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TWI702299B - Cu核球、焊接頭、焊膏及泡沫焊料 - Google Patents

Cu核球、焊接頭、焊膏及泡沫焊料 Download PDF

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Publication number
TWI702299B
TWI702299B TW108120074A TW108120074A TWI702299B TW I702299 B TWI702299 B TW I702299B TW 108120074 A TW108120074 A TW 108120074A TW 108120074 A TW108120074 A TW 108120074A TW I702299 B TWI702299 B TW I702299B
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TW
Taiwan
Prior art keywords
ball
mass
solder
core
less
Prior art date
Application number
TW108120074A
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English (en)
Chinese (zh)
Other versions
TW202003869A (zh
Inventor
川﨑浩由
近藤茂喜
須藤皓紀
��屋政人
八嶋崇志
六本木貴弘
相馬大輔
Original Assignee
日商千住金屬工業股份有限公司
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Publication of TW202003869A publication Critical patent/TW202003869A/zh
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Publication of TWI702299B publication Critical patent/TWI702299B/zh

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    • H10W72/07251—
    • H10W72/20—

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  • Powder Metallurgy (AREA)
TW108120074A 2018-06-12 2019-06-11 Cu核球、焊接頭、焊膏及泡沫焊料 TWI702299B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-111878 2018-06-12
JP2018111878A JP6485581B1 (ja) 2018-06-12 2018-06-12 Ｃｕ核ボール、はんだ継手、はんだペースト及びフォームはんだ

Publications (2)

Publication Number Publication Date
TW202003869A TW202003869A (zh) 2020-01-16
TWI702299B true TWI702299B (zh) 2020-08-21

Family

ID=65802258

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108120074A TWI702299B (zh) 2018-06-12 2019-06-11 Cu核球、焊接頭、焊膏及泡沫焊料

Country Status (2)

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JP (1) JP6485581B1 (ja)
TW (1) TWI702299B (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105392580A (zh) * 2013-06-19 2016-03-09 千住金属工业株式会社 Cu芯球

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105392580A (zh) * 2013-06-19 2016-03-09 千住金属工业株式会社 Cu芯球

Also Published As

Publication number Publication date
TW202003869A (zh) 2020-01-16
JP2019214761A (ja) 2019-12-19
JP6485581B1 (ja) 2019-03-20

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