TWI884620B - Array flow field structure - Google Patents

Abstract

An array flow field structure is applicable to a positive pressure environment test equipment, the array flow field structure comprises a housing, a plurality of test plates, a heat exchange device, at least a first circulation fan set, a first side fan set and a second side fan set, the housing has a pressure chamber, the pressure chamber is divided into a working area. The plurality of test plates are arranged in the working area. The heat exchange device is relatively arranged in the working area. At least a first circulation fan set is arranged on one side of the working area. A first side fan set and a second side fan set are respectively arranged on two sides of the working area. The array flow field structure of the present invention is used to dissipate heat from the IC chips on the aging test board, thereby improving the heat dissipation effect and efficiency of the IC chips and ensuring the temperature uniformity of each IC chip.

Description

Array flow field structure

The present invention relates to a flow field structure, and more particularly to an array flow field structure.

Burn-in board (BIB) is the last step in the IC manufacturing process. It is to put the ICs that have passed the final test through the high temperature, high voltage, and high current environment of the oven to select ICs with a shorter life cycle, and then ship the ICs with good quality to the manufacturer. In view of the fact that the power of IC chips has increased year by year, taking the current AI IC chip as an example, it has increased to 300~800 watts per chip. The standard atmospheric pressure (1atm) aging test machine cannot effectively dissipate heat, and it may also cause some areas with poor heat dissipation efficiency to easily cause damage to the IC chip.

Therefore, it is necessary to develop an aging test equipment that can improve the above-mentioned deficiencies in the known technology.

The purpose of the present invention is to provide an array flow field structure that can solve the above-mentioned problems.

The present invention proposes an array flow field structure, which uses a high-pressure environment (greater than normal pressure) to improve the heat transfer efficiency, and is matched with the flow field design of the array fan group to achieve the dual functions of the same heat dissipation efficiency. For areas with poor heat dissipation efficiency, the fan speed of the area can be changed by system control to improve the heat dissipation efficiency of the area, so as to achieve the same test conditions (such as temperature) on all aging test boards.

Therefore, in some embodiments, the array flow field structure of the present invention is suitable for positive pressure environment testing equipment, and the array flow field structure includes a housing having a pressure chamber, the pressure chamber is divided into a working area; a plurality of test plates are arranged in the working area; a heat exchange device is relatively arranged in the working area; at least one first circulation fan set is arranged on one side of the working area; and a first side fan set and a second side fan set are respectively arranged on two sides of the working area, wherein a pressure of the pressure chamber is greater than the positive pressure environment of normal pressure.

In some embodiments, the array flow field structure further includes a second circulation fan unit, which is disposed on a side of the heat exchange device away from the working area.

In some embodiments, the first side fan assembly and the second side fan assembly have a plurality of guide plates for changing an airflow direction or an airflow size.

In some embodiments, the first circulation fan set, the second circulation fan set, the first side fan set, and the second side fan set are arranged in a cross array or a parallel array to correspond to the plurality of test panels.

In some embodiments, the first circulation fan set, the second circulation fan set, the first side fan set, and the second side fan set are composed of a plurality of fans.

In some embodiments, the plurality of fans are fans with controllable speed.

In some embodiments, the airflow direction of the first circulation fan set, the second circulation fan set, the first side fan set, and the second side fan set is forward ventilation to guide the airflow circulation.

In some embodiments, the airflow direction of the first circulation fan set, the second circulation fan set, the first side fan set, and the second side fan set is reverse ventilation to guide the airflow circulation.

In some embodiments, the angle between the wind direction of the plurality of deflectors and the plurality of fans is 15°~90°.

In some embodiments, the array flow field structure further includes a pressurizing device to connect to the pressure chamber.

The present invention has at least the following effects: by arranging the heat exchange device, the first circulation fan set, the second circulation fan set, the first side fan set and the second side fan set, the IC chips on the aging test board can be cooled under this circulation air path, thereby improving the cooling effect and efficiency of the IC chips and ensuring the temperature uniformity of each IC chip.

100: Positive pressure environment test equipment

101: Array flow field structure

1: Shell

11: Pressure chamber

12: Pressurized channel

13: Pressure relief channel

14: Partition

111: Work area

2: Test board

3: Heat exchange device

4: First circulation fan unit

5: Second circulation fan unit

6: First side fan assembly

61: deflector

7: Second side fan assembly

8: Drive board area

9: Adapter board area

Other features and effects of the present invention will be clearly presented in the implementation method with reference to the drawings, wherein: FIG1 is a top view schematic diagram illustrating an implementation example of the array flow field structure of the present invention.

Figure 2 shows a schematic top view, illustrating that the airflow direction of the array flow field structure of the present invention is a forward ventilation implementation state.

Figure 3 shows a top view schematic diagram, which illustrates that the airflow direction of the array flow field structure of the present invention is a reverse ventilation implementation.

Some typical embodiments that embody the features and advantages of this case will be described in detail in the following description. It should be understood that this case can have various variations in different forms, all of which are within the scope of this case, and the descriptions and diagrams therein are essentially for illustrative purposes, rather than for limiting this case.

Please refer to FIG. 1, which is a top view schematic diagram illustrating an embodiment of the array flow field structure 101 of the present invention, which is applicable to a positive pressure environment test equipment 100, including a housing 1, a plurality of test plates 2, a heat exchange device 3, at least a first circulation fan set 4, a second circulation fan set 5, a first side fan set 6, a second side fan set 7, a driving plate area 8, a transfer plate area 9 and a partition 14.

Please continue to refer to FIG. 1. As shown in FIG. 1, the housing 1 has a pressure chamber 11, and the pressure chamber 11 is divided into two areas by a partition 14. One area is provided with an array flow field structure 101 for forming a field flow, and the other area is provided with a driving plate area 8 and a transfer plate area 9 for supplying power, signal transmission and control of the test board 2. The plurality of test boards 2 have a plurality of IC chips (not shown) and are arranged in the working area 111. The plurality of test boards 2 are arranged in layers in a rack manner, and correspond to the multi-layer design of the first circulation fan set 4, the second circulation fan set 5, the first side fan set 6, and the second side fan set 7. It can also be a single-layer design, but it is not limited thereto. The heat exchange device 3 is relatively disposed in the working area 111. In this embodiment, at least one first circulation fan set 4 is disposed on one side of the working area 111, and two sets of first circulation fan sets 4 can also be disposed at the front and rear sides of the working area 111, the front side of the working area 111, or the rear side of the working area 111, but not limited thereto. The first side fan set 6 and the second side fan set 7 are respectively disposed on the left and right sides of the working area 111 opposite to the first circulation fan set 4. The array flow field structure 101 further includes a second circulation fan set 5, which is disposed on a side of the heat exchange device 3 away from the working area 111, so that the pressure chamber 11 can achieve the effect of airflow circulation. And when the first circulation fan set 4, the second circulation fan set 5, the first side fan set 6 and the second side fan set 7 of the array flow field structure 101 rotate, the pressure of the pressure chamber 11 is greater than the positive pressure environment of the normal pressure.

In this embodiment, the first circulation fan set 4, the second circulation fan set 5, the first side fan set 6 and the second side fan set 7 are composed of a plurality of fans, and the plurality of fans are fans with controllable rotation speeds, and the plurality of fans can also be fans of different sizes. Among them, the fan type can be an axial flow fan, but is not limited thereto.

In this embodiment, the first circulation fan set 4, the second circulation fan set 5, the first side fan set 6 and the second side fan set 7 can be a one-dimensional array, a two-dimensional array, or a three-dimensional array, wherein the first and two-dimensional arrays can be arranged in a cross array or a parallel array, but not limited thereto. In addition, the first side fan set 6 and the second side fan set 7 have a plurality of guide plates 61 to change the direction or size of the fan airflow, and the preferred angle between the guide plate and the wind direction of the fan can be 15°~90°, but not limited thereto.

Please refer to FIG. 2, which is a top view schematic diagram illustrating the implementation of the array flow field structure of the present invention in which the airflow direction is forward ventilation. When the first circulation fan set 4, the second circulation fan set 5, the first side fan set 6 and the second side fan set 7 are in operation, the airflow direction generated by the plurality of fans is forward ventilation, so as to guide the airflow to circulate forward in the working area 111.

Please refer to FIG. 3, which is a top view schematic diagram illustrating the reverse ventilation implementation of the array flow field structure of the present invention. When the first circulation fan set 4, the second circulation fan set 5, the first side fan set 6 and the second side fan set 7 are in operation, the airflow direction generated by the plurality of fans is reverse ventilation, so as to guide the airflow to circulate in reverse in the working area 111.

Please continue to refer to Figures 2 and 3. As shown in the figure, the positive airflow in the working area 111 is as follows: the airflow is introduced by the second circulating fan unit 5, enters the heat exchange device 3, the first circulating fan unit 4, the working area 111, and then is guided out from both sides of the first side fan unit 6 and the second side fan unit 7. Finally, the airflow enters the second circulating fan unit 5 to achieve positive airflow circulation in the working area 111.

The reverse airflow direction in the working area 111 is: the airflow is introduced from both sides of the first side fan set 6 and the second side fan set 7, enters the working area 111, the first circulation fan set 4, the working area 111, and then is introduced from the second circulation fan set 52, and finally enters both sides of the first side fan set 6 and the second side fan set 7, so as to achieve reverse circulation of the airflow in the working area 111.

In this regard, the user can set multiple fans in any array form according to the needs, and for the IC chip area of the test board 2 with poor heat dissipation efficiency, the fan speed of the area can be changed by system control to improve the heat dissipation efficiency of the area, so as to achieve the same test conditions (such as temperature) on all aging test boards. In some embodiments, the IC chip can be equipped with a heat sink (not shown) to achieve better heat dissipation effect. In some embodiments, the IC chip can be equipped with a heater (not shown) to achieve better temperature uniformity.

From the above description, it can be known that the array flow field structure 101 of the present case adjusts the fan airflow direction or airflow size of the first side fan set 6 and the second side fan set 7 by using a plurality of guide plates 61, and its various capacity changes are shown in the following Table 1 and Table 2:

Therefore, it can be seen from the experimental table that when the airflow is ventilated in the forward direction, the angle of the guide plate 61 of the first side fan set 6 and the second side fan set 7 is between 15 degrees and 90 degrees, and the temperature difference of the test plate is at least 13.5℃ or less. The smaller (better) temperature difference is when the angle of the guide plate 61 is 45 degrees, and the temperature difference of the test plate reaches 4.6℃. When the airflow is ventilated in the reverse direction, the angle of the guide plate 61 of the first side fan set 6 and the second side fan set 7 is between 15 degrees and 90 degrees, and the temperature difference of the test plate is at least 15.8℃ or less. The best temperature difference is when the angle of the guide plate 61 is 75 degrees, and the temperature difference of the test plate reaches 7.5 degrees.

However, the angles of the guide plates 61 of the first side fan set 6 and the second side fan set 7 under forward and reverse ventilation conditions are obtained through experiments and cannot be directly derived from theoretical formulas. The speculation on the reasons for improving the heat dissipation effect is only a reasonable reference for the experiment.

In this embodiment, the array flow field structure 101 further includes a pressurizing device (not shown), a pressurizing channel 12, and a pressure relief channel 13. The pressurizing device is connected to the pressure chamber 11 through the pressurizing channel 12 to perform a pressurizing operation on the pressure chamber 11.

In summary, the array flow field structure provided by the present invention mainly includes the first circulation fan group, the second circulation fan group, the first side fan group and the second side fan group arranged in the array flow field structure in the pressure chamber. When the multiple fans rotate, the working area can achieve airflow circulation to cool down the IC chips on the aging test board. The fans can be arranged in a cross array, parallel array or other configurations to achieve more efficient heat dissipation for the working board in the corresponding working area.

However, the above is only an example of the implementation of the present invention, and it cannot be used to limit the scope of the implementation of the present invention. All simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the patent specification are still within the scope of the patent of the present invention.

100: Positive pressure environment test equipment

101: Array flow field structure

1: Shell

11: Pressure chamber

12: Pressurized channel

13: Pressure relief channel

14: Partition

111: Work area

2: Test board

3: Heat exchange device

4: First circulation fan unit

5: Second circulation fan unit

6: First side fan assembly

7: Second side fan assembly

8: Drive board area

9: Adapter board area

Claims (8)

An array flow field structure is applicable to a positive pressure environment test equipment, and the array flow field structure comprises: A housing having a pressure chamber, the pressure chamber is divided into a working area; A plurality of test plates are arranged in the working area; A heat exchange device is relatively arranged in the working area; At least one first circulation fan group is arranged on one side of the working area; A second circulation fan group is arranged on a side of the heat exchange device away from the working area; and A first side fan group and a second side fan group are respectively arranged on two sides of the working area, The pressure of the pressure chamber is a positive pressure environment with a pressure greater than normal pressure, and the first side fan set and the second side fan set have a plurality of guide plates for changing an airflow direction or an airflow size. The array flow field structure as described in claim 1, wherein the first circulation fan set, the second circulation fan set, the first side fan set and the second side fan set are arranged in a cross array or in a parallel array to correspond to the plurality of test plates. The array flow field structure as described in claim 1, wherein the first circulation fan set, the second circulation fan set, the first side fan set and the second side fan set are composed of a plurality of fans. An array flow field structure as described in claim 3, wherein the plurality of fans are fans with controllable rotation speed. The array flow field structure as described in claim 1, wherein the airflow direction of the first circulation fan set, the second circulation fan set, the first side fan set and the second side fan set is forward ventilation to guide the airflow circulation. The array flow field structure as described in claim 1, wherein the airflow direction of the first circulation fan set, the second circulation fan set, the first side fan set and the second side fan set is reverse ventilation to guide the airflow circulation. The array flow field structure as described in claim 1, wherein the angle between the plurality of guide plates and the wind direction of the first side fan set and the second side fan set is 15∘～90∘. The array flow field structure as described in claim 1 further includes a pressurizing device connected to the pressure chamber.

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