TWI712671B - 具有磁性之2-氰基丙烯酸酯(鹽)類組成物 - Google Patents
具有磁性之2-氰基丙烯酸酯(鹽)類組成物 Download PDFInfo
- Publication number
- TWI712671B TWI712671B TW104132738A TW104132738A TWI712671B TW I712671 B TWI712671 B TW I712671B TW 104132738 A TW104132738 A TW 104132738A TW 104132738 A TW104132738 A TW 104132738A TW I712671 B TWI712671 B TW I712671B
- Authority
- TW
- Taiwan
- Prior art keywords
- cyanoacrylate
- stainless steel
- salt
- weight
- aforementioned
- Prior art date
Links
- IJVRPNIWWODHHA-UHFFFAOYSA-N 2-cyanoprop-2-enoic acid Chemical compound OC(=O)C(=C)C#N IJVRPNIWWODHHA-UHFFFAOYSA-N 0.000 title claims abstract description 87
- 239000000203 mixture Substances 0.000 title claims abstract description 72
- 150000003839 salts Chemical class 0.000 title claims abstract description 43
- 230000005291 magnetic effect Effects 0.000 title claims abstract description 18
- 239000006247 magnetic powder Substances 0.000 claims abstract description 43
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 61
- 229910001220 stainless steel Inorganic materials 0.000 claims description 44
- 239000010935 stainless steel Substances 0.000 claims description 30
- 239000000377 silicon dioxide Substances 0.000 claims description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 229910000859 α-Fe Inorganic materials 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 229910021485 fumed silica Inorganic materials 0.000 claims description 11
- 239000011572 manganese Substances 0.000 claims description 8
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052717 sulfur Inorganic materials 0.000 claims description 7
- 239000011593 sulfur Substances 0.000 claims description 7
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052748 manganese Inorganic materials 0.000 claims description 6
- 229910000734 martensite Inorganic materials 0.000 claims description 5
- 238000004881 precipitation hardening Methods 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 239000012808 vapor phase Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 9
- 230000005389 magnetism Effects 0.000 abstract description 7
- -1 2-Cyanoacrylate ester Chemical class 0.000 description 46
- 239000002245 particle Substances 0.000 description 17
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 14
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 11
- 238000003860 storage Methods 0.000 description 11
- 230000002209 hydrophobic effect Effects 0.000 description 10
- 229910002012 Aerosil® Inorganic materials 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 7
- 229920000858 Cyclodextrin Polymers 0.000 description 6
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 239000004014 plasticizer Substances 0.000 description 6
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000004381 surface treatment Methods 0.000 description 6
- 239000011651 chromium Substances 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 239000003381 stabilizer Substances 0.000 description 5
- 239000002562 thickening agent Substances 0.000 description 5
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 4
- LJSAJMXWXGSVNA-UHFFFAOYSA-N a805044 Chemical compound OC1=CC=C(O)C=C1.OC1=CC=C(O)C=C1 LJSAJMXWXGSVNA-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 150000003983 crown ethers Chemical class 0.000 description 4
- 229940079877 pyrogallol Drugs 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 229910001566 austenite Inorganic materials 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- HFHDHCJBZVLPGP-UHFFFAOYSA-N schardinger α-dextrin Chemical compound O1C(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(O)C2O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC2C(O)C(O)C1OC2CO HFHDHCJBZVLPGP-UHFFFAOYSA-N 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- XQQZRZQVBFHBHL-UHFFFAOYSA-N 12-crown-4 Chemical compound C1COCCOCCOCCO1 XQQZRZQVBFHBHL-UHFFFAOYSA-N 0.000 description 2
- OAJNZFCPJVBYHB-UHFFFAOYSA-N 2,5,8,11-tetraoxabicyclo[10.4.0]hexadeca-1(16),12,14-triene Chemical compound O1CCOCCOCCOC2=CC=CC=C21 OAJNZFCPJVBYHB-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 description 2
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 2
- QZCLKYGREBVARF-UHFFFAOYSA-N Acetyl tributyl citrate Chemical compound CCCCOC(=O)CC(C(=O)OCCCC)(OC(C)=O)CC(=O)OCCCC QZCLKYGREBVARF-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 2
- 229920001651 Cyanoacrylate Polymers 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- UDSFAEKRVUSQDD-UHFFFAOYSA-N Dimethyl adipate Chemical compound COC(=O)CCCCC(=O)OC UDSFAEKRVUSQDD-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- VTJUKNSKBAOEHE-UHFFFAOYSA-N calixarene Chemical compound COC(=O)COC1=C(CC=2C(=C(CC=3C(=C(C4)C=C(C=3)C(C)(C)C)OCC(=O)OC)C=C(C=2)C(C)(C)C)OCC(=O)OC)C=C(C(C)(C)C)C=C1CC1=C(OCC(=O)OC)C4=CC(C(C)(C)C)=C1 VTJUKNSKBAOEHE-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- YSSSPARMOAYJTE-UHFFFAOYSA-N dibenzo-18-crown-6 Chemical compound O1CCOCCOC2=CC=CC=C2OCCOCCOC2=CC=CC=C21 YSSSPARMOAYJTE-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- QMLGNDFKJAFKGZ-UHFFFAOYSA-N dicyclohexano-24-crown-8 Chemical compound O1CCOCCOCCOC2CCCCC2OCCOCCOCCOC2CCCCC21 QMLGNDFKJAFKGZ-UHFFFAOYSA-N 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- JQCXWCOOWVGKMT-UHFFFAOYSA-N diheptyl phthalate Chemical compound CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 2
- ALOUNLDAKADEEB-UHFFFAOYSA-N dimethyl sebacate Chemical compound COC(=O)CCCCCCCCC(=O)OC ALOUNLDAKADEEB-UHFFFAOYSA-N 0.000 description 2
- 229960001826 dimethylphthalate Drugs 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000005294 ferromagnetic effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 125000001165 hydrophobic group Chemical group 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000005055 methyl trichlorosilane Substances 0.000 description 2
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000005049 silicon tetrachloride Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- PZTAGFCBNDBBFZ-UHFFFAOYSA-N tert-butyl 2-(hydroxymethyl)piperidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCCCC1CO PZTAGFCBNDBBFZ-UHFFFAOYSA-N 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- WEAPVABOECTMGR-UHFFFAOYSA-N triethyl 2-acetyloxypropane-1,2,3-tricarboxylate Chemical compound CCOC(=O)CC(C(=O)OCC)(OC(C)=O)CC(=O)OCC WEAPVABOECTMGR-UHFFFAOYSA-N 0.000 description 2
- UFTFJSFQGQCHQW-UHFFFAOYSA-N triformin Chemical compound O=COCC(OC=O)COC=O UFTFJSFQGQCHQW-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VFTFKUDGYRBSAL-UHFFFAOYSA-N 15-crown-5 Chemical compound C1COCCOCCOCCOCCO1 VFTFKUDGYRBSAL-UHFFFAOYSA-N 0.000 description 1
- XEZNGIUYQVAUSS-UHFFFAOYSA-N 18-crown-6 Chemical compound C1COCCOCCOCCOCCOCCO1 XEZNGIUYQVAUSS-UHFFFAOYSA-N 0.000 description 1
- UXWKDYXFUUBISW-UHFFFAOYSA-N 2,2-dimethyl-1,3,6,9-tetraoxa-2-silacycloundecane Chemical compound C[Si]1(C)OCCOCCOCCO1 UXWKDYXFUUBISW-UHFFFAOYSA-N 0.000 description 1
- AXWCVSOBRFLCJG-UHFFFAOYSA-N 2,5,12,15,22,25-hexaoxatetracyclo[24.4.0.06,11.016,21]triaconta-1(30),6,8,10,16,18,20,26,28-nonaene Chemical compound O1CCOC2=CC=CC=C2OCCOC2=CC=CC=C2OCCOC2=CC=CC=C21 AXWCVSOBRFLCJG-UHFFFAOYSA-N 0.000 description 1
- DSFHXKRFDFROER-UHFFFAOYSA-N 2,5,8,11,14,17-hexaoxabicyclo[16.4.0]docosa-1(22),18,20-triene Chemical compound O1CCOCCOCCOCCOCCOC2=CC=CC=C21 DSFHXKRFDFROER-UHFFFAOYSA-N 0.000 description 1
- CUEJHYHGUMAGBP-UHFFFAOYSA-N 2-[2-(1h-indol-5-yl)phenyl]acetic acid Chemical compound OC(=O)CC1=CC=CC=C1C1=CC=C(NC=C2)C2=C1 CUEJHYHGUMAGBP-UHFFFAOYSA-N 0.000 description 1
- DINZWXZHWUFYKI-UHFFFAOYSA-N 2-cyanoprop-2-enoic acid Chemical compound C(#N)C(C(=O)O)=C.C(#N)C(C(=O)O)=C DINZWXZHWUFYKI-UHFFFAOYSA-N 0.000 description 1
- UADWUILHKRXHMM-UHFFFAOYSA-N 2-ethylhexyl benzoate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1 UADWUILHKRXHMM-UHFFFAOYSA-N 0.000 description 1
- 229940106004 2-ethylhexyl benzoate Drugs 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- SVJYFWHFQPBIOY-UHFFFAOYSA-N 7,8,16,17-tetrahydro-6h,15h-dibenzo[b,i][1,4,8,11]tetraoxacyclotetradecine Chemical compound O1CCCOC2=CC=CC=C2OCCCOC2=CC=CC=C21 SVJYFWHFQPBIOY-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 229920001450 Alpha-Cyclodextrin Polymers 0.000 description 1
- KZMGYPLQYOPHEL-UHFFFAOYSA-N Boron trifluoride etherate Chemical compound FB(F)F.CCOCC KZMGYPLQYOPHEL-UHFFFAOYSA-N 0.000 description 1
- BTXKAKVDXACXPH-UHFFFAOYSA-N C(C)C(CC1=C(C(=O)O)C=CC=C1)CCCC.C(C1=CC=CC=C1)(=O)OCC(CCCC)CC Chemical compound C(C)C(CC1=C(C(=O)O)C=CC=C1)CCCC.C(C1=CC=CC=C1)(=O)OCC(CCCC)CC BTXKAKVDXACXPH-UHFFFAOYSA-N 0.000 description 1
- LTLRVQDQJBHFRZ-UHFFFAOYSA-N C(CCCCCC(C)C)C1=CC(=C(C=C1C(=O)O)C(=O)O)CCCCCCC(C)C.C(C1=CC(C(=O)O)=CC=C1)(=O)O Chemical compound C(CCCCCC(C)C)C1=CC(=C(C=C1C(=O)O)C(=O)O)CCCCCCC(C)C.C(C1=CC(C(=O)O)=CC=C1)(=O)O LTLRVQDQJBHFRZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- KCXZNSGUUQJJTR-UHFFFAOYSA-N Di-n-hexyl phthalate Chemical compound CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCC KCXZNSGUUQJJTR-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- VIZORQUEIQEFRT-UHFFFAOYSA-N Diethyl adipate Chemical group CCOC(=O)CCCCC(=O)OCC VIZORQUEIQEFRT-UHFFFAOYSA-N 0.000 description 1
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- VAUCILWNLYXVIS-UHFFFAOYSA-N [dimethyl-(trimethylsilylamino)silyl]methane Chemical compound C[Si](C)(C)N[Si](C)(C)C.C[Si](C)(C)N[Si](C)(C)C VAUCILWNLYXVIS-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- FNEPSTUXZLEUCK-UHFFFAOYSA-N benzo-15-crown-5 Chemical compound O1CCOCCOCCOCCOC2=CC=CC=C21 FNEPSTUXZLEUCK-UHFFFAOYSA-N 0.000 description 1
- UADWUILHKRXHMM-ZDUSSCGKSA-N benzoflex 181 Natural products CCCC[C@H](CC)COC(=O)C1=CC=CC=C1 UADWUILHKRXHMM-ZDUSSCGKSA-N 0.000 description 1
- BCSGAWBQJHXXSE-UHFFFAOYSA-N bis(11-methyldodecyl) benzene-1,2-dicarboxylate Chemical compound CC(C)CCCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCCCC(C)C BCSGAWBQJHXXSE-UHFFFAOYSA-N 0.000 description 1
- FZMLAKOUUYUIOD-UHFFFAOYSA-N bis(2-ethylhexyl) 1,2,2-trimethylcyclopentane-1,3-dicarboxylate Chemical compound CCCCC(CC)COC(=O)C1CCC(C)(C(=O)OCC(CC)CCCC)C1(C)C FZMLAKOUUYUIOD-UHFFFAOYSA-N 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- RSRICHZMFPHXLE-AATRIKPKSA-N bis(2-methylpropyl) (e)-but-2-enedioate Chemical compound CC(C)COC(=O)\C=C\C(=O)OCC(C)C RSRICHZMFPHXLE-AATRIKPKSA-N 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- GQPLZGRPYWLBPW-UHFFFAOYSA-N calix[4]arene Chemical compound C1C(C=2)=CC=CC=2CC(C=2)=CC=CC=2CC(C=2)=CC=CC=2CC2=CC=CC1=C2 GQPLZGRPYWLBPW-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000002603 chloroethyl group Chemical group [H]C([*])([H])C([H])([H])Cl 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 150000001923 cyclic compounds Chemical class 0.000 description 1
- 229940097362 cyclodextrins Drugs 0.000 description 1
- MXCSCGGRLMRZMF-UHFFFAOYSA-N dibenzo-30-crown-10 Chemical compound O1CCOCCOCCOCCOC2=CC=CC=C2OCCOCCOCCOCCOC2=CC=CC=C21 MXCSCGGRLMRZMF-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 229940014772 dimethyl sebacate Drugs 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- OEIWPNWSDYFMIL-UHFFFAOYSA-N dioctyl benzene-1,4-dicarboxylate Chemical compound CCCCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCCC)C=C1 OEIWPNWSDYFMIL-UHFFFAOYSA-N 0.000 description 1
- VBZDYERVMPSZPG-UHFFFAOYSA-N dipentadecyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCCCCCCCC VBZDYERVMPSZPG-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 125000006232 ethoxy propyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- XWHPIFXRKKHEKR-UHFFFAOYSA-N iron silicon Chemical compound [Si].[Fe] XWHPIFXRKKHEKR-UHFFFAOYSA-N 0.000 description 1
- 125000006229 isopropoxyethyl group Chemical group [H]C([H])([H])C([H])(OC([H])([H])C([H])([H])*)C([H])([H])[H] 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910001105 martensitic stainless steel Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910001172 neodymium magnet Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- SQGOMFWCSGKGEP-UHFFFAOYSA-N propan-2-yl 2-cyanoprop-2-enoate Chemical compound CC(C)OC(=O)C(=C)C#N SQGOMFWCSGKGEP-UHFFFAOYSA-N 0.000 description 1
- 125000006233 propoxy propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])OC([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000006225 propoxyethyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- 125000005767 propoxymethyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])[#8]C([H])([H])* 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- XQQWBPOEMYKKBY-UHFFFAOYSA-H trimagnesium;dicarbonate;dihydroxide Chemical compound [OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[O-]C([O-])=O.[O-]C([O-])=O XQQWBPOEMYKKBY-UHFFFAOYSA-H 0.000 description 1
- 238000006227 trimethylsilylation reaction Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/28—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder dispersed or suspended in a bonding agent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/30—Nitriles
- C08F222/32—Alpha-cyano-acrylic acid; Esters thereof
- C08F222/322—Alpha-cyano-acrylic acid ethyl ester, e.g. ethyl-2-cyanoacrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J135/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J135/04—Homopolymers or copolymers of nitriles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/0302—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity characterised by unspecified or heterogeneous hardness or specially adapted for magnetic hardness transitions
- H01F1/0306—Metals or alloys, e.g. LAVES phase alloys of the MgCu2-type
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Soft Magnetic Materials (AREA)
- Paints Or Removers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
提供具有磁性的單液常溫硬化型的2-氰基丙烯酸酯(鹽)類組成物。
含有2-氰基丙烯酸酯(a)、和可以分散在前述2-氰基丙烯酸酯內的磁性粉末(b);前述磁性粉末(b)的含量,相對於前述2-氰基丙烯酸酯(a)為100重量部分,係5~500重量部分,以此為特徵之具有磁性的2-氰基丙烯酸酯(鹽)類組成物。
Description
本發明係有關於2-氰基丙烯酸酯(2-Cyanoacrylate ester)以及含有磁性粉末的2-氰基丙烯酸酯(鹽)類(2-Cyanoacrylate)組成物(compopsition)。
含有2-氰基丙烯酸酯(2-Cyanoacrylate ester)的2-氰基丙烯酸酯(鹽)類組成物,由於其陰離子聚合性(anionic polymerization),靠著附在被黏物體表面的些許水分等的微弱陰離子而起始聚合,可以在很短時間內就牢固黏合各種材料;因此,作為所謂的瞬間黏著劑,可以廣泛應用在工業、醫療及家庭等領域。過去,為了在2-氰基丙烯酸酯(鹽)類組成物內賦予所預期的功能,調配了安定劑、促硬劑、增稠劑、和塑化劑等各類成分,但是因為前述陰離子聚合性的緣故,能夠調配的成分就受到限制。因此,為了使黏合部份具有磁性,例如專利文獻1所示,就必須預先在該黏合部分充填磁性粉末,其上再塗覆2-氰基丙烯酸酯(鹽)類組成物,將被黏物固定。
另一方面,作為具有磁性的黏著劑組成物,從過去就已經有各種黏著劑組成物被提案出來,被應用於為了在電子零件等的黏合部分處賦予磁性等;舉例來說,專利文獻2所揭示之環氧樹脂內調配鐵(Fe)、和鐵-矽(Fe
-Si)等的強磁性粉末的強磁性黏著劑;又,專利文獻3中揭示:由二種液體作成之丙烯酸類黏著劑的其中一者液體中,調配鐵粉等強磁性粉末的黏著劑組成物;再者,專利文獻4中揭示:熱硬化型(thermal cured)矽膠(silicone)樹脂、環氧(epoxy)樹脂、濕態硬化型(Moisture Cured)樹脂、壓克力(acrylyl)樹脂、紫外線硬化型樹脂之至少一種、和錳鋅鐵氧體(Mn-Zn ferrite)磁性粉末所作成之磁性黏著劑。
【專利文獻1】特開昭58-215476號公報
【專利文獻2】特開平1-289883號公報
【專利文獻3】特開昭59-91165號公報
【專利文獻4】特開平8-120234號公報
但是,專利文獻1的固定方法中,必須將磁性粉末和2-氰基丙烯酸酯(鹽)類組成物分別塗覆,操作方式不理想之外,還有垂直壁面等處無法填充磁性粉末的問題。專利文獻2~4所揭示之環氧樹脂、壓克力樹脂等等,因為是二液硬化型,必須要有混合作業;又,專利文獻4所揭示之熱硬化型矽
膠(silicone)樹脂、或紫外線硬化型樹脂,則又必須要有加熱裝置或紫外線照射裝置;專利文獻4中,雖然也記載濕態硬化型(moisture cured)樹脂,但關於適用於2-氰基丙烯酸酯(鹽)類組成物的磁性粉末,卻未有任何揭示。
本發明,係有鑑於前述之過去情況而做出之物,以提供具有磁性的單液常溫硬化型的2-氰基丙烯酸酯(鹽)類組成物作為目的。
本發明之發明人團隊,藉由在2-氰基丙烯酸酯中調配特定的磁性粉末,作出貯存穩定性良好的2-氰基丙烯酸酯(鹽)類組成物,因此完成本發明。
亦即,依據本發明的一個面向,本發明係提供具有磁性的2-氰基丙烯酸酯(鹽)類組成物,其中含有2-氰基丙烯酸酯(a)、和可以分散在前述2-氰基丙烯酸酯內的磁性粉末(b);前述磁性粉末(b)的含量,相對於前述2-氰基丙烯酸酯(a)為100重量部分,係5~500重量部分。
依據本發明的理想態樣,前述磁性粉末(b)係不鏽鋼(stainless steel)。
依據本發明的其他理想態樣,前述不鏽鋼係選自馬氏體不鏽鋼(martensite stainless steel)、鐵氧體不鏽鋼(ferrite stainless steel)、奧氏體.鐵氧體複式不鏽鋼(austenite-ferrite duplex stainless steels)、和析出硬化不鏽鋼
(precipitation hardening stainless steels)所成群類中至少一種。
依據本發明的又更其他理想態樣,前述不鏽鋼的體積基準的平均粒徑(median size),係1~200微米(μm)。
依據本發明的又更其他理想態樣,前述具有磁性的2-氰基丙烯酸酯(鹽)類組成物,更進一步含有氣相二氧化矽(fumed silica);前述氣相二氧化矽的含量,相對於前述2-氰基丙烯酸酯(a)為100重量部分,係1~30重量部分。
本發明之2-氰基丙烯酸酯(鹽)類組成物,因為含有2-氰基丙烯酸酯和特定的磁性粉末,因此製造時的穩定性以及貯存穩定性都良好。又,前述磁性粉末矽特定不鏽鋼的情形時,可以作成製造時的穩定性以及貯存穩定性更優越的2-氰基丙烯酸酯(鹽)類組成物。2-氰基丙烯酸酯(鹽)類組成物又更進而含有氣相二氧化矽的情形時,可以防止磁性粉末的沉降。使用這種具有磁性的2-氰基丙烯酸酯(鹽)類組成物就可以在各種各樣被黏物處極為簡單地作成磁性部份。
以下,詳細說明本發明之2-氰基丙烯酸酯(鹽)類組成物相關內容。本發
明之2-氰基丙烯酸酯(鹽)類組成物包含2-氰基丙烯酸酯(a),和可以分散在前述2-氰基丙烯酸酯內的磁性粉末(b),前述磁性粉末(b)的含量,相對於前述2-氰基丙烯酸酯(a)為100重量部分,係5~500重量部分。
作為前述「2-氰基丙烯酸酯(a)」,只要是一般使用在這種2-氰基丙烯酸酯(鹽)類組成物中的2-氰基丙烯酸酯就可以,沒有特別的限制。作為此種2-氰基丙烯酸酯,可以列舉使用的有:2-氰基丙烯酸的甲基、乙基、氯乙基(chloroethyl)、正-丙基(n-propyl)、異-丙基(i-propyl)、烯丙基(allyl)、炔丙基(propargyl)、正-丁基(n-butyl)、異-丁基(i-butyl)、正-戊基(n-pentyl)、正-己基(n-hexyl)、環己基(cyclohexyl)、苯基(phenyl)、四氫呋喃基(tetrahydrofurfuryl)、庚基(heptyl)、2-乙基己基(2-ethylhexyl)、正-辛基(n-octyl)、2-辛基(2-octyl)、正-壬基(n-nonyl)、氧基壬基(oxononyl)、正-癸基(n-decyl)、正-十二烷基(n-dodecyl)、甲氧基乙基(methoxyethyl)、甲氧基丙基、甲氧基異丙基、甲氧基丁基、乙氧基乙基(ethoxyethyl)、乙氧基丙基、乙氧基異丙基、丙氧基甲基(propoxymethyl)、丙氧基乙基、異丙氧基乙基、丙氧基丙基、丁氧基甲基(butoxymethyl)、丁氧基乙基、丁氧基丙基、丁氧基異丙基、丁氧基丁基、2,2,2-三氟乙基(2,2,2-trifluoroethyl)和六氟異丙基(hexafluoro isopropyl)等的酯類。
這些2-氰基丙烯酸酯可以單獨使用一種,也可以併用二種以上;又,這些2-氰基丙烯酸酯之中,從硬化性優良來看,具有碳數3以下的烷基(alky group)的2-氰基丙烯酸酯是合於理想的,而2-氰基丙烯酸異丙酯又更理想。
前述「磁性粉末(b)」,只要是可以分散在2-氰基丙烯酸酯中的磁性粉末即可,並無特別的限制。此處,所謂可以分散在2-氰基丙烯酸酯中,係指添加了磁性粉末在2-氰基丙烯酸酯中的2-氰基丙烯酸酯(鹽)類組成物,於室溫(15~30℃)經12小時以後,仍具有流動性。作為此種磁性粉末,可列舉使用的有:鐵粉以外的金屬和合金類、鐵氧體(ferrite)代表之金屬氧化物等的微細粉末。這些粉末之中,從在2-氰基丙烯酸酯中的分散性的觀點來看,不鏽鋼是合於理想的;再者,從具有強磁性之點來看,從馬氏體不鏽鋼(martensite stainless steel)、鐵氧體不鏽鋼(ferrite stainless steel)、奧氏體.鐵氧體複式不鏽鋼(austenite-ferrite duplex stainless steels)、和析出硬化不鏽鋼(precipitation hardening stainless steels)所成群類中選用至少一種會更合於理想。即使是前述不鏽鋼以外之奧氏體不鏽鋼(austenite stainless steels),藉由反覆加工,使其組織變成馬氏體化,如果成為具有磁性的不鏽鋼,也可以使用。
前述不鏽鋼以鐵作為主成分,雖然係含有鉻(chromium)、鎳(nickel)、錳(manganese)、和硫(sulfur)等的合金剛(alloy steel),但,不鏽鋼中的硫含量係0.03%重量比以下、且鎳含量係0.6%重量比以下是合於理想的;又,錳含量係0.5%重量比以下是合於理想的。不鏽鋼中的硫、鎳和錳係促進2-氰基丙烯酸酯的聚合的元素,能儘可能減量是較為理想的。不鏽鋼中
的硫、鎳和錳的含量在前述範圍內的話,不鏽鋼添加於2-氰基丙烯酸酯內之時的分散性、和2-氰基丙烯酸酯(鹽)類組成物的貯存穩定性會變的十分良好。
磁性粉末的粒子直徑,可以用雷射繞射粒徑分析儀(laser diffraction particle size analyzer)來定義,在分散於去離子水(deionized water)的狀態下測定,以體積基準所解析的平均粒徑(median size)作為粒子直徑的代表值,就可以應用。作為磁性粉末使用的情形時,若粒子直徑很小的話,在2-氰基丙烯酸酯內的分散性會變差,且組成物的黏度也會變的過高,發生處理困難的情形;另一方面,若粒子直徑很大的話,因為在組成物中容易沉澱,因此,平均粒徑為1~200微米是合於理想的,10~150微米更合於理想,20~100微米又更合於理想,55~75微米則特別合於理想。磁性粉末的平均粒徑在55~75微米的範圍內,則硬化物呈現更強力的磁性。
2-氰基丙烯酸酯(鹽)類組成物中的磁性粉末的含量,將2-氰基丙烯酸酯作為100重量部分的情形時,係5~500重量部分。磁性粉末的含量為7~450重量部分是較合於理想的,10~420重量部分又更合於理想;另一方面,磁性粉末的含量超過500重量部分的化,則2-氰基丙烯酸酯(鹽)類組成物的流動性變壞,有操作性降低的傾向,又,該組成物的貯存穩定性也有變差的情形。
2-氰基丙烯酸酯(鹽)類組成物中也可以含有氣相二氧化矽(fumed silica),此氣相二氧化矽係超微細粉末《原始粒子(primary particle)直徑在500奈米(η m)以下,特別是1~200奈米》的無水二氧化矽,此無水二氧化矽,例如,係以四氯化矽(silicon tetrachloride)作為原料,藉由在高溫火燄中的氣相狀態的氧化所生成的超微細粉末《原始粒子(primary particle)直徑在500奈米(η m)以下,特別是1~200奈米》,有親水性(hydrophylic)高的親水性二氧化矽、和疏水性(hydrophobic)高的疏水性二氧化矽。此種氣相二氧化矽(fumed silica),可以使用任何一種,為了在2-氰基丙烯酸酯的分散性較佳,則疏水性二氧化矽較合於理想。
作為親水性二氧化矽,可以使用市售的各種製品,舉例來說,可列舉使用的有:AEROSIL®50、130、200、300和380《以上均為商品名,日本AEROSIL公司製造》等,這些作為親水性二氧化矽的比表面面積(specific surface area)分別是50±15平方米/公克(m2/g)、130±25平方米/公克、200±25平方米/公克、300±30平方米/公克、380±30平方米/公克。又,作為市售的親水性二氧化矽,可以使用REOLOSIL QS-10、QS-20、QS-30和QS-40《以上均為商品名,日本德山公司製造》,這些親水性二氧化矽的比表面面積分別是140±20平方米/公克(m2/g)、220±20平方米/公克、300±30平方米/公克、380±30平方米/公克。此外,也可以使用CABOT公司
製造之市售的親水性二氧化矽等。親水性二氧化矽的比表面面積以20~600平方米/公克為合於理想。
再者,作為疏水性二氧化矽,可以使用將親水性二氧化矽做表面處理使之疏水化所生成的製品;這種親水性二氧化矽的表面處理,例如,與親水性二氧化矽表面存在的羥基(hydroxy group)反應,在該表面形成疏水基團(hydrophobic group)層所得之化合物、或者吸附於親水性二氧化矽的表面在該表面形成疏水性層所得之化合物,於溶劑存在或不存在的情形下、與親水性二氧化矽接觸,最好是以加熱方式進行,可以完成。
將親水性二氧化矽做表面處理使之疏水化所用的化合物,可列舉使用的有:具有正辛基三烷氧基矽烷(n-octyltrialkoxysilane)等疏水基的烷基(alkyl)、芳基(aryl)、芳代脂烷基(aralkyl)類的各種矽烷類偶聯劑(silane coupling agent);甲基三氯矽烷(methyltrichlorosilane)、二甲基二氯矽烷、六甲基二矽氮烷(hexamethyldisilazane)等的矽烷化劑(silylating agent);聚二甲基矽氧烷(polydimethylsiloxane)等的聚矽氧油(silicone oil);硬脂醇(stearyl alcohol)等的高碳醇(higher alcohol);以及硬脂酸(stearic acid)等的高碳脂肪酸酸(higher fatty acid)等。作為疏水性二氧化矽,也可以使用任何一者化合物將其疏水化所作成之製品。
市售的疏水性二氧化矽,例如,以聚矽氧油做表面處理使其疏水化的AEROSIL RY200、R202;以二甲基矽烷化劑(dimethyl silylating agent)做表面處理使其疏水化的AEROSIL R974、R972、R976;以正辛基三烷氧基矽烷做表面處理使其疏水化的AEROSIL R805;以三甲基矽烷化劑做表面處理使其疏水化的AEROSIL RX200、R812《以上均為商品名,日本AEROSIL公司製造》,還有以甲基三氯矽烷做表面處理使其疏水化的REOLOSIL MT-10《商品名,日本德山公司製造》等可以列舉使用。這些疏水性二氧化矽的比表面面積分別是100±20平方米/公克(m2/g)、100±20平方米/公克、170±20平方米/公克、110±20平方米/公克、250±25平方米/公克、150±20平方米/公克、150±20平方米/公克、260±20平方米/公克、120±10平方米/公克。疏水性二氧化矽的比表面面積以20~400平方米/公克為合於理想。
2-氰基丙烯酸酯(鹽)類組成物中的氣相二氧化矽(fumed silica)的理想含量,將2-氰基丙烯酸酯當作100重量部分時,係1~30重量部分;此氣相二氧化矽更理想的含量,也因為2-氰基丙烯酸酯的種類、和氣相二氧化矽的種類而不同,是1~25重量部分,特別理想的含量是2~20重量部分。氣相二氧化矽的含量是1~30重量部分的話,2-氰基丙烯酸酯(鹽)類組成物的硬化性和黏接強度等沒有損壞,可以防止磁性粉末沉降,也可以作成操作性良好的組成物。
本發明之2-氰基丙烯酸酯(鹽)類組成物中,前述成分之外,過去調配在含有2-氰基丙烯酸酯的組成物中所使用的陰離子聚合促進劑、安定劑(stabilizer)、增稠劑(thickener)、塑化劑(plasticizer)、著色劑(coloring agent)、香料(flavoring)、溶劑(solvent)、強化劑(strength agent)等,都可以因應使用目的,在無損組成物的硬化性及黏接強度等的範圍內,而適量調配使用。
陰離子聚合促進劑,可列舉使用的有:聚環氧烷類(polyalkylene oxide)、冠狀醚類(crown ether)、硅冠狀醚類(sila crown ether)、杯芳烴類(calixarene)、環糊精類(cyclodextrin)和焦棓酚類(pyrogallol)環狀化合物類等。
所謂聚環氧烷類(polyalkylene oxide),係指聚環氧烷及其衍生物,舉例來說,可列舉使用的有:特公昭60-37836號、特公平1-43790號、特開昭63-128088號、特開平3-167279號、美國專利第4386193號、美國專利第4424327號等所揭示之物。具體來說,有:(1)二甘醇(diethylene glycol)、三甘醇(triethylene glycol)、聚乙二醇(polyethylene glycol)、聚丙二醇(polypropylene glycol)等聚環氧烷類;(2)聚乙二醇單烷基酯(polyethylene glycol monoalkyl ester)、聚乙二醇雙烷基酯(polyethylene glycol dialkyl ester)、聚丙二醇雙烷基酯(polypropylene glycol dialkyl ester)、二甘醇單烷基醚(diethylene glycol monoalkyl ether)、二甘醇雙烷基醚(diethylene glycol dialkyl
ether)、雙丙甘醇單烷基醚(dipropylene glycol monoalkyl ether)、雙丙甘醇雙烷基醚(dipropylene glycol dialkyl ether)等的聚環氧烷類的衍生物等可列舉使用。
所謂冠狀醚類(crown ether),例如,可列舉使用的有:特公昭55-2238號、特開平3-167279號等所揭示之物。具體來說,有:12-冠醚-4(12-crown-4)、15-冠醚-5、18-冠醚-6、苯並-12-冠醚-4(benzo-12-crown-4)、苯並-15-冠醚-5、苯並-18-冠醚-6、二苯並-18-冠醚-6(dibenzo-18-crown-6)、二苯並-24-冠醚-8、二苯並-30-冠醚-10、三苯並-18-冠醚-6、不對稱-二苯並-22-冠醚-6(asym-dibenzo-22-crown-6)、二苯並-14-冠醚-4、二環己基-24-冠醚-8(dicyclohexyl-24-crown-8)、環己基-12-冠醚-4、1,2-二環癸-15-冠醚-5(1,2-decalyl-15-crown-5)、1,2-萘基-15-冠醚-5(1,2-naphth-15-crown-5)、3,4,5-萘基-16-冠醚-5(3,4,5-naphthyl-16-crown-5)、1,2-甲基苯並-18-冠醚-6、1,2-特-丁基-18-冠醚-6、1,2-乙烯基苯並-15-冠醚-5等可列舉使用。
所謂硅冠狀醚類(sila crown ether),例如,可列舉使用的有:特開昭60-168775號等所揭示之物;具體來說,有:二甲基硅-11-冠醚-4(dimethylsila-11-crown-4)、二甲基硅-14-冠醚-5、二甲基硅-17-冠醚-6等可列舉使用。
所謂杯芳烴類(calixarene),例如,可列舉使用的有:特開昭60-179482號、特開昭62-235379號、特開昭63-88152號等所揭示之物。具體來說,有:5,11,17,23,29,35-六-特-丁基-37,38,39,40,41,42-六羥杯[6]芳烴(5,11,17,23,29,35-hexa-tert-butyl-37,38,39,40,41,42-hexahydroxy calix[6]arene)、37,38,39,40,41,42-六羥杯[6]芳烴(37,38,39,40,41,42-hexahydroxy
calix[6]arene)、37,38,39,40,41,42-六-(2-氧基-2-乙氧基)-乙氧基杯[6]芳烴(37,38,39,40,41,42-hexa-(2-oxo-2-ethoxy)-ethoxy calix[6]arene)、25,26,27,28-四-(2-氧基-2-乙氧基)-乙氧基杯[4]芳烴等可列舉使用。
所謂環糊精類(cyclodextrin),例如,可列舉使用的有:公表平5-505835號等所揭示之物。具體來說,有:α-、β-或γ-環糊精類等可列舉使用。所謂焦棓酚類(pyrogallol)環狀化合物類,可列舉使用的有:特開2000-191600號等所揭示之化合物。具體來說,有:3,4,5,10,11,12,17,18,19,24,25,26-十二乙氧基甲酯基-C-1,C-8,C-15,C-22-四甲基[14]-間環芳(3,4,5,10,11,12,17,18,19,24,25,26-dodecaethoxy carbomethoxy-C-1,C-8,C-15,C-22-tetramethyl[14]-metacyclophane)等可列舉使用。
這些陰離子聚合促進劑可以單獨使用一種,也可以合併二種以上使用。
作為安定劑,可列舉使用的有:(1)二氧化硫(sulfur dioxide)和甲烷磺酸(methanesulfonic acid)等的脂肪族磺酸、對-甲苯磺酸(p-toluenesulfonic acid)等的芳香族磺酸、三氟化硼乙醚(boron trifluoride diethyl ether)、HBF4、及三烷基硼酸酯(鹽)(trialkyl borate)等的陰離子聚合抑制劑(polymerization-inhibitor);(2)氫醌(hydroquinone)、氫醌單甲基醚(hydroquinone monomethyl ether)、特-丁基鄰苯二酚(t-butylcatechol)、鄰苯二酚(catechol)及焦酸(pyrogallol)等自由基(radical)聚合抑制劑等。這些安定劑可以單獨使用一種,也可以爾種以上併用。
作為增稠劑,可列舉使用的有:聚甲基丙烯酸甲酯(polymethyl methacrylate)、丙烯酸酯橡膠(acrylic rubber)、聚氯乙烯(polyvinyl chloride)、聚苯乙烯(polystyrene)、纖維素酯(cellulose ester)、聚烷基-2-氰基丙烯酸酯(polyalkyl-2-cyanoacrylate ester)、以及乙烯/醋酸乙烯酯共聚物(Ethylene /vinyl acetate copolymers)等。這些增稠劑可以單獨使用一種,也可以合併二種以上使用。
作為塑化劑,可列舉使用的有:乙醯基檸檬酸三乙基酯(triethyl acetylcitrate.)、乙醯基檸檬酸三丁基酯、己二酸二甲酯(dimethyl adipate)、己二酸二乙酯、癸二酸二甲酯(dimethyl sebacate)、酞酸二甲酯(dimethyl phthalate)、酞酸二乙酯、酞酸二丁酯、酞酸二異癸酯(diisodecyl phthalate)、酞酸二己酯、酞酸二庚酯、酞酸二辛酯(dioctyl phthalate)、酞酸二個(2-乙基己基)酯(Bis(2-ethylhexyl)phthalate)、酞酸二異壬酯(diisononyl phthalat)、酞酸二異十三烷基酯(diisotridecyl phthalate)、酞酸二(十五烷基)酯(dipentadecyl phthalate)、對酞酸二辛酯(dioctyl terephthalate)、異酞酸二異壬酯(diisononyl isophthalat)、甲基苯甲酸癸酯(decyl toluate)、樟腦酸二(2-乙基己基)酯(Bis(2-ethylhexyl)camphorate)、羧酸2-乙基己基環己基酯(2-ethylhexyl cyclohexyl carboxylate)、富馬酸二異丁酯(diisobutyl fumarate)、馬來酸二異丁酯(diisobutyl maleate)、己酸三酸甘油酯(caproic acid
triglyceride)、安息香酸2-乙基己酯(2-ethylhexyl benzoate)、二安息香酸二丙二醇酯(dipropylene glycol dibenzoate)等。這些化合物中,從與2-氰基丙烯酸酯的互溶性優良、並且塑化效率又很高的觀點來看,合於理想的是乙醯基檸檬酸三丁基酯、己二酸二甲酯、酞酸二甲酯、安息香酸2-乙基己酯、二安息香酸二丙二醇酯。這些塑化劑可以單獨使用一種,也可以合併二種以上使用。又,塑化劑的含量並無特別的限制,將2-氰基丙烯酸酯當作100重量部分時,以3~120重量部分是較為理想的;如果是10~100重量部分則又更理想。塑化劑的含量為3~120重量部分的話,可以使2-氰基丙烯酸酯(鹽)類組成物的硬化物具有適度的柔軟性。
本發明之2-氰基丙烯酸酯(鹽)類組成物,在2-氰基丙烯酸酯和磁性粉末之外,可以因應需要混合前述成分,以一般已知的方法製造出來。2-氰基丙烯酸酯(鹽)類組成物製造後,貯存時,因為其組成的關係,有磁性粉末沉降的情形發生時,只要再度混合的話,就可以使用了。
以下,列舉實施例,更進一步詳細說明本發明,但本發明並不是侷限於相關實施例;又,以不超越本發明主旨為限,本發明也還可以進行各種改變或修改。再者,以下說明中,『部分』及『%』,除非有特別註明,係
以重量為基準。
以雷射繞射粒徑分析儀(laser diffraction particle size analyzer)測量,用體積為基準解析其結果。磁性粉末的粒徑d50的測定,首先將磁性粉末分散在去離子水(deionized water)中,用70瓦(70W)的超音波進行2分鐘以上的處理後,以雷射繞射粒徑分析儀測量,用體積為基準解析其結果。
將2-氰基丙烯酸酯和磁性粉末混合,評價組成物製造時的穩定性;又,將此組成物20公克放入聚乙烯(polyethylene)製的容器內,在23℃、50%相對濕度(RH)的環境下保存,評價液體的流動性《貯存穩定性》。評價的結果以流動性保存的日數表示之。
將2-氰基丙烯酸酯和磁性粉末混合,用目視觀察磁性粉末的沉降情形;又,將此組成物20公克放入聚乙烯(polyethylene)製的容器內,在23℃、50%相對濕度(RH)的環境下保存,評價液體和磁性粉末的分離狀態。
評價的結果以看不到分離的時間表示之。
在丙烯腈-丁二烯-苯乙烯樹脂(acrylonitrile-butadiene-styrene resin)板《長50毫米×25毫米》上,塗覆2-氰基丙烯酸酯(鹽)類組成物100毫克,於室溫《15~30℃》下使其硬化。將此硬化物靠近釹磁鐵(neodymium magnets),確認有無結合,○表示已結合,×表示未結合。
在2-氰基丙烯酸酯中,調配二氧化硫(Sulfur Dioxide)40百萬單位(ppm)、對苯二酚(hydroquinone)1000百萬單位《將2-氰基丙烯酸酯當作100重量部分》,然後再調配鐵氧體不鏽鋼《大同特殊鋼公司製造之「SUS 410L」,平均粒徑61微米;鉻(Cr)12.57%重量比、鎳(Ni)0.10%重量比、錳(Mn)0.14%重量比、硫(S)0.003%重量比》100重量部分,於室溫《15~30℃》下攪拌1分鐘,加以混合製作組成物;又,評價製造時的穩定性和貯存穩定性,以及磁性。其結果如表1所示。
在2-氰基丙烯酸酯中,調配二氧化硫(Sulfur Dioxide)40百萬單位(ppm)、對苯二酚(hydroquinone)1000百萬單位《將2-氰基丙烯酸酯當作100重量部分》,然後將增稠劑《聚甲基丙烯酸甲酯(Polymethylmethacrylate),分子量30萬》10重量部分溶解於其中,此液體中再調配與實施例1相同之鐵氧體不鏽鋼11重量部分,於室溫《15~30℃》下攪拌1分鐘,加以混合製作組成物;又,評價製造時的穩定性和貯存穩定性,以及磁性。其結果如表1所示。
將2-氰基丙烯酸酯(鹽)類組成物的組成,如表1至表3所示加以替代以外,以實施例1相同方法製造組成物,製造後加以評價;所使用之磁性粉末如下所示,其結果顯示於表1至表3。
SUS 430:大同特殊鋼公司製造,鐵氧體不鏽鋼,平均粒徑61微米;《鉻(Cr)16.15%重量比、鎳(Ni)0.12%重量比、錳(Mn)0.16%重量比、硫(S)0.003%重量比》
鐵粉:JFE鋼公司(JFE Steel Corporation)製造之『TK-H』,平均粒徑65微米
合金粉末:Kinsei Metec公司製造之『JEMK-S』,平均粒徑25微米《目錄值》
四氧化三鐵(triiron tetraoxide):平均粒徑76微米
在2-氰基丙烯酸酯中,調配二氧化硫(Sulfur Dioxide)40百萬單位(ppm)、對苯二酚(hydroquinone)1000百萬單位《將2-氰基丙烯酸酯當作100重量部分》,再將5重量部分的氣相二氧化矽《日本AEROSIL公司製造之『AEROSIL RX200』(商品名)》藉由分散劑(dispersant)分散於其中;在此液體中,調配與實施例1相同之鐵氧體不鏽鋼100重量部分,於室溫《15~30℃》下攪拌1分鐘,加以混合製作組成物;又,評價製造時的穩定性和貯存穩定性,以及磁性。其結果如表2所示。
將2-氰基丙烯酸酯(鹽)類組成物的組成,如表2所示加以替代以外,以實施例6相同方法製造組成物,製造後加以評價,其結果顯示於表2。
依據表1、表2的結果,2-氰基丙烯酸酯(鹽)類組成物,含有可以分散在2-氰基丙烯酸酯內的磁性粉末的情形時《實施例1~9》,可以作成貯存穩定性良好的組成物;又,所得到的2-氰基丙烯酸酯(鹽)類組成物的硬化物,也確認具有磁性。另一方面,如同表3所示,比較例1~3的情形下,在製造2-氰基丙烯酸酯(鹽)類組成物之際就固化,變成無法使用。
本發明之2-氰基丙烯酸酯(鹽)類組成物,係單液型常溫硬化型的組成物,可以在各種被黏物體上簡單地形成具有磁性的部份,因此,可以應用在各種產業界的廣泛製品、和技術領域。
Claims (4)
- 一種具有磁性的2-氰基丙烯酸酯(鹽)類接著劑組成物,含有具有3個以下碳原子烷基的2-氰基丙烯酸酯(a)、和可以分散在前述2-氰基丙烯酸酯的磁性粉末(b);前述磁性粉末(b)的含量,相對於前述2-氰基丙烯酸酯(a)為100重量部分,為5~500重量部分;前述磁性粉末(b)係選自馬氏體不鏽鋼(martensite stainless steel)、鐵氧體不鏽鋼(ferrite stainless steel)、奧氏體‧鐵氧體複式不鏽鋼(austenite-ferrite duplex stainless steels)、和析出硬化不鏽鋼(precipitation hardening stainless steels)所成群類中至少一種不鏽鋼、;前述不鏽鋼的體積基準的中位粒徑(median size),係20~200微米(μm)。
- 如申請專利範圍第1項所述之具有磁性的2-氰基丙烯酸酯(鹽)類接著濟組成物,其中前述不鏽鋼的體積基準的中位粒徑(median size)係55~75微米(μm)。。
- 如申請專利範圍第1項所述之具有磁性的2-氰基丙烯酸酯(鹽)類接著劑組成物,其中前述不鏽鋼中的硫含量為0.03重量%或更低,上述不銹鋼中的鎳含量為0.6重量%或更低,且不銹鋼中的錳含量為0.5%或更低。。
- 如申請專利範圍第1項至第4項之任一項所述之具有磁性的2-氰基丙烯酸酯(鹽)類接著劑組成物,其中更進一步含有氣相二氧化矽(fumed silica);前述氣相二氧化矽的含量,相對於前述2-氰基丙烯酸酯(a)為100重量部分,係1~30重量部分。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-210656 | 2014-10-15 | ||
| JP2014210656 | 2014-10-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201614026A TW201614026A (en) | 2016-04-16 |
| TWI712671B true TWI712671B (zh) | 2020-12-11 |
Family
ID=55746500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104132738A TWI712671B (zh) | 2014-10-15 | 2015-10-05 | 具有磁性之2-氰基丙烯酸酯(鹽)類組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10487244B2 (zh) |
| EP (1) | EP3208307B1 (zh) |
| JP (1) | JP6593338B2 (zh) |
| CN (1) | CN107075225B (zh) |
| ES (1) | ES2769623T3 (zh) |
| TW (1) | TWI712671B (zh) |
| WO (1) | WO2016059952A1 (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7409012B2 (ja) * | 2019-10-31 | 2024-01-09 | 株式会社レゾナック | 接着剤セット、構造体及び構造体の製造方法 |
| JP2022152227A (ja) * | 2021-03-29 | 2022-10-12 | キヤノン株式会社 | 樹脂組成物、樹脂成形体および物品 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61155482A (ja) * | 1984-12-28 | 1986-07-15 | Toagosei Chem Ind Co Ltd | 接着性組成物 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53115751A (en) | 1977-03-18 | 1978-10-09 | Kyoritsu Kagaku Sangyo | Adhesive composition |
| JPS6037836B2 (ja) | 1977-08-05 | 1985-08-28 | 東亞合成株式会社 | 接着剤組成物 |
| AT365623B (de) | 1980-03-10 | 1982-02-10 | Teroson Gmbh | Cyanoacrylat-klebstoffzusammensetzung |
| JPS588771A (ja) | 1981-07-08 | 1983-01-18 | Taoka Chem Co Ltd | 接着剤組成物 |
| JPS58215476A (ja) | 1982-06-09 | 1983-12-14 | Hitachi Denshi Ltd | 物体の固定方法 |
| JPH0240104B2 (ja) | 1982-11-17 | 1990-09-10 | Fuosutaa Denki Kk | Tojiseisetsuchakuzaisoseibutsu |
| US4477607A (en) | 1983-08-31 | 1984-10-16 | Loctite Corporation | Thixotropic cyanoacrylate compositions |
| ATE27171T1 (de) | 1983-11-10 | 1987-05-15 | Loctite Corp | Ploetzlich wirkende klebemittelzusammensetzung. |
| JPS60110774A (ja) * | 1983-11-21 | 1985-06-17 | Atsugi Chuo Kenkyusho Kk | シアノアクリレ−ト混合用金属粉並びにシアノアクリレ−ト混合用金属粉とシアノアクリレ−トよりなる良電導性の硬化性組成物 |
| JPS60179482A (ja) | 1984-01-27 | 1985-09-13 | ロクタイト.(アイルランド).リミテッド | 瞬間接着剤組成物 |
| US4695615A (en) | 1984-11-21 | 1987-09-22 | Loctite (Ireland) Limited | Instant adhesive composition utilizing mixed functionality calixarenes as accelerators |
| JPS60195174A (ja) * | 1984-03-19 | 1985-10-03 | Toagosei Chem Ind Co Ltd | 金属の接着方法 |
| US4837260A (en) * | 1986-05-23 | 1989-06-06 | Toagosei Chemical Industry Co., Ltd. | Cyanoacrylate compositions |
| EP0259016B1 (en) | 1986-08-29 | 1990-07-04 | LOCTITE (IRELAND) Ltd. | Calixarene derivatives and use of such compounds as accelerators in instant adhesive compositions |
| JPS63128088A (ja) | 1986-11-17 | 1988-05-31 | Koatsu Gas Kogyo Kk | α−シアノアクリレ−ト接着剤組成物 |
| JPH0742444B2 (ja) | 1986-11-29 | 1995-05-10 | 株式会社スリ−ボンド | α−シアノアクリレ−ト系組成物 |
| JPH01272102A (ja) * | 1988-04-23 | 1989-10-31 | Hirohata Denjikou Center Kk | 積層鉄心用接着剤及びこれを用いた電気機器用積層電磁鉄心 |
| JPH01289883A (ja) | 1988-05-16 | 1989-11-21 | Seiko Epson Corp | 強磁性接着剤 |
| JPH0228275A (ja) | 1988-07-15 | 1990-01-30 | Kansai Polymer Kenkyusho:Kk | 接着剤組成物 |
| JPH02142875A (ja) | 1988-11-22 | 1990-05-31 | Sekisui Aikoo Kk | α−シアノアクリレート系接着剤組成物 |
| JP2671528B2 (ja) | 1989-11-27 | 1997-10-29 | 東亞合成株式会社 | 瞬間接着剤組成物 |
| GB9401591D0 (en) | 1994-01-27 | 1994-03-23 | Univ Bradford | Powder injection moulding and extrusion |
| JP2851800B2 (ja) * | 1994-10-20 | 1999-01-27 | インダストリアル テクノロジー リサーチ インスチチュート | 導電性接着剤を用いた回路部材と基板との接続方法 |
| JPH08120234A (ja) | 1994-10-26 | 1996-05-14 | Tokin Corp | 磁性接着剤 |
| US5922783A (en) * | 1997-02-27 | 1999-07-13 | Loctite Corporation | Radiation-curable, cyanoacrylate-containing compositions |
| US20050274454A1 (en) * | 2004-06-09 | 2005-12-15 | Extrand Charles W | Magneto-active adhesive systems |
| JP5267571B2 (ja) * | 2008-12-25 | 2013-08-21 | 東亞合成株式会社 | 接着剤組成物 |
| CN104520396A (zh) | 2012-01-23 | 2015-04-15 | 汉高知识产权控股有限责任公司 | 双组分氰基丙烯酸酯/可自由基固化粘合剂体系 |
-
2015
- 2015-09-24 JP JP2016554028A patent/JP6593338B2/ja active Active
- 2015-09-24 EP EP15851025.5A patent/EP3208307B1/en active Active
- 2015-09-24 US US15/518,719 patent/US10487244B2/en active Active
- 2015-09-24 ES ES15851025T patent/ES2769623T3/es active Active
- 2015-09-24 WO PCT/JP2015/076942 patent/WO2016059952A1/ja not_active Ceased
- 2015-09-24 CN CN201580056183.1A patent/CN107075225B/zh active Active
- 2015-10-05 TW TW104132738A patent/TWI712671B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61155482A (ja) * | 1984-12-28 | 1986-07-15 | Toagosei Chem Ind Co Ltd | 接着性組成物 |
Non-Patent Citations (1)
| Title |
|---|
| Wang,Z. et al., " Magnetic Retraction of Bowel by Intraluminal Injectable Cyanoacrylate-Based Magnetic Glue", BioMed Research International, Article ID 526512,p.1-8. * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3208307A4 (en) | 2018-04-04 |
| WO2016059952A1 (ja) | 2016-04-21 |
| US20170233614A1 (en) | 2017-08-17 |
| JP6593338B2 (ja) | 2019-10-23 |
| ES2769623T3 (es) | 2020-06-26 |
| EP3208307B1 (en) | 2019-11-13 |
| CN107075225A (zh) | 2017-08-18 |
| TW201614026A (en) | 2016-04-16 |
| US10487244B2 (en) | 2019-11-26 |
| CN107075225B (zh) | 2020-08-25 |
| EP3208307A1 (en) | 2017-08-23 |
| JPWO2016059952A1 (ja) | 2017-09-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101667825B1 (ko) | 접착제 조성물 | |
| EP3260509B1 (en) | 2-cyanoacrylate adhesive composition | |
| JP6708982B2 (ja) | 接着剤組成物 | |
| JP2016513744A5 (zh) | ||
| TWI712671B (zh) | 具有磁性之2-氰基丙烯酸酯(鹽)類組成物 | |
| JP5326556B2 (ja) | 接着剤組成物 | |
| JP5434771B2 (ja) | 接着方法 | |
| TW202028388A (zh) | 光硬化性黏著劑組成物 | |
| JP5543844B2 (ja) | 2液硬化型アクリル系接着剤 | |
| CN107531814B (zh) | 固化性组合物及使用其的造型物的加固方法 | |
| JP2011241290A (ja) | 接着方法 | |
| JP5541226B2 (ja) | 接着剤組成物 | |
| ES2759052T3 (es) | Adhesivo rápido y universal | |
| JP2014034636A (ja) | 接着剤組成物 | |
| GB2482531B (en) | Adhesive composition with enhanced cure through volume | |
| CN105733450A (zh) | 一种uv固化胶 | |
| JPWO2017014124A1 (ja) | 硬化性組成物 | |
| JP2022156102A (ja) | 接着剤組成物および接合体 |