TW201350336A - Release film for adhesive film and adhesive film using the same - Google Patents

Abstract

The present invention provides a release film for an adhesive film for forming an adhesive film having less contamination to an adherend, and further, provides a release film for an adhesive film, and an adhesive film for a release film using the adhesive film, To form an adhesive film having excellent antistatic properties. The release film (5) for an adhesive film of the present invention can protect and release the adhesive layer (2) of the adhesive film, and the adhesive film has an adhesive layer (2) laminated on at least one side of the base film (1). Wherein the release agent layer (4) is laminated on at least one side of the resin film (3), and is adhered to the surface of the adhesive layer (2) via the release agent layer (4), the release agent The layer (4) contains a release agent containing dimethylpolysiloxane as a main component and a oxirane compound which is liquid at a temperature of 20 °C.

Description

Release film for adhesive film and adhesive film using the same

The present invention relates to a release film for an adhesive film which is attached to the surface of an adhesive layer of an adhesive film. More specifically, the present invention provides a release film for an adhesive film for achieving an adhesive film having less contamination to an adherend, and further, an adhesive film for providing an adhesive film having excellent antistatic properties. Release film.

A release film (also referred to as a "release film") has been used for various applications such as a protective film for protecting the surface of an adhesive layer. As a general use of the release film, for example, a release film is attached to an adhesive film having an adhesive layer formed on one side of a substrate, or bonded to a non-substrate adhesive layer for protecting an adhesive. Floor. The adhesive film of the release film is bonded to the adhesive layer, and is stored while maintaining the bonding state, thereby preventing the adhesive layer from being contaminated and the adhesive force being lowered.
Further, when the adhesive film is bonded to the adhesive film having the release film bonded thereto, the release film can be peeled off to expose the adhesive layer, and then bonded to another substrate or the like. The release film peeled off from the adhesive film is discarded.
Further, in an adhesive film in which an adhesive layer is formed on one surface of a substrate, a release agent is applied to one surface of the substrate to have a release function, and an adhesive is applied to the other surface of the substrate. After drying to form an adhesive layer, it may be wound into a roll as needed to save a release film.
Further, in the technical field of using a resin film laminate such as an optical film typified by a touch panel or a display, various adhesives are used when the resin film is bonded. Specifically, the polarizing plate is fixed to the liquid crystal panel by an adhesive layer; a plurality of optical films are bonded via an adhesive layer; and an optical film or the like is bonded using an adhesive layer such as glass or a resin plate. Further, the adhesive is also used for a protective film or a carrier film, not only for the purpose of permanently bonding the optical component, but also for the re-release type use of the optical component temporary surface protection application, the carrier application in the optical component manufacturing step, and the like. In the fit.
In such a technical field using an adhesive, as a protective use of the adhesive layer, a release film is used. In a typical release film, a release agent or the like is applied to at least one side of the substrate to form a release agent layer. As a property required for the release film, it is necessary to have a moderate release property, and even if it is attached to the adhesive layer, the adhesion is not lowered. In the release film using a silicone resin or the like as a release agent, when bonded to the adhesive layer, the epoxy resin is transferred to the surface of the adhesive layer, so that the adhesive force is lowered. Regarding the release film for reducing the transfer of the epoxy resin, various proposals have been made.
For example, in Patent Document 1 and Patent Document 2, a release film which reduces the transfer of the epoxy resin by defining the composition of the epoxy resin is proposed. Further, Patent Document 3 proposes a release film which reduces the transfer of the epoxy resin by providing an undercoat layer. Further, Patent Document 4 proposes a method in which an untreated surface of a polyester film is bonded to a release-treated surface of a release film, and then treated under a predetermined condition, and the surface of the treated polyester film is deuterated. Amount of release film.
As is clear from the contents described in Patent Document 1 to Patent Document 4, in the prior art, it has been proposed to reduce the component of the release agent from the release film to the bonding surface, and various components for reducing the release agent have been proposed. The plan for the joint transfer.
On the other hand, in the manufacturing step of the optical product, as the surface protective film for preventing damage or dirt adhesion, an adhesive film in which an adhesive layer is provided on one surface of the base film is generally used. This surface protective adhesive film is bonded to an optical film by an adhesive layer having a slight adhesive force. The reason why the adhesive layer having a microadhesive force is used is that when the surface protective film that has been used is removed from the surface of the optical film and removed, the release can be easily performed, and the adhesion and residue of the adhesive can be prevented. In the film product for optics as an adherend (so-called prevention of the generation of residual glue).
In recent years, in the production step of the liquid crystal display panel, the driving integrated circuit for controlling the liquid crystal display screen is used due to the release static voltage generated when the surface protective film attached to the optical film is removed and removed ( The phenomenon that the circuit components are damaged or the alignment of the liquid crystal molecules is damaged, although the number of occurrences is small, it is still occurring.
Further, in order to reduce the power consumption of the liquid crystal display panel, the driving voltage of the liquid crystal material becomes low. Accordingly, the breakdown voltage of the driving integrated circuit also becomes low. Recently, the static voltage control is also required to be in the range of +0.7 kV to -0.7 kV.
In order to prevent defects due to high release static voltage when removing the surface protective film from the optical film as the adherend, a surface protective film which is used for suppressing the lower static voltage is proposed. Adhesive layer of antistatic agent.
For example, Patent Document 5 discloses a surface protective film using an adhesive composed of an alkyltrimethylammonium salt, a hydroxyl group-containing acrylic polymer, and a polyisocyanate.
Further, Patent Document 6 discloses an adhesive composition comprising an ionic liquid and an acrylic polymer having an acid value of 1.0 or less, and an adhesive sheet using the adhesive composition.
Further, Patent Document 7 discloses an adhesive composition comprising an acrylic polymer, a polyether polyol compound, an alkali metal salt treated with an anion-adsorbing compound, and a surface protective film using the adhesive composition. .
Further, Patent Document 8 discloses a method of mixing a polyether-modified silicone in an adhesive layer of a surface protective film.
In the above-described Patent Documents 5 to 7, the antistatic agent is added to the inside of the adhesive layer, but the thickness of the adhesive layer becomes thicker, and the surface protection is applied with respect to the bonding. The amount of the antistatic agent that is transferred from the adhesive layer to the adherend is increased in the adherend of the film. Further, in the surface protective film used for an optical film such as a low-reflective (LR) polarizing plate or an anti-glare (AG)-low-reflecting polarizing plate, a cerium oxide compound or a fluorine compound is used. Since the surface of the optical film is subjected to an anti-pollution treatment, the release static voltage is increased when the surface protective film used for the optical film is released from the adherend.
Further, as described in Patent Document 8, when the polyether modified oxime resin is mixed in the adhesive layer, it is difficult to finely adjust the adhesion of the surface protective film. Further, since the polyether-modified oxime resin is mixed in the adhesive layer, if the conditions for applying/drying the adhesive composition on the substrate film are changed, the surface characteristics of the adhesive layer formed on the surface protective film Subtle changes have taken place. Further, from the viewpoint of protecting the surface of the film for optics, the thickness of the adhesive layer cannot be made extremely thin.
For this reason, it is necessary to increase the addition amount of the polyether modified oxirane resin mixed in the adhesive layer in accordance with the thickness of the adhesive layer. As a result, it is easy to cause contamination of the surface of the adherend, and the adhesion with time and the contamination of the adherend are changed. For this reason, an adhesive film as described below is required as an adhesive film for surface protection of an optical film such as a low-reflection polarizing plate or an anti-glare-low-reflecting polarizing plate, even if the surface of the optical film is passed through a silicone resin. The anti-pollution treatment by the compound or the fluorine compound can also suppress the release static voltage when the optical film is released from the optical film, and the contamination to the adherend is small.
CITATION LIST Patent Literature Patent Literature 1: JP-A-2009-214357, JP-A-2011-207197, JP-A-2011-246197, JP-A-2001-246698, Patent Document 4: JP-A-2004- Japanese Laid-Open Patent Publication No. 2005-330464 (Patent Document No. 2005-330476) Patent Document No. JP-A-2005-314476 (Patent Document No. JP-A-2009-275128) Bulletin

In order to solve the above problems, the inventors conducted intensive studies. Considering that the generated static voltage is larger as the triboelectric series of the overlapping substances is further away, therefore, it is attempted to form a surface of the frictional electric sequence and the optical film on the surface of the adhesive layer. Substance with similar materials.
As a result, it was found that the polyether-modified polysiloxane (s) was not mixed in the adhesive layer of the adhesive composition, but the adhesive composition was applied and dried to be laminated. After the agent layer, it is effective to adhere an appropriate amount of the polyether modified oxirane resin to the surface of the adhesive layer. Further, it has been found that when the adhesive layer which is in contact with the release agent layer is supplied to the adhesive layer which is in contact with the release agent layer in a necessary amount, it is possible to suppress the formation of the optical film from the above-mentioned form. The present invention has been completed in that the adhesive film of the adhesive layer has a low release static voltage and an adhesive film which is less contaminated by the adherend.
An object of the present invention is to provide a release film for an adhesive film for forming an adhesive film having less contamination to an adherend, and further to provide an adhesive film for forming an adhesive film having excellent antistatic properties. Type film.
In order to solve the above problems, the release film for an adhesive film of the present invention has a release agent layer laminated on at least one side of a substrate, and the release agent layer contains a release agent containing dimethyl polyoxymethane as a main component. And a silicone resin compound which is liquid at a temperature of 20 °C. The release film for an adhesive film of the present invention is bonded to the surface of the adhesive layer of the adhesive film via the release agent layer, whereby an appropriate amount of a silicone resin which is liquid at a temperature of 20 ° C is adhered to the surface of the adhesive layer. The compound suppresses the release static voltage from the adherend when the adhesive film is released.
In order to solve the above problems, the present invention provides a release film for an adhesive film which is capable of protecting the adhesive layer which is capable of protecting an adhesive film having an adhesive layer laminated on at least one side of a base film, and is capable of releasing the adhesive film. The release film is characterized in that a release agent layer is laminated on at least one side of the resin film, and is bonded to the surface of the adhesive layer via the release agent layer, and the release agent layer contains dimethyl A release agent having a polyoxyalkylene as a main component and a liquid epoxy resin at a temperature of 20 ° C.
Further, preferably, the above-mentioned epoxy resin compound is a polyether modified polyoxyalkylene.
Further, preferably, the above adhesive layer is composed of a (meth)acrylic polymer copolymerized with a compound containing a polyoxyalkylene group, or (meth) mixed with a compound containing a polyoxyalkylene group. It is composed of an acrylic polymer and contains an antistatic agent.
Further, preferably, the above antistatic agent is an alkali metal salt.
Further, the present invention provides an adhesive film to which the above-mentioned release film for an adhesive film is bonded.
Advantageous Effects of the Invention An adhesive film which is bonded to a surface of an adhesive layer by a release film for an adhesive film of the present invention is bonded to an adherend, and is adhered to the adhered body after being peeled off from the adhered body. Less pollution. Further, the adhesive film which is bonded to the surface of the adhesive layer by the release film of the adhesive film of the present invention can be separated from the adherend after being bonded to the adherend. The static voltage suppression is low, and an adhesive film having excellent antistatic properties can be obtained. Therefore, when the release film for an adhesive film of the present invention is used, the adhesive layer of the adhesive film can be effectively protected, and the adhesive film can be used as a surface protective film for the adherend.

1. . . Substrate film

2. . . Adhesive layer

3. . . Resin film

4. . . Release layer

5. . . Release film for adhesive film

7. . . a liquid oxygenated resin at 20 ° C

8. . . Adhesive body

10. . . Adhesive film with adhesive film for adhesive film

11. . . Peel off the adhesive film of the release film for the adhesive film

20. . . Adhesive body with adhesive film attached

Fig. 1 is a cross-sectional view showing a state in which a release film for an adhesive film of the present invention is bonded to an adhesive film.
Fig. 2 is a schematic cross-sectional view showing the state of the adhesive film of the release film for an adhesive film of the present invention, which is peeled off from the cross-sectional view shown in Fig. 1.
Fig. 3 is a cross-sectional view showing a state in which the adhesive film shown in Fig. 2 is attached to the adherend.

Hereinafter, the present invention will be described in detail based on the embodiments.
Fig. 1 is a cross-sectional view showing a state in which a release film for an adhesive film of the present invention is bonded to an adhesive film. The adhesive film 10 to which the release film for an adhesive film is bonded is formed by laminating an adhesive film and a release film 5 for an adhesive film which forms an adhesive on a single surface of the transparent base film 1. The release film 5 for the adhesive film is formed by forming the release agent layer 4 on the surface of the resin film 3.
The release film 5 for an adhesive film of the present invention has a release agent layer 4 formed on one surface of the resin film 3, and the release agent layer 4 uses a release agent containing dimethyl polyoxymethane as a main component and A mixture of liquid oxygenated resin compounds at a temperature of 20 ° C is formed. The resin film 3 may, for example, be a polyester film, a polyamide film, a polyethylene film, a polypropylene film or a polyimide film. However, in view of excellent transparency and relatively low cost, a polyester film is particularly preferable.
In addition, as a release agent containing dimethyl polysiloxane as a main component, a well-known epoxy resin type release agent, such as an addition reaction type, a condensation reaction type, a cationic polymerization type, and a radical polymerization type, etc. are mentioned. . As a commercially available product of an addition reaction type oxirane type release agent which can be usually obtained, KS-776A, KS-847T, KS-779H, KS-837, KS-778, KS-830 (Shin-Etsu Chemical) Industrial Co., Ltd.); SRX-211, SRX-345, SRX-357, SD7333, SD7220, SD7223, LTC-300B, LTC-350G, LTC-310 (manufactured by Toray Dow Corning Co., Ltd.). The commercially available product of the condensation reaction type may, for example, be SRX-290 or SYLOFF-23 (manufactured by Toray Dow Corning Co., Ltd.). The commercially available product of the cationic polymerization type may, for example, be TPR-6501, TPR-6500, UV9300, UV9315, UV9430 (manufactured by Momentive Advanced Materials Co., Ltd.) or X62-7622 (manufactured by Shin-Etsu Chemical Co., Ltd.). The commercially available product of the radical polymerization type may, for example, be X62-7205 (manufactured by Shin-Etsu Chemical Co., Ltd.).
Further, a release agent layer 4 containing dimethylpolysiloxane as a main component is formed on at least one surface of the resin film 3. The release agent layer 4 contains a silicone resin compound 7 which is liquid at a temperature of 20 °C. In order to easily transfer to the surface of the adhesive layer, it is important for the silicone resin to be liquid at a temperature of 20 °C. Further, in order to uniformly disperse into the release agent layer, an epoxy resin compound having a structure similar to that of a release agent containing dimethylpolysiloxane as a main component is preferable. Further, when an organic compound is used instead of the epoxy resin compound, the transferred component is easily agglomerated due to poor compatibility with the release agent, and it is easy to bond the adhesive layer to the adherend. Contamination of the adherend. The oxime resin compound 7 which is liquid at a temperature of 20 ° C is preferably a modified oxime resin compound, and examples thereof include a polyether modified polyoxy siloxane, an alkyl modified oxirane resin, and a methanol modified oxirane resin. Wait. In the present invention, in order to improve the antistatic property of the surface of the adhesive layer 2, it is liquid at a temperature of 20 ° C in a state of being dissolved in the release agent layer 4 containing dimethylpolysiloxane as a main component. Oxygenated resin compound 7. In view of the use of the present invention, it is preferred to use a polyether modified oxirane resin in the modified oxirane resin compound. The polyether chain in the polyether modified oxirane resin is composed of ethylene oxide (ethylene oxide, ethylene oxide), propylene oxide (propylene oxide, propylene oxide), etc., for example, by selecting a polyoxidation for a side chain. The molecular weight of the polyethylene oxide or the weight ratio of the polyoxyalkylene chain to adjust the physical properties such as the desired hydrophobicity.
Further, when a polyether-modified oxime resin is added to the adhesive layer of the adhesive film, the adherend is contaminated when the adhesive film is released from the adherend. For this reason, in the present invention, a polyether modified oxime resin is added to the release agent layer of the release film for an adhesive film.
In addition, as the polyether modified oxirane resin, a polyether modified dimethyl polyoxy siloxane, a polyether modified methyl alkyl polyoxy siloxane, a polyether modified methyl phenyl polyoxy siloxane, and a polyether modified methyl phenyl polyoxy siloxane are exemplified. Alkane, etc. As a commercial item of the polyether modified oxime resin, KF-351A, KF-352A, KF-353, KF-354L, KF-355A, KF-642 (made by Shin-Etsu Chemical Co., Ltd.); SH8400, SH8700, SF8410 (made by Toray Dow Corning Co., Ltd.); TSF-4440, TSF-4441, TSF-4445, TSF-4446, TSF-4450 (made by Momentive Advanced Materials); BYK-300, BYK-306, BYK -307, BYK-320, BYK-325, BYK-330 (manufactured by BYK Chemical Co., Ltd.), and the like.
The method of mixing the release agent containing dimethyl polysiloxane as a main component and the epoxy resin compound which is liquid at a temperature of 20 ° C, such as a polyether modified oxirane resin, is not particularly limited. As the mixing method, any one of the following methods may be employed: after adding and mixing a liquid epoxy resin compound at a temperature of 20 ° C in a release agent containing dimethyl polyoxyalkylene as a main component, a method of adding a catalyst for curing a release agent and mixing the mixture; and preliminarily diluting a release agent containing dimethyl polyoxyalkylene as a main component with an organic solvent, and then adding a liquid epoxy resin at a temperature of 20 ° C and A method of mixing and curing a catalyst for a release agent; after previously diluting a release agent containing dimethyl polyoxyalkylene as a main component with an organic solvent, adding a catalyst and mixing, and then adding a liquid which is liquid at a temperature of 20 ° C A method in which an oxygen-based compound is mixed and the like. Further, an adhesion enhancer such as a decane coupling agent may be added as needed.
The method of forming the release agent layer 4 on the resin film 3 of the release film 5 for an adhesive film of the present invention, and the method of bonding the adhesive film, may be exemplified by the following method and optionally: in the resin film 3 After coating the release agent composition for forming the release agent layer 4 and drying it to form the release agent layer 4, a method of bonding the adhesive film; and a release agent layer of the release film 5 for the adhesive film The surface of 4 is coated with an adhesive composition for forming the adhesive layer 2, and dried to form the adhesive layer 2, followed by a method of bonding the base film 1 and the like.
In the first embodiment, the release film 5 for an adhesive film in which the release agent layer 4 is laminated on one surface of the resin film 3 and the adhesive film on which the adhesive layer 2 is laminated on one surface of the base film 1 are shown. Examples of the combination are made, but the present invention is not limited to the above. The present invention is also applicable to a release film for an adhesive film in which a release agent layer is laminated on both surfaces of a resin film. In this case, it is also possible to bond only the one-side release agent layer to the adhesive layer of the adhesive film. Alternatively, the double-sided release agent layer may be attached to the adhesive layer of the adhesive film. Further, the present invention is also applicable to an adhesive film in which an adhesive layer is laminated on both surfaces of a base film. In this case, a separate release film for an adhesive film may be laminated on both surfaces of the adhesive layer. In addition, an adhesive film in which an adhesive layer is laminated on both surfaces of a base film and a release film in which a release agent layer is laminated on both surfaces of a resin film may be bonded together and wound into a roll ( Roll).
Further, the release agent layer 4 can be formed on the resin film 3 by a known method. Specifically, methods such as gravure coating, wire bar coating, and air knife coating can be used.
Similarly, the adhesive layer 2 can be formed on the surface of the base film 1 by a known method. Specifically, methods such as reverse coating, comma coating, gravure coating, slit extrusion coating, wire bar coating, air knife coating, and the like can be used.
A resin film having transparency and flexibility is used as the base film 1 for adhering the adhesive film of the release film 5 for an adhesive film of the present invention. Thereby, the visual inspection of the optical component can be performed in a state in which the adhesive film is bonded to the optical component as the adherend. As the base film 1, a polyester film is preferably used. In addition to the polyester film, other resin films may be used as long as it has the required strength and optical compatibility. The base film 1 may be an unstretched film, or may be a uniaxially stretched film or a biaxially stretched film. Further, the stretching ratio of the stretched film and the alignment angle in the axial direction formed by the crystallization of the stretched film may be controlled to specific values. The thickness of the base film 1 is not particularly limited, but is preferably, for example, a thickness of about 12 μm to 100 μm.
Further, the adhesive layer 2 used for the adhesive film is composed of a (meth)acrylic polymer copolymerized with a compound containing a polyoxyalkylene group or a compound containing a polyoxyalkylene group-containing compound (methyl group). An acrylic polymer is formed, and an adhesive for a curing agent or a thickener is added as needed. It is also possible to use copolymerization and mixing at the same time.
Further, examples of the (meth)acrylic polymer include a main monomer such as n-butyl acrylate, 2-ethylhexyl acrylate, isooctyl acrylate or isodecyl acrylate, and acrylonitrile or acetic acid. Copolymer monomer such as vinyl ester, methyl methacrylate or ethyl acrylate, acrylic acid, methacrylic acid, hydroxyethyl acrylate, hydroxybutyl acrylate, glycidyl methacrylate, N-methylol methacrylate A polymer in which a functional monomer such as an amine is copolymerized.
The polyoxyalkylene group-containing compound which can be copolymerized with the (meth)acrylic polymer is preferably a polyoxyalkylene group-containing (meth)acrylic monomer, and polyethylene glycol (400) is exemplified. Monoacrylate, polyethylene glycol (400) monomethacrylate, methoxy polyethylene glycol (400) acrylate, methoxy polyethylene glycol (400) methacrylate, polypropylene glycol (400) Monoacrylate, polypropylene glycol (400) monomethacrylate, methoxy polypropylene glycol (400) acrylate, methoxy polypropylene glycol (400) methacrylate, and the like. By copolymerizing these polyoxyalkylene group-containing monomers with a main monomer or a functional monomer of the above (meth)acrylic polymer, an adhesive composed of a polyoxyalkylene group-containing copolymer can be obtained.
The polyoxyalkylene group-containing compound which can be mixed with the (meth)acrylic polymer is preferably a polyoxyalkylene group-containing (meth)acrylic polymer, more preferably a polyoxyalkylene group (A) The polymer of the acrylic monomer may, for example, be polyethylene glycol (400) monoacrylate, polyethylene glycol (400) monomethacrylate, methoxy polyethylene glycol (400) acrylate, Methoxy polyethylene glycol (400) methacrylate, polypropylene glycol (400) monoacrylate, polypropylene glycol (400) monomethacrylate, methoxy polypropylene glycol (400) acrylate, methoxy polymerization A polymer such as propylene glycol (400) methacrylate. By mixing these polyoxyalkylene group-containing compounds with the above (meth)acrylic polymer, an adhesive to which a compound containing a polyoxyalkylene group is added can be obtained.
The curing agent to be added to the pressure-sensitive adhesive layer 2 may, for example, be an isocyanate compound, an epoxy compound, a melamine compound or a metal chelate compound. Further, examples of the tackifier include rosins, coumarone-quinones, terpenes, petroleums, and phenols.
An antistatic agent may also be mixed in the adhesive layer 2 as needed. As the antistatic agent, an antistatic agent having excellent dispersibility or compatibility with respect to the (meth)acrylic polymer is preferable. Specific examples of the antistatic agent that can be used include surfactants, ionic liquids, alkali metal salts, metal oxides, metal fine particles, conductive polymers, carbon, carbon nanotubes, etc., in consideration of transparency. An alkali metal salt is preferably used for the affinity for the (meth)acrylic polymer or the like.
The alkali metal salt may, for example, be a metal salt formed of lithium, sodium or potassium. Specifically, for example, a cation of Li ⁺ , Na ⁺ , K ⁺ and Cl ^- , Br ^- , I ^- , BF _{4 are} preferably used. ^- PF ₆ ^- , SCN ^- , ClO ₄ ^- , CF ₃ SO ₃ ^- , (CF ₃ SO ₂ ) ₂ N ^- , (C ₂ F ₅ SO ₂ ) ₂ N ^- , (CF ₃ SO ₂ ) ₃ C ^- The anion constitutes a metal salt. Among them, LiBr, LiI, LiBF ₄ , LiPF ₆ , LiSCN, LiClO ₄ , LICF ₃ SO ₃ , Li(CF ₃ SO ₂ ) ₂ N, Li(C ₂ F ₅ SO ₂ ) ₂ N, Li (CF) are particularly preferably used. ₃ SO ₂ ) ₃ C and other lithium salts. These alkali metal salts may be used singly or in combination of two or more. For the stabilization of the ionic substance, a compound containing a polyoxyalkylene structure may also be added.
The amount of the antistatic agent added to the base polymer such as a (meth)acrylic polymer varies depending on the type of the antistatic agent and the compatibility with the base polymer, and can be considered. It is set by the desired static voltage, adhesion to the adherend, adhesion characteristics, etc. when the body is adhered to the adhesive film.
In addition, the thickness of the adhesive layer 2 to be laminated on the base film 1 is not particularly limited, and is, for example, preferably about 5 μm to 40 μm, and more preferably about 10 μm to 30 μm. When the adhesive film has a micro-adhesive adhesive layer with a release strength of 0.03 N/25 mm to 0.3 N/25 mm with respect to the surface of the adherend, the release film for the adhesive film is peeled off from the adhesive film 5 The operability at the time of peeling off the adhesive film from the adherend is excellent, and it is preferable.
The surface potential of the adhesive film having the above-described configuration when it is released from the optical film as the adherend is preferably +0.7 kV to -0.7 kV. Further, the surface potential is more preferably +0.5 kV to -0.5 kV, and particularly preferably +0.1 kV to -0.1 kV. By increasing or decreasing the type or content of the antistatic agent contained in the adhesive layer, and the type and amount of the polyether modified epoxy resin contained in the release agent layer of the release film for the adhesive film, Adjust the above surface potential.
Fig. 2 is a schematic cross-sectional view showing the state of the adhesive film in which the release film for an adhesive film of the present invention is peeled off from the cross-sectional view shown in Fig. 1.
The adhesive film release film 5 is peeled off from the adhesive film of the release film for the adhesive film shown in Fig. 1 to be contained in the release agent layer 4 formed on the release film 5 for an adhesive film. A part of the liquid epoxy resin compound 7 at a temperature of 20 ° C adheres to the surface of the adhesive layer 2 of the adhesive film 10. Therefore, in the second drawing, the epoxy resin compound 7 which is liquid at a temperature of 20 ° C adhering to the surface of the adhesive layer 2 of the adhesive film is schematically shown using a spot.
In the release film for an adhesive film of the present invention, when the adhesive film 11 in the state of the release film for peeling off the adhesive film shown in Fig. 2 is attached to the adherend, it adheres to the surface of the adhesive layer 2. The epoxy resin compound 7 which is liquid at a temperature of 20 ° C is in contact with the surface of the adherend. Thereby, the release static voltage when the adhesive film is peeled off from the adherend can be suppressed to be low again.
Fig. 3 is a cross-sectional view showing a state in which the adhesive film shown in Fig. 2 is bonded to the adherend 8 .
The adhesive film 11 of the release film for an adhesive film 5 is peeled off from the adhesive film 10 to which the release film for an adhesive film 5 of the present invention is bonded, and is adhered by the adhesive layer 2 in a state where the adhesive layer 2 is exposed. On the optical component 8 as an adherend.
In other words, Fig. 3 shows a state in which the adhesive film of the release film 5 for an adhesive film of the present invention is finally bonded to the optical module 8. The optical component may be an optical film such as a polarizing plate, a phase difference plate, a lens film, a polarizing plate used for a phase difference plate, or a polarizing plate for a lens film. Such an optical component can be used as a constituent component of a liquid crystal display device such as a liquid crystal display panel or an optical device of various instruments. Further, examples of the optical component include an antireflection film, a hard coat film, and a transparent conductive film for a touch panel. In particular, it is preferably used as an adhesive film adhered to the surface of the optical film subjected to the anti-contamination treatment, which is a low-reflection treatment in which the surface is subjected to anti-pollution treatment by a cerium oxide compound or a fluorine compound. An optical film such as a polarizing plate (LR polarizing plate) or an anti-glare-low reflection-treated polarizing plate (AG-LR polarizing plate).

EXAMPLES Hereinafter, the present invention will be further described by way of examples.
Example 1
Adhesive film for release film production Addition reaction type oxime resin (manufactured by Toray Dow Corning Co., Ltd., trade name: SRX-345) 3 parts by weight, polyether modified oxime resin (Dongli Dao Kangning Co., Ltd. Company, trade name: SH8400) 0.1 parts by weight, 97 parts by weight of a 1:1 mixed solvent of toluene and ethyl acetate, and 0.03 parts by weight of a platinum catalyst (manufactured by Toray Dow Corning Co., Ltd., trade name: SRX-212). The coating used to form the release agent layer of Example 1 was blended. The coating material for the release agent layer of Example 1 was applied to the surface of polyethylene terephthalate having a thickness of 38 μm so that the thickness after drying became 0.1 μm, and 120 ° C was used. The hot air loop type oven was dried for 1 minute, whereby the release film for an adhesive film of Example 1 was obtained.

Preparation of Adhesive Composition In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen introduction tube, and a cooler, 90 parts by weight of 2-ethylhexyl acrylate and methoxypolyethylene glycol (400) were added. 10 parts by weight of acrylate, 3 parts by weight of 2-hydroxyethyl acrylate, 0.2 parts by weight of 2,2'-azobisisobutyronitrile as a polymerization initiator, and 154 parts by weight of ethyl acetate, stirred while introducing nitrogen gas The contents were heated to 65 °C. Further, the polymerization reaction was carried out for 6 hours at a temperature of about 65 ° C to produce an adhesive composition (solid content: 40%) of Example 1 composed of an acrylic acid polymer containing a polyoxyalkylene group.

In the production of the adhesive film to which the release film for an adhesive film is bonded, an HDI-based curing agent (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name: CORONATE (HY) HX) is added to 100 parts by weight of the adhesive composition of the first embodiment. 1.2 parts by weight and mixed to obtain a coating liquid. The surface of the polyethylene terephthalate film having a thickness of 38 μm was applied to the surface of the polyethylene terephthalate film having a thickness of 20 μm after drying, and then dried using a hot air loop oven at 100 ° C. Minutes, thereby forming an adhesive layer. Then, the release agent layer (the epoxy resin-treated surface) of the release film for an adhesive film of Example 1 produced above was bonded to the surface of the pressure-sensitive adhesive layer, whereby the adhesive film of Example 1 was bonded. Adhesive film of the release film.

Example 2
100 parts by weight of the pressure-sensitive adhesive composition of Example 1 and 0.1 parts by weight of lithium perchlorate as an antistatic agent were stirred and mixed to prepare an adhesive composition of Example 2 containing an antistatic agent. An adhesive film of the release film of the adhesive film of Example 2 was obtained in the same manner as in Example 1 except that the adhesive composition of Example 2 was used instead of the adhesive composition of Example 1. .

Example 3
100 parts by weight of the adhesive composition of Example 1 and 1.5 parts by weight of lithium bis(trifluoromethanesulfonate)imide as an antistatic agent were stirred and mixed to prepare an adhesive composition of Example 3 having an antistatic agent. Things. An adhesive film of the release film of the adhesive film of Example 3 was obtained in the same manner as in Example 1 except that the adhesive composition of Example 3 was used instead of the adhesive composition of Example 1. .

Example 4
Addition reaction type oxime resin (manufactured by Toray Dow Corning Co., Ltd., trade name: SRX-211) 3 parts by weight, polyether modified oxime resin (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KF352A) 0.1 parts by weight, 97 parts by weight of a 1:1 mixed solvent of toluene and ethyl acetate, and 0.03 parts by weight of a platinum catalyst (manufactured by Toray Dow Corning Co., Ltd., trade name: SRX-212) were stirred and mixed to prepare an example for formation. 4 coating of the release layer. The coating material for the release agent layer of Example 4 was applied to the surface of the polyethylene terephthalate film having a thickness of 38 μm so that the thickness after drying became 0.1 μm, and 120 ° C was used. The hot air loop type oven was dried for 1 minute, whereby the release film for an adhesive film of Example 4 was obtained.
The adhesive composition of Example 2 was used instead of the adhesive composition of Example 1, and the release film for an adhesive film of Example 4 was used instead of the release film for an adhesive film of Example 1. In the same manner as in Example 1, an adhesive film of the release film of the adhesive film of Example 4 was obtained.

Comparative example 1
A comparative example 1 was produced by the same method as in Example 1 except that butyl acrylate was used instead of the methoxypolyethylene glycol (400) monomethacrylate in the adhesive composition of Example 1. Adhesive composition (solid content 40%). An adhesive film of the release film of the adhesive film of Comparative Example 1 was obtained in the same manner as in Example 1 except that the adhesive composition of Comparative Example 1 was used instead of the adhesive composition of Example 1. .

Comparative example 2
100 parts by weight of the pressure-sensitive adhesive composition of Comparative Example 1 and 0.1 parts by weight of lithium perchlorate as an antistatic agent were stirred and mixed to prepare an adhesive composition of Comparative Example 2 containing an antistatic agent. An adhesive film of the release film of the adhesive film of Comparative Example 2 was obtained in the same manner as in Example 1 except that the adhesive composition of Comparative Example 2 was used instead of the adhesive composition of Example 1. .

Comparative example 3
The same procedure as in the production method of the release film for an adhesive film of Example 1 was carried out except that the polyether modified oxime resin (SH8400 manufactured by Toray Dow Corning Co., Ltd.) was not added in the production of the release film of Example 1. In the method, a release film for an adhesive film of Comparative Example 3 was obtained.
The adhesive composition of Example 2 was used instead of the adhesive composition of Example 1, and the release film for an adhesive film of Comparative Example 3 was used instead of the release film for an adhesive film of Example 1, In the same manner as in Example 1, an adhesive film of Comparative Example 3 to which a release film for an adhesive film was bonded was obtained.

Comparative example 4
100 parts by weight of the adhesive composition of Example 1, 1.5 parts by weight of lithium bis(trifluoromethanesulfonate)imide as an antistatic agent, and a polyether modified oxime resin (manufactured by Toray Dow Corning Co., Ltd., Name: SH8400) 0.1 part by weight of the mixture was stirred and mixed, and the adhesive composition of Comparative Example 4 was obtained. The adhesive composition of Comparative Example 4 was used instead of the adhesive composition of Example 1, and the release film for an adhesive film of Comparative Example 3 was used instead of the release film for an adhesive film of Example 1, In the same manner as in Example 1, an adhesive film of Comparative Example 4 to which a release film for an adhesive film was bonded was obtained.

Next, the method of evaluation test and the measurement result are shown.
The method of measuring the adhesive force of the adhesive film was carried out by bonding a AG-LR polarizing plate (anti-glare-low-reflecting polarizing plate) to the surface of the glass plate using a laminator. Then, the adhesive film with the adhesive film attached to the adhesive film was cut into a width of 25 mm, and adhered to the surface of the polarizing plate to peel off the adhesive film of the adhesive film for the adhesive film, and then at 23 ° C × 50% RH. Keep in a test environment for one day. Then, the strength when the adhesive film was released in a 180° direction at a release speed of 300 mm/min using a tensile tester was measured, and the strength thus measured was used as an adhesive force (N/25 mm).

The method of measuring the release static voltage of the adhesive film was carried out by using a laminator to bond an AG-LR polarizing plate (anti-glare-low-reflecting polarizing plate) to the surface of the glass plate. Then, the adhesive film with the adhesive film attached to the adhesive film was cut into a width of 25 mm, and adhered to the surface of the polarizing plate to peel off the adhesive film of the adhesive film for the adhesive film, and then at 23 ° C × 50% RH. Keep in a test environment for one day. Then, using a high-speed release tester (manufactured by TESTER SANGYOCO, LTD) to release the adhesive film at a release speed of 40 m per minute while using a surface potentiometer (Keyence Corporation) The surface potential of the surface of the polarizing plate was measured every 10 ms, and the maximum value of the absolute value of the surface potential at this time was taken as the release static voltage (kV).

In the method of confirming the surface contamination of the adhesive film, a light-shielding-low-reflection polarizing plate was bonded to the surface of the glass plate using a bonding machine. Then, the adhesive film with the adhesive film attached to the adhesive film was cut into a width of 25 mm, and adhered to the surface of the polarizing plate to peel off the adhesive film of the adhesive film for the adhesive film, and then at 23 ° C × 50% RH. Store in the test environment for 3 days and 30 days. Then, the adhesive film was peeled off, and the contamination of the surface of the polarizing plate was observed by the naked eye. As a criterion for determining the surface contamination property, the case where the contamination was not transferred to the polarizing plate was marked as "○", and the case where the contamination was transferred to the polarizing plate was marked as "x".

In the method of measuring the surface resistivity of the adhesive, the release film for the adhesive film was peeled off from the adhesive film, and a resistivity meter (manufactured by Mitsubishi Chemical Corporation, trade name: Hiresta) was used under the conditions of an applied voltage of 100 V × measurement time of 30 seconds. -(ハイレスタ)-UP) to determine the surface resistivity (Ω/□) of the adhesive layer.
The measurement results of the adhesive films of the obtained release film of the adhesive film of Example 1 to Example 4 and Comparative Example 1 to Comparative Example 4 are shown in Tables 1 and 2. Wherein "2EHA" means 2-ethylhexyl acrylate, "#400G" means methoxypolyethylene glycol (400) monomethacrylate, "HEA" means 2-hydroxyethyl acrylate, "BA" Represents butyl acrylate, "LiClO ₄ " represents lithium perchlorate, and "Li(CF ₃ SO ₂ ) ₂ N" represents lithium bis(trifluoromethanesulfonate) imide.
Table 1

Table 2


From the measurement results shown in Tables 1 and 2, the following can be known.
In the first to fourth embodiments of the present invention, the adhesive film to which the release film for an adhesive film is bonded has an appropriate adhesive force, and has little contamination to the surface of the adhered body, and is separated from the adhered body by the adhesive film. The static voltage is low.
On the other hand, in the adhesive film in which the release film for an adhesive film was bonded to Comparative Example 1 and Comparative Example 2, since the adhesive layer did not contain a compound containing a polyoxyalkylene group, the adhesive layer was released from the adherend. The release static voltage at the time of the film is high, and the contamination of the adherend is much after the release.
Further, in the adhesive film of the comparative example 3 to which the release film for an adhesive film was bonded, the polyether-modified silicone resin was not added to the release agent layer of the release film for the adhesive film, and only the dimethyl group was used. A release agent containing polyoxyalkylene as a main component. However, in Comparative Example 3, since the release static voltage is high when the adhesive film is released from the adherend, there is a fear that the integrated integrated circuit is broken and the alignment of the liquid crystal molecules is damaged.
Further, in the adhesive film to which the release film for an adhesive film was bonded in Comparative Example 4, the polyether-modified silicone resin was not added to the release agent layer of the release film for the adhesive film, but was added to the adhesive layer. Polyether modified oxirane resin. However, in Comparative Example 4, the release static voltage at the time of releasing the adhesive film from the adherend was low, but the contamination of the adherend was increased.
Industrial Applicability The release film for an adhesive film of the present invention can be bonded to protect the optical component, etc., in a production process such as an optical film such as a polarizing plate, a retardation film, or a lens film, or the like. The surface of the adhesive film is used as an adhesive layer. In particular, it can be used when it is used as an adhesive film for surface protection of an optical film such as a low-reflection polarizing plate or an anti-glare-low-reflecting polarizing plate which has been subjected to anti-pollution treatment on the surface by a silicone resin compound or a fluorine compound. Effect.
Further, the release film for an adhesive film according to the present invention can reduce the amount of static electricity generated when the adhesive film is released from the adhesive body to protect the adhesive layer of the adhesive layer, and the time-dependent change of the release-proof electrostatic property and adhesion to the film can be adhered. The body is less polluted, reliably protecting the surface of the optical component and increasing the yield of the production steps.

1. . . Substrate film

2. . . Adhesive layer

3. . . Resin film

4. . . Release layer

5. . . Release film for adhesive film

7. . . a liquid oxygenated resin at 20 ° C

10. . . Adhesive film with adhesive film for adhesive film

Claims (7)

A release film for an adhesive film, which is a pressure-sensitive adhesive layer capable of protecting and releasing a pressure-sensitive adhesive film, wherein the adhesive film is a release film for an adhesive film adhered to at least one surface of a base film by an adhesive layer. among them,
Forming a release agent layer on at least one side of the resin film, and bonding the release agent layer to the surface of the adhesive layer via the release agent layer,
The release agent layer contains a release agent containing dimethyl polysiloxane as a main component and a oxirane compound which is liquid at a temperature of 20 °C. The release film for an adhesive film according to claim 1, wherein the oxime resin compound is a polyether modified oxime resin. The release film for an adhesive film according to claim 1 or 2, wherein the adhesive layer is composed of a (meth)acrylic polymer copolymerized with a compound containing a polyoxyalkylene group, or It is composed of a (meth)acrylic polymer in which a compound containing a polyoxyalkylene group is mixed, and contains an antistatic agent. The release film for an adhesive film according to claim 3, wherein the antistatic agent is an alkali metal salt. An adhesive film which is bonded to a release film for an adhesive film as described in claim 1 or 2. An adhesive film which is bonded to a release film for an adhesive film according to claim 3 of the patent application. An adhesive film to which a release film for an adhesive film as described in claim 4 of the patent application is attached.