JP2018185250A - Electronic component conveying device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance device and an electronic component inspection device with which, of a simple configuration though, it is possible to accurately mount an electronic component on an electronic component mounting unit.SOLUTION: An electronic component conveyance device comprises: a holding unit in which an electronic component mounting unit, with an electronic component mounted, having a contact mark forming unit capable of forming a contact mark on the electronic component or a test piece, can be mounted and which can convey the electronic component or the test piece while holding it and press the electronic component or the test piece against the contact mark forming unit; and an imaging unit capable of imaging the electronic component or test piece that is held in the holding unit. The imaging unit captures a first image of the test piece after being contacted with the contact mark forming unit while being held by the holding unit and a second image of the electronic component being held by the holding unit after the first image is captured. The holding unit can adjust at least the position and the posture of the electronic component in relation to the electronic component mounting unit on the basis of the first image and the second image.SELECTED DRAWING: Figure 5

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

2. Description of the Related Art Conventionally, a component testing apparatus that performs an electrical test of an electronic component (component) such as an IC device has been known (see, for example, Patent Document 1). The component testing apparatus described in Patent Document 1 is configured to transport an IC device to a socket, place the IC device on the socket, and perform the test when testing an electronic component. Further, in the component testing apparatus described in Patent Document 1, an image of the IC device is captured by a plurality of cameras (for example, a component recognition camera and a socket recognition camera) while the IC device is transported to the socket. Then, by appropriately adjusting (correcting) the position of the IC device based on this image, the IC device can be accurately conveyed to the socket.

International Publication No. 2003/023430

However, the component testing apparatus described in Patent Document 1 has a problem that the configuration and control of the apparatus are complicated because a plurality of cameras are used. When a plurality of cameras are used, calibration (position correction) between the cameras is also necessary.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as follows.

The electronic component transport apparatus of the present invention is capable of placing an electronic component placement portion having a contact trace forming portion on which an electronic component is placed and capable of forming a contact trace on the electronic component or the test piece.
Gripping and transporting the electronic component or the test piece, and a gripping portion capable of pressing the electronic component or the test piece against the contact mark forming portion;
An imaging unit capable of imaging the electronic component or the test piece gripped by the gripping unit;
With
The imaging unit captures the first image of the test piece after the gripping part grips the test piece and contacts the contact mark forming part, and the gripping part after capturing the first image. Taking a second image of the gripped electronic component,
The gripping unit is capable of adjusting at least one of the position and orientation of the electronic component with respect to the electronic component placement unit based on the first image and the second image.

Thus, when placing the electronic component on the electronic component placement unit, prior to the placement, the gripping unit places the electronic component placement on the basis of the first image and the second image captured by the imaging unit. It is possible to adjust at least one of the position and posture of the electronic component with respect to the part. With this adjustment,
The electronic component is obtained in an appropriate position and posture to be placed on the electronic component placement portion, and is thus accurately placed on the electronic component placement portion. In addition, images (first image and second image) necessary for adjusting the position and orientation of the electronic component are obtained by using one imaging unit until the electronic component is placed on the electronic component placement unit. Can be acquired. As described above, the various adjustments can be performed with a simple configuration using one imaging unit. Further, it is also possible to omit the calibration (position correction) between the imaging units when two imaging units are used as in the conventional case.

Moreover, in the electronic component transport device of the present invention, the electronic component placement unit has a plurality of placement unit side terminals that are conductively connected to the electronic component,
It is preferable that the contact mark forming portion is composed of at least one placement portion side terminal among the plurality of placement portion side terminals.

Thereby, it can be omitted to provide a separate contact mark forming portion in addition to the placement portion side terminal,
Therefore, the configuration of the electronic component placement unit can be simplified.

Moreover, in the electronic component transport device of the present invention, the electronic component placement unit has a plurality of placement unit side terminals that are conductively connected to the electronic component,
It is preferable that the contact mark forming portion is constituted by a portion different from the placement portion side terminal.

Thereby, for example, the contact mark forming portion can be formed more easily than the placement portion side terminal.

In the electronic component transport device of the present invention, the first image includes an image of the contact mark,
The second image preferably includes an image of a terminal of the electronic component.

Thereby, for example, the first image and the second image can be synthesized on a common coordinate axis to obtain a synthesized image. The composite image can be used to adjust the position and orientation of the electronic component with respect to the electronic component placement unit.

Moreover, in the electronic component transport apparatus according to the present invention, the electronic component placement unit has a plurality of placement unit side terminals, and at least one placement unit side terminal among the plurality of placement unit side terminals. The mounting portion side reference terminal to be the contact mark forming portion,
The electronic component has an electronic component side reference terminal that is conductively connected to the placement portion side reference terminal.
The gripping unit is configured so that the position of the electronic component side reference terminal in the second image is aligned with the position of the contact mark formed by the placement unit side reference terminal in the first image. Preferably, at least one of the position and orientation of the part is adjusted.

As a result, the position and orientation of the electronic component can be adjusted quickly and accurately, and the subsequent placement of the electronic component on the electronic component placement portion can also be performed accurately.

In the electronic component transport apparatus of the present invention, it is preferable that the gripping portion includes a position adjustment mechanism that adjusts the position of the electronic component and a posture adjustment mechanism that adjusts the posture of the electronic component.

Thereby, when mounting an electronic component on an electronic component mounting part, both the position and attitude | position of an electronic component can be adjusted suitably as needed, Therefore The mounting can be performed correctly. .

Moreover, in the electronic component conveying apparatus of the present invention, it is preferable that the position adjusting mechanism moves the electronic component in a direction perpendicular to the vertical direction.

As a result, the electronic component can be finely adjusted, that is, corrected in a direction perpendicular to the vertical direction, so that the electronic component can be accurately placed on the electronic component placement portion.

In the electronic component transport apparatus according to the present invention, it is preferable that the posture adjusting mechanism rotates the electronic component around a vertical axis.

Accordingly, the attitude of the electronic component, that is, the direction around the vertical axis can be finely adjusted independently, that is, corrected, and thus the electronic component can be accurately placed on the electronic component placement portion. Can do.

Moreover, in the electronic component conveying apparatus of the present invention, it is preferable that the test piece has a member that can be discolored or deformed by applying a force.

Thereby, the discolored or deformed portion becomes a contact mark, and as a result, the contact mark is rapidly formed.

An electronic component inspection apparatus according to the present invention has an electronic component mounting portion on which an electronic component is mounted and has a contact mark forming portion capable of forming a contact mark on the electronic component or the test piece,
Gripping and transporting the electronic component or the test piece, and a gripping portion capable of pressing the electronic component or the test piece against the contact mark forming portion;
An imaging unit capable of imaging the electronic component or the test piece gripped by the gripping unit;
With
The electronic component placement unit is an inspection unit that can be inspected by placing the electronic component,
The imaging unit captures the first image of the test piece after the gripping part grips the test piece and contacts the contact mark forming part, and the gripping part after capturing the first image. Taking a second image of the gripped electronic component,
The gripping unit is capable of adjusting at least one of the position and orientation of the electronic component with respect to the electronic component placement unit based on the first image and the second image.

Thus, when placing the electronic component on the electronic component placement unit, prior to the placement, the gripping unit places the electronic component placement on the basis of the first image and the second image captured by the imaging unit. It is possible to adjust at least one of the position and posture of the electronic component with respect to the part. With this adjustment,
The electronic component has a proper position and posture to be placed on the electronic component placement portion, and is thus placed accurately on the electronic component placement portion, that is, connected electrically. In addition, images (first image and second image) necessary for adjusting the position and orientation of the electronic component are obtained by using one imaging unit until the electronic component is placed on the electronic component placement unit. Can be acquired. As described above, the various adjustments can be performed with a simple configuration using one imaging unit.

In addition, the electronic component can be transported to the electronic component placement unit as the inspection unit.
Inspection of the electronic component can be performed by the inspection unit. Moreover, the electronic component after inspection can be conveyed from the inspection unit.

FIG. 1 is a schematic perspective view of a first embodiment of an electronic component inspection apparatus according to the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection apparatus shown in FIG. FIG. 3 is a partial cross-sectional side view of the device transport head arranged in the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 4 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 5 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 6 is a partial cross-sectional side view sequentially showing the operation of the device transport head in the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 7 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 8 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 9 is a partial cross-sectional side view sequentially showing the operation of the device transport head in the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 10 is a partial cross-sectional side view sequentially showing the operation of the device transport head in the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 11 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection area of the electronic component inspection apparatus shown in FIG. FIG. 12 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 13 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 14 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus shown in FIG. FIG. 15 is an example of an image captured in the inspection area of the electronic component inspection apparatus shown in FIG. FIG. 16 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus (second embodiment) of the present invention. FIG. 17 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus (second embodiment) of the present invention. FIG. 18 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus (third embodiment) of the present invention. FIG. 19 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus (third embodiment) of the present invention. FIG. 20 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus (fourth embodiment) of the present invention. FIG. 21 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus (fourth embodiment) of the present invention. FIG. 22 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus (fourth embodiment) of the present invention. FIG. 23 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus (fifth embodiment). FIG. 24 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus (fifth embodiment). FIG. 25 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus (fifth embodiment). FIG. 26 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus (fifth embodiment). FIG. 27 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus (fifth embodiment). FIG. 28 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus (fifth embodiment). FIG. 29 is a partial cross-sectional side view sequentially illustrating the operation of the device transport head in the inspection region of the electronic component inspection apparatus (fifth embodiment). FIG. 30 is an example of an image captured in the inspection area of the electronic component inspection apparatus (fifth embodiment).

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
Hereinafter, with reference to FIGS. 1-15, 1st Embodiment of the electronic component conveying apparatus and electronic component inspection apparatus of this invention is described. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as an “X direction (first direction)”, a direction parallel to the Y axis is also referred to as a “Y direction (second direction)”, and a direction parallel to the Z axis is referred to as “ Also referred to as “Z direction (third direction)”. In addition, the direction in which the arrow in each direction points is “Positive”
The opposite direction is called “negative”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered. 1 and FIGS. 3 to 14 (the same applies to FIGS. 16 to 29), that is, the Z axis direction positive side is “up” or “up”, and the lower side, that is, the Z axis direction negative side. May be referred to as “down” or “down”.

The electronic component conveying apparatus 10 of the present invention has the appearance shown in FIG. The electronic component transport apparatus 10 of the present invention is a handler, and includes a reference probe pin 162a (contact mark forming portion) on which the electronic component is placed and capable of forming a contact mark 821 on the electronic component or the test piece 8. It is an apparatus in which the inspection unit 16 (electronic component placement unit) can be arranged. The electronic component transport device 10 grips and transports the electronic component or test piece 8, and the electronic component or test piece 8 is transferred to the reference probe pin 162.
a hand unit 9 (gripping part) that can be pressed to a (contact mark forming part), and an imaging unit 26 that can image the electronic component or the test piece 8 gripped by the hand unit 9 (gripping part). Yes. The imaging unit 26 includes a first image IM ₁ of the test piece 8 after the hand unit 9 (gripping part) holds the test piece 8 and makes it contact with the reference probe pin 162a (contact mark forming part), 1 image I
Second image IM ₂ of the electronic component gripped by the hand unit 9 (grip unit) after imaging M ₁
And image. Then, the hand unit 9 (gripping part) includes the first image IM ₁ and the second image IM.
₂ , at least one of the position and orientation of the electronic component with respect to the inspection unit 16 (electronic component placement unit) can be adjusted.

Accordingly, as described later, when the electronic component is placed on the inspection unit 16, the hand unit 9 (gripping unit) prior to the placement, the first image IM ₁ captured by the imaging unit 26 and the first image IM ₁ are captured. based on the two images IM _2, it is possible to adjust at least one of the position and orientation of the electronic component with respect to the inspection unit 16. With this adjustment, the electronic component can obtain an appropriate position and posture to be placed on the inspection unit 16, and thus is accurately connected to the inspection unit 16 so as to be conductive after being placed on the inspection unit 16. . In addition, the image (first image IM ₁ and second image IM) necessary for adjusting the position and orientation of the electronic component using one imaging unit 26 until the electronic component is placed on the inspection unit 16. ₂ ) can be obtained. Thus, the various adjustments described above can be performed with a simple configuration in which one imaging unit 26 is used.

As shown in FIG. 2, the electronic component inspection apparatus 1 of the present invention includes an electronic component transport apparatus 10 and further includes an inspection unit 16 that inspects the electronic component. In other words, the electronic component inspection apparatus 1 according to the present invention has an electronic component mounting having the reference probe pin 162a (contact mark forming portion) on which the electronic component is placed and capable of forming the contact mark 821 on the electronic component or the test piece 8. A hand unit 9 (gripping part) capable of gripping and transporting the mounting part and the electronic component or test piece 8 and pressing the electronic part or test piece 8 against the reference probe pin 162a (contact mark forming part); And an imaging unit 26 capable of imaging the electronic component or the test piece 8 gripped by 9 (grip unit). The electronic component placement unit is an inspection unit 16 on which an electronic component can be placed and inspected. The imaging unit 26 is configured such that the hand unit 9 (gripping unit) grips the test piece 8 and the reference probe pin 162a (contact mark forming unit).
The first image IM ₁ of the test piece 8 after being brought into contact with the first image IM ₁ and the second image IM ₂ of the electronic component gripped by the hand unit 9 (gripping part) after capturing the first image IM ₁ are captured. . Then, the hand unit 9 (gripping unit) is based on the first image IM ₁ and the second image IM ₂ and the inspection unit 16.
It is possible to adjust at least one of the position and orientation of the electronic component with respect to the (electronic component placement unit).

Thereby, the electronic component inspection apparatus 1 which has the advantage of the electronic component conveying apparatus 10 mentioned above is obtained. Further, the electronic component can be transported to the inspection unit 16, and therefore, the inspection unit 16 can inspect the electronic component. In addition, the inspected electronic component can be transported from the inspection unit 16.

Hereinafter, the configuration of each unit will be described in detail.
As shown in FIGS. 1 and 2, an electronic component inspection apparatus 1 having an electronic component transport apparatus 10 transports an electronic component such as an IC device that is, for example, a BGA (Ball Grid Array) package, and the electronic component in the transport process. It is a device for inspecting and testing (hereinafter simply referred to as “inspection”) the electrical characteristics of In the following, for convenience of explanation, the case where an IC device is used as the electronic component will be described as a representative, and this will be referred to as “IC device 90”. In this embodiment, the IC device 90 has a flat plate shape. The IC device 90 has a plurality of terminals (electronic component side terminals) 902 arranged in a matrix in a plan view on the lower surface.
Each terminal 902 has a hemispherical shape.

In addition to the above devices, for example, “LSI (Large Scale In
tegration) "" CMOS (Complementary MOS) "" CCD (Charge Coupled Device) "
”,“ Module IC ”in which a plurality of IC devices are packaged,“ crystal device ”,“ pressure sensor ”,“ inertial sensor (acceleration sensor) ”,“ gyro sensor ”,“ fingerprint sensor ”, etc. .

The electronic component inspection apparatus 1 (electronic component transport apparatus 10) includes a tray supply area A1, a device supply area A2, an inspection area A3, a device collection area A4, and a tray removal area A5. As will be described later, each wall is divided. IC device 90
From the tray supply area A1 to the tray removal area A5 via sequentially the respective regions in the arrow alpha ₉₀ direction, a check is made in the course of the inspection area A3. As described above, the electronic component inspection apparatus 1 includes the transport unit 25 that transports the IC device 90 so as to pass through each region.
0, an inspection unit 16 that performs inspection in the inspection area A3, and a control unit 800. In addition, the electronic component inspection apparatus 1 includes a monitor 300 and a signal lamp 40.
0 and an operation panel 700 are provided.

In the electronic component inspection apparatus 1, the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side in FIG. 2 is the front side, and the inspection area A3 is arranged, that is, FIG.
The upper inside is used as the back side.

In addition, the electronic component inspection apparatus 1 is used by mounting in advance a so-called “change kit” that is exchanged for each type of IC device 90. This change kit includes a placement portion (electronic component placement portion) on which an IC device 90 (electronic component) is placed. In the electronic component inspection apparatus 1 of the present embodiment, the placement units are installed at a plurality of locations, and include, for example, a temperature adjustment unit 12, a device supply unit 14, and a device collection unit 18 described later. In addition to the change kit as described above, the tray 200 prepared by the user, the collection tray 19, and the like are placed on the placement portion (electronic component placement portion) on which the IC device 90 (electronic component) is placed. In addition, there is also an inspection unit 16.

The tray supply area A1 is a tray 20 on which a plurality of untested IC devices 90 are arranged.
0 is a material supply unit to be supplied. The tray supply area A1 can also be said to be a mounting area in which a plurality of trays 200 can be stacked and mounted. In the present embodiment, each tray 200 has a plurality of recesses (pockets) arranged in a matrix. One IC device 90 can be stored and placed in each recess.

The device supply area A2 is an area where a plurality of IC devices 90 on the tray 200 conveyed from the tray supply area A1 are respectively conveyed and supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the trays 200 one by one in the horizontal direction are provided so as to straddle the tray supply region A1 and the device supply region A2. The tray transport mechanism 11A is a part of the transport unit 25, and moves the tray 200 together with the IC device 90 placed on the tray 200 in the positive direction in the Y direction, that is, in the direction of the arrow _{α11A in} FIG. be able to. As a result, the IC device 90 can be stably fed into the device supply area A2. The tray transport mechanism 11B is a moving unit that can move the empty tray 200 in the negative direction in the Y direction, that is, in the direction of the arrow _α11B in FIG. Thereby, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1.

In the device supply area A2, a temperature adjustment unit (soak plate (English notation: soak plate, Chinese notation (example): soaking plate)) 12, a device transport head 13, and a tray transport mechanism 15 are provided.
And are provided. Further, a device supply unit 14 that moves so as to straddle the device supply area A2 and the inspection area A3 is also provided.

The temperature adjustment unit 12 is a mounting unit on which a plurality of IC devices 90 are mounted, and is referred to as a “soak plate” that can heat or cool the mounted IC devices 90 collectively. With this soak plate, the IC device 90 before being inspected by the inspection unit 16 can be heated or cooled in advance and adjusted to a temperature suitable for the inspection (high temperature inspection or low temperature inspection).

The temperature adjusting unit 12 as such a mounting unit is fixed. As a result, the temperature of the IC device 90 on the temperature adjustment unit 12 can be adjusted stably.
Further, the temperature adjusting unit 12 is grounded (grounded).

In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. And I on the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A.
The C device 90 is transported to one of the temperature adjustment units 12.

The device transport head 13 is a gripping part that grips the IC device 90, and is supported so as to be movable in the X direction and the Y direction within the device supply region A2, and is also supported so as to be movable in the Z direction. The device transport head 13 is also a part of the transport unit 25, and transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, the temperature adjustment unit 12, and a device described later. The IC device 90 can be transported to and from the supply unit 14. In FIG. 2, the movement of the device transport head 13 in the X direction is indicated by an arrow α.
Indicated by _13X, it is shown moving in the Y-direction of the device conveying head 13 by the arrow alpha _13Y.

The device supply unit 14 is a mounting unit on which the IC device 90 whose temperature has been adjusted by the temperature adjusting unit 12 is mounted. The “supply shuttle plate” can transport the IC device 90 to the vicinity of the inspection unit 16. Or it is simply called a “supply shuttle”. The device supply unit 14 can also be a part of the transport unit 25. The device supply unit 14 has a recess (pocket) 141 in which the IC device 90 is accommodated and placed (see, for example, FIG. 8).

The device supply 14 as mounting portion, during the X direction and the inspection area A3 and the device supply area A2, i.e., is supported on the reciprocally movable (movable) along the arrow alpha ₁₄ direction. As a result, the device supply unit 14 moves the IC device 90 to the device supply area A2.
Can be stably transported from the inspection area A3 to the vicinity of the inspection portion 16 in the inspection area A3.
3, after the IC device 90 is removed by the device transport head 17 (hand unit 9), it can return to the device supply area A2.

In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction. The device supply unit 14 on the Y direction negative side is referred to as “device supply unit 14A”, and the device supply unit on the Y direction positive side. 14 may be referred to as “device supply unit 14B”. And the IC on the temperature adjustment unit 12
The device 90 is transported to the device supply unit 14A or the device supply unit 14B in the device supply region A2. Further, like the temperature adjustment unit 12, the device supply unit 14 is configured to be able to heat or cool the IC device 90 placed on the device supply unit 14. As a result, the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12 can be transported to the vicinity of the inspection unit 16 in the inspection region A3 while maintaining the temperature adjustment state. The device supply unit 14 is also grounded in the same manner as the temperature adjustment unit 12.

The tray transport mechanism 15 is an empty tray 200 with all IC devices 90 removed.
Positive side of the X direction within the device supplying area A2, i.e., a mechanism for conveying the arrow alpha ₁₅ direction. After this transport, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transport mechanism 11B.

The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, I
An inspection unit 16 that inspects the C device 90 and a device transport head 17 are provided.

The device transport head 17 is a part of the transport unit 25 and is configured to be able to heat or cool the gripped IC device 90 in the same manner as the temperature adjustment unit 12. As will be described later, the device transport head 17 includes a hand unit 9 (for holding an IC device 90 (electronic component)) (
Holding part). Thereby, the IC device 90 in which the temperature adjustment state is maintained can be gripped, and the IC device 90 can be transported in the inspection area A3 while maintaining the temperature adjustment state.

Such a device transport head 17 is supported so as to be able to reciprocate in the Y direction and the Z direction within the inspection area A3, and is a part of a mechanism called an “index arm”. Accordingly, the device transport head 17 can lift the IC device 90 from the device supply unit 14 carried in from the device supply region A2, transport the IC device 90 on the inspection unit 16, and place the device.

In FIG. 2, the reciprocating movement of the device transport head 17 in the Y direction is indicated by an arrow α _17Y . The device transport head 17 is supported so as to be reciprocally movable in the Y direction.
It is not limited to this, You may support so that a reciprocation is possible also to a X direction. In the configuration shown in FIG. 2, two device transport heads 17 are arranged in the Y direction. The device transport head 17 on the Y direction negative side is referred to as “device transport head 17A”, and the device on the Y direction positive side. The transport head 17 may be referred to as “device transport head 17B”. Device transfer head 17
A can carry the conveyance of the IC device 90 from the device supply unit 14A to the inspection unit 16 in the inspection region A3, and the device conveyance head 17B can be used for the device supply unit 14B of the IC device 90 in the inspection region A3. To the inspection unit 16.

The inspection unit 16 (socket) is a mounting unit (electronic component mounting unit) that mounts the IC device 90 that is an electronic component and inspects the electrical characteristics of the IC device 90. The inspection unit 16 has a recess (pocket) 161 in which the IC device 90 is accommodated and placed, and the recess 161
A plurality of probe pins (mounting part side terminals) 162 are provided on the bottom of the substrate (for example, FIG. 14).
reference). Then, the IC device 90 can be inspected by connecting the terminals 902 of the IC device 90 and the probe pins 162 in a conductive manner, that is, by contacting them. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. In addition, the shape of the upper end part of the probe pin 162 is adapted to the shape of the terminal 902, and in this embodiment, a crown shape adapted to the hemispherical terminal 902 is formed (for example, see FIG. 14).

Similar to the temperature adjustment unit 12, such an inspection unit 16 can heat or cool the IC device 90 to adjust the IC device 90 to a temperature suitable for the inspection.

The device collection area A4 is an area in which a plurality of IC devices 90 that have been inspected in the inspection area A3 and completed the inspection are collected. In the device collection area A4, the collection tray 19
A device transport head 20 and a tray transport mechanism 21 are provided. Further, a device collection unit 18 that moves so as to straddle the inspection area A3 and the device collection area A4 is also provided. An empty tray 200 is also prepared in the device collection area A4.

The device collection unit 18 is a placement unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed, and the IC device 90 can be transported to the device collection region A4.
It is called “recovery shuttle plate” or simply “recovery shuttle”. The device collection unit 18 can also be a part of the transport unit 25.

In addition, the device collection unit 18 has an X direction between the inspection area A3 and the device collection area A4,
That is reciprocally movably supported along the arrow alpha ₁₈ direction. In the configuration shown in FIG. 2, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the device collection unit 18 on the Y direction negative side is referred to as “device collection unit 18 </ b> A”. In other words, the device collection unit 18 on the Y direction positive side may be referred to as a “device collection unit 18B”. And inspection part 1
6 is transported to and placed on the device collection unit 18A or the device collection unit 18B. The IC device 90 is transported from the inspection unit 16 to the device recovery unit 18A by the device transport head 17A, and the transport from the inspection unit 16 to the device recovery unit 18B is performed by the device transport head 17B. The device collection unit 18 is also grounded, like the temperature adjustment unit 12 and the device supply unit 14.

The collection tray 19 is a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed, and is fixed so as not to move in the device collection area A4. As a result, the inspected IC device 90 can be stably placed on the collection tray 19 even in the device collection area A4 where a relatively large number of various movable parts such as the device transport head 20 are arranged. It becomes. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

Three empty trays 200 are also arranged along the X direction. This empty tray 20
0 is also a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed. Then, the IC device 90 on the device recovery unit 18 that has moved to the device recovery area A4 is conveyed and placed on either the recovery tray 19 or the empty tray 200. Thereby, the IC device 90 is classified and collected for each inspection result.

The device transport head 20 is supported so as to be movable in the X direction and the Y direction within the device collection area A4, and further has a portion that is also movable in the Z direction. This device transport head 2
0 is a part of the transport unit 25, and can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. In FIG. 2, the movement of the device transport head 20 in the X direction is indicated by an arrow α _20X , and the movement of the device transport head 20 in the Y direction is indicated by an arrow α _20Y .

Tray transfer mechanism 21, X-direction empty tray 200 is conveyed from the tray removal area A5 in the device collection region within A4, i.e., a mechanism for conveying the arrow alpha ₂₁ direction. And
After this transport, the empty tray 200 will be placed at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

The tray removal area A5 is a tray 2 in which a plurality of inspected IC devices 90 are arranged.
00 is a material removal portion that is collected and removed. In the tray removal area A5, a number of trays 20
0 can be stacked.

Further, the tray 200 is set to 1 so as to straddle the device collection area A4 and the tray removal area A5.
A tray transport mechanism 22A and a tray transport mechanism 22B that transport the sheets one by one in the Y direction are provided. The tray transport mechanism 22A is a part of the transport unit 25, and is a moving unit that can reciprocate the tray 200 in the Y direction, that is, the direction of the arrow α _22A . Thereby, the inspected IC device 90 can be transported from the device collection area A4 to the tray removal area A5. Further, the tray transport mechanism 22 </ b> B is an empty tray 2 for collecting the IC device 90.
00 can be moved in the positive direction of the Y direction, that is, in the direction of the arrow α _22B . Thereby, the empty tray 200 can be moved from the tray removal area A5 to the device collection area A4.

For example, the control unit 800 includes a tray transport mechanism 11A, a tray transport mechanism 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport. The operations of the head 17, the device collection unit 18, the device transport head 20, the tray transport mechanism 21, the tray transport mechanism 22A, and the tray transport mechanism 22B can be controlled.

The operator can set or confirm the operating conditions of the electronic component inspection apparatus 1 via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, and is disposed at the upper part on the front side of the electronic component inspection apparatus 1. As shown in FIG. 1, a mouse table 600 on which a mouse is placed is provided on the right side of the tray removal area A5 in the drawing. This mouse is used when operating the screen displayed on the monitor 300.

In addition, an operation panel 700 is arranged on the lower right side of FIG. The operation panel 700 instructs the electronic component inspection apparatus 1 to perform a desired operation separately from the monitor 300.

In addition, the signal lamp 400 has an electronic component inspection apparatus 1 according to a combination of colors to emit light.
It is possible to notify the operating state of. The signal lamp 400 is disposed on the electronic component inspection apparatus 1. Note that the electronic component inspection apparatus 1 has a built-in speaker 500, and the operational state of the electronic component inspection apparatus 1 can also be notified by the speaker 500.

In the electronic component inspection apparatus 1, the tray supply area A1 and the device supply area A2 are separated by a first partition 231 and the device supply area A2 and the inspection area A3 are separated by a second partition 232. The inspection area A3 and the device collection area A4 are separated by a third partition wall 233, and the device collection area A4 and the tray removal area A5 are separated by a fourth partition wall 234. The device supply area A2 and the device collection area A4 are also partitioned by the fifth partition wall 235.

The outermost exterior of the electronic component inspection apparatus 1 is covered with a cover. Examples of the cover include a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245.

By the way, with the recent miniaturization of the IC device 90, the pitch between the terminals 902 of the IC device 90 is also narrowed. As a result, each terminal 902 and the inspection unit 1 to be in contact with the terminal 902
6 probe pins 162 are difficult to contact, and there is a possibility that accurate inspection may be impossible.

Therefore, the electronic component inspection apparatus 1 is configured to prevent such a problem. Hereinafter, this configuration and operation will be described.

As shown in FIG. 3, the device transport head 17 includes at least one hand unit 9 (
Holding part). The hand unit 9 includes an IC device 90 on the device supply unit 14.
The electronic component is gripped and conveyed to the inspection unit 16. Hand unit 9
The number of arrangements is not particularly limited.

The hand unit 9 is supported by the base 94, the base 94, the first moving unit 95 that can reciprocate in the X direction with respect to the base 94, the first moving unit 95, and the first moving unit 95. Y
A second moving portion 96 that can reciprocate in the direction, and a rotating portion (rotating portion) 97 that is supported by the second moving portion 96 and that can rotate (rotate) around the Z axis with respect to the second moving portion 96. , A shaft 99 provided in the rotating portion 97, a holding portion 98 fixed to the shaft 99, a first piezoelectric actuator 911 that moves the first moving portion 95 relative to the base portion 94, and a second moving portion 96. First moving unit 95
And a third piezoelectric actuator (rotating part piezoelectric actuator) 913 for rotating the rotating part 97 relative to the second moving part 96.

The base portion 94 is provided on a plate-like portion 941 having a plate shape having a thickness in the Z direction, and a lower surface of the plate-like portion 941, and an engaging portion 942 and an engaging portion for guiding the first moving portion 95 in the X direction. Part 943. Each of the engaging portion 942 and the engaging portion 943 extends in the X direction,
Further, they are separated from each other in the Y direction. The configurations of the engaging portion 942 and the engaging portion 943 are not particularly limited, but in the present embodiment, there are grooves that are opened in the longitudinal direction of a rail 952 and a rail 953 described later, respectively. In other words, the engaging portion 942 and the engaging portion 943 are constituted by long portions having long grooves that open downward in FIG.

In addition, the base 94 has a contact portion 947 that extends from the plate-like portion 941 toward the negative side in the Z direction and contacts the first piezoelectric actuator 911. The contact portion 947 extends to the second moving portion 96 and is provided so as to be aligned in the Y direction with respect to the first moving portion 95 and the second moving portion 96. Further, the lower surface 947 a of the contact portion 947 extends in the X direction, and the lower surface 94.
The convex portion 911a (upper end portion) of the first piezoelectric actuator 911 is in contact with 7a. It is preferable that the surface of the lower surface 947a is subjected to a treatment for increasing the frictional resistance with the convex portion 911a or a high friction layer is formed.

The first moving part 95 is provided on the base part 951, the base part 951, the rail 952 engaged with the engaging part 942 of the base part 94, and the rail provided on the base part 951 and engaged with the engaging part 943 of the base part 94. 953. Thereby, the movement to the direction other than the X direction of the 1st moving part 95 is controlled, and the 1st moving part 95 moves to the X direction smoothly and reliably.

Further, the first moving unit 95 includes a first fixing unit 954 that extends from the base 951 toward the negative side in the Z direction and to which the first piezoelectric actuator 911 is fixed. The first fixing portion 954 has X
The plate extends in the Z plane and has a thickness in the Y direction, and is provided so as to line up in the Y direction with respect to the second moving portion 96 (base portion 961). The first piezoelectric actuator 911 is fixed to the surface of the first fixing portion 954.

The first piezoelectric actuator 911 has a plate shape and is fixed to the first fixing portion 954 so that the thickness is in the Y direction. By disposing the first piezoelectric actuator 911 in this manner, excessive outward protrusion of the first piezoelectric actuator 911 can be suppressed, and the hand unit 9 can be downsized.

The first moving unit 95 has a second fixed portion (not shown) that extends from the base portion 951 toward the negative side in the Z direction and to which the second piezoelectric actuator 912 is fixed. The second fixed portion has a plate shape having a spread in the YZ plane and having a thickness in the X direction.
It is provided so as to be aligned in the X direction with respect to the base 961). And the 2nd piezoelectric actuator 912 is being fixed to the back surface of the 2nd fixing | fixed part.

The second piezoelectric actuator 912 has a plate shape and is fixed to the second fixing portion so as to have a thickness in the X direction. By disposing the second piezoelectric actuator 912 in this way, the outward protrusion of the second piezoelectric actuator 912 can be suppressed, and the hand unit 9 can be downsized. The upper end portion of the second piezoelectric actuator 912 is in contact with the second moving portion 96 from below.

The first moving part 95 is an engaging part (guide part) for guiding the second moving part 96 in the Y direction.
956. The engaging portion 956 extends in the Y direction. The configuration of the engaging portion 956 is not particularly limited, but in this embodiment, the engaging portion 956 has a groove that opens in the longitudinal direction of a rail 963 described later. In other words, the engaging portion 956 is constituted by a long portion having a long groove that opens downward in FIG.

The second moving part 96 includes a columnar base 961 and a rail 963 that is provided on the base 961 and engages with the engaging part 956 of the first moving part 95. Thereby, the movement to the direction other than the Y direction of the 2nd moving part 96 is controlled, and the 2nd moving part 96 moves to a Y direction smoothly and reliably.

In addition, the base 961 of the second moving unit 96 is formed with a surface 961a that is recessed relative to other portions, and the third piezoelectric actuator 9 for rotating the rotating unit 97 on the surface 961a.
13 is fixed. The surface 961a is configured by a YZ plane, and the plate-like third piezoelectric actuator 913 is fixed to the surface 961a so as to have a thickness in the X direction. By disposing the third piezoelectric actuator 913 in this way, excessive protrusion of the third piezoelectric actuator 913 to the outside can be suppressed, so that the hand unit 9 can be downsized.

In the hand unit 9, the position adjusting mechanism 92 is configured by the first moving unit 95 and the second moving unit 96 configured as described above. The position adjusting mechanism 92 is an I
The C device 90 (electronic component) is moved in a direction orthogonal to the Z direction (vertical direction), that is, in the X direction and the Y direction. The movement in the X direction is performed by the first moving unit 95, and the movement in the Y direction is performed by the second moving unit 96. Thereby, among the device transport heads 17 supported so as to be reciprocally movable in the Y direction and the Z direction, the positions of the IC device 90 in the X direction and the Y direction can be finely adjusted independently, that is, corrected. .

A rotation unit 97 is located below the second moving unit 96 (on the negative side in the Z direction). The rotating part 97 has a tubular support part 971 fixed to the lower end of the base part 961 of the second moving part 96. For example, a rotating body (not shown) that is provided coaxially with the supporting portion 971 and is inserted into the support portion 971 and supports the rotating body with respect to the supporting portion 971 so as to be rotatable. A bearing (not shown) or the like is disposed.

Further, the rotating body has a third piezoelectric actuator 9 at a position eccentric from the rotating shaft.
Thirteen convex portions 913a are in contact with each other. Then, the rotating body rotates with respect to the support portion 971 (second moving portion 96) by driving the third piezoelectric actuator 913.

In the hand unit 9, the posture adjusting mechanism 93 is configured by the rotating portion 97 configured as described above. The attitude adjustment mechanism 93 rotates the IC device 90 (electronic component) held by the holding unit 98 around the Z axis (vertical axis). Accordingly, among the device transport heads 17 supported so as to be reciprocally movable in the Y direction and the Z direction, the posture of the IC device 90,
That is, the direction around the Z axis can be finely adjusted independently, that is, corrected.

As described above, the hand unit 9 (gripping unit) includes the position adjusting mechanism 92 that adjusts the position of the IC device 90 (electronic component) and the attitude adjusting mechanism 93 that adjusts the attitude of the IC device 90 (electronic component). doing. Thereby, as will be described later, the IC device 90 is connected to the inspection unit 16.
When mounting the IC device 90, both the position and the posture of the IC device 90 can be adjusted as necessary, so that the mounting can be performed accurately.

The shaft 99 extends to the plate-like portion 941 of the base portion 94. The base 94 incorporates a copying mechanism (compliance mechanism) 948. The shaft 99 is connected to the copying mechanism 948. Thereby, the attitude | position of the shaft 99 can imitate the external force which the shaft 99 receives.

A holding portion 98 that holds the IC device 90 is disposed at the lower end of the shaft 99.
The holding portion 98 is supported by the rotating portion 97 via the shaft 99 and can rotate with respect to the second moving portion 96 integrally with the rotating body.

The holding unit 98 includes a suction surface 981 that faces the IC device 90, a suction hole 982 that opens to the suction surface 981, and a vacuum pump 983 that decompresses the suction hole 982. When the suction surface 981 is brought into contact with the IC device 90 so as to close the suction hole 982, the pressure inside the suction hole 982 is reduced by the vacuum pump 983, whereby the IC device 90 can be sucked and held on the suction surface 981. On the contrary, if the decompression pump 983 is stopped and the inside of the suction hole 982 is released, the IC device 90 can be released.

As the first piezoelectric actuator 911, the second piezoelectric actuator 912, and the third piezoelectric actuator 913, for example, one having a strip-shaped piezoelectric element can be used. The piezoelectric element expands and contracts in the longitudinal direction when an AC voltage is applied. And using this expansion-contraction operation | movement, the 1st moving part 95 is moved with respect to the base 94, the 2nd moving part 96 is moved with respect to the 1st moving part 95, and the rotation part 97 is made into 2nd. It can be rotated with respect to the moving part 96. The constituent material of the piezoelectric element is not particularly limited. Lead zirconate titanate (PZT), crystal, lithium niobate, barium titanate, lead titanate, lead metaniobate, polyvinylidene fluoride, lead zinc niobate Various types such as lead scandium niobate can be used.

Moreover, the hand unit 9 (gripping part) can also grasp and convey the test piece 8 in addition to the IC device 90 (electronic component) (see FIGS. 4 to 7). Test piece 8 is hand unit 9
The reference probe pin 162a (contact mark forming part) of the inspection part 16 to be described later in the state of being gripped by
The contact mark 821 is formed. The contact mark 821 is used to correct the position and posture of the IC device 90 when the IC device 90 is transported from the device supply unit 14 to the inspection unit 16 and placed on the inspection unit 16.

The test piece 8 has a member that can be discolored or deformed by applying a force. In the present embodiment, the test piece 8 has a member that can be discolored when a force is applied. For example, as shown in FIGS. The microcapsule layer 82 is formed on the material 81 and dispersed with microcapsules. The microcapsule contains a developer. The “force” is a reaction force generated from the reference probe pin 162a (contact mark forming portion) that is generated when the test piece 8 is pressed against the reference probe pin 162a (contact mark forming portion). Then, the microcapsule is crushed by this reaction force, the internal developer is released, and a part of the microcapsule layer 82 is discolored. Thereby, the discolored part becomes the contact mark 821 (see FIG. 5). By using the test piece 8 having such a configuration, the contact mark 821 can be quickly formed.

As shown in FIGS. 4-14, the imaging part 26 is arrange | positioned and fixed to test | inspection area | region A3.
The imaging unit 26 is located between the inspection unit 16 and the device supply unit 14 stopped in the inspection region A3. As described above, the device supply unit 14 includes the device supply unit 14A and the device supply unit 14B. Therefore, the imaging unit 26 includes one that is positioned between the inspection unit 16 and the device supply unit 14A and one that is positioned between the inspection unit 16 and the device supply unit 14B.
Hereinafter, the imaging unit 26 on the device supply unit 14A side will be described as a representative.

The imaging unit 26 includes various cameras such as a CCD (Charge Coupled Devices) camera and a three-dimensional camera. The imaging unit 26 has an imaging direction facing upward, and the IC device 90 (see FIG. 11) or the test piece 8 gripped by the hand unit 9 (gripping unit).
(See FIG. 7). As the imaging order (timing), the imaging unit 2
6, first, the hand unit 9 (gripping part) grips the test piece 8, and the reference probe pin 162.
capturing a first image IM ₁ specimens 8 after contact with the a (contact mark forming portion). Then, after capturing the first image IM _1, the imaging unit 26 captures a hand unit 9 second image IM ₂ of gripped (grip portion) the IC device 90 (electronic component). As shown in FIG.
The image IM ₁ includes an image of the contact mark 821, and the second image IM ₂ includes the IC device 90 (
An image of the terminal 902 of the electronic component) is included.

As described above, the inspection unit 16 (electronic component placement unit) places and inspects the IC device 90 (electronic component). The inspection unit 16 (electronic component placement unit) includes an IC device 90.
It has a plurality of probe pins (mounting part side terminals) 162 that are electrically conductively connected to the (electronic component). The probe pin (mounting part side terminal) 162 of at least one of the plurality of probe pins (mounting part side terminal) 162 (in this embodiment, as an example, the leftmost in FIGS. 4 to 14). Is a reference probe pin (mounting part side reference terminal) 162a which is a contact mark forming part for forming a contact mark 821 on the test piece 8. As described above, the contact mark forming portion is at least one probe pin (mounting portion side terminal) among the plurality of probe pins (mounting portion side terminals) 162.
162, that is, the reference probe pin (mounting portion side reference terminal) 162a in this embodiment. Accordingly, it is possible to omit providing a separate contact mark forming portion in addition to the probe pin 162, and thus the configuration of the inspection portion 16 can be simplified.

On the other hand, in the IC device 90, among the plurality of terminals 902, a terminal 902 that is conductively connected to the reference probe pin 162a is referred to as a reference terminal (electronic component side reference terminal) 902a.

Next, in the inspection area A3, the hand unit 9 (device transport head 17A) transports the IC device 90 to the inspection unit 16 and performs an operation (an example) until the IC device 90 can be inspected. This will be described with reference to FIGS.

As shown in FIG. 4, the hand unit 9 holds the test piece 8. The position of the hand unit 9 is such that the test piece 8 faces the recess 161 immediately above the recess 161 of the inspection unit 16.

Next, as shown in FIG. 5, the microcapsule layer 82 of the test piece 8 is connected to the probe pin 162.
The hand unit 9 is lowered until it is pressed against and abuts. Thereby, a plurality of contact marks 821 are formed in the microcapsule layer 82.

Next, as shown in FIG. 6, the hand unit 9 is raised to the same height as the hand unit 9 in FIG. In FIG. 6, the rising direction and the rising amount of the hand unit 9 at this time are indicated by an arrow _α9Z .

Next, as shown in FIG. 7, the hand unit 9 is moved to the Y direction negative side, that is, the device supply unit 14 </ b> A side, and is temporarily stopped in the middle thereof. The stop position of the hand unit 9 is
The test piece 8 is located immediately above the imaging unit 26, and the test piece 8 can be imaged by the imaging unit 26. Then, the first image IM ₁ (see FIG. 15) is obtained by operating the imaging unit 26 at this position. From the first image IM _1, the center _{O 821a} of the contact mark 821 reference probe pin 162a is formed (hereinafter referred to as "reference abutment traces 821a") is detected. This detection is performed by the control unit 800. Further, in FIG. 7, the moving direction and the moving amount until the hand unit 9 stops are indicated by an arrow α _9Y .

Next, as shown in FIG. 8, the hand unit 9 is further moved to the Y-direction negative side, that is, the device supply unit 14A side, and stopped just above the device supply unit 14A. Thereafter, the test piece 8 is removed from the hand unit 9.

Next, as shown in FIG. 9, the hand unit 9 is lowered until the hand unit 9 comes into contact with the IC device 90 placed on the device supply unit 14A. Thereby, the IC device 90 can be gripped by the hand unit 9.

Next, as shown in FIG. 10, the hand unit 9 is raised to the same height as the hand unit 9 in FIG.

Next, as shown in FIG. 11, the hand unit 9 is moved to the Y direction positive side, that is, the inspection unit 16.
Move to the side and stop temporarily in the middle. The stop position of the hand unit 9 is the imaging unit 2
There is an IC device 90 immediately above 6, which is a position where the imaging device 26 can image the IC device 90. Then, by operating the imaging unit 26 at this position, the second image I
M ₂ (see FIG. 15) is obtained. From the second image IM _2, the center of the reference pin 902a _{O 90
2a} is detected. This detection is performed by the control unit 800.

As described above, the first image IM ₁ includes the image of the contact mark 821, and the second image IM ₂ includes the image of the terminal 902 of the IC device 90 (electronic component) (see FIG. 15). Thus, for example, it is possible to obtain the first image IM ₁ and the second image IM ₂ synthesized and on a common axis (arrow C1), the composite image IM _3.

Further, as described above, the inspection unit 16 (electronic component placement unit) has a plurality of probe pins (placement unit side terminals) 162. In addition, the inspection unit 16 (electronic component mounting unit) uses at least one probe pin (mounting unit side terminal) 162 among the plurality of probe pins (mounting unit side terminals) 162 as a contact trace forming unit. Reference probe pin (mounting portion side reference terminal) 162a. In addition, the IC device 90 (electronic component) has a reference terminal (electronic component side reference terminal) 902a that is conductively connected to a reference probe pin (mounting portion side reference terminal) 162a. From the composite image IM _3, a reference terminal 90 with respect to the center _{O 821a} of the reference abutment traces 821a
A deviation amount ΔY of the center O _902a of 2a is detected. This detection is also performed by the control unit 800. If the IC device 90 is moved by the amount of deviation ΔY by appropriately operating the position adjustment mechanism 92 and the posture adjustment mechanism 93 of the hand unit 9, the center O _{82 is obtained.
1a} and the center O _902a can be matched, i.e. overlapped. Thus, the hand unit 9 (grip portion), the center _{O 821a} (contact mark 821 of the reference abutment traces 821a which reference probe pin (mounting portion side reference terminal) 162a of the first in the image IM ₁ is formed position,
Reference terminal during the second image IM ₂ (electronic component-side reference terminal) 902a of the center _{O 902a} (position)
So that at least one of the position and orientation of the IC device 90 (electronic component) can be adjusted (hereinafter, this adjustment may be referred to as “correction”). In this embodiment, the position of the IC device 90 is adjusted by the operation of the position adjusting mechanism 92 of the hand unit 9, and the state after this adjustment is shown in FIG.

Next, as shown in FIG. 13, the hand unit 9 is further moved to the Y-direction positive side, that is, the inspection unit 16 side, and stopped just above the inspection unit 16. In FIG. 13, the moving direction and the moving amount until the hand unit 9 stops are indicated by an arrow β _9Y . Arrow beta _9Y, the direction is opposite to the arrow alpha _9Y, the amount of movement is the same as the amount of movement of the arrow alpha _9Y.

Next, as shown in FIG. 14, the hand unit 9 is lowered. In FIG. 14, the downward direction and the downward amount of the hand unit 9 at this time are indicated by an arrow β _9Z . The direction of the arrow β _9Z is opposite to the direction of the arrow α _9Z , and the downward amount is the same as the upward amount of the arrow α _9Z . Thereby, the reference terminal 902a of the IC device 90 and the reference probe pin 16 of the inspection unit 16 are provided.
The other terminal 902 and the probe pin 162 are connected to each other in a conductive manner as well as to the conductive connection, so that the IC device 90 can be inspected. In the present embodiment, when the correction is omitted, the reference terminal 902a of the IC device 90 and the reference probe pin 162a of the inspection unit 16 are not contacted, and as a result, the IC
The device 90 cannot be inspected.

As described above, in the electronic component inspection apparatus 1 (electronic component transport apparatus 10), the IC device 90
Is placed on the inspection unit 16, prior to the placement, the hand unit 9 (gripping unit) performs an inspection based on the first image IM ₁ and the second image IM ₂ captured by the imaging unit 26. Part 16 (
It is possible to adjust at least one of the position and posture of the IC device 90 (electronic component) with respect to the electronic component mounting portion). By this adjustment, the IC device 90 can obtain an appropriate position and posture for placement on the inspection unit 16, so that each terminal 902 can conduct electricity with each probe pin 162 after placement on the inspection unit 16. To be connected accurately. Further, IC until the device 90 is placed in the inspection unit 16, using one imaging unit 26, an image necessary for adjustment of the position and posture of the IC device 90 (first image IM ₁ and the second An image IM ₂ ) can be acquired. In this way, various adjustments can be performed with a simple configuration in which one imaging unit 26 is used.

Note that to match the center _{O 902a} of the center _{O 821a} and the reference terminal 902a of the reference abutment traces 821a, in the present embodiment, although adjusting the position in the Y direction of the IC device 90,
It is not limited to this. Depending on the IC device 90 held by the hand unit 9, for example, the position of the IC device 90 in the X direction is adjusted, the attitude of the IC device 90 around the Z axis is adjusted, the position of the IC device 90 is adjusted, and the Y direction is adjusted. In some cases, the position adjustment and the posture adjustment around the Z axis may be combined as appropriate.

Further, a plurality of reference contact marks 821a and a plurality of reference terminals 902a may be set for the various adjustments.

Second Embodiment
Hereinafter, the second embodiment of the electronic component transport apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to FIGS. 16 and 17. However, the difference from the above-described embodiment will be mainly described, and similar matters will be described. Will not be described.

The present embodiment is the same as the first embodiment except that the configuration of the contact mark forming portion is different.

As described in the first embodiment, the inspection unit 16 (electronic component mounting unit) includes a plurality of probe pins (mounting unit side terminals) 162 that are conductively connected to the IC device 90 (electronic component). Have. And in this embodiment, as shown in FIG. 16, FIG.
It consists of a pin member 163 (part) different from the probe pin (mounting portion side terminal) 162. As a result, for example, the pin member 163 (contact mark forming portion) can form the contact mark 821 more easily than the probe pin 162. The pin member 163 is not particularly limited. For example, the pin member 163 is made of a hard resin material harder than the probe pin 162, and the shape of the upper end 163a is more than the shape of the upper end of the probe pin 162.
A material suitable for forming the film can be used. In addition, as a hard resin material, an acrylic resin is mentioned, for example. Moreover, as a shape of the upper end 163a, it can be set as the rounded shape, for example.

In addition, the arrangement | positioning location of the pin member 163 is not limited to the position shown in FIG.16 and FIG.17.
The pin member 163 may be made of a metal material. In this case, the pin member 16
3 is preferably formed with an insulating film.

<Third Embodiment>
Hereinafter, the third embodiment of the electronic component transport apparatus and the electronic component inspection apparatus of the present invention will be described with reference to FIGS. 18 and 19, but the differences from the above-described embodiment will be mainly described and the same matters will be described. Will not be described.

This embodiment is the same as the first embodiment except that the configuration of the test piece is different from the configuration of the contact mark forming portion.

As shown in FIGS. 18 and 19, in this embodiment, the test piece 8 is a small piece made of, for example, a hard resin material. Further, when the contact trace forming part comes into contact with the test piece 8, the marker applying part 164 for applying a marker 83 (see FIG. 19) to the test piece 8 with, for example, ink.
It has become. The marker 83 becomes a contact mark.

With such a configuration, it is possible to simplify the configuration of the test piece 8 by using a single-layer test piece 8.

<Fourth embodiment>
Hereinafter, the fourth embodiment of the electronic component transport device and the electronic component inspection device according to the present invention will be described with reference to FIGS. 20 to 22. However, the difference from the above-described embodiment will be mainly described, and similar matters will be described. Will not be described.

This embodiment is the same as the first embodiment except that the configuration of the test piece is different.
As described in the first embodiment, the test piece 8 has a member that can be discolored or deformed by applying a force. As shown in FIGS. 20 to 22, in this embodiment, the test piece 8 has a member that can be deformed when a force is applied. It has a clay layer 84 formed on the material 81 and made of plastic clay. The plasticizing clay is not particularly limited, and for example, oil clay or wax clay can be used. Accordingly, when the clay layer 84 receives a reaction force from the reference probe pin 162a (contact mark forming portion), the portion is plastically deformed. As a result, the plastically deformed portion becomes the contact mark 841.
(FIGS. 21 and 22). The contact mark 841 can also be quickly formed by using the test piece 8 having such a configuration.

The clay layer 84 may be kneaded with a particulate abrasive. Accordingly, when the contact mark 841 is formed on the clay layer 84, the probe pin 162 (reference probe pin 162a is formed.
) Is polished by the abrasive, and the dirt adhering to the probe pin 162 can be scraped off.

In addition, the test piece 8 is plastically deformed in the present embodiment, but is not limited thereto, and may be elastically deformed. In this case, the material that is elastically deformed is not particularly limited. For example, it is preferable to use a low-repulsion material such as urethane rubber. Thereby, a contact trace can be maintained.

<Fifth Embodiment>
Hereinafter, the fifth embodiment of the electronic component transport apparatus and the electronic component inspection apparatus of the present invention will be described with reference to FIGS. 23 to 30. However, the differences from the above-described embodiment will be mainly described and the same matters will be described. Will not be described.

This embodiment is the same as the first embodiment except that the method for adjusting the position and orientation of the IC device when the IC device is placed on the inspection unit is different.

As shown in FIGS. 23 to 29, in this embodiment, the inspection unit 16 includes a guide pin 165 that protrudes upward, and a guide pin 1 that protrudes upward similarly to the guide pin 165.
66. The guide pin 165 and the guide pin 166 are disposed via the recess 161.

An imaging unit (second imaging unit) 27 is disposed above the inspection unit 16. The imaging unit 27
Similar to the imaging unit 26, it is configured by various cameras such as a CCD (Charge Coupled Devices) camera and a three-dimensional camera. The imaging unit 27 has its imaging direction facing downward, and can image the inspection unit 16. Thus, to obtain the inspection unit image IM ₄ (see FIG. 30).

Further, the device transport head 17A (device transport head 17) is provided with a guide plate 17
1 The guide plate 171 is connected to the base 94 of the hand unit 9, for example. The guide plate 171 includes a large opening 172, a guide hole 173, and a guide hole 1.
74 is formed to penetrate therethrough. A holding portion 98 of the hand unit 9 is disposed inside the large opening 172. The large opening 172 has a position adjustment mechanism 92 and a posture adjustment mechanism 93.
Even if the holding portion 98 is displaced by the operation of, the size is large enough not to interfere with the holding portion 98. The guide hole 173 is a portion into which the guide pin 165 of the inspection unit 16 is fitted,
The guide hole 174 is a portion into which the guide pin 166 is fitted (see FIG. 29).

Next, an operation (an example) until the hand unit 9 (device transport head 17A) transports the IC device 90 to the inspection unit 16 and can inspect the IC device 90 in the inspection area A3 will be described. To do.

As shown in FIG. 23, the hand unit 9 has not yet gripped the IC device 90, and is located immediately above the device supply unit 14A. Then, in this state, by operating the imaging unit 27 to obtain an inspection unit image IM _4. From the inspection section image IM _4,
And the center _{O 162a} of the reference probe pin 162a, and the center _{O 165} of the guide pin 165 is detected (see FIG. 30). Thereby, the positional relationship between the center O _162a and the center O ₁₆₅ , that is, where the center O _162a is located with respect to the center O ₁₆₅ is detected. Each detection is performed by the control unit 800.

Next, as shown in FIG. 24, the hand unit 9 is lowered until the hand unit 9 comes into contact with the IC device 90 placed on the device supply unit 14 </ b> A. Thereby, the IC device 90 can be gripped by the hand unit 9.

Next, as shown in FIG. 25, the hand unit 9 is raised to the same height as the hand unit 9 in FIG.

Next, as shown in FIG. 26, the hand unit 9 is moved to the Y direction positive side, that is, the inspection unit 16.
Move to the side and stop temporarily in the middle. The stop position of the hand unit 9 is the imaging unit 2
There is an IC device 90 immediately above 6, which is a position where the imaging device 26 can image the IC device 90. Then, by operating the imaging section 26 in this position, the device image IM 5 _(see FIG. 30) is obtained. From the device image IM _5, the center _{O 902a} reference terminal 902a, and the center _{O 173} of the guide hole 173 is detected (see FIG. 30). Accordingly, the positional relationship between the center O _902a and the center O ₁₇₃ , that is, the center O _902a is the center O _902a.
It is detected in which position it is with respect to ₁₇₃ . Each detection is performed by the control unit 800.

Then, the inspection unit image IM ₄ and the device image IM ₅ are compared (arrow C2), and the positional relationship between the center O _902a and the center O ₁₇₃ in the device image IM _{5 is} the center in the inspection unit image IM _4. At least one of the position and posture of the IC device 90 is adjusted so that the positional relationship is equivalent to the positional relationship between the O _162a and the center O ₁₆₅ . In the present embodiment, the position of the IC device 90 is adjusted by the operation of the position adjustment mechanism 92 of the hand unit 9, and the state after this adjustment is shown in FIG. Further, the device image IM ₅ ′ in FIG. 30 is a virtual image assumed by virtually assuming this adjusted state (arrow C3).

Next, as shown in FIG. 28, the hand unit 9 is further moved to the Y-direction positive side, that is, the inspection unit 16 side, and stopped just above the inspection unit 16.

Next, as shown in FIG. 29, the hand unit 9 is lowered. As a result, the reference terminal 902a of the IC device 90 and the reference probe pin 162a of the inspection unit 16 are connected so as to be conductive, and other remaining terminals 902 and the probe pin 162 are also connected to be conductive. Therefore, the IC device 90 can be inspected. In the present embodiment, when the adjustment is omitted, the reference terminal 902a of the IC device 90 and the reference probe pin 162a of the inspection unit 16 are not contacted, and as a result, the IC device 90 cannot be inspected. .

As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

In addition, the imaging unit is fixed in the inspection area, but is not limited thereto, for example,
It may be movable together with the device supply unit.

In addition, when adjusting the position or posture of the IC device, in each of the above embodiments, the contact mark is formed on the test piece and the adjustment is performed. However, the adjustment is not limited to this.
The contact mark may be formed on the electronic component and the adjustment may be performed.

DESCRIPTION OF SYMBOLS 1 ... Electronic component inspection apparatus, 10 ... Electronic component conveyance apparatus, 11A ... Tray conveyance mechanism, 11B ...
Tray transport mechanism, 12 ... temperature adjustment unit, 13 ... device transport head, 14 ... device supply unit, 14A ... device supply unit, 14B ... device supply unit, 141 ... concave (pocket), 15
... Tray transport mechanism, 16 ... Inspection part, 161 ... Recess (pocket), 162 ... Probe pin (
(Placement side terminal), 162a ... Reference probe pin (Placement side reference terminal), 163 ... Pin member, 164 ... Marker applying part, 165 ... Guide pin, 166 ... Guide pin, 17 ... Device transport head, 17A ... Device transport head, 17B ... Device transport head, 171 ... Guide plate, 172 ... Large opening, 173 ... Guide hole, 174 ... Guide hole, 18 ... Device recovery part, 18A ... Device recovery part, 18B ... Device recovery part, 19 ... Tray for collection, 20
... device transport head, 21 ... tray transport mechanism, 22A ... tray transport mechanism, 22B ... tray transport mechanism, 231 ... first partition, 232 ... second partition, 233 ... third partition, 234 ... fourth partition, 235 ... first 5 partition walls, 241 ... front cover, 242 ... side cover, 243 ... side cover, 244 ... rear cover, 245 ... top cover, 25 ... conveying section, 26 ... imaging section,
27 ... Imaging unit (second imaging unit), 8 ... Test piece, 81 ... Base material, 82 ... Microcapsule layer, 8
21 ... Contact mark, 821a ... Reference contact mark, 83 ... Marker, 84 ... Clay layer, 841 ... Contact mark, 9 ... Hand unit, 911 ... First piezoelectric actuator, 911a ... Projection, 912 ...
Second piezoelectric actuator, 913... Third piezoelectric actuator (piezoelectric actuator for rotating portion), 913a... Projection, 92... Position adjustment mechanism, 93.
941 ... Plate-like part, 942 ... Engagement part, 943 ... Engagement part, 947 ... Contact part, 947a ... Lower surface,
948 ... Copying mechanism (compliance mechanism), 95 ... First moving part, 951 ... Base part, 952
... rail, 953 ... rail, 954 ... first fixed part, 956 ... engaging part (guide part), 96 ... second moving part, 961 ... base part, 961a ... surface, 963 ... rail, 97 ... rotating part (rotation) Part), 9
71 ... Supporting part, 98 ... Holding part, 981 ... Adsorption surface, 982 ... Adsorption hole, 983 ... Decompression pump,
DESCRIPTION OF SYMBOLS 99 ... Shaft, 90 ... IC device, 902 ... Terminal (electronic component side terminal), 902a ... Reference terminal (electronic component side reference terminal), 200 ... Tray, 300 ... Monitor, 301 ... Display screen, 400 ... Signal lamp, 500 ... Speaker, 600 ... Mouse base, 700 ... Operation panel, 800 ... Control unit, A1 ... Tray supply area, A2 ... Device supply area, A3 ... Inspection area, A4 ... Device collection area, A5 ... Tray removal area, C1 ... Arrow , C2 ... arrow, C3 ... arrow, IM ₁ ... first image, IM ₂ ... second image, IM ₃ ... composite image, IM ₄ ... inspection part image, I
M ₅ ... Device image, IM ₅ '... Device image, O _162a ... Center, O ₁₇₃ ... Center, O
_821a ... center, O _902a ... center, α _9Y ... arrow, α _9Z ... arrow, α _11A ... arrow, α
_11B : Arrow, α _13X … Arrow, α _13Y … Arrow, α ₁₄ … Arrow, α ₁₅ … Arrow, α _17
Y ... arrow, α ₁₈ ... arrow, α _20X ... arrow, α _20Y ... arrow, α ₂₁ ... arrow, α _22A ...
Arrow, α _22B ... Arrow, α ₉₀ ... Arrow, β _9Y ... Arrow, β _9Z ... Arrow, ΔY ... Deviation amount

Claims (10)

An electronic component is placed, and an electronic component placement portion having a contact trace forming portion capable of forming a contact trace on the electronic component or the test piece can be disposed.
Gripping and transporting the electronic component or the test piece, and a gripping portion capable of pressing the electronic component or the test piece against the contact mark forming portion;
An imaging unit capable of imaging the electronic component or the test piece gripped by the gripping unit;
With
The imaging unit captures the first image of the test piece after the gripping part grips the test piece and contacts the contact mark forming part, and the gripping part after capturing the first image. Taking a second image of the gripped electronic component,
The electronic component transporting device, wherein the gripper is capable of adjusting at least one of a position and an attitude of the electronic component with respect to the electronic component placement unit based on the first image and the second image. apparatus. The electronic component placement part has a plurality of placement part side terminals connected to the electronic component in a conductive manner,
2. The electronic component carrying device according to claim 1, wherein the contact mark forming portion is configured by at least one placement portion side terminal among the plurality of placement portion side terminals. The electronic component placement part has a plurality of placement part side terminals connected to the electronic component in a conductive manner,
The electronic component carrying device according to claim 1, wherein the contact mark forming portion is configured by a portion different from the placement portion side terminal. The electronic component conveying apparatus according to claim 1, wherein the first image includes an image of the contact mark, and the second image includes an image of a terminal of the electronic component. The electronic component placement portion has a plurality of placement portion side terminals, and at least one placement portion side terminal of the plurality of placement portion side terminals serves as the contact mark forming portion. Side reference terminal,
The electronic component has an electronic component side reference terminal that is conductively connected to the placement portion side reference terminal.
The gripping unit is configured so that the position of the electronic component side reference terminal in the second image is aligned with the position of the contact mark formed by the placement unit side reference terminal in the first image. The electronic component conveying apparatus according to claim 4, wherein at least one of a position and a posture of the component is adjusted. The electronic component transport apparatus according to claim 1, wherein the grip portion includes a position adjustment mechanism that adjusts a position of the electronic component, and a posture adjustment mechanism that adjusts a posture of the electronic component. The electronic component transport apparatus according to claim 6, wherein the position adjustment mechanism moves the electronic component in a direction perpendicular to the vertical direction. The electronic component transport apparatus according to claim 6, wherein the posture adjustment mechanism rotates the electronic component around a vertical axis. The said test piece has a member which can be discolored or deformed by applying force.
The electronic component conveying apparatus described in 1. An electronic component placement unit on which an electronic component is placed and has a contact mark forming part capable of forming a contact mark on the electronic component or the test piece;
Gripping and transporting the electronic component or the test piece, and a gripping portion capable of pressing the electronic component or the test piece against the contact mark forming portion;
An imaging unit capable of imaging the electronic component or the test piece gripped by the gripping unit;
With
The electronic component placement unit is an inspection unit that can be inspected by placing the electronic component,
The imaging unit captures the first image of the test piece after the gripping part grips the test piece and contacts the contact mark forming part, and the gripping part after capturing the first image. Taking a second image of the gripped electronic component,
The gripping part is capable of adjusting at least one of a position and a posture of the electronic component with respect to the electronic component placement part based on the first image and the second image. apparatus.

Images