TWI716461B - Spacer-attached adhesive layer, optical film with spacer-attached adhesive layer, image display device and manufacturing method thereof - Google Patents
Spacer-attached adhesive layer, optical film with spacer-attached adhesive layer, image display device and manufacturing method thereof Download PDFInfo
- Publication number
- TWI716461B TWI716461B TW105131274A TW105131274A TWI716461B TW I716461 B TWI716461 B TW I716461B TW 105131274 A TW105131274 A TW 105131274A TW 105131274 A TW105131274 A TW 105131274A TW I716461 B TWI716461 B TW I716461B
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- Taiwan
- Prior art keywords
- spacer
- adhesive layer
- layer
- optical film
- conductive
- Prior art date
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- 239000012790 adhesive layer Substances 0.000 title claims abstract description 176
- 239000012788 optical film Substances 0.000 title claims abstract description 95
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 239000010410 layer Substances 0.000 claims abstract description 176
- 125000006850 spacer group Chemical group 0.000 claims abstract description 145
- 239000010408 film Substances 0.000 claims abstract description 87
- 230000002265 prevention Effects 0.000 claims abstract description 50
- 239000000203 mixture Substances 0.000 claims description 60
- 230000001070 adhesive effect Effects 0.000 claims description 43
- 239000000853 adhesive Substances 0.000 claims description 42
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 37
- 229920005989 resin Polymers 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 37
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 36
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 28
- 150000001875 compounds Chemical class 0.000 claims description 21
- 229920001940 conductive polymer Polymers 0.000 claims description 21
- 239000000377 silicon dioxide Substances 0.000 claims description 18
- 238000002360 preparation method Methods 0.000 claims description 16
- 229920005601 base polymer Polymers 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 54
- 229920006267 polyester film Polymers 0.000 abstract description 18
- -1 polyethylene Polymers 0.000 description 61
- 238000000576 coating method Methods 0.000 description 31
- 230000015572 biosynthetic process Effects 0.000 description 26
- 239000002585 base Substances 0.000 description 23
- 239000000243 solution Substances 0.000 description 23
- 239000011248 coating agent Substances 0.000 description 21
- 239000003431 cross linking reagent Substances 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 18
- 238000001035 drying Methods 0.000 description 18
- 239000000126 substance Substances 0.000 description 18
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 17
- 239000000178 monomer Substances 0.000 description 16
- 229920000058 polyacrylate Polymers 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 229910052757 nitrogen Inorganic materials 0.000 description 14
- 230000003068 static effect Effects 0.000 description 13
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 12
- 230000005611 electricity Effects 0.000 description 12
- 229920000139 polyethylene terephthalate Polymers 0.000 description 12
- 239000005020 polyethylene terephthalate Substances 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 12
- 125000000217 alkyl group Chemical group 0.000 description 11
- 239000011230 binding agent Substances 0.000 description 11
- 238000010828 elution Methods 0.000 description 11
- 229910052744 lithium Inorganic materials 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000007787 solid Substances 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 10
- 229910001887 tin oxide Inorganic materials 0.000 description 10
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- 150000008040 ionic compounds Chemical class 0.000 description 9
- 229920001296 polysiloxane Polymers 0.000 description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 8
- 229910052783 alkali metal Inorganic materials 0.000 description 8
- 150000001450 anions Chemical class 0.000 description 8
- 150000003839 salts Chemical class 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- 150000002894 organic compounds Chemical class 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- 239000006087 Silane Coupling Agent Substances 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 150000001768 cations Chemical class 0.000 description 6
- 239000006258 conductive agent Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 229910044991 metal oxide Inorganic materials 0.000 description 6
- 150000004706 metal oxides Chemical class 0.000 description 6
- 125000003545 alkoxy group Chemical group 0.000 description 5
- 125000000129 anionic group Chemical group 0.000 description 5
- 125000002091 cationic group Chemical group 0.000 description 5
- 239000000460 chlorine Substances 0.000 description 5
- 239000010954 inorganic particle Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 239000003505 polymerization initiator Substances 0.000 description 5
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- KWIUHFFTVRNATP-UHFFFAOYSA-N Betaine Natural products C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- 238000011088 calibration curve Methods 0.000 description 4
- 239000013522 chelant Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 239000006082 mold release agent Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920000123 polythiophene Polymers 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 3
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 150000001340 alkali metals Chemical class 0.000 description 3
- 239000012986 chain transfer agent Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 3
- 238000004128 high performance liquid chromatography Methods 0.000 description 3
- 229910003437 indium oxide Inorganic materials 0.000 description 3
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 3
- 239000011630 iodine Substances 0.000 description 3
- 229910052740 iodine Inorganic materials 0.000 description 3
- 239000002563 ionic surfactant Substances 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 125000005375 organosiloxane group Chemical group 0.000 description 3
- 229920000767 polyaniline Polymers 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 3
- 238000007127 saponification reaction Methods 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- 229910016467 AlCl 4 Inorganic materials 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- 229910017008 AsF 6 Inorganic materials 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920002284 Cellulose triacetate Polymers 0.000 description 2
- 229910020366 ClO 4 Inorganic materials 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229910018286 SbF 6 Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910001413 alkali metal ion Inorganic materials 0.000 description 2
- 125000005907 alkyl ester group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 229910000410 antimony oxide Inorganic materials 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 2
- 229960003237 betaine Drugs 0.000 description 2
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000010494 dissociation reaction Methods 0.000 description 2
- 230000005593 dissociations Effects 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 239000003480 eluent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229920001477 hydrophilic polymer Polymers 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- HSZCZNFXUDYRKD-UHFFFAOYSA-M lithium iodide Chemical compound [Li+].[I-] HSZCZNFXUDYRKD-UHFFFAOYSA-M 0.000 description 2
- 229910003002 lithium salt Inorganic materials 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 150000002902 organometallic compounds Chemical class 0.000 description 2
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920002401 polyacrylamide Polymers 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 229920000128 polypyrrole Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-O pyridinium Chemical compound C1=CC=[NH+]C=C1 JUJWROOIHBZHMG-UHFFFAOYSA-O 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 238000007761 roller coating Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- PSBDWGZCVUAZQS-UHFFFAOYSA-N (dimethylsulfonio)acetate Chemical compound C[S+](C)CC([O-])=O PSBDWGZCVUAZQS-UHFFFAOYSA-N 0.000 description 1
- ZXMGHDIOOHOAAE-UHFFFAOYSA-N 1,1,1-trifluoro-n-(trifluoromethylsulfonyl)methanesulfonamide Chemical compound FC(F)(F)S(=O)(=O)NS(=O)(=O)C(F)(F)F ZXMGHDIOOHOAAE-UHFFFAOYSA-N 0.000 description 1
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- NIHOUJYFWMURBG-UHFFFAOYSA-N 1-ethyl-1-methylpyrrolidin-1-ium Chemical compound CC[N+]1(C)CCCC1 NIHOUJYFWMURBG-UHFFFAOYSA-N 0.000 description 1
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BNCADMBVWNPPIZ-UHFFFAOYSA-N 2-n,2-n,4-n,4-n,6-n,6-n-hexakis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical compound COCN(COC)C1=NC(N(COC)COC)=NC(N(COC)COC)=N1 BNCADMBVWNPPIZ-UHFFFAOYSA-N 0.000 description 1
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 1
- ULRCHFVDUCOKTE-UHFFFAOYSA-N 3-[3-aminopropyl(diethoxy)silyl]oxybutan-1-amine Chemical compound NCCC[Si](OCC)(OCC)OC(C)CCN ULRCHFVDUCOKTE-UHFFFAOYSA-N 0.000 description 1
- ZDZYGYFHTPFREM-UHFFFAOYSA-N 3-[3-aminopropyl(dimethoxy)silyl]oxypropan-1-amine Chemical compound NCCC[Si](OC)(OC)OCCCN ZDZYGYFHTPFREM-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 229920008790 Amorphous Polyethylene terephthalate Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000858 Cyclodextrin Polymers 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000001116 FEMA 4028 Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical group C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229940100389 Sulfonylurea Drugs 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- UIDZKLBCABAXMS-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCC(CO)CC1 UIDZKLBCABAXMS-UHFFFAOYSA-N 0.000 description 1
- ZGUQGPFMMTZGBQ-UHFFFAOYSA-N [Al].[Al].[Zr] Chemical compound [Al].[Al].[Zr] ZGUQGPFMMTZGBQ-UHFFFAOYSA-N 0.000 description 1
- JVQAJHYYWVAKPP-UHFFFAOYSA-N [O-2].[Ti+4].[Sn+2]=O.[O-2].[O-2] Chemical class [O-2].[Ti+4].[Sn+2]=O.[O-2].[O-2] JVQAJHYYWVAKPP-UHFFFAOYSA-N 0.000 description 1
- PCXYJRNVVZVBRB-UHFFFAOYSA-N [Sn+2]=O.[O-2].[Ce+3].[O-2].[Ti+4] Chemical class [Sn+2]=O.[O-2].[Ce+3].[O-2].[Ti+4] PCXYJRNVVZVBRB-UHFFFAOYSA-N 0.000 description 1
- MBYNTKPBDYZMAQ-UHFFFAOYSA-N [benzhydrylperoxy(phenyl)methyl]benzene Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)OOC(C=1C=CC=CC=1)C1=CC=CC=C1 MBYNTKPBDYZMAQ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- IYABWNGZIDDRAK-UHFFFAOYSA-N allene Chemical group C=C=C IYABWNGZIDDRAK-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229910021383 artificial graphite Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 150000001541 aziridines Chemical class 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 159000000009 barium salts Chemical class 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical group C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- WHGYBXFWUBPSRW-FOUAGVGXSA-N beta-cyclodextrin Chemical compound OC[C@H]([C@H]([C@@H]([C@H]1O)O)O[C@H]2O[C@@H]([C@@H](O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O[C@H]3O[C@H](CO)[C@H]([C@@H]([C@H]3O)O)O3)[C@H](O)[C@H]2O)CO)O[C@@H]1O[C@H]1[C@H](O)[C@@H](O)[C@@H]3O[C@@H]1CO WHGYBXFWUBPSRW-FOUAGVGXSA-N 0.000 description 1
- 235000011175 beta-cyclodextrine Nutrition 0.000 description 1
- 229960004853 betadex Drugs 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 1
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000009125 cardiac resynchronization therapy Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical group 0.000 description 1
- 125000005670 ethenylalkyl group Chemical group 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 229960002089 ferrous chloride Drugs 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910017053 inorganic salt Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-M iodide Chemical compound [I-] XMBWDFGMSWQBCA-UHFFFAOYSA-M 0.000 description 1
- 229940006461 iodide ion Drugs 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- MHCFAGZWMAWTNR-UHFFFAOYSA-M lithium perchlorate Chemical compound [Li+].[O-]Cl(=O)(=O)=O MHCFAGZWMAWTNR-UHFFFAOYSA-M 0.000 description 1
- 229910001486 lithium perchlorate Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- GNARHXWTMJZNTP-UHFFFAOYSA-N methoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[SiH2]CCCOCC1CO1 GNARHXWTMJZNTP-UHFFFAOYSA-N 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 229910021382 natural graphite Inorganic materials 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- QVLTXCYWHPZMCA-UHFFFAOYSA-N po4-po4 Chemical group OP(O)(O)=O.OP(O)(O)=O QVLTXCYWHPZMCA-UHFFFAOYSA-N 0.000 description 1
- 229920000233 poly(alkylene oxides) Chemical class 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 229920000417 polynaphthalene Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 239000000661 sodium alginate Substances 0.000 description 1
- 235000010413 sodium alginate Nutrition 0.000 description 1
- 229940005550 sodium alginate Drugs 0.000 description 1
- 229920005552 sodium lignosulfonate Polymers 0.000 description 1
- KVCGISUBCHHTDD-UHFFFAOYSA-M sodium;4-methylbenzenesulfonate Chemical compound [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1 KVCGISUBCHHTDD-UHFFFAOYSA-M 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229940117986 sulfobetaine Drugs 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- PHBSBOANHONSDB-UHFFFAOYSA-N triethoxy(7-oxabicyclo[4.1.0]heptan-5-yl)silane Chemical compound CCO[Si](OCC)(OCC)C1CCCC2OC12 PHBSBOANHONSDB-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 description 1
- KAKQVSNHTBLJCH-UHFFFAOYSA-N trifluoromethanesulfonimidic acid Chemical compound NS(=O)(=O)C(F)(F)F KAKQVSNHTBLJCH-UHFFFAOYSA-N 0.000 description 1
- IWZLBIVZPIDURM-UHFFFAOYSA-N trimethoxy(3-prop-1-enoxypropyl)silane Chemical compound CO[Si](OC)(OC)CCCOC=CC IWZLBIVZPIDURM-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133528—Polarisers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/22—Presence of unspecified polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2425/00—Presence of styrenic polymer
- C09J2425/006—Presence of styrenic polymer in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2429/00—Presence of polyvinyl alcohol
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- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2465/00—Presence of polyphenylene
- C09J2465/006—Presence of polyphenylene in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2483/00—Presence of polysiloxane
- C09J2483/006—Presence of polysiloxane in the substrate
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Polarising Elements (AREA)
Abstract
本發明目的在於提供一種附間隔件之黏合劑層及附有附間隔件之黏合劑層的光學薄膜,其藉由抑制間隔件中使用之聚酯薄膜等基材薄膜中所含低聚物向黏合劑層溶出,而可以防止由亮點造成的亮度不均等所致之液晶面板的不佳狀況,並且在液晶顯示裝置的製造時,即使應用RTP貼合步驟,也可以抑制液晶面板的白色不均。本發明係在間隔件上具有黏合劑層的附間隔件之黏合劑層,前述間隔件在基材薄膜上具有脫模層,並且在前述基材薄膜與前述脫模層之間,具有低聚物防止層及導電層,前述黏合劑層設於前述間隔件的脫模層。The object of the present invention is to provide an adhesive layer with a spacer and an optical film with an adhesive layer with a spacer, which can prevent the oligomer contained in the base film such as polyester film used in the spacer from becoming The adhesive layer is eluted, which can prevent the poor condition of the liquid crystal panel caused by the uneven brightness caused by the bright spot, and in the manufacture of the liquid crystal display device, even if the RTP bonding step is applied, the white unevenness of the liquid crystal panel can be suppressed . The present invention is an adhesive layer with a spacer having an adhesive layer on the spacer, the spacer has a release layer on the base film, and between the base film and the release layer, there is an oligomer The object prevention layer and the conductive layer, and the adhesive layer is provided on the release layer of the spacer.
Description
技術領域 本發明涉及附間隔件之黏合劑層、附有附間隔件之黏合劑層的光學薄膜。本發明涉及從所述附有附間隔件之黏合劑層的光學薄膜,剝離間隔件狀態下之附黏合劑層之光學薄膜的黏合劑層側被貼合於顯示面板的影像顯示裝置及其製造方法。Technical Field The present invention relates to an adhesive layer with a spacer and an optical film with an adhesive layer with a spacer. The present invention relates to an image display device in which the adhesive layer side of the optical film with an adhesive layer in the state of peeling off the spacer is attached to a display panel from the optical film with an adhesive layer with spacers, and its manufacture method.
作為所述光學薄膜,可以使用偏光薄膜、相位差板、光學補償薄膜、亮度提高薄膜、防反射薄膜等表面處理薄膜、以及此等薄膜積層而成者。從所述附有附間隔件之黏合劑層的光學薄膜剝離間隔件而得之附黏合劑層之光學薄膜被用於液晶顯示裝置、有機EL顯示裝置、CRT、PDP等影像顯示裝置中。As the optical film, a polarizing film, a retardation film, an optical compensation film, a brightness enhancement film, a surface treatment film such as an anti-reflection film, and a laminate of these films can be used. The optical film with the adhesive layer obtained by peeling the optical film with the adhesive layer with the spacer is used in image display devices such as liquid crystal display devices, organic EL display devices, CRTs, and PDPs.
背景技術 在液晶顯示裝置等影像顯示裝置中,使用偏光薄膜等光學薄膜。在將所述光學薄膜貼合在液晶面板等顯示面板上時,通常使用黏合劑。由於有無需為了使光學薄膜貼合而進行乾燥步驟等優點,因此通常使用預先在光學薄膜一側設置有黏合劑作為黏合劑層的附黏合劑層之光學薄膜。另外,附黏合劑層之光學薄膜通常用作保護貼合前之黏合劑層為目的,被作為在黏合劑層表面設有間隔件(也被稱作脫模膜、或剝離襯墊)之附有附間隔件之黏合劑層的光學薄膜製造。BACKGROUND ART In image display devices such as liquid crystal display devices, optical films such as polarizing films are used. When bonding the optical film to a display panel such as a liquid crystal panel, an adhesive is usually used. Since there is no need to perform a drying step for bonding the optical film, an optical film with an adhesive layer preliminarily provided with an adhesive as the adhesive layer on one side of the optical film is generally used. In addition, the optical film with the adhesive layer is usually used to protect the adhesive layer before lamination. It is used as the adhesive layer with spacers (also called release films or release liners) on the surface of the adhesive layer. Manufacture of optical film with adhesive layer with spacers.
此種附有附間隔件之黏合劑層的光學薄膜因間隔件中使用聚酯薄膜等基材薄膜中所含低聚物向黏合劑層溶出,而有產生由亮點造成的亮度不均等所致的液晶面板的不佳狀況情況,因此在專利文獻1中,提出過在間隔件上設置低聚物防止層的方案。This type of optical film with an adhesive layer with spacers is caused by the elution of oligomers contained in the base film such as polyester film used in the spacer to the adhesive layer, resulting in uneven brightness caused by bright spots. Due to the poor condition of the liquid crystal panel,
另外,在液晶顯示裝置的製造中,在剝離附有附間隔件之黏合劑層的光學薄膜的間隔件時,在附黏合劑層之光學薄膜、以及間隔件中會產生靜電(剝離帶電)。將具有靜電的附黏合劑層之光學薄膜貼合於液晶面板上,就會因此而在液晶面板中產生感應帶電。該感應帶電的電荷對液晶面板的液晶的配向造成影響,會導致影像的顯示不均等不良。此外,在製造現場靜電有時會導致因異物等的附著或帶入而發生產品不良等不佳狀況。In addition, in the manufacture of liquid crystal display devices, when the spacer of the optical film with the adhesive layer with the spacer is peeled off, static electricity (peeling charge) is generated in the optical film with the adhesive layer and the spacer. Sticking an optical film with an electrostatic adhesive layer on a liquid crystal panel will cause induction charging in the liquid crystal panel. The inductively charged charge affects the alignment of the liquid crystal of the liquid crystal panel, and may cause the uneven display of the image. In addition, static electricity at the manufacturing site may cause product defects and other problems due to the adhesion or introduction of foreign objects.
專利文獻2~4中,為了抑制靜電的發生,提出過一種黏合片,其具有藉由向黏合劑層中配合離子性化合物或導電性高分子而賦予防靜電干擾功能的黏合劑層。另外,專利文獻5中,提出過一種對所述間隔件的脫模層賦予防靜電干擾功能的間隔件。 先行技術文獻 專利文獻In
專利文獻1:日本特開2006-113600號公報 專利文獻2:日本特開平6-128539號公報 專利文獻3:日本特表2007-536427號公報 專利文獻4:日本特開2003-246874號公報 專利文獻5:日本特開2014-141557號公報Patent Document 1: Japanese Patent Application Publication No. 2006-113600 Patent Document 2: Japanese Patent Application Publication No. 6-128539 Patent Document 3: Japanese Patent Application Publication No. 2007-536427 Patent Document 4: Japanese Patent Application Publication No. 2003-246874 Patent Document 5: Japanese Patent Publication No. 2014-141557
發明概要 發明所要解決的課題 但是,在使用專利文獻5的間隔件、附有附間隔件之黏合劑層的光學薄膜的情況下,也無法充分地抑制間隔件剝離時的靜電的發生。特別是發現,在利用一邊從附有附間隔件之黏合劑層的光學薄膜剝離間隔件(參照圖3)(與剝離同時地)、一邊將間隔件剝離後露出的附黏合劑層之光學薄膜的黏合劑層側貼合於液晶面板上的步驟(Roll-To-Panel(RTP)貼合步驟)製造液晶顯示裝置時,因在液晶面板上貼合具有未衰減靜電的附黏合劑層之光學薄膜,而產生感應帶電。在其後的製造步驟中,發生感應帶電的液晶面板與製造機器等電介質接觸,由此在液晶面板中產生電流(磁場),因液晶的配向不良而產生液晶面板變白的白色不均(漏光)。一旦在液晶面板中產生白色不均,就會在液晶配向恢復原狀之前持續白色不均,因此製造步驟中的品質檢查延滯,產生生產效率惡化的問題。SUMMARY OF THE INVENTION Problems to be Solved by the Invention However, even in the case of using the spacer of
本發明的目的在於,提供一種附間隔件之黏合劑層,其藉由抑制間隔件中使用的聚酯薄膜等基材薄膜中所含低聚物向黏合劑層溶出,可以防止由亮點造成的亮度不均等所致的液晶面板的不佳狀況,並且在液晶顯示裝置的製造時,即使應用上述的RTP貼合步驟,也可以抑制液晶面板的白色不均,此外還提供附有附間隔件之黏合劑層的光學薄膜。The object of the present invention is to provide an adhesive layer with spacers, which can prevent elution of oligomers contained in base films such as polyester films used in the spacers to the adhesive layer, thereby preventing bright spots from being caused The poor condition of the liquid crystal panel caused by uneven brightness, and during the manufacture of the liquid crystal display device, even if the above-mentioned RTP bonding step is applied, the white unevenness of the liquid crystal panel can be suppressed. In addition, a spacer with a spacer is also provided. Optical film with adhesive layer.
另外,本發明的目的還在於,提供一種影像顯示裝置,其特徵在於,在顯示面板的至少一面,貼合有從所述附有附間隔件之黏合劑層的光學薄膜,剝離間隔件狀態下之附黏合劑層之光學薄膜的黏合劑層側,此外還提供該影像顯示裝置的製造方法。 用於解決課題的手段In addition, an object of the present invention is to provide an image display device characterized in that at least one surface of the display panel is bonded with an optical film from the spacer-attached adhesive layer, and the spacer is peeled off. The adhesive layer side of the optical film attached with the adhesive layer also provides a manufacturing method of the image display device. Means to solve the problem
本案發明人等為了解決所述課題反復進行深入研究,結果發現下述附間隔件之黏合劑層、附有附間隔件之黏合劑層的光學薄膜、影像顯示裝置及其製造方法,從而完成本發明。In order to solve the above-mentioned problems, the inventors of this case have conducted intensive studies and found the following adhesive layers with spacers, optical films with adhesive layers with spacers, image display devices, and manufacturing methods thereof, thereby completing the present invention invention.
即,本發明涉及一種附間隔件之黏合劑層,係在間隔件上具有黏合劑層的附間隔件之黏合劑層,其特徵在於,所述間隔件在基材薄膜上具有脫模層,並且在所述基材薄膜與所述脫模層之間,具有低聚物防止層及導電層,所述黏合劑層設於所述間隔件的脫模層上。That is, the present invention relates to a spacer-attached adhesive layer, which is a spacer-attached adhesive layer having an adhesive layer on the spacer, characterized in that the spacer has a release layer on a base film, And between the base film and the release layer, there is an oligomer prevention layer and a conductive layer, and the adhesive layer is provided on the release layer of the spacer.
本發明附間隔件之黏合劑層較佳所述低聚物防止層是由含有二氧化矽系材料及/或聚乙烯醇系樹脂的組合物形成的層。The adhesive layer with a spacer of the present invention is preferably a layer formed of a composition containing a silica-based material and/or a polyvinyl alcohol-based resin.
本發明附間隔件之黏合劑層較佳所述導電層是由含有導電性高分子的導電性組合物形成的層。It is preferable that the adhesive layer with a spacer of the present invention is a layer formed of a conductive composition containing a conductive polymer.
本發明附間隔件之黏合劑層較佳所述脫模層的表面電阻值為1.0×1012 Ω/□以下。The adhesive layer with a spacer of the present invention preferably has a surface resistance value of the release layer of 1.0×10 12 Ω/□ or less.
本發明附間隔件之合劑層較佳所述黏合劑層是由含有基礎聚合物及導電性化合物的黏合劑組合物形成的層。The mixture layer with spacers of the present invention is preferably a layer formed of an adhesive composition containing a base polymer and a conductive compound.
本發明附間隔件之黏合劑層較佳所述黏合劑層的表面電阻值為1.0×1012 Ω/□以下。The adhesive layer with a spacer of the present invention preferably has a surface resistance value of 1.0×10 12 Ω/□ or less.
本發明涉及一種附有附間隔件之黏合劑層的光學薄膜,其特徵在於,在光學薄膜的至少一面貼合有所述附間隔件之黏合劑層的黏合劑層側。The present invention relates to an optical film with a spacer-attached adhesive layer, characterized in that the adhesive layer side of the spacer-attached adhesive layer is attached to at least one surface of the optical film.
本發明涉及一種影像顯示裝置,其特徵在於,在顯示面板的至少一面貼合有從所述附有附間隔件之黏合劑層的光學薄膜,剝離所述間隔件狀態下之附黏合劑層之光學薄膜的黏合劑層側。The present invention relates to an image display device, characterized in that an optical film from the adhesive layer with spacers is attached to at least one surface of a display panel, and the adhesive layer in the spacer state is peeled off. The adhesive layer side of the optical film.
本發明涉及一種影像顯示裝置的製造方法,係所述影像顯示裝置的製造方法,其特徵在於,包括:卷材準備步驟,係準備附有附間隔件之黏合劑層的光學薄膜的長條片作為卷材;顯示面板搬送準備步驟,係將顯示面板搬送到黏貼位置而準備;以及貼合步驟,在從所述卷材抽出所述附有附間隔件之黏合劑層的光學薄膜,並從所述附有附間隔件之黏合劑層的光學薄膜藉由剝離體剝離間隔件的同時,使所述間隔件剝離後露出的附黏合劑層之光學薄膜的黏合劑層側貼合於搬送到所述黏貼位置的所述顯示面板上。 發明效果The present invention relates to a method of manufacturing an image display device. The method of manufacturing the image display device is characterized by comprising: a coil preparation step of preparing a strip of optical film with a spacer-attached adhesive layer As a coil; the display panel transport preparation step is prepared by transporting the display panel to the pasting position; and the laminating step is to extract the optical film with the spacer-attached adhesive layer from the coil and remove it from The optical film with the adhesive layer with spacer is peeled off the spacer by the release body, and the adhesive layer side of the optical film with the adhesive layer exposed after the spacer is peeled is bonded to the On the display panel at the sticking position. Invention effect
本發明附間隔件之黏合劑層具有在間隔件的基材薄膜與脫模層之間積層有低聚物防止層及導電層的構成。低聚物防止層可以抑制間隔件的聚酯薄膜等的基材薄膜中所含低聚物向黏合劑層溶出,對於防止由亮點造成的亮度不均等液晶面板的不佳狀況是有用的。The adhesive layer with a spacer of the present invention has a configuration in which an oligomer prevention layer and a conductive layer are laminated between the base film of the spacer and the release layer. The oligomer prevention layer can suppress the elution of the oligomer contained in the base film such as the polyester film of the spacer to the adhesive layer, and is useful for preventing the defects of the liquid crystal panel such as uneven brightness caused by bright spots.
另外,將所述附間隔件之黏合劑層的黏合劑層側黏貼於光學薄膜上而得之本發明附有附間隔件之黏合劑層的光學薄膜由於間隔件具有導電層,因此間隔件剝離時的靜電的產生少。另一方面,如果向低聚物防止層、脫模層中添加導電性化合物等導電劑,則由於低聚物防止層、脫模層中的導電劑與導電性黏合劑相互作用,會有損害防靜電干擾功能的情況,然而在本發明中,藉由將低聚物防止層與導電層積層,可以對間隔件表面賦予充分的導電性能。In addition, the adhesive layer side of the adhesive layer with the spacer is stuck on the optical film to obtain the optical film with the adhesive layer with the spacer of the present invention. Since the spacer has a conductive layer, the spacer is peeled off The generation of static electricity is small. On the other hand, if a conductive agent such as a conductive compound is added to the oligomer prevention layer and mold release layer, the conductive agent in the oligomer prevention layer and mold release layer interacts with the conductive adhesive, which will cause damage In the case of the anti-static interference function, however, in the present invention, by laminating the oligomer preventing layer and the conductive layer, sufficient conductive performance can be provided to the surface of the spacer.
此外,本發明附有附間隔件之黏合劑層的光學薄膜在液晶顯示裝置的製造時,即使在應用如下的步驟(RTP貼合步驟)時,即,一邊從附有附間隔件之黏合劑層的光學薄膜利用剝離體剝離間隔件(與剝離同時地),一邊將間隔件剝離後露出的附黏合劑層之光學薄膜的黏合劑層側貼合於液晶面板上,由於間隔件具有導電層,因此也可以抑制靜電(剝離帶電)的產生,此外,即使因間隔件的剝離而產生靜電,由於可以將附黏合劑層之光學薄膜中產生的靜電電荷快速地移動到剝離後的間隔件中,因此也可以使靜電的電荷衰減,對於抑制液晶面板的白色不均是有用的。In addition, the optical film with a spacer-attached adhesive layer of the present invention is used in the manufacture of a liquid crystal display device, even when the following steps (RTP bonding step) are applied, that is, the spacer-attached adhesive layer The optical film of the layer is peeled off the spacer (simultaneously with the peeling), and the adhesive layer side of the optical film with the adhesive layer exposed after the spacer is peeled off is attached to the liquid crystal panel, because the spacer has a conductive layer Therefore, it is possible to suppress the generation of static electricity (peeling charge). In addition, even if static electricity is generated due to the peeling of the spacer, the electrostatic charge generated in the optical film with the adhesive layer can be quickly transferred to the peeled spacer Therefore, it can also attenuate the electrostatic charge, which is useful for suppressing the white unevenness of the liquid crystal panel.
用以實施發明之形態 以下,對本發明的實施形態進行詳細說明。Modes for Carrying Out the Invention Hereinafter, embodiments of the present invention will be described in detail.
<附間隔件之黏合劑層、以及附有附間隔件之黏合劑層的光學薄膜的整體結構> 將本發明附間隔件之黏合劑層的典型構成例示意性地表示於圖1(a)及(b)中。附間隔件之黏合劑層2是在間隔件1的脫模層12設有黏合劑層21的形態。另外,間隔件1是在基材薄膜11與脫模層12之間設有低聚物防止層13及導電層14的形態。對於低聚物防止層13及導電層14的積層順序沒有限制,然而在(a)的情況下,由於低聚物防止層13與基材薄膜11接觸,因此抑制聚酯薄膜等基材中所含低聚物向黏合劑層溶出的效果高,另外,由於導電層14與脫模層12接觸,因此抑制液晶面板的白色不均的效果高。在(b)的情況下,在保持間隔件1整體的防靜電干擾效果的同時、抑制低聚物向黏合劑層的溶出的效果高。另外,低聚物防止層13與導電層14的積層也可以是低聚物防止層13與導電層14的多層。<The overall structure of the adhesive layer with spacer and the optical film with the adhesive layer with spacer> A typical configuration example of the adhesive layer with spacer of the present invention is schematically shown in FIG. 1(a) And (b). The spacer-attached
將本發明附有附間隔件之黏合劑層的光學薄膜的典型構成例示意性地表示於圖2中。附有附間隔件之黏合劑層的光學薄膜3是使光學薄膜31貼合於附間隔件之黏合劑層2上而成。從附有附間隔件之黏合劑層的光學薄膜3,剝離間隔件1後之附黏合劑層之光學薄膜4是將黏合劑層21黏貼於作為被黏物的顯示面板上而使用。A typical configuration example of the optical film with a spacer-attached adhesive layer of the present invention is schematically shown in FIG. 2. The
<附間隔件之黏合劑層> 本發明附間隔件之黏合劑層是在間隔件上具有黏合劑層的結構。所述間隔件在所述基材薄膜與所述脫模層之間具有低聚物防止層及導電層。<Adhesive layer with spacer> The adhesive layer with spacer of the present invention has a structure having an adhesive layer on the spacer. The spacer has an oligomer prevention layer and a conductive layer between the base film and the release layer.
<基材薄膜> 作為本發明間隔件的基材薄膜,可以使用塑膠薄膜。作為塑膠薄膜,可以舉出聚乙烯薄膜、聚丙烯薄膜、聚丁烯薄膜、聚丁二烯薄膜、聚甲基戊烯薄膜等聚烯烴薄膜、聚氯乙烯薄膜、氯乙烯共聚物薄膜等氯乙烯系薄膜;聚對苯二甲酸乙二醇酯薄膜、聚對苯二甲酸丁二醇酯薄膜、聚對苯二甲酸萘二酯薄膜等聚酯薄膜;以及聚胺酯薄膜、乙烯-乙酸乙烯酯共聚物薄膜等。本發明中,出於防止所述基材薄膜中的低聚物的溶出的目的,在所述基材薄膜當中,以使用聚酯薄膜的情況為佳。<Base film> As the base film of the spacer of the present invention, a plastic film can be used. Examples of plastic films include polyolefin films such as polyethylene films, polypropylene films, polybutene films, polybutadiene films, and polymethylpentene films, and vinyl chloride films such as polyvinyl chloride films and vinyl chloride copolymer films. Series films; polyester films such as polyethylene terephthalate film, polybutylene terephthalate film, polynaphthalene terephthalate film, etc.; and polyurethane film, ethylene-vinyl acetate copolymer Film etc. In the present invention, for the purpose of preventing the elution of oligomers in the base film, among the base films, a polyester film is preferably used.
所述基材薄膜的厚度通常為5~200μm,較佳為5~100μm。在形成低聚物防止層及導電層時,可以預先對基材薄膜實施電暈處理、電漿處理等表面處理。The thickness of the substrate film is usually 5 to 200 μm, preferably 5 to 100 μm. When forming the oligomer prevention layer and the conductive layer, the base film may be subjected to surface treatment such as corona treatment and plasma treatment in advance.
<低聚物防止層> 作為本發明的低聚物防止層,可以用於防止聚酯薄膜等基材薄膜中所含低聚物向黏合劑層溶出的適當的材料來形成。作為低聚物防止層的形成材料,可以使用無機物或有機物、或其等的複合材料。作為無機物,可以舉出二氧化矽系材料、或者包含金、銀、鉑、鈀、銅、鋁、鎳、鉻、鈦、鐵、鈷或錫或其等的合金等的金屬、或者包含氧化銦、氧化錫、氧化鈦、氧化鎘或其等的混合物的金屬氧化物、包含碘化鋼等的其他金屬化合物等。作為有機物,可以舉出聚乙烯醇系樹脂、丙烯酸系樹脂、胺基甲酸酯系樹脂、三聚氰胺系樹脂、UV固化型樹脂、環氧系樹脂。另外,作為複合材料,可以舉出所述有機物與氧化鋁、二氧化矽、雲母等無機粒子的混合物。<Oligomer Prevention Layer> As the oligomer prevention layer of the present invention, it can be formed using an appropriate material that prevents oligomers contained in base films such as polyester films from eluting into the adhesive layer. As a material for forming the oligomer prevention layer, inorganic substances, organic substances, or composite materials thereof can be used. Examples of inorganic substances include silicon dioxide-based materials, metals containing gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, or alloys thereof, or metals containing indium oxide , Tin oxide, titanium oxide, cadmium oxide, or a mixture of metal oxides, and other metal compounds including steel iodide. Examples of organic substances include polyvinyl alcohol resins, acrylic resins, urethane resins, melamine resins, UV curable resins, and epoxy resins. In addition, as a composite material, a mixture of the organic substance and inorganic particles such as alumina, silica, mica, etc. can be cited.
所述低聚物防止層較佳由含有二氧化矽系材料、聚乙烯醇系樹脂的組合物形成。The oligomer prevention layer is preferably formed of a composition containing a silica-based material and a polyvinyl alcohol-based resin.
<二氧化矽系材料> 作為所述二氧化矽系材料,例如可以舉出以下述通式(I)表示的有機矽氧烷。 [化1] <Silicon dioxide-based material> As the above-mentioned silicon dioxide-based material, for example, an organosiloxane represented by the following general formula (I) can be cited. [化1]
所述通式(I)中,R1 及R2 各自獨立地為γ-環氧丙氧基丙基、3,4-環氧基環己基乙基等般的含有環氧基的有機基、或甲氧基、乙氧基等烷氧基,R3 為甲氧基、乙氧基等烷氧基、或以下述通式(II)表示的基團。n及m為0~10的整數。 [化2] In the general formula (I), R 1 and R 2 are each independently an epoxy-containing organic group such as γ-glycidoxypropyl, 3,4-epoxycyclohexylethyl, etc. Or an alkoxy group such as a methoxy group and an ethoxy group, and R 3 is an alkoxy group such as a methoxy group and an ethoxy group, or a group represented by the following general formula (II). n and m are integers of 0-10. [化2]
所述通式(II)中,R4是與R1基或R2基相同的含有環氧基的有機基或烷氧基。In the general formula (II), R4 is the same epoxy group-containing organic group or alkoxy group as the R1 group or R2 group.
作為所述有機矽氧烷的具體例,可以例示出γ-環氧丙氧基丙基三甲氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷、2-(3,4-環氧基環己基)乙基三乙氧基矽烷、5,6-環氧基環己基三乙氧基矽烷、四乙氧基矽烷等單體、以及此等單體或此等單體的混合物的水解性產物(低聚物)。As specific examples of the organosiloxane, γ-glycidoxypropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 2- (3,4-Epoxycyclohexyl) ethyltriethoxysilane, 5,6-epoxycyclohexyltriethoxysilane, tetraethoxysilane and other monomers, and these monomers or this Hydrolyzable product (oligomer) of a mixture of other monomers.
另外,作為所述二氧化矽系材料,可以舉出具有胺基的矽烷化合物。所述具有胺基的矽烷化合物,較佳以下述通式(III)表示的烷氧基矽烷。 Y-R-Si-(X)3 ……(III) 所述通式(III)中,Y表示胺基,R表示亞甲基、亞乙基、亞丙基等亞烷基,X表示甲氧基、乙氧基等烷氧基、烷基、或具有此等基團的有機官能團,至少1個以上為烷氧基。In addition, as the silica-based material, a silane compound having an amine group can be cited. The silane compound having an amino group is preferably an alkoxysilane represented by the following general formula (III). Y-R-Si-(X) 3 ……(III) In the general formula (III), Y represents an amino group, R represents an alkylene group such as methylene, ethylene, and propylene, and X represents methyl At least one of an alkoxy group such as an oxy group and an ethoxy group, an alkyl group, or an organic functional group having these groups is an alkoxy group.
作為所述具有胺基的矽烷化合物的具體例,可以舉出N-β(胺基乙基)γ-胺基丙基三甲氧基矽烷、N-β(胺基乙基)γ-胺基丙基三乙氧基矽烷、N-β(胺基乙基)γ-胺基丙基甲基二甲氧基矽烷、γ-胺基丙基三甲氧基矽烷、N-苯基-γ-胺基丙基三甲氧基矽烷等。Specific examples of the silane compound having an amino group include N-β (aminoethyl)γ-aminopropyl trimethoxysilane, and N-β (aminoethyl)γ-aminopropyl Triethoxysilane, N-β(aminoethyl)γ-aminopropylmethyldimethoxysilane, γ-aminopropyltrimethoxysilane, N-phenyl-γ-amino Propyl trimethoxysilane, etc.
此外,作為所述二氧化矽系材料,可以舉出3-丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷等含有(甲基)丙烯醯基的矽烷化合物、3-異氰酸酯基丙基三乙氧基矽烷等含有異氰酸酯基的矽烷化合物等。In addition, examples of the silica-based materials include 3-propenyloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, etc. containing (meth)acrylic acid Silane compounds containing isocyanate groups, 3-isocyanate propyl triethoxysilane, etc.
作為所述二氧化矽系材料的具體的產品,可以舉出信越化學工業公司製的KR-401N、X-40-9227、X-40-9247、KR-510、KR-9218、KR-213、KR-217、X-41-1053、X-40-1056、X-41-1805、X-41-1810、X-40-2651、X-40-2652B、X-40-2655A、X-40-2761、X-40-2672等。As specific products of the silicon dioxide-based materials, KR-401N, X-40-9227, X-40-9247, KR-510, KR-9218, KR-213, manufactured by Shin-Etsu Chemical Co., Ltd. KR-217, X-41-1053, X-40-1056, X-41-1805, X-41-1810, X-40-2651, X-40-2652B, X-40-2655A, X-40- 2761, X-40-2672, etc.
所述二氧化矽系材料既可以僅使用1種,也可以使用2種以上。The above-mentioned silicon dioxide-based materials may use only one type or two or more types.
在利用所述二氧化矽系材料形成的低聚物防止層中,根據需要,可以含有具有金屬元素的有機化合物(金屬螯合物等金屬化合物)、催化劑等。具有金屬元素的金屬有機化合物既可以僅使用1種,也可以使用2種以上。The oligomer prevention layer formed using the silica-based material may contain an organic compound having a metal element (metal compound such as a metal chelate), a catalyst, and the like as necessary. Only 1 type may be used for the metal organic compound which has a metal element, and 2 or more types may be used for it.
在所述具有金屬元素的金屬有機化合物中,特別是從低聚物溶出防止性能良好的方面考慮,較佳具有螯合物結構的具有鋁元素的有機化合物、具有鈦元素的有機化合物、具有鋯元素的有機化合物。該化合物具體記載於《交聯劑手冊》(山下晉三、金子東助編著(株)大成社 平成2年版)中。Among the metal-organic compounds with metal elements, especially from the viewpoint of good oligomer elution prevention performance, organic compounds with aluminum element having chelate structure, organic compounds with titanium element, and zirconium are preferred. Organic compounds of the elements. The compound is specifically described in the "Crosslinking Agent Handbook" (edited by Shinzo Yamashita and Tosuke Kaneko (Co., Ltd.) Daseisha, Heisei 2).
利用所述二氧化矽系材料形成之低聚物防止層的形成可以藉由如下操作來進行,即,將所述二氧化矽系材料溶解於醇等溶劑中,將所得的溶液塗布於基材薄膜或導電層上,並進行乾燥。溶解有所述二氧化矽系材料的溶液的濃度應該沒有特別限制,然而較佳為0.1~40重量%左右。塗布後的乾燥溫度應該沒有特別限定,然而較佳為100~150℃左右。另外,塗布後的乾燥時間應該沒有特別限定,然而較佳為30秒~30分鐘左右。The formation of the oligomer prevention layer formed by the silica-based material can be carried out by dissolving the silica-based material in a solvent such as alcohol, and coating the resulting solution on a substrate On the film or conductive layer, and dry. The concentration of the solution in which the silica-based material is dissolved should not be particularly limited, but is preferably about 0.1-40% by weight. The drying temperature after coating should not be particularly limited, but it is preferably about 100 to 150°C. In addition, the drying time after coating should not be particularly limited, but it is preferably about 30 seconds to 30 minutes.
<含有聚乙烯醇系樹脂的組合物> 作為所述聚乙烯醇系樹脂,可以舉出聚乙烯醇或其衍生物。作為聚乙烯醇的衍生物,可以舉出聚乙烯醇縮甲醛、聚乙烯醇縮乙醛等,此外還可以舉出用乙烯、丙烯等烯烴、丙烯酸、甲基丙烯酸、巴豆酸等不飽和羧酸及其烷基酯、丙烯醯胺等經改性的樹脂。聚乙烯醇系樹脂既可以僅使用1種,也可以使用2種以上。<Composition containing polyvinyl alcohol-based resin> As the polyvinyl alcohol-based resin, polyvinyl alcohol or a derivative thereof can be given. Examples of derivatives of polyvinyl alcohol include polyvinyl formal, polyvinyl acetal, etc., in addition to olefins such as ethylene and propylene, and unsaturated carboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid. Its alkyl ester, acrylamide and other modified resins. Only one type of polyvinyl alcohol resin may be used, or two or more types may be used.
所述聚乙烯醇系樹脂的聚合度應該沒有特別限定,然而通常適合使用100以上、較佳為300~40000的樹脂。另一方面,聚乙烯醇系樹脂的皂化度應該沒有特別限定,然而適合使用70莫耳%以上、較佳為80莫耳%以上、且為99.9莫耳%以下的樹脂。The degree of polymerization of the polyvinyl alcohol-based resin should not be particularly limited, but it is generally suitable to use a resin of 100 or more, preferably 300 to 40,000. On the other hand, the degree of saponification of the polyvinyl alcohol-based resin should not be particularly limited, but it is suitable to use a resin of 70 mol% or more, preferably 80 mol% or more, and 99.9 mol% or less.
在含有所述聚乙烯醇系樹脂的組合物中,可以含有黏結劑聚合物。作為黏結劑聚合物,可以舉出聚丙烯醯胺、聚伸烷基二醇、聚烯化亞胺、甲基纖維素、羥基纖維素、澱粉類、聚胺酯、聚酯、聚丙烯酸酯、氯系聚合物(聚氯乙烯、氯乙烯乙酸乙烯酯共聚物等)、聚烯烴等。其等當中,在利用塗布拉伸法塗設低聚物防止層的情況下,可以舉出能夠作為非離子系、陽離子系、兩性系的水溶液或水分散體使用的有機聚合物,另外,在其等當中,在使用聚胺酯、聚酯、聚丙烯酸酯的情況下,膠黏性變得良好。藉由作為此等聚合物的單體的一個成分將非離子、陽離子、或兩性系的親水性成分共聚,就能夠賦予親水性,使之分散於水中。The composition containing the polyvinyl alcohol-based resin may contain a binder polymer. Examples of binder polymers include polyacrylamide, polyalkylene glycol, polyalkyleneimine, methylcellulose, hydroxycellulose, starches, polyurethane, polyester, polyacrylate, and chlorine-based Polymers (polyvinyl chloride, vinyl chloride vinyl acetate copolymer, etc.), polyolefins, etc. Among them, when the oligomer preventing layer is applied by the coating stretching method, organic polymers that can be used as nonionic, cationic, and amphoteric aqueous solutions or dispersions can be cited. In addition, in Among them, in the case of using polyurethane, polyester, or polyacrylate, the adhesiveness becomes good. By copolymerizing a nonionic, cationic, or amphoteric hydrophilic component as a component of the monomer of these polymers, it is possible to impart hydrophilicity and disperse it in water.
在含有所述聚乙烯醇系樹脂的組合物中,可以含有交聯劑。作為交聯劑,可以舉出羥甲基化或羥烷基化的尿素系、三聚氰胺系、胍胺系、丙烯醯胺系、聚醯胺系化合物、環氧化合物、氮丙啶化合物、封端多異氰酸酯、矽烷偶聯劑、鈦偶聯劑、鋁鋯偶聯劑等。此等交聯成分也可以與黏結劑聚合物預先鍵合。The composition containing the polyvinyl alcohol-based resin may contain a crosslinking agent. Examples of crosslinking agents include methylolated or hydroxyalkylated urea-based, melamine-based, guanamine-based, acrylamide-based, polyamide-based compounds, epoxy compounds, aziridine compounds, and blocked Polyisocyanate, silane coupling agent, titanium coupling agent, aluminum zirconium coupling agent, etc. These crosslinking components can also be pre-bonded with the binder polymer.
在含有所述聚乙烯醇系樹脂的組合物中,出於改良低聚物防止層的固著性、滑動性的目的,可以含有無機系粒子。作為無機系粒子,可以舉出二氧化矽、氧化鋁、高嶺土、碳酸鈣、氧化鈦、鋇鹽等。The composition containing the polyvinyl alcohol-based resin may contain inorganic particles for the purpose of improving the fixability and sliding properties of the oligomer prevention layer. Examples of inorganic particles include silica, alumina, kaolin, calcium carbonate, titanium oxide, and barium salts.
所述低聚物防止層的形成可以藉由如下操作來進行,即,將含有所述聚乙烯醇系樹脂的組合物溶解於水、醇等溶劑中,將所得的溶液塗布於基材薄膜或低聚物防止層上後,進行乾燥。另外,在乾燥時,也可以拉伸。溶解有含有所述聚乙烯醇系樹脂的組合物的溶液的濃度應該沒有特別限制,然而較佳為0.1~40重量%左右。塗布後的乾燥溫度應該沒有特別限定,然而較佳為60~200℃左右。另外,塗布後的乾燥時間應該沒有特別限定,然而較佳為3~60秒左右。根據需要也可以組合使用熱處理及紫外線照射等活性能量射線照射。The formation of the oligomer preventing layer can be performed by dissolving the composition containing the polyvinyl alcohol-based resin in a solvent such as water and alcohol, and coating the resulting solution on a substrate film or After the oligomer prevention layer is applied, it is dried. In addition, it can also be stretched during drying. The concentration of the solution in which the composition containing the polyvinyl alcohol resin is dissolved should not be particularly limited, but is preferably about 0.1 to 40% by weight. The drying temperature after coating should not be particularly limited, but it is preferably about 60 to 200°C. In addition, the drying time after coating should not be particularly limited, but it is preferably about 3 to 60 seconds. If necessary, active energy ray irradiation such as heat treatment and ultraviolet irradiation may be used in combination.
所述低聚物防止層中的聚乙烯醇系樹脂的含量沒有特別限定,然而較佳為10~100重量%,更佳為20~90重量%,最佳為30~80重量%的範圍。The content of the polyvinyl alcohol-based resin in the oligomer prevention layer is not particularly limited, but is preferably 10 to 100% by weight, more preferably 20 to 90% by weight, and most preferably in the range of 30 to 80% by weight.
所述低聚物防止層的形成方法沒有特別限定,只要根據其形成材料適當地選擇即可,可以使用塗布法、噴霧法、旋塗法、連線塗布法等。另外,也可以使用真空蒸鍍法、濺射法、離子鍍法、噴霧熱分解法、化學鍍敷法、電鍍法等。The method for forming the oligomer prevention layer is not particularly limited, as long as it is appropriately selected according to its forming material, and a coating method, a spray method, a spin coating method, an inline coating method, etc. can be used. In addition, a vacuum vapor deposition method, a sputtering method, an ion plating method, a spray thermal decomposition method, an electroless plating method, an electroplating method, etc. can also be used.
所述低聚物防止層的厚度較佳在5~100nm的範圍中適當地設定,更佳為10~70nm。The thickness of the oligomer prevention layer is preferably set appropriately in the range of 5 to 100 nm, and more preferably 10 to 70 nm.
<導電層> 本發明的導電層可以抑制由間隔件的剝離造成的靜電的產生,並且即使因間隔件的剝離而產生靜電,由於在附黏合劑層之光學薄膜中產生的靜電的電荷可以快速地向剝離後的間隔件移動,因此也可以防止液晶面板的白色不均。導電層只要是具有導電性的層,就沒有特別限定,然而可以舉出利用含有導電性高分子的導電性組合物、含有陰離子性表面活性劑、陽離子性表面活性劑等離子性表面活性劑的導電性組合物、含有氧化錫、氧化銻、氧化銦、氧化鋅等金屬氧化物的導電性組合物等形成的層。從容易獲得具有所期望的脫模層的表面電阻值的間隔件的觀點考慮,導電層較佳為利用含有導電性高分子的導電性組合物形成的層。<Conductive layer> The conductive layer of the present invention can suppress the generation of static electricity caused by the peeling of the spacer, and even if static electricity is generated due to the peeling of the spacer, the charge of the static electricity generated in the optical film with the adhesive layer can be fast Since the ground moves to the spacer after peeling, the white unevenness of the liquid crystal panel can also be prevented. The conductive layer is not particularly limited as long as it is a conductive layer. However, it can be a conductive composition using a conductive composition containing a conductive polymer, an anionic surfactant, a cationic surfactant, and a plasma surfactant. A layer formed of a conductive composition, a conductive composition containing metal oxides such as tin oxide, antimony oxide, indium oxide, and zinc oxide. From the viewpoint of easily obtaining a spacer having a desired surface resistance value of the release layer, the conductive layer is preferably a layer formed of a conductive composition containing a conductive polymer.
作為所述導電性高分子,可以舉出聚苯胺、聚吡咯、聚噻吩、聚(亞乙基二氧噻吩)(簡稱為PEDOT)、聚(亞乙基二氧噻吩)/聚苯乙烯磺酸(簡稱為PEDOT/PSS)等。從防靜電干擾性及透明性的方面考慮,特佳為聚(亞乙基二氧噻吩)/聚苯乙烯磺酸(簡稱為PEDOT/PSS)。導電性高分子既可以僅使用1種,也可以使用2種以上。Examples of the conductive polymer include polyaniline, polypyrrole, polythiophene, poly(ethylenedioxythiophene) (referred to as PEDOT), poly(ethylenedioxythiophene)/polystyrene sulfonic acid (Referred to as PEDOT/PSS) etc. From the perspective of anti-static interference and transparency, poly(ethylenedioxythiophene)/polystyrene sulfonic acid (referred to as PEDOT/PSS) is particularly preferred. Only one type of conductive polymer may be used, or two or more types may be used.
在含有所述導電性高分子的導電性組合物中,可以含有黏結劑樹脂。作為黏結劑樹脂,可以舉出聚乙烯醇樹脂、聚酯樹脂、聚胺酯樹脂、丙烯酸類樹脂、乙烯基樹脂、環氧樹脂、醯胺樹脂等。The conductive composition containing the conductive polymer may contain a binder resin. Examples of binder resins include polyvinyl alcohol resins, polyester resins, polyurethane resins, acrylic resins, vinyl resins, epoxy resins, and amide resins.
所述導電性高分子與黏結劑樹脂的重量比例(導電性高分子:黏結劑樹脂)較佳為50:1~1:1,更佳為20:1~2:1,進一步更佳為15:1~5:1。The weight ratio of the conductive polymer to the binder resin (conductive polymer: binder resin) is preferably 50:1 to 1:1, more preferably 20:1 to 2:1, and still more preferably 15 :1~5:1.
所述導電層的形成可以藉由如下操作來進行,即,將含有所述導電性高分子的導電性組合物溶解於水、醇等溶劑中,將所得的溶液塗布於基材薄膜或低聚物防止層上後,進行乾燥。溶解有含有所述導電性高分子的導電性組合物的溶液的濃度沒有特別限制,然而較佳為0.1~40重量%左右。塗布後的乾燥溫度沒有特別限定,然而較佳為100~150℃左右。另外,塗布後的乾燥時間沒有特別限定,然而較佳為1~60分鐘左右。The formation of the conductive layer can be performed by dissolving a conductive composition containing the conductive polymer in a solvent such as water, alcohol, and coating the resulting solution on a substrate film or oligomer. After the material prevention layer is on, it is dried. The concentration of the solution in which the conductive composition containing the conductive polymer is dissolved is not particularly limited, but is preferably about 0.1 to 40% by weight. The drying temperature after coating is not particularly limited, but is preferably about 100 to 150°C. In addition, the drying time after coating is not particularly limited, but it is preferably about 1 to 60 minutes.
所述導電層的形成方法沒有特別限定,可以使用塗布法、噴霧法、旋塗法、連線塗布法等。The method of forming the conductive layer is not particularly limited, and a coating method, spray method, spin coating method, in-line coating method, etc. can be used.
所述導電層的厚度較佳為1nm~500nm,更佳為10nm~200nm,進一步更佳為20nm~100nm。The thickness of the conductive layer is preferably 1 nm to 500 nm, more preferably 10 nm to 200 nm, and still more preferably 20 nm to 100 nm.
<脫模層> 然後,在本發明的低聚物防止層及導電層上,設置脫模層。脫模層是為了提高從黏合劑層的剝離性而設置的。脫模層的形成材料沒有特別限制,可以舉出矽酮系、氟系、長鏈烷基系或脂肪酸醯胺系的脫模劑等。其等當中,較佳為矽酮系脫模劑。脫模層可以在低聚物防止層及導電層上作為塗布層形成。另外,脫模層也可以利用轉印來形成。<Release layer> Then, a release layer is provided on the oligomer prevention layer and the conductive layer of the present invention. The release layer is provided to improve the releasability from the adhesive layer. The material for forming the release layer is not particularly limited, and examples include silicone-based, fluorine-based, long-chain alkyl-based, or fatty acid amide-based mold release agents. Among them, a silicone-based mold release agent is preferred. The release layer can be formed as a coating layer on the oligomer prevention layer and the conductive layer. In addition, the release layer can also be formed by transfer.
作為所述矽酮系脫模劑,例如可以舉出加成反應型矽酮樹脂。作為加成反應型矽酮樹脂,可以舉出信越化學工業製的KS-774、KS-775、KS-778、KS-779H、KS-847H、KS-847T、Toshiba Silicone製的TPR-6700、TPR-6710、TPR-6721、Dow Corning Toray製的SD7220、SD7226等。As said silicone type mold release agent, addition reaction type silicone resin is mentioned, for example. As addition reaction type silicone resins, KS-774, KS-775, KS-778, KS-779H, KS-847H, KS-847T, TPR-6700, TPR manufactured by Toshiba Silicone manufactured by Shin-Etsu Chemical Industry -6710, TPR-6721, SD7220, SD7226 manufactured by Dow Corning Toray, etc.
矽酮系脫模層的塗布量(乾燥後)較佳為0.01~2g/m2 ,更佳為0.01~1g/m2 ,進一步更佳為0.01~0.5g/m2 的範圍。The coating amount (after drying) of the silicone-based mold release layer is preferably in the range of 0.01 to 2 g/m 2 , more preferably 0.01 to 1 g/m 2 , and still more preferably 0.01 to 0.5 g/m 2 .
所述脫模層的形成可以藉由如下操作來進行,例如,利用反向凹版塗布法、棒塗法、模塗法等以往公知的塗布方式將上述材料塗布於所述功能層上,然後,通常在120~200℃左右以30秒~30分鐘實施熱處理,從而使其固化。另外,還可以根據需要將熱處理及紫外線照射等活性能量射線照射組合使用。The formation of the release layer can be performed by the following operations, for example, the above-mentioned materials are coated on the functional layer by a conventionally known coating method such as reverse gravure coating, bar coating, and die coating, and then, Generally, the heat treatment is performed at about 120 to 200°C for 30 seconds to 30 minutes to cure it. In addition, it is also possible to combine active energy ray irradiation such as heat treatment and ultraviolet irradiation as necessary.
所述脫模層的厚度通常為10~2000nm,較佳為10~1000nm,更佳為10~500nm。The thickness of the release layer is usually 10 to 2000 nm, preferably 10 to 1000 nm, more preferably 10 to 500 nm.
對於所述脫模層的表面電阻值,從對間隔件賦予導電性、抑制液晶面板的白色不均的觀點考慮,較佳為1.0×1012 Ω/□以下,更佳為1.0×1011 Ω/□以下,進一步更佳為1.0×1010 Ω/□以下。The surface resistance value of the mold release layer is preferably 1.0×10 12 Ω/□ or less, and more preferably 1.0×10 11 Ω, from the viewpoint of imparting conductivity to the spacer and suppressing white unevenness of the liquid crystal panel /□ or less, more preferably 1.0×10 10 Ω/□ or less.
<黏合劑層> 本發明的黏合劑層由黏合劑組合物形成。作為黏合劑組合物,可以舉出橡膠系黏合劑組合物、丙烯酸系黏合劑組合物、矽酮系黏合劑組合物、胺基甲酸酯系黏合劑組合物、乙烯基烷基醚系黏合劑組合物、聚乙烯醇系黏合劑組合物、聚乙烯基吡咯烷酮系黏合劑組合物、聚丙烯醯胺系黏合劑組合物、纖維素系黏合劑組合物等。在黏合劑組合物中,較佳含有基礎聚合物。<Adhesive layer> The adhesive layer of the present invention is formed of an adhesive composition. Examples of the adhesive composition include rubber-based adhesive compositions, acrylic-based adhesive compositions, silicone-based adhesive compositions, urethane-based adhesive compositions, and vinyl alkyl ether-based adhesives. Composition, polyvinyl alcohol-based adhesive composition, polyvinylpyrrolidone-based adhesive composition, polyacrylamide-based adhesive composition, cellulose-based adhesive composition, etc. The adhesive composition preferably contains a base polymer.
<基礎聚合物> 基礎聚合物可以根據所述黏合劑組合物的種類選擇黏合性的基礎聚合物。<Base polymer> The base polymer can select an adhesive base polymer according to the type of the adhesive composition.
在所述黏合劑組合物當中,從光學的透明性優異、顯示出適當的浸潤性、凝聚性及膠黏性的黏合特性、耐候性及耐熱性等優異的方面考慮,較佳使用丙烯酸系黏合劑組合物。丙烯酸系黏合劑組合物較佳作為黏合性的基礎聚合物含有(甲基)丙烯酸系聚合物。(甲基)丙烯酸系聚合物通常作為單體單元,以(甲基)丙烯酸烷基酯作為主成分含有。而且,(甲基)丙烯酸酯是指丙烯酸酯及/或甲基丙烯酸酯,本發明的所謂(甲基)表示同樣的意味。Among the adhesive compositions, from the viewpoints of excellent optical transparency, proper wettability, cohesiveness and adhesive properties, weather resistance and heat resistance, etc., it is preferable to use acrylic adhesive.剂组合物。 Agent composition. The acrylic adhesive composition preferably contains a (meth)acrylic polymer as an adhesive base polymer. The (meth)acrylic polymer is usually contained as a monomer unit with an alkyl (meth)acrylate as a main component. In addition, (meth)acrylate means acrylate and/or methacrylate, and the term (meth) in the present invention means the same.
作為構成所述(甲基)丙烯酸系聚合物的主骨架的(甲基)丙烯酸烷基酯,可以例示出直鏈狀或支鏈狀的烷基的碳原子數1~18的(甲基)丙烯酸烷基酯。作為所述烷基,可以例示出甲基、乙基、丙基、異丙基、丁基、異丁基、戊基、己基、環己基、庚基、2-乙基己基、異辛基、壬基、癸基、異癸基、十二烷基、異肉豆蔻基、月桂基、十三烷基、十五烷基、十六烷基、十七烷基、十八烷基等。(甲基)丙烯酸烷基酯既可以僅使用1種,也可以使用2種以上。此等烷基的平均碳原子數較佳為3~9。As the (meth)acrylic acid alkyl ester constituting the main skeleton of the (meth)acrylic polymer, a linear or branched alkyl group having 1 to 18 carbon atoms (methyl) can be exemplified Alkyl acrylate. Examples of the alkyl group include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, pentyl, hexyl, cyclohexyl, heptyl, 2-ethylhexyl, isooctyl, Nonyl, decyl, isodecyl, dodecyl, isomyristyl, lauryl, tridecyl, pentadecyl, hexadecyl, heptadecyl, octadecyl, etc. Alkyl (meth)acrylate may be used only 1 type or 2 or more types. The average number of carbon atoms of these alkyl groups is preferably 3-9.
另外,作為所述(甲基)丙烯酸烷基酯,從黏合特性、耐久性、相位差的調整、折射率的調整等方面考慮,可以使用(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸苄酯之類的含有芳香族環的(甲基)丙烯酸烷基酯。In addition, as the alkyl (meth)acrylate, phenoxyethyl (meth)acrylate, (methyl) ) Alkyl (meth)acrylates containing aromatic rings such as benzyl acrylate.
在所述(甲基)丙烯酸系聚合物中,出於改善膠黏性、耐熱性的目的,可以利用共聚導入1種以上的具有(甲基)丙烯醯基或乙烯基等具有不飽和雙鍵的聚合性官能團的共聚單體。作為共聚單體的具體例,可以舉出:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、丙烯酸(4-羥基甲基環己基)甲基酯等含羥基單體;(甲基)丙烯酸、(甲基)丙烯酸羧基乙酯、(甲基)丙烯酸羧基戊酯、衣康酸、馬來酸、富馬酸、巴豆酸等含羧基單體;馬來酸酐、衣康酸酐等含酸酐基單體;丙烯酸的己內酯加成物;苯乙烯磺酸、烯丙基磺酸、2-(甲基)丙烯醯胺-2-甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、(甲基)丙烯酸磺基丙酯、(甲基)丙烯醯氧基萘磺酸等含磺酸基單體;丙烯醯磷酸2-羥基乙酯等含磷酸基單體等。In the (meth)acrylic polymer, for the purpose of improving adhesiveness and heat resistance, one or more kinds of unsaturated double bonds with (meth)acrylic groups or vinyl groups can be introduced by copolymerization. The comonomer of polymerizable functional groups. Specific examples of the comonomer include: 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, (meth)acrylic acid 6-hydroxyhexyl ester, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (4-hydroxymethylcyclohexyl)methacrylate Monomers containing hydroxyl groups such as (meth)acrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, etc. Body; maleic anhydride, itaconic anhydride and other acid anhydride group-containing monomers; acrylic acid caprolactone adducts; styrene sulfonic acid, allyl sulfonic acid, 2-(meth)acrylamide-2-methyl Sulfonic acid group-containing monomers such as propanesulfonic acid, (meth)acrylamide propanesulfonic acid, sulfopropyl (meth)acrylate, and (meth)acryloxynaphthalenesulfonic acid; acrylic acid 2-hydroxyl phosphate Phosphoric acid group-containing monomers such as ethyl ester.
所述(甲基)丙烯酸系聚合物在全部構成單體的重量比率中,以(甲基)丙烯酸烷基酯作為主成分,(甲基)丙烯酸系聚合物中的所述共聚單體的比例沒有特別限制,然而所述共聚單體的比例在全部構成單體的重量比率中,較佳為0~20%左右,更佳為0.1~15%左右,進一步更佳為0.1~10%左右。The (meth)acrylic polymer has an alkyl (meth)acrylate as the main component in the weight ratio of all constituent monomers, and the ratio of the comonomer in the (meth)acrylic polymer There is no particular limitation. However, the ratio of the comonomer is preferably about 0-20%, more preferably about 0.1-15%, and still more preferably about 0.1-10% in the weight ratio of all constituent monomers.
所述(甲基)丙烯酸系聚合物通常使用重均分子量(Mw)為50萬~300萬的範圍的聚合物。如果考慮耐久性,特別是考慮耐熱性,則較佳使用重均分子量(Mw)為70萬~270萬的聚合物,更佳為80萬~250萬。如果重均分子量(Mw)小於50萬,則從耐熱性的方面考慮則不為所欲。另外,如果重均分子量(Mw)大於300萬,則為了調整為用於塗布的黏度,需要大量的稀釋溶劑,使得成本升高,因此不為所欲。而且,重均分子量(Mw)是指利用GPC(凝膠滲透色譜)測定、並利用聚苯乙烯換算算出的值。The (meth)acrylic polymer generally uses a polymer having a weight average molecular weight (Mw) in the range of 500,000 to 3 million. If durability is considered, especially heat resistance is considered, it is preferable to use a polymer having a weight average molecular weight (Mw) of 700,000 to 2.7 million, more preferably 800,000 to 2.5 million. If the weight average molecular weight (Mw) is less than 500,000, it is undesirable from the viewpoint of heat resistance. In addition, if the weight average molecular weight (Mw) is greater than 3 million, in order to adjust the viscosity for coating, a large amount of diluting solvent is required, which increases the cost, which is not desirable. In addition, the weight average molecular weight (Mw) is a value measured by GPC (gel permeation chromatography) and calculated in terms of polystyrene.
所述(甲基)丙烯酸系聚合物的製造可以適當地選擇溶液聚合、本體聚合、乳液聚合、各種自由基聚合等公知的製造方法。另外,所得的(甲基)丙烯酸系聚合物可以是無規共聚物、嵌段共聚物、接枝共聚物等任意共聚物。For the production of the (meth)acrylic polymer, known production methods such as solution polymerization, bulk polymerization, emulsion polymerization, and various radical polymerizations can be appropriately selected. In addition, the obtained (meth)acrylic polymer may be any copolymer such as a random copolymer, a block copolymer, and a graft copolymer.
所述自由基聚合中所用的聚合引發劑、鏈轉移劑、乳化劑等沒有特別限定,可以適當地選擇使用。而且,(甲基)丙烯酸系聚合物的重均分子量(Mw)可以利用聚合引發劑、鏈轉移劑的使用量、反應條件進行控制,可以根據其等的種類適當地調整其使用量。The polymerization initiator, chain transfer agent, emulsifier, etc. used in the radical polymerization are not particularly limited, and can be appropriately selected and used. In addition, the weight average molecular weight (Mw) of the (meth)acrylic polymer can be controlled by the usage amount of the polymerization initiator and the chain transfer agent, and the reaction conditions, and the usage amount can be appropriately adjusted according to the kind of the polymerization initiator and the chain transfer agent.
而且,在所述溶液聚合中,作為聚合溶劑,可以使用乙酸乙酯、甲苯等。作為具體的溶液聚合例,可以在氮氣等非活性氣體氣流下,加入聚合引發劑,通常在50~70℃左右、5~30小時左右的反應條件下進行反應。Furthermore, in the solution polymerization, ethyl acetate, toluene, etc. can be used as the polymerization solvent. As a specific example of solution polymerization, a polymerization initiator can be added under an inert gas flow such as nitrogen, and the reaction is usually carried out under reaction conditions of about 50 to 70°C for about 5 to 30 hours.
<導電性化合物> 本發明的黏合劑組合物較佳除了所述基礎聚合物以外,還含有導電性化合物。作為導電性化合物,可以舉出離子性化合物、離子性表面活性劑、導電性聚合物、金屬氧化物等。<Conductive compound> The adhesive composition of the present invention preferably contains a conductive compound in addition to the base polymer. Examples of conductive compounds include ionic compounds, ionic surfactants, conductive polymers, and metal oxides.
作為所述離子性化合物,可以較佳使用鹼金屬鹽及/或有機陽離子-陰離子鹽。鹼金屬鹽可以使用鹼金屬的有機鹽及無機鹽。而且,本發明中所謂“有機陽離子-陰離子鹽”是有機鹽,且表示其陽離子部由有機物構成的鹽,陰離子部可以是有機物,也可以是無機物。“有機陽離子-陰離子鹽”也被稱作離子性液體、離子性固體。離子性化合物既可以僅使用1種,也可以使用2種以上。As the ionic compound, alkali metal salts and/or organic cation-anion salts can be preferably used. As the alkali metal salt, organic salts and inorganic salts of alkali metals can be used. Furthermore, the "organic cation-anion salt" in the present invention refers to an organic salt, and means a salt whose cation portion is composed of an organic substance, and the anion portion may be an organic substance or an inorganic substance. "Organic cation-anion salt" is also called ionic liquid or ionic solid. Only one type of ionic compound may be used, or two or more types may be used.
作為構成所述鹼金屬鹽的陽離子部的鹼金屬離子,可以舉出鋰、鈉、鉀的各離子。在此等鹼金屬離子當中較佳鋰離子。Examples of the alkali metal ions constituting the cation part of the alkali metal salt include ions of lithium, sodium, and potassium. Among these alkali metal ions, lithium ion is preferred.
所述鹼金屬鹽的陰離子部也可以由有機物構成,也可以由無機物構成。作為構成有機鹽的陰離子部,可以使用CH3
COO-
、CF3
COO-
、CH3
SO3 -
、CF3
SO3 -
、(CF3
SO2
)3
C-
、C4
F9
SO3 -
、C3
F7
COO-
、(CF3
SO2
)(CF3
CO)N-
、-
O3
S(CF2
)3
SO3 -
、PF6 -
、CO3 2 -
、或以下述通式(1)至(4)表示的陰離子部等: (1):(Cn
F2n +1
SO2
)2
N-
(其中,n為1~10的整數)、 (2):CF2
(Cm
F2m
SO2
)2
N-
(其中,m為1~10的整數)、 (3):-
O3
S(CF2
)l
SO3 -
(其中,l為1~10的整數)、 (4):(Cp
F2p +1
SO2
)N-
(Cq
F2q +1
SO2
)(其中,p、q為1~10的整數)。特別是含有氟原子的陰離子部由於可以獲得離子解離性良好的離子化合物,因此較佳使用。作為構成無機鹽的陰離子部,可以使用Cl-
、Br-
、I-
、AlCl4 -
、Al2
Cl7 -
、BF4 -
、PF6 -
、ClO4 -
、NO3 -
、AsF6 -
、SbF6 -
、NbF6 -
、TaF6 -
、(CN)2
N-
等。作為陰離子部,較佳為(CF3
SO2
)2
N-
、(C2
F5
SO2
)2
N-
等以所述通式(1)表示的(全氟烷基磺醯)亞胺,特佳為以(CF3
SO2
)2
N-
表示的(三氟甲磺醯)亞胺。The anion part of the alkali metal salt may be composed of an organic substance or an inorganic substance. As the anion part constituting the organic salt, CH 3 COO - , CF 3 COO - , CH 3 SO 3 - , CF 3 SO 3 - , (CF 3 SO 2 ) 3 C - , C 4 F 9 SO 3 - , C 3 F 7 COO -, (
作為鹼金屬的有機鹽,具體而言,可舉出:乙酸鈉、海藻酸鈉、木質磺酸鈉、甲苯磺酸鈉、LiCF3 SO3 、Li(CF3 SO2 )2 N、Li(CF3 SO2 )2 N、Li(C2 F5 SO2 )2 N、Li(C4 F9 SO2 )2 N、Li(CF3 SO2 )3 C、KO3 S(CF2 )3 SO3 K、LiO3 S(CF2 )3 SO3 K等,其等當中較佳為LiCF3 SO3 、Li(CF3 SO2 )2 N、Li(C2 F5 SO2 )2 N、Li(C4 F9 SO2 )2 N、Li (CF3 SO2 )3 C等,更佳為Li(CF3 SO2 )2 N、Li(C2 F5 SO2 )2 N、Li(C4 F9 SO2 )2 N等含氟醯亞胺鋰鹽,特佳為(全氟烷基磺醯)亞胺鋰鹽。As the organic salt of alkali metal, specifically, sodium acetate, sodium alginate, sodium lignosulfonate, sodium toluenesulfonate, LiCF 3 SO 3 , Li(CF 3 SO 2 ) 2 N, Li(CF 3 SO 2 ) 2 N, Li (C 2 F 5 SO 2 ) 2 N, Li (C 4 F 9 SO 2 ) 2 N, Li (CF 3 SO 2 ) 3 C, KO 3 S (CF 2 ) 3 SO 3 K, LiO 3 S(CF 2 ) 3 SO 3 K, etc. Among them, LiCF 3 SO 3 , Li(CF 3 SO 2 ) 2 N, Li(C 2 F 5 SO 2 ) 2 N, Li (C 4 F 9 SO 2 ) 2 N, Li (CF 3 SO 2 ) 3 C, etc., more preferably Li (CF 3 SO 2 ) 2 N, Li (C 2 F 5 SO 2 ) 2 N, Li (C 4 F 9 SO 2 ) 2 N and other fluorine-containing imide lithium salt, particularly preferably (perfluoroalkylsulfonyl) imide lithium salt.
另外,作為鹼金屬的無機鹽,可以舉出高氯酸鋰、碘化鋰。In addition, examples of inorganic salts of alkali metals include lithium perchlorate and lithium iodide.
所述有機陽離子-陰離子鹽由陽離子成分及陰離子成分構成,所述陽離子成分由有機物構成。作為陽離子成分,具體而言,可以舉出:吡啶鎓陽離子、呱啶鎓陽離子、吡咯烷鎓陽離子、具有吡咯啉骨架的陽離子、具有吡咯骨架的陽離子、咪唑鎓陽離子、四氫嘧啶鎓陽離子、二氫嘧啶鎓陽離子、吡唑鎓陽離子、吡唑啉鎓陽離子、四烷基銨陽離子、三烷基鋶陽離子、四烷基鏻陽離子等。The organic cation-anion salt is composed of a cation component and an anion component, and the cation component is composed of an organic substance. Specific examples of the cationic component include: pyridinium cation, pyridinium cation, pyrrolidinium cation, pyrroline skeleton cation, pyrrole skeleton cation, imidazolium cation, tetrahydropyrimidinium cation, di Hydropyrimidinium cation, pyrazolium cation, pyrazolium cation, tetraalkylammonium cation, trialkylaluminium cation, tetraalkylphosphonium cation, etc.
作為所述陰離子成分,可以使用Cl-
、Br-
、I-
、AlCl4 -
、Al2
Cl7 -
、BF4 -
、PF6 -
、ClO4 -
、NO3 -
、CH3
COO-
、CF3
COO-
、CH3
SO3 -
、CF3
SO3 -
、(CF3
SO2
)3
C-
、AsF6 -
、SbF6 -
、NbF6 -
、TaF6 -
、(CN)2
N-
、C4
F9
SO3 -
、C3
F7
COO-
、((CF3
SO2
)(CF3
CO)N-
、-
O3
S(CF2
)3
SO3 -
、或以下述通式(1)至(4)表示的陰離子成分等: (1):(Cn
F2n +1
SO2
)2
N-
(其中,n為1~10的整數)、 (2):CF2
(Cm
F2m
SO2
)2
N-
(其中,m為1~10的整數)、 (3):-
O3
S(CF2
)l
SO3 -
(其中,l為1~10的整數)、 (4):(Cp
F2p +1
SO2
)N-
(Cq
F2q +1
SO2
)(其中,p、q為1~10的整數)。其中,特別是含有氟原子的陰離子成分由於可以獲得離子解離性良好的離子化合物,因此較佳使用。Examples of the anion component include Cl -, Br -, I - , AlCl 4 -,
另外,作為所述離子性化合物,除了所述的鹼金屬鹽、有機陽離子-陰離子鹽以外,還可以舉出氯化銨、氯化鋁、氯化銅、氯化亞鐵、氯化鐵、硫酸銨等無機鹽。In addition, as the ionic compound, in addition to the alkali metal salt, organic cation-anion salt, ammonium chloride, aluminum chloride, copper chloride, ferrous chloride, ferric chloride, sulfuric acid Inorganic salts such as ammonium.
作為所述離子性表面活性劑,可以舉出陽離子系(四級銨鹽型、鏻鹽型、鋶鹽型等)、陰離子系(羧酸型、磺酸鹽型、硫酸鹽型、磷酸鹽型、亞硫酸鹽型等)、兩性離子系(磺基甜菜鹼型、烷基甜菜鹼型、烷基咪唑鎓甜菜鹼型等)或非離子系(多元醇衍生物、β-環糊精包絡化合物、去水山梨醇脂肪酸單酯・二酯、聚環氧烷烴衍生物、氧化胺等)的各種表面活性劑。離子性表面活性劑既可以僅使用1種,也可以使用2種以上。Examples of the ionic surfactant include cationic (quaternary ammonium salt type, phosphonium salt type, sulfonate type, etc.), anionic type (carboxylic acid type, sulfonate type, sulfate type, phosphate type, etc.) , Sulfite type, etc.), zwitterionic type (sulfobetaine type, alkyl betaine type, alkyl imidazolium betaine type, etc.) or non-ionic type (polyol derivatives, β-cyclodextrin inclusion compound , Sorbitan fatty acid monoesters and diesters, polyalkylene oxide derivatives, amine oxides, etc.) various surfactants. The ionic surfactant may be used alone or in two or more types.
作為所述導電性聚合物,可以舉出聚苯胺系、聚噻吩系、聚吡咯系、聚喹喔啉系等聚合物,其等當中,較佳使用容易變為水溶性導電性聚合物或水分散性導電性聚合物的聚苯胺、聚噻吩等。特佳為聚噻吩。導電性聚合物既可以僅使用1種,也可以使用2種以上。Examples of the conductive polymer include polyaniline, polythiophene, polypyrrole, polyquinoxaline and other polymers. Among them, it is preferable to use a water-soluble conductive polymer or water. Disperse conductive polymer such as polyaniline and polythiophene. Particularly preferred is polythiophene. Only one type of conductive polymer may be used, or two or more types may be used.
作為所述金屬氧化物,可以舉出氧化錫系、氧化銻系、氧化銦系、氧化鋅系等。其等當中較佳氧化錫系。作為氧化錫系的金屬氧化物,除了氧化錫以外,還可以舉出摻銻氧化錫、摻銦氧化錫、摻鋁氧化錫、摻鎢氧化錫、氧化鈦-氧化鈰-氧化錫的複合物、氧化鈦-氧化錫的複合物等。金屬氧化物既可以僅使用1種,也可以使用2種以上。As said metal oxide, tin oxide type, antimony oxide type, indium oxide type, zinc oxide type, etc. are mentioned. Among them, tin oxide is preferred. As tin oxide-based metal oxides, in addition to tin oxide, antimony-doped tin oxide, indium-doped tin oxide, aluminum-doped tin oxide, tungsten-doped tin oxide, titanium oxide-cerium oxide-tin oxide composites, Titanium oxide-tin oxide composites, etc. Only one type of metal oxide may be used, or two or more types may be used.
此外作為所述以外的導電性化合物,可以例示出乙炔黑、科琴黑、天然石墨、人造石墨、鈦黑、或具有陽離子型(四級銨鹽等)、兩性離子型(甜菜鹼化合物等)、陰離子型(磺酸鹽等)或非離子型(甘油等)的離子導電性基的單體的均聚物或該單體與其他單體的共聚物、具有來自於具有四級銨鹽基的丙烯酸酯或甲基丙烯酸酯的部位的聚合物等具有離子導電性的聚合物;使聚乙烯甲基丙烯酸酯共聚物等親水性聚合物與丙烯酸系樹脂等合金化的類型的永久防靜電干擾劑。In addition, examples of conductive compounds other than those described above include acetylene black, Ketjen black, natural graphite, artificial graphite, titanium black, or cationic (quaternary ammonium salts, etc.), zwitterionic (betaine compounds, etc.) , Anionic (sulfonate, etc.) or non-ionic (glycerol, etc.) ionic conductive group monomer homopolymers or copolymers of this monomer and other monomers, with quaternary ammonium salt groups The acrylate or methacrylate part of the polymer and other polymers with ion conductivity; the type of alloying hydrophilic polymers such as polyethylene methacrylate copolymer with acrylic resins, etc. permanent anti-static interference Agent.
從導電性能高的方面、在黏合劑中分散性、透明性優異的方面、在黏合劑中的保管穩定性的觀點考慮,所述導電性化合物較佳使用離子性化合物。From the viewpoint of high conductivity, excellent dispersibility in the adhesive, and transparency, and the viewpoint of storage stability in the adhesive, it is preferable to use an ionic compound as the conductive compound.
所述導電性化合物的配合比例較佳相對於基礎聚合物100重量份為0.0001~5重量份。如果導電性化合物小於0.0001重量份,則會有防靜電干擾性能的提高效果不夠充分的情況。另一方面,如果導電性化合物大於5重量份,則會有耐久性不夠充分的情況。導電性化合物較佳為0.01重量份以上,更佳為0.1重量份以上。另外,導電性化合物較佳為3重量份以下,更佳為2重量份以下。The blending ratio of the conductive compound is preferably 0.0001 to 5 parts by weight with respect to 100 parts by weight of the base polymer. If the conductive compound is less than 0.0001 part by weight, the effect of improving the anti-static interference performance may be insufficient. On the other hand, if the conductive compound exceeds 5 parts by weight, the durability may be insufficient. The conductive compound is preferably 0.01 part by weight or more, more preferably 0.1 part by weight or more. In addition, the conductive compound is preferably 3 parts by weight or less, more preferably 2 parts by weight or less.
此外,在本發明的黏合劑組合物中,可以含有交聯劑。作為交聯劑,可以使用有機系交聯劑、多官能性金屬螯合物。作為有機系交聯劑,可以舉出異氰酸酯系交聯劑、過氧化物系交聯劑、環氧系交聯劑、亞胺系交聯劑等。多官能性金屬螯合物是多價金屬與有機化合物形成共價鍵或配位鍵而成的化合物。作為多價金屬原子,可以舉出Al、Cr、Zr、Co、Cu、Fe、Ni、V、Zn、In、Ca、Mg、Mn、Y、Ce、Sr、Ba、Mo、La、Sn、Ti等。作為形成共價鍵或配位鍵的有機化合物中的原子可以舉出氧原子等,作為有機化合物可以舉出烷基酯、醇化合物、羧酸化合物、醚化合物、酮化合物等。作為交聯劑,較佳異氰酸酯系交聯劑、過氧化物系交聯劑。交聯劑既可以僅使用1種,也可以使用2種以上。In addition, the adhesive composition of the present invention may contain a crosslinking agent. As the crosslinking agent, organic crosslinking agents and polyfunctional metal chelate compounds can be used. Examples of the organic crosslinking agent include isocyanate-based crosslinking agents, peroxide-based crosslinking agents, epoxy-based crosslinking agents, and imine-based crosslinking agents. Multifunctional metal chelate is a compound in which a multivalent metal and an organic compound form a covalent bond or a coordinate bond. Examples of multivalent metal atoms include Al, Cr, Zr, Co, Cu, Fe, Ni, V, Zn, In, Ca, Mg, Mn, Y, Ce, Sr, Ba, Mo, La, Sn, Ti Wait. Examples of the atoms in the organic compound forming a covalent bond or coordination bond include an oxygen atom, and examples of the organic compound include alkyl esters, alcohol compounds, carboxylic acid compounds, ether compounds, and ketone compounds. As the crosslinking agent, isocyanate-based crosslinking agents and peroxide-based crosslinking agents are preferred. As for the crosslinking agent, only 1 type may be used, and 2 or more types may be used.
所述交聯劑的配合比例較佳相對於基礎聚合物100重量份為0.01~20重量份,更佳為0.03~10重量份。而且,如果交聯劑小於0.01重量份,則會有黏合劑的凝聚力不足的趨勢,在加熱時有可能產生發泡,另一方面,如果大於20重量份,則耐濕性不夠充分,在可靠性試驗等中容易產生剝離。The mixing ratio of the crosslinking agent is preferably 0.01 to 20 parts by weight, more preferably 0.03 to 10 parts by weight relative to 100 parts by weight of the base polymer. Moreover, if the crosslinking agent is less than 0.01 parts by weight, the cohesive force of the adhesive tends to be insufficient, and foaming may occur during heating. On the other hand, if the crosslinking agent is greater than 20 parts by weight, the moisture resistance is insufficient and the Peeling easily occurs during performance tests.
此外,在本發明的黏合劑組合物中,可以含有矽烷偶聯劑。藉由使用矽烷偶聯劑,可以提高耐久性。矽烷偶聯劑既可以僅使用1種,也可以使用2種以上。In addition, the adhesive composition of the present invention may contain a silane coupling agent. By using silane coupling agent, durability can be improved. Only one type of silane coupling agent may be used, or two or more types may be used.
對於所述矽烷偶聯劑的配合比例,較佳相對於基礎聚合物100重量份,矽烷偶聯劑為0.001~5重量份,更佳為0.01~1重量份,進一步更佳為0.02~1重量份,特佳為0.05~0.6重量份。為了提高耐久性、適度地保持對液晶面板等光學構件的膠黏力,可以在該範圍內適當地選擇。The mixing ratio of the silane coupling agent is preferably 0.001 to 5 parts by weight relative to 100 parts by weight of the base polymer, more preferably 0.01 to 1 part by weight, and still more preferably 0.02 to 1 part by weight Parts, particularly preferably 0.05 to 0.6 parts by weight. In order to improve durability and appropriately maintain the adhesive force to optical members such as liquid crystal panels, it can be appropriately selected within this range.
此外,在本發明的黏合劑組合物中,也可以還含有其他公知的添加劑,可以根據所使用的用途適當地添加著色劑、顏料等粉體、染料、表面活性劑、增塑劑、增黏劑、表面潤滑劑、流平劑、軟化劑、抗氧化劑、防老化劑、光穩定劑、紫外線吸收劑、聚合禁阻劑、無機或有機的填充劑、金屬粉、粒子狀、箔狀物等。另外,也可以在可以控制的範圍內,採用加入還原劑的氧化還原體系。In addition, the adhesive composition of the present invention may also contain other well-known additives, and powders such as colorants and pigments, dyes, surfactants, plasticizers, and tackifiers may be appropriately added according to the intended use. Agents, surface lubricants, leveling agents, softeners, antioxidants, anti-aging agents, light stabilizers, ultraviolet absorbers, polymerization inhibitors, inorganic or organic fillers, metal powders, particles, foils, etc. . In addition, a redox system with a reducing agent can also be used within a controllable range.
本發明附間隔件之黏合劑層可以藉由如下操作來製造,即,在所述間隔件的脫模層上,塗布含有所述黏合劑組合物的溶液後,進行乾燥而形成黏合劑層。而且,在黏合劑組合物的塗布時,也可以適當地新加入聚合溶劑以外的一種以上的溶劑。The adhesive layer with the spacer of the present invention can be produced by applying a solution containing the adhesive composition on the release layer of the spacer, and then drying to form an adhesive layer. In addition, at the time of applying the adhesive composition, one or more solvents other than the polymerization solvent may be newly added as appropriate.
作為所述黏合劑組合物的塗布方法,可以使用各種方法。具體而言,可以舉出輥塗法、輥舔式塗布法、凹版塗布法、反轉塗布法、輥式刷塗法、噴塗法、浸入式輥塗法、棒塗法、刮塗法、氣刀塗布法、淋塗法、模唇塗布法、藉由模塗機等的擠出塗布法等方法。As a coating method of the adhesive composition, various methods can be used. Specifically, the roller coating method, the roller lick coating method, the gravure coating method, the reverse coating method, the roller brush method, the spray method, the immersion roller coating method, the bar coating method, the blade coating method, the gas Knife coating method, curtain coating method, die lip coating method, extrusion coating method by die coater, etc.
所述黏合劑層的厚度沒有特別限制,為1~100μm左右。較佳為2~50μm,更佳為2~40μm,進一步更佳為5~35μm。The thickness of the adhesive layer is not particularly limited, and it is about 1-100 μm. It is preferably 2 to 50 μm, more preferably 2 to 40 μm, and still more preferably 5 to 35 μm.
從對附間隔件之黏合劑層賦予導電性、抑制液晶面板的白色不均的觀點考慮,所述黏合劑層的表面電阻值較佳為1.0×1012 Ω/□以下,更佳為1.0×1011 Ω/□以下,進一步更佳為1.0×1010 Ω/□以下。From the viewpoint of imparting conductivity to the spacer-attached adhesive layer and suppressing white unevenness of the liquid crystal panel, the surface resistance value of the adhesive layer is preferably 1.0×10 12 Ω/□ or less, more preferably 1.0× 10 11 Ω/□ or less, more preferably 1.0×10 10 Ω/□ or less.
<附有附間隔件之黏合劑層的光學薄膜> 本發明附有附間隔件之黏合劑層的光學薄膜在光學薄膜的至少一面貼合有附間隔件之黏合劑層的黏合劑層側。<Optical film with spacer-attached adhesive layer> The optical film with spacer-attached adhesive layer of the present invention has the adhesive layer side of the spacer-attached adhesive layer bonded to at least one surface of the optical film.
作為所述光學薄膜,可以使用液晶顯示裝置等影像顯示裝置的形成中所用的光學薄膜,其種類沒有特別限制。作為光學薄膜,可以舉出偏光薄膜、相位差板、光學補償薄膜、亮度提高薄膜、或防反射薄膜等表面處理薄膜、以及此等薄膜積層而成者等。As the optical film, optical films used in the formation of image display devices such as liquid crystal display devices can be used, and the type thereof is not particularly limited. Examples of the optical film include surface treatment films such as polarizing films, retardation films, optical compensation films, brightness enhancement films, or anti-reflection films, and laminates of these films.
所述偏光薄膜一般使用在偏光件的一面或兩面具有透明保護薄膜的偏光薄膜。偏光件沒有特別限定,可以使用各種偏光件。作為偏光件,可以舉出使聚乙烯醇系薄膜、部分縮甲醛化聚乙烯醇系薄膜、乙烯・乙酸乙烯酯共聚物系部分皂化薄膜等親水性高分子薄膜吸附碘或二色性染料的二色性物質並進行單軸拉伸而得的材料、聚乙烯醇的脫水處理物或聚氯乙烯的脫鹽酸處理物等聚烯系配向薄膜等。其等當中,較佳包含聚乙烯醇系薄膜及碘等二色性物質的偏光件。此等偏光件的厚度沒有特別限制,然而一般為80μm左右以下。The polarizing film generally uses a polarizing film having a transparent protective film on one or both sides of a polarizer. The polarizer is not particularly limited, and various polarizers can be used. Examples of polarizers include two hydrophilic polymer films such as polyvinyl alcohol-based films, partially formalized polyvinyl alcohol-based films, and ethylene-vinyl acetate copolymer-based partially saponified films, which adsorb iodine or dichroic dyes. Materials obtained by uniaxially stretching coloring substances, polyolefin-based alignment films such as dehydrated polyvinyl alcohol or dehydrated polyvinyl chloride. Among them, a polarizer containing a dichroic substance such as a polyvinyl alcohol-based film and iodine is preferable. The thickness of these polarizers is not particularly limited, but is generally about 80 μm or less.
另外,作為所述偏光件可以使用厚度為10μm以下的薄型的偏光件。從薄型化的觀點考慮,該厚度較佳為1~7μm。此種薄型的偏光件的厚度不均少,觀察性優異,另外尺寸變化少,因此耐久性優異,此外作為偏光薄膜的厚度也可以實現薄型化,從這一點考慮為較佳。In addition, as the polarizer, a thin polarizer having a thickness of 10 μm or less can be used. From the viewpoint of thinning, the thickness is preferably 1 to 7 μm. Such a thin polarizer has little unevenness in thickness, is excellent in observability, and has little dimensional change, so it is excellent in durability. In addition, the thickness of the polarizing film can also be reduced in thickness, which is preferable.
作為構成所述透明保護薄膜的材料,可以使用透明性、機械強度、熱穩定性、阻水性、各向同性等方面優異的熱塑性樹脂。作為此種熱塑性樹脂的具體例,可以舉出三乙醯纖維素等纖維素樹脂、聚酯樹脂、聚醚碸樹脂、聚碸樹脂、聚碳酸酯樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚烯烴樹脂、(甲基)丙烯酸類樹脂、環狀聚烯烴樹脂(降冰片烯系樹脂)、聚芳酯樹脂、聚苯乙烯樹脂、聚乙烯醇樹脂、以及其等的混合物。而且,雖然是在偏光件的一側利用膠黏劑層貼合透明保護薄膜,然而在另一側,作為透明保護薄膜,可以使用(甲基)丙烯酸系、胺基甲酸酯系、丙烯酸胺基甲酸酯系、環氧系、矽酮系等熱固化性樹脂或紫外線固化型樹脂。在透明保護薄膜中可以含有1種以上的任意的合適的添加劑。As a material constituting the transparent protective film, a thermoplastic resin excellent in transparency, mechanical strength, thermal stability, water resistance, isotropy, and the like can be used. Specific examples of such thermoplastic resins include cellulosic resins such as triacetyl cellulose, polyester resins, polyether resins, polycarbonate resins, polycarbonate resins, polyamide resins, and polyimide resins. , Polyolefin resin, (meth)acrylic resin, cyclic polyolefin resin (norbornene resin), polyarylate resin, polystyrene resin, polyvinyl alcohol resin, and mixtures thereof. Moreover, although the transparent protective film is attached to one side of the polarizer with an adhesive layer, on the other side, as a transparent protective film, (meth)acrylic, urethane, or acrylic amine can be used. Thermosetting resins or ultraviolet curing resins such as carbamic acid ester, epoxy, and silicone. One or more arbitrary suitable additives may be contained in the transparent protective film.
所述偏光件與透明保護薄膜的貼合中所用的膠黏劑只要是光學上透明,就沒有特別限制,可以使用水系、溶劑系、熱熔系、自由基固化型、陽離子固化型的各種形態的材料,然而較佳水系膠黏劑或自由基固化型膠黏劑。The adhesive used for bonding the polarizer and the transparent protective film is not particularly limited as long as it is optically transparent, and various forms of water-based, solvent-based, hot-melt-based, radical-curing type, and cation-curing type can be used. However, water-based adhesives or radical curing adhesives are preferred.
<影像顯示裝置> 本發明的影像顯示裝置在顯示面板的至少一面,貼合有從附有附間隔件之黏合劑層的光學薄膜,剝離所述間隔件狀態下之附黏合劑層之光學薄膜的黏合劑層側。作為顯示面板,可以舉出液晶面板等。液晶面板可以使用TN型或STN型、π型、VA型、IPS型等任意類型的液晶面板。<Image display device> The image display device of the present invention is attached to at least one surface of the display panel from the optical film with the adhesive layer with spacers, and peels off the optical film with the adhesive layer in the state of the spacers The adhesive layer side. As a display panel, a liquid crystal panel etc. are mentioned. Any type of liquid crystal panel such as TN type, STN type, π type, VA type, and IPS type can be used for the liquid crystal panel.
<影像顯示裝置的製造方法> 本發明影像顯示裝置的製造方法是包括如下步驟的製造方法,即,卷材準備步驟,準備附有附間隔件之黏合劑層的光學薄膜的長條片作為卷材;顯示面板搬送準備步驟,將顯示面板搬送到黏貼位置而準備;以及貼合步驟(RTP貼合步驟),在從所述卷材抽出所述附有附間隔件之黏合劑層的光學薄膜,並從所述附有附間隔件之黏合劑層的光學薄膜利用剝離體剝離間隔件的同時,使所述間隔件剝離後露出的附黏合劑層之光學薄膜的黏合劑層側貼合於搬送到所述黏貼位置的所述顯示面板上。<The manufacturing method of the image display device> The manufacturing method of the image display device of the present invention is a manufacturing method including the following steps: a roll preparation step, preparing a long sheet of optical film with a spacer-attached adhesive layer as a roll The display panel transportation preparation step, the display panel is transported to the bonding position and prepared; and the bonding step (RTP bonding step), the optical film with the adhesive layer with spacers is extracted from the roll , And while peeling the spacer from the optical film with the spacer with the adhesive layer using the release body, the adhesive layer side of the optical film with the adhesive layer exposed after the spacer is peeled is bonded to Transported to the display panel at the pasting position.
<卷材準備步驟> 所述卷材準備步驟是製造附有附間隔件之黏合劑層的光學薄膜作為長條(帶狀)的片的卷材的步驟,該卷材沒有特別限定,可以依照以往方法來製造。<The coil preparation step> The coil preparation step is a step of manufacturing an optical film with a spacer-attached adhesive layer as a long (belt-shaped) sheet of the coil. The coil is not particularly limited and can be Manufactured in the past method.
<顯示面板搬送準備步驟> 所述顯示面板搬送準備步驟是將液晶面板等顯示面板搬送到黏貼位置的步驟,搬送方法沒有特別限制,可以依照以往方法來搬送。<Display panel transportation preparation step> The display panel transportation preparation step is a step of transporting a display panel such as a liquid crystal panel to the pasting position. The transportation method is not particularly limited, and it can be transported in accordance with the conventional method.
<RTP貼合步驟> 將所述RTP貼合步驟的典型示意圖表示於圖3中。在從所述卷材抽出的附有附間隔件之黏合劑層的光學薄膜3的長條片即將被向黏貼位置101搬送之前,從附有附間隔件之黏合劑層的光學薄膜3利用剝離體100剝離間隔件1。間隔件1剝離後露出的附黏合劑層之光學薄膜4的黏合劑層21被利用黏貼輥103貼合在由接收輥102導引到貼合給定位置101的顯示面板5上,製造出影像顯示裝置。<RTP bonding step> A typical schematic diagram of the RTP bonding step is shown in FIG. 3. Immediately before the long sheet of the
在所述RTP貼合步驟中,由於附有附間隔件之黏合劑層的光學薄膜3是沒有被裁斷的長條片,因此在間隔件1的剝離後,長條片狀附黏合劑層之光學薄膜4(或黏合劑層21)也是與剝離前的間隔件1繼續接觸的狀態。由此,即使因間隔件1的剝離而在長條片狀附黏合劑層之光學薄膜4(或黏合劑層21)產生靜電,靜電的電荷也可以經由剝離前的間隔件1快速地向剝離後的間隔件1移動,因此該剝離後的間隔件1起到接地的作用,其結果是,靜電的電荷得到衰減。In the RTP bonding step, since the
另外,影像顯示裝置的製造方法也可以是在將顯示面板與附黏合劑層之光學薄膜貼合後,適當地組裝根據需要使用的照明系統等構成部件,再裝入驅動電路而製造,例如可以舉出在液晶面板等顯示面板的一側或兩側配置附黏合劑層之光學薄膜的液晶顯示裝置的製造方法、在照明系統中使用背光燈或反射板的液晶顯示裝置的製造方法等。該情況下,本發明附黏合劑層之光學薄膜可以設於液晶面板等顯示面板的一側或兩側。在兩側設置光學薄膜的情況下,其等既可以相同,也可以不同。此外,在液晶顯示裝置的製造方法中,也可以在適當的位置配置1層或2層以上的擴散層、防眩光層、防反射膜、保護板、棱鏡陣列、透鏡陣列片、光擴散片、背光燈等適當的部件。In addition, the manufacturing method of the image display device may also be manufactured by bonding the display panel and the optical film with the adhesive layer, appropriately assembling the components such as the lighting system used as needed, and then incorporating the driving circuit. For example, Examples include a method of manufacturing a liquid crystal display device in which an optical film with an adhesive layer is arranged on one or both sides of a display panel such as a liquid crystal panel, and a method of manufacturing a liquid crystal display device using a backlight or a reflector in an illumination system. In this case, the optical film with an adhesive layer of the present invention can be provided on one or both sides of a display panel such as a liquid crystal panel. When optical films are provided on both sides, they may be the same or different. In addition, in the method of manufacturing a liquid crystal display device, one or two or more diffusion layers, anti-glare layers, anti-reflection films, protective plates, prism arrays, lens array sheets, light diffusion sheets, Appropriate components such as backlights.
[實施例] 以下,利用實施例對本發明進行具體的說明,然而本發明並不受此等實施例限定。而且,各例中的份及%都是重量基準。[Examples] Hereinafter, the present invention will be specifically described using examples, but the present invention is not limited by these examples. In addition, parts and% in each example are based on weight.
實施例1 <間隔件的製作> <<低聚物防止層的形成>> 作為二氧化矽系材料,將有機矽氧烷(Ethyl Silicate 48:COLCOAT公司)利用異丙醇稀釋至固體成分濃度為1%而製備出塗布液。利用凹版塗布機將所得的塗布液以使乾燥後的厚度為50nm的方式塗布於作為基材薄膜的聚酯薄膜(厚度:38μm)上後,在120℃乾燥30秒,形成低聚物防止層(1)。Example 1 <Production of spacer> <<Formation of oligomer prevention layer>> As a silica-based material, organosiloxane (Ethyl Silicate 48: COLCOAT) was diluted with isopropanol to a solid content concentration of 1% to prepare a coating liquid. The resulting coating solution was coated on a polyester film (thickness: 38μm) as a base film using a gravure coater so that the thickness after drying was 50nm, and dried at 120°C for 30 seconds to form an oligomer prevention layer (1).
<<導電層的形成>> 作為導電性高分子,使用聚(亞乙基二氧噻吩)/聚苯乙烯磺酸(PEDOT/PSS),製備出固體成分濃度為1%的水/異丙基醇(1/1:重量比)的溶液。將所得的溶液以使乾燥後的厚度為100nm的方式塗布於低聚物防止層(1)上,在80℃乾燥2分鐘而形成導電層(1)。<<Formation of conductive layer>> As a conductive polymer, poly(ethylenedioxythiophene)/polystyrene sulfonic acid (PEDOT/PSS) was used to prepare water/isopropyl group with a solid content of 1% Alcohol (1/1: weight ratio) solution. The obtained solution was coated on the oligomer prevention layer (1) so that the thickness after drying was 100 nm, and dried at 80° C. for 2 minutes to form the conductive layer (1).
<<脫模層的形成>> 將矽酮樹脂(KS-847H:信越化學製):20份及固化劑(PL-50T:信越化學製):0.2份用甲乙酮/甲苯混合溶劑(混合比率為1:1)350份稀釋,製備出矽酮系脫模劑的溶液。將所得的矽酮系脫模劑的溶液利用凹版塗布機以使乾燥後的厚度為100nm的方式塗布於導電層(1)上後,在120℃乾燥30秒,形成脫模層,得到具有聚酯薄膜/低聚物防止層(1)/導電層(1)/脫模層的構成的實施例1的間隔件。<<Formation of the release layer>> The silicone resin (KS-847H: manufactured by Shin-Etsu Chemical): 20 parts and curing agent (PL-50T: manufactured by Shin-Etsu Chemical): 0.2 parts are mixed with methyl ethyl ketone/toluene mixed solvent (mixing ratio is 1:1) Dilute 350 parts to prepare a silicone-based release agent solution. The obtained silicone-based mold release agent solution was coated on the conductive layer (1) with a gravure coater so that the thickness after drying was 100 nm, and then dried at 120°C for 30 seconds to form a mold release layer to obtain a poly The spacer of Example 1 with the composition of ester film/oligomer prevention layer (1)/conductive layer (1)/release layer.
實施例2 <間隔件的製作> <<導電層的形成>> 作為導電性高分子,使用聚(亞乙基二氧噻吩)/聚苯乙烯磺酸(PEDOT/PSS),製備出固體成分濃度為1%的水/異丙基醇(1/1:重量比)的溶液。將所得的溶液以使乾燥後的厚度為100nm的方式塗布於作為基材薄膜的聚酯薄膜(厚度:38μm)上,在80℃乾燥2分鐘而形成導電層(1)。Example 2 <Production of spacer> <<Formation of conductive layer>> As a conductive polymer, poly(ethylenedioxythiophene)/polystyrene sulfonic acid (PEDOT/PSS) was used to prepare solid content concentration It is a 1% water/isopropyl alcohol (1/1: weight ratio) solution. The obtained solution was applied to a polyester film (thickness: 38 μm) as a base film so that the thickness after drying was 100 nm, and dried at 80° C. for 2 minutes to form a conductive layer (1).
<<低聚物防止層的形成>> 作為二氧化矽系材料,將平均粒徑0.05μm的二氧化矽溶膠用異丙醇稀釋至固體成分濃度為1%而製備出塗布液。將所得的塗布液利用凹版塗布機以使乾燥後的厚度為50nm的方式塗布於導電層(1)上後,在120℃乾燥30秒,形成低聚物防止層(2)。<<Formation of oligomer prevention layer>> As a silica-based material, a silica sol with an average particle diameter of 0.05 μm was diluted with isopropanol to a solid content concentration of 1% to prepare a coating liquid. The obtained coating liquid was coated on the conductive layer (1) with a gravure coater so that the thickness after drying was 50 nm, and then dried at 120° C. for 30 seconds to form the oligomer prevention layer (2).
<<脫模層的形成>> 除了在實施例1中,在<<脫模層的形成>>時,在低聚物防止層(2)上形成脫模層以外,與實施例1相同地得到具有聚酯薄膜/導電層(1)/低聚物防止層(2)/脫模層的構成的實施例2的間隔件。<<Formation of the release layer>> In Example 1, the same as in Example 1, except that the release layer was formed on the oligomer preventing layer (2) in the case of <<Formation of the release layer>> The spacer of Example 2 having a composition of polyester film/conductive layer (1)/oligomer prevention layer (2)/release layer was obtained.
實施例3 <間隔件的製作> <<導電層的形成>> 作為導電性高分子,使用聚(亞乙基二氧噻吩)/聚苯乙烯磺酸(PEDOT/PSS),作為黏結劑樹脂,使用聚胺酯樹脂,製備出固體成分濃度為0.8%的水/異丙基醇(1/1:重量比)的溶液。而且,導電性高分子與黏結劑樹脂的重量比為10:1。將所得的溶液以使乾燥後的厚度為100nm的方式塗布在作為基材薄膜的聚酯薄膜(厚度:38μm)上,在80℃乾燥2分鐘而形成導電層(2)。Example 3 <Production of spacer> <<Formation of conductive layer>> As the conductive polymer, poly(ethylenedioxythiophene)/polystyrene sulfonic acid (PEDOT/PSS) was used as the binder resin, Using polyurethane resin, a water/isopropyl alcohol (1/1: weight ratio) solution with a solid content concentration of 0.8% was prepared. Furthermore, the weight ratio of the conductive polymer to the binder resin is 10:1. The obtained solution was coated on a polyester film (thickness: 38 μm) as a base film so that the thickness after drying was 100 nm, and dried at 80° C. for 2 minutes to form a conductive layer (2).
<<低聚物防止層的形成>> <<脫模層的形成>> 除了在實施例2中,在<<低聚物防止層的形成>>、<<脫模層的形成>>時,在導電層(2)上形成低聚物防止層(2),此外,在低聚物防止層(2)上設置脫模層以外,與實施例2相同地得到具有聚酯薄膜/導電層(2)/低聚物防止層(2)/脫模層的構成的實施例3的間隔件。<<Formation of oligomer prevention layer>> <<Formation of mold release layer>> Except in Example 2, when <<Formation of oligomer prevention layer>>, <<Formation of release layer>> , The oligomer prevention layer (2) is formed on the conductive layer (2), and the release layer is provided on the oligomer prevention layer (2), and the polyester film/conductive layer is obtained in the same manner as in Example 2 (2) The spacer of Example 3 of the structure of (2)/oligomer prevention layer (2)/release layer.
實施例4 <間隔件的製作> <<低聚物防止層的形成>> 作為含有聚乙烯醇系樹脂的組合物,將聚乙烯醇系樹脂(皂化度=88莫耳%、聚合度=500的聚乙烯醇)70份、黏結劑聚合物(水系聚酯樹脂:使以間苯二甲酸、乙二醇、二乙二醇為主的聚酯共聚新戊二醇、具有脂肪族二羧酸酐的二羧酸衍生物,將所得的聚酯用胺化合物中和並水系化而得的水系聚酯)15份、交聯劑(六甲氧基甲基三聚氰胺)10份、無機系粒子(平均粒徑65nm的二氧化矽溶膠)5份用水稀釋至固體成分濃度為2%而製備出塗布液。將所得的塗布液利用凹版塗布機以使乾燥後的厚度為50nm的方式塗布於作為基材薄膜的聚酯薄膜(厚度:38μm)上後,將薄膜導入展幅機而在100℃進行拉伸,然後,在230℃進行熱固定,形成低聚物防止層(3)。Example 4 <Production of spacer> <<Formation of oligomer prevention layer>> As a composition containing a polyvinyl alcohol resin, a polyvinyl alcohol resin (degree of saponification=88 mol%, degree of polymerization=500 Polyvinyl alcohol) 70 parts, binder polymer (water-based polyester resin: polyester copolymerized with isophthalic acid, ethylene glycol, and diethylene glycol, with aliphatic dicarboxylic anhydride The dicarboxylic acid derivative of the resulting polyester is neutralized and hydrated with an amine compound to obtain 15 parts of an aqueous polyester, 10 parts of a crosslinking agent (hexamethoxymethyl melamine), and inorganic particles (average particle size) 5 parts of silica sol with a diameter of 65 nm) was diluted with water to a solid content concentration of 2% to prepare a coating liquid. The obtained coating solution was applied to a polyester film (thickness: 38μm) as a base film using a gravure coater so that the thickness after drying was 50nm, and the film was introduced into a stenter and stretched at 100°C Then, heat fixation is performed at 230°C to form an oligomer prevention layer (3).
<<導電層的形成>> <<脫模層的形成>> 在實施例1中,在<<導電層的形成>>、<<脫模層的形成>>時,與實施例1相同地得到具有聚酯薄膜/低聚物防止層(3)/導電層(1)/脫模層的構成的實施例4的間隔件。<<Formation of conductive layer>> <<Formation of release layer>> In Example 1, in the case of <<Formation of conductive layer>> and <<Formation of release layer>>, the same as in Example 1 The spacer of Example 4 having a composition of polyester film/oligomer prevention layer (3)/conductive layer (1)/release layer was obtained.
比較例1 <間隔件的製作> 除了在實施例1中,沒有形成導電層(1)以外,與實施例1相同地得到具有基材薄膜/低聚物防止層(1)/脫模層的構成的比較例1的間隔件。Comparative Example 1 <Preparation of Spacer> In the same manner as in Example 1, except that the conductive layer (1) was not formed in Example 1, a substrate film/oligomer preventing layer (1)/release layer was obtained. Structure of the spacer of Comparative Example 1.
比較例2 <間隔件的製作> <<加入導電劑的低聚物防止層的形成>> 作為形成加入導電劑的低聚物防止層的組合物,將作為導電材料的具有氮元素的化合物(在主鏈中具有吡咯鎓環的化合物:第一工業製藥公司製:Sharoll DC-303P)85份、聚乙烯醇系樹脂(皂化度=88莫耳%、聚合度=500的聚乙烯醇)10份、無機系粒子(平均粒徑50nm的二氧化矽溶膠)5份用水稀釋至固體成分濃度為2%而製備出塗布液。將所得的塗布液利用凹版塗布機以使乾燥後的厚度為50nm的方式塗布於作為基材薄膜的聚酯薄膜(厚度:38μm)上後,將薄膜導入展幅機而在100℃進行拉伸,然後,在230℃進行熱固定,形成加入導電劑的低聚物防止層。Comparative Example 2 <Production of spacer> <<Formation of oligomer prevention layer with conductive agent added>> As a composition for forming an oligomer prevention layer with conductive agent added, a compound having a nitrogen element as a conductive material ( Compound having a pyrrolium ring in the main chain: Daiichi Kogyo Pharmaceutical Co., Ltd.: Sharoll DC-303P) 85 parts, polyvinyl alcohol resin (polyvinyl alcohol with saponification degree = 88 mol%, polymerization degree = 500) 10 Part, 5 parts of inorganic particles (silica sol with an average particle diameter of 50 nm) were diluted with water to a solid content concentration of 2% to prepare a coating liquid. The obtained coating solution was applied to a polyester film (thickness: 38μm) as a base film using a gravure coater so that the thickness after drying was 50nm, and the film was introduced into a stenter and stretched at 100°C Then, heat fixation is performed at 230°C to form an oligomer prevention layer with conductive agent added.
<<脫模層的形成>> 除了在實施例1中,在<<脫模層的形成>>時,在加入導電劑的低聚物防止層上形成脫模層以外,與實施例1相同地得到具有聚酯薄膜/加入導電劑的低聚物防止層/脫模層的構成的比較例2的間隔件。<<Formation of the release layer>> In Example 1, the same as Example 1 except that in the case of <<Formation of the release layer>>, the release layer was formed on the oligomer prevention layer with the conductive agent added Thus, a separator of Comparative Example 2 having a configuration of a polyester film/conducting agent-added oligomer prevention layer/release layer was obtained.
<附間隔件之黏合劑層的製作> <<丙烯酸系聚合物的製備>> 向具備冷卻管、氮氣導入管、溫度計及攪拌裝置的反應容器中,加入含有丙烯酸丁酯99份及丙烯酸4-羥基丁酯1份的單體混合物。繼而,相對於所述單體混合物(固體成分)100份,作為聚合引發劑將2,2’-偶氮二異丁腈0.1份與乙酸乙酯一起加入,一邊緩慢地攪拌一邊導入氮氣而進行氮氣置換後,將燒瓶內的液溫保持為60℃附近而進行7小時聚合反應。其後,向所得的反應液中加入乙酸乙酯,製備出將固體成分濃度調整為30%的重均分子量(Mw)160萬的丙烯酸系聚合物的溶液。<Preparation of adhesive layer with spacer> <<Preparation of acrylic polymer>> Into a reaction vessel equipped with a cooling tube, a nitrogen introduction tube, a thermometer, and a stirring device, add 99 parts of butyl acrylate and acrylic 4- A monomer mixture of 1 part of hydroxybutyl ester. Next, with respect to 100 parts of the monomer mixture (solid content), 0.1 part of 2,2'-azobisisobutyronitrile and ethyl acetate were added as a polymerization initiator, and nitrogen was introduced while stirring slowly. After the nitrogen replacement, the liquid temperature in the flask was maintained at around 60°C to perform the polymerization reaction for 7 hours. Then, ethyl acetate was added to the obtained reaction liquid, and the solution of the acrylic polymer of 1.6 million weight average molecular weight (Mw) adjusted to 30% of solid content concentration was prepared.
<<黏合劑組合物的製備>> 相對於利用上述操作得到的丙烯酸系聚合物(A)溶液的固體成分100份,作為離子性化合物,配合1-乙基-1-甲基吡咯烷鎓・三氟甲磺醯亞胺0.7份、及雙(三氟甲磺醯)亞胺鋰(三菱材料電子化成(株)製)1.0份,作為交聯劑,配合三羥甲基丙烷二甲苯二異氰酸酯(三井化學公司製:Takenate D110N)0.1份、及過氧化二苯甲醯0.3份,作為矽烷偶聯劑,配合γ-環氧丙氧基丙基甲氧基矽烷(信越化學工業公司製:KBM-403)0.2份,得到黏合劑組合物的溶液。<<Preparation of adhesive composition>> With respect to 100 parts of the solid content of the acrylic polymer (A) solution obtained by the above operation, 1-ethyl-1-methylpyrrolidinium is blended as an ionic compound. 0.7 part of trifluoromethanesulfonimide, and 1.0 part of lithium bis(trifluoromethanesulfonate)imide (manufactured by Mitsubishi Materials Electronics Co., Ltd.) as a crosslinking agent, combined with trimethylolpropane xylene diisocyanate (Mitsui Chemical Co., Ltd.: Takenate D110N) 0.1 part, and 0.3 part of diphenylmethyl peroxide, as a silane coupling agent, mixed with γ-glycidoxypropyl methoxysilane (Shin-Etsu Chemical Co., Ltd.: KBM -403) 0.2 parts to obtain a solution of the adhesive composition.
<<黏合劑層的形成>> 將利用上述操作製備的黏合劑組合物的溶液利用噴注式塗布機均勻地塗布於利用上述操作得到的實施例1~4及比較例1~2的間隔件的脫模層上後,在150℃的空氣迴圈式恒溫烘箱中乾燥60秒,在所述脫模層的表面形成厚度20μm的黏合劑層,得到實施例1~4及比較例1~2的附間隔件之黏合劑層。<<Formation of Adhesive Layer>> The solution of the adhesive composition prepared by the above operation was uniformly applied to the spacers of Examples 1 to 4 and Comparative Examples 1 and 2 obtained by the above operation using a jet coater After the release layer on the release layer, it was dried in an air-circulating constant temperature oven at 150°C for 60 seconds to form an adhesive layer with a thickness of 20 μm on the surface of the release layer to obtain Examples 1 to 4 and Comparative Examples 1 to 2 Adhesive layer with spacers.
<附有附間隔件之黏合劑層的光學薄膜的製作> <<光學薄膜的製作>> 為了製作薄型偏光件,首先,將在非晶性聚對苯二甲酸乙二醇酯(PET)基材上形成9μm厚的聚乙烯醇(PVA)層的積層體利用拉伸溫度130℃的空中輔助拉伸生成拉伸積層體,然後,藉由對拉伸積層體染色而生成著色積層體,繼而將著色積層體利用拉伸溫度65度的硼酸水中拉伸以使總拉伸倍率為5.94倍的方式生成包含與非晶性PET基材一體化拉伸的4μm厚的PVA層的光學薄膜積層體。利用此種2階段拉伸,製膜於非晶性PET基材上的PVA層的PVA分子被高次地配向,可以生成如下的光學薄膜積層體,其構成因染色而吸附的碘被作為聚碘離子絡合物沿一個方向高次地配向的高功能偏光件,包含厚度4μm的PVA層。此外,在一邊向該光學薄膜積層體的偏光件的表面塗布聚乙烯醇系膠黏劑,一邊貼合進行皂化處理的80μm厚的三乙醯纖維素薄膜後,剝離非晶性PET基材,製造出使用薄型偏光件的偏光薄膜。<Production of optical film with adhesive layer with spacer> <<Production of optical film>> In order to produce a thin polarizer, first of all, use an amorphous polyethylene terephthalate (PET) base A laminate with a 9μm-thick polyvinyl alcohol (PVA) layer formed on the material is stretched by air-assisted stretching at a stretching temperature of 130°C to produce a stretched laminate, and then the stretched laminate is dyed to produce a colored laminate, and then The colored laminate was stretched in boric acid water at a stretching temperature of 65°C to produce an optical film laminate comprising a 4μm thick PVA layer stretched integrally with an amorphous PET substrate so that the total stretch ratio was 5.94 times . With this two-stage stretching, the PVA molecules of the PVA layer formed on the amorphous PET substrate are aligned to a high degree, and the following optical film laminate can be produced. The iodine adsorbed by dyeing is used as polymer A highly functional polarizer in which an iodide ion complex is aligned in one direction at a high order and includes a PVA layer with a thickness of 4 μm. In addition, a polyvinyl alcohol-based adhesive was applied to the surface of the polarizer of the optical film laminate, and a saponified 80 μm-thick triacetyl cellulose film was laminated, and then the amorphous PET substrate was peeled off. Manufactured polarizing films using thin polarizers.
<附有附間隔件之黏合劑層的光學薄膜的製作> 然後,在使用利用上述操作得到的薄型偏光件的偏光薄膜上,貼合利用上述操作得到的實施例1~4及比較例1~2的附間隔件之黏合劑層,使黏合劑層轉印,得到實施例1~4及比較例1~2的附有附間隔件之黏合劑層的光學薄膜。<Preparation of optical film with adhesive layer with spacer> Then, on the polarizing film using the thin polarizer obtained by the above operation, the Examples 1 to 4 and the comparative example 1 obtained by the above operation were bonded together The adhesive layer with spacer of 2 was transferred to the adhesive layer, and the optical film with the adhesive layer with spacer of Examples 1-4 and Comparative Examples 1-2 was obtained.
<影像顯示裝置的製造> 為了利用圖3中所示的RTP貼合步驟製造影像顯示裝置,作為卷材準備利用上述操作得到的實施例1~4及比較例1~2的附有附間隔件之黏合劑層的光學薄膜的長條片,並準備用於向黏貼位置搬送的液晶面板。其後,在從卷材抽出實施例1~4及比較例1~2的附有附間隔件之黏合劑層的光學薄膜,並從附有附間隔件之黏合劑層的光學薄膜利用剝離體剝離間隔件的同時,將間隔件剝離後露出的附黏合劑層之光學薄膜的黏合劑層側貼合於搬送到黏貼位置的液晶面板上,製造出使用實施例1~4及比較例1~2的液晶面板的影像顯示裝置(液晶顯示裝置)。<Production of image display device> In order to manufacture an image display device using the RTP bonding process shown in FIG. 3, the spacers of Examples 1 to 4 and Comparative Examples 1 to 2 obtained by the above operations were prepared as roll materials. The long strip of optical film of the adhesive layer is prepared for the liquid crystal panel to be transported to the sticking position. After that, the optical films with the adhesive layer with spacers of Examples 1 to 4 and Comparative Examples 1 to 2 were taken out from the roll, and the optical film with the adhesive layer with spacers was used as a release body While peeling the spacer, the adhesive layer side of the optical film with the adhesive layer exposed after the spacer was peeled was bonded to the liquid crystal panel that was transported to the bonding position to manufacture and use Examples 1 to 4 and Comparative Examples 1 to 2 LCD panel image display device (liquid crystal display device).
利用GPC(凝膠滲透色譜)基於以下的條件測定出利用上述操作得到的(甲基)丙烯酸系聚合物的重均分子量(Mw)。 ・分析裝置:東曹公司製、HLC-8120GPC ・色譜柱:東曹公司製、G7000HXL+GMHXL+ GMHXL ・柱尺寸:各7.8mmφ×30cm ・柱溫:40℃ ・流量:0.8ml/min ・注入量:100μl ・洗脫液:四氫呋喃 ・檢測器:示差折射儀(RI) ・標準試樣:聚苯乙烯The weight average molecular weight (Mw) of the (meth)acrylic polymer obtained by the above operation was measured by GPC (gel permeation chromatography) based on the following conditions.・Analysis device: Tosoh Corporation, HLC-8120GPC ・Column: Tosoh Corporation, G7000HXL+GMHXL+GMHXL ・Column size: 7.8mmφ×30cm each ・Column temperature: 40°C ・Flow rate: 0.8ml/min ・Injection volume : 100μl ・Eluent: Tetrahydrofuran ・Detector: Differential Refractometer (RI) ・Standard sample: Polystyrene
對利用上述操作得到的實施例1~4及比較例1~2的間隔件、附間隔件之黏合劑層、以及附有附間隔件之黏合劑層的光學薄膜進行以下的評價。將評價結果表示於表1中。The spacers of Examples 1 to 4 and Comparative Examples 1 to 2, the spacer-attached adhesive layer, and the optical film with the spacer-attached adhesive layer obtained by the above operations were evaluated as follows. The evaluation results are shown in Table 1.
<脫模層的表面電阻值的測定方法> 對利用上述操作得到的實施例1~4及比較例1~2的間隔件,使用三菱化學Analytech公司製MCP-HT450測定出脫模層的表面的表面電阻值(Ω/□)。<Method for measuring the surface resistance of the release layer> The spacers of Examples 1 to 4 and Comparative Examples 1 and 2 obtained by the above operation were measured using MCP-HT450 manufactured by Mitsubishi Chemical Analytech. Surface resistance value (Ω/□).
<黏合劑層的表面電阻值的測定方法> 對利用上述操作得到的實施例1~4及比較例1~2的附間隔件之黏合劑層,使用三菱化學Analytech公司製MCP-HT450測定出黏合劑層的表面的表面電阻值(Ω/□)。<Method for measuring the surface resistance of the adhesive layer> The adhesive layers with spacers of Examples 1 to 4 and Comparative Examples 1 to 2 obtained by the above operation were measured for adhesion using MCP-HT450 manufactured by Mitsubishi Chemical Analytech Co., Ltd. The surface resistance value of the surface of the agent layer (Ω/□).
<PET低聚物的溶出量的測定方法> 將利用上述操作得到的實施例1~4及比較例1~2的附有附間隔件之黏合劑層的光學薄膜在60℃、90%RH的條件下放置500小時之後,除去間隔件。從附黏合劑層之偏光薄膜採集黏合劑層(樣品)約0.025g,加入氯仿1ml並在室溫下振盪18小時,然後加入乙腈5ml進行萃取,並振盪3小時。利用0.45ml薄膜濾器將所得溶液過濾,對試樣進行調整。將三聚體的PET低聚物的標準品調整至一定濃度,製作校正曲線,並使用該校正曲線求出黏合劑中所含的PET低聚物量(ppm)。校正曲線是使用PET低聚物濃度(ppm)已知的樣品、利用HPLC進行測定而製作的。 HPLC裝置:Agilent Technologies製1200系列 測定條件 色譜柱:Agilent Technologies製ZORBAX SB-C18 柱溫:40℃ 柱流量:0.8ml/min 洗脫液組成:水/乙腈反相梯度條件 注入量:5μl 檢測器:PDA 定量方法:用氯仿溶解PET低聚物三聚體的標準試樣之後,用乙腈進行稀釋,以一定的濃度製備標樣。由其HPLC面積與製備濃度製作校正曲線,並求出樣品的PET低聚物的溶出量。 而且,PET低聚物的溶出量較佳為30ppm以下,更佳為20ppm以下,進一步更佳為10ppm以下。<Method for measuring the elution amount of PET oligomer> The optical films with spacer-attached adhesive layers of Examples 1 to 4 and Comparative Examples 1 to 2 obtained by the above operation were heated at 60°C and 90%RH After standing for 500 hours under the conditions, the spacer was removed. Collect about 0.025 g of the adhesive layer (sample) from the polarized film with the adhesive layer, add 1 ml of chloroform and shake at room temperature for 18 hours, then add 5 ml of acetonitrile for extraction and shake for 3 hours. The resulting solution was filtered using a 0.45ml membrane filter to adjust the sample. The trimer PET oligomer standard was adjusted to a certain concentration to create a calibration curve, and the calibration curve was used to determine the amount of PET oligomer (ppm) contained in the binder. The calibration curve was created by using a sample with a known PET oligomer concentration (ppm) and measuring by HPLC. HPLC device: 1200 series manufactured by Agilent Technologies Chromatographic column: ZORBAX SB-C18 manufactured by Agilent Technologies Column temperature: 40°C Column flow: 0.8ml/min Eluent composition: Water/acetonitrile reversed phase gradient conditions Injection volume: 5μl detector : PDA Quantitative method: After dissolving a standard sample of PET oligomer trimer in chloroform, dilute it with acetonitrile to prepare a standard sample at a certain concentration. A calibration curve was prepared from the HPLC area and preparation concentration, and the elution amount of the PET oligomer of the sample was obtained. Furthermore, the elution amount of the PET oligomer is preferably 30 ppm or less, more preferably 20 ppm or less, and still more preferably 10 ppm or less.
對利用上述操作得到的實施例1~4及比較例1~2的液晶顯示裝置進行以下的評價。將評價結果表示於表1中。 <白色不均的評價> 將利用上述操作得到的實施例1~4及比較例1~2的液晶顯示裝置設置於背光燈上。使手接觸所設置的液晶顯示裝置的端部,在液晶面板中產生白色不均。計測出該白色不均消失的時間。消失時間較佳為200秒以下,更佳為100秒以下,進一步更佳為50秒以下,特佳為20秒以下。The following evaluations were performed on the liquid crystal display devices of Examples 1 to 4 and Comparative Examples 1 and 2 obtained by the above operation. The evaluation results are shown in Table 1. <Evaluation of white unevenness> The liquid crystal display devices of Examples 1 to 4 and Comparative Examples 1 and 2 obtained by the above operation were installed on a backlight. When the hand touches the end of the installed liquid crystal display device, white unevenness occurs in the liquid crystal panel. The time until the white unevenness disappeared was measured. The disappearance time is preferably 200 seconds or less, more preferably 100 seconds or less, still more preferably 50 seconds or less, and particularly preferably 20 seconds or less.
[表1] [Table 1]
如表1所示,對於本發明的實施例1~4,在任意的評價項目中都得到良好的結果。另一方面,對於比較例1~2,在任意的評價項目中都得到比實施例1~4差的結果。由該結果可知,根據本發明,可以提供一種附間隔件之黏合劑層,其藉由抑制間隔件中使用的聚酯薄膜等基材薄膜中所含低聚物向黏合劑層溶出,可以防止由亮點造成的亮度不均等所致的液晶面板的不佳狀況,並且在液晶顯示裝置的製造時,即使應用上述的RTP貼合步驟,也可以抑制液晶面板的白色不均,此外還可以提供附有附間隔件之黏合劑層的光學薄膜。As shown in Table 1, for Examples 1 to 4 of the present invention, good results were obtained in any evaluation items. On the other hand, in Comparative Examples 1-2, results inferior to Examples 1-4 were obtained in any evaluation item. From this result, according to the present invention, it is possible to provide a spacer-attached adhesive layer, which can prevent elution of oligomers contained in a base film such as a polyester film used in the spacer to the adhesive layer. The poor condition of the liquid crystal panel caused by the uneven brightness caused by the bright spot, and in the manufacture of the liquid crystal display device, even if the above-mentioned RTP bonding step is applied, the white unevenness of the liquid crystal panel can be suppressed. In addition, additional accessories can be provided. Optical film with adhesive layer with spacers.
1‧‧‧間隔件
2‧‧‧附間隔件之黏合劑層
3‧‧‧附有附間隔件之黏合劑層的光學薄膜
4‧‧‧附黏合劑層之光學薄膜
5‧‧‧顯示面板
11‧‧‧基材薄膜
12‧‧‧脫模層
13‧‧‧低聚物防止層
14‧‧‧導電層
21‧‧‧黏合劑層
31‧‧‧光學薄膜
100‧‧‧剝離體
101‧‧‧黏貼位置
102‧‧‧接收輥
103‧‧‧黏貼輥1‧‧‧
圖1(a)、(b)是表示附間隔件之黏合劑層的構成例的示意性剖面圖。 圖2是表示附有附間隔件之黏合劑層的光學薄膜的構成例的示意性剖面圖。 圖3是說明影像顯示裝置的製造方法中的RTP貼合步驟的示意圖。Fig. 1 (a), (b) is a schematic cross-sectional view showing a configuration example of an adhesive layer with a spacer. Fig. 2 is a schematic cross-sectional view showing a configuration example of an optical film with a spacer-attached adhesive layer. 3 is a schematic diagram illustrating the RTP bonding step in the manufacturing method of the image display device.
1‧‧‧間隔件 1‧‧‧Spacer
2‧‧‧附間隔件之黏合劑層 2‧‧‧Adhesive layer with spacer
11‧‧‧基材薄膜 11‧‧‧Substrate film
12‧‧‧脫模層 12‧‧‧Release layer
13‧‧‧低聚物防止層 13‧‧‧Oligomer prevention layer
14‧‧‧導電層 14‧‧‧Conductive layer
21‧‧‧黏合劑層 21‧‧‧Adhesive layer
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| JP2015193282A JP6208728B2 (en) | 2015-09-30 | 2015-09-30 | Pressure-sensitive adhesive layer with separator, optical film with pressure-sensitive adhesive layer with separator, image display device, and manufacturing method thereof |
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| TW201726854A TW201726854A (en) | 2017-08-01 |
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| TW105131274A TWI716461B (en) | 2015-09-30 | 2016-09-29 | Spacer-attached adhesive layer, optical film with spacer-attached adhesive layer, image display device and manufacturing method thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6208728B2 (en) |
| KR (1) | KR102575111B1 (en) |
| CN (1) | CN106957610B (en) |
| TW (1) | TWI716461B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7161963B2 (en) | 2018-03-16 | 2022-10-27 | 日東電工株式会社 | Laminate for biosensor and biosensor |
| WO2019176839A1 (en) | 2018-03-16 | 2019-09-19 | 日東電工株式会社 | Biosensor laminate and biosensor |
| US20220350063A1 (en) * | 2021-04-29 | 2022-11-03 | Meta Platforms Technologies, Llc | High surface quality optical film |
| WO2022231825A1 (en) * | 2021-04-29 | 2022-11-03 | Meta Platforms Technologies, Llc | High surface quality optical film |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201726854A (en) | 2017-08-01 |
| KR20170038700A (en) | 2017-04-07 |
| JP2017066271A (en) | 2017-04-06 |
| JP6208728B2 (en) | 2017-10-04 |
| CN106957610B (en) | 2021-08-06 |
| CN106957610A (en) | 2017-07-18 |
| KR102575111B1 (en) | 2023-09-05 |
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