JP2013004615A - Electronic component mounting device and electronic component mounting method - Google Patents

Abstract

【Task】
The present invention is to provide a highly versatile electronic component mounting apparatus and electronic component mounting method capable of mounting not only a die on a substrate but also mounting a die and an electronic component other than the die together.
[Solution]
The present invention relates to an electronic component mounting apparatus or electronic component mounting method for transporting a substrate, picking up a die from a wafer, and mounting the picked die on the substrate, in parallel with a first transport line for transporting the substrate. A component supply unit including components that are electronic components other than the die is transported by a second transport line provided in the component, the component is picked up from the component transport unit, and the component is mounted on the substrate. And
[Selection] Figure 1

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method, and more particularly to an electronic component mounting apparatus and an electronic component mounting method capable of mounting a die (semiconductor chip) and an electronic component other than the die on a substrate.

  With recent manufacturing technology and progress of bare semiconductor chips (hereinafter referred to as dies), it is desired to mount electronic components that are surface mount components other than the die together with the die.

  As a technology for such a requirement, a feeder or tray for supplying electronic components is provided on a fixed base, and a die and an electronic component other than the die are both attracted and transported by a mounting head that moves in the X and Y directions. There is a method of mounting (Patent Document 1).

  Further, Patent Document 2 discloses a method in which a feeder is mounted on a fixed base, a tray is transported by one line of two transport lines, an electronic component other than a die is supplied, and mounted on a substrate transported by another transport line. Has been.

JP 2006-080105 A JP 2009-182025 A

However, in the techniques disclosed in Patent Documents 1 and 2, the mechanism for moving the mounting head in the X and Y directions becomes heavy and the structure tends to be complicated, and the electronic component mounting apparatus is also enlarged.
Further, in the technique disclosed in Patent Document 2, there is no disclosure of a problem with respect to mounting a die and an electronic component other than the die together and a solution to the problem.

  Accordingly, an object of the present invention is to provide a small electronic component mounting apparatus capable of mounting a die and an electronic component other than the die together, and an electronic component mounting method capable of realizing a small electronic component mounting apparatus.

In order to achieve the above object, the present invention has at least the following features.
The present invention provides a transport unit having a plurality of transport lines capable of transporting a substrate, a die supply unit that holds a wafer, a pickup head that picks up a die from the wafer, and a mounting that mounts the picked-up die on the substrate In the electronic component mounting apparatus having a head, the transport unit is provided in parallel with a first transport line that transports the substrate in a first direction out of two directions on a horizontal plane, and the first transport line. A second conveyance line that conveys a component supply unit including components that are electronic components other than the die, and the mounting head that picks up the component from the component supply unit and mounts the component on the substrate. Is the first feature.

  Further, the present invention provides an electronic component mounting method for transporting a substrate, picking up a die from a wafer, and mounting the picked-up die on the substrate, and is provided in parallel with a first transport line for transporting the substrate. A second supply line that transports a component supply unit including a component that is an electronic component other than the die, picks up the component from the component transport unit, and mounts the component on the substrate. And

  The present invention further includes a drive unit that moves the die supply unit in a direction parallel to the first direction, the mounting head reciprocates in a second direction orthogonal to the first direction, The component supply unit and the mounting head are aligned by the movement of the component supply unit in one direction and the movement of the mounting head in the second direction, and the mounting head removes the component from the component supply unit. A third feature is that the pickup is mounted on the substrate that moves in the second direction and reciprocates in the first direction.

Further, according to the present invention, the alignment of the conveyance direction to the position where the die and the component are mounted on the substrate is performed by controlling the positions on the conveyance of the first conveyance line and the second conveyance line. This is the fourth feature.
Furthermore, the present invention is characterized in that the pickup head is the mounting head.

According to a sixth aspect of the present invention, the die picked up from the wafer is placed on a pre-alignment stage, the die is picked up from the pre-alignment stage, and mounted on the substrate.
The seventh aspect of the present invention is that the component recognition camera provided between the wafer and the first transfer line images at least the mounting state of the die or the component among the components.

Further, according to the present invention, the component recognition camera provided between the first transport line and the second transport line images the mounting state of at least the part among the die or the part. Features.
The ninth feature of the present invention is that the die pick-up from the pre-alignment stage and the component pick-up from the component supply unit are performed by different mounting heads and mounted on the substrate.

  Therefore, according to the present invention, it is possible to provide a small electronic component mounting apparatus that can mount a die and an electronic component other than the die together, and an electronic component mounting method that can realize a small electronic component mounting apparatus.

It is a figure showing the schematic diagram of the electronic parts mounting device which is a 1st embodiment of the present invention. It is a figure which shows the state which has mounted the several sheet | seat board | substrate on one conveyance pallet, and the component supply part which supplies electronic components other than die | dye to a board | substrate with the die supply part on the other conveyance pallet. It is a figure which shows the schematic of the electronic component mounting apparatus which is the 2nd Embodiment of this invention. It is a figure which shows the schematic of the electronic component mounting apparatus which is the 3rd Embodiment of this invention. It is a figure which shows the schematic of the electronic component mounting apparatus which is the 4th Embodiment of this invention.

FIG. 1 is a diagram showing a schematic diagram of an electronic component mounting apparatus 100 according to the first embodiment of the present invention. FIG. 1A is a top view of the electronic component mounting apparatus 100, and FIG. 1B is a front view as viewed from the arrow A in FIG.
The electronic component mounting apparatus 100 is roughly divided into a die supply unit 1 that pushes the die D from the wafer 11 and components that are electronic components such as integrated circuits and connectors (hereinafter, unless otherwise specified, A component supply unit 2 that supplies components (referred to as electronic components when both a die and a component are shown), and a mounting unit 4 that picks up the die D and the components by the mounting head 41 and mounts them on the substrate P that has been conveyed. The substrate supply unit 6 for supplying the substrate to the transfer pallet 51, the transfer pallet 51 from the substrate supply unit 6 to the substrate unloading unit 7 via the mounting position, and the component supply unit 2 is moved in the X direction. A transport unit 5, a substrate carry-out unit 7 that receives the substrate P on which the die D is mounted (bonded) from the substrate transport pallet 51, and a control unit 8 that monitors and controls the operation of each unit.

Next, the configuration and operation of each part of the electronic component mounting apparatus 100 according to the embodiment will be described in detail with reference to FIG.
First, the conveyance part 5 and the component supply part 2 are demonstrated using FIG.1 and FIG.2. FIG. 2 is a diagram showing only the transport unit 5 and the component supply unit 2 in the electronic component mounting apparatus shown in FIG.

  The conveyance unit 5 moves the conveyance pallet 51 on which the component supply unit 2 for supplying the substrate P and the components, the pallet rail 52 on which the conveyance pallet 51 moves, and the conveyance pallet 51 in the X (left and right in the drawing) direction. And a first transport line 5A and a second transport line 5B having the same structure provided in parallel. As shown in FIG. 2, the pallet driving unit 53 includes a nut 53n indicated by a broken line fixed to the substrate carrying pallet 51, a ball joint 53b for moving the nut, and a drive motor 53m for driving the ball joint.

  FIG. 2 shows a component supply unit that places a plurality of substrates P (two or even one in FIG. 2) on one transfer pallet 51 and supplies components together with the die supply unit 1 to the other transfer pallet 51. The state which has mounted 2 is shown. In the present embodiment, the component supply unit 2 includes one or a plurality of feeders 21 (three in FIG. 2) that can take out components such as an integrated circuit built in a supply tape (not shown) from the takeout port 21d. ) And a tray 22 in which connectors and the like are arranged on the board surface. The component supply unit 2 may be only the feeder 21 or only the tray 22.

  With this configuration, the transport unit 5 moves the substrate P to the mounting position and the component supply unit 2 to the suction position of the mounting head 41.

  Next, the die supply unit 1 will be described with reference to FIG. The die supply unit 1 moves the wafer holding table in the X and Y directions, a wafer recognition camera 18 that detects the alignment mark of the wafer to set the wafer at a predetermined position, a wafer holding table 12 that holds the wafer 11, and the wafer holding table. An XY drive unit 15 to be moved, a push-up unit 13 that pushes up the die D so that the mounting head 41 can be attracted and picked up, and a holding unit base 17 that fixes the XY drive unit 15 and the push-up unit 13. Furthermore, a mechanism for finely adjusting the position of the push-up unit 13 may be provided.

  The die supply unit 1 selects the die D on the wafer to be picked up by the XY drive unit 15 and pushes up the die D selected by the push-up unit 13 so that the mounting head 41 can suck and pick up.

  Next, the mounting portion 4 will be described with reference to FIG. The mounting unit 4 has a suction nozzle 46 that sucks the die D from the wafer 11 and a component from the component supply unit 2, and a plurality of suction nozzles 46 (four in FIG. 1). The mounting head 41 that picks up the component and mounts it on the substrate P that has been transported, the two component recognition cameras 42 that capture the holding state of the die D of the mounting head 41, and the mounting head 41 are moved in the Y direction. A Y drive shaft 43 and a substrate recognition camera 44 that images a position recognition mark (not shown) of the substrate P that has been transported and recognizes the mounting position of the die D to be mounted. Reference numeral 45 denotes a mounting head nozzle stocker that stocks the replacement suction nozzle 46 when the model is changed to change the substrate to be processed.

  With such a configuration, the mounting head 41 picks up the die D and the component, images the holding state of the die D and the component with the component recognition camera 42 while moving along the Y drive axis, and mounts based on the result. The position and orientation are corrected, and the die D and components are mounted on the board P.

  In the present embodiment, the four suction nozzles 46 of the mounting head 41 suck the die D and three components, or four components, and mount (bond) them on the substrate P. Positioning in the X (conveyance) direction to the take-out position 21d (see FIG. 2) of the feeder 21 and the tray 22 is performed by controlling the conveyance unit 5 and moving the conveyance pallet 51 in the X (conveyance) direction. On the other hand, alignment in the Y direction is performed by the Y drive unit 43 of the mounting head 41. The alignment to the mounting position on the substrate P is similarly performed by allocating to the transport unit 5 and the Y drive unit 43, or sequentially from the front end (upstream) side of the substrate in the X direction.

Next, returning to FIG. 2, the relationship between the position of the component supply device 2 and the position of the board P and the relationship between the overall operation of the present embodiment and the position of the component recognition camera 42 will be described.
FIG. 2A is a diagram illustrating an example in which the component supply unit 2, the substrate P, and the wafer 11 are provided in the Y direction. FIG. 2B is a diagram showing an example in which the substrate P, the component supply unit 2, and the wafer are provided in the Y direction in this order.

  In the case of FIG. 2A, the installation position of the component recognition camera 42 that recognizes the mounting state of the electronic component of the mounting head 41 differs depending on the movement of the mounting head 41. If a component is picked up from the component supply unit 2 after picking up the die D from the wafer 11, it is necessary to take an image after picking up the component. Therefore, the component recognition camera 42 needs to be provided at least at the position of 42C. On the other hand, if the die D is picked up from the wafer 11 after picking up the component from the component supply unit 2, the component recognition camera 42 needs to be provided at least at the position 42B.

  Unlike the above, in order to pick up an image after picking up each electronic component, it is necessary to provide both component recognition cameras 42B and 42C. Providing both has the advantage that the processing time can be afforded. Further, when the number of times of picking up and mounting (bonding) only one electronic component is large, by providing the component recognition camera 42 on the electronic component side, the moving time of the mounting head 41 can be shortened, and the processing time can be shortened. For example, the component recognition camera 42 is provided at the position 42C if the number of times is not the die D side but the component side.

  On the other hand, in the case of FIG. 2B, if the component recognition camera 42 is provided at the position 42C, the mounting head can pass over the component recognition camera 42 without any useless movement in any case. The adsorption state of 41 electronic components can be grasped. In the case of FIG. 2B, the processing of the die D takes time.

  Which case described above should be used may be determined according to the processing content.

  Therefore, according to the first embodiment described above, the mounting head 41 only needs to move in the Y direction by reciprocating at least one of the substrate and the component supply unit in the transport direction. It is possible to provide an electronic component mounting apparatus and an electronic component mounting method capable of mounting together a die and an electronic component other than the die with a small structure in which the mechanism can be simplified as much as possible.

  In addition, according to the first embodiment described above, the die supply unit that supplies the die is provided in the fixed unit, and the component is placed and moved on the transport unit that transports the substrate. A small electronic component mounting apparatus that can be mounted and an electronic component mounting method that can realize a small electronic component mounting apparatus can be provided.

  Furthermore, according to the present embodiment, an electronic component mounting method capable of realizing an electronic component mounting apparatus capable of reducing the mounting time by arranging the component recognition camera 42 according to the mounting frequency and mounting order of the die and components is provided. it can.

  In the electronic component mounting apparatus 100 according to the first embodiment described above, the substrate P is transported to one transport line, the component supply unit 2 is placed and moved to the other transport line, and the die D and the component are moved. Is mounted on the substrate P. In addition, the electronic component mounting apparatus 100 can transport a substrate through two transport lines, pick up a die from the die supply unit 1, and alternately mount the substrates on the substrates of the two transport lines. For example, while the die D is mounted on the substrate of one transport line, the substrate of the other transport line is transported to the substrate carry-out unit 7 and returned to the substrate carry-in unit 6 to place a new substrate. By sequentially repeating this, it can be mounted alternately.

  Therefore, according to the first embodiment, a highly versatile electronic component mounting apparatus capable of selectively performing a mounting operation for mounting both the die D and the component on the substrate and a mounting operation for mounting only the die D on the substrate. And an electronic component mounting method.

  Furthermore, in the electronic component mounting apparatus 100 according to the first embodiment described above, the mounting head 41 has a drive unit only in the Y direction. However, the transport pallet 51 is provided with an X drive unit that moves in the X direction. The die D or component may be mounted on the substrate P with the side stopped. In this case, the effect of simplifying the mounting head cannot be achieved, but other effects can be achieved.

  FIG. 3 is a diagram showing a schematic diagram of an electronic component mounting apparatus 200 according to the second embodiment of the present invention. FIG. 3A is a top view of the electronic component mounting apparatus 200, and FIG. 3B is a front view as viewed from the arrow A in FIG.

The difference of the second embodiment from the first embodiment is as follows.
First, the die supply unit 1 has a plurality of wafer holding tables 12 (four in FIG. 3) for holding wafers so that different or the same type of dies D can be supplied. Second, in order to shorten the processing time for picking up, the mounting head 41 does not pick up the die D directly from the wafer 11 but provides a dedicated pickup unit 9 for picking up the die D. Third, a pre-alignment unit 4 having a pre-alignment stage (hereinafter simply referred to as a pre-stage) 31 on which the picked up die D is placed is provided. Fourth, since the number of parts that can be sucked by the mounting head 41 is increased, the number of suction nozzles 46 is increased. In the second embodiment, the number is increased from 4 to 8.

  Next, different points will be described. As shown in FIG. 3B, the first die supply unit 1 includes four wafer holding tables 12, a wafer holding stage 14 that fixes the four wafer holding tables in a square shape, and a wafer holding stage 14. And an XY drive unit 15 for moving the wafer holding stage 14 and the rotation drive unit 16 in the X and Y directions. The XY drive unit 15 is basically fixed to a predetermined position of the holding unit base 17 together with the push-up unit 13. Basically, the push-up unit 13 may have a fine adjustment mechanism if necessary.

  In this embodiment, since the position of the push-up unit 13 is basically fixed, the die D of each wafer 11 is moved to the position of the push-up unit 13. For example, when starting from the wear 11 shown in the lattice shape of FIG. 3A, an initial position is set for the wafer 11 and a die is picked up. Thereafter, if the same type of die is rotated 90 degrees (counterclockwise), the die D at the same position on the wafer comes to the pickup position. If the dies have different dimensions, they are moved in the XY directions by the XY drive unit 15 and adjusted so that the die D comes to the position of the push-up unit 13. This operation is performed until one rotation. After one rotation, the wafer 11 on the lattice is moved by the XY drive unit 15 so that the adjacent die D is brought to the push-up position. These operations are repeated.

  When the dimensions of the dies are different, there is an advantage that it is easier to control by providing a drive unit that moves the push-up unit 13 in the XY directions.

  Next, the pickup unit 9 includes a pickup head 91 that picks up and picks up the die pushed up by the push-up unit 13 and an X drive shaft 92 that moves the pickup head 91 in the X direction. In accordance with the operation of the wafer holding unit 1, the pickup head 91 reciprocates between the push-up position of the die D and the prestage 31 by the X drive shaft 92, and sequentially moves the four dies to the prestage 31. ) Place in a row in the direction. Reference numeral 94 denotes a pickup nozzle stocker for the suction nozzle 26 of the pickup head 21.

  Next, in the pre-alignment unit 3, in addition to the pre-stage 31, in this embodiment, the pickup head 91 does not have a degree of freedom in the Y direction, so the pickup head 91 forms the dies D in a row in the Y (longitudinal) direction. The Y drive shaft 33 that moves the prestage 31 in the Y direction and the placement component recognition camera 35 for imaging the placement state of the die D are provided. The movable range in the Y direction may be widened not only to place the die D but also to the front of the component recognition camera 42A in order to narrow the moving range of the mounting head 41 and shorten the processing time as a whole.

  With the above configuration, the mounting head 41 picks up and picks up a maximum of four dies from the prestage 31, and takes out the components from the component supply unit 2 with the other suction nozzles 46 and mounts them on the substrate P. In this case, the suction nozzles do not have to be assigned to the die D or the component, but, for example, in the two rows of eight suction nozzles, the four suction nozzles 46 in the row close to the drive shaft 43 with respect to the die D. It is also possible to assign four suction nozzles 46 in a row far from the drive shaft 43 to the part. In this case, the processing time can be shortened by imaging the suction state of the die D with the component recognition camera 42B adjacent to the pre-stage 31 and the component recognition camera 42C adjacent to the component supply unit 2. Further, there is an advantage that it is not necessary to move the imaging positions of the component recognition cameras 42B and 42C due to the positional deviation between the two rows.

  The relationship between the position of the component supply apparatus 2 shown in FIG. 2 and the position of the substrate P described in the first embodiment and the relationship between the overall operation of the present embodiment and the position of the component recognition camera 42 are as follows. The same applies to the embodiments.

  Therefore, also in the second embodiment described above, the same effects can be obtained as in the first embodiment.

In the second embodiment described above, the mounting process is shared between the mounting head 41 and the pickup head 92 by picking up the die D with the pickup head 91 different from the mounting head 41 and placing it on the prestage 31. This shortens the mounting process.
Furthermore, in the second embodiment described above, by moving the prestage 31 in the Y direction, the burden on the mounting head can be reduced and the mounting process can be shortened.

FIG. 4 is a diagram showing a schematic diagram of an electronic component mounting apparatus 300 according to the third embodiment of the present invention.
FIG. 4 is a diagram showing a top view of the electronic component mounting apparatus 300.
A difference of the third embodiment from the second embodiment is that two mounting heads 41B and 41C are provided. The mounting head 41B picks up the die D from the prestage 31 and mounts it on the substrate P. On the other hand, the mounting head 41 </ b> C picks up components from the component supply unit 2 and mounts them on the board P. The two mounting heads 41 </ b> B and 41 </ b> C are subjected to interference avoidance control so that one of the mounting heads 41 </ b> B and 41 </ b> C is mounted on the substrate P and the other does not enter the mounting region of the substrate P.

  According to the third embodiment, by separating the two mounting heads 41 for the die D and for the component, the movement time of the mounting head can be shortened, and the processing time can be shortened.

  In the third embodiment, the same effects as those in the first and second embodiments can be obtained.

FIG. 5 is a schematic view of an electronic component mounting apparatus 400 according to the fourth embodiment of the present invention.
FIG. 5 is a diagram showing a top view of the electronic component mounting apparatus 400.
The fourth embodiment is different from the third embodiment in the following two points. The first point is that the mounting heads 41B and 41C are provided so as to move relative to each other on the left and right surfaces of the Y drive shaft in the Y direction of the mounting head. In the present embodiment, even when the mounting heads 41B and 41C both mount the die D and the component, or are separated for the die D and the component, it is possible to avoid interference when the two mounting heads move relative to each other. .

  The second point is that an X drive shaft 34 for moving the prestage 31 in the X direction is provided. In the present embodiment, while one mounting head is mounting the die D or component on the substrate P, the other mounting head picks up the die D or component and prepares for the next mounting on the next substrate P or substrate P. It can be carried out. Alternatively, the mounting head 41B can pick up the die D from the prestage 31 and mount it on the substrate P, while the mounting head 41C can pick up the component from the component supply unit 2 and mount it on the substrate P. These result processing times can be shortened. In the latter case, the two mounting heads 41B and 41C can be safely mounted by preventing one from entering the mounting area of the substrate P while the other is mounted on the substrate P.

  Also in the fourth embodiment, the same effects as in the third embodiment can be obtained.

  In the first to fourth embodiments, the example in which the transport unit has two transport lines has been described. The present invention can be applied even when there are three or more transfer lines. For example, in three transport lines, a substrate is transported to two transport lines, components are supplied from a component supply unit 2 provided in one transport line, and are alternately mounted on the substrates of the two transport lines. In the four transport lines, the substrate is transported to the three transport lines, the components are supplied from the component supply unit 2 provided in one transport line, and are alternately mounted on the substrates of the three transport lines. Or conversely, components are supplied from the component supply unit 2 of the three conveyance lines to the substrate of one conveyance line. Alternatively, there are two transport lines, and two sets of the relationships described in the first embodiment are provided.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

1: Die supply unit 11: Wafer 12: Wafer holder 13: Pickup unit
14: Wafer holding stage 15: XY drive unit 16: Rotation drive unit 17: Holding unit base 18: Wafer recognition camera 2: Component supply unit 21: Feeder 22: Tray 3: Pre-alignment unit
31: Pre-alignment stage (pre-stage)
33: Y drive shaft 34: X drive shaft 35: Mounted component recognition camera 4: Mounting portion 41: Mounting head 42, 42B, 42C: Component recognition camera 43: Y drive shaft 44: Board recognition camera 45: Mounting head nozzle Stocker 5: Transport unit 5A: First transport line 5B: Second transport line 51: Substrate transport pallet 52: Pallet rail 53: Pallet drive unit 6: Substrate supply unit 7: Substrate unloading unit 8: Control unit 9: Pickup Portion 91: Pickup head 92: X drive shaft 94: Pickup nozzle stocker 100, 200, 300, 400: Electronic component mounting apparatus D: Die P: Substrate

Claims (13)

A transport unit having a plurality of transport lines capable of transporting a substrate; a die supply unit that holds a wafer; a pickup head that picks up a die from the wafer; and a mounting head that mounts the picked-up die on the substrate. In electronic component mounting equipment,
The transport unit includes: a first transport line that transports the substrate in a first direction of two horizontal planes; and a component that is provided in parallel with the first transport line and is an electronic component other than the die. An electronic component mounting apparatus comprising: a second transport line that transports a component supply unit, and the mounting head that picks up the component from the component supply unit and mounts the component on the substrate. A drive unit that moves the die supply unit in a direction parallel to the first direction;
The mounting head reciprocates in a second direction orthogonal to the first direction;
The component supply unit and the mounting head are aligned by the movement of the component supply unit in the first direction and the movement of the mounting head in the second direction, and the mounting head is moved from the component supply unit to the 2. The electronic component mounting apparatus according to claim 1, wherein a component is picked up and mounted on the substrate that moves in the second direction and reciprocates in the first direction.   Alignment in the transport direction of the die and the component to the mounting position with respect to the mounting head in the transport direction is performed by controlling the transport position on the first transport line and the second transport line. The electronic component mounting apparatus according to claim 1.   The electronic component mounting apparatus according to claim 1, wherein the pickup head is the mounting head.   The electronic component mounting apparatus according to claim 1, wherein the pickup head places the picked-up die on a pre-alignment stage, and the mounting head picks up the placed die.   The electronic component mounting apparatus according to claim 1, wherein the component supply unit includes at least one of a feeder and a tray for supplying components.   The component recognition camera which images the mounting state of the mounting head of at least the die among the die or the component is provided between the wafer and the first transfer line. The electronic component mounting apparatus according to any one of the above.   The component recognition camera which images the mounting state of the mounting head of at least the component of the die or the component is provided between the first transport line and the second transport line. The electronic component mounting apparatus according to any one of 1 to 5.   6. The electronic component mounting apparatus according to claim 5, wherein a plurality of the wafers are provided, and the pickup head sequentially picks up the dies from the plurality of wafers and places the dies on the pre-alignment stage.   6. The mounting head includes: a first mounting head that picks up the die from the pre-alignment stage; and a second mounting head that picks up the component from the component supply unit. Electronic component mounting equipment. In an electronic component mounting method for conveying a substrate, picking up a die from a wafer, and mounting the picked-up die on the substrate,
The second conveyance line provided in parallel with the first conveyance line that conveys the substrate conveys a component supply unit including components that are electronic components other than the die, and picks up the component from the component conveyance unit. An electronic component mounting method comprising mounting the component on the substrate.   The position of the conveyance direction to the position where the die and the component are mounted on the substrate is controlled by controlling a position on the conveyance to the first conveyance line and the second conveyance line. Item 12. The electronic component mounting method according to Item 11.   12. The electronic component mounting method according to claim 11, wherein the die picked up from the wafer is placed on a pre-alignment stage, the die is picked up from the pre-alignment stage, and mounted on the substrate.

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