TWI775678B - Electronic component back film method and equipment - Google Patents

Abstract

The invention provides a method and equipment for the back film of an electronic component, comprising: making a carrier plate with a plurality of coils adhered on the lower side conveyed by a conveying device to a gluing device, so that the lower side of the coil is dipped into the gluing device A glue tray is attached with resin; the carrier is transported away from the glue-dipping device to a hardening device by the conveying device, so that the resin attached to the underside of the coil is pressed against a transparent film by a transparent film The board is irradiated by a hardening light source to be hardened; thereby improving the yield of the back film of the electronic components.

Description

Electronic component back film method and equipment

The present invention relates to a back film method and equipment, in particular to a back film method and equipment for electronic components for forming a back film on one side of a coil.

Generally speaking, electronic components such as inductors usually need to wind a wire between the two flanges of an iron core to form a coil; because the electronic components need to use surface mount technology (SMT; Surface Mount Technology) Attached to the surface of the circuit board, in order to make the attachment device easily absorb the electronic component and attach it to the surface of the circuit board, a flat back film is usually formed on the side of the electronic component without electrodes.

For the electronic component, as disclosed in Announcement No. 567509 "Wound Type Chip Coil and Its Characteristics Adjustment Method", the coil after winding the wire is held on the bracket with the side without electrodes facing down, and is placed on the fixing plate. A resin that can be cured by irradiation with UV light is arranged on the top, and then the coil is dipped into the resin at a preset depth and then lifted, and the resin adhered to the coil is irradiated by UV light to harden to form a back film.

Because the coil of the prior art is suspended on the support, under the action of gravity, although the resin adhered to the lower side of the coil will not drip from the coil due to its viscosity and surface tension, the resin still remains. It will sag or accumulate in specific parts, resulting in the unevenness of the back film after hardening. Nowadays, electronic components have entered the era of miniaturization. , even if it is a drop of 0.1mm, it will eventually affect the back film yield of electronic components.

In other words, the purpose of the present invention is to provide a back film method for electronic components that can improve the yield of the back film.

Another object of the present invention is to provide an apparatus for performing the method for the back film of an electronic component.

The method for the back film of electronic components according to the object of the present invention includes: making a carrier plate with a plurality of coils adhered on the lower side conveyed by a conveying device to a glue-dipping device, so that the lower side of the coil is dipped into the glue-dipping device. A glue tray is attached with resin; the carrier is transported away from the glue device to a hardening device by the conveying device, so that the resin attached to the underside of the coil is pressed against a transparent plate by a transparent film. Hardened by irradiation of a hardening light source.

According to another object of the present invention, the electronic component back film equipment includes: an apparatus for performing the electronic component back film method.

In the method and apparatus for the back film of an electronic component according to the embodiment of the present invention, the resin on the lower side of the coil first contacts the light-transmitting film and then presses against the light-transmitting plate, so that the resin forms a flat surface before being subjected to the Hardening light source irradiation can reduce the height difference after the back film is formed; and because the light-transmitting plate and the resin are separated by the light-transmitting film, it can prevent the resin from sticking and contaminating the light-transmitting plate and affecting the Forming of the back film; thereby improving the yield of the back film of electronic components.

Please refer to FIG. 1 , the method and apparatus for the back film of an electronic component according to the embodiment of the present invention can form a back film W2 on one side of the coil W1 as shown in the figure; The coil W1 is provided with a winding core portion W11 in the Y-axis direction and two flanges W12 respectively provided at both ends of the winding core portion W11; the winding core portion W11 is provided with a wire W13 such as enameled wire wound thereon; the flanges An electrode portion W121 is provided on the upper side of the W12, and both ends of the wire W13 can be welded to the electrode portions W121 of the two flanges W12 respectively; The back film W2 is formed on the underside of the coil W1 without the electrode portion W121, so that the underside of the coil W1 has a flat surface to facilitate subsequent bonding operations; the back film W2 is formed by, for example, irradiating UV It is made of resin that can be hardened after light.

Referring to FIGS. 2 and 3 , in the embodiment of the present invention, a carrier M is used to hold a plurality of coils W1 at the same time, so that the coils W1 can be transported to different devices to form the back film W2 on one side of the coils W1 ( FIG. 1 ). ); A double-faced adhesive film N is arranged between the carrier M and the coil W1, one side of which is attached to the carrier M, and the other side is attached to and holds the coil W1; a plurality of coils W1 can be in a matrix form Arranged on the adhesive film N; the adhesive film N is, for example, a thermal release film that can eliminate viscosity after heating; The side of the carrier M with the adhesive film N facing downwards, so that the adhesive film N is attached to the upper side of the coil W1 having the electrode portion W121, and the lower side of the coil W1 without the electrode portion W12 is suspended in the air to be transported.

Please refer to FIGS. 3 and 4 . The method for the back film of electronic components according to the embodiment of the present invention can be described by taking the device shown in FIG. 4 as an example. The device is provided with: A conveying device A is installed on a machine table T; the conveying device A can convey the carrier M to different devices in the X-axis conveying flow path, so as to adjust the plurality of coils W1 held on the carrier M perform different tasks; a calibration device B, arranged on the table top T of the machine, capable of calibrating the plurality of coils W1 held on the carrier M at the same time; A gluing device C, located on the machine table T and located on the downstream side of the calibration device C in the conveying flow path, can store the resin W2' to be hardened for a plurality of coils held on the carrier M W1 attached; A curing device D, located on the machine table T and located on the downstream side of the gluing device C in the conveying flow path, can cure the resin W2' adhered to the coil W1 to form the back film W2 (figure 1); A feeding device E and a receiving device F are respectively disposed on both sides of the machine table T. The feeding device E supplies a carrier M holding a plurality of coils W1, and is sequentially transported to the After calibrating the device B, the gluing device C and the hardening device D, the carrier M is transported to the receiving device F for collection.

Please refer to FIGS. 5 and 6 , the conveying device A is provided with a gantry mechanism A1, a lifting mechanism A2 and a conveying mechanism A3; The gantry mechanism A1 supports an X-axis rail A12 with two brackets A11 erected on the machine table T (FIG. 4); the front side of the rail A12 is provided with two upper and lower spaced apart The X-axis slide rail A121 is used for a slide seat A122 to slide upward; a screw A123 is arranged between the two slide rails A121, which is linked by a belt A125 driven by a driver A124 such as a motor, so that the screw A123 drives the slide The seat A122 is moved back and forth horizontally in the X-axis on the rail frame A12; The elevating mechanism A2 is arranged on the sliding seat A122, and the elevating mechanism A2 drives a moving seat A22 to move vertically in the Z-axis by a driver A21 such as a pneumatic cylinder; The conveying mechanism A3 is set on the moving base A22 and can be driven to perform horizontal displacement in the X-axis and vertical displacement in the Z-axis; the conveying mechanism A3 is provided with a suction nozzle seat A31 and a universal joint A32. The joint A32 is connected between the suction nozzle base A31 and the movable base A22; the suction nozzle base A31 is provided with a flat suction surface A311 on which a plurality of suction nozzles A312 are arranged. The trachea A313 communicates with the external negative pressure unit (not shown); the suction nozzle seat A31 is provided with a first positioning member A314 and a second positioning member A315 on both sides of the suction nozzle seat A31 on the X-axis, respectively, and the suction surface A311 is provided on both sides In between, a circular first positioning hole A316 is recessed on the first positioning member A314, and an oblong second positioning hole A317 is recessed on the second positioning member A315.

Please refer to FIGS. 7 and 8 , the calibration device B is provided with a calibration platform B1 and a cleaning mechanism B2; The calibration platform B1 supports a calibration base B12 with two upright brackets B11; the calibration base B12 is provided with a horizontal calibration surface B121, and a limiter B122 is provided on both sides of the calibration base B12 on the X-axis. A limit pin B123 is protruded on the positioning member B122, and the correction surface B121 is arranged between the positioning members B122 on both sides; The cleaning mechanism B2 is arranged on the upper side of the Y-axis of the calibration base B12. The cleaning mechanism B2 is provided with a horizontal and elongated air port B21 near the calibration surface B121. The air port B21 communicates with an air passage B22. The airway B22 communicates with an external positive pressure unit (not shown) through a plurality of ventilation pipes B23.

Please refer to FIGS. 9 , 10 and 11 , the gluing device C is provided with a gluing tray carrier C1 , a gluing tray driving mechanism C2 , a gluing tray C3 and a gluing mechanism C4 ; The plastic tray carrier C1 supports a carrier C12 with two upright brackets C11. A limiter C121 is provided on each of the two sides of the carrier C12 in the X-axis direction. A limiter pin is protruded from the limiter C121. C122; The rubber tray driving mechanism C2 is arranged on the rubber tray carrier C1, and the rubber tray driving mechanism C2 is provided with a Y-axis sliding rail C21 between the two limiting members C121 for a sliding seat C22 to slide on; Below the carrier C12 is a driver C23 such as a pneumatic cylinder, which can drive a link C231 passing through the slot of the carrier C12 to link the slider C22 on the plastic disc carrier C1 for Y-axis movement Horizontal reciprocating shift; The rubber tray C3 is set on the sliding seat C22 of the rubber tray driving mechanism C2, and can be driven to move back and forth horizontally in the Y-axis direction relative to the rubber tray carrier C1; A U-shaped plastic seat C31, two long strip-shaped mounting pieces C32 and two long strip-shaped blocking pieces C33 are composed; the mounting pieces C32 are arranged on both sides of the plastic socket C31 on the Y-axis, and the blocking pieces C33 is correspondingly disposed on the mounting member C32; the glue seat C31, the mounting member C32 and the blocking member C33 are surrounded by a glue-dipping area C34, and two long strip-shaped magnetic members C35 are arranged on the glue-dipping area C34. on the mounting pieces C32 on both sides of the glue area C34; The squeegee mechanism C4 is set on the glue tray carrier C1, and is provided with two scrapers C41 and a glue storage area C42; the scraper C41 extends into the glue dipping area C34 and is held with the upper surface of the glue seat C31 A preset glue discharge gap d (Fig. 12); the glue storage area C42 is set between the two scrapers C41 for storing the resin W2' to be hardened. When the glue tray C3 moves horizontally and vertically relative to the glue scraping mechanism C4 At this time, the resin W2' can flow out to the glue-dipping area C31 through the gap d and be smoothed to a predetermined height by the scraper C41.

Please refer to Figures 13 and 14, the hardening device D is provided with a hardening mechanism D1 and a film belt conveying mechanism D2; The hardening mechanism D1 supports a fixed seat D12 with two upright supports D11, and a hardening light source D13 capable of emitting UV light, for example, is disposed below the fixed seat D12; the fixed seat D12 is provided with a pair of first hollow sections D121 The light source D13 should be hardened, the four corners of the fixed seat D12 are respectively provided with a bushing D122, and the two sides of the fixed seat D12 located on the Y-axis are provided with a guide member D123 such as a roller; A mounting seat D14 is arranged above the fixing seat D12, and a second hollowed-out area D141 is formed corresponding to the first hollowed-out area D121; a limiting member D142 is provided on each of the two sides of the mounting seat D14 on the X-axis, and the limiting member D142 is protruded with a limit pin D143; two sides of the mounting seat D14 located in the upper Y-axis are provided with a mounting portion D144, and a horizontal light-transmitting plate D15 such as glass is mounted on both sides of the mounting portion D144 and cover the second hollow section D141; A movable pressing plate D16 is arranged above the light-transmitting plate D15, which has a third hollow section D161 corresponding to the light-transmitting plate D15; the pressing plate D16 is provided with a long slot hole D162 on both sides of the upper X-axis corresponding to the limiting position Piece D142; The pressing plate D16 is driven by a lifting mechanism D17; the lifting mechanism D17 is provided with four lifting rods D171, the upper end of which is connected to the pressing plate D16 through the shaft sleeve D122, and the lower end of which is connected to a lifting plate D172 through the machine table T , the lift plate D172 is driven by a driver D173 such as a pneumatic cylinder to vertically reciprocate in the Z-axis, so as to drive the lift rod D171 to link the pressure plate D16 to selectively approach or move away from the light-transmitting plate D15.

Please refer to FIGS. 14 and 15 , the film belt conveying mechanism D2 is provided with a light-transmitting film P, a tape unwinding mechanism D21, a tape take-up mechanism D22 and a tension adjusting mechanism D23; the tape unwinding mechanism D21 is provided on the hardening mechanism D1 at the On the upper side of the Y-axis, the take-up mechanism D22 and the tension adjustment mechanism D23 are arranged on the other side of the hardening mechanism D1 on the Y-axis; The light-transmitting film P is made of plastic materials such as PET. The light-transmitting film P is sent out from the unwinding mechanism D21, passes through the hardening mechanism D1, and is wound up by the tape-receiving mechanism D22; the light-transmitting film P passes through the hardening mechanism D22. During the mechanism D1, the pressing plate D16 selectively approaches or moves away from the light-transmitting plate D15 to selectively press and clamp the light-transmitting film P between the light-transmitting plate D15 and the pressing plate D16; The unwinding mechanism D21 is provided with a unwinding reel D211 such as a roller, and one end of the transparent film P is wound on the unwinding reel D211; The take-up mechanism D22 is provided with a take-up reel D221 such as a roller, and the other end of the transparent film P is wound on the take-up reel D221; the take-up reel D221 can be selectively driven by a driver D222 such as a motor Rotate clockwise to pull the light-transmitting film P located at the tape unwinding mechanism D21 away from the tape unwinding mechanism D21 to the tape take-up mechanism D22; The tension adjustment mechanism D23 is arranged between the hardening mechanism D1 and the take-up mechanism D22; the tension adjustment mechanism D23 is provided with a driven component D231 that can move relative to a bracket D232 in the Z-axis; the bracket D232 is provided with a sensor D233 can sense the position of the driven component D231, and send a control signal to control the actuation of the driver D222; wherein, the transparent film P is wound around and lifts the driven component D231, when the tension of the transparent film P is higher than that of the driven component D231 When it is large, the driven component D231 is lifted upward by the light-transmitting film P, and after the sensor D233 senses the upward displacement of the driven component D231, the sensor D233 sends a control signal to control the driver D222 to suspend operation; when When the tension of the transparent film P is small, the driven component D231 is displaced downward, and the sensor D233 sends a control signal to control the driver D222 to start to act.

Please refer to FIG. 16 , the feeding device E is provided with a feeding box E1, a feeding lifting mechanism E2, a feeding flow channel E3 and a first pushing mechanism E4; the feeding box E1 is provided with a plurality of devices The slot E11 is for a plurality of carrier plates M (FIG. 3) holding a plurality of coils W1 to be stacked at a fixed distance. The two sides of the feeding box E1 are provided with X-axis openings; the feeding lifting mechanism E2 can drive The feeding box E1 is displaced in the Z-axis to correspond to the feeding channel E3; the first pushing mechanism E4 can push the carrier M stacked in the feeding box E1 into the feeding channel E3 .

Please refer to FIG. 17 , the receiving device F is provided with a receiving box F1, a receiving lifting mechanism F2, a receiving flow channel F3 and a second pushing mechanism F4; the receiving box F1 is provided with a plurality of The slot F11 is for a plurality of carrier plates M (FIG. 3) holding a plurality of coils W1 to be stacked at a fixed distance. The receiving box F1 is provided with openings on both sides of the X-axis; the receiving and lifting mechanism F2 can drive The receiving box F1 is displaced in the Z-axis to correspond to the receiving flow channel F3; the second pushing mechanism F4 can push the carrier M on the receiving flow channel F3 into the receiving box F1.

In the implementation of the method and apparatus for the back film of electronic components in the embodiment of the present invention, the carrier M holding a plurality of coils W1 is placed on the feeding device E with one side attached to the adhesive film N facing downward; the conveying The device A uses the suction nozzle A312 on the suction nozzle seat A31 to suck the upper side of the carrier M, so that the carrier M with a plurality of coils W1 adhered to the lower side is taken out from the feeding device E, and conveyed in the X axis The flow path is conveyed to the calibration device B; After the carrier M reaches the calibration device B, the suction nozzle holder A31 descends so that the underside of the coil W1 is pressed against the calibration surface B121 of the calibration device B, so that the underside of the coil W1 is pressed against the calibration surface B121 of the calibration device B. are aligned at the same level; when the lower side of the coil W1 is pressed against the calibration surface B121, the suction nozzle holder A31 is simultaneously pressed against the two limiting members B122 on both sides of the calibration surface B121 and the limiting The pin B123 penetrates the corresponding first positioning hole A315 and the second positioning hole A316, so that the nozzle seat A31 is limited to a preset height, so as not to drop too much and crush the coil W1; at the same time, the air port B21 provides positive pressure gas to blow to the coil W1 to clean the dust on the coil W1; After the calibration is completed, the carrier M is then transported by the conveying device A away from the calibration device B to the gluing device C; after the carrier M reaches the gluing device C, the nozzle holder A31 is lowered to make the The underside of the coil W1 is dipped into the glue tray C3 to adhere to the resin W2' located in the glue-dipping area C34; when the underside of the coil W1 is dipped into the glue tray C3, the nozzle seat A31 is pressed against at the same time On the two limiting members C121 on both sides of the plastic tray C3, and the limiting pins C122 penetrate the corresponding first positioning holes A315 and the second positioning holes A316, so that the nozzle seat A31 is limited to a predetermined position. height, so that the coil W1 will not touch the upper surface of the rubber seat C31; After the adhesive dip is completed, the carrier M continues to be transported from the adhesive dip device C to the hardening device D by the conveying device A. After the carrier M reaches the hardening device D, the nozzle holder A31 descends to make the dip stick D. The resin W2' attached to the lower side of the coil W1 first contacts the light-transmitting film P, and then presses against the light-transmitting plate D15 so that the light-transmitting film is formed between the light-transmitting plate D15 and the resin W2'. P is separated to prevent the resin W2' from sticking and contaminating the light-transmitting plate D15; the resin W2 adhering to the lower side of the coil W1 is pressed against the light-transmitting plate D15 through the light-transmitting film P' A flat surface is formed, and then irradiated by the hardening light source D13, so that the resin W2' adhered to the lower side of the coil W1 is irradiated by the hardening light source D13 to harden to form the back film W2; and when adhering to the coil W1 When the resin W2' on the lower side is pressed against the light-transmitting plate D15, the nozzle holder A31 is pressed against the two limiting members D142 on both sides of the light-transmitting plate D15, and the limiting pins D143 penetrate the corresponding The first positioning hole A315 and the second positioning hole A316 make the nozzle holder A31 limited to a predetermined height, so as not to drop excessively and crush the coil W1; After the hardening is completed, the carrier M is then continuously transported by the conveying device A to leave the hardening device D to the receiving device F for collection; after the carrier M is collected by the receiving device F, the nozzle holder A31 Can go back to the top of the feeding device E, thus completing a cycle of the back film of the electronic component W; In each cycle, after the resin W2' in the gluing device C is impregnated, the resin W2' will be re-smeared by the displacement of the glue disc C3 relative to the squeegee mechanism C4, and when the glue disc C3 is displaced relative to the squeegee mechanism C4 When the coil W1 in C3 falls, the coil W1 can also be blocked by the scraper C41 and pushed to both sides of the rubber plate C3 to be adsorbed by the magnetic piece C35 without affecting the next dipping; After the light-transmitting film P is used, it can be driven to move relative to the light-transmitting plate D15, so that the unused light-transmitting film P is moved to the light-transmitting plate D15, and when the light-transmitting film P moves, the light-transmitting plate D15 and the pressing plate D16 do not press and clamp the transparent film P.

In the method and apparatus for the back film of an electronic component according to the embodiment of the present invention, the resin W2' on the lower side of the coil W1 first contacts the light-transmitting film P and then presses against the light-transmitting plate D15 to make the resin W2' After the flat surface is formed, it is irradiated by the hardening light source D13, which can reduce the height difference after the back film W2 is formed; The resin W2' sticks and contaminates the light-transmitting plate D15 and affects the forming of the back film W2; thereby, the yield of the back film of the electronic device can be improved.

However, the above are only preferred embodiments of the present invention, and should not limit the scope of the present invention, that is, any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the contents of the description of the invention, All still fall within the scope of the patent of the present invention.

A: Conveying device A1: Gantry mechanism A11: Bracket A12: Rail frame A121: Slide rail A122: Slider A123: Screw A124: Driver A125: Belt A2: Lifting mechanism A21: Drive A22: Mobile seat A3: Conveying mechanism A31: Nozzle holder A311: Adsorption surface A312: Nozzle A313: Snorkel A314: The first positioning piece A315: Second positioning piece A316: The first positioning hole A317: Second positioning hole A32: Universal joint B: Correction device B1: Calibration Platform B11: Bracket B12: Correction seat B121: Correction Surface B122: Stopper B123: Limit pin B2: Cleaning Agency B21: Air port B22: Airway B23: Snorkel C: Dipping device C1: plastic disc carrier C11: Bracket C12: Carrier C121: Stopper C122: Limit pin C2: plastic disc drive mechanism C21: Slide rail C22: Slider C23: Drive C3: plastic tray C31: plastic seat C32: Mounting C33: Stopper C34: Adhesive area C35: Magnetics C4: Squeegee mechanism C41: scraper C42: Glue storage area D: Hardening device D1: Hardening mechanism D11: Bracket D12: Fixed seat D121: The first hollow section D122: Bushing D123: Guide D13: Hardened light source D14: Mounting base D141: The second hollow section D142: Stopper D143: Limit pin D144: Installation Department D15: Translucent plate D16: Platen D161: The third hollow section D162: Long slotted hole D17: Lifting mechanism D171: Lifting rod D172: Lifting plate D173: Drive D2: Membrane belt conveying mechanism D21: Unwinding mechanism D211: Unwind reel D22: take-up mechanism D221: Take-up reel D222: Drive D23: Tension adjustment mechanism D231: driven components D232: Bracket D233: Sensor E: Feeding device E1: Feed box E11: slotting E2: Feeding lifting mechanism E3: Feed runner E4: The first pushing mechanism F: Receiving device F1: Receiving box F11: slot F2: Receiving lifting mechanism F3: Receiving runner F4: The second pushing mechanism M: carrier board N: film P: light-transmitting film T: machine table W1: Coil W11: roll core W12: Flange W121: Electrode part W13: Wire W2: Back film W2': Resin d: glue gap

FIG. 1 is a schematic diagram of forming a back film on one side of a coil in an embodiment of the present invention. FIG. 2 is a three-dimensional schematic diagram of a carrier plate and an adhesive film in an embodiment of the present invention. FIG. 3 is a schematic diagram of a carrier board simultaneously holding a plurality of coils according to an embodiment of the present invention. FIG. 4 is a three-dimensional schematic diagram of a back film device for electronic components in an embodiment of the present invention. Fig. 5 is a front view of the conveying device in the embodiment of the present invention. FIG. 6 is a schematic diagram of an upside-down suction nozzle seat in an embodiment of the present invention. FIG. 7 is a three-dimensional schematic diagram of a calibration device according to an embodiment of the present invention. 8 is a schematic diagram of an airway in an embodiment of the present invention. FIG. 9 is a three-dimensional schematic diagram of a glue-dipping device according to an embodiment of the present invention. FIG. 10 is a schematic diagram of resin storage in the gluing device according to the embodiment of the present invention. FIG. 11 is a schematic diagram of the driver of the gluing device driving the linking element to move the sliding seat according to the embodiment of the present invention. FIG. 12 is a schematic diagram of a glue discharge gap in an embodiment of the present invention. FIG. 13 is a three-dimensional schematic diagram of a hardening device in an embodiment of the present invention. FIG. 14 is a schematic diagram of the light-transmitting film being pressed and clamped between the pressing plate and the light-transmitting plate according to the embodiment of the present invention. FIG. 15 is a schematic diagram of the light-transmitting film being wound on the hardening mechanism and the film belt conveying mechanism in the embodiment of the present invention. FIG. 16 is a three-dimensional schematic diagram of a feeding device in an embodiment of the present invention. FIG. 17 is a three-dimensional schematic diagram of the receiving device in the embodiment of the present invention.

A: Conveying device

B: Correction device

C: Dipping device

D: Hardening device

E: Feeding device

F: Receiving device

T: machine table

W2': Resin

Claims (9)

A method for back filming of electronic components, comprising: making a carrier plate with a plurality of coils adhered to the lower side conveyed by a conveying device to a gluing device, so that the lower side of the coil is immersed in a glue tray of the gluing device Adhering resin; make the carrier transfer the carrier plate away from the gluing device to a hardening device, so that the resin adhering to the lower side of the coil is pressed against a light-transmitting plate by a light-transmitting film separated by a light-transmitting film and subjected to a hardening light source The light-transmitting film can be driven to move relative to the light-transmitting plate. The method for the back film of electronic components according to claim 1, wherein a double-sided adhesive film is arranged between the carrier board and the coil, one side of which is attached to the carrier board, and the other side of which is adhered to the coil. The method for back filming of electronic components as claimed in claim 1, wherein the carrier is adsorbed and conveyed by a suction nozzle seat of the conveying device; when the resin adhered to the underside of the coil is pressed against the light-transmitting plate , the suction nozzle holder is pressed against the two limiting pieces on both sides of the light-transmitting plate, so that the suction nozzle holder is limited to a preset height, so as not to drop excessively and crush the coil. The method for back filming of electronic components according to claim 1, wherein the carrier is sucked and transported by a suction nozzle seat of the conveying device; when the underside of the coil is dipped into the plastic tray, the suction nozzle seat presses Relying on the two limiting members on both sides of the plastic tray, the suction nozzle seat is restricted to a preset height, so that the coil does not touch the upper surface of a plastic seat of the plastic tray. The method for back filming of electronic components as claimed in claim 1, wherein before the conveying device conveys the carrier to the gluing device, the conveying device first conveys the carrier to a calibration device to press the lower side of the coil Abut against a horizontal correction surface of the correction device, so that the lower side of the coil is aligned at the same level. The electronic component back film method according to claim 5, wherein when the lower side of the coil is pressed against the correction surface, a positive pressure gas is provided to blow the coil. The method for back filming of electronic components according to claim 5, wherein the carrier is sucked and transported by a suction nozzle seat of the conveying device; when the lower side of the coil is pressed against the calibration surface, the suction nozzle seat presses Relying on the two limiting pieces on both sides of the calibration surface, the suction nozzle seat is limited to a preset height, so as not to drop excessively and crush the coil. The method for back filming of electronic components according to claim 5, wherein the conveying device takes out the carrier from a feeding device, and conveys the carrier to the calibration device, the gluing device and the hardening device in sequence, and finally makes the carrier It is transported to a receiving device for collection. An electronic component back film device can be used to perform the electronic component back film method according to any one of claims 1 to 8.

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