TWI698789B - Electronic device and manufacturing method thereof - Google Patents

Abstract

An electronic device includes a display panel, a cover, a touch layer, and a fingerprint identification sensor. The display panel has a first surface and a second surface opposite to each other. The cover is disposed on the first surface of the display panel. The touch layer is disposed between the display panel and the cover. The fingerprint identification sensor includes a sensor electrode layer, a first conductive layer, a piezoelectric material layer and a second conductive layer. The sensor electrode layer is attached to the second surface of the display panel with an adhesive layer. The first conductive layer is disposed on the sensor electrode layer. The first conductive layer has a first portion and a second portion interconnecting each other. The first portion of the first conductive layer contacts the sensor electrode layer. The piezoelectric material layer is disposed between the sensor electrode layer and the second portion of the first conductive layer. The second conductive layer is disposed on the second portion of the first conductive layer. The first conductive layer and the second conductive layer are made of materials including silver.

Description

Electronic device and manufacturing method thereof

This disclosure relates to an electronic device and a manufacturing method of the electronic device.

With the development of technology, in addition to the protection function of character password encryption for electronic products such as smart phones and tablet computers, the protection function of fingerprint recognition encryption is gradually integrated into electronic products. According to its principle, fingerprint recognition technology can be divided into optical recognition, thermal induction recognition, capacitance induction recognition and ultrasonic recognition. Generally speaking, ultrasonic signals have better penetrability and can avoid interference from finger dirt, grease, and sweat. In addition, the pulses emitted by the ultrasonic sensor can sense the depth of the fingerprint to form three-dimensional information, so the ultrasonic fingerprint recognition has high accuracy and security.

However, in the process of manufacturing the ultrasonic sensor, the thickness of the metal electrode layer is often too large, so that the welding of the circuit board needs to be performed multiple times, which makes the process time long and cannot increase the production capacity according to the needs of users. In addition, the thickness of the metal electrode layer is too large, so that the size of the ultrasonic fingerprint recognition device cannot be reduced. Therefore, how to overcome the above problems has become an urgent issue to be solved at present.

One technical aspect of this disclosure is an electronic device.

According to an embodiment of the present disclosure, an electronic device includes a display panel, a cover plate, a touch layer, and a fingerprint recognition sensor. The display panel has a first surface and a second surface opposite to each other. The cover plate is arranged on the first surface of the display panel. The touch layer is arranged between the display panel and the cover plate. The fingerprint recognition sensor includes a sensor electrode layer, a first conductive layer, a piezoelectric material layer, and a second conductive layer. The sensor electrode layer is attached to the second surface of the display panel with an adhesive layer. The first conductive layer is arranged on the sensor electrode layer. The first conductive layer has a first part and a second part connected, and the first part contacts the sensor electrode layer. The material of the first conductive layer contains silver. The piezoelectric material layer is arranged between the sensor electrode layer and the second part of the first conductive layer. The second conductive layer is disposed on the second part of the first conductive layer. The material of the second conductive layer includes silver.

In an embodiment of the present disclosure, the first conductive layer covers the piezoelectric material layer.

In an embodiment of the present disclosure, the thickness of the first conductive layer is greater than 0 μm and less than 1 μm.

In an embodiment of the present disclosure, the vertical distance between the sidewall of the first portion of the first conductive layer and the sidewall of the piezoelectric material layer is greater than 150 microns and less than 200 microns.

In an embodiment of the present disclosure, the sidewalls of the sensor electrode layer protrude from the sidewalls of the piezoelectric material layer, respectively.

In an embodiment of the present disclosure, the sensor electrode layer includes a welding area and a non-welding area, and the electronic device further includes a flexible circuit board. Flexible circuit board design It is placed on the welding area of the sensor electrode layer and contacts the first part of the first conductive layer located in the welding area.

In an embodiment of the present disclosure, the vertical distance between the side wall of the first part of the first conductive layer and the side wall of the piezoelectric material layer in the non-welded area is greater than or equal to the bottom surface of the second part of the first conductive layer and the piezoelectric material layer. The vertical distance between the bottom surfaces of the material layers.

In an embodiment of the present disclosure, there is a boundary line between the welding area and the non-welding area, and the first part of the first conductive layer located in the welding area has a vertex with the largest vertical distance from the boundary line, and the vertex extends parallel to the boundary The imaginary line of the boundary line, and the first area of the first part of the first conductive layer located in the welding area is less than or equal to the second area formed by the boundary line, the imaginary line, and the two sidewalls of the sensor electrode layer intersecting the boundary line.

Another technical aspect of this disclosure is a manufacturing method of an electronic device.

In an embodiment of the present disclosure, a method for manufacturing an electronic device includes: attaching a sensor electrode layer on a substrate with an adhesive layer; forming a piezoelectric material layer on the sensor electrode layer; forming a first conductive layer by sputtering coating. The first conductive layer has a first part and a second part, the first part contacts the sensor electrode layer, and the second part covers the piezoelectric material layer, and the thickness of the first conductive layer is greater than 0 microns and less than 1 micron; form a second conductive layer on the second part of the first conductive layer by screen printing; connect the flexible circuit board on the sensor electrode layer and cover part of the first part of the first conductive layer.

In an embodiment of the present disclosure, the flexible circuit board is connected by thermal The pressing method is executed.

According to the above embodiments of the present disclosure, since the fingerprint recognition sensor is directly attached to the display panel, the area ratio of the display panel in the electronic device can be increased. In addition, because there is a first conductive layer between the piezoelectric material layer and the second conductive layer, and the first conductive layer and the second conductive layer contain the same material, the thickness of the first conductive layer can be adjusted appropriately. The thickness of the second conductive layer is set to optimize the sum of the thickness of the first conductive layer and the second conductive layer to reduce the size of the electronic device. In addition, since the first conductive layer with a small thickness is first formed by sputtering coating, no excessive gap is formed between the first part of the first conductive layer above the sensor electrode layer and the sensor electrode layer. In this way, the flexible circuit board can be pressed once to the top of the sensor electrode layer without being pressed in sections (for example, pressing more than twice), so as to reduce the process time of the electronic device and effectively increase the productivity.

100: electronic device

105: substrate

110: display panel

112: first surface

114: second surface

120: cover

130: Touch layer

140: Adhesive layer

200: Fingerprint recognition sensor

210: sensor electrode layer

210a: welding zone

210b: non-welded area

211: Bottom

212: Sidewall

214: Sidewall

216: Sidewall

220: the first conductive layer

221: Bottom

222: Part One

223: Bottom

224: Part Two

225a: side wall

225b: side wall

225c: side wall

230: Piezoelectric material layer

231: Bottom

232: Sidewall

232a: side wall

240: second conductive layer

250: flexible circuit board

M: interface

P: vertex

L: dividing line

V: virtual line

H1, H2: thickness

A1~A4: area

D1~D5: distance

S1~S5: steps

a-a, b-b, c-c: line segment

In order to make the above and other objectives, features, advantages and embodiments of the present invention more comprehensible, detailed descriptions of the accompanying drawings are as follows: Figure 1 shows a bottom view of an electronic device according to an embodiment of the present disclosure.

Fig. 2 shows a cross-sectional view of the electronic device of Fig. 1.

Fig. 3 is a bottom view of the electronic device of Fig. 1 with the flexible circuit board removed.

FIG. 4A is a cross-sectional view of the fingerprint recognition sensor in FIG. 3 according to an embodiment of the present disclosure.

Figure 4B shows the fingerprint identification of Figure 3 according to another embodiment of the present disclosure Cross-sectional view of the sensor.

FIG. 5A is a cross-sectional view of the fingerprint recognition sensor in FIG. 3 according to an embodiment of the present disclosure.

FIG. 5B is a cross-sectional view of the fingerprint recognition sensor of FIG. 3 according to another embodiment of the present disclosure.

6A to 6C are bottom views of the first conductive layer of different shapes disposed on the sensor electrode layer according to an embodiment of the present disclosure.

FIG. 7 is a flowchart of a manufacturing method of an electronic device according to an embodiment of the disclosure.

8 to 12 are cross-sectional views of the manufacturing method of the electronic device of FIG. 1 at various steps.

Hereinafter, multiple implementation manners of the present disclosure will be disclosed in diagrams. For the sake of clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this disclosure. In other words, in some implementations of this disclosure, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventionally used structures and elements are shown in the drawings in a simple and schematic manner.

It should be understood that relative terms such as "lower" or "bottom" and "upper" or "top" can be used herein to describe the relationship between one element and another element, as shown in the figure. It should be understood that relative terms are intended to include different orientations of the device other than those shown in the figures. For example, if the device in one figure is turned over, the elements described as being on the "lower" side of other elements will be oriented on the other The "upper" side of the component. Therefore, the exemplary term "lower" may include an orientation of "lower" and "upper", depending on the specific orientation of the drawing. Similarly, if the device in one figure is turned over, elements described as "below" or "below" other elements will be oriented "above" the other elements. Thus, the exemplary terms "below" or "below" can include an orientation of above and below.

As used herein, "approximately", "approximately", or "substantially" includes the stated value and the average value within the acceptable deviation range of the specific value determined by a person of ordinary skill in the art, taking into account the measurement and the A certain amount of measurement-related error (ie, the limitation of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the "about", "approximate" or "substantially" used herein can select a more acceptable deviation range or standard deviation based on optical properties, etching properties or other properties, and not one standard deviation can be applied to all properties .

FIG. 1 shows a bottom view of an electronic device 100 according to an embodiment of the present disclosure. FIG. 2 shows a cross-sectional view of the electronic device 100 in FIG. 1 along the line a-a. Referring to FIGS. 1 and 2 at the same time, the electronic device 100 includes a display panel 110, a cover 120, a touch layer 130 and a fingerprint recognition sensor 200. The display panel 110 has a first surface 112 and a second surface 114 opposite to each other. The cover 120 is disposed on the first surface 112 of the display panel 110. The touch layer 130 is disposed between the display panel 110 and the cover 120. The fingerprint recognition sensor 200 includes a sensor electrode layer 210, a first conductive layer 220, a piezoelectric material layer 230, and a second conductive layer 240. The sensor electrode layer 210 is attached to the second surface 114 of the display panel 110 with an adhesive layer 140. The first conductive layer 220 is disposed on the sensor electrode layer 210. The first conductive layer 220 has a first part 222 and a second part 224 connected, and the first part 222 is in contact with the sensor 器electrode layer 210. The material of the first conductive layer 220 includes silver. The piezoelectric material layer 230 is disposed between the sensor electrode layer 210 and the second portion 224 of the first conductive layer 220. The second conductive layer 240 is disposed on the second portion 224 of the first conductive layer 220. The material of the second conductive layer 240 includes silver.

Since the fingerprint recognition sensor 200 is directly attached to the other surface of the display panel 110 opposite to the cover 120 (ie, the second surface 114), that is, there is no sense of fingerprint recognition between the cover 120 and the display panel 110. The detector 200 does not affect the range of the visible area presented by the display panel 110, so the area ratio of the visible area of the display panel 110 in the electronic device 100 can be increased. In addition, since there is the first conductive layer 220 between the piezoelectric material layer 230 and the second conductive layer 240, and the first conductive layer 220 and the second conductive layer 240 contain the same material, it can be based on the The thickness H1 is used to appropriately adjust the thickness H2 of the second conductive layer 240 to be provided, so that the total thickness of the first conductive layer 220 and the second conductive layer 240 (thickness H1+thickness H2) can be optimized to reduce the electronic device 100 size of.

In an embodiment of the present disclosure, the density of the first conductive layer 220 is greater than the density of the second conductive layer 240. In addition, when observed through an electron microscope, it can be seen that the first conductive layer 220 has a different surface structure from the second conductive layer 240. That is, although the materials of the first conductive layer 220 and the second conductive layer 240 are the same, because they have different densities and surface structures, there is an interface M between the first conductive layer 220 and the second conductive layer 240.

In an embodiment of the present disclosure, the first conductive layer 220 covers the piezoelectric material layer 230. In detail, the second portion 224 of the first conductive layer 220 is disposed on the bottom surface 231 of the piezoelectric material layer 230, and the first portion of the first conductive layer 220 222 surrounds the sidewall 232 of the piezoelectric material layer 230 so that the first conductive layer 220 covers and closely adheres to the bottom surface 231 and the sidewall 232 of the piezoelectric material layer 230. In other words, the first conductive layer 220 and the sensor electrode layer 210 completely cover the piezoelectric material layer 230 together. In addition, the plurality of sidewalls 212 of the sensor electrode layer 210 respectively protrude from the plurality of sidewalls 232 of the piezoelectric material layer 230. In this way, the effect of protecting the piezoelectric material layer 230 can be achieved, so as to enhance the overall strength of the electronic device 100, thereby ensuring that the electronic device 100 can pass subsequent temperature and humidity tests.

In an embodiment of the present disclosure, the thickness H1 of the first conductive layer 220 is greater than 0 μm and less than 1 μm. It should be understood that since the first conductive layer 220 is conformally disposed on the sensor electrode layer 210 to cover the piezoelectric material layer 230, the thickness H1 here may refer to the bottom surface 223 of the second portion 224 of the first conductive layer 220 The vertical distance from the bottom surface 231 of the piezoelectric material layer 230 and the vertical distance between the bottom surface 221 of the first portion 222 of the first conductive layer 220 and the bottom surface 211 of the sensor electrode layer 210.

The electronic device 100 further includes a flexible circuit board 250. In an embodiment of the present disclosure, the sensor electrode layer 210 includes a welding area 210a and a non-welding area 210b. The welding area 210a is an area where the flexible circuit board 250 is disposed, and the non-welding area 210b is an area where the flexible circuit board 250 is not disposed. Specifically, the sidewall 232a of the piezoelectric material layer 230 adjacent to the flexible circuit board 250 is taken as the dividing line L, the area where the flexible circuit board 250 is arranged on one side of the dividing line L is the soldering area 210a, and the dividing line L is the other The area on the side is the non-welded area 210b. The flexible circuit board 250 is disposed on the sensor electrode layer 210 and contacts the first portion 222 of the first conductive layer 220 located in the soldering area 210a. In addition, the flexible circuit board 250 partially overlaps the first portion 222 of the first conductive layer 220 located in the bonding area 210a.

In an embodiment of the present disclosure, since the second conductive layer 240 is disposed on the second portion 224 of the first conductive layer 220, and the second portion 224 of the first conductive layer 220 is disposed on the piezoelectric material layer 230, The area A1 of the second conductive layer 240 projected vertically on the cover plate 120 may be equal to the area A2 of the piezoelectric material layer 230 projected vertically on the cover plate 120, and the area A1 completely overlaps the area A2, but is not limited thereto. In other embodiments, the area A1 of the second conductive layer 240 projected vertically on the cover plate 120 may be smaller than the area A2 of the piezoelectric material layer 230 projected vertically on the cover plate 120, that is, the area A2 completely covers the area A1. In addition, since the second conductive layer 240 is provided on the second portion 224 of the first conductive layer 220, the total thickness of the conductive structure formed by the first conductive layer 220 and the second conductive layer 240 is increased (that is, the thickness H1 Increase to thickness H1+thickness H2), so the electronic device 100 can have a smaller impedance. In an embodiment of the present disclosure, the electronic device 100 has an impedance less than or equal to 3 ohms.

FIG. 3 is a bottom view of the electronic device 100 of FIG. 1 after the flexible circuit board 250 is removed. It should be understood that in the electronic device 100 of FIG. 3, the area A1 of the second conductive layer 240 projected vertically on the cover 120 completely overlaps the area A2 of the piezoelectric material layer 230 projected perpendicularly on the cover 120. In an embodiment of the present disclosure, the vertical distance D1 between the sidewall 225a of the first portion 222 of the first conductive layer 220 in the bonding area 210a and the sidewall 232a of the adjacent piezoelectric material layer 230 is greater than 150 microns and less than 200 microns. In this way, the first portion 222 of the first conductive layer 220 located in the bonding area 210a may have a sufficient width for the flexible circuit board 250 in Figure 1 to contact and partially overlap it.

Since the sidewall 225a of the first portion 222 of the first conductive layer 220 located in the bonding area 210a is perpendicular to the sidewall 232a of the adjacent piezoelectric material layer 230 The direct distance D1 is greater than 150 microns and less than 200 microns. Therefore, the vertical distance D2 between the welding area 210a of the sensor electrode layer 210 adjacent to the sidewall 225a and the sidewall 232a of the piezoelectric material layer 230 also needs to be greater than 150 microns and less than 200 microns , For setting the first portion 222 of the first conductive layer 220.

FIG. 4A is a cross-sectional view of the fingerprint recognition sensor 200 along the line b-b in FIG. 3 according to an embodiment of the present disclosure. 4B is a cross-sectional view of the fingerprint recognition sensor 200 in FIG. 3 according to another embodiment of the present disclosure, and the cross-sectional position is the same as the line segment b-b in FIG. 3. Referring to FIGS. 3 and 4A at the same time, in an embodiment of the present disclosure, the sidewall 225b of the first portion 222 of the first conductive layer 220 in the non-welded area 210b and the sidewall 232 of the adjacent piezoelectric material layer 230 The vertical distance D3 may be equal to the vertical distance D4 between the bottom surface 223 of the second portion 224 of the first conductive layer 220 and the bottom surface 231 of the piezoelectric material layer 230 (that is, equal to the thickness H1). Referring to FIGS. 3 and 4B at the same time, in another embodiment of the present disclosure, the sidewall 225b of the first portion 222 of the first conductive layer 220 in the non-welded area 210b and the sidewall 232 of the adjacent piezoelectric material layer 230 The vertical distance D3 may be greater than the vertical distance D4 between the bottom surface 223 of the second portion 224 of the first conductive layer 220 and the bottom surface 231 of the piezoelectric material layer 230. In other words, if viewed from the viewing angles (ie side view angles) of Figures 4A and 4B, it can be seen that the first conductive layer 220 has a uniform thickness as shown in Figure 4A or thickened at the edges as shown in Figure 4B. .

FIG. 5A is a cross-sectional view of the fingerprint recognition sensor 200 along the line c-c in FIG. 3 according to an embodiment of the present disclosure. FIG. 5B shows a cross-sectional view of the fingerprint recognition sensor 200 in FIG. 3 according to another embodiment of the present disclosure, and the cross-sectional position is the same as the line segment c-c in FIG. 3. Similar to Figure 4A, the sidewall 225c of the first portion 222 of the first conductive layer 220 in the non-welded area 210b is adjacent to The vertical distance D5 between the sidewalls 232 of the piezoelectric material layer 230 may be equal to the vertical distance D4 between the bottom surface 223 of the second portion 224 of the first conductive layer 220 and the bottom surface 231 of the piezoelectric material layer 230 (as shown in FIG. 5A). Show). Similar to FIG. 4B, the vertical distance D5 between the sidewall 225c of the first portion 222 of the first conductive layer 220 in the non-welded area 210b and the sidewall 232 of the adjacent piezoelectric material layer 230 may be greater than that of the first conductive layer 220 The vertical distance D4 between the bottom surface 223 of the second portion 224 and the bottom surface 231 of the piezoelectric material layer 230 (as shown in FIG. 5B). Similarly, if viewed from the viewing angles (ie, side view angles) of FIGS. 5A and 5B, it can be seen that the first conductive layer 220 exhibits a uniform thickness as shown in FIG. 5A or thickens at the edges as shown in FIG. 5B.

6A to 6C show bottom views of the first conductive layer 220 of different shapes disposed on the sensor electrode layer 210 according to an embodiment of the present disclosure. Here, for convenience of description, the first conductive layer 220 located in the welding area 210a and the non-welding area 210b is separated by a dividing line L. The first portion 222 of the first conductive layer 220 located in the bonding area 210a has at least one vertex P with the largest vertical distance from the dividing line L. If this vertex P extends a virtual line V parallel to the dividing line L, the dividing line The area formed by the imaginary line V and the two sidewalls 214, 216 of the sensor electrode layer 210 intersecting with the boundary line L has an area A3, and the area A4 of the first portion 222 of the first conductive layer 220 located in the bonding area 210a may be smaller than Or equal to area A3.

Taking Fig. 6A to Fig. 6C as an example, the difference between Fig. 6A and Fig. 6C is mainly the shape of the first conductive layer 220 located in the bonding area 210a, more specifically, the first conductive layer located in the bonding area 210a The shape of the first portion 222 of the layer 220. The shape of the first conductive layer 220 located in the bonding area 210a can be rectangular (As shown in Figure 6A), embossed (as shown in Figure 6B) and arbitrary polygons (as shown in Figure 6C).

It should be understood that the component materials, connection relationships and effects that have been described will not be repeated, and will be described first. In the following description, a method of manufacturing the electronic device 100 will be explained.

FIG. 7 shows a flowchart of the electronic device 100 according to an embodiment of the disclosure. The manufacturing method of the electronic device 100 includes the following steps. In step S1, the sensor electrode layer is attached above the substrate with an adhesive layer. In step S2, a piezoelectric material layer is formed above the sensor electrode layer. In step S3, a first conductive layer is formed above the sensor electrode layer by sputtering coating. The first conductive layer has a first part and a second part, and the first part contacts the sensor electrode layer, and the second part covers the piezoelectric The material layer, and the thickness of the first conductive layer is greater than 0 μm and less than 1 μm. In step S4, a second conductive layer is formed on the second portion of the first conductive layer by screen printing. In step S5, connect the flexible circuit board above the sensor electrode layer and cover part of the first part of the first conductive layer. In the following description, the above-mentioned steps will be explained.

8 to 12 are cross-sectional views of the manufacturing method of the electronic device 100 in FIG. 1 at various steps. Referring to FIG. 8, in an embodiment of the present disclosure, a stack structure including a display panel 110, a cover 120 and a touch layer 130 may be provided first, and the stack structure is regarded as the substrate 105 for convenience of description. Then, the sensor electrode layer 210 is attached to the top of the substrate 105 with the adhesive layer 140. In another embodiment of the present disclosure, a stacked structure including the cover 120 and the touch layer 130 can also be provided first, and the sensor electrode layer 210 is attached to the display panel 110 by the adhesive layer 140, and then the Display panel 100 of sensor electrode layer 210 It is arranged above the stacked structure with the cover 120 and the touch layer 130. In an embodiment of the present disclosure, the adhesive layer 140 may be made of a material including epoxy resin or polymethyl methacrylate (acrylic), but it is not used to limit the present disclosure.

Referring to FIG. 9, after the sensor electrode layer 210 is disposed on the substrate 105, the piezoelectric material layer 230 can be disposed on the sensor electrode layer 210. In an embodiment of the present disclosure, the piezoelectric material layer 230 may be made of a material including polyvinylidene difluoride (PVDF), lead zirconate titanate (PZT), ceramics, or a derivative of any of the above Manufactured, but not to limit this disclosure. When performing this step, the piezoelectric material, the solvent, and the glue can be uniformly mixed first, and the mixture containing the piezoelectric material can be coated on the sensor electrode layer 210 by means of slit coating. Subsequently, the crystallinity of the piezoelectric material is improved by annealing. Next, the piezoelectric material is made into an electric dipole with polarity in the manner of corona poling to form the piezoelectric material layer 230.

Referring to FIG. 10, after the piezoelectric material layer 230 is formed on the sensor electrode layer 210, the first conductive layer 220 can be conformally formed on the sensor electrode layer 210 by sputtering. The first conductive layer 220 has a first portion 222 and a second portion 224. The first portion 222 surrounds the piezoelectric material layer 230 and contacts the sensor electrode layer 210, and the second portion 224 covers the piezoelectric material layer 230. Since the heat-resistant temperature of the piezoelectric material layer 230 is about 110°C, and during the sputtering coating process, the measured temperature of the surface of the piezoelectric material layer 230 is greater than about 20°C and less than about 50°C, that is, with sputtering When the first conductive layer 220 is formed by spray coating, the characteristics of the piezoelectric material layer 230 and the function of the sensor electrode layer 210 are not affected. For example, when using a voltage of about 52 volts and about 3.6 amperes When the current is used for sputtering coating, the measured temperature of the surface of the piezoelectric material layer 230 is about 46° C. at about 100 seconds, and the thickness H1 of the piezoelectric material layer 230 formed at this time is less than about 15 nm.

Referring to FIG. 11, after the first conductive layer 220 is formed to cover the piezoelectric material layer 230, the second conductive layer 240 can be formed on the second portion 224 of the first conductive layer 220 by using screen printing. . Since the first conductive layer 220 has been deposited by sputtering, in this step, the thickness H2 of the second conductive layer 240 to be provided can be appropriately adjusted according to the thickness H1 of the first conductive layer 220, so as to maximize Optimize the sum of the thickness of the second portion 224 of the first conductive layer 220 and the second conductive layer 240 located above the piezoelectric material layer 230 (ie, thickness H1 + thickness H2). Subsequently, the first conductive layer 220 and the second conductive layer 240 can be dried, and the sensor electrode layer 210 can be cut according to user requirements. After completing this step, the fingerprint recognition sensor 200 including the sensor electrode layer 210, the first conductive layer 220, the piezoelectric material layer 230, and the second conductive layer 240 is formed on the substrate 105.

Referring to FIG. 12, the flexible circuit board 250 can then be connected above the sensor electrode layer 210. The flexible circuit board 250 contacts and covers part of the first portion 222 of the first conductive layer 220. In an embodiment of the present disclosure, the flexible circuit board 250 is connected to the sensor electrode layer 210 by thermocompression bonding. Since the first conductive layer 220 with a small thickness H1 (less than about 1 micron) is formed by sputtering, the first portion 222 of the first conductive layer 220 above the sensor electrode layer 210 and the sensor electrode layer 210 are formed Will not form too large gap. Therefore, in this step, the flexible circuit board 250 can be pressed onto the sensor electrode layer 210 at one time, instead of being pressed in sections (for example, pressing more than twice) The flexible circuit board 250 that does not overlap with the first portion 222 of the first conductive layer 220 is pressed first, and then the flexible circuit board 250 overlapping with the first portion 222 of the first conductive layer 220 is pressed. In this way, the process time of the electronic device 100 can be reduced to further increase the productivity.

Although this disclosure has been disclosed in the above manner, it is not intended to limit this disclosure. Anyone who is familiar with this technique can make various changes and modifications without departing from the spirit and scope of this disclosure. Therefore, this disclosure is protected The scope shall be subject to the definition of the attached patent scope.

100: electronic device

110: display panel

112: first surface

114: second surface

120: cover

130: Touch layer

140: Adhesive layer

200: Fingerprint recognition sensor

210: sensor electrode layer

210a: welding zone

210b: non-welded area

211: Bottom

220: the first conductive layer

221: Bottom

222: Part One

223: Bottom

224: Part Two

230: Piezoelectric material layer

231: Bottom

232: Sidewall

232a: side wall

240: second conductive layer

250: flexible circuit board

M: interface

L: dividing line

H1, H2: thickness

A1, A2: area

Claims (10)

An electronic device including: A display panel having a first surface and a second surface opposite to each other; A cover plate disposed on the first surface of the display panel; A touch layer disposed between the display panel and the cover plate; and A fingerprint recognition sensor, including: A sensor electrode layer attached to the second surface of the display panel with an adhesive layer; A first conductive layer is disposed on the sensor electrode layer, and the first conductive layer has a first part and a second part connected, and the first part contacts the sensor electrode layer, and the material of the first conductive layer Contains silver; A piezoelectric material layer disposed between the sensor electrode layer and the second portion of the first conductive layer; and A second conductive layer is disposed on the second part of the first conductive layer, and the material of the second conductive layer includes silver. The electronic device according to claim 1, wherein the first conductive layer covers the piezoelectric material layer. The electronic device according to claim 1, wherein a thickness of the first conductive layer is greater than 0 μm and less than 1 μm. The electronic device according to claim 1, wherein a vertical distance between a sidewall of the first portion of the first conductive layer and a sidewall of the piezoelectric material layer is greater than 150 microns and less than 200 microns. The electronic device according to claim 1, wherein the plurality of side walls of the sensor electrode layer respectively protrude from the plurality of side walls of the piezoelectric material layer. The electronic device according to claim 1, wherein the sensor electrode layer includes a welding area and a non-welding area, and the electronic device further includes a flexible circuit board, wherein the flexible circuit board is disposed on the welding of the sensor electrode layer And contacting the first part of the first conductive layer in the soldering area. The electronic device according to claim 6, wherein a vertical distance between at least one side wall of the first portion of the first conductive layer in the non-welded area and at least one side wall of the piezoelectric material layer is greater than or equal to the first A vertical distance between a bottom surface of the second portion of a conductive layer and a bottom surface of the piezoelectric material layer. The electronic device according to claim 6, wherein there is a boundary line between the soldering area and the non-welding area, and the first portion of the first conductive layer located in the soldering area has the largest vertical distance from the boundary line At least one vertex of the apex, and the apex extends a virtual line parallel to the boundary line, and a first area of the first portion of the first conductive layer located in the welding area is less than or equal to the boundary line, the virtual line A second area formed by the line and the two side walls of the sensor electrode layer intersecting with the boundary line. A manufacturing method of an electronic device, including: Attach a sensor electrode layer on a substrate with an adhesive layer; Forming a piezoelectric material layer above the sensor electrode layer; A first conductive layer is formed above the sensor electrode layer by sputtering coating, wherein the first conductive layer has a first part and a second part, and the first part contacts the sensor electrode layer, and the second part Covering the piezoelectric material layer, and a thickness of the first conductive layer is greater than 0 micrometer and less than 1 micrometer; Forming a second conductive layer on the second portion of the first conductive layer by screen printing; A flexible circuit board is connected above the sensor electrode layer and covers part of the first part of the first conductive layer. The method of manufacturing an electronic device according to claim 9, wherein the connection of the flexible circuit board is performed by thermocompression bonding.

Images