TWI750962B - Powder atomic layer deposition apparatus for preventing powders from sticking to filter unit - Google Patents

Abstract

The invention is a powder atomic layer deposition apparatus for preventing powders from sticking to filter unit, which mainly includes a vacuum chamber, a shaft sealing device and a driving unit, wherein the driving unit is connected through the shaft sealing device and drives the vacuum chamber to rotate. An air extraction line and at least one air intake line are arranged in the shaft sealing device, and a filter unit is arranged at one end of the shaft sealing device connected to the reaction space of the vacuum chamber. The air extraction line extracts the gas in the reaction space through the filter unit, and the air intake line transports the precursor gas or non-reactive gas to the reaction space through the filter unit. The state of the non-reactive gas transmitted by the intake pipeline includes a stirring state and a sticking prevention state, wherein the flow rate of the non-reactive gas output from the intake pipeline in the sticking prevention state is less than that of the stirring state to prevent powders from sticking to the filter unit.

Description

Powder Atomic Layer Deposition Device for Preventing Powder Sticking

The present invention relates to a powder atomic layer deposition device for preventing powder from sticking, wherein the state in which the non-reactive gas is conveyed by the air inlet pipeline includes a stirring state and an anti-adhesion state, and the non-reactive gas output by the air inlet line in the non-sticking state is prevented. The flow rate is lower than that of the stirring state, and is used to prevent powder from sticking to the filter unit.

Nanoparticles are generally defined as particles smaller than 100 nanometers in at least one dimension that are physically and chemically distinct from macroscopic substances. In general, the physical properties of macroscopic substances are independent of their size, but this is not the case for nanoparticles, which have potential applications in fields such as biomedicine, optics, and electronics.

Quantum Dot (Quantum Dot) is a semiconductor nanoparticle. The currently studied semiconductor materials are II-VI materials, such as ZnS, CdS, CdSe, etc., among which CdSe is the most attention. The size of quantum dots is usually between 2 and 50 nanometers. When the quantum dots are irradiated with ultraviolet light, the electrons in the quantum dots absorb energy and transition from the valence band to the conduction band. Excited electrons release energy by emitting light as they travel from the conduction band back to the valence band.

The energy gap of quantum dots is related to the size. The larger the size of the quantum dot, the smaller the energy gap, and it will emit light with a longer wavelength after irradiation. The smaller the size of the quantum dot, the larger the energy gap, and the wavelength will be emitted after irradiation. shorter light. For example, quantum dots of 5 to 6 nanometers will emit orange or red light, while quantum dots of 2 to 3 nanometers will emit blue or green light, of course, the light color depends on the material composition of the quantum dots.

Light emitting diodes (LEDs) using quantum dots can produce light close to a continuous spectrum, and at the same time have high color rendering properties, which is beneficial to improve the luminous quality of light emitting diodes. In addition, the wavelength of the emitted light can be adjusted by changing the size of the quantum dots, making the quantum dots become the focus of the development of the new generation of light-emitting devices and displays.

Although quantum dots have the above-mentioned advantages and characteristics, they are prone to agglomeration in the process of application or manufacture. In addition, quantum dots have high surface activity and easily react with air and water vapor, thereby shortening the life of quantum dots.

Specifically, when quantum dots are used as sealants for light-emitting diodes, agglomeration effects may occur, which reduce the optical properties of quantum dots. In addition, after the quantum dots are made into the sealant of the light-emitting diodes, the external oxygen or moisture may still pass through the sealant and contact the surface of the quantum dots, resulting in oxidation of the quantum dots and affecting the quantum dots and light-emitting diodes. performance or service life. Surface defects and dangling bonds of quantum dots may also cause nonradiative recombination, which also affects the luminous efficiency of quantum dots.

At present, the industry mainly uses atomic layer deposition (ALD) to form a nanometer-thick film on the surface of the quantum dot, or to form a multi-layer film on the surface of the quantum dot to form a quantum well structure.

Atomic layer deposition can form a thin film with uniform thickness on the substrate, and can effectively control the thickness of the thin film. It is also suitable for three-dimensional quantum dots in theory. When the quantum dots are placed on the carrier plate, there will be contact points between adjacent quantum dots, so that the precursor gas of atomic layer deposition cannot contact these contact points, and it is impossible to form uniform thickness on the surface of all nanoparticles. film.

In order to solve the above-mentioned problems faced by the prior art, the present invention provides a powder atomic layer deposition device for preventing powder from sticking, which can fully stir the powder during the atomic layer deposition process, so as to facilitate the formation of a thin film with uniform thickness on the surface of each powder. In the process of stirring the powder, the non-reactive gas can be delivered to the reaction space through the air inlet line through the filter unit, so as to prevent the powder in the reaction space from sticking to the filter unit.

An object of the present invention is to provide a powder atomic layer deposition device for preventing powder from sticking, which mainly includes a driving unit, a shaft sealing device and a vacuum chamber, wherein the driving unit is connected through the shaft sealing device and drives the vacuum chamber to rotate. At least one air extraction line, at least one stirring gas delivery line and at least one intake line are located in the shaft sealing device, and a filter unit is arranged at one end of the shaft sealing device connected to or contacting the reaction space of the vacuum chamber.

The gas extraction line extracts the gas in the reaction space through the filter unit, so as to prevent the extraction line from extracting the powder in the reaction space. The stirring gas delivery line delivers a stirring gas to the reaction space through the filter unit, so as to blow the powder in the reaction space. In addition, when the agitation gas delivery line sends the agitation gas to the reaction space through the filter unit, the inlet line will also deliver the non-reactive gas to the reaction space through the filter unit, so that the side of the filter unit connected to the reaction space forms a positive pressure or a gas wall, To prevent the powder from sticking to the surface or inside of the filter unit.

An object of the present invention is to provide a powder atomic layer deposition device for preventing powder from sticking, which mainly includes a driving unit, a shaft sealing device and a vacuum chamber, wherein the driving unit is connected through the shaft sealing device and drives the vacuum chamber to rotate. The gas extraction line extracts the gas in the reaction space through the filter unit, so as to prevent the extraction line from extracting the powder in the reaction space. At least one air inlet pipeline conveys a non-reactive gas to the reaction space through the filter unit, wherein the state in which the air inlet pipeline conveys the non-reactive gas includes a stirring state and a sticking prevention state. The flow rate of the non-reactive gas output from the inlet line in the stirring state is greater than that in the anti-sticking state, and the powder in the reaction space can be blown through the larger flow of non-reactive gas. In the state of preventing sticking, a small flow of non-reactive gas forms an air wall or positive pressure on the surface of the filter unit connected to the reaction space to prevent the powder from sticking to the surface or inside of the filter unit.

In order to achieve the above purpose, the present invention provides a powder atomic layer deposition device for preventing powder from sticking, including: a vacuum chamber, including a reaction space for accommodating a plurality of powders; a shaft sealing device, connected to the vacuum chamber; a A driving unit is connected to the vacuum chamber through the shaft sealing device, and drives the vacuum chamber to rotate through the shaft sealing device; a filter unit is located at one end of the reaction space where the shaft sealing device is connected to the vacuum chamber; at least one suction line is located at the shaft seal inside the device, and is fluidly connected to the reaction space of the vacuum chamber through a filter unit to extract a gas in the reaction space; at least one agitating gas delivery line is located in the shaft sealing device and conveys a stirring gas to the reaction space through the filter unit , to blow the powder in the reaction space; and at least one inlet line, located in the shaft sealing device, and conveys a precursor gas or a non-reaction gas to the reaction space through the filter unit, wherein the agitating gas delivery line will agitate the gas When delivering the reaction space, the gas inlet line delivers the non-reactive gas to the reaction space.

The present invention provides another powder atomic layer deposition device for preventing powder from sticking, including: a vacuum chamber including a reaction space for accommodating a plurality of powders; a shaft sealing device connected to the vacuum chamber; The sealing device is connected to the vacuum chamber, and drives the vacuum chamber to rotate through the shaft sealing device; a filter unit is located at one end of the reaction space where the shaft sealing device is connected to the vacuum chamber; at least one suction line is located in the shaft sealing device and is The filter unit is fluidly connected to the reaction space of the vacuum chamber, so as to extract a gas in the reaction space; and at least one intake line is located in the shaft sealing device, and transmits a non-reactive gas to the reaction space through the filter unit, wherein the intake air The state in which the non-reactive gas is transported by the pipeline includes a stirring state and an anti-sticking state. In the stirring state, the flow rate of the non-reactive gas output by the intake line is greater than the anti-sticking state, so as to blow the powder in the reaction space.

In the powder atomic layer deposition device for preventing powder from sticking, the stirring gas conveying line includes an extension line, which is located in the reaction space and extends toward a surface of the reaction space.

The powder atomic layer deposition device for preventing powder from sticking, wherein the shaft sealing device includes an outer tube body and an inner tube body, and the outer tube body has an accommodating space for accommodating the inner tube body, the air extraction pipeline, The agitating gas delivery line and the air inlet line are located in the inner tube body.

In the powder atomic layer deposition device for preventing powder from sticking, the inner tube body extends from the accommodating space of the outer tube body to the reaction space of the vacuum cavity, and a protruding tube portion is formed in the reaction space.

The powder atomic layer deposition device for preventing powder from sticking, wherein the air inlet pipeline transports the non-reactive gas to the reaction space through the filter unit, and a gas wall or a positive pressure is formed on a surface of the filter unit that contacts the reaction space to prevent The powder sticks to the surface of the filter unit.

In the powder atomic layer deposition device for preventing powder from sticking, the inlet line conveys a precursor gas to the reaction space through the filter unit.

The powder atomic layer deposition device for preventing powder from sticking, wherein the air inlet pipeline transports the non-reactive gas to the reaction space through the filter unit in the state of preventing adhesion, and forms a gas wall or a surface of the filter unit in contact with the reaction space. A positive pressure to prevent powder from sticking to the surface of the filter unit.

Please refer to FIG. 1 , FIG. 2 and FIG. 3 , which are a three-dimensional schematic diagram, a schematic cross-sectional view, and a shaft sealing device of the powder atomic layer deposition device for preventing powder sticking according to an embodiment of the present invention, respectively. Schematic cross-sectional view of the embodiment. As shown in the figure, the powder atomic layer deposition apparatus 10 for preventing powder adhesion mainly includes a vacuum chamber 11 , a shaft sealing device 13 and a driving unit 15 , wherein the driving unit 15 is connected to the vacuum chamber 11 through the shaft sealing device 13 , and Drive the vacuum chamber 11 to rotate.

The vacuum chamber 11 has a reaction space 12 for accommodating a plurality of powders 121, wherein the powders 121 can be quantum dots (Quantum Dot), such as ZnS, CdS, CdSe and other II-VI semiconductor materials, and formed in the quantum dots The film on the top can be aluminum oxide (Al2O3). The vacuum chamber 11 may include a cover plate 111 and a cavity 113 , wherein an inner surface 1111 of the cover plate 111 is used to cover the cavity 113 and form the reaction space 12 therebetween.

In an embodiment of the present invention, a monitoring wafer 115 may be disposed on the inner surface 1111 of the cover plate 111 . When the cover plate 111 covers the cavity 113 , the monitoring wafer 115 will be located in the reaction space 12 . During the atomic layer deposition in the reaction space 12 , a thin film is formed on the surface of the monitoring wafer 115 . In practical application, the film thickness on the surface of the monitoring wafer 115 and the film thickness on the surface of the powder 121 can be further measured, and the relationship between the two can be calculated. Then, the film thickness on the surface of the wafer 115 can be monitored and measured, and the film thickness on the surface of the powder 121 can be converted.

In an embodiment of the present invention, the shaft sealing device 13 includes an outer tube body 131 and an inner tube body 133, wherein the outer tube body 131 has an accommodating space 132, and the inner tube body 133 has a connecting space 134, for example The outer tube body 131 and the inner tube body 133 may be hollow cylindrical bodies. The accommodating space 132 of the outer tube body 131 is used for accommodating the inner tube body 133 , wherein the outer tube body 131 and the inner tube body 133 are coaxially arranged. The shaft seal device 13 may be a common shaft seal or a magnetic fluid shaft seal, and is mainly used to isolate the reaction space 12 of the vacuum chamber 11 from the external space, so as to maintain the vacuum of the reaction space 12 .

The driving unit 15 is connected to the vacuum chamber 11 through the outer tube body 131 , and drives the vacuum chamber body 11 to rotate through the outer tube body 131 . In addition, the driving unit 15 is not connected to the inner tube body 133 , so when the driving unit 15 drives the outer tube body 131 and the vacuum chamber 11 to rotate, the inner tube body 133 will not rotate along with it.

The driving unit 15 can drive the outer tube body 131 and the vacuum chamber 11 to continuously rotate in the same direction, for example, clockwise or counterclockwise. In different embodiments, the driving unit 15 can drive the outer tube 131 and the vacuum chamber 11 to rotate clockwise by a specific angle, and then rotate counterclockwise by a specific angle, for example, the specific angle can be 360 degrees. When the vacuum chamber 11 rotates, the powder 121 in the reaction space 12 is stirred, so that the powder 121 is heated evenly and contacts with the precursor gas, the non-reactive gas or the stirring gas.

In an embodiment of the present invention, the driving unit 15 can be a motor, connected to the outer tube body 131 through at least one gear 14 , and drives the outer tube body 131 and the vacuum chamber 11 to rotate relative to the inner tube body 133 through the gear 14 .

At least one suction line 171 , at least one intake line 173 , at least one stirring gas delivery line 175 , a heater 177 and/or a temperature sensor can be arranged in the connecting space 134 of the shaft sealing device 13 or its inner pipe body 133 Unit 179 is shown in FIGS. 2 and 3 . In addition, a filter unit 139 may be provided at one end of the inner tube body 133 connected to the reaction space 12 , wherein the filter unit 139 is mainly used for filtering the powder 121 in the reaction space 12 .

The exhaust line 171 is fluidly connected to the reaction space 12 of the vacuum chamber 11 through the filter unit 139 , and the gas in the reaction space 12 is extracted through the filter unit 139 , so that the reaction space 12 is in a vacuum state for performing the atomic layer deposition process. Specifically, the pumping line 171 can be connected to a pump, and the gas in the reaction space 12 can be pumped out through the pump. In addition, the arrangement of the filter unit 139 can prevent the powder 121 from entering the gas extraction line 171 during the gas extraction process, which can effectively reduce the loss of the powder 121 .

The inlet line 173 is fluidly connected to the reaction space 12 of the vacuum chamber 11 through the filter unit 139, and sends a precursor gas or a non-reactive gas to the reaction space 12 through the filter unit 139, wherein the non-reactive gas can be nitrogen or argon. and other inert gases. For example, the inlet line 173 can be connected to a precursor gas storage tank and a non-reactive gas storage tank through the valve assembly, and the precursor gas can be transported into the reaction space 12 through the valve assembly to deposit the precursor gas on the powder 121 surface. In practical applications, the gas inlet line 173 may transport a carrier gas and the precursor gas into the reaction space 12 together. Then, the unreacted gas is transported into the reaction space 12 through the valve assembly, and pumped through the exhaust line 171 to remove the unreacted gas, the reacted gas or the precursor gas in the reaction space 12 . In an embodiment of the present invention, the inlet line 173 can be connected to a plurality of branch lines, and different precursor gases are sequentially transported into the reaction space 12 through each branch line.

In addition, the flow rate of the non-reactive gas delivered to the reaction space 12 by the inlet line 173 can be increased, and the powder 121 in the reaction space 12 is blown through the non-reactive gas, so that the powder 121 is driven by the non-reactive gas and diffuses into the reaction space 12 of each area.

In an embodiment of the present invention, the flow rate of the non-reactive gas output from the inlet line 173 is adjustable. When the flow rate of the non-reactive gas output from the inlet line 173 is relatively large, the non-reactive gas can agitate the gas in the reaction space 12 through the non-reactive gas. Powder 121, and this state can be defined as a stirring state. On the contrary, when the flow rate of the non-reactive gas output from the intake line 173 is small, the non-reactive gas may not be able to agitate the powder 121 in the reaction space 12 . However, the output non-reactive gas can form a gas wall or positive pressure on the surface of the filter unit 139 contacting the reaction space 12 to prevent the powder 121 in the reaction space 12 from sticking to the surface of the filter unit 139, and this state can be defined as 1. Prevent sticking state. In other words, in the stirring state, the flow rate of the non-reactive gas output from the inlet line 173 will be greater than that in the sticking prevention state.

In practical application, the flow rate of the non-reactive gas output from the air inlet line 173 can be adjusted according to the requirements of the process, and can be switched between the stirring state and the sticking prevention state. Specifically, the inlet line 173 can output a small flow of non-reactive gas at all times except for the stirring state and the output of the precursor gas.

In another embodiment of the present invention, the shaft sealing device 13 of the powder atomic layer deposition apparatus 10 for preventing powder adhesion may be provided with at least one stirring gas delivery line 175 , wherein the stirring gas delivery line 175 is fluidly connected to the vacuum chamber through the filter unit 139 The reaction space 12 of the body 11 is connected to the reaction space 12 of the body 11, and a stirring gas is delivered to the reaction space 12 through the filter unit 139. For example, the stirring gas delivery line 175 can be connected to a nitrogen storage tank through the valve assembly, and the nitrogen is sent to the reaction space through the valve assembly. 12. The stirring gas is used to blow the powder 121 in the reaction space 12 , and cooperates with the driving unit 15 to drive the vacuum chamber 11 to rotate, which can effectively and uniformly stir the powder 121 in the reaction space 12 , and is conducive to deposition on the surface of each powder 121 Films of uniform thickness.

Specifically, the gas inlet line 173 is used for outputting the precursor gas or the non-reactive gas, and the stirring gas delivery line 175 is used for outputting the stirring gas, wherein the stirring gas and the non-reactive gas can be the same or different gases, such as stirring gas The gas and non-reactive gas can be inert gas or nitrogen gas. The flow rate of the non-reactive gas transported by the inlet line 173 is relatively small, and is mainly used to remove the precursor gas in the reaction space 12 , while the flow rate of the agitated gas transported by the agitating gas transport line 175 is relatively large, mainly used to blow the reaction space 12 . Powder 121 inside.

In the embodiment of the present invention, when the stirring gas delivery line 175 delivers the stirring gas to the reaction space 12 , the gas inlet line 173 can also deliver the non-reactive gas to the reaction space 12 , and the filter unit 139 contacts the surface of the reaction space 12 An air wall or positive pressure is formed to prevent the powder 121 blown by the stirring gas in the reaction space 12 from sticking to the surface of the filter unit 139 .

In an embodiment of the present invention, as shown in FIG. 4 , the inner tube body 133 of the shaft sealing device 13 extends from the accommodating space 132 of the outer tube body 131 to the reaction space 12 of the vacuum chamber 11 , wherein the inner tube body 133 in the reaction space 12 extends The inner tube body 133 is defined as a protruding tube portion 130 . In addition, the suction line 171 , the intake line 173 , the stirring gas delivery line 175 , the heater 177 and/or the temperature sensing unit 179 located in the connection space 134 of the inner pipe body 133 are also located in the protruding pipe portion 130 . The distance between the gas inlet line 173 and/or the stirring gas delivery line 175 and the cover plate 111 can be shortened or adjusted through the arrangement of the protruding pipe portion 130, so that the gas inlet line 173 and/or the stirring gas delivery line 175 can be delivered to the reaction space The non-reactive gas and/or agitation gas of 12 are transferred to the cover plate 111 and diffused to various regions of the reaction space 12 through the cover plate 111 . In addition, the filter unit 139 may be disposed at one end of the protruding pipe part 130 .

The heater 177 is used to heat the air extraction line 171 , the air inlet line 173 and/or the stirring gas delivery line 175 in the inner pipe body 133 , so as to improve the inside of the air extraction line 171 , the air inlet line 173 and/or the stirring gas delivery line 175 temperature of the gas. For example, the temperature of the non-reactive gas and/or the precursor gas delivered to the reaction space 12 by the gas inlet line 173 can be increased, and the temperature of the agitated gas delivered to the reaction space 12 by the agitation gas delivery line 175 can be increased. When the non-reactive gas, the stirring gas and/or the precursor gas is allowed to enter the reaction space 12 , the temperature of the reaction space 12 will not be greatly decreased or changed. In addition, the temperature of the heater 177 or the connection space 134 can be measured through the temperature sensing unit 179 to know the working state of the heater 177 . Of course, another heating device 16 is usually disposed inside, outside or around the vacuum chamber 11 , as shown in FIG. .

When the driving unit 15 drives the outer tube body 131 and the vacuum chamber 11 to rotate, the inner tube body 133 and the inner air extraction line 171 , the air intake line 173 and/or the stirring gas delivery line 175 will not rotate along with it, which is beneficial to Stable delivery of non-reactive gas, agitation gas, and precursor gas to the reaction space 12 .

In an embodiment of the present invention, the powder atomic layer deposition apparatus 10 for preventing powder adhesion may also include a carrier board 191 and at least one fixing frame 193 , wherein the carrier board 191 may be a board body for carrying the driving unit 15 , Vacuum chamber 11 and shaft sealing device 13 . For example, the carrier plate 191 is connected to the driving unit 15 , and is connected to the shaft sealing device 13 and the vacuum chamber 11 through the driving unit 15 . In addition, the shaft sealing device 13 and/or the vacuum chamber 11 can also be connected to the carrier plate 191 through at least one support frame, so as to improve the stability of the connection.

The carrier plate 191 can be connected to the fixing frame 193 through at least one connecting shaft 195 , wherein the number of the fixing frames 193 can be two, and the fixing frames 193 are respectively disposed on both sides of the bearing plate 191 . The bearing plate 191 can be connected to the shaft 195 to rotate relative to the fixing frame 193 to change the elevation angle of the drive unit 15 , the shaft sealing device 13 and the vacuum chamber 11 , so as to form a film with uniform thickness on the surface of each powder 121 .

In another embodiment of the present invention, as shown in FIG. 5 , the stirring gas delivery line 175 extends from the connecting space 134 of the inner pipe body 133 to the reaction space 12 of the vacuum chamber 11 , wherein the stirring gas extending to the reaction space 12 is delivered Line 175 may be defined as an extension line 172 . The extension line 172 is located in the reaction space 12 and extends toward a surface of the reaction space 12 , for example, the surface of the lower half of the reaction space 12 . The stirring gas delivery line 175 and the extension line 172 do not send the stirring gas to the reaction space 12 of the vacuum chamber 11 through the filter unit 139 , but directly deliver the stirring gas to the reaction space 12 .

When the agitation gas delivery line 175 and the extension line 172 output the agitation gas, the inlet line 173 also outputs non-reactive gas, and a gas wall or positive pressure is formed on the surface of the filter unit 139 contacting the reaction space 12 to prevent the reaction space 12 The powder 121 sticks to the surface of the filter unit 139 .

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Modifications should be included within the scope of the patent application of the present invention.

10: Powder atomic layer deposition device to prevent powder from sticking 11: Vacuum chamber 111: Cover 1111: inner surface 113: Cavity 115: Monitor Wafers 12: Reaction Space 121: Powder 13: Shaft seal device 130: protruding pipe 131: outer tube body 132: accommodating space 133: inner tube body 134: Connect Space 139: Filter unit 14: Gear 15: Drive unit 16: Heating device 171: Exhaust line 172: Extension Line 173: Intake line 175: Agitation gas delivery line 177: Heater 179: Temperature Sensing Unit 191: Carrier plate 193:Fixed frame 195: connecting shaft

1 is a schematic perspective view of an embodiment of a powder atomic layer deposition apparatus for preventing powder from sticking according to the present invention.

2 is a schematic cross-sectional view of an embodiment of a powder atomic layer deposition apparatus for preventing powder from sticking according to the present invention.

3 is a schematic cross-sectional view of an embodiment of the shaft sealing device of the powder atomic layer deposition device for preventing powder sticking according to the present invention.

4 is a schematic cross-sectional view of another embodiment of the powder atomic layer deposition apparatus for preventing powder adhesion according to the present invention.

5 is a schematic cross-sectional view of another embodiment of the powder atomic layer deposition apparatus for preventing powder adhesion according to the present invention.

10: Powder atomic layer deposition device to prevent powder from sticking

11: Vacuum chamber

111: Cover

1111: inner surface

113: Cavity

115: Monitor Wafers

12: Reaction Space

121: Powder

13: Shaft seal device

131: outer tube body

132: accommodating space

133: inner tube body

134: Connect Space

139: Filter unit

14: Gear

15: Drive unit

171: Exhaust line

175: Agitation gas delivery line

177: Heater

179: Temperature Sensing Unit

Claims (8)

A powder atomic layer deposition device for preventing powder from sticking, comprising: a vacuum chamber including a reaction space for accommodating a plurality of powders; a shaft sealing device connected to the vacuum chamber, wherein the shaft sealing device includes an outer tube body and an inner tube body, the outer tube body has an accommodating space for accommodating the inner tube body; a driving unit is connected to the vacuum chamber through the outer tube body of the shaft sealing device, and passes through the outer tube body The tube body drives the vacuum chamber body to rotate, and the inner tube body does not rotate with the outer tube body; a filter unit is located at one end of the reaction space where the shaft sealing device is connected to the vacuum chamber body; at least one air extraction line , located in the inner tube of the shaft sealing device, and fluidly connected to the reaction space of the vacuum chamber through the filter unit to extract a gas in the reaction space; at least one agitating gas delivery line, located in the shaft sealing device in the inner tube body, and deliver a stirring gas to the reaction space through the filter unit to blow the powder in the reaction space; and at least one intake line is located in the inner tube body of the shaft sealing device, And through the filter unit, a precursor gas or a non-reactive gas is delivered to the reaction space, wherein when the stirring gas delivery line delivers the stirring gas to the reaction space, the inlet line will deliver the non-reactive gas to the reaction space space. The powder atomic layer deposition apparatus for preventing powder from sticking as claimed in claim 1, wherein the stirring gas conveying line comprises an extension line located in the reaction space and extending toward a surface of the reaction space. The powder atomic layer deposition device for preventing powder from sticking as claimed in claim 1, wherein the inner tube body extends from the accommodating space of the outer tube body to the reaction space of the vacuum chamber, and is within the reaction space A protruding tube portion is formed. The powder atomic layer deposition device for preventing powder from sticking as claimed in claim 1, wherein the air inlet line transports the non-reactive gas to the reaction space through the filter unit, and the filter unit A surface contacting the reaction space forms an air wall or a positive pressure to prevent the powder from sticking to the surface of the filter unit. A powder atomic layer deposition device for preventing powder from sticking, comprising: a vacuum chamber including a reaction space for accommodating a plurality of powders; a shaft sealing device connected to the vacuum chamber, wherein the shaft sealing device includes an outer tube body and an inner tube body, the outer tube body has an accommodating space for accommodating the inner tube body; a driving unit is connected to the vacuum chamber through the outer tube body of the shaft sealing device, and passes through the outer tube body The tube body drives the vacuum chamber body to rotate, and the inner tube body does not rotate with the outer tube body; a filter unit is located at one end of the reaction space where the shaft sealing device is connected to the vacuum chamber body; at least one air extraction line , located in the inner tube of the shaft sealing device, and fluidly connected to the reaction space of the vacuum chamber through the filter unit to extract a gas in the reaction space; and at least one intake line, located in the shaft sealing device In the inner tube body, a non-reactive gas is delivered to the reaction space through the filter unit, wherein the state of the non-reactive gas delivered by the inlet line includes a stirring state and an anti-sticking state. In the stirring state, the feeding The flow rate of the non-reactive gas output from the gas line is greater than the anti-sticking state, so as to blow the powder in the reaction space. The powder atomic layer deposition apparatus for preventing powder from sticking as claimed in claim 5, wherein the inlet line conveys a precursor gas to the reaction space through the filter unit. The powder atomic layer deposition device for preventing powder from sticking as claimed in claim 5, wherein the inner tube body extends from the accommodating space of the outer tube body to the reaction space of the vacuum chamber, and is within the reaction space A protruding tube portion is formed. The powder atomic layer deposition apparatus for preventing powder from sticking as claimed in claim 5, wherein the air inlet line conveys the non-reactive gas to the reaction air through the filter unit in the anti-sticking state while forming an air wall or a positive pressure on a surface of the filter unit contacting the reaction space to prevent the powder from sticking to the surface of the filter unit.

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