TWI771245B - Electronic component back film method and equipment - Google Patents

Abstract

The invention provides a method and equipment for the back film of an electronic component, comprising: making a carrier plate with a plurality of coils adhered on the lower side conveyed by a conveying device to a gluing device, so that the lower side of the coil is dipped into the gluing device A glue tray is attached with resin; the carrier is transported away from the glue-dipping device to a curing device by the conveying device, so that the resin attached to the underside of the coil is irradiated by a curing light source to be cured; The device transports the carrier plate away from the hardening device to an unloading device, so that the coils are collected by the unloading device; the transport device transports the carrier plate away from the unloading device to a collecting device, so that the carrier plate is collected by the unloading device. The collection device collects; whereby the electronic component back film can be automated.

Description

Electronic component back film method and equipment

The present invention relates to a back film method and equipment, in particular to a back film method and equipment for electronic components for forming a back film on one side of a coil.

Generally speaking, electronic components such as inductors usually need to wind a wire between the two flanges of an iron core to form a coil; because the electronic components need to use surface mount technology (SMT; Surface Mount Technology) Attached to the surface of the circuit board, in order to make the attachment device easily absorb the electronic component and attach it to the surface of the circuit board, a flat back film is usually formed on the side of the electronic component without electrodes.

For the electronic component, as disclosed in Announcement No. 567509 "Wound Type Chip Coil and Its Characteristics Adjustment Method", the coil after winding the wire is held on the bracket with the side without electrodes facing down, and is placed on the fixing plate. A resin that can be cured by irradiation with UV light is arranged on the top, and then the coil is dipped into the resin at a preset depth and then lifted, and the resin adhered to the coil is irradiated by UV light to harden to form a back film.

The back film method of electronic components in the prior art mostly requires manual operations, which not only consumes time and manpower, but also increases the difficulty of manual operations when dealing with miniaturized inductors such as 0201, 0402, 0603, and 0805. , so how to automatically carry out the back film of electronic components has become a trend in the development of the industry.

In other words, the purpose of the present invention is to provide an electronic component back film method that can automatically perform the electronic component back film.

Another object of the present invention is to provide an apparatus for performing the method for the back film of an electronic component.

The method for the back film of electronic components according to the object of the present invention includes: making a carrier plate with a plurality of coils adhered on the lower side conveyed by a conveying device to a glue-dipping device, so that the lower side of the coil is dipped into the glue-dipping device. A glue tray is attached with resin; the carrier is transported from the glue-dipping device to a curing device, and the resin attached to the underside of the coil is irradiated by a curing light source to be cured; make the transport device transporting the carrier plate away from the hardening device to an unloading device, so that the coils are collected by the unloading device; causing the transport device to transport the carrier plate from the unloading device to a collecting device, so that the carrier plate is collected by the unloading device device collection.

According to another object of the present invention, an electronic component back film apparatus is used to perform the electronic component back film method as described above.

In the method and apparatus for the back film of electronic components according to the embodiment of the present invention, the conveying device sequentially transports the carrier board with the coils adhered to the gluing device, the hardening device and the unloading device, which not only makes the back film of electronic components work It can be carried out automatically, and the coil behind the back film can be automatically separated from the carrier plate, which can save time and manpower for subsequent manual separation.

Please refer to FIG. 1 , the method and apparatus for the back film of an electronic component according to an embodiment of the present invention forms a back film W2 on one side of the coil W1; The coil W1 is provided with a winding core portion W11 in the Y-axis direction and two flanges W12 respectively provided at both ends of the winding core portion W11; the winding core portion W11 is provided with a wire W13 such as enameled wire wound thereon; the flanges An electrode portion W121 is provided on the upper side of the W12, and both ends of the wire W13 can be welded to the electrode portions W121 of the two flanges W12 respectively; The back film W2 is formed on the underside of the coil W1 without the electrode portion W121, so that the underside of the coil W1 has a flat surface to facilitate subsequent bonding operations; the back film W2 is formed by, for example, irradiating UV It is made of resin that can be hardened after light.

Referring to FIGS. 2 and 3 , in the embodiment of the present invention, a carrier M is used to hold a plurality of coils W1 at the same time, so that the coils W1 can be transported to different devices, so that the back film W2 is formed on one side of the coils W1 (Fig. 1); A double-faced adhesive film N is arranged between the carrier M and the coil W1, one side of which is attached to the carrier M, and the other side is attached to and holds the coil W1; a plurality of coils W1 can be in a matrix form Arranged on the adhesive film N; the adhesive film N is, for example, a thermal release film that can eliminate viscosity after heating; The side of the carrier M with the adhesive film N is facing downward, so that the adhesive film N is attached to the coil W1 having the upper side of the electrode portion W121, so that the coil W1 does not have the lower side of the electrode portion W12 It was transported in the air.

Please refer to FIGS. 3 and 4 . The method for the back film of electronic components according to the embodiment of the present invention can be described by taking the device shown in FIG. 4 as an example. The device is provided with: A conveying device A is installed on a machine table T; the conveying device A can convey the carrier M to different devices in the X-axis conveying flow path, so as to adjust the plurality of coils W1 held on the carrier M perform different tasks; a calibration device B, arranged on the table top T of the machine, capable of calibrating the plurality of coils W1 held on the carrier M at the same time; A gluing device C, located on the machine table T and located on the downstream side of the calibration device C in the conveying flow path, can store the resin W2' to be hardened for a plurality of coils held on the carrier M W1 attached; A curing device D, located on the machine table T and located on the downstream side of the gluing device C in the conveying flow path, can cure the resin W2' adhered to the coil W1 to form the back film W2 (figure 1); an unloading device E, disposed on the machine table T and located on the downstream side of the hardening device D in the conveying flow path, capable of separating a plurality of coils W1 from the carrier M and collecting the coils W1; A supply device F and a collection device G are respectively disposed on both sides of the machine table T. The supply device F supplies a carrier M holding a plurality of coils W1, and is sequentially transported to the calibration device B by the transport device A. , After the gluing device C, the hardening device D and the unloading device E, the carrier M without holding a plurality of coils W1 is transported to the collecting device G for collection; wherein, when the carrier M is transported, The coil W1 is held with its long axis (an axis passing through both flanges W12) substantially perpendicular to the conveying flow path.

Please refer to FIGS. 5 and 6 , the conveying device A is provided with a gantry mechanism A1, a lifting mechanism A2 and a conveying mechanism A3; The gantry mechanism A1 supports an X-axis rail A12 with two brackets A11 erected on the machine table T (FIG. 4); the front side of the rail A12 is provided with two upper and lower spaced apart The X-axis slide rail A121 is used for a slide seat A122 to slide upward; a screw A123 is arranged between the two slide rails A121, which is linked by a belt A125 driven by a driver A124 such as a motor, so that the screw A123 drives the slide The seat A122 is moved back and forth horizontally in the X-axis on the rail frame A12; The elevating mechanism A2 is arranged on the sliding seat A122, and the elevating mechanism A2 drives a moving seat A22 to move vertically in the Z-axis by a driver A21 such as a pneumatic cylinder; The conveying mechanism A3 is set on the moving base A22 and can be driven to perform horizontal displacement in the X-axis and vertical displacement in the Z-axis; the conveying mechanism A3 is provided with a suction nozzle seat A31 and a universal joint A32. The joint A32 is connected between the suction nozzle base A31 and the movable base A22; the suction nozzle base A31 is provided with a flat suction surface A311 on which a plurality of suction nozzles A312 are arranged. The trachea A313 communicates with the external negative pressure unit (not shown); the suction nozzle seat A31 is provided with a first positioning member A314 and a second positioning member A315 on both sides of the suction nozzle seat A31 on the X-axis, respectively, and the suction surface A311 is provided on both sides In between, a circular first positioning hole A316 is recessed on the first positioning member A314, and an oblong second positioning hole A317 is recessed on the second positioning member A315.

Please refer to FIGS. 7 and 8 , the calibration device B is provided with a calibration platform B1 and a cleaning mechanism B2; The calibration platform B1 supports a calibration base B12 with two upright brackets B11; the calibration base B12 is provided with a horizontal calibration surface B121, and a limiter B122 is provided on both sides of the calibration base B12 on the X-axis. A limit pin B123 is protruded on the positioning member B122, and the correction surface B121 is arranged between the positioning members B122 on both sides; The cleaning mechanism B2 is arranged on the upper side of the Y-axis of the calibration base B12. The cleaning mechanism B2 is provided with a horizontal and elongated air port B21 near the calibration surface B121. The air port B21 communicates with an air passage B22. The airway B22 communicates with an external positive pressure unit (not shown) through a plurality of ventilation pipes B23.

Please refer to FIGS. 9 , 10 and 11 , the gluing device C is provided with a gluing tray carrier C1 , a gluing tray driving mechanism C2 , a gluing tray C3 and a gluing mechanism C4 ; The plastic tray carrier C1 supports a carrier C12 with two upright brackets C11. A limiter C121 is provided on each of the two sides of the carrier C12 in the X-axis direction. A limiter pin is protruded from the limiter C121. C122; The rubber tray driving mechanism C2 is arranged on the rubber tray carrier C1, and the rubber tray driving mechanism C2 is provided with a Y-axis sliding rail C21 between the two limiting members C121 for a sliding seat C22 to slide on; Below the carrier C12 is a driver C23 such as a pneumatic cylinder, which can drive a link C231 passing through the slot of the carrier C12 to link the slider C22 on the plastic disc carrier C1 for Y-axis movement Horizontal reciprocating shift; The rubber tray C3 is set on the sliding seat C22 of the rubber tray driving mechanism C2, and can be driven to move back and forth horizontally in the Y-axis direction relative to the rubber tray carrier C1; A U-shaped plastic seat C31, two long strip-shaped mounting pieces C32 and two long strip-shaped blocking pieces C33 are composed; the mounting pieces C32 are arranged on both sides of the plastic socket C31 on the Y-axis, and the blocking pieces C33 is correspondingly disposed on the mounting member C32; the glue seat C31, the mounting member C32 and the blocking member C33 are surrounded by a glue-dipping area C34, and two long strip-shaped magnetic members C35 are arranged on the glue-dipping area C34. on the mounting pieces C32 on both sides of the glue area C34; The squeegee mechanism C4 is set on the glue tray carrier C1, and is provided with two scrapers C41 and a glue storage area C42; the scraper C41 extends into the glue dipping area C34 and is held with the upper surface of the glue seat C31 A preset glue discharge gap d (Fig. 12); the glue storage area C42 is set between the two scrapers C41 for storing the resin W2' to be hardened. When the glue tray C3 moves horizontally and vertically relative to the glue scraping mechanism C4 At this time, the resin W2' can flow out to the glue-dipping area C31 through the gap d and be smoothed to a predetermined height by the scraper C41.

Please refer to Figures 13 and 14, the hardening device D is provided with a hardening mechanism D1 and a film belt conveying mechanism D2; The hardening mechanism D1 supports a fixed seat D12 with two upright supports D11, and a hardening light source D13 capable of emitting UV light, for example, is disposed below the fixed seat D12; the fixed seat D12 is provided with a pair of first hollow sections D121 The light source D13 should be hardened, the four corners of the fixed seat D12 are respectively provided with a bushing D122, and the two sides of the fixed seat D12 located on the Y-axis are provided with a guide member D123 such as a roller; A mounting seat D14 is arranged above the fixing seat D12, and a second hollowed-out area D141 is formed corresponding to the first hollowed-out area D121; a limiting member D142 is provided on each of the two sides of the mounting seat D14 on the X-axis, and the limiting member D142 is protruded with a limit pin D143; two sides of the mounting seat D14 located in the upper Y-axis are provided with a mounting portion D144, and a horizontal light-transmitting plate D15 such as glass is mounted on both sides of the mounting portion D144 and cover the second hollow section D141; A movable pressing plate D16 is arranged above the light-transmitting plate D15, which has a third hollow section D161 corresponding to the light-transmitting plate D15; the pressing plate D16 is provided with a long slot hole D162 on both sides of the upper X-axis corresponding to the limiting position Piece D142; The pressing plate D16 is driven by a lifting mechanism D17; the lifting mechanism D17 is provided with four lifting rods D171, the upper end of which is connected to the pressing plate D16 through the shaft sleeve D122, and the lower end of which is connected to a lifting plate D172 through the machine table T , the lift plate D172 is driven by a driver D173 such as a pneumatic cylinder to vertically reciprocate in the Z-axis, so as to drive the lift rod D171 to link the pressure plate D16 to selectively approach or move away from the light-transmitting plate D15.

Please refer to FIGS. 14 and 15 , the film belt conveying mechanism D2 is provided with a light-transmitting film P, a tape unwinding mechanism D21, a tape take-up mechanism D22 and a tension adjusting mechanism D23; the tape unwinding mechanism D21 is provided on the hardening mechanism D1 at the On the upper side of the Y-axis, the take-up mechanism D22 and the tension adjustment mechanism D23 are arranged on the other side of the hardening mechanism D1 on the Y-axis; The light-transmitting film P is made of, for example, a PFT material. The light-transmitting film P is sent out from the unwinding mechanism D21, passed through the hardening mechanism D1, and then wound up by the tape-receiving mechanism D22; the light-transmitting film P passes through the hardening mechanism D1 When the pressing plate D16 is selectively approached or moved away from the light-transmitting plate D15, the light-transmitting film P between the light-transmitting plate D15 and the pressing plate D16 can be selectively pressed and clamped; The unwinding mechanism D21 is provided with a unwinding reel D211 such as a roller, and one end of the transparent film P is wound on the unwinding reel D211; The take-up mechanism D22 is provided with a take-up reel D221 such as a roller, and the other end of the transparent film P is wound on the take-up reel D221; the take-up reel D221 can be selectively driven by a driver D222 such as a motor Rotate clockwise to pull the light-transmitting film P located at the tape unwinding mechanism D21 away from the tape unwinding mechanism D21 to the tape take-up mechanism D22; The tension adjustment mechanism D23 is arranged between the hardening mechanism D1 and the take-up mechanism D22; the tension adjustment mechanism D23 is provided with a driven component D231 that can move relative to a bracket D232 in the Z-axis; the bracket D232 is provided with a sensor D233 can sense the position of the driven component D231, and send a control signal to control the actuation of the driver D222; wherein, the transparent film P is wound around and lifts the driven component D231, when the tension of the transparent film P is higher than that of the driven component D231 When it is large, the driven component D231 is lifted upward by the light-transmitting film P, and after the sensor D233 senses the upward displacement of the driven component D231, the sensor D233 sends a control signal to control the driver D222 to suspend operation; when When the tension of the transparent film P is small, the driven component D231 is displaced downward, and the sensor D233 sends a control signal to control the driver D222 to start to act.

Please refer to Figures 16 and 17, the unloading device E is provided with a frame E1, an unloading mechanism E2 and an unloading box E3; The frame body E1 is provided with a limit seat E11 on a bracket E12. The limit seat E11 has a U-shape with a notch facing the discharge mechanism E2 and is provided with a hollow discharge port E111. The discharge port E111 is located in the discharge mechanism E2. On the conveying flow path, the limit seat E11 is provided with two horizontal and equal heights E112 on both sides of the discharge port E111, and the height of the seat E112 is slightly lower than a horizontal upper surface of the limit seat E11 E113; The discharge opening E111 is rectangular and corresponds to the carrier M (Fig. 2); The unloading mechanism E2 is provided on the frame body E1 on one side of the conveying flow path and is located on one side of the unloading port E111; the unloading mechanism E2 is provided with an unloading part E21 with a wedge and, for example, a pneumatic cylinder A driver E22, the driver E22 is arranged on a mounting frame E13 of the frame body E1, the discharge element E21 can be driven by the driver E22 to make a horizontal reciprocating movement of the Y-axis in the discharge port E111; the The discharge member E21 is provided with a horizontal upper surface E211 and an inclined side surface E212; The unloading box E3 can be selectively stored under the limiting seat E11. The unloading box E3 is provided with an opening E31 corresponding to the unloading port E111 and an opening E31 for the operator to hold and move the unloading box E3. Grip E32.

Please refer to FIG. 18 , the feeding device F is provided with a feeding box F1, a feeding lifting mechanism F2, a feeding flow channel F3 and a first pushing mechanism F4; the feeding box F1 is provided with a plurality of slots F11 for feeding A plurality of carrier plates M (Fig. 3) are stacked at a fixed distance, and there are X-axis openings on both sides of the supply box F1; The supply channel F3 should be used; the first pushing mechanism F4 can push the carrier M stacked in the supply box F1 into the supply channel F3.

Please refer to FIG. 19, the collection device G is provided with a collection box G1, a material receiving and lifting mechanism G2, a material receiving flow channel G3 and a second material pushing mechanism G4; the collection box G1 is provided with a plurality of slots G11 for A plurality of carrier plates M (FIG. 3) are stacked at a fixed distance, and the two sides of the collection box G1 are provided with openings in the X axis; the collecting and lifting mechanism G2 can drive the collection box G1 to make Z axis displacement to The material receiving channel G3 should be received; the second pushing mechanism G4 can push the carrier M on the receiving channel G3 into the collecting box G1.

In the implementation of the method and apparatus for the back film of electronic components in the embodiment of the present invention, the carrier M holding a plurality of coils W1 is placed on the supply device F with one side attached to the adhesive film N facing down; the conveying device A uses the suction nozzle A312 on the suction nozzle holder A31 to suck the upper side of the carrier M, so that the carrier M with a plurality of coils W1 adhered to the lower side is taken out from the supply device F, and is conveyed in the X-axis flow path transported to the calibration device B; After the carrier M reaches the calibration device B, the suction nozzle holder A31 descends so that the underside of the coil W1 is pressed against the calibration surface B121 of the calibration device B, so that the underside of the coil W1 is pressed against the calibration surface B121 of the calibration device B. are aligned at the same level; when the lower side of the coil W1 is pressed against the calibration surface B121, the suction nozzle holder A31 is simultaneously pressed against the two limiting members B122 on both sides of the calibration surface B121 and the limiting The pin B123 penetrates the corresponding first positioning hole A315 and the second positioning hole A316, so that the nozzle seat A31 is limited to a preset height, so as not to drop too much and crush the coil W1; at the same time, the air port B21 provides positive pressure gas to blow to the coil W1 to clean the dust on the coil W1; After the calibration is completed, the carrier M is then transported by the conveying device A away from the calibration device B to the gluing device C; after the carrier M reaches the gluing device C, the nozzle holder A31 is lowered to make the The underside of the coil W1 is dipped into the glue tray C3 to adhere the resin W2' located in the glue-dipping area C34. Because the underside of the coil W1 is first snapped to the same level and then impregnated, it is possible to reduce the amount of time required. The drop between the preset depth and the actual depth of the immersion caused by the coil W1 sagging from the rubber film N under the action of gravity; when the underside of the coil W1 is immersed into the rubber tray C3, the suction nozzle seat A31 is pressed against the two limiting members C121 on both sides of the rubber plate C3 at the same time, and the limiting pin C122 penetrates the corresponding first positioning hole A315 and the second positioning hole A316, so that the nozzle seat A31 is limited to a preset height, so that the coil W1 will not touch the upper surface of the rubber seat C31; After the adhesive dip is completed, the carrier M continues to be transported from the adhesive dip device C to the hardening device D by the conveying device A. After the carrier M reaches the hardening device D, the nozzle holder A31 descends to make the dip stick D. The resin W2' attached to the lower side of the coil W1 first contacts the light-transmitting film P, and then presses against the light-transmitting plate D15 so that the light-transmitting film is formed between the light-transmitting plate D15 and the resin W2'. P is separated to prevent the resin W2' from sticking and contaminating the light-transmitting plate D15; the resin W2 adhering to the lower side of the coil W1 is pressed against the light-transmitting plate D15 through the light-transmitting film P' A flat surface is formed, and then irradiated by the hardening light source D13, so that the resin W2' adhered to the lower side of the coil W1 is irradiated by the hardening light source D13 to harden to form the back film W2, which can reduce the resin W2' due to gravity When the resin W2' adhered to the lower side of the coil W1 is pressed against the light-transmitting plate D15, the suction nozzle seat A31 is pressed against the two limiting members D142 on both sides of the transparent plate D15, and the limiting pin D143 penetrates the corresponding first positioning hole A315 and the second positioning hole A316, so that the nozzle holder A31 is It is limited to a preset height, so as not to drop too much and crush the coil W1; After the hardening is completed, the carrier M continues to be transported from the hardening device D to the unloading device E by the conveying device A, so that the coil W1 is collected by the unloading device E; when the carrier M reaches the unloading device E After the feeding device E is installed, the suction nozzle seat A31 is lowered so that the two sides of the carrier M2 are pressed against the two resting surfaces E112 on both sides of the discharge opening E111, and then the carrier M and the discharge member E21 are used. The relative displacement between the two causes the coil W1 adhered to the carrier M to be separated from the carrier M; when the coil W1 is separated from the carrier M, the carrier M is stationary on the two resting surfaces E112 , and the discharger E21 is driven by the driver E22 to displace and peel off the coil W1 from one side of the discharge port E111 in a direction perpendicular to the conveying flow path toward the other side of the discharge port E111, so as to make the coil W1 falls into the unloading box E3 to be collected; during the displacement process of the unloading member E21, the unloading member E21 and the carrier M keep a preset distance and the upper surface E211 is kept parallel to the carrier M, The tip of the discharger E21 only contacts one of the flanges W12 of the coil W1 and exerts force to peel off the coil W1 (as shown in FIG. 20 ); After the unloading is completed, then continue to make the carrier M without the coil W1 to be transported by the conveying device A from the unloading device E to the collecting device G for collection; after the carrier M is collected by the collecting device G After that, the nozzle holder A31 can be returned to the top of the supply device F, thus completing one cycle of the back film of electronic components; In each cycle, after the resin W2' in the gluing device C is impregnated, the resin W2' will be re-smeared by the displacement of the glue disc C3 relative to the squeegee mechanism C4, and when the glue disc C3 is displaced relative to the squeegee mechanism C4 When the coil W1 in C3 falls, the coil W1 can also be blocked by the scraper C41 and pushed to both sides of the rubber plate C3 to be adsorbed by the magnetic piece C35 without affecting the next dipping; After the light-transmitting film P is used, it can be driven to move relative to the light-transmitting plate D15, so that the unused light-transmitting film P is moved to the light-transmitting plate D15, and when the light-transmitting film P moves, the light-transmitting plate D15 and the pressing plate D16 do not press and clamp the transparent film P.

In the method and apparatus for the back film of electronic components according to the embodiment of the present invention, the conveying device A sequentially conveys the carrier M with the coils W1 attached to the gluing device C, the hardening device D and the unloading device E, not only The back film operation of the electronic components can be performed automatically, and the coil W1 behind the back film can be automatically separated from the carrier M, which can save time and manpower for subsequent manual separation.

However, the above are only preferred embodiments of the present invention, and should not limit the scope of the present invention, that is, any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the contents of the description of the invention, All still fall within the scope of the patent of the present invention.

A: Conveying device A1: Gantry mechanism A11: Bracket A12: Rail frame A121: Slide rail A122: Slider A123: Screw A124: Driver A125: Belt A2: Lifting mechanism A21: Drive A22: Mobile seat A3: Conveying mechanism A31: Nozzle holder A311: Adsorption surface A312: Nozzle A313: Snorkel A314: The first positioning piece A315: Second positioning piece A316: The first positioning hole A317: Second positioning hole A32: Universal joint B: Correction device B1: Calibration Platform B11: Bracket B12: Correction seat B121: Correction Surface B122: Stopper B123: Limit pin B2: Cleaning Agency B21: Air port B22: Airway B23: Snorkel C: Dipping device C1: plastic disc carrier C11: Bracket C12: Carrier C121: Stopper C122: Limit pin C2: plastic disc drive mechanism C21: Slide rail C22: Slider C23: Drive C3: plastic tray C31: plastic seat C32: Mounting C33: Stopper C34: Adhesive area C35: Magnetics C4: Squeegee mechanism C41: scraper C42: Glue storage area D: Hardening device D1: Hardening mechanism D11: Bracket D12: Fixed seat D121: The first hollow section D122: Bushing D123: Guide D13: Hardened light source D14: Mounting base D141: The second hollow section D142: Stopper D143: Limit pin D144: Installation Department D15: Translucent plate D16: Platen D161: The third hollow section D162: Long slotted hole D17: Lifting mechanism D171: Lifting rod D172: Lifting plate D173: Drive D2: Membrane belt conveying mechanism D21: Unwinding mechanism D211: Unwind reel D22: take-up mechanism D221: Take-up reel D222: Drive D23: Tension adjustment mechanism D231: driven components D232: Bracket D233: Sensor E: unloading device E1: Frame E11: Support plate E12: Limit seat E121: discharge port E122: Facing E123: Upper surface E13: Mounting bracket E2: unloading mechanism E21: Discharge parts E211: Upper surface E212: Side Surface E22: Drive E3: Unloading box E31: Opening E32: Grip F: Supply device F1: Supply Box F11: slot F2: Feeding lifting mechanism F3: Feed runner F4: The first pushing mechanism G: Collection device G1: Collection Box G11: slotting G2: Receiving and lifting mechanism G3: Receiving runner G4: The second pushing mechanism M: carrier board N: film P: light-transmitting film T: machine table W1: Coil W11: roll core W12: Flange W121: Electrode part W13: Wire W2: back film W2': Resin d: glue gap

FIG. 1 is a schematic diagram of forming a back film on one side of a coil in an embodiment of the present invention. FIG. 2 is a three-dimensional schematic diagram of a carrier plate and an adhesive film in an embodiment of the present invention. FIG. 3 is a schematic diagram of a carrier board simultaneously holding a plurality of coils according to an embodiment of the present invention. FIG. 4 is a three-dimensional schematic diagram of a back film device for electronic components in an embodiment of the present invention. Fig. 5 is a front view of the conveying device in the embodiment of the present invention. FIG. 6 is a schematic diagram of an upside-down suction nozzle seat in an embodiment of the present invention. FIG. 7 is a three-dimensional schematic diagram of a calibration device according to an embodiment of the present invention. 8 is a schematic diagram of an airway in an embodiment of the present invention. FIG. 9 is a three-dimensional schematic diagram of a glue-dipping device according to an embodiment of the present invention. FIG. 10 is a schematic diagram of resin storage in the gluing device according to the embodiment of the present invention. FIG. 11 is a schematic diagram of the driver of the gluing device driving the linking element to move the sliding seat according to the embodiment of the present invention. FIG. 12 is a schematic diagram of a glue discharge gap in an embodiment of the present invention. FIG. 13 is a three-dimensional schematic diagram of a hardening device in an embodiment of the present invention. FIG. 14 is a schematic diagram of the light-transmitting film being pressed and clamped between the pressing plate and the light-transmitting plate according to the embodiment of the present invention. FIG. 15 is a schematic diagram of the light-transmitting film being wound on the hardening mechanism and the film belt conveying mechanism in the embodiment of the present invention. FIG. 16 is a three-dimensional schematic diagram of the unloading device in the embodiment of the present invention. FIG. 17 is a schematic diagram of the arrangement relationship among the frame body, the unloading mechanism and the unloading box in the embodiment of the present invention. FIG. 18 is a schematic perspective view of a supply device in an embodiment of the present invention. FIG. 19 is a three-dimensional schematic diagram of a collecting device in an embodiment of the present invention. FIG. 20 is a schematic diagram of the stripping coil of the unloading member according to the embodiment of the present invention.

A: Conveying device

B: Correction device

C: Dipping device

D: Hardening device

E: Supply device

F: Collection device

G: unloading device

T: machine table

W2': Resin

Claims (10)

An electronic component back film method, comprising: A carrier plate with a plurality of coils attached to the lower side is transported by a conveying device to a gluing device, so that the lower side of the coil is dipped into a glue tray of the gluing device to adhere resin; causing the conveying device to convey the carrier plate away from the gluing device to a curing device, so that the resin adhered to the underside of the coil is irradiated by a curing light source to be cured; causing the conveying device to convey the carrier plate away from the hardening device to an unloading device, so that the coils are collected by the unloading device; The conveying device is made to transport the carrier plate away from the unloading device to a collecting device, so that the carrier plate is collected by the collecting device. The method for back filming of electronic components as claimed in claim 1, wherein the coils adhered to the carrier are separated from the carrier by the relative displacement between the carrier and a stripper. The discharge device collects. The method for back filming of electronic components according to claim 2, wherein when the coil is separated from the carrier plate, the carrier plate is stationary and the stripper is driven and displaced to peel off the coil. The method for back filming of electronic components according to claim 3, wherein during the displacement process of the unloading part, the unloading part maintains a preset distance from the carrier board; and one end of the unloading part contacts one of the coils. a flange. The method for back filming of electronic components as claimed in claim 2, wherein the carrier is adsorbed and transported by a suction nozzle seat of the transporting device; after the carrier is sent to the unloading device, the carrier is pressed against a limit seat The two resting surfaces on both sides of a discharge opening. The method for back filming of electronic components according to claim 5, wherein the unloading member can be driven by a driver to move horizontally and vertically in the unloading opening; an unloading box is accommodated under the limit seat, and the coil After being separated from the carrier, it falls into the unloading box and is collected. The electronic component back film method according to claim 1, wherein the unloading device is provided between the curing device and the collecting device, and the unloading device is located on the downstream side of the curing device in the conveying flow path of the conveying device, The collecting device is located on the downstream side of the unloading device in the conveying flow path of the conveying device. The method for the back film of electronic components according to claim 1, wherein a double-sided adhesive film is arranged between the carrier board and the coil, one side of which is attached to the carrier board, and the other side of which is adhered to the coil. The method for back filming of electronic components according to claim 1, wherein the hardening device is provided with a horizontal light-transmitting plate, so that the resin adhering to the lower side of the coil is pressed against the light-transmitting plate to form a flat surface, and then a flat surface is formed. irradiated by the hardening light source; when the resin is pressed against the transparent plate, the transparent plate and the resin are separated by a transparent film, and the transparent film can be driven to face the transparent plate move. An electronic component back film device for performing the electronic component back film method according to any one of claims 1 to 9.

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