TWM621477U - Close loop liquid cooling burn-in apparatus - Google Patents

Abstract

The creation discloses a close loop liquid cooling burn-in apparatus including at least one burn-in socket having a base seat for receiving a DUT and a lid movably connecting to the base seat. The lid includes a liquid cooling body having an inlet member for receiving cooling liquid, an outlet member for exhausting the cooling liquid and a contact member for contacting the DUT when the lid is locked. The liquid cooling body further has a heat exchanging channel extending between the inlet member and the outlet member.

Description

Closed loop liquid cooling burner device

This creation is about a burn-in test device, especially a burn-in test device that adopts a liquid cooling mechanism to control the test temperature.

In the semiconductor or PCB industry, burn-in or burn-in is a process of testing wafers or chips, and a plurality of chips to be tested (ie DUT) will be correspondingly installed on the test seat of the burn-in board Various items of testing, such as temperature, stress, frequency, etc., are performed on the chip to determine the yield of the chip.

The packaged integrated circuit (IC) usually needs to undergo a burn-in test for a certain period of time to ensure that the IC product can operate in a harsh environment. The first figure shows a schematic diagram of a known burn-in socket. A packaged chip (100) is accommodated in a base (102) on a circuit board (101), and the bottom of the chip (100) is electrically connected to a plurality of signal contacts in the base (102) (eg pogo pin). During the test, a cover (103) with a heat dissipation unit is combined with the base (102) and contacts the chip (100) with a water-cooled head at the bottom, and contacts the top of the chip (100) with a contact portion (1031). Generally speaking, the heat dissipation unit of the cover body (103) is formed by a plurality of heat dissipation fins (1032) arranged in a specific form, and these heat dissipation fins (1032) are connected with the contact part (1031), so that the test period is The heat accumulated on the top of the chip (100) is conducted to the heat dissipation fins (1032) through the contact portion (1031), and dissipated by air convection. In the known design, an additional fan is provided on the heat dissipation fin (1032) to increase convection, or a plurality of conduits to help heat conduction are provided between the contact portion (1031) and the heat dissipation fin (1032), thereby Improve the heat dissipation capacity of the burn-in socket. However, with the advent of the 5G and AI era, the demand for higher power ICs has increased, and the burn-in test for high-power ICs has become more stringent. For example, in the burn-in process, the heat generated by high-power IC chips, such as a heat source greater than 1500 watts, may not meet the test of such devices with the above-mentioned air-cooled burn-in socket.

Compared with the air cooling mechanism, the known liquid cooling mechanism has more advantages, such as reducing the volume occupied by the fan disposed in the heating core, and increasing the contact area between the heat dissipation interface and the heating element. However, currently, liquid cooling mechanisms are commonly found in high-end electronic products, but in the past, the maintenance and configuration costs of the liquid cooling mechanism were considered, and they were not generally applied to the burn-in device. Therefore, how to effectively integrate the liquid cooling mechanism into a burn-in device including a plurality of burn-in sockets is a development goal of the industry.

The purpose of the present invention is to provide a closed-loop liquid-cooled burn-in device, which is provided with a closed loop for conveying cooling liquid, comprising: at least one burn-in socket, which has a base and an upper cover, wherein the base is used to receive a For the device to be tested, the upper cover is movably connected to the base, so that the upper cover can move between a locking position and a releasing position. The upper cover includes: a water block disposed in the closed circuit and having an inflow portion for receiving cooling liquid, an outflow portion for discharging cooling liquid, and contacting the device to be tested when the upper cover is in the locked position A contact part of the water cooling head also has a heat exchange channel extending between the inflow part and the outflow part. Wherein, at least one of the inflow part and the outflow part is provided with a pump for determining the flow rate of the cooling liquid in the heat exchange channel.

In a specific embodiment, the water cooling head has a water cooling plate with a top and a bottom, the inflow portion and the outflow portion are connected to the top of the water cooling plate, and the bottom of the water cooling plate faces in the locked position. the device under test.

In a specific embodiment, the inflow portion and the outflow portion respectively have a longitudinal channel, and the bottom end of the longitudinal channel is connected to the heat exchange channel.

In a specific embodiment, the contact portion of the water cooling head has a heating head, which is located at the bottom of the water cooling head, and is configured with one or more heaters, and the heaters are located below the heat exchange channel.

In a specific embodiment, the water cooling head has a plurality of fins, which are accommodated in the heat exchange channel, so that the cooling liquid contacts the fins when passing through the heat exchange channel.

In a specific embodiment, wherein the water cooling head has a water cooling plate and a heating head, the heating head is detachably connected to the bottom of the water cooling plate, so that when the heating head is connected with the water cooling plate, the water cooling plate is The lower surface of the heating head and an upper surface of the heating head form the heat exchange channel.

In a specific embodiment, wherein the water cooling head has a water cooling plate and a heating head which are connected in a detachable manner, the lower surface of the water cooling plate has a groove, and an upper surface of the heating head is a flat surface, so that the When the water cooling plate and the heating head are connected, the grooves on the lower surface of the water cooling plate and the upper surface of the heating head form the heat exchange channel.

In a specific embodiment, the closed-loop liquid-cooled burn-in device includes a first burn-in socket and a second burn-in socket, wherein the pump of the water block of the first burn-in socket and the pump of the second burn-in socket The pumps of the water blocks are respectively electrically connected to the respective controllers, so that the pump of the first burn-in socket and the pump of the second burn-in socket are operated at different motor speeds.

Another object of the present invention is to provide a closed-loop liquid-cooled burn-in device, which is provided with a closed loop for conveying cooling liquid, comprising: at least one burn-in socket, which has a base and an upper cover, wherein the base is used for For receiving a device under test, the upper cover is movably connected to the base so that the upper cover can move between a locking position and a releasing position. The upper cover includes: a water block disposed in the closed circuit and having an inflow portion for receiving cooling liquid, an outflow portion for discharging cooling liquid, and contacting the device to be tested when the upper cover is in the locked position A contact part of the water cooling head also has a heat exchange channel extending between the inflow part and the outflow part. Wherein, the water cooling head has a water cooling plate connected between the inflow part and the outflow part, the contact part of the water cooling head has a heating head, the water cooling plate and the heating head are detachably connected, and when the water cooling head is When the plate is connected to the heating head, a lower surface of the water cooling plate and an upper surface of the heating head form the heat exchange channel.

A further object of the present invention is to provide a closed-loop liquid-cooled burn-in device, which is provided with a closed loop for conveying cooling liquid, including: at least one burn-in socket, which has a base and an upper cover, wherein the base is used for For receiving a device under test, the upper cover is movably connected to the base so that the upper cover can move between a locking position and a releasing position. The upper cover includes: a water block disposed in the closed circuit and having an inflow portion for receiving cooling liquid, an outflow portion for discharging cooling liquid, and contacting the device to be tested when the upper cover is in the locked position A contact part of the water cooling head also has a heat exchange channel extending between the inflow part and the outflow part. a radiator with a collecting part for recovering the cooling liquid from the at least one burn-in socket, a diverting part for supplying the cooling liquid to the at least one burn-in socket, and a heat exchange channel extending between the collecting part and the at least one burn-in socket The split parts and the fans are arranged on one side of the heat exchange channel.

In a specific embodiment, the heat sink has a front end and a rear end opposite to the front end, the front end of the heat sink is connected to a burn-in carrier board carrying the at least one burn-in socket, and the rear end of the heat sink The fans and the heat exchange channel are configured.

In a specific embodiment, the heat sink has a bottom plate, the bottom plate has a front end and a rear end, the front end of the bottom plate is configured with the collecting part and the shunt part, and the rear end of the bottom plate is configured with the fans and the heat exchange channel.

In a specific embodiment, the collecting part includes a water tank and a plurality of ports, the diverting part includes a water tank and a plurality of ports, and the ports of the collecting part and the diverting part are respectively arranged along a straight direction.

In a specific embodiment, wherein the heat dissipation radiator has a pair of side walls, the collecting part, the shunt part, the fans and the heat exchange channel are arranged between the pair of side walls, and the distance between the pair of side walls is arranged as It is suitable for connection with a burn-in carrier board carrying the at least one burn-in socket.

In a specific embodiment, the heat dissipation radiator further has a pump and a flow meter, which are disposed between the heat exchange channel and the branch portion.

A further object of the present invention is to provide a closed-loop liquid-cooled burn-in device, which is provided with a closed loop for conveying cooling liquid, including: a first burn-in socket with a first water-cooled head, disposed in the closed loop and It has a first inflow part for receiving cooling liquid, a first outflow part for discharging cooling liquid, and the first water block also has a first heat exchange channel extending between the inflow part and the outflow part ; and a second burn-in socket with a second water block disposed in the closed circuit and having a second inflow portion for receiving cooling liquid, a second outflow portion for discharging cooling liquid, the first The two water blocks also have a second heat exchange channel extending between the inflow portion and the outflow portion. Wherein, the first heat exchange channel and the second heat exchange channel are connected in parallel.

The present invention will be described more fully below with reference to the drawings, and by way of illustration specific example embodiments. However, the claimed subject matter may be embodied in many different forms, and thus the construction of the claimed subject matter covered or claimed is not limited to any example embodiments disclosed in this specification; the example embodiments are merely illustrative. Again, this creation is intended to provide a reasonably broad scope for the claimed subject matter claimed or covered.

The phrase "in one embodiment" used in this specification does not necessarily refer to the same specific embodiment, and the use of "in other (some/some) embodiments" in this specification does not necessarily refer to a different specific embodiment. It is intended, for example, that the claimed subject matter includes combinations of all or part of the exemplary embodiments.

The second figure shows a perspective view of an embodiment of the closed-loop liquid-cooled burn-in device of the present invention. The third figure shows a top view of this embodiment. It should be understood that the closed-loop liquid-cooled burn-in device of the present invention needs to be further inserted into a test chamber (not shown) to receive the power signal and test signal provided by the test chamber to achieve the purpose of testing. The cooling liquid circuit of the present invention does not pass through the test cavity, so the technical content of the test cavity is omitted.

As shown in Figures 2 and 3, the closed-loop liquid-cooled burn-in device of the creation is provided with one or more closed circuits for conveying the cooling liquid, and the creation device can be divided into a host module (1) and a plurality of a test module (2), wherein the host module (1) includes a heat sink (10), the test modules (2) are arranged on a burn-in carrier board (11), and each test module ( 2) Responsible for testing a device under test (DUT, not shown). The burn-in carrier board (11) has a long side (parallel to the X-axis) and a short side (parallel to the Y-axis). The host module (1) is generally connected to the short side of the burn-in carrier board (11) to meet the above Spatial configuration of the test chamber. In a known method, an extension board can be used to connect the host module (1) or the burn-in carrier board (11) to the test cavity.

The closed circuit for conveying coolant passes through the host module (1) and one or more test modules (2) on the burn-in carrier board (11), so that the coolant with lower temperature is transported from the host module (1) to the In the test module (2), the coolant with higher temperature is transported from the test module (2) back to the host module (1) for heat exchange. Referring to the third figure, the host module (1) has a circuit board, also known as the host circuit board (H), which is mainly used to monitor the coolant flow and temperature of the host module. A test circuit (T) of a burn-in socket, which is electrically connected to the host circuit board (H), and is mainly used to monitor the coolant flow of the test module and the temperature of the socket.

The fourth figure A shows a burn-in socket included in the test module (2), which has a base (21) and an upper cover (22). The base (21) is electrically connected to the aforementioned burn-in carrier board (11) and is used for accommodating a device to be tested (eg, a wafer). Besides, the base (21) may have a known configuration, so the relevant details will not be repeated here. The upper cover (22) is movably connected to the base (21), such as in a pivoting manner, whereby the upper cover (22) can be moved between a locking position and a releasing position, as shown in Figure 4 B and Figure 4, respectively. Four C diagrams.

The upper cover (22) has a cover (23) and a water cooling head (24). The cover (23) defines a space for accommodating the water-cooling head (24), and a plurality of hollows are formed on the side surface (such as the XZ plane) of the cover (23) so that the conveying pipeline of the cooling liquid can pass through the cover (23) and Connect the water block (24). One side of the cover (23) is connected to the base (21) by a pivot and is used to stabilize the water block (24). In other possibilities, a fan may be provided on one side of the cover (23) to enhance the heat dissipation effect of the burn-in socket.

As shown in Figure 4B and Figure 4C, when the upper cover (22) is in the locked position, the cover (23) locks the water block (24), so that the contact part at the bottom of the water block (24) properly presses the device to be tested ( not shown), which can absorb the heat generated by the device under test during the test; when the upper cover (22) is in the release position, the cover (23) is lifted to release the water block (24), so that the water block ( 24) It can be removed from the upper surface of the device under test, and the device under test can be taken out from the base (21). In addition, it is known that an elastic mechanism (such as a spring) can be appropriately configured in the upper cover (22), so that the water block (24) can touch the device under test with an appropriate downward pressure when it is in the locked position, so as to avoid damage to the device under test. . In other embodiments, the shield (23) and the waterblock (24) may be configured to pivot synchronously, ie when the shield (23) moves from the locked position to the release position, the waterblock (24) also moves together , so the transmission line connecting the water block (24) is preferably made of flexible material, but this creation is not limited by this.

Figure 5 A shows the water block ( 24 ) with the aforementioned base ( 21 ) and cover ( 23 ) removed, which has a housing ( 240 ), an inflow portion ( 241 ) for receiving closed-circuit coolant and An outlet (242) is used to drain the coolant to the closed circuit. One side of the housing (240) is hollowed out to expose the connection ports of the inflow part (241) and the outflow part (242), which are configured as pipeline connectors suitable for connecting the cooling liquid.

The fifth drawing B shows the removal of the housing (240) to expose the entirety of the inflow (241) and outflow (242). Figure 5 C shows the structure of a water cooling plate (243) after partially removing the inflow portion (241) and outflow portion (242). Both the inflow part (241) and the outflow part (242) are fixed to the top of the water cooling plate (243) in an appropriate manner. The inflow part (241) is configured to receive a pump of the cooling liquid and push the received cooling liquid to the water cooling plate (243) by the pump. As shown in Figure 5 B, the cooling liquid will enter the inflow part (241) along the Y direction, and a guide pipe (244) extends longitudinally along the Z direction to the top of the water cooling plate (243), and is connected with the fifth C An entry (245) of the diagram is connected. Therefore, the cooling liquid enters the inflow part (241) in the Y direction and then enters the inlet (245) of the water cooling plate (243) in the Z direction.

The sixth picture A is the fifth picture C according to the cross section of the AA line. It can be seen that a longitudinal channel (246) extends downward from the inlet (245) to the lower surface of the water cooling plate (243) for longitudinally transporting the cooling liquid. Referring back to Figure 5B, the inflow section (241) includes a motor (not shown) that provides pumping operation, the rotational speed of which is monitored by a controller.

The cooling liquid enters the outflow part (242) after passing through the water cooling plate (243) along the -X direction. Referring also to the sixth picture B, which is the section of the fifth picture C according to line BB, it is shown that the outflow part (242) has a longitudinal channel (247) for the cooling liquid to be transported in the Z direction and leave the outflow part ( 242). The outflow part (242) is not equipped with a motor as a pump, which means that the outflow part (242) is only a conveying path, but the present invention is not limited to this. In one possible configuration, such as a coolant leak detection mechanism, the outflow portion (242) may be configured with another pump with a different delivery direction than the inflow portion (241), so that the coolant is not only in the closed circuit Can be transported in one direction.

In other possible embodiments, the inflow part (241) and the outflow part (242) may be configured with a mechanism for diverting the cooling liquid. In other words, although not shown, the inflow part (241) and the outflow part (242) of the fifth B diagram may be provided with other outlets or inlets on the +Y side, so that the inflow part (241) can direct the cooling liquid in the +Y direction. Diverted from the -Z direction, the outflow part (242) joins the cooling liquid entering in the -Y direction and the cooling liquid in the +Z direction, and then discharges it in the -Y direction, but this creation is not limited by this.

The bottom of the water block (24) has a contact portion for contacting the device under test accommodated in the base. The seventh figure is a cross section according to the line CC of the fifth figure C, and the configuration of the top of the water cooling plate ( 243 ) is omitted. The contact part (248) of the water cooling head (24) extends from the lower surface of the water cooling plate (243), and forms a contact surface whose size is the same as the area of the upper surface of the device to be tested. The contact part (248) includes a heating head (249), which is detachably connected to the water cooling plate (243). Specifically, the upper surface of the heating head (249) is connected to the lower surface of the water cooling plate (243), and the lower surface of the heating head (249) serves as the contact surface of the device to be tested. As shown, the heating head (249) has a hole for embedding heating pipes or heating coils, so that the temperature of the heating head can be monitored by a controller.

The water block (24) has a heat exchange channel (250) extending between the inflow part (241) and the outflow part (242). Specifically, the two ends of the heat exchange channel (250) are respectively connected to the aforementioned longitudinal channels (246, 247), receiving the cooling liquid with lower temperature from the inflow part (241) and discharging the cooling liquid with higher temperature to the outflow part (241). 242). The length, width and height of the heat exchange channel (250) are both smaller than those of the water cooling plate, but the length and width should preferably cover the upper surface of the heating head (249) as much as possible.

As shown in the figure, the heat exchange channel (250) is jointly defined by the water cooling plate (243) and the heating head (249). A groove (251) is formed on the lower surface of the water-cooling plate (243), and the upper surface of the heating head (249) is a flat surface, so when the water-cooling plate (243) and the heating head (249) are connected, the heat can be jointly defined. Swap channels (250), but this creation is not limited by this. Preferably, the heat exchange channel (250) further accommodates a plurality of fins (252), whereby the cooling liquid entering the heat exchange channel (250) is brought into contact with the fins to obtain a better heat exchange effect. In addition, the fins (252) are arranged in parallel so that the cooling liquid can reach the other end from one end of the fins along one direction, but the present invention is not limited to this.

The eighth figure shows another embodiment of the water block of the present invention, wherein neither the inflow part (241') nor the outflow part (242') is equipped with a pump, but the configuration of the water cooling plate (243) and the heating head (249) is still the same .

The ninth figure shows another embodiment of the water block of the present invention, which also includes an inflow part, an outflow part, a heat exchange channel, a contact part, etc., but the difference is that the inflow part and the outflow part not only have longitudinal channels, but also other transverse channels. Configuration.

Figure 10 alone shows the heat sink (10) of the host module (1) of the second figure, which has a front end (1000) for connecting to a burn-in carrier board and a rear end (1001) for heat exchange . Although not shown, the front end (1000) of the heat sink (10) can be provided with known electrical connection means, such as an extension plate or a corresponding busbar device, to connect the heat sink (10) to the on-board heater The boards are electrically connected to transmit control signals. The control signal mentioned here refers to the control of the test module by the host module, including the flow rate of the closed loop and the temperature control of the test socket. As for the power signal and test signal provided for the operation of the burn-in board, other power modules and drive modules are supplied, and these modules can be arranged in a known test cavity.

The heat sink (10) has a bottom plate (1002) which is substantially parallel to the burn-in carrier plate (11) of the second figure and extends between the front end (1000) and the rear end (1001). The heat dissipation radiator (10) also has a pair of side walls (1003) fixed on the bottom plate (1002) and extending between the front end (1000) and the rear end (1001). The bottom plate (1002) and the pair of side walls (1003) form a box for accommodating a collecting part (1004), a dividing part (1005), a plurality of fans (1006) and a heat exchange channel (not shown). The length of the bottom plate (1002) and the distance between the pair of side walls (1003) may be approximately equal to the width of the burn-in carrier to optimize space utilization efficiency.

The collecting part (1004) and the distribution part (1005) are arranged at the front end (1000) of the heat dissipation radiator (10), respectively receiving the cooling liquid returned from the test modules and distributing the cooling liquid to each test module. The collecting part (1004) and the diverting part (1005) are respectively a long water tank, the length of which extends along the X direction. The collecting part (1004) and the branching part (1005) are respectively provided with a plurality of ports (1007) for connecting the pipeline connectors for conveying the cooling liquid. As shown in the figure, the ports (1007) of the collecting part (1004) and the shunt part (1005) are arranged along the Y direction, and the ports of the front row part (ie the shunt water tank) and the rear row part (ie the collecting water tank) are presented A staggered arrangement, thereby optimizing the number of lines that can be connected.

One end of the water tank of the collecting part (1004) is connected with a pipeline (1008), which is used for transporting the collected cooling water to the heat exchange channel located at the rear end (1001). One end of the water tank of the shunt part (1005) is connected to another pipeline (1009), which is used to transport the cooled cooling water to the water tank of the shunt part (1005). Although not shown, those skilled in the art will appreciate that the heat exchange flow channels can have a variety of known forms. The rotation speed of the fan (1006) can be monitored by a controller to generate convection on the heat exchange channel, so that the coolant with a higher temperature can be cooled after passing through the heat exchange channel.

The radiator (10) can also have a flowmeter and a pump (1010), wherein the flowmeter can be arranged at the pipeline (1009) to detect the flow of the cooling liquid in the radiator (10), but this is not the purpose of this creation limit. The motor speed of the pump (1010) can be monitored by a controller to determine the flow of coolant in the radiator. The heat sink (10) also has a circuit board (H), which is installed at the position shown in the third figure or can be installed on the inner side of the pair of side walls (1003), and is provided with one or more circuits for monitoring the heat sink (10). a controller. One or more temperature sensors can be disposed at the front and rear ends of the heat exchange channels to obtain the temperature change value, but the present invention is not limited to this.

Figure 11 shows the flow direction of the coolant in the closed circuit, at least through a first burn-in socket and a second burn-in socket, which respectively include a first water block (1100) and a second water block (1200 ). The branching part (105) of the host module (1) transports the cooling liquid with lower temperature to a first inflow part (1101) of the first water-cooling head (1100) through a pipeline. The first inflow portion (1101) is configured to divert the cooling liquid to the first heat exchange channel (1102) and the second inflow portion (1201) of the second water block (1200). The second inflow portion (1201) guides the cooling liquid into the second heat exchange channel (1202). The first outflow part of the first water block (1100) receives the first heat exchange channel (1102) and the higher temperature cooling liquid from the second outflow part (1203), and discharges the combined cooling liquid back to the host module (1 ), received by the collection unit (104) for subsequent heat exchange. The first heat exchange channel (1102) and the second heat exchange channel (1202) are respectively disposed above a device under test (not shown).

The closed circuit of this embodiment can be divided into a liquid inlet part for conveying lower temperature cooling liquid and a liquid return part for conveying higher temperature cooling liquid, wherein the liquid inlet part includes the shunt part (105) of the host module (1), the first part An inflow part (1101) and a second inflow part (1201), and the liquid return part includes a collection part (104), a first outflow part (1103) and a second outflow part (1203) of the host module (1). One ends of the first heat exchange flow channel (1102) and the second exchange flow channel (1202) are connected to the liquid inlet part of the closed circuit, and the other ends of the first heat exchange flow channel (1102) and the second exchange flow channel (1202) Connect the liquid return portion of the closed loop. In other words, the first heat exchange channel (1102) and the second heat exchange channel (1202) are connected in parallel in the closed circuit. However, it should be understood that the specific embodiment of the closed loop of the present creation is not limited thereto. In other embodiments, the first inflow portion (1101) or the first outflow portion (1103) is configured with a first pump, and the second inflow portion (1201) or the second outflow portion (1203) is configured with a second pump The first pump and the second pump operate at different rotational speeds, so that the cooling liquid flow rate of the first heat exchange channel and the cooling liquid flow rate of the second heat exchange channel are different, thereby realizing temperature monitoring for different devices under test. .

Figure 12 illustrates the control configuration of the host module (1) in Figure 3, including a processor (30) on the host circuit board (H), which controls the host module (30) according to commands from a remote computer (31). 1) on the pump (P1) and fan (R). According to the control requirements, the host circuit board (H) can have more processors, such as MCU. Specifically, the processor (30) is used to determine the motor rotational speed value of the pump (P1) and the motor rotational speed value of the fan (R). The processor (30) also receives the temperature value returned by the temperature sensor (t) configured in the host module (1) and the flow value read by the flow meter (F1). The temperature sensor ( t1 ) may be a known diode sensor or RTD sensor. The remote computer (31) may be the computer provided in the test chamber itself or a remote computer connected to the test chamber via a network, and is used for various control settings of the host module (1).

Figure 13 illustrates the control configuration of the test module (2) in Figure 3, including the processor (40) on the test circuit board (T), which can be controlled according to the remote computer (31) and the host processor (30) control the pump (P2) and heater (TH) of the test module (2) as shown in the fifth figure. Specifically, the processor (40) determines the motor speed of the water block pump (P2) and the output power value of the water block bottom heater (TH). The processor (40) may also receive a temperature value returned by a temperature sensor (t2) configured in the water block or a surrounding pipeline and a flow rate value returned by the flow meter (F2).

It should be understood that the twelfth and thirteenth pictures are only one configuration, and the present creation is not limited thereto.

Figure 14 illustrates the control means of the host module (1) and one of the test modules (2). The host module (1) has a cooling controller A for reducing the temperature value of the coolant located in the host module (1). The cooling controller A makes the temperature sensor in the heat dissipation line read the temperature value of the coolant and transmit it to the PID controller. The PID controller outputs a PWM signal to the pump and the fan of the host module (1) according to the real-time sensed temperature value and a target temperature value, respectively, as shown in Figure 10 for the pump (1010) and the fan (1006) , which determines the rotational speed of its motor. The flow meter at the downstream end of the pump can read a flow value, which together with the rotational speed value of the fan motor is sent back to the cooling controller A as two control parameters.

The test module (2) has a cooling controller B, which reduces the temperature value of the water-cooling head of the burn-in socket according to the instructions of the host module (1). The cooling controller A on the host side can provide the real-time read control parameters, such as the pump motor speed value, fan motor speed value, coolant temperature value and flow value, etc. on the host side, to the cooling control module B on the test side as control. basis. The test module (2) also has a heating controller for increasing the temperature of the heater in the water block. According to this, different from the host side, the temperature control of the test side is actually realized by a cooling mechanism (- value) and a heating mechanism (+ value) working together (such as the direction of the dotted arrow), but this creation is not limited by this .

The cooling controller B at least makes the PID controller determine the motor speed value of the pump at the test end according to one or more parameters provided by the cooling controller A, so as to decide whether to increase or decrease the flow rate of the test end (that is, the heat exchange efficiency). On the other hand, the cooling controller B also causes the PID controller to determine the output power of the heater at the test end at least according to one or more parameters provided by the cooling controller A. For example, the PID controller determines the output power of a heater according to a target temperature of a test end and the real-time temperature value (ie, a temperature difference) read by a temperature sensor. The SSR controller can be used to amplify the output of the heater as an input parameter of the heater controller.

In addition, the cooling controller B can also match the parameters provided by the cooling controller A to increase or decrease the PID controller according to the motor speed value (or flow value) of the pump at the test end. It should be understood that the control strategy in Fig. 14 is only a basic example, and the specific control may vary according to actual requirements.

According to the above, the specific technical features of the closed-loop liquid-cooled burn-in device of the present creation have been clearly presented in different embodiments, which integrates the closed loop of the cooling liquid into the burn-in carrier board and the water-cooled head of the burn-in socket, and is matched with the heat sink configuration, so that the The overall closed loop conducts heat exchange at the test end to reduce the temperature of the test end, and on the other hand, it also conducts heat exchange at the host end to remove heat from the closed loop system.

1: host module 2: Test module 10: Heat sink 11: Burn-in carrier board 100: Wafer 101: Circuit Board 102: Pedestal 103: Cover 1031: Contact Department 1032: cooling fins 21: Pedestal 22: upper cover 23: Mask 24: water cooling head 240: Shell 241, 241’: Inflow Department 242, 242': Outflow 243: Water cooling plate 244: Guide tube 245: Entrance 246: Longitudinal channel 247: Longitudinal channel 248: Contact Department 249: Heating head 250: heat exchange channel 251: Groove 252: Fins 1000: front end 1001: Backend 1002: Bottom Plate 1003: Sidewall 1004: Collection Department 1005: Diversion Department 1006: Fan 1007: port 1008: Pipelines 1009: Pipelines 1010: Pump 1100: The first water block 1101: First Inflow Department 1102: First heat exchange channel 1103: First outflow 1200: Second water block 1201: Second Inflow Department 1202: Second exchange channel 1203: Second outflow 30: Processor 31: Remote computer 40: Processor H: host circuit board T: Test circuit P1, P2: pump F1, F2: flowmeter R: fan t1, t2: temperature sensor TH: heater

The present creation can be further understood with reference to the following drawings and descriptions. Non-limiting and non-exhaustive examples are described with reference to the following figures. The components in the drawings are not necessarily to actual size; the emphasis is on illustrating the structure and principles.

The first figure shows a schematic diagram of a known burn-in socket.

The second figure shows a perspective view of an embodiment of the closed-loop liquid-cooled burn-in device of the present invention.

The third figure shows a top view of this embodiment.

Figures 4A to 4C show a burn-in socket included in the test module.

Picture 5A shows the water block with the base and cover removed; Picture 5B shows the shell removed to expose the entire inflow and outflow parts; Picture 5C shows a water-cooled block after partially removing the inflow and outflow parts structure of the board.

The sixth picture A is the section of the fifth picture C according to the line AA; the sixth picture B is the section of the fifth picture C according to the line BB.

The seventh figure is a cross-section according to the line CC of the fifth figure C.

The eighth figure shows another embodiment of the water block of the present invention.

The ninth figure shows another embodiment of the water block of the present invention.

Figure 10 shows the heat sink of the host module in Figure 2 alone.

Figure 11 illustrates the flow direction of the coolant in the closed circuit.

Figure 12 illustrates the control configuration of the host module in Figure 3.

Figure 13 illustrates the control configuration of the test module in Figure 3.

Figure 14 illustrates the control means of the host module and one of the test modules.

243: Water cooling plate

248: Contact Department

249: Heating head

250: heat exchange channel

251: Groove

252: Fins

Claims (23)

A closed-loop liquid-cooled burn-in device is provided with a closed loop for conveying cooling liquid, comprising: At least one burn-in socket has a base and an upper cover, wherein the base is used to receive a device to be tested, and the upper cover is movably connected to the base, so that the upper cover can move between a locked position and a release position room, the cover contains: A water block, disposed in the closed circuit and having an inflow portion for receiving cooling liquid, an outflow portion for discharging cooling liquid, and a contact portion for contacting the device under test when the upper cover is in the locked position , the water cooling head also has a heat exchange channel extending between the inflow part and the outflow part, Wherein, at least one of the inflow part and the outflow part is provided with a pump for determining the flow rate of the cooling liquid in the heat exchange channel. The closed-loop liquid-cooled burn-in device as claimed in claim 1, wherein the water-cooled head has a water-cooled plate, the water-cooled plate has a top and a bottom, the inflow portion and the outflow portion are connected to the top of the water-cooled plate, and the water-cooled plate has a top and a bottom. The bottom of the water-cooling plate faces the device under test in the locked position, wherein the heat exchange channel extends in the water-cooling plate. The closed-loop liquid-cooled burn-in device according to claim 1, wherein the inflow part and the outflow part respectively have a longitudinal channel, the bottom end of the longitudinal channel is connected to the heat exchange channel, and the inflow part or the outflow part has a longitudinal channel. A longitudinal channel is connected to the pump. The closed-loop liquid-cooled burn-in device as claimed in claim 1, wherein the contact portion of the water-cooled head has a heating head, which is located at the bottom of the water-cooled head, and is equipped with one or more heaters, and the heaters are located in the thermal head. Below the exchange channel, when in the locked position, the heater head contacts the device under test in the base. The closed-loop liquid-cooled burn-in device according to claim 1, wherein the water-cooled head has a plurality of fins, which are accommodated in the heat exchange channel, so that the cooling liquid contacts the fins when passing through the heat exchange channel, the The fins are arranged in parallel so that the cooling fluid flows from one end of the fins to the other in one direction. The closed-loop liquid-cooled burn-in device as claimed in claim 1, wherein the water-cooled head has a water-cooled plate and a heating head, and the heating head is detachably connected to the bottom of the water-cooled plate, so that when the heating head is connected to the When the water cooling plate is connected, a lower surface of the water cooling plate and an upper surface of the heating head form the heat exchange channel, and the bottom ends of a longitudinal channel of the inflow portion and the outflow portion are located on the lower surface of the water cooling plate. The closed-loop liquid-cooled burn-in device as claimed in claim 1, wherein the water-cooled head has a water-cooled plate and a heating head connected in a detachable manner, the lower surface of the water-cooled plate has a groove, and the heating head has a groove on its lower surface. An upper surface is a flat surface, and when the water-cooling plate and the heating head are connected, the grooves on the lower surface of the water-cooling plate and the upper surface of the heating head form the heat exchange channel. The closed-loop liquid-cooled burn-in device as claimed in claim 1, comprising a first burn-in socket and a second burn-in socket, wherein the pump of the water block of the first burn-in socket and the second burn-in socket The pumps of the water blocks are respectively electrically connected to respective controllers, so that the pump of the first burn-in socket and the pump of the second burn-in socket are operated at different motor speeds. A closed-loop liquid-cooled burn-in device is provided with a closed loop for conveying cooling liquid, comprising: At least one burn-in socket has a base and an upper cover, wherein the base is used to receive a device to be tested, and the upper cover is movably connected to the base, so that the upper cover can move between a locked position and a release position room, the cover contains: A water block, disposed in the closed circuit and having an inflow portion for receiving cooling liquid, an outflow portion for discharging cooling liquid, and a contact portion for contacting the device under test when the upper cover is in the locked position , the water cooling head also has a heat exchange channel extending between the inflow part and the outflow part, Wherein, the water cooling head has a water cooling plate connected between the inflow part and the outflow part, the contact part of the water cooling head has a heating head, the water cooling plate and the heating head are detachably connected, and when the water cooling head is When the plate is connected to the heating head, a lower surface of the water cooling plate and an upper surface of the heating head form the heat exchange channel. The closed-loop liquid-cooled burn-in device as claimed in claim 9, wherein the inflow portion and the outflow portion are connected to the top of the water-cooled plate, and respectively have a longitudinal channel, and the bottom end of the longitudinal channel is connected to the heat exchange channel , the longitudinal channel of the inflow part or the outflow part is connected to a pump of the water block. The closed-loop liquid-cooled burn-in device as claimed in claim 9, wherein the water-cooled head has a plurality of fins and is accommodated in the heat exchange channel, so that the cooling liquid contacts the fins when passing through the heat exchange channel, the The fins are arranged in parallel so that the cooling fluid flows from one end of the fins to the other in one direction. The closed-loop liquid-cooled burn-in device of claim 9, wherein the heating head accommodates one or more heaters, and when the heating head is connected to the water-cooled plate, the heaters are located below the heat exchange channel , when in the locked position, the heating head contacts the device under test in the base. The closed-loop liquid-cooled burn-in device as claimed in claim 9, wherein a groove is formed on the lower surface of the water-cooled plate, and when the water-cooled plate is connected to the heating head, the groove and the upper surface of the heating head define a the heat exchange channel. The closed-loop liquid-cooled burn-in device according to claim 9, wherein the length, width and height of the heat exchange channel are smaller than the length, width and height of the water cooling plate. A closed-loop liquid-cooled burn-in device is provided with a closed loop for conveying cooling liquid, comprising: At least one burn-in socket has a base and an upper cover, wherein the base is used to receive a device to be tested, and the upper cover is movably connected to the base, so that the upper cover can move between a locked position and a release position room, the cover contains: A water block, disposed in the closed circuit and having an inflow portion for receiving cooling liquid, an outflow portion for discharging cooling liquid, and a contact portion for contacting the device under test when the upper cover is in the locked position , the water block also has a heat exchange channel extending between the inflow portion and the outflow portion; and a heat dissipation radiator having a collection part for recovering the cooling liquid from the at least one burn-in socket, a diverting part for supplying the cooling liquid to the at least one burn-in socket, and a heat exchange channel extending between the collection part and the at least one burn-in socket Between the shunts and a plurality of fans are arranged on one side of the heat exchange channel. The closed-loop liquid-cooled burn-in device of claim 15, wherein the heat sink has a front end and a rear end opposite to the front end, and the front end of the heat sink is connected to a burn-in device mounted with the at least one burn-in socket The rear end of the heat dissipation radiator is equipped with the fans and the heat exchange channel. The closed-loop liquid-cooled burn-in device as claimed in claim 15, wherein the heat sink has a bottom plate, the bottom plate has a front end and a rear end, the front end of the bottom plate is provided with the collecting part and the shunt part, and the bottom plate has a bottom plate. The rear end is provided with the fans and the heat exchange channel. The closed-loop liquid-cooled burn-in device as claimed in claim 15, 16 or 17, wherein the collecting part comprises a water tank and a plurality of ports, the diverting part comprises a water tank and a plurality of ports, and the collecting part and the The ports of the shunt are respectively arranged along a straight line. The closed-loop liquid-cooled burn-in device as claimed in claim 15, wherein the heat dissipation radiator has a pair of side walls, the collecting part, the branching part, the fans and the heat exchange channel are arranged between the pair of side walls, the The distance between the opposite side walls is configured to be suitable for connection with a burn-in carrier board carrying the at least one burn-in socket. The closed-loop liquid-cooled burn-in device as claimed in claim 15, wherein the heat radiator further has a pump and a flow meter, which are disposed between the heat exchange flow channel and the branch portion. A closed-loop liquid-cooled burn-in device is provided with a closed loop for conveying cooling liquid, comprising: A first burn-in socket has a first water-cooled head, which is disposed in the closed circuit and has a first inflow portion for receiving cooling liquid and a first outflow portion for discharging cooling liquid. The first water-cooled The head also has a first heat exchange channel extending between the inflow portion and the outflow portion; and A second burn-in socket with a second water-cooled head, disposed in the closed circuit and having a second inflow portion for receiving cooling liquid, a second outflow portion for discharging cooling liquid, the second water-cooled The head also has a second heat exchange channel extending between the inflow portion and the outflow portion, Wherein, the first heat exchange channel and the second heat exchange channel are connected in parallel. The closed-loop liquid-cooled burn-in device as claimed in claim 21, wherein the closed loop is divided into a liquid inlet part with a lower temperature and a liquid return part with a higher temperature; One end of the two heat exchange channels is commonly connected to the liquid inlet part of the closed circuit, and the other end of the first heat exchange channel and the other end of the second heat exchange channel are commonly connected to the liquid return part of the closed circuit. A heat exchange channel and the second exchange flow are respectively disposed above a device to be tested. The closed-loop liquid-cooled burn-in device of claim 21, wherein the first inflow portion is configured to divert the cooling liquid to the first heat exchange channel and the second inflow portion, the second inflow portion is configured to flow from the The cooling liquid of the first inflow portion is introduced into the second heat exchange passage, the first outflow portion is configured to collect the cooling liquid of the first heat exchange passage and the cooling liquid from the second outflow portion, the first inflow portion or The first outflow portion is configured with a first pump, the second inflow portion or the second outflow portion is configured with a second pump, and the first pump and the second pump operate at different rotational speeds, so that the first pump The coolant flow rate of the heat exchange channel and the coolant flow rate of the second exchange channel are different.

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