TWI698952B - Electronic device mounting device and mounting method, and package component manufacturing method - Google Patents

Abstract

[Problem] To provide a mounting device that does not form a support substrate such as a mark for position detection in each mounting area, and mounts electronic components with high precision and efficiency. [Solution] The mounting device (1) of the embodiment includes: a stage part (20) that moves a stage (21) on which a support substrate (W) having a plurality of mounting areas is placed, and has a plurality of mounting areas The mounting part (40) where the first and second mounting heads (43) of the tool (43a, 43b) move, the first recognition part that recognizes the entire position of the support substrate (W), and the recognition held in the mounting tool (43a) , 43b) The second recognition unit of the position of the electronic component; wherein the movement of the stage (21) and the first and second mounting heads (43) is based on the position data of the support substrate (W) and the electronic components, The correction data of the stage and tools are arranged to arrange the mounting area on the mounting line set in the X direction, and the electronic parts are mounted in the first and second mounting heads (43) in the plural mounting areas. Way to control.

Description

Electronic component mounting device and mounting method, and packaging component manufacturing method

The embodiment of the present invention relates to a mounting device and a mounting method of an electronic component, and a manufacturing method of a package component.

In the past, semiconductor packaging processes using interposer substrates (relay substrates) such as CSP (Chip Size Package) and BGA (Ball Grid Array) have been known. In addition, there is also known a process called Wafer Level Package (LWP) that does not use an intermediate substrate and does not divide into individual semiconductor wafers while maintaining the wafer state for packaging. WLP has the advantage that it can reduce the thickness and manufacturing cost of the semiconductor package without using an intermediate substrate.

In WLP, in order not to protrude the area on the surface of the semiconductor wafer where the electrode pads are formed, it is known to form a rewiring layer including the I/O terminals of the semiconductor package on the semiconductor wafer, fan-in and wafer-level packaging. (fan in-WLP: FI-WLP). In addition, in recent years, fan out/wafer level packaging (fan out-WLP: FO-WLP) has been proposed in which the area of the semiconductor chip is protruded to form a rewiring layer including the I/O terminals of the semiconductor package. FO-WLP can also be applied to multiple chip packages (MCP) in which semiconductor chips such as RAM, flash memory, and CPU, or multiple types of electronic components such as diodes and capacitors are mounted in a single package. Attention.

Here, the MCP refers to the one that mounts multiple types of electronic components in one package as described above. In this type of MCP, because the deviation of the respective mounting positions of the electronic components mounted in the same package affects the electrical characteristics of the package, high position accuracy is required for the mounting of the respective electronic components. In the semiconductor packaging process using the aforementioned interposer substrate, because each mounting area on the interposer substrate is provided with alignment marks for position identification, the alignment marks are applied to each mounting area and the electronic components are The method of positioning and mounting of the mounting area (hereinafter referred to as the area recognition method) realizes mounting with high position accuracy.

In the FO-WLP process, a plurality of semiconductor wafers are first mounted in rows and columns at intervals on a support substrate, and then the gaps between the semiconductor wafers are sealed with resin and the plural semiconductor wafers are integrated to form A pseudo-wafer shaped like a wafer formed by a semiconductor process. On the pseudo wafer, a rewiring layer for providing I/O terminals is formed. After the plural semiconductor wafers are resin-sealed and integrated, the supporting substrate is peeled and removed. However, when you want to manufacture MCP with FO-WLP, because there is no image-recognizable pattern that can be used for position recognition in each mounting area of the semiconductor chip on the support substrate, it is suitable for the intermediate substrate. That kind of area identification method is not practical.

When region recognition is not performed, it is applicable to recognize the overall position of the support substrate by recognizing the alignment mark indicating the outline position of the support substrate or the position of the entire substrate, and each mounting area on the support substrate depends on the overall position of the support substrate A method of mounting a semiconductor chip (hereinafter referred to as the global identification method). In addition, the deviation of the mounting position of the semiconductor wafer of the MCP, for example, when considering a semiconductor wafer with a standard electrode pad diameter (20 μm) and a formation pitch (35 μm), the terminals of the semiconductor wafer and the rewiring layer formed Under the premise of ensuring the contact area between the terminals and avoiding the contact between adjacent terminals, it is desirable to suppress it to ±7 μm or less.

However, the mounting device required to mount a semiconductor chip on a substrate with alignment marks in each mounting area of the intermediate substrate, etc., is set to the global recognition method. When used in the FO-WLP process, the actual The mounting accuracy will have a mounting error of more than ±7μm, and a support substrate that does not have an alignment mark on each mounting area cannot mount a semiconductor wafer with high precision. Therefore, in the FO-WLP process using the global recognition method, there is no mounting device that can mount semiconductor wafers with a position accuracy of ±7 μm or less.

If only the mounting accuracy is improved, considering that on the support substrate used in the FO-WLP process, alignment marks are preset to correspond to each mounting area, and the area identification method is applied. However, the support substrate of FO-WLP is peeled and removed from the pseudo wafer after the pseudo wafer is formed, and cannot be used as a product. In order to support the substrate installation and marking equipment and process, it will not only increase the equipment cost, equipment installation space, and the number of processes. In the mounting process, it is also necessary to mark the identification area every time a semiconductor wafer is mounted. The time required for the mounting process of one semiconductor chip has also increased. From this point of view, the application of the area identification method increases the manufacturing cost of the semiconductor package, which undermines the advantages of WLP.

In addition, in order to cope with the mounting error of the semiconductor wafer, a technique of forming a rewiring layer in consideration of the mounting error of the semiconductor wafer has been proposed. In this technology, when the circuit pattern of the rewiring layer is exposed on the pseudo-wafer, the mounting error (the positional deviation from the ideal position) of each semiconductor wafer on the pseudo-wafer is individually measured before exposure, and the laser light for exposure is When scanning each semiconductor wafer, the position information of each circuit pattern included in the drawing data is corrected based on the mounting error of the semiconductor wafer to be exposed. This technology can also be applied to a single-chip package in which one semiconductor chip is assembled in one semiconductor package. However, in the case of MCP, since the circuit pattern drawing data is created by the package unit, when the relative positional deviation between semiconductor chips in the same package occurs, only the correction of the position information of the drawn circuit pattern cannot correspond.

Furthermore, the mounting equipment used in the FO-WLP process requires a reduction in the mounting time of semiconductor wafers. That is, the process of forming the rewiring layer on the suspected wafer is generally performed collectively for one suspected wafer, whereas the mounting process of the semiconductor wafer supporting the substrate is performed separately for each semiconductor chip. Considering the processing time, the mounting process of the semiconductor wafer requires time compared to the formation process of the rewiring layer, and it is required to shorten the mounting time of the semiconductor wafer. If only to shorten the mounting time, consider applying a mounting device with multiple mounting heads. However, if only the plural mounting heads are applied, the mounting accuracy of semiconductor wafers will be further reduced due to the influence of the movement error generated in each mounting head. Therefore, in the mounting device used in the FO-WLP process, it is required to improve the mounting accuracy of electronic components such as semiconductor wafers and shorten the mounting time.

In addition, the FO-WLP process is a process in which wafers are used on a wafer base called "wafer level", which is a support substrate. In contrast to this, recently, it has been proposed to use organic substrates such as glass and epoxy (FR-4) substrates used in the process of printed circuit boards (Printed Circuit Board) and glass substrates used in the manufacture of liquid crystal display panels as supporting substrates. The manufacturing process of the substrate base called fan-out, panel and package (FO-PLP).

In the FO-WLP process, as it is called wafer level, silicon wafers are used in the support substrate. This is because in the formation process of the rewiring layer, the equipment used in the formation process of the wiring layer of the silicon wafer can be used. Similarly, the wiring layer formation process is also used in the manufacturing process of the printed circuit board and the manufacturing process of the liquid crystal display panel. Therefore, the equipment used in the manufacturing process of the printed circuit board and the manufacturing process of the liquid crystal display panel can be used in the process of FO-PLP.

When an organic substrate and a glass substrate are used as the support substrate, it has the advantage of being able to cut costs compared with the case of using a silicon wafer. In addition, there is an advantage that the size of the support substrate can be larger than that of the silicon wafer. Because the larger the support substrate, the number of semiconductor packages such as MCP that can be produced at one time can be increased, which can improve productivity. Therefore, it is predicted that the requirements for the mounting device of electronic components applicable to the FO-PLP process will arise.

Among them, in the manufacturing process of the printed circuit board, the size of the copper clad laminate that becomes the base material is currently 1020×1020 mm or 1020×1220 mm. When a substrate with a side exceeding 1000 mm is used as a support substrate, it is estimated that the convenience of handling will be impaired. Therefore, in the FO-PLP process, it is predicted that the copper clad laminate will be used as a support substrate to the extent that it is divided into four. On the other hand, in the manufacturing process of liquid crystal display panels, it is difficult to use the 5th generation or more (about 1000×1200mm or more), especially the 7th generation or more (about 1900×2200mm or more) glass substrates (the so-called Therefore, it is estimated that the production equipment of the third to fourth generation (approximately 550×650 mm to 680×880 mm) that is not used due to the increase in the size of the liquid crystal display panel will be used. Therefore, in the FO-PLP process, the size of the support substrate required by the electronic component mounting device is approximately four times the size of the support substrate in the previous FO-WLP process of 300×300mm. About 600×600mm in size

When a semiconductor wafer is mounted on a support substrate having the above-mentioned size of 600×600 mm, the stage on which the support substrate is mounted becomes larger, and therefore the moving distance of the mounting head is increased. Therefore, the time required for the transportation of the semiconductor wafer becomes longer, and it is expected that the mounting efficiency of the semiconductor wafer will decrease. Also, in the case of MCP, that is, the case of mounting a plurality of semiconductor chips of different types, the time required for mounting depends on the size of the semiconductor chip and the type of adhesive used for the mounting of the semiconductor chip. Pressing time or pressing/heating time) are different, and the mounting efficiency of semiconductor wafers with a long mounting time will be affected. Therefore, the mounting efficiency of the entire package is reduced because of the long time required for mounting the semiconductor wafer. Therefore, in the mounting device used in the FO-PLP process, it is estimated that it is required to improve the mounting accuracy of electronic components such as semiconductor wafers, and to further shorten the mounting time corresponding to the increase in the size of the support substrate. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2008-041976 A [Patent Document 2] JP 2009-259917 A [Patent Document 3] International Publication No. 2007/072714 [Patent Document 4] JP 2013-058520 A

[The problem to be solved by the invention]

The problem to be solved by the present invention is to provide an electronic component mounting device and mounting method, and a manufacturing method of a package component to which the mounting method is applied. It is used for detection of positions not formed in each mounting area. A support substrate with a pattern such as a mark, particularly a support substrate that is expected to be enlarged, can also mount electronic components such as semiconductor wafers in each mounting area with high precision and efficiency. [Means to solve the problem]

The electronic component mounting device of the embodiment is an electronic component mounting device that mounts an electronic component on a support substrate, and includes: a stage section including: a mounting area having a plurality of mounting areas for mounting the electronic components The stage supporting the substrate, and a stage moving mechanism that moves the stage in the Y direction perpendicular to the X direction along one direction of the horizontal direction; and a mounting section including: arranged along the X direction and each The first and second mounting heads having plural mounting tools for holding the electronic components, and the first and second mounting heads for holding the electronic components are set along the X direction by the plural mounting tools The mounting head moving mechanism that moves on the mounting line; the first recognition part, which recognizes the entire position of the support substrate placed on the stage; the second recognition part, which recognizes the positions of the first and second parts The position of the electronic component of the plurality of mounting tools of the mounting head; the memory unit, which stores: stage correction data for correcting the movement position error of the stage caused by the stage moving mechanism, and correction of the mounting head movement The tool correction data for the movement position errors of the first and second mounting heads on each of the plurality of mounting tools on the mounting line caused by the mechanism; the control unit is based on the aforementioned recognition by the first recognition unit The position data of the support substrate, the stage correction data memorized in the memory section, the position data of the electronic components held in the plurality of mounting tools recognized by the second recognition section, and the memory memorized in the memory section Tool correction data to sequentially arrange the mounting areas of the supporting board along the X direction on the mounting line, and at the same time arrange the electronic components in the plural mounting areas of the mounting line The operations of the stage moving mechanism and the mounting head moving mechanism are controlled in a manner that the first and second mounting heads share the mounting.

The electronic component mounting method of the embodiment is an electronic component mounting method for mounting an electronic component on a support substrate, and includes: obtaining a stage for mounting a support substrate having a plurality of mounting areas for mounting the electronic component. The movement position error, the process of memorizing the stage correction data for the aforementioned movement position error to the memory unit; the first and second mounting heads arranged in the X direction along the horizontal direction, and the aforementioned electronics The movement position error of the plural mounting tools of the component is obtained on the mounting line set along the aforementioned X direction, and the tool correction data for correcting the movement position error is memorized in the aforementioned memory section; the aforementioned support is placed on the aforementioned stage Substrate, the process of recognizing the entire position of the support substrate placed on the stage; the process of correcting the stage based on the position data of the support substrate and the stage correction data obtained from the position identification process of the support substrate The process of moving the stage so that the rows of the mounting areas along the X-direction in the plural mounting areas are located on the mounting line according to the order; the first and second mounting The plurality of mounting tools of the head interactively accept the electronic components, identify the position of the electronic components held in the plurality of mounting tools, and at the same time correct the first step based on the position data of the recognized electronic components and the tool correction data. And the movement of the plural mounting tools of the second mounting head, and moving the first and second mounting heads on the mounting line, by the plural mounting tools of the first and second mounting heads The first and second mounting heads share the mounting process of the electronic component in the mounting area located on the mounting line.

The method of manufacturing a packaged component of the embodiment includes a process of separately mounting electronic components in a plurality of mounting areas of a support substrate, and forming a suspected wafer or a pseudo wafer by collectively sealing the electronic components mounted in the plurality of mounting areas The process of pseudo-panel, and the process of manufacturing packaged components by forming a rewiring layer on the aforementioned electronic component of the pseudo-wafer or pseudo-panel. In the manufacturing method of the package component of the embodiment, the mounting process of the electronic component includes: acquiring a movement position error of a stage on which the support substrate is placed, and storing stage correction data for correcting the movement position error in a memory unit The project; The first and second mounting heads are arranged in the X direction along one direction of the horizontal direction, and the movement position error of the plural mounting tools of the aforementioned electronic components is maintained, and the movement position error is set along the aforementioned X direction Obtained on the mounting line, and memorize the tool correction data for correcting the movement position error in the memory section; placing the support substrate on the stage and at the same time recognizing the entire position of the support substrate placed on the stage Process; Based on the position data of the support substrate and the correction data of the stage obtained from the position identification process of the support substrate, the movement of the stage is corrected, and at the same time, the movement of the stage along the X direction in the plural mounting area is corrected. The arrangement of the mounting area follows the process of moving the carrier in the way that it is located on the mounting line; using the plural mounting tools of the first and second mounting heads to interactively accept the electronic components, and the identification remains at the plural The position of the electronic component of the mounting tool is also corrected based on the recognized position data of the electronic component and the tool correction data to correct the movement of the plural mounting tools of the first and second mounting heads, and make the first The first and second mounting heads move on the aforementioned mounting line, and the aforementioned electronic components are moved by the aforementioned plural mounting tools of the aforementioned first and second mounting heads in the aforementioned mounting area on the aforementioned mounting line. The first and second mounting heads share the mounting process.

Hereinafter, the electronic component mounting apparatus and mounting method according to the embodiment will be described with reference to the drawings. The drawing is a schematic diagram, and the relationship between the thickness and the plane size, the ratio of the thickness of each part, etc. may be different from reality. In the description, the terms indicating the up-and-down direction, unless otherwise specified, indicate the relative direction when the mounting surface of the electronic component of the support substrate described later is used as the upper relative direction, and the terms indicating the left-right direction. The front view is used as the reference direction.

[Configuration of Mounted Device] 1 is a plan view showing the configuration of the electronic component mounting device of the embodiment, FIG. 2 is a front view of the mounting device shown in FIG. 1, and FIG. 3 is a right side view of the mounting device shown in FIG. 4 is a block diagram showing the configuration of the mounting device shown in FIG. 1. In FIGS. 1 to 3, based on FIG. 1, the left-right direction in the mounting device 1 is the X direction, the front-rear direction is the Y direction, and the vertical direction is the Z direction. The mounting apparatus 1 shown in these figures includes: a component supply unit 10 for supplying electronic components such as semiconductor wafers t, a stage unit 20 on which a support substrate W is placed on a stage 21, and a semiconductor wafer t from the component supply unit 10 The transfer section 30, the mounting section 40 that receives the semiconductor wafer t taken out by the transfer section 30 and mounts it on the support substrate W placed on the stage 21, and the control section 50 that controls the operations of the sections 10, 20, 30, and 40 .

(Parts Supply Department 10) The component supply unit 10 is arranged in the center of the front side of the base portion 1 a of the mounting device 1. The component supply unit 10 supplies a semiconductor wafer t as an electronic component mounted on the support substrate W. The component supply unit 10 is provided with: a wafer ring 11 for holding and attaching the resin sheet S of the semiconductor wafer T into each semiconductor wafer t, and the wafer ring 11 is detachably held by XY (not shown) The wafer ring holder 12 whose moving mechanism is movable in the XY direction. When the semiconductor wafer t is taken out by the transfer part 30, the taken-out semiconductor wafer t is lifted from the lower side of the wafer ring 11. Up the organization. The jack-up mechanism is fixedly installed at the position where the semiconductor wafer t is taken out by the transfer unit 30. As the jacking-up mechanism, a mechanism having a well-known structure can be used, for example, a mechanism described in JP 2010-056466 A.

The component supply unit 10 further includes a wafer ring 11 exchange device not shown. The exchange device is provided with: a storage section (the one provided with a plurality of structures for accommodating the wafer ring 11 in the vertical direction, also called a cassette) provided on the front surface of the base portion 1a, and is guided between the wafer ring holder 12 and the storage section The guide part of the wafer ring 11 being transported. The exchange device supplies the unused wafer ring 11 to the wafer ring holder 12, stores the wafer ring 11 after the removal of the semiconductor wafer t is completed in the storage part, and supplies the new wafer ring 11 to the wafer ring Bracket 12. In addition, for the supply and storage of the wafer ring 11, a wafer ring holding device 32 provided in the transfer unit 30 described later is used.

The electronic components mounted on the support substrate W are not limited to one type of semiconductor wafer t, but may be plural types of semiconductor wafers, semiconductor wafers, diodes, and capacitors. The mounting device 1 of the embodiment is suitable for mounting multiple types of electronic components including semiconductor wafers, diodes, capacitors, etc., on a support substrate W to manufacture MCP. Examples of the configuration of the MCP include plural types of semiconductor wafers, one type of semiconductor wafers, diodes, and capacitors, and plural types of semiconductor chips, diodes, and capacitors.

(Carrier 20) The stage part 20 is arrange|positioned at the back center of the base part 1a. The stage section 20 includes a stage 21 on which a support substrate W having a plurality of mounting regions is placed, and an XY moving mechanism 22 as a stage moving device that moves the stage 21 in the XY direction. The XY moving mechanism 22 makes the rows of the mounting area along the X direction of the support substrate W placed on the stage 21 sequentially positioned on a certain mounting area set on a straight line along the X direction as described in detail later The line method moves the stage 21. The XY moving mechanism 22 has the largest support substrate W that can be placed on the stage 21, and can be a little larger than 1/2 of the size of the support substrate W in the X direction in the X direction (1/2X+α) The movement stroke of the range of movement is a movement stroke that can move in the Y direction in a range that is a little larger (Y+α) than the size of the support substrate W in the Y direction. The stage 21 can suck and hold the supporting substrate W placed on it by a suction suction mechanism not shown.

The support substrate W placed on the stage 21 is, for example, a substrate used for the formation of a pseudo panel based on a pseudo wafer, which is suitable for the manufacture of FO-PLP, and is a glass substrate, an organic substrate (glass and epoxy) (FR-4) substrates, etc.), silicon substrates, metal substrates such as stainless steel, etc., but not limited to this. It is also possible to use a pseudo-wafer-formed substrate suitable for the manufacture of FO-WLP. The pseudo-panel is the same as the pseudo-wafer used in the manufacture of FO-WLP. In order to arrange the individual electronic components such as multiple semiconductor chips in a plane, the electronic components are sealed with resin to form a single plate state. By. Therefore, the shape of the support substrate W used for forming the pseudo-panel is not limited to a circular shape, and may be a quadrangular shape or other polygonal shapes, an elliptical shape, etc., and the shape is not particularly limited. As the support substrate W, it is preferable to apply the substrate used when manufacturing the MCP by the above-mentioned FO-PLP process, that is, a substrate on which a plurality of semiconductor chips and electronic components such as capacitors are mounted in each mounting area.

The support substrate W has a plurality of mounting areas for mounting electronic components such as semiconductor wafer t. However, the plural mounting regions are imaginary regions set on the support substrate W, and marks, patterns, etc., indicating the mounting regions are not formed. The support substrate W may include an alignment mark for global recognition that indicates the position of the entire substrate, but it does not include an alignment mark for area recognition that indicates the position of each mounting area. The global recognition method refers to a method in which electronic components are mounted on the multiple mounting regions on the substrate with a single substrate position detection when the electronic components are mounted on the multiple mounting regions of the support substrate W. The area recognition method refers to a method in which the position of the electronic component mounting area is detected every time the electronic component is mounted when the electronic components are mounted on the plurality of mounting areas on the support substrate W. In addition, the size of the supporting substrate W is preferably 300×300 mm or more. In this embodiment, a 600×600 mm supporting substrate W is used as an example. That is, in the mounting apparatus 1 of this embodiment, the stage 21 has a size that can mount a support substrate W of 600×600 mm.

(Transfer section 30) The transfer unit 30 includes a pair of left and right transfer units 30A, 30B, an intermediate stage 31, and a wafer ring holding device 32, and the two transfer units 30A, 30B are arranged in a left-right reversed state. The two transfer parts 30A and 30B are arranged separately on the front two sides of the base part 1a so as to sandwich the component supply part 10, and have the same configuration except that they are reversed left and right. In the following, the configuration of the left transfer portion 30A will be described, and the description of the configuration of the right transfer portion 30B will be omitted.

The transfer portion 30A includes a Y-direction moving device 33 extending from the front end of the base portion 1a to the vicinity of the center in the Y direction on the front left side of the base portion 1a. In the Y-direction moving device 33, the Y-direction moving block 34 is supported so as to move freely in the Y direction. On the back surface of the upper end side of the Y-direction moving block 34, a rectangular plate-shaped support 35 extending from the Y-direction moving block 34 in the horizontal direction of the X direction, that is, to the right in the figure is provided. The back side of the support 35 is provided with an X-direction moving body 36 that is supported to be movable in the X-direction by an X-direction moving device not shown, and has a rough crank shape in a plan view. The transfer head 37 is supported at the end of the X-direction movable body 36 in the right direction in the figure. In addition, at the end of the X-direction movable body 36 in the right direction in the figure, a wafer recognition camera 38 is provided on the surface opposite to the surface supporting the transfer head 37.

In the transfer head 37, in the X direction, the left and right two suction nozzles (transfer nozzles) 37a, 37b are provided so as to be freely movable in the vertical direction by the Z (vertical) direction moving devices 37c, 37d, respectively. The transfer head 37 is supported by the reversing mechanisms 37e, 37f so as to be able to individually reverse the suction nozzles 37a, 37b up and down. Thereby, the postures of the suction nozzles 37a and 37b can be selectively switched between the state where the suction surface of the semiconductor wafer t is held downward and the state where the suction surface is upward. The wafer recognition camera 38 is used to recognize the position of the semiconductor wafer t held in the wafer ring 11 of the component supply unit 10.

In addition, in the transfer section 30A on the left, the part number of the suction nozzle located on the outer side (left side in the figure) is set to 37a, and the part number of the Z-direction moving device located on the outer side is set to 37c, and the inverted position on the outer side The part number of the mechanism is set to 37e. However, the left and right transfer parts 30A and 30B are arranged in a state where they are reversed left and right. Here, in the transfer section 30B on the right side, since the right side of the figure is the outer side, the part number of the suction nozzle on the right side is set to 37a, and the part number of the Z-direction moving device on the right side is set to 37c. The part number of the reversing mechanism on the right is set to 37e. Among them, the transfer head 37 on the left is the first transfer head, and the transfer head 37 on the right is the second transfer head.

The intermediate stage 31 is used to temporarily place the semiconductor wafer t taken out by the suction nozzles 37 a and 37 b of the left and right transfer heads 37, and is provided at a substantially central position of the base portion 1 a between the component supply section 10 and the stage section 20. The intermediate stage 31 corresponds to the arrangement of the two suction nozzles 37a, 37b of the transfer heads 37 of the left and right transfer sections 30A, 30B, and includes four mounting sections 31a to 31d.

The wafer ring holding device 32 is used when the wafer ring 11 is supplied and stored in the wafer ring holder 12 of the component supply unit 10. The wafer ring holding device 32 is provided on the right end of the support 35 of the transfer portion 30A on the left side, and the surface on the opposite side to the surface on which the X-direction movable body 36 is provided, that is, the front surface. The wafer ring holding device 32 is provided with: a rod-shaped support arm 32a installed in the X direction by an X-direction moving device not shown such as an air cylinder, and a front end of the support arm 32a in the right direction of the figure. , Hold the clamping portion 32b of the wafer ring 11.

Such a transfer unit 30 sequentially takes out the semiconductor wafers t from the component supply unit 10 and transfers them to the mounting unit 40. When the transfer section 30 mounts the semiconductor wafer t face up (mounting the electrode surface of the semiconductor wafer t to the substrate), the semiconductor wafer t taken out from the component supply section 10 is received by the intermediate stage 31 When the semiconductor wafer t is mounted face down (the electrode surface of the semiconductor wafer t is mounted on the substrate), the semiconductor wafer t taken out from the component supply part 10 is attached to the nozzle 37a. , 37b is inverted up and down, and the state where the front and back sides of the semiconductor wafer t are reversed is transferred to the mounting section 40.

(Installation Department 40) The mounting section 40 is provided with two mounting sections 40A, 40B having the same configuration as the pair of left and right transfer sections 30A, 30B. The two mounting parts 40A and 40B are arranged separately on the rear sides of the base part 1a in a state of being reversed left and right so as to sandwich the stage part 20. Hereinafter, regarding the pair of left and right mounting portions 40, only the configuration of the mounting portion 40A on the left will be described, and the description of the configuration of the mounting portion 40B on the right will be omitted.

The mounting portion 40A includes a support frame 41 that extends from the rear end to the center of the base portion 1a in the Y direction on the rear left side of the base portion 1a and has a gate shape in a side view. On the right side of the support frame 41, the head support 42 is supported by the Y-direction moving device 41a so as to be freely movable in the Y direction. The head support 42 extends to the vicinity of the center of the base portion 1a toward the horizontal direction along the X direction, that is, the right direction in the figure. In front of the head support body 42, the mounting head 43 is provided by an X-direction moving device 42a that can move in the X direction.

The mounting head 43 is provided with two mounting tools 43a, 43b arranged in the X direction (left and right in the figure), holding and mounting the semiconductor wafer t on the support substrate W, and two mounting tools 43a, 43b separately Z-direction moving devices 43c and 43d that move in the Z direction. Among them, the Y-direction moving device 41a, the X-direction moving device 42a, and the Z-direction moving devices 43c, 43d constitute a mounting head transfer mechanism. Furthermore, the mounting section 40 includes an imaging unit 44 for imaging the semiconductor wafer t held by the mounting tools 43a and 43b.

The mounting tools 43 a and 43 b are provided at the same arrangement interval as the suction nozzles 37 a and 37 b of the transfer head 37. In addition, the mounting tools 43a and 43b, which suck and hold the semiconductor wafer t, are constituted by members that can see through the vertical direction. Thereby, the semiconductor wafer t sucked and held by the mounting tools 43a, 43b can be viewed from the upper side of the mounting tools 43a, 43b. The mounting tools 43a and 43b are equipped with a horizontal rotation device (not shown), and can rotate the semiconductor wafer t held by suction in a horizontal plane. Furthermore, among the mounting tools 43a and 43b, the mounting tool 43b located on the inner side (the center side of the base portion 1a) is equipped with a board recognition camera 43f as a first recognition unit. The substrate recognition camera 43f is used to image the alignment mark (global mark) of the support substrate W placed on the stage 21.

In addition, like the transfer part 30, the left and right mounting parts 40A and 40B in the mounting part 40 are also arranged in a left-right reversed state. Therefore, in the left and right mounting parts 40A and 40B, the part numbers of the mounting tools located on the outer sides (the mounting part 40A on the left side is the left side, and the mounting part 40B on the right side is the right side) are set to 43a, Set the part number of the Z-direction moving device located on the outside to 43c. Among them, the mounting head 43 on the left is the first mounting head, and the mounting head 43 on the right is the second mounting head.

The imaging unit 44 is provided with four wafer recognition cameras 44a to 44d as second recognition sections corresponding to the four mounting sections 31a to 31d at positions above the four mounting sections 31a to 31d of the intermediate stage 31. The wafer recognition cameras 44a to 44d can image the semiconductor wafer t placed on the mounting portions 31a to 31d, and can image the mounting tools moved below the wafer recognition cameras 44a to 44d through the mounting tools 43a, 43b. 43a, 43b semiconductor wafer t. The chip recognition cameras 44a to 44d are supported by a pair of XY moving devices 44e and 44f in a group of two to be movable in the XY direction. The two wafer recognition cameras (44a and 44b and 44c and 44d) are arranged at the same arrangement interval as the mounting tools 43a and 43b and the suction nozzles 37a and 37b. The pair of XY moving devices 44e and 44f are supported on the lower side of the beam part of the camera support frame 44g extending in the X direction and having a gate shape in the front view. The camera support frame 44g is provided at the front end portions of the upper surface of the left and right support frames 41 of the mounting part 40, bridged to the left and right support frames 41.

Such a mounting unit 40 receives the semiconductor wafer t taken out from the component supply unit 10 by the transfer unit 30 and mounts the received semiconductor wafer t on the support substrate W placed on the stage 21. At this time, the mounting tools 43a and 43b of the left and right mounting heads 43 mount the semiconductor wafer t on a fixed mounting line. This mounting line is a straight line imaginarily set in the X direction within the movement range of the stage 21 in the Y direction, and is managed by the coordinates used for the movement of the stage 21 and the mounting tools 43a and 43b. In other words, the mounting line is a collection of coordinate points on the X axis on a certain Y axis. In the support substrate W, usually, mounting areas are set in rows and columns along the XY direction. Therefore, when the semiconductor wafer t is mounted on the support substrate W, the stage 21 is moved and controlled so that the row of the mounting area along the X direction where the semiconductor wafer t is to be mounted is located on the mounting line. The mounting tools 43a and 43b are moved and controlled so as to mount the semiconductor wafer t on a predetermined mounting area among the mounting areas on the mounting line.

The mounting heads 43, 43 of the left and right mounting parts 40A, 40B are on the mounting line, respectively, and divide the mounting area on the support substrate W into two equal parts in the X direction, that is, two equal parts left and right, and divide the left area by The mounting head 43 on the left and the area on the right are shared by the mounting head 43 on the right while mounting the semiconductor wafer t in parallel. At this time, in order to prevent physical interference between the mounting heads 43, the minimum distance between the two mounting heads 43 and 43 can be limited by software or mechanically. The minimum distance that can be approached is called the "closest distance". In addition, the left and right mounting heads 43, 43 are positioned at the closest distance, and the mounting tools located on the outer side are connected to each other, that is, the left mounting tool 43a of the mounting head 43 on the left and the right mounting tool 43a of the mounting head 43 on the right. The distance between the mounting tools 43a is called "proximity interval". If the size of the support substrate W in the X direction is less than twice the length of the proximity interval, it is difficult to mount the semiconductor wafer t by the left and right mounting heads 43 simultaneously in the X direction of the support substrate W. of.

As shown in FIG. 5, there are four sets of combinations of the mounting heads 43, 43 on the left and right, and mounting tools 43a, 43b that are simultaneously mounted. The first example is a combination of the right mounting tool 43b of the mounting head 43 on the left side and the left mounting tool 43b of the mounting head 43 on the right side simultaneously mounting the semiconductor wafer t as shown in FIG. 5(A). The second example is a combination of the right mounting tool 43b of the mounting head 43 on the left side and the right mounting tool 43a of the mounting head 43 on the right side simultaneously mounting the semiconductor wafer t as shown in FIG. 5(B). The third example is a combination of the left mounting tool 43a of the mounting head 43 on the left side and the left mounting tool 43b of the mounting head 43 on the right side simultaneously mounting the semiconductor wafer t as shown in FIG. 5(C). The fourth example shown in FIG. 5(D) is a combination in which the left mounting tool 43a of the mounting head 43 on the left and the right mounting tool 43a of the mounting head 43 on the right simultaneously mount the semiconductor wafer t.

Among them, the combination with the longest distance L between the mounting tools 43a and 43b that are mounted at the same time is performed by the mounting tools 43a located outside the left and right mounting heads 43 as shown in FIG. 5(D) The combination of actual installation. Next, in this combination, the distance L between the mounting tools 43a in the state where the left and right mounting heads 43 are located at the closest distance is the above-mentioned "proximity interval". Therefore, when the length of the support substrate W in the X direction is less than twice the proximity interval, in the combination of FIG. 5(D), it becomes impossible to mount the semiconductor wafer t at the same time in the entire X direction of the support substrate W. In addition, in this embodiment, the proximity interval is 150 mm. That is, the distance L between the mounting tools 43a and 43b shown in FIG. 5(D) is 150 mm.

In addition, as the operation program of the mounting head 43, the combination of mounting tools 43a and 43b that are simultaneously mounted is limited to the combination of Figs. 5(A) to (C). When the combination of Fig. 5(D) does not exist, " The "close distance" is as shown in FIG. 5(B). The right mounting tool 43b of the left mounting head 43 and the right mounting tool 43b of the right mounting head 43 in the state where the left and right mounting heads 43 are at the closest distance The distance between the mounting tools 43a, or as shown in FIG. 5(C), the left and right mounting heads 43 are at the closest distance between the left mounting tool 43a of the left mounting head 43 and the right mounting head 43 The distance between the left mounting tool 43b.

(Control part 50) The control section 50 controls the operations of the component supply section 10, the stage section 20, the transfer section 30, and the mounting section 40 based on the control information stored in the memory section 51, and places the electronic components including the semiconductor chip t on the support substrate W Each installation area is installed in order. In the memory 51, there are stored: stage correction data for correcting the movement position error of the stage 21 obtained by the acquisition process of the movement position error of the stage 21 described later, and correction of the movement positions of the mounting tools 43a, 43b The tool correction data of the movement position error of the mounting tools 43a, 43b obtained by the error acquisition process controls the movement of the stage 21 and the mounting part 40 based on the correction data. In addition, the memory unit 51 also stores operation programs for mounting the semiconductor chip t on the support substrate W, the transfer unit 30, the mounting unit 40, and the like.

[The operation of the mounting device (the mounting of electronic parts)] Next, the mounting process of electronic components such as the semiconductor wafer t using the mounting apparatus 1 will be described. When electronic components such as semiconductor wafer t are mounted on each mounting area of the support substrate W, when only the global recognition method is applied, because the position of the mounting area is not recognized, the positioning accuracy of the semiconductor wafer t in each mounting area is Depends on the recognition accuracy of the global mark of the support substrate W, the machining accuracy of the XY moving mechanism 22 of the stage 21, etc., and the X-direction moving device 42a, Y-direction moving device 41a, and Z-direction movement of the mounting tools 43a, 43b The machining accuracy of the devices 43c, 43d, etc. However, the guide rails that guide the movement of the stage 21 or the mounting tools 43a, 43b are completed within a desired range with an accuracy of ±7 μm or less, which is substantially impossible in metal processing. More than this, it is even more impossible to assemble a guide rail with a desired length to a metal frame or the like in a straight manner of ±7 μm or less. Here, the movement position error of the stage 21 is measured, and data for correcting the movement of the stage 21 is acquired (corrected). In addition, the movement position error of the mounting tools 43a, 43b is measured on the mounting line, and data for correcting the movement of the mounting tools 43a, 43b is acquired (calibrated).

[Acquisition process (correction process (1)) of movement position error of stage 21 (stage correction data)] The data for correcting the movement position error of the stage 21 is obtained using the correction board 71 shown in FIGS. 6 and 7. The calibration substrate 71 is, for example, a substrate made of glass that is arranged in rows and columns at intervals of dot marks 72 for position recognition in advance. The dot marks 72 of the calibration substrate 71 are provided at intervals of 3 mm, for example, within a range of 600 mm in length×600 mm in width. The dot mark 72 is formed of a metal thin film or the like, and can be formed by film forming techniques such as etching and sputtering. The diameter of the dot mark is 0.2 mm, for example. The calibration board 71 is accurately set on the stage 21. Although the setting method of the calibration board 71 is not specifically limited, it implements by the method shown below, for example. Here, the calibration substrate 71 has the same size as the support substrate W, and the range where the dot marks are set is the same size as the range including all the mounting regions on the support substrate W.

(Setting of calibration board 71) The above-mentioned calibration board 71 is manually set on the stage 21 by the operator. The setting of the calibration board 71 is performed by performing parallel adjustment of the calibration board 71 (adjustment to make the arrangement direction of the dot marks 72 match the XY direction) after the calibration board 71 is placed on the stage 21. The parallel adjustment is performed by, for example, the board recognition camera 43f of the left mounting head 43 among the board recognition camera 43f for supporting imaging of the global mark of the board W. First, on the calibration substrate 71 placed on the stage 21, as shown in FIG. 6, the dot mark 72 located at the front left corner of the calibration substrate 71 becomes the center of the imaging field of view V of the substrate recognition camera 43f. Adjust the position of the stage 21.

From this state, the stage 21 is moved to the left in the X direction at a low speed (speed at which the dot mark 72 is slowly moved in the field of view V of the camera 22). At this time, the operator monitors the captured image of the board recognition camera 43f with a monitor, and stops the movement of the stage 21 if the position of the dot mark 72 captured by the board recognition camera 43f is shifted upward or downward from the imaging field of view V. , Manually adjust the inclination of the correction substrate 71 to a direction without deviation. The imaging field of view V in FIG. 6 shows an example of a state where the position of the dot mark 72 appearing in the imaging field of view V gradually shifts downward along with the movement of the stage 21.

After adjusting and calibrating the inclination of the substrate 71, the position of the stage 21 is adjusted so that the point mark 72 located at the front left corner becomes the center of the imaging field of view V of the substrate recognition camera 43f, and the stage 21 is moved to the left in the X direction at a low speed . The operator also monitors whether there is a deviation in the position of the point mark 72 with a monitor. Next, if there is a deviation in the position, the movement of the stage 21 is stopped, and the tilt of the correction substrate 71 is adjusted. Such an operation is repeated over the entire range of the movable range in the X direction of the stage 21 until the dot mark 71 does not exceed the imaging field of view V and is reflected on the monitor screen. The movement of the stage 21 by the operator is performed by the operation of the touch panel and the joystick.

(Acquisition of movement position error (correction data) of stage 21) Next, the position of the dot mark 72 of the calibration substrate 71 set on the stage 21 is recognized by the above-mentioned method using the substrate recognition cameras 43f of the left and right mounting heads 43 to obtain the movement position error of the stage 21 and the corresponding Correct the information. The recognition of the dot mark 72 is performed by moving the calibration board 71 in a state where the left and right board recognition cameras 43f are stopped at predetermined positions. The imaging of the dot mark 72 on the calibration substrate 71, for example, as shown in FIG. 7, from the dot mark 72 at the left end of the calibration substrate 71 (located on the rear side of the base portion 1a) toward the right side in the X direction with the dot mark 72 The placement interval of 3mm starts to move in pitch, and turns back in sequence toward the front (on the side of the front side of the base portion 1a) simultaneously. At this time, among the dot marks 72 on the calibration board 71, the dot mark 72 provided in the left half area is captured by the board recognition camera 43f on the left, and the dot mark 72 provided in the right half area is captured by the right board. The recognition camera 43f performs imaging.

Specifically, in a state where the stage 21 is positioned at the center of the movement stroke in the XY direction of the XY movement mechanism 22 (this position is referred to as the origin position), the board recognition camera 43f on the left is positioned on the left side of the calibration board 71. The center of the half-minute dot mark group (the position shown by the symbol 71A in FIG. 7), and the board recognition camera 43f on the right side is positioned at the center of the right half-minute dot mark group on the calibration board 71 (the position shown by the symbol 71B in FIG. ). From this state, while keeping the left and right board recognition cameras 43f in a stopped state, the operator observes the monitor while operating the XY moving mechanism 22 to mark the left half of the dot mark group with the upper left dot mark 72 on the left side board recognition camera The center of the imaging field of view V of 43f moves the correction board 71. Thereby, the upper left point mark 72 of the point mark group on the right half is located within the imaging field of view V of the board recognition camera 43f on the right. Among the left and right dot mark groups, the dot mark 72 on the upper left becomes the first dot mark 72.

After the first dot mark 72 is positioned at the center of the imaging field of view V of the board recognition camera 43f, the detection operation of the dot mark 72 by the left and right board recognition cameras 43f is started. After that, the automatic control of the control unit 50 is performed first. The detection operation is started by the operator pressing (touching) the start button of the detection operation displayed on the touch panel. After the detection operation of the dot mark 72 is started, first, the first dot mark 72 is captured. The captured image of the first dot mark 72 is processed by a known image recognition technique, and the positional deviation of the dot mark 72 with respect to the center of the imaging field of view V of the substrate recognition camera 43f is detected. The detected positional deviation is stored in the storage unit 51 as information paired with the moving position (XY coordinates) of the stage 21. After the position recognition of the dot mark 72 is completed, the stage 21 is moved in order to place the next (second) dot mark 72 within the field of view of the camera in accordance with the aforementioned movement sequence. In the example of FIG. 7, because the second dot mark 72 is located on the right side of the first dot mark 72, the stage 21 is moved 3 mm to the left in the X direction.

The movement of the stage 21 is performed based on the read value of the linear encoder of the XY movement mechanism provided on the stage 21. The scale meter of the linear encoder preferably uses a glass scale meter with a small thermal expansion coefficient as a thermal countermeasure. After the movement of the stage 21 is completed, the position deviation of the second point mark 72 is detected as with the first point mark 72a, and is stored in the memory 51 as information paired with the XY coordinates of the stage 21 at this time. The imaging of the dot mark 72 is performed after the stage 21 is stopped, and then after waiting for a time for the vibration generated when the stage 21 is stopped to subside. This operation is performed on all the dot marks 72 on the calibration substrate 71, and the movement position deviation data of the dot marks 72 corresponding to the respective positions are acquired, and stored in the memory unit 51 as stage correction data.

(Acquisition of correction data accompanying the thermal expansion of substrate W) In order to improve the bondability of the bonding die-bonding film used for the semiconductor wafer t, there is a case where a heater is provided on the stage 21 to heat the support substrate W. In this case, because the temperature of the support substrate W changes (rises) before and after the mounting on the stage 21, the support substrate W thermally expands due to this. If the support substrate W undergoes thermal expansion, even if the stage 21 and the mounting head 55 are moved with high precision, the extension of the support substrate W will cause a deviation in the mounting position.

Here, the amount of thermal expansion of the support substrate W caused by the heating of the heater is measured in advance and known in advance. When the semiconductor wafer t is mounted on the support substrate W, the coefficient (percentage) corresponding to the amount of thermal expansion obtained in advance is multiplied by the correction data And it is better to control the movement of the carrier 21. At this time, due to factors such as the shape and arrangement of the heater and the structure of the stage 21, the entire supporting substrate W does not necessarily expand uniformly, and the distribution of the thermal expansion can also be grasped. For example, the area on the support substrate W is divided into grid-like plural areas such as 10 rows×10 columns, and the thermal expansion amount (displacement due to thermal expansion at each measurement point) is measured for each divided area. Next, the coefficient of the correction data on the stage 21 may be switched to each area.

In addition, the amount of thermal expansion of the support substrate W is measured at each predetermined elapsed time after the support substrate W is placed on the stage 21 until the thermal expansion of the support substrate W becomes saturated with respect to the temperature of the stage 21, and is calculated in advance The coefficient of thermal expansion corresponding to each predetermined elapsed time may also be used. In this case, the coefficient corresponding to the amount of thermal expansion may be obtained for each area divided into a plurality of areas on the support substrate W. Next, when the semiconductor wafer t is mounted, at each elapsed time after the support substrate W is placed on the stage 21, the coefficient of the elapsed time is switched, and the coefficient is multiplied by the correction data to make the stage 21 mobile. Thereby, without waiting until the thermal expansion of the support substrate W becomes saturated with respect to the temperature of the stage 21, the semiconductor wafer t can be mounted on the support substrate W, and the semiconductor wafer t can be mounted with high efficiency, and High-precision implementation.

(Correction of the moving position of the stage 21) When the stage 21 is moved, among the stage correction data obtained by the acquisition process of the movement position error of the stage 21, refer to the stage correction obtained by the board recognition camera 43f provided with the mounting head 43 on the left. Data, the movement position of the stage 21 is corrected. The control unit 50 controls the XY moving mechanism 22 so that the rows of the mounting area along the X direction on the support substrate W placed on the stage 21 are sequentially positioned on the mounting line. At this time, the control unit 50 refers to the position information (XY coordinates) of the mounting area stored in the memory unit 51 and the above-mentioned stage correction data, and calculates the correction value required when the row of the mounting area is located on the mounting line. Next, the movement position of the stage 21 when the row of the mounting area is positioned on the mounting line is corrected only by the points of the calculated correction value. When the stage 21 has a heater, it is better to multiply the coefficient based on the amount of thermal expansion of the support substrate W by the correction data of the stage 21.

In addition, the stage correction data obtained by the board recognition camera 43f provided in the mounting head 43 on the right side is used to correct the movement position of the mounting head 43 on the right side. That is, because the board recognition cameras 43f of the left and right mounting heads 43 capture the dot marks 72 arranged on the same calibration board 71 at regular intervals, as long as the stage 21 (calibration board 71) moves in parallel, the left and right board recognition cameras 43f The position deviations of the point markers 72 recognized by the camera images should be consistent. However, when the stage 21 is moving, there may be a slight backlash in the horizontal plane, that is, a sway. In this case, even if the stage 21 is moved by correcting the movement error of the stage 21 using the stage correction data obtained by the board recognition camera 43f on the left, it is estimated that the mounting tools 43a, 43b of the mounting head 43 on the right are performed The installation accuracy may also be insufficient. Here, the movement position of the mounting head 43 on the right is based on the difference between the stage correction data obtained by the board recognition camera 43f on the left and the stage correction data obtained by the board recognition camera 43f on the right. Correction. Thereby, even when the stage 21 skews, the mounting accuracy of the left and right mounting heads 43 can be ensured.

[Acquisition process (correction process (2)) of movement position error of mounting tools 43a, 43b (the first tool correction data)] The data (first tool correction data) for correcting the movement position error in the XY directions of the mounting tools 43a and 43b is obtained using the correction board 71 in the same way as the correction of the stage 21. Therefore, it is sufficient to continue with the above-mentioned calibration process (1). The acquisition of this correction data is to be located in a region with a predetermined width in the Y direction centered on the mounting line in a state where the stage 21 is stopped at the origin position (Figure 7 shows the region with a dashed diagonal line, which is hereinafter referred to as " The position of the position point mark 72 in the correction data acquisition area Dt".) is recognized while individually moving the board recognition cameras 43f provided in the left and right mounting heads 43. The board recognition camera 43f of each mounting head 43 performs correction data within the range of a predetermined width set in the X direction in the X direction of the mounting head 43 for the entire movable range of the mounting head 43 in the X direction. The point mark in the area Dt is obtained. 72's camera.

Specifically, first, the board recognition camera 43f of the mounting head 43 on the left is moved to the left end of the movable range of the mounting head 43 on the left in the X direction, that is, behind the correction data acquisition area Dt. The dot mark 72 of is located at the center of the imaging field of view V of the board recognition camera 43f. In this state, the detection operation is started by the operator pressing (touching) the start button of the detection operation displayed on the touch panel.

After the detection operation starts, the board recognition camera 43f starts to move to the right in the X direction at the interval of the dot marks 72, and then turns back forward within the movable range in the X direction while sequentially imaging the correction data acquisition area Dt. Point mark 72. Next, the board recognition camera 43f recognizes the position of the point mark 72 in the same way as the above-mentioned acquisition of the stage correction data, and acquires the first tool correction data that is the correction data for correcting the movement positions of the mounting tools 43a, 43b, and stores it in the memory 51. The board recognition camera 43f of the mounting head 43 on the right also performs the same operation, and the first tool correction data of the mounting tools 43a, 43b of the mounting head 43 on the right are acquired and stored in the memory 51. In addition, the predetermined width of the correction data acquisition area Dt can be appropriately set in accordance with the size of the electronic component mounted on the support substrate W, but it is generally set within the range of 30 mm to 100 mm. In addition, the width of one minute of the electronic component may be sufficient.

The acquisition process of the stage correction data and tool correction data is basically carried out when the mounting device 1 is operated, and the movement of the stage 21 and the mounting head 43 may be controlled based on the measurement result. However, in the stage 21 and the mounting head 43, a heater or the like that assists the mounting of the semiconductor wafer t may be incorporated. In this case, the temperature of each part of the device may rise and the mechanical accuracy may decrease due to thermal expansion. In addition, as the mounting process of the semiconductor wafer t of the mounting device 1 progresses, the mechanical accuracy of each part of the device may be reduced due to heat generated by the motor of the moving device that moves the mounting head 43. Taking into account the movement error caused by the temperature rise, it is not limited to one time during the operation of the device, and it may be implemented regularly.

(Correction of the moving position of mounting tools 43a, 43b) The correction of the moving position when the left and right mounting heads 43 are moved will be described. First, when the left mounting head 43 is moved to the mounting position on the mounting line, among the first tool correction data obtained by the acquisition process of the movement position error of the mounting tools 43a, 43b, refer to the use of the left side The tool correction data acquired by the board recognition camera 43f of the mounting head 43 corrects the movement positions of the mounting tools 43a and 43b. The control unit 50 controls the movement of the mounting head 43 in the X direction in order to mount the semiconductor wafer t held by the mounting tools 43a, 43b in the mounting area on the mounting line in the row of the mounting area on the mounting line The device 42a and the Y-direction moving device 41a. At this time, the control unit 50 refers to the position information (XY coordinates) of the mounting area stored in the memory unit 51 and the first tool correction data, and calculates that the center of the semiconductor chip t coincides with the center of the mounting area The correction value required for positioning. Next, the movement positions of the mounting tools 43a and 43b when the semiconductor wafer t is mounted on the mounting area are corrected only by the calculated correction value.

In addition, the situation of the mounting head 43 on the right is also the same as the mounting head 43 on the left. Refer to the first tool correction data obtained by the board recognition camera 43f provided in the mounting head 43 on the right to correct the mounting tools 43a, 43b. move Place. In addition, in the present embodiment, in each mounting head 43, the relative positional relationship between the two mounting tools 43a, 43b and the board recognition camera 43f is preferably assembled within a certain accuracy by a jig or the like. Thereby, the positioning accuracy of the semiconductor wafer t and the like can be further improved.

[Acquisition process (correction process (3)) of movement position error of mounting tools 43a, 43b (second tool correction data)] Data for correcting the movement position error of the mounting tools 43a, 43b in the Z direction (the second tool correction data), after the correction process (1), (2), the state of the application stage correction data and the first tool correction data Next, with respect to the support substrate W or the test support substrate Ws, the semiconductor wafer t or the test wafer ts is mounted on the mounting line at a predetermined pitch, and the positional deviation from the target position of the mounted wafer is measured. Obtained.

Specifically, the supporting substrate Ws for testing is placed on the stage 21. Although the supporting substrate Ws for testing may be the supporting substrate W for manufacturing, it is sufficient if at least the mounting area can be secured on the mounting line, which is about the same as the correction data acquisition area Dt shown in FIG. 7 The size of the substrate is also possible. If the support substrate Ws is placed on the stage 21, the same operation as the transfer process of the semiconductor wafer t and the mounting process of the semiconductor wafer t described later will be used as a correction data acquisition along the mounting line preset mounting interval For example, the test chip ts is mounted with adhesive at intervals of 1 mm. The adhesive glue may be attached to the supporting substrate Ws in advance. The installation is carried out by means of global identification.

When the mounting of the test wafer ts is completed, the support substrate Ws is removed from the stage 21, and the mounting position deviation with respect to the target position of each wafer ts is measured by an inspection device not shown. The relevant data obtained in this way and indicating the relationship between the target position on the mounting line and the mounting position deviation with respect to the target position is stored in the memory 51 as the second tool correction data. This operation is performed individually for each mounting tool 43a, 43b of the left and right mounting heads 43, and the second tool correction data is acquired for each mounting tool 43a, 43b.

In addition, the set mounting interval is smaller than the size of the wafer t in the X direction. For example, when the mounting interval is 1 mm and the size of the wafer ts is 4×4 mm, the wafer ts cannot be continuously arranged on the mounting line. In this case, the position of the support substrate Ws is shifted in the Y direction, and the wafer ts is mounted along the mounting line in plural times. That is, first, the wafer ts is mounted along the mounting line at an interval larger than 4 mm. After that, the position of the supporting substrate Ws is moved in the Y direction by a distance greater than 4 mm. At this position, the wafer ts is mounted along the mounting line with a position shift of 1 mm in the X direction from the previous time. Repeat this action until the installation gap is filled.

In addition, the test wafer ts may be mounted on the test support substrate Ws with the area mark by the global recognition method, and the position deviation with respect to the mounting position of the mounted wafer ts may be recognized by the substrate recognition camera 43f.

(Correction of the moving position of mounting tools 43a, 43b) The correction of the moving positions of the mounting tools 43a and 43b will be described. When moving each mounting tool 43a, 43b on the mounting area on the mounting line, refer to the second tool correction data stored in the memory unit 51, that is, the target position on the mounting line and the mounting position relative to the target position. Based on the data related to the relationship between the two, the correction value is calculated from the value of the mounting position deviation corresponding to the mounting area. Then, only the points for calculating the correction value of the movement position of the mounting head 43 when the mounting tools 43a, 43b are moved to the mounting area are corrected. In addition, in the second tool correction data, when there is no target position that coincides with the position of the mounting area, for example, the mounting position deviation of two target positions adjacent to the position of the mounting area is calculated by linear or The polynomial interpolation can be used to calculate the correction value of the mounting position deviation corresponding to the position of the mounting area.

[Installation process of electronic components] After the above-mentioned calibration process (1) to (3), the process of mounting electronic components such as the semiconductor wafer t on the support substrate W is performed.

(1) Import process of wafer ring 11 First, the unused wafer ring 11 is carried into the wafer ring holder 12 from a storage portion not shown, and the wafer ring 11 is fixed to the wafer ring holder 12. At this time, as shown in FIG. 8, the support arm 32a of the wafer ring holding device 32 provided in the transfer portion 30A on the left side is moved to the right in the figure, and the clamping portion 32b is moved to the holding position of the wafer ring 11. . In this state, move to the position shown by the two-dot chain line, grasp the rear end of the wafer ring 11 in the storage portion, and move it to the position shown by the solid line, thereby removing the wafer ring 11 from the storage portion Pull out to move the wafer ring 11 to the wafer ring holder 12. If the wafer ring 11 is positioned on the wafer ring holder 12, the grip of the wafer ring 11 by the chuck portion 32b is released, the support arm 32a is moved to the left in the figure, and the clamp portion 32b is moved to the standby position. The wafer ring 11 located on the wafer ring holder 12 is held by a stretch mechanism (not shown) provided in the component supply unit 10 in a stretched state.

(2) Support the setting process of substrate W (2-1: Support the supply of substrate W) The support substrate W held by a transport robot (not shown) is supplied to the stage 21. The transport robot, not shown, is equipped with a transport arm for placing and holding a supporting substrate W, and the supporting substrate W is transferred from the left side of the mounting device 1 through the space under the door of the support frame 41 of the left mounting section 40A onto the stage 21 . After the support substrate W is supplied to the stage 21, the transfer arm is retracted from the mounting device 1. The supply process of the support substrate W and the loading process (1) of the wafer ring 11 may be performed in parallel, or may be performed separately.

(2-2: Checkout of global mark) The global mark of the supporting substrate W placed on the stage 21 is detected, and the position of the supporting substrate W is recognized. For example, as shown in FIG. 9, among the four corners of the support substrate W, the global marks A, B, and C provided at the three corners are sequentially captured by the substrate recognition cameras 43 provided in the left and right mounting heads 43. . Specifically, the global mark A located on the left rear of the support substrate W (upper left in FIG. 9) is positioned directly below the substrate recognition camera 43f of the mounting head 43 on the left, and the mounting head 43 on the left is connected to the mounting head 43. The stage 21 moves relatively, and the whole area is marked A. Next, the global mark B located on the right rear of the support substrate W (upper right in FIG. 9) is positioned directly below the substrate recognition camera 43f of the right mounting head 43, so that the right mounting head 43 and the stage 21 Relative movement, mark B of the whole camera. Finally, the global mark C located on the front right of the support substrate W (bottom right in FIG. 9) is positioned directly below the substrate recognition camera 43f of the mounting head 43 on the right, so that the mounting head 43 and the stage 21 Relative movement, mark C in the whole camera. Based on the captured image, the positions of the three global marks A, B, and C are detected. Based on the positions of the three global marks A, B, and C, the positional deviation in the XY direction and the θ direction ( Horizontal rotation direction) position deviation. The positional deviation of the support substrate W can be obtained by various known methods, and is not particularly limited to this method.

An example of how to detect positional deviation is described below. In FIG. 9, the solid line indicates the support substrate W actually placed on the stage 21. The two-dot chain line indicates the support substrate W in a state placed on the stage 21 without positional deviation. The support substrate W described by the two-dot chain line is an ideal state, and the center of the support substrate W at this time coincides with the center position O(x0, y0) of the stage 21.

First, the positions of the three global marks A, B, and C provided on the support substrate W are detected by a known image recognition technology, and the line connecting the global marks A and B is divided into the inclination θ1 of AB with respect to the X direction and the connected global The average value of the inclination θ2 of the line components BC marked B and C with respect to the Y direction is the inclination θ (=(θ1+θ2)/2) of the support substrate W. Next, using the center position O of the stage 21 as the center of rotation, the support substrate W is virtually rotated so that the inclination θ disappears. This state is indicated by a broken line in FIG. 9. The amount of movement (Δx1, Δy1) of the midpoint M1 (x1, y1) of the global markers A and C located at the diagonal at this time is obtained. The total value (Δx1 + Δx2, Δy1 + Δy2) of the calculated movement amount (Δx1, Δy1) and the difference between the midpoint M2 (x2, y2) and the coordinate O after the movement (Δx2, Δy2) is used as the support substrate Calculate the positional deviation of W in the XY direction.

If the positional deviation of the support substrate W on the stage 21 is calculated, the positional deviation is corrected, and the stage 21 is moved so that the row of the mounting area where the semiconductor wafer t is initially mounted on the support substrate W is located on the mounting line . Specifically, the stage 21 is moved to the position of the solid line shown in FIG. 10 so that the row of the mounting area located at the rear of the support substrate W is on the mounting line. In addition, in FIG. 10, the mounting line is represented by a dotted chain line for convenience. At this time, the movement of the stage 21 for positioning the rows of each mounting area on the mounting line is based on the data that corrects the positional deviation of the support substrate W obtained by the recognition of the global marks A, B, and C, and is stored in The stage correction data of the storage unit 51 is corrected. As in the present embodiment, when the XY moving mechanism 22 of the stage 21 does not have a θ stage (θ moving mechanism), the tilt of the support substrate W is adjusted by the θ adjustment mechanism provided in the mounting head 43 to adjust the mounted semiconductor wafer t The inclination of, to correct it.

(3) Transfer process of semiconductor wafer t (3-1: Position detection of semiconductor wafer t) After the wafer ring 11 is held by the wafer ring holder 12, the semiconductor wafer t that was first taken out on the wafer ring 11 is positioned at the take-out position. The take-out position is set at the center of the wafer ring holder 12 in the state shown in FIG. 10. The order of taking out the semiconductor wafer t on the wafer ring 11 is stored in the memory unit 51 in advance, and the control unit 50 controls the movement of the wafer ring holder 12 in accordance with the order. Therefore, after taking out the first semiconductor wafer t, the wafer ring holder 12 moves the wafer ring 11 pitch in accordance with the sequence memorized in the memory portion 51.

After the first semiconductor wafer t is located at the take-out position, in order to make the semiconductor wafer t and the next taken-out semiconductor wafer t adjacent to the semiconductor wafer t in the X direction, the wafer identification camera 38 of the transfer section 30A on the left is taken in In the imaging field of view, the Y-direction moving block 34 and the X-direction moving body 36 are moved. That is, the wafer recognition camera 38 has an imaging field of view of a size that simultaneously captures two adjacent semiconductor wafers t held on the wafer ring 11. The two alignment marks provided on the pair of corners of the semiconductor wafers t are imaged by the wafer recognition camera 38. The position of each semiconductor wafer t is detected based on the position of the two alignment marks of each semiconductor wafer t that is imaged. When the position of the semiconductor wafer t taken out first is deviated from the take-out position, the wafer ring holder 12 is moved to correct the position.

In addition, the detection of the positional deviation of the semiconductor wafer t located at the take-out position is not particularly limited, and can be carried out in accordance with various known methods. For example, from the captured images of two alignment marks provided at diagonal positions on the semiconductor wafer t, the position of each alignment mark is detected by a known image recognition technique. The inclination of the line connecting the two marks is obtained from the position of the obtained mark, and the inclination is compared with the inclination of the line connecting the connecting marks in the semiconductor wafer t stored in advance in the memory 51 without positional deviation, and the The difference is detected as the tilt deviation of the semiconductor wafer t. In addition, the difference between the actual midpoint position between the alignment marks and the midpoint position between the alignment marks of the semiconductor wafer t with no positional deviation stored in the memory portion 51 is taken as the positional deviation in the XY direction of the semiconductor wafer t Find out.

(3-2: Taking out the semiconductor wafer t) After recognizing the positional deviation of the two semiconductor wafers t, the left suction nozzle 37a of the transfer head 37 on the left side is moved to directly above the semiconductor wafer t at the take-out position. Next, the Z-direction moving device 37c is driven to lower the suction nozzle 37a, and the suction surface of the suction nozzle 37a is brought into contact with the upper surface (electrode formation surface) of the semiconductor wafer t. After the suction nozzle 37a abuts on the semiconductor wafer t, the semiconductor wafer t is suction-held to the suction nozzle 37a. The timing at which the suction nozzle 37a exerts the suction force may be set to an appropriate timing before the suction nozzle 37a abuts on the semiconductor wafer t, simultaneously with the abutment, or after the abutment.

After the left suction nozzle 37a suctions and holds the semiconductor wafer t, the suction nozzle 37a is raised to the original height. At this time, in accordance with the upward movement of the suction nozzle 37a, an unshown push-up mechanism is actuated to assist the separation of the semiconductor wafer t from the resin sheet S. After the left suction nozzle 37a sucking and holding the semiconductor wafer t is raised to the original height, or in parallel with the raising, the next semiconductor wafer t is positioned at the take-out position and the right suction nozzle 37b is positioned directly above the take-out position. In the right suction nozzle 37b, the semiconductor wafer t is taken out in the same manner as the left suction nozzle 37a.

After the left and right suction nozzles 37a and 37b of the transfer head 37 on the left suck and hold the semiconductor wafer t respectively, the left and right suction nozzles 37a of the transfer head 37 on the left are moved by the movement of the Y-direction moving block 34 and the X-direction moving body 36. , 37b is located on the placement portions 31a and 31b of the intermediate stage 31 as shown in FIG. In this state, the left and right suction nozzles 37a and 37b are lowered, and the semiconductor wafer t held by the left and right suction nozzles 37a and 37b is placed on the mounting portions 31a and 31b.

In addition, in the above-mentioned take-out process, there are cases where the semiconductor wafer t that should be taken out next to the semiconductor wafer t located at the take-out position does not exist, that is, the semiconductor wafer t located at the take-out position is the row of the semiconductor wafer t. In the case of terminal semiconductor wafer t. In this case, the semiconductor wafer t located at the head of the next row becomes the semiconductor wafer t to be taken out next. When the semiconductor wafer t is located in a range capable of taking in the imaging field of view of the wafer recognition camera 38, two semiconductor wafers t are simultaneously imaged. On the other hand, when it is not in the range where the imaging field of view can be captured, two semiconductor wafers t are separately captured. In the case of individual imaging, the imaging of the next (second) semiconductor wafer t may be performed before the removal of the first semiconductor wafer t located at the removal position, or may be performed after the removal of the first semiconductor wafer t.

(3-3: Acceptance of semiconductor wafer t) After the semiconductor wafer t is placed on the placement portions 31a, 31b of the intermediate stage 31, the mounting head 43 of the left mounting portion 40A moves to the intermediate stage 31, and as shown in FIG. 11, the left and right mounting tools 43a, 43b is located above the placing parts 31a and 31b. After the left and right mounting tools 43a, 43b are positioned on the mounting portions 31a, 31b, the Z-direction moving devices 43c, 43d are driven to lower the mounting tools 43a, 43b, and the mounting tools 43a, 43b abut against the semiconductor wafer t, respectively. After the mounting tools 43a and 43b abut on the semiconductor wafer t, the semiconductor wafer t is sucked and held to the mounting tools 43a and 43b. The timing of this suction holding may be set to an appropriate time before the mounting tools 43a, 43b abut on the semiconductor wafer t, at the same time as the abutment, or after the abutment. After the mounting tools 43a and 43b suck and hold the semiconductor wafer t, the mounting tools 43a and 43b are raised to their original heights by the Z-direction moving devices 43c and 43d. Thereby, two semiconductor wafers t are simultaneously received by mounting tools 43a and 43b.

Among them, in parallel with the transfer of the above-mentioned semiconductor wafer t, (3-1) and (3-2) of the process (3) are performed by the transfer section 30B on the right side. At this time, the same applies to the transfer head 37 on the right side. The suction nozzle 37a on the outer side (because the transfer head 37 on the left is inverted left and right, it is the suction nozzle 37a on the right side). Take out the wafer t. In addition, the take-out position where the transfer section 30 takes out the semiconductor wafer t from the component supply section 10 is a single position. Therefore, the removal of the semiconductor wafer t by the transfer portion 30A on the left and the removal of the semiconductor wafer t by the transfer portion 30B on the right are performed alternately.

(4) Mounting process of semiconductor wafer t (4-1: Position detection and movement of semiconductor wafer t) After the mounting tools 43a, 43b receive the semiconductor wafer t, the semiconductor wafer t held by the mounting tools 43a, 43b is picked up by the wafer recognition cameras 44a, 44b of the imaging unit 44 arranged above the mounting portions 31a, 31b. This imaging is performed through a member that can see through the mounting tools 43a and 43b. Based on the captured images of the wafer recognition cameras 44a and 44b, the position of the semiconductor wafer t sucked and held by the mounting tools 43a and 43b is detected. This position detection can be implemented using a known image recognition technology as in (3-1) of the above-mentioned process (3). Based on the detected position of the semiconductor wafer t, the positional deviation of the semiconductor wafer t is obtained.

In addition, the position detection of the semiconductor wafer t may be performed on the mounting portions 31a and 31b. At this time, after imaging the semiconductor wafer t by the recognition cameras 44a and 44b, the mounting tools 43a and 43b will suck and hold the semiconductor wafer t. After the imaging of the semiconductor wafer t by the recognition cameras 44a and 44b is completed, as shown in FIG. 12, the mounting tools 43a and 43b move above the row of the mounting area of the support substrate W on the mounting line along the X direction .

(4-2: Mounting of semiconductor wafer t) In the mounting head 43, among the left and right mounting tools 43a and 43b, the semiconductor wafer t held by the left mounting tool 43a is positioned on the mounting area of the mounting semiconductor wafer t held by the left mounting tool 43a. And move. At this time, because the semiconductor wafer t held by the left mounting tool 43a is the semiconductor wafer t that was initially mounted on the support substrate W, the left mounting tool 43a is moved to the row of the mounting area on the mounting line Located on the leftmost mounting area.

The moving position at this time is corrected based on the first and second tool correction data stored in the memory 51 and the positional deviation of the semiconductor wafer t calculated in the (4-1: position detection and movement of semiconductor wafer t) process . In the (2-2: detection of global mark) process, when the inclination θ of the support substrate W is detected, the inclination θ is also corrected by the mounting tool 43a. After that, the mounting tool 43a is lowered, and the semiconductor wafer t is mounted to a desired mounting area of the support substrate W.

The bonding of the semiconductor wafer t with respect to the support substrate W is performed by the adhesive force of the adhesive sheet and die attach film (Die Attach Film: DAF) attached to the surface of the support substrate W or the underside of the semiconductor wafer t in advance. The bonding of the semiconductor wafer t may be performed by installing a heater on the stage 21 in advance, and pressing the semiconductor wafer t against the heated support substrate W. The heater may be built in the mounting tool 43a. After only the semiconductor wafer t is pressurized for a predetermined time, the suction of the semiconductor wafer t is released, and the mounting tool 43a is raised to the original height.

After the mounting by the mounting tool 43a is completed, first move the mounting head in order to position the semiconductor wafer t held by the right mounting tool 43b on the mounting area of the semiconductor wafer t held by the right mounting tool 43b 43. After the semiconductor wafer t held by the right mounting tool 43b is positioned on the mounting area, the semiconductor wafer t is mounted on the mounting area by the same operation as the above-mentioned left mounting tool 43a. After the mounting of the semiconductor wafer t by the left and right mounting tools 43 a and 43 b is completed, the mounting head 43 on the left side moves to the intermediate stage 31.

Among them, in parallel with the mounting process of the semiconductor wafer t described above, (3-1) and (3-2) of the process (3) are performed by the transfer section 30A on the left. Therefore, when the mounting head 43 on the left side moves to the mounting portions 31a and 31b of the intermediate stage 31, the semiconductor wafer t subsequently mounted is placed on the mounting portions 31a and 31b. Therefore, the mounting head 43 moved to the left on the intermediate stage 31 immediately receives the semiconductor wafer t from the mounting portions 31a and 31b, and then executes (4-1) and (4-2) of the process (4). Thereafter, this operation is repeated until the mounting of the semiconductor wafer t in all the mounting regions on the support substrate W is completed.

Even in the middle of the mounting of the semiconductor wafer t performed by the mounting tools 43a, 43b of the mounting head 43 on the left, when the mounting portions 31c, 31d of the intermediate stage 31 are opposed by the transfer portion 30B on the right At the stage when the transfer of the semiconductor wafer t is completed, the mounting of the semiconductor wafer t by the mounting head 43 of the mounting portion 40B on the right side starts. This operation is the same as (4-2) of the above process (4) described in the example of the mounting part 40A on the left. In addition, the same applies to the mounting head 43 on the right side. The mounting tool 43a from the outside (because it is inverted left and right from the mounting head 43 on the left, it is the right side) performs the semiconductor wafer t in the order of the mounting tool 43b on the inside. Real installation. The same is true for the mounting of the semiconductor wafer t performed by the mounting section 40B on the right side. Similar to the mounting section 40A on the left, it is repeated until the mounting of the semiconductor wafer t in all mounting areas on the support substrate W is completed. The action.

At this time, the mounting portion 40A on the left and the mounting portion 40B on the right divide the area on the support substrate W into two equal parts on the left and right (X direction), and the respective areas are allocated to mount the semiconductor wafer t. Therefore, the mounting head 43 of the mounting section 40A on the left and the mounting head 43 of the mounting section 40B on the right can not only perform the above-mentioned process (4) (4-1) and (4-2) alternately, but also Simultaneously in parallel. In addition, in the mounting of the semiconductor wafer t described above, the movement of the stage 21 is also performed. That is, when the left and right mounting heads 43 mount the semiconductor wafer t in the mounting area of the support substrate W, the mounting tools 43a on the outside of each mounting head 43 are respectively set at predetermined positions on the mounting line (hereinafter referred to as Is the "mounting position".) The moving position is controlled by the method of mounting.

This mounting position is set as a position indicated by reference numerals 71A and 71B in FIG. 7 with respect to the support substrate W placed in a regular positional relationship on the stage 21 located at the origin position, for example. In this embodiment, the distance between the two mounting positions is set to "a distance of an integer multiple (n times) of the distance (2P) that is twice the distance (2P) of the placement interval of the mounting area (the distance between centers) P" . The distance (2P×n) between the mounting positions becomes more than the close interval, and the distance (2P×n) is set so that the distance (2P×n) is narrowed in accordance with the arrangement state of the mounting area of the support substrate W. What is important is that it is better to set the distance between the mounting positions at the value of (2P×n) that is the closest to the close interval or more. In this case, because the mounting position performed by the mounting tool 43a on the outside of each mounting head 43 is set at a fixed position on the mounting line, the stage 21 moves in the mounting area on the mounting line supporting the substrate W Here, the movement control is performed so that the mounting area where the semiconductor chip t is mounted by the outer mounting tool 43a is sequentially located at the mounting position. Of course, this movement control is performed by adding the stage correction data stored in the memory unit 51.

More specifically, first, the stage 21 is located in the row of the mounting area on the support substrate W on the mounting line, so that the semiconductor chip is initially mounted by the mounting tool 43a outside the mounting head 43 on the left. The mounting area of t moves in the order of the mounting position on the left. After the semiconductor chip t is mounted in the mounting area at the mounting position on the left, the mounting area next to the mounting area is mounted with the mounting tool 43b inside (right) of the mounting head 43 on the left Semiconductor wafer t. The movement when mounting the semiconductor wafer t with the inner mounting tool in the adjacent mounting area is performed by the movement of the mounting head 43 as described above. At this time, the mounting area where the semiconductor chip t is initially mounted by the mounting tool 43a on the outside (right) of the mounting head 43 on the right is located at the mounting position on the right. The tool 43a mounts the semiconductor wafer t, and then the semiconductor wafer t is mounted by the inner (right) mounting tool 43b.

When the semiconductor chip t is mounted by the mounting tool 43b inside (left) of the mounting head 43 on the right, the stage 21 is located in the row of the mounting area on the support substrate W on the mounting line so that The left mounting tool 43a moves the mounting area where the second semiconductor wafer t is mounted to the mounting position on the left side. In this case, the stage 21 sequentially positions the mounting area for mounting the semiconductor chip t at the mounting position by the left and right mounting tools 43a. During the mounting of a series of semiconductor wafers t by the mounting tools 43a, 43b of the left and right mounting heads 43 (the mounting of 4 semiconductor wafers t), the support substrate W is stopped at a certain position, and the next Before the mounting of the semiconductor wafer t (the mounting of the next four semiconductor wafers t), the support substrate W is moved by the stage 21 so that the next mounting area of the support substrate W is located at the mounting position. In addition, in the above-mentioned correction process (1), if there is a deviation in the position recognition result of the dot mark by the board recognition cameras 43f of the left and right mounting heads 43, the movement is performed to correct the deviation.

(5) Support the loading and unloading process of substrate W After the mounting of the semiconductor wafer t with respect to all the mounting areas on the support substrate W is completed, the transfer section 30 and the mounting section 40 are temporarily stopped, and the mounting of the support substrate W from the stage 21 of the support substrate W is completed. Unloading and loading onto the stage 21 that newly supports the substrate W. The carrying out of the support substrate W from the stage 21 is performed by a transport robot different from the transport robot described in the above process (2). The transfer robot intrudes from the right side of the mounting device 1 through the space under the door of the support frame 41 of the right mounting portion 40B, receives the support substrate W on the stage 21, and passes through one of the doors of the support frame 41 The space below will support the substrate W to be moved out. The carried out support substrate W is carried to the sealing process S2 described later. The new support substrate W is set on the stage 21 in the same manner as in the above-mentioned process (2).

(6) Exchange project of wafer ring 11 As mentioned above, by repeatedly mounting the semiconductor wafer t on the support substrate W, when the semiconductor wafer t on the wafer ring 11 is gone, the wafer ring 11 is exchanged with a new wafer ring 11. This exchange is performed using the wafer ring holding device 32 provided in the transfer part 30A on the left side, as in the above-mentioned process (1). That is, after the semiconductor wafer t on the wafer ring 11 is gone, the holding of the wafer ring 11 by the stretching mechanism (not shown) included in the component supply unit 10 is released. After that, the wafer ring holding device 32 stores the wafer ring 11 from the wafer ring holder 12 into the storage portion (not shown) in the reverse operation of the process (1), and then moves the new wafer ring 11 in the process (1). The wafer ring 11 is supplied to the wafer ring holder 12 from the storage part.

As shown in FIG. 13, there is a case where a plurality of semiconductor wafers t1 to t3 are mounted in one mounting area MA. In this case, as described above, after the mounting of the first semiconductor chip t1 is completed, the wafer ring 11 on which the second semiconductor chip t2 is mounted is set in the component supply section 10, and the mounting stage 21 is set to be completed. Support substrate W for one semiconductor wafer t1. Next, by performing the same operation as the above-mentioned operation, the mounting of the second semiconductor chip t2 is sequentially performed on each mounting area MA where the first semiconductor chip t1 is mounted. In this way, after the second semiconductor chip t2 is mounted on all the mounted mounting areas MA of the semiconductor chip t1, the wafer ring 11 on which the third semiconductor chip t3 is mounted is set in the parts supply unit 10, The stage 21 sets the support substrate W on which the semiconductor wafers t1 and t2 have been mounted, and the third semiconductor wafer t3 is mounted by the same operation. In this way, a plurality of semiconductor wafers t1 to t3 are mounted on each mounting area MA of the support substrate W.

When mounting a plurality of semiconductor wafers t1 to t3 in one mounting area MA, after mounting the first semiconductor wafer t1 on all support substrates W as described above, it is not limited to switching to the mounting of the second semiconductor wafer t2 method. For example, after completing the mounting of the first semiconductor wafer t1 on one support substrate W, the semiconductor wafer t supplied from the component supply unit 10 may be switched to the second semiconductor wafer t2. The same is true for the third semiconductor wafer t3. After the second semiconductor wafer t2 has been mounted on one support substrate W, it may be switched to the third semiconductor wafer t3. In other words, multiple types of semiconductor wafers t may be mounted in units of support substrate W. At this time, since the support substrate W is not removed from the stage 21 until the mounting of all types of semiconductor wafers t on one support substrate W is completed, the mounting accuracy of the plural types of semiconductor wafers t can be further improved.

In the method of mounting each type of semiconductor wafer t described above on all support substrates W, the support substrate W on which the semiconductor wafer t1 of the first type has been mounted is temporarily unloaded from the stage 21, and the semiconductor wafer of the second type is mounted. The wafer is then placed on the stage 21 at t2. Therefore, when the semiconductor wafer t1 of the first type is mounted and the semiconductor wafer t2 of the second type is mounted, the position of the support substrate W on the stage 21 is shifted, that is, the mounting position is shifted. Even if the same position is accidentally located on the stage 21, it will generally deviate. Although the position of the support substrate W is recognized by global recognition, there is a possibility of deviation in the recognition position of the support substrate W due to factors such as recognition errors. Therefore, it is estimated that only this part will cause the relative position accuracy between the first variety and the second variety to decrease. In contrast, when the semiconductor wafer t1 of the first type and the semiconductor wafer t2 of the second type are continuously mounted without removing the support substrate W from the stage 21, it is possible to prevent positional deviation due to identification errors. Therefore, the relative position accuracy between the first item and the second item can be improved.

The semiconductor wafer t mounted on the plural mounting regions of each support substrate W is not limited to one type. It is also possible to divide one support substrate W into a plurality of regions, and mount different types of semiconductor wafers t in each region. For example, the semiconductor wafer ta of type A may be mounted in the first area half-divided on one side of the support substrate W in the Y direction, and the semiconductor wafer tb of type B may be mounted in the second half-divided area. A type A semiconductor package is manufactured from the first area where the type A semiconductor wafer ta is mounted. The semiconductor package of type B is manufactured from the area where the semiconductor wafer tb of type B is mounted.

At this time, the semiconductor wafer ta of the A type and the semiconductor wafer tb of the B type have different circuit patterns for the rewiring layer formed in the post process, and therefore the exposure patterns for forming the rewiring are also different. Therefore, it is estimated that it will be more and more difficult to correct the mounting errors of the semiconductor wafers ta and tb by the exposure process. When the mounting apparatus and mounting method of the embodiment are applied, it is possible to perform mounting with high relative positional accuracy between the type A semiconductor wafer ta and the type B semiconductor wafer tb. Therefore, the exposure process for the area where the type A semiconductor wafer ta is mounted and the exposure process for the area where the type B semiconductor wafer tb is mounted can also be performed collectively, and the production efficiency can be improved.

When mounting type A semiconductor wafer ta in the first area and mounting type B semiconductor wafer tb in the second area, there are cases where the size of type A semiconductor wafer ta and type B semiconductor wafer tb are different, etc., type A When the mounting pitch of the product is different from the mounting pitch of the B product. In this case, when mounting a semiconductor wafer ta of type A and when mounting a semiconductor wafer tb of type B, by switching the feed rate of the stage 21, the plurality of types of semiconductor wafers ta and tb can be successfully transferred. It is mounted to the plural areas of the support substrate W. Similarly, in the first area of the support substrate W, the combination of the semiconductor chips of the C type and the D type constituting the first multiple chip package is mounted, and the E type and the F type constituting the second multiple chip package are mounted in the second area A combination of semiconductor wafers is also possible. In any of these mountings, each type of semiconductor wafer t may be mounted on a plurality of supporting substrates W, or plural types of semiconductor wafers may be mounted on a supporting substrate W unit. These specific installation projects are as mentioned above.

In addition, in these cases as well, the recognition of the global mark of the support substrate W may be performed once at first, and it is not necessary to recognize the support substrate W again when the semiconductor wafer t is moved from the mounting area from the first area to the second area. The global markup is fine. In addition, when a heater or the like is provided on the stage 21 to heat the support substrate W, the correction data of the stage 21 may be switched after the first area where the semiconductor wafer t is mounted first and then the second area where the semiconductor wafer t is mounted. Thereby, even when the amount of thermal expansion of the portion corresponding to the second area of the support substrate W increases during the mounting of the semiconductor wafer ta of the type A in the first area, the semiconductor wafer t(tb) can be The mounting accuracy is maintained at high precision.

When mounting plural types of semiconductor wafers t in units of the above-mentioned support substrate W, a wafer supply mechanism using tape feeders as the component supply unit 10 may be equipped with plural tape feeders corresponding to the plural types. When using a tape feeder, the transfer section 30A and mounting section 40A on the left and the transfer section 30B and mounting section 40B on the right are respectively equipped with dedicated wafer supply mechanisms on both sides of the package parts supply section 10. can. In this case, different types of semiconductor wafers t or different combinations of semiconductor wafers t can be supplied to the left and right transfer parts 30A, 30B and the mounting parts 40A, 40B. Therefore, it is effective when the above-mentioned support substrate W is divided into two regions to manufacture incompatible semiconductor packages.

The supporting substrate W on which the mounting of the above-mentioned one type of semiconductor wafer t, or plural types of semiconductor wafers t1, t2, t3, or semiconductor wafers ta, tb, etc. is completed is sent to the following post process to produce a semiconductor package The kind of packaged components. That is, the support substrate W on which the mounting of the semiconductor wafer is completed is sent to the sealing process and the rewiring layer formation process in order. In the sealing process, the gap between the semiconductor wafers mounted on the support substrate W is filled with resin, thereby forming a pseudo panel or pseudo wafer. The suspected panel or pseudo-wafer is sent to the formation process of the rewiring layer. In the process of forming the rewiring layer, the process of forming semiconductor wafers, the process of printed substrates, or the process of circuit formation in the process of display panels, that is, the process of coating photosensitive materials such as photoresist materials, and the exposure of photosensitive materials And the development process, the etching process, the ion implantation process, the photoresist stripping process, etc., through these processes, the rewiring layer is formed on the semiconductor wafer that is suspected to be a panel or a wafer. The suspected panel or pseudo-wafer forming the rewiring layer is sent to the dicing process, where the suspected panel or pseudo-wafer is sliced into pieces to manufacture the kind of package components for semiconductor packaging.

Therefore, the manufacturing method of the package component of the embodiment, as shown in FIG. 14, includes: a mounting process S1 for mounting electronic components on a plurality of mounting areas of the support substrate W, by mounting them in the plural mounting areas Sealing process S2 of sealing the electronic components to form a suspected wafer or pseudo-panel. S3 of rewiring process by forming a rewiring layer on the electronic components of the suspected wafer or pseudo-panel, cutting the suspected panel or pseudo-panel to produce packaged components The cutting works S4. The rewiring process S3 includes the above-mentioned photosensitive material coating process S31, photosensitive material exposure and development process S32, etching process S33, ion implantation process S34, photoresist peeling process S35, and the like. The electronic component mounting process in the manufacturing method of the package component of the embodiment is implemented based on the electronic component mounting method of the embodiment. In the method of manufacturing the package component of the embodiment, the electronic components mounted on each mounting area of the support substrate W may be one semiconductor wafer t, plural types of semiconductor wafers, or plural semiconductor wafers of the same type as described above. can. The variety and quantity of electronic components are not particularly limited.

In the mounting apparatus 1 of the above-mentioned embodiment, the two mounting heads 43, 43 on the left and the right are provided with two mounting tools 43a, 43b, respectively. Among the plural mounting areas on the support substrate W, the The semiconductor wafer t is mounted along several mounting areas on the mounting line preset in the X direction. At this time, the movement of the stage 21 by the XY movement mechanism 22 as the stage movement mechanism of the stage section 20 is performed by the stage correction which is obtained in advance and stored in the memory section 51 to correct the movement position error of the stage 21 The information is corrected. In addition, the movement of the Y-direction moving device 41a and the X-direction moving device 42a as the mounting head moving mechanism of the left and right mounting heads 43 on the mounting lines of the mounting tools 43a and 43b is used: obtained in advance and memorized in The memory 51 contains the first tool correction data as tool correction data for correcting the movement position errors of the left and right mounting tools 43a, 43b on each mounting line, and the mounting tool moved to the mounting position as a correction The second tool correction data of the tool correction data of the position error at the time of mounting performed by 43a and 43b is corrected.

Thereby, the left and right mounting heads 43, respectively, by means of two mounting tools 43a, 43b, respectively mount the semiconductor wafer t with respect to the support substrate W at different positions on the mounting line, the same can be applied to the support substrate W. The mounting error of the semiconductor wafer t in each mounting area above is reduced. In addition, by using the left and right mounting heads 43 respectively equipped with plural (2) mounting tools 43a and 43b to mount the semiconductor wafer t in the plural mounting regions of the support substrate W, the mounting time of one semiconductor wafer t can be achieved. (Man-hours required for the mounting of one semiconductor wafer t as the mounting device 1) are reduced. Therefore, reduction of man-hours and improvement of mounting accuracy can be achieved.

That is, in the mounting device 1 of the embodiment, the left and right mounting heads 43 are provided with two mounting tools 43a, 43b in total, and they are usually set along the arrangement direction (X direction) of the mounting tools 43a, 43b. The semiconductor chip t is mounted on a certain mounting line. Therefore, the mounting positions performed by the four mounting tools 43a, 43b are concentrated on one line, and the increase in mounting time based on the time required for the movement of the mounting tools 43a, 43b can be suppressed, and the application can be simplified as much as possible. The pattern of the movement position error of each mounting tool 43a, 43b generated during the movement of mounting. Thereby, the movement position accuracy of each mounting tool 43a, 43b can be ensured by a simple correction method, the reduction of mounting efficiency can be suppressed, and the mounting precision of the semiconductor wafer t can be improved.

In addition, since the movement position error of the stage 21 is corrected by the stage correction data, the stage 21 can be moved with high precision by a preset movement amount. Thereby, the positioning accuracy when each row of the mounting area of the support substrate W is located on the mounting line can be improved. Furthermore, when obtaining stage correction data, the positions of the dot marks 72 provided at equal intervals on one calibration substrate 71 are recognized at respective fixed positions by the substrate recognition cameras 43f provided on the left and right mounting heads 43. Thereby, it is possible to grasp the difference in the movement position error between different areas on the same stage 21, and the left and right mounting heads 43 can perform the semiconductor wafer t at different positions of the stage 21 (different positions on the mounting line). The mounting accuracy can also be ensured during mounting.

Therefore, it is possible to achieve a mounting accuracy of ±7 μm or less and a man-hour of 0.4 seconds or less at the same time. As a result, it is possible to mount the electronic components including the semiconductor wafer t with a mutual interval to a predetermined interval with high precision, with respect to the support substrate W in which the mark for position detection is not provided in each mounting area. Furthermore, electronic components including the semiconductor wafer t on the support substrate W can be mounted with high productivity. That is, through the simultaneous and parallel mounting of the left and right mounting parts 40A and 40B, the man-hours required for the mounting of the semiconductor chip t can be shortened, and at the same time, the mounting and the mounting of the semiconductor chip t on a certain mounting line The correction of the movement position of the stage correction data and the tool correction data can simultaneously achieve the effect of improving the mounting accuracy and preventing the reduction of productivity.

For example, consider not moving the stage 21 on which the support substrate W is placed, and moving the mounting tools 43a and 43b of the left and right mounting heads 43 in the respective mounting areas on the support substrate W in order, and the mounting tools 43a and 43b The side prepares correction data for the entire area on the protection support substrate W. In this case, compared with the case where the correction data is created on the substrate stage side, the correction data needs to be enlarged, and the time required for the correction becomes longer. That is, the mounting tools 43a and 43b are different from the substrate stage 21, and the up-and-down mechanism is necessary for mounting the semiconductor wafer t on the support substrate W. Therefore, when used as the correction data, in addition to the movement position error of the mounting head moving mechanism, the position deviation in the XY direction caused by the up and down movement of the mounting tools 43a and 43b should also be considered.

Here, when creating the correction data on the mounting head side, it is used when obtaining the stage correction data of the stage 21. At intervals shorter than 3mm, for example, the movement position error should be measured at short intervals such as 1mm pitch. necessary. If the displacement position deviation is measured at a pitch of 1mm with respect to a moving range of 600mm×600mm, a measurement of 600 points×600 points, that is, 360000 points is necessary. Compared with the case of measuring at a 3mm pitch (3mm pitch is 40,000 points), The measurement site becomes 9 times. Therefore, the measurement time also becomes 9 times. For example, in the mounting device 1 of the embodiment, if it takes about 4 to 5 hours to acquire the stage correction data, it takes 36 to 45 hours. This is not practical.

Therefore, the left and right mounting heads 43 are equipped with two mounting tools 43a and 43b in total, and are generally equipped to mount the semiconductor wafer t on a certain mounting line, and at the same time, the movement position error of the stage 21 is adjusted to the stage The mounting device 1 of the embodiment constructed to correct the correction data and the movement position error of the mounting tools 43a, 43b with the tool correction data is able to achieve the improvement of the mounting accuracy of the semiconductor chip t and the semiconductor chip The man-hour required for t's mounting is shortened, achieving high productivity and being extremely effective.

Among them, when the left and right mounting heads 43 are equipped with two mounting tools 43a and 43b, two semiconductor wafers t can be mounted with one reciprocation. This is different from the configuration with only one mounting head 43 and the left and right mounting heads. Compared with the configuration in which each mounting tool 43 is provided with one mounting tool, the total moving distance of the mounting head 43 can be simply shortened. This is effective in shortening the man-hours based on the shortening of the moving distance of the mounting head 43 when the supporting substrate W is enlarged to 600×600 mm or more. Furthermore, in the mounting device 1 of the embodiment, since the mounting of the four mounting tools 43a, 43b of the left and right mounting heads 43 in total is performed, the rows of the mounting area of the support substrate W are fixed at a certain level. By implementing the mounting line moving state, the moving distance of the mounting head 43 can be further shortened.

Also, even if the left and right mounting heads 43 are equipped with two mounting tools 43a and 43b, the mounting position is taken as a fixed position, and the mounting areas of the support substrate W are sequentially positioned at the fixed mounting positions. When the mounting head 43 alternately performs mounting of the semiconductor wafer t, while the semiconductor wafer is mounted by one mounting head, the other mounting head stands by. Among them, even if each mounting head is equipped with a plurality of mounting tools, the man-hour cannot be sufficiently shortened. Furthermore, that is, the mounting positions of the left and right mounting heads 43 are individually set to the left and right, and the support substrate cannot be moved until the mounting of the semiconductor wafer by the left and right mounting heads 43 is completed. In this case, there is a possibility that the waiting time of the mounting head may occur, which prevents shortening of working hours.

In the mounting apparatus 1 of the embodiment, the left and right mounting heads 43 are provided with two mounting tools 43a, 43b in total, and the semiconductor wafer t is usually mounted on a certain mounting line while adjusting the left and right mounting heads 43. It is possible to simultaneously mount semiconductor wafers by the left and right mounting heads 43 at the interval between the two. Furthermore, after the semiconductor wafer t is mounted by the one mounting tool 43a of the one mounting head 43, the mounting of the semiconductor wafer t by the other mounting tool 43b is implemented by moving the mounting head 43. Therefore, it is possible to shorten or reduce the waiting time when the semiconductor wafer t is mounted with the mounting heads 43 on the left and right. That is, the mounting of the semiconductor wafer t by the mounting tools 43a and 43b respectively provided in the left and right mounting heads 43 can be performed more efficiently. Thereby, it is possible to efficiently implement the mounting of electronic components such as the semiconductor wafer t by a total of four mounting tools 43a and 43b, and furthermore, it is possible to shorten the man-hours for the entire mounting device 1.

The mounting apparatus 1 of the above-mentioned embodiment, as shown in FIG. 13, mounts plural types of semiconductor wafers t1, t2, t3, etc., or mounts one type or plural types of semiconductor wafers t, and the like in one mounting area MA. Situations such as diodes or capacitors are effective. As mentioned above, when multiple types of electronic components are mounted in one mounting area, the relative positional deviation of the plural electronic components in one mounting area (package) may occur. Therefore, it is corrected in one mounting area (package). It is difficult to apply the mounting error technology applicable to a single chip package in which one semiconductor chip is incorporated in the mounting area (package). Therefore, it is necessary to improve the positional accuracy during mounting of a plurality of electronic components. In response to this point, since the mounting device 1 of the embodiment can improve the mounting accuracy of each electronic component including the semiconductor wafer t, even when a plurality of electronic components are mounted in one mounting area, it can be improved in one mounting area. The relative position accuracy of multiple electronic components in the area.

In addition, in the above-mentioned embodiment, description has been given of mounting the semiconductor wafer t on the supporting substrate W on a certain mounting line. The certain mounting line can be set at the same position in the Y direction that does not normally change in the mounting device 1. For example, it can also be a position that can be set and changed in the Y direction according to conditions such as the size of the supporting substrate W. . The mounting line set along the X direction may be held at a certain position at least from the start of the mounting of the electronic component to be mounted to the end of the mounting.

In addition, in the above embodiment, the stage correction data for correcting the movement error of the stage 21 may be acquired in the entire movable range of the stage 21, at least when each mounting area on the support substrate W is located in the mounting area. The position may be acquired within the range where the stage 21 moves. In addition, the tool correction data for correcting the movement position error of the mounting tools 43a, 43b can also be obtained in the entire movable range of the mounting tools 43a, 43b, at least in each mounting area on the support substrate W When the semiconductor wafer t is mounted, it may be acquired within the range of movement of the mounting tools 43a and 43b. Furthermore, the stage correction data and tool correction data can also use the actual measurement values of the movement position error of the stage 21 and the movement position error of the mounting tools 43a, 43b, or the correction value to offset the movement position error, etc. Measured value processor. The data is mainly used to correct the error of the moving position of the stage 21 and the mounting tools 43a, 43b.

In the mounting apparatus 1 of the above-mentioned embodiment, although the semiconductor wafer t is mounted on the support substrate W with the electrode formation surface (upper surface) facing upward as an example of surface-up mounting as the main description, it is not Limiting this, it is also applicable to face-down mounting of the semiconductor wafer t on the support substrate W with the electrode formation face down.

When the mounting device 1 of the embodiment is mounted face-down, the semiconductor wafer t taken out by the suction nozzles 37a and 37b of the transfer part 30 is not mounted on the intermediate stage 31, and the reversing mechanism 37e , 37f reverses the suction nozzles 37a, 37b up and down. In this state, the suction nozzles 37a and 37b are moved on the intermediate stage 31, and the semiconductor wafer t is transferred from the suction nozzles 37a and 37b to the mounting tools 43a and 43b of the mounting section 40.

The operation after receiving the semiconductor wafer t by the mounting tools 43a and 43b can be performed in the same manner as in the above-mentioned process (4). In addition, it is possible to use wafer recognition cameras 44a to 44d to detect the position of the semiconductor wafer t before mounting, but the camera that picks up the semiconductor wafer t held by the mounting tools 43a and 43b from the lower side is placed in The vicinity of the intermediate stage 31 or it may be arranged instead of the intermediate stage 31. why? In face-down bonding, although the semiconductor wafer t is held by the mounting tools 43a and 43b with the electrode forming surface facing down, the alignment mark of the semiconductor wafer t is usually provided on the electrode forming surface, and the wafer recognition camera 44a -44d cannot image the alignment mark of the semiconductor wafer t.

Here, if a camera is installed to image the semiconductor wafer t sucked and held by the mounting tools 43a and 43b from below, it is possible to directly image the alignment marks of the semiconductor wafer t sucked and held by the mounting tools 43a and 43b. When the wafer recognition cameras 44a to 44d are used, when the wafer recognition camera 38 detects the position of the alignment mark of the semiconductor wafer t, the positional relationship between the alignment mark and the outer shape of the semiconductor wafer t is recognized in advance. Next, after the semiconductor wafer t is sucked and held by the mounting tools 43a, 43b, the semiconductor wafer t is imaged by the mounting tools 43a, 43b by the wafer recognition cameras 44a to 44d, based on the shape of the semiconductor wafer t obtained from the captured image The position and the positional relationship between the previously recognized alignment mark and the outer shape position of the semiconductor wafer t may be detected, and the position of the semiconductor wafer t sucked and held by the mounting tools 43a and 43b may be detected.

In the above embodiment, an example in which two mounting tools 43a and 43b are respectively provided on the left and right mounting heads 43 has been described, but it is not limited to this, and the number of mounting tools may be three or more. However, since an increase in the number of mounting tools will increase the proximity interval, the size of the support substrate W on which the semiconductor chip t is mounted is preferably set. In the 600×600 mm supporting substrate W exemplified in this embodiment, the number of mounting tools relative to one mounting head 43 is preferably 2 to 3.

Furthermore, in the above-mentioned embodiment, an example is described in which one mounting head 43 is arranged on the left side as the first mounting head and one mounting head 43 is arranged on the right side as the second mounting head. A plurality of mounting heads 43 may be arranged separately. That is, the first and second mounting heads do not necessarily have to be constituted by a single mounting head, but may be constituted by a plurality of mounting heads. At this time, the plural mounting heads are arranged side by side in the Y direction and configured to be able to move independently in the XYZθ directions. In this case, the support frame 41 supporting the Y-direction moving device 41a may be shared by a plurality of mounting heads, or may be provided separately for each mounting head.

Furthermore, in the above-mentioned embodiment, the support substrate W is not provided with a mark for position detection in each mounting area. Although it is described that it is removed during the manufacturing process of the package component, it is not limited to this. According to the mounting device and mounting method of the embodiment, for example, each mounting area has a mark for position detection, that is, relative to a substrate used as a part of a package component, of course, there is no need to rely on the mark for position detection. , Can also mount semiconductor wafers (electronic components) with high accuracy and efficiency. [Example]

Next, examples of the present invention and evaluation results thereof will be described.

(Example 1) Using the mounting apparatus 1 of the above-mentioned embodiment, the semiconductor wafer is actually mounted on the support substrate under the following conditions. The target mounting accuracy is within ±7μm, and the target man-hour is within 0.45 seconds. <Installation conditions> ・The size of semiconductor wafer t: 4mm×4mm ・Number of mountings (vertical × horizontal): 14 pcs x 7 pcs per 1 mounting head (98 pcs in total) Each 1 mounting tool is 7×7 (total 49)×4 mounting tool ・Mounting pitch (vertical×horizontal): 12mm×60mm per mounting head Each mounting tool is 24mm×60mm ・Joint time: 0.1 second ・Joint load: 5N (Newton)

FIG. 15 is a virtual representation of the mounting area set on the support substrate W. As shown in FIG. However, only the global mark is provided on the actual support substrate W, and the mounting area cannot be seen. As shown in Fig. 15, on the support substrate W for measurement, 49 mounting tools 43a, 43b of the left and right mounting heads 43 are set at 7 positions in the X direction and 7 positions in the Y direction, respectively. area. Set the mounting area of the left mounting tool 43a of the left mounting head 43 with symbols A1 to A49, the mounting area of the right mounting tool 43b of the left mounting head 43 with symbols B1 to B49, and the left of the right mounting head 43 The mounting area of the mounting tool 43a is indicated by symbols C1 to C49, and the mounting area of the right mounting tool 43b of the right mounting head 43 is indicated by symbols D1 to D49.

In addition, together with the left and right mounting heads 43, the mounting area of the left mounting tool 43a is indicated by the white corners (□), and the mounting area of the right mounting tool 43b is shown by the black corners (■). In the left half of the support substrate W, set the mounting area of each mounting tool 43a, 43b of the left mounting head 43, and set the mounting area of each mounting tool 43a, 43b of the right mounting head 43 in the right half.装区. The mounting areas of the left and right mounting tools 43a, 43b are set to be alternately arranged in the X direction. The interval between the mounting areas is set to 12mm. That is, regarding the X direction, a total of 14 mounting areas are set at 12 mm intervals. Regarding the Y direction, 7 mounting areas are set at 60 mm intervals.

As shown in Fig. 15, together with the left half area and the right half area, the upper left mounting areas A1 and C1 are taken as the starting points, and the trajectory is turned back in the X direction indicated by the dotted arrow in the figure, by The left and right mounting tools 43a and 43b are mounted alternately. From the time when the mounting tools 43a and 43b of each mounting head 43 suck and hold the first semiconductor wafer t, the mounting tool 43a on the left side begins to descend toward the first mounting area A1, and the mounting tool 43b on the right side ends The elapsed time (referred to as the "mounting required time") until the time when the mounting and raising of the last (49th) semiconductor wafer t ended to the original height was 41.2 seconds. Thereby, the mounting position deviation of 98 semiconductor wafers t mounted on the support substrate W is measured by the inspection device. The results are shown in Table 1.

In Table 1, the symbols of the mounting area in FIG. 15 are represented by English letters and numbers, respectively. That is, the English letters (A, B, C, D) corresponding to the mounting tools 43a and 43b are described as the columns of the table, and the numbers are described as the rows of the table. The amount of positional deviation in the X direction and the Y direction of the semiconductor wafer t in each mounting area is shown for each mounting tool 43a, 43b. In addition, the unit is micrometer [μm]. Under the data of the mounting position deviation of the semiconductor wafer t of each mounting tool 43a, 43b, record the average, minimum, maximum, maximum, and minimum of the position deviation of each mounting tool 43a, 43b, respectively The width, σ value, and 3σ value of, the same value for all mounting position deviation data is recorded on the right side.

As shown in Table 1, the maximum value of the positional deviation in the X direction of the semiconductor wafer t is 3.1 μm of the mounting area number D1 caused by the right mounting tool 43b of the right mounting head 43, and the minimum value is the right mounting head 43 The mounting area number C35 caused by the left mounting tool 43a is -3.3μm. In addition, the maximum value of the position deviation in the Y direction is 3.2 μm of the mounting area number B2 caused by the right mounting tool 43b of the left mounting head 43, and the minimum value is caused by the right mounting tool 43b of the right mounting head 43 The mounting area number D43 is -2.8μm. It was confirmed that the mounting accuracy of 196 semiconductor wafers t was within ±7μm of the target. Since the time required for mounting is 41.2 seconds, the time required for mounting one semiconductor wafer t is 41.2 seconds/98 pieces=0.42 seconds. Therefore, the working hours are 0.42 seconds, and the number of production per hour is about 8570 (=3600 seconds/0.42 seconds).

(Comparative example 1) Except that the stage correction data and tool correction data are not used, the semiconductor wafer t is mounted on each mounting area of the support substrate W under the same conditions as in the first embodiment. Table 2 shows the results of the measurement of the mounting position deviation of the 196 semiconductor wafers t mounted on the support substrate W with the inspection device.

As shown in Table 2, the maximum value of the positional deviation in the X direction of the semiconductor wafer t is 8.8 μm of the mounting area number B7 caused by the right mounting tool 43b of the left mounting head 43, and the minimum value is the right mounting head 43 The mounting area number C43 caused by the left mounting tool 43a is -27.0μm. The maximum value of the position deviation in the Y direction is 23.7μm of the mounting area number C23 caused by the left mounting tool 43a of the right mounting head 43, and the minimum value is the mounting caused by the left mounting tool 43a of the right mounting head 43 Area number C45 is -22.7μm. In Comparative Example 1, it was confirmed that the mounting accuracy of the semiconductor wafer t was completely insufficient to be within ±7 μm of the target.

In addition, although several embodiments of the present invention have been described, these embodiments are merely examples and are not intended to limit the scope of the present invention. These novel embodiments can also be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the scope of the invention. These embodiments and their modifications are not only included in the scope and summary of the invention, but also include the invention described in the scope of patent application and its equivalent scope.

1‧‧‧Installation device 10‧‧‧Parts Supply Department 11‧‧‧Wafer Ring 12‧‧‧Wafer ring holder 20‧‧‧Stage Department 21‧‧‧ Stage 22‧‧‧XY moving mechanism 30, 30A, 30B‧‧‧Transfer Department 31‧‧‧Intermediate stage 37‧‧‧Transfer head 40, 40A, 40B‧‧‧Installation Department 41‧‧‧Support Framework 41a‧‧‧Y direction moving device 42a‧‧‧X direction moving device 43‧‧‧Mounting head 43a, 43b‧‧‧Mounting tools 43c, 43d‧‧‧Z direction moving device 43f‧‧‧Substrate recognition camera 44‧‧‧Camera unit 44a, 44b, 44c, 44d‧‧‧ chip recognition camera 50‧‧‧Control Department 51‧‧‧Memory Department W‧‧‧Support substrate t‧‧‧Semiconductor chip T‧‧‧Semiconductor wafer

[Fig. 1] A plan view showing the mounting device of the embodiment. [Fig. 2] A front view showing the mounting device of the embodiment. [Fig. 3] A right side view showing the mounting device of the embodiment. [Fig. 4] A block diagram showing the configuration of the mounting device of the embodiment. [Fig. 5] A diagram showing a combination of mounting operations performed by a mounting tool of the mounting device of the embodiment. [FIG. 6] A diagram showing the preparation process of the calibration process of the substrate stage and the mounting tool in the mounting device of the embodiment. [Fig. 7] A diagram showing a calibration process of the substrate stage and the mounting tool in the mounting device of the embodiment. [Fig. 8] A plan view showing an example of the operation state of the mounting device of the embodiment, and a diagram showing the operation state of an exchange wafer ring. [Fig. 9] A diagram for explaining the method of correcting the error in the moving position of the substrate stage in the mounting device of the embodiment. [FIG. 10] A plan view showing an example of the operating state of the mounting device of the embodiment, and a view showing a state where the left and right transfer heads and the left and right mounting heads are located at different positions. [Fig. 11] A front view showing the mounting device of the embodiment, with the parts supply unit and the left and right transfer units omitted. [Fig. 12] A front view showing the mounting device of the embodiment, with the parts supply unit and the transfer unit abbreviated as a whole. [Fig. 13] A plan view showing an example of electronic components mounted in one mounting area using the mounting device of the embodiment. [Fig. 14] A flowchart showing the manufacturing process of the package component of the embodiment. [FIG. 15] A plan view showing a support substrate for mounting a semiconductor wafer using the mounting devices of Example 1 and Comparative Example 1.

1‧‧‧Installation device

1a‧‧‧Base

10‧‧‧Parts Supply Department

11‧‧‧Wafer Ring

12‧‧‧Wafer ring holder

20‧‧‧Stage Department

21‧‧‧ Stage

22‧‧‧XY moving mechanism

30, 30A, 30B‧‧‧Transfer Department

31‧‧‧Intermediate stage

31a~31d‧‧‧Placement part

32‧‧‧Wafer ring holding device

32a‧‧‧Support arm

32b‧‧‧Clamping part

33‧‧‧Y direction moving device

34‧‧‧Move block in Y direction

35‧‧‧Support

36‧‧‧X-direction moving body

37‧‧‧Transfer head

37a, 37b‧‧‧Adsorption nozzle

37c, 37d‧‧‧Mobile device

37e、37f‧‧‧Reversing mechanism

38‧‧‧Wafer Identification Camera

40, 40A, 40B‧‧‧Installation Department

41‧‧‧Support Framework

41a‧‧‧Y direction moving device

42‧‧‧Head support

42a‧‧‧X direction moving device

43‧‧‧Mounting head

43a, 43b‧‧‧Mounting tools

43c, 43d‧‧‧Z direction moving device

43f‧‧‧Substrate recognition camera

44‧‧‧Camera unit

44a, 44b, 44c, 44d‧‧‧ chip recognition camera

44e, 44f‧‧‧A pair of XY mobile devices

44g‧‧‧Camera support frame

50‧‧‧Control Department

s‧‧‧resin sheet

t‧‧‧Semiconductor chip

T‧‧‧Semiconductor wafer

W‧‧‧Support substrate

Claims (5)

An electronic component mounting device for mounting electronic components on a support substrate includes: a stage portion including: a stage for mounting the support substrate having a plurality of mounting regions for mounting the electronic components, and A stage moving mechanism that moves the stage in the X direction, which is one of the horizontal directions, and the Y direction perpendicular to it; a mounting section including: a plurality of mounting tools that are arranged along the X direction and each have a plurality of mounting tools for holding the electronic components The first and second mounting heads, and the first and second mounting heads that hold the electronic components by the plurality of mounting tools move independently, and at the same time move on the mounting line set along the X direction Mounting head moving mechanism; a first recognition unit that recognizes the entire position of the support substrate placed on the stage; a second recognition unit that recognizes the plurality of real positions of the first and second mounting heads The position of the aforementioned electronic component of the mounting tool; the memory unit, which memorizes: the stage correction data for correcting the movement position error of the aforementioned stage caused by the aforementioned stage moving mechanism, and the correction of the aforementioned mounting caused by the aforementioned mounting head moving mechanism Online tool correction data of the movement position error of the first and second mounting heads in each of the plural mounting tools; the control unit based on the position data of the support substrate recognized by the first recognition unit, And the aforementioned carrier correction data stored in the aforementioned memory part The material, in a manner that the rows of the mounting areas along the X direction in the support substrate are sequentially arranged on the mounting line set along the X direction, and the stage that moves the stage is controlled The operation of the moving mechanism is based on the position data of the electronic components held in the plurality of mounting tools recognized by the second recognition unit and the tool correction data stored in the memory unit, so as to be placed on the mounting The plurality of the mounting areas in the row of the mounting area of the support substrate of the line, the first and second mounting heads share the mounting of the electronic components, and the first and second mounting heads are controlled The movement of the moving mechanism. The mounting device according to claim 1, wherein the stage has a size that can place the support substrate, and the support substrate has the actual position outside in the X direction of the first and second mounting heads. The dimension in the X direction that is at least twice the distance between the close proximity of the tools. The mounting device according to claim 1, wherein the stage has a size capable of placing the support substrate, and the support substrate has a size of 300 mm or more in the X direction. The mounting device according to any one of claims 1 to 3, wherein the mounting section mounts a plurality of the electronic components in one of the mounting areas of the support substrate. For example, the actual installation device described in any one of claim 1 to claim 3 is more Prepared by: a component supply unit that supplies the aforementioned electronic components; a transfer unit, which includes: the aforementioned plural realities that receive the aforementioned electronic components from the aforementioned component supply unit and deliver the aforementioned electronic components to the aforementioned first or second mounting head, respectively The first and second transfer nozzles for tools.

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