TW202601838A - Semiconductor manufacturing apparatus and method for manufacturing semiconductor device - Google Patents

Abstract

[Problem] To provide a technology that can improve the accuracy of positioning. [Solution] A semiconductor manufacturing apparatus includes: an imaging device having a first camera for photographing a substrate having a tab area with mounted chips and a reference mark, a second camera for photographing the reference mark, and a lens portion; and a coaxial illumination device. The aforementioned lens portion has a first lens that functions as an objective lens for the first camera, a second lens that functions as an objective lens for the second camera, and a beam splitter that branches reflected light from the photographed object to the first lens and the second lens.

Description

Semiconductor manufacturing apparatus and method for manufacturing semiconductor device

This disclosure relates to semiconductor manufacturing apparatus, such as a die bonding apparatus applicable to treating dies or substrates with location identification markings.

As part of the semiconductor device manufacturing process, dies are picked up from the wafer and bonded to a substrate. For example, sometimes an image is captured by a camera of the die and substrate, and the die and substrate are positioned based on that image. [Prior Art Documents] [Patent Documents]

[Patent Document 1] Japanese Patent Application Publication No. 2022-98312

[Problem to be Solved by the Invention] For example, in the aforementioned positioning, sometimes the edge of the position identification mark formed on the substrate or die is used as a reference position. In this case, it is sometimes difficult to obtain the position of the edge (reference position) with good accuracy.

The problem disclosed herein lies in providing a technique that can improve positioning accuracy. Other problems and novel features will become clear from the description and diagrams in this manual. [Means used to solve the problem]

A brief summary of representative embodiments of this disclosure is as follows: Specifically, a semiconductor manufacturing apparatus includes: an imaging device having a first camera for photographing a substrate having a tab area with mounted chips and reference marks, a second camera for photographing the aforementioned reference marks, and a lens portion; and a coaxial illumination device. The aforementioned lens portion has a first lens acting as an objective lens for the aforementioned first camera, a second lens acting as an objective lens for the aforementioned second camera, and a beam splitter that branches reflected light from the photographed object to the aforementioned first lens and the aforementioned second lens. [Invention Benefits]

According to the disclosure, the accuracy of positioning can be improved.

The following explanations, including embodiments and variations, will use diagrams. In these explanations, the same symbols may be used to label the same constituent elements, omitting repetitive descriptions. Furthermore, to make the explanations clearer, the width, thickness, shape, etc., of each part may be schematically represented rather than the actual appearance. Additionally, the dimensional relationships and ratios of elements may not be consistent across multiple diagrams.

The configuration of a die bonding device according to one embodiment of the device will be explained using Figures 1 and 2. Figure 1 is a schematic top view illustrating an example configuration of the die bonding device in the embodiment. Figure 2 is a diagram illustrating the schematic configuration as seen from the direction of arrow A in Figure 1.

The die bonding apparatus 1, generally speaking, includes: a wafer supply unit 10; a pick-up unit 20; an intermediate stage unit 30; a bonding unit 40; a transport unit 50; a substrate supply unit 60; a substrate removal unit 70; and a control unit (control device) 80. The Y2-Y1 direction is the front-to-back direction of the die bonding apparatus 1, the X2-X1 direction is the left-to-right direction, and the Z1-Z2 direction is the up-and-down direction. The wafer supply unit 10 is disposed on the front side of the die bonding apparatus 1, and the bonding unit 40 is disposed on the rear side.

The wafer supply unit 10 includes: a wafer cassette lifter 11; a wafer holding stage 12; a stripping unit 13; and a wafer identification camera 14.

The wafer cassette lifter 11 moves the wafer cassette (not shown) storing a plurality of wafer rings (WRs) up and down to the wafer transport height. The wafer alignment slot (not shown) aligns the wafer rings (WRs) supplied from the wafer cassette lifter 11. The wafer extractor (not shown) removes the wafer rings (WRs) from the wafer cassette and supplies them to the wafer holding stage 12, from which they are removed and stored in the wafer cassette.

A wafer W, divided into a plurality of dies D, is bonded (attached) to a dicing tape DT. The dicing tape DT is held by a wafer ring WR. The wafer W is, for example, a semiconductor wafer, a glass wafer, etc., and the dies D are semiconductor wafers, glass wafers, etc. Alternatively, a film-like adhesive material DF, called a die-attach film (DAF), can be attached between the wafer W and the dicing tape DT. The adhesive material DF hardens upon heating.

The wafer holding stage 12 moves along the X1-X2 and Y1-Y2 directions using a drive unit (not shown) to move the picked-up die D to the position of the peeling unit 13. Furthermore, the wafer holding stage 12 rotates the wafer ring WR in the XY plane using a drive unit (not shown). The peeling unit 13 moves vertically using a drive unit (not shown). The peeling unit 13 peels the die D from the dicing tape DT.

The wafer identification camera 14 identifies the pickup position of the die D picked up from the wafer W, or performs surface inspection of the die D.

The pickup unit 20 includes a pickup head 21 and a pickup head stage 23. The pickup head 21 has a clamping portion 22 that holds the peeled die D at its top. The pickup head 21 picks up the die D from the wafer supply unit 10 and places it on the intermediate stage 31. The pickup head stage 23 moves the pickup head 21 in the Z1-Z2, Y1-Y2, and X1-X2 directions. Additionally, the pickup head stage 23 can also rotate the pickup head 21.

The intermediate stage 30 includes: an intermediate stage 31 for mounting a die D; and a stage recognition camera 34 for identifying the die D on the intermediate stage 31. The intermediate stage 31 has an attraction hole for adsorbing the mounted die D. The mounted die D is temporarily held by the intermediate stage 31. The intermediate stage 31 serves as both a platform for mounting the die D and a pickup stage for picking up the die D.

The bonding portion 40 includes: a bonding head 41; a bonding head stage 43; a substrate identification camera 44; and a bonding platform 46. The bonding head 41 has a clamping portion 42 for holding the die D at its top. The bonding head stage moves the bonding head 41 in the Z1-Z2, Y1-Y2, and X1-X2 directions. The bonding head stage 43 can also rotate the bonding head 41. The substrate identification camera 44 captures an image of the substrate S and identifies the bonding position. Here, the substrate S may include, for example, a wiring substrate, a lead frame, or a glass substrate. A plurality of product regions (hereinafter referred to as packaging regions P) are formed on the substrate S to form the final package. Furthermore, a position identification mark (not shown) for the packaging regions P is formed on the substrate S. The bonding stage 46 is raised when the die D is placed on the substrate S, supporting the substrate S from below. The bonding stage 46 has a suction port (not shown) for vacuum adsorption of the substrate S, which can fix the substrate S. The bonding stage 46 has a heating section (not shown) for heating the substrate S.

With this configuration, the bonding head 41 corrects the pickup position and posture based on the image data from the stage recognition camera 34, and picks up the die D from the intermediate stage 31. Furthermore, the bonding head 41 is bonded to the packaging area P of the substrate S based on the image data from the substrate recognition camera 44, or is bonded in the form of stacking on the die already bonded to the packaging area P of the substrate S.

The conveying unit 50 includes a conveying claw 51 for gripping and conveying a substrate S, and a conveying channel 52 for moving the substrate S. The substrate S is moved in the X1 direction by a nut (not shown) provided on the conveying claw 51 in the conveying channel 52, which is driven by a ball screw (not shown) provided along the conveying channel 52. With this configuration, the substrate S moves from the substrate supply unit 60 along the conveying channel 52 to the engagement position, and after engagement, moves to the substrate delivery unit 70, where the substrate S is handed over.

The substrate supply unit 60 takes the substrate S stored and moved into the transport fixture from the transport fixture and supplies it to the transport unit 50. The substrate removal unit 70 stores the substrate S transported by the transport unit 50 in the transport fixture.

Next, the control unit 80 will be explained using FIG3. FIG3 is a block diagram illustrating the schematic configuration of the control system of the die bonding device shown in FIG1.

The control system 8 includes a control unit (control device) 80, a driver unit 86, a signal unit 87, and an optical system 88. The control unit 80 is generally configured as a computer, which includes a control and calculation device 81 mainly composed of a CPU (Central Processing Unit), a memory device 82, an input/output device 83, bus cables 84, and a power supply unit 85. The memory device 82 includes a main memory device 82a and an auxiliary memory device 82b. The main memory device 82a is configured with RAM (Random Access Memory) that stores processing programs, etc. The auxiliary memory device 82b is configured to store control data, image data, etc., required for control, such as HDD (Hard Disk Drive) or SSD (Solid State Drive). Furthermore, the control unit 80 is equipped with an external memory device that can be connected.

The input/output device 83 includes: a monitor 83a that displays device status, information, etc.; a touch panel 83b that inputs operator instructions; a pointing device such as a mouse 83c that operates the monitor 83a; and an image acquisition device 83d that acquires image data from the optical system 88. The input/output device 83 further includes a motor control device 83e and an I/O signal control device 83f. The motor control device 83e controls the drive units 86 of the wafer supply section 10, including the XY stage (not shown), the pick-up head 23, and the bonding head 43. The I/O signal control device 83f receives signals from various sensors in the signal unit 87, or controls switches, knobs, valves, etc., that control the brightness of illumination devices, etc., in the signal unit 87. The optical system 88 includes a wafer identification camera 14, a stage identification camera 34, and a substrate identification camera 44. The wafer identification camera 14, stage identification camera 34, and substrate identification camera 44 digitize light intensity and color. The control and calculation device 81 receives and processes necessary data via bus 84, and transmits information to the control of the pickup head 21, the monitor 83a, etc.

The control unit 80 stores image data captured by the wafer identification camera 14, the stage identification camera 34, and the substrate identification camera 44 in the memory device 82 via the image acquisition device 83d. Using software programmed based on the stored image data, the control and calculation device 81 performs positioning of the die D and the packaging area P of the substrate S, as well as an appearance inspection of the die D and the substrate S. Based on the position of the die D and the packaging area P of the substrate S calculated by the control and calculation device 81, the drive unit 86 is driven via the motor control device 83e using the software. Using this procedure, the die on the wafer is positioned, the pickup head 23 and the bonding head 43 are activated, and the die D is bonded to the packaging area P of the substrate S.

The control unit 80 is configured to install the aforementioned program stored in an external memory device onto a computer. The external memory device includes, for example, an HDD, USB memory, or SSD. The auxiliary memory device 82b and the external memory device constitute a computer-readable recording medium. Hereinafter, these will be referred to collectively only as recording media. When the term "recording media" is used in this specification, it includes: only the auxiliary memory device 82b unit; only the external memory device unit; or both. In addition, the provision of programs and data to computers and the provision of programs and data from computers to external devices can also be carried out using communication means such as the Internet and dedicated lines without the use of external memory devices.

A portion of the semiconductor device manufacturing process (semiconductor device manufacturing method) using the die bonding device 1 will be explained using FIG4. FIG4 is a flowchart illustrating the semiconductor device manufacturing method using the die bonding device shown in FIG1. In the following explanation, the operation of each part constituting the die bonding device 1 is controlled by the control unit 80.

(Wafer loading procedure: Procedure S1) The wafer cassette containing the wafer ring WR is loaded into the wafer cassette lift 11. The loaded wafer ring WR is then fed (loaded) into the wafer holding stage 12.

(Substrate loading procedure: Procedure S2) A transport fixture storing substrate S is loaded into substrate supply unit 60. In substrate supply unit 60, substrate S stored in the transport fixture is removed from the transport fixture. And, it is supplied (loaded) to joint unit 40 via transport unit 50.

(Pickup Procedure: Procedure S3) After Procedure S1, the wafer holding stage 12 is moved in a manner that allows the desired die D to be picked up from the dicing tape DT. The die D is photographed using the wafer recognition camera 14, and the die D is positioned and its surface inspected based on the image data obtained from the photograph. Image processing is performed on the image data to calculate the offset (X, Y, θ directions) of the die D on the wafer holding stage 12 from the die position reference point of the die bonding device, and the position is then determined. Furthermore, the die position reference point is pre-set at a predetermined position on the wafer holding stage 12 as the initial setting of the device. Image processing is performed on the image data to inspect the surface of the die D.

The positioned grain D is peeled off from the cutting strip DT using the peeling unit 13 and the pick-up head 21. The grain D peeled off from the cutting strip DT is adsorbed and held by the clamping part 22 provided in the pick-up head 21, and then transported and placed on the intermediate stage 31.

A stage recognition camera 34 is used to photograph the die D on the intermediate stage 31. Based on the image data obtained from the photograph, the die D is positioned and its surface is inspected. Image processing is performed on the image data to calculate the offset (X, Y, θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonding device, and the die D is positioned accordingly. In addition, the die position reference point is pre-set with a predetermined position of the intermediate stage 31 as the initial setting of the device. Image processing is performed on the image data to inspect the surface of the die D.

The pick-up head 21, which transports die D to the intermediate stage 31, is returned to the wafer supply section 10. Following the above sequence, the next die D is peeled off from the dicing tape DT, and then, following the same sequence, dies D are peeled off one at a time from the dicing tape DT.

(Bonding Procedure: Procedure S4) The substrate S is transported to the bonding stage 46 via the transport unit 50. The substrate S, placed on the bonding stage 46, is imaged using the substrate recognition camera 44, and image data is acquired. The image data is processed to calculate the offset (X, Y, θ directions) of the substrate S from the substrate position reference point of the die bonding device 1. Furthermore, the substrate position reference point is pre-set with a predetermined position of the bonding portion 40 as the initial setting of the device.

Based on the offset of the die D on the intermediate stage 31 calculated in program S3, the adsorption position of the bonding head 41 is corrected, and the die D is adsorbed by the clamping part 42. Using the bonding head 41 that has adsorbed the die D from the intermediate stage 31, the die D is bonded to a predetermined position on the substrate S supported by the bonding stage 46. The substrate recognition camera 44 takes a picture of the die D bonded to the substrate S, and based on the image data obtained by the camera, checks are performed to see if the die D is bonded to the desired position (relative position check of the die D and the substrate S), etc.

The die D is bonded to the substrate S via the bonding head 41 and then returned to the intermediate stage 31. In the same sequence, the next die D is picked up from the intermediate stage 31 and bonded to the substrate S. This process is repeated until the die D is bonded to all the packaging areas P of the substrate S.

(Substrate removal procedure: Procedure S5) Using the transport unit 50, the substrate S with the bonded die D is transported from the bonding unit 40 to the substrate removal unit 70. At the substrate removal unit 70, the substrate S is removed and stored in the transport fixture, and the substrate S is removed. The transport fixture storing the substrate S is removed from the die bonding device 1.

As described above, die D is mounted on substrate S and removed from die bonding device 1. Then, for example, a transport fixture storing substrate S with die D mounted is transported to a wire bonding process, where the electrodes of die D are electrically connected to the electrodes of substrate S via Au metal wires, etc. Furthermore, substrate S is transported to a molding process, where die D and Au metal wires are sealed with molding resin (not shown), thereby completing semiconductor packaging.

Next, the optical system for the joint 40 will be explained using FIG5. FIG5 is a diagram illustrating an example of the optical system for the joint.

The substrate recognition camera 44, which serves as an imaging device, includes a first camera 441, a second camera 442, and a lens 443 on which the first camera 441 and the second camera 442 are mounted. The first camera 441 and the second camera 442 are configured to capture images of the main surface (surface, upper surface) of the substrate S or the main surface of the grain D bonded to the substrate S through the lens 443. An illumination device 45 is disposed between the lens 443 and the substrate S, etc. The first camera 441 and the illumination device 45 are disposed directly above the packaging area P of the substrate S, which is the object of imaging (the object being photographed).

The lens section 443 includes a first lens 443a and a second lens 443b. The lens section 443 further includes a semi-reflective mirror (beam splitter) 443c disposed between the first lens 443a and the illumination device 45, and a reflector 443d disposed between the second camera 442 and the second lens 443b. The components of the lens section 443 can also be housed within a lens barrel (body), with the first camera 441 and the second camera 442 respectively fixed within the lens barrel.

For example, the first camera 441 is a camera that photographs the subject at low magnification (low resolution). The second camera 442 is a camera that photographs the subject at high magnification (high resolution). Here, "low magnification" refers to a magnification that provides a sufficient field of view for positioning. "High magnification" refers to a magnification that provides a pixel resolution capable of detecting the edges of the reference lines described later with high precision. Alternatively, while the first camera 441 photographs the subject at high magnification (high resolution), the second camera 442 can also be a camera that photographs the subject at low magnification (low resolution).

The first lens 443a is an objective lens disposed between the first camera 441 and the semi-reflective mirror 443c. The second lens 443b is an objective lens disposed between the reflector 443d and the semi-reflective mirror 443c. The semi-reflective mirror 443c splits the light (optical axis OA) incident from the Z2 side onto the Z1 side into transmitted light (optical axis OA1) towards the Z1 side and reflected light (optical axis OA2) towards the X1 side. The reflector 443d reflects the reflected light from the semi-reflective mirror 443c back to the Z1 side.

The pixel count of the first camera 441 and the second camera 442 is, for example, 300,000 to 60,000,000 pixels. For example, if the first camera 441 and the second camera 442 have the same pixel count, the magnification of the first lens 443a is set to be smaller than that of the second lens 443b. Accordingly, the resolution of the first camera 441 is smaller than that of the second camera 442. If the pixel count of the first camera 441 is smaller than that of the second camera 442, the magnification of the first lens 443a and the second lens 443b is set to be the same. Accordingly, the resolution of the first camera 441 is smaller than that of the second camera 442.

The illumination device 45 includes a surface-emitting illumination (light source) 451 and a semi-reflective mirror 452 inside the lens barrel. Irradiation light from the surface-emitting illumination 451 is reflected by the semi-reflective mirror 452 along the same optical axis as the first camera 441 and the second camera 442, illuminating the substrate S, etc. Light illuminating the substrate S along the same optical axis OA as the first camera 441 and the second camera 442 is reflected by the substrate S, etc., and the reflected light passes through the semi-reflective mirror 452 to reach the first camera 441 and the second camera 442, forming an image of the substrate S, etc. That is, the illumination device 45 has the function of coaxial incident illumination (coaxial lighting).

Next, the reference positions used for positioning, etc., will be explained using Figure 6. Figure 6 is a diagram showing the position identification marks and bonding centers provided on the substrate.

A position identification mark M is provided in each packaging area P of the substrate S. At least one position identification mark M is provided on the outer side of the area (tabe area) where the die D is mounted. Alternatively, in the case of layer bonding, the position identification mark M is sometimes provided on the die D. The position identification mark M is, for example, constructed as a reference lead. When bonding the dies, the coordinates of the bonding center _CB are sometimes represented by the distance (dx, dy) from the edge (edge, boundary, reference position) of the reference lead. Sometimes the reference lead is simply referred to as the lead LE. Alternatively, the coordinates of the bonding center _CB are sometimes represented by the distance from the center _CM of the reference lead. The reference position of the position identification mark M can be the centerline of the lead width direction, or the center or centroid of the position identification mark M. In addition, for the reference on the D side of the die, sometimes the coordinates of the corner of the bonding pad or the center of the bonding pad of the die D are used instead of the coordinates of the bonding center _CB .

In this case, the die bonding device needs to use image processing to measure the width and center of the lead LE and other edges to determine the coordinates of the reference position. Even if the reference is any one of the edge, center, or center line of the reference lead, the substrate recognition camera 44 needs to use a high-magnification lens to achieve high pixel resolution in order to more accurately detect the position of the edge of the lead LE and other edges.

On the other hand, the substrate identification camera 44 performs identification (positioning) of the bonding position and surface inspection of the die or substrate S, so it is necessary to use a low magnification lens to create a wide field of view that includes at least one packaging area P.

The first camera 441 can photograph the die D and the substrate S at low magnification, while the second camera 442 can photograph the position identification mark M at high magnification. The first camera 441 can at least photograph an area including the protruding region and the position identification mark M located on the outer side of the protruding region. The second camera 442 photographs the position identification mark M. Accordingly, the substrate identification camera 44 can solve the two problems mentioned above.

Next, a method for more accurately detecting the position of the edge of the lead LE will be explained.

First, the lead LE and the lighting device will be explained. Figure 7 is a cross-sectional view of the substrate with the lead. Figure 8 is a diagram showing the relationship between the lead and the lighting device shown in Figure 7.

As shown in Figure 7A, the surface (upper surface) of the lead LE can be flush with (at the same height) the surface (upper surface) of the substrate S. However, the surface of the lead LE is sometimes not flush with the surface of the substrate S. The surface of the lead may protrude or be recessed from the surface of the substrate S, and the side may sometimes be curved. For example, as shown in Figure 7B, the lead LE is sometimes convex relative to the surface of the substrate S, and the side is curved.

As shown in Figure 7B, even when observed at high magnification, when using coaxial illumination with near-parallel light as the illumination device 45, as shown in Figure 8A, only the flat portion of the upper surface of the lead LE becomes bright, so only the flat portion of the upper surface of the lead LE can be observed.

It can also be used as an oblique illumination device 45 by illuminating the side of the lead LE. However, the reflected light from the lead LE has a high specular reflection component, so as shown in Figure 8B, only the edge of the lead LE becomes brighter, and only the side of the lead LE is emphasized, making it difficult to detect the edge in image processing. The reason is that the density distribution (brightness: BR) on the side of the lead LE becomes a pair of pulses, and the density distribution is better as a rectangular wave.

Next, a suitable lighting device for lead LE of B as shown in FIG. 7 will be described using FIG. 9. FIG. 9 is a diagram illustrating the lighting device in the embodiment.

As shown in Figure 9A, it is preferable to use a surface-emitting coaxial lighting device as shown in Figure 5 as the lighting device 45. Alternatively, as shown in Figure 9B, it is preferable to combine the coaxial lighting device 453 with the hemispherical lighting device 454 as the lighting device 45. The coaxial lighting device 453 can also be a surface-emitting coaxial lighting device as shown in Figure 5, or it can be a parallel light type or a near-parallel light coaxial lighting device. The hemispherical lighting device 454 has an opening in the center of its top, and the coaxial lighting device 453 is provided above the opening. The surface-emitting coaxial lighting and the hemispherical lighting can capture a large incident light NA (the range of light reaching the point on the subject) when viewed from the subject, so the light can also illuminate the side of the lead LE.

At this point, it is best to determine the incident light NA based on the following considerations: Illuminate a range that is wider than the incident light NA determined by these conditions.

(a) Horizontal distance from the edge of lead LE to the point where the bend begins (d shown in Figure 7B) (b) Inclination of the side portion of lead LE (θ shown in Figure 7B) (c) Light intensity of reflected light on the surface of lead LE

The positioning method is illustrated using Figures 10 and 11. Figure 10 illustrates the teaching action. Figure 11 illustrates the production action.

The localization algorithm primarily employs pattern matching when using a template model (a search algorithm using template matching), utilizing model matching methods such as the commonly known Normalized Cross Correlation (NCC) and geometric search. The result is then expressed as a consistency rate. Template matching includes both the teaching actions of benchmark learning and the production actions of product assembly.

The following explanation uses substrate positioning as an example. The teaching action is a pre-operation performed before the die bonding process shown in Figure 4.

The control unit 80 uses the first camera 441 of the substrate recognition camera 44 to photograph the reference substrate S and obtain the image PCr shown in FIG10. The second camera 442 of the substrate recognition camera 44 photographs the position recognition mark M formed on the reference substrate S and obtains the image.

The operator of the die bonding device uses a human-machine interface (touch panel 83b, mouse 83c) to select a unique region UA containing a characteristic pattern from the image PCr. Here, the characteristic pattern of the unique region UA is, for example, a position identification mark M. Although the position identification mark M is shown as a cross shape, it is not limited to this. For example, a wiring (lead) containing a characteristic pattern (e.g., an L-shaped pattern) formed on the substrate S, such as the circular lead shown in FIG10, can also be used as a position identification mark M.

The control unit 80 stores the positional relationship (coordinates) between the selected unique region UA and the reference substrate S in the memory device 82. For example, it stores the position coordinates of the reference on the grain side of the reference substrate S, such as the bonding center C _B , relative to the reference position of the position identification mark M (see FIG6).

The control unit 80 stores the image of the unique region UA that serves as the reference (hereinafter referred to as the template image PT) and its coordinates in the memory device 82. For example, the template image PT includes an image of a position identification mark M. The coordinates of the stored template image PT are the reference position calculated based on the position coordinates of the center C _M of the position identification mark M calculated from the image of the position identification mark M and the line width of the reference line constituting the position identification mark M (see Figure 6).

Next, the production operations in the grain bonding process shown in Figure 4 will be explained.

In program S4, the control unit 80 uses the first camera 441 of the substrate identification camera 44 to capture an image of the product substrate S, as shown in FIG11.

As shown in Figure 11, the control unit 80 compares the saved template image PT with the acquired image PCn of the product substrate S using a teaching action, and calculates the coordinates of the image PTn of the most similar part.

The control unit 80 compares the coordinates of the image PTn with the coordinates measured by the reference substrate S and calculates the position of the product substrate S (the offset between the image PTn and the template image PT).

Next, the effects of this implementation method will be explained.

Imaging systems used for positioning can achieve the positioning performance required for bonding accuracy even at pixel resolutions greater than the reproducibility bonding accuracy, thanks to statistical calculations in image processing. However, this only achieves reproducibility accuracy. To accurately mount the die to the desired mounting location, it is necessary to feed back the offset measured by an offline system after temporary bonding. While this system can guarantee bonding reproducibility, it is difficult to detect the workpiece's reference surface (e.g., the edge of the reference lead, called the reference edge) at a resolution below pixel resolution. Therefore, it is difficult to implement a teaching action specifying the offset from the reference surface.

Therefore, increasing the magnification to achieve high pixel resolution can solve the above problem. However, high magnification leads to a narrower field of view, making it impossible to obtain a sufficient field of view for positioning.

High magnification and a wide field of view can be achieved by using zoom lenses or a dual-lens optical system. However, the following problems exist.

While zoom lenses can solve the aforementioned problems due to their automatic magnification changes, zoom lenses with drive systems are affected by the accuracy of field-of-view position reproduction during magnification switching. In other words, when returning to the original magnification after a change, mechanical movement errors are included, resulting in no 100% coordinate reproduction. Consequently, the offset between the template model used for positioning and the reference edge will contain variations. Furthermore, while using multiple cameras with different magnifications can solve the problem, this may result in any one camera losing its straightness relative to the workpiece (the optical axis will tilt).

When implemented in this manner, at least one of the following effects is achieved.

(a) By setting the two cameras with the same optical axis, a high degree of reproducibility of the field of view position can be maintained when switching.

(b) It enables more precise detection of the reference edge using a high-magnification optical system. This allows for accurate detection of offsets in the template model at the reference edge, thus improving the accuracy of reference edge detection.

(c) It can perform positioning using a pattern matching optical system with a wide field of view (low magnification).

(d) Using the above method, the offset between the reference position specified at high magnification and the model registered at low magnification can be obtained stably (the offset can still be obtained accurately after re-teaching).

(e) Off-line offset measurement becomes unnecessary.

<Variations> Several representative variations of the embodiments are illustrated below. In the descriptions of the following variations, parts having the same structure and function as those described in the above embodiments shall be treated with the same symbols as those used in the above embodiments. Furthermore, the descriptions of such parts shall be deemed to be derived from the descriptions in the above embodiments, to the extent that they do not contradict each other technically. In addition, a portion of the above embodiments and all or part of the variations may be applied in combination, to the extent that they do not contradict each other technically.

The arrangement of the reflector and lens in the lens section 443 can also be changed. Furthermore, the arrangement of the camera can also be changed. Moreover, the arrangement of the lighting device can also be changed. These will be explained below.

(First Variation) The optical system in the first variation will be explained using FIG12. FIG12 is a diagram illustrating the configuration of the optical system at the joint in the first variation.

In the first variation, the reflector 443d is disposed on the Z1 side of the first lens 443a. Furthermore, the arrangement of the first lens 443a, the second lens 443b, and the semi-reflective mirror 443c is the same as in the embodiment. The first camera 441 is disposed on the X1 side of the reflector 443d. The second camera 442 is disposed on the X1 side of the second lens 443b. The semi-reflective mirror 443c, as in the embodiment, splits light incident from the Z2 side onto the Z1 side into transmitted light towards the Z1 side and reflected light towards the X1 side. The reflector 443d reflects the transmitted light from the semi-reflective mirror 443c to the X1 side.

(Second Variation) The optical system in the second variation will be explained using FIG13. FIG13 is a diagram illustrating the configuration of the optical system at the joint in the second variation.

In the second variation, mirror 443d is not provided. The arrangement of the first lens 443a, the second lens 443b, and the semi-reflective mirror 443c is the same as in the embodiment. A first camera 441 is located on the Z1 side of the first lens 443a. A second camera 442 is located on the X1 side of the second lens 443b. The semi-reflective mirror 443c, as in the embodiment, splits light incident from the Z2 side onto the Z1 side into transmitted light towards the Z1 side and reflected light towards the X1 side.

(Third Variation) The optical system in the third variation will be explained using FIG14. FIG14 is a diagram illustrating the configuration of the optical system at the joint in the third variation.

In the third variation, the second lens 443b is disposed between the second camera 442 and the reflector 443d. Other configurations and embodiments are the same.

(Fourth Variation) The optical system in the fourth variation will be explained using FIG15. FIG15 is a diagram illustrating the configuration of the optical system at the joint in the fourth variation.

In the fourth variation, the illumination device 47 is inserted into the lens portion 443 in the second variation. The illumination device 47 is an insert-type coaxial illumination, wherein the insert-type coaxial illumination has a light source 471 and a semi-reflective mirror 472 disposed between the semi-reflective mirror 443c and the second lens 443b. The light source 471 can be parallel light or diffused light.

(Fifth Variation) The optical system in the fifth variation will be explained using FIG16. FIG16 is a diagram illustrating the configuration of the optical system at the joint in the fifth variation.

In the fifth variation, the illumination device 47 is inserted into the lens portion 443 in the second variation. The illumination device 47 is an insert-type coaxial illumination, wherein the insert-type coaxial illumination has a light source 471 and a semi-reflective mirror 472 disposed between the semi-reflective mirror 443c and the first lens 443a. The light source 471 can be parallel light or diffused light.

The above describes the disclosure made by the discloser in detail according to the implementation method and variations. However, this disclosure is not limited to the above implementation method and variations, and various changes are self-evident.

Alternatively, a lens with a magnetic field (NA) capable of precisely detecting the leading edge of the lead can be used. Accordingly, even when using a coaxial illumination device with parallel or near-parallel light, illumination light can still be shone onto the side of the lead.

While an example of using a die-attach film has been described in the embodiment, it is also possible to install a preforming section for coating adhesive on a substrate without using a die-attach film. The preforming section includes a preforming head for coating a paste-like adhesive and a preforming table for driving the preforming head in the vertical and horizontal directions.

In the embodiment, a die bonding device is described as follows: a die is picked up from a wafer supply section by a pick-up head and placed on an intermediate stage, and the die placed on the intermediate stage is bonded to a substrate by a bonding head. However, it is not limited to this, and a die bonding device that picks up a die from a wafer supply section by a bonding head and bonds it to a substrate can also be applied.

For example, it can also be applied to die bonding devices that bond the wafer supply die to the substrate with a bonding head without an intermediate stage or pick-up head.

In addition, it can also be applied to the following flip chip bonders: without an intermediate stage, picking up the die from the wafer supply section, flipping the pick-up head up and down to transfer the die to the bonding head, and bonding the die to the substrate.

While the implementation method is explained using a die bonding device as an example, it can also be applied to an actual device that adsorbs and picks up a workpiece and places the picked-up workpiece on a substrate or the like.

1: Die bonding device (semiconductor manufacturing device) 44: Substrate recognition camera (camera device) 441: First camera 442: Second camera 443: Lens section 443a: First lens 443b: Second lens 443c: Semi-reflective mirror (beam splitter) 45: Illumination device

[Figure 1] Figure 1 is a schematic top view illustrating an example of the configuration of the die bonding apparatus in the embodiment. [Figure 2] Figure 2 is a diagram illustrating the schematic configuration when viewed from the direction of arrow A in Figure 1. [Figure 3] Figure 3 is a block diagram illustrating the schematic configuration of the control system of the die bonding apparatus shown in Figure 1. [Figure 4] Figure 4 is a flowchart illustrating a method for manufacturing a semiconductor device using the die bonding apparatus shown in Figure 1. [Figure 5] Figure 5 is a diagram illustrating an example of the optical system of the bonding portion. [Figure 6] Figure 6 is a diagram illustrating the position identification mark and bonding center provided on the substrate. [Figure 7] Figure 7 is a diagram illustrating a cross-section of a substrate with leads. [Figure 8] Figure 8 is a diagram illustrating the relationship between the lead wire and the lighting device shown in Figure 7. [Figure 9] Figure 9 is a diagram illustrating the lighting device in the embodiment. [Figure 10] Figure 10 is a diagram illustrating the teaching operation. [Figure 11] Figure 11 is a diagram illustrating the production operation. [Figure 12] Figure 12 is a diagram illustrating the configuration of the optical system of the joint in the first variation. [Figure 13] Figure 13 is a diagram illustrating the configuration of the optical system of the joint in the second variation. [Figure 14] Figure 14 is a diagram illustrating the configuration of the optical system of the joint in the third variation. [Figure 15] Figure 15 is a diagram illustrating the configuration of the optical system of the joint in the fourth variation. [Fig. 16] Fig. 16 is a diagram illustrating the configuration of the optical system at the joint in the fifth variation.

44: Substrate Identification Camera (Video Camera)

45: Lighting Devices

441: The First Camera

442: Second Camera

443: Lens section

443a: First Lens

443b: Second Lens

443c: Partial Reflector (Beam Splitter)

443d: Mirror

451: Luminous Illumination

452: Semi-reflective mirror

OA, OA1, OA2: Optical axis

P: Each packaging area Packaging areas

S:Substrate

Claims (8)

A semiconductor manufacturing apparatus includes: an imaging device having a first camera for photographing a substrate having a tab area with mounted chips and a reference mark, a second camera for photographing the reference mark, and a lens portion; and a coaxial illumination device; the lens portion having: a first lens that functions as an objective lens for the first camera; a second lens that functions as an objective lens for the second camera; and a beam splitter that splits reflected light from a photographed object to the first lens and the second lens. As in the semiconductor manufacturing apparatus of claim 1, wherein, the aforementioned beam splitter is configured to split the aforementioned reflected light from the aforementioned photographed object into vertically upward transmitted light and horizontally reflected light, and the aforementioned coaxial illumination device is provided on the side of the substrate closer to the aforementioned lens portion. As in the semiconductor manufacturing apparatus of claim 1, wherein the aforementioned beam splitter is configured to split the aforementioned reflected light from the aforementioned photographed object into vertically upward transmitted light and horizontally reflected light, and the aforementioned coaxial illumination device is inserted and disposed in the aforementioned lens portion. As in the semiconductor manufacturing apparatus of claim 1, the aforementioned coaxial illumination device has a surface-emitting light source. The semiconductor manufacturing apparatus of claim 1 further includes a hemispherical lighting device disposed on the substrate side of the coaxial lighting device. As in the semiconductor manufacturing apparatus of claim 1, wherein the aforementioned reference mark is formed by leads. The semiconductor manufacturing apparatus of claim 1 includes a control unit configured to position the substrate based on an image obtained by photographing the substrate with the first camera and an image obtained by photographing the reference mark with the second camera. A method for manufacturing a semiconductor device includes: a process of photographing a substrate using an imaging device of a semiconductor manufacturing apparatus, wherein the semiconductor manufacturing apparatus is equipped with the aforementioned imaging device and a coaxial illumination device, wherein the aforementioned imaging device comprises a first camera for photographing a substrate having a tab area with mounted chips and a reference mark, a second camera for photographing the aforementioned reference mark, and a lens portion; the aforementioned lens portion comprises a first lens acting as an objective lens for the aforementioned first camera, a second lens acting as an objective lens for the aforementioned second camera, and a beam splitter for splitting reflected light from the subject to the aforementioned first lens and the aforementioned second lens; and A procedure for positioning the substrate based on images obtained by photographing the substrate with the first camera and images obtained by photographing the reference mark with the second camera.