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TWI799582B - Semiconductor device, thermosetting resin composition and die-bonding integrated tape used in its manufacture - Google Patents

Semiconductor device, thermosetting resin composition and die-bonding integrated tape used in its manufacture Download PDF

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Publication number
TWI799582B
TWI799582B TW108116804A TW108116804A TWI799582B TW I799582 B TWI799582 B TW I799582B TW 108116804 A TW108116804 A TW 108116804A TW 108116804 A TW108116804 A TW 108116804A TW I799582 B TWI799582 B TW I799582B
Authority
TW
Taiwan
Prior art keywords
die
manufacture
semiconductor device
resin composition
thermosetting resin
Prior art date
Application number
TW108116804A
Other languages
Chinese (zh)
Other versions
TW202010788A (en
Inventor
山本和弘
Original Assignee
日商昭和電工材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
Publication of TW202010788A publication Critical patent/TW202010788A/en
Application granted granted Critical
Publication of TWI799582B publication Critical patent/TWI799582B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • H10W74/47—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H10P72/7402—
    • H10W72/013—
    • H10W72/073—
    • H10W72/30—
    • H10W74/014—
    • H10W74/019—
    • H10W74/114—
    • H10W74/121—
    • H10W90/00—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/04—Crosslinking with phenolic resin
    • H10P72/7416—
    • H10W70/40—
    • H10W72/01304—
    • H10W72/01336—
    • H10W72/0198—
    • H10W72/07332—
    • H10W72/07338—
    • H10W72/07354—
    • H10W72/075—
    • H10W72/325—
    • H10W72/344—
    • H10W72/353—
    • H10W72/354—
    • H10W72/5363—
    • H10W72/551—
    • H10W72/884—
    • H10W72/951—
    • H10W90/20—
    • H10W90/732—
    • H10W90/734—
    • H10W90/752—
    • H10W90/754—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW108116804A 2018-05-15 2019-05-15 Semiconductor device, thermosetting resin composition and die-bonding integrated tape used in its manufacture TWI799582B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2018/018765 WO2019220540A1 (en) 2018-05-15 2018-05-15 Semiconductor device, thermosetting resin composition used for production thereof, and dicing die bonding integrated tape
WOPCT/JP2018/018765 2018-05-15

Publications (2)

Publication Number Publication Date
TW202010788A TW202010788A (en) 2020-03-16
TWI799582B true TWI799582B (en) 2023-04-21

Family

ID=68539657

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108116804A TWI799582B (en) 2018-05-15 2019-05-15 Semiconductor device, thermosetting resin composition and die-bonding integrated tape used in its manufacture

Country Status (6)

Country Link
JP (1) JP7136200B2 (en)
KR (1) KR102482629B1 (en)
CN (1) CN112204730B (en)
SG (1) SG11202011196SA (en)
TW (1) TWI799582B (en)
WO (1) WO2019220540A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7461337B2 (en) * 2019-03-28 2024-04-03 三井金属鉱業株式会社 Resin composition and resin-coated copper foil
WO2021221460A1 (en) * 2020-04-28 2021-11-04 주식회사 아모센스 Adhesive transfer film and method for manufacturing power module substrate by using same
JP2022115581A (en) * 2021-01-28 2022-08-09 昭和電工マテリアルズ株式会社 Semiconductor device and manufacturing method thereof, thermosetting resin composition, adhesive film and dicing/die bonding integrated film
JP2022182532A (en) * 2021-05-28 2022-12-08 キオクシア株式会社 Semiconductor device and manufacturing method for the same
JP2023142888A (en) * 2022-03-25 2023-10-06 株式会社レゾナック Adhesive film for semiconductors, dicing die bonding film, and method for manufacturing semiconductor devices
KR102734679B1 (en) * 2023-04-10 2024-11-27 에센코어 리미티드 Method for processing memory device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018014501A (en) * 2017-08-07 2018-01-25 日立化成株式会社 Film adhesive and dicing die bonding integrated adhesive sheet

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5236134B2 (en) 2001-01-26 2013-07-17 日立化成株式会社 Adhesive composition, adhesive member, semiconductor mounting support member, semiconductor device, etc.
JP2005103180A (en) 2003-10-02 2005-04-21 Matsushita Electric Ind Co Ltd Washing machine
US7560821B2 (en) * 2005-03-24 2009-07-14 Sumitomo Bakelite Company, Ltd Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same
JP5524465B2 (en) 2007-10-24 2014-06-18 日立化成株式会社 Adhesive sheet, semiconductor device using the same, and manufacturing method thereof
JP2010118554A (en) * 2008-11-13 2010-05-27 Nec Electronics Corp Semiconductor device and method of manufacturing the same
JP5390209B2 (en) * 2009-02-04 2014-01-15 日東電工株式会社 Thermosetting die bond film
WO2012067158A1 (en) * 2010-11-18 2012-05-24 日立化成工業株式会社 Film-like resin composition for sealing and filling semiconductor, method for manufacturing semiconductor device, and semiconductor device
JP5781794B2 (en) 2011-03-11 2015-09-24 積水化学工業株式会社 Semiconductor chip with adhesive layer and method for manufacturing semiconductor device
KR102067945B1 (en) * 2012-03-08 2020-01-17 히타치가세이가부시끼가이샤 Adhesive sheet and method for manufacturing semiconductor device
JP2015120836A (en) * 2013-12-24 2015-07-02 日東電工株式会社 Adhesive film, dicing die bond film, semiconductor device manufacturing method, and semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018014501A (en) * 2017-08-07 2018-01-25 日立化成株式会社 Film adhesive and dicing die bonding integrated adhesive sheet

Also Published As

Publication number Publication date
CN112204730A (en) 2021-01-08
KR102482629B1 (en) 2022-12-29
JP7136200B2 (en) 2022-09-13
WO2019220540A1 (en) 2019-11-21
KR102482629B9 (en) 2024-03-25
CN112204730B (en) 2025-06-13
TW202010788A (en) 2020-03-16
SG11202011196SA (en) 2020-12-30
JPWO2019220540A1 (en) 2021-07-01
KR20210008341A (en) 2021-01-21

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