TWI582029B - Testing device of electronic components having fingerprint identification and testing apparatus thereof - Google Patents

Description

Fingerprint identification electronic component testing device and testing device thereof

The invention relates to a fingerprint identification electronic component testing device and a testing device thereof, in particular to a fingerprint identification electronic component testing device and a testing device thereof, which use the mobile carrier and the buffer module to improve test efficiency.

Everyday life is filled with a variety of electronic products, each of which uses semiconductor components to achieve specific functions, such as lighting with LEDs, temperature sensors and pressure sensors to measure changes in the external environment, etc. Before the components are mounted on the product, reliability testing and functional testing are required to ensure that the functions of the semiconductor components can be performed normally.

In the functional testing of fingerprint identification electronic components, in general, a semiconductor component having a fingerprint identification function begins to fingerprint a single electronic component after undergoing a semiconductor packaging process such as injection molding, cutting, and pick-and-place to a tray. function test.

When a single electronic component is taken out of the tray and placed on the test equipment, the vacuum adsorption device must be used to transfer the electronic components. During the adsorption and transfer process, the electronic components are easily flying out due to improper adsorption force. Electronic components are damaged and yields are declining, and due to the trend of lightness and thinness in today's electronic products, the size of electronic components in electronic products is also reduced with size. Small electronic components are easier to fly during adsorption and transfer. Out, and positioning in the test equipment is also more difficult.

Therefore, in order to solve the above problems, the inventors have conceived a fingerprint identification electronic component testing device and a testing device thereof based on the spirit of active invention creation, and can utilize the structural design of the finger pressing module, the test base and the moving stage. The device under test is tested in the form of a substrate to improve the testing efficiency of the fingerprint identification electronic component, and the research is finally completed to complete the present invention.

The main object of the present invention is to solve the above problems, and provide a fingerprint identification electronic component testing device and a testing device thereof, thereby achieving the purpose of improving the testing efficiency of the fingerprint identification electronic component.

To achieve the above objective, the fingerprint identification electronic component testing apparatus of the present invention comprises: a finger pressure module, a test base and a mobile stage. The acupressure module is movable in a vertical direction, and includes a driving portion, a plurality of conductive elastic indenters and a plurality of receiving holes, the driving portion can drive the plurality of conductive elastic indenters to act, and the plurality of conductive elastic indenters can correspond to the plurality of receiving holes, and the test The base has a plurality of test protrusions, and the plurality of test protrusions can correspond to the plurality of conductive elastic indenters, and the movable stage can be disposed between the finger pressure module and the test base, and moves in the horizontal direction and the vertical direction, including useful The integrated component to be tested is integrated, and the moving carrier is disposed in a hollow plurality of receiving slots, and the plurality of receiving slots can accommodate the plurality of test protrusions.

The fingerprint identification electronic component testing device of the present invention may further comprise a test carrier, the test pedestal may be disposed on the test carrier, and the fingerprint identification function of the electronic component is tested by connecting a fingerprint identification signal analysis device through the test carrier.

The test protrusions are provided with a plurality of test terminals, and the plurality of test terminals are connected to the test carrier, and the height of the test protrusions is the same as the height of the detection area of the moving stage, thereby integrating the components to be tested and the plurality of test terminals. Counterpoint.

The moving carrier may further include a plurality of positioning pins integrally disposed around the component to be tested, and the finger pressing module further includes a plurality of positioning holes for accommodating the plurality of positioning pins, whereby the plurality of positioning pins are positioned to integrate the components to be tested.

The acupressure module further includes a plurality of vacuum adsorption portions corresponding to the components to be tested, whereby the acupressure module can perform the pick and place operation of the components to be tested integrated.

The acupressure module may further comprise a push plate connected to the driving portion, and the push plate may be connected to a receiving seat for placing a plurality of conductive elastic indenters, wherein the driving portion may be a pneumatic cylinder and cooperate with the push plate to provide a plurality of conductive elastic The pressure of the indenter is averaged, and the pressure measurement operation of the component to be tested is integrated.

The fingerprint identification electronic component testing device of the present invention comprises: a feeding module, a transfer module, a fingerprint identification electronic component testing device, a buffer module, a processor (Handler) and a discharging module. The feeding module can perform the feeding operation of the component to be tested integrated, the transfer module can receive the component to be tested of the feeding module integrated and carry out the transfer operation, and the fingerprint identification electronic component testing device can be set in a test area for performing The pick-and-place operation and the pressure measurement operation of the component to be tested include a finger pressure module, a test base and a moving stage, and the finger pressure module can be moved in a vertical direction, and includes a driving portion and a plurality of conductive elastic indenters a plurality of accommodating holes and a plurality of vacuum adsorption portions, the driving portion can drive the plurality of conductive elastic indenters to act, the plurality of conductive elastic indenters can correspond to the plurality of accommodating holes, the test pedestal has a plurality of test convex portions, and the plurality of test convex portions can correspond to the plurality The conductive elastic indenter, the moving stage can be disposed between the finger pressing module and the test base, and moves in the horizontal direction and the vertical direction, including the purpose of placing the component to be tested integrated, and moving the moving stage and being hollow a plurality of accommodating slots, the plurality of accommodating slots accommodating the plurality of test protrusions, the buffer module is movable between the transfer module and the test area, and the processor is movable between the transfer module and the buffer module The DUT integrated line operations take place, the material under test module may receive a shift element of the module carrier and the integrated discharge operation.

The invention further includes a 2D Code Reader integrated with the component to be tested for distinguishing the number of the component to be tested integrated.

The moving carrier may further include a plurality of positioning pins integrally disposed around the component to be tested, and the finger pressing module may further include a plurality of positioning holes for accommodating the plurality of positioning pins, whereby the plurality of positioning pins are positioned to integrate the components to be tested.

The acupressure module may further comprise a push plate connected to the driving portion, and the push plate may be connected to a receiving seat for placing a plurality of conductive elastic indenters, wherein the driving portion may be a pneumatic cylinder and cooperate with the push plate to provide a plurality of conductive elastic The pressure of the indenter is averaged, and the pressure measurement operation of the component to be tested is integrated.

The fingerprint identification electronic component testing device further includes a test carrier disposed in the test area, and the test base can be disposed on the test carrier, thereby connecting a fingerprint identification signal analysis device to test the fingerprint identification function of the electronic component.

The test protrusions are provided with a plurality of test terminals, and the plurality of test terminals are connected to the test carrier, and the height of the test protrusions is the same as the height of the detection area of the moving stage, thereby integrating the components to be tested and the plurality of test terminals. Counterpoint.

The buffer module may further include a buffer for integrating the components to be tested, thereby improving the testing efficiency of the electronic component.

The above summary and the following detailed description are intended to be illustrative of the scope of the invention, and the scope of the invention Explain it.

Referring to FIG. 1 , FIG. 2 and FIG. 3A to FIG. 3E , FIG. 1 is a schematic diagram of a three-dimensional structure of a fingerprint identification electronic component testing device according to the present invention, a schematic view of a three-dimensional structure of another viewing angle, and a schematic diagram of a test flow.

The fingerprint identification electronic component testing device 10 of the present invention comprises: a finger pressing module 101, a test pedestal 102, a moving carrier 103, a test carrier 104 and a device under test integration 105.

The finger pressing module 101 is moved in a vertical direction, and includes a pushing plate 1010, a driving portion 1011, a plurality of conductive elastic indenters 1012, a plurality of receiving holes 1013, a plurality of positioning holes 1014, a plurality of vacuum adsorption portions 1015, and a receiving seat 1016. The driving part 1011 is connected to the push plate 1010, and the push plate 1010 is connected to the receiving seat 1016, the receiving seat 1016 is provided with a plurality of conductive elastic indenters 1012, and the plurality of conductive elastic indenters 1012 are provided with a snap ring 1012A, and a plurality of conductive elastic indenters 1012 can be fixed between the push plate 1010 and the receiving seat 1016. The driving part 1011 of the finger pressing module 101 can control the moving position of the plurality of conductive elastic indenters 1012, and the plurality of conductive elastic indenters 1012 correspond to the plurality of receiving holes 1013. The test base 102 has a plurality of test protrusions 1021, the plurality of test protrusions 1021 correspond to a plurality of conductive elastic heads 1012, and the mobile stage 103 is disposed on the finger pressure module 101 and tested. The susceptor 102 is moved in the horizontal direction and the vertical direction, and includes a detecting area 1031, a plurality of accommodating grooves 1032, and a plurality of positioning pins 1033. The plurality of accommodating grooves 1032 are used for arranging the component to be tested 105. Moving the stage 103 and The plurality of test protrusions 1021 are disposed on the test carrier 104, and the plurality of test pins 1033 are connected to the test component board 104. The positioning pins 1033 are received in the first positioning holes 1014a or the second positioning holes 1014b of the plurality of positioning holes 1014, and the test base 102 is disposed on the test carrier 104. .

It should be noted that the device under test 105 is a strip type in the form of a substrate. Generally, the device to be tested is a single electronic component after cutting and separating, and the plurality of electrons on the device to be tested are integrated 105. The component has not been subjected to the cutting and separating operation, that is, the component to be tested 105 corresponds to a plurality of electronic components having an array arrangement on the surface of the finger pressing module 101, and the component integration 105 to be tested is oriented toward the moving stage 103. On the surface, there is an electrical contact (not shown) corresponding to the plurality of electronic components.

When the pressure measurement operation is performed, the acupressure module 101 can move along the direction axis Z of the vertical direction, and the movement stage 103 can move along the direction axis X, Y of the horizontal direction and the direction axis Z of the vertical direction, to be tested. The component integration 105 is placed in the detection area 1031, and the plurality of vacuum adsorption sections 1015 and the two-dimensional barcode reader are disposed corresponding to the detection zone 1031, and the test base 102 and the test carrier 104 are fixed.

The test flow actuation mode of the fingerprint identification electronic component testing device 10 is sequentially described with reference to FIG. 3A to FIG. 3E. For convenience of description, the upper and lower directions of FIG. 3A to FIG. 3E refer to the movement along the direction axis Z shown in FIG. The direction refers to the movement along the direction axis X shown in FIG.

As shown in FIG. 3A, in the standby state, the finger pressing module 101, the test base 102, and the moving stage 103 are separated, and the component integration 105 to be tested is placed in the detection by the plurality of vacuum adsorption portions 1015 of the finger pressing module 101. In the region 1031, since the moving stage 103 has a plurality of positioning pins 1033, the sheet-like type of the component under test 105 can be easily positioned by the plurality of positioning pins 1033 at a position to be tested.

When the pressure measurement operation is performed, as shown in FIG. 3B, the acupressure module 101 moves downward, so that the bottom side of the finger pressure module 101 abuts against the component integration 105 to be tested, and then, as shown in FIG. 3C, The squeezing module 101 and the moving stage 103 are simultaneously moved downward, so that the test protrusions 1021 are received in the through holes 1032a, 1032c, 1032e of the accommodating groove 1032, and the height H1 of the test protrusion 1021 is moved and loaded. The height H2 of the detection area 1031 of the stage 103 is the same, so that the accommodating groove 1032 of the moving stage 103 is disposed at the height position of the test protrusion 1021, whereby the moving stage 103 and the test protrusion 1021 can form a horizontal surface. The device under test integration 105 is placed such that the plurality of test terminals 1022 on the test protrusion 1021 are accurately connected to the electrical contacts of the component integration 105 to be tested, and then, as shown in FIG. 3D, the drive unit 1011 that operates with the pneumatic cylinder will The plurality of conductive elastic indenters 1012 are pressed down, and the plurality of conductive elastic indenters 1012 are connected to the sensing portions of the component-integrated component 105 of the corresponding through holes 1032a, 1032c, 1032e. At this time, the conductive elastic indenter 1012 is to be tested. The component integration 105 and the test protrusion 1021 are electrically connected, through The test carrier 104 connected to the test protrusion 1021 transmits the fingerprint identification signal of the sensing unit to a fingerprint identification signal analysis device (not shown), so that the corresponding through hole 1032a, 1032c on the component integration 105 to be tested can be measured. Whether the fingerprint identification signal of the plurality of electronic components at the position 1032e is normal.

Next, in order to test the plurality of electronic components at the position corresponding to the through holes 1032b and 1032d of the device under test 105, as shown in FIG. 3E, while the finger pressing module 101 moves upward, the driving portion 1011 also presses the plurality of conductive elastic members. The head 1012 is stowed, and after the moving stage 103 moves upward, it is moved to the left by a predetermined distance, so that the plurality of electronic components located at the positions of the through holes 1032b, 1032d can be combined with the plurality of conductive elastic indenters 1012 and the plurality of test protrusions. The portion 1021 is aligned, and then the test flow of FIG. 3A to FIG. 3D is performed to complete the fingerprint identification signal test of all the electronic components on the component integration 105 to be tested, whereby the fingerprint identification electronic component testing device 10 of the present invention can be efficiently The fingerprint identification test operation of the component integration 105 to be tested is performed.

Referring to FIG. 4A to FIG. 4C , FIG. 4 is a schematic diagram showing another test flow of the fingerprint identification electronic component testing device of the present invention. For convenience of description, only the relative positions of the component integration 105 and the test convex portion 1021 of the device to be tested are viewed from a plan view. It should be noted that the operation modes of the squeezing module 101 and the moving stage 103 are known from the description of FIG. 3A to FIG. 3E described above, and therefore will not be described again.

As shown in FIG. 4A, the number of electronic components on the component-integrated component 105 is 90, and forms a first region r1, a second region r2, a third region r3, a fourth region r4, and a fifth region r5, and each region The number of electronic components is 18, and the pedestals 1021a, 1021b, and 1021c of the test convex portion 1021 can test 18 electronic components at a time. In the standby state, the component under test 105 and the pedestals 1021a, 1021b, and 1021c are separated. When the test is started, as shown in FIG. 4B, the fifth zone r5 is aligned with the base 1021a by the moving stage 103 and tested. After the test of the fifth zone r5 is completed, as shown in FIG. 4C, The moving stage 103 aligns and tests the third area r3 with the pedestal 1021a and the fifth area r5 and the pedestal 1021b, and repeats the above-mentioned aligning mode for testing. Therefore, it can be seen that the testing process of FIG. 4A to FIG. 4C can be performed. Cross-testing the electronic components of the fifth zone r5, and repeating the test of the fifth zone r5 by the pedestals 1021a, 1021b, can improve the reliability of the test.

It can be seen from the above that the design of the finger pressing module 101 and the moving stage 103 can simultaneously test a plurality of electronic components on the sheet substrate, the conductive elastic indenter 1012, the receiving hole 1013, the test convex portion 1021, and The number of the receiving slots 1032 can also be changed according to the number of electronic components, and the positioning pin 1033 can position the whole component to be tested 105 without any problem that the size of the electronic component is too small to be easily positioned, and the test is performed. The entire device under test 105 is vacuum-adsorbed and pick-and-placed, and does not cause a problem that the size of the electronic component is too small to easily fly out during adsorption, thereby improving the test efficiency.

Referring to FIG. 5 and FIG. 1 and FIG. 3A , FIG. 5 is a schematic diagram of a fingerprint identification electronic component testing device according to the present invention. The fingerprint identification electronic component testing device of the present invention includes: a fingerprint identification electronic component testing device 10 The material module 20, a transfer module 30, a buffer module 40, a processor 50, a discharge module 60, a fingerprint identification signal analysis device 70 and a two-dimensional barcode reader 80.

The fingerprint identification electronic component testing device 10 is disposed in a test area A1, and performs a pick-and-place operation and a pressure measurement operation of the component integration 105 to be tested, and includes a finger pressure module 101, a test base 102, a mobile stage 103, and a The test carrier 104 is moved in a vertical direction, and includes a push plate 1010, a driving portion 1011, a plurality of conductive elastic indenters 1012, a plurality of receiving holes 1013, a plurality of positioning holes 1014, and a plurality of vacuum adsorption portions 1015. A receiving portion 1016, the driving portion 1011 is connected to the push plate 1010, and the push plate 1010 is connected to the receiving seat 1016. The receiving seat 1016 is provided with a plurality of conductive elastic indenters 1012, and the plurality of conductive elastic indenters 1012 are provided with a snap ring 1012A. The plurality of conductive elastic indenters 1012 can be fixed between the push plate 1010 and the receiving seat 1016. The driving portion 1011 of the finger pressing module 101 can control the moving position of the plurality of conductive elastic indenters 1012, and the plurality of conductive elastic indenters 1012 correspond to The plurality of receiving holes 1013 are disposed on the test carrier 104 and have a plurality of test protrusions 1021. The plurality of test protrusions 1021 correspond to the plurality of conductive elastic indenters 1012. The moving stage 103 is disposed on the finger pressing module 101 and tested. Pedestal 1 02, and moving in the horizontal direction and the vertical direction, including a detecting area 1031, a plurality of receiving grooves 1032 and a plurality of positioning pins 1033, the plurality of vacuum adsorption portions 1015 and the two-dimensional barcode reader 80 are corresponding to the detection area 1031, plural The accommodating slot 1032 is configured to place the component to be tested 105, which is hollowed through the moving carrier 103, and the plurality of accommodating slots 1032 accommodate the plurality of test protrusions 1021, and the plurality of positioning pins 1033 are disposed on the component to be tested 105. The circumference of the plurality of positioning pins 1033 is received in the first positioning hole 1014a or the second positioning hole 1014b of the plurality of positioning holes 1014 during the pressing operation, the test carrier 104 is disposed at the test area A1, and the test base 102 is tested. It is disposed on the test carrier 104.

The feeding module 20 performs the feeding operation of the component integration 105 to be tested, the transfer module 30 receives the component to be tested 105 of the feeding module 20 and performs the transfer operation, and the buffer module 40 has two components to be tested. The buffers A2 and A3 of the integrated 105 are moved between the transfer module 30 and the test area A1, and the processor 50 moves between the transfer module 30 and the buffer module 40 and performs the pick-and-place integration of the component under test 105. The operation and discharge module 60 receives the component under test 105 of the transfer module 30 and performs a discharge operation, and the fingerprint identification signal analysis device 70 analyzes the signal measured by the fingerprint identification electronic component testing device 10, thereby improving The test rate of the component under test integration 105.

In detail, the untested component under test 105 is transported by the feed module 20 to the transfer module 30. At this time, the buffer module 40 moves closer to the transfer module 30, and is not processed by the processor 50. The tested component integration 105 is taken into the buffer A2 of the buffer module 40, and the buffer module 40 is moved to the test area A1, and is located between the acupressure module 101 and the mobile carrier 103, and then adsorbed by multiple vacuums. After the component 1015 adsorbs the untested component under test 105 of the buffer A2, the buffer module 40 moves closer to the transfer module 30, and the fingerprint identification electronic component testing device 10 can be performed as shown in FIG. 3A to FIG. 3E or FIG. 4A. The test procedure described in Figure 4C.

Next, while the test flow is being performed, the processor 50 takes another untested component under test 105 from the transfer module 30 to the buffer A2 of the buffer module 40. At this time, the fingerprint identification electronic component test The testing process of the device 10 is completed, the finger pressing module 101 adsorbs and rises the component under test 105 that has completed the test, and the buffer module 40 moves to the test area A1 and is located in the finger pressing module 101 and the mobile carrier board 103. Between the finger pressure module 101 and the test component integration 105 after the test is placed in the buffer A3, the mobile buffer module 40 allows the finger pressure module 101 to adsorb another untested component to be tested in the buffer A2. 105. The buffer module 40 is moved closer to the transfer module 30.

Finally, while the fingerprint identification electronic component testing device 10 tests another untested component under test 105, the processor 50 places the component under test 105 of the buffer A3 that has been tested and is placed in the transfer module 30. The untested component under test 105 is taken from the transfer module 30 to the buffer A2 of the buffer module 40, and the buffer module 40 is moved to the test area A1, and the foregoing process is repeated for testing and testing is completed. The component under test 105 is transported from the transfer module 30 to the discharge module 60, and the discharge module 60 performs the discharge operation of the component under test 105 for testing.

It can be seen from the foregoing that the fingerprint identification electronic component testing device of the present invention can perform the testing of the component under test 105 that has not been tested and completed testing by the buffer module 40 while the fingerprint identification electronic component testing device 10 is being tested. Improve the test efficiency and test capacity of fingerprint identification electronic components.

The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

10‧‧‧Fingerprint identification electronic component test device
101‧‧‧ finger pressure module
1010‧‧‧ push board
1011‧‧‧Drive Department
1012‧‧‧Electrical elastic indenter
1012A‧‧‧ card ring
1013‧‧‧ accommodating holes
1014‧‧‧Positioning holes
1014a‧‧‧First positioning hole
1014b‧‧‧Second positioning hole
1015‧‧‧vacuum adsorption department
1016‧‧‧ 容座
102‧‧‧Test base
1021‧‧‧Test convex
1021a~1021c‧‧‧Base
1022‧‧‧Test terminals
103‧‧‧Mobile stage
1031‧‧‧Detection area
1032‧‧‧ accommodating slots
1032a~1032e‧‧‧Tongkong
1033‧‧‧Locating pin
104‧‧‧Test carrier
105‧‧‧Device under test integration
20‧‧‧ Feeding module
30‧‧‧Transfer module
40‧‧‧buffer module
50‧‧‧ processor
60‧‧‧ discharging module
70‧‧‧Fingerprint signal analysis equipment
80‧‧‧2D barcode reader
A1‧‧‧ test area
A2, A3‧‧‧ buffer zone
H1, H2‧‧‧ height
r1‧‧‧First District
R2‧‧‧Second District
R3‧‧‧ third district
r4‧‧‧Fourth District
R5‧‧‧5th District
X, Y, Z‧‧‧ direction axis

1 is a schematic perspective view showing the fingerprint identification electronic component testing device of the present invention. 2 is a schematic perspective view showing another perspective of the fingerprint identification electronic component testing device of the present invention. 3A to 3E are schematic diagrams showing the test flow of the fingerprint identification electronic component testing device of the present invention. 4A to 4C are schematic diagrams showing another test flow of the fingerprint identification electronic component testing device of the present invention. FIG. 5 is a schematic diagram showing the structure of a fingerprint identification electronic component testing device of the present invention.

10‧‧‧Fingerprint identification electronic component test device

101‧‧‧ finger pressure module

1010‧‧‧ push board

1011‧‧‧Drive Department

1012‧‧‧Electrical elastic indenter

1012A‧‧‧ card ring

1013‧‧‧ accommodating holes

1016‧‧‧ 容座

102‧‧‧Test base

1021‧‧‧Test convex

1022‧‧‧Test terminals

103‧‧‧Mobile stage

1032‧‧‧ accommodating slots

1032a~1032e‧‧‧Tongkong

1033‧‧‧Locating pin

104‧‧‧Test carrier

105‧‧‧Device under test integration

X, Z‧‧‧ direction axis

Claims (19)

A fingerprint identification electronic component testing device includes: a finger pressing module, which is moved in a vertical direction, and includes a driving portion, a plurality of conductive elastic indenters, and a plurality of receiving holes, wherein the driving portion drives the plurality of conductive elastic indenters Actuating, the plurality of conductive elastic indenters are corresponding to the plurality of receiving holes; a test base having a plurality of test protrusions, the plurality of test protrusions corresponding to the plurality of conductive elastic indenters; and a moving stage disposed on The finger pressure module and the test base are moved in a horizontal direction and a vertical direction, and include a plurality of receiving slots for inserting a component to be tested and passing through the moving stage and being hollow. The plurality of receiving slots receive the plurality of test protrusions. The fingerprint identification electronic component testing device of claim 1, wherein the mobile carrier further comprises a plurality of positioning pins disposed on the integrated circumference of the component to be tested, the finger pressure module further comprising a plurality of components. The positioning hole of the plurality of positioning pins. The fingerprint identification electronic component testing device of claim 1, wherein the acupressure module further comprises a plurality of vacuum adsorption portions corresponding to the components to be tested. The fingerprint identification electronic component testing device according to claim 1, wherein the driving portion is a pneumatic cylinder. The fingerprint identification electronic component testing device of claim 1, further comprising a test carrier, the test pedestal being disposed on the test carrier. The fingerprint identification electronic component testing device according to claim 1, wherein the height of the test protrusion is the same as the height of the detection area of the moving stage. The fingerprint identification electronic component testing device of claim 5, wherein the test protrusion is provided with a plurality of test terminals, and the plurality of test terminals are connected to the test carrier. The fingerprint identification electronic component testing device of claim 1, wherein the acupressure module further comprises a push plate connected to the driving portion. The fingerprint identification electronic component testing device of claim 8, wherein the push plate is connected to a receiving seat for placing the plurality of conductive elastic indenters. A fingerprint identification electronic component testing device includes: a feeding module for performing a feeding operation for integrating a component to be tested; and a transfer module for integrating and performing the component to be tested receiving the feeding module Transfer operation; a fingerprint identification electronic component test device is disposed in a test area for performing the pick-and-place operation and the pressure measurement operation of the component to be tested, including a finger pressure module, a test base and a mobile stage The finger pressing module is moved in a vertical direction, and includes a driving portion, a plurality of conductive elastic indenters, a plurality of receiving holes, and a plurality of vacuum adsorption portions, wherein the driving portion drives the plurality of conductive elastic indenters to act, the plurality of conductive elastic The ram has a plurality of accommodating holes, and the test pedestal has a plurality of test protrusions corresponding to the plurality of conductive elastic rams, wherein the moving stage is disposed on the squeezing module and the test base Between the seats, and moving in the horizontal direction and the vertical direction, including a plurality of accommodating grooves for placing the component to be tested and passing through the moving stage and being hollow, the complex The accommodating slot is configured to receive the plurality of test protrusions; a buffer module is moved between the transfer module and the test area; and a processor is between the transfer module and the buffer module Moving and performing the pick-and-place operation of the component to be tested integrated; and a discharging module, which is configured to receive the component to be tested of the transfer module and perform a discharging operation. The fingerprint identification electronic component testing device of claim 10, wherein the mobile carrier further comprises a plurality of positioning pins integrally disposed around the component to be tested, the finger pressure module further comprising a plurality of the plurality of receiving components Positioning hole for the positioning pin. The fingerprint identification electronic component testing device according to claim 10, further comprising a pair of two-dimensional barcode readers that should be integrated with the component to be tested. The fingerprint identification electronic component testing device according to claim 10, wherein the driving portion is a pneumatic cylinder. The fingerprint identification electronic component testing device of claim 10, wherein the fingerprint identification electronic component testing device further comprises a test carrier disposed in the test area, the test base being disposed on the test carrier on. The fingerprint identification electronic component testing device of claim 10, wherein the buffer module further comprises a buffer for placing the component to be tested integrated. The fingerprint identification electronic component testing device according to claim 10, wherein the height of the test protrusion is the same as the height of the detection area of the moving stage. The fingerprint identification electronic component testing device of claim 14, wherein the test protrusion is provided with a plurality of test terminals, and the plurality of test terminals are connected to the test carrier. The fingerprint identification electronic component testing device of claim 10, wherein the finger pressing module further comprises a push plate connected to the driving portion. The fingerprint identification electronic component testing device of claim 18, wherein the push plate is connected to a receiving seat for placing the plurality of conductive elastic indenters.