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TWI751196B - 含金屬氮化物粒子、分散組成物、硬化性組成物、硬化膜及它們的製造方法以及彩色濾光片、固體攝影元件、固體攝像裝置、紅外線感測器 - Google Patents

含金屬氮化物粒子、分散組成物、硬化性組成物、硬化膜及它們的製造方法以及彩色濾光片、固體攝影元件、固體攝像裝置、紅外線感測器 Download PDF

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Publication number
TWI751196B
TWI751196B TW106131597A TW106131597A TWI751196B TW I751196 B TWI751196 B TW I751196B TW 106131597 A TW106131597 A TW 106131597A TW 106131597 A TW106131597 A TW 106131597A TW I751196 B TWI751196 B TW I751196B
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TW
Taiwan
Prior art keywords
metal
atom
containing nitride
group
curable composition
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TW106131597A
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English (en)
Chinese (zh)
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TW201815682A (zh
Inventor
浜田大輔
久保田誠
田口貴規
坂本裕貴
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日商富士軟片股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/076—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with titanium or zirconium or hafnium
    • C01B21/0763—Preparation from titanium, zirconium or hafnium halides
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G23/00—Compounds of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Geology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Optical Filters (AREA)
  • Materials For Photolithography (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Polymerisation Methods In General (AREA)
TW106131597A 2016-09-30 2017-09-14 含金屬氮化物粒子、分散組成物、硬化性組成物、硬化膜及它們的製造方法以及彩色濾光片、固體攝影元件、固體攝像裝置、紅外線感測器 TWI751196B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-193263 2016-09-30
JP2016193263 2016-09-30

Publications (2)

Publication Number Publication Date
TW201815682A TW201815682A (zh) 2018-05-01
TWI751196B true TWI751196B (zh) 2022-01-01

Family

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TW106131597A TWI751196B (zh) 2016-09-30 2017-09-14 含金屬氮化物粒子、分散組成物、硬化性組成物、硬化膜及它們的製造方法以及彩色濾光片、固體攝影元件、固體攝像裝置、紅外線感測器

Country Status (4)

Country Link
JP (2) JPWO2018061644A1 (fr)
KR (1) KR102294518B1 (fr)
TW (1) TWI751196B (fr)
WO (1) WO2018061644A1 (fr)

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* Cited by examiner, † Cited by third party
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CN112400124B (zh) * 2018-09-11 2022-08-12 富士胶片株式会社 遮光性组合物、固化膜、滤色器、遮光膜、固体摄像元件、图像显示装置
DE102019124713B4 (de) 2018-11-27 2025-08-14 Samsung Electronics Co., Ltd. Vorrichtungen und Verfahren zur Steuerung einer Exposition gegenüber drahtloser Kommunikation
JP2020200376A (ja) * 2019-06-07 2020-12-17 三菱ケミカル株式会社 樹脂組成物、積層フィルム、積層フィルムの製造方法及び積層フィルムの使用用途
CN113104822A (zh) * 2021-03-31 2021-07-13 攀枝花学院 氧化钛还原氮化的方法
CN114813668B (zh) * 2022-03-01 2025-01-07 南方科技大学 一种氨气荧光传感器及其制备方法和应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0222110A (ja) * 1988-04-23 1990-01-25 Tioxide Group Plc 窒素化合物
TW200631898A (en) * 2004-12-28 2006-09-16 Ishihara Sangyo Kaisha Black-type titanium oxynitride
TW201101489A (en) * 2009-02-13 2011-01-01 Semiconductor Energy Lab Transistor, semiconductor device including the transistor, and manufacturing method of the transistor and the semiconductor device

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JP4058850B2 (ja) * 1999-08-11 2008-03-12 住友金属鉱山株式会社 日射フィルター膜形成用塗布液
JP4640961B2 (ja) * 2005-07-27 2011-03-02 株式会社日清製粉グループ本社 微粒子の製造方法および装置
JP5095939B2 (ja) 2004-12-28 2012-12-12 石原産業株式会社 黒色系酸窒化チタン
JP5035720B2 (ja) * 2007-04-17 2012-09-26 三菱マテリアル株式会社 導電性黒色粉末の製造方法と導電性黒色膜
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JP5424591B2 (ja) * 2008-07-29 2014-02-26 三菱マテリアル株式会社 黒色顔料分散液とその製造方法および用途
JP5099094B2 (ja) 2008-09-18 2012-12-12 東レ株式会社 黒色樹脂組成物、樹脂ブラックマトリクス、カラーフィルターおよび液晶表示装置
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TWI483999B (zh) * 2009-06-15 2015-05-11 Toray Industries 黑色複合微粒子、黑色樹脂組成物、彩色濾光片基板及液晶顯示裝置
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JP6639827B2 (ja) * 2014-08-08 2020-02-05 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP5941180B1 (ja) * 2015-03-20 2016-06-29 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0222110A (ja) * 1988-04-23 1990-01-25 Tioxide Group Plc 窒素化合物
TW200631898A (en) * 2004-12-28 2006-09-16 Ishihara Sangyo Kaisha Black-type titanium oxynitride
TW201101489A (en) * 2009-02-13 2011-01-01 Semiconductor Energy Lab Transistor, semiconductor device including the transistor, and manufacturing method of the transistor and the semiconductor device

Also Published As

Publication number Publication date
JP2022079500A (ja) 2022-05-26
KR20190041493A (ko) 2019-04-22
TW201815682A (zh) 2018-05-01
KR102294518B1 (ko) 2021-08-27
JP7373000B2 (ja) 2023-11-01
WO2018061644A1 (fr) 2018-04-05
JPWO2018061644A1 (ja) 2019-09-05

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