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TWI799445B - 電路連接用接著劑膜及其製造方法、電路連接結構體的製造方法及接著劑膜收容套組 - Google Patents

電路連接用接著劑膜及其製造方法、電路連接結構體的製造方法及接著劑膜收容套組 Download PDF

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Publication number
TWI799445B
TWI799445B TW107131739A TW107131739A TWI799445B TW I799445 B TWI799445 B TW I799445B TW 107131739 A TW107131739 A TW 107131739A TW 107131739 A TW107131739 A TW 107131739A TW I799445 B TWI799445 B TW I799445B
Authority
TW
Taiwan
Prior art keywords
manufacturing
adhesive film
circuit connection
storage set
connection structure
Prior art date
Application number
TW107131739A
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English (en)
Other versions
TW201920554A (zh
Inventor
森尻智樹
大當友美子
Sunao Kudou
Original Assignee
日商昭和電工材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
Publication of TW201920554A publication Critical patent/TW201920554A/zh
Application granted granted Critical
Publication of TWI799445B publication Critical patent/TWI799445B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H10W72/073—
    • H10W74/15—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
TW107131739A 2017-09-11 2018-09-10 電路連接用接著劑膜及其製造方法、電路連接結構體的製造方法及接著劑膜收容套組 TWI799445B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017173941 2017-09-11
JP2017-173941 2017-09-11

Publications (2)

Publication Number Publication Date
TW201920554A TW201920554A (zh) 2019-06-01
TWI799445B true TWI799445B (zh) 2023-04-21

Family

ID=65634086

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107131739A TWI799445B (zh) 2017-09-11 2018-09-10 電路連接用接著劑膜及其製造方法、電路連接結構體的製造方法及接著劑膜收容套組

Country Status (5)

Country Link
JP (1) JP7264054B2 (zh)
KR (2) KR102533475B1 (zh)
CN (1) CN111051456B (zh)
TW (1) TWI799445B (zh)
WO (1) WO2019050011A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7516777B2 (ja) * 2020-02-26 2024-07-17 株式会社レゾナック 回路接続用接着剤フィルム、回路接続構造体及びその製造方法
KR20230034223A (ko) * 2020-07-07 2023-03-09 레조낙 가부시끼가이샤 회로 접속용 접착제 필름, 및 회로 접속 구조체 및 그 제조 방법
JP2022072297A (ja) * 2020-10-29 2022-05-17 デクセリアルズ株式会社 異方性導電フィルム
JP7608800B2 (ja) * 2020-11-30 2025-01-07 株式会社レゾナック 回路接続用接着剤、接続構造体及び接続構造体の製造方法
JP7608801B2 (ja) * 2020-11-30 2025-01-07 株式会社レゾナック 回路接続用接着剤、接続構造体及び接続構造体の製造方法
JP2025029739A (ja) * 2023-08-22 2025-03-07 株式会社レゾナック 接着剤組成物、回路接続用接着剤フィルム、回路接続構造体及びその製造方法
JP2025038510A (ja) * 2023-09-07 2025-03-19 株式会社レゾナック フィルム状接着剤、接着剤フィルム、接続構造体、及び接続構造体の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201318952A (zh) * 2011-08-18 2013-05-16 Hitachi Chemical Co Ltd 接著材捲筒、阻塞抑制方法、接著材捲筒的交換方法、接著材帶的抽出方法、接著材捲筒的製造方法、設置結束標誌的方法、捲筒套件及包裝體
TW201422745A (zh) * 2012-08-03 2014-06-16 迪睿合股份有限公司 異向性導電膜及其製造方法

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JP3873651B2 (ja) * 2001-04-23 2007-01-24 ソニーケミカル＆インフォメーションデバイス株式会社 帯電防止剤組成物
WO2005054388A1 (ja) 2003-12-04 2005-06-16 Asahi Kasei Emd Corporation 異方導電性接着シート及び接続構造体
JP5067355B2 (ja) * 2007-12-17 2012-11-07 日立化成工業株式会社 回路接続材料及び回路部材の接続構造
JP4897778B2 (ja) * 2008-11-20 2012-03-14 ソニーケミカル＆インフォメーションデバイス株式会社 接続フィルム、並びに、接合体及びその製造方法
JP2010199087A (ja) * 2010-05-11 2010-09-09 Sony Chemical & Information Device Corp 異方性導電膜及びその製造方法、並びに、接合体及びその製造方法
KR101615796B1 (ko) * 2010-12-27 2016-04-26 히타치가세이가부시끼가이샤 건조제 수용기 및 접착 테이프용 릴
KR20120076187A (ko) * 2010-12-29 2012-07-09 제일모직주식회사 이방 도전성 필름
JP5690648B2 (ja) * 2011-04-28 2015-03-25 デクセリアルズ株式会社 異方性導電フィルム、接続方法及び接続構造体
JP6792319B2 (ja) * 2014-10-22 2020-11-25 昭和電工マテリアルズ株式会社 異方導電フィルム巻

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201318952A (zh) * 2011-08-18 2013-05-16 Hitachi Chemical Co Ltd 接著材捲筒、阻塞抑制方法、接著材捲筒的交換方法、接著材帶的抽出方法、接著材捲筒的製造方法、設置結束標誌的方法、捲筒套件及包裝體
TW201422745A (zh) * 2012-08-03 2014-06-16 迪睿合股份有限公司 異向性導電膜及其製造方法

Also Published As

Publication number Publication date
KR20230074287A (ko) 2023-05-26
TW201920554A (zh) 2019-06-01
JPWO2019050011A1 (ja) 2020-08-20
WO2019050011A1 (ja) 2019-03-14
JP7264054B2 (ja) 2023-04-25
CN111051456B (zh) 2022-08-05
KR102732843B1 (ko) 2024-11-20
CN111051456A (zh) 2020-04-21
KR20200052281A (ko) 2020-05-14
KR102533475B1 (ko) 2023-05-19

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