TW201911462A - Mounting device and mounting method of electronic component, and manufacturing method of package component - Google Patents

Abstract

The present invention provides a mounting device for mounting an electronic component accurately and efficiently on a support substrate on which the marks for position detection are not formed for each mounting region. A mounting device (1) according to an embodiment includes a stage part (20) for moving a stage (21) on which a support substrate (W) having a plurality of mounting areas is mounted, a mounting unit (40) for moving first and second mounting heads (43) having a plurality of mounting tools (43a, 43b), a first recognition unit that recognizes the entire position of the support substrate (W), and a second recognition unit that recognizes the position of the electronic component held by the mounting tools (43a, 43b). The movement of the stage (21) and the first and second mounting heads (43) is based on the position data of the support substrate (W) and the electronic component, and the correction data of the stage and the tools, so as to allocate the mounting area row in the X-direction mounting line. In addition, the electronic component is controlled so as to be shared and mounted by the first and second mounting heads (43) in a plurality of mounting areas.

Description

Mounting device and mounting method of electronic component, and manufacturing method of package component

Embodiments of the present invention relate to a mounting device and mounting method for an electronic component, and a method of manufacturing a package member.

Conventionally, a process of semiconductor package using an interposer (relay substrate) such as a CSP (Chip Size Package) and a BGA (Ball Grid Array) has been known. Further, a process called Wafer Level Package (LWP) which does not use an interposer and does not divide into semiconductor wafers and maintains a wafer state and is packaged is also known. The WLP has such an advantage that the thinning of the semiconductor package and the manufacturing cost can be reduced without using an interposer substrate.

In the WLP, a fan-in/wafer-level package is known in which a rewiring layer including an I/O terminal of a semiconductor package is formed on a semiconductor wafer so as not to protrude a region on the surface on which the electrode pad is formed. (fan in-WLP: FI-WLP). In addition, in recent years, a fan-out wafer-level package (fan out-WLP: FO-WLP) has been proposed in which a semiconductor wafer region is protruded to form a rewiring layer including an I/O terminal of a semiconductor package. The FO-WLP can also be applied to a multi-chip package (MCP) in which a semiconductor chip such as a RAM, a flash memory, or a CPU, or a plurality of types of electronic components such as a diode or a capacitor are mounted in one package. Attention.

Here, the MCP is a person who mounts a plurality of types of electronic components in one package as described above. In such an MCP, since variations in the mounting positions of the electronic components mounted on the same package affect the electrical characteristics of the package, the mounting of the electronic components requires high positional accuracy. In the process of the semiconductor package using the interposer substrate, since the alignment marks for position identification are provided on the respective mounting regions on the interposer substrate, the alignment marks are recognized in each of the mounting regions and the electronic components are A method of mounting and mounting the area (hereinafter referred to as an area identification method) to achieve high positional accuracy.

In the process of the FO-WLP, a plurality of semiconductor wafers are first mounted in a matrix on a support substrate, and then the gap between the semiconductor wafers is sealed with a resin and the plurality of semiconductor wafers are integrated, as formed by A wafer formed by a semiconductor process formed by a wafer. On the pseudo wafer, a rewiring layer for setting the I/O terminals is formed. After the plurality of semiconductor wafers are resin-sealed and integrated, the support substrate is peeled off and removed. However, when the MCP is to be fabricated by the FO-WLP, since there is no image recognition pattern that can be used for position recognition in each mounting region of the mounted semiconductor wafer on the supporting substrate, it is suitable for the interposer substrate. That way of identifying areas is not practical.

When the area recognition is not performed, it is possible to identify the entire position of the support substrate by identifying the alignment mark indicating the outer shape position of the support substrate or the position of the entire substrate, and the mounting area on the support substrate depending on the entire position of the support substrate. A method of mounting a semiconductor wafer (hereinafter referred to as a global identification method). Further, when the semiconductor wafer having the standard electrode pad has a diameter (20 μm) and a semiconductor wafer having a pitch (35 μm) in consideration of variations in the mounting position of the semiconductor wafer of the MCP, the terminal of the semiconductor wafer and the rewiring layer are formed. It is desirable to suppress the contact area between the terminals and the contact between the adjacent terminals, and it is desirable to suppress the contact area to ±7 μm or less.

However, in the mounting device required for mounting the semiconductor wafer on each of the mounting regions of the interposer or the like on the substrate having the alignment mark, the setting of the global identification method is applied, and when used in the process of the FO-WLP, The mounting accuracy produces a mounting error of more than ±7 μm, and the supporting substrate which is not provided with the alignment mark in each mounting area cannot mount the semiconductor wafer with high precision. Therefore, in the process of the FO-WLP to which the global identification method is applied, the mounting device capable of mounting the semiconductor wafer with a positional accuracy of ±7 μm or less does not exist.

If only the mounting accuracy is improved, it is considered that in the support substrate for the FO-WLP process, an alignment mark is provided in advance to correspond to each mounting area, and the area identification method is applied. However, the support substrate of the FO-WLP is removed from the pseudo wafer after forming the pseudo wafer, and cannot be used as a product. In order to provide a device and a project for forming a mark on the supporting substrate, not only the equipment cost, the installation space of the device, the number of engineering, and the like are increased, but in the mounting process, the identification area mark is required every time the semiconductor wafer is mounted. The operation time of one semiconductor wafer is also increased. From this point of view, the application of the area identification method increases the manufacturing cost of the semiconductor package and impairs the advantages of the WLP.

Further, in order to cope with the mounting error of the semiconductor wafer, a technique of forming a rewiring layer in consideration of a mounting error of the semiconductor wafer has been proposed. The technique is to separately measure the mounting error (position deviation from the ideal position) of each semiconductor wafer on the pseudo wafer before the exposure, in the case of the circuit pattern of the rewiring layer of the wafer, and to expose the laser light for exposure. When scanning each semiconductor wafer, the position information of each circuit pattern included in the drawing material is corrected based on the mounting error of the semiconductor wafer to be exposed. This technique is also applicable to a single-chip package in which one semiconductor wafer is incorporated in one semiconductor package. However, in the case of the MCP, when the drawing data of the circuit pattern is created in a package unit and the relative positional deviation between the semiconductor wafers in the same package occurs, the positional information of the circuit pattern to be traced is not matched.

Further, the mounting apparatus for the process of the FO-WLP requires shortening the mounting time of the semiconductor wafer. In other words, the formation of the rewiring layer on the suspected wafer is generally performed on one suspected wafer. On the other hand, the mounting process of the semiconductor wafer supporting the substrate is performed for each semiconductor wafer. In view of such processing time, since the mounting process of the semiconductor wafer requires time compared to the formation process of the rewiring layer, it is required to shorten the mounting time of the semiconductor wafer. If only the mounting time is shortened, it is considered to apply a mounting device having a plurality of mounting heads. However, the application of the plurality of mounting heads alone, because of the influence of the movement error generated in each of the mounting heads, makes the mounting accuracy of the semiconductor wafer even lower. Therefore, in the mounting apparatus for the process of the FO-WLP, it is required to improve the mounting accuracy of the electronic component such as the semiconductor wafer and the shortening of the mounting time.

In addition, the FO-WLP process is a wafer substrate called "wafer level", that is, a process for using a wafer on a support substrate. In contrast, recently, an organic substrate such as a glass/epoxy (FR-4) substrate used for a process of a printed circuit board and a glass substrate for manufacturing a liquid crystal display panel have been proposed as a support substrate. A process called a fan-out, panel, and package (FO-PLP) substrate substrate.

In the FO-WLP process, as called wafer level, germanium wafers are used on the support substrate. This is because the apparatus for forming the wiring layer of the tantalum wafer can be used in the formation process of the rewiring layer. Similarly, the wiring layer forming process is also used in the process of the printed substrate and the process of the liquid crystal display panel. Therefore, the apparatus for the process of printing a substrate and the process of the liquid crystal display panel can be used for the process of the FO-PLP.

When the organic substrate and the glass substrate are used for the support substrate, there is an advantage that the cost can be reduced as compared with the case of using the germanium wafer. Moreover, there is an advantage that the size of the support substrate can be made larger than that of the germanium wafer. Since the larger the supporting substrate, the number of semiconductor packages such as MCP that can be produced at one time can be increased, and productivity can be improved. Therefore, the requirements for the mounting device for predicting the electronic components to be used for the process of such FO-PLP are generated.

Among them, in the process of printing a substrate, the size of the copper-clad laminate which becomes a substrate is 1020×1020 mm or 1020×1220 mm. When a substrate having a length of more than 1000 mm is used as a support substrate, it is presumed that the handling of the damage is impaired. Therefore, in the process of the FO-PLP, it is predicted that the copper clad laminate is used as a support substrate by four divisions. On the other hand, in the process of the liquid crystal display panel, it is difficult to use a glass substrate of 5 generations or more (about 1000 × 1200 mm or more), in particular, 7 generations or more (about 1900 × 2200 mm or more) which is mainly used nowadays (so-called In the manufacturing equipment of the mother glass, it is estimated that a manufacturing facility of 3rd to 4th generation (about 550 x 650 mm to 680 x 880 mm) which is not used due to the enlargement of the liquid crystal display panel is used. Therefore, in the process of the FO-PLP, the size of the support substrate required for the mounting device of the electronic component is about 4 times larger than the size of the support substrate in the previous FO-WLP process of 300×300 mm. The size of around 600×600mm

When the semiconductor wafer is mounted on the support substrate having the size of 600 × 600 mm described above, the stage on which the support substrate is placed becomes large, so that the moving distance of the mounting head is increased. Therefore, the time required for the transfer of the semiconductor wafer becomes long, and it is expected that the mounting efficiency of the semiconductor wafer will be lowered. Further, in the case of the MCP, that is, a case where a plurality of semiconductor wafers having different types of semiconductors are mounted, the time required for mounting depends on the size of the semiconductor wafer and the type of the adhesive used for mounting the semiconductor wafer. The pressing time, the pressurization time, and the heating time are different, and the mounting efficiency of the semiconductor wafer having a long mounting time is affected. Therefore, the mounting efficiency of the entire package as a semiconductor wafer which is required for the mounting time is lowered. Therefore, in the mounting apparatus for the process of the FO-PLP, it is estimated that the mounting accuracy of the electronic component such as the semiconductor wafer is required to be improved, and the mounting time is required to be increased in accordance with the increase in the size of the supporting substrate. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. 2007-259917 (Patent Document 3).

[Problems to be solved by the invention]

The problem to be solved by the present invention is to provide an electronic device mounting device and a mounting method, and a method of manufacturing a package member to which the mounting method is applied, for which position detection is not performed in each mounting region. The support substrate of the pattern such as the mark, in particular, the support substrate which is expected to be enlarged, can also be mounted with high precision and high efficiency in electronic components such as semiconductor wafers in the respective mounting regions. [Means for solving problems]

The mounting device for an electronic component according to the embodiment is an electronic device mounting device that mounts an electronic component on a support substrate, and includes a stage portion that mounts a plurality of mounting regions having the electronic component mounted thereon a stage for supporting the substrate, and a stage moving mechanism that moves the stage in a Y direction perpendicular to the X direction in one direction in the horizontal direction; and a mounting portion that is disposed along the X direction and respectively a first and a second mounting head having a plurality of mounting tools for holding the electronic component, and the first and second mounting heads for holding the electronic component by the plurality of mounting tools are set along the X direction a mounting head moving mechanism that moves on the mounting line; the first identifying unit identifies the entire position of the support substrate placed on the stage; and the second identifying unit identifies and holds the first and second sides a position of the electronic component of the plurality of mounting tools of the head; the memory unit storing the stage correction data for correcting a movement position error of the stage caused by the stage moving mechanism, and correcting the foregoing a tool correction data of an error in a positional position of each of the plurality of mounting tools of the first and second mounting heads on the mounting line caused by the head movement mechanism; and a control unit that is identified by the first identification unit The position data of the support substrate, the table correction data stored in the memory unit, the position data of the electronic component held by the plurality of mounting tools recognized by the second identification unit, and the memory stored in the memory The tool correction data of the part is arranged such that the rows of the mounting regions along the X direction in the support substrate are sequentially arranged on the mounting line, and are disposed in the plurality of mounting regions of the mounting wires. The electronic component controls the operation of the stage moving mechanism and the mounting head moving mechanism so that the first and second mounting heads are shared.

The method of mounting an electronic component according to the embodiment is a method of mounting an electronic component in which an electronic component is mounted on a support substrate, and includes: a carrier for mounting a support substrate having a plurality of mounting regions on which the electronic component is mounted; Moving the position error, storing the stage correction data for correcting the movement position error in the memory unit; and setting the first and second mounting heads arranged in the X direction in one direction in the horizontal direction, and holding the electrons The movement position error of the plurality of component mounting tools is obtained on the mounting line set along the X direction, and the tool correction data for correcting the movement position error is memorized to the memory unit; the support is placed on the stage a substrate for simultaneously identifying the entire position of the support substrate placed on the stage; and correcting the stage by the position data of the support substrate obtained by the position recognition project of the support substrate and the stage correction data Moving while aligning the columns of the aforementioned mounting regions along the X direction in the plurality of mounting regions a method of moving the stage to move the stage; the electronic component is interactively received by the plurality of mounting tools of the first and second mounting heads, and the electronic component held by the plurality of mounting tools is identified And correcting the movement of the plurality of mounting tools of the first and second mounting heads based on the identified position data of the electronic component and the tool correction data, and the first and second mounting heads Moving on the mounting line, the electronic component is placed on the mounting area of the mounting line by the first and second mounting heads by the plurality of mounting tools of the first and second mounting heads Share the work of the installation.

In the method of manufacturing a package member according to the embodiment, the electronic component is mounted on a plurality of mounting regions of the support substrate, and the electronic component mounted on the plurality of mounting regions is collectively sealed to form a suspect wafer or The engineering of a panel, and the engineering of manufacturing a package component by forming a rewiring layer on the aforementioned electronic component of the suspect wafer or the pseudo panel. In the method of manufacturing a package member according to the embodiment, the mounting process of the electronic component includes: acquiring a movement position error of the stage on which the support substrate is placed, and memorizing the stage correction data for correcting the movement position error to the memory unit The first and second mounting heads respectively disposed in the X direction in one direction in the horizontal direction, and the movement position error of the plurality of mounting tools of the electronic component is maintained, and is set along the X direction. Acquiring on the mounting line, storing the tool correction data for correcting the movement position error in the memory unit; placing the support substrate on the stage and identifying the entire position of the support substrate placed on the stage And correcting the movement of the stage based on the position data of the support substrate obtained by the position recognition project of the support substrate and the stage correction data, and at the same time, the actual direction along the X direction in the plurality of mounting areas The column of the loading area is located in the manner of the above-mentioned mounting line, and the above-mentioned stage is moved; The plurality of mounting tools of the loading head exchange the electronic component, identify the position of the electronic component held by the plurality of mounting tools, and correct the foregoing based on the identified position data of the electronic component and the tool correction data. 1 and movement of the plurality of mounting tools of the second mounting head, and moving the first and second mounting heads on the mounting line, and the plurality of mountings of the first and second mounting heads The tool causes the electronic component to share the mounting work in the mounting area of the mounting line by the first and second mounting heads.

Hereinafter, a mounting device and a mounting method of an electronic component according to an embodiment will be described with reference to the drawings. The drawing is a schematic diagram, and the relationship between the thickness and the plane size, the ratio of the thickness of each part, and the like are different from the reality. In the description, the term "upward and downward direction" is used to indicate the relative direction when the mounting surface of the electronic component of the support substrate described later is the upper direction, and the term "left and right direction" is used. The front view is the direction of the datum.

[FIG. 1] FIG. 1 is a plan view showing a configuration of an electronic component mounting device according to an embodiment, FIG. 2 is a front view of the mounting device shown in FIG. 1, and FIG. 3 is a mounting device shown in FIG. The right side view of the apparatus, and Fig. 4 is a block diagram showing the configuration of the mounting apparatus shown in Fig. 1. In FIGS. 1 to 3, the left-right direction of the mounting device 1 is defined as the X direction, the front-rear direction is the Y direction, and the vertical direction is the Z direction. The mounting device 1 shown in the drawings includes a component supply unit 10 that supplies electronic components such as a semiconductor wafer t, a stage unit 20 on which the stage 21 of the support substrate W is placed, and a semiconductor wafer t that is taken out from the component supply unit 10. The transfer unit 30 and the semiconductor wafer t taken out by the transfer unit 30 are mounted on the mounting unit 40 of the support substrate W placed on the stage 21, and the control unit 50 that controls the operations of the respective units 10, 20, 30, and 40. .

(Component Supply Unit 10) The component supply unit 10 is disposed at the center of the front side of the base portion 1a of the mounting device 1. The component supply unit 10 supplies a semiconductor wafer t as an electronic component mounted on the support substrate W. The component supply unit 10 includes a wafer ring 11 that holds a resin sheet S that is singulated into a semiconductor wafer T of each semiconductor wafer t, and detachably holds the wafer ring 11 by XY (not shown). When the wafer ring holder 12 that is movable in the XY direction by the moving mechanism and the semiconductor wafer t are taken out by the transfer unit 30, the semiconductor wafer t to be taken out is lifted from the lower side of the wafer ring 11 and not shown. Starting the institution. The jacking mechanism is fixedly disposed at a take-out position of the semiconductor wafer t by the transfer unit 30. As the jacking mechanism, a mechanism having a known configuration can be used, and for example, a mechanism described in Japanese Laid-Open Patent Publication No. 2010-056466.

The component supply unit 10 further includes an exchange device of the wafer ring 11 (not shown). The exchange device includes a accommodating portion provided on the front surface of the base portion 1a (having a plurality of members accommodating the wafer ring 11 in the vertical direction, also referred to as 匣), and is guided between the wafer ring holder 12 and the accommodating portion. The guiding portion of the wafer ring 11 to be conveyed. The switching device supplies the unused wafer ring 11 to the wafer ring holder 12, stores the wafer ring 11 after the semiconductor wafer t is taken out to the storage portion, and supplies the new wafer ring 11 to the wafer ring. Bracket 12. Further, in the supply and storage of the wafer ring 11, a wafer ring holding device 32 provided in the transfer unit 30 to be described later is used.

The electronic component mounted on the support substrate W is not limited to one type of semiconductor wafer t, and may be a plurality of types of semiconductor wafers, semiconductor wafers, diodes, capacitors, and the like. In the mounting device 1 of the embodiment, a plurality of types of electronic components including a semiconductor wafer, a diode, and a capacitor are mounted on the support substrate W to manufacture an MCP. As a configuration example of the MCP, there are a plurality of semiconductor wafers, a semiconductor wafer, a diode, a capacitor, and the like, and a plurality of types of semiconductor wafers, diodes, and capacitors.

(Mounting Unit 20) The stage unit 20 is disposed at the center of the rear of the base portion 1a. The stage unit 20 includes a stage 21 on which the support substrate W having a plurality of mounting areas is placed, and an XY moving mechanism 22 as a stage moving device that moves the stage 21 in the XY direction. The XY moving mechanism 22 causes each row of the mounting region along the X direction of the support substrate W placed on the stage 21 to be sequentially placed in a certain mounting set on the straight line along the X direction, which will be described later in detail. The way of the line moves the stage 21. The XY moving mechanism 22 has a maximum support substrate W that can be placed on the stage 21, and is larger than a factor of 1 in the X direction of the support substrate W in the X direction (1/2X+α). The movement stroke of the range movement is a movement stroke in the Y direction that is larger than the size of the support substrate W in the Y direction (Y+α). The stage 21 can adsorb and hold the mounted support substrate W by a suction suction mechanism (not shown).

The support substrate W placed on the stage 21 is, for example, a substrate for forming a pseudo-panel based on a pseudo-wafer, and is a glass substrate or an organic substrate (glass/epoxy). (FR-4) substrate, etc.), ruthenium substrate, metal substrate such as stainless steel, etc., but not limited thereto. A substrate on which a wafer is formed, which is suitable for use in the manufacture of FO-WLP, may also be used. In the same manner as the pseudo wafer to be used in the manufacture of the FO-WLP, the electronic components such as the individual semiconductor wafers are arranged in a plane, and the electronic components to be placed are sealed with a resin to form a single plate. By. Therefore, the shape of the support substrate W used for the formation of the pseudo panel is not limited to a circular shape, and may be a polygonal shape or a polygonal shape other than a square shape or the like, and the shape thereof is not particularly limited. As the support substrate W, a substrate used for manufacturing the MCP by the above-described FO-PLP process, that is, a substrate in which a plurality of semiconductor wafers and electronic components such as capacitors are mounted in each mounting region is preferably used.

The support substrate W has a plurality of mounting regions in which electronic components such as semiconductor wafers t are mounted. However, the plurality of mounting regions are regions that are virtually set on the support substrate W, and marks, patterns, and the like indicating the respective mounting regions are not formed. The support substrate W may include an alignment mark for global identification indicating the position of the entire substrate, but does not include an alignment mark for area recognition indicating the position of each of the mounting regions. The global identification method refers to a method of mounting electronic components on a plurality of mounting areas on a substrate by detecting the position of the substrate once in the plurality of mounting areas of the support substrate W. The area identification method refers to a method of detecting the position of the mounting area of the electronic component each time the electronic component is mounted, when the electronic component is mounted on the plurality of mounting areas on the support substrate W. Further, the support substrate W preferably has a size of 300 × 300 mm or more. In the present embodiment, a 600 × 600 mm support substrate W is used as an example. In other words, in the mounting device 1 of the present embodiment, the stage 21 has a size in which the support substrate W of 600 × 600 mm can be placed.

(Transfer Unit 30) The transfer unit 30 includes a pair of left and right transfer units 30A and 30B, an intermediate stage 31, and a wafer ring holder 32, and the two transfer units 30A and 30B are arranged in a left-right direction. . The two transfer portions 30A and 30B are disposed apart from each other on the front side of the base portion 1a so as to sandwich the component supply portion 10, and have the same configuration except for the right and left inversion. Hereinafter, the configuration of the left transfer unit 30A will be described, and the description of the configuration of the right transfer unit 30B will be omitted.

The transfer unit 30A includes a Y-direction moving device 33 that extends from the front end portion of the base portion 1a to the vicinity of the center in the Y direction in the front left side of the base portion 1a. In the Y-direction moving device 33, the Y-direction moving block 34 is supported in a movable manner in the Y direction. The back surface on the upper end side of the Y-direction moving block 34 is provided with a rectangular plate-shaped support 35 extending from the Y-direction moving block 34 in the horizontal direction in the X direction, that is, in the right direction of the drawing. The back side of the support body 35 is provided with an X-direction moving body 36 that is supported by the X-direction moving device (not shown) so as to be movable in the X direction, and has a schematic crank shape in plan view. The transfer head 37 is supported at the end portion of the X-direction moving body 36 in the right direction. Further, a wafer identification camera 38 is provided on the surface of the X-direction moving body 36 in the right direction on the side opposite to the surface on which the transfer head 37 is supported.

In the transfer head 37, in the X direction, the left and right adsorption nozzles (transfer nozzles) 37a and 37b are movably provided in the vertical direction by the Z (up and down) direction moving devices 37c and 37d, respectively. The transfer head 37 is supported by the reversing mechanisms 37e and 37f so that the respective adsorption nozzles 37a and 37b can be individually inverted upside down. Thereby, the adsorption nozzles 37a and 37b can be selectively switched to maintain the state in which the adsorption surface of the semiconductor wafer t is facing downward and the state in which the adsorption surface is facing upward. The wafer identification camera 38 is for holding the position identification of the semiconductor wafer t of the wafer ring 11 of the component supply portion 10.

In the transfer unit 30A on the left side, the part number of the adsorption nozzle located on the outer side (the left side of the drawing) is 37a, and the part number of the Z-direction moving device located outside is 37c, and the reversal is located outside. The part number of the mechanism is set to 37e. However, the left and right transfer portions 30A and 30B are arranged in a state of being reversed left and right. Here, in the transfer unit 30B on the right side, since the right side of the drawing is outside, the part number of the adsorption nozzle located on the right side is 37a, and the part number of the Z-direction moving device located on the right side is 37c, and will be located. The part number of the reverse mechanism on the right side is set to 37e. The transfer head 37 on the left side is the first transfer head, and the transfer head 37 on the right side is the second transfer head.

The intermediate stage 31 is for temporarily placing the semiconductor wafer t taken out by the adsorption nozzles 37a and 37b of the left and right transfer heads 37, and is provided at a substantially central position of the base portion 1a between the component supply unit 10 and the stage unit 20. The intermediate stage 31 is disposed in accordance with the arrangement of the two adsorption nozzles 37a and 37b of each of the transfer heads 37 of the left and right transfer units 30A and 30B, and includes four mounting portions 31a to 31d.

The wafer ring holding device 32 is used when the wafer ring 11 is supplied and stored in the wafer ring holder 12 of the component supply unit 10. The wafer ring holding device 32 is provided on the surface on the opposite side to the surface on which the X-direction moving body 36 is provided, which is the end portion in the right direction of the support body 35 of the transfer portion 30A on the left side, that is, the front surface. The wafer ring holding device 32 includes a rod-shaped support arm 32a that is provided to be movable in the X direction by an X-direction moving device (not shown) such as an air cylinder, and a front end in the right direction of the support arm 32a. The holding portion 32b of the wafer ring 11 is held.

The transfer unit 30 sequentially takes out the semiconductor wafer t from the component supply unit 10 and transfers it to the mounting unit 40. When the semiconductor wafer t is mounted face up (the electrode surface of the semiconductor wafer t is mounted upward to the substrate), the semiconductor wafer t taken out from the component supply portion 10 is received by the intermediate stage 31. When the semiconductor wafer t is mounted face down (the electrode surface of the semiconductor wafer t is mounted downward to the substrate), the semiconductor wafer t taken out from the component supply portion 10 is brought to the adsorption nozzle 37a. 37b is reversed upside down, and the state in which the inside of the semiconductor wafer t is inverted is received in the mounting unit 40.

(Mounting Unit 40) The mounting unit 40 includes two mounting units 40A and 40B having the same configuration, similarly to the pair of left and right transfer units 30A and 30B. The two mounting portions 40A and 40B are disposed to be vertically separated from each other on the rear sides of the base portion 1a so as to sandwich the stage portion 20, respectively. Hereinafter, the configuration of the left and right mounting portions 40A will be described with respect to the pair of right and left mounting portions 40, and the description of the configuration of the right mounting portion 40B will be omitted.

The mounting portion 40A includes a support frame 41 that extends from the rear end portion to the center portion of the base portion 1a in the Y direction on the left rear side of the base portion 1a, and has a gate shape when viewed from the side. The head support 42 is supported by the Y-direction moving device 41a so as to be movable in the Y direction on the side of the right side of the support frame 41. The head support body 42 extends toward the horizontal direction in the X direction, that is, in the right direction of the drawing, to the vicinity of the center of the base portion 1a. On the front side of the head support 42, the mounting head 43 is provided by the X-direction moving device 42a which is movable in the X direction.

The mounting head 43 includes two mounting tools 43a and 43b that are arranged in the X direction (left and right of the drawing), and that are attached to the support substrate W by the semiconductor wafer t, and the two mounting tools 43a and 43b are individually provided. The Z-direction moving devices 43c and 43d that move in the Z direction. Among them, the Y-direction moving device 41a, the X-direction moving device 42a, and the Z-direction moving devices 43c and 43d constitute a solid head transfer mechanism. Further, the mounting unit 40 includes an imaging unit 44 for imaging and holding the semiconductor wafer t held by the mounting tools 43a and 43b.

The mounting tools 43a and 43b are provided at the same arrangement intervals as the adsorption nozzles 37a and 37b of the transfer head 37. Further, the mounting tools 43a and 43b are configured to be capable of absorbing and holding the semiconductor wafer t by means of a member that can see through the vertical direction. Thereby, the semiconductor wafer t adsorbed and held by the mounting tools 43a and 43b can be viewed from the upper side of the mounting tools 43a and 43b. The mounting tools 43a and 43b include a horizontal rotating device (not shown), and can rotate the semiconductor wafer t held and held in the horizontal plane. Further, among the mounting tools 43a and 43b, the mounting tool 43b located inside (the center side of the base portion 1a) is attached with the substrate identifying camera 43f as the first identifying unit. The substrate identification camera 43f is used to image an alignment mark (global mark) of the support substrate W placed on the stage 21.

Further, similarly to the transfer unit 30, the left and right mounting portions 40A and 40B in the mounting portion 40 are also disposed in a state of being reversed left and right. Therefore, in the left and right mounting portions 40A and 40B, the component numbers of the mounting tools located on the outer sides (the left mounting unit 40A is the left side and the right mounting unit 40B is the right side) are 43a. The part number of the Z-direction moving device located outside is set to 43c. Among them, the mounting head 43 on the left side is the first mounting head, and the mounting head 43 on the right side is the second mounting head.

The imaging unit 44 includes four wafer identification cameras 44a to 44d as second identification portions corresponding to the four mounting portions 31a to 31d at positions above the four mounting portions 31a to 31d of the intermediate stage 31. The wafer identification cameras 44a to 44d can image and hold the semiconductor wafer t placed on the mounting portions 31a to 31d, and can be image-held by the mounting tools 43a and 43b to be mounted on the lower surface of the wafer identification cameras 44a to 44d. Semiconductor wafer t of 43a, 43b. The wafer identification cameras 44a to 44d are supported by a pair of XY moving devices 44e and 44f so as to be movable in the XY direction in groups of two. The two sets of wafer identification cameras (44a and 44b and 44c and 44d) are arranged at the same arrangement intervals as the mounting tools 43a, 43b and the adsorption nozzles 37a, 37b. The pair of XY moving devices 44e, 44f are supported by the lower side of the portion of the beam extending in the X direction to indicate the front view of the camera support frame 44g. The camera support frame 44g is provided at the front end portion of the upper surface of the left and right support frames 41 of the mounting portion 40, and is bridged to the left and right support frames 41.

The mounting unit 40 receives the semiconductor wafer t taken out from the component supply unit 10 by the transfer unit 30, and mounts the received semiconductor wafer t on the support substrate W placed on the stage 21. At this time, the mounting tools 43a and 43b of the left and right mounting heads 43 mount the semiconductor wafer t on a fixed mounting line. The mounting line is a line that is virtually set in the X direction within the movement range of the stage 21 in the Y direction, and is managed by coordinates for the movement of the stage 21 and the mounting tools 43a and 43b. That is, the mounting line is a collection of coordinate points on the X-axis that lie on a certain Y-axis. In the support substrate W, generally, the mounting area is set in a matrix in the XY direction. Therefore, when the semiconductor wafer t is mounted on the support substrate W, the stage 21 is moved and controlled so that the row of the mounting region in the X direction in which the semiconductor wafer t is to be mounted is placed on the mounting line. The mounting tools 43a and 43b are moved and controlled so as to mount the semiconductor wafer t on a predetermined mounting area among the mounting areas located on the mounting line.

The mounting heads 43 and 43 of the left and right mounting portions 40A and 40B are equally divided on the mounting line by the mounting area on the support substrate W in the X direction, that is, the left and right sides are equally divided, and the left side area is On the left side of the mounting head 43, the right side area is shared by the right mounting head 43 while the semiconductor wafer t is mounted in parallel. At this time, in order to prevent physical interference between the mounting heads 43, the minimum distance that the two mounting heads 43, 43 can approach is mechanically or mechanically restricted. The minimum distance that can be approached is called the "closest distance." Further, the left and right mounting heads 43, 43 are located in the closest distance, and the mounting tools located on the outer side, that is, the left mounting tool 43a of the left mounting head 43 and the right mounting head 43 of the right side. The distance between the tools 43a is referred to as a "close interval". When the dimension of the support substrate W in the X direction is less than twice the length of the proximity interval, it is difficult to mount the semiconductor wafer t by the left and right mounting heads 43 in parallel in the X direction of the support substrate W. of.

The combination of the mounting tools 43a and 43b which are simultaneously mounted on the left and right mounting heads 43, 43 has four groups as shown in Fig. 5 . In the first example, as shown in FIG. 5(A), the combination of the right mounting tool 43b of the mounting head 43 on the left side and the left mounting tool 43b of the mounting head 43 on the right side simultaneously mounts the semiconductor wafer t. In the second example, as shown in FIG. 5(B), the combination of the right mounting tool 43b of the mounting head 43 on the left side and the right mounting tool 43a of the mounting head 43 on the right side simultaneously mounts the semiconductor wafer t. In the third example, as shown in FIG. 5(C), the combination of the left mounting tool 43a of the mounting head 43 on the left side and the left mounting tool 43b of the mounting head 43 on the right side simultaneously mounts the semiconductor wafer t. Fourth, as shown in FIG. 5(D), the combination of the left mounting tool 43a of the mounting head 43 on the left side and the right mounting tool 43a of the mounting head 43 on the right side simultaneously mounts the semiconductor wafer t.

In the meantime, the mounting distances L of the mounting tools 43a and 43b which are simultaneously mounted are the longest, and the mounting tools 43a located outside the left and right mounting heads 43 as shown in FIG. 5(D) are mutually arranged. The combination of the installation. Next, in this combination, the distance L between the mounting tools 43a in which the right and left mounting heads 43 are located closest to each other is the above-mentioned "close interval". Therefore, when the length of the support substrate W in the X direction is less than twice the proximity interval, the semiconductor wafer t cannot be mounted at the same time in the entire X direction of the support substrate W in the combination of FIG. 5(D). Further, in the present embodiment, the proximity interval is 150 mm. That is, the distance L between the mounting tools 43a and 43b shown in Fig. 5(D) is 150 mm.

Further, as an operation program of the mounting head 43, the combination of the mounting tools 43a and 43b to be mounted at the same time is limited to the combination of FIGS. 5(A) to (C), and when there is no combination of FIG. 5(D), As shown in Fig. 5(B), the right mounting tool 43b of the mounting head 43 on the left side of the left and right mounting heads 43 and the right mounting head 43 on the right side of the mounting head 43 on the right side. The distance between the loading tool 43a and the left mounting head 43 and the right mounting head 43 of the mounting head 43 on the left side of the left and right mounting heads 43 in the state closest to the distance shown in Fig. 5(C) The distance between the left mounting tools 43b.

(Control Unit 50) The control unit 50 controls the operation of the component supply unit 10, the stage unit 20, the transfer unit 30, and the mounting unit 40 based on the control information stored in the storage unit 51, and the electronic component including the semiconductor wafer t. The mounting areas of the support substrate W are sequentially mounted. In the storage unit 51, the stage correction data for correcting the movement position error of the stage 21 obtained by the acquisition of the movement position error of the stage 21, which will be described later, and the movement position of the mounting tools 43a and 43b are corrected. The tool correction data of the movement position error of the mounting tools 43a and 43b obtained by the error acquisition control controls the movement of the stage 21 and the mounting unit 40 based on the correction data. Further, in the memory unit 51, an operation program for the transfer unit 30, the mounting unit 40, and the like for mounting the semiconductor wafer t on the support substrate W is also stored.

[Operation of Mounting Device (Embodiment of Electronic Component)] Next, an installation process of an electronic component such as a semiconductor wafer t using the mounting device 1 will be described. When an electronic component such as a semiconductor wafer t is mounted in each mounting region of the support substrate W, when only the global identification method is applied, the positioning accuracy of the semiconductor wafer t in each mounting region is not performed because the position of the mounting region is not recognized. Depending on the identification accuracy of the global mark or the like of the support substrate W, the machining accuracy of the XY moving mechanism 22 of the stage 21, and the X-direction moving device 42a, the Y-direction moving device 41a, and the Z-direction movement of the mounting tools 43a and 43b. Machining accuracy of the devices 43c, 43d, and the like. However, the guide rail or the like for guiding the movement of the stage 21 or the mounting tools 43a and 43b is completed with an accuracy of ±7 μm or less in a desired range, and is substantially impossible in metal working. More specifically, it is more impossible to assemble a guide rail having a desired length in a linear frame of ±7 μm or less in a metal frame or the like. Here, the movement position error of the stage 21 is measured, and the data of the movement of the correction stage 21 is acquired (corrected). Moreover, the movement position error of the mounting tools 43a and 43b is measured on the mounting line, and the data of the movement of the correction mounting tools 43a and 43b is acquired (corrected).

[Acquisition of the movement position error (stage correction data) of the stage 21 (correction item (1))] The correction substrate 71 of the type shown in FIGS. 6 and 7 is used as the data for correcting the movement position error of the stage 21. Come to get. The correction substrate 71 is, for example, a matrix in which the glass substrate is arranged in a row at a predetermined interval between the dot marks 72 for position recognition. The dot marks 72 of the correction substrate 71 are provided at intervals of 3 mm, for example, in a range of 600 mm in length × 600 mm in width. The dot mark 72 is formed of a metal thin film or the like, and can be formed by a film forming technique such as etching or sputtering. The diameter of the dot mark is, for example, 0.2 mm. Such a correction substrate 71 is correctly set on the stage 21. The method of setting the correction substrate 71 is not particularly limited, but is carried out, for example, by the method described below. Here, the correction substrate 71 has the same size as the support substrate W, and the range of the dot is set to be the same as the range including all the mounting regions on the support substrate W.

(Setting of Correction Substrate 71) The above-described correction substrate 71 is set on the stage 21 by the operator's manual. The setting of the correction substrate 71 is performed by placing the correction substrate 71 on the stage 21, and then performing parallel adjustment of the correction substrate 71 (alignment of the arrangement of the dot marks 72 in the XY direction). Parallel adjustment is performed in the substrate recognition camera 43f for supporting the imaging of the global mark of the substrate W, for example, by the substrate recognition camera 43f of the left solid head 43. First, as shown in FIG. 6, the correction mark 71 placed on the stage 21 has a dot mark 72 located at a corner on the left front side of the correction substrate 71 as a center of the imaging field of view V of the substrate recognition camera 43f. Adjust the position of the stage 21.

From this state, the stage 21 is moved to the left side in the X direction at a low speed (a speed at which the point in the field of view V of the camera 22 is gradually moved by the dot mark 72). At this time, the operator monitors the image of the substrate identification camera 43f with the monitor, and stops the movement of the stage 21 when the position of the dot mark 72 imaged by the substrate recognition camera 43f is shifted upward or downward with respect to the imaging field of view V. The inclination of the correction substrate 71 is manually adjusted in a direction in which there is no deviation. The imaging field of view V of FIG. 6 shows an example of a state in which the position of the dot mark 72 appearing in the imaging field of view V gradually shifts downward as the movement of the stage 21 moves.

After adjusting the inclination of the correction substrate 71, the position of the stage 21 is adjusted so that the dot mark 72 located at the corner of the left front becomes the center of the imaging field of view V of the substrate recognition camera 43f, and the stage 21 is moved to the left in the X direction at a low speed. . The operator also monitors whether the position of the dot mark 72 is deviated by the monitor. Next, when there is a deviation in position, the movement of the stage 21 is stopped, and the inclination of the correction substrate 71 is adjusted. Such an operation is repeated until the point mark 71 is displayed outside the imaging field of view V in the entire range of the movable range of the stage 21 in the X direction. The movement of the stage 21 by such an operator is performed by the operation of the touch panel and the joystick.

(Acquisition of the movement position error (correction data) of the stage 21) Next, the position of the dot mark 72 of the correction substrate 71 set on the stage 21 is determined by the substrate recognition camera 43f provided in the left and right mounting heads 43 by the above-described method. The identification is performed, and the movement position error of the stage 21 and the correction data based thereon are obtained. The identification of the dot mark 72 is performed by moving the correction substrate 71 in a state where the left and right substrate recognition cameras 43f are stopped at predetermined positions. The imaging of the dot mark 72 on the correction substrate 71 is, for example, as shown in FIG. 7, from the dot mark 72 located at the left end of the correction substrate 71 (on the side of the rear side of the base portion 1a) toward the right side in the X direction by a dot mark 72. The pitch of 3 mm is arranged to start the pitch movement, and the front side (the side on the front side of the base portion 1a) is sequentially folded back simultaneously. At this time, among the dot marks 72 on the correction substrate 71, the dot marks 72 provided in the left half-divided area are imaged by the substrate recognition camera 43f on the left side, and the dot marks 72 provided in the right half-divided area are used on the right side substrate. The recognition camera 43f performs imaging.

Specifically, in a state where the stage 21 is located at the center of the moving stroke in the XY direction of the XY moving mechanism 22 (this position is referred to as an origin position), the left substrate recognition camera 43f is positioned on the correction substrate 71. The center of the half mark group (the position indicated by symbol 71A in Fig. 7) causes the right substrate recognition camera 43f to be located at the center of the dot mark group of the right half of the correction substrate 71 (the position shown by the symbol 71B in Fig. 7). ). In this state, when the left and right substrate recognition cameras 43f are kept stopped, the operator observes the monitor and simultaneously operates the XY moving mechanism 22, and the left side dot mark 72 of the left half of the dot mark group is located on the left side of the substrate recognition camera. The correction substrate 71 is moved in such a manner that the center of the imaging field of view V is 43f. Thereby, the dot mark 72 on the upper left side of the dot mark group of the right half is located in the imaging field of view V of the substrate recognition camera 43f on the right side. Among the dot mark groups on the left and right, the dot mark 72 on the upper left becomes the first dot mark 72.

After the first dot mark 72 is positioned at the center of the imaging field of view V of the substrate recognition camera 43f, the detection operation of the dot mark 72 by the left and right substrate recognition cameras 43f is started. After that, it is first performed by the automatic control of the control unit 50. The detection operation is started by the operator pressing (touching) the start button of the detection operation displayed on the touch panel. After the detection operation of the dot mark 72 is started, the first dot mark 72 is first imaged. The image of the first dot mark 72 imaged is processed by a known image recognition technique, and the positional deviation of the dot mark 72 with respect to the center of the imaging field of view V of the substrate recognition camera 43f is detected. The detected positional deviation is stored in the memory unit 51 as information paired with the moving position (XY coordinate) of the stage 21. After the position recognition of the dot mark 72 is completed, the stage 21 is moved in order to move the next (second) dot mark 72 within the field of view of the camera in the above-described moving order. In the example of Fig. 7, since the second dot mark 72 is located on the right side of the first dot mark 72, the stage 21 is moved to the left side in the X direction by 3 mm.

The movement of the stage 21 is performed based on the read value of the linear encoder provided in the XY moving mechanism of the stage 21. As the thermal countermeasure, the scale of the linear encoder is preferably a glass graduated meter having a small thermal expansion coefficient. When the movement of the stage 21 is completed, the positional deviation of the second dot mark 72 is detected in the same manner as the first dot mark 72a, and the information paired with the XY coordinates of the stage 21 at this time is stored in the memory unit 51. The imaging of the dot mark 72 is performed after the time when the stage 21 is stopped and waits for the vibration generated when the stage 21 is stopped to be flat. This operation is performed on all the dot marks 72 on the correction substrate 71, and the movement position deviation data of the dot marks 72 corresponding to the respective positions is acquired, and is stored in the memory unit 51 as the stage correction data.

(Acquisition of the correction data accompanying the thermal expansion of the support substrate W) In order to improve the adhesion of the bonded die film used for the semiconductor wafer t, a heater is provided on the stage 21 to heat the support substrate W. In this case, since the temperature of the support substrate W changes (rises) before and after being placed on the stage 21, the support substrate W is thermally expanded. When the support substrate W thermally expands, even if the stage 21 and the mounting head 55 are moved with high precision, the extension of the support substrate W may cause the mounting position to vary.

Here, it is known in advance that the amount of thermal expansion of the support substrate W due to the heating of the heater is measured, and when the semiconductor wafer t is mounted on the support substrate W, the coefficient (percentage) of the amount of thermal expansion that is previously grasped is multiplied by the correction data. It is also preferable to control the movement of the stage 21. At this time, the shape and arrangement of the heater, the structure of the stage 21, and the like are such that the entire support substrate W does not necessarily thermally expand uniformly, and the distribution of thermal expansion can be collectively grasped. For example, the region on the support substrate W is divided into a lattice-shaped complex region of 10 rows×10 columns, and the amount of thermal expansion (displacement due to thermal expansion of each measurement point) is measured for each divided region. Next, the coefficient of the correction data of the uploading table 21 in the area may be switched.

In addition, the amount of thermal expansion of the support substrate W is measured in advance from the predetermined elapsed time from the time when the support substrate W is placed on the stage 21 until the thermal expansion of the support substrate W is saturated with respect to the temperature of the stage 21, and is obtained in advance. The coefficient of the amount of thermal expansion for each predetermined elapsed time is also acceptable. At this time, it is also possible to determine the coefficient corresponding to the amount of thermal expansion by dividing the support substrate W into each of the plurality of regions. Next, when the semiconductor wafer t is mounted, the elapsed time after the support substrate W is placed on the stage 21 is switched to a coefficient due to the elapsed time, and the coefficient is multiplied by the correction data so that the stage 21 is loaded. mobile. Thereby, the semiconductor wafer t can be mounted on the support substrate W without waiting for the thermal expansion of the support substrate W to be saturated with respect to the temperature of the stage 21, and the semiconductor wafer t can be mounted with high efficiency. High precision implementation.

(Remediation of the movement position of the stage 21) When the stage 21 is moved, the stage correction data obtained by the acquisition of the movement position error of the stage 21 is referred to by the mounting head 43 provided on the left side. The substrate recognition camera 43f acquires the stage correction data and corrects the movement position of the stage 21. The control unit 50 controls the XY moving mechanism 22 such that each row of the mounting region in the X direction placed on the support substrate W of the stage 21 is sequentially positioned on the mounting line. At this time, the control unit 50 refers to the position information (XY coordinates) stored in the mounting area of the storage unit 51 and the above-described stage correction data, and calculates a correction value required when the line of the mounting area is placed on the mounting line. Next, the movement position of the stage 21 when the row of the mounting area is placed on the mounting line is corrected only by the calculated correction value. When the stage 21 has a heater, it is preferable to multiply the coefficient of the thermal expansion amount of the support substrate W by the correction data of the stage 21.

In addition, the stage correction data acquired by the substrate recognition camera 43f provided in the right mounting head 43 is used for correction of the movement position of the right mounting head 43. In other words, the substrate identification camera 43f of the right and left mounting heads 43 captures the dot marks 72 provided at the same arrangement intervals of the same correction substrate 71, and the camera 43f is recognized from the left and right substrates as long as the stage 21 (correction substrate 71) moves in parallel. The positional deviation of the point mark 72 recognized by the captured image should be the same. However, when the stage 21 is moved, there is a slight backlash in the horizontal plane, that is, a state of swaying. In this case, even if the movement error of the stage correction data correction stage 21 acquired by the substrate recognition camera 43f on the left side is used and moved, it is estimated that the mounting tools 43a and 43b of the right mounting head 43 are actually implemented. The accuracy of the installation may not be sufficient. Here, the movement position of the right mounting head 43 is based on the difference between the stage correction data acquired by the substrate recognition camera 43f on the left side and the stage correction data acquired by the substrate identification camera 43f on the right side. Correction. Thereby, even when the stage 21 is shaken, the mounting accuracy of the left and right mounting heads 43 can be ensured.

[Acquisition of the movement position error (the first tool correction data) of the mounting tools 43a and 43b (correction project (2))] Correction of the movement position error in the XY direction of the mounting tools 43a and 43b (the first tool) The correction data is obtained using the correction substrate 71 in the same manner as the calibration of the stage 21. Therefore, it is sufficient to continuously perform the above-described correction project (1). In the state in which the stage 21 is stopped at the origin position, the correction data is located in a region having a predetermined width in the Y direction centering on the mounting line (the area indicated by a broken line in FIG. 7 is hereinafter referred to as " The position of the position point mark 72 in the correction data acquisition area Dt") is recognized while the substrate recognition camera 43f provided in the left and right mounting heads 43 is individually moved. The substrate identification camera 43f of each of the mounting heads 43 corrects the dot mark in the data acquisition region Dt with respect to the Y direction within a predetermined predetermined width in the X direction with respect to the entire range of the movable range of the mounting head 43 in the X direction. 72 cameras.

Specifically, first, the substrate recognition camera 43f of the left mounting head 43 is moved to the left end of the movable range in the X direction of the left mounting head 43, that is, the rear side of the correction data acquisition region Dt, at which position The dot mark 72 is located at the center of the imaging field of view V of the substrate recognition camera 43f. In this state, the detection operation is started by the operator pressing (touching) the start button of the detection operation displayed on the touch panel.

After the start of the detection operation, the substrate recognition camera 43f starts the pitch movement at the arrangement interval of the dot marks 72 on the right side in the X direction, and folds back in the X direction in the movable range while sequentially capturing the correction data acquisition region Dt. Point marker 72. Then, the substrate identification camera 43f recognizes the position of the dot mark 72 in the same manner as the acquisition of the stage correction data, and acquires the first tool correction data as the correction data for correcting the movement position of the mounting tools 43a and 43b, and stores the data in the memory unit 51. The substrate recognition camera 43f of the mounting head 43 on the right side performs the same operation, and acquires the first tool correction data of the mounting tools 43a and 43b of the right mounting head 43 and stores them in the memory unit 51. In addition, the predetermined width of the correction data acquisition area Dt may be appropriately set in accordance with the size of the electronic component mounted on the support substrate W, but it may be set in a range of 30 mm to 100 mm. Moreover, the width of one part of the electronic component may be sufficient.

The acquisition of the stage correction data and the tool correction data is basically performed when the mounting device 1 is operated, and the movement of the stage 21 and the mounting head 43 may be controlled based on the measurement result. However, in the stage 21 and the mounting head 43, there is a case where a heater or the like that supports the mounting of the semiconductor wafer t is incorporated. In this case, there is a case where the temperature of each part of the apparatus rises and the mechanical precision is lowered due to thermal expansion. In addition, as the mounting work of the semiconductor wafer t of the mounting device 1 progresses, the motor of the moving device that moves the mounting head 43 generates heat, and the mechanical accuracy of each part of the device may decrease. In consideration of such a movement error due to an increase in temperature, it is not limited to one time during the operation of the device, and may be performed periodically.

(Revision of the movement position of the mounting tools 43a and 43b) The correction of the movement position when the left and right mounting heads 43 are moved will be described. First, when the mounting head 43 on the left side is moved to the mounting position on the mounting line, the first tool correction data obtained by the acquisition of the movement position error of the mounting tools 43a and 43b is referred to the left side. The tool correction information acquired by the substrate recognition camera 43f included in the head 43 corrects the movement position of the mounting tools 43a and 43b. The control unit 50 controls the movement of the mounting head 43 in the X direction in order to mount the semiconductor wafer t held on the mounting tools 43a and 43b in the mounting area of the mounting line in order to be mounted in a predetermined mounting area. The device 42a and the Y-direction moving device 41a. At this time, the control unit 50 refers to the position information (XY coordinates) stored in the mounting area of the storage unit 51 and the first tool correction data, and calculates that the center of the semiconductor wafer t coincides with the center of the mounting area. The correction value required for positioning. Next, the movement position of the mounting tools 43a and 43b when the semiconductor wafer t is mounted on the mounting area is corrected only by the calculated correction value.

In the same manner as the mounting head 43 on the left side, the first tool correction data acquired by the substrate recognition camera 43f provided in the right mounting head 43 is corrected, and the mounting tools 43a and 43b are corrected. move Place. Further, in the present embodiment, the relative positional relationship between the two mounting tools 43a and 43b and the substrate recognition camera 43f in each of the mounting heads 43 is preferably assembled by a jig or the like with a certain precision. Thereby, the positioning accuracy of the semiconductor wafer t or the like can be further improved.

[Acquisition of the movement position error (the second tool correction data) of the mounting tools 43a and 43b (correction project (3))] Correction of the movement position error of the mounting tools 43a and 43b in the Z direction (the second tool) In the correction data (1) and (2), the support substrate W or the test support substrate Ws is placed on the mounting line in a state where the stage correction data and the first tool correction data are applied. The pitch-mounted semiconductor wafer t or the test wafer ts is obtained by measuring the positional deviation with respect to the target position of the mounted wafer.

Specifically, the test support substrate Ws is placed on the stage 21 . The support substrate Ws for the test may be the support substrate W for manufacturing. However, the mounting area can be secured at least on the mounting line, and the same as the correction data acquisition area Dt shown in FIG. A size substrate is also available. When the support substrate Ws is placed on the stage 21, the same operation as the mounting process of the semiconductor wafer t and the mounting process of the semiconductor wafer t, which is described later, is used as the correction data to be set in advance along the mounting line. For example, the test wafer ts is mounted by an adhesive at intervals of 1 mm. The adhesive is attached to the support substrate Ws in advance. The implementation is performed in a globally recognized manner.

When the mounting of the test wafer ts is completed, the support substrate Ws is detached from the stage 21, and the mounting position deviation with respect to the target position of each wafer ts is measured by an inspection apparatus (not shown). The data relating to the relationship between the target position on the mounting line and the mounting position deviation with respect to the target position obtained in this manner is stored in the storage unit 51 as the second tool correction data. This operation is performed individually for each of the mounting tools 43a and 43b of the right and left mounting heads 43, and the second tool correction data is acquired for each of the mounting tools 43a and 43b.

Further, the set mounting interval is smaller than the X-direction dimension of the wafer t, for example, the mounting interval is 1 mm, and when the size of the wafer ts is 4 × 4 mm, the wafer ts cannot be continuously arranged on the mounting line. In this case, the position of the support substrate Ws is shifted in the Y direction, and the wafer ts may be mounted along the mounting line in plural times. That is, the wafer ts is first mounted along the mounting line at an interval greater than 4 mm. Thereafter, the position of the support substrate Ws is moved in the Y direction by a distance larger than 4 mm. At this position, the wafer ts is mounted along the mounting line with respect to the previous position shifted by 1 mm in the X direction. This action is repeated until the mounting interval is filled.

In addition, the test wafer Ws for the test with the region mark is mounted on the wafer ts for the test in the global identification method, and the substrate identification camera 43f may be used to identify the positional deviation with respect to the mounting position of the mounted wafer ts.

(Revision of the movement position of the mounting tools 43a and 43b) The correction of the movement position of the mounting tools 43a and 43b will be described. When the mounting tools 43a and 43b are moved on the mounting area of the mounting line, the target position on the mounting line, which is the second tool correction data stored in the memory unit 51, and the mounting position deviation from the target position are referred to. The relevant information of the relationship is calculated from the value of the deviation of the mounting position of the mounting area. Next, only the correction of the correction value of the movement position of the mounting head 43 when the mounting tools 43a and 43b are moved to the mounting area is calculated. Further, in the second tool correction data, when there is no target position that coincides with the position of the mounting area, for example, the mounting position of the two target positions adjacent to the position of the mounting area is deviated by one-time or The polynomial is interpolated, and the correction value of the mounting position deviation corresponding to the position of the mounting area may be calculated.

[Installation of Electronic Components] After the above-described correction works (1) to (3), the mounting work of the electronic components such as the semiconductor wafer t to the support substrate W is performed.

(1) Loading of the wafer ring 11 First, the unused wafer ring 11 is carried into the wafer ring holder 12 from a housing portion (not shown), and the wafer ring 11 is fixed to the wafer ring holder 12. At this time, as shown in FIG. 8, the support arm 32a of the wafer ring holding device 32 provided in the transfer unit 30A on the left side is moved in the right direction of the drawing, and the holding portion 32b is moved to the holding position of the wafer ring 11. . In this state, the position shown by the two-dot chain line is moved, and the rear end portion of the wafer ring 11 in the accommodating portion is moved to a position indicated by a solid line, whereby the wafer ring 11 is taken from the accommodating portion. Pulling out causes the wafer ring 11 to move onto the wafer ring holder 12. When the wafer ring 11 is placed on the wafer ring holder 12, the holding of the wafer ring 11 by the chuck portion 32b is released, and the support arm 32a is moved in the left direction of the drawing to move the holding portion 32b to the standby position. The wafer ring 11 on the wafer ring holder 12 is held in a stretched state by a stretching mechanism (not shown) provided in the component supply unit 10.

(2) Setting work of the support substrate W (2-1: supply of the support substrate W) The support substrate W held by the transfer robot (not shown) is supplied to the stage 21. The transport robot (not shown) includes a transport arm on which the support substrate W is placed and held, and the support substrate W is carried into the stage 21 from the left side of the mounting device 1 through the space below the door of the support frame 41 of the mounting unit 40A on the left side. . After the support substrate W is supplied onto the stage 21, the transfer arm is retracted from the mounting device 1. The supply process of the support substrate W may be performed in parallel with the carry-in process (1) of the wafer ring 11 or may be performed individually.

(2-2: Detection of global mark) The global mark of the support substrate W placed on the stage 21 is detected, and the position of the support substrate W is recognized. For example, as shown in FIG. 9 , among the four corners of the support substrate W, the global marks A, B, and C provided at the three corners are sequentially imaged by the substrate recognition camera 43 provided in the left and right mounting heads 43. . Specifically, the left-hand mounting head 43 is loaded so that the global mark A located on the left rear side (upper left in FIG. 9) of the support substrate W is directly below the substrate recognition camera 43f of the mounting head 43 on the left side. The stage 21 is relatively moved, and the camera is marked with the entire area A. Next, the right mounting head 43 and the stage 21 are placed so that the global mark B located at the right rear side of the support substrate W (upper right in FIG. 9) is located immediately below the substrate identification camera 43f of the mounting head 43 on the right side. Relative movement, camera global mark B. Finally, the right mounting head 43 and the stage are placed such that the global mark C located on the right front side (lower right in FIG. 9) of the support substrate W is directly below the substrate recognition camera 43f of the mounting head 43 on the right side. 21 relative movement, camera global mark C. The position of the three global marks A, B, and C is detected based on the captured image, and the positional deviation and the θ direction of the support substrate W in the XY direction are obtained based on the positions of the three global marks A, B, and C detected ( Positional deviation of the horizontal rotation direction). The positional deviation of the support substrate W can be obtained by various known methods, and is not particularly limited to this method.

An example of the detection method of the positional deviation will be described below. In FIG. 9, the solid line indicates the support substrate W actually placed on the stage 21. The two-dot chain line indicates the support substrate W in a state in which the stage 21 is placed without positional deviation. The support substrate W described by the two-dot chain line is in an ideal state, and the center of the support substrate W at this time coincides with the center position O (x0, y0) of the stage 21.

First, the positions of the three global marks A, B, and C provided on the support substrate W are detected by a known image recognition technique, and the inclination θ1 from the line direction AB connecting the global marks A and B with respect to the X direction and the connected whole domain are detected. The average value of the inclination θ2 of the line division BC of the marks B and C with respect to the Y direction is the inclination θ (=(θ1 + θ2)/2) of the support substrate W. Next, the support substrate W is imaginarily rotated such that the center position O of the stage 21 is the center of rotation and the inclination θ disappears. This state is indicated by a broken line in FIG. The amount of movement (Δx1, Δy1) of the midpoint M1 (x1, y1) of the diagonally located global markers A and C at this time is obtained. The total value (Δx1 + Δx2, Δy1 + Δy2) of the obtained movement amount (Δx1, Δy1) and the difference (Δx2, Δy2) between the moving midpoint M2 (x2, y2) and the coordinate O is used as a supporting substrate. The positional deviation of W in the XY direction is obtained.

When the positional deviation of the support substrate W on the stage 21 is calculated, the positional deviation is corrected, and the stage 21 is moved such that the row of the mounting area on which the semiconductor wafer t is first mounted on the support substrate W is placed on the mounting line. . Specifically, the stage 21 is moved to the position of the solid line shown in FIG. 10, and the row position of the last mounting region of the support substrate W is placed on the mounting line. Further, in Fig. 10, the mounting line is indicated by a dotted line for convenience. At this time, the movement of the stage 21 for arranging the rows of the respective mounting areas on the mounting line is based on the correction of the positional deviation of the support substrate W obtained by the identification of the global marks A, B, and C, and The stage correction data of the memory unit 51 is corrected. In the present embodiment, when the XY moving mechanism 22 of the stage 21 does not have the θ stage (θ moving mechanism), the tilt of the support substrate W is adjusted by the θ adjusting mechanism provided in the mounting head 43 to adjust the mounted semiconductor wafer t The tilt is used to correct it.

(3) Transfer process of semiconductor wafer t (3-1: position detection of semiconductor wafer t) After the wafer ring 11 is held by the wafer ring holder 12, the semiconductor wafer which is initially taken out on the wafer ring 11 is t Located at the removal location. The take-out position is set at the center of the wafer ring holder 12 in the state shown in FIG. The order in which the semiconductor wafer t on the wafer ring 11 is taken out is previously stored in the memory unit 51, and the control unit 50 controls the movement of the wafer ring holder 12 in this order. Therefore, after the first semiconductor wafer t is taken out, the wafer ring holder 12 moves the wafer ring 11 in accordance with the order of the memory unit 51.

After the first semiconductor wafer t is located at the take-out position, the wafer identification camera 38 that takes up the transfer unit 30A on the left side in order to make the semiconductor wafer t and the next semiconductor wafer t taken out in the X direction with the semiconductor wafer t The Y-direction moving block 34 and the X-direction moving body 36 are moved. In other words, the wafer identification camera 38 has an imaging field of view of a size in which two adjacent semiconductor wafers t held on the wafer ring 11 are simultaneously taken. The two alignment marks provided at the pair of corner portions of the semiconductor wafer t are imaged by the wafer identification camera 38. The position of each semiconductor wafer t is detected based on the positions of the two alignment marks of each semiconductor wafer t that are imaged. When the position of the semiconductor wafer t taken out first differs from the take-out position, the wafer ring holder 12 is moved to correct the position.

Further, the detection of the positional deviation of the semiconductor wafer t located at the take-out position is not particularly limited, and can be carried out in accordance with various known methods. For example, the position of each alignment mark is detected by a known image recognition technique from an image of two alignment marks provided at diagonal positions on the semiconductor wafer t. The inclination of the line connecting the two marks is obtained from the position of the obtained mark, and the inclination of the line between the connection marks in the semiconductor wafer t in which the positional deviation of the memory unit 51 is stored in advance is compared. The difference is detected as the tilt deviation of the semiconductor wafer t. Further, the difference between the position of the midpoint between the actual alignment marks and the position of the midpoint between the alignment marks of the semiconductor wafer t which is stored in the memory portion 51 without the positional deviation is taken as the positional deviation of the semiconductor wafer t in the XY direction. Find out.

(3-2: Extraction of Semiconductor Wafer t) After recognizing the positional deviation of the two semiconductor wafers t, the left adsorption nozzle 37a of the left transfer head 37 is moved right above the semiconductor wafer t located at the take-out position. Then, the Z-direction moving device 37c is driven to lower the adsorption nozzle 37a, and the adsorption surface of the adsorption nozzle 37a is brought into contact with the upper surface (electrode forming surface) of the semiconductor wafer t. After the adsorption nozzle 37a abuts on the semiconductor wafer t, the semiconductor wafer t is adsorbed and held to the adsorption nozzle 37a. The timing at which the adsorption force is applied to the adsorption nozzle 37a may be set to an appropriate timing before or after the adsorption nozzle 37a comes into contact with the semiconductor wafer t.

After the left adsorption nozzle 37a is adsorbed and held to the semiconductor wafer t, the adsorption nozzle 37a is raised to the original height. At this time, the lifting mechanism (not shown) is actuated in accordance with the rise of the adsorption nozzle 37a, and the semiconductor wafer t from the resin sheet S is assisted to be peeled off. After the left adsorption nozzle 37a of the semiconductor wafer t is adsorbed and held up to the original height or in parallel with the rise, the right adsorption nozzle 37b is positioned directly above the removal position while the next semiconductor wafer t is positioned at the removal position. The semiconductor wafer t is taken out in the same manner as the left adsorption nozzle 37a in the right adsorption nozzle 37b.

After the left and right adsorption nozzles 37a and 37b of the transfer head 37 on the left side respectively adsorb and hold the semiconductor wafer t, the left and right adsorption nozzles 37a of the left transfer head 37 are moved by the movement of the Y-direction moving block 34 and the X-direction moving body 36. As shown in FIG. 10, 37b is located on the mounting portions 31a and 31b of the intermediate stage 31. In this state, the left and right adsorption nozzles 37a and 37b are lowered, and the semiconductor wafer t held by the left and right adsorption nozzles 37a and 37b is placed on the placement portions 31a and 31b.

Further, in the above-described take-out process, there is a case where the semiconductor wafer t to be taken out to the side of the semiconductor wafer t located at the take-out position does not exist, that is, the semiconductor wafer t located at the take-out position is the line of the semiconductor wafer t. The case of the semiconductor wafer t of the terminal. In this case, the semiconductor wafer t located at the head of the next row becomes the semiconductor wafer t to be taken out next. When the semiconductor wafer t is in a range in which the imaging field of view of the wafer recognition camera 38 can be taken in, two semiconductor wafers t are simultaneously imaged. On the other hand, when not in the range in which the imaging field of view can be taken in, two semiconductor wafers t are individually imaged. In the case of individual imaging, the imaging of the next (second) semiconductor wafer t may be performed before the removal of the first semiconductor wafer t located at the take-out position, or after the removal of the first semiconductor wafer t.

(3-3: Receiving of the semiconductor wafer t) After the semiconductor wafer t is placed on the mounting portions 31a and 31b of the intermediate stage 31, the mounting head 43 of the mounting portion 40A on the left side moves toward the intermediate stage 31, as As shown in Fig. 11, the left and right mounting tools 43a and 43b are positioned above the placing portions 31a and 31b. After the left and right mounting tools 43a and 43b are placed on the placing portions 31a and 31b, the Z-direction moving devices 43c and 43d are driven to lower the mounting tools 43a and 43b, and the mounting tools 43a and 43b are respectively brought into contact with the semiconductor wafer t. After the mounting tools 43a and 43b are in contact with the semiconductor wafer t, the semiconductor wafer t is adsorbed and held to the mounting tools 43a and 43b. The timing of the adsorption holding may be set to an appropriate timing before the mounting tools 43a and 43b are brought into contact with the semiconductor wafer t, abutting, or after abutting. After the mounting tools 43a and 43b adsorb and hold the semiconductor wafer t, the mounting tools 43a and 43b are raised to the original height by the Z-direction moving devices 43c and 43d. Thereby, the two semiconductor wafers t are simultaneously received by the mounting tools 43a and 43b.

In addition, in parallel with the reception of the semiconductor wafer t, (3-1) and (3-2) of the process (3) performed by the transfer unit 30B on the right side are performed. In this case, the transfer head 37 on the right side is also the same, and the semiconductor is performed in the order of the adsorption nozzles 37b on the inner side from the adsorption nozzles 37a on the outer side (the suction nozzles 37a on the right side are reversed from the transfer head 37 on the left side). The removal of the wafer t. Further, the removal position at which the transfer unit 30 takes out the semiconductor wafer t from the component supply unit 10 is a single position. Therefore, the extraction of the semiconductor wafer t by the transfer unit 30A on the left side and the removal of the semiconductor wafer t by the transfer unit 30B on the right side are performed in parallel.

(4) Mounting process of the semiconductor wafer t (4-1: Position detection and movement of the semiconductor wafer t) After the mounting tools 43a and 43b receive the semiconductor wafer t, the mounting is performed on the mounting portions 31a and 31b. The wafer identification cameras 44a and 44b of the unit 44 image and hold the semiconductor wafer t held by the mounting tools 43a and 43b. This imaging is performed by a member that can see through the mounting tools 43a, 43b. Based on the captured images of the wafer identification cameras 44a and 44b, the position of the semiconductor wafer t adsorbed and held by the mounting tools 43a and 43b is detected. This position detection can be carried out in the same manner as (3-1) of the above-mentioned item (3) by a known image recognition technique. Based on the position of the detected semiconductor wafer t, the positional deviation of the semiconductor wafer t is obtained.

Further, the position detection of the semiconductor wafer t may be performed on the placing portions 31a and 31b. At this time, after the imaging of the semiconductor wafer t by the identification cameras 44a and 44b, the mounting tools 43a and 43b adsorb and hold the semiconductor wafer t. After the imaging of the semiconductor wafer t by the recognition cameras 44a and 44b is completed, as shown in FIG. 12, the mounting tools 43a and 43b are moved toward the row of the mounting area of the support substrate W on the mounting line along the X direction. .

(4-2: mounting of the semiconductor wafer t) The mounting head 43 is first held in the mounting area of the mounted semiconductor wafer t held by the left mounting tool 43a among the left and right mounting tools 43a and 43b. The semiconductor wafer t held by the left mounting tool 43a is positioned and moved. At this time, since the semiconductor wafer t held by the left mounting tool 43a is the semiconductor wafer t originally mounted on the support substrate W, the left mounting tool 43a is moved to the row of the mounting area located on the mounting line. Located on the leftmost mounting area.

The movement position at this time is corrected based on the first and second tool correction data stored in the memory unit 51 and the positional deviation of the semiconductor wafer t calculated by (4-1: position detection and movement of the semiconductor wafer t). . Further, when the inclination θ of the support substrate W is detected in the (2-2: detection of the global mark) project, the inclination θ is also corrected by the mounting tool 43a. Thereafter, the mounting tool 43a is lowered and the semiconductor wafer t is mounted to a desired mounting area of the support substrate W.

The bonding of the semiconductor wafer t with respect to the support substrate W is performed by an adhesive force which is attached to the surface of the support substrate W or the underside of the semiconductor wafer t and an adhesive film (Die Attach Film: DAF). In the bonding of the semiconductor wafer t, a heater is provided on the stage 21 in advance, and the semiconductor wafer t may be pressurized and implemented with respect to the heated support substrate W. The heater may be housed in the mounting tool 43a. Only after the semiconductor wafer t is pressurized for a predetermined time, the adsorption of the semiconductor wafer t is released, and the mounting tool 43a is raised to the original height.

After the mounting by the mounting tool 43a is completed, first, in order to fix the semiconductor wafer t held by the right mounting tool 43b on the mounting area of the mounted semiconductor wafer t held in the right mounting tool 43b, the mounting head is moved. 43. After the semiconductor wafer t held by the right mounting tool 43b is placed on the mounting area, the semiconductor wafer t is mounted on the mounting area by the same operation as the left mounting tool 43a. The mounting head 43 on the left side after the mounting of the semiconductor wafer t by the left and right mounting tools 43a and 43b is completed moves to the intermediate stage 31.

In the parallel operation of the semiconductor wafer t, (3-1) and (3-2) of the engineering (3) are performed by the transfer unit 30A on the left side. Therefore, when the mounting head 43 on the left side moves to the placing portions 31a and 31b of the intermediate stage 31, the semiconductor wafer t to be mounted next is placed on the mounting portions 31a and 31b. Therefore, the mounting head 43 moved to the left side on the intermediate stage 31 immediately receives the semiconductor wafer t from the mounting portions 31a and 31b, and performs (4-1) and (4-2) of the process (4). Thereafter, this operation is repeated until the mounting of the semiconductor wafer t with respect to all the mounting regions on the support substrate W is completed.

Even in the middle of the mounting of the semiconductor wafer t by the mounting tools 43a and 43b of the mounting head 43 on the left side, the mounting portions 31c and 31d of the intermediate stage 31 are placed on the transfer table 30B on the right side. At the stage of completion of the transfer of the semiconductor wafer t, the mounting of the semiconductor wafer t by the mounting head 43 of the mounting unit 40B on the right side is started. This operation is the same as (4-2) of the above-described item (4) described in the example of the mounting unit 40A on the left side. In addition, the mounting head 43 on the right side is also the same, and the mounting tool 43a from the outside (because the mounting head 43 on the left side is reversed to the right) is the semiconductor wafer t in the order of the mounting tool 43b on the inner side. Installed. The same applies to the mounting of the semiconductor wafer t by the mounting portion 40B on the right side, and similarly to the mounting of the semiconductor wafer t in all the mounting regions on the support substrate W, as in the case of the mounting portion 40A on the left side. The action.

At this time, the mounting portion 40A on the left side and the mounting portion 40B on the right side divide the region on the support substrate W into two equal parts in the left and right directions (X direction), and share the respective regions to mount the semiconductor wafer t. Therefore, the mounting head 43 of the mounting unit 40A on the left side and the mounting head 43 of the mounting unit 40B on the right side can not only perform (4-1) and (4-2) of the above-described project (4), but also Simultaneously performed in parallel. Further, in the mounting of the semiconductor wafer t, the movement of the stage 21 is also performed. In other words, when the semiconductor wafer t is mounted on the mounting area of the support substrate W, the left and right mounting heads 43 are respectively fixed at predetermined positions on the mounting line by the mounting tools 43a on the outer side of each of the mounting heads 43 (hereinafter referred to as For the "installation position".) The way to install controls the movement position.

The mounting position is set with respect to the support substrate W placed in a normal positional relationship with the stage 21 located at the origin position, for example, as indicated by reference numerals 71A and 71B in Fig. 7 . In the present embodiment, the distance between the two mounting positions is set to "the distance of the integral multiple (n times) of the distance (2P) twice the arrangement interval (distance between centers) P of the mounting area" . The distance (2P×n) between the mounting positions is equal to or greater than the proximity interval, and is set so as to be narrowed by the distance (2P×n) in accordance with the arrangement state of the mounting region of the support substrate W. It is important that the value of (2P x n) which is above the close interval and which is closest to the close spacing is preferably set as the distance between the mounting positions. In this case, since the mounting position by the mounting tool 43a on the outer side of each of the mounting heads 43 is set at a predetermined position on the mounting line, the stage 21 is placed on the mounting area of the mounting board W on the mounting line. In this case, the movement control is performed such that the mounting area of the semiconductor wafer t mounted on the outer mounting tool 43a is sequentially placed at the mounting position. Of course, this movement control is performed by adding the stage correction data memorized in the memory unit 51.

More specifically, first, the stage 21 is placed in a row of the mounting area on the support substrate W on the mounting line so that the semiconductor wafer is initially mounted by the mounting tool 43a on the outer side of the left mounting head 43. The mounting area of t moves in the same manner as the mounting position on the left side. After mounting the semiconductor wafer t in the mounting area of the mounting position on the left side, the mounting area next to the mounting area is mounted by the mounting tool 43b on the inner side (right) of the left mounting head 43. Semiconductor wafer t. The movement of the semiconductor wafer t in the adjacent mounting area by the inner mounting tool is performed by the movement of the mounting head 43 as described above. At this time, the mounting area of the semiconductor wafer t is initially mounted by the mounting tool 43a of the outer side (right) of the mounting head 43 on the right side, because the mounting position on the right side is performed by the outer side (right). The tool 43a mounts the semiconductor wafer t, and then the semiconductor wafer t is mounted by the inner (right) mounting tool 43b.

When the semiconductor wafer t is mounted by the inner (left) mounting tool 43b of the mounting head 43 on the right side, the stage 21 is placed in the row of the mounting area on the support substrate W on the mounting line. The left mounting tool 43a moves the mounting area of the second semiconductor wafer t to the mounting position on the left side. In this case, the stage 21 sequentially positions the mounting area of the mounted semiconductor wafer t by the left and right mounting tools 43a at the mounting position. While the mounting of the semiconductor wafers t (the mounting of the four semiconductor wafers t) of the mounting tools 43a and 43b of the left and right mounting heads 43 is performed, the supporting substrate W is stopped at a predetermined position, and the next step is performed. Before the mounting of the semiconductor wafer t (the mounting of the next four semiconductor wafers t), the support substrate W is moved by the stage 21 so that the next mounting region of the support substrate W is at the mounting position. Further, in the above-described correction project (1), when there is a deviation in the position recognition result of the dot mark by the substrate identification camera 43f of the left and right mounting heads 43, the deviation is shifted so as to correct the deviation.

(5) After the loading and unloading of the support substrate W is completed with respect to the mounting of the semiconductor wafers t in all the mounting regions on the support substrate W, the transfer portion 30 and the mounting portion 40 are temporarily stopped, and the semiconductor wafer t is solidified. The loading and unloading of the stage 21 of the support substrate W and the loading onto the stage 21 of the new support substrate W are performed. The carry-out of the support substrate W from the stage 21 is performed by a transfer robot different from the transfer robot described in the above item (2). The transport robot passes through the space below the door of the support frame 41 of the right mounting portion 40B from the right side of the mounting device 1 to invade the transfer arm, receives the support substrate W on the stage 21, and passes through the door of the support frame 41. The space below will support the substrate W to be carried out. The support substrate W that has been carried out is transported to a sealing process S2 to be described later. The new support substrate W is set on the stage 21 in the same manner as the above-described item (2).

(6) The exchange process of the wafer ring 11 is repeated as described above by mounting the semiconductor wafer t on the support substrate W. When the semiconductor wafer t on the wafer ring 11 is gone, the wafer ring 11 and the new wafer are Ring 11 is exchanged. This exchange is performed using the wafer ring holding device 32 provided on the transfer unit 30A on the left side, similarly to the above-described item (1). That is, after the semiconductor wafer t on the wafer ring 11 is not provided, the holding of the wafer ring 11 of the stretching mechanism (not shown) provided in the component supply unit 10 is released. Thereafter, the wafer ring holding device 32 stores the wafer ring 11 from the wafer ring holder 12 in the accommodating portion (not shown) in the reverse operation of the item (1), and then newly operates by the operation of the item (1). The wafer ring 11 is supplied from the accommodating portion to the wafer ring holder 12.

As shown in FIG. 13, there are cases where a plurality of semiconductor wafers t1 to t3 are mounted in one mounting area MA. In this case, after the mounting of the first semiconductor wafer t1 is completed, the wafer ring 11 on which the second semiconductor wafer t2 is mounted is set in the component supply unit 10, and the mounting on the stage 21 is set. A support substrate W of one semiconductor wafer t1. Next, by performing the same operation as the above operation, the mounting of the second semiconductor wafer t2 is sequentially performed on each of the mounting regions MA on which the first semiconductor wafer t1 is mounted. In this manner, after the second semiconductor wafer t2 is mounted on all the mounted mounting areas MA of the semiconductor wafer t1, the wafer supply ring 11 on which the third semiconductor wafer t3 is mounted is set in the component supply unit 10, and The stage 21 sets the support substrate W on which the semiconductor wafers t1 and t2 have been mounted, and the third semiconductor wafer t3 is mounted by the same operation. In this way, the plurality of semiconductor wafers t1 to t3 are mounted on the respective mounting regions MA of the support substrate W.

When the plurality of semiconductor wafers t1 to t3 are mounted in one mounting area MA, the mounting of the first semiconductor wafer t1 to all the supporting substrates W is not limited to the mounting of the second semiconductor wafer t2 as described above. method. For example, after the first semiconductor wafer t1 is mounted on one support substrate W, the semiconductor wafer t supplied from the component supply unit 10 may be switched to the second semiconductor wafer t2. Similarly to the third semiconductor wafer t3, after the second semiconductor wafer t2 is mounted on one support substrate W, the third semiconductor wafer t3 may be switched. In other words, the mounting of the plurality of semiconductor wafers t in the unit of the support substrate W may be performed. At this time, since the support substrate W is not detached from the stage 21 until the semiconductor wafer t of all types is mounted for one support substrate W, the mounting accuracy of the plurality of semiconductor wafers t can be further improved.

In the method of mounting the semiconductor wafers t of the above-described respective types to the support substrates W, the support substrate W of the semiconductor wafer t1 of the first type is temporarily carried out from the stage 21, and the semiconductor of the second type is mounted. The wafer t2 is placed on the stage 21 again. Therefore, when the semiconductor wafer t1 of the first type is mounted and the semiconductor wafer t2 of the second type is mounted, the position of the support substrate W on the stage 21 varies, that is, the placement position varies. Even if there is a case where the stage 21 accidentally becomes the same position, it is generally deviated. Although the position of the support substrate W is recognized by the global identification, there is a possibility that a deviation occurs in the identification position of the support substrate W due to a recognition error or the like. Therefore, it is presumed that the relative positional accuracy between the first type and the second type is lowered only by this part. On the other hand, when the semiconductor wafer t1 of the first type and the semiconductor wafer t2 of the second type are not removed from the stage 21 and the mounting substrate W is continuously mounted, it is possible to prevent positional deviation due to the identification error. Therefore, the relative positional accuracy between the first type and the second type can be improved.

The semiconductor wafer t mounted in the plurality of mounting regions of the support substrates W is not limited to one type. It is also possible to divide one support substrate W into a plurality of regions, and to mount semiconductor wafers t of different types in each region. For example, the semiconductor wafer ta of the A type may be mounted on the first region of the one-half half of the support substrate W in the Y direction, and the semiconductor wafer tb of the B type may be mounted in the second region of the remaining half. A semiconductor package of the A type is manufactured from the first region of the semiconductor wafer ta in which the A type is mounted. A semiconductor package of the B type is manufactured from the region of the semiconductor wafer tb in which the B type is mounted.

At this time, the semiconductor wafer ta of the A type and the semiconductor wafer tb of the B type differ in the circuit pattern for forming the rewiring layer formed in the subsequent process, and the exposure pattern for rewiring is also different. Therefore, it is estimated that it is increasingly difficult to correct the mounting errors of the semiconductor wafers ta and tb by exposure engineering. When the mounting device and the mounting method of the embodiment are applied, the semiconductor wafer ta of the A type and the semiconductor wafer tb of the B type can be mounted with high relative positional accuracy. Therefore, the exposure processing of the region of the semiconductor wafer ta of the mounting type A and the exposure processing of the region of the semiconductor wafer tb of the mounting type B can be collectively performed, and the production efficiency can be improved.

When the semiconductor wafer ta of the A type is mounted in the first region and the semiconductor wafer tb of the B type is mounted in the second region, the size of the semiconductor wafer ta of the A type and the semiconductor wafer tb of the B type are different. The mounting pitch is different from the mounting pitch of the B type. In this case, when the semiconductor wafer ta of the A type is mounted and the semiconductor wafer tb of the B type is mounted, by switching the throughput of the stage 21, the plurality of semiconductor wafers ta and tb can be satisfactorily It is mounted to a plurality of regions supporting the substrate W. Similarly, in the first region of the support substrate W, the combination of the C type of the first multi-chip package and the semiconductor wafer of the D type is mounted, and the E-type and the F-type of the second multi-chip package are mounted in the second area. Combinations of semiconductor wafers are also possible. In any of the mountings, the semiconductor wafer t of each type may be mounted on the plurality of support substrates W, or a plurality of semiconductor wafers may be mounted in the support substrate W unit. These specific mounting works are as described above.

Further, in the same case, the identification of the global mark of the support substrate W may be performed once, and the support substrate W does not have to be recognized again when the semiconductor wafer t is moved from the first region to the second region from the mounting region. The global markup is fine. In addition, when the heater 21 or the like is provided on the stage 21 to heat the support substrate W, the correction region of the stage 21 may be switched in the second region which is mounted after the first region of the semiconductor wafer t is mounted. By the way, when the semiconductor wafer ta of the A type is mounted in the first region, even if the amount of thermal expansion corresponding to the portion corresponding to the second region of the support substrate W is increased, the semiconductor wafer t(tb) can be used. The mounting accuracy is maintained at high precision.

When the semiconductor wafer t of a plurality of types is mounted in the above-described support substrate W unit, the wafer supply mechanism using the tape supply as the component supply unit 10 may be equipped with a plurality of multi-tape feeders. When the tape feeder is used, the transfer unit 30A and the mounting unit 40A on the left side, and the transfer unit 30B and the mounting unit 40B on the right side are respectively equipped with a dedicated wafer supply mechanism on both sides of the package member supply unit 10. can. In this case, different types of semiconductor wafers t or different combinations of semiconductor wafers t can be supplied with respect to the left and right transfer portions 30A, 30B and the mounting portions 40A, 40B. Therefore, it is effective to separately divide the above-mentioned support substrate W into two regions to manufacture a semiconductor package which is not in phase.

The semiconductor wafer t of the above-described one type, or the semiconductor wafers t1, t2, and t3 of a plurality of types, or the support substrate W of the semiconductor wafers ta and tb, which have been mounted, are sent to the following post-process to fabricate a semiconductor package. The kind of packaged parts. That is, the support substrate W on which the semiconductor wafer is mounted is sequentially sent to the formation process of the sealing process and the rewiring layer. In the sealing process, the gap between the semiconductor wafers mounted on the support substrate W is filled with a resin, thereby forming a suspected panel or a pseudo wafer. The suspected panel or pseudo-wafer is sent to the formation of the rewiring layer. In the formation process of the rewiring layer, the semiconductor wafer process, the process of the printed circuit board, or the circuit formation process in the process of the display panel, that is, the coating process of the photosensitive material such as a photoresist material, and the exposure of the photosensitive material are performed. And a development process, an etching process, an ion implantation process, a stripping process of a photoresist, etc., by which the rewiring layer is formed on a semiconductor wafer of a suspect panel or a wafer. A suspected panel or pseudo-wafer that forms a rewiring layer is sent to a dicing process where a packaged component of a semiconductor package is fabricated by singulating a suspected panel or a pseudo-wafer.

Therefore, as shown in FIG. 14, the manufacturing method of the package member of the embodiment includes mounting work S1 for mounting electronic components in a plurality of mounting regions of the support substrate W, and mounting on the plurality of mounting regions. The electronic component collectively seals to form a suspected wafer or a panel-like sealing process S2, re-wiring the S4 by forming a rewiring layer on the electronic component of the suspected wafer or the pseudo-panel, and manufacturing the packaged component by using a suspected panel or a pseudo-wafer Cutting engineering S4. The rewiring project S3 includes the coating process S31 of the above-described photosensitive material, the exposure and development process S32 of the photosensitive material, the etching process S33, the ion implantation process S34, and the peeling process S35 of the photoresist. The mounting process of the electronic component in the method of manufacturing the package member of the embodiment is carried out based on the method of mounting the electronic component according to the embodiment. In the method of manufacturing a package member according to the embodiment, the electronic component mounted on each of the mounting regions of the support substrate W may be a plurality of semiconductor wafers or a plurality of semiconductor wafers of the same type, as described above. can. There are no special restrictions on the variety and quantity of electronic components.

In the mounting device 1 of the above-described embodiment, the two mounting heads 43 and 43 on the left and right sides of the two mounting tools 43a and 43b are respectively positioned in the plurality of mounting regions on the support substrate W. The semiconductor wafer t is mounted in several mounting areas on a pre-set mounting line in the X direction. At this time, the movement of the stage 21 by the XY moving mechanism 22, which is the stage moving mechanism of the stage unit 20, is corrected by the stage correction of the movement position error of the stage 21, which is stored in the memory unit 51 in advance. The information is corrected. Further, the movement of the mounting tools 43a and 43b on the mounting line of the mounting tools 43a and 43b by the Y-direction moving device 41a and the X-direction moving device 42a of the mounting head moving mechanism of the left and right mounting heads 43 is used in advance and is stored in The first tool correction data of the tool correction data for correcting the movement position error of the left and right mounting tools 43a and 43b on each of the mounting wires in the memory unit 51, and the mounting tool for correcting the movement to the mounting position. Correction of the second tool correction data of the tool correction data of the position error at the time of mounting at 43a and 43b.

Thereby, when the semiconductor wafers t are individually mounted at different positions on the mounting line with respect to the support substrate W by the two mounting tools 43a and 43b, respectively, the left and right mounting heads 43 can also be made to be opposite to the support substrate W. The mounting error of the semiconductor wafer t in each of the mounted regions is lowered. Moreover, by mounting the semiconductor wafer t in the plurality of mounting regions of the support substrate W by the left and right mounting heads 43 each having the plurality of (two) mounting tools 43a and 43b, the mounting time of one semiconductor wafer t can be achieved. (the number of man-hours required for mounting the semiconductor wafer t as the mounting device 1) is lowered. Therefore, it is possible to achieve a reduction in man-hours and an improvement in mounting accuracy.

In other words, in the mounting device 1 of the embodiment, the left and right mounting heads 43 are provided with two total of four mounting tools 43a and 43b, and are normally set along the arrangement direction (X direction) of the mounting tools 43a and 43b. The semiconductor device wafer t is mounted on a certain mounting line. Therefore, the mounting positions of the four mounting tools 43a and 43b are concentrated on one line, and the simplification of the mounting time for suppressing the movement of the mounting tools 43a and 43b can be used for simplification. A pattern for generating a movement position error of each of the mounting tools 43a and 43b generated during the movement of the mounting. Thereby, the accuracy of the movement position of each of the mounting tools 43a and 43b can be ensured by a simple correction method, and the reduction in the mounting efficiency can be suppressed, and the mounting accuracy of the semiconductor wafer t can be improved.

Further, since the movement position error of the stage 21 is corrected by the stage correction data, the stage 21 can be moved with high precision with a predetermined movement amount. Thereby, the positioning accuracy when each row of the mounting area of the support substrate W is located on the mounting line can be improved. When the stage correction data is acquired, the position of the dot mark 72 provided at equal intervals on one calibration substrate 71 is recognized at each predetermined position by the substrate identification camera 43f provided on the right and left mounting heads 43. Thereby, the difference in the movement position error between the different regions on the same stage 21 can be grasped, and the semiconductor wafer t can be performed at different positions of the stage 21 (different positions on the mounting line) by the left and right mounting heads 43. The same accuracy can be ensured when mounting.

Therefore, the mounting accuracy of ±7 μm or less and the man-hour of 0.4 second or less can be achieved at the same time. As a result, the electronic component including the semiconductor wafer t can be mounted with high precision so as to be at a predetermined interval with respect to the support substrate W in which the mark for position detection is not provided in each of the mounting areas. Moreover, the electronic component including the semiconductor wafer t on the support substrate W can be mounted with high productivity. That is, by the simultaneous mounting of the left and right mounting portions 40A, 40B, it is possible to achieve a reduction in the number of man-hours required for mounting the semiconductor wafer t, and at the same time, by mounting the semiconductor wafer t on a certain mounting line. The correction of the movement position of the stage correction data and the tool correction data can simultaneously achieve the effect of improving the mounting accuracy and preventing the reduction in productivity.

For example, in consideration of the fact that the stage 21 on which the support substrate W is placed is not moved, the mounting tools 43a and 43b of the left and right mounting heads 43 are sequentially moved on the mounting areas of the support substrate W, and the mounting tools 43a and 43b are mounted. The side is made to protect the global correction material on the support substrate W. At this time, compared with the case where the correction data is made on the substrate stage side, the enlarged correction data is required, and the time required for the correction is lengthened. In other words, unlike the substrate stage 21, the mounting tools 43a and 43b are required to mount the semiconductor wafer t on the support substrate W, and the vertical movement mechanism is necessary. Therefore, when it is used as the correction data, in addition to the movement position error of the mounting head moving mechanism, the positional deviation in the XY direction due to the vertical movement of the mounting tools 43a and 43b is also considered.

Here, when the correction data is created on the mounting head side, when the stage correction data of the stage 21 is obtained, the movement position error should be measured at a short interval of 3 mm or less, for example, at a short interval of 1 mm pitch or the like. necessary. In the case where the movement position deviation is measured at a pitch of 1 mm with respect to the movement range of 600 mm × 600 mm, it is necessary to measure 600 points × 600 points, that is, 360,000 points, compared with the case where the measurement is performed at a distance of 3 mm (the distance of 3 mm is 40000 points). The measurement site was 9 times. Therefore, the measurement time is also 9 times. For example, in the mounting device 1 of the embodiment, when it takes about 4 to 5 hours to acquire the stage correction data, it takes 36 to 45 hours. This is not practical.

Therefore, the left and right mounting heads 43 each include two total of four mounting tools 43a and 43b, and the semiconductor wafer t is usually mounted on a fixed mounting line, and the movement position error of the stage 21 is used as a stage. In the mounting device 1 of the embodiment in which the correction data is corrected and the movement position error of the mounting tools 43a and 43b is corrected by the tool correction data, it is known that the mounting accuracy of the semiconductor wafer t can be improved and the semiconductor wafer can be obtained. The man-hours required for the installation of t are shortened, achieving high productivity and being extremely effective.

In the case where the left and right mounting heads 43 are provided with two mounting tools 43a and 43b, respectively, two semiconductor wafers t can be mounted by one reciprocation, and only one mounting head 43 is provided, and the left and right mounting heads can be mounted. The total moving distance of the mounting head 43 can be simply shortened compared to the configuration in which each of the mounting tools 43 is provided. When the support substrate W is increased in size by 600 × 600 mm or more, it is effective in shortening the working time based on the shortening of the moving distance of the mounting head 43. In addition, in the mounting device 1 of the embodiment, the mounting of the four mounting tools 43a and 43b of the left and right mounting heads 43 is performed, and the row of the mounting area of the supporting substrate W is fixed. When the wire loading is performed, the moving distance of the mounting head 43 can be further shortened.

Further, even if the left and right mounting heads 43 are provided with the two mounting tools 43a and 43b, respectively, the mounting position is set to a constant position, and the mounting areas of the support substrate W are sequentially placed at a fixed mounting position, and then left and right. When the mounting head 43 alternately mounts the semiconductor wafer t, the other mounting head stands by while the semiconductor wafer is mounted by one of the mounting heads. Among them, even if the actual mounting head is equipped with a plurality of mounting tools, the working hours cannot be sufficiently shortened. In addition, the mounting positions of the left and right mounting heads 43 are set to the respective mounting positions on the right and left sides, and the support substrate cannot be moved until the mounting of the semiconductor wafer by the left and right mounting heads 43 is completed. In this case, there is also a delay in the standby time for the actual head, and the shortening of the work time is prevented.

In the mounting device 1 of the embodiment, the left and right mounting heads 43 are provided with two total of four mounting tools 43a and 43b, and the semiconductor wafer t is usually mounted on a fixed mounting line, and the left and right mounting heads 43 are adjusted. It is possible to mount semiconductor wafers simultaneously with the left and right mounting heads 43. Further, after the semiconductor wafer t is mounted on one of the mounting tools 43a of one of the mounting heads 43, the mounting of the semiconductor wafer t by the other mounting tool 43b is performed by moving the mounting head 43. Therefore, the standby time when the semiconductor wafer t is mounted on the left and right mounting heads 43 can be shortened or reduced. In other words, the mounting of the semiconductor wafer t by the mounting tools 43a and 43b provided in the left and right mounting heads 43 can be more efficiently performed. By this, it is possible to efficiently assemble the electronic components such as the semiconductor wafer t by the four mounting tools 43a and 43b, and it is possible to shorten the number of man-hours as the entire mounting device 1.

As shown in FIG. 13, the mounting device 1 of the above-described embodiment mounts a plurality of types of semiconductor wafers t1, t2, and t3 in one mounting area MA, or mounts one or more types of semiconductor wafers t and Conditions such as diodes or capacitors are effective. As described above, when a plurality of types of electronic components are mounted in one mounting area, there is a difference in relative positional deviation of the plurality of electronic components in one mounting area (package), and is corrected to one in the exposure. The technique of mounting errors applicable to a single wafer package in which a semiconductor wafer is mounted in a package (package) is difficult to apply. Therefore, there is a need to improve the positional accuracy of the mounting of the plurality of electronic components. In this regard, the mounting device 1 of the embodiment can improve the mounting accuracy of each electronic component including the semiconductor wafer t, and can improve the mounting performance even when a plurality of electronic components are mounted in one mounting region. The relative positional accuracy of the complex electronic components in the area.

Further, in the above embodiment, the case where the semiconductor wafer t is mounted on the support substrate W on a fixed mounting line will be described. The predetermined mounting line may be set to the same position in the Y direction that is not normally changed in the mounting device 1, and may be, for example, a position that can be set in the Y direction in response to conditions such as the size of the supporting substrate W. . The mounting line set along the X direction may be at least a position from the start of mounting of the electronic component to be mounted to the end of mounting.

Further, in the above-described embodiment, the stage correction data for correcting the movement error of the stage 21 may be obtained over the entire movable range of the stage 21, and at least the mounting area on the support substrate W may be mounted. The position may be acquired within the range in which the stage 21 moves. Further, the tool correction data for correcting the movement position error of the mounting tools 43a and 43b may be obtained in the entire range of the movable range of the mounting tools 43a and 43b, and at least the mounting area on the support substrate W may be provided. When the semiconductor wafer t is mounted, it may be obtained within the range of movement of the mounting tools 43a and 43b. Further, the stage correction data and the tool correction data may be used by using the movement position error of the stage 21 and the actual measurement value of the movement position error of the mounting tools 43a and 43b, or the correction value for canceling the movement position error. Measured value processor. It is mainly used to correct the movement position error of the stage 21 and the mounting tools 43a and 43b.

In the mounting device 1 of the above-described embodiment, an example in which the semiconductor wafer t is mounted on the support substrate W with the electrode forming surface (upper surface) facing upward is mainly described as an example. On the other hand, the semiconductor wafer t can be mounted on the support substrate W with the surface on which the electrode formation surface faces downward.

When the mounting device 1 of the embodiment is mounted face down, the semiconductor wafer t taken out by the adsorption nozzles 37a and 37b of the transfer unit 30 is not placed on the intermediate stage 31, and the reversing mechanism 37e is used. 37f causes the adsorption nozzles 37a and 37b to be inverted upside down. In this state, the adsorption nozzles 37a and 37b are moved on the intermediate stage 31, and the semiconductor wafer t is taken up from the adsorption nozzles 37a and 37b to the mounting tools 43a and 43b of the mounting unit 40.

The operation after the semiconductor wafer t is received by the mounting tools 43a and 43b can be performed in the same manner as the above-described item (4). In addition, although the wafer identification cameras 44a to 44d can be used for detecting the position of the semiconductor wafer t before mounting, the camera of the semiconductor wafer t that is sucked and held by the mounting tools 43a and 43b from the lower side is disposed on the camera. The intermediate stage 31 may be disposed in the vicinity of or in place of the intermediate stage 31. why? Since the semiconductor wafer t is adsorbed and held by the mounting tools 43a and 43b with the electrode forming surface facing downward in the face-down bonding, the alignment mark of the semiconductor wafer t is usually provided on the electrode forming surface, and the wafer identification camera 44a is provided. ～44d cannot capture the alignment mark of the semiconductor wafer t.

Here, when a camera that adsorbs and holds the semiconductor wafer t held by the mounting tools 43a and 43b from the lower side is provided, the alignment mark of the semiconductor wafer t held by the mounting tools 43a and 43b can be directly imaged. When the wafer identification cameras 44a to 44d are used, the positional relationship between the alignment marks and the outer shape position of the semiconductor wafer t is recognized in advance at the stage where the wafer identification camera 38 detects the position of the alignment mark of the semiconductor wafer t. Next, after the semiconductor wafer t is adsorbed and held by the mounting tools 43a and 43b, the semiconductor wafer t is imaged by the wafer identification cameras 44a to 44d by the mounting tools 43a and 43b, based on the shape of the semiconductor wafer t obtained from the image pickup image. The positional relationship between the position and the previously recognized alignment mark and the outer shape position of the semiconductor wafer t may be detected and held at the position of the semiconductor wafer t held by the mounting tools 43a and 43b.

In the above-described embodiment, an example in which two mounting tools 43a and 43b are provided in each of the left and right mounting heads 43 is described. However, the number of mounting tools may be three or more. However, since the number of mounting tools increases, the proximity interval becomes large, and the size of the support substrate W on which the semiconductor wafer t is mounted is preferably set. In the 600 × 600 mm support substrate W exemplified in the present embodiment, the number of mounting tools with respect to one of the mounting heads 43 is preferably 2 to 3.

In the above-described embodiment, an example in which one of the mounting heads 43 is disposed on the left side as the first mounting head and one of the mounting heads 43 is disposed on the right side as the second mounting head is described. However, the present invention is not limited thereto. It is also possible to separately configure the plurality of mounting heads 43. In other words, the first and second mounting heads are not necessarily required to be constituted by a single solid head, and may be constituted by a plurality of solid heads. In this case, the plurality of mounting heads may be arranged in the Y direction, and may be configured to be independently movable in the XYZθ direction. At this time, the support frame 41 supporting the Y-direction moving device 41a may be shared by a plurality of solid heads, and may be provided individually for each of the mounting heads.

Further, in the above-described embodiment, the support substrate W is not provided with a mark for position detection in each of the mounting regions, and is described as being removed during the manufacturing process of the package member, but is not limited thereto. According to the mounting apparatus and the mounting method of the embodiment, for example, a mark for position detection is provided in each of the mounting regions, that is, a substrate for use as a part of the package member is of course not required to be used for the mark for position detection. It is also possible to mount a semiconductor wafer (electronic component) with high precision and high efficiency. [Examples]

Next, examples of the present invention and evaluation results thereof will be described.

(Example 1) Using the mounting device 1 of the above-described embodiment, the mounting of the semiconductor wafer was actually performed on the support substrate under the following conditions. The target mounting accuracy is within ±7μm and the target working time is within 0.45 seconds. <Finishing conditions> ・The size of the semiconductor wafer t: 4mm × 4mm ・The number of mountings (vertical × horizontal): 14 × 7 for each 1 mounting head (98) 1 for each 1 mounting tool × 7 (49) × 4 mounting tools and mounting pitch (longitudinal × horizontal): 12 mm × 60 mm per 1 mounting head 24 mm × 60 mm per 1 mounting tool ・ Engagement time: 0.1 second ・ Bonding load: 5N (Newton)

Fig. 15 is a view schematically showing a mounting area set on the support substrate W. However, in the actual support substrate W, only the global mark is set, and the mounting area cannot be recognized. As shown in FIG. 15, in the support substrate W for measurement, 49 mountings are set in seven positions in the X direction and seven positions in the Y direction with respect to the mounting tools 43a and 43b of the right and left mounting heads 43, respectively. region. The mounting area of the left mounting tool 43a of the left mounting head 43 is indicated by the symbols A1 to A49 and the mounting area of the right mounting tool 43b of the left mounting head 43 by the symbols B1 to B49 and the left of the right mounting head 43. The mounting area of the mounting tool 43a is indicated by the symbols C1 to C49 and the mounting area of the right mounting tool 43b of the right mounting head 43 by symbols D1 to D49.

Further, together with the left and right mounting heads 43, the mounting area of the left mounting tool 43a is indicated by the four corners of the opposite sides (□) and the mounting area of the right mounting tool 43b by blackened corners (■). The mounting area of each of the mounting tools 43a and 43b of the left mounting head 43 is set in the left half of the support substrate W, and the mounting tools 43a and 43b of the right mounting head 43 are set in the right half of the area. Loading area. The mounting areas of the left and right mounting tools 43a and 43b are set so as to be alternately arranged in the X direction. The interval of the mounting area is set to 12 mm. In other words, in the X direction, a total of 14 mounting areas are set at intervals of 12 mm with respect to the Y direction, and seven mounting areas are respectively set at intervals of 60 mm.

As shown in FIG. 15, together with the area of the left half and the area of the right half, the upper left mounting areas A1 and C1 are used as starting points, and the X direction indicated by the dotted arrow in the figure is a reentry path. The left and right mounting tools 43a, 43b are interactively mounted. When the first semiconductor wafer t is sucked and held from the mounting tools 43a and 43b of the mounting heads 43, the left mounting tool 43a starts to descend toward the first mounting area A1, and the right mounting tool 43b ends. The elapsed time (referred to as "time required for mounting") of the final (49th) semiconductor wafer t and the rise of the original height is 41.2 seconds. Thereby, the mounting position deviation of the 98 semiconductor wafers t mounted on the support substrate W is measured by an inspection apparatus. The results are shown in Table 1.

In Table 1, the symbols of the mounting area of Fig. 15 are indicated by English letters and numbers, respectively. That is, the English letters (A, B, C, and D) corresponding to the mounting tools 43a and 43b are listed as a table, and the numbers are described as rows in the table. The amount of positional deviation of the semiconductor wafer t in the X direction and the Y direction in each of the mounting regions is indicated by each of the mounting tools 43a and 43b. In addition, the unit is micrometer [μm]. Under the data of the mounting position deviation of the semiconductor wafer t of each of the mounting tools 43a and 43b, the average value, the minimum value, the maximum value, the maximum value, and the minimum value of the positional deviation of each of the mounting tools 43a and 43b are respectively described. The width, the σ value, and the 3σ value are described on the right side of the data of all the mounting position deviations as the same value of the object.

As shown in Table 1, the maximum value of the positional deviation of the semiconductor wafer t in the X direction is 3.1 μm of the mounting area number D1 caused by the right mounting tool 43b of the right mounting head 43, and the minimum value is the right mounting head 43. The left mounting tool 43a causes the mounting area number C35 to be -3.3 μm. Further, the maximum value of the positional deviation in the Y direction is 3.2 μm of the mounting area number B2 by the right mounting tool 43b of the left mounting head 43, and the minimum value is caused by the right mounting tool 43b of the right mounting head 43. The mounting area number D43 is -2.8 μm. It was confirmed that the mounting accuracy of the 196 semiconductor wafers t was within ±7 μm of the target. Since the time required for mounting is 41.2 seconds, the time required for the mounting of one semiconductor wafer t is 41.2 seconds / 98 = 0.42 seconds. Therefore, the working time is 0.42 seconds, and the number of production per hour is about 8570 (= 3600 seconds / 0.42 seconds).

(Comparative Example 1) The semiconductor wafer t was mounted on each of the mounting regions of the support substrate W under the same conditions as in the first embodiment except that the stage correction data and the tool correction data were not used. The results of measurement of the mounting position deviation of the 196 semiconductor wafers t mounted on the support substrate W by the inspection apparatus are shown in Table 2.

As shown in Table 2, the maximum value of the positional deviation of the semiconductor wafer t in the X direction is 8.8 μm of the mounting area number B7 caused by the right mounting tool 43b of the left mounting head 43, and the minimum value is the right mounting head 43. The left mounting tool 43a has a mounting area number C43 of -27.0 μm. The maximum value of the positional deviation in the Y direction is 23.7 μm of the mounting area number C23 caused by the left mounting tool 43a of the right mounting head 43, and the minimum value is the mounting of the left mounting tool 43a of the right mounting head 43. The area number C45 is -22.7 μm. In Comparative Example 1, it was confirmed that the mounting accuracy of the semiconductor wafer t was not able to satisfy the target within ±7 μm.

The embodiments of the present invention have been described, but the embodiments are merely illustrative and are not intended to limit the scope of the invention. The various embodiments of the invention may be carried out in various other forms, and various omissions, substitutions and changes may be made without departing from the scope of the invention. The invention and its modifications are intended to be included within the scope and spirit of the invention.

1‧‧‧Installation device

10‧‧‧ Parts Supply Department

11‧‧‧ wafer ring

12‧‧‧ Wafer ring bracket

20‧‧‧Depot

21‧‧‧ stage

22‧‧‧XY mobile mechanism

30, 30A, 30B‧‧‧Transportation Department

31‧‧‧Intermediate stage

37‧‧‧Transfer head

40, 40A, 40B‧‧‧Secure Department

41‧‧‧Support framework

41a‧‧‧Y direction mobile device

42a‧‧‧X direction mobile device

43‧‧‧Finished head

43a, 43b‧‧‧Installation tools

43c, 43d‧‧‧Z direction mobile device

43f‧‧‧Substrate identification camera

44‧‧‧ camera unit

44a, 44b, 44c, 44d‧‧‧ wafer identification camera

50‧‧‧Control Department

51‧‧‧Memory Department

W‧‧‧Support substrate

t‧‧‧Semiconductor wafer

T‧‧‧Semiconductor Wafer

Fig. 1 is a plan view showing a mounting device of an embodiment. Fig. 2 is a front elevational view showing the mounting device of the embodiment. Fig. 3 is a right side view showing the mounting device of the embodiment. Fig. 4 is a block diagram showing the configuration of a mounting device of the embodiment. Fig. 5 is a view showing a combination of mounting operations performed by a mounting tool of the mounting device of the embodiment. Fig. 6 is a view showing a preparation process of a substrate stage and a tool for correcting a mounting tool in the mounting device of the embodiment. Fig. 7 is a view showing a calibration process of a substrate stage and a mounting tool in the mounting device of the embodiment. FIG. 8 is a plan view showing an example of an operation state of the mounting device according to the embodiment, and shows an operation state of the exchange wafer ring. Fig. 9 is a view for explaining a method of correcting a movement position error of a substrate stage in the mounting device of the embodiment. [Fig. 10] A plan view showing an example of an operation state of the mounting device according to the embodiment, showing a state in which the left and right transfer heads and the left and right mounting heads are located at different positions. Fig. 11 is a front elevational view showing the mounting device of the embodiment, and the component supply portion and the left and right transfer portions are omitted. Fig. 12 is a front elevational view showing the mounting device of the embodiment, and the entire component supply unit and the transfer unit are omitted. Fig. 13 is a plan view showing an example of an electronic component mounted in one mounting area using the mounting device of the embodiment. Fig. 14 is a flow chart showing a manufacturing process of a package member according to an embodiment. Fig. 15 is a plan view showing a support substrate on which a semiconductor wafer is mounted using the mounting devices of the first embodiment and the comparative example 1.

Claims (11)

An apparatus for mounting an electronic component in which a substrate is mounted on an electronic component, comprising: a stage portion including: a stage on which the support substrate having a plurality of mounting regions of the electronic component is mounted; and a stage moving mechanism that moves the stage in a Y direction perpendicular to the X direction in one direction in the horizontal direction, and a mounting unit that includes a plurality of mounting tools arranged along the X direction and each of which holds the electronic component The first and second mounting heads, and the mounting head moving mechanism that moves the first and second mounting heads holding the electronic component on the mounting line set along the X direction by the plurality of mounting tools a first identification unit that identifies an entire position of the support substrate placed on the stage; and a second identification unit that identifies the electronic component of the plurality of mounting tools held by the first and second mounting heads a position of the component; the memory portion includes: a correction data for the stage that corrects a movement position error of the stage caused by the stage moving mechanism, and a correction of the head movement of the mounting head a tool correction data for the movement position error of each of the plurality of mounting tools of the first and second mounting heads on the mounting line, and a control unit based on the aforementioned identification by the first identification unit Position data of the support substrate, the stage correction data stored in the memory unit, position data of the electronic component held by the plurality of mounting tools recognized by the second identification unit, and the aforementioned memory stored in the memory unit The tool correction data is arranged such that the rows of the mounting regions along the X direction in the support substrate are sequentially arranged on the mounting line, and the electronic components disposed in the plurality of mounting regions of the mounting wires are arranged The operation of the stage moving mechanism and the mounting head moving mechanism is controlled so that the first and second mounting heads are shared. The mounting device according to claim 1, wherein the stage has a size capable of mounting the support substrate, and the support substrate has the outer side of the first and second mounting heads located outside in the X direction The size of the aforementioned X direction is twice or more of the proximity of the mounting tools. The mounting device according to claim 1, wherein the stage has a size capable of mounting the support substrate, and the support substrate has a size of 300 mm or more in the X direction. The mounting device according to any one of claims 1 to 3, wherein the mounting portion mounts the plurality of electronic components in one of the mounting regions of the support substrate. The mounting device according to any one of claims 1 to 3, further comprising: a component supply unit that supplies the electronic component; and a transfer unit that receives the electronic component from the component supply unit, respectively The electronic component is supplied to the first and second transfer nozzles of the plurality of mounting tools of the first or second mounting head. A method of mounting an electronic component in which a substrate is mounted on an electronic component, comprising: acquiring a movement position error of a stage on which a support substrate having a plurality of mounting regions of the electronic component is mounted; and correcting the movement position error The stage correction data is stored in the memory unit; the first and second mounting heads are disposed in the X direction in one direction in the horizontal direction, and the movement position error of the plurality of mounting tools of the electronic component is maintained. Obtaining, in the mounting line set along the X direction, a tool for correcting the tool correction data for correcting the movement position error to the memory unit; placing the support substrate on the stage and identifying the carrier on the stage The entire position of the support substrate; the position data of the support substrate obtained by the position recognition project of the support substrate and the stage correction data to correct the movement of the stage, and at the same time in the plurality of mounting areas The row of the above-mentioned mounting area along the aforementioned X direction is located on the side of the aforementioned mounting line a process of moving the stage; the electronic component is interactively received by the plurality of mounting tools of the first and second mounting heads, and the position of the electronic component held by the plurality of mounting tools is recognized and identified based on the identification The positional data of the electronic component and the tool correction data obtained to correct the movement of the plurality of mounting tools of the first and second mounting heads, and moving the first and second mounting heads on the mounting line The electronic component is shared by the first and second mounting heads in the mounting area of the mounting line by the plurality of mounting tools of the first and second mounting heads. The mounting method according to claim 6, wherein the support substrate has the X that is twice or more the distance between the mounting tools of the first and second mounting heads located outside the X direction. The size of the direction. The mounting method according to claim 6, wherein the support substrate has a size in the X direction of 300 mm or more. The mounting method according to any one of the preceding claims, wherein the mounting process includes a process of mounting the plurality of electronic components in one of the mounting regions of the support substrate. A method of manufacturing a package member, comprising: separately mounting an electronic component in a plurality of mounting regions of a support substrate, and collectively sealing the electronic component mounted in the plurality of mounting regions to form a suspected wafer or a pseudo panel And a process for manufacturing a package component by forming a rewiring layer on the electronic component of the suspected wafer or the pseudo panel; wherein the mounting of the electronic component includes: acquiring a carrier on which the support substrate is placed The movement position error of the stage, the stage correction data for correcting the movement position error is memorized to the memory unit; and the first and second solid heads arranged in the X direction in one direction in the horizontal direction are held and held The movement position error of the plurality of mounting tools of the electronic component is obtained on a mounting line set along the X direction, and the tool correction data for correcting the movement position error is stored in the memory unit; The support substrate simultaneously recognizes the entirety of the support substrate placed on the stage Fixing the movement of the stage based on the position data of the support substrate obtained by the position recognition project of the support substrate and the stage correction data, and simultaneously making the plurality of mounting areas along the X direction a step of moving the stage in such a manner that the row of the mounting area is located in the mounting line; and the electronic component is interactively received by the plurality of mounting tools of the first and second mounting heads And correcting the movement of the plurality of mounting tools of the first and second mounting heads based on the position information of the electronic component and the tool correction data of the plurality of mounting tools; The first and second mounting heads are moved on the mounting line, and the electronic component is placed in the mounting area of the mounting line by the plurality of mounting tools of the first and second mounting heads. The first and second actual heads share the work of the installation. The method of manufacturing a package member according to claim 10, wherein the mounting of the electronic component includes a process of mounting the plurality of electronic components in one of the mounting regions of the support substrate.