TWM642111U - Thin film chip packaging structure - Google Patents

Abstract

A thin-film chip packaging structure, which includes: a thin-film substrate; a chip, arranged on the upper surface of the thin-film substrate; part and a third covering part connected with the second covering part, the first covering part is covered above the wafer, and the second covering part is suspended between one long side of the wafer and the film substrate, And the third covering part covers a heat dissipation sticker covering area of the film substrate; wherein, the second covering part is provided with at least one opening to expose the chip.

Description

Thin Film Chip Package Structure

The invention is related to chip packaging, in particular to a thin film chip packaging structure.

In the semiconductor field, COF (chip-on-film; chip-on-film) is mainly used in the display driver IC package.

In recent years, as the market's requirements for screen resolution and refresh rate have been increasing, the heat dissipation performance requirements for driver ICs have also become higher and higher. At present, the mainstream COF driver IC products on the market attach heat dissipation stickers to the back of the film substrate, and a few companies attach heat dissipation stickers to the front of the chip on the film substrate. However, there is still room for improvement in the heat dissipation effect.

In order to solve the above problems, there is an urgent need in the art for a novel thin film chip packaging structure.

One purpose of this creation is to disclose a thin-film chip packaging structure, which can make the heat dissipation paste evenly adhere to the chip and the film substrate by opening holes in a local area corresponding to the long side of a chip on the heat dissipation paste Wrinkles are avoided, thereby preventing the heat dissipation sticker from reducing the heat conduction effect due to the air bubbles in the wrinkles and preventing the heat dissipation sticker from being separated from the chip and the film substrate due to thermal expansion of the air bubbles in the wrinkles.

In order to achieve the aforementioned purpose, a thin film chip packaging structure is proposed, which includes: a thin film substrate; a chip, arranged on the upper surface of the thin film substrate; A second covering part connected with the second covering part and a third covering part connected with the second covering part, the first covering part is covered above the wafer, and the second covering part is suspended from one long side of the wafer Between the side surface and the film substrate, the third covering part is covering a heat dissipation sticker covering area of the film substrate; wherein, the second covering part is provided with at least one opening to expose the chip.

In one embodiment, the opening extends from the second covering portion to the third covering portion.

In one embodiment, the heat dissipation sticker includes a heat dissipation layer and a protective layer, the heat dissipation layer is pasted on the film substrate and the chip, and the protection layer covers the heat dissipation layer.

In a possible embodiment, the heat dissipation layer may include at least one material selected from aluminum, copper and graphene.

In order to achieve the aforementioned purpose, this creation further proposes a thin film chip packaging structure, which includes: a thin film substrate; a chip, arranged on the upper surface of the thin film substrate; a heat dissipation paste, including a first covering part, and the first covering A second covering part connected with the second covering part and a third covering part connected with the second covering part, the first covering part is covered above the wafer, and the second covering part is suspended from one long side of the wafer Between the side surface and the film substrate, and the third covering part covers a heat dissipation sticker covering area of the film substrate, wherein the second covering part is provided with at least one opening to expose the chip; and a back heat dissipation sticker, Attached to the lower surface of the film substrate.

In one embodiment, the opening extends from the second covering portion to the third covering portion.

In one embodiment, the heat dissipation sticker includes a heat dissipation layer and a protective layer, the heat dissipation layer is pasted on the film substrate and the chip, and the protection layer covers the heat dissipation layer.

In a possible embodiment, the heat dissipation layer may include at least one material selected from aluminum, copper and graphene.

In one embodiment, the back heat dissipation sticker includes another heat dissipation layer and another protective layer, the other heat dissipation layer is attached on the film substrate and the chip, and the another protection layer covers the other heat dissipation layer .

In a possible embodiment, the other heat dissipation layer may include at least one material selected from among aluminum, copper and graphene.

In order to enable your review committee members to further understand the structure, characteristics and purpose of this creation, drawings and detailed descriptions of preferred specific embodiments are hereby attached.

Please refer to Fig. 1, 2 and 3 together, wherein, Fig. 1 is the appearance schematic diagram of one embodiment of the thin film chip packaging structure of this creation; Fig. 2 is the top view of the thin film chip packaging structure of Fig. 1; And Fig. 3 is Fig. 1 A cross-sectional view of the thin film chip packaging structure along the section line A-A.

As shown in Figures 1, 2 and 3, the thin film chip packaging structure includes a thin film substrate 10, a heat dissipation paste 20 and a chip 30; the thin film substrate 10 has an upper surface 10a and a lower surface 10b; the chip 30 is arranged on the upper surface 10a; heat dissipation paste 20 includes a first covering part 20a, two second covering parts 20b connected with the first covering part 20a and two third covering parts 20c connected with the second covering part 20b, the first covering The part 20a is covered above the wafer 30, the second covering part 20b is suspended between one of the long sides of the wafer 30 and the film substrate 10, and the third covering part 20c is covered on a heat dissipation paste coverage area of the film substrate 10; Wherein, the second covering portion 20 b is provided with an opening 40 to expose the chip 30 .

In the embodiment of FIG. 1 , although the opening 40 of the second covering portion 20 b is shown as a square shape, the present invention is not limited thereto, and it may also be in geometric shapes such as circles, triangles, squares, or other non-geometric shapes. In addition, the number of openings 40 may also be multiple, and the arrangement thereof may be parallel, symmetrical, and the like. In addition, the opening 40 may be limited to the second covering portion 20b, or extend to the third covering portion 20c. According to this arrangement, the heat dissipation sticker 20 can be evenly pasted on the chip 30 and the film substrate 10 to avoid wrinkles, thereby preventing the heat dissipation sticker 20 from reducing the heat conduction effect due to the air bubbles in the wrinkles and preventing the heat dissipation sticker 20 from being wrinkled. The thermal expansion of the air bubbles in the fold separates from the wafer 30 and the film substrate 10 .

In addition, the film substrate 10 also includes a circuit layer 12 and an ink layer 14, the circuit layer 12 will expose part of the metal and the chip 30 for press-fit connection; Layer 22, which may include at least one material in the options of aluminum, copper and graphene, is attached to the upper surface 10a of the chip 30 and the film substrate 10, and the protective layer 24 completely covers the heat dissipation layer 22 and its size is larger than that of the heat dissipation layer 22 .

Please refer to FIG. 4 and FIG. 5 together, which are schematic appearance diagrams of another two embodiments of the thin film chip packaging structure of the present invention. As shown in FIG. 4 , the opening 40 of the cooling sticker 20 has a large size and extends along the second covering portion 20 b to the third covering portion 20 c. As shown in FIG. 5 , the cooling sticker 20 is provided with an opening 40 on each second covering portion 20b, and the two openings 40 are symmetrically arranged. This arrangement also helps to remove the air between the heat dissipation paste 20 and the chip 30, thereby preventing the heat dissipation paste 20 from reducing the heat conduction effect due to the barrier of air bubbles and preventing the heat dissipation paste 20 from being separated from the chip 30 due to the thermal expansion of the air bubbles.

In addition, in the present invention, a back heat dissipation sticker can also be provided on the lower surface 10b of the film substrate 10 to enhance the heat dissipation effect. Please refer to FIG. 6 , which is a cross-sectional view of another embodiment of the thin film chip packaging structure of the present invention. As shown in FIG. 6 , the lower surface 10b of the film substrate 10 is provided with a back heat dissipation paste 20d, and the back heat dissipation paste 20d includes a heat dissipation layer 22 and a protective layer 24, wherein the heat dissipation layer 22 may include aluminum, copper and graphene. At least one material in the options is attached to the lower surface 10 b of the film substrate 10 , and the protective layer 24 completely covers the heat dissipation layer 22 and has a larger size than the heat dissipation layer 22 .

By the design disclosed above, this creation has the following advantages: 1. The thin-film chip packaging structure of this invention can make holes on the heat dissipation sticker in a local area corresponding to the long side of a chip, so that the heat dissipation sticker can be evenly pasted on the chip and the film substrate to avoid wrinkles Folding, so as to prevent the heat dissipation paste from reducing the heat conduction effect due to the barrier of air bubbles in the folds and avoid the heat dissipation paste from being separated from the chip and the film substrate due to thermal expansion of the air bubbles in the folds.

What is disclosed in this case is a preferred embodiment. For example, any partial changes or modifications derived from the technical ideas of this case and easily deduced by those who are familiar with the technology are within the scope of the patent right of this case.

To sum up, the purpose, means and efficacy of this case all show that it is very different from the conventional technology, and its first creation is practical, and indeed meets the requirements of a patent for a new model. I urge your review committee to clearly understand it and grant a patent as soon as possible. Society is for the Most Prayer.

10: Film substrate

10a: Upper surface

10b: lower surface

12: Circuit layer

14: ink layer

20: cooling stickers

20a: first covering part

20b: the second covering part

20c: The third covering part

20d: Cooling sticker on the back

22: heat dissipation layer

24: protective layer

30: Wafer

FIG. 1 is a schematic view of the appearance of an embodiment of the thin film chip packaging structure of the present invention.

FIG. 2 is a top view of the thin film chip package structure in FIG. 1 .

FIG. 3 is a cross-sectional view of the thin film chip package structure of FIG. 1 along the section line A-A.

4 to 5 are schematic appearance diagrams of another second embodiment of the thin film chip packaging structure of the present invention.

FIG. 6 is another embodiment of the thin film chip packaging structure of the present invention.

FIG. 7 is a cross-sectional view of the thin film chip package structure in FIG. 6 along the section line B-B.

10: Film substrate

20: cooling stickers

20a: first covering part

20b: the second covering part

20c: The third covering part

30: Wafer

40: opening

Claims (10)

A thin-film chip packaging structure, which includes: a thin-film substrate; a chip, arranged on the upper surface of the thin-film substrate; part and a third covering part connected with the second covering part, the first covering part is covered above the wafer, and the second covering part is suspended between one long side of the wafer and the film substrate, And the third covering part covers a heat dissipation sticker covering area of the film substrate; wherein, the second covering part is provided with at least one opening to expose the chip. In the thin film chip packaging structure described in claim 1 of the patent claims, the opening extends from the second covering part to the third covering part. The thin film chip packaging structure as described in item 1 of the scope of patent application, wherein the heat dissipation paste includes a heat dissipation layer and a protective layer, the heat dissipation layer is attached to the thin film substrate and the chip, and the protective layer covers the thermal layer. The thin film chip package structure as described in claim 3 of the patent application, wherein the heat dissipation layer includes at least one material selected from the group consisting of aluminum, copper and graphene. A thin-film chip packaging structure, which includes: a thin-film substrate; a chip, arranged on the upper surface of the thin-film substrate; a heat dissipation sticker, including a first covering part and a second covering part connected with the first covering part and a third covering part connected to the second covering part, the first covering part is covered above the wafer, the second covering part is suspended between one long side of the wafer and the film substrate, and The third cover It is a heat dissipation paste covering area covered on the film substrate, wherein the second covering part is provided with at least one opening to expose the chip; and a back heat dissipation paste is attached to the lower surface of the film substrate. In the thin film chip packaging structure described in claim 5 of the patent claims, wherein the opening extends from the second covering part to the third covering part. The thin film chip packaging structure as described in item 5 of the scope of patent application, wherein the heat dissipation paste includes a heat dissipation layer and a protective layer, the heat dissipation layer is attached to the thin film substrate and the chip, and the protective layer covers the thermal layer. According to the thin film chip packaging structure described in item 7 of the patent scope of the application, the heat dissipation layer includes at least one material selected from the group consisting of aluminum, copper and graphene. The thin-film chip packaging structure described in item 5 of the scope of the patent application, wherein the back heat dissipation sticker includes another heat dissipation layer and another protective layer, and the other heat dissipation layer is attached to the film substrate and the chip, and The another protection layer covers the other heat dissipation layer. The thin film chip packaging structure as described in claim 9 of the patent application, wherein the other heat dissipation layer includes at least one material selected from the group consisting of aluminum, copper and graphene.

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