TWI794115B - Thin Film Chip Package Structure - Google Patents

Abstract

A thin film chip packaging structure, which includes: a film substrate; a chip, arranged on the upper surface of the film substrate; and a heat dissipation paste, including a first covering part and at least one second covering part connected to the first Covering parts, wherein, the first covering part covers the wafer, each of the second covering parts covers the upper surface of the film substrate on one side of the wafer, and each of the second covering parts The part has at least one hollow area.

Description

Thin Film Chip Package Structure

The invention relates to chip packaging, in particular to a thin film chip packaging structure.

In the semiconductor field, COF (chip-on-film; chip-on-film) is mainly used in the display driver IC package.

In recent years, as the market's requirements for screen resolution and refresh rate have been increasing, the heat dissipation performance requirements for driver ICs have also become higher and higher. At present, the mainstream COF driver IC products on the market attach heat dissipation stickers to the back of the film substrate, and a few companies attach heat dissipation stickers to the front of the chip on the film substrate. However, there is still room for improvement in the heat dissipation effect.

In order to solve the above problems, there is an urgent need in the art for a novel thin film chip packaging structure.

One purpose of the present invention is to disclose a thin-film chip packaging structure, which can ensure that the air between the heat-dissipating paste, the chip and a thin-film substrate is completely excluded by providing a hollow area adjacent to the long side of a chip in a heat-dissipating paste , so as to prevent the heat dissipation sticker from reducing the heat conduction effect due to the barrier of air bubbles.

Another object of the present invention is to disclose a thin-film chip packaging structure, which can ensure that the air between the heat-dissipating paste, the chip and a thin-film substrate is completely closed by providing a hollow area adjacent to the long side of a chip in a heat-dissipating paste. Excluded to prevent the heat dissipation paste from detaching from the chip and the film substrate due to the thermal expansion of the air bubbles, thereby enhancing the packaging reliability of the product.

Yet another object of the present invention is to disclose a thin film chip packaging structure, which can enhance the heat dissipation effect by providing a hollow area in a heat dissipation paste to disperse the physical area of the heat dissipation paste, thereby reducing the materials used in the heat dissipation paste and reducing the packaging cost.

To achieve the aforementioned purpose, a thin film chip packaging structure is proposed, which includes: a film substrate; a wafer disposed on the upper surface of the film substrate; and A heat dissipation sticker, comprising a first covering part and at least one second covering part connected with the first covering part, wherein the first covering part is covered above the chip, and each of the second covering parts is covered On the upper surface of the film substrate on one side of the wafer, each of the second covering parts has at least one hollow area.

In one embodiment, the wafer has a first length along a long side direction, the first covering portion has a second length along the long side direction, and the second length is smaller than the first length.

In one embodiment, the chip has a first length along a long side direction, the first covering portion has a second length along the long side direction, and the second length is equal to the first length.

In one embodiment, the wafer has a first length in a long side direction, the first covering portion has a second length in the long side direction, the second length is greater than the first length, and the first covering portion The part protrudes from both sides of the wafer along the long side direction to expose the two side surfaces of the wafer.

In one embodiment, the total physical length of any cooling patch of each second covering portion in the longitudinal direction is equal to the length of the first covering portion in the longitudinal direction.

In one embodiment, the total length of any heat dissipation sticker in the longitudinal direction of each of the second covering parts is smaller than the length of the first covering part in the longitudinal direction.

In one embodiment, each hollow area of each second covering portion is a closed hollow area.

In one embodiment, each hollow area of each second covering portion is an open hollow area.

In one embodiment, the heat dissipation sticker includes a heat dissipation layer and a protective layer, the heat dissipation layer is pasted on the film substrate and the chip, and the protection layer covers the heat dissipation layer.

In a possible embodiment, the heat dissipation layer may include at least one material selected from aluminum, copper and graphene.

In one embodiment, the thin film chip packaging structure further includes a back heat dissipation sticker attached to the lower surface of the thin film substrate.

In order to enable your review committee members to further understand the structure, features and purpose of the present invention, drawings and detailed descriptions of preferred specific embodiments are hereby attached.

Please refer to Figs. 1, 2 and 3 together, wherein Fig. 1 is a schematic view of the appearance of an embodiment of the thin film chip packaging structure of the present invention; Fig. 2 is a top view of the thin film chip packaging structure of Fig. 1; and Fig. 3 is a view of Fig. 1 A cross-sectional view of the thin film chip packaging structure along the section line V1-V1.

As shown in Figures 1, 2 and 3, the thin film chip packaging structure includes a thin film substrate 10, a heat dissipation paste 20 and a chip 30; the thin film substrate 10 has an upper surface 10a and a lower surface 10b; the chip 30 is arranged on the upper surface 10a and it has a length B along a long side direction; the heat dissipation sticker 20 includes a first covering part 20a and two second covering parts 20b, wherein the first covering part 20a has a length A in the long side direction, each The second covering part 20b has a hollow part 25, and the solid parts of the heat dissipation sticker 20 on both sides of the hollow part 25 in the longitudinal direction have a length A1 and A2 respectively, and preferably, the hollow part 25 is in the second covering part. 20b is relatively close to the wafer 30. In this embodiment, the length A is smaller than the length B, and the sum of the lengths A1 and A2 is equal to the length A, so there are protrusions above and below the hollow portion 25 .

In addition, the film substrate 10 also includes a circuit layer 12 and an ink layer 14, the circuit layer 12 will expose part of the metal and the chip 30 for press-fit connection; Layer 22, which may include at least one material in the options of aluminum, copper and graphene, is attached to the upper surface 10a of the chip 30 and the film substrate 10, and the protective layer 24 completely covers the heat dissipation layer 22 and its size is larger than that of the heat dissipation layer 22 .

In addition, in a possible variation embodiment, the length A may be greater than or equal to the length B. Please refer to FIG. 4 , which shows a top view of another embodiment of the thin film chip packaging structure of the present invention. As shown in FIG. 4 , the length A is greater than the length B, and the thermal paste 20 protrudes from the two short sides of the chip 30 in the long side direction to expose the two sides of the chip 30 connected to the two short sides.

In addition, in a possible variation embodiment, the heat dissipation sticker 20 may not be provided with the above-mentioned protruding portion. Please refer to FIGS. 5 and 6 together, which illustrate the top views of another two embodiments of the thin film chip packaging structure of the present invention. As shown in FIG. 5 , the heat dissipation sticker 20 does not have the protrusion, and the length A is smaller than the length B; and as shown in FIG. 6 , the heat dissipation sticker 20 does not have the protrusion, and the length A is smaller than the length B; The length A is greater than the length B.

In addition, in a possible variation embodiment, the heat dissipation sticker 20 may have a plurality of hollow parts 25 . Please refer to Figures 7 to 10, which illustrate the top views of another four embodiments of the thin film chip packaging structure of the present invention. As shown in Figure 7, the heat dissipation paste 20 is respectively provided with two hollow parts 25 on both sides of the long side of the chip 30, and the length A is smaller than the length B, and the equivalent entity of the heat dissipation paste 20 in the long side direction of the chip 30 The length is the sum of the three sections of physical lengths A1, A2 and A3, and the equivalent physical length is equal to the length A; as shown in Figure 8, the cooling paste 20 is provided with two hollow parts 25 on both sides of the long side of the chip 30 , the length A is greater than the length B, the equivalent physical length of the cooling sticker 20 in the long side direction of the chip 30 is the sum of the three physical lengths A1, A2 and A3, and the equivalent physical length is equal to the length A; as shown As shown in 9, the heat dissipation sticker 20 is provided with two pairs of hollow parts 25 on both sides of the long side of the chip 30, the length A is smaller than the length B, and the equivalent physical length of the heat dissipation sticker 20 in the long side direction of the chip 30 is The sum of the three sections of physical lengths A1, A2 and A3, and the equivalent physical length is equal to the length A; and as shown in Figure 10, the cooling paste 20 is respectively provided with two pairs of hollow parts 25 on both sides of the long side of the chip 30, The length A is greater than the length B, and the equivalent physical length of the thermal paste 20 in the long side direction of the chip 30 is the sum of the three physical lengths A1, A2 and A3, and the equivalent physical length is equal to the length A.

In addition, although the hollow portion 25 in the above-mentioned embodiment is a closed hollow area, the present invention is not limited thereto, and it can also be an open hollow area. Please refer to Figures 11 to 14, which illustrate the top views of another four embodiments of the thin film chip packaging structure of the present invention. As shown in FIG. 11 , the cooling sticker 20 has an open hollow part 25 on both sides of the long side of the chip 30, and the solid parts of the cooling sticker 20 on both sides of the hollow part 25 in the direction of the long side have a length A1 and A2 respectively. , the length A is less than the length B, and the sum of the lengths A1 and A2 is equal to the length A; as shown in FIG. The physical parts of the cooling stickers 20 on both sides of the side direction have a length A1 and A2 respectively, the length A is greater than the length B, and the sum of the lengths A1 and A2 is equal to the length A; There are two open hollows 25 on both sides of the side. The equivalent physical length of the cooling paste 20 in the long side direction of the chip 30 is the sum of the three physical lengths A1, A2 and A3. The equivalent physical length is equal to the length A. And the length A is less than the length B; and as shown in Figure 14, the heat dissipation paste 20 has two open hollows 25 on both sides of the long side of the chip 30, and the equivalent physical length of the heat dissipation paste 20 in the long side direction of the chip 30 It is the sum of three physical lengths A1, A2 and A3, the equivalent physical length is equal to length A, and length A is greater than length B.

In addition, in the present invention, a back heat dissipation sticker can also be provided on the lower surface 10b of the film substrate 10 to enhance the heat dissipation effect. Please refer to Figures 15 and 16 together, wherein, Figure 15 is a schematic view of the appearance of another embodiment of the thin film chip packaging structure of the present invention; and Figure 16 is a cross section of the thin film chip packaging structure of Figure 15 along the section line V2-V2 picture. As shown in Figures 15 and 16, the lower surface 10b of the film substrate 10 is provided with a back heat dissipation paste 20c, and the back heat dissipation paste 20c includes a heat dissipation layer 22 and a protective layer 24, wherein the heat dissipation layer 22 may include aluminum, copper and graphite At least one material in the option of vinyl is to stick the lower surface 10b of the film substrate 10, and the protective layer 24 completely covers the heat dissipation layer 22 and its size is larger than the heat dissipation layer 22.

With the design disclosed above, the present invention has the following advantages: 1. The thin-film chip packaging structure of the present invention can avoid the heat dissipation by setting a hollow area near the long side of a chip in a heat dissipation paste to ensure that the air between the heat dissipation paste, the chip and a thin film substrate is completely excluded. The paste reduces the heat conduction effect due to the barrier of air bubbles. 2. The thin-film chip packaging structure of the present invention can ensure that the air between the heat-dissipating paste, the chip and a thin-film substrate is completely excluded by setting a hollow area adjacent to the long side of a chip in a heat-dissipating paste, so as to avoid the heat dissipation The paste is detached from the chip and the film substrate due to the thermal expansion of the air bubbles, thereby enhancing the packaging reliability of the product. 3. The thin film chip packaging structure of the present invention can enhance the heat dissipation effect by setting hollow areas in a heat dissipation paste to disperse the physical area of the heat dissipation paste, thereby reducing the materials used in the heat dissipation paste and reducing the packaging cost.

What is disclosed in this case is a preferred embodiment. For example, any partial changes or modifications derived from the technical ideas of this case and easily deduced by those who are familiar with the technology are within the scope of the patent right of this case.

To sum up, regardless of the purpose, means and efficacy of this case, it shows that it is very different from the conventional technology, and its first invention is practical, and it does meet the patent requirements of the invention. I implore your review committee to understand it clearly and grant a patent as soon as possible. Society is for the Most Prayer.

10: Film substrate 10a: Upper surface 10b: lower surface 12: Circuit layer 14: ink layer 20: cooling stickers 20a: first covering part 20b: the second covering part 20c: Cooling sticker on the back 22: heat dissipation layer 24: protective layer 25: hollow out part 30: Wafer

FIG. 1 is a schematic view of the appearance of an embodiment of the thin film chip packaging structure of the present invention. FIG. 2 is a top view of the thin film chip packaging structure in FIG. 1 . FIG. 3 is a cross-sectional view of the thin film chip package structure in FIG. 1 along the section line V1-V1. FIG. 4 is a top view of another embodiment of the thin film chip packaging structure of the present invention. 5 and 6 show top views of another two embodiments of the thin film chip packaging structure of the present invention. 7 to 10 show top views of another four embodiments of the thin film chip packaging structure of the present invention. 11 to 14 show top views of another four embodiments of the thin film chip packaging structure of the present invention. FIG. 15 is a schematic view of another embodiment of the thin film chip package structure of the present invention. FIG. 16 is a cross-sectional view of the thin film chip package structure of FIG. 15 along the section line V2-V2.

10: Film substrate

10a: Upper surface

10b: lower surface

20: cooling stickers

20a: first covering part

20b: the second covering part

22: heat dissipation layer

24: protective layer

25: hollow out part

30: Wafer

Claims (9)

A thin film chip packaging structure, which includes: a film substrate; a chip, arranged on the upper surface of the film substrate; and a heat dissipation paste, including a first covering part and at least one second covering part connected to the first Covering parts, wherein, the first covering part covers the wafer, each of the second covering parts covers the upper surface of the film substrate on one side of the wafer, and each of the second covering parts The portion has at least one hollow area; wherein, each of the hollow areas of each of the second covering portions is a closed hollow area. The thin film chip packaging structure as described in item 1 of the scope of the patent application, wherein, the chip has a first length in a long side direction, the first covering part has a second length in the long side direction, and the second length is less than the first length. The thin film chip packaging structure as described in item 1 of the scope of the patent application, wherein, the chip has a first length in a long side direction, the first covering part has a second length in the long side direction, and the second The length is equal to the first length. The thin film chip packaging structure as described in item 1 of the scope of patent application, wherein, the chip has a first length in a long side direction, the first covering part has a second length in the long side direction, and the second length greater than the first length, and the first covering part protrudes from both sides of the wafer along the long side direction to expose the two side surfaces of the wafer. The thin-film chip packaging structure as described in item 1 of the scope of the patent application, wherein, the total length of any heat dissipation sticker of each of the second covering parts in the long-side direction is equal to the length of the first covering part in the long-side direction . The thin-film chip packaging structure as described in item 1 of the scope of the patent application, wherein, the total length of any heat dissipation sticker of each of the second covering parts in the long-side direction is smaller than the length of the first covering part in the long-side direction . The thin film chip packaging structure as described in item 1 of the scope of patent application, wherein the heat dissipation paste includes a heat dissipation layer and a protective layer, the heat dissipation layer is attached to the thin film substrate and the chip, and the protective layer covers the thermal layer. According to the thin film chip packaging structure described in claim 7 of the patent application, the heat dissipation layer includes at least one material selected from the group consisting of aluminum, copper and graphene. The thin-film chip packaging structure described in any one of items 1 to 8 of the scope of the patent application further includes: a back heat dissipation sticker attached to the lower surface of the thin-film substrate.

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