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TWI759342B - resin composition - Google Patents

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TWI759342B
TWI759342B TW106135600A TW106135600A TWI759342B TW I759342 B TWI759342 B TW I759342B TW 106135600 A TW106135600 A TW 106135600A TW 106135600 A TW106135600 A TW 106135600A TW I759342 B TWI759342 B TW I759342B
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resin composition
mass
resin
component
manufactured
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TW201833213A (en
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長嶋将毅
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日商味之素股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/156—Heterocyclic compounds having oxygen in the ring having two oxygen atoms in the ring
    • C08K5/1575—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Fluid Mechanics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

本發明的課題係提供一種相溶性為良好的樹脂組成物等，其可得到介電正切低、鍍敷密著性及基底密著性為良好且污斑去除性為優異的絕緣層。 　　解決課題之手段為一種樹脂組成物，其係包含(A)環氧樹脂、(B)硬化劑、及(C)具有5員環以上的環狀醚構造之化合物，且將樹脂成分設為100質量%時，(C)成分的含量為1質量%~50質量%。An object of the present invention is to provide a resin composition and the like having good compatibility, which can obtain an insulating layer having a low dielectric tangent, good plating adhesion and substrate adhesion, and excellent stain removability. Means for solving the problem is a resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) a compound having a cyclic ether structure having five or more membered rings, and having a resin component of 100 In mass %, content of (C)component is 1 mass % - 50 mass %.

Description

樹脂組成物resin composition

[0001] 本發明係關於一種樹脂組成物。進一步關於含有該樹脂組成物之薄片狀基材、接著薄膜、印刷配線板、及半導體裝置。The present invention relates to a kind of resin composition. Furthermore, it is about the sheet-like base material, the adhesive film, the printed wiring board, and the semiconductor device containing this resin composition.

[0002] 作為印刷配線板之製造技術，已知有藉由在內層電路基板上相互堆疊絕緣層與導體層之增層(Build-up)方式之製造方法。絕緣層係通常可藉由使樹脂組成物硬化從而形成。例如，專利文獻1中記載著一種樹脂組成物，其特徵係含有(A)自由基聚合性化合物、(B)環氧樹脂、(C)硬化劑及(D)粗糙化成分。 [先前技術文獻] [專利文獻] 　　[0003] 　　[專利文獻1] 日本特開2014-034580號公報[0002] As a manufacturing technique of a printed wiring board, a manufacturing method of a build-up method by stacking an insulating layer and a conductor layer on an inner-layer circuit board is known. The insulating layer is usually formed by hardening a resin composition. For example, Patent Document 1 describes a resin composition characterized by containing (A) a radically polymerizable compound, (B) an epoxy resin, (C) a curing agent, and (D) a roughening component. [Prior Art Document] [Patent Document] [0003] [Patent Document 1] Japanese Patent Laid-Open No. 2014-034580

[發明所欲解決之課題] 　　[0004] 適合於內層電路基板的絕緣層之形成的環氧樹脂組成物，包含專利文獻1記載的樹脂組成物已有為數不少的提案，但近年對於可形成低介電正切為優異的絕緣層之樹脂組成物之期待逐漸提高。又，隨著電子機器的小型化、高性能化之發展，在多層印刷配線板中，增層(Build-up)層已為多層化，而要求著配線的微細化及高密度化。 　　[0005] 為了達成配線的進一步的微細化及高密度化，雖要求著一種相溶性為良好的樹脂組成物，其可得到介電正切低、鍍敷密著性及基底密著性為良好且污斑去除性為優異的絕緣層，但現況是仍無法滿足該等之全部特性。 　　[0006] 本發明的課題係提供：一種相溶性為良好的樹脂組成物，其可得到介電正切低、鍍敷密著性及基底密著性為良好且污斑去除性為優異的絕緣層；含有該樹脂組成物之薄片狀基材；含有該樹脂組成物之接著薄膜；具備使用該樹脂組成物所形成的絕緣層之印刷配線板、及半導體裝置。 [解決課題之手段] 　　[0007] 本發明人得到下述之見解：以往一般的樹脂組成物，當降低介電正切時，污斑(smear)去除性會變差，即，介電正切與污斑去除性係存有互相權衡（trade-off）之關係。本發明人為解決上述課題經深入研究之結果發現，藉由在樹脂組成物中含有(A)環氧樹脂、(B)硬化劑、及指定量的(C)具有5員環以上的環狀醚構造之化合物，可得到介電正切低、鍍敷密著性及基底密著性為良好且污斑去除性為優異的絕緣層，因而完成本發明。 　　[0008] 即，本發明係包含以下之內容。 　　[1].一種樹脂組成物，其係包含(A)環氧樹脂、(B)硬化劑、及(C)具有5員環以上的環狀醚構造之化合物，且將樹脂成分設為100質量%時，(C)成分的含量為1質量%~50質量%。 　　[2].如[1]所記載之樹脂組成物，其中，將樹脂成分設為100質量%時，(A)成分的含量為5質量%~50質量%。 　　[3].如[1]或[2]所記載之樹脂組成物，其中，將樹脂成分設為100質量%時，(B)成分的含量為5質量%~60質量%。 　　[4].如[1]~[3]中任一項所記載之樹脂組成物，其中，(B)成分為活性酯系硬化劑。 　　[5].如[1]~[4]中任一項所記載之樹脂組成物，其係包含(D)無機填充材。 　　[6].如[5]所記載之樹脂組成物，其中，將樹脂組成物的不揮發成分設為100質量%時，(D)成分的含量為50質量%以上。 　　[7].如[1]~[6]中任一項所記載之樹脂組成物，其中，(C)成分係包含二噁烷構造。 　　[8].如[1]~[7]中任一項所記載之樹脂組成物，其中，(C)成分係具有碳-碳不飽和鍵。 　　[9].如[1]~[8]中任一項所記載之樹脂組成物，其中，(C)成分係具有碳-碳雙鍵。 　　[10].如[1]~[9]中任一項所記載之樹脂組成物，其中，(C)成分係具有由乙烯基、甲基丙烯醯基、丙烯醯基、烯丙基、苯乙烯基、及丙烯基所成之群中選出之1種以上的官能基。 　　[11].如[1]~[10]中任一項所記載之樹脂組成物，其中，(C)成分係具有乙烯基。 　　[12].如[1]~[11]中任一項所記載之樹脂組成物，其中，(C)成分為下述之化合物，

Figure 02_image001
。 　　[13].如[1]~[12]中任一項所記載之樹脂組成物，其係印刷配線板的絕緣層形成用。 　　[14].如[1]~[12]中任一項所記載之樹脂組成物，其係印刷配線板的層間絕緣層形成用。 　　[15].一種薄片狀基材，其係包含[1]~[14]中任一項所記載之樹脂組成物。 　　[16].一種接著薄膜，其係包含支撐體、與被設置於該支撐體上的以[1]~[14]中任一項所記載之樹脂組成物所形成的樹脂組成物層。 　　[17].一種印刷配線板，其係包含第1導體層、第2導體層、及在第1導體層與第2導體層之間所形成的絕緣層，且該絕緣層係[1]~[14]中任一項所記載之樹脂組成物的硬化物。 　　[18].一種半導體裝置，其係具備[17]所記載之印刷配線板。 [發明的效果] 　　[0009] 依據本發明可提供：一種相溶性為良好的樹脂組成物，其可得到介電正切低、鍍敷密著性及基底密著性為良好且污斑去除性為優異的絕緣層；含有該樹脂組成物之薄片狀基材；含有該樹脂組成物之接著薄膜；具備使用該樹脂組成物所形成的絕緣層之印刷配線板、及半導體裝置。[Problems to be Solved by the Invention] [0004] There have been many proposals for epoxy resin compositions suitable for the formation of insulating layers of inner-layer circuit boards, including the resin compositions described in Patent Document 1. The expectation of forming a resin composition having an excellent insulating layer with a low dielectric tangent is increasing. In addition, with the development of miniaturization and higher performance of electronic equipment, in multilayer printed wiring boards, build-up layers are multi-layered, and miniaturization and high density of wiring are required. In order to achieve further miniaturization and high density of wiring, although a resin composition with good compatibility is required, it can obtain a low dielectric tangent, good plating adhesion and substrate adhesion, and The stain removability is an excellent insulating layer, but it is still unable to satisfy all of these characteristics. The subject of the present invention is to provide: a resin composition with good compatibility, which can obtain an insulating layer with low dielectric tangent, good plating adhesion and substrate adhesion, and excellent stain removal performance A sheet-like base material containing the resin composition; an adhesive film containing the resin composition; a printed wiring board provided with an insulating layer formed using the resin composition, and a semiconductor device. [MEANS TO SOLVE THE PROBLEM] [0007] The present inventors have obtained the following knowledge: when the dielectric tangent of a conventional general resin composition is lowered, the smear removability deteriorates, that is, the dielectric tangent and the stain There is a trade-off relationship between spot removal. As a result of intensive research to solve the above-mentioned problems, the present inventors have found that a resin composition contains (A) an epoxy resin, (B) a hardener, and a prescribed amount of (C) a cyclic ether having a 5-membered ring or more. The compound of the structure can obtain an insulating layer having a low dielectric tangent, good plating adhesion and substrate adhesion, and excellent stain removability, thus completing the present invention. That is, the present invention includes the following contents. [1]. A resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a compound having a cyclic ether structure having five or more membered rings, and wherein the resin component is 100 mass %, content of (C)component is 1 mass % - 50 mass %. [2]. The resin composition according to [1], wherein the content of the component (A) is 5% by mass to 50% by mass when the resin component is 100% by mass. [3]. The resin composition according to [1] or [2], wherein the content of the component (B) is 5% by mass to 60% by mass when the resin component is 100% by mass. [4]. The resin composition according to any one of [1] to [3], wherein the component (B) is an active ester-based curing agent. [5]. The resin composition according to any one of [1] to [4], which contains (D) an inorganic filler. [6]. The resin composition according to [5], wherein the content of the component (D) is 50% by mass or more when the nonvolatile content of the resin composition is 100% by mass. [7]. The resin composition according to any one of [1] to [6], wherein the component (C) contains a dioxane structure. [8]. The resin composition according to any one of [1] to [7], wherein the component (C) has a carbon-carbon unsaturated bond. [9]. The resin composition according to any one of [1] to [8], wherein the component (C) has a carbon-carbon double bond. [10]. The resin composition according to any one of [1] to [9], wherein the component (C) has a compound consisting of a vinyl group, a methacryloyl group, an acryl group, an allyl group, and a benzene group. One or more functional groups selected from the group consisting of vinyl groups and acryl groups. [11]. The resin composition according to any one of [1] to [10], wherein the component (C) has a vinyl group. [12]. The resin composition according to any one of [1] to [11], wherein the component (C) is the following compound,
Figure 02_image001
. [13]. The resin composition according to any one of [1] to [12], which is for forming an insulating layer of a printed wiring board. [14]. The resin composition according to any one of [1] to [12], which is for forming an interlayer insulating layer of a printed wiring board. [15]. A sheet-like substrate comprising the resin composition according to any one of [1] to [14]. [16]. An adhesive film comprising a support and a resin composition layer provided on the support and formed of the resin composition according to any one of [1] to [14]. [17]. A printed wiring board comprising a first conductor layer, a second conductor layer, and an insulating layer formed between the first conductor layer and the second conductor layer, and the insulating layer is [1]~ The cured product of the resin composition according to any one of [14]. [18]. A semiconductor device including the printed wiring board according to [17]. [Effects of the Invention] [0009] According to the present invention, it is possible to provide: a resin composition with good compatibility, which can obtain a low dielectric tangent, good plating adhesion and substrate adhesion, and stain removal of An excellent insulating layer; a sheet-like base material containing the resin composition; an adhesive film containing the resin composition; a printed wiring board provided with an insulating layer formed using the resin composition, and a semiconductor device.

[實施發明之最佳形態] 　　[0011] 以下，對於本發明的樹脂組成物、薄片狀基材、接著薄膜、印刷配線板、及半導體裝置來進行詳細說明。 　　[0012] [樹脂組成物] 　　本發明的樹脂組成物係包含(A)環氧樹脂、(B)硬化劑、及(C)具有5員環以上的環狀醚構造之化合物，將樹脂成分設為100質量%時，(C)成分的含量為1質量%~50質量%。藉此，將可提供一種相溶性為良好的樹脂組成物，其可得到介電正切低、鍍敷密著性及基底密著性為良好且污斑去除性為優異的絕緣層。 　　[0013] 所謂「樹脂成分」係指在構成樹脂組成物之不揮發成分中，除去後述的(D)無機填充材後的成分。以下，對於樹脂組成物中所包含的各成分進行詳細說明。 　　[0014] ＜(A)環氧樹脂＞ 　　樹脂組成物係含有(A)環氧樹脂。作為(A)環氧樹脂，可舉例如雙酚AF型環氧樹脂、及全氟烷基型環氧樹脂等的含有氟的環氧樹脂；雙酚A型環氧樹脂；雙酚F型環氧樹脂；雙酚S型環氧樹脂；聯二甲酚型環氧樹脂；二環戊二烯型環氧樹脂；三酚型環氧樹脂；萘酚酚醛清漆型環氧樹脂；苯酚酚醛清漆型環氧樹脂；tert-丁基-兒茶酚型環氧樹脂；萘型環氧樹脂；萘酚型環氧樹脂；蒽型環氧樹脂；縮水甘油胺型環氧樹脂；縮水甘油酯型環氧樹脂；甲酚酚醛清漆型環氧樹脂；聯苯型環氧樹脂；線狀脂肪族環氧樹脂；具有丁二烯構造的環氧樹脂；脂環式環氧樹脂；雜環式環氧樹脂；含有螺環的環氧樹脂；環己烷二甲醇型環氧樹脂；伸萘基醚型環氧樹脂；三羥甲基型環氧樹脂；四苯乙烷型環氧樹脂等。環氧樹脂係可單獨使用1種，亦可組合2種以上來使用。 　　[0015] 環氧樹脂係以包含在1分子中具有2個以上的環氧基的環氧樹脂為較佳。將環氧樹脂之不揮發成分設為100質量%時，在1分子中具有2個以上的環氧基的環氧樹脂係以至少50質量%以上為較佳。環氧樹脂較佳為：在1分子中具有2個以上的環氧基且在溫度20℃下為液狀的環氧樹脂(以下稱為「液狀環氧樹脂」)、及/或在1分子中具有3個以上的環氧基且在溫度20℃下為固體狀的環氧樹脂(以下稱為「固體狀環氧樹脂」)，而以固體狀環氧樹脂為較佳。環氧樹脂亦可併用液狀環氧樹脂與固體狀環氧樹脂。 　　[0016] 作為液狀環氧樹脂，較佳為雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚AF型環氧樹脂、萘型環氧樹脂、縮水甘油酯型環氧樹脂、縮水甘油胺型環氧樹脂、苯酚酚醛清漆型環氧樹脂、具有酯骨架的脂環式環氧樹脂、環己烷二甲醇型環氧樹脂、縮水甘油胺型環氧樹脂、及具有丁二烯構造的環氧樹脂；又較佳為以縮水甘油胺型環氧樹脂、雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚AF型環氧樹脂及萘型環氧樹脂。作為液狀環氧樹脂之具體例，可舉出DIC公司製的「HP4032」、「HP4032D」、「HP4032SS」(萘型環氧樹脂)、三菱化學公司製的「828US」、「jER828EL」(雙酚A型環氧樹脂)、「jER807」(雙酚F型環氧樹脂)、「jER152」(苯酚酚醛清漆型環氧樹脂)、「630」、「630LSD」(縮水甘油胺型環氧樹脂)、新日鐵住金化學公司製的「ZX1059」(雙酚A型環氧樹脂與雙酚F型環氧樹脂的混合品)、新日鐵住金化學公司製「YD-8125G」(雙酚A型環氧樹脂)、Nagasechemtex公司製的「EX-721」(縮水甘油酯型環氧樹脂)、DAICEL公司製的「CELOXIDE 2021P」(具有酯骨架的脂環式環氧樹脂)、「PB-3600」(具有丁二烯構造的環氧樹脂)、新日鐵化學公司製的「ZX1658」、「ZX1658GS」(液狀1,4-縮水甘油環己烷)、大金工業公司製的「E-7432」、「E-7632」(全氟烷基型環氧樹脂)等。該等係可單獨使用1種，亦可組合2種以上來使用。 　　[0017] 作為固體狀環氧樹脂，較佳為萘型4官能環氧樹脂、甲酚酚醛清漆型環氧樹脂、二環戊二烯型環氧樹脂、三酚型環氧樹脂、萘酚型環氧樹脂、聯苯型環氧樹脂、伸萘基醚型環氧樹脂、蒽型環氧樹脂、雙酚A型環氧樹脂、四苯乙烷型環氧樹脂；又較佳為萘型4官能環氧樹脂、萘酚型環氧樹脂、及聯苯型環氧樹脂。作為固體狀環氧樹脂之具體例，可舉出DIC公司製的「HP4032H」(萘型環氧樹脂)、「HP-4700」、「HP-4710」(萘型4官能環氧樹脂)、「N-690」(甲酚酚醛清漆型環氧樹脂)、「N-695」(甲酚酚醛清漆型環氧樹脂)、「HP-7200」、「HP-7200HH」、「HP-7200H」(二環戊二烯型環氧樹脂)、「EXA-7311」、「EXA-7311-G3」、「EXA-7311-G4」、「EXA-7311-G4S」、「HP6000」(伸萘基醚型環氧樹脂)、日本化藥公司製的「EPPN-502H」(三酚型環氧樹脂)、「NC7000L」(萘酚酚醛清漆型環氧樹脂)、「NC3000H」、「NC3000」、「NC3000L」、「NC3100」(聯苯型環氧樹脂)、新日鐵住金化學公司製的「ESN475V」(萘型環氧樹脂)、「ESN485」(萘酚酚醛清漆型環氧樹脂)、三菱化學公司製的「YX4000H」、「YL6121」(聯苯型環氧樹脂)、「YX4000HK」(聯二甲酚型環氧樹脂)、「YX8800」(蒽型環氧樹脂)、大阪瓦斯化學公司製的「PG-100」、「CG-500」、三菱化學公司製的「YL7800」(芴型環氧樹脂)、三菱化學公司製的「jER1010」、(固體狀雙酚A型環氧樹脂)、「jER1031S」(四苯乙烷型環氧樹脂)、「YL7760」(雙酚AF型環氧樹脂)等。 　　[0018] 作為環氧樹脂，若併用液狀環氧樹脂與固體狀環氧樹脂之情形時，該等的量比(液狀環氧樹脂：固體狀環氧樹脂)就質量比計以1：0.1~1：15的範圍為較佳，以1：0.1~1：10的範圍為又較佳，以1：0.3~1：3的範圍為更佳。 　　[0019] 樹脂組成物中的環氧樹脂的含量，就良好的拉伸破壞強度、可得到展現出絕緣可靠性的絕緣層之觀點而言，將樹脂成分設為100質量%時，較佳為5質量%以上，又較佳為10質量%以上，更較佳為20質量%以上。環氧樹脂的含量的上限，只要是能發揮本發明的效果即可，並無特別限定，較佳為50質量%以下，又較佳為40質量%以下。 　　[0020] 環氧樹脂的環氧當量，較佳為50~5000，又較佳為50~3000，更佳為80~2000，進而又較佳為110~1000。藉由成為該範圍內，樹脂組成物層的硬化物的交聯密度將變得充分，故可得到表面粗糙度為小的絕緣層。尚，環氧當量係可依據JIS K7236來進行測定，並為包含1當量的環氧基之樹脂的質量。 　　[0021] 環氧樹脂的重量平均分子量係較佳為100~ 5000，又較佳為250~3000，更佳為400~1500。於此，環氧樹脂之重量平均分子量係藉由凝膠滲透層析法(GPC)法所測定之聚苯乙烯換算之重量平均分子量。 　　[0022] ＜(B)硬化劑＞ 　　樹脂組成物係含有(B)硬化劑。作為硬化劑，只要是具有將(A)環氧樹脂硬化之機能即可，並無特別限定，可舉例如苯酚系硬化劑、萘酚系硬化劑、活性酯系硬化劑、苯并噁嗪系硬化劑、氰酸酯系硬化劑、及碳二醯亞胺系硬化劑等。硬化劑係可單獨使用1種、或亦可並用2種以上。(B)成分係以由苯酚系硬化劑、萘酚系硬化劑、活性酯系硬化劑、碳二醯亞胺系硬化劑及氰酸酯系硬化劑中所選出之1種以上為較佳，就降低介電正切之觀點而言，以活性酯系硬化劑為較佳。 　　[0023] 作為苯酚系硬化劑及萘酚系硬化劑，就耐熱性及耐水性之觀點而言，以具有酚醛清漆構造的苯酚系硬化劑、或具有酚醛清漆構造的萘酚系硬化劑為較佳。又，就與導體層的密著性之觀點而言，以含氮苯酚系硬化劑為較佳，以含有三嗪骨架的苯酚系硬化劑為又較佳。 　　[0024] 作為苯酚系硬化劑及萘酚系硬化劑之具體例，可舉例如明和化成公司製的「MEH-7700」、「MEH-7810」、「MEH-7851」、日本化藥公司製的「NHN」、「CBN」、「GPH」、新日鐵住金化學公司製的「SN170」、「SN180」、「SN190」、「SN475」、「SN485」、「SN495」、「SN-495V」、「SN375」、「SN395」、DIC公司製的「TD-2090」、「LA-7052」、「LA-7054」、「LA-1356」、「LA-3018-50P」、「EXB-9500」等。 　　[0025] 作為活性酯系硬化劑，並無特別限制，一般較佳使用為苯酚酯類、苯硫酚酯類、N-羥基胺酯類、雜環羥基化合物的酯類等的在1分子中具有2個以上反應活性高的酯基之化合物。該活性酯系硬化劑係以藉由羧酸化合物及/或硫代羧酸化合物與羥基化合物及/或硫醇化合物的縮合反應而得到者為較佳。特別是就耐熱性提升之觀點而言，以由羧酸化合物與羥基化合物所得之活性酯系硬化劑為較佳，以由羧酸化合物與苯酚化合物及/或萘酚化合物所得之活性酯系硬化劑為又較佳。作為羧酸化合物，可舉例如苯甲酸、乙酸、琥珀酸、馬來酸、伊康酸、鄰苯二甲酸、間苯二甲酸、對苯二甲酸、均苯四甲酸等。作為苯酚化合物或萘酚化合物，可舉例如氫醌、間苯二酚、雙酚A、雙酚F、雙酚S、還原酚酞、甲基化雙酚A、甲基化雙酚F、甲基化雙酚S、苯酚、o-甲酚、m-甲酚、p-甲酚、兒茶酚、α-萘酚、β-萘酚、1,5-二羥基萘、1,6-二羥基萘、2,6-二羥基萘、二羥基苯甲酮、三羥基苯甲酮、四羥基苯甲酮、間苯三酚、苯三酚、二環戊二烯型二苯酚化合物、苯酚酚醛清漆等。於此，所謂「二環戊二烯型二苯酚化合物」係指對於二環戊二烯1分子縮合苯酚2分子而得到的二苯酚化合物。 　　[0026] 具體而言係以包含二環戊二烯型二苯酚構造的活性酯化合物、包含萘構造的活性酯化合物、包含苯酚酚醛清漆的乙醯化物的活性酯化合物、包含苯酚酚醛清漆的苯甲醯化物的活性酯化合物為較佳，其中，以包含萘構造的活性酯化合物、包含二環戊二烯型二苯酚構造的活性酯化合物為又較佳。所謂「二環戊二烯型二苯酚構造」係表示由伸苯基-二伸環戊基-伸萘基所成的2價的構造單位。 　　[0027] 作為活性酯系硬化劑之市售品，作為包含二環戊二烯型二苯酚構造的活性酯化合物可舉出「EXB9451」、「EXB9460」、「EXB9460S」、「HPC-8000-65T」、「HPC-8000H-65TM」、「EXB-8000L-65TM」(DIC公司製)，作為包含萘構造的活性酯化合物可舉出「EXB9416-70BK」(DIC公司製)，作為包含苯酚酚醛清漆的乙醯化物的活性酯化合物可舉出「DC808」(三菱化學公司製)，作為包含苯酚酚醛清漆的苯甲醯化物的活性酯化合物可舉出「YLH1026」(三菱化學公司製)，作為苯酚酚醛清漆的乙醯化物的活性酯系硬化劑可舉出「DC808」(三菱化學公司製)，作為苯酚酚醛清漆的苯甲醯化物的活性酯系硬化劑可舉出「YLH1026」(三菱化學公司製)、「YLH1030」(三菱化學公司製)、「YLH1048」(三菱化學公司製)等。 　　[0028] 作為苯并噁嗪系硬化劑之具體例，可舉出昭和高分子公司製的「HFB2006M」、四國化成工業公司製的「P-d」、「F-a」。 　　[0029] 作為氰酸酯系硬化劑，可舉例如雙酚A二氰酸酯、多元酚氰酸酯、寡(3-亞甲基-1,5-伸萘基氰酸酯)、4,4’-亞甲基雙(2,6-二甲基苯基氰酸酯)、4,4’-亞乙基二苯基二氰酸酯、六氟雙酚A二氰酸酯、2,2-雙(4-氰酸酯)苯基丙烷、1,1-雙(4-氰酸酯苯基甲烷)、雙(4-氰酸酯-3,5-二甲基苯基)甲烷、1,3-雙(4-氰酸酯苯基-1-(甲基亞乙基))苯、雙(4-氰酸酯苯基)硫醚、及雙(4-氰酸酯苯基)醚等的2官能氰酸酯樹脂、由苯酚酚醛清漆及甲酚酚醛清漆等所衍生的多官能氰酸酯樹脂、該等氰酸酯樹脂的一部份進行三嗪化的預聚物等。作為氰酸酯系硬化劑之具體例，可舉出Lonza Japan公司製的「PT30」及「PT60」(苯酚酚醛清漆型多官能氰酸酯樹脂)、「ULL-950S」(多官能氰酸酯樹脂)、「BA230」、「BA230S75」(雙酚A二氰酸酯的一部份或全部進行了三嗪化成為三聚體的預聚物)等。 　　[0030] 作為碳二醯亞胺系硬化劑之具體例，可舉出日清紡化學公司製的「V-03」、「V-07」等。 　　[0031] 環氧樹脂與硬化劑的量比，以[環氧樹脂的環氧基之合計數]：[硬化劑的反應基之合計數]的比率計，以1：0.01~1：3的範圍為較佳，以1：0.015~1：2為又較佳，以1：0.02~1：1.5為更佳。於此，所謂硬化劑的反應基係指活性羥基、活性酯基等，且依硬化劑的種類而有所不同。又，所謂環氧樹脂的環氧基之合計數係指對於全部的環氧樹脂，將各環氧樹脂的固形分質量除以環氧當量所得之值進行合計而得到的值；所謂硬化劑的反應基之合計數係指對於全部的硬化劑，將各硬化劑的固形分質量除以反應基當量所得之值進行合計的值。藉由將環氧樹脂與硬化劑的量比設為上述之範圍內，從而可更加提升樹脂組成物層的硬化物的耐熱性。 　　[0032] 硬化劑的含量並無特別限定，將樹脂成分設為100質量%時，較佳為60質量%以下，又較佳為55質量%以下，更佳為50質量%以下。又，下限並無特別限制，較佳為5質量%以上，又較佳為10質量%以上，更佳為20質量%以上。藉由將硬化劑的含量設為5質量%以上，從而可提升鍍敷密著性及基底密著性。又，藉由設為60質量%以下，在活性酯系硬化劑中可提升污斑去除性，在苯酚系硬化劑及萘酚系硬化劑中則可降低介電正切。 　　[0033] ＜(C)具有5員環以上的環狀醚構造之化合物＞ 　　將樹脂成分設為100質量%時，樹脂組成物係含有1質量%~50質量%的(C)具有5員環以上的環狀醚構造之化合物。 　　[0034] 如前述般，以往而言，介電正切與污斑去除性係存在有互相權衡之關係，但藉由含有指定量的(C)具有5員環以上的環狀醚構造之化合物，從而能夠降低介電正切之同時，可使污斑去除性提升。5員環以上的環狀醚係由於分子的運動被限制，故具有介電正切低之類的性質。又，5員環以上的環狀醚係由於具有極性，故具有一定程度的親水性。藉由具有親水性，污斑的去除將變得容易，從而使污斑去除性為提升。進而認為，藉由具有極性及親水性，而使得相溶性、鍍敷密著性及基底密著性為提升。但，本發明的技術範圍不受限於此處所述能得到的效果的機制之說明。 　　[0035] 環狀醚構造中所包含的氧原子數，就可顯著地得到本發明所期望的效果之觀點而言，較佳為1以上，又較佳為2以上。下限並無特別限定，較佳為5以下，又較佳為4以下，更佳為3以下。 　　[0036] 作為5員環以上的環狀醚構造，只要是5員環以上即可並無特別限定，可以是單環、多環或縮合環。又，(C)成分亦可具有複數個環狀醚構造。環狀醚構造係以5~10員環為較佳，以5~8員環為又較佳，以5~6員環為更佳。作為具體的5員環以上的環狀醚構造，可舉出呋喃構造、四氫呋喃構造、二氧戊環構造、吡喃構造、二氫吡喃構造、四氫吡喃構造、二噁烷構造等，其中，就使相溶性提升之觀點而言，具有5員環以上的環狀醚構造之化合物係以包含二噁烷構造為較佳。所謂二噁烷構造係指包含1,2-二噁烷構造、1,3-二噁烷構造及1,4-二噁烷構造的概念，以1,3-二噁烷構造為較佳。 　　[0037] 又，5員環以上的環狀醚構造中亦可鍵結烷基及烷氧基等的取代基。該等取代基的碳原子數係通常為1~6(較佳為1~3)。 　　[0038] (C)成分就降低介電正切之觀點而言，以具有碳-碳不飽和鍵為較佳，以具有碳-碳雙鍵為又較佳。可在環狀醚構造內具有碳-碳不飽和鍵，亦可具有在環狀醚構造外具有碳-碳不飽和鍵，但其中，以具有作為後述的官能基為較佳。(C)成分中亦可具有複數個碳-碳不飽和鍵。 　　[0039] (C)成分就降低介電正切，且可容易與(A)成分反應之觀點而言，以具有由乙烯基、甲基丙烯醯基、丙烯醯基、烯丙基、苯乙烯基、及丙烯基所成之群中選出之1種以上的官能基為較佳，以具有乙烯基為又較佳。只要是(C)成分中之任意構造為具有該官能基即可，可在環狀醚構造內具有，亦可具有在環狀醚構造外具有。可具有複數個該官能基。 　　[0040] 具有5員環以上的環狀醚構造之化合物，較佳為以下述一般式(1)所表示者。

Figure 02_image003
(式(1)中，環A係表示具有5員環以上的環狀醚構造的2價的基，B1 及B2 係分別獨立表示單鍵或2價的連結基，C1 及C2 係分別獨立表示官能基) 　　[0041] 環A係表示具有5員環以上的環狀醚構造的2價的基。5員環以上的環狀醚構造係與上述5員環以上的環狀醚構造為相同，較佳的範圍也為相同。 　　[0042] 作為具有5員環以上的環狀醚構造的2價的基，具體而言可舉出呋喃-2,5-二基、四氫呋喃-2,5-二基、二氧戊環-2,5-二基、吡喃-2,5-二基、二氫吡喃-2,5-二基、四氫吡喃-2,5-二基、1,2-二噁烷-3,6-二基、1,3-二噁烷-2,5-二基、1,4-二噁烷-2,5-二基、5-乙基-1,3-二噁烷-2,5-二基等，以5-乙基-1,3-二噁烷-2,5-二基為較佳。 　　[0043] B1 及B2 係分別獨立表示單鍵或2價的連結基，以2價的連結基為較佳。作為2價的連結基，可舉例如可具有取代基的伸烷基、可具有取代基的伸炔基、可具有取代基的伸芳基、可具有取代基的伸雜芳基(heteroarylene group)、酯鍵、醚鍵、醯胺鍵、脲鍵、胺基甲酸酯鍵、 -C(=O)-、-S-、-SO-、-NH-所表示之基等，亦可以是複數組合該等之基。 　　[0044] 作為可具有取代基的伸烷基，係以碳原子數1~10的伸烷基為較佳，以碳原子數1~6的伸烷基為又較佳，以碳原子數1~5的伸烷基、或碳原子數1~3的伸烷基為更佳。伸烷基係可以是直鏈、支鏈、環狀任何皆可。作為如此般的伸烷基，可舉例如亞甲基、伸乙基、伸丙基、伸丁基、伸戊基基、伸己基、1,1-二甲基伸乙基等，以亞甲基、伸乙基、1,1-二甲基伸乙基為較佳。 　　[0045] 伸烷基係可具有取代基。作為取代基並無特別限制，可舉例如鹵原子、-OH、-O-C1-6 烷基、 -N(C1-6 烷基)2 、C1-6 烷基、C6-10 芳基、-NH2 、-CN、 -C(O)O-C1-6 烷基、-COOH、-C(O)H、-NO2 等。 　　[0046] 於此，「Cp-q 」(p及q係正整數且滿足p＜q)之類用語係表示該用語之後所記載之有機基的碳原子數為p~q。例如「C1-6 烷基」之類表現，係表示碳原子數1~6的烷基。 　　[0047] 上述之取代基係可進而具有取代基(以下有稱為「二次取代基」之情形)。作為二次取代基，在無特別的記載的情形下，可使用與上述之取代基為相同者。 　　[0048] 作為可具有取代基的伸炔基，以碳原子數2~10的伸炔基為較佳，以碳原子數2~6的伸炔基為又較佳，以碳原子數2~5的伸炔基為更佳。作為伸炔基，可舉例如伸乙炔基、伸丙炔基、伸丁炔基、伸戊炔基、伸己炔基。作為伸炔基可具有的取代基，係與伸烷基可具有的取代基為相同。 　　[0049] 作為具有取代基的伸芳基，係以碳原子數6~14的伸芳基為較佳，以碳原子數6~10的伸芳基為又較佳。作為伸芳基，可舉例如伸苯基、伸萘基、伸蒽基等。作為伸芳基可具有的取代基，係與伸烷基可具有的取代基為相同。 　　[0050] 作為可具有取代基的伸雜芳基，係以碳原子數3~15的伸雜芳基為較佳，以碳原子數3~9的伸雜芳基為又較佳，以碳原子數3~6的伸雜芳基為更佳。作為伸雜芳基，可舉例如呋喃二基、吡啶二基、噻吩二基等。作為伸雜芳基可具有的取代基，係與伸烷基可具有的取代基為相同。 　　[0051] 該等之中，B1 及B2 係以由可具有取代基的伸烷基、可具有取代基的伸炔基、酯鍵、醚鍵中選出之1種以上來做組合的基為較佳，以由可具有取代基的伸烷基、酯鍵中選出之1種以上來做組合的基為又較佳。 　　[0052] C1 及C2 係分別獨立表示官能基。作為官能基，可舉例如乙烯基、甲基丙烯醯基、丙烯醯基、烯丙基、苯乙烯基、丙烯基、環氧基，以乙烯基為又較佳。 　　[0053] 以下為表示(C)成分之具體例(示例化合物)，但(C)成分並不被限定於該等中。
Figure 02_image005
[0054] 作為(C)成分可以使用市售品，可舉例如新中村化學工業公司製的「A-DOG」(上述具體例之化合物)、日本化藥公司製「KAYARAD R-604」(上述具體例之化合物)等。 　　[0055] 將樹脂成分設為100質量%時，(C)成分的含量係1質量%以上，較佳為5質量%以上，又較佳為10質量%以上。上限係50質量%以下，較佳為48質量%以下，又較佳為45質量%以下，更佳為40質量%以下。藉由將含量設為1質量%以上，故介電正切為低，進而可使污斑去除性提升，藉由設為50質量%以下，則可使鍍敷密著性及基底密著性提升。 　　[0056] 環氧樹脂與(C)成分的質量比係以(環氧樹脂：(C)成分的質量)1：0.01~1：100的範圍為較佳，以1：0.1~1：90的範圍為又較佳，以1：0.1~1：80的範圍為更佳。藉由設為如此般的範圍內，從而可提升相溶性。 　　[0057] ＜(D)無機填充材＞ 　　樹脂組成物，就降低介電正切，且使污斑去除性提升之觀點而言，除(A)~(C)成分以外，亦可含有(D)無機填充材。 　　[0058] 無機填充材的材料並無特別限定，可舉例如二氧化矽、氧化鋁、玻璃、堇青石、矽氧化物、硫酸鋇、碳酸鋇、滑石、黏土、雲母粉、氧化鋅、水滑石、水鋁礦、氫氧化鋁、氫氧化鎂、碳酸鈣、碳酸鎂、氧化鎂、氮化硼、氮化鋁、氮化錳、硼酸鋁、碳酸鍶、鈦酸鍶、鈦酸鈣、鈦酸鎂、鈦酸鉍、氧化鈦、氧化鋯、鈦酸鋇、鈦酸鋯酸鋇、鋯酸鋇、鋯酸鈣、磷酸鋯、及磷酸鎢酸鋯等。該等之中，以二氧化矽為特別適合。作為二氧化矽，可舉例如無定形二氧化矽、熔融二氧化矽、結晶二氧化矽、合成二氧化矽、中空二氧化矽等。又，作為二氧化矽係以球狀二氧化矽為較佳。無機填充材係可單獨使用1種，亦可組合2種以上來使用。 　　[0059] 無機填充材的平均粒徑，就可得到表面粗糙度較小的絕緣層、及微細配線形成性提升之觀點而言，較佳為3μm以下，又較佳為2μm以下，更佳為1μm以下。該平均粒徑的下限，並無特別限定，較佳為0.01μm以上，又較佳為0.1μm以上，更佳為0.3μm以上。作為具有如此般的平均粒徑的無機填充材的市售品，可舉例如Admatechs公司製「YC100C」、「YA050C」、「YA050C-MJE」、「YA010C」、電氣化學工業公司製「UFP-30」、德山公司製「Shirufiru NSS-3N」、「Shirufiru NSS-4N」、「Shirufiru NSS-5N」、Admatechs公司製「SO-C2」、「SO-C1」等。 　　[0060] 無機填充材的平均粒徑係可藉由基於米氏(Mie)散射理論之雷射繞射・散射法來進行測定。具體而言係可藉由雷射繞射散射式粒度分布測定裝置，依體積基準來製成無機填充材的粒度分布，並將其均粒徑作為平均粒徑來進行測定。測定樣品係以可藉由超音波，使無機填充材分散至甲基乙基酮中者為較佳使用。作為雷射繞射散射式粒度分布測定裝置，可使用堀場製作所公司製「LA-500」、島津製作所公司製「SALD-2200」等。 　　[0061] 無機填充材，就提高耐濕性及分散性之觀點而言，以利用含有氟的矽烷偶合劑、胺基矽烷系偶合劑、環氧基矽烷系偶合劑、巰基矽烷系偶合劑、矽烷系偶合劑、烷氧基矽烷、有機矽氮烷化合物、鈦酸酯系偶合劑等的1種以上的表面處理劑來進行處理為較佳。作為表面處理劑的市售品，可舉例如信越化學工業公司製「KBM403」(3-縮水甘油氧基丙基三甲氧基矽烷)、信越化學工業公司製「KBM803」(3-巰基丙基三甲氧基矽烷)、信越化學工業公司製「KBE903」(3-胺基丙基三乙氧基矽烷)、信越化學工業公司製「KBM573」(N-苯基-3-胺基丙基三甲氧基矽烷)、信越化學工業公司製「SZ-31」(六甲基二矽氮烷)、信越化學工業公司製「KBM103」(苯基三甲氧基矽烷)、信越化學工業公司製「KBM-4803」(長鏈環氧型矽烷偶合劑)、信越化學工業公司製「KBM-7103」(3,3,3-三氟丙基三甲氧基矽烷)等。 　　[0062] 藉由表面處理劑之表面處理的程度，就無機填充材的分散性提升之觀點而言，相對於無機填充材100質量份，以利用0.2質量份~5質量份的表面處理劑來進行表面處理為較佳，以利用0.2質量份~3質量份來進行表面處理為較佳，以利用0.3質量份~2質量份來進行表面處理為較佳。 　　[0063] 藉由表面處理劑之表面處理的程度，係可藉由無機填充材的每單位表面積的碳量來做評估。無機填充材的每單位表面積的碳量，就無機填充材的分散性提升之觀點而言，以0.02mg/m2 以上為較佳，以0.1mg/m2 以上為又較佳，以0.2mg/m2 以上為更佳。另一方面，就抑制樹脂清漆的熔融黏度及在薄片形態下的熔融黏度的上昇之觀點而言，以1mg/m2 以下為較佳，以0.8mg/m2 以下為又較佳，以0.5mg/m2 以下為更佳。 　　[0064] 無機填充材的每單位表面積的碳量，係可藉由溶劑(例如甲基乙基酮(MEK))將表面處理後的無機填充材洗淨處理後來進行測定。具體而言，對於經表面處理的無機填充材添加充分量的MEK作為溶劑，並以25℃下進行超音波洗淨5分鐘。除去上清液，並使固形分乾燥後，可使用碳分析計來測定無機填充材的每單位表面積的碳量。作為碳分析計，可使用堀場製作所公司製「EMIA-320V」等。 　　[0065] 若樹脂組成物含有無機填充材之情形時，無機填充材的含量，就降低介電正切，且使污斑去除性提升之觀點而言，將樹脂組成物中的不揮發成分設為100質量%時，較佳為50質量%以上，又較佳為55質量%以上，更佳為60質量%以上、65質量%以上、或70質量%以上。樹脂組成物中的無機填充材的含量的上限，就絕緣層的機械強度之觀點而言，較佳為90質量%以下，又較佳為85質量%以下，更佳為80質量%以下、或75質量%以下。 　　[0066] ＜(E)硬化促進劑＞ 　　一實施形態中，樹脂組成物系能夠含有(E)硬化促進劑。作為硬化促進劑，可舉例如磷系硬化促進劑、胺系硬化促進劑、咪唑系硬化促進劑、胍系硬化促進劑、金屬系硬化促進劑、有機過氧化物系硬化促進劑等，以磷系硬化促進劑、胺系硬化促進劑、咪唑系硬化促進劑、金屬系硬化促進劑為較佳，以咪唑系硬化促進劑、有機過氧化物系硬化促進劑為又較佳。硬化促進劑係可單獨使用1種，亦可組合2種以上來使用。 　　[0067] 作為磷系硬化促進劑，可舉例如三苯基膦、硼酸鏻化合物、四苯基鏻四苯基硼酸酯、n-丁基鏻四苯基硼酸酯、四丁基鏻癸酸鹽、(4-甲基苯基)三苯基鏻硫氰酸酯、四苯基鏻硫氰酸酯、丁基三苯基鏻硫氰酸酯等，以三苯基膦、四丁基鏻癸酸鹽為較佳。 　　[0068] 作為胺系硬化促進劑，可舉例如三乙基胺、三丁基胺等的三烷基胺、4-二甲基胺基吡啶、苄基二甲基胺、2,4,6,-參(二甲基胺基甲基)苯酚、1,8-二氮雜雙環(5,4,0)-十一烯等，以4-二甲基胺基吡啶、1,8-二氮雜雙環(5,4,0)-十一烯為較佳。 　　[0069] 作為咪唑系硬化促進劑，可舉例如2-甲基咪唑、2-十一烷基咪唑、2-十七烷基咪唑、1,2-二甲基咪唑、2-乙基-4-甲基咪唑、1,2-二甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑、1-苄基-2-甲基咪唑、1-苄基-2-苯基咪唑、1-氰乙基-2-甲基咪唑、1-氰乙基-2-十一烷基咪唑、1-氰乙基-2-乙基-4-甲基咪唑、1-氰乙基-2-苯基咪唑、1-氰乙基-2-十一烷基咪唑偏苯三甲酸鹽、1-氰乙基-2-苯基咪唑偏苯三甲酸鹽、2,4-二胺基-6-[2’-甲基咪唑基-(1’)]-乙基-s-三嗪、2,4-二胺基-6-[2’-十一烷基咪唑基-(1’)]-乙基-s-三嗪、2,4-二胺基-6-[2’-乙基-4’-甲基咪唑基-(1’)]-乙基-s-三嗪、2,4-二胺基-6-[2’-甲基咪唑基-(1’)]-乙基-s-三嗪異氰脲酸加成物、2-苯基咪唑異氰脲酸加成物、2-苯基-4,5-二羥基甲基咪唑、2-苯基-4-甲基-5-羥基甲基咪唑、2,3-二氫-1H-吡咯[1,2-a]苯并咪唑、1-十二烷基-2-甲基-3-苄基咪唑鎓氯化物、2-甲基咪唑啉、2-苯基咪唑啉等的咪唑化合物及咪唑化合物與環氧樹脂的加成物，以2-乙基-4-甲基咪唑、1-苄基-2-苯基咪唑為較佳。 　　[0070] 作為咪唑系硬化促進劑可使用市售品，可舉例如三菱化學公司製的「P200-H50」等。 　　[0071] 作為胍系硬化促進劑，可舉例如二氰二胺、1-甲基胍、1-乙基胍、1-環己基胍、1-苯基胍、1-(o-甲苯基)胍、二甲基胍、二苯基胍、三甲基胍、四甲基胍、五甲基胍、1,5,7-三氮雜雙環[4.4.0]癸-5-烯、7-甲基-1,5,7-三氮雜雙環[4.4.0]癸-5-烯、1-甲基雙胍、1-乙基雙胍、1-n-丁基雙胍、1-n-十八烷基雙胍、1,1-二甲基雙胍、1,1-二乙基雙胍、1-環己基雙胍、1-烯丙基雙胍、1-苯基雙胍、1-(o-甲苯基)雙胍等，以二氰二胺、1,5,7-三氮雜雙環[4.4.0]癸-5-烯為較佳。 　　[0072] 作為金屬系硬化促進劑，可舉例如鈷、銅、鋅、鐵、鎳、錳、錫等的金屬之有機金屬錯合物或有機金屬鹽。作為有機金屬錯合物之具體例，可舉出鈷(II)乙醯丙酮、鈷(III)乙醯丙酮等的有機鈷錯合物、銅(II)乙醯丙酮等的有機銅錯合物、鋅(II)乙醯丙酮等的有機鋅錯合物、鐵(III)乙醯丙酮等的有機鐵錯合物、鎳(II)乙醯丙酮等的有機鎳錯合物、錳(II)乙醯丙酮等的有機錳錯合物等。作為有機金屬鹽，可舉例如辛酸鋅、辛酸錫、環烷酸鋅、環烷酸鈷、硬脂酸錫、硬脂酸鋅等。 　　[0073] 作為有機過氧化物系硬化促進劑，可舉例如過氧化二異丙苯、過氧化環己酮、過氧化苯甲酸叔丁基酯、過氧化甲基乙基酮、過氧化二異丙苯、過氧化叔丁基異丙苯、過氧化二叔丁基、過氧化氫二異丙苯、過氧化氫異丙苯、過氧化氫叔丁基等。作為有機過氧化物系硬化促進劑可使用市售品，可舉例如日油公司製的「PERCUMYL D」等。 　　[0074] 若樹脂組成物含由硬化促進劑之情形時，將樹脂組成物中的不揮發成分設為100質量%時，硬化促進劑的含量係以0.01質量%~1質量%為較佳，以0.01質量%~0.5質量%為又較佳，以0.01質量%~0.1質量%為更佳。 　　[0075] ＜(F)茚香豆酮樹脂＞ 　　一實施形態中，樹脂組成物係能夠含有(F)茚香豆酮樹脂。作為茚香豆酮樹脂，可舉例如茚及香豆酮的共聚物、茚、香豆酮及苯乙烯的共聚物等。 　　[0076] 茚香豆酮樹脂中之香豆酮成分的含有比率，較佳為5莫耳%以上，又較佳為8莫耳%以上，更佳為10莫耳%以上。上限係較佳為40莫耳%以下，又較佳為35莫耳%以下，更佳為30莫耳%以下。 　　[0077] 茚香豆酮樹脂中之茚成分的含有比率，較佳為30莫耳%以上，又較佳為35莫耳%以上，更佳為40莫耳%以上。上限係較佳為80莫耳%以下，又較佳為75莫耳%以下，更佳為70莫耳%以下。 　　[0078] 若茚香豆酮樹脂為茚、香豆酮及苯乙烯的共聚物之情形時，苯乙烯成分的含有比率，較佳為20莫耳%以上，又較佳為25莫耳%以上，更佳為30莫耳%以上。上限係較佳為70莫耳%以下，又較佳為65莫耳%以下，更佳為60莫耳%以下。 　　[0079] 作為茚香豆酮樹脂的具體例，可舉出日塗化學公司製的「H-100」、「V-120S」、「V-120」等。 　　[0080] 若樹脂組成物含有茚香豆酮樹脂之情形時，就使相溶性提升之觀點而言，將樹脂組成物中的不揮發成分設為100質量%時，茚香豆酮樹脂的含量係以0.1~3質量%為較佳，以0.3~2質量%為又較佳，以0.5~1.5質量%為更佳。 　　[0081] ＜(G)熱可塑性樹脂＞ 　　一實施形態中，樹脂組成物係能夠含有(G)熱可塑性樹脂。作為熱可塑性樹脂，可舉例如苯氧基樹脂、聚乙烯縮醛樹脂、聚烯烴樹脂、聚丁二烯樹脂、聚醯亞胺樹脂、聚醯胺醯亞胺樹脂、聚醚醯亞胺樹脂、聚碸樹脂、聚醚碸樹脂、聚伸苯醚樹脂、聚碳酸酯樹脂、聚醚醚酮樹脂、聚酯樹脂，以苯氧基樹脂為較佳。熱可塑性樹脂係可單獨使用1種、或亦可組合2種以上來使用。 　　[0082] 熱可塑性樹脂的聚苯乙烯換算之重量平均分子量係較佳為8,000以上，又較佳為10,000以上，更佳為20,000以上，特佳為40,000以上。上限並無特別限定，但較佳為70,000以下，又較佳為60,000以下。熱可塑性樹脂的聚苯乙烯換算之重量平均分子量，係利用凝膠滲透層析法(GPC)法來進行測定。具體而言，熱可塑性樹脂的聚苯乙烯換算之重量平均分子量係使用作為測定裝置之島津製作所公司製LC-9A/RID-6A，作為管柱之昭和電工公司製Shodex K-800P/K-804L/K-804L，作為流動相之氯仿等，藉由在40℃下來測定管柱溫度，並使用標準聚苯乙烯的校正曲線來算出。 　　[0083] 作為苯氧基樹脂，可舉例如具有由雙酚A骨架、雙酚F骨架、雙酚S骨架、雙酚苯乙酮骨架、酚醛清漆骨架、聯苯骨架、茀骨架、二環戊二烯骨架、降冰片烯骨架、萘骨架、蒽骨架、金剛烷骨架、萜烯骨架、及三甲基環己烷骨架所成之群中選出之1種以上的骨架之苯氧基樹脂。苯氧基樹脂的末端係可以是酚性羥基、環氧基等的任意的官能基。苯氧基樹脂係可單獨使用1種，亦可組合2種以上來使用。作為苯氧基樹脂的具體例，可舉出三菱化學公司製的「1256」及「4250」(皆為含有雙酚A骨架的苯氧基樹脂)、「YX8100」(含有雙酚S骨架的苯氧基樹脂)、及「YX6954」(含有雙酚苯乙酮骨架的苯氧基樹脂)，其他以外可舉出新日鐵住金化學公司製的「FX280」及「FX293」、三菱化學公司製的「YL7500BH30」、「YX6954BH30」、「YX7553」、「YX7553BH30」、「YL7769BH30」、「YL6794」、「YL7213」、「YL7290」及「YL7482」等。 　　[0084] 作為聚乙烯縮醛樹脂，可舉例如聚乙烯甲醛樹脂、聚乙烯基丁縮醛樹脂，以聚乙烯基丁縮醛樹脂為較佳。作為聚乙烯縮醛樹脂的具體例，可舉例如電氣化學工業公司製的「電化butyral 4000-2」、「電化butyral 5000-A」、「電化butyral 6000-C」、「電化butyral 6000-EP」、積水化學工業公司製的S-LEC BH series、BX series(例如BX-5Z)、KS series(例如KS-1)、BL series、BM series等。 　　[0085] 作為聚醯亞胺樹脂的具體例，可舉出新日本理化公司製的「RIKACOAT SN20」及「RIKACOAT PN20」。作為聚醯亞胺樹脂的具體例又可舉出使2官能性羥基末端聚丁二烯、二異氰酸酯化合物及四元酸酐反應後所得之線狀聚醯亞胺(日本特開2006-37083號公報記載的聚醯亞胺)、含有聚矽氧烷骨架的聚醯亞胺(日本特開 2002-12667號公報及日本特開2000-319386號公報等所記載的聚醯亞胺)等的改質聚醯亞胺。 　　[0086] 作為聚醯胺醯亞胺樹脂的具體例，可舉出東洋紡織公司製的「VYLOMAX HR11NN」及「VYLOMAX HR16NN」。作為聚醯胺醯亞胺樹脂的具體例又可舉出日立化成工業公司製的「KS9100」、「KS9300」(含有聚矽氧烷骨架的聚醯胺醯亞胺)等的改質聚醯胺醯亞胺。 　　[0087] 作為聚醚碸樹脂的具體例，可舉出住友化學公司製的「PES5003P」等。作為聚伸苯醚樹脂的具體例，可舉出三菱瓦斯化學公司製的具有乙烯基的寡伸苯基醚・苯乙烯樹脂「OPE-2St 1200」等。 　　[0088] 作為聚碸樹脂的具體例，可舉出Solvay Advanced Polymers公司製的聚碸「P1700」、「P3500」等。 　　[0089] 其中，作為熱可塑性樹脂，係以苯氧基樹脂、聚乙烯縮醛樹脂為較佳。因此，在適合的一實施形態中，熱可塑性樹脂係包含由苯氧基樹脂及聚乙烯縮醛樹脂所成之群中選出的1種以上。其中，作為熱可塑性樹脂，係以苯氧基樹脂為較佳，以重量平均分子量為40,000以上的苯氧基樹脂為特佳。藉由使用重量平均分子量為40,000以上的苯氧基樹脂，從而可使配線電路的微細化成為可能。 　　[0090] 若樹脂組成物含有熱可塑性樹脂之情形時，將樹脂組成物中的不揮發成分設為100質量%時，熱可塑性樹脂的含量係以1~10質量%為較佳，以1.5~5質量%為又較佳，以2質量%~5質量%為更佳。 　　[0091] ＜(H)阻燃劑＞ 　　一實施形態中，樹脂組成物係能夠含有(H)阻燃劑。作為阻燃劑，可舉例如有機磷系阻燃劑、含有有機系氮的磷化合物、氮化合物、聚矽氧阻燃劑、金屬氫氧化物等。阻燃劑係可單獨使用1種、或亦可並用2種以上。 　　[0092] 作為阻燃劑可使用市售品，可舉例如三光公司製的「HCA-HQ」、大八化學工業公司製的「PX-200」等。作為阻燃劑，以難以水解者為較佳，可舉例如10-(2,5-二羥基苯基)-10-氫-9-氧雜-10-磷雜菲-10-氧化物等。 　　[0093] 若樹脂組成物含有阻燃劑之情形時，將樹脂組成物中的不揮發成分設為100質量%時，阻燃劑的含量係以0.5~20質量%為較佳，以0.5~15質量%為又較佳，以0.5~10質量%為更佳。 　　[0094] ＜(I)有機填充材＞ 　　一實施形態中，樹脂組成物係能夠含有(I)有機填充材。藉由含有(I)成分，從而可使接著薄膜之樹脂組成物層的硬化物的拉伸破壞強度提升。作為有機填充材，可使用印刷配線板的絕緣層形成用時所使用的任意有機填充材，可舉例如橡膠粒子、聚醯胺微粒子、聚矽氧粒子等。 　　[0095] 作為橡膠粒子可使用市售品，可舉例如Dow Chemical日本公司製的「EXL2655」、Aica工業公司製的「AC3401N」、「AC3816N」等。 　　[0096] 若樹脂組成物含有有機填充材之情形時，將樹脂組成物中的不揮發成分設為100質量%時，有機填充材的含量係以0.1~20質量%為較佳，以0.2~10質量%為又較佳，以0.3~5質量%、或0.5~3質量%為更佳。 　　[0097] ＜(J)任意的添加劑＞ 　　一實施形態中，樹脂組成物係進而因應所需，亦可包含其他的添加劑，作為上述其他的添加劑，可舉例如有機銅化合物、有機鋅化合物及有機鈷化合物等的有機金屬化合物、以及增稠劑、消泡劑、調平劑、密著性賦予劑、及著色劑等的樹脂添加劑等。 　　[0098] ＜樹脂組成物之物性、用途＞ 　　本發明的樹脂組成物，可得到介電正切低、鍍敷密著性及基底密著性為良好且污斑去除性為優異的絕緣層，又相溶性亦為良好。因此，本發明的樹脂組成物係可適合使用作為用來形成印刷配線板的絕緣層的樹脂組成物(印刷配線板的絕緣層用樹脂組成物)，更可適合使用作為用來形成印刷配線板的層間絕緣層的樹脂組成物(印刷配線板的層間絕緣層用樹脂組成物)。又，本發明的樹脂組成物係因可得到零件填埋性為良好的絕緣層，故印刷配線板若為零件內藏電路板之情形時亦可適合使用。 　　[0099] 在190℃下使樹脂組成物熱硬化90分鐘所得之硬化物，係展現出介電正切為低之類的特性。即，可得到介電正切低的絕緣層。作為介電正切係較佳為0.005以下，又較佳為0.0045以下，更佳為0.004以下。下限並無特別限定，能夠設為0.0001以上。介電正切之測定係可依據後述的＜介電正切之測定＞所記載之方法來進行測定。 　　[0100] 在190℃下使樹脂組成物熱硬化90分鐘而得的硬化物，係展現出與由鍍敷等所成的導體層的密著性(鍍敷密著性)為優異之類的特性。即，可得到展現出良好的鍍敷密著性的絕緣層。作為鍍敷密著性係較佳為超過0.3 kgf/cm，又較佳為0.31kgf/cm以上，更佳為0.32kgf/cm以上。上限並無特別限定，能夠設為10kgf/cm以下、或1kgf/cm以下。鍍敷密著性之測定係可依據後述的＜鍍敷密著性之測定＞所記載之方法來進行測定。 　　[0101] 在190℃下使樹脂組成物熱硬化90分鐘而得的硬化物，係展現出與銅箔等的密著性(基底密著性)為優異之類的特性。即，可得到展現出良好的基底密著性的絕緣層。作為基底密著性係較佳為超過0.3kgf/cm，又較佳為0.31kgf/cm以上，更佳為0.32kgf/cm以上。上限並無特別限定，能夠設為10kgf/cm以下、或1kgf/cm以下。基底密著性之測定係可依據後述的＜基底密著性之測定＞所記載之方法來進行測定。 　　[0102] 在190℃下使樹脂組成物熱硬化90分鐘而得的硬化物，係展現出容易去除於通孔洞形成時所產生的污斑(污斑去除性為優異)之類的特性。即，可得到展現出良好的污斑去除性的絕緣層。因為污斑去除性為優異，故從通孔洞底部的壁面側所測定的最大污斑長度係較佳為未滿3μm，又較佳為2.5μm以下，更佳為2μm以下。下限並無特別限定，能夠設為0.01μm以上。污斑去除性之測定係可依據後述的＜通孔洞底部的污斑去除性之評估＞所記載之方法來進行測定。 　　[0103] 樹脂組成物係因含有指定量的(C)成分，故展現出相溶性為優異之類的特性。因為相溶性為優異，故樹脂組成物係無法觀察到較佳為30μm以上(又較佳為40μm以上，更佳為50μm以上)的粗粒的析出、油滴。 　　[0104] [薄片狀基材] 　　本發明的樹脂組成物係亦可以清漆狀態來塗佈並使用，但工業上而言一般係以包含該樹脂組成物的薄片狀基材的形態來使用為適合。作為薄片狀基材，係以如以下所表示之接著薄膜、預浸體為較佳。 　　[0105] ＜接著薄膜＞ 　　一實施形態中，接著薄膜係包含支撐體、與被設置於該支撐體上的樹脂組成物層，且樹脂組成物層係由本發明的樹脂組成物所形成。 　　[0106] 樹脂組成物層的厚度，就印刷配線板的薄型化之觀點而言，較佳為100μm以下，又較佳為80μm以下，更佳為60μm以下，更又較佳為50μm以下或40μm以下。樹脂組成物層的厚度的下限，並無特別限定，通常能夠設為1μm以上、5μm以上、10μm以上。 　　[0107] 作為支撐體，可舉例如由塑膠材料所成的薄膜、金屬箔、脫模紙，以由塑膠材料所成的薄膜、金屬箔為較佳。 　　[0108] 若使用由塑膠材料所成的薄膜來作為支撐體之情形時，作為塑膠材料，可舉例如聚對苯二甲酸乙二醇酯(以下有時簡稱為「PET」)、聚萘二甲酸乙二醇酯(以下有時簡稱為「PEN」)等的聚酯、聚碳酸酯(以下以下有時簡稱為「PC」)、聚甲基丙烯酸甲酯(PMMA)等的丙烯酸、環狀聚烯烴、三乙醯纖維素(TAC)、聚醚硫醚(PES)、聚醚酮、聚醯亞胺等。其中，以聚對苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯為較佳，以價廉的聚對苯二甲酸乙二醇酯為特佳。 　　[0109] 若使用金屬箔來作為支撐體之情形時，作為金屬箔，可舉例如銅箔、鋁箔等，以銅箔為較佳。作為銅箔，可使用由銅的單質金屬所成的箔，亦可使用由銅與其他金屬(例如、錫、鉻、銀、鎂、鎳、鋯、矽、鈦等)的合金所成的箔。 　　[0110] 可對支撐體的與樹脂組成物層接合的面施予拋光處理、電暈處理、防靜電處理。 　　[0111] 又，作為支撐體，亦可使用在與樹脂組成物層接合的面上為具有脫模層的「附脫模層的支撐體」。作為附脫模層的支撐體的脫模層中使用的脫模劑，可舉例如由醇酸樹脂、聚烯烴樹脂、胺基甲酸酯樹脂、及聚矽氧樹脂所成之群中選出的1種以上的脫模劑。附脫模層的支撐體係可使用市售品，例如，具有將醇酸樹脂系脫模劑作為主成分的脫模層的PET薄膜，可舉出LINTEC公司製的「SK-1」、「AL-5」、「AL-7」、Toray公司製的「Lumirror T60」帝人公司製的「PUREX」、Unitika公司製的「Unipeel」等。 　　[0112] 作為支撐體的厚度，並無特別限定，以5μm~75μm的範圍為較佳，以10μm~60μm的範圍為又較佳。尚，若使用附脫模層的支撐體之情形時，附脫模層的支撐體全體的厚度以設為上述範圍為較佳。 　　[0113] 接著薄膜可藉由例如下述之方法來進行製造：調製在有機溶劑中為溶解有樹脂組成物而成的樹脂清漆，使用模塗佈機等將該樹脂清漆塗佈至支撐體上，進而使其乾燥從而形成樹脂組成物層。 　　[0114] 作為有機溶劑，可舉例如丙酮、甲基乙基酮(MEK)及環己酮等的酮類、乙酸乙酯、乙酸丁酯、乙酸溶纖劑、丙二醇單甲基醚乙酸酯及卡必醇乙酸酯等的乙酸酯類、溶纖劑及丁基卡必醇等的卡必醇類、甲苯及二甲苯等的芳香族烴類、二甲基甲醯胺、二甲基乙醯胺(DMAc)及N-甲基吡咯啶酮等的醯胺系溶劑等。有機溶劑係可單獨使用1種，亦可組合2種以上來使用。 　　[0115] 乾燥可藉由加熱、吹拂熱風等的周知方法來實施。乾燥條件並無別限定，樹脂組成物層中的有機溶劑的含量為10質量%以下，較佳以成為5質量%以下之方式來使其乾燥。依據樹脂清漆中的有機溶劑的沸點而有所不同，但例如若使用包含30質量%~60質量%的有機溶劑的樹脂清漆之情形時，可藉由在50℃~150℃下使其乾燥3分鐘~10分鐘乾燥，從而形成樹脂組成物層。 　　[0116] 接著薄膜中，在樹脂組成物層的未與支撐體接合的面(即，與支撐體為相反側的面)上，可進而層合依據支撐體的保護薄膜。保護薄膜的厚度並無特別限定，例如1μm~40μm。藉由層合保護薄膜，可防止灰塵等的附著於樹脂組成物層的表面或損傷。接著薄膜將可能捲取成輥狀來保存。若接著薄膜具有保護薄膜之情形時，藉由將保護薄膜剝下來後而可使用。 　　[0117] ＜預浸體＞ 　　一實施形態中，預浸體係將本發明的樹脂組成物含浸在薄片狀纖維基材中來形成。 　　[0118] 預浸體中使用的薄片狀纖維基材並無特別限定，可使用玻璃布、芳香族聚醯胺不織布、液晶聚合物不織布等的作為預浸體用基材而常被使用者。就印刷配線板的薄型化之觀點而言，薄片狀纖維基材的厚度係較佳為50μm以下，又較佳為40μm以下，更佳為30μm以下，更又較佳為20μm以下。薄片狀纖維基材的厚度的下限並無特別限定，但通常為10μm以上。 　　[0119] 預浸體係可藉由熱溶法、溶劑法等的周知方法來製造。 　　[0120] 預浸體的厚度係能夠設為與上述接著薄膜中的樹脂組成物層為相同的範圍。 　　[0121] [印刷配線板、印刷配線板之製造方法] 　　本發明的印刷配線板係包含絕緣層、第1導體層、及第2導體層，該絕緣層係藉由本發明的樹脂組成物的硬化物所形成。絕緣層係被設置於第1導體層與第2導體層之間，且將第1導體層與第2導體層予以絕緣(導體層有時稱為配線層)。 　　[0122] 第1及第2導體層間的絕緣層的厚度係較佳為6μm以下，又較佳為5.5μm以下，更佳為5μm以下。對於下限並無特別限定，但能夠設為0.1μm以上。所謂第1導體層與第2導體層的間隔(第1及第2導體層間的絕緣層的厚度)係指如圖1所表示之一例般，第1導體層1的主面11與第2導體層2的主面21間之絕緣層3的厚度t1。第1及第2導體層係介隔著絕緣層並鄰近的導體層，主面11及主面21係互相面對。第1及第2導體層間的絕緣層的厚度，係可依據後述的＜導體層間的間隔(導體層間的絕緣層的厚度)之測定＞所記載之方法來進行測定。 　　[0123] 尚，絕緣層全體的厚度t2係較佳為30μm以下，又較佳為20μm以下，更佳為15μm以下、或10μm以下。對於下限並無特別限定，但通常能夠設為1μm以上、1.5μm以上、2μm以上。 　　[0124] 印刷配線板係使用上述接著薄膜，並可藉由包含下述(I)及(II)之步驟之來進行製造。 　　(I)在內層基板上，以接著薄膜的樹脂組成物層與內層基板接合之方式來進行層合之步驟； 　　(II)將樹脂組成物層熱硬化後形成絕緣層之步驟。 　　[0125] 步驟(I)中使用的所謂的「內層基板」係指主要為玻璃環氧基板、金屬基板、聚酯基板、聚醯亞胺基板、BT樹脂基板、熱硬化型聚伸苯醚基板等的基板、或在該基板的單面或雙面上形成有經圖型加工的導體層(電路)的電路基板。又於製造印刷配線板時，進而應形成絕緣層及/或導體層的中間製造物的內層電路基板，亦包含在本發明所謂的「內層基板」中。若印刷配線板為零件內藏電路板之情形時，能夠使用內藏零件的內層基板。 　　[0126] 內層基板與接著薄膜的層合，可藉由例如從支撐體側將接著薄膜加熱壓黏至內層基板來進行。將接著薄膜加熱壓黏至內層基板的構件(以下亦稱為「加熱壓黏構件」)，可舉例如經加熱的金屬板(SUS鏡板等)或金屬輥(SUS輥)等。尚，不將加熱壓黏構件直接按壓(press)在接著薄膜，而是以接著薄膜可充分地追隨內層基板的表面凹凸並介隔著耐熱橡膠等的彈性材來進行按壓為較佳。 　　[0127] 內層基板與接著薄膜的層合，可藉由真空層合法來實施。真空層合法中，加熱壓黏溫度係較佳為60℃~160℃，又較佳為80℃~140℃的範圍，加熱壓黏壓力係較佳為0.098MPa~1.77MPa，又較佳為0.29MPa~1.47MPa的範圍，加熱壓黏時間係較佳為20秒鐘~400秒鐘，又較佳為30秒鐘~300秒鐘的範圍。層合係較佳為在壓力26.7hPa以下的減壓條件下來實施。 　　[0128] 層合係可藉由市售的真空貼合機來進行。作為市售的真空貼合機，可舉例如名機製作所公司製的真空加壓式貼合機、Nikko-Materials公司製的真空貼合機、分批式真空加壓貼合機等。 　　[0129] 於層合之後，在常壓下(大氣壓下)例如藉由將加熱壓黏構件從支撐體側來予以按壓，從而可進行已層合的接著薄膜的平滑化處理。平滑化處理之按壓條件係可設為與上述層合之加熱壓黏條件為相同之條件。平滑化處理係可藉由市售的貼合機來進行。尚，層合與平滑化處理係可使用上述之市售的真空貼合機來連續地進行。 　　[0130] 支撐體可以在步驟(I)與步驟(II)之間來去除，亦可以在步驟(II)之後來去除。 　　[0131] 步驟(II)中，將樹脂組成物層熱硬化後來形成絕緣層。 　　[0132] 樹脂組成物層之熱硬化條件並無特別限定，於形成印刷配線板的絕緣層時，可使用一般所採用之條件。 　　[0133] 例如樹脂組成物層之熱硬化條件，係依樹脂組成物的種類等而有所不同，硬化溫度係可設為120℃~240℃的範圍(較佳為150℃~220℃的範圍，又較佳為170℃~200℃的範圍)，硬化時間係可設為5分鐘~120分鐘的範圍(較佳為10分鐘~100分鐘，又較佳為15分鐘~90分鐘)。 　　[0134] 使樹脂組成物層熱硬化前，可藉由比硬化溫度更低的溫度來將樹脂組成物層進行預熱。例如在使樹脂組成物層熱硬化之前，在50℃以上未滿120℃(較佳為60℃以上110℃以下，又較佳為70℃以上100℃以下)的溫度下，將樹脂組成物層預熱5分鐘以上(較佳為5分鐘~150分鐘，又較佳為15分鐘~120分鐘)。 　　[0135] 於製造印刷配線板時，亦可進而實施(III)在絕緣層開孔之步驟、(IV)對絕緣層進行粗糙化處理之步驟、(V)形成導體層之步驟。該等的步驟(III)至(V)，可依據印刷配線板的製造中該業者所使用的周知的各種方法來予以實施。尚，於步驟(II)之後去除支撐體之情形時，該支撐體的去除係可於步驟(II)與步驟(III)之間、步驟(III)與步驟(IV)之間、或步驟(IV)與步驟(V)之間來實施。又，因應所需重複實施步驟(II)~(V)的絕緣層及導體層的形成，從而可形成多層配線板。此情形時，分別的導體層間的絕緣層的厚度(圖1的t1)係以上述範圍內為較佳。 　　[0136] 步驟(III)係在絕緣層開孔之步驟，藉此可在絕緣層形成通孔洞、穿通孔等的孔洞。步驟(III)係因應絕緣層的形成中使用的樹脂組成物之組成等，可使用例如鑽孔、雷射、電漿等來實施。孔洞的尺寸或形狀係可因應印刷配線板的設計來適當決定。 　　[0137] 步驟(IV)係對絕緣層進行粗糙化處理之步驟。粗糙化處理的程序、條件並無特別限定，於形成印刷配線板的絕緣層時，可採用通常所使用的周知的程序、條件。例如可依序實施藉由膨潤液之膨潤處理、藉由氧化劑之粗糙化處理、藉由中和液之中和處理，來對絕緣層進行粗糙化處理。作為粗糙化處理中使用的膨潤液並無特別限定，可舉出鹼溶液、界面活性劑溶液等，較佳為鹼溶液，作為該鹼溶液，以氫氧化鈉溶液、氫氧化鈣溶液為又較佳。作為市售的膨潤液，可舉例如Atotech Japan公司製的「Swelling Dip Securiganth P」、「Swelling Dip Securiganth SBU」等。藉由膨潤液之膨潤處理並無特別限定，例如可藉由將絕緣層浸漬在30℃~90℃的膨潤液中1分鐘~20分鐘從而進行。就將絕緣層的樹脂的膨潤抑制在適度的水平之觀點而言，以將絕緣層浸漬在40℃~80℃的膨潤液中5分鐘~15分鐘為較佳。作為粗糙化處理中使用的氧化劑，並無特別限定，可舉例如在氫氧化鈉的水溶液中溶解過錳酸鈣或過錳酸鈉的鹼性過錳酸溶液。藉由鹼性過錳酸溶液等的氧化劑之粗糙化處理係藉由將絕緣層浸漬加熱至60℃~80℃的氧化劑溶液中10分鐘~30分鐘來進行為較佳。又，鹼性過錳酸溶液中之過錳酸鹽的濃度係以5質量%~10質量%為較佳。作為市售的氧化劑，可舉例如Atotech Japan公司製的「Concentrate Compact CP」、「Dosing Solution Securiganth P」等的鹼性過錳酸溶液。又，作為粗糙化處理中使用的中和液，係以酸性的水溶液為較佳，做為市售品，可舉例如Atotech Japan公司製的「Reduction solution Securiganth P」。藉由中和液之處理係可藉由將進行了經氧化劑之粗糙化處理的處理面浸漬在30℃~80℃的中和液中5分鐘~30分鐘來進行。就作業性等之點而言，以將藉由氧化劑之粗糙化處理的對象物浸漬在40℃~70℃的中和液中5分鐘~20分鐘之方法為較佳。 　　[0138] 一實施形態中，粗糙化處理後的絕緣層表面的算術平均粗糙度Ra係較佳為400nm以下，又較佳為350nm以下，更佳為300nm以下。對於下限並無特別限定，但較佳為0.5nm以上，又較佳為1nm以上。又，粗糙化處理後的絕緣層表面的均方平方根粗糙度Rq係較佳為400nm以下，又較佳為350nm以下，更佳為300nm以下，對於下限並無特別限定，但較佳為0.5nm以上，又較佳為1nm以上。絕緣層表面的算術平均粗糙度(Ra)及均方平方根粗糙度(Rq)係可使用非接觸型表面粗糙度計來進行測定。 　　[0139] 步驟(V)係形成導體層之步驟。若在內層基板未形成導體層之情形時，步驟(V)係形成第1導體層之步驟，若在內層基板形成導體層之情形時，該導體層為第1導體層，故步驟(V)係形成第2導體層之步驟。 　　[0140] 導體層中使用的導體材料並無特別限定。適合的實施形態中，導體層係包含由金、白金、鈀、銀、銅、鋁、鈷、鉻、鋅、鎳、鈦、鎢、鐵、錫及銦所成之群中選出的1種以上的金屬。導體層可以是單質金屬層，亦可以是合金層，作為合金層，可舉例如由上述之群中所選出的2種以上的金屬的合金(例如鎳・鉻合金、銅・鎳合金及銅・鈦合金)所形成的層。其中，就導體層形成的通用性、成本、圖型化的容易性等之觀點而言，以鉻、鎳、鈦、鋁、鋅、金、鈀、銀或銅的單質金屬層、或鎳・鉻合金、銅・鎳合金、銅・鈦合金的合金層為較佳，以鉻、鎳、鈦、鋁、鋅、金、鈀、銀或銅的單質金屬層、或鎳・鉻合金的合金層為又較佳，以銅的單質金屬層為更佳。 　　[0141] 導體層可以是單層構造、亦可以是由不同種類的金屬或合金所成的單質金屬層或合金層層合2層以上的多層構造。若導體層為多層構造之情形時，與絕緣層相接的層係以鉻、鋅或鈦的單質金屬層、或鎳・鉻合金的合金層為較佳。 　　[0142] 導體層的厚度係依據所期望的印刷配線板的設計，一般為3μm~35μm，較佳為5μm~30μm。 　　[0143] 一實施形態中，導體層係可藉由鍍敷來形成。例如可藉由半加成法、全加成法等的以往周知的技術，鍍敷在絕緣層的表面來形成具有所期望的配線圖型的導體層。以下，表示藉由半加成法來形成導體層之例子。 　　[0144] 首先，在絕緣層的表面上，藉由無電解鍍敷來形成鍍敷種晶層。接下來，在形成的鍍敷種晶層上，對應所期望的配線圖型來形成使鍍敷種晶層的一部份露出的遮罩圖型。在露出的鍍敷種晶層上，藉由電解鍍敷來形成金屬層後，去除遮罩圖型。之後，藉由蝕刻等來去除不要的鍍敷種晶層，可形成具有所期望的配線圖型的導體層。 　　[0145] 本發明的接著薄膜係因可得到零件填埋性亦為良好的絕緣層，故印刷配線板若為零件內藏電路板之情形時亦可適合使用。零件內藏電路板係可藉由周知的製造方法來製作。 　　[0146] 使用本發明的接著薄膜所製造的印刷配線板，可以是具備接著薄膜之樹脂組成物層為硬化物的絕緣層、與被埋置在絕緣層中的埋入型配線層之樣態。 　　[0147] 其他的實施形態中，印刷配線板係可使用上述之預浸體來製造。製造方法係基本上與使用接著薄膜之情形為相同。 　　[0148] [半導體裝置] 　　本發明的半導體裝置係包含本發明的印刷配線板。本發明的半導體裝置係可使用本發明的印刷配線板來製造。 　　[0149] 作為半導體裝置，可舉出被供給於電氣製品(例如電腦、行動電話、數位相機及電視等)及交通工具(例如摩托車、汽車、電車、船舶及飛機等)等的各種半導體裝置。 　　[0150] 本發明的半導體裝置，可藉由在印刷配線板的導通部位安裝零件(半導體晶片)來製造。所謂的「導通部位」係指「印刷配線板中的傳達電信號的部位」，其位置可以是表面、或被埋入的部位均可。又，半導體晶片只要是將半導體作為材料的電氣電路元件即可，並無特別限定。 　　[0151] 製造半導體裝置時的半導體晶片之安裝方法，只要是使半導體晶片有效地發揮功能即可，並無特別限定，但具體而言可舉出導線接合安裝方法、倒裝晶片安裝方法、藉由無凸塊增層(BBUL)之安裝方法、藉由異向性導電薄膜(ACF)之安裝方法、藉由非導電性薄膜(NCF)之安裝方法等。於此，所謂的「藉由無凸塊增層(BBUL)之安裝方法」係指「將半導體晶片直接埋入印刷配線板的凹部，使半導體晶片與印刷配線板上的配線接續之安裝方法」。 [實施例] 　　[0152] 以下，藉由實施例具體地來說明本發明。本發明並不被限定於該等之實施例中。尚，下述的「份」及「%」，若如無特別說明，則分別意味著「質量份」及「質量%」。 　　[0153] ＜實施例1＞ 　　將聯二甲酚型環氧樹脂(三菱化學公司製「YX4000HK」、環氧當量約185)40份，在溶劑石油腦30份中一邊攪拌一邊加熱溶解，之後冷卻至室溫。將無機填充材(Admatechs公司製「SO-C2」、平均粒徑0.5μm、每單位表面積的碳量0.38mg/m2 )330份進行混合，並用三輥來混練使其分散。於此中，將活性酯系硬化劑(DIC公司製「HPC-8000-65T」、活性基當量約223的不揮發分65%的甲苯溶液)92.3份、具有5員環以上的環狀醚構造之化合物(新中村化學工業公司製「A-DOG」)15份、茚香豆酮樹脂(日塗化學公司製「H-100」)5份、作為硬化促進劑之4-二甲基胺基吡啶(DMAP)的5%的MEK溶液2份及過氧化二異丙苯(日油公司製「PERCUMYL D」)0.13份進行混合，利用旋轉混和機來均勻地分散，從而製作樹脂清漆1。 　　[0154] 藉由模塗佈機，將樹脂清漆1以乾燥後的樹脂組成物層的厚度成為40μm之方式來均勻地塗佈至附有醇酸系脫模處理的聚對苯二甲酸乙二醇酯薄膜(PET薄膜、LINTEC公司製「AL-5」、厚度38μm)的脫模面上，並以80~110℃(平均95℃)下乾燥5分鐘，從而製作接著薄膜1。 　　[0155] ＜實施例2＞ 　　實施例1中，將聯二甲酚型環氧樹脂(三菱化學公司製「YX4000HK」、環氧當量約185)從40份變更成25份，將無機填充材(Admatechs公司製「SO-C2」、平均粒徑0.5μm、每單位表面積的碳量0.38mg/m2 )從330份變更成320份，將活性酯系硬化劑(DIC公司製「HPC-8000-65T」、活性基當量約223的不揮發分65%的甲苯溶液)從92.3份變更成61.5份，將具有5員環以上的環狀醚構造之化合物(新中村化學工業公司製「A-DOG」)從15份變更成40份。除以上的事項以外係採與實施例1相同之方式來製作樹脂清漆2及接著薄膜2。 　　[0156] ＜實施例3＞ 　　實施例1中，將具有5員環以上的環狀醚構造之化合物(新中村化學工業公司製「A-DOG」)從15份變更成1.5份，將聯二甲酚型環氧樹脂(三菱化學公司製「YX4000HK」、環氧當量約185)從40份變更成45份，將活性酯系硬化劑(DIC公司製「HPC-8000-65T」、活性基當量約223的不揮發分65%的甲苯溶液)從92.3份變更成84.6份，進而混合熱可塑性樹脂(三菱瓦斯化學公司製「OPE-2St 1200」、不揮發分60%的甲苯溶液)22.5份。除以上的事項以外係採與實施例1相同之方式來製作樹脂清漆3及接著薄膜3。 　　[0157] ＜實施例4＞ 　　實施例1中，將聯二甲酚型環氧樹脂(三菱化學公司製「YX4000HK」、環氧當量約185)從40份變更成20份，將無機填充材(Admatechs公司製「SO-C2」、平均粒徑0.5μm、每單位表面積的碳量0.38mg/m2 )從330份變更成310份，將活性酯系硬化劑(DIC公司製「HPC-8000-65T」、活性基當量約223的不揮發分65%的甲苯溶液)從92.3份變更成46.2份，將具有5員環以上的環狀醚構造之化合物(新中村化學工業公司製「A-DOG」)從15份變更成50份。除以上的事項以外係採與實施例1相同之方式來製作樹脂清漆4及接著薄膜4。 　　[0158] ＜比較例1＞ 　　實施例1中，將聯二甲酚型環氧樹脂(三菱化學公司製「YX4000HK」、環氧當量約185)從40份變更成20份，將無機填充材(Admatechs公司製「SO-C2」、平均粒徑0.5μm、每單位表面積的碳量0.38mg/m2 )從330份變更成310份，將活性酯系硬化劑(DIC公司製「HPC-8000-65T」、活性基當量約223的不揮發分65%的甲苯溶液)從92.3份變更成46.2份，將具有5員環以上的環狀醚構造之化合物(新中村化學工業公司製「A-DOG」)從15份變更成60份。除以上的事項以外係採與實施例1相同之方式來製作樹脂清漆5及接著薄膜5。 　　[0159] ＜比較例2＞ 　　實施例3中，將具有5員環以上的環狀醚構造之化合物(新中村化學工業公司製「A-DOG」)從1.5份變更成0.5份，將熱可塑性樹脂(三菱瓦斯化學公司製「OPE-2St 1200」、不揮發分60%的甲苯溶液)從22.5份變更成24.2份。除以上的事項以外係採與實施例3相同之方式來製作樹脂清漆6及接著薄膜6。 　　[0160] ＜比較例3＞ 　　實施例1中，將具有5員環以上的環狀醚構造之化合物(新中村化學工業公司製「A-DOG」)15份，變更成具有乙烯基之樹脂(新中村化學工業公司製「23G」)15份。除以上的事項以外係採與實施例1相同之方式來製作樹脂清漆7及接著薄膜7。 　　[0161] ＜比較例4＞ 　　實施例1中，將具有5員環以上的環狀醚構造之化合物(新中村化學工業公司製「A-DOG」)15份，變更成具有乙烯基之樹脂(新中村化學工業公司製「A-DCP」)15份。除以上的事項以外係採與實施例1相同之方式來製作樹脂清漆8及接著薄膜8。 　　[0162] ＜比較例5＞ 　　實施例1中，將具有5員環以上的環狀醚構造之化合物(新中村化學工業公司製「A-DOG」)15份，變更成熱可塑性樹脂(三菱瓦斯化學公司製「OPE-2St 1200」、不揮發分60%的甲苯溶液)25份。除以上的事項以外係採與實施例1相同之方式來製作樹脂清漆9及接著薄膜9。 　　[0163] [評估方法] ＜硬化物性評估用樣品之製作＞ 　　將實施例及比較例所得之接著薄膜，以190℃使其熱硬化90分鐘，藉由剝離支撐體的PET薄膜，從而製作薄片狀的硬化物評估用樣品。 　　[0164] ＜介電正切之測定＞ 　　從硬化物評估用樣品中裁切出寬2mm、長80mm的試片。使用Agilent Technologies公司製之測定裝置「HP8362B」，藉由空腔共振擾動法(cavity resonance perturbation method)對於裁切出的試片，以測定頻率5.8GHz、測定溫度23℃來測定介電正切，並依以下之基準來進行評估。 　　[0165] ＜相溶性之評估＞ 　　使用顯微鏡(Hirox公司製「DIGITAL MICROSCOPE KH-8700」)，在面積1cm2 的範圍內觀察實施例及比較例所製作之接著薄膜之樹脂組成物層側，確認粗粒之有無，並依以下之基準來進行評估。 　　良：在樹脂組成物層中，並無觀察到50μm以上的粗粒之析出、油滴。 　　不良：在樹脂組成物層中，可觀察到50μm以上的粗粒之析出、油滴。 　　[0166] ＜評估基板之調製＞ (1)基板之基底處理 　　準備已形成內層電路之玻璃布基材環氧樹脂雙面覆銅層合板(銅箔的厚度18μm、基板的厚度0.4mm、Panasonic公司製「R1515A」)。該層合板係在表面上具有作為第1導體層的銅箔。將該層合體的雙面浸漬於MEC公司製「CZ8101」並蝕刻1μm來進行銅表面的粗糙化處理，從而製作內層電路基板。 　　[0167] (2)接著薄膜之層合處理 　　使用分批式真空加壓貼合機(名機公司製「MVLP-500」)，以樹脂組成物層與內層電路基板接合之方式，將實施例及比較例所製作之接著薄膜層合處理至內層電路基板的雙面。層合處理係於減壓30秒鐘並將氣壓設為13hPa以下後，藉由以100℃、壓力0.74MPa下壓黏30秒鐘來進行。之後，利用烘箱以190℃、加熱90分鐘，從而得到使樹脂組成物層硬化的絕緣層。 　　[0168] (3)通孔洞形成 　　使用日立Via Mechanics公司製CO2 雷射加工機(LC-2E21B/1C)，以遮罩徑1.60mm、焦距偏差值值0.050、脈衝寬25μs、功率0.66W、孔徑13、發射數2、脈衝間歇模式之條件下，對絕緣層的一部份照射雷射，並對該絕緣層的一部份施予開孔加工。藉由開孔加工所形成的孔(通孔洞)的頂端口徑(直徑)為50μm。之後，將支撐體的PET薄膜進行剝離。 　　[0169] (4)粗糙化處理 　　使用膨潤液、氧化劑、中和液的表面處理劑的套組，將已形成絕緣層之內層電路基板來進行濕式粗糙化處理。具體而言，將已形成絕緣層之內層電路基板以60℃下浸漬10分鐘於膨潤液之Atotech Japan公司製的含有二乙二醇單丁基醚的Swelling Dip Securiganth P(乙二醇類、氫氧化鈉的水溶液)中，接下來，以80℃下浸漬20分鐘於作為氧化劑之Atotech Japan公司製的Concentrate Compact P (KMnO4 ：60g/L、NaOH：40g/L的水溶液)中，最後，以40℃下浸漬5分鐘於作為中和液之Atotech Japan公司製的Reduction solution Securiganth P(硫酸的水溶液)中，之後以80℃下乾燥30分鐘。將所得之基板作為評估基板A。 　　[0170] (5)藉由半加成工法之鍍敷 　　將評估基板A以40℃下浸漬5分鐘於包含PdCl2 的無電解鍍敷用溶液中，接下來，在無電解銅鍍敷液中以25℃下浸漬20分鐘。將浸漬後的評估基板A，藉以150℃加熱30分鐘並進行退火處理後，施予硫酸銅電解鍍敷，以30μm的厚度來形成第2導體層。將所得之具有第2導體層之評估基板A，藉以190℃、60分鐘來進行退火處理，並將所得之基板作為評估基板B。 　　[0171] ＜鍍敷密著性之測定＞ 　　在評估基板B之第2導體層上，切開寬10mm、長100mm的部分的切口，將其一端剝開並利用夾片器(TSE公司製、AUTO COM型試驗機AC-50C-SL)夾住，測定在室溫(25℃)中，以50mm/分的速度沿著垂直方向剝離35mm時的荷重(kgf/cm)。 　　[0172] ＜通孔洞底部的污斑去除性之評估＞ 　　藉由掃描式電子顯微鏡(SEM)來觀察評估基板A的通孔洞底部的周圍，從所得之畫面測定自通孔洞底部的壁面側的最大污斑長度。於此，所謂的「最大污斑長度」係指從通孔底面的圓周到圓中心的污斑的最大長度之意。評估係如以下般。 　　良：最大污斑長度為未滿3μm 　　不良：最大污斑長度為3μm以上 　　[0173] ＜基底密著性之測定＞ (1)銅箔的基底處理 　　將三井金屬礦山公司製「3EC-III」(電界銅箔、35μm)的光澤面浸漬於MEC公司製MECetchBOND「CZ-8101」中，對銅表面進行粗糙化處理(Ra值=1μm)，並施予防鏽處理(CL8300)。將該銅箔稱為CZ銅箔。進而，利用130℃的烘箱加熱處理30分鐘。 　　[0174] (2)銅箔的層合與絕緣層形成 　　使用分批式真空加壓貼合機(名機公司製「MVLP-500」)，以樹脂組成物層與內層電路基板接合之方式，將實施例及比較例所製作之接著薄膜層合處理至內層電路基板的雙面。層合處理係於減壓30秒鐘並將氣壓設為13hPa以下後，藉由以100℃、壓力0.74MPa下壓黏30秒鐘來進行。從已層合處理的接著薄膜上將支撐體的PET薄膜進行剝離。使用與上述為相同之條件，將「3EC-III」的CZ銅箔的處理面層合至支撐體已剝離的樹脂組成物層上。然後，藉由以190℃、90分鐘之硬化條件下將樹脂組成物層硬化來形成絕緣層，從而製作樣品。 　　[0175] (3)銅箔剝離強度(密著性)之測定 　　將製作之樣品切斷成150×30mm的小片。使用切割機，在小片的銅箔部分上切開寬10mm、長100mm的部分的切口，將銅箔的一端剝開並利用夾片器(TSE公司製、AUTO COM型試驗機、「AC-50C-SL」)夾住，使用英斯特萬能試驗機，依據JIS C6481來測定在室溫中，以50mm/分的速度沿著垂直方向剝離35mm時的荷重。 　　[0176] 將上述之實施例及比較例之結果表示於下述之表中。下述之表中，簡稱之意思係如下述般。 　　YX4000HK：聯二甲酚型環氧樹脂(三菱化學公司製「YX4000HK」) 　　HPC-8000-65T：活性酯系硬化劑(DIC公司製「HPC-8000-65T」) 　　A-DOG：二噁烷丙烯酸單體(新中村化學工業公司製「A-DOG」) 　　A-DCP：二環戊烷丙烯酸單體(新中村化學工業公司製「A-DCP」) 　　23G：環氧乙烷丙烯酸單體(新中村化學工業公司製「23G」) 　　OPE-2St 1200：熱可塑性樹脂(三菱瓦斯化學公司製「OPE-2St 1200」) 　　H-100：茚香豆酮樹脂(日塗化學公司製「H-100」) 　　SO-C2：球狀二氧化矽(Admatechs公司製「SO-C2」) 　　PERCUMYL D：過氧化二異丙苯(日油公司製) 　　DMAP：4-二甲基胺基吡啶 　　尚，表中的調配量係固形分換算值，「(A)成分的含量(質量%)」、「(B)成分的含量(質量%)」、及「(C)成分的含量(質量%)」係表示將樹脂成分設為100質量%之情形時的含量。 　　[0177]
Figure 02_image007
[0178] 由表1之結果可得知，含有(A)~(C)成分並含有指定量的(C)成分的實施例1~4，係介電正切、相溶性、鍍敷密著性、基底密著性、及污斑去除性均為優異。 　　[0179] 另一方面，雖含有(A)~(C)成分，但將樹脂成分設為100質量%時，(C)成分的含量為超過50質量%的比較例1，與實施例1~4相較時，可得知鍍敷密著性及基底密著性為差。 　　雖含有(A)~(C)成分，但將樹脂成分設為100質量%時，(C)成分的含量為未滿1質量%的比較例2，與實施例1~4相較時，可得知污斑去除性為差。 　　未含有(C)成分的比較例3，與實施例1~4相較時，可得知介電正切為差。 　　又，未含有(C)成分的比較例4~5，由於相溶性為差，故無法測定介電正切、鍍敷密著性、基底密著性、及污斑去除性。 　　[0180] 尚，即使實施例1~4為未含有(D)成分~(G)成分之情形，但可確認儘管程度上略有差異仍可歸屬於與上述實施例為相同之結果。[Best Mode for Carrying out the Invention] [0011] Hereinafter, the resin composition, sheet-like base material, adhesive film, printed wiring board, and semiconductor device of the present invention will be described in detail. [Resin Composition] The resin composition of the present invention contains (A) an epoxy resin, (B) a hardener, and (C) a compound having a cyclic ether structure having five or more membered rings, and the resin composition is composed of When it is 100 mass %, content of (C)component is 1 mass % - 50 mass %. Thereby, a resin composition with good compatibility can be provided, which can obtain an insulating layer with a low dielectric tangent, good plating adhesion and substrate adhesion, and excellent stain removability. [0013] The term "resin component" refers to the component obtained by removing the (D) inorganic filler described later among the non-volatile components constituting the resin composition. Hereinafter, each component contained in the resin composition will be described in detail. <(A) Epoxy resin> The resin composition contains (A) epoxy resin. As (A) epoxy resin, fluorine-containing epoxy resin such as bisphenol AF type epoxy resin and perfluoroalkyl type epoxy resin; bisphenol A type epoxy resin; bisphenol F type ring is mentioned, for example Oxygen resin; bisphenol S type epoxy resin; bixylenol type epoxy resin; dicyclopentadiene type epoxy resin; trisphenol type epoxy resin; naphthol novolak type epoxy resin; phenol novolak type epoxy resin; tert-butyl-catechol type epoxy resin; naphthalene type epoxy resin; naphthol type epoxy resin; anthracene type epoxy resin; glycidylamine type epoxy resin; glycidyl ester type epoxy resin Resin; cresol novolac type epoxy resin; biphenyl type epoxy resin; linear aliphatic epoxy resin; epoxy resin with butadiene structure; alicyclic epoxy resin; heterocyclic epoxy resin; Epoxy resin containing spiro ring; cyclohexanedimethanol type epoxy resin; naphthyl ether type epoxy resin; trimethylol type epoxy resin; tetraphenylethane type epoxy resin, etc. An epoxy resin type may be used individually by 1 type, and may be used in combination of 2 or more types. [0015] The epoxy resin is preferably an epoxy resin containing two or more epoxy groups in one molecule. It is preferable that the epoxy resin system which has two or more epoxy groups in 1 molecule is at least 50 mass % or more when the non-volatile matter of an epoxy resin is made into 100 mass %. The epoxy resin is preferably an epoxy resin having two or more epoxy groups in one molecule and being liquid at a temperature of 20° C. (hereinafter referred to as a “liquid epoxy resin”), and/or one epoxy resin in a liquid state. The epoxy resin having three or more epoxy groups in the molecule and being solid at a temperature of 20° C. (hereinafter referred to as “solid epoxy resin”) is preferably a solid epoxy resin. As the epoxy resin, a liquid epoxy resin and a solid epoxy resin may be used in combination. As the liquid epoxy resin, preferably bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin , Glycidylamine type epoxy resin, phenol novolak type epoxy resin, alicyclic epoxy resin with ester skeleton, cyclohexane dimethanol type epoxy resin, glycidylamine type epoxy resin, Epoxy resin with alkene structure; preferably glycidylamine type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin and naphthalene type epoxy resin. Specific examples of liquid epoxy resins include "HP4032", "HP4032D", and "HP4032SS" (naphthalene-type epoxy resins) manufactured by DIC Corporation, "828US" and "jER828EL" (double-type epoxy resins) manufactured by Mitsubishi Chemical Corporation. Phenol A type epoxy resin), "jER807" (bisphenol F type epoxy resin), "jER152" (phenol novolac type epoxy resin), "630", "630LSD" (glycidylamine type epoxy resin) , "ZX1059" (mixture of bisphenol A epoxy resin and bisphenol F epoxy resin) manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., "YD-8125G" manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd. epoxy resin), "EX-721" (glycidyl ester type epoxy resin) manufactured by Nagasechemtex, "CELOXIDE 2021P" (alicyclic epoxy resin having an ester skeleton) manufactured by DAICEL, "PB-3600" (epoxy resin having a butadiene structure), "ZX1658", "ZX1658GS" (liquid 1,4-glycidylcyclohexane) manufactured by Nippon Steel Chemical Co., Ltd., "E-7432 manufactured by Daikin Industries Ltd."","E-7632" (perfluoroalkyl epoxy resin), etc. These systems may be used alone or in combination of two or more. As solid epoxy resin, preferably naphthalene type 4-functional epoxy resin, cresol novolac type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol type epoxy resin Epoxy resin, biphenyl type epoxy resin, naphthylene ether type epoxy resin, anthracene type epoxy resin, bisphenol A type epoxy resin, tetraphenylethane type epoxy resin; preferably naphthalene type 4 Functional epoxy resins, naphthol-type epoxy resins, and biphenyl-type epoxy resins. Specific examples of solid epoxy resins include "HP4032H" (naphthalene-type epoxy resin), "HP-4700", "HP-4710" (naphthalene-type tetrafunctional epoxy resin), "N-690" (cresol novolac epoxy resin), "N-695" (cresol novolac epoxy resin), "HP-7200", "HP-7200HH", "HP-7200H" (two Cyclopentadiene epoxy resin), "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000" (naphthylene ether type ring Oxygen resin), "EPPN-502H" (trisphenol type epoxy resin), "NC7000L" (naphthol novolak type epoxy resin), "NC3000H", "NC3000", "NC3000L", "NC3100" (biphenyl type epoxy resin), "ESN475V" (naphthalene type epoxy resin), "ESN485" (naphthol novolac type epoxy resin) manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., manufactured by Mitsubishi Chemical Corporation "YX4000H", "YL6121" (biphenyl type epoxy resin), "YX4000HK" (bixylenol type epoxy resin), "YX8800" (anthracene type epoxy resin), "PG- 100", "CG-500", "YL7800" (fluorene type epoxy resin) manufactured by Mitsubishi Chemical Corporation, "jER1010" manufactured by Mitsubishi Chemical Corporation, (solid bisphenol A epoxy resin), "jER1031S" ( Tetraphenylethane type epoxy resin), "YL7760" (bisphenol AF type epoxy resin), etc. As epoxy resin, if the situation of liquid epoxy resin and solid epoxy resin is used in combination, these quantitative ratios (liquid epoxy resin: solid epoxy resin) are calculated as 1 in terms of mass ratio: The range of 0.1 to 1:15 is preferable, the range of 1:0.1 to 1:10 is more preferable, and the range of 1:0.3 to 1:3 is more preferable. The content of the epoxy resin in the resin composition is preferably 100% by mass when the resin composition is 100% by mass from the viewpoint of obtaining a good tensile rupture strength and an insulating layer exhibiting insulation reliability. 5 mass % or more, preferably 10 mass % or more, more preferably 20 mass % or more. The upper limit of the content of the epoxy resin is not particularly limited as long as the effect of the present invention can be exhibited, but it is preferably 50 mass % or less, and more preferably 40 mass % or less. [0020] The epoxy equivalent of the epoxy resin is preferably 50 to 5000, preferably 50 to 3000, more preferably 80 to 2000, and then preferably 110 to 1000. By being within this range, the crosslinking density of the cured product of the resin composition layer becomes sufficient, so that an insulating layer with a small surface roughness can be obtained. Furthermore, the epoxy equivalent can be measured according to JIS K7236, and is the mass of the resin containing 1 equivalent of epoxy groups. The weight-average molecular weight of epoxy resin is preferably 100～5000, preferably 250～3000 again, more preferably 400～1500. Here, the weight average molecular weight of the epoxy resin is the weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC). <(B) Hardening Agent> The resin composition contains the (B) hardening agent. The curing agent is not particularly limited as long as it has a function of curing the epoxy resin (A), and examples thereof include phenol-based curing agents, naphthol-based curing agents, active ester-based curing agents, and benzoxazine-based curing agents. Hardeners, cyanate-based hardeners, and carbodiimide-based hardeners, etc. A hardener system may be used individually by 1 type, or may use 2 or more types together. The component (B) is preferably at least one selected from a phenol-based hardener, a naphthol-based hardener, an active ester-based hardener, a carbodiimide-based hardener, and a cyanate-based hardener, From the viewpoint of lowering the dielectric tangent, an active ester-based curing agent is preferred. As a phenol-based hardener and a naphthol-based hardener, from the viewpoint of heat resistance and water resistance, a phenol-based hardener having a novolak structure or a naphthol-based hardener having a novolak structure are preferred. good. Moreover, from the viewpoint of the adhesiveness with the conductor layer, a nitrogen-containing phenol-based curing agent is preferred, and a phenol-based curing agent containing a triazine skeleton is further preferred. As specific examples of the phenol-based hardener and the naphthol-based hardener, "MEH-7700", "MEH-7810", "MEH-7851" manufactured by Meiwa Chemical Co., Ltd., and "MEH-7851" manufactured by Nippon Kayaku Co., Ltd. "NHN", "CBN", "GPH", "SN170", "SN180", "SN190", "SN475", "SN485", "SN495", "SN-495V" manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., "SN375", "SN395", "TD-2090", "LA-7052", "LA-7054", "LA-1356", "LA-3018-50P", "EXB-9500" manufactured by DIC Corporation, etc. . As the active ester-based hardener, there is no particular limitation, and in general, those of phenol esters, thiophenol esters, N-hydroxyamine esters, esters of heterocyclic hydroxy compounds, etc. are preferably used in 1 molecule. A compound having two or more highly reactive ester groups. The active ester-based curing agent is preferably obtained by a condensation reaction of a carboxylic acid compound and/or a thiocarboxylic acid compound with a hydroxy compound and/or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester-based curing agent obtained from a carboxylic acid compound and a hydroxy compound is preferable, and an active ester-based curing agent obtained from a carboxylic acid compound and a phenol compound and/or a naphthol compound is preferred. agent is also better. As a carboxylic acid compound, benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, pyromellitic acid, etc. are mentioned, for example. Examples of the phenol compound or naphthol compound include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, reduced phenolphthalein, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxyl Naphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucinol, phloroglucinol, dicyclopentadiene type diphenol compound, phenol novolac Wait. Here, the "dicyclopentadiene-type diphenol compound" refers to a diphenol compound obtained by condensing 2 molecules of phenol with respect to 1 molecule of dicyclopentadiene. Be specifically with the active ester compound that comprises dicyclopentadiene-type diphenol structure, the active ester compound that comprises naphthalene structure, the active ester compound that comprises the acetyl compound of phenol novolak, the benzene that comprises phenol novolak The active ester compound of the formate is preferable, and among them, the active ester compound containing a naphthalene structure and the active ester compound containing a dicyclopentadiene-type diphenol structure are further preferable. The "dicyclopentadiene-type diphenol structure" refers to a divalent structural unit consisting of a phenylene-dicyclopentylene-naphthylene group. [0027] As a commercial product of an active ester-based hardener, "EXB9451", "EXB9460", "EXB9460S", "HPC-8000-65T" can be cited as the active ester compound containing a dicyclopentadiene-type diphenol structure ", "HPC-8000H-65TM", "EXB-8000L-65TM" (manufactured by DIC Corporation), "EXB9416-70BK" (manufactured by DIC Corporation) as an active ester compound containing a naphthalene structure, and as an active ester compound containing a phenol novolak "DC808" (manufactured by Mitsubishi Chemical Corporation) is mentioned as the active ester compound of the acetylated compound, "YLH1026" (manufactured by Mitsubishi Chemical Corporation) is mentioned as the active ester compound containing the benzyl compound of phenol novolak, and "YLH1026" is mentioned as the active ester compound of phenol novolak. "DC808" (manufactured by Mitsubishi Chemical Co., Ltd.) is mentioned as an active ester-based hardener for acetylated compounds of novolak, and "YLH1026" (Mitsubishi Chemical Corporation) is mentioned as an active ester-based hardening agent for benzyl compounds of phenol novolaks. (manufactured by Mitsubishi Chemical Corporation), "YLH1030" (manufactured by Mitsubishi Chemical Corporation), "YLH1048" (manufactured by Mitsubishi Chemical Corporation), etc. [0028] As specific examples of the benzoxazine-based curing agent, "HFB2006M" manufactured by Showa Polymer Co., Ltd., "Pd" and "Fa" manufactured by Shikoku Chemical Industry Co., Ltd. can be cited. As the cyanate-based hardener, for example, bisphenol A dicyanate, polyhydric phenol cyanate, oligo(3-methylene-1,5-naphthylene cyanate), 4, 4'-methylene bis(2,6-dimethylphenylcyanate), 4,4'-ethylene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2, 2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanatephenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-Bis(4-cyanatephenyl-1-(methylethylene))benzene, bis(4-cyanatephenyl)sulfide, and bis(4-cyanatephenyl) Bifunctional cyanate resins such as ethers, polyfunctional cyanate resins derived from phenol novolacs, cresol novolacs, and the like, and prepolymers in which a part of these cyanate resins are triazinated, and the like. Specific examples of cyanate-based hardeners include "PT30" and "PT60" (phenol novolak-type polyfunctional cyanate resin), "ULL-950S" (polyfunctional cyanate resin) manufactured by Lonza Japan resin), "BA230", "BA230S75" (a prepolymer in which a part or all of bisphenol A dicyanate is triazinized to form a trimer), and the like. [0030] As a specific example of the carbodiimide-based curing agent, "V-03", "V-07" manufactured by Nisshinbo Chemical Co., Ltd., and the like can be cited. The amount ratio of epoxy resin to hardener, in the ratio of [total number of epoxy groups of epoxy resin]:[total number of reactive groups of hardener], in the ratio of 1:0.01~1:3 The range is preferably, 1:0.015~1:2 is still more preferable, and 1:0.02~1:1.5 is more preferable. Here, the reactive group of the curing agent refers to an active hydroxyl group, an active ester group, and the like, and varies depending on the type of the curing agent. In addition, the total number of epoxy groups of epoxy resins refers to a value obtained by adding up the value obtained by dividing the solid content mass of each epoxy resin by the epoxy equivalent for all epoxy resins; The total number of reactive groups refers to the total value obtained by dividing the solid content mass of each hardener by the equivalent weight of reactive groups for all hardeners. The heat resistance of the hardened|cured material of a resin composition layer can be improved more by making the quantity ratio of an epoxy resin and a hardening|curing agent into the said range. [0032] The content of the curing agent is not particularly limited, but when the resin component is 100% by mass, it is preferably 60% by mass or less, more preferably 55% by mass or less, and more preferably 50% by mass or less. In addition, the lower limit is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, and more preferably 20% by mass or more. By making content of a hardening|curing agent 5 mass % or more, metal-plating adhesiveness and base adhesiveness can be improved. Moreover, by setting it as 60 mass % or less, stain removal property can be improved in an active ester type hardening|curing agent, and a dielectric tangent can be reduced in a phenol type hardening|curing agent and a naphthol type hardening|curing agent. <(C) Compound having 5-membered ring or more cyclic ether structure> When the resin component is 100% by mass, the resin composition contains 1% by mass to 50% by mass of (C) having a 5-membered ring A compound of the above cyclic ether structure. As mentioned above, the dielectric tangent and the stain removal performance have a trade-off relationship in the past. However, by containing a prescribed amount of (C) a compound having a cyclic ether structure having five or more membered rings, Therefore, while the dielectric tangent can be reduced, the stain removal performance can be improved. Cyclic ethers having five or more membered rings have properties such as a low dielectric tangent because the movement of the molecules is restricted. Moreover, since the cyclic ether system with a 5-membered ring or more has polarity, it has a certain degree of hydrophilicity. By having hydrophilicity, stain removal will be facilitated, thereby improving stain removal performance. Furthermore, it is considered that compatibility, plating adhesion, and substrate adhesion are improved by having polarity and hydrophilicity. However, the technical scope of the present invention is not limited to the description of the mechanism of the effects that can be obtained as described herein. The number of oxygen atoms contained in the cyclic ether structure is preferably 1 or more, and more preferably 2 or more, from the viewpoint that the desired effect of the present invention can be obtained remarkably. The lower limit is not particularly limited, but is preferably 5 or less, more preferably 4 or less, and more preferably 3 or less. [0036] The cyclic ether structure having 5 or more membered rings is not particularly limited as long as it is a 5-membered ring or more, and may be a single ring, a polycyclic ring, or a condensed ring. Moreover, (C)component may have a some cyclic ether structure. The cyclic ether structure is preferably a 5-10-membered ring, more preferably a 5-8-membered ring, and more preferably a 5-6-membered ring. Specific examples of the cyclic ether structure having five or more membered rings include a furan structure, a tetrahydrofuran structure, a dioxolane structure, a pyran structure, a dihydropyran structure, a tetrahydropyran structure, a dioxane structure, and the like, Among them, from the viewpoint of improving compatibility, it is preferable that the compound having a cyclic ether structure having five or more membered rings contains a dioxane structure. The dioxane structure refers to a concept including a 1,2-dioxane structure, a 1,3-dioxane structure, and a 1,4-dioxane structure, and a 1,3-dioxane structure is preferable. [0037] In addition, substituents such as an alkyl group and an alkoxy group may be bonded to the cyclic ether structure having five or more members. The number of carbon atoms of these substituents is usually 1 to 6 (preferably 1 to 3). From the viewpoint of reducing the dielectric tangent of the component (C), it is preferable to have a carbon-carbon unsaturated bond, and it is preferable to have a carbon-carbon double bond. Although it may have a carbon-carbon unsaturated bond in a cyclic ether structure, and may have a carbon-carbon unsaturated bond outside a cyclic ether structure, it is preferable to have the functional group mentioned later among them. The (C) component may have a plurality of carbon-carbon unsaturated bonds. The (C) component has the viewpoint of reducing the dielectric tangent and being easily reacted with the (A) component, with a vinyl group, a methacryloyl group, an acryl group, an allyl group, and a styryl group. , and one or more functional groups selected from the group consisting of acryl groups are preferred, and those having a vinyl group are further preferred. Any structure in (C) component should just have this functional group, and it may have in a cyclic ether structure, and may have it outside a cyclic ether structure. A plurality of these functional groups may be present. [0040] The compound having a cyclic ether structure of 5 or more membered rings is preferably represented by the following general formula (1).
Figure 02_image003
(In formula (1), ring A represents a divalent group having a cyclic ether structure with five or more members, B 1 and B 2 each independently represent a single bond or a divalent linking group, C 1 and C 2 each independently represents a functional group) [0041] Ring A represents a divalent group having a cyclic ether structure with five or more members. The cyclic ether structure having five or more membered rings is the same as the above-mentioned cyclic ether structure having five or more membered rings, and the preferred range is also the same. Specific examples of the divalent group having a cyclic ether structure with five or more members include furan-2,5-diyl, tetrahydrofuran-2,5-diyl, and dioxolane-2. ,5-diyl, pyran-2,5-diyl, dihydropyran-2,5-diyl, tetrahydropyran-2,5-diyl, 1,2-dioxane-3, 6-diyl, 1,3-dioxane-2,5-diyl, 1,4-dioxane-2,5-diyl, 5-ethyl-1,3-dioxane-2, 5-diyl and the like, preferably 5-ethyl-1,3-dioxane-2,5-diyl. [0043] B 1 and B 2 each independently represent a single bond or a divalent linking group, preferably a divalent linking group. Examples of the divalent linking group include an optionally substituted alkylene group, an optionally substituted alkynylene group, an optionally substituted aryl group, and an optionally substituted heteroarylene group. , ester bond, ether bond, amide bond, urea bond, urethane bond, groups represented by -C(=O)-, -S-, -SO-, -NH-, etc., may also be plural Combine these bases. As the alkylidene group that can have substituent, the alkylidene group with carbon number 1～10 is preferably, the alkylene group with carbon number 1～6 is preferably again, with carbon number 1 An alkylene group of ~5, or an alkylene group of 1 to 3 carbon atoms is more preferred. The alkylene group may be any of straight chain, branched chain and cyclic. As such an alkylene group, for example, a methylene group, an ethylidene group, a propylidene group, a butylidene group, a pentylene group, a hexylene group, a 1,1-dimethylethylidene group, etc. are mentioned, and a methylene group is used. group, ethylidene, and 1,1-dimethylethylidene are preferred. [0045] The alkylene system may have a substituent. The substituent is not particularly limited, and examples thereof include a halogen atom, -OH, -OC 1-6 alkyl group, -N(C 1-6 alkyl group) 2 , C 1-6 alkyl group, and C 6-10 aryl group , -NH 2 , -CN, -C(O)OC 1-6 alkyl, -COOH, -C(O)H, -NO 2 and the like. [0046] Here, "C pq " (p and q are positive integers and satisfy p<q) and the like terms represent that the number of carbon atoms of the organic group described after the term is p~q. For example, expressions such as "C 1-6 alkyl" mean an alkyl group having 1 to 6 carbon atoms. The above-mentioned substituents may further have substituents (hereinafter referred to as "secondary substituents"). As the secondary substituent, the same ones as those described above can be used unless otherwise specified. As the alkynylene group that can have substituent, preferably with carbon number 2～10 alkynylene group, with carbon number 2～6 alkynylene group is preferably again, with carbon number 2～10 The alkynylene group of 5 is more preferred. As an alkynylene group, an ethynylene group, a propynylene group, a butynylene group, a pentynylene group, and a hexynylene group are mentioned, for example. The substituent which the alkynylene group may have is the same as the substituent which the alkylene group may have. As the aryl extension with substituent, the aryl extension with carbon number 6～14 is preferably, and the aryl extension with carbon number 6～10 is preferably again. As the arylidene group, for example, a phenylene group, a naphthylene group, an anthracylene group, etc. are mentioned. The substituent which the arylidene group may have is the same as the substituent which the alkylene group may have. As the extension of the heteroaryl group that can have substituent, the extension of the heteroaryl group with the carbon number of 3～15 is preferably, with the extension of the heteroaryl group of the carbon number of 3～9 is preferably again, with carbon A heteroaryl group having 3 to 6 atoms is more preferable. As a heteroaryl group, a furandiyl group, a pyridinediyl group, a thiophenediyl group, etc. are mentioned, for example. The substituent which the heteroaryl group may have is the same as the substituent which the alkylene group may have. Among these, B 1 and B 2 are the bases that are combined by more than one selected from the alkylene group that can have a substituent, the alkynylene group that can have a substituent group, an ester bond, an ether bond More preferably, it is also more preferable to use one or more groups selected from an alkylene group which may have a substituent and an ester bond as a combination. [0052] C 1 and C 2 represent functional groups independently. As the functional group, for example, vinyl group, methacryloyl group, acryl group, allyl group, styryl group, acryl group, and epoxy group are mentioned, and vinyl group is more preferable. [0053] The following are specific examples (exemplary compounds) of the (C) component, but the (C) component is not limited to these.
Figure 02_image005
As the (C) component, commercially available products can be used, such as "A-DOG" (the compound of the above-mentioned specific example) manufactured by Shin-Nakamura Chemical Industry Co., Ltd., "KAYARAD R-604" manufactured by Nippon Kayaku Co., Ltd. (above-mentioned). specific examples of compounds) and the like. When the resin component is 100% by mass, the content of the component (C) is 1% by mass or more, preferably 5% by mass or more, and more preferably 10% by mass or more. The upper limit is 50 mass % or less, preferably 48 mass % or less, more preferably 45 mass % or less, and more preferably 40 mass % or less. By setting the content to 1 mass % or more, the dielectric tangent is low, and stain removability can be improved, and by setting the content to 50 mass % or less, plating adhesion and substrate adhesion can be improved. . The mass ratio of epoxy resin and (C) component is preferably in the range of (epoxy resin: the quality of (C) component) 1:0.01～1:100, with the range of 1:0.1～1:90 The range is preferably 1:0.1~1:80. Compatibility can be improved by setting it in such a range. <(D) Inorganic Filler> The resin composition may contain (D) in addition to the components (A) to (C) from the viewpoint of reducing the dielectric tangent and improving the stain removability. Inorganic fillers. The material of the inorganic filler is not particularly limited, such as silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite , gibbsite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, titanic acid Magnesium, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium titanate zirconate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate, etc. Among them, silica is particularly suitable. As silica, amorphous silica, fused silica, crystalline silica, synthetic silica, hollow silica, etc. are mentioned, for example. Moreover, spherical silica is preferable as a silica system. An inorganic filler system may be used individually by 1 type, and may be used in combination of 2 or more types. The average particle size of the inorganic filler is preferably below 3 μm, preferably below 2 μm, more preferably below from the viewpoint of obtaining an insulating layer with less surface roughness and the improvement of the fine wiring formability. 1 μm or less. The lower limit of the average particle diameter is not particularly limited, but is preferably 0.01 μm or more, more preferably 0.1 μm or more, and more preferably 0.3 μm or more. Examples of commercially available inorganic fillers having such an average particle size include "YC100C", "YA050C", "YA050C-MJE", "YA010C" manufactured by Admatechs, and "UFP-30 manufactured by Denki Chemical Industry Co., Ltd."","ShirufiruNSS-3N","ShirufiruNSS-4N","ShirufiruNSS-5N" manufactured by Tokuyama Corporation, "SO-C2", "SO-C1" manufactured by Admatechs Corporation, etc. [0060] The average particle size of the inorganic filler can be measured by a laser diffraction/scattering method based on the Mie scattering theory. Specifically, the particle size distribution of the inorganic filler can be prepared on a volume basis by a laser diffraction scattering particle size distribution analyzer, and the average particle size can be measured as the average particle size. The measurement sample is preferably one that can disperse the inorganic filler in methyl ethyl ketone by ultrasonic waves. As a laser diffraction scattering particle size distribution measuring apparatus, "LA-500" manufactured by Horiba Corporation, "SALD-2200" manufactured by Shimadzu Corporation, and the like can be used. Inorganic fillers, from the viewpoint of improving moisture resistance and dispersibility, use fluorine-containing silane coupling agents, aminosilane-based coupling agents, epoxy silane-based coupling agents, mercaptosilane-based coupling agents, It is preferable to treat with one or more surface treatment agents such as a silane-based coupling agent, an alkoxysilane, an organic silazane compound, and a titanate-based coupling agent. As commercial products of the surface treatment agent, "KBM403" (3-glycidyloxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM803" (3-mercaptopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd. oxysilane), "KBE903" (3-aminopropyltriethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd. Silane), "SZ-31" (hexamethyldisilazane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM103" (phenyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM-4803" manufactured by Shin-Etsu Chemical Co., Ltd. (Long-chain epoxy silane coupling agent), "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., etc. By the degree of the surface treatment of surface treatment agent, with respect to the viewpoint of the dispersibility promotion of inorganic filler, with respect to 100 mass parts of inorganic fillers, to utilize the surface treatment agent of 0.2 mass parts～5 mass parts to come. The surface treatment is preferably performed, preferably 0.2 to 3 parts by mass, and preferably 0.3 to 2 parts by mass. [0063] The degree of surface treatment by the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the inorganic filler. The carbon content per unit surface area of the inorganic filler, from the viewpoint of improving the dispersibility of the inorganic filler, is preferably 0.02 mg/m 2 or more, more preferably 0.1 mg/m 2 or more, and 0.2 mg /m 2 or more is more preferable. On the other hand, from the viewpoint of suppressing the increase of the melt viscosity of the resin varnish and the melt viscosity in the form of flakes, it is preferably 1 mg/m 2 or less, more preferably 0.8 mg/m 2 or less, and 0.5 mg/m 2 or less. mg/m 2 or less is more preferable. [0064] The carbon content per unit surface area of the inorganic filler can be measured by washing the surface-treated inorganic filler with a solvent (eg, methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK was added as a solvent to the surface-treated inorganic filler, and ultrasonic cleaning was performed at 25° C. for 5 minutes. After removing the supernatant and drying the solid content, the amount of carbon per unit surface area of the inorganic filler can be measured using a carbon analyzer. As a carbon analyzer, "EMIA-320V" manufactured by Horiba, Ltd., etc. can be used. If the resin composition contains the situation of the inorganic filler, the content of the inorganic filler, from the viewpoint of reducing the dielectric tangent, and making the stain removal property improve, the non-volatile component in the resin composition is set as At 100 mass %, it is preferably 50 mass % or more, more preferably 55 mass % or more, more preferably 60 mass % or more, 65 mass % or more, or 70 mass % or more. From the viewpoint of the mechanical strength of the insulating layer, the upper limit of the content of the inorganic filler in the resin composition is preferably 90% by mass or less, more preferably 85% by mass or less, more preferably 80% by mass or less, or 75% by mass or less. <(E) Hardening accelerator> In one embodiment, the resin composition system may contain (E) hardening accelerator. Examples of the curing accelerator include phosphorus-based curing accelerators, amine-based curing accelerators, imidazole-based curing accelerators, guanidine-based curing accelerators, metal-based curing accelerators, organic peroxide-based curing accelerators, and the like. A hardening accelerator, an amine-based hardening accelerator, an imidazole-based hardening accelerator, and a metal-based hardening accelerator are preferable, and an imidazole-based hardening accelerator and an organic peroxide-based hardening accelerator are further preferable. A hardening accelerator system may be used individually by 1 type, and may be used in combination of 2 or more types. As the phosphorus-based hardening accelerator, for example, triphenylphosphine, phosphonium borate compound, tetraphenylphosphonium tetraphenyl borate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decyl acid salt, (4-methylphenyl) triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyl triphenylphosphonium thiocyanate, etc., with triphenylphosphine, tetrabutyl Phosphonium decanoate is preferred. Examples of the amine-based curing accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6 ,-Sample(dimethylaminomethyl)phenol, 1,8-diazabicyclo(5,4,0)-undecene, etc., with 4-dimethylaminopyridine, 1,8-di Azabicyclo(5,4,0)-undecene is preferred. As the imidazole-based hardening accelerator, for example, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4 -Methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole Imidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl -4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole trimellitate, 1-cyanoethyl-2-phenylimidazole Tricarboxylate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2 '-Undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1 ')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid addition compound, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3 -Dihydro-1H-pyrro[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenyl The imidazole compound such as imidazoline and the adduct of the imidazole compound and the epoxy resin are preferably 2-ethyl-4-methylimidazole and 1-benzyl-2-phenylimidazole. As an imidazole-based hardening accelerator, a commercial item can be used, for example, "P200-H50" manufactured by Mitsubishi Chemical Corporation, and the like. Examples of guanidine-based curing accelerators include dicyandiamine, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, and 1-(o-tolyl) Guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7- Methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 1-methyl biguanide, 1-ethyl biguanide, 1-n-butyl biguanide, 1-n-octadecane Alkyl biguanide, 1,1-dimethyl biguanide, 1,1-diethyl biguanide, 1-cyclohexyl biguanide, 1-allyl biguanide, 1-phenyl biguanide, 1-(o-tolyl) biguanide etc., preferably dicyandiamide and 1,5,7-triazabicyclo[4.4.0]dec-5-ene. [0072] As the metal-based hardening accelerator, for example, metal organometallic complexes or organometallic salts of cobalt, copper, zinc, iron, nickel, manganese, tin and the like can be mentioned. Specific examples of the organometallic complex include organocobalt complexes such as cobalt (II) acetylacetone, cobalt (III) acetylacetone, and the like, and organocopper complexes such as copper (II) acetylacetone. , Organic zinc complexes such as zinc (II) acetone acetone, organic iron complexes such as iron (III) acetylacetone, etc., organo-nickel complexes such as nickel (II) acetone acetone, manganese (II) Organic manganese complexes such as acetone acetone, etc. As an organic metal salt, zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate, zinc stearate, etc. are mentioned, for example. As the organic peroxide-based curing accelerator, for example, dicumyl peroxide, cyclohexanone peroxide, tert-butyl peroxybenzoate, methyl ethyl ketone peroxide, diisoperoxide Propylbenzene, tert-butyl cumene peroxide, di-tert-butyl peroxide, dicumyl hydroperoxide, cumene hydroperoxide, tert-butyl hydroperoxide, etc. As an organic peroxide type hardening accelerator, a commercial item can be used, for example, "PERCUMYL D" by NOF Corporation etc. are mentioned. When the resin composition contains a hardening accelerator, when the nonvolatile content in the resin composition is set to 100% by mass, the content of the hardening accelerator is preferably 0.01% by mass to 1% by mass, 0.01 mass % - 0.5 mass % are more preferable, and 0.01 mass % - 0.1 mass % are more preferable. <(F) Indencoumarone Resin> In one embodiment, the resin composition system may contain (F) indencoumarone resin. As indenecoumarone resin, the copolymer of indene and coumarone, the copolymer of indene, coumarone, and styrene, etc. are mentioned, for example. The content ratio of the coumarone component in the indenecoumarone resin is preferably more than 5 mol %, preferably more than 8 mol %, more preferably more than 10 mol %. The upper limit is preferably 40 mol % or less, more preferably 35 mol % or less, more preferably 30 mol % or less. The content ratio of the indene component in the indenecoumarone resin is preferably more than 30 mol %, preferably more than 35 mol %, more preferably more than 40 mol %. The upper limit is preferably 80 mol % or less, more preferably 75 mol % or less, more preferably 70 mol % or less. If the indenecoumarone resin is the situation of the copolymer of indene, coumarone and styrene, the content ratio of the styrene component is preferably more than 20 mol %, preferably more than 25 mol % , more preferably 30 mol% or more. The upper limit is preferably 70 mol % or less, more preferably 65 mol % or less, more preferably 60 mol % or less. [0079] As a specific example of the indenecoumarone resin, "H-100", "V-120S", "V-120" manufactured by Nippon Paint Chemical Co., Ltd., etc. can be cited. When the resin composition contains the indenecoumarone resin, from the viewpoint of improving compatibility, when the non-volatile component in the resin composition is set to 100% by mass, the content of the indenecoumarone resin 0.1-3 mass % is preferable, 0.3-2 mass % is more preferable, and 0.5-1.5 mass % is more preferable. <(G) Thermoplastic resin> In one embodiment, the resin composition system can contain (G) thermoplastic resin. Examples of thermoplastic resins include phenoxy resins, polyvinyl acetal resins, polyolefin resins, polybutadiene resins, polyimide resins, polyimide resins, polyetherimide resins, Polyester resin, polyether resin, polyphenylene ether resin, polycarbonate resin, polyether ether ketone resin, polyester resin, preferably phenoxy resin. A thermoplastic resin type may be used individually by 1 type, or may be used in combination of 2 or more types. [0082] The weight average molecular weight of the thermoplastic resin in terms of polystyrene is preferably 8,000 or more, more preferably 10,000 or more, more preferably 20,000 or more, particularly preferably 40,000 or more. The upper limit is not particularly limited, but is preferably 70,000 or less, and more preferably 60,000 or less. The polystyrene conversion weight average molecular weight of a thermoplastic resin is measured by gel permeation chromatography (GPC) method. Specifically, the weight average molecular weight of the thermoplastic resin in terms of polystyrene was LC-9A/RID-6A manufactured by Shimadzu Corporation as a measuring device, and Shodex K-800P/K-804L manufactured by Showa Denko Corporation as a column was used. /K-804L, chloroform or the like as a mobile phase, was calculated by measuring the column temperature at 40°C and using a calibration curve of standard polystyrene. As the phenoxy resin, for example, there can be mentioned those with a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol S skeleton, a bisphenol acetophenone skeleton, a novolak skeleton, a biphenyl skeleton, a perylene skeleton, and a dicyclopentane skeleton. A phenoxy resin with one or more skeletons selected from the group consisting of diene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantane skeleton, terpene skeleton, and trimethylcyclohexane skeleton. The terminal system of the phenoxy resin may be any functional group such as a phenolic hydroxyl group and an epoxy group. A phenoxy resin type may be used individually by 1 type, and may be used in combination of 2 or more types. Specific examples of the phenoxy resin include "1256" and "4250" (both are phenoxy resins containing a bisphenol A skeleton), "YX8100" (a benzene resin containing a bisphenol S skeleton) manufactured by Mitsubishi Chemical Corporation. Oxygen resin), and "YX6954" (phenoxy resin containing bisphenol acetophenone skeleton), other than "FX280" and "FX293" manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., and "FX293" manufactured by Mitsubishi Chemical Corporation "YL7500BH30", "YX6954BH30", "YX7553", "YX7553BH30", "YL7769BH30", "YL6794", "YL7213", "YL7290" and "YL7482", etc. [0084] As the polyvinyl acetal resin, for example, polyvinyl acetal resin and polyvinyl butyral resin can be cited, and polyvinyl butyral resin is preferred. Specific examples of the polyvinyl acetal resin include "Denka butyral 4000-2", "Denka butyral 5000-A", "Denka butyral 6000-C", and "Denka butyral 6000-EP" manufactured by Denki Chemical Industries, Ltd. , S-LEC BH series, BX series (eg BX-5Z), KS series (eg KS-1), BL series, BM series, etc. manufactured by Sekisui Chemical Industry Co., Ltd. [0085] As a specific example of the polyimide resin, "RIKACOAT SN20" and "RIKACOAT PN20" manufactured by Nippon Chemical Co., Ltd. can be cited. Specific examples of the polyimide resin include linear polyimide obtained by reacting a bifunctional hydroxyl-terminated polybutadiene, a diisocyanate compound, and a tetrabasic acid anhydride (JP-A-2006-37083 ). Modification of polyimide described in), polyimide containing polysiloxane skeleton (polyimide described in Japanese Patent Laid-Open No. 2002-12667, Japanese Patent Laid-Open No. 2000-319386, etc.), etc. Polyimide. [0086] As a specific example of the polyamide imide resin, "VYLOMAX HR11NN" and "VYLOMAX HR16NN" manufactured by Toyobo Co., Ltd. can be cited. Specific examples of the polyamide imide resin include modified polyamides such as "KS9100" and "KS9300" (polyamide imide containing a polysiloxane skeleton) manufactured by Hitachi Chemical Co., Ltd. imide. [0087] As a specific example of the polyether resin, "PES5003P" manufactured by Sumitomo Chemical Co., Ltd., etc. can be cited. Specific examples of the polyphenylene ether resin include "OPE-2St 1200", an oligophenylene ether/styrene resin having a vinyl group, manufactured by Mitsubishi Gas Chemical Co., Ltd. [0088] Specific examples of the polysiloxane resin include polysilicon "P1700", "P3500" manufactured by Solvay Advanced Polymers, and the like. [0089] Among them, as the thermoplastic resin, phenoxy resin and polyvinyl acetal resin are preferred. Therefore, in a suitable embodiment, the thermoplastic resin contains at least one selected from the group consisting of a phenoxy resin and a polyvinyl acetal resin. Among them, as the thermoplastic resin, a phenoxy resin is preferable, and a phenoxy resin having a weight average molecular weight of 40,000 or more is particularly preferable. By using a phenoxy resin having a weight average molecular weight of 40,000 or more, it becomes possible to miniaturize the wiring circuit. When the resin composition contains a thermoplastic resin, when the non-volatile content in the resin composition is set to 100% by mass, the content of the thermoplastic resin is preferably 1 to 10% by mass, and is preferably 1.5 to 10% by mass. 5 mass % is more preferable, and 2 mass % - 5 mass % are more preferable. <(H) Flame Retardant> In one embodiment, the resin composition system can contain (H) a flame retardant. Examples of the flame retardant include organic phosphorus flame retardants, organic nitrogen-containing phosphorus compounds, nitrogen compounds, polysiloxane flame retardants, metal hydroxides, and the like. A flame retardant system may be used individually by 1 type, or may use 2 or more types together. [0092] As the flame retardant, commercially available products can be used, for example, "HCA-HQ" manufactured by Sanko Co., Ltd., "PX-200" manufactured by Daihachi Chemical Industry Co., Ltd., and the like. As a flame retardant, what is difficult to hydrolyze is preferable, for example, 10-(2,5-dihydroxyphenyl)-10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide etc. are mentioned. When the resin composition contains a flame retardant, the non-volatile content in the resin composition is set to 100 mass %, and the content of the flame retardant is preferably 0.5 to 20 mass %, and 0.5 to 20 mass %. 15 mass % is more preferable, and 0.5-10 mass % is more preferable. <(I) Organic Filler> In one embodiment, the resin composition system can contain (1) an organic filler. By containing the component (I), the tensile rupture strength of the cured product of the resin composition layer to which the film is bonded can be improved. As the organic filler, any organic filler used for forming an insulating layer of a printed wiring board can be used, and examples thereof include rubber particles, polyamide fine particles, and polysiloxane particles. As the rubber particles, commercially available products can be used, for example, "EXL2655" manufactured by Dow Chemical Japan, "AC3401N", "AC3816N" manufactured by Aica Industries, and the like. When the resin composition contains an organic filler, when the non-volatile content in the resin composition is set to 100% by mass, the content of the organic filler is preferably 0.1 to 20% by mass, and the content of the organic filler is preferably 0.2 to 20% by mass. 10 mass % is more preferable, and 0.3-5 mass %, or 0.5-3 mass % is more preferable. <(J) Optional Additives> In one embodiment, the resin composition system may further contain other additives as required, and as the above-mentioned other additives, for example, organic copper compounds, organic zinc compounds, and organic Organometallic compounds such as cobalt compounds, and resin additives such as thickeners, defoaming agents, leveling agents, adhesion imparting agents, and coloring agents. <Physical properties and uses of resin composition> The resin composition of the present invention can obtain an insulating layer having a low dielectric tangent, good plating adhesion and substrate adhesion, and excellent stain removability, and Compatibility is also good. Therefore, the resin composition system of the present invention can be suitably used as a resin composition for forming an insulating layer of a printed wiring board (resin composition for an insulating layer of a printed wiring board), and more preferably as a resin composition for forming a printed wiring board The resin composition of the interlayer insulating layer (the resin composition for the interlayer insulating layer of the printed wiring board). In addition, since the resin composition of the present invention can obtain an insulating layer with good parts-embedding properties, it can also be suitably used in the case where the printed wiring board is a part-embedded circuit board. [0099] The cured product obtained by thermally curing the resin composition at 190° C. for 90 minutes exhibits characteristics such as low dielectric tangent. That is, an insulating layer with a low dielectric tangent can be obtained. The dielectric tangent is preferably 0.005 or less, more preferably 0.0045 or less, and more preferably 0.004 or less. The lower limit is not particularly limited, and can be set to 0.0001 or more. The measurement of the dielectric tangent can be performed according to the method described in <Measurement of the dielectric tangent> described later. The cured product obtained by thermally curing the resin composition at 190° C. for 90 minutes exhibits excellent adhesion (plating adhesion) with the conductor layer formed by plating or the like. characteristic. That is, an insulating layer exhibiting good plating adhesion can be obtained. The plating adhesion is preferably more than 0.3 kgf/cm, more preferably 0.31 kgf/cm or more, and more preferably 0.32 kgf/cm or more. The upper limit is not particularly limited, and can be 10 kgf/cm or less, or 1 kgf/cm or less. The measurement of the plating adhesion can be performed according to the method described in <Measurement of the plating adhesion> described later. [0101] The cured product obtained by thermally curing the resin composition at 190° C. for 90 minutes exhibits characteristics such as excellent adhesion to copper foil or the like (substrate adhesion). That is, an insulating layer exhibiting good substrate adhesion can be obtained. The base adhesion is preferably more than 0.3 kgf/cm, more preferably 0.31 kgf/cm or more, and more preferably 0.32 kgf/cm or more. The upper limit is not particularly limited, and can be 10 kgf/cm or less, or 1 kgf/cm or less. The measurement of the substrate adhesion can be performed according to the method described in <Measurement of the substrate adhesion> described later. [0102] The cured product obtained by thermally curing the resin composition at 190° C. for 90 minutes exhibits characteristics such as easy removal of stains generated during the formation of via holes (excellent stain removability). That is, an insulating layer exhibiting good stain removability can be obtained. Since the stain removability is excellent, the maximum stain length measured from the wall surface side of the bottom of the through hole is preferably less than 3 μm, more preferably 2.5 μm or less, and more preferably 2 μm or less. The lower limit is not particularly limited, and can be set to 0.01 μm or more. The measurement of stain removability can be performed according to the method described in <Evaluation of stain removability at the bottom of a through hole> described later. Since the resin composition contains the specified amount of the component (C), it exhibits characteristics such as excellent compatibility. Since the compatibility is excellent, precipitation and oil droplets of coarse particles preferably 30 μm or more (more preferably 40 μm or more, more preferably 50 μm or more) cannot be observed in the resin composition system. [sheet-like base material] The resin composition of the present invention can also be applied and used in a varnish state, but industrially, it is generally used in the form of a sheet-like base material comprising the resin composition to be suitable for use. . The sheet-like base material is preferably an adhesive film or a prepreg as shown below. <Adhesive film> In one embodiment, the adhesive film includes a support and a resin composition layer provided on the support, and the resin composition layer is formed of the resin composition of the present invention. The thickness of the resin composition layer is preferably 100 μm or less, more preferably 80 μm or less, more preferably 60 μm or less, more preferably 50 μm or less or 40 μm from the viewpoint of thinning the printed wiring board. the following. The lower limit of the thickness of the resin composition layer is not particularly limited, but can usually be 1 μm or more, 5 μm or more, and 10 μm or more. [0107] As the support, for example, a film made of a plastic material, a metal foil, or a release paper, and a film or a metal foil made of a plastic material is preferable. When using a film made of a plastic material as the support body, as the plastic material, for example, polyethylene terephthalate (hereinafter sometimes referred to as "PET"), polyethylene naphthalate Polyester such as ethylene formate (hereinafter sometimes abbreviated as "PEN"), acrylic acid such as polycarbonate (hereinafter sometimes abbreviated as "PC"), polymethyl methacrylate (PMMA), etc. Polyolefin, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, polyimide, etc. Among them, polyethylene terephthalate and polyethylene naphthalate are preferred, and inexpensive polyethylene terephthalate is particularly preferred. [0109] In the case of using a metal foil as a support, as the metal foil, for example, copper foil, aluminum foil, etc. can be mentioned, and copper foil is preferred. As the copper foil, a foil made of a simple metal of copper can be used, or a foil made of an alloy of copper and other metals (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) can be used . [0110] Polishing treatment, corona treatment, and antistatic treatment may be applied to the surface of the support to be joined to the resin composition layer. [0111] Also, as a support, a "support with a mold release layer" having a mold release layer on the surface bonded to the resin composition layer can also be used. As the release agent used for the release layer of the support with the release layer, for example, those selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and polysiloxane resins can be mentioned. 1 or more release agents. As a support system with a release layer, a commercially available product can be used. For example, a PET film having a release layer containing an alkyd resin-based release agent as a main component includes "SK-1" and "AL" manufactured by LINTEC. -5", "AL-7", "Lumirror T60" manufactured by Toray Corporation, "PUREX" manufactured by Teijin Corporation, "Unipeel" manufactured by Unitika Corporation, etc. [0112] The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, and is also preferably in the range of 10 μm to 60 μm. Furthermore, in the case of using a support with a mold release layer, the thickness of the entire support with a mold release layer is preferably set to the above-mentioned range. Then film can be manufactured by for example following method: be modulated in organic solvent for the resin varnish that is dissolved with resin composition and form, use die coater etc. this resin varnish is coated on support body , and then dried to form a resin composition layer. Examples of the organic solvent include ketones such as acetone, methyl ethyl ketone (MEK), and cyclohexanone, ethyl acetate, butyl acetate, cellosolve acetate, and propylene glycol monomethyl ether acetate. Acetates such as carbitol acetate, carbitols such as cellosolve and butyl carbitol, aromatic hydrocarbons such as toluene and xylene, dimethylformamide, dimethylformamide, etc. Acetamide-based solvents such as acetamide (DMAc) and N-methylpyrrolidone, and the like. An organic solvent system may be used individually by 1 type, and may be used in combination of 2 or more types. [0115] Drying can be carried out by known methods such as heating and blowing hot air. The drying conditions are not particularly limited, but the content of the organic solvent in the resin composition layer is 10% by mass or less, preferably 5% by mass or less, to be dried. Although it varies depending on the boiling point of the organic solvent in the resin varnish, for example, in the case of using a resin varnish containing an organic solvent in an amount of 30% by mass to 60% by mass, it can be dried at 50°C to 150°C for 3 The resin composition layer is formed by drying for 10 minutes to 10 minutes. [0116] Next in the film, on the surface of the resin composition layer that is not bonded to the support (that is, the surface on the opposite side to the support), a protective film based on the support can be further laminated. The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, it is possible to prevent dust or the like from adhering to the surface of the resin composition layer or being damaged. The film will then possibly be wound into a roll for storage. When the adhesive film has a protective film, it can be used by peeling off the protective film. <Prepreg> In one embodiment, the prepreg system is formed by impregnating a sheet-like fiber base material with the resin composition of the present invention. The sheet-like fiber base material used in the prepreg is not particularly limited, and glass cloth, aromatic polyamide non-woven fabric, liquid crystal polymer non-woven fabric, etc. can be used as the base material for prepreg and are often used. From the viewpoint of thinning the printed wiring board, the thickness of the sheet-like fiber base material is preferably 50 μm or less, more preferably 40 μm or less, more preferably 30 μm or less, and still more preferably 20 μm or less. The lower limit of the thickness of the sheet-like fibrous base material is not particularly limited, but is usually 10 μm or more. [0119] The prepreg system can be produced by a known method such as a thermal solution method and a solvent method. [0120] The thickness of the prepreg can be set in the same range as the resin composition layer in the above-mentioned adhesive film. [Printed Wiring Board, Manufacturing Method of Printed Wiring Board] The printed wiring board of the present invention includes an insulating layer, a first conductor layer, and a second conductor layer, and the insulating layer is cured by the resin composition of the present invention. formed by things. The insulating layer is provided between the first conductor layer and the second conductor layer, and insulates the first conductor layer and the second conductor layer (the conductor layer may be referred to as a wiring layer). [0122] The thickness of the insulating layer between the first and second conductor layers is preferably 6 μm or less, more preferably 5.5 μm or less, and more preferably 5 μm or less. The lower limit is not particularly limited, but can be 0.1 μm or more. The interval between the first conductor layer and the second conductor layer (the thickness of the insulating layer between the first and second conductor layers) refers to the distance between the main surface 11 of the first conductor layer 1 and the second conductor as shown in the example shown in FIG. 1 . The thickness t1 of the insulating layer 3 between the main surfaces 21 of the layer 2 . The first and second conductor layers are adjacent conductor layers with an insulating layer interposed therebetween, and the main surface 11 and the main surface 21 face each other. The thickness of the insulating layer between the first and second conductor layers can be measured according to the method described in <Measurement of the interval between conductor layers (thickness of insulating layer between conductor layers)> described later. [0123] Furthermore, the thickness t2 of the entire insulating layer is preferably 30 μm or less, more preferably 20 μm or less, more preferably 15 μm or less, or 10 μm or less. The lower limit is not particularly limited, but can usually be set to 1 μm or more, 1.5 μm or more, or 2 μm or more. [0124] The printed wiring board uses the above-mentioned adhesive film, and can be manufactured by the steps including the following (I) and (II). (I) The step of laminating on the inner layer substrate by bonding the resin composition layer of the film to the inner layer substrate; (II) The step of forming the insulating layer after thermosetting the resin composition layer. The so-called "inner layer substrate" used in the step (1) refers to mainly glass epoxy substrates, metal substrates, polyester substrates, polyimide substrates, BT resin substrates, thermosetting polyphenylene ether A board such as a board, or a circuit board in which a patterned conductor layer (circuit) is formed on one side or both sides of the board. Furthermore, when manufacturing a printed wiring board, an inner layer circuit board of an intermediate product in which an insulating layer and/or a conductor layer should be further formed is also included in the so-called "inner layer substrate" of the present invention. When the printed wiring board is a circuit board with built-in components, an inner-layer substrate with built-in components can be used. [0126] The lamination of the inner layer substrate and the adhesive film can be performed by, for example, heating and pressure bonding the adhesive film to the inner layer substrate from the support side. The member (hereinafter also referred to as a "heating and pressure bonding member") for heating and pressure bonding the adhesive film to the inner layer substrate includes, for example, a heated metal plate (SUS mirror plate, etc.), a metal roll (SUS roll), and the like. Furthermore, it is preferable to press the adhesive film through an elastic material such as heat-resistant rubber so that the adhesive film can sufficiently follow the surface unevenness of the inner layer substrate without directly pressing the thermocompression-bonding member against the adhesive film. [0127] The lamination of the inner layer substrate and the adhesive film can be performed by a vacuum lamination method. In the vacuum lamination method, the heating pressure bonding temperature is preferably 60°C to 160°C, and preferably 80°C to 140°C, and the heating pressure bonding pressure is preferably 0.098MPa to 1.77MPa, and preferably 0.29 In the range of MPa to 1.47 MPa, the heating and pressing time is preferably 20 seconds to 400 seconds, and more preferably 30 seconds to 300 seconds. The lamination system is preferably carried out under reduced pressure at a pressure of 26.7 hPa or less. [0128] The lamination system can be carried out by a commercially available vacuum laminating machine. As a commercially available vacuum laminating machine, the vacuum pressurization type|mold lamination machine by Meiki Seisakusho Co., Ltd., the vacuum lamination machine by Nikko-Materials Co., Ltd., a batch type vacuum pressurization lamination machine, etc. are mentioned, for example. [0129] After lamination, under normal pressure (atmospheric pressure), for example, by pressing the thermocompression-bonding member from the support side, smoothing treatment of the laminated adhesive film can be performed. The pressing conditions of the smoothing treatment can be set to the same conditions as the heating and pressing conditions of the above-mentioned lamination. The smoothing process can be performed by a commercially available laminator. Furthermore, the lamination and smoothing can be continuously performed using the above-mentioned commercially available vacuum laminating machine. [0130] The support can be removed between the step (I) and the step (II), and can also be removed after the step (II). [0131] In the step (II), the insulating layer is formed after the resin composition layer is thermally hardened. [0132] The thermosetting conditions of the resin composition layer are not particularly limited, and generally used conditions can be used when forming the insulating layer of the printed wiring board. For example, the thermal curing conditions of the resin composition layer vary depending on the type of resin composition, etc., and the curing temperature can be set in the range of 120°C to 240°C (preferably in the range of 150°C to 220°C). , and preferably in the range of 170°C to 200°C), and the hardening time can be set in the range of 5 minutes to 120 minutes (preferably 10 minutes to 100 minutes, and preferably 15 minutes to 90 minutes). [0134] Before thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, before thermosetting the resin composition layer, the resin composition layer is heated at a temperature of 50°C or more and less than 120°C (preferably 60°C or more and 110°C or less, and preferably 70°C or more and 100°C or less). Preheat for more than 5 minutes (preferably 5 minutes to 150 minutes, and preferably 15 minutes to 120 minutes). [0135] When manufacturing the printed wiring board, (III) the step of opening holes in the insulating layer, (IV) the step of roughening the insulating layer, and (V) the step of forming the conductor layer may be further performed. These steps (III) to (V) can be implemented according to various well-known methods used in the manufacture of printed wiring boards. Furthermore, in the case of removing the support after step (II), the removal of the support may be between step (II) and step (III), between step (III) and step (IV), or between step ( IV) and step (V). In addition, the formation of the insulating layer and the conductor layer in the steps (II) to (V) is repeated as necessary, so that a multilayer wiring board can be formed. In this case, the thickness of the insulating layer between the respective conductor layers ( t1 in FIG. 1 ) is preferably within the above range. [0136] The step (III) is a step of opening holes in the insulating layer, whereby holes such as through holes and through holes can be formed in the insulating layer. The step (III) can be implemented using, for example, drilling, laser, plasma, etc., depending on the composition of the resin composition used in the formation of the insulating layer, and the like. The size or shape of the holes can be appropriately determined according to the design of the printed wiring board. [0137] The step (IV) is a step of roughening the insulating layer. The procedures and conditions of the roughening treatment are not particularly limited, and well-known procedures and conditions generally used can be employed when forming the insulating layer of the printed wiring board. For example, the insulating layer can be roughened by sequentially performing swelling treatment with a swelling liquid, roughening treatment with an oxidizing agent, and neutralization treatment with a neutralizing liquid. The swelling liquid used in the roughening treatment is not particularly limited, and examples thereof include an alkaline solution, a surfactant solution, and the like, and an alkaline solution is preferred. As the alkaline solution, a sodium hydroxide solution and a calcium hydroxide solution are further preferred. good. As a commercially available swelling liquid, "Swelling Dip Securiganth P", "Swelling Dip Securiganth SBU" by Atotech Japan, etc. are mentioned, for example. The swelling treatment by the swelling liquid is not particularly limited, but it can be performed, for example, by immersing the insulating layer in the swelling liquid at 30° C. to 90° C. for 1 minute to 20 minutes. From the viewpoint of suppressing the swelling of the resin of the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling liquid at 40° C. to 80° C. for 5 minutes to 15 minutes. Although it does not specifically limit as an oxidizing agent used for roughening process, For example, the alkaline permanganic acid solution which melt|dissolved calcium permanganate or sodium permanganate in the aqueous solution of sodium hydroxide is mentioned. The roughening treatment by an oxidizing agent such as an alkaline permanganic acid solution is preferably performed by immersing the insulating layer in an oxidizing agent solution heated to 60° C. to 80° C. for 10 minutes to 30 minutes. In addition, the concentration of the permanganate in the alkaline permanganic acid solution is preferably 5% by mass to 10% by mass. Examples of commercially available oxidizing agents include alkaline permanganic acid solutions such as "Concentrate Compact CP" and "Dosing Solution Securiganth P" manufactured by Atotech Japan. Moreover, as a neutralization liquid used for roughening process, an acidic aqueous solution is preferable, and "Reduction solution Securiganth P" by Atotech Japan is mentioned as a commercial item, for example. The treatment with the neutralization solution can be performed by immersing the treated surface roughened by the oxidizing agent in the neutralization solution at 30° C. to 80° C. for 5 minutes to 30 minutes. From the viewpoint of workability and the like, a method of immersing the object to be roughened by the oxidizing agent in a neutralizing liquid at 40° C. to 70° C. for 5 minutes to 20 minutes is preferable. [0138] In one embodiment, the arithmetic mean roughness Ra of the surface of the insulating layer after the roughening treatment is preferably 400 nm or less, more preferably 350 nm or less, and more preferably 300 nm or less. The lower limit is not particularly limited, but is preferably 0.5 nm or more, and more preferably 1 nm or more. In addition, the root mean square roughness Rq of the surface of the insulating layer after the roughening treatment is preferably 400 nm or less, more preferably 350 nm or less, more preferably 300 nm or less, and the lower limit is not particularly limited, but is preferably 0.5 nm The above, and preferably 1 nm or more. The arithmetic mean roughness (Ra) and the root mean square roughness (Rq) of the insulating layer surface can be measured using a non-contact surface roughness meter. [0139] The step (V) is a step of forming a conductor layer. If the conductor layer is not formed on the inner layer substrate, step (V) is the step of forming the first conductor layer. If the conductor layer is formed on the inner layer substrate, the conductor layer is the first conductor layer, so step ( V) is the step of forming the second conductor layer. [0140] The conductor material used in the conductor layer is not particularly limited. In a suitable embodiment, the conductor layer includes at least one selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. Metal. The conductor layer may be a single metal layer or an alloy layer. As the alloy layer, for example, an alloy of two or more metals selected from the above group (such as nickel-chromium alloy, copper-nickel alloy and copper- layer of titanium alloy). Among them, from the viewpoints of versatility, cost, ease of patterning, etc. of conductor layer formation, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or nickel, Alloy layers of chromium alloys, copper-nickel alloys, copper-titanium alloys are preferred, and elemental metal layers of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or alloy layers of nickel-chromium alloys are preferred. It is still more preferable, and the elemental metal layer of copper is more preferable. [0141] The conductor layer may have a single-layer structure, or may be a multi-layer structure in which a single metal layer or alloy layer composed of different kinds of metals or alloys is laminated with two or more layers. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a simple metal layer of chromium, zinc or titanium, or an alloy layer of nickel-chromium alloy. [0142] The thickness of the conductor layer is based on the desired design of the printed wiring board, and is generally 3 μm to 35 μm, preferably 5 μm to 30 μm. [0143] In one embodiment, the conductor layer can be formed by plating. For example, a conductor layer having a desired wiring pattern can be formed by plating on the surface of the insulating layer by a conventionally known technique such as a semi-additive method or a full-additive method. Hereinafter, an example in which the conductor layer is formed by the semi-additive method will be shown. [0144] First, on the surface of the insulating layer, a plating seed layer is formed by electroless plating. Next, on the formed plating seed layer, a mask pattern for exposing a part of the plating seed layer is formed in accordance with a desired wiring pattern. On the exposed plating seed layer, after forming a metal layer by electrolytic plating, the mask pattern is removed. After that, the unnecessary plating seed layer is removed by etching or the like, and a conductor layer having a desired wiring pattern can be formed. [0145] The adhesive film of the present invention can be used to obtain an insulating layer with a good part-filling property, so the printed wiring board can also be suitably used when a circuit board is embedded in the parts. The component-embedded circuit board can be produced by a well-known manufacturing method. The printed wiring board manufactured using the adhesive film of the present invention may be provided with an insulating layer in which the resin composition layer of the adhesive film is a cured product, and an embedded wiring layer embedded in the insulating layer. . [0147] In other embodiments, the printed wiring board can be manufactured using the above-mentioned prepreg. The manufacturing method is basically the same as the case of using the adhesive film. [Semiconductor Device] The semiconductor device of the present invention includes the printed wiring board of the present invention. The semiconductor device of the present invention can be manufactured using the printed wiring board of the present invention. Examples of semiconductor devices include various semiconductor devices that are supplied to electrical products (such as computers, mobile phones, digital cameras, televisions, etc.) and vehicles (such as motorcycles, automobiles, trains, ships, airplanes, etc.), etc. . [0150] The semiconductor device of the present invention can be manufactured by mounting a component (semiconductor chip) on a conductive portion of a printed wiring board. The so-called "conduction part" refers to "a part in a printed wiring board that transmits electrical signals", and the position may be a surface or a buried part. In addition, the semiconductor wafer is not particularly limited as long as it is an electric circuit element using a semiconductor as a material. The mounting method of the semiconductor wafer when manufacturing the semiconductor device is not particularly limited as long as the semiconductor wafer can function effectively, but specifically, a wire bonding mounting method, a flip-chip mounting method, a Mounting method by bumpless build-up layer (BBUL), mounting method by anisotropic conductive film (ACF), mounting method by non-conductive film (NCF), etc. Here, the so-called "mounting method by bumpless build-up layer (BBUL)" refers to "mounting method in which the semiconductor chip is directly embedded in the concave portion of the printed wiring board, and the semiconductor chip is connected to the wiring on the printed wiring board" . [Examples] [0152] Hereinafter, the present invention will be specifically described with reference to examples. The present invention is not limited to these embodiments. In addition, the following "parts" and "%" mean "mass parts" and "mass %", respectively, unless otherwise specified. <Example 1> 40 parts of bixylenol type epoxy resin ("YX4000HK" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent about 185) was heated and dissolved in 30 parts of solvent naphtha while stirring, and then cooled to room temperature. 330 parts of an inorganic filler ("SO-C2" manufactured by Admatechs, average particle diameter 0.5 μm, carbon content per unit surface area 0.38 mg/m 2 ) was mixed, kneaded with three rolls, and dispersed. Here, 92.3 parts of an active ester-based curing agent ("HPC-8000-65T" manufactured by DIC Corporation, a toluene solution with an active group equivalent of about 223 and a nonvolatile content of 65%) and a cyclic ether structure having five or more members 15 parts of the compound ("A-DOG" manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), 5 parts of indencoumarone resin ("H-100" manufactured by Nippon Paint Chemical Co., Ltd.), 4-dimethylamino group as a hardening accelerator Resin varnish 1 was prepared by mixing 2 parts of a 5% MEK solution of pyridine (DMAP) and 0.13 part of dicumyl peroxide ("PERCUMYL D" manufactured by NOF Corporation), and uniformly dispersing it with a rotary mixer. By means of a die coater, resin varnish 1 was uniformly applied to polyethylene terephthalate with alkyd mold release treatment so that the thickness of the resin composition layer after drying was 40 μm. The adhesive film 1 was produced by drying the release surface of an alcohol ester film (PET film, "AL-5" manufactured by LINTEC, thickness 38 μm) at 80 to 110° C. (average 95° C.) for 5 minutes. <Example 2> In Example 1, the bixylenol type epoxy resin ("YX4000HK" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent of about 185) was changed from 40 parts to 25 parts, and the inorganic filler ( "SO-C2" manufactured by Admatechs Co., Ltd., average particle size 0.5 μm, carbon content per unit surface area 0.38 mg/m 2 ) was changed from 330 parts to 320 parts, and an active ester-based hardener (“HPC-8000- 65T", a 65% non-volatile toluene solution with an active group equivalent of about 223) was changed from 92.3 parts to 61.5 parts, and a compound having a cyclic ether structure with five or more membered rings ("A-DOG manufactured by Shin-Nakamura Chemical Industry Co., Ltd.") was changed from 92.3 parts to 61.5 parts. ”) changed from 15 to 40. Resin varnish 2 and adhesive film 2 were produced in the same manner as in Example 1 except for the above. <Example 3> In Example 1, the compound ("A-DOG" manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) having a cyclic ether structure with five or more membered rings was changed from 15 parts to 1.5 parts, and the Cresol-type epoxy resin ("YX4000HK" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent of about 185) was changed from 40 parts to 45 parts, and an active ester-based hardener ("HPC-8000-65T" manufactured by DIC Corporation, active group equivalent A 65% nonvolatile toluene solution of about 223) was changed from 92.3 parts to 84.6 parts, and 22.5 parts of thermoplastic resin ("OPE-2St 1200" manufactured by Mitsubishi Gas Chemical Co., a 60% nonvolatile toluene solution) was further mixed. Resin varnish 3 and adhesive film 3 were produced in the same manner as in Example 1 except for the above. <Example 4> In Example 1, the bixylenol type epoxy resin ("YX4000HK" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent of about 185) was changed from 40 parts to 20 parts, and the inorganic filler ( "SO-C2" manufactured by Admatechs Co., Ltd., average particle size 0.5 μm, carbon content per unit surface area 0.38 mg/m 2 ) was changed from 330 parts to 310 parts, and an active ester-based hardener (DIC Co., Ltd. “HPC-8000- 65T", a 65% non-volatile toluene solution with an active group equivalent of about 223) was changed from 92.3 parts to 46.2 parts, and a compound having a cyclic ether structure with five or more membered rings ("A-DOG manufactured by Shin-Nakamura Chemical Industry Co., Ltd.") was changed from 92.3 to 46.2 parts. ”) changed from 15 to 50. Resin varnish 4 and adhesive film 4 were produced in the same manner as in Example 1 except for the above. <Comparative Example 1> In Example 1, the bixylenol type epoxy resin ("YX4000HK" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent of about 185) was changed from 40 parts to 20 parts, and the inorganic filler ( "SO-C2" manufactured by Admatechs Co., Ltd., average particle size 0.5 μm, carbon content per unit surface area 0.38 mg/m 2 ) was changed from 330 parts to 310 parts, and an active ester-based hardener (DIC Co., Ltd. “HPC-8000- 65T", a 65% non-volatile toluene solution with an active group equivalent of about 223) was changed from 92.3 parts to 46.2 parts, and a compound having a cyclic ether structure with five or more membered rings ("A-DOG manufactured by Shin-Nakamura Chemical Industry Co., Ltd.") was changed from 92.3 to 46.2 parts. ”) was changed from 15 to 60. Resin varnish 5 and adhesive film 5 were produced in the same manner as in Example 1 except for the above. <Comparative Example 2> In Example 3, the compound ("A-DOG" manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) having a cyclic ether structure with five or more membered rings was changed from 1.5 parts to 0.5 parts, and the thermoplastic Resin ("OPE-2St 1200" manufactured by Mitsubishi Gas Chemical Co., Ltd., 60% nonvolatile toluene solution) was changed from 22.5 parts to 24.2 parts. Resin varnish 6 and adhesive film 6 were produced in the same manner as in Example 3 except for the above. <Comparative Example 3> In Example 1, 15 parts of a compound ("A-DOG" manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) having a cyclic ether structure having a 5-membered ring or more was changed to a vinyl resin ( New Nakamura Chemical Industry Co., Ltd. "23G") 15 copies. Resin varnish 7 and adhesive film 7 were produced in the same manner as in Example 1 except for the above. <Comparative Example 4> In Example 1, 15 parts of a compound ("A-DOG" manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) having a cyclic ether structure having five or more membered rings was changed to a resin having a vinyl group ( 15 copies of "A-DCP" manufactured by Shin-Nakamura Chemical Industry Co., Ltd. Resin varnish 8 and adhesive film 8 were produced in the same manner as in Example 1 except for the above. <Comparative Example 5> In Example 1, 15 parts of a compound having a cyclic ether structure with five or more membered rings (“A-DOG” manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) was changed to a thermoplastic resin (Mitsubishi Gas Chemical Co., Ltd. "OPE-2St 1200", 60% nonvolatile toluene solution) 25 parts. Resin varnish 9 and adhesive film 9 were produced in the same manner as in Example 1 except for the above. [Evaluation method] <Preparation of samples for evaluation of cured physical properties> The adhesive films obtained in Examples and Comparative Examples were thermally cured at 190° C. for 90 minutes, and the PET film of the support was peeled off to prepare a sheet-like film. samples for hardened product evaluation. <Measurement of Dielectric Tangent> A test piece having a width of 2 mm and a length of 80 mm was cut out from the sample for evaluation of the cured product. Using a measuring device "HP8362B" manufactured by Agilent Technologies, the cut-out test piece was measured by the cavity resonance perturbation method at a measurement frequency of 5.8 GHz and a measurement temperature of 23 °C to measure the dielectric tangent, and The evaluation is based on the following criteria. <Evaluation of Compatibility> Using a microscope (“DIGITAL MICROSCOPE KH-8700” manufactured by Hirox Corporation), the resin composition layer side of the adhesive films produced in the Examples and Comparative Examples was observed in an area of 1 cm , and it was confirmed that The presence or absence of coarse particles shall be evaluated according to the following criteria. Good: Precipitation of coarse particles of 50 μm or more and oil droplets were not observed in the resin composition layer. Defect: Precipitation of coarse particles of 50 μm or more and oil droplets were observed in the resin composition layer. <Preparation of Evaluation Substrate> (1) Base Treatment of Substrate Preparation Glass cloth base epoxy resin double-sided copper-clad laminate with inner layer circuit formed (thickness of copper foil 18 μm, thickness of substrate 0.4 mm, Panasonic Company system "R1515A"). This laminate has a copper foil as a first conductor layer on the surface. Both surfaces of this laminate were immersed in "CZ8101" manufactured by MEC Corporation, and etched by 1 μm to roughen the copper surface, thereby producing an inner-layer circuit board. (2) The lamination process of the next film is carried out using a batch type vacuum pressure laminating machine (“MVLP-500” manufactured by Meiki Co., Ltd.), and the resin composition layer is bonded to the inner layer circuit board. The adhesive films produced in Examples and Comparative Examples were laminated to both sides of the inner-layer circuit substrate. The lamination process was performed by pressure-bonding at 100° C. and a pressure of 0.74 MPa for 30 seconds after reducing the pressure for 30 seconds and making the air pressure 13 hPa or less. Then, it heated at 190 degreeC for 90 minutes in an oven, and obtained the insulating layer which hardened the resin composition layer. (3) The through hole was formed using a CO 2 laser processing machine (LC-2E21B/1C) manufactured by Hitachi Via Mechanics, with a mask diameter of 1.60 mm, a focal length deviation value of 0.050, a pulse width of 25 μs, a power of 0.66 W, Under the conditions of aperture 13, emission number 2, and pulse intermittent mode, a part of the insulating layer is irradiated with a laser, and a part of the insulating layer is subjected to hole processing. The tip diameter (diameter) of the hole (through hole) formed by the drilling process was 50 μm. After that, the PET film of the support was peeled off. (4) Roughening treatment Using a set of surface treatment agents of swelling liquid, oxidizing agent, and neutralizing liquid, wet roughening treatment is performed on the inner layer circuit substrate on which the insulating layer has been formed. Specifically, the inner-layer circuit board with the insulating layer formed thereon was immersed in Swelling Dip Securiganth P (ethylene glycol, ethylene glycol, monobutyl ether) containing diethylene glycol monobutyl ether made by Atotech Japan Co., Ltd. in a swelling liquid at 60° C. for 10 minutes. Aqueous solution of sodium hydroxide), then immersed in Concentrate Compact P (aqueous solution of KMnO 4 : 60 g/L, NaOH: 40 g/L) manufactured by Atotech Japan as an oxidizing agent at 80° C. for 20 minutes, and finally, It was immersed in Reduction solution Securiganth P (aqueous solution of sulfuric acid) manufactured by Atotech Japan Co., Ltd. as a neutralizing solution at 40° C. for 5 minutes, and then dried at 80° C. for 30 minutes. The obtained board|substrate was used as evaluation board|substrate A. (5) The evaluation substrate A is immersed in a solution for electroless plating containing PdCl at 40° C. for 5 minutes by plating by a semi-additive method, and then, in an electroless copper plating solution Immersion at 25°C for 20 minutes. The immersed evaluation substrate A was heated at 150° C. for 30 minutes and subjected to annealing treatment, and then copper sulfate electroplating was applied to form a second conductor layer with a thickness of 30 μm. The obtained evaluation substrate A having the second conductor layer was subjected to annealing treatment at 190° C. for 60 minutes, and the obtained substrate was used as the evaluation substrate B. <Measurement of Plating Adhesion> On the second conductor layer of the evaluation substrate B, a 10 mm wide and 100 mm long part of the incision was cut, one end was peeled off, and a clipper (manufactured by TSE, AUTO COM type testing machine (AC-50C-SL) was clamped, and the load (kgf/cm) when peeled off 35 mm in the vertical direction at a speed of 50 mm/min at room temperature (25° C.) was measured. <Evaluation of stain removability at the bottom of the via hole> The periphery of the bottom of the via hole of the evaluation substrate A was observed with a scanning electron microscope (SEM), and the maximum value from the wall surface side of the bottom of the via hole was measured from the obtained image. Spot length. Here, the so-called "maximum stain length" means the maximum length of the stain from the circumference of the bottom surface of the through hole to the center of the circle. The evaluation system is as follows. Good: The maximum stain length is less than 3 μm Defective: The maximum stain length is 3 μm or more The glossy surface of the electrical boundary copper foil, 35 μm) was immersed in MECetchBOND “CZ-8101” manufactured by MEC Corporation, and the copper surface was roughened (Ra value = 1 μm) and rust-preventive treatment (CL8300) was applied. This copper foil is called CZ copper foil. Furthermore, it heat-processed for 30 minutes in the oven of 130 degreeC. (2) Lamination of copper foil and formation of insulating layer Using a batch vacuum pressure laminating machine (“MVLP-500” manufactured by Meiki Co., Ltd.), the resin composition layer is bonded to the inner layer circuit board. , the adhesive films produced in the examples and comparative examples were laminated to both sides of the inner-layer circuit substrate. The lamination process was performed by pressure-bonding at 100° C. and a pressure of 0.74 MPa for 30 seconds after reducing the pressure for 30 seconds and making the air pressure 13 hPa or less. The PET film of the support was peeled off from the lamination-treated adhesive film. Using the same conditions as above, the treated surface of the CZ copper foil of "3EC-III" was laminated on the resin composition layer from which the support was peeled off. Then, by curing the resin composition layer under curing conditions of 190° C. for 90 minutes, an insulating layer was formed to prepare a sample. (3) Measurement of copper foil peel strength (adhesion) The produced sample was cut into small pieces of 150×30 mm. Using a cutter, cut a 10 mm wide and 100 mm long portion of the copper foil portion of the small piece, peel off one end of the copper foil, and use a clipper (TSE Co., Ltd., AUTO COM type testing machine, "AC-50C- SL") was clamped, and the load when peeled off 35mm in the vertical direction at a speed of 50mm/min at room temperature was measured according to JIS C6481 using an Inster universal testing machine. The results of the above-mentioned examples and comparative examples are shown in the following table. In the following tables, the meanings of the abbreviations are as follows. YX4000HK: Bixylenol type epoxy resin ("YX4000HK" manufactured by Mitsubishi Chemical Corporation) HPC-8000-65T: Active ester type hardener ("HPC-8000-65T" manufactured by DIC Corporation) A-DOG: Dioxane acrylic acid Monomer ("A-DOG" manufactured by Shin-Nakamura Chemical Co., Ltd.) A-DCP: Dicyclopentane acrylic monomer ("A-DCP" manufactured by Shin-Nakamura Chemical Co., Ltd.) 23G: Ethylene oxide acrylic monomer (New "23G" manufactured by Nakamura Chemical Industry Co., Ltd.) OPE-2St 1200: Thermoplastic resin ("OPE-2St 1200" manufactured by Mitsubishi Gas Chemical Co., Ltd.) H-100: Indenecoumarone resin ("H-100" manufactured by Nippon Paint Chemical Co., Ltd. ) SO-C2: Spherical silica ("SO-C2" manufactured by Admatechs) PERCUMYL D: Dicumyl peroxide (manufactured by NOF Corporation) DMAP: 4-dimethylaminopyridine, as shown in the table The compounding amount is a solid content conversion value, and "content (mass %) of (A) component", "content (mass %) of (B) component", and "content (mass %) of (C) component" are expressed as Content when the resin component is set to 100 mass %. [0177]
Figure 02_image007
As can be known from the results in Table 1, the Examples 1 to 4 containing (A) to (C) components and containing a specified amount of (C) components are dielectric tangent, compatibility, and plating adhesion. , substrate adhesion, and stain removal are excellent. On the other hand, although containing (A)～(C) component, but when resin component is set to 100 mass %, the content of (C) component is the comparative example 1 that exceeds 50 mass %, and embodiment 1～ When compared with 4, it can be seen that the plating adhesion and the base adhesion are poor. Although the components (A) to (C) are contained, when the resin component is 100% by mass, the comparative example 2 in which the content of the component (C) is less than 1% by mass can be compared with Examples 1 to 4. The stain removal property was found to be poor. In Comparative Example 3 not containing the component (C), when compared with Examples 1 to 4, it was found that the dielectric tangent was poor. Moreover, since the comparative examples 4-5 which did not contain (C)component were inferior in compatibility, the dielectric tangent, the plating adhesion, the base adhesion, and the stain removal property could not be measured. Still, even if embodiment 1～4 is the situation that does not contain (D) component～(G) component, but it can be confirmed that although the degree is slightly different, it can still be attributed to the same result as the above-mentioned embodiment.

[0181]1‧‧‧第1導體層11‧‧‧第1導體層的主面2‧‧‧第2導體層21‧‧‧第2導體層的主面3‧‧‧絕緣層t1‧‧‧第1導體層與第2導體層的間隔(第1及第2導體層間的絕緣層的厚度)t2‧‧‧絕緣層全體的厚度[0181] 1‧‧‧First Conductor Layer 11‧‧‧Main Surface of First Conductor Layer 2‧‧‧Second Conductor Layer 21‧‧‧Main Surface of Second Conductor Layer 3‧‧‧Insulating Layer t1‧‧ ‧Interval between the first conductor layer and the second conductor layer (thickness of the insulating layer between the first and second conductor layers) t2‧‧‧Thickness of the entire insulating layer

[0010] 　　[圖1] 圖1係模擬性表示印刷配線板之一例的一部份截面圖。[0010] [FIG. 1] FIG. 1 is a partial cross-sectional view schematically showing an example of a printed wiring board.

Claims (15)

一種樹脂組成物，其係包含(A)環氧樹脂、(B)硬化劑、(C)具有5員環以上的環狀醚構造之化合物及(D)無機填充材的樹脂組成物，其中將構成樹脂組成物之不揮發成分中，去除(D)無機填充材的成分設為100質量%時，(A)成分的含量為5質量%~40質量%，將構成樹脂組成物之不揮發成分中，去除(D)無機填充材的成分設為100質量%時，(B)成分的含量為5質量%~60質量%，將構成樹脂組成物之不揮發成分中，去除(D)無機填充材的成分設為100質量%時，(C)成分的含量為1質量%~50質量%。 A resin composition comprising (A) an epoxy resin, (B) a hardener, (C) a compound having a cyclic ether structure with 5 or more membered rings, and (D) an inorganic filler, wherein the Among the non-volatile components constituting the resin composition, when the component excluding the inorganic filler (D) is set to 100% by mass, the content of the (A) component is 5% by mass to 40% by mass, and the non-volatile components constituting the resin composition are Among them, when the component excluding the inorganic filler (D) is set to 100% by mass, the content of the component (B) is 5% by mass to 60% by mass, and the non-volatile components constituting the resin composition are removed from the (D) inorganic filler. When the component of a material is 100 mass %, content of (C)component is 1 mass % - 50 mass %. 如請求項1所記載之樹脂組成物，其中，(B)成分為活性酯系硬化劑。 The resin composition according to claim 1, wherein the component (B) is an active ester-based curing agent. 如請求項1所記載之樹脂組成物，其中，將樹脂組成物的不揮發成分設為100質量%時，(D)成分的含量為50質量%以上。 The resin composition according to claim 1, wherein the content of the component (D) is 50 mass % or more when the nonvolatile content of the resin composition is 100 mass %. 如請求項1所記載之樹脂組成物，其中，(C)成分係包含二噁烷構造。 The resin composition according to claim 1, wherein the component (C) contains a dioxane structure. 如請求項1所記載之樹脂組成物，其中，(C)成分係具有碳-碳不飽和鍵。 The resin composition according to claim 1, wherein the component (C) has a carbon-carbon unsaturated bond. 如請求項1所記載之樹脂組成物，其中，(C)成分係具有碳-碳雙鍵。 The resin composition according to claim 1, wherein the component (C) has a carbon-carbon double bond. 如請求項1所記載之樹脂組成物，其中，(C)成分係具有由乙烯基、甲基丙烯醯基、丙烯醯基、烯丙基、苯乙烯基、及丙烯基所成之群中選出之1種以上的官能基。 The resin composition according to claim 1, wherein the component (C) is selected from the group consisting of vinyl, methacryloyl, acryl, allyl, styryl, and acryl. one or more functional groups. 如請求項1所記載之樹脂組成物，其中，(C)成分係具有乙烯基。 The resin composition according to claim 1, wherein the component (C) has a vinyl group. 如請求項1所記載之樹脂組成物，其中，(C)成分為下述之化合物，
Figure 106135600-A0305-02-0061-1
 The resin composition according to claim 1, wherein the component (C) is the following compound,
Figure 106135600-A0305-02-0061-1
 如請求項1所記載之樹脂組成物，其係印刷配線板的絕緣層形成用。 The resin composition according to claim 1, which is for forming an insulating layer of a printed wiring board. 如請求項1所記載之樹脂組成物，其係印刷配線板的層間絕緣層形成用。 The resin composition according to claim 1, which is for forming an interlayer insulating layer of a printed wiring board. 一種薄片狀基材，其係包含請求項1~11中任一項所記載之樹脂組成物。 A sheet-like base material comprising the resin composition according to any one of claims 1 to 11. 一種接著薄膜，其係包含支撐體、與被設置於該支撐體上的以請求項1~11中任一項所記載之樹脂組成物所形成的樹脂組成物層。 An adhesive film comprising a support and a resin composition layer provided on the support and formed of the resin composition according to any one of claims 1 to 11. 一種印刷配線板，其係包含第1導體層、第2導體層、及在第1導體層與第2導體層之間所形成的絕緣層，且該絕緣層係請求項1~11中任一項所記載之樹脂組成物的硬化物。 A printed wiring board comprising a first conductor layer, a second conductor layer, and an insulating layer formed between the first conductor layer and the second conductor layer, wherein the insulating layer is any one of claims 1 to 11 The cured product of the resin composition described in the item. 一種半導體裝置，其係具備請求項14所記載之印刷配線板。 A semiconductor device including the printed wiring board of claim 14.
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Publication number Priority date Publication date Assignee Title
JP6859897B2 (en) * 2017-08-21 2021-04-14 味の素株式会社 Resin composition
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JP7342358B2 (en) * 2018-12-26 2023-09-12 住友ベークライト株式会社 Resin compositions, resin films with carriers using the same, prepregs, laminates, printed wiring boards, and semiconductor devices
JP2024033072A (en) * 2022-08-30 2024-03-13 デクセリアルズ株式会社 Anisotropic conductive film, connected structure, and method for manufacturing the connected structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005200444A (en) * 2004-01-13 2005-07-28 Sumitomo Bakelite Co Ltd Thermosetting liquid encapsulating resin composition and semiconductor device using the same
JP2016117803A (en) * 2014-12-19 2016-06-30 Dic株式会社 Active ester compound, active ester resin, manufacturing method of active ester compound, curable resin composition, cured article thereof, adhesive film for build up, semiconductor encapsulation material, prepreg and circuit board

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5585214A (en) * 1992-06-25 1996-12-17 Canon Kabushiki Kaisha Electrophotographic photosensitive member having polycarbonate with end-cured glycidyl groups
JP3790771B2 (en) * 1993-02-24 2006-06-28 イビデン株式会社 Manufacturing method of resin composite
JPH09244241A (en) * 1996-03-13 1997-09-19 Ibiden Co Ltd Plating resist composition and printed circuit board
JPH10306202A (en) * 1997-05-07 1998-11-17 Ibiden Co Ltd Resin composite and adhesive for electroless plating
JP2000010276A (en) * 1998-06-24 2000-01-14 Ibiden Co Ltd Solder resist composition and printed wiring board
JP2002201358A (en) * 2000-12-27 2002-07-19 Hitachi Chem Co Ltd Electronic component sealing material, electronic component sealing method, semiconductor package, and semiconductor package manufacturing method
JP4086131B2 (en) * 2001-01-30 2008-05-14 日本化薬株式会社 Resin composition, solder resist resin composition, and cured products thereof
JP4109500B2 (en) * 2002-07-08 2008-07-02 株式会社カネカ Thermosetting resin composition, thermosetting resin solution, and thermosetting resin sheet
JP2006063256A (en) * 2004-08-30 2006-03-09 Dainippon Ink & Chem Inc Epoxy resin composition and laminate using the same
TWI494364B (en) * 2009-01-30 2015-08-01 Ajinomoto Kk Resin composition
WO2013061478A1 (en) * 2011-10-26 2013-05-02 味の素株式会社 Resin composition
JP6308713B2 (en) 2012-08-07 2018-04-11 味の素株式会社 Resin composition
JP2015010153A (en) * 2013-06-28 2015-01-19 日本ゼオン株式会社 Curable epoxy composition, film, laminate film, prepreg, laminate, cured product, and composite
TWI545996B (en) * 2014-04-23 2016-08-11 財團法人工業技術研究院 Substrate structure, manufacturing method thereof, and method for manufacturing an electric device
TWI514073B (en) * 2014-06-11 2015-12-21 Chi Mei Corp Photosensitive resin composition and its application
TWI668269B (en) * 2014-06-30 2019-08-11 日商味之素股份有限公司 Resin composition
JP6558055B2 (en) * 2015-04-30 2019-08-14 味の素株式会社 Resin composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005200444A (en) * 2004-01-13 2005-07-28 Sumitomo Bakelite Co Ltd Thermosetting liquid encapsulating resin composition and semiconductor device using the same
JP2016117803A (en) * 2014-12-19 2016-06-30 Dic株式会社 Active ester compound, active ester resin, manufacturing method of active ester compound, curable resin composition, cured article thereof, adhesive film for build up, semiconductor encapsulation material, prepreg and circuit board

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