CN204408834U - A kind of heat abstractor - Google Patents

Abstract

A kind of heat abstractor, is made up of the sub-pipe of the heat radiation of one or more tubuloses arranged in parallel.The sub-pipe that dispels the heat is set to door opening shape or semicircle or half elliptic, the sub-pipe that dispels the heat is provided with outer tube, interior pipe and cavity, outer tube sleeve is located at interior pipe and is welded with the interior seal of tube at port outer tube, outer tube outer wall face is provided with the first coating, outer tube wall face is provided with the second coating, interior pipe outside wall surface be provided with the 3rd coating, the surface of the 3rd coating is provided with the capillary function layer be made up of the metal dust with rough surface structure, the cavity of sealing is formed between interior pipe and outer tube, be filled with cooling fluid in cavity and arrange in vacuum, second coating, 3rd coating not with cooling fluid generation chemical reaction.Heat radiation manages the ascending pipe be also provided with for injecting cooling fluid.Outer tube wall face is provided with multiple the first groove towards outer tube outside wall surface direction depression and the second groove, and the outside wall surface of interior pipe is provided with the pillar for abutting against with the second groove.This radiating tube volume is little, and radiating effect is good.

Description

a cooling device

technical field

The utility model relates to the technical field of heat dissipation of electronic products, in particular to a heat dissipation device.

Background technique

Good heat dissipation performance is an important guarantee to ensure the effective operation of electronic products. Electronic products usually use heat sinks made of aluminum or copper for heat dissipation, and some larger products are also cooled by liquids such as water or other cooling fluids. However, with the gradual miniaturization of electronic products, the volume of the cooling device is required to be smaller and smaller, and the traditional cooling device can no longer meet the requirements.

In the prior art, for the heat dissipation problem of electronic products such as CPU, there is also a method of dissipating heat through heat sinks, but this method still has the disadvantage of large volume.

Therefore, in view of the deficiencies of the prior art, it is necessary to provide a heat sink with a small volume and good heat dissipation performance to overcome the deficiencies of the prior art.

Contents of the invention

The purpose of the utility model is to avoid the deficiencies of the prior art and provide a cooling device, which has the characteristics of convenient operation, high preparation efficiency and good product quality.

The purpose of this utility model is achieved through the following technical measures.

A heat dissipation device is composed of one or more tubular radiating sub-pipes, and when composed of multiple radiating sub-pipes, the plurality of radiating sub-pipes are arranged in parallel.

Preferably, the above-mentioned heat dissipation sub-pipes are set in the shape of a door opening or a semicircle or a semiellipse.

Preferably, the heat dissipation sub-tube is provided with an outer tube, an inner tube and a cavity, the outer tube is sleeved on the inner tube and sealed and welded at the port, the outer wall of the outer tube is provided with a first coating, the The inner wall of the outer tube is provided with a second coating, the outer wall of the inner tube is provided with a third coating, and the surface of the third coating is provided with a capillary functional layer composed of metal powder with a rough surface structure. A sealed cavity is formed between the outer tube and the cavity, the cavity is filled with cooling liquid and set in vacuum, and the second coating layer and the third coating layer do not chemically react with the cooling liquid.

Preferably, the above-mentioned outer tube and the inner tube are tube bodies made of metal materials.

Preferably, the second coating layer is the same as the third coating layer.

Preferably, the heat dissipation sub-pipe is further provided with an injection pipe for injecting cooling liquid, and the injection pipe is arranged at the position of the outer pipe or the inner pipe or at the connection between the inner pipe and the outer pipe.

Preferably, the capillary function layer is made of copper powder.

Preferably, the inner wall of the inner tube is provided with a fourth coating.

Preferably, the inner wall of the outer tube is provided with a plurality of first grooves and second grooves that are recessed toward the outer wall of the outer tube, and the outer wall of the inner tube is provided with a groove for connecting with the second grooves. a pillar, and the pillar is correspondingly abutted against the second groove.

Preferably, the above-mentioned first groove is configured as a strip or a circle or a rhombus or other irregular shapes, and the second groove is configured as a circle.

The heat dissipation device provided by the utility model is composed of one or more tubular heat dissipation sub-pipes, and when composed of multiple heat dissipation sub-pipes, the plurality of heat dissipation sub-pipes are arranged in parallel. Through the heat dissipation device, the heat dissipation device is installed on the surface of the heating element during use, and heat can be dissipated through the heat dissipation sub-pipe, and has the characteristics of small size and good heat dissipation effect.

Description of drawings

Utilize accompanying drawing to further illustrate the utility model, but the content in the accompanying drawing does not constitute any limitation to the utility model.

Fig. 1 is a schematic view of a heat dissipation device in use according to the present invention.

Fig. 2 is a structural schematic diagram of a heat dissipation sub-pipe of a heat dissipation device of the present invention.

Fig. 3 is a schematic cross-sectional structure diagram of a heat dissipation sub-pipe of a heat dissipation device of the present invention.

In Figures 1 to 3, including:

heating element 100,

Radiating tube 200,

outer tube 210,

the first groove 211,

the second groove 213,

inner tube 220,

Capillary function layer 221,

Pillar 222,

cavity 230,

Injection tube 240 .

Detailed ways

The utility model will be further described in conjunction with the following examples.

Example 1.

This embodiment provides a heat dissipation device, as shown in FIG. 1 , which is composed of a plurality of tubular heat dissipation sub-pipes 200 arranged in parallel. The tubular heat dissipation sub-pipe 200 is assembled on the surface of the heating element 100 during use, and can transfer the heat generated by the heating element 100 in time. Adopting the tubular structure can reduce the volume of the heat dissipation device, which is suitable for the development demand of miniaturization of electronic products. It should be noted that the number of heat dissipation sub-pipes 200 constituting the heat dissipation device can be flexibly set according to actual needs, and is not limited to three in this embodiment, and can also be set to one when the power of the heating element 100 is relatively small.

In this embodiment, the heat dissipation sub-pipe 200 is set in a door-hole shape so as to be in contact with the heating element 100 with a maximum area, so that the heat generated by the heating element 100 during operation can be transferred and dissipated in time. It should be noted that the shape of the heat dissipation sub-pipe 200 refers to the overall structure of a single heat dissipation sub-pipe, and its structure is not limited to the shape of the door opening in this embodiment, and can also be set as a semicircle or semi-ellipse or other shapes to It depends on the specific use situation.

As shown in FIG. 2 and FIG. 3 , the heat dissipation sub-tube 200 is provided with an outer tube 210 , an inner tube 220 and a cavity 230 , the outer tube 210 is sleeved on the inner tube 220 and the outer tube 210 and the inner tube 220 are sealed and welded at the ports. The central axis of the inner pipe 220 and the outer pipe 210 defines the interior or exterior of the pipe body, corresponding to the inner wall surface and the outer wall surface, the surface closest to the central axis of the pipe body is the inner wall surface, and the side farther from the central axis of the pipe body is the outer wall surface . The outer wall surface of the outer tube 210 is provided with a first coating layer, the inner wall surface of the outer tube 210 is provided with a second coating layer, the outer wall surface of the inner tube 220 is provided with a third coating layer, and the surface of the third coating layer is provided with a metal powder with a rough surface structure. The capillary function layer 221 is formed, and a sealed cavity 230 is formed between the inner tube 220 and the outer tube 210. The cavity 230 is filled with cooling liquid and placed in a vacuum. The second coating layer and the third coating layer do not chemically react with the cooling liquid. . Preferably, the inner wall of the inner tube 220 is provided with a fourth coating.

Both the outer tube 210 and the inner tube 220 are made of metal materials with good thermal conductivity, such as copper tubes, aluminum tubes, etc., to achieve good thermal conductivity. The first coating layer provided on the outer wall of the outer tube 210 is used to conduct the heat generated by the heat-generating components in time on the one hand, and to dissipate the conducted heat in time on the other hand. Therefore, the first coating layer is also made of a material with good heat dissipation performance. formed coating. The second coating on the inner wall of the outer tube 210 and the third coating on the outer wall of the inner tube 220 are used to prevent the cooling liquid in the cavity 230 from chemically reacting with the outer tube 210 and the inner tube 220. It is provided that the cooling liquid in the cavity 230 does not chemically react with the outer tube 210 and the inner tube 220, and the second coating layer and the third coating layer can be set to be exactly the same.

The cooling sub-pipe 200 is also provided with an injection pipe 240 for injecting cooling liquid. The injection pipe 240 is arranged at the position of the outer pipe 210 or the inner pipe 220 or at the connection between the inner pipe 220 and the outer pipe 210. When the outer pipe 210, the inner pipe 210 After the pipe 220 is sealed and welded, the cooling liquid is injected into the cavity 230 through the injection pipe 240 and vacuumized, and then the injection pipe 240 is sealed to obtain the finished heat dissipation sub-pipe 200 .

A capillary functional layer 221 composed of metal powder with a rough surface structure is provided on the surface of the third plating layer, and the capillary functional layer 221 is specifically composed of copper powder. Through the capillary function layer 221, the cooling liquid is absorbed in the gap position in the copper powder at normal temperature. When the heating element 100 generates heat, the copper powder in the cavity 230 will be discharged due to the capillary phenomenon, pushing the cooling liquid to move, thereby A driving force for the movement of the cooling liquid in the cavity 230 is formed to promote the flow of the cooling liquid so as to transfer heat in time.

In order to effectively transfer heat, the inner wall of the outer tube 210 is provided with a plurality of first grooves 211 and second grooves 212 that are sunken toward the outer wall of the outer tube 210, and the outer wall of the inner tube 220 is provided with grooves for connecting with the second grooves. 212 is grounded with a pillar 222 , and the pillar 222 abuts against the second groove 212 correspondingly. The first groove 211 is configured as a strip or a circle or a rhombus or other irregular shapes, and the second groove 212 is configured as a circle. The pillar 222 and the second groove 212 are used to effectively support the outer tube 210 and the inner tube 220 to form an internal space position, prevent the deformation of the outer tube 210 and the inner tube 220 after being heated and affect the structure of the cavity 230, and facilitate internal cooling fluid moves efficiently.

The heat dissipation device provided by the utility model is composed of one or more tubular heat dissipation sub-pipes 200, and when composed of multiple heat dissipation sub-pipes 200, the plurality of heat dissipation sub-pipes 200 are arranged in parallel. Through the heat dissipation device, the heat dissipation device is installed on the surface of the heating element 100 during use, which has a small size and can meet the needs of miniaturization and development of electronic products. However, the capillary effect is used to dissipate heat through the heat dissipation sub-pipe 200 , which has a good heat dissipation effect.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model rather than limiting the protection scope of the present utility model. Although the utility model has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should It is understood that the technical solution of the utility model can be modified or equivalently replaced without departing from the essence and scope of the technical solution of the utility model.

Claims (10)

1. a heat abstractor, is characterized in that: be made up of the sub-pipe of the heat radiation of one or more tubuloses, when being made up of the many sub-pipes of heat radiation, in arranged in parallel between the many sub-pipes of heat radiation.

2. heat abstractor according to claim 1, is characterized in that: the sub-pipe of described heat radiation is set to door opening shape or semicircle or half elliptic.

3. heat abstractor according to claim 1 and 2, it is characterized in that: the sub-pipe of described heat radiation is provided with outer tube, interior pipe and cavity, described outer tube sleeve is located at described interior pipe and is welded with the interior seal of tube at port outer tube, described outer tube outer wall face is provided with the first coating, described outer tube wall face is provided with the second coating, described interior pipe outside wall surface be provided with the 3rd coating, the surface of described 3rd coating is provided with the capillary function layer be made up of the metal dust with rough surface structure, the cavity of sealing is formed between described interior pipe and described outer tube, be filled with cooling fluid in described cavity and arrange in vacuum, described second coating, described 3rd coating not with described cooling fluid generation chemical reaction.

4. heat abstractor according to claim 3, is characterized in that: described outer tube, described interior pipe are the body of metal material.

5. heat abstractor according to claim 4, is characterized in that: described second coating is identical with described 3rd coating.

6. heat abstractor according to claim 3, is characterized in that: described heat radiation manages the ascending pipe that is also provided with for injecting cooling fluid, and described ascending pipe is arranged at described outer tube or described interior pipe position or is arranged at the connecting portion of described interior pipe and outer tube.

7. heat abstractor according to claim 3, is characterized in that: described capillary function layer is made up of copper powder.

8. heat abstractor according to claim 3, is characterized in that: the internal face of described interior pipe is provided with the 4th coating.

9. heat abstractor according to claim 3, it is characterized in that: described outer tube wall face is provided with multiple the first groove towards outer tube outside wall surface direction depression and the second groove, the outside wall surface of described interior pipe be provided with for the pillar that connects of described second groove phase ground, described pillar correspondence is connected to described second groove.

10. heat abstractor according to claim 9, is characterized in that: described first groove is set to strip or circular or rhombus, and described second groove is set to circle.