TWI638176B - Electrometric apparatus - Google Patents
Electrometric apparatus Download PDFInfo
- Publication number
- TWI638176B TWI638176B TW106123963A TW106123963A TWI638176B TW I638176 B TWI638176 B TW I638176B TW 106123963 A TW106123963 A TW 106123963A TW 106123963 A TW106123963 A TW 106123963A TW I638176 B TWI638176 B TW I638176B
- Authority
- TW
- Taiwan
- Prior art keywords
- hub assembly
- carrier block
- block
- assembly
- die
- Prior art date
Links
- 239000000523 sample Substances 0.000 claims abstract description 124
- 238000007789 sealing Methods 0.000 claims abstract description 63
- 230000013011 mating Effects 0.000 claims description 26
- 238000012360 testing method Methods 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000001179 sorption measurement Methods 0.000 claims description 8
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 238000011084 recovery Methods 0.000 claims 1
- 239000013078 crystal Substances 0.000 abstract description 13
- 230000000712 assembly Effects 0.000 abstract description 2
- 238000000429 assembly Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000001514 detection method Methods 0.000 description 6
- 238000000691 measurement method Methods 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000036316 preload Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000011895 specific detection Methods 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
一種電測裝置用以檢測晶粒。電測裝置包含承載塊、針座組件以及彈性密封結構。承載塊具有承載面以及穿孔連通至承載面。承載面配置以承載晶粒。穿孔配置以連通至真空源使晶粒真空吸附固定於承載面。針座組件包含複數個點測探針,針座組件配置以朝向或遠離承載塊移動,使點測探針經由穿孔接觸或遠離晶粒。彈性密封結構設置於承載塊與針座組件之間,並配置以使承載塊與針座組件相對移動時保持氣密。An electrical measuring device is used to detect crystal grains. The electrical measuring device comprises a bearing block, a needle seat assembly and an elastic sealing structure. The carrier block has a bearing surface and the perforations communicate with the bearing surface. The bearing surface is configured to carry the die. The perforation is configured to communicate to a vacuum source to vacuum attach the die to the load bearing surface. The hub assembly includes a plurality of spot probe assemblies configured to move toward or away from the carrier block such that the spot probes contact or move away from the die via the perforations. The resilient sealing structure is disposed between the carrier block and the hub assembly and is configured to maintain airtightness when the carrier block and the hub assembly are moved relative to each other.
Description
本發明是有關於一種電測裝置,特別是有關於一種用以檢測晶粒的電測裝置,本發明還涉及電測方法及針座電路結構。The present invention relates to an electrical measuring device, and more particularly to an electrical measuring device for detecting a crystal grain. The present invention also relates to an electrical measuring method and a needle block circuit structure.
目前,一種用以檢測習知背點式LED (Light-emitting Diode)晶粒(即正面發光,背面電極傳輸電流)的習知檢測架構係包含承載塊以及探針。承載塊具有穿針孔以及真空孔。LED晶粒的背面放置在承載塊上,而探針係通過承載塊的穿針孔以點觸LED晶粒的背面電極。承載塊的真空孔連接真空源以吸附LED晶粒,以避免探針點觸LED晶粒的背面電極時,因接觸力量過大使得LED晶粒被頂起而脫離承載塊。Currently, a conventional detection architecture for detecting a conventional light-emitting diode (ie, front side illumination, back side electrode current) includes a carrier block and a probe. The carrier block has a pinhole and a vacuum hole. The back side of the LED die is placed on the carrier block, and the probe passes through the pinhole of the carrier block to touch the back electrode of the LED die. The vacuum hole of the carrier block is connected to the vacuum source to attract the LED die to prevent the probe from touching the back electrode of the LED die, and the LED die is lifted off the carrier block due to excessive contact force.
對於習知的背點式LED晶片來說,因為目前LED製程不斷進展的緣故,LED晶片的尺寸也隨之越來越小。然而,若繼續採用前述習知檢測架構檢測小型LED晶片,則承載塊的真空孔與穿針孔的面積也必須設計得越來越小,而真空孔卻需要一定的面積大小才能穩固地將LED晶粒的背面吸附於承載塊上。因此,對於小型LED晶片來說,習知檢測架構已經不敷使用。For the conventional back-point LED chip, the size of the LED chip is getting smaller and smaller due to the continuous progress of the LED process. However, if the small LED chip is continuously detected by the aforementioned conventional detection architecture, the area of the vacuum hole and the pinhole of the carrier block must also be designed to be smaller and smaller, and the vacuum hole requires a certain area size to stably hold the LED. The back side of the grain is adsorbed on the carrier block. Therefore, for small LED chips, the conventional detection architecture is no longer sufficient.
因此,如何提出一種可解決上述問題的電測裝置,是目前業界亟欲投入研發資源解決的問題之一。Therefore, how to propose an electric measuring device that can solve the above problems is one of the problems that the industry is eager to invest in research and development resources.
有鑑於此,本發明之一目的在於提出一種可有效解決上述問題的電測裝置。In view of the above, it is an object of the present invention to provide an electrical measuring device that can effectively solve the above problems.
為了達到上述目的,依據本發明之一實施方式,一種電測裝置包含承載塊、針座組件以及彈性密封結構。承載塊具有承載面以及穿孔連通至承載面。承載面配置以承載晶粒。穿孔配置以連通至一真空源使晶粒藉由真空吸附而固定於承載面。針座組件包含複數個點測探針,針座組件配置以朝向或遠離承載塊移動,使點測探針隨著針座組件移動而經由穿孔接觸或遠離晶粒。彈性密封結構設置於承載塊與針座組件之間,並配置以使承載塊與針座組件相對移動時保持氣密。In order to achieve the above object, according to an embodiment of the present invention, an electrical measuring device includes a carrier block, a hub assembly, and an elastic sealing structure. The carrier block has a bearing surface and the perforations communicate with the bearing surface. The bearing surface is configured to carry the die. The perforation is configured to communicate to a vacuum source to secure the die to the carrier surface by vacuum adsorption. The hub assembly includes a plurality of spot probes configured to move toward or away from the carrier block such that the spot probe contacts or moves away from the die via the perforations as the hub assembly moves. The resilient sealing structure is disposed between the carrier block and the hub assembly and is configured to maintain airtightness when the carrier block and the hub assembly are moved relative to each other.
根據上述結構配置,本發明的電測裝置是利用承載塊的一穿孔同時作為點測晶粒(即提供電信號作晶粒的光電測試)與吸附晶粒(避免點測探針接觸晶粒時,因力量過大而使晶粒脫離承載塊)的通道。也就是說,本發明的電測裝置並不需要為了個別點測探針提供多個穿孔,因此即使晶粒的尺寸縮小,承載塊仍有足夠的真空吸附面積用來吸附晶粒,且可減少製作微孔所需的成本。另外,本發明的電測裝置可利用彈性密封結構在承載塊與針座組件之間形成密封通道氣密地連通穿孔,藉以在承載塊與針座組件接觸時避免兩者之間發生不完全氣密的問題。並且,彈性密封結構之收縮還可用來達到控制點測探針點觸晶粒施加於晶粒之力量大小的功能。此外,在完成測試晶粒之後,本發明的電測裝置還可利用彈性密封結構使承載塊與針座組件回復至分離狀態,以避免針座組件因與承載塊之間的摩擦力(因兩者之間的間隙過小)而發生無法分離的問題。According to the above configuration, the electrical measuring device of the present invention utilizes a perforation of the carrier block as both a spotted die (ie, an electrical signal for providing an electrical signal for the die) and an adsorbed die (to avoid contact of the spot probe with the die) The passage of the die from the bearing block due to excessive force. That is to say, the electrical measuring device of the present invention does not need to provide a plurality of perforations for the individual spotting probes, so even if the size of the crystal grains is reduced, the bearing block still has a sufficient vacuum adsorption area for adsorbing the crystal grains, and can be reduced. The cost of making micropores. In addition, the electrical measuring device of the present invention can utilize a resilient sealing structure to form a sealed passage between the carrier block and the hub assembly to hermetically communicate the perforations, thereby avoiding incomplete gas between the carrier block and the hub assembly. Secret question. Moreover, the shrinkage of the elastic sealing structure can also be used to control the function of the spotting probe to touch the force applied by the die to the die. In addition, after the test die is completed, the electrical measuring device of the present invention can also return the carrier block and the hub assembly to a separated state by using an elastic sealing structure to avoid friction between the needle block assembly and the carrier block (due to two The gap between the two is too small to cause separation problems.
以下將以圖式揭露本發明之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.
請參照第1圖以及第2圖。第1圖為繪示本發明一實施方式之電測裝置100的局部立體圖。第2圖為繪示第1圖中之電測裝置100的另一局部立體圖,其中固定擋塊121被移除。如第1圖與第2圖所示,於本實施方式中,電測裝置100包含旋轉模組111以及複數個懸臂112。旋轉模組111具有旋轉軸心111a。每一懸臂112的一端連接至旋轉模組111,並可由旋轉模組111帶動而繞著旋轉軸心111a轉動。電測裝置100還包含升降滑軌113。升降滑軌113設置於懸臂112的另一端(即懸臂112遠離旋轉軸心111a的一端)。電測裝置100還包含承載塊130、針座組件140以及電路板160。針座組件140配置以朝向或遠離承載塊130移動。電路板160設置在針座組件140下方用以將針座組件140固定至電路板160,電路板160與承載塊130分別位於針座組件140的相對兩側。承載塊130上承載有晶粒200。電測裝置100還包含固定擋塊121。固定擋塊121位於承載塊130背對針座模組142的一側,並配置以供承載塊130抵靠。針座組件140係可滑動地銜接至升降滑軌113,致使針座組件140可受升降滑軌113導引而朝向或遠離固定擋塊121移動。具體來說,針座組件140可受外部推塊升降模組122推動而帶動承載塊130朝向固定擋塊121移動。Please refer to Figure 1 and Figure 2. FIG. 1 is a partial perspective view of an electrical measuring device 100 according to an embodiment of the present invention. FIG. 2 is another partial perspective view of the electrical measuring device 100 of FIG. 1 in which the fixed stop 121 is removed. As shown in FIGS. 1 and 2, in the present embodiment, the electrical measuring device 100 includes a rotating module 111 and a plurality of cantilevers 112. The rotation module 111 has a rotation axis 111a. One end of each cantilever 112 is connected to the rotation module 111, and can be rotated by the rotation module 111 to rotate about the rotation axis 111a. The electrical measuring device 100 also includes a lifting rail 113. The lifting rail 113 is disposed at the other end of the cantilever 112 (ie, the end of the cantilever 112 away from the rotating shaft center 111a). The electrical testing device 100 also includes a carrier block 130, a hub assembly 140, and a circuit board 160. The hub assembly 140 is configured to move toward or away from the carrier block 130. The circuit board 160 is disposed below the hub assembly 140 for securing the hub assembly 140 to the circuit board 160, the circuit board 160 and the carrier block 130 being located on opposite sides of the hub assembly 140, respectively. The die 200 carries the die 200 thereon. The electrical measuring device 100 also includes a fixed stop 121. The fixed stop 121 is located on a side of the bearing block 130 opposite to the hub module 142 and is configured to abut the carrier block 130. The hub assembly 140 is slidably coupled to the lift rail 113 such that the hub assembly 140 can be guided by the lift rail 113 to move toward or away from the fixed stop 121. Specifically, the hub assembly 140 can be pushed by the external push block lifting module 122 to drive the carrier block 130 to move toward the fixed stop 121.
於一些實施方式中,電測裝置100可包含八個懸臂112,但本發明並不以此為限,可依據實際需求而彈性地增加或減少。In some embodiments, the electrical measuring device 100 can include eight cantilevers 112, but the invention is not limited thereto, and can be elastically increased or decreased according to actual needs.
藉由前述結構配置,旋轉模組111可帶動所有懸臂112一起轉動,使得位於每一懸臂112末端的承載塊130上的晶粒200可以依序位於固定擋塊121的正下方,以進行後續的檢測程序。要說明的是,在對任一承載塊130上的晶粒200進行檢測時,本發明之電測裝置100會依照第3圖、第10圖、第11圖再回到第3圖的順序為一個循環進行作動,以下將詳細介紹電測裝置100所包含的各元件在這些過程中的作動方式與提供的功能。With the foregoing configuration, the rotating module 111 can drive all the cantilevers 112 to rotate together, so that the die 200 on the carrier block 130 at the end of each cantilever 112 can be sequentially located directly below the fixed block 121 for subsequent Test procedure. It should be noted that, when detecting the die 200 on any of the carrier blocks 130, the electrical measuring device 100 of the present invention will follow the steps of FIG. 3, FIG. 10, and FIG. 11 and back to FIG. One cycle is performed. The operation of the components included in the electrical measuring device 100 in these processes and the functions provided will be described in detail below.
請參照第3圖、第4圖以及第5圖。第3圖為繪示第1圖中之電測裝置100沿著線段3-3的局部剖面圖,其中外部推塊升降模組122尚未推動針座組件140。第4圖為繪示承載塊130、針座組件140、彈性密封結構150與電路板160的爆炸圖。第5圖為繪示第3圖的局部放大圖。如第3圖至第5圖所示,於本實施方式中,承載塊130具有承載面131、下表面134以及一個穿孔132。穿孔132連通承載面131以及下表面134。承載面131配置以承載晶粒200。針座組件140包含複數個點測探針141。點測探針141的一端係持續與電路板160抵接,以與電路板160電性連接。電測裝置100還包含彈性密封結構150。彈性密封結構150設置於承載塊130與針座組件140之間。點測探針141可穿設於穿孔132以貫穿承載塊130之下表面134及承載面131。Please refer to Figure 3, Figure 4 and Figure 5. 3 is a partial cross-sectional view of the electrical measuring device 100 of FIG. 1 along line 3-3, wherein the outer push block lifting module 122 has not yet pushed the hub assembly 140. FIG. 4 is an exploded view showing the carrier block 130, the hub assembly 140, the elastic sealing structure 150 and the circuit board 160. Fig. 5 is a partially enlarged view showing Fig. 3. As shown in FIGS. 3 to 5, in the present embodiment, the carrier block 130 has a bearing surface 131, a lower surface 134, and a through hole 132. The perforations 132 communicate with the bearing surface 131 and the lower surface 134. The bearing surface 131 is configured to carry the die 200. The hub assembly 140 includes a plurality of spot probes 141. One end of the spotting probe 141 is continuously abutted against the circuit board 160 to be electrically connected to the circuit board 160. The electrical testing device 100 also includes an elastomeric sealing structure 150. The elastic sealing structure 150 is disposed between the carrier block 130 and the hub assembly 140. The spotting probe 141 can be passed through the through hole 132 to penetrate the lower surface 134 of the carrier block 130 and the bearing surface 131.
由另一角度來看,於本實施方式中,針座模組142、複數個點測探針141及電路板160可構成一針座電路結構的至少一部分,且電測裝置100提供複數個供電探針123(請先參照第13圖,其僅繪示一個作為代表)電性連接一電源(圖未示)分離地設置於針座電路結構之外。在電測裝置100測試晶粒200時,複數個供電探針123經由針座電路結構提供電源至晶粒200。針座電路結構係氣密地連接於電測裝置100。需要注意的是,本發明的針座電路結構是對應電測裝置100上懸臂112的數目。如第1圖、第2圖所示,針座電路結構可以為八組,但本發明並不以此為限。From another point of view, in the present embodiment, the hub module 142, the plurality of spot probes 141, and the circuit board 160 can form at least a portion of a header circuit structure, and the electrical testing device 100 provides a plurality of power supplies. The probe 123 (please refer to FIG. 13 first, which is only a representative) is electrically connected to a power source (not shown) and is disposed separately from the hub circuit structure. When the electrical measurement device 100 tests the die 200, a plurality of power supply probes 123 provide power to the die 200 via the header circuit structure. The hub circuit structure is hermetically connected to the electrical measuring device 100. It should be noted that the hub circuit structure of the present invention corresponds to the number of cantilevers 112 on the electrical measuring device 100. As shown in FIG. 1 and FIG. 2, the configuration of the header circuit can be eight groups, but the invention is not limited thereto.
具體來說,請參照第6圖,其為繪示第4圖中之點測探針141與針座模組142於一實施方式中的剖面圖。如第3、4、6圖所示,於本實施方式中,針座組件140還包含針座模組142。複數個點測探針141穿設於針座模組142中。針座模組142具有上導板142a及一下導板,下導板可以為一片式或者多片式組成,在本實施例中,下導板可以由第一下導板142b以及第二下導板142c組成。第二下導板142c位於上導板142a與第一下導板142b之間。上導板142a具有複數個上穿孔142a21,下導板具有複數個下穿孔,在本實施例中每一個下穿孔是由第一下導板142b的第一下穿孔142b1與第二下導板142c的第二下穿孔142c1組成,這些點測探針141分別穿設對應的其中一個上穿孔142a21、其中一個下穿孔(本實施例為其中一個第一下穿孔142b1以及第二下穿孔142c1)。電路板160具有複數個第一接點161及複數個第二接點162。這些第一接點161及這些第二接點162位於電路板160的同一表面上。這些第一接點161各自對應並電性連接其中一個第二接點162。當針座模組142固定於電路板160時,這些點測探針141分別接觸其中一個第一接點161,使這些點測探針141固定在針座模組142及電路板160內。而這些第二接點162曝露在針座模組142之外,以供複數個供電探針123接觸。Specifically, please refer to FIG. 6 , which is a cross-sectional view showing the spotting probe 141 and the hub module 142 in FIG. 4 in one embodiment. As shown in FIGS. 3, 4, and 6, in the present embodiment, the hub assembly 140 further includes a hub module 142. A plurality of spotting probes 141 are bored in the hub module 142. The needle hub module 142 has an upper guide plate 142a and a lower guide plate. The lower guide plate may be a one-piece or a multi-piece. In this embodiment, the lower guide plate may be composed of a first lower guide plate 142b and a second lower guide. The plate 142c is composed of. The second lower guide plate 142c is located between the upper guide plate 142a and the first lower guide plate 142b. The upper guide plate 142a has a plurality of upper perforations 142a21, and the lower guide plate has a plurality of lower perforations. In this embodiment, each of the lower perforations is a first lower perforation 142b1 and a second lower guide plate 142c of the first lower guide plate 142b. The second lower through holes 142c1 are formed, and the spotting probes 141 respectively pass through one of the corresponding upper through holes 142a21 and one of the lower through holes (one of the first lower through holes 142b1 and the second lower through holes 142c1 in this embodiment). The circuit board 160 has a plurality of first contacts 161 and a plurality of second contacts 162. These first contacts 161 and these second contacts 162 are located on the same surface of the circuit board 160. Each of the first contacts 161 is correspondingly and electrically connected to one of the second contacts 162. When the hub module 142 is fixed to the circuit board 160, the spot probes 141 respectively contact one of the first contacts 161 to fix the spot probes 141 in the hub module 142 and the circuit board 160. The second contacts 162 are exposed outside the hub module 142 for contacting a plurality of power supply probes 123.
於一些實施方式中,如第4圖所示,其中二個第一接點161間的距離或二第二接點162間的距離小於其中一個第一接點161與其中一個第二接點162間的距離。In some embodiments, as shown in FIG. 4, the distance between the two first contacts 161 or the distance between the two second contacts 162 is smaller than one of the first contacts 161 and one of the second contacts 162. The distance between them.
於一些實施方式中,為了可以吸收各電路板160製作上的公差,如第4圖所示,第二接點162的面積會製作的比第一接點161大,以確保供電探針123可以確實接觸第二接點162。如第4圖所示,以間距來說,其中二個第一接點161間的間距小於二個第二接點162間的間距。In some embodiments, in order to absorb the tolerances of the respective circuit boards 160, as shown in FIG. 4, the area of the second contacts 162 is made larger than the first contacts 161 to ensure that the power supply probe 123 can It does contact the second contact 162. As shown in FIG. 4, in terms of spacing, the spacing between the two first contacts 161 is less than the spacing between the two second contacts 162.
更詳細來說,如第4圖與第6圖所示,針座模組142的上導板142a具有承靠部142a1及凸出部142a2。承靠部142a1具有上表面142a11及下表面142a12。承靠部142a1的上表面142a11凸出形成凸出部142a2。換句話說,承靠部142a1的上表面142a11與凸出部142a2上端表面具有一高度差。在上導板142a、第一下導板142b與第二下導板142c組裝之後,上導板142a的下表面與下導板的上表面(進一步來說是第二下導板142c的上表面)之間具有容置空間A,以供點測探針141穿設上穿孔142a21及下穿孔並設置在容置空間A之中。具體來說,前述容置空間A是由承靠部142a1的下表面142a12所凹陷形成的,且容置空間A的位置對應於凸出部142a2的位置(亦即,凸出部142a2的下表面部分會對應容置空間A)。進一步來說,凸出部142a2的下表面與承靠部142a1具有上表面142a11有一高度差,使凸出部142a2的下表面之下即為容置空間A的一部分。凸出部142a2具有至少一上穿孔142a21。凸出部142a2的面積小於承靠部142a1。本案凸出部142a2的設計是為了讓針座模組142的上導板142a與承載塊130之間的間隙可以縮小,同時增加上導板142a的結構強度,以符合點測探針141的深寬比需求。More specifically, as shown in FIGS. 4 and 6, the upper guide plate 142a of the hub module 142 has a bearing portion 142a1 and a projection portion 142a2. The bearing portion 142a1 has an upper surface 142a11 and a lower surface 142a12. The upper surface 142a11 of the bearing portion 142a1 is convex to form a projection 142a2. In other words, the upper surface 142a11 of the bearing portion 142a1 has a height difference from the upper end surface of the projection portion 142a2. After the upper guide plate 142a, the first lower guide plate 142b, and the second lower guide plate 142c are assembled, the lower surface of the upper guide plate 142a and the upper surface of the lower guide plate (further, the upper surface of the second lower guide plate 142c) There is an accommodating space A therebetween for the spotting probe 141 to pass through the upper through hole 142a21 and the lower through hole and disposed in the accommodating space A. Specifically, the accommodating space A is recessed by the lower surface 142a12 of the bearing portion 142a1, and the position of the accommodating space A corresponds to the position of the protruding portion 142a2 (that is, the lower surface of the protruding portion 142a2). Part will correspond to the accommodation space A). Further, the lower surface of the protruding portion 142a2 and the bearing portion 142a1 have a height difference from the upper surface 142a11 such that a portion of the accommodating space A is formed below the lower surface of the protruding portion 142a2. The projection 142a2 has at least one upper perforation 142a21. The area of the projection 142a2 is smaller than the bearing portion 142a1. The protrusion 142a2 of the present invention is designed to reduce the gap between the upper guide plate 142a of the hub module 142 and the carrier block 130, and increase the structural strength of the upper guide plate 142a to conform to the depth of the spot probe 141. Wide ratio demand.
請參照第7圖,其為繪示第4圖中之點測探針141與針座模組142於另一實施方式中的剖面圖。需要說明的是,相較於第6圖所示之針座模組142,本實施方式主要係針對針座模組142的第一下導板142b以及第二下導板142c的結構進行修改。具體來說,第6圖所示之第二下導板142c具有朝向上導板142a凸起的部位,且第一下導板142b呈平板狀,藉以提供點測探針141足夠的支撐。相較之下,第7圖所示之第二下導板142c實質上呈平板狀,並不具有凸起的部位,且第一下導板142b面向第二下導板142c的表面具有凹陷的部位。於實際應用時,若所採用的點測探針141的結構強度較弱,則可採用第6圖所示之第二下導板142c;若所採用的點測探針141具有足夠的結構強度,則可採用第7圖所示之第二下導板142c。Please refer to FIG. 7 , which is a cross-sectional view showing the spot probe 141 and the hub module 142 in FIG. 4 in another embodiment. It should be noted that, in comparison with the hub module 142 shown in FIG. 6, the present embodiment mainly modifies the structure of the first lower guide plate 142b and the second lower guide plate 142c of the hub module 142. Specifically, the second lower guide plate 142c shown in FIG. 6 has a portion that is convex toward the upper guide plate 142a, and the first lower guide plate 142b has a flat shape to provide sufficient support for the spotting probe 141. In contrast, the second lower guide plate 142c shown in FIG. 7 has a substantially flat shape and does not have a convex portion, and the surface of the first lower guide plate 142b facing the second lower guide plate 142c has a recessed surface. Part. In practical applications, if the structural strength of the spot probe 141 is weak, the second lower guide 142c shown in FIG. 6 can be used; if the spot probe 141 is used, it has sufficient structural strength. Then, the second lower guide plate 142c shown in Fig. 7 can be used.
如第4圖所示,針座組件140還包含承載件143,進一步來說,針座電路結構更包含此承載件143。承載件143具有一開口143c貫穿承載件143的上下表面,而針座模組142穿設於開口143c處。針座模組142的承靠部142a1用以承靠在承載件143的上表面。承載件143具有凹陷空間S1,凹陷空間S1係從承載件143的下表面所凹陷成之一空間。凹陷空間S1連通開口143c。電路板160的一部份設置且氣密地連接於凹陷空間S1。電路板160的這些第一接點161位於凹陷空間S1內。電路板160的這些第二接點162曝露於承載件143之外。針座電路結構更包含承載塊130,承載塊130在承載件143上。As shown in FIG. 4, the hub assembly 140 further includes a carrier 143. Further, the hub circuit structure further includes the carrier 143. The carrier 143 has an opening 143c extending through the upper and lower surfaces of the carrier 143, and the hub module 142 is disposed at the opening 143c. The bearing portion 142a1 of the needle hub module 142 is used to bear against the upper surface of the carrier 143. The carrier 143 has a recessed space S1 which is recessed into a space from the lower surface of the carrier 143. The recessed space S1 communicates with the opening 143c. A portion of the circuit board 160 is disposed and hermetically connected to the recessed space S1. These first contacts 161 of the circuit board 160 are located in the recessed space S1. These second contacts 162 of the circuit board 160 are exposed outside of the carrier 143. The hub circuit structure further includes a carrier block 130 on the carrier 143.
承載件143固定至一鎖固件144上,鎖固件144先固定在電測裝置100上,而點測探針141及針座模組142係設置於承載件143上,點測探針141及針座模組142可以安裝於承載件143上或者從承載件143上拆卸。彈性密封結構150係設置於承載塊130與承載件143之間,進一步來說,承載件143具有一環形槽143a,彈性密封結構150係設置於環形槽143a上。The carrier 143 is fixed to a locking member 144. The locking member 144 is first fixed on the electrical measuring device 100, and the spotting probe 141 and the needle hub module 142 are disposed on the carrier 143, and the probe 141 and the needle are spotted. The seat module 142 can be mounted on or detached from the carrier 143. The elastic sealing structure 150 is disposed between the bearing block 130 and the carrier 143. Further, the carrier 143 has an annular groove 143a, and the elastic sealing structure 150 is disposed on the annular groove 143a.
進一步來說,如第4圖所示,於本實施方式中,電測裝置100還包含複數個距離調整件181。距離調整件181連接於承載塊130與針座組件140之間,並配置以使承載塊130與針座組件140相距一調整距離,使得彈性密封結構150預壓於承載塊130與針座組件140之間。當承載塊130與針座組件140相距前述調整距離時,彈性密封結構150在承載塊130與針座組件140之間形成密封通道T1(請參照第3圖),且密封通道T1氣密地連通穿孔132。此時,點測探針141遠離電路板160的另一端係穿入穿孔132中,但尚未與晶粒200電性接觸。Further, as shown in FIG. 4, in the present embodiment, the electrical measuring device 100 further includes a plurality of distance adjusting members 181. The distance adjusting member 181 is connected between the bearing block 130 and the hub assembly 140 and configured to adjust the distance between the carrier block 130 and the hub assembly 140 such that the elastic sealing structure 150 is pre-stressed on the carrier block 130 and the hub assembly 140. between. When the bearing block 130 and the hub assembly 140 are apart from the aforementioned adjustment distance, the elastic sealing structure 150 forms a sealed passage T1 between the bearing block 130 and the hub assembly 140 (please refer to FIG. 3), and the sealing passage T1 is airtightly connected. Perforation 132. At this time, the other end of the spotting probe 141 away from the circuit board 160 penetrates into the through hole 132 but has not yet electrically contacted with the die 200.
由此可知,本實施方式藉由利用彈性密封結構150在承載塊130與針座組件140之間形成密封通道T1氣密地連通穿孔132,即可在承載塊130與針座組件140接觸時避免兩者之間發生不完全氣密的問題。而且,距離調整件181可用來限制承載塊130與針座組件140兩者之間的最大間距為前述調整距離。此外,彈性密封結構150之收縮還可用來達到控制點測探針141點觸晶粒200時施加於晶粒200之力量大小的功能。It can be seen that the present embodiment avoids the airtight connection 132 by forming the sealing passage T1 between the bearing block 130 and the hub assembly 140 by using the elastic sealing structure 150, so that the bearing block 130 can be avoided when it contacts the needle hub assembly 140. There is a problem of incomplete airtightness between the two. Moreover, the distance adjustment member 181 can be used to limit the maximum distance between the carrier block 130 and the hub assembly 140 to the aforementioned adjustment distance. In addition, the shrinkage of the elastic sealing structure 150 can also be used to control the magnitude of the force applied to the die 200 when the spotting probe 141 touches the die 200.
於一些實施方式中,距離調整件181為螺絲,且距離調整件181係穿過承載塊130的穿孔135而鎖入針座組件140(具體來說,是鎖入承載件143的螺孔143b),並可藉由旋轉而改變鎖入針座組件140的深度,以調整前述調整距離,但本發明並不以此為限。In some embodiments, the distance adjusting member 181 is a screw, and the distance adjusting member 181 is inserted through the through hole 135 of the bearing block 130 to lock into the needle seat assembly 140 (specifically, the screw hole 143b of the locking carrier 143). The depth of the lock into the hub assembly 140 can be changed by rotation to adjust the aforementioned adjustment distance, but the invention is not limited thereto.
再更進一步來說,如第4圖所示,於本實施方式中,電測裝置100還包含複數個第一導引件182以及複數個第二導引件183。第一導引件182連接承載塊130。舉例來說,第一導引件182可嵌入位於承載塊130的下表面134上的凹陷部136內,以將第一導引件182固定在承載塊130上,如第8圖所示,但本發明並不以此為限。第二導引件183設置於承載件143上,進一步來說,第二導引件183是固定於承載件143上。第二導引件183分別可滑動地銜接第一導引件182,致使承載件143帶動針座模組142朝向或遠離承載塊130移動。於一些實施例中,第一導引件182為襯套,而第二導引件183為與其可滑動地銜接之導引桿,但本發明並不以此為限,兩者亦可互換,即第一導引件182為導引桿,第二導引件183為襯套。於實際應用中,第一導引件182、第二導引件183可以視為一個整體的導引件,導引件的一部分連接承載件143,一部分連接承載塊130,以限制承載件143與承載塊130的相對位置及相對位移的位置,使承載件143可以朝向或遠離承載塊130的方向移動,而導引件亦可為彈片(例如Z型彈片)。Furthermore, as shown in FIG. 4, in the present embodiment, the electrical testing device 100 further includes a plurality of first guiding members 182 and a plurality of second guiding members 183. The first guiding member 182 is connected to the carrier block 130. For example, the first guide 182 can be embedded in the recess 136 on the lower surface 134 of the carrier block 130 to secure the first guide 182 to the carrier block 130, as shown in FIG. The invention is not limited thereto. The second guiding member 183 is disposed on the carrier 143. Further, the second guiding member 183 is fixed to the carrier 143. The second guiding member 183 slidably engages the first guiding member 182, respectively, so that the bearing member 143 drives the needle holder module 142 to move toward or away from the bearing block 130. In some embodiments, the first guiding member 182 is a bushing, and the second guiding member 183 is a guiding rod slidably coupled thereto, but the invention is not limited thereto, and the two are also interchangeable. That is, the first guiding member 182 is a guiding rod, and the second guiding member 183 is a bushing. In a practical application, the first guiding member 182 and the second guiding member 183 can be regarded as an integral guiding member. A part of the guiding member is connected to the carrier member 143, and a portion is connected to the carrier block 130 to limit the carrier member 143 and The relative position of the bearing block 130 and the position of the relative displacement enable the carrier 143 to move toward or away from the carrier block 130, and the guiding member may also be a spring piece (for example, a Z-shaped spring piece).
於一些實施方式中,彈性密封結構150為O型密封環(O-ring),但本發明並不以此為限。In some embodiments, the elastic sealing structure 150 is an O-ring, but the invention is not limited thereto.
於一些實施方式中,承載件143的材質包含金屬,但本發明並不以此為限。In some embodiments, the material of the carrier 143 includes metal, but the invention is not limited thereto.
另外,請參照第3圖,於本實施方式中,承載塊130具有真空通道T2以及真空抽氣口133,且真空通道T2連通於密封通道T1與真空抽氣口133之間。因此,當晶粒200承載於承載塊130的承載面131上並覆蓋穿孔132時,可藉由諸如真空幫浦的外部抽氣裝置(圖未示)從真空抽氣口133進行抽氣,藉以經由穿孔132而將晶粒200吸附於承載面131上。In addition, referring to FIG. 3 , in the present embodiment, the carrier block 130 has a vacuum channel T2 and a vacuum pumping port 133 , and the vacuum channel T2 is in communication with the sealing channel T1 and the vacuum pumping port 133 . Therefore, when the die 200 is carried on the bearing surface 131 of the carrier block 130 and covers the through hole 132, it can be evacuated from the vacuum pumping port 133 by an external air extracting device (not shown) such as a vacuum pump, thereby The through holes 132 are used to adsorb the crystal grains 200 on the bearing surface 131.
進一步參照第8圖,其為繪示第4圖中之承載塊130於另一視角的立體圖。如第8圖所示,承載塊130具有凹陷空間S2。凹陷空間S2設置在承載塊130的下表面134,且真空通道T2連通凹陷空間S2(於第8圖中,真空通道T2係部分地位於凹陷空間S2)。凹陷空間S2的面積大於穿孔132的面積。穿孔132位在凹陷空間S2內。此外,凸出部142a2的位置對應凹陷空間S2的位置。Further referring to FIG. 8 , a perspective view of the carrier block 130 in FIG. 4 is shown in another perspective. As shown in Fig. 8, the carrier block 130 has a recessed space S2. The recessed space S2 is disposed on the lower surface 134 of the carrier block 130, and the vacuum channel T2 is connected to the recessed space S2 (in FIG. 8, the vacuum channel T2 is partially located in the recessed space S2). The area of the recessed space S2 is larger than the area of the perforations 132. The perforations 132 are located in the recessed space S2. Further, the position of the projection 142a2 corresponds to the position of the recessed space S2.
然而,本發明並不以此為限,請參照第14圖,其為繪示第3圖中的結構於另一實施方式中的局部剖面圖。如圖所示,本實施方式係將第3圖中設置於承載塊130上的真空通道T2與真空抽氣口133改為設置於針座組件140上(第14圖中未示真空抽氣口133,其結構可參照第3圖)。因此,當晶粒200承載於承載塊130的承載面131上並覆蓋穿孔132時,可藉由外部抽氣裝置(圖未示)從真空抽氣口133進行抽氣,同樣可達到經由穿孔132將晶粒200吸附於承載面131上的目的。However, the present invention is not limited thereto. Please refer to FIG. 14 , which is a partial cross-sectional view showing the structure of FIG. 3 in another embodiment. As shown in the figure, the vacuum channel T2 and the vacuum suction port 133 disposed on the carrier block 130 in FIG. 3 are instead disposed on the hub assembly 140 (the vacuum suction port 133 is not shown in FIG. The structure can be referred to Figure 3). Therefore, when the die 200 is carried on the bearing surface 131 of the carrier block 130 and covers the through hole 132, the air can be evacuated from the vacuum suction port 133 by an external air suction device (not shown), which can also be achieved via the through hole 132. The grain 200 is adsorbed on the bearing surface 131 for the purpose.
此外,如第3圖所示,在點測晶粒200之前,外部推塊升降模組122與針座組件140下的鎖固件144之間有一縫隙G1,以及承載塊130與固定擋塊121之間有一縫隙G2,使得旋轉模組111旋轉時,不會有任何干涉現象產生。In addition, as shown in FIG. 3, before the die 200 is spotted, there is a gap G1 between the external push block lifting module 122 and the locking member 144 under the hub assembly 140, and the carrier block 130 and the fixed block 121. There is a gap G2 between them, so that when the rotation module 111 is rotated, no interference phenomenon occurs.
請參照第9圖,其為繪示第4圖中之電路板160的側視圖。如第9圖所示,電路板160具有表面電路層163及結構增強層164。結構增強層164的厚度大於表面電路層163的厚度。第一接點161及第二接點162係設置在同一表面電路層163。藉此,電路板160可具有較佳的結構強度。Please refer to FIG. 9, which is a side view of the circuit board 160 in FIG. As shown in FIG. 9, the circuit board 160 has a surface circuit layer 163 and a structural enhancement layer 164. The thickness of the structural enhancement layer 164 is greater than the thickness of the surface circuit layer 163. The first contact 161 and the second contact 162 are disposed on the same surface circuit layer 163. Thereby, the circuit board 160 can have better structural strength.
請參照第10圖,其為繪示第3圖中之各部件的另一剖面圖,其中外部推塊升降模組122推動針座組件140而使得承載塊130抵靠固定擋塊121。如第10圖所示,於本實施方式中,外部推塊升降模組122係由第3圖中的位置向上移動,並推動針座組件140而使得承載塊130抵靠固定擋塊121。此時,晶粒200係進入固定擋塊121的開口121a中,且點測探針141仍尚未與晶粒200電性接觸(配合參照點測探針141與晶粒200在第5圖中的相對位置)。在承載塊130抵靠固定擋塊121之後,朝向承載塊130移動之針座模組142可進一步壓縮彈性密封結構150。Please refer to FIG. 10 , which is another cross-sectional view of the components in FIG. 3 , wherein the external push block lifting module 122 pushes the hub assembly 140 such that the carrier block 130 abuts the fixed stop 121 . As shown in FIG. 10, in the present embodiment, the external push block lifting module 122 is moved upward from the position in FIG. 3 and pushes the needle hub assembly 140 such that the carrier block 130 abuts against the fixed stop 121. At this time, the die 200 enters the opening 121a of the fixed block 121, and the spot probe 141 has not yet been electrically contacted with the die 200 (in conjunction with the reference spot probe 141 and the die 200 in FIG. 5 relative position). After the carrier block 130 abuts the fixed stop 121, the hub module 142 that moves toward the carrier block 130 can further compress the resilient sealing structure 150.
請參照第11圖以及第12圖。第11圖為繪示第3圖中之各部件的另一剖面圖,其中外部推塊升降模組122使針座組件140繼續朝向承載塊130推動,進而使針座組件140抵靠承載塊130。第12圖為繪示第11圖的局部放大圖。如第11圖與第12圖所示,於本實施方式中,外部推塊升降模組122係接著由第10圖中的狀態使針座組件140繼續朝向承載塊130推動,而承載塊130係被固定擋塊121擋住而無法繼續向上移動,因此彈性密封結構150會繼續被向上移動的針座組件140朝向承載塊130壓縮。此時,如第12圖所示,當針座組件140與承載塊130進一步壓縮彈性密封結構150而相抵靠時,點測探針141隨著針座組件140移動而經由穿孔132接觸晶粒200。Please refer to Figure 11 and Figure 12. 11 is another cross-sectional view of the components of FIG. 3, wherein the outer push block lift module 122 continues to push the hub assembly 140 toward the carrier block 130, thereby causing the hub assembly 140 to abut the carrier block 130. . Fig. 12 is a partially enlarged view showing Fig. 11. As shown in FIG. 11 and FIG. 12, in the present embodiment, the external push block lifting module 122 continues to push the hub assembly 140 toward the carrier block 130 by the state in FIG. 10, and the carrier block 130 is attached. It is blocked by the fixed stop 121 and cannot continue to move upward, so the elastic sealing structure 150 will continue to be compressed by the upwardly moving needle hub assembly 140 toward the carrier block 130. At this time, as shown in FIG. 12, when the hub assembly 140 and the carrier block 130 further compress the elastic sealing structure 150, the spot probe 141 contacts the die 200 via the through hole 132 as the hub assembly 140 moves. .
於一些實施方式中,在移除固定擋塊121與晶粒200的情況之下,當針座組件140與承載塊130抵靠時,可以設定使點測探針141穿出穿孔132的長度為0至10微米,但本發明並不以此為限。藉此,在實際檢測晶粒200的過程中,當針座組件140與承載塊130抵靠時,點測探針141可以微乎其微的力量電性接觸晶粒200的接點,並不會將晶粒200頂離承載塊130 (亦即,前述力量小於真空吸力)。In some embodiments, in the case where the fixed stopper 121 and the die 200 are removed, when the hub assembly 140 abuts against the carrier block 130, the length of the spot probe 141 passing through the through hole 132 can be set to be 0 to 10 microns, but the invention is not limited thereto. Thereby, in the process of actually detecting the die 200, when the hub assembly 140 abuts against the carrier block 130, the spot probe 141 can electrically contact the contact of the die 200 with a slight force, and the crystal will not be crystallized. The pellets 200 are separated from the carrier block 130 (i.e., the aforementioned force is less than the vacuum suction).
於一些實施方式中,亦可藉由控制外部推塊升降模組122使得針座組件140尚未抵靠承載塊130時而點測探針141已經由穿孔132接觸晶粒200,進而可控制點測探針141施加於晶粒200的力量。In some embodiments, by controlling the external push block lifting module 122 such that the needle hub assembly 140 has not yet abutted against the carrier block 130, the spot probe 141 has been contacted by the through hole 132 to contact the die 200, thereby controlling the spot measurement. The force applied by the probe 141 to the die 200 is shown.
請參照第13圖,其為繪示第1圖中之電測裝置100的局部側視圖。如第13圖所示,於本實施方式中,供電探針123分離地設置於針座組件140之外。舉例來說,如第13圖所示,供電探針123係位於外部推塊升降模組122的上方。在針座組件140朝向承載塊130移動使得點測探針141經由穿孔132接觸晶粒200期間(亦即,電測裝置100的作動由第10圖進行至第11圖的期間),供電探針123係電性接觸電路板160,藉以經由電路板160與點測探針141供電至晶粒200。於一些實施方式中,前述晶粒200為背點式LED (Light-emitting Diode)晶粒,其在背面電極經由點測探針141通電之後,可由正面發光。藉此,即可藉由檢測晶粒200所發射之光線而得知其發光特性。Please refer to FIG. 13 , which is a partial side view showing the electrical measuring device 100 in FIG. 1 . As shown in FIG. 13, in the present embodiment, the power supply probe 123 is separately provided outside the hub assembly 140. For example, as shown in FIG. 13, the power supply probe 123 is located above the external push block lifting module 122. During the movement of the hub assembly 140 toward the carrier block 130 such that the spotting probe 141 contacts the die 200 via the via 132 (ie, the operation of the electrical measuring device 100 proceeds from the 10th to the 11th), the power supply probe The 123 series electrical contact circuit board 160 is used to supply power to the die 200 via the circuit board 160 and the spot probe 141. In some embodiments, the foregoing die 200 is a Light-emitting Diode (LED) die that can be illuminated by the front side after the back electrode is energized via the spot probe 141. Thereby, the light emission characteristics can be known by detecting the light emitted by the crystal grain 200.
由前述結構配置可知,本實施方式的電測裝置100是利用承載塊130的穿孔132同時作為點測晶粒200(即提供電信號作晶粒200的光電測試)與吸附晶粒200(避免點測探針141接觸晶粒200時,因力量過大而使晶粒200脫離承載塊130)的通道。因此,本發明的電測裝置100並不需要為了個別點測探針141提供多個穿孔132。即使晶粒200的尺寸縮小,承載塊130仍有足夠的真空吸附面積用來吸附晶粒200,且可減少製作微孔所需的成本。It can be seen from the foregoing configuration that the electrical testing device 100 of the present embodiment utilizes the through holes 132 of the carrier block 130 as both the spot die 200 (ie, provides an electrical signal for the photoelectric test of the die 200) and the adsorption die 200 (avoiding points). When the probe 141 contacts the die 200, the die 200 is disengaged from the channel of the carrier block 130) due to excessive force. Therefore, the electrical measuring device 100 of the present invention does not need to provide a plurality of perforations 132 for the individual spotting probes 141. Even if the size of the die 200 is reduced, the carrier block 130 has sufficient vacuum adsorption area for adsorbing the die 200, and the cost required for making the microvia can be reduced.
於一些實施方式中,為了獲得更為準確之檢測結果,可在第11圖中所示之固定擋塊121的開口121a上方設置一積分球(圖未示)完整罩住晶粒200,因此積分球可避免外部之光線進入而影響檢測結果。於一些實施方式中,固定擋塊121的開口121a成階梯狀(亦即,朝遠離晶粒200的方向外擴),以避免晶粒200所發射之光線被開口121a內壁遮擋,因此可增加積分球的收光角度。In some embodiments, in order to obtain a more accurate detection result, an integrating sphere (not shown) may be disposed over the opening 121a of the fixed stopper 121 shown in FIG. 11 to completely cover the die 200, so the integral The ball can prevent external light from entering and affect the detection result. In some embodiments, the opening 121a of the fixed block 121 is stepped (that is, expanded outward in a direction away from the die 200) to prevent the light emitted by the die 200 from being blocked by the inner wall of the opening 121a, thereby increasing The angle of collection of the integrating sphere.
在檢測完晶粒200之後,電測裝置100即可回復至第3圖所示的狀態。也就是說,外部推塊升降模組122會由第11圖中的位置向下移動而回復至第3圖中的位置而離開針座組件140,而針座組件140也會因為重力的關係沿著升降滑軌113由第11圖中的位置向下移動而回復至第3圖中的位置。After the die 200 is detected, the electrical measuring device 100 can return to the state shown in FIG. That is, the external push block lifting and lowering module 122 will move downward from the position in FIG. 11 and return to the position in FIG. 3 to leave the needle seat assembly 140, and the needle seat assembly 140 will also follow the gravity relationship. The lifting rail 113 is moved downward from the position in Fig. 11 to return to the position in Fig. 3.
並且,此時彈性密封結構150係彈性恢復而回復至第3圖所示的預壓狀態,並使得承載塊130與針座模組142兩者之間的間距回復維持前述距離。也就是說,在完成測試晶粒200之後,本實施方式的電測裝置100還可利用彈性密封結構150使承載塊130與針座組件140回復至分離狀態,以避免針座組件140因與承載塊130之間的摩擦力(因兩者之間的間隙過小)而發生無法分離的問題。Moreover, at this time, the elastic sealing structure 150 is elastically restored to return to the pre-stressed state shown in FIG. 3, and the spacing between the carrier block 130 and the hub module 142 is restored to maintain the aforementioned distance. That is, after the test die 200 is completed, the electrical testing device 100 of the present embodiment can also return the carrier block 130 and the hub assembly 140 to the separated state by using the elastic sealing structure 150 to avoid the bearing assembly 140 being loaded and loaded. The friction between the blocks 130 (because the gap between the two is too small) causes a problem that separation is impossible.
請參照第15圖,其為繪示本發明一實施方式之電測方法的流程圖。如第15圖所示,於本實施方式中,電測方法係用以利用電測裝置檢測晶粒。電測裝置包含承載塊、包含複數個點測探針之針座組件、彈性密封結構以及固定擋塊。承載塊具有配置以承載晶粒之承載面以及連通至承載面之穿孔。舉例來說,電測方法可利用例如第1圖至第14圖所示之電測裝置100或者如第16圖至第25圖所示之電測裝置300來檢測晶粒,但本發明並不以此為限。Please refer to FIG. 15 , which is a flow chart showing an electrical measurement method according to an embodiment of the present invention. As shown in Fig. 15, in the present embodiment, the electrical measurement method is for detecting a crystal grain by using an electrical measuring device. The electrical measuring device comprises a carrier block, a hub assembly comprising a plurality of spotting probes, an elastic sealing structure and a fixed stop. The carrier block has a bearing surface configured to carry the die and a perforation that communicates to the carrier surface. For example, the electrical measurement method can detect the die by using, for example, the electrical measuring device 100 shown in FIGS. 1 to 14 or the electrical measuring device 300 shown in FIGS. 16 to 25, but the present invention does not This is limited to this.
電測方法包含步驟S101~S105。具體來說,於步驟S101中,晶粒係經由穿孔而被吸附於承載面上。於步驟S102中,針座組件係朝向固定擋塊移動,致使承載塊抵靠固定擋塊。於步驟S103中,針座組件係被繼續朝向固定擋塊移動且進一步壓縮彈性密封結構,致使點測探針隨著針座組件移動而經由穿孔接觸晶粒。於步驟S104中,晶粒係經由點測探針進行點測。於步驟S105中,在點測之後,針座組件係被釋放,致使彈性密封結構彈性恢復而使針座組件與承載塊分離,進而使點測探針離開晶粒。The electrical measurement method includes steps S101 to S105. Specifically, in step S101, the crystal grains are adsorbed on the bearing surface via the perforations. In step S102, the hub assembly moves toward the fixed stop, causing the carrier block to abut the fixed stop. In step S103, the hub assembly is continued to move toward the fixed stop and further compresses the resilient sealing structure such that the spot probe contacts the die via the perforations as the hub assembly moves. In step S104, the die is spotted via a spot probe. In step S105, after the spotting, the needle seat assembly is released, causing the elastic sealing structure to elastically recover to separate the needle seat assembly from the carrier block, thereby causing the spotting probe to leave the die.
於一些實施方式中,電測裝置還包含電路板。針座組件係固定至電路板。點測探針係電性連接電路板。電測方法還包含步驟S106~S109。於步驟S106中,在點測之前,點測探針中之一者的電阻值係經由電路板檢測。於步驟S107中,被檢測之點測探針的電阻值係被判斷是否大於預定電阻值,若是,則被檢測之點測探針被進行清針。於步驟S108中,被清針之點測探針的電阻值係經由電路板檢測。於步驟S109中,被清針之該點測探針的電阻值係被判斷是否大於預定電阻值,若是,則被清針之點測探針被進行換針。In some embodiments, the electrical measurement device further includes a circuit board. The hub assembly is secured to the board. The spot probe is electrically connected to the board. The electrical measurement method further includes steps S106 to S109. In step S106, before the spot test, the resistance value of one of the spot probes is detected via the circuit board. In step S107, the resistance value of the detected spot probe is determined to be greater than a predetermined resistance value, and if so, the detected spot probe is cleaned. In step S108, the resistance value of the spot probe to be cleaned is detected via the circuit board. In step S109, the resistance value of the spot probe to be cleaned is determined to be greater than a predetermined resistance value, and if so, the spot probe to be cleaned is changed.
於一些實施方式中,前述預定電阻值可設為0.5~15歐姆,但本發明並不以此為限。In some embodiments, the predetermined resistance value may be set to 0.5 to 15 ohms, but the invention is not limited thereto.
由以上對於本發明之具體實施方式之詳述,可以明顯地看出,本發明的電測裝置及電測方法是利用承載塊的一穿孔同時作為點測晶粒(即提供電信號作晶粒的光電測試)與吸附晶粒(避免點測探針接觸晶粒時,因力量過大而使晶粒脫離承載塊)的通道。也就是說,本發明的電測裝置及電測方法並不需要為了個別點測探針提供多個穿孔,因此即使晶粒的尺寸縮小,承載塊仍有足夠的真空吸附面積用來吸附晶粒,且可減少製作微孔所需的成本。另外,本發明的電測裝置及電測方法可利用彈性密封結構在承載塊與針座組件之間形成密封通道氣密地連通穿孔,藉以在承載塊與針座組件接觸時避免兩者之間發生不完全氣密的問題。並且,彈性密封結構之收縮還可用來達到控制點測探針點觸晶粒施加於晶粒之力量大小的功能。此外,在完成測試晶粒之後,本發明的電測裝置及電測方法還可利用彈性密封結構使承載塊與針座組件回復至分離狀態,以避免針座組件因與承載塊之間的摩擦力(因兩者之間的間隙過小)而發生無法分離的問題。然而,本發明並不限定使用在承載塊與針座組件之間可同時提供氣密效果及彈性回復力量之單一元件型態的彈性密封結構,亦即,本發明的彈性密封結構可由一個或多個元件所構成,只要能在承載塊與針座組件之間提供氣密效果及提供承載塊與針座組件回復到點測探針尚未接觸到晶粒的回復力量即可;其次,本發明的針座組件亦不限定前述實施方式所揭露的態樣,可以有多種變化。From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that the electrical measuring device and the electrical measuring method of the present invention utilize a perforation of the carrier block as a spot die (ie, provide an electrical signal for the die). Photoelectric test) and the adsorption of crystal grains (avoiding the force of the probe to contact the die when the spot probe is in contact with the die). That is to say, the electrical measuring device and the electrical measuring method of the present invention do not need to provide a plurality of perforations for the individual spotting probes, so even if the size of the crystal grains is reduced, the bearing block still has sufficient vacuum adsorption area for adsorbing the crystal grains. And can reduce the cost of making micropores. In addition, the electrical measuring device and the electrical measuring method of the present invention can utilize a resilient sealing structure to form a sealed passage between the carrier block and the hub assembly to hermetically communicate the perforations, thereby avoiding the contact between the carrier block and the hub assembly. An incomplete airtight problem has occurred. Moreover, the shrinkage of the elastic sealing structure can also be used to control the function of the spotting probe to touch the force applied by the die to the die. In addition, after the test die is completed, the electrical measuring device and the electrical measuring method of the present invention can also return the carrier block and the hub assembly to a separated state by using an elastic sealing structure to avoid friction between the needle block assembly and the carrier block. The force (because the gap between the two is too small) causes problems that cannot be separated. However, the present invention does not limit the use of a single-element type of elastic sealing structure that can provide both an airtight effect and an elastic restoring force between the carrier block and the hub assembly, that is, the elastic sealing structure of the present invention can be made of one or more The components are configured to provide an airtight effect between the carrier block and the hub assembly and provide a return force for the carrier block and the hub assembly to return to the spot probe without contacting the die; secondly, the present invention The needle hub assembly also does not limit the aspects disclosed in the foregoing embodiments, and various modifications are possible.
例如,第16圖繪示了本發明另一實施方式所提供的電測裝置300。如第16圖所示,電測裝置300包含旋轉模組111、懸臂112、設置於懸臂112一端的升降滑軌113、固定擋塊121、外部推塊升降模組122,以及供電探針123等構件。前述構件的詳細結構以及連結作動方式,係與前一實施方式相同,故在此不予以贅述。本實施方式所提供之電測裝置300與前一實施方式所提供的電測裝置100的差異在於,電測裝置300還包含(但不限於)由承載塊410及針座組件420所組成的探針總成400,探針總成400固定於升降滑軌113上,因此探針總成400可隨著升降滑軌113之上、下位移而朝向或遠離固定擋塊121移動。具體來說,探針總成400可受外部推塊升降模組122推動而帶動承載塊410朝向固定擋塊121移動,使得承載塊410可以頂抵於該固定擋塊121。For example, FIG. 16 illustrates an electrical measuring device 300 provided by another embodiment of the present invention. As shown in FIG. 16, the electrical measuring device 300 includes a rotating module 111, a cantilever 112, a lifting rail 113 disposed at one end of the cantilever 112, a fixed stopper 121, an external push block lifting module 122, and a power supply probe 123, etc. member. The detailed structure and the connection operation of the above-described members are the same as those of the previous embodiment, and thus will not be described herein. The difference between the electrical testing device 300 provided in this embodiment and the electrical testing device 100 provided in the previous embodiment is that the electrical testing device 300 further includes, but is not limited to, a probe block 410 and a hub assembly 420. The needle assembly 400, the probe assembly 400 is fixed to the lift rail 113, so the probe assembly 400 can move toward or away from the fixed stop 121 as the lift rail 113 moves up and down. Specifically, the probe assembly 400 can be pushed by the external push block lifting module 122 to drive the carrying block 410 to move toward the fixed stop 121, so that the carrying block 410 can abut against the fixed stop 121.
第17~25圖繪製了本實施方式所提供的探針總成400的各個構件之間的結構關係。請先參閱第17~22圖,探針總成400包含有承載塊410、針座組件420、彈性密封結構430、加熱組件440以及結合結構450。如第18、20及25圖所示,承載塊410具有承載面411、與承載面411相對的下表面412、位於底部且具有側向開口的凹陷部413、與凹陷部413連通的配接孔414、與配接孔414及承載面411連通的穿孔415,以及與凹陷部413相對而往側向延伸的加熱部416。晶粒200設置於承載面411並覆蓋住穿孔415,藉此,可藉由連通於穿孔415的、諸如真空幫浦(vacuum pump)之類的真空源(vacuum source,圖中未示)而將晶粒200吸附固定在承載面411上(以下詳述)。FIGS. 17 to 25 are diagrams showing the structural relationship between the respective members of the probe assembly 400 provided by the present embodiment. Referring to FIGS. 17-22, the probe assembly 400 includes a carrier block 410, a hub assembly 420, a resilient sealing structure 430, a heating assembly 440, and a bonding structure 450. As shown in FIGS. 18, 20 and 25, the carrier block 410 has a bearing surface 411, a lower surface 412 opposite to the bearing surface 411, a recessed portion 413 at the bottom and having a lateral opening, and a matching hole communicating with the recessed portion 413. 414, a through hole 415 that communicates with the matching hole 414 and the bearing surface 411, and a heating portion 416 that extends laterally opposite to the recessed portion 413. The die 200 is disposed on the bearing surface 411 and covers the through hole 415, whereby the vacuum source (not shown) such as a vacuum pump may be connected to the through hole 415. The die 200 is adsorbed and fixed on the bearing surface 411 (described in detail below).
如第18~21圖所示,針座組件420具有座體421、塞件423、管路配接頭425、電路板427,以及複數個點測探針429。座體421具有位於其底部且具有側向開口的第一凹陷部421a、位於底部並與第一凹陷部421a連通的第二凹陷部421b、自座體421一側邊往內部延伸而連通於第二凹陷部421b的流道421c(請同時參看第24圖)、突設於座體421頂面的滑動配接部421d,以及貫穿滑動配接部421d而連通第二凹陷部421b與滑動配接部421d頂面的流道421e(請同時參看第23、24圖)。其中,滑動配接部421d的外周面凹陷設置有環形槽421f。針座組件420的塞件423,於本實施例中係為一概呈L型的塊體,藉由螺絲(圖中未示)鎖固於座體421底部而封閉住第二凹陷部421b的底面開口以及部分側邊開口。針座組件420的管路配接頭425,係為一般流體管路中常用的、用以銜接流體管路的元件,配接頭425一端插設鎖固於流道421c中,另一端則連接管路(圖中未示)而連通至真空源(圖中未示)。電路板427頂面一側設有複數個、可供供電探針123點觸的接點427a,另一側則固定有L型的複數個點測探針429,亦即,點測探針429具有水平段以及與水平段一體連接的垂直段,水平段之一端固定於電路板427的另一側並透過電路板427的佈線而分別電性連接至前述接點427a。 As shown in FIGS. 18-21, the hub assembly 420 has a base 421, a plug 423, a conduit fitting 425, a circuit board 427, and a plurality of spot probes 429. The seat body 421 has a first recessed portion 421a at the bottom thereof and a lateral opening, a second recessed portion 421b located at the bottom portion and communicating with the first recessed portion 421a, and extending from the side of the seated body 421 to the inside. The flow path 421c of the second recessed portion 421b (please refer to FIG. 24 at the same time), the sliding engagement portion 421d protruding from the top surface of the seat body 421, and the second recessed portion 421b and the sliding mating through the sliding engagement portion 421d The flow path 421e on the top surface of the portion 421d (please refer to Figs. 23 and 24 at the same time). The outer circumferential surface of the sliding engagement portion 421d is recessed and provided with an annular groove 421f. The plug member 423 of the hub assembly 420 is an L-shaped block in this embodiment. The bottom surface of the second recessed portion 421b is closed by a screw (not shown) locked to the bottom of the base 421. The opening and a portion of the side opening. The pipe fitting 425 of the needle hub assembly 420 is a component commonly used in a general fluid pipeline for engaging a fluid pipeline. One end of the fitting joint 425 is inserted and locked in the flow passage 421c, and the other end is connected to the pipeline. (not shown) and connected to a vacuum source (not shown). The top surface of the circuit board 427 is provided with a plurality of contacts 427a for the power supply probe 123 to touch, and the other side is fixed with a plurality of L-shaped spot probes 429, that is, the spot probe 429 A vertical segment and a vertical segment integrally connected to the horizontal segment are fixed to the other side of the circuit board 427 and electrically connected to the contact 427a through the wiring of the circuit board 427.
針座組件420組裝時,搭載固定有點測探針429的電路板427係自座體421的底部裝設於第一、二凹陷部421a、421b中,並藉由螺絲(圖中未示)鎖固於座體421,再將塞件423鎖固於座體421,如此,即可完成一個內部具有一個由流道421c、部分第二凹陷部421b及流道421e所連通組成的氣密流道T3(請參看第24圖)的模組化針座組件420,亦即,可以獲得一個模組化的針座組件420,針座組件420內部設置有一個具有二端開口的氣密流道T3,其中一開口為流道421c位於座體421側邊的開口,其中塞設有配接頭425,另一開口為流道421e位於滑動配接部421d頂面的開口。在完成組裝的模組化針座組件420中,L型點測探針429的水平段係水平延伸於 該第二凹陷部421b中(請同時參看第23圖),亦即完全位在氣密流道T3中,而L型點測探針429的垂直段係往上穿置於流道421e中並穿過流道421e位於該滑動配接部421d頂面的開口,如此,點測探針429的垂直段的尖端(亦即針尖)係突出滑動配接部421d的頂面一預定長度(請同時參看第21圖及23圖);其次,電路板427的接點427a係暴露於座體421的外部(請同時參看第21~23圖),而可被供電探針123點觸。必須特別說明的是,針座組件420組裝時,座體421、塞件423、管路配接頭425及電路板427之間連接的介面,可以施加諸如環氧樹脂之類的黏著劑,以達到良好的氣密效果。其次針座組件420係不限於由本實施方式所揭露的座體421、塞件423、管路配接頭425、電路板427及點測探針429等構件所組成,例如,可以利用殼體搭配電路板及點測探針,來完成內部具有氣密流道且具有突露針尖以及電路板接點的針座模組420。 When the hub assembly 420 is assembled, the circuit board 427 on which the fixed probe 429 is mounted is mounted from the bottom of the base 421 in the first and second recessed portions 421a and 421b, and is locked by a screw (not shown). The body 421 is fixed to the seat body 421, and the plug member 423 is locked to the seat body 421. Thus, an airtight flow passage having a flow passage 421c, a portion of the second recessed portion 421b and the flow passage 421e is integrally formed. The modularized needle hub assembly 420 of T3 (see Figure 24), that is, a modular hub assembly 420 can be obtained. The needle hub assembly 420 is internally provided with a gas-tight flow passage T3 having a two-end opening. One of the openings is an opening of the flow channel 421c at the side of the seat body 421, wherein the plug is provided with a fitting 425, and the other opening is an opening of the flow channel 421e at the top surface of the sliding mating portion 421d. In the assembled modular hub assembly 420, the horizontal section of the L-shaped spot probe 429 extends horizontally In the second recessed portion 421b (please refer to FIG. 23 at the same time), that is, completely in the airtight flow passage T3, and the vertical section of the L-shaped spotting probe 429 is placed upward in the flow passage 421e and The through-flow passage 421e is located at an opening of the top surface of the sliding mating portion 421d. Thus, the tip end (ie, the needle tip) of the vertical section of the spotting probe 429 protrudes from the top surface of the sliding mating portion 421d by a predetermined length (please simultaneously Referring to Figures 21 and 23), second, the contact 427a of the circuit board 427 is exposed to the outside of the body 421 (see also Figures 21 to 23), and can be touched by the power supply probe 123. It should be particularly noted that when the needle hub assembly 420 is assembled, the interface between the seat body 421, the plug member 423, the pipe fitting 425 and the circuit board 427 can be applied with an adhesive such as epoxy resin. Good airtight effect. Secondly, the needle hub assembly 420 is not limited to the components such as the seat body 421, the plug member 423, the pipe fitting 425, the circuit board 427, and the spot probe 429 disclosed in the embodiment. For example, the housing can be used with the circuit. The board and the spot probe are used to complete the needle hub module 420 having a gas tight flow path and having a protruding tip and a board contact.
如第18、20及21圖所示,在本實施例中,彈性密封結構430係由多個元件所組成而非由單一元件(如前述實施例所揭露的O型密封環150)所構成。詳而言之,彈性密封結構430包含有用以在承載塊410與針座組件420之間提供氣密效果之密封件431,以及用以在承載塊410與針座組件420之間提供彈性支撐及回復力量的彈性件433。密封件431係由諸如橡膠之類的彈性材料所製成的環狀元件,可利用機械工業常用的O型密封環(O-ring)來具體實現。組裝時,密封件431係套設在座體421的滑動配接部421d的環形槽421f中,而滑動配接部421d係可滑動地插置在承載塊410的配接孔414中(請參看第23~25圖),使承載塊410與針座組件420可相互遠離或靠近滑移地配接在一起,此時,具有彈性的密封件431係被稍微壓縮但仍然可以滑動地抵壓在配接孔414的孔壁上,藉此,滑動配接部421d內部的流道421e可與配接孔414連通,並藉由密封件431達成承載塊410與針座組件420的座體421之間的氣密效果,如此一來,在承載塊410與針座組件420相對遠離或靠近位移時,前述氣密流道T3、部分的配接孔414以及與配接孔414連通的穿孔415將構成一個完整的、氣密的真空流道,由於氣密流道T3的一端藉由管路配接頭425而連通一真空源,因此藉由前述保持氣密的真空流道,可將晶粒200吸附固定在承載塊410的承載面411上。其次,在本實施例中,彈性件433係以線圈彈簧來實現,但本發明並不以此為限,例如,以可使用諸如彈片、彈性膠體之類的彈性元件來達成同樣的功效。彈性件433係預先被壓縮地配置在承載塊410與針座組件420的座體421之間(請同時參看第24圖),藉此,彈性件433可針對可相互滑移地配接在一起的承載塊410與針座組件420,提供一個使承載塊410與針座組件420相互遠離的彈性回復力量。彈性密封結構430還可以選擇性地包含定位件435,在本實施例中,定位件435係為一體突出於座體421頂面的柱體(請參看第21及24圖),供彈性件433套設,以限制彈性件433位置,避免彈性件433在反覆壓縮的過程中偏離,實際上,彈性件433除套設於定位件435上,亦同時設置於承載塊410底面412的定位孔417中(請參看第24圖),然而,本發明並不以此種設計為限,例如前述用以供彈性件433容置的定位孔可以設置在座體421頂面而將定位件設置在承載塊410的底面,或者可以不設置定位孔且/或定位件。As shown in Figures 18, 20 and 21, in the present embodiment, the elastic sealing structure 430 is composed of a plurality of elements and is not composed of a single element (such as the O-ring 15 of the foregoing embodiment). In detail, the elastomeric sealing structure 430 includes a seal 431 for providing a gas-tight effect between the carrier block 410 and the hub assembly 420, and for providing resilient support between the carrier block 410 and the hub assembly 420 and A resilient member 433 that restores strength. The seal member 431 is an annular member made of an elastic material such as rubber, and can be specifically realized by an O-ring commonly used in the mechanical industry. When assembled, the sealing member 431 is sleeved in the annular groove 421f of the sliding mating portion 421d of the seat body 421, and the sliding mating portion 421d is slidably inserted into the mating hole 414 of the carrier block 410 (see the 23 to 25), the carrier block 410 and the hub assembly 420 can be coupled together away from each other or close to each other. At this time, the elastic sealing member 431 is slightly compressed but still slidably pressed against The hole 414 is formed in the hole wall, whereby the flow path 421e inside the sliding mating portion 421d can communicate with the mating hole 414, and the bearing block 410 and the seat body 421 of the hub assembly 420 are achieved by the sealing member 431. The airtight effect, as described above, when the carrier block 410 and the hub assembly 420 are relatively far apart or close to each other, the airtight flow passage T3, a portion of the mating hole 414, and the through hole 415 communicating with the mating hole 414 will constitute A complete, airtight vacuum flow path, since one end of the airtight flow passage T3 is connected to a vacuum source through the pipe fitting 425, the grain 200 can be adsorbed by the aforementioned airtight vacuum flow path. It is fixed on the bearing surface 411 of the carrier block 410. Secondly, in the present embodiment, the elastic member 433 is realized by a coil spring, but the invention is not limited thereto, for example, an elastic member such as a spring piece or an elastic colloid can be used to achieve the same effect. The elastic member 433 is pre-compressed between the carrier block 410 and the seat body 421 of the hub assembly 420 (please refer to FIG. 24 at the same time), whereby the elastic members 433 can be mated together for sliding The carrier block 410 and the hub assembly 420 provide an elastic restoring force that moves the carrier block 410 and the hub assembly 420 away from each other. The elastic sealing structure 430 can also optionally include a positioning member 435. In the embodiment, the positioning member 435 is a column integrally protruding from the top surface of the seat body 421 (see FIGS. 21 and 24) for the elastic member 433. The sleeve is arranged to limit the position of the elastic member 433 to prevent the elastic member 433 from deviating during the reverse compression. In fact, the elastic member 433 is disposed on the positioning member 435 and is also disposed on the bottom surface 412 of the bearing block 410. In the present invention (see FIG. 24), however, the present invention is not limited to such a design. For example, the positioning hole for accommodating the elastic member 433 may be disposed on the top surface of the seat body 421 to set the positioning member on the carrier block. The bottom surface of 410 may or may not be provided with a positioning hole and/or a positioning member.
探針總成400可以選擇性的配置加熱組件440,亦即,若待檢測的晶粒必須在特定的環境溫度條件下進行檢測,則探針總成400可以配置特定的加熱組件。如第18~20及23圖所示,本實施例中,加熱組件440具有一絕熱下蓋441、一加熱器固定座442、一電加熱器443、一溫度感測器444以及一絕熱上蓋445。絕熱下蓋441與絕熱上蓋445由可由諸如玻璃纖維、石棉之類的隔熱材料(thermal insulation material)製成,絕熱下蓋441的頂面具有一容置部441a;加熱器固定座442,設置於前述容置部411a中,由導熱性良好的金屬材質製成,且其頂面具有一容置部442a;電加熱器443可使用一般的電阻式加熱器,但本發明不以此為限,電加熱器443設置於加熱器固定座44的容置部442a中,並貼抵於承載塊410的加熱部416底面,用以加熱承載塊410而間接地對設置於承載面411上的晶粒200進行加熱;溫度感測器444貼抵於電加熱器443上,並電性連接至一控制器(圖中未示),藉此感測電加熱器443的溫度,並由控制器控制電加熱器443的工作溫度;絕熱上蓋445覆蓋於承載塊410的加熱部416的頂面。藉由螺絲(圖中未示),絕熱下蓋441、加熱器固定座442、電加熱器443、溫度感測器444及絕熱上蓋445相互組合在一起並固定於承載塊410的加熱部416上,而可對承載塊410進行加熱,進而對待測晶粒200提供特定的檢測溫度。The probe assembly 400 can selectively configure the heating assembly 440, that is, if the die to be inspected must be tested under specific ambient temperature conditions, the probe assembly 400 can be configured with a particular heating assembly. As shown in FIGS. 18-20 and 23, in the present embodiment, the heating assembly 440 has a heat insulating lower cover 441, a heater holder 442, an electric heater 443, a temperature sensor 444, and a heat insulating upper cover 445. . The heat insulating lower cover 441 and the heat insulating upper cover 445 are made of a thermal insulation material such as glass fiber or asbestos, and the top cover of the heat insulating lower cover 441 has a receiving portion 441a; the heater fixing seat 442 is provided. The accommodating portion 411a is made of a metal material having good thermal conductivity, and the top mask has a receiving portion 442a; the electric heater 443 can use a general resistive heater, but the invention is not limited thereto. The electric heater 443 is disposed in the accommodating portion 442a of the heater holder 44 and abuts against the bottom surface of the heating portion 416 of the carrier block 410 for heating the carrier block 410 and indirectly for the crystal disposed on the bearing surface 411. The pellet 200 is heated; the temperature sensor 444 is attached to the electric heater 443 and electrically connected to a controller (not shown), thereby sensing the temperature of the electric heater 443 and being controlled by the controller. The operating temperature of the electric heater 443 covers the top surface of the heating portion 416 of the carrier block 410. The heat insulating lower cover 441, the heater holder 442, the electric heater 443, the temperature sensor 444, and the heat insulating upper cover 445 are combined with each other and fixed to the heating portion 416 of the carrier block 410 by screws (not shown). The carrier block 410 can be heated to provide a specific detection temperature for the die 200 to be measured.
結合結構450連結承載塊410與針座組件420,主要用途是將配接在一起的承載塊410與針座組件420保持在可於一定的位移距離之間相對位移但不會相互脫離的結合狀態,亦即,不會因為被配置在承載塊410與針座組件420之間的彈性件433的彈性回復力量而使承載塊410與針座組件420相互脫離,並可設定及調整承載塊410與針座組件420之間的位移行程。如第18~20及22圖所示,在本實施例中,結合結構450包含有二結合件451,係為一具有頂板、底板以及連接於該頂、底板之間的側板的C型塊體,結合件451在頂、底板之間具有一三面開放的容置空間451a,且頂、底板設有對應的螺孔,藉此,承載塊410側邊突出且設有螺孔的結合部418以及與該結合部418位置對應、位於針座組件420之座體421的側邊的結合部421g,可以同時嵌卡於結合件451的容置空間451a中,而保持承載塊410與針座組件420可相對位移而不脫離的結合狀態,並且,可以利用穿設於結合件451之頂板及結合部418的螺栓(圖中未示)來調整承載塊410與針座組件420之間的可相對位移的行程。必須加以說明的是,結合結構450並不以此實施例中所揭露的結構為限,例如,亦可利用前一實施例中所揭露的距離調整件181(螺絲或螺栓)配合設置在承載塊410與針座組件420的螺孔且/或穿孔而達成同樣的功能。其次,在本實施例中,係提供二個結合件451夾持在承載塊410與座體421二相對側邊的結合部418、421g上,但本發明所提供的結合件的數量並不以此為限。此外,在本實施例中,結合結構450還可選擇性的包含一結合底板453,供結合件451鎖設固定,該結合底板453係進一步鎖設於升降滑軌113的頂端(請參見第16圖),如此,探針總成400可隨著升降滑軌113之上、下位移而朝向或遠離固定擋塊121移動。當然,結合底板453可以省略,而將結合件451或探針總成400的其他構件直接固定於升降滑軌113即可。The bonding structure 450 connects the carrier block 410 and the hub assembly 420, and the main purpose is to maintain the mating carrier block 410 and the hub assembly 420 in a combined state that can be relatively displaced between certain displacement distances but not separated from each other. That is, the carrier block 410 and the hub assembly 420 are not separated from each other by the elastic restoring force of the elastic member 433 disposed between the carrier block 410 and the hub assembly 420, and the carrier block 410 can be set and adjusted. The displacement stroke between the hub assemblies 420. As shown in FIGS. 18-20 and 22, in the present embodiment, the bonding structure 450 includes a second bonding member 451, which is a C-shaped block having a top plate, a bottom plate, and a side plate connected between the top and bottom plates. The joint member 451 has a three-sided open accommodating space 451a between the top and the bottom plate, and the top and bottom plates are provided with corresponding screw holes, whereby the joint portion 418 of the bearing block 410 protruding and having a screw hole is provided. And the joint portion 421g corresponding to the position of the joint portion 418 and located at the side of the seat body 421 of the needle hub assembly 420 can be simultaneously engaged in the accommodating space 451a of the joint member 451 to hold the carrier block 410 and the needle seat assembly. The 420 can be displaced relative to the disengaged state, and the bolts (not shown) that are disposed on the top plate of the coupling member 451 and the joint portion 418 can be used to adjust the relative position between the carrier block 410 and the hub assembly 420. The travel of the displacement. It should be noted that the bonding structure 450 is not limited to the structure disclosed in the embodiment. For example, the distance adjusting member 181 (screw or bolt) disclosed in the previous embodiment may be used to be disposed on the carrier block. 410 achieves the same function as the screw holes and/or perforations of the hub assembly 420. Next, in the present embodiment, the two coupling members 451 are provided on the joint portions 418, 421g of the opposite sides of the carrier block 410 and the seat body 421, but the number of the joint members provided by the present invention is not This is limited. In addition, in the embodiment, the joint structure 450 can also optionally include a joint bottom plate 453 for locking and fixing the joint member 451, and the joint bottom plate 453 is further locked to the top end of the lift rail 113 (see item 16). As such, the probe assembly 400 can be moved toward or away from the fixed stop 121 as the lift rail 113 moves up and down. Of course, the joint bottom plate 453 can be omitted, and the joint member 451 or other members of the probe assembly 400 can be directly fixed to the lift rail 113.
如第18、20圖所示,於本實施方式中,電測裝置300的探針總成400同樣包含複數個第一導引件182以及複數個第二導引件183,前述導引件182、183係設置在承載塊410與針座組件420的座體421之間。詳而言之,第一導引件182嵌入位於承載塊410的下表面412上的凹陷部419(請參見第20圖內),以將第一導引件182固定在承載塊410上。第二導引件183設置於座體410頂面上而分別可滑動地銜接第一導引件182,藉此,承載塊410與針座組件420相對靠近或遠離位移時,第一、二導引件182、183可發揮良好的導引作用。有關第一、二導引件181、182的詳細實施方式及功能,可參照前一實施例的描述。As shown in FIGS. 18 and 20, in the present embodiment, the probe assembly 400 of the electrical measuring device 300 also includes a plurality of first guiding members 182 and a plurality of second guiding members 183, and the guiding members 182. The 183 is disposed between the carrier block 410 and the seat 421 of the hub assembly 420. In detail, the first guiding member 182 is embedded in a recess 419 (see FIG. 20) on the lower surface 412 of the carrier block 410 to fix the first guiding member 182 on the carrier block 410. The second guiding member 183 is disposed on the top surface of the base body 410 to slidably engage the first guiding member 182, respectively, whereby the first and second guiding members are relatively close to or away from the needle seat assembly 420. The lead members 182, 183 can exert a good guiding effect. For detailed implementations and functions of the first and second guiding members 181 and 182, reference may be made to the description of the previous embodiment.
以下進一步說明本實施方式所提供之探針總成400的作動方式。請參閱第23~25圖,第23及24圖係繪示探針總成400尚未被外部推塊升降模組122往上推動,點測探針429尚未接觸晶粒200之態樣,而第25圖係繪示探針總成400被外部推塊升降模組122往上推動,致使點測探針429接觸晶粒200之態樣。詳而言之,第23~24圖所示之態樣,係指旋轉模組111帶動懸臂112轉動,使得透過升降滑軌113而連接於懸臂112末端的探針總成400位移到固定擋塊121的正下方,以準備進行檢測程序的態樣,此時,外部推塊升降模組122與針座組件420的座體421底部之間有一縫隙(圖中未示),而承載塊410與固定擋塊121之間亦存有一縫隙(圖中未示),此外,點測探針429的針尖係被保持在對正著承載塊410的穿孔415並位於晶粒200下方一預定距離的狀態,而晶粒200係受真空吸引而固定在承載塊410的承載面。而第25圖所示的態樣,係指外部推塊升降模組122往上推動探針總成400,致使承載塊410抵靠於固定擋塊121而固定不動且晶粒200係進入固定擋塊121的開口121a之中,之後外部推塊升降模組122往上朝固定擋塊121的方向繼續推動探針總成400,致使針座組件420相對固定不動的承載塊410往上相對滑移,以致點測探針429被往上帶動穿入承載塊410的穿孔415中並點觸於晶粒200下方的狀態,此時,彈性密封結構430的彈性件433係被進一步壓縮,而且供電探針123係電性接觸電路板427的接點427a,藉以經由電路板427與點測探針429供電至晶粒200而對晶粒200進行檢測。在前述針座組件420相對固定不動的承載塊410往上滑移的過程中,彈性密封結構430的密封件431係保持彈性抵壓著承載塊410的配接孔414的孔壁,藉此在承載塊410與針座組件420之間保持良好的氣密效果,使得晶粒200與點測探針429接觸時,仍然能夠被穩固地吸附在承載塊410的承載面411而不會被頂離承載面411。此外,透過承載塊410與針座組件420之間的位移行程設定,以及彈性密封結構430的彈性件433的收縮,還可達到控制點測探針429點觸晶粒200時施加於晶粒200之力量大小的功能。The mode of operation of the probe assembly 400 provided by the present embodiment will be further described below. Please refer to the figures 23 to 25, and the 23 and 24 diagrams show that the probe assembly 400 has not been pushed up by the external push block lifting module 122, and the spotting probe 429 has not contacted the die 200, and the 25 shows that the probe assembly 400 is pushed up by the external push block lifting module 122, causing the spotting probe 429 to contact the die 200. In detail, the manner shown in FIGS. 23~24 means that the rotating module 111 drives the cantilever 112 to rotate, so that the probe assembly 400 connected to the end of the cantilever 112 through the lifting rail 113 is displaced to the fixed stop. Directly below the 121, in preparation for the test procedure, at this time, there is a gap (not shown) between the external push block lifting module 122 and the bottom of the seat body 421 of the hub assembly 420, and the carrying block 410 and A slit (not shown) is also disposed between the fixed stoppers 121. Further, the tip of the spotting probe 429 is held in a state of being aligned with the through hole 415 of the carrying block 410 and below the die 200 by a predetermined distance. The die 200 is vacuum-applied and fixed to the bearing surface of the carrier block 410. The aspect shown in FIG. 25 means that the external push block lifting module 122 pushes the probe assembly 400 upward, so that the bearing block 410 is fixed against the fixed stop 121 and the die 200 is in the fixed position. In the opening 121a of the block 121, the external push block lifting module 122 continues to push the probe assembly 400 upwardly in the direction of the fixed stop 121, so that the hub assembly 420 relatively slides relative to the fixed carrier block 410. Therefore, the spotting probe 429 is driven upward into the through hole 415 of the carrying block 410 and touches the state under the die 200. At this time, the elastic member 433 of the elastic sealing structure 430 is further compressed, and the power supply is probed. The pin 123 electrically contacts the contact 427a of the circuit board 427, thereby supplying power to the die 200 via the circuit board 427 and the spot probe 429 to detect the die 200. During the sliding of the aforementioned needle holder assembly 420 relative to the stationary carrier block 410, the sealing member 431 of the elastic sealing structure 430 maintains the wall of the hole of the mating hole 414 of the carrier block 410 elastically, thereby The carrier block 410 and the hub assembly 420 maintain a good airtight effect, so that when the die 200 is in contact with the spot probe 429, it can still be firmly adsorbed on the bearing surface 411 of the carrier block 410 without being lifted off. Bearing surface 411. In addition, the displacement stroke setting between the carrier block 410 and the hub assembly 420 and the contraction of the elastic member 433 of the elastic sealing structure 430 can also be applied to the die 200 when the spotting probe 429 is touched by the die 200. The power of the size of the function.
在晶粒200檢測完成之後,外部推塊升降模組122向下移動直到離開針探針總成400,過程中,彈性密封結構430的彈性件433將彈性恢復至初始的預壓狀態,而迫使探針組件420與承載塊410相對遠離位移而回復至第23~24圖所示的狀態。After the detection of the die 200 is completed, the external push block lifting module 122 moves downward until it leaves the needle probe assembly 400. During the process, the elastic member 433 of the elastic sealing structure 430 restores the elasticity to the initial preload state, forcing The probe assembly 420 and the carrier block 410 are relatively displaced from each other and returned to the state shown in FIGS. 23 to 24.
由以上描述可知,本實施方式所提供的電測裝置300同樣是利用承載塊410的穿孔415同時作為點測探針429點測晶粒200與真空吸附晶粒200的通道。其次,本實施方式的另一技術特徵在於,提供一個模組化且內部具有氣密流道T3的針座組件420,且針座組件420裝配有外露的彈性密封結構430,並可滑移地與承載塊410配接,如此一來,一旦彈性密封結構430的密封件431磨損,可以很容易地將針座組件420與承載塊410拆卸分離並快速更換新的密封件,或者,一旦點測探針429磨損,可以快速地更換整個針座組件420,以提升維修效率。It can be seen from the above description that the electrical measuring device 300 provided by the present embodiment also uses the through holes 415 of the bearing block 410 to simultaneously measure the channel of the die 200 and the vacuum adsorption die 200 as the spot probe 429. Secondly, another technical feature of the present embodiment is that a hub assembly 420 is provided which is modular and has an airtight flow passage T3 therein, and the needle hub assembly 420 is equipped with an exposed elastic sealing structure 430 and is slidably The mating block 410 is mated so that once the seal 431 of the elastic sealing structure 430 is worn, the hub assembly 420 can be easily detached from the carrier block 410 and the new seal can be quickly replaced, or once the spot is measured. The probe 429 is worn and the entire hub assembly 420 can be quickly replaced to improve maintenance efficiency.
雖然本發明已以實施方式揭露如上,然其並不用以限定本發明,任何熟習此技藝者,在不脫離本發明的精神和範圍內,當可作各種的更動與潤飾,因此本發明的保護範圍當視後附的申請專利範圍所界定者為準。The present invention has been disclosed in the above embodiments, and is not intended to limit the scope of the present invention, and the invention may be modified and modified in various ways without departing from the spirit and scope of the invention. The scope is subject to the definition of the scope of the patent application.
100‧‧‧電測裝置100‧‧‧Electrical measuring device
111‧‧‧旋轉模組111‧‧‧Rotary Module
111a‧‧‧旋轉軸心111a‧‧‧Rotary axis
112‧‧‧懸臂112‧‧‧cantilever
113‧‧‧升降滑軌113‧‧‧ Lifting rails
121‧‧‧固定擋塊121‧‧‧Fixed stop
121a、143c‧‧‧開口121a, 143c‧‧
122‧‧‧外部推塊升降模組122‧‧‧External push block lifting module
123‧‧‧供電探針123‧‧‧Powered probe
130‧‧‧承載塊130‧‧‧bearing block
131‧‧‧承載面131‧‧‧ bearing surface
132、135‧‧‧穿孔132, 135‧‧‧ perforation
133‧‧‧真空抽氣口133‧‧‧Vacuum suction port
134、142a12‧‧‧下表面134, 142a12‧‧‧ lower surface
136‧‧‧凹陷部136‧‧‧Depression
140‧‧‧針座組件140‧‧‧ needle seat assembly
141‧‧‧點測探針141‧‧ ‧ spot probe
142‧‧‧針座模組142‧‧‧ needle seat module
142a‧‧‧上導板142a‧‧‧Upper guide
142a1‧‧‧承靠部142a1‧‧‧Responsible Department
142a11‧‧‧上表面142a11‧‧‧ upper surface
142a2‧‧‧凸出部142a2‧‧‧protrusion
142a21‧‧‧上穿孔142a21‧‧‧perforation
142b‧‧‧第一下導板142b‧‧‧First lower guide
142b1‧‧‧第一下穿孔142b1‧‧‧First perforation
142c‧‧‧第二下導板142c‧‧‧Second lower guide
142c1‧‧‧第二下穿孔142c1‧‧‧Second perforation
143‧‧‧承載件143‧‧‧Carrier
143a‧‧‧環形槽143a‧‧‧ring groove
143b‧‧‧螺孔143b‧‧‧ screw hole
144‧‧‧鎖固件144‧‧‧Locker
150‧‧‧彈性密封結構150‧‧‧Elastic sealing structure
160‧‧‧電路板160‧‧‧ boards
161‧‧‧第一接點161‧‧‧ first joint
162‧‧‧第二接點162‧‧‧second junction
163‧‧‧表面電路層163‧‧‧Surface circuit layer
164‧‧‧結構增強層164‧‧‧Structural enhancement layer
181‧‧‧距離調整件181‧‧‧ distance adjustment
182‧‧‧第一導引件182‧‧‧First guide
183‧‧‧第二導引件183‧‧‧Second guide
200‧‧‧晶粒200‧‧‧ grain
300‧‧‧電測裝置300‧‧‧Electrical measuring device
400‧‧‧探針總成400‧‧‧ probe assembly
410‧‧‧承載塊410‧‧‧bearing block
411‧‧‧承載面411‧‧‧ bearing surface
412‧‧‧下表面412‧‧‧ lower surface
413‧‧‧凹陷部413‧‧‧Depression
414‧‧‧配接孔414‧‧‧With holes
415‧‧‧穿孔415‧‧‧Perforation
416‧‧‧加熱部416‧‧‧ heating department
417‧‧‧定位孔417‧‧‧Positioning holes
418‧‧‧結合部418‧‧‧Combination Department
419‧‧‧凹陷部419‧‧‧Depression
420‧‧‧針座組件420‧‧‧ needle seat assembly
421‧‧‧座體421‧‧‧ body
421a‧‧‧第一凹陷部421a‧‧‧The first depression
421b‧‧‧第二凹陷部421b‧‧‧second depression
421c‧‧‧流道421c‧‧‧ runner
421d‧‧‧滑動配接部421d‧‧‧Sliding mating
421e‧‧‧流道421e‧‧‧ runner
421f‧‧‧環形槽421f‧‧‧ring groove
421g‧‧‧結合部421g‧‧‧Combination Department
423‧‧‧塞件423‧‧‧plugs
425‧‧‧管路配接頭425‧‧‧Pipe fittings
427‧‧‧電路板427‧‧‧ boards
427a‧‧‧接點427a‧‧‧Contacts
429‧‧‧點測探針429‧‧ ‧ spot probe
430‧‧‧彈性密封結構430‧‧‧Flexible sealing structure
431‧‧‧密封件431‧‧‧Seal
433‧‧‧彈性件433‧‧‧Flexible parts
435‧‧‧定位件435‧‧‧ positioning parts
440‧‧‧加熱組件440‧‧‧heating components
441‧‧‧絕熱下蓋441‧‧‧Insulated lower cover
441a‧‧‧容置部441a‧‧‧ 容部
442‧‧‧加熱器固定座442‧‧‧heater mount
442a‧‧‧容置部442a‧‧‧Receipt Department
443‧‧‧電加熱器443‧‧‧Electric heater
444‧‧‧溫度感測器444‧‧‧temperature sensor
445‧‧‧絕熱上蓋445‧‧‧Insulated upper cover
450‧‧‧結合結構450‧‧‧Combination structure
451‧‧‧結合件451‧‧‧Connected parts
451a‧‧‧容置空間451a‧‧‧ accommodating space
453‧‧‧結合底板453‧‧‧ combined with the bottom plate
A‧‧‧容置空間A‧‧‧ accommodating space
G1、G2‧‧‧縫隙G1, G2‧‧‧ gap
S1‧‧‧凹陷空間S1‧‧‧ recessed space
S2‧‧‧凹陷空間S2‧‧‧ recessed space
T1‧‧‧密封通道T1‧‧‧ sealed passage
T2‧‧‧真空通道T2‧‧‧ vacuum channel
T3‧‧‧氣密流道T3‧‧‧ airtight runner
S101~S105‧‧‧步驟S101~S105‧‧‧Steps
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖為繪示本發明一實施方式之電測裝置的局部立體圖。 第2圖為繪示第1圖中之電測裝置的另一局部立體圖,其中固定擋塊被移除。 第3圖為繪示第1圖中之電測裝置沿著線段3-3的局部剖面圖,其中外部推塊升降模組尚未推動針座組件。 第4圖為繪示承載塊、針座組件、彈性密封結構與電路板的爆炸圖。 第5圖為繪示第3圖的局部放大圖。 第6圖為繪示第4圖中之點測探針與針座模組於一實施方式中的剖面圖。 第7圖為繪示第4圖中之點測探針與針座模組於另一實施方式中的剖面圖。 第8圖為繪示第4圖中之承載塊於另一視角的立體圖。 第9圖為繪示第4圖中之電路板的側視圖。 第10圖為繪示第3圖中之各部件的另一剖面圖,其中外部推塊升降模組推動針座組件而使得承載塊抵靠固定擋塊。 第11圖為繪示第3圖中之各部件的另一剖面圖,其中外部推塊升降模組使針座組件繼續朝向承載塊推動,進而使針座組件抵靠承載塊。 第12圖為繪示第11圖的局部放大圖。 第13圖為繪示第1圖中之電測裝置的局部側視圖。 第14圖為繪示第3圖中的結構於另一實施方式中的局部剖面圖。 第15圖為繪示本發明一實施方式之電測方法的流程圖。 第16圖為繪示本發明另一實施方式之電測裝置的部分立體分解圖。 第17圖為繪示包含承載塊與針座組件之探針總成的組合立體圖。 第18圖為第17圖所繪示之探針總成的爆炸圖。 第19圖為繪示包含承載塊與針座組件之探針總成於另一視角的組合立體圖。 第20圖為第19圖所繪示之探針總成的爆炸圖。 第21圖為繪示針座組件與彈性密封結構之組合立體圖。 第22圖為第17圖所繪示之探針總成的頂視圖。 第23圖為第22圖中沿著線段23—23的局部剖面圖,其中點測探針尚未接觸晶粒。 第24為第22圖中沿著線段24—24的剖面圖。 第25圖類似第23圖,惟顯示點測探針接觸晶粒的態樣。The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; FIG. 2 is another partial perspective view of the electrical measuring device of FIG. 1 in which the fixed stop is removed. 3 is a partial cross-sectional view of the electrical measuring device of FIG. 1 along line 3-3, wherein the external push block lifting module has not yet pushed the hub assembly. Figure 4 is an exploded view showing the carrier block, the hub assembly, the elastic sealing structure and the circuit board. Fig. 5 is a partially enlarged view showing Fig. 3. Fig. 6 is a cross-sectional view showing the spotting probe and the hub module of Fig. 4 in an embodiment. Figure 7 is a cross-sectional view showing the spotting probe and the hub module of Figure 4 in another embodiment. Figure 8 is a perspective view showing the carrier block of Figure 4 in another perspective. Figure 9 is a side view showing the circuit board in Figure 4. Figure 10 is another cross-sectional view of the components of Figure 3, wherein the outer push block lift module pushes the hub assembly such that the carrier block abuts the fixed stop. 11 is a cross-sectional view showing the components of FIG. 3, wherein the outer push block lifting module continues to push the hub assembly toward the carrier block, thereby causing the hub assembly to abut the carrier block. Fig. 12 is a partially enlarged view showing Fig. 11. Figure 13 is a partial side elevational view showing the electrical measuring device of Figure 1. Figure 14 is a partial cross-sectional view showing the structure of Figure 3 in another embodiment. FIG. 15 is a flow chart showing an electrical measurement method according to an embodiment of the present invention. Figure 16 is a partially exploded perspective view showing the electrical measuring device according to another embodiment of the present invention. Figure 17 is a perspective view showing the combination of the probe assembly including the carrier block and the hub assembly. Figure 18 is an exploded view of the probe assembly depicted in Figure 17. Figure 19 is a combined perspective view showing the probe assembly including the carrier block and the hub assembly at another viewing angle. Figure 20 is an exploded view of the probe assembly shown in Figure 19. Figure 21 is a perspective view showing the combination of the needle hub assembly and the elastic sealing structure. Figure 22 is a top plan view of the probe assembly illustrated in Figure 17. Figure 23 is a partial cross-sectional view along line 22-23 of Figure 22, in which the spot probe has not been in contact with the die. Figure 24 is a cross-sectional view taken along line 24-24 in Figure 22. Figure 25 is similar to Figure 23 except that the spot probe is in contact with the grain.
Claims (14)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106123963A TWI638176B (en) | 2017-07-18 | 2017-07-18 | Electrometric apparatus |
| MYPI2017703723A MY170560A (en) | 2016-10-05 | 2017-10-02 | Probing appratus and probing method |
| SG10201708132QA SG10201708132QA (en) | 2016-10-05 | 2017-10-03 | Probing apparatus and probing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106123963A TWI638176B (en) | 2017-07-18 | 2017-07-18 | Electrometric apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI638176B true TWI638176B (en) | 2018-10-11 |
| TW201908748A TW201908748A (en) | 2019-03-01 |
Family
ID=64802843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106123963A TWI638176B (en) | 2016-10-05 | 2017-07-18 | Electrometric apparatus |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI638176B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI700501B (en) * | 2019-05-06 | 2020-08-01 | 美商第一檢測有限公司 | Detecting apparatus |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023032036A1 (en) * | 2021-08-31 | 2023-03-09 | 信越エンジニアリング株式会社 | Energization testing device and energization testing method |
| TWI788113B (en) * | 2021-11-23 | 2022-12-21 | 創意電子股份有限公司 | Inspecting device and its probe socket |
| TWI803188B (en) * | 2022-02-11 | 2023-05-21 | 尹鑽科技有限公司 | Translational detection module and detection device using the detection module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1281966C (en) * | 2002-10-02 | 2006-10-25 | 株式会社瑞萨科技 | Probe sheet, probe card, semiconductor detector and method for producing semiconductor device |
| TWM330470U (en) * | 2007-07-27 | 2008-04-11 | King Yuan Electronics Co Ltd | Clamp having a sealing ring, handler thereof, and tester thereof |
| US7724006B2 (en) * | 2008-02-27 | 2010-05-25 | Renesas Technology Corp. | Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device |
| TW201445146A (en) * | 2013-05-30 | 2014-12-01 | Mpi Corp | Electrical test equipment |
| TWM500893U (en) * | 2014-09-24 | 2015-05-11 | Mpi Corp | Die spot measuring equipment |
-
2017
- 2017-07-18 TW TW106123963A patent/TWI638176B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1281966C (en) * | 2002-10-02 | 2006-10-25 | 株式会社瑞萨科技 | Probe sheet, probe card, semiconductor detector and method for producing semiconductor device |
| TWM330470U (en) * | 2007-07-27 | 2008-04-11 | King Yuan Electronics Co Ltd | Clamp having a sealing ring, handler thereof, and tester thereof |
| US7724006B2 (en) * | 2008-02-27 | 2010-05-25 | Renesas Technology Corp. | Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device |
| TW201445146A (en) * | 2013-05-30 | 2014-12-01 | Mpi Corp | Electrical test equipment |
| TWM500893U (en) * | 2014-09-24 | 2015-05-11 | Mpi Corp | Die spot measuring equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI700501B (en) * | 2019-05-06 | 2020-08-01 | 美商第一檢測有限公司 | Detecting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201908748A (en) | 2019-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI638176B (en) | Electrometric apparatus | |
| KR101183978B1 (en) | Jig unit for testing LED chip | |
| CN109116879B (en) | Temperature controller | |
| US11226362B2 (en) | System-level testing apparatus and system-level testing system | |
| KR20190106616A (en) | Handler for electronic component test | |
| CN116754918B (en) | A wafer-level semiconductor high-voltage reliability test fixture | |
| CN113253100B (en) | A testing device and a detection system | |
| US9880196B2 (en) | Semiconductor device inspection apparatus and semiconductor device inspection method | |
| JP2016095141A (en) | Inspection unit for semiconductor device | |
| KR101852794B1 (en) | Apparatus for testing semiconductor package | |
| TWI704360B (en) | Wafer testing device of flip chip vcsel | |
| JP5491581B2 (en) | Socket for semiconductor chip inspection | |
| JP2002022768A (en) | Pogo pin for inspecting integrated circuit package | |
| TWI603096B (en) | Electronic parts conveying apparatus and electronic parts inspection apparatus | |
| US11169178B2 (en) | Locking mechanism for a press head and electronic device testing apparatus comprising the same | |
| KR100702021B1 (en) | Contactor device for semiconductor devices and test method of semiconductor device | |
| TWI638178B (en) | Electrometric apparatus, electrometric method and probe circuit structure | |
| CN110600389A (en) | System and method for detecting photoelectric performance of micro surface-emitting photoelectric chip array in huge amount | |
| CN208722062U (en) | A kind of temperature controller | |
| TWI741693B (en) | Connecting apparatus and handler having the same | |
| TWM546007U (en) | Electrometric apparatus and probe circuit structure | |
| KR101217823B1 (en) | Jig unit for testing LED chip | |
| US7466153B2 (en) | Apparatuses for inspecting pogo pins of an electrical die sorting system and a method for performing the same | |
| CN114646784B (en) | Test seat capable of being positioned accurately | |
| TWI582029B (en) | Testing device of electronic components having fingerprint identification and testing apparatus thereof |