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TWI743196B - 正型感光性樹脂組成物、乾膜、硬化物、印刷配線板及半導體元件 - Google Patents

正型感光性樹脂組成物、乾膜、硬化物、印刷配線板及半導體元件 Download PDF

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Publication number
TWI743196B
TWI743196B TW106131345A TW106131345A TWI743196B TW I743196 B TWI743196 B TW I743196B TW 106131345 A TW106131345 A TW 106131345A TW 106131345 A TW106131345 A TW 106131345A TW I743196 B TWI743196 B TW I743196B
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
silane coupling
positive photosensitive
coupling agent
Prior art date
Application number
TW106131345A
Other languages
English (en)
Chinese (zh)
Other versions
TW201827488A (zh
Inventor
秋元真
許成強
Original Assignee
日商太陽控股股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商太陽控股股份有限公司 filed Critical 日商太陽控股股份有限公司
Publication of TW201827488A publication Critical patent/TW201827488A/zh
Application granted granted Critical
Publication of TWI743196B publication Critical patent/TWI743196B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW106131345A 2016-09-20 2017-09-13 正型感光性樹脂組成物、乾膜、硬化物、印刷配線板及半導體元件 TWI743196B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-182791 2016-09-20
JP2016182791 2016-09-20

Publications (2)

Publication Number Publication Date
TW201827488A TW201827488A (zh) 2018-08-01
TWI743196B true TWI743196B (zh) 2021-10-21

Family

ID=61690282

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106131345A TWI743196B (zh) 2016-09-20 2017-09-13 正型感光性樹脂組成物、乾膜、硬化物、印刷配線板及半導體元件

Country Status (5)

Country Link
JP (1) JP7011591B2 (ja)
KR (1) KR102385641B1 (ja)
CN (1) CN109716235B (ja)
TW (1) TWI743196B (ja)
WO (1) WO2018056013A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018097210A (ja) * 2016-12-14 2018-06-21 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、硬化パターンの製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
JP7440224B2 (ja) * 2019-08-21 2024-02-28 太陽ホールディングス株式会社 ポジ型感光性樹脂組成物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201533524A (zh) * 2014-02-28 2015-09-01 Jsr Corp 絕緣膜的形成方法及使用絕緣膜的裝置
TW201600564A (zh) * 2014-06-27 2016-01-01 Fujifilm Corp 熱硬化性樹脂組成物、硬化膜、硬化膜的製造方法及半導體元件

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TW594287B (en) * 2002-12-17 2004-06-21 Ind Tech Res Inst Transflective display with different pre-tilt angle structures and its manufacturing method
JP2008538011A (ja) * 2005-03-25 2008-10-02 フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド 前処理組成物
WO2007122929A1 (ja) * 2006-03-30 2007-11-01 Jsr Corporation 感放射線性絶縁樹脂組成物
JP5498170B2 (ja) * 2007-12-26 2014-05-21 旭化成イーマテリアルズ株式会社 耐熱性樹脂前駆体及びそれを用いた感光性樹脂組成物
KR100914064B1 (ko) * 2008-03-19 2009-08-28 제일모직주식회사 포지티브형 감광성 수지 조성물
JP5169446B2 (ja) 2008-04-28 2013-03-27 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、該樹脂組成物を用いたポリベンゾオキサゾール膜、パターン硬化膜の製造方法及び電子部品
WO2009136647A1 (ja) * 2008-05-07 2009-11-12 住友ベークライト株式会社 ポジ型感光性樹脂組成物、硬化膜、保護膜及び絶縁膜、並びにそれを用いた半導体装置及び表示体装置
KR101249568B1 (ko) * 2008-07-03 2013-04-01 아사히 가세이 이-매터리얼즈 가부시키가이샤 내열성 수지 전구체 및 그것을 사용한 감광성 수지 조성물
CN102365341B (zh) * 2009-03-31 2014-12-31 大日本印刷株式会社 碱产生剂、感光性树脂组合物、含有该感光性树脂组合物的图案形成用材料、使用该感光性树脂组合物的图案形成方法以及物品
JP2011053458A (ja) 2009-09-02 2011-03-17 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品
WO2011135887A1 (ja) * 2010-04-28 2011-11-03 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
TWI430024B (zh) * 2010-08-05 2014-03-11 旭化成電子材料股份有限公司 A photosensitive resin composition, a method for manufacturing a hardened bump pattern, and a semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201533524A (zh) * 2014-02-28 2015-09-01 Jsr Corp 絕緣膜的形成方法及使用絕緣膜的裝置
TW201600564A (zh) * 2014-06-27 2016-01-01 Fujifilm Corp 熱硬化性樹脂組成物、硬化膜、硬化膜的製造方法及半導體元件

Also Published As

Publication number Publication date
JPWO2018056013A1 (ja) 2019-07-04
TW201827488A (zh) 2018-08-01
WO2018056013A1 (ja) 2018-03-29
CN109716235B (zh) 2022-11-18
JP7011591B2 (ja) 2022-01-26
KR102385641B1 (ko) 2022-04-12
KR20190054128A (ko) 2019-05-21
CN109716235A (zh) 2019-05-03

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