a computer on which a test program is installed. In the present invention, the number of the measuring probes 11 does not exactly correspond to the number of the electrical connection members 93 of the semiconductor device 9, so when the semiconductor device 9 is placed on the moving member 22 (as shown in FIG. 10), that is, which measurement probes 11 will contact the electrical connection member 93 in the next step according to the arrangement position of the electrical connection members 93 (these measurement probes 11 are called the first quantity) The measuring probe 11) and which measuring probes 11 do not contact the electrical connection member 93 in the next steps (these measuring probes 11 are called second measuring probes 11). The above-mentioned data is first input into the test program of the human-machine interface unit 62 to invalidate the second measurement probes 11 in advance. Next, in step (e) of FIG. 13, the test program of the human-machine interface unit 62 only needs to judge or process the test data of the first measurement probes 11.

After the test is completed, the indenter 30 can be moved upward to disengage the indenter 30 from the semiconductor device 9, and the at least one elastic member 23 pushes the moving member 22 upward to reset the moving member 22. , And reply to the position shown in Figure 11.

In an embodiment, as shown in FIG. 2, the size of the indenter 30 is smaller than the size of the rectangular array A in which the alignment holes 221 and the openings 222 are arranged. For example, the indenter 30 The size is 50% to 90%, 50% to 70%, 60% to 90%, 60% to 80%, or 70% to 90% of the size of the rectangular array A. When the size of the semiconductor device 9 is smaller than the size of the indenter 30, the indenter 30 can completely press the entire top surface 91 of the semiconductor device 9, and therefore, the force of the entire semiconductor device 9 is averaged. However, even if the size of the semiconductor device 9 is larger than the size of the indenter 30 (for example, the size of the semiconductor device 9 is approximately equal to the size of the rectangular array A), the geometric center of the indenter 30 and the geometric center of the semiconductor device 9 The distance between them is not large. Therefore, even if the indenter 30 cannot completely press the entire top surface 91 of the semiconductor device 9, the force of the entire semiconductor device 9 is still average.

In addition, in step (a) of the novel testing method, for example, as shown in FIG. 2, FIG. 8, and FIG. For example, the XY coordinate of the corner 31 of the indenter 30 at the original point (or starting point) without testing is (X0, Y0), for example: (0,0), and the alignment hole 221 The XY coordinate is (X ₁ , Y ₁ ), for example: (194.340,203.130). After inputting the (X ₁ , Y ₁ ) coordinates of the alignment hole 221 into the test program of the human-machine interface unit 62, regardless of the size of the semiconductor device 9, the mobile device 40 will press the pressure every time when testing After the head 30 is moved to (X ₁ , Y ₁ ) and then pressed down to perform the test; after the test is completed, the moving device 40 moves the head 30 up and back to (X ₀ , Y ₀ ). Therefore, the above-mentioned coordinate setting only needs to be performed once, and the mobile device 40 can be automatically moved in each subsequent test; even if the size of the semiconductor device 9 is different, there is no need to reset it.

The above-mentioned embodiments are only for explaining the principle and effect of the new model, and not for limiting the new model. Therefore, those skilled in the art can modify and change the above embodiments without departing from the spirit of the new model. The scope of rights of the new model shall be as listed in the scope of patent application mentioned later.

1‧‧‧test equipment
10‧‧‧test board
11‧‧‧ Measuring Probe
20‧‧‧Test Block
21‧‧‧ seat
211‧‧‧Receiving slot
213‧‧‧ inside wall
22‧‧‧ moving parts
221‧‧‧Alignment hole
222‧‧‧Opening
23‧‧‧Elastic piece
30‧‧‧ Indenter
31‧‧‧ Horned Owl
32‧‧‧ side
40‧‧‧ mobile device
41‧‧‧first axis translation stage
42‧‧‧Second axis translation stage
43‧‧‧Third axis lifting platform
60‧‧‧Test program interface
61‧‧‧testing machine
62‧‧‧Human Machine Interface Unit
70‧‧‧ support
81‧‧‧frame
82‧‧‧Data Display Unit
9‧‧‧ semiconductor device
91‧‧‧Top
92‧‧‧ side
93‧‧‧Electrical connection
A‧‧‧ rectangular array
B‧‧‧ local area
C‧‧‧ Center of counter hole
D1‧‧‧distance
D2‧‧‧Pitch
E‧‧‧Partial area
F‧‧‧ partial area

When read in conjunction with the accompanying drawings, aspects of some embodiments of the present invention will be readily understood from the following detailed description. It should be noted that various structures may not be drawn to scale, and the dimensions of various structures may be arbitrarily increased or decreased for clarity of discussion.

FIG. 1 is a schematic perspective view of a testing device according to an embodiment of the present invention.

FIG. 2 shows a top view of the configuration of the novel test board, test base, indenter and semiconductor device.

FIG. 3 is a cross-sectional view showing the configuration of the novel test board, test base, indenter and semiconductor device.

FIG. 4 shows an enlarged view of the partial area E of FIG. 3.

FIG. 5 shows a three-dimensional assembled view of the novel mobile device and the indenter.

FIG. 6 shows an enlarged view of the local area B of FIG. 2.

FIG. 7 is a schematic perspective view of a testing device according to an embodiment of the present invention.

FIG. 8 is a cross-sectional view showing a configuration of a test board, a test base and an indenter in the novel test method.

FIG. 9 shows an enlarged view of the partial area F of FIG. 8.

FIG. 10 shows a schematic diagram of a semiconductor device mounted on a moving part in the novel testing method.

FIG. 11 shows a schematic diagram of moving the indenter above the test base and making an angle of the indenter correspond to the alignment hole of the moving part in the new testing method.

FIG. 12 shows a schematic diagram of moving the indenter down to a top surface of a semiconductor device and applying a pressure on the semiconductor device in the novel testing method.

FIG. 13 shows a schematic diagram of electrically connecting a test board using a test program interface in the novel test method.

Claims (13)

A test device including:
A test board with a plurality of measurement probes for testing a semiconductor device;
A test socket disposed on the test board for carrying the semiconductor device, and the test socket defines a pair of bit holes and a plurality of openings, the openings corresponding to the measurement probes of the test board; and An indenter is disposed above the test base for applying a pressure on the semiconductor device, and an angle of the indenter corresponds to the positioning hole of the test base. If the test equipment of claim 1 further includes a mobile device, the indenter is disposed on the mobile device. If the test equipment of claim 2 further includes a frame, the mobile device is disposed on the frame. If the test equipment of claim 3, wherein the moving device includes a first axis translation stage, a second axis translation stage and a third axis lifting stage, the first axis translation stage is connected to the frame, and the second axis translation The stage is connected to the first shaft translation stage, the third shaft lifting stage is connected to the second shaft translation stage, and the indenter is disposed on the third shaft lifting stage. If the test equipment of claim 3 further includes a data display unit, the data display unit is arranged on the frame to display the test conditions including the pressure of the indenter. The test equipment of claim 1, wherein at least one side of the indenter is aligned with at least one side of the semiconductor device. The test equipment of claim 1, wherein the size of the indenter is greater than or equal to the size of the semiconductor device. If the test equipment of claim 1, wherein the test base includes a body and a moving part, the moving part is arranged in the body, the positioning holes and the openings are located on the moving part, and the positioning hole and The openings are arranged in a rectangular array, and the positioning holes are located at a corner of the rectangular array. For example, the test equipment of claim 8, wherein the base body has an inner side wall, and the distance from the center of the positioning hole to the inner side wall of the base body is greater than the needle distance between two adjacent measuring probes of the test board. A test device including:
A test board with a plurality of measurement probes for testing a semiconductor device;
A test stand is disposed on the test board and is used for accommodating the semiconductor device;
An indenter disposed above the test base for applying a pressure on the semiconductor device so that the plurality of electrical connections of the semiconductor device respectively contact at least a part of the measurement probe of the test board; and A test program interface is electrically connected to the test board to obtain test data of the at least part of the measurement probes, and disables the measurement probes that are not in contact with the electrical connector. The testing device of claim 10, wherein the failure of the measurement probe includes not obtaining test data. The test equipment of claim 10, wherein the number of the measurement probes of the test board is greater than the number of the electrical connections of the semiconductor device. For example, the test equipment of claim 10, wherein the test base includes a body and a moving part, the moving part is arranged in the body for carrying the semiconductor device, and the moving part defines a pair of bit holes and a plurality of openings Holes, the openings correspond to the measuring probes of the test board, and the total number of the positioning holes and the openings is greater than the number of the electrical connections of the semiconductor device.