TWI779194B - Workpiece processing method - Google Patents

Abstract

[Problem] To provide a workpiece processing method that can appropriately adjust the height of the cutting blade without greatly reducing the throughput. [Solution] A workpiece processing method, which includes: a reference setting step, setting the height of the cutting unit as a reference; a target setting step, setting the cutting unit as the cutting blade in such a way that the cutting blade cuts into the predetermined depth of the cutting film. The height of the target; the first cutting step is to cut the workpiece by making the cutting unit and the chuck table relatively move in the state where the cutting unit is positioned at the height of the target; the correction value acquisition step is based on the cutting blade The length of the contact trace formed on the adhesive film is obtained to obtain the correction value; and in the second cutting step, the cutting unit is positioned at the height of the target after being corrected according to the correction value, and the cutting unit and the chuck table are relatively moved To cut and process workpieces.

Description

Workpiece processing method

The invention relates to a processing method for workpieces, which cuts and processes plate-shaped workpieces pasted with cutting adhesive films.

When processing a plate-shaped workpiece representing a semiconductor wafer or a package substrate, for example, a dicing device with a ring-shaped dicing blade mounted on a spindle is used. The main shaft is rotated to cut the cutting blade into the workpiece, and the main shaft and the cutting blade are moved relative to the workpiece, so that the workpiece can be cut along the direction of the relative movement.

However, when the workpiece is cut with the above-mentioned cutting device, the cutting blade will be worn, and its diameter will gradually become smaller. If the cutting blade whose diameter is reduced due to wear continues to be used, the cutting blade's penetration into the workpiece becomes shallow, and the workpiece cannot be properly cut.

Therefore, a method of detecting the position of the front end (lower end) of the cutting blade at an arbitrary point of time and controlling the cutting of the cutting blade into the workpiece based on the position of the front end (for example, refer to Patent Document 1) has been put into practical use. The method is to make the cutting blade intrude into the optical sensor provided on the cutting device, and detect the position of the front end of the cutting blade by blocking the optical path in the sensor. [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2001-298001

[Problems to be Solved by the Invention] In recent years, along with miniaturization of wafers cut out from workpieces, etc., the number of processing planning lines (dicing streets) set on the workpieces has also increased. Therefore, it is likely to occur that the cutting blade is greatly worn during cutting and processing of a workpiece, and the height of the cutting blade must be adjusted by confirming the position of the front end of the cutting blade.

Once this situation occurs, the cutting process of the workpiece will be stopped, and after the above-mentioned sensor detects the position of the front end of the cutting blade, the height of the cutting blade is adjusted, and the cutting process is restarted. However, in this case, the cutting blade must be relatively moved between the workpiece and the sensor, so the yield is likely to decrease.

The present invention was made in view of such a problem, and an object of the present invention is to provide a workpiece processing method capable of appropriately adjusting the height of a cutting blade without greatly reducing throughput.

[Technical means to solve the problem] According to an aspect of the present invention, it is a workpiece processing method, which uses a cutting device to cut and process a workpiece pasted with a cutting adhesive film, the cutting adhesive film is attached to the opening of the ring frame, and the cutting device includes: holding the workpiece a chuck table; a cutting unit equipped with a cutting blade for cutting the workpiece held on the chuck table; and a setting unit for setting the height of the cutting unit as a reference based on the height of the front end of the outer periphery of the cutting blade The workpiece processing method comprises the following steps: a benchmark setting step, based on the height of the cutting blade peripheral front end, setting the cutting unit as the height of the benchmark; target setting step, so that the cutting blade cuts into the cutting film In the predetermined depth mode, the height of the cutting unit is set as the target; in the first cutting step, the cutting unit is positioned at the height of the target, by making the cutting unit and the chuck table Relatively moving to cut and process the workpiece; the correction value obtaining step is simultaneously with the first cutting step, or after the first cutting step, based on the length of the contact trace formed by the cutting blade on the cutting adhesive film, obtaining a value for Correcting the correction value of the height of the target as the cutting unit; and a second cutting step, positioning the cutting unit at a height obtained by correcting the height of the target according to the correction value, by making the The cutting unit moves relative to the chuck table to cut and process the workpiece.

In one aspect of the present invention, in the first cutting step, the cutting unit may be lowered in the first area where the cutting adhesive film is exposed between the workpiece and the frame, and then descended to the target height. so that the cutting blade moves relative to the workpiece until the second area where the cutting adhesive film on the opposite side of the first area is exposed, by making the cutting unit and the chuck table move relatively, While cutting and processing the workpiece, the contact trace is formed on the cutting adhesive film.

In addition, in one aspect of the present invention, it may further include a step of forming contact marks, after the first cutting step and before the correction value obtaining step, the cutting glue between the workpiece and the frame of the cutting unit The exposed area of the film descends to form the contact mark on the dicing adhesive film by descending to the target height.

In addition, in an aspect of the present invention, in the correction value obtaining step, the correction value may be obtained based on the depth of the contact mark calculated from the length of the contact mark and the outer diameter of the cutting blade.

[Efficacy of the invention] In the workpiece processing method related to one aspect of the present invention, based on the length of the contact trace formed by the cutting blade on the dicing adhesive film, a correction value for correcting the height of the cutting unit as a target is obtained, and thereafter, the cutting unit is positioned The workpiece is cut and processed at the height corrected according to the correction value.

Therefore, the height of the cutting unit can be appropriately adjusted without the setting unit detecting the height of the outer peripheral tip of the cutting blade every time the cutting blade is worn. That is, when adjusting the height of the dicing blade, the relative movement distance of the dicing blade does not need to be as large as before, so the height of the dicing blade can be appropriately adjusted without greatly reducing the throughput.

Embodiments of one aspect of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of a workpiece 11 and the like to be cut using the workpiece processing method of the present embodiment. As shown in FIG. 1 , the workpiece 11 is, for example, a disk-shaped wafer formed using a semiconductor material such as silicon (Si).

The front surface 11 a side of the workpiece 11 is divided into a plurality of small areas by a plurality of crossing planned processing lines (cutting lines) 13 , and components 15 such as IC (Integrated Circuit) are formed in each small area. On the back side 11b side of the workpiece 11, the first surface 21a side of the dicing adhesive film 21 having a diameter larger than the workpiece 11 is pasted.

In addition, the outer peripheral portion of the dicing adhesive film 21 on the first surface 21a side is stuck to the ring frame 23 having a substantially circular opening 23a. That is, on the back side 11b side of the workpiece 11, a cutting adhesive film 21 attached to the opening 23a of the annular frame 23 is pasted, and the workpiece 11 is supported by the frame 23 through the cutting adhesive film 21.

Furthermore, in this embodiment, although a disk-shaped wafer formed of a semiconductor material such as silicon is used as the workpiece 11 , the material, shape, structure, size, etc. of the workpiece 11 are not limited. For example, a substrate or the like formed of other materials such as semiconductors, ceramics, resins, and metals may be used as the workpiece 11 . Likewise, there are no limitations on the kind, number, shape, structure, size, arrangement, etc. of the elements 15 . The element 15 may not be formed on the workpiece 11 .

Moreover, in this embodiment, although the example of sticking the dicing adhesive film 21 on the back side 11b side of the workpiece 11 and cutting the workpiece 11 from the front side 11a side is described, the dicing adhesive film 21 may also be attached to the workpiece. 11 on the front 11a side. In this case, the workpiece 11 is cut from the rear surface 11b side.

In the workpiece processing method according to the present embodiment, first, preparations for cutting and processing the above-mentioned workpiece 11 with a cutting device are performed. FIG. 2 is a perspective view showing a configuration example of a cutting device 2 used in the workpiece processing method according to the present embodiment. In addition, in FIG. 2, some structural elements are shown by a functional block. As shown in FIG. 2 , the cutting device 2 includes a base 4 that supports each component.

An opening 4a is formed at a front corner of the base 4, and a cassette lifter 6 that is raised and lowered by a lifting mechanism (not shown) is provided in the opening 4a. A cassette 8 is placed on the upper surface of the cassette lifter 6, and the cassette 8 is used to accommodate the workpiece 11 in a state supported by the frame 23 through the cutting adhesive film 21. Furthermore, in FIG. 2 , only the outline of the cassette 8 is shown for convenience of description.

A long opening 4 b is formed in the X-axis direction (front-rear direction, machining feed direction) in the side surface direction of the cassette lifter 6 . A ball screw type X-axis moving mechanism (machining feed mechanism) 10 and a bellows-shaped cover 12 covering the upper part of the X-axis moving mechanism 10 are arranged in the opening 4 b. The X-axis moving mechanism 10 includes an X-axis moving table (not shown), and moves the X-axis moving table in the X-axis direction. Furthermore, the upper part of the X-axis moving table is covered by the table cover 10a.

A chuck table (holding table) 14 for holding the workpiece 11 through the dicing film 21 is disposed on the X-axis moving table, and the chuck table 14 is exposed from the table cover 10a. The chuck table 14 is connected to a rotational drive source (not shown) such as a motor, and rotates around a rotational axis substantially parallel to the Z-axis direction (vertical direction). In addition, the chuck table 14 is moved in the X-axis direction together with the X-axis moving table by the above-mentioned X-axis moving mechanism 10 (processing feed).

A part of the upper surface of the chuck table 14 is a holding surface 14 a for holding the workpiece 11 . The holding surface 14a is formed substantially parallel to the X-axis direction and the Y-axis direction (left-right direction, index feed direction), and passes through the suction passage 14b formed inside the chuck table 14 (see FIG. 4(A)), etc. Instead, it is connected by a source of attraction (not shown). In addition, four clamps 16 are provided around the chuck table 14, and the clamps 16 are used to fix the ring frame 23 supporting the workpiece 11 from four directions.

A transfer unit (not shown) for transferring the workpiece 11 (frame 23 ) to the chuck table 14 and the like is arranged above the opening 4 b. The workpiece 11 conveyed by the conveying unit is placed on the holding surface 14 a of the chuck table 14 , for example, with the front surface 11 a side exposed upward. That is, in this embodiment, the dicing adhesive film 21 adhered to the back surface 11 b side of the workpiece 11 contacts the holding surface 14 a of the chuck table 14 .

A cantilever beam-shaped support structure 20 is disposed in the lateral direction of the opening 4 b, and the support structure 20 is used to support the cutting unit 18 for cutting the workpiece 11 . A cutting unit moving mechanism (an index feed mechanism, a cutting feed mechanism) 22 for moving the cutting unit 18 in the Y-axis direction and the Z-axis direction is provided on the front upper portion of the support structure 20 .

The cutting unit moving mechanism 22 includes a pair of Y-axis guide rails 24 arranged on the front surface of the support structure 20 and substantially parallel to the Y-axis direction. A slidable Y-axis moving plate 26 is installed on the Y-axis guide rail 24 , and the Y-axis moving plate 26 constitutes the cutting unit moving mechanism 22 .

A nut portion (not shown) is provided on the back side (rear side) of the Y-axis moving plate 26 , and the Y-axis ball screw 28 substantially parallel to the Y-axis guide rail 24 is screwed into the nut portion. A Y-axis pulse motor (not shown) is connected to one end of the Y-axis ball screw 28 . When the Y-axis ball screw 28 is rotated by the Y-axis pulse motor, the Y-axis moving plate 26 moves in the Y-axis direction along the Y-axis guide rail 24 .

A pair of Z-axis guide rails 30 substantially parallel to the Z-axis direction is provided on the surface (front surface) of the Y-axis moving plate 26 . A slidable Z-axis moving plate 32 is installed on the Z-axis guide rail 30 .

A nut portion (not shown) is provided on the back side (rear side) of the Z-axis moving plate 32 , and the Z-axis ball screw 34 parallel to the Z-axis guide rail 30 is screwed into the nut portion. A Z-axis pulse motor 36 is connected to one end of the Z-axis ball screw 34 . When the Z-axis ball screw 34 is rotated by the Z-axis pulse motor 36 , the Z-axis moving plate 32 moves in the Z-axis direction along the Z-axis guide rail 30 .

A cylindrical spindle housing 38 constituting the cutting unit 18 is fixed to a lower portion of the Z-axis moving plate 32 . Inside the spindle housing 38 , a spindle 40 (see FIG. 3 ) is housed as a rotation shaft. One end of the spindle 40 is exposed from one end of the spindle housing 38 , and a cutting blade 42 for cutting the workpiece 11 is attached to one end of the spindle 40 . A rotational drive source (not shown) such as a motor is connected to the other end side of the main shaft 40 .

At a position adjacent to the cutting unit 18 , a camera (photographing unit) 44 for photographing the workpiece 11 and the like held on the chuck table 14 is provided. When the cutting unit moving mechanism 22 moves the Y-axis moving plate 26 in the Y-axis direction, the cutting unit 18 and the camera 44 move in the Y-axis direction (index feed). Also, when the Z-axis moving plate 32 is moved in the Z-axis direction by the cutting unit moving mechanism 22 , the cutting unit 18 and the camera 44 move in the Z-axis direction (cutting feed).

Above the opening 4b and below the position of the cutting unit 18, a blade position detection unit (setting unit) 46 is disposed, which is used to detect the edge of the cutting blade 42 (the front end of the outer periphery). The position (height) along the Z axis. Moreover, the opening 4c is formed in the position on the opposite side with respect to the opening 4b and the opening 4a. A cleaning unit 48 for cleaning the cut workpiece 11 and the like is arranged in the opening 4c.

The control unit (setting unit) 50 is connected with various constituent elements such as the X-axis moving mechanism 10 , the cutting unit 18 , the cutting unit moving mechanism 22 , the camera 44 , and the blade position detecting unit 46 . The control unit 50 controls each component of the cutting device 2 in accordance with, for example, processing conditions of the workpiece 11 and the like.

FIG. 3 is an enlarged perspective view of the cutting unit 18 and the blade position detection unit 46 . In addition, some components of the cutting unit 18 are omitted in FIG. 3 . As shown in FIG. 3 , the blade position detection unit 46 includes a detector 54 located below the cutting unit 18 . The detector 54 includes, for example, a substantially rectangular parallelepiped support portion 54 a and a detection portion 54 b provided above the rear end side (either side in the X-axis direction) of the support portion 54 a.

The upper end portion of the detection portion 54b is formed with a notched blade intrusion portion 54c formed in such a manner that the cutting blade 42 can intrude. The blade intrusion portion 54c has a pair of inner surfaces facing each other in the Y-axis direction, and a light emitting unit 56 and a light receiving unit 58 constituting an optical sensor are disposed on the pair of inner surfaces, respectively. That is, the light-emitting part 56 and the light-receiving part 58 face across the blade intrusion part 54c.

Two air supply nozzles 60 are provided on the upper surface of the support portion 54a located on the front side (the other side in the X-axis direction) of the detection portion 54b. The air supply nozzles 60 are used to supply air to the light emitting portion 56 and the light receiving portion 58. . In addition, two liquid supply nozzles 62 are provided in front of the air supply nozzle 60 , and the two liquid supply nozzles 62 are used to supply liquid such as water to the light emitting unit 56 and the light receiving unit 58 . For example, after cleaning the light emitting unit 56 and the light receiving unit 58 with the liquid supplied from the liquid supply nozzle 62 , the light emitting unit 56 and the light receiving unit 58 are dried with the air supplied from the air supply nozzle 60 .

A rectangular parallelepiped cover 66 is attached to the rear end surface of the detector 54 via a connector 64 formed of a hinge or the like. The inside of this cover 66 is hollow. Therefore, for example, by rotating the cover 66 around the coupler 64 , the detection unit 54 b , the air supply nozzle 60 , the liquid supply nozzle 62 , and the like can be accommodated inside the cover 66 .

On the other hand, when the position of the outer peripheral front end of the cutting blade 42 is to be detected by the blade position detection unit 46, the cover 66 is rotated to the position shown in FIG. Wait for it to show up. Thereby, it becomes possible to detect the position of the outer periphery front-end|tip so that the cutting blade 42 may intrude into the blade intrusion part 54c.

In the workpiece processing method of this embodiment, first, a reference height (reference height H ₀ ) of the cutting unit 18 is set in the cutting device 2 based on the height of the outer peripheral tip of the cutting blade 42 (reference setting step). Specifically, first, the cutting blade 42 that has been rotated is positioned above the detector 54 of the blade position detection unit 46 . Then, as shown in FIG. 3 , in the state where the light is emitted from the light emitting portion 56, the cutting unit 18 is lowered, and the rotating cutting blade 42 is inserted into the blade intrusion portion 54c (between the light emitting portion 56 and the light receiving portion 58). ).

Thereby, the light radiated from the light emitting part 56 to the light receiving part 58 is partially blocked by the dicing blade 42, and the amount of light received by the light receiving part 58 gradually decreases. The control unit 50 monitors the amount of light received by the light receiving portion 58 (voltage value corresponding to the amount of light received, etc.), and the height of the cutting unit 18, for example, the height of the cutting unit 18 when the amount of light received by the light receiving portion 58 is reduced to a predetermined threshold is used as a reference. The height H ₀ is stored in the memory part of the control unit 50 .

In this embodiment, the height of the cutting unit 18 when the tip of the outer periphery of the cutting blade 42 comes into contact with the holding surface 14a of the chuck table 14 is set as the reference height H ₀ . That is, the threshold value of the amount of light received by the light receiving unit 58 and the like are adjusted so that this reference height H0 is _set . However, the reference height H ₀ may not necessarily be set so that the outer peripheral tip of the cutting blade 42 contacts the holding surface 14 a of the chuck table 14 .

In this embodiment, an example in which the reference height H0 is _set in a non-contact manner using the blade position detection means 46 has been described, but the method of setting the reference height H0 is _not limited. For example, the reference height H ₀ may be set by creating a potential difference between the chuck table 14 and the cutting blade 42 , bringing these members into contact and confirming conduction.

After the reference height H0 is set, the target height (target height H1) of the cutting unit ₁₈ is set in the cutting device ₂ so that the workpiece 11 held by the chuck table 14 can be appropriately cut (target setting step ). More specifically, the target height H ₁ is set so that the cutting blade 42 can cut into the cutting adhesive film 21 held on the chuck table 14 together with the workpiece 11 to a predetermined depth.

For example, the thickness of the cutting adhesive film 21 is T ₀ , and it is desired that the cutting blade 42 cut into the position where the depth from the first surface 21a of the cutting adhesive film 21 is D ₀ (that is, the distance between the first surface 21a and the cutting blade 42 When the distance of the lowest point is D ₀ ), the target height H ₁ is H ₀ +T ₀ -D ₀ .

The control unit 50 memorizes the obtained target height H1 in _a storage unit in the control unit 50 . Furthermore, the depth D ₀ used to calculate the target height H ₁ is preferably 5 μm to 35 μm, typically about 10 μm. However, the value of the depth D ₀ can be adjusted arbitrarily within a range in which the workpiece 11 can be properly cut.

After setting the reference height _H0 and the target height H1, the workpiece 11 is cut (the _first cutting step). 4(A) and 4(B) are partial cross-sectional side views showing the state of cutting the workpiece 11 . Specifically, first, the dicing adhesive film 21 attached to the back surface 11b side of the workpiece 11 is brought into contact with the holding surface 14a of the chuck table 14, and the negative pressure of the suction source is applied. At the same time, the frame 23 is fixed with the clamp 16 . Thereby, the workpiece|work 11 is hold|maintained in the state which exposed the front surface 11a side upward.

Next, for example, the chuck table 14 is rotated so that the target processing line 13 is aligned with the X-axis direction of the cutting device 2 . In addition, the chuck table 14 and the cutting unit 18 are relatively moved so that the position of the cutting blade 42 is aligned above the extension line of the target processing line 13 .

Then, as shown in FIG. 4(A) , the cutting unit 18 is lowered to the target height H ₁ while the cutting blade 42 is rotated. As a result, the dicing blade 42 cuts into the dicing adhesive film 21 in the first region where the dicing adhesive film 21 is exposed between the workpiece 11 and the frame 23 .

Thereafter, the chuck table 14 is moved in the X-axis direction. Specifically, as shown in FIG. 4(A) and FIG. 4(B), the cutting blade 42 is relatively moved to the second area on the opposite side to the workpiece 11 and the first area, so that the chuck table 14 is at X move in the axis direction.

Thereby, the workpiece 11 to be processed is cut along the planned processing line 13 of the object. Furthermore, the second area is also the same as the first area, exposing the cutting adhesive film 21 . In the present embodiment, the distance by which the chuck table 14 moves in the X-axis direction (the distance by which the cutting blade 42 is relatively moved) is x ₀ .

FIG. 5(A) is a plan view showing the cut workpiece 11 and the like. As a result of the above-mentioned cutting process, a cut (kerf) 11c that cuts the workpiece 11 along the target processing line 13 will be formed on the workpiece 11. In this embodiment, the cutting blade 42 is pressed against the cutting film 21. Cutting in, one side makes it move relatively from the first area to the second area.Therefore, as shown in Figure 5 (A), on the cutting adhesive film 21 also will form the contact trace caused by the contact with the cutting blade 42 21b.

For example, after cutting the workpiece 11 along the target processing line 13 and forming the contact mark 21 b on the dicing film 21 , _a correction value for correcting the above-mentioned target height H1 is acquired (correction value acquisition step). In the present embodiment, the correction value is obtained based on the depth of the contact mark 21 b calculated from the length of the contact mark 21 b and the outer diameter (diameter) of the cutting blade 42 .

Furthermore, for the sake of convenience of description, although the example of obtaining the correction value after cutting the workpiece 11 along one planned processing line 13 will be described, it is also possible to cut the workpiece 11 along a plurality of planned processing lines 13. After that, the corrected value is obtained. Before obtaining the correction value, the number of planned processing lines 13 to be cut (that is, the number of planned processing lines to be cut in the first cutting step) can be adjusted according to the wear condition of the cutting blade 42 and the like.

FIG. 5(B) is a conceptual diagram showing the depth D of the contact mark formed when the cutting blade 42 is cut in place (that is, when the cutting blade 42 is not relatively moved in the X-axis direction). From the geometric relationship shown in Figure 5 (B), when the cutting blade 42 cuts in on the spot, the depth D of the formed contact trace can be used as the diameter d of the cutting blade 42, and the length of the contact trace (X-axis direction The length of ) is taken as L ₀ and expressed by formula (1).

【Mathematical formula 1】

As described above, in the present embodiment, in order to form the contact marks 21b, the relative movement distance of the dicing blade 42 is set to x ₀ . Therefore, assuming that the length of the contact mark 21b (the length in the X-axis direction) is L ₁ , L ₀ becomes L ₁ −x ₀ . That is, the depth D ₁ (≒D) of the contact mark 21b can be expressed by the length L ₁ of the contact mark 21b by the formula (2).

【Mathematical formula 2】

Therefore, to acquire the correction value, first, the length L ₁ of the contact mark 21b is acquired. In this embodiment, the camera 44 photographs the contact trace 21b to form an image, and the control unit 50 calculates the length L ₁ based on the contact trace 21b reflected on the image. Furthermore, the image of the contact mark 21b and the acquisition _of the length L1 can also be performed simultaneously with the above-mentioned cutting process of the workpiece 11 . In this case, a part of the correction value acquisition step is performed simultaneously with the first cutting step.

The diameter d of the cutting blade 42 and the distance x ₀ of the relative movement of the cutting blade 42 are known. Therefore, by calculating the length L ₁ of the contact mark 21b, the depth D ₁ of the contact mark 21b can be calculated from the above formula (2). The decrease in the diameter d of the cutting blade 42 due to wear or the like has little influence on the depth D1 _of the contact trace 21b, and thus can be ignored.

The control unit 50 calculates the depth D1 _of the contact mark 21b, and obtains _a correction value based on the depth D1. In this embodiment, when calculating the target height H1, the difference _{D0 -} D1 between the depth _D0 used and the depth D1 _of the contact mark 21b is used as _a correction value. After the control unit 50 acquires the correction value, it is stored in the memory unit in the control unit 50 .

After obtaining the correction value, the cutting unit ₁₈ is positioned at the height obtained by correcting the target height H1 according to the correction value, and the workpiece 11 is cut (the second cutting step). FIG. 6(A) is a partial cross-sectional side view showing the state of cutting the workpiece 11, and FIG. 6(B) is a plan view showing the cut workpiece 11 and the like.

The specific cutting procedure is the same as the above-mentioned first cutting step. Specifically, first, the chuck table 14 and the cutting unit 18 are relatively moved so that the position of the cutting blade 42 is aligned above the extension line of the target line 13 to be processed. Furthermore, when the direction of the planned processing line 13 that has just been cut and processed is different from the direction of the planned processing line 13 of the object, the chuck table 14 must be rotated so that the planned processing line 13 of the object is consistent with the X-axis direction of the cutting device 2 .

Next, as shown in FIG. 6(A), the cutting unit 18 is lowered to a predetermined height H ₂ while rotating the cutting blade 42 . In this embodiment, for example, a difference H ₁ -(D ₀ -D ₁ ) between the target height H ₁ and the correction value D ₀ -D ₁ is used as the predetermined height H ₂ . This is only the part where the cutting becomes shallow due to the wear of the cutting blade 42, which means that the cutting unit 18 is positioned at a lower position.

Then, the chuck table 14 is moved in the X-axis direction. Thereby, the workpiece 11 is cut and processed along the planned processing line 13 of the object. FIG. 6(B) is a plan view showing the cut workpiece 11 and the like. As a result of the cutting process described above, a cut (kerf) 11 d in which the workpiece 11 is cut along the target line 13 to be processed is formed on the workpiece 11 .

Here, since the target height H ₁ is corrected according to the correction value obtained by the above procedure, even when the cutting blade 42 is worn, the cutting blade 42 can be cut to an appropriate height to cut the workpiece 11 . In addition, when the cutting blade 42 wears etc. later, after performing a correction value acquisition process again and acquiring a correction value, what is necessary is just to perform a further cutting process.

As above, in the workpiece processing method related to the present embodiment, based on the length of the contact mark 21b formed on the dicing adhesive film 21 by the dicing blade 42, a correction value for correcting the target height of the dicing unit 18 is obtained, Afterwards, the cutting unit 18 is positioned at the height corrected according to the correction value to cut the workpiece 11 .

Therefore, the height of the cutting unit 18 can be appropriately adjusted without detecting the height of the outer peripheral tip of the cutting blade 42 by the blade position detection unit (setting unit) 46 or the like every time the cutting blade 42 is worn. That is, when adjusting the height of the cutting blade 42, the distance of the relative movement of the cutting blade 42 does not need to be as large as before, so the height of the cutting blade 42 can be adjusted appropriately without significantly reducing the throughput.

In addition, this invention is not limited to description of said embodiment, It can change variously and can implement. For example, in the above-mentioned embodiment, although in the first cutting step of cutting the workpiece 11, the kerf 11c is formed on the workpiece 11, and the contact marks 21b are formed on the dicing adhesive film 21, but it is also possible to After a cutting step, contact marks are formed in a different step (contact mark forming step).

FIG. 7 is a plan view showing the dicing adhesive film 21 and the like in which the contact marks 21c are formed in a different procedure from the above-described embodiment. To form such a contact trace 21c, for example, in the first cutting step, after cutting the workpiece 11 along the intended processing line 13 of the object, the cutting blade 42 is cut outside the second area (that is, on the side of the frame 23 ). the third area.

That is, in the first cutting step, after the workpiece 11 is cut, the cutting unit 18 is raised, and the chuck table 14 is moved in the X-axis direction. Specifically, the chuck table 14 is moved in the X-axis direction so that the cutting blade 42 moves relatively to the upper side of the third region.

Then, for example, the cutting unit 18 is lowered to the target height H ₁ in a state where the chuck table 14 is not moved. As a result, the dicing blade 42 cuts into the dicing adhesive film 21 in the third region where the dicing adhesive film 21 is exposed between the workpiece 11 and the frame 23 .

Thereby, contact marks 21 c are formed on the dicing adhesive film 21 . In this way, the length L ₂ of the formed cutting mark 21 c (the length in the X-axis direction) is equal to the length L ₀ of the contact mark in the above formula (1) through the procedure of cutting the cutting blade 42 on the spot. Therefore, the control unit 50 can calculate the depth D ₂ (=D)) of the contact mark 21c from the formula (1).

In addition, as long as the structure, method, etc. of the above-mentioned embodiment do not deviate from the scope of the object of the present invention, they can be appropriately changed and implemented.

11‧‧‧Workpiece 11a‧‧‧Front 11b‧‧‧back side 11c, 11d‧‧‧incision (kerf) 13‧‧‧Processing scheduled line (cutting lane) 15‧‧‧Components 21‧‧‧Cutting film 21a‧‧‧first side 21b, 21c contact marks 23‧‧‧Framework 23a‧‧‧opening 2‧‧‧Cutting device 4‧‧‧Abutment 4a, 4b, 4c‧‧‧opening 6‧‧‧cassette elevator

8: Cassette

10: X-axis moving mechanism (processing feed mechanism)

10a: Workbench cover

12: Bellows cover

14: Chuck table (holding table)

14a: Keeping surface

14b: Attraction pathway

16: Fixture

18: Cutting unit

20: Support structure

22: Cutting unit moving mechanism (index feed mechanism, cut-in feed mechanism)

24: Y-axis guide rail

26: Y-axis moving plate

28: Y-axis ball screw

30: Z-axis guide rail

32: Z-axis moving board

34: Z-axis ball screw

36: Z axis pulse motor

38: Spindle housing

40:Spindle

42: Cutting blade

44: Camera (camera unit)

46: Blade position detection unit (setting unit)

48: cleaning unit

50: Control unit (setting unit)

54: detector

54a: support part

54b: Detection Department

54c: blade penetration part

56: Luminous department

58‧‧‧light receiving part 60‧‧‧Air supply nozzle 62‧‧‧Liquid supply nozzle 64‧‧‧connector 66‧‧‧Cover

FIG. 1 shows a perspective view of a configuration example of a workpiece or the like. Fig. 2 is a perspective view showing a configuration example of a cutting device. 3 is an enlarged perspective view of a cutting unit and a blade position detection unit. 4(A) and 4(B) of FIG. 4 are partial cross-sectional side views showing a state of cutting a workpiece. 5(A) of FIG. 5 shows a plan view of a cut workpiece, etc., and FIG. 5(B) shows a conceptual diagram of the depth of contact marks. 6(A) of FIG. 6 shows a partial cross-sectional side view in the case of cutting a workpiece, and FIG. 6(B) shows a plan view of the cut workpiece and the like. Fig. 7 shows a top view of a dicing adhesive film etc. in which contact marks are formed in different steps.

11‧‧‧Workpiece

11a‧‧‧Front

11c‧‧‧Incision

13‧‧‧Processing scheduled line

15‧‧‧Components

21‧‧‧Cutting film

21a‧‧‧first side

21b‧‧‧Traces of contact

23‧‧‧Framework

23a‧‧‧opening

42‧‧‧Cutting blade

L ₁ ‧‧‧Length

Claims (2)

A workpiece processing method, which is to use a cutting device to cut and process a workpiece pasted with a cutting adhesive film. The cutting adhesive film is attached to the opening of a ring frame. The cutting device includes: a chuck table for holding the workpiece; a cutting unit equipped with a cutting A blade, the cutting blade cuts the workpiece held on the chuck table; and a setting unit, based on the height of the outer peripheral front end of the cutting blade, sets the height of the cutting unit as a reference; it is characterized by comprising the following steps: The benchmark setting step is to set the height of the cutting unit as the benchmark based on the height of the front end of the cutting blade periphery; the target setting step is to set the cutting unit so that the cutting blade cuts into the predetermined depth of the cutting adhesive film The height as the target; the first cutting step, in the state of positioning the cutting unit at the height as the target, cutting and processing the workpiece by making the cutting unit and the chuck table move relatively; the correction value is obtained step, simultaneously with the first cutting step, or after the first cutting step, based on the length of the contact trace formed by the cutting blade on the cutting adhesive film, obtaining the height of the cutting unit as the target for correcting correction value; and, the second cutting step, in the state where the cutting unit is positioned at the height obtained by correcting the height of the target according to the correction value, by making the cutting unit and the chuck table relatively move To cut and process the workpiece, in the first cutting step, the cutting unit is lowered in the first region exposed by the cutting adhesive film between the workpiece and the frame, and after falling to the target height, the The cutting blade moves relative to the workpiece until it reaches the second area where the cutting adhesive film on the opposite side of the first area is exposed. By making the cutting unit and the chuck table move relatively, the The contact mark is formed on the dicing adhesive film while the workpiece is being processed. In the correction value obtaining step, the correction value is obtained based on the depth of the contact mark calculated from the length of the contact mark and the outer diameter of the cutting blade. A workpiece processing method, which is to use a cutting device to cut and process a workpiece pasted with a cutting adhesive film. The cutting adhesive film is attached to the opening of a ring frame. The cutting device includes: a chuck table for holding the workpiece; a cutting unit equipped with a cutting blade, the cutting blade is held on the workpiece on the chuck table performing cutting processing; and a setting unit, based on the height of the cutting blade peripheral front end, setting the height of the cutting unit as a reference; it is characterized in that it includes the following steps: a reference setting step, based on the height of the cutting blade peripheral front end, setting the cutting The height of the unit as the reference; the target setting step is to set the height of the cutting unit as the target in such a way that the cutting blade cuts into the predetermined depth of the cutting film; In the state of being positioned as the height of the target, the workpiece is cut and processed by making the cutting unit and the chuck table move relatively; the contact mark forming step is performed after the first cutting step by making the cutting When the unit is raised, the cutting unit and the chuck table are relatively moved, and the cutting unit is positioned above the exposed area of the cutting adhesive film between the workpiece and the frame. Secondly, by making the cutting The unit descends to the height as the target to form the contact trace on the dicing adhesive film; the correction value obtaining step, after the contact trace forming step, based on the length of the contact trace formed by the cutting blade on the dicing adhesive film, obtaining a correction value for correcting the height of the target of the cutting unit; and a second cutting step of positioning the cutting unit at a height obtained by correcting the height of the target according to the correction value, by The workpiece is cut and processed by relatively moving the cutting unit and the chuck table. In the correction value obtaining step, the correction value is obtained based on the depth of the contact mark calculated from the length of the contact mark and the outer diameter of the cutting blade. value.

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