TWI786739B - Die bonding device and method for manufacturing semiconductor device - Google Patents

Abstract

[Problem] To provide a technology capable of correcting the illuminance of a plurality of types of lighting devices. [Solution] A die bonding apparatus includes a plurality of imaging devices, a first lighting device, and a second lighting device, and a control unit that controls the plurality of imaging devices, the first lighting device, and the second lighting device. The control unit is configured to irradiate light from the first illuminating device to take an image of the object to be imaged by the plurality of imaging devices, correct the brightness of the captured plurality of images, and obtain a first combined image combining the corrected plurality of images, Light is irradiated from the second illuminating device, and the object to be photographed is imaged by a plurality of imaging devices, the brightness of the captured plurality of images is respectively corrected, and a second combined image combining the corrected multiple images is obtained, and the first combined image is obtained. It is added and synthesized with the second combined portrait.

Description

Die bonding device and method for manufacturing semiconductor device

The present disclosure relates to a die bonding device, and is applicable to, for example, a die bonder that can simultaneously irradiate illumination light from a plurality of types of illumination devices.

A die bonder as a die bonding device uses resin paste, solder, gold plating, etc. as a bonding material to bond (place and bond) a semiconductor chip (hereinafter, simply referred to as a die) on a wiring board or a lead frame ( Hereinafter, it is simply referred to as a substrate) or a device on a bonded die. For example, in a die bonder that bonds a die to the surface of a substrate, it is repeatedly picked up by suctioning a die from a wafer using a suction nozzle called a chuck attached to the front end of the bonding head, and The action (operation) of bonding by placing on a specific position on the substrate, applying a pressing force, and heating the bonding material at the same time.

For example, when a resin is used as a bonding material, a resin paste is used as an adhesive (hereinafter, referred to as a paste adhesive). The adhesive paste is enclosed in a syringe, and the syringe moves up and down relative to the substrate to eject and apply the adhesive paste. Install a recognition camera near the syringe, and use the recognition camera to confirm the position where the adhesive paste is applied for positioning. Furthermore, it is confirmed whether the applied adhesive paste is applied in a specific shape and only a specific amount placed in a specific location.

Furthermore, an identification camera is installed near the bonding head, and the identification camera is used to confirm the position of the substrate on which the die is bonded for positioning, and furthermore, it is confirmed whether the bonded die is bonded at a specific position.

Furthermore, in the die bonder, since the lighting system of the device covers the variety of types, the correspondence of the process, the algorithm of positioning or inspection, etc., it is necessary to mount multiple types of lighting devices to one identification camera. For example, it is equipped with coaxial lighting and oblique lighting, and irradiates illumination light at the same time. [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2017-147258

[Problem to be Solved by the Invention]

As mentioned above, although there are cases where illumination light is irradiated simultaneously from a plurality of types of lighting devices, it is difficult to correct the brightness of a captured image due to the difference in characteristics of each lighting device.

The subject of this disclosure is to provide a technology capable of correcting the illuminance of a plurality of types of lighting devices. [Means to solve the problem]

The summary of the representative content in this disclosure is briefly described as follows. That is, the die bonding apparatus includes a plurality of imaging devices, a first lighting device, and a second lighting device, and a control unit that controls the plurality of imaging devices, the first lighting device, and the second lighting device. The control unit is configured to irradiate light from the first illuminating device to take an image of the object to be imaged by the plurality of imaging devices, correct the brightness of the captured plurality of images, and obtain a first combined image combining the corrected plurality of images, Light is irradiated from the second illuminating device, and the object to be photographed is imaged by a plurality of imaging devices, the brightness of the captured plurality of images is respectively corrected, and a second combined image combining the corrected multiple images is obtained, and the first combined image is obtained. It is added and synthesized with the second combined portrait. [Effect of Invention]

If the above-mentioned die bonding device is used, it is possible to correct the illuminance of multiple types of lighting devices.

Hereinafter, implementation forms and examples will be described using drawings. However, in the following description, the same reference numerals are given to the same components, and overlapping descriptions may be omitted. In addition, in order to clarify the description, although the width, thickness, shape, etc. of each part may be schematically shown in the drawing compared with the actual state, this is only an example and is not intended to limit the interpretation of the present invention.

First, the technique that the inventors of the present invention examined will be described using FIGS. 1 to 3 . FIG. 1 is a plan view illustrating multiplexing of an imaging device. Fig. 2 is a side view when viewed from the direction of arrow A in Fig. 1 . FIG. 3 is a diagram showing an illumination device used in a multiplexed imaging device, FIG. 3( a ) is a cross-sectional view, and FIG. 3( b ) is a cross-sectional view of a plane different from that shown in FIG. 3( a ).

For example, as shown in FIG. 1 , above the substrate S, a plurality of imaging devices 101 to 103 are arranged in a row in the width direction of the substrate S (Y-axis direction) and fixedly arranged. As shown in FIG. 2 , the imaging devices 101 - 103 are at the same height at a certain interval in the horizontal direction, and the optical axes of the imaging devices 101 - 103 are parallel to each other and perpendicular to the substrate S. As shown in FIG.

1 and 2 show an example in which three imaging devices are provided and six bonding regions are provided in one row of the substrate S, and the distance between the imaging devices is greater than the distance between the bonding regions. Here, the substrate S is rectangular and flat as shown in FIG. 1 , and has many bonding regions AA11 to AA16 , AA21 to AA26 , and AAn1 to AAn6 vertically and horizontally. For example, the board|substrate S is comprised so that the length of a conveyance direction (X-axis direction) may be longer than the length of a width direction (Y-axis direction).

The imaging devices 101 to 103 image the imaging objects in the joint areas AA11 to AA16. Here, the imaging fields of view IA1 to IA3 of the imaging devices 101 to 103 overlap each other. Furthermore, by moving the board|substrate S in a conveyance direction (X-axis direction), the imaging target object of the remaining row is imaged sequentially. By multiplying the imaging device, imaging can be performed slightly directly above the imaging object, and the uniformity of illumination in the imaging field of view can be improved for inspection. Furthermore, by multiplying the camera device, the same processing efficiency as that of the wide-field optical system can be obtained without moving the camera device.

It is better for multiple camera devices to have the same lighting system. For example, as shown in FIG. 3( a ), between the imaging devices 101 to 103 and the substrate S, a coaxial illuminator 121 with a surface light emitting surface (light source) 121 a, a half mirror (half mirror) 121 b and an oblique light as an oblique light are arranged inside. The oblique light strip lighting 122 in two directions of lighting.

Illuminating light from the surface light-emitting surface 121a of the coaxial illuminator 121 is reflected by the half mirror 121b on the same optical axis as the imaging devices 101-103, and is irradiated to the imaging objects in the bonding regions AA11-AA16 of the substrate S. The scattered light irradiated to the imaging objects in the joint areas AA11-AA16 with the same optical axis as the imaging devices 101-103 is reflected by the imaging objects in the joint areas AA11-AA16, and the regular reflection light penetrates the half mirror 121b and reaches the imaging devices 101-103 to form images of the imaging objects in the bonding areas AA11-AA16. As shown in FIG. 3( b ), the length in the Y-axis direction of the surface light-emitting surface 121 a and the half mirror 121 b is slightly wider than the overall imaging field of view of the imaging devices 101 to 103 in the width direction of the substrate S.

The oblique light bar lighting 122 has a light emitting surface 122 a, is lighting for illuminating the object to be photographed from obliquely above, and is arranged on both sides of the coaxial lighting 121 . The oblique light bar illumination 122 is configured so that the length in the Y-axis direction is slightly wider than the overall imaging field of view of the imaging devices 101 to 103 in the width direction of the substrate S.

Next, a description will be given using FIG. 4 of one image acquired using multiple imaging devices and multiple lighting. FIG. 4 is a flowchart illustrating image synthesis.

The control unit 200 irradiates the imaged objects in the plurality of bonding areas AA11 to AA16 by using both the coaxial illumination 121 and the oblique light strip illumination 122 (step S1 ). The control part 200 images the object to be imaged in the plurality of bonding regions AA11 to AA15 by the plurality of imaging devices 101 to 103 (step S2). The control unit 200 performs coordinate transformation based on projective transformation or affine transformation on the images captured by the plurality of imaging devices 101 to 103, and obtains a combined image in which the images of the imaging devices are smoothly stitched together. (step S3).

Next, in a multiplexed imaging device, problems in the case where plural types of illumination are simultaneously irradiated will be described with reference to FIGS. 5 and 6 . Fig. 5 is a diagram of a photographed image of a problem in the case of simultaneously irradiating plural types of illumination in a multiplexed imaging device, and Fig. 5(a) shows a photographed image when only the coaxial illumination shown in Fig. 3 is irradiated , FIG. 5(b) is a diagram showing a captured image when only the oblique light bar illumination shown in FIG. 3 is irradiated. FIG. 6 is a graph showing an example of attenuation rate or magnification of the average brightness in the field of view due to the combination of the lens shown in FIG. 5 and the illumination used for the illumination.

Even if the characteristics of each imaging device and the characteristics of each lens are matched, and the illuminance in the light-emitting surface is made uniform, the position of the illumination relative to the position of each imaging device of the multiple imaging device will not be the same (the imaging device and the lighting The relative positional relationship is different), so the brightness in the field of view of each camera device is different. That is, in multiple imaging devices, since the brightness in the field of view of each imaging device is different, it is necessary to correct the captured image. However, within the same field of view, there is a mixture of areas that tend to reflect on-axis lighting and areas that tend to reflect oblique lighting. Therefore, only when the on-axis illumination 121 shown in FIG. 5( a ) is irradiated and only when the oblique light bar illumination 122 is irradiated as shown in FIG. 5( b ) is the brightness different, the correction value is different. As a result, it is difficult to obtain a correction value when the coaxial illumination 121 and the oblique light strip illumination 122 are used together. Here, in FIG. 5, the boundary line of the field of view of each imaging device is shown.

Furthermore, in addition to the above-mentioned difference in brightness due to illumination, there is also a difference in brightness due to variations in the lenses 111 to 113 . As the individual difference of the lens, the brightness of the lens may have a difference of several percent due to the deviation in processing such as aperture number, F number (F number), working distance (Working Distance: WD), focal length, etc. The difference in the number of openings will affect the concentration of diffused light. The cause of the deviation of the lens and the brightness deviation between the images caused by the illumination system are as shown in Fig. 6, and the attenuation rate or the magnification rate in the field of view is different respectively.

When the coaxial illumination 121 and the oblique light strip illumination 122 are irradiated at the same time for imaging, since the brightness of the image increases and decreases with the rate of change of the attenuation rate or magnification rate in the field of view shown in FIG. Therefore, it is difficult to correct the brightness after the image is acquired.

Next, a method in an embodiment of obtaining a single image using the multiple imaging devices and multiple types of illumination shown in FIG. 3 will be described using FIG. 3 and FIG. 7 . Fig. 7 is a flowchart illustrating image synthesis in the embodiment.

On the premise that the object to be irradiated (imaged object) and the imaging system (imaging device, lens and lighting device) are in a static state, each image is captured through the combination of each lens (imaging device) and lighting. For the image, the brightness between the lenses is digitally corrected, the image of each lighting is synthesized by projection conversion, etc., and then the combined image of each lighting is added and synthesized. In this way, a uniform combined image (synthesized image) due to projection transformation or the like can be obtained. Hereinafter, it demonstrates in more detail.

The control unit 200 irradiates the plurality of imaging objects in the plurality of bonding areas AA11 to AA16 only by the coaxial illumination 121 (step S11 ). In the state of step S11, the control unit 200 images the imaging objects of the plurality of joining regions AA11 to AA16 by the plurality of imaging devices 101 to 103 (step S12). The control unit 200 performs digital correction by multiplying each captured image by a specific coefficient corresponding to the brightness so that the brightness of the plurality of captured images captured by the plurality of imaging devices 101 to 103 becomes the same in step S12 (step S13) . Similar to step S3, the control unit 200 performs coordinate conversion based on projective conversion or simulation conversion on the complex images corrected in step S13, and obtains a smooth splicing of the corrected images between the imaging devices. One portrait (first combined portrait) (step S14).

The control unit 200 irradiates the plurality of imaging objects in the plurality of joining regions AA11 to AA16 only by the oblique light bar illumination 122 (step S15 ). In the state of step S15, the control part 200 images the object to be imaged in the plurality of joining regions AA11 to AA16 by the plurality of imaging devices 101 to 103 (step S16). The control unit 200 performs digital correction by multiplying each captured image by a specific coefficient corresponding to the brightness so that the brightness of the plurality of captured images captured by the plurality of imaging devices 101 to 103 becomes the same in step S16 (step S17) . Similar to step S3, the control unit 200 performs coordinate conversion based on projective conversion or simulation conversion on the complex images corrected in step S17, and obtains a smooth stitching of the corrected images between the imaging devices. One portrait (second combined portrait) (step S18).

The control unit 200 obtains an image (synthesized image) by performing additive synthesis in which pixel values at corresponding positions of the first combined image acquired in step S14 and the second combined image acquired in step S18 are respectively added. (step S19).

In addition, it does not matter which one of steps S11 to S14 and steps S15 to S18 is performed first. Furthermore, steps S11, S12 and steps S15, S16 are not performed at the same time, even if steps S13, S14 and steps S17, S18 are performed at the same time or before and after.

Accordingly, a uniform combined image can be obtained. Since the brightness can be made the same even if the images between the imaging devices are combined, the accuracy of brightness correction between the imaging devices can be improved. It can improve inspection sensitivity and positioning accuracy. It is possible to correct the brightness caused by the machine error of the camera device, the machine error of the lens, and the difference in position relative to the illumination.

In addition, although the example of a multiple imaging device was demonstrated in embodiment, it is not limited to a multiple imaging device, It can apply to the person who irradiates two or more plural illuminators simultaneously with one imaging device. An example thereof will be described using FIG. 8 . Fig. 8 is a diagram showing an imaging device and an illumination device in another embodiment, Fig. 8(a) is a cross-sectional view, and Fig. 8(b) is a cross-sectional view of a plane different from the cross-section shown in Fig. 8(a) .

For example, as shown in FIG. 8( b ), above the substrate S, an imaging device 101 capable of moving in the width direction of the substrate S (Y-axis direction) is disposed. The substrate S is the same as the substrate S shown in FIG. 1 , and six bonding regions are provided in a row.

The imaging device 101 sequentially images the imaging objects in the joining regions AA11 to AA16 by moving in the Y-axis direction. Furthermore, by moving the board|substrate S in a conveyance direction (Y-axis direction), the imaging target object of the remaining row is imaged sequentially.

As shown in Figure 8(a) and Figure 8(b), between the imaging device 101 and the substrate S, the coaxial illumination 121 shown in Figure 3(a) and Figure 3(b) and oblique light in two directions are arranged. Strip lighting 122 is the same lighting device.

Next, a method in another embodiment using the imaging device shown in FIG. 8 and plural types of lighting will be described using FIGS. 8 and 9 . FIG. 9 is a flowchart illustrating image synthesis in another embodiment.

The control unit 200 irradiates the plurality of imaging objects in the plurality of bonding regions AA11 to AA16 only by the coaxial illumination 121 (step S21 ). In the state of step S21, the control unit 200 uses the imaging device 101 to sequentially image the objects to be imaged in the plurality of joining regions AA11 to AA16 (step S22). The control unit 200 performs digital correction by multiplying each captured image by a specific coefficient corresponding to the brightness so that the brightness of the plurality of captured images captured by the imaging device 101 becomes the same in step S22, and obtains a plurality of corrected images. image (first corrected image) (step S23).

The control unit 200 irradiates the plurality of imaging objects in the plurality of bonding areas AA11 to AA16 only by the oblique light bar illumination 122 (step S25 ). In the state of step S25, the control unit 200 uses the imaging device 101 to sequentially image the objects to be imaged in the plurality of joining regions AA11 to AA15 (step S26). The control unit 200 performs digital correction by multiplying each captured image by a specific coefficient corresponding to the brightness so that the brightness of the plurality of captured images captured by the imaging device 101 becomes the same in step S12, and obtains the multiple corrected images. image (second corrected image) (step S27).

The control unit 200 obtains a plurality of images (synthesized images) by adding and synthesizing the plurality of first corrected images acquired in step S23 and the plurality of second corrected images acquired in step S27 (step S29 ).

In addition, it does not matter which one of steps S21 to S23 and steps S25 to S27 is performed first. Furthermore, steps S21 and S22 and steps S25 and S26 may not be performed at the same time, and even step S23 and step S27 may be performed at the same time or in front of each other. [Example]

Embodiments applicable to the above-mentioned implementation forms will be described below. Fig. 10 is a schematic plan view showing the adapter in the embodiment. Fig. 11 is a diagram illustrating the operation of the pick-up head and the bonding head when viewed from the direction of arrow A in Fig. 10 .

The die bonder 10 roughly includes a die supply unit 1 for supplying a die D mounted on a substrate S, a pickup unit 2, an intermediate platform unit 3, a preforming unit 9, a bonding unit 4, a transport unit 5, a substrate supply unit 6, The substrate unloading unit 7 and the control unit 8 monitor and control the operation of each unit. The Y-axis direction is the front-back direction of the die bonder 10 , and the X-axis direction is the left-right direction. The die supply unit 1 is arranged on the front side of the die bonder 10 , and the bonding unit 4 is arranged on the deep side. Here, on the substrate S, a plurality of product regions (hereinafter referred to as package regions P) to be the final package are formed. For example, when the substrate S is a lead frame, the package region P has a tab on which the die D is placed.

First, the die supply unit 1 supplies the die D mounted on the package area P of the substrate S. As shown in FIG. The die supply unit 1 has a wafer holding table 12 holding a wafer 11 and a peeling unit 13 shown by a dotted line pushing a die D from the wafer 11 . The die supply part 1 moves in the XY axis direction by a driving means not shown, and moves the picked up die D to the position of the peeling unit 13 .

The pick-up unit 2 has a pick-up head 21 for picking up the die D, a Y drive unit 23 for the pick-up head that moves the pick-up head 21 to the Y-axis direction, and various components (not shown) that move the chuck 22 up and down, rotate, and move in the X-axis direction. A drive unit, and a wafer recognition camera 24 for grasping the pick-up position of the die D picked up from the wafer 11 . The pick-up head 21 has a chuck 22 (also refer to FIG. 11 ) that sucks and holds the pushed-up die D at the tip, picks up the die D from the die supply unit 1 , and mounts it on the intermediate table 31 . The pick-up head 21 has drive units (not shown) for moving the chuck 22 up and down, rotating, and moving in the X-axis direction.

The intermediate stage part 3 has an intermediate stage 31 on which the die D is temporarily placed, and a stage identification camera 32 for identifying the die D on the intermediate stage 31 .

The preforming unit 9 has a syringe 91 , a drive unit 93 for moving the syringe 91 in the Y direction and Z direction, and an adhesive recognition camera 94 as an imaging device for grasping the application position of the syringe 91 and the like. Here, the adhesive agent recognition camera 94 is the same as the multiple imaging devices 101 to 103 of the embodiment, and the adhesive agent recognition camera 94 is composed of the coaxial lighting 121 and the two-directional oblique light strip lighting 122 used in the embodiment. And take pictures. The preforming unit 9 applies a paste-like adhesive such as epoxy resin to the substrate S transported by the transport unit 5 with a syringe 91 . The syringe 91 is configured such that the adhesive paste is sealed inside, and the adhesive paste is pushed out from the tip of the nozzle to the substrate S by air pressure to be applied. In the case of the substrate S, for example, a plurality of unit lead frames are arranged in a row horizontally to form a series of multiple lead frames, and a paste-like adhesive is applied to each tab of the unit lead frame.

The bonding part 4 picks up the die D from the intermediate platform 31 and bonds it to the package area P coated with the paste adhesive of the transported substrate S. The bonding unit 4 has a bonding head 41 including a chuck 42 (also refer to FIG. 11 ) that adsorbs and holds the die D at the tip similar to the pick-up head 21, a Y drive unit 43 that moves the bonding head 41 in the Y-axis direction, and The position identification mark (not shown) of the packaging area P of the camera substrate S is photographed, and the substrate identification camera 44 is used to identify the bonding position. Here, the substrate recognition camera 44 is composed of three cameras 44a, 44b, and 44c. For example, it is the same as the multiplexed imaging devices 101-103 of the embodiment. The substrate recognition camera 44 is configured as a coaxial camera used in the embodiment. The illumination 121 and the oblique light strip illumination 122 in two directions are used for imaging. With such a configuration, the bonding head 41 corrects the pick-up position and posture based on the imaging data of the platform recognition camera 32 , picks up the die D from the intermediate stage 31 , and bonds the die D to the substrate based on the imaging data of the substrate recognition camera 44 .

The conveyance unit 5 has a substrate conveyance claw 51 for grasping and conveying the substrate S, and a conveyance path 52 for moving the substrate S. As shown in FIG. The substrate S is moved by driving an unillustrated nut provided on the substrate conveyance claw 51 provided on the conveyance passage 52 by a ball screw (not shown) provided along the conveyance passage 52 . With such a configuration, the substrate S is moved from the substrate supply unit 6 to the bonding position along the conveyance path 52 , and after bonding, is moved to the substrate carry-out portion 7 , and the substrate S is delivered to the substrate carry-out portion 7 .

Next, the structure of the crystal grain supply part 1 is demonstrated using FIG. 12. FIG. Fig. 12 is a schematic cross-sectional view showing main parts of the crystal grain supply unit shown in Fig. 10 .

The die supply unit 1 includes a wafer holding table 12 that moves in the horizontal direction (XY axis direction), and a peeling unit 13 that moves in the vertical direction. The wafer holding table 12 includes an expansion ring 15 for holding the wafer ring 14 and a support ring 17 for horizontally positioning the dicing tape 16 fixed to the wafer ring 14 . In the wafer 11 , the die D diced into a mesh shape is then fixed to the dicing tape 16 . The peeling unit 13 is disposed inside the support ring 17 .

When the die supply unit 1 pushes up the die D, the expansion ring 15 holding the wafer ring 14 descends. As a result, the dicing tape 16 held on the wafer ring 14 is elongated, the interval between the dies D is widened, and when the peeling unit 13 pushes up the dicing tape 16 from below the die D, it moves horizontally, and Improve pick-up of Die D.

The control system of the die bonder 10 will be described using FIG. 13 . FIG. 13 is a block diagram showing a schematic configuration of a control system of the die bonder shown in FIG. 10 .

As shown in FIG. 11 , the control system 80 includes a control unit 8 , a drive unit 86 , a signal unit 87 , and an optical system 88 . The control unit 8 generally has a control operation device 81 mainly composed of a CPU (Central Processor Unit), a memory device 82 , an input/output device 83 , a bus line 84 , and a power supply unit 85 . The memory device 82 has a main memory device 82a composed of RAM storing processing programs and the like, and an auxiliary memory device 82b composed of HDD storing control data and image data required for control. The input and output device 83 has a screen 83a for displaying device status or information, etc., a touch panel 83b for inputting instructions from the operator, a mouse 83c for operating the screen, and an image capture device for capturing image data from the optical system 88 83d. Moreover, the input/output device 83 has a motor control device 83e for controlling the drive unit 86 of the XY stage (not shown) of the crystal grain supply unit 1 or the ZY drive shaft of the bonding head stage, etc., and signals from various sensors or lighting The I/O signal control device 83f of the signal part 87 of the switch etc. of the device etc. fetches or controls a signal. The optical system 88 includes the wafer recognition camera 24 shown in FIG. 11 , the adhesive recognition camera 94 shown in FIG. 10 , the platform recognition camera 32 and the substrate recognition camera 44 . The control computing device 81 captures the required data through the bus line 84, performs calculations, and controls the pick-up head 41, etc., or sends information to the screen 83a, etc.

The control unit 8 saves the image data captured by the optical system 88 in the memory device 82 via the image capture device 83d. According to the software programmed based on the stored image data, the control calculation device 81 is used to perform positioning of the die D and the substrate S, inspection of the coating pattern of the paste adhesive, and surface inspection of the die D and the substrate S. Based on the positions of the die D and the substrate S calculated by the control computing device 81, the drive unit 86 is moved by software through the motor control device 83e. Through this process, the positioning of the die D on the wafer 11 is performed, and the driving unit of the die supply unit 1 and the die bonding unit 4 operates to bond the die D on the substrate S. The recognition camera used in the optical system 88 is a gray scale, color camera, etc., and digitizes the light intensity.

Next, the manufacturing method of the semiconductor device using the die bonder concerning an Example is demonstrated using FIG. 14. FIG. FIG. 14 is a flowchart showing a method of manufacturing a semiconductor device using the die bonder shown in FIG. 10 .

(Step S51: Wafer and substrate loading process) The wafer ring 14 holding the dicing tape 16 attached to the die D divided from the wafer 11 is stored in a wafer cassette (not shown), and loaded into the die bonder 10 . The control unit 8 supplies the wafer ring 14 to the die supply unit 1 from a wafer cassette filled with the wafer ring 14 . Furthermore, the board|substrate S is prepared, and it carries in to the die bonder 10. The control part 8 mounts the board|substrate S to the board|substrate conveyance claw 51 by the board|substrate supply part 6.

(Step S52: pick up project) The control unit 8 moves the wafer ring 14 in such a way that the desired die D can be picked up from the wafer ring 14 by the wafer holding table 12, and performs positioning and surface inspection based on the data captured by the wafer recognition camera 24. examine. The control unit 8 peels the positioned die D from the dicing tape 16 by the peeling unit 13 .

The control unit 8 picks up the peeled die D from the wafer 11 by the pick-up head 21 . In this way, the die D peeled off from the dicing tape 16 is sucked and held by the chuck 22 of the pick-up head 21 to be transported to the next process (step S53 ). And when the die D is returned to the die supply unit 1 from the chuck 22 transported to the next process, the following die D is peeled off from the dicing tape 16 according to the above procedure, and then the die D is peeled off according to the same procedure. D is peeled off one by one from the dicing tape 16 .

(Step S53: Joining process) The control part 8 acquires the image of the surface of the board|substrate S before application|coating by the adhesive agent recognition camera 94, and confirms the surface to which a paste adhesive agent should be applied. If there is no problem on the surface to be coated, the control unit 8 applies the paste adhesive from the syringe 91 to the substrate S transported by the transport unit 5 . When the substrate S is a multi-lead frame, paste adhesive is applied to all the tabs. The control unit 8 uses the adhesive recognition camera 94 to reconfirm whether the adhesive paste is applied correctly after application, and inspects the applied adhesive paste. If there is no problem in coating, the control unit 8 transports the substrate S to the bonding station BS by the transport unit, and performs positioning based on the image data captured by the substrate recognition camera 44 .

The control unit 8 places the die D picked up from the wafer 11 by the pick-up head 21 on the intermediate platform 31 , picks up the die D from the intermediate platform 31 again by the bonding head 41 , and bonds it to the positioned substrate S. The control unit 8 checks whether or not the die D is bonded at a desired position based on the image data captured by the substrate recognition camera 44 .

(Step S54: Substrate unloading process) The control unit 8 takes out the substrate S of the dies D to be bonded from the substrate conveying claw 51 by the substrate carrying out unit 7 . The substrate S is unloaded from the die bonder 10 .

As mentioned above, although the invention created by the present inventors was concretely described based on the embodiment and the Example, this indication is not limited to the said embodiment and Example, Of course, various changes are possible.

For example, in the embodiment, an example of irradiating coaxial lighting and oblique light bar lighting was described, but it is not limited thereto and can be applied to different types of lighting. For example, oblique ring lighting, four-way oblique light bar lighting, dome lighting, penetrating lighting, etc. are also possible.

In addition, in the embodiment, although the example of two lighting devices was described, it is not limited to two lighting devices, and it can be applied to those who irradiate three or more plural lighting devices at the same time.

Furthermore, in the embodiment, although the example in which the adhesive agent recognition camera 94 and the substrate recognition camera 44 are the same as the multiplexed imaging devices 101 to 103 of the embodiment is described, even with the non-multiplexed imaging of other embodiments, The device 101 can also be the same.

Furthermore, in the embodiment, although the example of applying a paste-like adhesive on the substrate in the prefabricated part is described, the adhesive for bonding the die to the substrate even if the adhesive bonded to the wafer 11 and the dicing tape 16 is used A film-like adhesive material called Die Adhesive Film (DAF) may be used instead of the paste-like adhesive applied by the syringe 91 . DAF is suitable for a stacked package formed by mounting many chips on a chip on a substrate S.

Furthermore, in the embodiment, although it is described that an intermediate platform portion 3 is provided between the die supply unit 1 and the bonding unit 4, the die D picked up from the die supply unit 1 by the pick-up head 21 is placed in the middle. The platform 31 is an example where the bonding head 41 picks up the die D again from the intermediate stage 31 and bonds it to the substrate S being transported. S is also available.

10: Die bonder (die bonder) 101～103: camera device 111～113: lens 121: Coaxial lighting (the first lighting device) 122: Oblique light strip lighting (second lighting device) 200: control department

[FIG. 1] It is a plan view explaining the multiplexing of an imaging device. [ Fig. 2 ] It is a side view when viewed from the direction of arrow A in Fig. 1 . [ Fig. 3 ] is a diagram showing an illumination device used in a multiplexed imaging device. [FIG. 4] It is a flow chart explaining the composition of the captured image of the multiplexed imaging device. [FIG. 5] It is a figure which shows the captured image explaining the problem of the case where plural types of illuminations are irradiated simultaneously in the multiplexed imaging device. [ Fig. 6 ] is a graph showing an example of attenuation rate or magnification rate of the average brightness in the field of view due to the combination of illuminations used. [ Fig. 7 ] is a flow chart illustrating image synthesis in the embodiment. [ Fig. 8 ] is a diagram showing an imaging device and a lighting device in another embodiment. [ Fig. 9 ] is a flow chart illustrating image synthesis in another embodiment. [ Fig. 10 ] is a schematic plan view showing the adapter in the embodiment. [FIG. 11] It is a figure explaining the operation|movement of a pick-up head and a bonding head seen from the direction of the arrow A in FIG. 10. [ Fig. 12] Fig. 12 is a schematic cross-sectional view showing main parts of the crystal grain supply unit shown in Fig. 10 . [ Fig. 13 ] is a block diagram showing a schematic configuration of a control system of the die bonder shown in Fig. 10 . [FIG. 14] It is a flowchart which shows the manufacturing method of the semiconductor device of the die bonder shown in FIG. 10.

Claims (18)

A die bonding apparatus is configured to have: multiple cameras; A plurality of lenses installed on each of the above-mentioned plurality of imaging devices; the first lighting device; a second lighting device of a different kind from the above-mentioned first lighting device; and a control unit that controls the plurality of imaging devices, the first lighting device, and the second lighting device, The above control department irradiating light from the first illuminating device to image the object to be imaged by the plurality of imaging devices, correcting the luminances of the captured images respectively, and obtaining a first combined image combining the corrected images, irradiating light from the second illuminating device, imaging the object to be photographed by the plurality of imaging devices, correcting the luminance of the captured plurality of images, and obtaining a second combined image combining the corrected plurality of images, Adding and synthesizing the above-mentioned first combined portrait and the above-mentioned second combined portrait. The die bonding device as claimed in claim 1, wherein The above-mentioned first lighting device is coaxial lighting, and the above-mentioned second lighting device is two-directional oblique light strip lighting. The die bonding device as claimed in item 1, wherein The control unit is configured to generate the first combined image and the second combined image by projection conversion. The die bonding device as claimed in claim 1, wherein The plurality of imaging devices are fixedly arranged in a row along the width direction of the substrate above the conveyed substrate, The control unit is configured to use the plurality of imaging devices to image imaging objects of a plurality of bonding regions located in a row along the width direction on the substrate. Such as the die bonding device of claim 4, wherein The control unit is configured to transport the substrate in the longitudinal direction of the substrate and image the imaging target object in the plurality of bonding regions in the next row with the plurality of imaging devices. Such as the die bonding device of claim 5, wherein The object to be photographed is a paste adhesive coated on the substrate. Such as the die bonding device of claim 5, wherein The object to be imaged is the substrate or a die bonded to an already bonded die. A method of manufacturing a semiconductor device, comprising: The importing process includes a plurality of imaging devices fixedly arranged in a row along the width direction of the substrate above the substrate, a plurality of lenses installed on each of the plurality of imaging devices, and the first lighting device, and a die bonding device of a second lighting device of a type different from the first lighting device described above, loaded into the substrate; and Imaging engineering, which is to image the imaging object of the plurality of bonding areas located on the above-mentioned substrate, The above camera project includes: Light is irradiated from the above-mentioned first illuminating device, and the image-capturing objects of the plurality of joining regions along the one row in the width direction are imaged by the plurality of imaging devices, and the luminances of the captured plurality of images are respectively corrected to obtain a combined and corrected image. The works of the first combined portrait of the portrait; and Light is irradiated from the second illuminating device, and the above-mentioned object to be imaged is imaged by the plurality of image-capturing devices in the plurality of bonded regions along one row in the width direction, and the luminances of the imaged plural images are respectively corrected to obtain combined and corrected images. The engineering of the second joint image of the plurality of images; and A process of adding and synthesizing the above-mentioned first combined image and the above-mentioned second combined image. The method of manufacturing a semiconductor device according to Claim 8, wherein The above-mentioned first lighting device is coaxial lighting, and the above-mentioned second lighting device is two-directional oblique light strip lighting. The method of manufacturing a semiconductor device according to Claim 8, wherein The above-mentioned first combined image and the above-mentioned second combined image are generated by projection transformation. The method of manufacturing a semiconductor device according to Claim 8, wherein In the imaging process, the substrate is transported in the longitudinal direction of the substrate, and the imaging target of the plurality of bonding regions in the next row is imaged by the plurality of imaging devices. The method of manufacturing a semiconductor device according to any one of claims 8 to 11, wherein It is further equipped with the process of coating the paste adhesive on the above-mentioned substrate, The object to be imaged is the applied paste adhesive. The method of manufacturing a semiconductor device according to any one of claims 8 to 11, wherein further possesses the process of bonding dies to the above-mentioned substrates or dies that have been bonded, The object to be imaged is the bonded crystal grain. A die bonding apparatus is configured to have: camera device; a lens, which is arranged on the above-mentioned imaging device; the first lighting device; a second lighting device of a different kind from the above-mentioned first lighting device; and a control unit that controls the imaging device, the first lighting device, and the second lighting device, The above control department irradiating light from the first illuminating device to capture an image of an object to be imaged by the imaging device to obtain a first corrected image in which the brightness of the captured image is corrected, irradiating light from the second illuminating device, imaging the object to be imaged by the imaging device, and obtaining a second corrected image in which the brightness of the captured image is corrected, A synthetic image is generated by adding and synthesizing the first corrected image and the second corrected image. The die bonding device as claimed in claim 14, wherein The imaging device is arranged so as to be able to move above the conveyed substrate along the width direction of the substrate, The control unit is configured to move the imaging device to sequentially image imaging objects in a plurality of bonding regions located in a row along the width direction on the substrate. The die bonding device according to claim 15, wherein The above control department irradiating light from the first illuminating device and sequentially imaging the object to be imaged by the imaging device to obtain a first corrected image in which the brightness of the plurality of captured images is respectively corrected, The imaging device sequentially captures images of the imaging objects by irradiating light from the second illuminating device, and obtains second corrected images obtained by correcting the luminances of the captured images. The die bonding device according to claim 15, wherein The control unit is configured to transport the substrate in the longitudinal direction of the substrate and image the plurality of joining regions in the next row with the plurality of imaging devices. The die bonding device as claimed in claim 14, wherein The above-mentioned first lighting device is coaxial lighting, and the above-mentioned second lighting device is two-directional oblique light strip lighting.

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