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TWI799444B - 用於分離暫時接合之基板堆疊之裝置及方法 - Google Patents

用於分離暫時接合之基板堆疊之裝置及方法 Download PDF

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Publication number
TWI799444B
TWI799444B TW107130300A TW107130300A TWI799444B TW I799444 B TWI799444 B TW I799444B TW 107130300 A TW107130300 A TW 107130300A TW 107130300 A TW107130300 A TW 107130300A TW I799444 B TWI799444 B TW I799444B
Authority
TW
Taiwan
Prior art keywords
separating
bonded substrate
substrate stack
temporarily bonded
temporarily
Prior art date
Application number
TW107130300A
Other languages
English (en)
Other versions
TW201923949A (zh
Inventor
伊莉莎白 布蘭德
波利斯 波維賽
湯瑪斯 烏爾曼
Original Assignee
奧地利商Ev集團E塔那有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 奧地利商Ev集團E塔那有限公司 filed Critical 奧地利商Ev集團E塔那有限公司
Publication of TW201923949A publication Critical patent/TW201923949A/zh
Application granted granted Critical
Publication of TWI799444B publication Critical patent/TWI799444B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H10P72/74—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
    • H10P72/7416—
    • H10P72/7422—

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laser Beam Processing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW107130300A 2017-09-12 2018-08-30 用於分離暫時接合之基板堆疊之裝置及方法 TWI799444B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/EP2017/072869 2017-09-12
PCT/EP2017/072869 WO2019052634A1 (de) 2017-09-12 2017-09-12 Vorrichtung und verfahren zum trennen eines temporär gebondeten substratstapels

Publications (2)

Publication Number Publication Date
TW201923949A TW201923949A (zh) 2019-06-16
TWI799444B true TWI799444B (zh) 2023-04-21

Family

ID=59856533

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107130300A TWI799444B (zh) 2017-09-12 2018-08-30 用於分離暫時接合之基板堆疊之裝置及方法

Country Status (7)

Country Link
US (1) US11534868B2 (zh)
EP (1) EP3682470A1 (zh)
JP (2) JP7130735B2 (zh)
KR (2) KR102550390B1 (zh)
CN (1) CN111095519B (zh)
TW (1) TWI799444B (zh)
WO (1) WO2019052634A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019116798A1 (de) * 2019-06-21 2020-12-24 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Bearbeiten mindestens eines Werkstücks
JP2021005805A (ja) * 2019-06-26 2021-01-14 パナソニックＩｐマネジメント株式会社 光電センサ、レーザ樹脂溶着における樹脂透過率の測定方法、レーザ樹脂溶着方法、レーザ加工装置
JP7339031B2 (ja) * 2019-06-28 2023-09-05 株式会社ディスコ レーザー加工装置
US20210078294A1 (en) * 2019-09-16 2021-03-18 Shenzhenshi Yuzhan Precision Technology Co., Ltd. Glass article, methods for manufacturing the same, and laser welding equipemnt
CN111933531B (zh) * 2020-08-11 2023-06-20 中国电子科技集团公司第三十八研究所 一种基于激光键合的立体电路积层制造方法
TWI773067B (zh) * 2021-01-04 2022-08-01 財團法人工業技術研究院 雷射光路之調校方法與雷射光路之調校裝置
CN118385776B (zh) * 2024-06-17 2024-08-27 天津中科晶禾电子科技有限责任公司 激光解键合方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160329233A1 (en) * 2014-11-07 2016-11-10 International Business Machines Corporation Double Layer Release Temporary Bond and Debond Processes and Systems

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW564471B (en) * 2001-07-16 2003-12-01 Semiconductor Energy Lab Semiconductor device and peeling off method and method of manufacturing semiconductor device
US20030224581A1 (en) * 2002-06-03 2003-12-04 Robert Bosch Gmbh Flip chip packaging process using laser-induced metal bonding technology, system utilizing the method, and device created by the method
JP4439210B2 (ja) * 2002-08-29 2010-03-24 京セラ株式会社 ダミーウエハ
JP4038435B2 (ja) * 2002-10-15 2008-01-23 Ｊｕｋｉ株式会社 ダイボンディング装置
RU2010129076A (ru) 2008-01-24 2012-01-20 Брюэр Сайенс Инк. (Us) Способ обратимого крепления полупроводниковой пластины со сформированными устройствами к несущей подложке
KR100953686B1 (ko) * 2008-02-18 2010-04-19 에이피시스템 주식회사 레이저 가공장치
JP2011040564A (ja) * 2009-08-11 2011-02-24 Toshiba Corp 半導体素子の製造方法および製造装置
JP2011083795A (ja) * 2009-10-15 2011-04-28 Pulstec Industrial Co Ltd レーザ加工装置およびレーザ加工方法
WO2011071889A1 (en) 2009-12-07 2011-06-16 J.P. Sercel Associates, Inc. Laser lift off systems and methods
CN102905839B (zh) * 2010-03-30 2016-03-09 Imra美国公司 基于激光的材料加工装置和方法
WO2013010113A1 (en) * 2011-07-14 2013-01-17 The Board Of Trustees Of The University Of Illinois Non-contact transfer printing
JP5878330B2 (ja) * 2011-10-18 2016-03-08 株式会社ディスコ レーザー光線の出力設定方法およびレーザー加工装置
WO2013126927A2 (en) * 2012-02-26 2013-08-29 Solexel, Inc. Systems and methods for laser splitting and device layer transfer
JP6007688B2 (ja) * 2012-09-11 2016-10-12 富士電機株式会社 半導体装置の製造方法
JP6110136B2 (ja) * 2012-12-28 2017-04-05 株式会社ディスコ ウエーハのレーザー加工方法およびレーザー加工装置
US20140251533A1 (en) * 2013-03-11 2014-09-11 Samsung Display Co., Ltd. Substrate peeling device, method for peeling substrate, and method for fabricating flexible display device
GB2519088B (en) * 2013-10-08 2015-09-16 M Solv Ltd Laser scanning system for laser release
JP6399913B2 (ja) 2014-12-04 2018-10-03 株式会社ディスコ ウエーハの生成方法
JP6314082B2 (ja) * 2014-12-18 2018-04-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
WO2016112975A1 (de) * 2015-01-14 2016-07-21 Ev Group E. Thallner Gmbh Verfahren und vorrichtung zum lösen eines substrats von einem substratstapel
CN105977194A (zh) 2016-06-30 2016-09-28 华进半导体封装先导技术研发中心有限公司 纳秒固态激光调制系统及键合晶圆分离的方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160329233A1 (en) * 2014-11-07 2016-11-10 International Business Machines Corporation Double Layer Release Temporary Bond and Debond Processes and Systems

Also Published As

Publication number Publication date
KR20200050967A (ko) 2020-05-12
JP7130735B2 (ja) 2022-09-05
JP2020537817A (ja) 2020-12-24
KR102550390B1 (ko) 2023-07-03
TW201923949A (zh) 2019-06-16
JP2022133361A (ja) 2022-09-13
US20210060710A1 (en) 2021-03-04
EP3682470A1 (de) 2020-07-22
US11534868B2 (en) 2022-12-27
CN111095519B (zh) 2023-08-18
CN111095519A (zh) 2020-05-01
JP7428752B2 (ja) 2024-02-06
KR20220116568A (ko) 2022-08-23
WO2019052634A1 (de) 2019-03-21

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