TWI787749B - Heat dissipation structure, manufacturing method of the heat dissipation structure, and device - Google Patents
Heat dissipation structure, manufacturing method of the heat dissipation structure, and device Download PDFInfo
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- TWI787749B TWI787749B TW110107616A TW110107616A TWI787749B TW I787749 B TWI787749 B TW I787749B TW 110107616 A TW110107616 A TW 110107616A TW 110107616 A TW110107616 A TW 110107616A TW I787749 B TWI787749 B TW I787749B
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000007788 liquid Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 11
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- 239000012530 fluid Substances 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 238000005245 sintering Methods 0.000 description 5
- 230000004308 accommodation Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000009489 vacuum treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本申請涉及散熱領域,尤其涉及一種散熱結構、散熱結構的製作方法以及裝置。 The present application relates to the field of heat dissipation, and in particular to a heat dissipation structure, a manufacturing method and a device for the heat dissipation structure.
對於具有發熱件的裝置(例如機械設備、電子產品等),隨著裝置的運行,發熱件產生的熱量也越來越多。通常在發熱件表面設置具有散熱功能的散熱結構對熱量進行散熱。 For devices with heat generating parts (such as mechanical equipment, electronic products, etc.), with the operation of the device, the heat generated by the heat generating parts is also increasing. Usually, a heat dissipation structure with a heat dissipation function is arranged on the surface of the heating element to dissipate the heat.
目前的散熱結構中,熱管中的毛細結構沿熱管延伸方向連接至均溫板底部的毛細結構,會使蒸汽通道處毛細結構阻擋,蒸氣流入熱管端的流動阻力較大,需要較高的蒸汽壓力才能使蒸汽通過,蒸汽壓力高意味著溫度變高也會導致熱阻增加;且上述的毛細結構在形成過程中需兩次填粉,在連接處會出現斷層的情況,影響毛細回流,導致熱阻增加。 In the current heat dissipation structure, the capillary structure in the heat pipe is connected to the capillary structure at the bottom of the vapor chamber along the extension direction of the heat pipe, which will block the capillary structure at the steam channel, and the flow resistance of steam flowing into the end of the heat pipe is relatively high, which requires high steam pressure. Let the steam pass through, and the high steam pressure means that the temperature will increase and the thermal resistance will increase; and the above-mentioned capillary structure needs to be filled twice during the formation process, and there will be faults at the connection, which will affect the capillary return and cause thermal resistance. Increase.
因此,有必要提供一種熱阻小的散熱結構。 Therefore, it is necessary to provide a heat dissipation structure with small thermal resistance.
另,還有必要提供一種散熱結構的製作方法以及包括所述散熱結構的裝置。 In addition, it is also necessary to provide a method for manufacturing a heat dissipation structure and a device including the heat dissipation structure.
一種散熱結構,包括第一殼體、管體、第二殼體、第一毛細結構以及工作液體;第一殼體包括主體部與連接部,所述連接部在所述主體部的一側並彎折圍設成通孔;管體包括第一端以及第二端,所述第一端開口,所述第二端封口,所述第一端與所述第二端連通形成一腔體,所述第一端與所述連接部連接,所述腔體與所述通孔連通;第二殼體與所述第一殼體以及所述管體連接形成一密封的容納腔;第一毛細結構位於所述管體的內壁以及所述第一殼體與所述管體連接的同一表面;以及工作液體容置於所述容納腔中。 A heat dissipation structure, comprising a first shell, a pipe body, a second shell, a first capillary structure, and a working liquid; the first shell includes a main body and a connecting portion, the connecting portion is on one side of the main body and Bend to form a through hole; the tube body includes a first end and a second end, the first end is open, the second end is sealed, the first end communicates with the second end to form a cavity, The first end is connected to the connection part, and the cavity communicates with the through hole; the second shell is connected with the first shell and the tube body to form a sealed cavity; the first capillary The structure is located on the inner wall of the pipe body and the same surface where the first shell is connected to the pipe body; and the working liquid is accommodated in the accommodating chamber.
在一些實施方式中,所述第一端位於所述連接部的內部並與所述連接部連接。 In some embodiments, the first end is located inside the connecting portion and connected to the connecting portion.
在一些實施方式中,所述第一端位於所述與所述連接部的端部連接,所述第一毛細結構還覆蓋所述連接部。 In some embodiments, the first end is located at the end connected to the connection part, and the first capillary structure also covers the connection part.
在一些實施方式中,所述第二殼體具有一凹槽,所述凹槽與所述腔體連通形成所述容納腔。 In some embodiments, the second housing has a groove, and the groove communicates with the cavity to form the accommodation cavity.
在一些實施方式中,所述第二殼體朝向所述第一殼體的表面還設置有第二毛細結構,所述第二毛細結構與所述第一毛細結構連接。 In some embodiments, the surface of the second housing facing the first housing is further provided with a second capillary structure, and the second capillary structure is connected to the first capillary structure.
一種散熱結構的製作方法,包括以下步驟:提供一第一殼體,包括主體部與連接部,所述連接部在所述主體部的一側並彎折圍設成通孔;提供管體,所述管體包括第一端以及第二端,所述第一端開口,所述第二端封口,所述第一端與所述第二端連通形成一腔體,將所述第一端與所述連接部連接,所述腔體與所述通孔連通;在所述管體中插入芯棒,所述芯棒與所述管體之間預留縫隙;在所述縫隙中以及所述第一殼體與所述管體連接的同一表面填充金屬粉末後燒結,以使所述金屬粉末形成第一毛細結構; 取出所述芯棒;提供第二殼體,連接所述第二殼體與所述第一殼體,所述第二殼體與所述第一殼體以及所述管體形成一具有注液口的容納腔;以及向所述容納腔中注入工作液體後密封所述注液口,得到所述散熱結構。 A method for manufacturing a heat dissipation structure, comprising the following steps: providing a first shell, including a main body and a connecting portion, the connecting portion is bent to form a through hole on one side of the main body; providing a pipe body, The tube body includes a first end and a second end, the first end is open, the second end is sealed, the first end communicates with the second end to form a cavity, and the first end Connected with the connection part, the cavity communicates with the through hole; insert a core rod into the tube body, and reserve a gap between the core rod and the tube body; in the gap and the The same surface where the first shell is connected to the pipe body is filled with metal powder and then sintered, so that the metal powder forms a first capillary structure; Take out the mandrel; provide a second shell, connect the second shell and the first shell, the second shell and the first shell and the tube form a liquid injection and sealing the liquid injection port after injecting working liquid into the accommodation cavity, so as to obtain the heat dissipation structure.
在一些實施方式中,所述連接部的數量為複數個,每一所述連接部連接一所述管體。 In some embodiments, the number of the connecting parts is plural, and each of the connecting parts is connected to one of the tube bodies.
在一些實施方式中,所述管體穿設於所述通孔並與所述連接部相互重合連接。 In some embodiments, the pipe body is passed through the through hole and overlapped with the connecting portion to connect with each other.
在一些實施方式中,所述第二殼體朝向所述第一殼體的表面設置有第二毛細結構,所述第二毛細結構與所述第一毛細結構連接。 In some embodiments, a surface of the second housing facing the first housing is provided with a second capillary structure, and the second capillary structure is connected to the first capillary structure.
一種裝置,所述裝置包括所述散熱結構。 A device includes the heat dissipation structure.
本申請提供的散熱結構,在所述第一殼體與所述管體的表面設置一體結構的第一毛細結構,在所述工作液體受熱流動的過程中,流動阻力小,散熱快。 In the heat dissipation structure provided by the present application, a first capillary structure with an integrated structure is provided on the surface of the first shell and the tube body, and the flow resistance is small and the heat dissipation is fast when the working fluid is heated and flows.
200:裝置 200: device
210:發熱件 210: heating element
100:散熱結構 100: heat dissipation structure
10:第一殼體 10: The first shell
12:主體部 12: Main body
14:連接部 14: Connecting part
16:通孔 16: Through hole
20:管體 20: tube body
22:第一端 22: first end
24:第二端 24: second end
26:腔體 26: Cavity
30:芯棒 30: mandrel
35:第一毛細結構 35: The first capillary structure
50:第二殼體 50: second shell
52:凹槽 52: Groove
53:密封塞 53: sealing plug
54:第二毛細結構 54:Second capillary structure
60:容納腔 60:Accommodating cavity
圖1為本申請實施例提供的裝置的結構示意圖。 FIG. 1 is a schematic structural diagram of a device provided by an embodiment of the present application.
圖2為圖1所示的散熱結構的結構示意圖。 FIG. 2 is a structural schematic diagram of the heat dissipation structure shown in FIG. 1 .
圖3為本申請一實施方式中的散熱結構的截面示意圖。 FIG. 3 is a schematic cross-sectional view of a heat dissipation structure in an embodiment of the present application.
圖4為本申請一實施方式提供的第一殼體的截面示意圖。 Fig. 4 is a schematic cross-sectional view of a first casing provided by an embodiment of the present application.
圖5為在圖4所示的第一殼體上連接管體的截面示意圖。 Fig. 5 is a schematic cross-sectional view of connecting the pipe body on the first casing shown in Fig. 4 .
圖6為在圖5所示的管體中插入芯棒後的截面示意圖。 Fig. 6 is a schematic cross-sectional view after a mandrel is inserted into the tube body shown in Fig. 5 .
圖7為在圖6所示的管體與芯棒之間以及第一殼體的表面填充金屬粉末並燒結後形成第一毛細結構的截面示意圖。 Fig. 7 is a schematic cross-sectional view of the first capillary structure formed after the metal powder is filled and sintered between the tube body and the mandrel shown in Fig. 6 and the surface of the first shell.
圖8為去除圖7所示的芯棒後的截面示意圖。 Fig. 8 is a schematic cross-sectional view after removing the mandrel shown in Fig. 7 .
為了能夠更清楚地理解本申請的上述目的、特徵和優點,下面結合附圖和具體實施方式對本申請進行詳細描述。需要說明的是,在不衝突的情況下,本申請的實施方式及實施方式中的特徵可以相互組合。在下面的描述中闡述了很多具體細節以便於充分理解本申請,所描述的實施方式僅僅是本申請一部分實施方式,而不是全部的實施方式。 In order to more clearly understand the above objects, features and advantages of the present application, the present application will be described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. A lot of specific details are set forth in the following description to facilitate a full understanding of the application, and the described implementations are only a part of the implementations of the application, but not all of the implementations.
除非另有定義,本文所使用的所有的技術和科學術語與屬於本申請的技術領域的技術人員通常理解的含義相同。本文中在本申請的說明書中所使用的術語只是為了描述具體的實施方式的目的,不是旨在於限制本申請。本文所使用的術語“和/或”包括一個或複數個相關的所列項目的所有的和任意的組合。 Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is only for the purpose of describing specific embodiments, and is not intended to limit the application. As used herein, the term "and/or" includes all and any combination of one or a plurality of the associated listed items.
在本申請的各實施例中,為了便於描述而非限制本申請,本申請專利申請說明書以及申請專利範圍中使用的術語“連接”並非限定於物理的或者機械的連接,不管是直接的還是間接的。“上”、“下”、“上方”、“下方”、“左”、“右”等僅用於表示相對位置關係,當被描述物件的絕對位置改變後,則該相對位置關係也相應地改變。 In each embodiment of the present application, for the convenience of description and not to limit the present application, the term "connection" used in the description of the patent application and the patent scope of the present application is not limited to physical or mechanical connection, whether direct or indirect of. "Up", "Down", "Above", "Bottom", "Left", "Right" and so on are only used to indicate the relative positional relationship. When the absolute position of the described object changes, the relative positional relationship is also corresponding Change.
請參閱圖1,一種裝置200,包括發熱件210以及散熱結構100。所述散熱結構100連接所述發熱件210,所述發熱件210在運行過程中產生熱量,所述散熱結構100將熱量傳遞給所述散熱結構100,通過散熱結構100快速將熱量散
發出去,以維持所述發熱件210工作環境的穩定。其中,所述發熱件210可以是電池、CPU等。
Please refer to FIG. 1 , a
請參閱圖2以及圖3,所述散熱結構100包括第一殼體10、第二殼體50、管體20、第一毛細結構35以及工作液體(圖未示)。
Please refer to FIG. 2 and FIG. 3 , the
所述第一殼體10、所述管體20與所述第二殼體50形成一密閉的容納腔60,所述第一毛細結構35位於所述管體20的內壁以及所述第一殼體10的表面,所述工作液體容置於所述容納腔60中。
The
所述第一殼體10包括主體部12與連接部14,所述連接部14在所述主體部12的一側並延伸圍設形成通孔16,每一所述連接部14圍設形成一通孔16,複數個所述連接部14圍設形成複數個通孔16。
The
在一些實施方式中,所述管體20的數量為複數個,每一所述連接部14連接一所述管體20,複數個所述連接部14位於所述主體部12的同一側,複數個所述管體20位於所述主體部12的同一側。複數個所述管體20,有利於增加所述散熱結構100的散熱面積,從而提升所述散熱結構100的散熱效率。
In some embodiments, the number of the
所述管體20大致為管狀,所述管體20包括第一端22以及第二端24,所述第一端22與所述第二端24相互連接且連通形成一腔體26。所述第一端22開口,所述第二端24封口,所述第一端22與所述連接部14連接,所述腔體26與所述通孔16連通,所述第二端24與所述連接部14朝向同一方向延伸。
The
所述第一毛細結構35覆蓋所述管體20的內壁以及所述主體部12與所述管體20相連接的同一表面。
The
在一些實施方式中,所述管體20的第一端22位於所述連接部14的內部並與所述連接部14連接,即所述管體20與所述連接部14疊加重合,所述管體20的外壁與所述連接部14的內壁連接。
In some embodiments, the
在一些實施方式中,所述管體20位於所述連接部14背離所述主體部12的端部並與所述連接部14連接,則所述第一毛細結構35覆蓋所述管體20內壁與所述主體部12表面的同時還覆蓋所述連接部14的表面。
In some embodiments, the
所述第二殼體50具有一凹槽52,所述第二殼體50位於所述第一殼體10背離與所述管體20的一側,所述第二殼體50與所述第一殼體10最外緣的主體部12連接,所述凹槽52與複數個所述腔體26共同形成所述容納腔60。所述凹槽52的設置,可以增加所述容納腔60的體積,從而可以容納更多的工作液體,提升所述散熱結構100的散熱效率。
The
在一些實施方式中,所述第二殼體50朝向所述第一殼體10的表面還設置有第二毛細結構54,所述第二毛細結構54與所述第一毛細結構35連接。所述散熱結構100安裝與所述裝置200中時,所述第二殼體50背離所述第一殼體10的表面與所述發熱件210連接,所述發熱件210產生熱量時,所述第二殼體50的溫度高於所述第一殼體10以及所述管體20的溫度,位於所述第二毛細結構54中的工作流體吸收熱量,吸收熱量後的工作流體隨著所述第一毛細結構35將熱量傳遞至管體20中,從而快速將熱量散發出去。
In some embodiments, the surface of the
請參閱圖3至圖8,本申請實施例提供一種散熱結構100的製作方法,包括步驟S1-S7。
Please refer to FIG. 3 to FIG. 8 , the embodiment of the present application provides a manufacturing method of the
步驟S1:請參閱圖4,提供一第一殼體10,包括主體部12與連接部14,所述連接部14在所述主體部12的一側並彎折圍設成通孔16。
Step S1 : Referring to FIG. 4 , a
即所述第一殼體10未形成所述通孔16的區域為主體部12,所述連接部14與所述主體部12連接。
That is, the area of the
所述通孔16的數量可以為一個或複數個。在本實施方式中,所述通孔16的數量為複數個,複數個所述通孔16的位置可以根據需要進行設置,例如按照一定的陣列排列。
The number of said through
可以理解地,每一所述通孔16的周緣具有一所述連接部14,複數個所述通孔16具有複數個所述連接部14。複數個所述連接部14均朝向同一方向彎折延伸,即複數個所述連接部14位於所述主體部12的同一側。
It can be understood that each through-
步驟S2:請參閱圖5,提供管體20,所述管體20包括第一端22以及第二端24,所述第一端22開口,所述第二端24封口,所述第一端22與所述第二端24連通形成一腔體26,將所述第一端22與所述連接部14連接,所述腔體26與所述通孔16連通。
Step S2: Please refer to FIG. 5, provide a
所述管體20的數量與連接部14的數量相同,每一所述連接部14連接一所述管體20,所述第二端24沿所述連接部14彎折方向延伸。
The number of the
在一些實施方式中,所述管體20的第一端22的外徑與所述通孔16的直徑相適配,所述管體20穿設於所述通孔16中。所述第一端22的外壁與所述連接部14內壁連接,可以通過鐳射焊、擴散焊等方式連接成一體。
In some embodiments, the outer diameter of the
在另一些實施方式中,所述管體20的第一端22與所述連接部14背離所述主體部12的端部連接。
In other embodiments, the
所述管體20的材質為導熱性能好的材質,例如金屬,用於提升散熱效率。
The material of the
步驟S3:請參閱圖6,在所述管體20中插入芯棒30,所述芯棒30與所述管體20之間預留縫隙。
Step S3: Please refer to FIG. 6 , insert a
可以理解地,所述芯棒30的直徑小於所述通孔16的直徑。將所述芯棒30從開口的第一端22插入所述管體20,所述芯棒30位於所述管體20的中心位置,所述芯棒30的一端抵接於所述第二端24或者與第二端24相距設置,預留後續形成第一毛細結構35的空間。
Understandably, the diameter of the
步驟S4:請參閱圖7,在所述縫隙中以及第一殼體10與所述管體20連接的同一表面填充金屬粉末後燒結,以使所述金屬粉末形成第一毛細結構35。
Step S4 : Please refer to FIG. 7 , filling the gap and the same surface where the
在一些實施方式中,所述金屬粉末填充所述管體20與所述芯棒30之間的縫隙,還將所述金屬粉末一併鋪設於所述主體部12與所述管體20連接的同一側的表面,從而在一步燒結過程中,同時在所述管體20內壁以及所述主體部12的表面形成連續地所述第一毛細結構35,可以避免多次燒結而導致第一毛細結構35斷層的情況,另外,還可以簡化流程。
In some embodiments, the metal powder fills the gap between the
在另一些實施方式中,所述金屬粉末還覆蓋所述連接部14的表面。
In other embodiments, the metal powder also covers the surface of the connecting
步驟S5:請參閱圖8,取出所述芯棒30。
Step S5: Referring to FIG. 8 , take out the
所述金屬粉末被燒結形成的所述第一毛細結構35固定於所述管體20內壁以及所述連接部14的表面。將所述芯棒30從所述管體20中取出後,在所述管體20中形成一腔體26。可以理解地,所述第一毛細結構35在同一燒結步驟中形成,所述第一毛細結構35為一體結構,不會出現斷層。
The
在一些實施方式中,所述第一毛細結構35還一併覆蓋所述連接部14的表面。
In some embodiments, the
可以理解地,在本實施方式中,所述腔體26的數量為複數個。
It can be understood that, in this embodiment, the number of
步驟S6:請再次參閱圖3,提供第二殼體50,連接所述第二殼體50與所述第一殼體10,所述第二殼體50與所述第一殼體10以及所述管體20形成一具有注液口(圖未標)的容納腔60。
Step S6: Please refer to FIG. 3 again, provide a
所述第二殼體50與所述第一殼體10的形狀大致相適配。所述第二殼體50具有一凹槽52,所述第二殼體50位於所述第一殼體10背離與所述管體20的一側,所述第二殼體50與所述第一殼體10最外緣的主體部12連接,所述凹槽52與複數個所述腔體26共同形成所述容納腔60。
The shape of the
所述第二殼體50與所述第一殼體10連接時,預留一注液口,用於後續步驟中朝向所述容納腔60中注入工作液體。
When the
在一些實施方式中,所述第二殼體50朝向所述第一殼體10的表面還設置有第二毛細結構54,所述第二毛細結構54與所述第一毛細結構35連接,便於蒸汽傳輸,降低熱阻。
In some embodiments, the surface of the
步驟S7:從所述注液口朝向所述容納腔60中注入工作液體後密封所述注液口,得到所述散熱結構100。
Step S7: inject working liquid from the liquid injection port into the
所述工作液體可以是水,也可以是其他在使用過程中能夠產生相變的液體,例如丙酮、乙醇等。 The working liquid may be water, or other liquids capable of phase change during use, such as acetone, ethanol, and the like.
在注入所述工作液體40後,進行抽真空處理,然後可以採用焊接或者採用一密封塞53密封所述注液口。
After injecting the working liquid 40 , perform vacuum treatment, and then seal the liquid injection port by welding or a sealing
本申請提供的散熱結構100,在所述第一殼體10與所述管體20的表面設置一體結構的第一毛細結構35,在所述工作液體40受熱流動的過程中,流動阻力小,散熱快;本申請提供的散熱結構100在製作過程中,一次燒結步驟中形成所述第一毛細結構35,避免出現斷層;同時,流程簡化,節省成本。
In the
以上實施方式僅用以說明本申請的技術方案而非限制,儘管參照以上較佳實施方式對本申請進行了詳細說明,本領域的普通技術人員應當理解,可以對本申請的技術方案進行修改或等同替換都不應脫離本申請技術方案的精神和範圍。 The above embodiments are only used to illustrate the technical solutions of the present application without limitation. Although the present application has been described in detail with reference to the above preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified or equivalently replaced All should not deviate from the spirit and scope of the technical solution of the present application.
100:散熱結構 100: heat dissipation structure
10:第一殼體 10: The first shell
12:主體部 12: Main body
14:連接部 14: Connecting part
20:管體 20: tube body
22:第一端 22: first end
24:第二端 24: second end
26:腔體 26: Cavity
35:第一毛細結構 35: The first capillary structure
50:第二殼體 50: second shell
52:凹槽 52: Groove
54:第二毛細結構 54:Second capillary structure
60:容納腔 60:Accommodating cavity
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| CN202110214018.1 | 2021-02-25 |
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| US12516890B2 (en) | 2023-11-08 | 2026-01-06 | Asia Vital Components (China) Co., Ltd. | Combination heat dissipation structure |
| TWI874082B (en) * | 2023-12-28 | 2025-02-21 | 李克勤 | Methods of manufacture three-dimensional vapor chamber |
| TWI892452B (en) * | 2024-01-09 | 2025-08-01 | 高柏科技股份有限公司 | Heat dissipating system and manufacturing method thereof |
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| US6647625B2 (en) * | 2001-12-13 | 2003-11-18 | Wei Te Wang | Method for fabricating a heat pipe structure in a radiating plate |
| CN1909771A (en) * | 2005-08-02 | 2007-02-07 | 鸿富锦精密工业(深圳)有限公司 | Heat radiator |
| TW201719101A (en) * | 2015-11-17 | 2017-06-01 | Asia Vital Components Co Ltd | Heat dissipation device |
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| CN101295685B (en) * | 2007-04-28 | 2011-03-23 | 新灯源科技有限公司 | Heat pipe and manufacturing method thereof |
| WO2008131587A1 (en) * | 2007-04-28 | 2008-11-06 | Jenshyan Chen | Heat pipe and manufacturing method thereof |
| US20170314873A1 (en) * | 2016-04-30 | 2017-11-02 | Taiwan Microloops Corp. | Heat conduction module structure and method of manufacturing the same |
| CN108731526A (en) * | 2017-04-24 | 2018-11-02 | 迈萪科技股份有限公司 | Heat conduction structure and manufacturing method thereof |
| TWM590849U (en) * | 2019-11-26 | 2020-02-11 | 大陸商深圳興奇宏科技有限公司 | Heat dissipation element joining structure |
| CN113573540B (en) * | 2020-04-29 | 2024-10-29 | 华为机器有限公司 | Heat dissipation device, manufacturing method thereof and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6647625B2 (en) * | 2001-12-13 | 2003-11-18 | Wei Te Wang | Method for fabricating a heat pipe structure in a radiating plate |
| CN1909771A (en) * | 2005-08-02 | 2007-02-07 | 鸿富锦精密工业(深圳)有限公司 | Heat radiator |
| TW201719101A (en) * | 2015-11-17 | 2017-06-01 | Asia Vital Components Co Ltd | Heat dissipation device |
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