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TWI741151B - 工件的檢查方法、工件的檢查裝置及加工裝置 - Google Patents

工件的檢查方法、工件的檢查裝置及加工裝置 Download PDF

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Publication number
TWI741151B
TWI741151B TW107106243A TW107106243A TWI741151B TW I741151 B TWI741151 B TW I741151B TW 107106243 A TW107106243 A TW 107106243A TW 107106243 A TW107106243 A TW 107106243A TW I741151 B TWI741151 B TW I741151B
Authority
TW
Taiwan
Prior art keywords
workpiece
processed surface
light
processing
image
Prior art date
Application number
TW107106243A
Other languages
English (en)
Chinese (zh)
Other versions
TW201834051A (zh
Inventor
高橋邦充
北野元己
前嶋信
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201834051A publication Critical patent/TW201834051A/zh
Application granted granted Critical
Publication of TWI741151B publication Critical patent/TWI741151B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping
    • H10P72/06—
    • H10P74/203—
    • H10P74/235—
    • H10P74/27—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Computer Hardware Design (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
TW107106243A 2017-02-28 2018-02-23 工件的檢查方法、工件的檢查裝置及加工裝置 TWI741151B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-036598 2017-02-28
JP2017036598A JP2018140469A (ja) 2017-02-28 2017-02-28 被加工物の検査方法、被加工物の検査装置及び加工装置

Publications (2)

Publication Number Publication Date
TW201834051A TW201834051A (zh) 2018-09-16
TWI741151B true TWI741151B (zh) 2021-10-01

Family

ID=63375560

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107106243A TWI741151B (zh) 2017-02-28 2018-02-23 工件的檢查方法、工件的檢查裝置及加工裝置

Country Status (4)

Country Link
JP (1) JP2018140469A (ja)
KR (1) KR20180099490A (ja)
CN (1) CN108500842A (ja)
TW (1) TWI741151B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110153859A (zh) * 2019-06-28 2019-08-23 深圳方达半导体装备有限公司 一种全自动研磨机
JP7529408B2 (ja) * 2020-02-17 2024-08-06 株式会社ディスコ 加工装置
JP7519804B2 (ja) * 2020-04-27 2024-07-22 株式会社ディスコ 加工装置
JP7455476B2 (ja) * 2020-05-28 2024-03-26 株式会社ディスコ ウエーハ検査装置、及びウエーハ検査方法
CN111843675B (zh) * 2020-07-15 2021-09-07 郑州龙华机电工程有限公司 一种电力设备在线监测系统
CN112025547B (zh) * 2020-09-15 2021-11-02 泉芯集成电路制造(济南)有限公司 激光投影虚拟校正设备和方法
JP7746093B2 (ja) * 2021-09-24 2025-09-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200618944A (en) * 2004-12-02 2006-06-16 Taiwan Semiconductor Mfg Co Ltd Methods of predicting CMP removal rate and transferring CMP processes
JP2008155292A (ja) * 2006-12-21 2008-07-10 Disco Abrasive Syst Ltd 基板の加工方法および加工装置
JP2016156822A (ja) * 2015-02-25 2016-09-01 株式会社昭和電気研究所 ウェハ欠陥検査装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06105741B2 (ja) * 1989-11-24 1994-12-21 株式会社東芝 インナーリードボンディング検査方法
JPH05288687A (ja) * 1992-04-09 1993-11-02 Fujitsu Ltd リード検査装置
FI111757B (fi) * 1999-05-10 2003-09-15 Metso Automation Oy Menetelmä ja mittausjärjestely mitata paperin pintaa
NL1018943C2 (nl) * 2001-09-13 2003-03-14 Tno Werkwijze en inrichting voor het polijsten van een werkstukoppervlak.
JP2006208347A (ja) * 2004-02-25 2006-08-10 Jfe Steel Kk 圧延用ロールの表面欠陥検出装置、研削装置、表面欠陥検出方法及び表面欠陥検出用プログラム並びに圧延用ロール研削方法
JP2006226804A (ja) * 2005-02-17 2006-08-31 Matsushita Electric Ind Co Ltd フラットディスプレイパネルの検査方法
JP4635939B2 (ja) * 2006-03-30 2011-02-23 株式会社ニコン 表面検査装置
JP5274919B2 (ja) 2008-07-09 2013-08-28 株式会社ディスコ 研削装置及びスクラッチ検出装置
CN101762250A (zh) * 2010-01-28 2010-06-30 上海交通大学 磨削工件表面质量光学实时检测装置
CN101805903B (zh) * 2010-04-12 2012-07-25 太原理工大学 一种钢基表面激光钎焊熔覆铜合金层的方法
KR20150143151A (ko) * 2014-06-13 2015-12-23 삼성전자주식회사 웨이퍼의 연마 방법
JP6377459B2 (ja) * 2014-08-29 2018-08-22 株式会社ディスコ ウエーハ検査方法、研削研磨装置
WO2016080401A1 (ja) * 2014-11-18 2016-05-26 三菱レイヨン株式会社 金属板の補修方法、及び鋳型の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200618944A (en) * 2004-12-02 2006-06-16 Taiwan Semiconductor Mfg Co Ltd Methods of predicting CMP removal rate and transferring CMP processes
JP2008155292A (ja) * 2006-12-21 2008-07-10 Disco Abrasive Syst Ltd 基板の加工方法および加工装置
JP2016156822A (ja) * 2015-02-25 2016-09-01 株式会社昭和電気研究所 ウェハ欠陥検査装置

Also Published As

Publication number Publication date
JP2018140469A (ja) 2018-09-13
KR20180099490A (ko) 2018-09-05
TW201834051A (zh) 2018-09-16
CN108500842A (zh) 2018-09-07

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