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TWI788505B - Cutting knife management method and cutting device - Google Patents

Cutting knife management method and cutting device Download PDF

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Publication number
TWI788505B
TWI788505B TW108101140A TW108101140A TWI788505B TW I788505 B TWI788505 B TW I788505B TW 108101140 A TW108101140 A TW 108101140A TW 108101140 A TW108101140 A TW 108101140A TW I788505 B TWI788505 B TW I788505B
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cutting
light
blade
unit
value
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TW108101140A
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TW201932236A (en
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田中誠
笠井剛史
小池彩子
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日商迪思科股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • H10P54/00
    • H10P72/0414
    • H10P72/0428
    • H10P72/06
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30Computing systems specially adapted for manufacturing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Dicing (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Harvester Elements (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)

Abstract

本發明的課題係提供可更適切地判定切削刀之破損的切削刀的管理方法。   解決手段是一種切削刀的管理方法,係包含從發光部放射之光線不被該切削刀遮蔽,射入至受光部的全射入狀態下,以從光電轉換部輸出的電性訊號之值變成所定值以上或大於該所定值之方式,利用調整部調整從發光部放射之光線的量的初期調整步驟、實施初期調整步驟之後,以切削刀對被加工物進行切削的切削步驟、及在實施切削步驟之後,將可動部定位於開位置之後,使切削刀接近刀片位置檢測單元,檢測出因為切削步驟所消耗之切削刀的刀鋒之位置的刀鋒位置檢測步驟,在刀鋒位置檢測步驟中將可動部定位於開位置之後,實施利用調整部再次調整從發光部放射之光線的量的平常時再調整步驟。The subject of this invention is to provide the management method of the cutting blade which can judge the breakage of a cutting blade more suitably. The solution is a cutting blade management method, which includes the light emitted from the light-emitting part is not blocked by the cutting blade, and enters the light-receiving part under the full-incidence state, and the value of the electrical signal output from the photoelectric conversion part becomes In the manner above the predetermined value or greater than the predetermined value, the initial adjustment step of adjusting the amount of light radiated from the light emitting part by the adjustment part, the cutting step of cutting the workpiece with a cutting blade after the initial adjustment step, and after the implementation After the cutting step, after the movable part is positioned at the open position, the cutting blade is brought close to the blade position detection unit, and the blade position detection step of detecting the position of the blade edge of the cutting blade consumed by the cutting step is performed, and the movable part is moved in the blade position detection step After the part is positioned at the open position, a normal-time readjustment step of readjusting the amount of light emitted from the light emitting part by the adjustment part is performed.

Description

切削刀的管理方法及切削裝置Cutting knife management method and cutting device

本發明係關於管理安裝於切削裝置的切削刀之切削刀的管理方法、及使用切削刀的管理方法的切削裝置。The present invention relates to a cutting blade management method for managing a cutting blade mounted on a cutting device, and a cutting device using the cutting blade management method.

在對半導體晶圓及封裝基板所代表之板狀的被加工物進行加工時,例如使用將環狀的切削刀安裝於主軸的切削裝置。利用一邊使主軸旋轉使切削刀切入被加工物,一邊使主軸及切削刀與被加工物相對地移動,可沿著該相對移動的方向對被加工物進行切削加工。When processing plate-shaped workpieces represented by semiconductor wafers and package substrates, for example, a cutting device in which a ring-shaped cutting blade is attached to a spindle is used. The workpiece can be cut along the direction of the relative movement by moving the spindle and the cutting blade relative to the workpiece while rotating the spindle to cut the cutting blade into the workpiece.

於如上所述的切削裝置,設置有在被加工物的切削加工中監視切削刀之狀態的切削刀監視單元(例如參照專利文獻1)。該切削刀監視單元係例如包含配置於挾持切削刀之位置的發光部與受光部,從發光部放射之射入至受光部之光線的量局部性增加的話,則判定為切削刀已破損。 [先前技術文獻] [專利文獻]The cutting device described above is provided with a cutting blade monitoring unit that monitors the state of the cutting blade during cutting of a workpiece (for example, refer to Patent Document 1). The cutting blade monitoring unit includes, for example, a light emitting unit and a light receiving unit disposed at a position where the cutting blade is interposed. If the amount of light emitted from the light emitting unit and incident on the light receiving unit locally increases, it is determined that the cutting blade is broken. [Prior Art Document] [Patent Document]

[專利文獻1] 日本特開2001-298001號公報[Patent Document 1] Japanese Patent Laid-Open No. 2001-298001

[發明所欲解決之課題][Problem to be Solved by the Invention]

然而,在上述之切削刀監視單元中,因切削加工所產生之切削屑附著於發光部或受光部的表面的話,射入至受光部之光線的量會減少,有變成無法適切判斷切削刀的破損之狀況。However, in the above-mentioned cutting tool monitoring unit, if chips generated by cutting adhere to the surface of the light emitting unit or the light receiving unit, the amount of light incident on the light receiving unit decreases, and the cutting tool cannot be properly judged. Condition of damage.

本發明係有鑑於相關問題點所發明者,其目的係提供可更適切地判定切削刀的破損之切削刀的管理方法,及使用該切削刀的管理方法的切削裝置。 [用以解決課題之手段]The present invention was made in view of the related problems, and an object of the present invention is to provide a cutting blade management method capable of more appropriately determining breakage of a cutting blade, and a cutting device using the cutting blade management method. [Means to solve the problem]

依據本發明的一樣態,提供一種切削刀的管理方法,係管理被安裝於切削裝置的切削刀;該切削裝置係具備保持被加工物的吸盤台、包含安裝對被加工物進行切削之切削刀的主軸的切削單元、包含被固定於該切削單元的固定部,與對於該固定部在開位置及閉位置之間移動的可動部,在該可動部被定位於該閉位置之狀態下覆蓋該切削刀的一部分,在該可動部被定位於該開位置之狀態下使該切削刀的該一部分露出的刀套、設置於該可動部,挾持該切削刀侵入之間隙而相互對向的發光部及受光部、將射入至該受光部之光線,轉換成對應該光線的量之值的電性訊號的光電轉換部、調整從該發光部放射之光線的量的調整部、檢測出該切削刀的刀鋒之位置的刀片位置檢測單元、及對被加工物供給切削液的噴嘴;該管理方法係具備:初期調整步驟,係在該可動部定位於該開位置,且從該發光部放射之光線不被該切削刀遮蔽,射入至該受光部的全射入狀態下,以從該光電轉換部輸出的電性訊號之值變成所定值以上或大於該所定值之方式,利用該調整部調整從該發光部放射之光線的量;切削步驟,係在實施該初期調整步驟之後,在該可動部定位於該閉位置,從該發光部放射之光線被該切削刀部分地被遮蔽的部分遮蔽狀態下,一邊對該被加工物供給該切削液一邊以該切削刀對該被加工物進行切削,並且監視該電性訊號之值;刀鋒位置檢測步驟,係在實施該切削步驟之後,將該可動部定位於該開位置之後,使該切削刀接近該刀片位置檢測單元,檢測出因為該切削步驟所消耗之切削刀的刀鋒的位置;在該刀鋒位置檢測步驟中將該可動部定位於該開位置之後,實施在該全射入狀態下,以從該光電轉換部輸出的電性訊號之值變成該所定值以上或大於該所定值之方式,利用該調整部再次調整從該發光部放射之光線的量的平常時再調整步驟。According to one aspect of the present invention, there is provided a cutting tool management method, which is to manage the cutting tool installed in the cutting device; The cutting unit of the main shaft includes a fixed part fixed to the cutting unit, and a movable part that moves between an open position and a closed position for the fixed part, and covers the A portion of the cutting blade, a housing that exposes the portion of the cutting blade when the movable portion is positioned at the open position, and light emitting portions that are provided on the movable portion and face each other across a gap where the cutting blade penetrates And a light receiving part, a photoelectric conversion part that converts the light incident on the light receiving part into an electrical signal of a value corresponding to the amount of light, an adjustment part that adjusts the amount of light emitted from the light emitting part, and detects the cutting A blade position detection unit for the position of the blade edge of the knife, and a nozzle for supplying cutting fluid to the workpiece; the management method includes: an initial adjustment step of positioning the movable part at the open position and emitting light from the light emitting part The adjustment unit is used in such a way that the value of the electrical signal output from the photoelectric conversion unit becomes more than a predetermined value or greater than the predetermined value in a state where the light is not shielded by the cutting blade and enters the light receiving unit. Adjusting the amount of light emitted from the light-emitting part; cutting step, after the initial adjustment step is carried out, after the movable part is positioned at the closed position, the light emitted from the light-emitting part is partially shielded by the cutting blade In the shielded state, while supplying the cutting fluid to the workpiece, the workpiece is cut with the cutting knife, and the value of the electrical signal is monitored; the blade position detection step is performed after the cutting step, and the After the movable portion is positioned at the open position, the cutting knife is brought close to the blade position detection unit to detect the position of the blade edge of the cutting blade consumed by the cutting step; the movable portion is positioned in the blade position detection step After the open position, in the full-incidence state, the value of the electrical signal output from the photoelectric conversion part becomes more than the predetermined value or greater than the predetermined value, and the adjusting part is used to adjust the light emitting part again The usual adjustment procedure for the amount of emitted light.

於本發明的一樣態中,在該切削步驟中所監視的該電性訊號之值降低至下限值為止時,實施中斷該切削步驟而將該可動部定位於該開位置,且在該全射入狀態下,以從該光電轉換部輸出的電性訊號之值變成該所定值以上或大於該所定值之方式,利用該調整部再次調整從該發光部放射之光線的量的臨時再調整步驟為佳。In one aspect of the present invention, when the value of the electrical signal monitored during the cutting step decreases to a lower limit value, the cutting step is interrupted and the movable part is positioned at the open position, and in the full Temporary readjustment in which the amount of light emitted from the light emitting part is readjusted by the adjustment part in such a way that the value of the electrical signal output from the photoelectric conversion part becomes more than or greater than the predetermined value in the incident state steps are better.

又,於本發明的一樣態中,以從該光電轉換部輸出的電性訊號之值變成該所定值以上或大於該所定值之方式,利用該調整部再次調整從該發光部放射之光線的量時,實施判定該調整部的調整量是否到達限度的調整量判定步驟為佳。Also, in one aspect of the present invention, the adjusting part is used to readjust the intensity of the light radiated from the light emitting part in such a way that the value of the electrical signal output from the photoelectric conversion part becomes more than or greater than the predetermined value. It is preferable to implement the adjustment amount determination step of determining whether the adjustment amount of the adjustment unit reaches the limit.

依據本發明的另一樣態,提供一種切削裝置,係具備:吸盤台,係保持被加工物;切削單元,係包含安裝對被加工物進行切削之切削刀的主軸;刀套,係包含被固定於該切削單元的固定部,與對於該固定部在開位置及閉位置之間移動的可動部,在該可動部被定位於該閉位置之狀態下覆蓋該切削刀的一部分,在該可動部被定位於該開位置之狀態下使該切削刀的該一部分露出;發光部及受光部,係設置於該可動部,挾持該切削刀侵入之間隙而相互對向;光電轉換部,係將射入至該受光部之光線,轉換成對應該光線的量之值的電性訊號;調整部,係調整從該發光部放射之光線的量;刀片位置檢測單元,係檢測出該切削刀的刀鋒之位置;噴嘴,係對被加工物供給切削液;及控制單元,係控制各構成要素;該控制單元係包含:開閉控制部,係進行將該可動部定位於該開位置或該閉位置的控制;及判定部,係在該可動部定位於該開位置,且從該發光部放射之光線不被該切削刀遮蔽,射入至該受光部的全射入狀態下,判定從該光電轉換部輸出的電性訊號之值是否變成所定值以上或大於該所定值;在該全射入狀態下,判定從該光電轉換部輸出的電性訊號之值未成為所定值以上或大於該所定值時,則在該全射入狀態下,以從該光電轉換部輸出的電性訊號之值變成該所定值以上或大於該所定值之方式,利用該調整部調整從該發光部放射之光線的量。According to another aspect of the present invention, a cutting device is provided, which includes: a suction cup table, which holds a workpiece; a cutting unit, which includes a spindle for installing a cutting knife for cutting the workpiece; a tool holder, which includes a fixed The fixed portion of the cutting unit, and the movable portion that moves between the open position and the closed position for the fixed portion, cover a part of the cutting blade when the movable portion is positioned at the closed position, and the movable portion In the state of being positioned at the open position, the part of the cutting blade is exposed; the light-emitting part and the light-receiving part are arranged on the movable part, and face each other with the gap in which the cutting blade penetrates; the photoelectric conversion part is to emit The light entering the light-receiving part is converted into an electrical signal corresponding to the value of the light; the adjustment part is to adjust the amount of light emitted from the light-emitting part; the blade position detection unit is to detect the cutting edge of the cutting knife The position of the nozzle; the nozzle is used to supply cutting fluid to the workpiece; and the control unit is used to control each component; the control unit includes: an opening and closing control part, which is used to position the movable part at the open position or the closed position control; and a judging part, which judges that the light emitted from the photoelectric conversion is in a full-incidence state in which the movable part is positioned at the open position, and the light emitted from the light emitting part is not blocked by the cutting blade and enters the light receiving part. Whether the value of the electrical signal output from the part becomes above the predetermined value or greater than the predetermined value; in the full-injection state, it is determined that the value of the electrical signal output from the photoelectric conversion part does not become above the predetermined value or greater than the predetermined value , then in the total incident state, the adjusting part is used to adjust the intensity of the light radiated from the light emitting part in such a way that the value of the electrical signal output from the photoelectric conversion part becomes above the predetermined value or greater than the predetermined value. quantity.

於本發明的另一樣態中,該判定部,係在該可動部定位於該閉位置,且從該發光部放射之光線被該切削刀部分地遮蔽的部分遮蔽狀態下,判定從該光電轉換部輸出的電性訊號之值是否降低至下限值為止;在該部分遮蔽狀態下,判定從該光電轉換部輸出的電性訊號之值降低至下限值為止時,則在該全射入狀態下,以從該光電轉換部輸出的電性訊號之值變成該所定值以上或大於該所定值之方式,利用該調整部調整從該發光部放射之光線的量為佳。 [發明的效果]In another aspect of the present invention, the judging unit judges whether the light from the photoelectric conversion is partially shielded when the movable part is positioned at the closed position and the light radiated from the light emitting part is partially shielded by the cutting blade. Whether the value of the electrical signal output from the photoelectric conversion part has decreased to the lower limit value; in the partially shielded state, when it is determined that the value of the electrical signal output from the photoelectric conversion unit has decreased to the lower limit value, then the total input In this state, it is preferable to use the adjustment unit to adjust the amount of light emitted from the light emitting unit so that the value of the electrical signal output from the photoelectric conversion unit becomes equal to or greater than the predetermined value. [Effect of the invention]

在本發明的一樣態之切削刀的管理方法中,以切削刀切削被加工物之後,利用刀片位置檢測單元檢測出因該切削所消耗之切削刀的刀鋒的位置時,會再次調整從破損檢測單元的發光部放射之光線的量,所以,即使發光部及受光部的表面附著些許的切削屑,也可維持從發光部放射之射入至受光部之光線的量。因此,依據本發明的一樣態之切削刀的管理方法,可更適切地判定切削刀的破損。In the management method of the cutting blade according to the present invention, after the workpiece is cut with the cutting blade, when the position of the blade edge of the cutting blade consumed by the cutting is detected by the blade position detection unit, the damage detection method will be adjusted again. The amount of light emitted from the light-emitting part of the unit can maintain the amount of light emitted from the light-emitting part and enter the light-receiving part even if a little cutting debris adheres to the surface of the light-emitting part and the light-receiving part. Therefore, according to the management method of the cutting blade in one aspect of the present invention, it is possible to determine the breakage of the cutting blade more appropriately.

參照添附圖面,針對本發明的一樣態相關的實施形態進行說明。圖1係揭示採用了本實施形態之切削刀的管理方法之切削裝置2的構造例的立體圖。再者,在圖1中,以功能區塊揭示切削裝置2之一部分的構成要件。又,以下的說明所用之X軸方向、Y軸方向、及Z軸方向設為相互垂直。Embodiments related to one aspect of the present invention will be described with reference to the attached drawings. FIG. 1 is a perspective view showing a structural example of a cutting device 2 to which the cutting blade management method of the present embodiment is applied. In addition, in FIG. 1 , some components of the cutting device 2 are shown as functional blocks. In addition, the X-axis direction, the Y-axis direction, and the Z-axis direction used in the following description are assumed to be perpendicular to each other.

如圖1所示,切削裝置2係具備支持各構成要素的基台4。於基台4之前方的角部形成有開口4a,於該開口4a內設置有藉由升降機構(未圖示)升降的晶匣升降機6。於晶匣升降機6的上面,載置可收容複數被加工物11的晶匣8。再者,在圖1中,為了便利說明,僅揭示晶匣8的輪廓。As shown in FIG. 1 , the cutting device 2 includes a base 4 that supports each component. An opening 4 a is formed at a front corner of the base 4 , and a cassette elevator 6 that is raised and lowered by a lifting mechanism (not shown) is provided in the opening 4 a. On the upper surface of the cassette elevator 6 , a cassette 8 capable of accommodating a plurality of workpieces 11 is placed. Furthermore, in FIG. 1 , for convenience of description, only the outline of the crystal box 8 is disclosed.

被加工物11係例如以矽等的半導體元件所成之圓盤狀的晶圓。該被加工物11的表面(圖1的上面)側係藉由相互交叉之複數預定分割線(切割道)區隔成複數區域,於各區域形成有IC(Integrated Circuit)等的裝置。The workpiece 11 is, for example, a disk-shaped wafer made of semiconductor elements such as silicon. The surface (upper side in FIG. 1 ) side of the workpiece 11 is partitioned into a plurality of regions by a plurality of predetermined dividing lines (cut lines) crossing each other, and devices such as IC (Integrated Circuit) are formed in each region.

於被加工物11的背面(圖1的下面)側,貼附有直徑大於被加工物11的黏著膠帶(切割膠帶)。黏著膠帶13的外周部分係固定於環狀的框架15。被加工物11係在隔著該黏著膠帶13被框架15支持的狀態下收容於晶匣8。An adhesive tape (dicing tape) having a larger diameter than the workpiece 11 is attached to the back side of the workpiece 11 (lower surface in FIG. 1 ). The outer peripheral portion of the adhesive tape 13 is fixed to the ring-shaped frame 15 . The workpiece 11 is accommodated in the cassette 8 in a state supported by the frame 15 via the adhesive tape 13 .

再者,在本實施形態中,將以矽等的半導體元件所成之圓盤狀的晶圓設為被加工物11,但是,被加工物11的材質、形狀、構造、大小等並無限制。例如,作為被加工物11,也可使用其他半導體、陶瓷、樹脂、金屬等的材料所成之基板等。同樣地,裝置的種類、數量、形狀、構造、大小、配置等也未有限制。於被加工物11未形成裝置亦可。Furthermore, in this embodiment, a disk-shaped wafer made of semiconductor elements such as silicon is used as the workpiece 11, but the material, shape, structure, size, etc. of the workpiece 11 are not limited. . For example, substrates made of other materials such as semiconductors, ceramics, resins, and metals may be used as the workpiece 11 . Likewise, the kind, number, shape, configuration, size, arrangement, etc. of the devices are not limited. No device may be formed on the workpiece 11 .

於晶匣升降機6的側方,形成X軸方向(前後方向,加工進送方向)長的開口4b。於開口4b內,配置有滾珠螺桿式的X軸移動機構(加工進送單元)10,與覆蓋X軸移動機構10之上部的蛇腹狀護蓋12。X軸移動機構10係具備X軸移動台(未圖示),使該軸移動台網X軸方向移動。再者,該X軸移動台的上部被台座護蓋10a覆蓋。On the side of the cassette elevator 6, an opening 4b long in the X-axis direction (front-back direction, processing feeding direction) is formed. In the opening 4b, a ball screw type X-axis moving mechanism (processing feeding unit) 10 and a bellows-shaped cover 12 covering the upper part of the X-axis moving mechanism 10 are arranged. The X-axis moving mechanism 10 includes an X-axis moving stage (not shown), and moves the axis moving stage in the X-axis direction. In addition, the upper part of this X-axis moving table is covered with the base cover 10a.

於X軸移動台上,保持被加工物11的吸盤台(保持台)14以從台座護蓋10a露出的樣態配置。吸盤台14係連結於馬達等的旋轉驅動源(未圖示),繞與Z軸方向(垂直方向)大略平行的旋轉軸周圍旋轉。又,吸盤台14係藉由上述之X軸移動機構10,與X軸移動台一起往X軸方向移動(加工進送)。On the X-axis moving table, a chuck table (holding table) 14 holding the workpiece 11 is arranged in a state exposed from the table cover 10a. The chuck table 14 is connected to a rotational drive source (not shown) such as a motor, and rotates around a rotational axis approximately parallel to the Z-axis direction (vertical direction). Furthermore, the chuck table 14 is moved in the X-axis direction together with the X-axis moving table by the above-mentioned X-axis moving mechanism 10 (processing feed).

保持台14的上面成為用以保持被加工物11的保持面14a。保持面14a係行程為大略平行於X軸方向及Y軸方向(左右方向,分度進送方向),透過形成於吸盤台14的內部之吸引路徑(未圖示)等連接於吸引源(未圖示)。又,於吸盤台14的周圍,設置有用以從四方固定支持被加工物11的環狀之框架15的4個箝夾16。The upper surface of the holding table 14 serves as a holding surface 14 a for holding the workpiece 11 . The stroke of the holding surface 14a is roughly parallel to the X-axis direction and the Y-axis direction (left-right direction, indexing feed direction), and is connected to a suction source (not shown) through a suction path (not shown) formed in the suction cup table 14, etc. icon). In addition, four jaws 16 for fixing and supporting a ring-shaped frame 15 of the workpiece 11 from four directions are provided around the chuck table 14 .

於開口4b的上方,配置有用以將上述之被加工物11(框架15)搬送至吸盤台14等的搬送單元(未圖示)。利用搬送單元搬送的被加工物11係例如以表面側露出於上方之方式被載於吸盤台14的保持面14a。Above the opening 4b, a transfer unit (not shown) for transferring the above-mentioned workpiece 11 (frame 15) to the chuck table 14 and the like is arranged. The workpiece 11 conveyed by the conveying unit is placed on the holding surface 14 a of the chuck table 14 such that the surface side thereof is exposed upward, for example.

於鄰接於開口4b的位置,配置有用以支持對被加工物11進行切削之切削單元18的懸樑狀的支持構造20。於支持構造20的前面上部,設置有使切削單元18移動於Y軸方向及Z軸方向的切削單元移動機構(分度進送單元,進刀單元)22。At a position adjacent to the opening 4b, a cantilever-shaped support structure 20 for supporting the cutting unit 18 for cutting the workpiece 11 is arranged. On the upper front surface of the support structure 20, a cutting unit moving mechanism (index feeding unit, knife feeding unit) 22 for moving the cutting unit 18 in the Y-axis direction and the Z-axis direction is provided.

切削單元移動機構22係具備配置於支持構造20的前面,且大略平行於Y軸方向的一對Y軸導引軌道24。於Y軸導引軌道24,可滑動地設置有構成切削單元移動機構22的Y軸移動板26。The cutting unit moving mechanism 22 is provided with a pair of Y-axis guide rails 24 arranged in front of the support structure 20 and roughly parallel to the Y-axis direction. A Y-axis moving plate 26 constituting the cutting unit moving mechanism 22 is slidably provided on the Y-axis guide rail 24 .

於Y軸移動板26的背面側(後面側),設置有螺帽部(未圖示),於該螺帽部,螺合大略平行於Y軸導引軌道24的Y軸滾珠螺桿28。於Y軸滾珠螺桿28的一端部,連結Y軸脈衝馬達(未圖示)。利用以Y軸脈衝馬達使Y軸滾珠螺桿28旋轉的話,Y軸移動板26係沿著Y軸導引軌道24,移動於Y軸方向。A nut portion (not shown) is provided on the back side (rear side) of the Y-axis moving plate 26 , and a Y-axis ball screw 28 substantially parallel to the Y-axis guide rail 24 is screwed to the nut portion. A Y-axis pulse motor (not shown) is connected to one end of the Y-axis ball screw 28 . When the Y-axis ball screw 28 is rotated by the Y-axis pulse motor, the Y-axis moving plate 26 moves in the Y-axis direction along the Y-axis guide rail 24 .

於Y軸移動板26的表面(前面),設置有大略平行於Z軸方向的一對Z軸導引軌道30。於Z軸導引軌道30,可滑動地安裝有Z軸移動板32。On the surface (front) of the Y-axis moving plate 26, a pair of Z-axis guide rails 30 roughly parallel to the Z-axis direction are provided. A Z-axis moving plate 32 is slidably mounted on the Z-axis guide rail 30 .

於Z軸移動板32的背面側(後面側),設置有螺帽部(未圖示),於該螺帽部,螺合平行於Z軸導引軌道30的Z軸滾珠螺桿34。於Z軸滾珠螺桿34的一端部,連結Z軸脈衝馬達36。利用以Z軸脈衝馬達36使Z軸滾珠螺桿34旋轉的話,Z軸移動板32係沿著Z軸導引軌道30,移動於Z軸方向。A nut portion (not shown) is provided on the back side (rear side) of the Z-axis moving plate 32 , and the Z-axis ball screw 34 parallel to the Z-axis guide rail 30 is screwed to the nut portion. A Z-axis pulse motor 36 is connected to one end of the Z-axis ball screw 34 . When the Z-axis ball screw 34 is rotated by the Z-axis pulse motor 36 , the Z-axis moving plate 32 moves in the Z-axis direction along the Z-axis guide rail 30 .

於Z軸移動板32的下部,設置有切削單元18。圖2係揭示切削單元18等之構造例的立體圖,圖3係揭示切削單元18等之構造例的模式圖。再者,在圖3中也利用功能區塊揭示一部分的構成要件。A cutting unit 18 is provided on the lower part of the Z-axis moving plate 32 . FIG. 2 is a perspective view showing a structural example of the cutting unit 18 and the like, and FIG. 3 is a schematic view showing a structural example of the cutting unit 18 and the like. In addition, also in FIG. 3, a part of constituent elements are shown using a functional block.

切削單元18係具備筒狀的主軸殼體38(圖1)。於主軸殼體38,收容有成為旋轉軸的主軸40(圖3)。主軸40的一端部係從主軸殼體38的一端側露出至外部,於該主軸40的一端部,透過刀座42等,安裝用以切削加工被加工物11的切削刀44。於主軸40的另一端側,連結有包含馬達的旋轉驅動源(未圖示)。The cutting unit 18 includes a cylindrical spindle housing 38 ( FIG. 1 ). The spindle housing 38 accommodates a spindle 40 ( FIG. 3 ) serving as a rotation axis. One end of the spindle 40 is exposed from one end of the spindle housing 38 to the outside, and a cutting blade 44 for cutting the workpiece 11 is attached to the one end of the spindle 40 through a tool holder 42 or the like. A rotary drive source (not shown) including a motor is connected to the other end side of the main shaft 40 .

於主軸殼體38的一端部,安裝有用以收容被安裝於主軸40隻切削刀44等的刀套46。刀套46包含固定於主軸殼體38之一端部的固定部48,與可對於固定部48移動的可動部50。A tool holder 46 for accommodating the cutting blades 44 and the like attached to the main shaft 40 is attached to one end of the main shaft housing 38 . The tool holder 46 includes a fixed portion 48 fixed to one end of the spindle housing 38 , and a movable portion 50 movable relative to the fixed portion 48 .

可動部50係例如透過空氣汽缸52(參照圖4(A))等連結於固定部48,藉由空氣汽缸52所供給之空氣等的壓力對於固定部48滑動。將該可動部50定位於最接近固定部48的閉位置時,切削刀44的一部分會被刀套46覆蓋。另一方面,將該可動部50定位於最接近固定部48的開位置時,切削刀44的一部分會被刀套46覆蓋。The movable part 50 is connected to the fixed part 48 through the air cylinder 52 (refer to FIG. When the movable portion 50 is positioned at the closed position closest to the fixed portion 48 , a part of the cutting blade 44 is covered by the blade case 46 . On the other hand, when the movable portion 50 is positioned at the open position closest to the fixed portion 48 , a part of the cutting blade 44 is covered by the blade case 46 .

於可動部50,設置有挾持切削刀44之下部的一對刀片冷卻噴嘴54。各刀片冷卻噴嘴54係形成為大略L字狀,對於其基端側,透過連結具56供給純水等的切削液。於各刀片冷卻噴嘴54之與切削刀44對向的位置,形成有複數縫隙(未圖示),切削液係通過該等複數縫隙供給至切削刀44及被加工物11。The movable part 50 is provided with a pair of blade cooling nozzles 54 sandwiching the lower part of the cutting blade 44 . Each of the insert cooling nozzles 54 is formed in a substantially L-shape, and a cutting fluid such as pure water is supplied to the base end side through the coupling 56 . A plurality of slits (not shown) are formed at positions facing the cutting blade 44 of each insert cooling nozzle 54 , and the cutting fluid is supplied to the cutting blade 44 and the workpiece 11 through the plurality of slits.

另一方面,於固定部48的內部,設置有用以對切削刀44供給切削液的噴頭(未圖示)。於噴頭的基端側,透過連結具58供給純水等的切削液。於與切削刀44對向之噴頭的前端部,形成供給孔(未圖示),切削液係透過該供給孔主要供給至切削刀44。On the other hand, a spray head (not shown) for supplying cutting fluid to the cutting blade 44 is provided inside the fixing portion 48 . A cutting fluid such as pure water is supplied through a coupling 58 to the base end side of the shower head. A supply hole (not shown) is formed at the tip of the head facing the cutting blade 44 , and the cutting fluid is mainly supplied to the cutting blade 44 through the supply hole.

又,於可動部50的上部,配置有檢測出切削刀44之破損等的破損檢測單元60的一部分。如圖3所示,破損檢測單元60係包含挾持切削刀44可侵入之間隙而相互對向的發光部60a與受光部60b。將可動部50定位於閉位置時,切削刀44會侵入該間隙,發光部60a與受光部60b挾持切削刀44相對向。Moreover, a part of the breakage detection unit 60 which detects breakage of the cutting blade 44 etc. is arrange|positioned at the upper part of the movable part 50. As shown in FIG. As shown in FIG. 3 , the breakage detection unit 60 includes a light emitting unit 60 a and a light receiving unit 60 b facing each other across a gap through which the cutting blade 44 can penetrate. When the movable portion 50 is positioned at the closed position, the cutting blade 44 enters the gap, and the light emitting portion 60 a and the light receiving portion 60 b face each other with the cutting blade 44 interposed therebetween.

發光部60a係透過光纖等連接於LED(Light Emitting Diode)等的發光元件60c,可朝向受光部60b放射光線。再者,於發光元件60c,連接放大器(調整部)60d。例如,藉由放大器60d控制被供給至發光元件60c的電力的話,可調整從發光部60a放射之光線的量。The light emitting part 60a is connected to a light emitting element 60c such as an LED (Light Emitting Diode) through an optical fiber or the like, and can emit light toward the light receiving part 60b. Furthermore, an amplifier (adjustment unit) 60d is connected to the light emitting element 60c. For example, if the power supplied to the light emitting element 60c is controlled by the amplifier 60d, the amount of light emitted from the light emitting portion 60a can be adjusted.

另一方面,受光部60b係透過光纖等連接於光二極體等的受光元件(光電轉換部)60e。該受光元件60e係產生因應受光部60b之受光亮的電力(代表性的有電壓)。亦即,受光元件60e係將射入至受光部60b的光線,轉換成對應該光線的量之值的電性訊號。On the other hand, the light receiving unit 60b is connected to a light receiving element (photoelectric conversion unit) 60e such as a photodiode through an optical fiber or the like. The light receiving element 60e generates electric power (typically, a voltage) corresponding to the light received by the light receiving unit 60b. That is, the light receiving element 60e converts the light incident on the light receiving part 60b into an electrical signal having a value corresponding to the amount of the light.

如此構成之破損檢測單元60中,例如將從發光部60a放射之光線的量大略保持為一定,不被切削刀44遮蔽,並監視射入至受光部60b之光線的量,藉此可即刻發現切削刀44的缺口等的破算。In the breakage detection unit 60 configured in this way, for example, the amount of light emitted from the light-emitting portion 60a is kept approximately constant without being shielded by the cutting blade 44, and the amount of light incident on the light-receiving portion 60b is monitored, thereby enabling immediate detection. The gap of the cutting blade 44 etc. is calculated.

如圖1所示,於鄰接切削單元18的位置,設置有對被加工物11進行攝像的攝像單元(相機)62。利用切削單元移動機構22使Y軸移動板26往Y軸方向移動的話,切削單元18及攝像單元62會往Y軸方向移動(分度進送)。又,利用切削單元移動機構22使Z軸移動板32往Z軸方向移動的話,切削單元18及攝像單元62會往Z軸方向移動。As shown in FIG. 1 , an imaging unit (camera) 62 for imaging the workpiece 11 is provided at a position adjacent to the cutting unit 18 . When the cutting unit moving mechanism 22 moves the Y-axis moving plate 26 in the Y-axis direction, the cutting unit 18 and the imaging unit 62 move in the Y-axis direction (index feed). Moreover, when the Z-axis moving plate 32 is moved in the Z-axis direction by the cutting unit moving mechanism 22, the cutting unit 18 and the imaging unit 62 are moved in the Z-axis direction.

於切削單元18的下方,配置有於Z軸方向中檢測出切削刀44之刀鋒(前端)的位置(高度)的刀片位置檢測單元64。該刀片位置檢測單元64係具有與破損檢測單元60類似的構造,可利用使切削刀44侵入發光部(未圖示)與受光部(未圖示)之間,檢測出該切削刀44之刀鋒的位置。Below the cutting unit 18 , a blade position detecting unit 64 is arranged to detect the position (height) of the blade edge (tip) of the cutting blade 44 in the Z-axis direction. The blade position detection unit 64 has a structure similar to that of the damage detection unit 60, and can detect the blade edge of the cutting blade 44 by intruding the cutting blade 44 between the light-emitting part (not shown) and the light-receiving part (not shown). s position.

例如,上述之切削刀44因切削加工等而消耗時,切削刀44對於被加工物11切入時之切削刀44之下端的深度(切入深度)會偏離設為目標的深度。此時,藉由刀片位置檢測單元64檢測出切削刀44之刀鋒的位置,進行適切的修正,藉此可使切削刀44切入至適切的深度為止。For example, when the above-mentioned cutting blade 44 is consumed by cutting processing, etc., the depth (cutting depth) of the lower end of the cutting blade 44 when the cutting blade 44 penetrates into the workpiece 11 deviates from the target depth. At this time, the position of the blade edge of the cutting blade 44 is detected by the blade position detection unit 64 and an appropriate correction is performed so that the cutting blade 44 can cut to an appropriate depth.

於對於開口4b與開口4a相反側的位置,形成開口4c。於開口4c內,配置有用以洗淨切削加工後之被加工物11等的洗淨單元66。於X軸移動機構10、切削單元18、切削單元移動機構22、破損檢測單元60、刀片位置檢測單元64等的各構成要素,連接控制單元68。控制單元68係配合被加工物11的加工條件等,控制各構成要素。An opening 4c is formed at a position opposite to the opening 4a with respect to the opening 4b. In the opening 4c, a cleaning unit 66 for cleaning the workpiece 11 and the like after cutting is disposed. A control unit 68 is connected to each component such as the X-axis moving mechanism 10 , the cutting unit 18 , the cutting unit moving mechanism 22 , the breakage detection unit 60 , and the blade position detection unit 64 . The control unit 68 controls each component in accordance with the processing conditions of the workpiece 11 and the like.

該控制單元68係如圖3所示,包含控制相對於刀套46的固定部48之可動部50的位置的開閉指示部68a。例如,在藉由上述之刀片位置檢測單元64檢測出切削刀44之刀鋒的位置時,藉由開閉指示部68a的指示,可動部50被定位於開位置。另一方面,利用切削刀44對藉由吸盤台18保持的被加工物11進行切削加工時,藉由開閉指示部68a的指示,可動部50被定位於閉位置。As shown in FIG. 3 , the control unit 68 includes an opening/closing instruction portion 68 a for controlling the position of the movable portion 50 relative to the fixed portion 48 of the tool holder 46 . For example, when the position of the blade edge of the cutting blade 44 is detected by the above-mentioned blade position detection means 64, the movable part 50 is positioned at the open position by the instruction of the opening and closing instruction part 68a. On the other hand, when the workpiece 11 held by the chuck table 18 is cut by the cutting blade 44 , the movable portion 50 is positioned at the closed position by an instruction from the opening/closing instruction portion 68 a.

又,控制單元68包含進行各種判定處理的判定部68b。該判定部68b更包含記憶判定部68b的判定處理所使用之所定值得所定值記憶部68c,與記憶下限值的下限值記憶部68d。關於判定部68b、所定值記憶部68c、及下限值記憶部68d的具體功能等於後敘述。In addition, the control unit 68 includes a determination unit 68b that performs various determination processes. The judging unit 68b further includes a predetermined value storage unit 68c for storing a predetermined value used in the judging process of the judging unit 68b, and a lower limit value storage unit 68d for storing a lower limit value. The specific functions of the determination unit 68b, the predetermined value storage unit 68c, and the lower limit storage unit 68d will be described later.

接著,針對利用上述之切削裝置2進行之切削刀的管理方法進行說明。在本實施形態之切削刀的管理方法中,首先,進行以從受光元件60e輸出的電性訊號之值成為所定值以上之方式,調整從發光部60a放射之光線的量的初期調整步驟。Next, a method of managing cutting blades using the cutting device 2 described above will be described. In the cutting blade management method of this embodiment, first, an initial adjustment step is performed to adjust the amount of light emitted from the light emitting unit 60a so that the value of the electrical signal output from the light receiving element 60e becomes a predetermined value or more.

圖4(A)係揭示初期調整步驟等的側視圖。如圖4(A)所示,在該初期調整步驟中,首先,開閉指示部68a將可動部50定位於開位置,使切削刀44的一部分從刀套46露出。如此,可動部50被定位於開位置的話,則成為切削刀44未被配置於發光部60a與受光部60b之間隙的狀態。FIG. 4(A) is a side view showing an initial adjustment step and the like. As shown in FIG. 4(A), in this initial adjustment step, first, the opening/closing instruction portion 68a positions the movable portion 50 at the open position to expose a part of the cutting blade 44 from the blade housing 46 . In this way, when the movable part 50 is positioned at the open position, the cutting blade 44 is not disposed in the gap between the light emitting part 60a and the light receiving part 60b.

因此,從破損檢測單元60的發光部60a放射之光線,係不被切削刀44遮蔽,射入至受光部60b。在本實施形態中,將從發光部60a放射的光線不被切削刀44遮蔽,射入至受光部60b的狀態稱為全射入狀態。Therefore, the light emitted from the light emitting unit 60 a of the damage detection unit 60 enters the light receiving unit 60 b without being shielded by the cutting blade 44 . In the present embodiment, the state in which light rays emitted from the light emitting portion 60a are incident on the light receiving portion 60b without being shielded by the cutting blade 44 is referred to as a total incident state.

在初期調整步驟中,以在該全射入狀態下從受光元件60e輸出的電性訊號之值成為所定值以上之方式,利用放大器60d調整從發光部60a放射之光線的量。亦即,控制單元68係以一邊將從受光元件60e輸出的電性訊號之值與所定值進行比較,一邊從受光元件60e輸出的電性訊號之值成為該所定值以上之方式,調整從放大器60d供給至發光元件60c的電力。In the initial adjustment step, the amount of light emitted from the light emitting unit 60a is adjusted by the amplifier 60d so that the value of the electrical signal output from the light receiving element 60e in the total incident state becomes equal to or greater than a predetermined value. That is, the control unit 68 adjusts the slave amplifier so that the value of the electrical signal output from the light receiving element 60e becomes equal to or greater than the predetermined value while comparing the value of the electrical signal output from the light receiving element 60e with a predetermined value. 60d supplies power to the light emitting element 60c.

適切調整從放大器60d供給至發光元件60c的電力,將此時的放大器60d的狀態作為基準狀態記憶於控制單元68時,則結束初期調整步驟。再者,在該初期調整步驟中所使用之所定值,係在可適切檢測出切削刀44之破損的範圍內任意設定,預先記憶於判定部68b的所定值記憶部68c。When the power supplied from the amplifier 60d to the light-emitting element 60c is appropriately adjusted, and the state of the amplifier 60d at this time is stored in the control unit 68 as a reference state, the initial adjustment step ends. The predetermined value used in the initial adjustment step is arbitrarily set within a range in which breakage of the cutting blade 44 can be appropriately detected, and is stored in the predetermined value storage unit 68c of the determination unit 68b in advance.

在初期調整步驟之後,進行利用切削刀44對被加工物11進行切削加工的切削步驟。圖4(B)係揭示切削步驟的側視圖,圖5係揭示切削步驟的一部分剖面側視圖。如圖4(B)所示,在該切削步驟中,首先,開閉指示部68a將可動部50定位於閉位置,以刀套46覆蓋切削刀44。After the initial adjustment step, a cutting step of cutting the workpiece 11 with the cutting blade 44 is performed. FIG. 4(B) is a side view showing the cutting step, and FIG. 5 is a partial cross-sectional side view showing the cutting step. As shown in FIG. 4(B), in this cutting step, first, the opening and closing instruction portion 68 a positions the movable portion 50 at the closed position, and the cutting blade 44 is covered with the blade case 46 .

如此,可動部50被定位於閉位置的話,則成為切削刀44被配置於發光部60a與受光部60b之間隙的狀態。因此,從破損檢測單元60的發光部60a放射之光線,係被切削刀44部分遮蔽。在本實施形態中,將從發光部60a放射的光線被切削刀44部分遮蔽的狀態稱為部分遮蔽狀態。In this way, when the movable part 50 is positioned at the closed position, the cutting blade 44 is placed in the gap between the light emitting part 60a and the light receiving part 60b. Therefore, the light emitted from the light emitting unit 60 a of the breakage detection unit 60 is partially shielded by the cutting blade 44 . In this embodiment, the state in which the light emitted from the light emitting portion 60a is partially shielded by the cutting blade 44 is referred to as a partially shielded state.

在本實施形態的切削步驟中,一邊在該部分遮蔽狀態下監視從受光元件60e輸出的電性訊號之值,一邊對被加工物11進行切削加工。具體來說,在放大器60d被調整為上述之基準狀態的狀況下,如圖5所示,一邊從刀片冷卻噴嘴54及噴頭供給切削液,一邊使旋轉的切削刀44切入至藉由吸盤台18保持之被加工物11。In the cutting step of this embodiment, the workpiece 11 is cut while monitoring the value of the electrical signal output from the light receiving element 60e in this partially shielded state. Specifically, when the amplifier 60d is adjusted to the above-mentioned reference state, as shown in FIG. The processed object 11 is kept.

藉此,對被加工物11進行切削加工。在此切削步驟中,一邊監視在上述之部分遮蔽狀態下從受光元件60e輸出的電性訊號之值,一邊對被加工物11進行切削加工,所以,可即時發現切削加工中所發生之切削刀44的缺口等的破損。Thereby, cutting processing is performed on the workpiece 11 . In this cutting step, the workpiece 11 is cut while monitoring the value of the electrical signal output from the light-receiving element 60e in the above-mentioned partial shielding state. Therefore, it is possible to immediately find the cutting edge generated during the cutting process. 44 damage such as a notch.

圖6(A)係揭示在部分遮蔽狀態下從受光元件60e輸出的電性訊號之範例的圖表。再者,在圖6(A)中,例示從受光元件60e作為電性訊號輸出電壓的狀況。在圖6(A)的範例中,於時間t1 中,從受光元件60e輸出對於平均電壓Va1 超出允許範圍的高電壓V1 。此種狀況中,判定部68b係判定切削刀44破損。FIG. 6(A) is a diagram illustrating an example of an electrical signal output from the light receiving element 60e in a partially shielded state. In addition, in FIG. 6(A), the state where the voltage is output as an electrical signal from the light receiving element 60e is illustrated. In the example of FIG. 6(A), at time t 1 , a high voltage V 1 exceeding the allowable range with respect to the average voltage V a1 is output from the light receiving element 60 e. In such a situation, the judging unit 68b judges that the cutting blade 44 is broken.

再者,判定為在該切削步驟中切削刀44破損時,中斷或中止切削步驟,進行交換切削刀44的切削刀交換步驟為佳。藉此,可將起因於切削刀44的破損而切削加工的品質降低的可能性抑制成較低。Furthermore, when it is determined that the cutting blade 44 is damaged during this cutting step, it is preferable to interrupt or stop the cutting step and perform a cutting blade exchange step of exchanging the cutting blade 44 . Thereby, the possibility of the quality reduction of a cutting process due to the breakage of the cutting blade 44 can be suppressed low.

切削步驟之後,例如為了修正起因於切削刀44的消耗等之切入深度的偏差,進行檢測出切削刀44的刀鋒之位置的刀鋒位置檢測步驟。在該刀鋒位置檢測步驟中,首先,開閉指示部68a將可動部50定位於開位置(圖4(A))。After the cutting step, for example, a blade position detection step of detecting the position of the blade edge of the cutting blade 44 is performed in order to correct a variation in the cutting depth due to wear of the cutting blade 44 or the like. In this blade position detection step, first, the opening/closing instructing portion 68a positions the movable portion 50 at the open position ( FIG. 4(A) ).

接著,一邊從刀片位置檢測單元64的發光部放射光線一邊使切削單元18下降,讓切削刀44侵入刀片位置檢測單元64的發光部與受光部之間。藉此,可依據刀片位置檢測單元64的受光部之受光量的變化,檢測出切削刀44之刀鋒的位置。所檢測出的切削刀44之刀鋒的位置係使用於修正切削刀44的切入深度的偏差。Next, the cutting unit 18 is lowered while emitting light from the light emitting unit of the blade position detecting unit 64 , and the cutting blade 44 is inserted between the light emitting unit and the light receiving unit of the blade position detecting unit 64 . Thereby, the position of the blade edge of the cutting blade 44 can be detected according to the change of the light receiving amount of the light receiving part of the blade position detecting unit 64 . The detected position of the cutting edge of the cutting blade 44 is used to correct deviations in the cutting depth of the cutting blade 44 .

在本實施形態的刀鋒位置檢測步驟中,利用將可動部50定位於開位置,刀片冷卻噴嘴54等可被定位於充分遠離切削刀44的位置。因此,在切削刀44侵入刀片位置檢測單元64的發光部與受光部之間時,刀片冷卻噴嘴54等不會干擾到刀片位置檢測單元64。In the blade position detection step of the present embodiment, by positioning the movable portion 50 at the open position, the blade cooling nozzle 54 and the like can be positioned sufficiently away from the cutting blade 44 . Therefore, when the cutting blade 44 enters between the light emitting unit and the light receiving unit of the insert position detecting unit 64 , the insert cooling nozzle 54 and the like do not interfere with the insert position detecting unit 64 .

在刀鋒位置檢測步驟中將可動部50定位於開位置之後,與該刀鋒位置檢測步驟同步,進行再次調整放大器60d之狀態的再調整步驟(平常時再調整步驟)。再調整步驟的具體流程,係與上述之初期調整步驟相同。After the movable part 50 is positioned at the open position in the blade position detection step, a readjustment step (ordinary readjustment step) for readjusting the state of the amplifier 60d is performed in synchronization with the blade position detection step. The specific process of the re-adjustment step is the same as the above-mentioned initial adjustment step.

具體來說,以在上述之全射入狀態下從受光元件60e輸出的電性訊號之值成為所定值以上之方式,利用放大器60d調整從發光部60a放射之光線的量。亦即,控制單元68係以一邊將從受光元件60e輸出的電性訊號之值與所定值進行比較,一邊從受光元件60e輸出的電性訊號之值成為該所定值以上之方式,調整從放大器60d供給至發光元件60c的電力。Specifically, the amount of light emitted from the light emitting unit 60a is adjusted by the amplifier 60d so that the value of the electrical signal output from the light receiving element 60e in the above-mentioned full-incidence state becomes a predetermined value or more. That is, the control unit 68 adjusts the slave amplifier so that the value of the electrical signal output from the light receiving element 60e becomes equal to or greater than the predetermined value while comparing the value of the electrical signal output from the light receiving element 60e with a predetermined value. 60d supplies power to the light emitting element 60c.

適切調整從放大器60d供給至發光元件60c的電力,將此時的放大器60d的狀態作為基準狀態記憶於控制單元68時,則結束再調整步驟。再者,此再調整步驟中所使用的所定值係與初期調整步驟中所使用的所定值相同即可。亦即,即使在該再調整步驟中,也使用預先記憶於所定值記憶部68c的所定值。When the power supplied from the amplifier 60d to the light-emitting element 60c is appropriately adjusted, and the state of the amplifier 60d at this time is stored in the control unit 68 as a reference state, the readjustment step ends. Furthermore, it is sufficient that the set value used in the readjustment step is the same as the set value used in the initial adjustment step. That is, even in this readjustment step, the predetermined value stored in advance in the predetermined value storage unit 68c is used.

如此,利用與切削步驟之後所進行的刀鋒位置檢測步驟同步進行再調整步驟,例如,即使在因切削加工所發生之切削屑等附著於發光部60a或受光部60b的表面的狀況中,也可維持從發光部60a放射而射入至受光部60b之光線的量。因此,容易適切判定切削刀44的缺口等的破損。In this way, by performing the readjustment step synchronously with the blade position detection step performed after the cutting step, for example, even in a situation where cutting chips and the like generated by the cutting process adhere to the surface of the light emitting part 60a or the light receiving part 60b, it is possible to The amount of light emitted from the light emitting unit 60a and incident on the light receiving unit 60b is maintained. Therefore, it is easy to properly determine damage such as chipping of the cutting blade 44 .

又,在本實施形態中,與刀鋒位置檢測步驟同步進行再調整步驟,所以,相較於以不同時機實施該等步驟的狀況,被加工物11的切削加工可使用的時間(切削裝置2的實質上運作時間)不會被縮短。在刀鋒位置檢測步驟及再調整步驟中,需要將可動部50定位於開位置,無法與切削加工同時實施該等兩個步驟,所以,同步進行刀鋒位置檢測步驟及再調整步驟的效果很大。Also, in the present embodiment, the readjustment step is performed synchronously with the blade position detection step, so the time available for cutting the workpiece 11 (the cutting device 2's Substantial operating time) will not be shortened. In the blade position detection step and the readjustment step, the movable part 50 needs to be positioned at the open position, and these two steps cannot be performed simultaneously with the cutting process. Therefore, synchronously performing the blade position detection step and the readjustment step is very effective.

再者,在上述之切削步驟的途中,從受光元件60e輸出的電性訊號之值降低至允許範圍的下限值為止時,中斷降低步驟而進行再調整步驟(臨時再調整步驟)為佳。圖6(B)係揭示從受光元件60e輸出的電性訊號降低之樣子的圖表。Furthermore, when the value of the electrical signal output from the light receiving element 60e drops to the lower limit of the allowable range during the above-mentioned cutting step, it is preferable to interrupt the lowering step and perform the readjustment step (temporary readjustment step). FIG. 6(B) is a graph showing how the electrical signal output from the light receiving element 60e decreases.

此時,判定部68b在切削步驟的實施中判定從受光元件60e輸出的電性訊號之值是否降低至下限值為止。亦即,判定部68b係藉由比較從受光元件60e輸出的電性訊號之值,與預先記憶於下限值記憶部68d的下限值V2 ,來進行上述的判定。再者,在圖6(B)中,將對於平均電力Va2 超過允許範圍的低電壓設定為下限值V2At this time, the determination unit 68b determines whether or not the value of the electrical signal output from the light receiving element 60e has decreased to a lower limit value during the execution of the cutting step. That is, the determination unit 68b performs the above determination by comparing the value of the electrical signal output from the light receiving element 60e with the lower limit value V 2 previously stored in the lower limit value storage unit 68d. In addition, in FIG.6(B), the low voltage which exceeds the allowable range with respect to average electric power V a2 is set as the lower limit value V2 .

中斷切削步驟後進行之再調整步驟的具體流程,係與上述之初期調整步驟等相同。具體來說,首先,開閉指示部68a將可動部50定位於開位置。然後,以在上述之全射入狀態下從受光元件60e輸出的電性訊號之值成為所定值以上之方式,利用放大器60d調整從發光部60a放射之光線的量。The specific flow of the readjustment step performed after the cutting step is interrupted is the same as the above-mentioned initial adjustment step. Specifically, first, the opening and closing instructing portion 68a positions the movable portion 50 at the open position. Then, the amount of light radiated from the light emitting unit 60a is adjusted by the amplifier 60d so that the value of the electrical signal output from the light receiving element 60e in the above-mentioned total incident state becomes a predetermined value or more.

亦即,控制單元68係以一邊將從受光元件60e輸出的電性訊號之值與所定值進行比較,一邊從受光元件60e輸出的電性訊號之值成為該所定值以上之方式,調整從放大器60d供給至發光元件60c的電力。適切調整從放大器60d供給至發光元件60c的電力,將此時的放大器60d的狀態作為基準狀態記憶於控制單元68時,則結束再調整步驟。That is, the control unit 68 adjusts the slave amplifier so that the value of the electrical signal output from the light receiving element 60e becomes equal to or greater than the predetermined value while comparing the value of the electrical signal output from the light receiving element 60e with a predetermined value. 60d supplies power to the light emitting element 60c. When the power supplied from the amplifier 60d to the light-emitting element 60c is appropriately adjusted, and the state of the amplifier 60d at this time is stored in the control unit 68 as a reference state, the readjustment step ends.

再者,此再調整步驟中所使用的所定值係與初期調整步驟等所使用的所定值相同即可。亦即,即使在該再調整步驟中,也使用預先記憶於所定值記憶部68c的所定值。又,該再調整步驟結束之後,再次開始切削步驟即可。In addition, the set value used in this readjustment process should just be the same as the set value used in the initial stage adjustment process etc. That is, even in this readjustment step, the predetermined value stored in advance in the predetermined value storage unit 68c is used. In addition, after the readjustment step is completed, the cutting step may be restarted.

如以上所述,在本實施形態之切削刀的管理方法中,以切削刀44切削被加工物11之後,利用刀片位置檢測單元64檢測出因該切削所消耗之切削刀44的刀鋒的位置時,會再次調整從破損檢測單元60的發光部60a放射之光線的量,所以,即使發光部60a及受光部60b的表面附著些許的切削屑,也可維持從發光部60a放射之射入至受光部60b之光線的量。因此,依據本實施形態之切削刀的管理方法,可更適切地判定切削刀44的破損。As described above, in the cutting blade management method of the present embodiment, after cutting the workpiece 11 with the cutting blade 44, the position of the blade edge of the cutting blade 44 consumed by the cutting is detected by the blade position detection means 64. , the amount of light emitted from the light emitting portion 60a of the breakage detection unit 60 will be adjusted again, so even if a little cutting chips adhere to the surfaces of the light emitting portion 60a and the light receiving portion 60b, the light emitted from the light emitting portion 60a can be kept incident on the light receiving portion. The amount of light from the portion 60b. Therefore, according to the management method of the cutting blade of this embodiment, it is possible to determine the damage of the cutting blade 44 more appropriately.

再者,本發明並不限制於前述實施形態的記載,可進行各種變更來實施。例如,在前述實施形態中進行再調整步驟(平常時再調整步驟、臨時再調整步驟)之後(或進行之後),進行判定放大器60d的調整量是否到達限度的調整量判定步驟為佳。該調整量判定步驟係利用判定部68b進行。In addition, this invention is not limited to description of the said embodiment, It can change variously and can implement. For example, after (or after) the readjustment step (ordinary readjustment step, temporary readjustment step) in the above-mentioned embodiment, it is preferable to perform the adjustment amount determination step of judging whether the adjustment amount of the amplifier 60d has reached the limit. This adjustment amount determination step is performed by the determination unit 68b.

判定放大器60d的調整量未達到限度時,亦即,可適切調整放大器60d時,則可持續適切進行再調整步驟(平常時再調整步驟、臨時再調整步驟)。另一方面,判定放大器60d的調整量達到限度時,例如對於切削裝置2的操作員通知其要旨。以該通知為契機,操作員可進行發光部60a及受光部60b的清掃。When it is determined that the adjustment amount of the amplifier 60d has not reached the limit, that is, when the amplifier 60d can be properly adjusted, the appropriate readjustment step (normal readjustment step, temporary readjustment step) can be continued. On the other hand, when it is determined that the adjustment amount of the amplifier 60d has reached the limit, for example, the operator of the cutting device 2 is notified of the fact. With this notification as an opportunity, the operator can clean the light emitting unit 60a and the light receiving unit 60b.

又,在前述實施形態的初期調整步驟及再調整步驟中,以從受光元件60e輸出的電性訊號之值成為所定值以上之方式調整從發光部60a放射之光線的量,但是,以從受光元件60e輸出的電性訊號大於所定值之方式調整從發光部60a放射之光線的量亦可。Also, in the initial adjustment step and the readjustment step of the aforementioned embodiment, the amount of light emitted from the light emitting unit 60a is adjusted so that the value of the electrical signal output from the light receiving element 60e becomes equal to or greater than a predetermined value. The amount of light emitted from the light emitting portion 60a may be adjusted so that the electrical signal output from the element 60e is greater than a predetermined value.

此外,前述實施形態及變形例等的構造、方法等只要不脫離本發明的目的的範圍,可適當變更來實施。In addition, the structures, methods, and the like of the above-mentioned embodiments and modified examples can be appropriately changed and implemented as long as they do not depart from the scope of the object of the present invention.

2‧‧‧切削裝置4‧‧‧基台4a,4b,4c‧‧‧開口6‧‧‧晶匣升降機8‧‧‧晶匣10‧‧‧X軸移動機構(加工進送單元)10a‧‧‧台座護蓋11‧‧‧被加工物12‧‧‧蛇腹狀護蓋13‧‧‧黏著膠帶(切割膠帶)14‧‧‧吸盤台(保持台)14a‧‧‧保持面15‧‧‧框架16‧‧‧箝夾18‧‧‧切削單元20‧‧‧支持構造22‧‧‧切削單元移動機構(分度進送單元,進刀單元)24‧‧‧Y軸導引軌道26‧‧‧Y軸移動板28‧‧‧Y軸滾珠螺桿30‧‧‧Z軸導引軌道32‧‧‧Z軸移動板34‧‧‧Z軸滾珠螺桿36‧‧‧Z軸脈衝馬達38‧‧‧主軸殼體40‧‧‧主軸42‧‧‧刀座44‧‧‧切削刀46‧‧‧刀套48‧‧‧固定部50‧‧‧可動部52‧‧‧空氣汽缸54‧‧‧刀片冷卻噴嘴56,58‧‧‧連結具60‧‧‧破損檢測單元60a‧‧‧發光部60b‧‧‧受光部60c‧‧‧發光元件60d‧‧‧放大器(調整部)60e‧‧‧受光元件(光電轉換部)62‧‧‧攝像單元(相機)64‧‧‧刀片位置檢測單元66‧‧‧洗淨單元68‧‧‧控制單元68a‧‧‧開閉指示部68b‧‧‧判定部68c‧‧‧所定值記憶部68d‧‧‧下限值記憶部2‧‧‧Cutting device 4‧‧‧Abutment 4a, 4b, 4c‧‧‧Opening 6‧‧‧Case elevator 8‧‧‧Case 10‧‧‧X-axis moving mechanism (processing feed unit) 10a‧ ‧‧Pedestal cover 11‧‧‧Workpiece 12‧‧‧Concertina cover 13‧‧‧Adhesive tape (cutting tape) 14‧‧‧Sucker table (holding table) 14a‧‧‧Holding surface 15‧‧‧ Frame 16‧‧‧Clamp 18‧‧‧Cutting Unit 20‧‧‧Supporting Structure 22‧‧‧Moving Mechanism of Cutting Unit (Indexing Feeding Unit, Tooling Unit) 24‧‧‧Y-axis Guide Rail 26‧‧ ‧Y-axis moving plate 28‧‧‧Y-axis ball screw 30‧‧‧Z-axis guide rail 32‧‧‧Z-axis moving plate 34‧‧‧Z-axis ball screw 36‧‧‧Z-axis pulse motor 38‧‧‧ Spindle housing 40‧‧‧Spindle 42‧‧‧Knife seat 44‧‧‧Cutting tool 46‧‧‧Knife holder 48‧‧‧Fixed part 50‧‧‧Moving part 52‧‧‧Air cylinder 54‧‧‧Blade cooling Nozzles 56, 58 ‧‧‧connector 60‧‧‧damage detection unit 60a‧‧‧light emitting part 60b‧‧‧light receiving part 60c‧‧‧light emitting element 60d‧‧‧amplifier (adjustment part) 60e‧‧‧light receiving element ( Photoelectric conversion unit) 62‧‧‧camera unit (camera) 64‧‧‧blade position detection unit 66‧‧‧cleaning unit 68‧‧‧control unit 68a‧‧‧opening and closing instruction unit 68b‧‧‧judgment unit 68c‧‧ ‧Set value storage unit 68d‧‧‧lower limit value storage unit

[圖1] 揭示切削裝置的構造例的立體圖。   [圖2] 揭示切削單元等的構造例的立體圖。   [圖3] 揭示切削單元等的構造例的模式圖。   [圖4] 圖4(A)係揭示初期調整步驟等的側視圖,圖4(B)係揭示切削步驟等的側視圖。   [圖5] 揭示切削步驟等的一部分剖面側視圖。   [圖6] 圖6(A)係揭示在部分遮蔽狀態下從受光元件輸出之電性訊號的範例的圖表,圖6(B)係揭示從受光元件輸出之電性訊號之值降低的樣子的圖表。[ Fig. 1 ] A perspective view showing a structural example of a cutting device. [Fig. 2] A perspective view showing a structural example of a cutting unit and the like. [Fig. 3] A schematic diagram showing a structural example of a cutting unit and the like. [Fig. 4] Fig. 4(A) is a side view showing the initial adjustment step, etc., and Fig. 4(B) is a side view showing the cutting step, etc. [Fig. 5] Partial sectional side view showing cutting steps etc. [Fig. 6] Fig. 6(A) is a graph showing an example of the electrical signal output from the light receiving element in a partially shielded state, and Fig. 6(B) is a graph showing how the value of the electrical signal output from the light receiving element decreases chart.

2‧‧‧切削裝置 2‧‧‧Cutting device

4‧‧‧基台 4‧‧‧Abutment

4a,4b,4c‧‧‧開口 4a, 4b, 4c‧‧‧opening

6‧‧‧晶匣升降機 6‧‧‧Case elevator

8‧‧‧晶匣 8‧‧‧Crystal box

10‧‧‧X軸移動機構 10‧‧‧X-axis moving mechanism

10a‧‧‧台座護蓋 10a‧‧‧pedestal cover

11‧‧‧被加工物 11‧‧‧processed object

12‧‧‧蛇腹狀護蓋 12‧‧‧Concertina-shaped cover

13‧‧‧黏著膠帶 13‧‧‧Adhesive Tape

14‧‧‧吸盤台 14‧‧‧Suction cup table

14a‧‧‧保持面 14a‧‧‧Retaining surface

15‧‧‧框架 15‧‧‧Framework

16‧‧‧箝夾 16‧‧‧Clamp

18‧‧‧切削單元 18‧‧‧Cutting unit

20‧‧‧支持構造 20‧‧‧Support structure

22‧‧‧切削單元移動機構 22‧‧‧Moving mechanism of cutting unit

24‧‧‧Y軸導引軌道 24‧‧‧Y-axis guide track

26‧‧‧Y軸移動板 26‧‧‧Y-axis moving plate

28‧‧‧Y軸滾珠螺桿 28‧‧‧Y-axis ball screw

30‧‧‧Z軸導引軌道 30‧‧‧Z-axis guide track

32‧‧‧Z軸移動板 32‧‧‧Z-axis moving plate

34‧‧‧Z軸滾珠螺桿 34‧‧‧Z-axis ball screw

36‧‧‧Z軸脈衝馬達 36‧‧‧Z axis pulse motor

38‧‧‧主軸殼體 38‧‧‧Spindle housing

60‧‧‧破損檢測單元 60‧‧‧Damage detection unit

62‧‧‧攝像單元 62‧‧‧camera unit

64‧‧‧刀片位置檢測單元 64‧‧‧Blade position detection unit

66‧‧‧洗淨單元 66‧‧‧Cleaning unit

68‧‧‧控制單元 68‧‧‧Control Unit

Claims (5)

一種切削刀的管理方法,係管理被安裝於切削裝置的切削刀;該切削裝置係具備保持被加工物的吸盤台、包含安裝對被加工物進行切削之切削刀的主軸的切削單元、包含被固定於該切削單元的固定部,與對於該固定部在開位置及閉位置之間移動的可動部,在該可動部被定位於該閉位置之狀態下覆蓋該切削刀的一部分,在該可動部被定位於該開位置之狀態下使該切削刀的該一部分露出的刀套、設置於該可動部,挾持該切削刀侵入之間隙而相互對向的發光部及受光部、將射入至該受光部之光線,轉換成對應該光線的量之值的電性訊號的光電轉換部、調整從該發光部放射之光線的量的調整部、檢測出該切削刀的刀鋒之位置的刀片位置檢測單元、及對被加工物供給切削液的噴嘴;其特徵為具備:初期調整步驟,係在該可動部定位於該開位置,且從該發光部放射之光線不被該切削刀遮蔽,射入至該受光部的全射入狀態下,以從該光電轉換部輸出的電性訊號之值變成所定值以上或大於該所定值之方式,利用該調整部調整從該發光部放射之光線的量;切削步驟,係在實施該初期調整步驟之後,在該可動部定位於該閉位置,從該發光部放射之光線被該切削刀部分地被遮蔽的部分遮蔽狀態下,一邊對該被加工物供給該 切削液一邊以該切削刀對該被加工物進行切削,並且監視該電性訊號之值;及刀鋒位置檢測步驟,係在實施該切削步驟之後,將該可動部定位於該開位置之後,使該切削刀接近該刀片位置檢測單元,檢測出因為該切削步驟所消耗之切削刀的刀鋒的位置;在該刀鋒位置檢測步驟中將該可動部定位於該開位置之後,實施在該全射入狀態下,以從該光電轉換部輸出的電性訊號之值變成該所定值以上或大於該所定值之方式,利用該調整部再次調整從該發光部放射之光線的量的平常時再調整步驟;與在切削步驟之後所進行的刀鋒位置檢測步驟同步進行再調整步驟。 A cutting tool management method, which manages cutting tools installed in a cutting device; A fixed portion fixed to the cutting unit, and a movable portion that moves between an open position and a closed position for the fixed portion, covers a part of the cutting blade when the movable portion is positioned at the closed position, and the movable portion is positioned at the closed position. The cutter holder which exposes the part of the cutting blade in the state where the cutting blade is positioned at the open position is installed on the movable part, and the light-emitting part and the light-receiving part which are opposed to each other across the gap where the cutting blade penetrates will emit light into the The photoelectric conversion unit that converts the light from the light receiving unit into an electrical signal corresponding to the value of the light quantity, the adjustment unit that adjusts the quantity of light emitted from the light emitting unit, and the blade position that detects the position of the blade edge of the cutting blade A detection unit, and a nozzle for supplying cutting fluid to the workpiece; it is characterized by: an initial adjustment step, when the movable part is positioned at the open position, and the light emitted from the light-emitting part is not blocked by the cutting blade, the In the state of total incidence into the light-receiving part, the adjustment part is used to adjust the intensity of the light emitted from the light-emitting part in such a way that the value of the electrical signal output from the photoelectric conversion part becomes more than a predetermined value or greater than the predetermined value. Quantity; cutting step, after implementing the initial adjustment step, when the movable part is positioned at the closed position, the light emitted from the light emitting part is partially shielded by the part of the cutting blade, while the workpiece is processed supply the Cutting the workpiece with the cutting tool while the cutting fluid is cutting, and monitoring the value of the electrical signal; and the step of detecting the position of the blade is after the cutting step is performed, and after the movable part is positioned at the open position, the The cutting blade approaches the blade position detection unit to detect the position of the blade edge of the cutting blade consumed by the cutting step; after positioning the movable part at the open position in the blade position detection step, the full injection is performed In the normal state, the value of the electrical signal output from the photoelectric conversion part becomes more than or greater than the predetermined value, and the adjustment part is used to readjust the amount of light emitted from the light emitting part. ; The readjustment step is performed synchronously with the blade position detection step performed after the cutting step. 如申請專利範圍第1項所記載之切削刀的管理方法,其中,在該切削步驟中所監視的該電性訊號之值降低至下限值為止時,實施中斷該切削步驟而將該可動部定位於該開位置,且在該全射入狀態下,以從該光電轉換部輸出的電性訊號之值變成該所定值以上或大於該所定值之方式,利用該調整部再次調整從該發光部放射之光線的量的臨時再調整步驟。 The cutting tool management method described in Claim 1, wherein, when the value of the electrical signal monitored during the cutting step drops to a lower limit value, the cutting step is interrupted and the movable part is interrupted. Positioned at the open position, and in the full-incidence state, the value of the electrical signal output from the photoelectric conversion part becomes more than the predetermined value or greater than the predetermined value, and the adjustment part is used to adjust the light emission from the light source again. Temporary readjustment of the amount of light emitted from the part. 如申請專利範圍第1項或第2項所記載之切削刀的管理方法,其中,以從該光電轉換部輸出的電性訊號之值變成該所定值以上或大於該所定值之方式,利用該調整部再次調整從該發光部放射之光線的量時,實施判定該調整部的調整量是否到達限度的調整量判定步驟。 The cutting tool management method described in claim 1 or claim 2, wherein the value of the electrical signal output from the photoelectric conversion unit becomes equal to or greater than the predetermined value, using the When the adjustment unit readjusts the amount of light emitted from the light emitting unit, an adjustment amount determination step of determining whether the adjustment amount of the adjustment unit has reached a limit is performed. 一種切削裝置,其特徵為具備:吸盤台,係保持被加工物;切削單元,係包含安裝對被加工物進行切削之切削刀的主軸;刀套,係包含被固定於該切削單元的固定部,與對於該固定部在開位置及閉位置之間移動的可動部,在該可動部被定位於該閉位置之狀態下覆蓋該切削刀的一部分,在該可動部被定位於該開位置之狀態下使該切削刀的該一部分露出;發光部及受光部,係設置於該可動部,挾持該切削刀侵入之間隙而相互對向;光電轉換部,係將射入至該受光部之光線,轉換成對應該光線的量之值的電性訊號;調整部,係調整從該發光部放射之光線的量;刀片位置檢測單元,係檢測出該切削刀的刀鋒之位置;噴嘴,係對被加工物供給切削液;及 控制單元,係控制各構成要素;該控制單元係包含:開閉控制部,係進行將該可動部定位於該開位置或該閉位置的控制;及判定部,係在該可動部定位於該開位置,且從該發光部放射之光線不被該切削刀遮蔽,射入至該受光部的全射入狀態下,判定從該光電轉換部輸出的電性訊號之值是否變成所定值以上或大於該所定值;在該全射入狀態下,判定從該光電轉換部輸出的電性訊號之值未成為所定值以上或大於該所定值時,則在該全射入狀態下,以從該光電轉換部輸出的電性訊號之值變成該所定值以上或大於該所定值之方式,利用該調整部調整從該發光部放射之光線的量;該調整部之光線的量的調整,係與對該被加工物進行切削之後所進行的切削刀的刀鋒之位置的檢測同步進行。 A cutting device, characterized by comprising: a suction cup table holding a workpiece; a cutting unit including a main shaft on which a cutting knife for cutting the workpiece is mounted; a tool holder including a fixing portion fixed to the cutting unit , and the movable part that moves between the open position and the closed position for the fixed part covers a part of the cutting blade when the movable part is positioned at the closed position, and when the movable part is positioned at the open position In this state, the part of the cutting blade is exposed; the light-emitting part and the light-receiving part are arranged on the movable part, and they face each other with the gap in which the cutting blade penetrates; , which is converted into an electrical signal corresponding to the value of the amount of light; the adjustment part is to adjust the amount of light emitted from the light emitting part; the blade position detection unit is to detect the position of the blade edge of the cutting knife; the nozzle is to the The workpiece is supplied with cutting fluid; and The control unit controls each constituent element; the control unit includes: an opening and closing control part, which performs control to position the movable part at the open position or the closed position; and a determination part, which locates the movable part at the open position position, and the light radiated from the light-emitting part is not blocked by the cutting blade, and enters the light-receiving part in the full-incidence state, and determines whether the value of the electrical signal output from the photoelectric conversion part becomes a predetermined value or greater The predetermined value; in the state of full incidence, when it is determined that the value of the electrical signal output from the photoelectric conversion part is not above the predetermined value or greater than the predetermined value, then in the state of total incidence, the photoelectric signal from the photoelectric In such a way that the value of the electrical signal output by the conversion part becomes above the predetermined value or greater than the predetermined value, the adjustment part is used to adjust the amount of light emitted from the light emitting part; the adjustment of the light amount of the adjustment part is related to the The detection of the position of the blade edge of the cutting blade performed after the workpiece is cut is performed simultaneously. 如申請專利範圍第4項所記載之切削裝置,其中,該判定部,係在該可動部定位於該閉位置,且從該發光部放射之光線被該切削刀部分地遮蔽的部分遮蔽狀態下,判定從該光電轉換部輸出的電性訊號之值是否降低至下限值為止;在該部分遮蔽狀態下,判定從該光電轉換部輸出的電性訊號之值降低至下限值為止時,則在該全射入狀態下,以從該光電轉換部輸出的電性訊號之值變成該所定值以上 或大於該所定值之方式,利用該調整部調整從該發光部放射之光線的量。 The cutting device described in claim 4 of the scope of the patent application, wherein the judging part is in a partially shielded state in which the movable part is positioned at the closed position and the light emitted from the light emitting part is partially shielded by the cutting blade , to determine whether the value of the electrical signal output from the photoelectric conversion unit has decreased to the lower limit value; in the partially shielded state, when it is determined that the value of the electrical signal output from the photoelectric conversion unit has decreased to the lower limit value, Then, in the full-incidence state, the value of the electrical signal output from the photoelectric conversion part becomes more than the predetermined value or greater than the predetermined value, the adjustment unit is used to adjust the amount of light emitted from the light emitting unit.
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