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TWI799582B - 半導體裝置以及在其製造中使用的熱硬化性樹脂組成物以及切晶黏晶一體型帶 - Google Patents

半導體裝置以及在其製造中使用的熱硬化性樹脂組成物以及切晶黏晶一體型帶 Download PDF

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Publication number
TWI799582B
TWI799582B TW108116804A TW108116804A TWI799582B TW I799582 B TWI799582 B TW I799582B TW 108116804 A TW108116804 A TW 108116804A TW 108116804 A TW108116804 A TW 108116804A TW I799582 B TWI799582 B TW I799582B
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TW
Taiwan
Prior art keywords
die
manufacture
semiconductor device
resin composition
thermosetting resin
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Application number
TW108116804A
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English (en)
Chinese (zh)
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TW202010788A (zh
Inventor
山本和弘
Original Assignee
日商昭和電工材料股份有限公司
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Publication of TW202010788A publication Critical patent/TW202010788A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • H10W74/47—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H10P72/7402—
    • H10W72/013—
    • H10W72/073—
    • H10W72/30—
    • H10W74/014—
    • H10W74/019—
    • H10W74/114—
    • H10W74/121—
    • H10W90/00—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/04—Crosslinking with phenolic resin
    • H10P72/7416—
    • H10W70/40—
    • H10W72/01304—
    • H10W72/01336—
    • H10W72/0198—
    • H10W72/07332—
    • H10W72/07338—
    • H10W72/07354—
    • H10W72/075—
    • H10W72/325—
    • H10W72/344—
    • H10W72/353—
    • H10W72/354—
    • H10W72/5363—
    • H10W72/551—
    • H10W72/884—
    • H10W72/951—
    • H10W90/20—
    • H10W90/732—
    • H10W90/734—
    • H10W90/752—
    • H10W90/754—

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesive Tapes (AREA)
TW108116804A 2018-05-15 2019-05-15 半導體裝置以及在其製造中使用的熱硬化性樹脂組成物以及切晶黏晶一體型帶 TWI799582B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2018/018765 2018-05-15
PCT/JP2018/018765 WO2019220540A1 (ja) 2018-05-15 2018-05-15 半導体装置、並びに、その製造に使用する熱硬化性樹脂組成物及びダイシングダイボンディング一体型テープ

Publications (2)

Publication Number Publication Date
TW202010788A TW202010788A (zh) 2020-03-16
TWI799582B true TWI799582B (zh) 2023-04-21

Family

ID=68539657

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108116804A TWI799582B (zh) 2018-05-15 2019-05-15 半導體裝置以及在其製造中使用的熱硬化性樹脂組成物以及切晶黏晶一體型帶

Country Status (6)

Country Link
JP (1) JP7136200B2 (ja)
KR (1) KR102482629B1 (ja)
CN (1) CN112204730B (ja)
SG (1) SG11202011196SA (ja)
TW (1) TWI799582B (ja)
WO (1) WO2019220540A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210148201A (ko) * 2019-03-28 2021-12-07 미쓰이금속광업주식회사 수지 조성물 및 수지 구비 구리박
US20230178509A1 (en) * 2020-04-28 2023-06-08 Amosense Co., Ltd. Adhesive transfer film and method for manufacturing power module substrate by using same
JP2022115581A (ja) * 2021-01-28 2022-08-09 昭和電工マテリアルズ株式会社 半導体装置及びその製造方法、並びに、熱硬化性樹脂組成物、接着フィルム及びダイシング・ダイボンディング一体型フィルム
JP2022182532A (ja) * 2021-05-28 2022-12-08 キオクシア株式会社 半導体装置およびその製造方法
JP2023142888A (ja) * 2022-03-25 2023-10-06 株式会社レゾナック 半導体用接着フィルム、ダイシングダイボンディングフィルム、及び、半導体装置を製造する方法
KR102734679B1 (ko) * 2023-04-10 2024-11-27 에센코어 리미티드 메모리 장치를 처리하는 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018014501A (ja) * 2017-08-07 2018-01-25 日立化成株式会社 フィルム状接着剤及びダイシングダイボンディング一体型接着シート

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5236134B2 (ja) 2001-01-26 2013-07-17 日立化成株式会社 接着剤組成物、接着部材、半導体搭載用支持部材及び半導体装置等
JP2005103180A (ja) 2003-10-02 2005-04-21 Matsushita Electric Ind Co Ltd 洗濯機
US7560821B2 (en) * 2005-03-24 2009-07-14 Sumitomo Bakelite Company, Ltd Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same
JP5524465B2 (ja) 2007-10-24 2014-06-18 日立化成株式会社 接着シート及びこれを用いた半導体装置およびその製造方法
JP2010118554A (ja) * 2008-11-13 2010-05-27 Nec Electronics Corp 半導体装置およびその製造方法
JP5390209B2 (ja) * 2009-02-04 2014-01-15 日東電工株式会社 熱硬化型ダイボンドフィルム
CN103249559B (zh) * 2010-11-18 2015-08-05 日立化成株式会社 半导体密封填充用膜状树脂组合物、半导体装置的制造方法和半导体装置
JP5781794B2 (ja) 2011-03-11 2015-09-24 積水化学工業株式会社 接着剤層付き半導体チップ及び半導体装置の製造方法
KR20140126736A (ko) * 2012-03-08 2014-10-31 히타치가세이가부시끼가이샤 접착시트 및 반도체 장치의 제조 방법
JP2015120836A (ja) * 2013-12-24 2015-07-02 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018014501A (ja) * 2017-08-07 2018-01-25 日立化成株式会社 フィルム状接着剤及びダイシングダイボンディング一体型接着シート

Also Published As

Publication number Publication date
TW202010788A (zh) 2020-03-16
JP7136200B2 (ja) 2022-09-13
KR102482629B1 (ko) 2022-12-29
CN112204730B (zh) 2025-06-13
SG11202011196SA (en) 2020-12-30
CN112204730A (zh) 2021-01-08
JPWO2019220540A1 (ja) 2021-07-01
KR102482629B9 (ko) 2024-03-25
KR20210008341A (ko) 2021-01-21
WO2019220540A1 (ja) 2019-11-21

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