TWI778655B - Touch panel - Google Patents

Abstract

A touch panel includes a first substrate, a first electrode, a first bonding pad, a second electrode, a second substrate, a conductive member, a carrier, a first electrode pin and a conductive paste. The first substrate has opposite first surface and second surface. The first electrode is on the first surface. The first bonding pad is on the first surface and is connected to the first electrode. The second electrode is on the second surface. The second substrate is over the first electrode and has a third surface facing the first substrate. The conductive member is on the third surface. The carrier has a fourth surface facing the first substrate, and the second electrode is between the carrier and the first substrate. The first electrode pin is on the fourth surface. The conductive paste connects the first bonding pad, the conductive member and the first electrode pin.

Description

touch panel

Some embodiments of the present disclosure relate to a touch panel, especially a touch panel having a capacitive sensor.

A touch panel is one of the components in an electronic device. In response to the advancement of the times and modern needs, many touch panels have been improved to have user identification functions, such as fingerprint identification functions. The fingerprint recognition function has the advantages of quickly identifying users, high stability, and easy to exclude others from being used. Therefore, it has been widely used in touch panels of different electronic devices.

There are many techniques for identifying fingerprints today, such as ultrasonic sensing, optical sensing and capacitive sensing. Among them, the capacitive fingerprint identification technology has been widely used in various electronic devices due to its low price and mature technology. The capacitive touch panel senses the position touched by the user by changing the capacitance value of the electrodes by touching. The process involved in the manufacturing process of the current capacitive touch panel is complicated, so that the cost of the manufactured touch panel cannot be reduced. Therefore, there is an urgent need for a novel touch panel that can improve the above problems.

An embodiment of the present disclosure is a touch panel, which includes a first substrate, a first electrode, a first bonding pad, a second electrode, a second substrate, a conductive member, a carrier plate, a first electrode pin, and a conductive adhesive. The first substrate has opposite first and second surfaces. The first electrode is located on the first surface of the first substrate. The first bonding pad is located on the first surface of the first substrate and connected to the first electrode. The second electrode is on the second surface of the first substrate. The second substrate is over the first electrode and has a third surface facing the first substrate. The conductive member is located on the third surface of the second substrate. The carrier has a fourth surface facing the first substrate, wherein the second electrode is located between the carrier and the first substrate. The first electrode pins are located on the fourth surface of the carrier board. The conductive adhesive connects the first bonding pad, the conductive member and the first electrode pin.

In some embodiments, the conductive member is located directly above the first bonding pad and the first electrode pin.

In some embodiments, the touch panel further includes second bonding pads and second electrode pins. The second bond pad is on the second surface of the first electrode and is connected to the second electrode. The second electrode pins are located on the fourth surface of the carrier board and are connected to the second bonding pads.

In some embodiments, the touch panel further includes a shielding layer and a third bonding pad. The shielding layer is on the third surface of the second substrate. The third bonding pad is on the third surface of the second substrate and is connected to the shielding layer.

In some embodiments, the touch panel further includes shielding layer pins located on the fourth surface of the carrier board and below the third bonding pads, wherein the conductive adhesive further connects the third bonding pads and the shielding layer pins.

In some embodiments, the touch panel further includes a first insulating layer located between the first substrate and the second substrate, wherein the shielding layer and the first electrode are both embedded in the first insulating layer.

In some embodiments, the protrusions of the second substrate protrude from the sidewalls of the first substrate.

In some embodiments, a portion of the conductive member is located on the protrusion of the second substrate.

In some embodiments, the protrusions of the carrier plate protrude from the sidewall of the first substrate.

In some embodiments, the first electrode pins are located on the protrusions of the carrier.

Embodiments of the present disclosure provide advantages. For example, the embodiments of the present disclosure can simultaneously complete the connection between all electrical components in a single lamination process. In addition, the embodiments of the present disclosure can also reduce the process to 3 processes. According to the above advantages, the cost of the touch panel manufacturing process can be reduced.

Several embodiments of the present disclosure will be disclosed in the following drawings, and for the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the present disclosure. That is, in some embodiments of the present disclosure, these practical details are unnecessary. In addition, for the purpose of simplifying the drawings, some well-known structures and elements will be shown in a simple and schematic manner in the drawings.

Some embodiments of the present disclosure can improve the manufacturing process of the touch panel. Specifically, some embodiments of the present disclosure can simplify the number of layers in the manufacturing process, for example, simplify the manufacturing process of the touch panel into three manufacturing processes. In addition, in some embodiments of the present disclosure, all layers in the touch panel can be pressed together at one time, and the electrical connection between the conductive elements in the touch panel can be achieved through conductive adhesive. Therefore, the present disclosure can provide the advantage of simplifying the process and further reduce the manufacturing cost of the touch panel.

FIG. 1 illustrates a cross-sectional view of a touch panel 100 according to some embodiments of the present disclosure, and illustrates the corresponding x, y, and z directions in the touch panel 100 . The touch panel 100 may include a first substrate 110 , a first electrode 122 , a second electrode 126 , a second substrate 140 , a shielding layer 152 , a conductive member 156 , a circuit board 160 and a conductive adhesive 180 .

In FIG. 1 , the first substrate 110 has an opposite first surface 112 and a second surface 114 , the first surface 112 is the upper surface of the first substrate 110 , and the second surface 114 is the lower surface of the first substrate 110 . The first electrode 122 is located on the first surface 112 of the first substrate 110 , and the second electrode 126 is located on the second surface 114 of the first substrate 110 , so that the first electrode 122 and the second electrode 126 are respectively located on the first substrate 110 . above and below the first substrate 110 . The first electrode 122 and the second electrode 126 can be arranged on the first surface 112 and the second surface 114 in any suitable form, respectively, and the upper first electrode 122 and the lower second electrode 126 can jointly form a plurality of capacitive sensing The device is used to sense objects (eg, fingers) in contact with the surface of the touch panel 100 . In some embodiments, as shown in FIG. 1 , the touch panel 100 includes a plurality of first electrodes 122 with equal spacing on the first surface 112 , and includes a plurality of first electrodes 122 with equal spacing on the second surface 114 . Two electrodes 126 . In FIG. 1, the first electrode 122 and the second electrode 126 extend along the y direction. The dimensions of the first electrode 122 and the second electrode 126 can also be adjusted according to different situations. For example, in the embodiment shown in FIG. 1 , the width of the first electrode 122 is smaller than that of the second electrode 126 . In other embodiments, the width of the first electrode 122 may be equal to or greater than the width of the second electrode 126 . It should be noted that the arrangement of the first electrodes 122 and the second electrodes 126 is not limited to that shown in FIG. 1 .

The touch panel 100 further includes a first bonding pad 124 and a second bonding pad 128 . The first bond pads 124 are located on the first surface 112 of the first substrate 110 and are connected to the first electrodes 122, and are used to bond the first electrodes 122 to an underlying circuit (eg, the circuit board 160). The second electrode 126 is connected to the second bond pad 128 . The second bond pads 128 are located on the second surface 114 of the first substrate 110 and are connected to the second electrodes 126 and are used to bond the second electrodes 126 to an underlying circuit (eg, the circuit board 160). In other words, the first bonding pads 124 and the second bonding pads 128 are respectively located on two opposite surfaces of the first substrate 110 and are connected to the first electrodes 122 and the second electrodes 126 , respectively.

For the sake of clarity, only one first bonding pad 124 is shown in FIG. 1, which is connected to one first electrode 122. In other embodiments, the touch panel 100 may include a plurality of first bonding pads 124, which are respectively connected to each other. to a plurality of first electrodes 122 . Similarly, although only one second bonding pad 128 is shown in FIG. 1 , which is connected to one second electrode 126 , in other embodiments, the touch panel 100 may include a plurality of second bonding pads 128 , which are respectively connected to each other. to a plurality of second electrodes 126 .

The second substrate 140 is located above the first electrode 122 and has a third surface 142 facing the first electrode 122 . The second substrate 140 has a protruding portion 144 , and the protruding portion 144 protrudes from the sidewall 116 of the first substrate 110 . In other words, the area of the third surface 142 of the second substrate 140 is larger than that of the first surface 112 of the first substrate 110 . The conductive member 156 is located on the third surface 142 of the second substrate 140 . A portion of the conductive member 156 is located on the third surface 142 of the protruding portion 144 , and the other portion is located just above the first bonding pads 124 on the first surface 112 of the first substrate 110 , and is used to connect the conductive member 156 on the third surface 142 of the first substrate 110 . The first bond pads 124 on a surface 112 are connected to the circuit board 160 . Conductor 156 may be made of any suitable conductive material, such as metal.

The shielding layer 152 is located on the third surface 142 of the second substrate 140 and can be used for shielding interference from the outside, such as static electricity, etc., so as to prevent the interior of the touch panel 100 from being damaged. The touch panel 100 further includes a third bonding pad 154 located on the third surface 142 of the protruding portion 144 and connected to the shielding layer 152. The third bonding pad 154 is used for bonding the shielding layer 152 to the underlying A circuit, such as circuit board 160 .

The circuit board 160 is located below the second electrode 126 . The circuit board 160 may include a carrier board 162 and lines 170 . The carrier 162 has a fourth surface 166 facing the first substrate 110 , and the second electrode 126 is located between the carrier 162 and the first substrate 110 . In some embodiments, the carrier 162 can be a flexible carrier, such as a carrier made of polyimide. In addition, the area of the fourth surface 166 of the carrier board 162 is larger than any surface of the first substrate 110 , so the carrier board 162 has a protrusion 164 , and the protrusion 164 protrudes from the sidewall 116 of the first substrate 110 .

The circuit 170 is located on the carrier board 162 and is connected to the first electrode pin 172 , the second electrode pin 174 and the shielding layer pin 176 . The first electrode pins 172 , the second electrode pins 174 and the shielding layer pins 176 are all located on the fourth surface 166 of the carrier board 162 and are all located on the protrusions 164 of the carrier board 162 . In the touch panel 100 , the first electrode pins 172 face the conductive members 156 connected to the first bonding pads 124 , the second electrode pins 174 face the second bonding pads 128 , and the shielding layer pins 176 face Opposite the third bond pad 154 . Since the first electrode pins 172 , the second electrode pins 174 and the shielding layer pins 176 face their corresponding conductive members or bonding pads at the same time, the first electrode pins 172 can be attached to the first electrode pins 172 at one time through the conductive adhesive 180 . The shielding layer pins 176 are respectively connected to the first electrode 122 and the shielding layer 152 . Specifically, the touch panel 100 includes a conductive adhesive 180 for electrically connecting various elements. The conductive adhesive 180 is anisotropic conductive adhesive, so the conductive adhesive 180 only provides conductivity in the vertical direction, but does not provide conductivity in the horizontal direction. That is, the conductive member 156 is located directly above the first bonding pad 124 and the first electrode pin 172 , so that the conductive adhesive 180 can directly electrically connect the first bonding pad 124 and the first electrode pin 172 . The conductive adhesive 180 is coated on the conductive member 156 on the protruding portion 144 of the second substrate 140 and just above the first bonding pad 124 . When the first substrate 110 , the second substrate 140 and the circuit board 160 are pressed together by a pressing device, the conductive adhesive 180 connects the first bonding pads 124 , the conductive members 156 and the first electrode pins 172 . In more detail, the conductive adhesive 180 can directly electrically connect the first bonding pad 124 of the first electrode 122 to the conductive member 156 through the conductive adhesive 180 , and the conductive member 156 is then electrically connected to the circuit board 160 through the conductive adhesive 180 . The first electrode pin 172 . The signal transmitted from the first electrode 122 can be directly transmitted to the first electrode pin 172 through the conductive glue 180 and the conductive member 156 . While the first substrate 110 , the second substrate 140 and the circuit board 160 are pressed together, the second electrode pins 174 can be connected to the second bonding pads 128 directly or through the conductive adhesive 180 , and connected to the third bonding of the shielding layer 152 The pads 154 may also be bonded to the shielding layer pins 176 directly or through the conductive glue 180 . In this way, the electrical connection between the first electrode 122 , the second electrode 126 and the shielding layer 152 can be completed by only one pressing process, thereby simplifying the manufacturing process of the touch panel 100 and reducing the cost.

The touch panel 100 further includes a first insulating layer 132 and a second insulating layer 134 . The first insulating layer 132 is located between the first substrate 110 and the second substrate 140 to provide electrical isolation between the first electrode 122 and the shielding layer 152 . In some embodiments, the shielding layer 152 and the first electrode 122 are both embedded in the first insulating layer 132 , and the embedded second substrate 140 can better isolate interference from the outside. The second insulating layer 134 is located between the circuit board 160 and the second electrode 126 . To provide electrical isolation between the second electrode 126 and the line 170 .

FIG. 2 is a perspective view of a touch panel 200 according to other embodiments of the present disclosure. FIG. 3 is an exploded schematic view of the touch panel 200 in FIG. 2 . FIG. 2 and FIG. 3 both illustrate the x-direction and the y-direction of the touch panel 200 . The touch panel 200 includes a first substrate 210 , a first electrode 222 , a second substrate 240 , a shielding layer 252 , a conductive member 256 , a circuit board 260 and a conductive adhesive 280 . In FIGS. 2 and 3 , the shielding layer 252 and the conductive members 256 on the second substrate 240 are elongated structures arranged in the same direction, and the shielding layer 252 is located at the opposite outer side of the second substrate 240 . The plurality of first electrodes 222 on the first substrate 210 are arranged in the same direction, and each first electrode 222 is connected to the corresponding first bonding pad 224 . The plurality of lines 270 on the carrier board 262 are arranged in the same direction, and each line 270 is connected to the corresponding first electrode pin 272 or the shielding layer pin 276 . The conductive adhesive 280 is a conductive adhesive layer for bonding the first substrate 210 , the second substrate 240 and the circuit board 260 in the lamination process, and can pass through the corresponding first electrodes 222 on the first substrate 210 The conductive members 256 are connected to the first electrode pins 272 on the circuit board 260 . Details about the touch panel 200 are described below with reference to FIGS. 4 and 5 .

FIG. 4 is a cross-sectional view of the touch panel 200 along the A-A section in FIG. 2 . Different from the touch panel 100 in FIG. 1 , the first electrodes 222 and the second electrodes 226 in the touch panel 200 in FIG. 4 extend in different directions. In some embodiments, the shape of the first electrodes 222 can be formed on the first surface 212 of the first substrate 210 according to different requirements and conditions, for example, the first electrodes 222 in a plurality of strip-like structures. In other embodiments, the shape of the second electrode 226 on the second surface 214 of the first substrate 210 can also be adjusted according to the situation. For example, the second electrode 226 can also be formed as the structure of the first electrode 222 or are other suitable shapes. Furthermore, in the touch panel 200 , the first bonding pads 224 are connected to the first electrodes 222 . In some embodiments, since the first electrode 222 and the first bonding pad 224 are made of the same material, there is no obvious boundary between the two. In addition, as shown in FIGS. 2 to 4 , the extending direction of the wires 270 on the fourth surface 266 of the carrier board 262 is different from that of the second electrodes 226 , and the wires 270 are connected to the first wires 270 also on the fourth surface 266 . Electrode pins 272 . In some embodiments, since the circuit 270 and the first electrode pin 272 are made of the same material, there is no obvious boundary between the two. In the embodiment in which the first electrode 222 and the line 270 extend along the x-direction, the conductive adhesive 280 and the conductive member 256 on the third surface 242 of the second substrate 240 are connected to the first electrode 222 and the first electrode pin 272 The way is shown in Figure 4. A portion of the conductive member 256 in the touch panel 200 is located directly above the first bonding pad 224 , and another portion of the conductive member 256 is located directly above the first electrode pin 272 . Therefore, the vertical projection of the conductive members 256 on the first substrate 210 and the carrier board 262 covers at least a part of the first bonding pads 224 and the first electrode pins 272 . In some embodiments, the conductive adhesive 280 is anisotropic conductive adhesive as described above, and the conductive adhesive 280 covers most of the first bonding pads 224 and provides a gap between the first bonding pads 224 and the conductive members 256 . vertical conductivity. The conductive adhesive 280 further electrically connects the conductive member 256 to the lower first electrode pin 272 . Therefore, the signal transmitted from the first electrode 222 can be transmitted to the first electrode pin 272 through the conductive adhesive 280 and the conductive member 256 .

FIG. 5 is a cross-sectional view of the touch panel 200 along the B-B section in FIG. 2 . FIG. 5 shows the connection of the shielding layer 252 and the shielding layer pins 276 in the B-B section. Referring to FIG. 2 , FIG. 3 and FIG. 5 , the shielding layer 252 and the conductive member 256 of the touch panel 200 are not on the same section. For example, the shielding layer 252 of the touch panel 200 is located near the edge of the second substrate 240 , and the conductive member 256 is located at the center of the second substrate 240 . Lines 270 are connected to shielding layer pins 276 . In some embodiments, since the circuit 270 and the shielding layer pin 276 are made of the same material, there is no obvious demarcation between the two. In some embodiments, the shielding layer 252 and the third bonding pad 254 are made of the same material, so there is no obvious boundary between the two. A portion of the third bonding pads 254 on the third surface 242 of the second substrate 240 is located directly above the shielding layer pins 276 , and a portion of the conductive adhesive 280 is coated under the third bonding pads 254 . Therefore, after the lamination process, the conductive adhesive 280 connects the third bonding pad 254 and the shielding layer pin 276 and provides a vertical electrical connection therebetween.

As shown in FIGS. 4 and 5 , the touch panel 200 further includes a first insulating layer 232 and a second insulating layer 234 . The related details of the first insulating layer 232 and the second insulating layer 234 are the same as those of the first insulating layer 132 and the second insulating layer 134 of the touch panel 100 , and thus are not repeated here.

It should be noted that, for the purpose of simplification, FIGS. 4 and 5 do not illustrate the connection between the second electrode and the second electrode pin. In some embodiments, the connection manner of the second electrode 226 and the second electrode pin is similar to the connection manner of the second electrode 126 and the second electrode pin 174 in FIG. 1 . In other embodiments, the connection between the second electrode 226 and the second electrode pin is similar to the connection between the first electrode 222 and the first electrode pin 272 in FIG. 4 . In addition, while the first bonding pad 224 is bonded to the first electrode pin 272 through the conductive adhesive 280 and the conductive member 256, the third bonding pad 254 is bonded to the shielding layer pin 276, and the second bonding pad is also bonded to the first electrode pin 272. the second electrode pin. In other words, the first bonding pads 224 , the second bonding pads and the third bonding pads 254 can be bonded to the first electrode pins 272 , the second electrode pins and the shielding layer pins 276 at the same time. This simplifies the manufacturing process of the touch panel 200, thereby reducing the cost and complexity of the manufacturing process.

FIGS. 6 to 11 illustrate a manufacturing process of the touch panel 100 according to some embodiments of the present disclosure. In FIG. 6, a first substrate 110 having opposing first and second surfaces 112 and 114 is provided, and a first electrode 122 and a second electrode 126 are formed on the first and second surfaces 112 and 114, respectively. The first electrode 122 is connected to the first bond pad 124 on the first surface 112 of the first substrate 110 , and the second electrode 126 is connected to the second bond pad 128 on the second surface 114 of the first substrate 110 . As mentioned above, for the sake of clarity, only one first bonding pad 124 and one second bonding pad 128 are shown in FIGS. 6 to 11 . In some embodiments, the first electrode 122 and the second electrode 126 may be formed by a patterning or etching process. In some embodiments, the first bond pad 124 connected to the first electrode 122 and the second bond pad 128 connected to the second electrode 126 are formed simultaneously with the formation of the first electrode 122 and the second electrode 126 .

In FIG. 7, a first insulating layer 132 is formed on the first surface 112 of the first substrate 110 and the first electrode 122, and a second insulating layer is formed on the second surface 114 of the first substrate 110 and the second electrode 126 Layer 134. In some embodiments, the first insulating layer 132 and the second insulating layer 134 may be formed by a deposition process. The first insulating layer 132 and the second insulating layer 134 are materials that can provide electrical isolation between the electrodes (the first electrode 122 and the second electrode 126 ) and the conductors above (the shielding layer 152 and the circuit board 160 ), such as two. Dielectric materials such as silicon oxide.

In FIG. 8 , the second substrate 140 is provided, and the shielding layer 152 and the conductive member 156 are formed on the third surface 142 of the second substrate 140 , wherein the third surface 142 is the surface facing the first substrate 110 . In some embodiments, the shielding layer 152 and the conductive member 156 can be formed by a patterning or etching process. Specifically, the shielding layer 152 and the conductive member 156 can be formed in the same patterning and etching process, respectively. For example, a conductive layer is first deposited on the third surface 142 , and then the conductive layer is etched to form patterns of the shielding layer 152 and the conductive member 156 . In some embodiments, when the shielding layer 152 and the conductive member 156 are formed, the third bonding pads 154 connected to the shielding layer 152 may also be formed. In some embodiments, the conductive member 156 is made of metal. After the shielding layer 152 and the conductive member 156 are formed, the second substrate 140 having the shielding layer 152 and the conductive member 156 is placed on the structure as shown in FIG. 7 . Since the area of the third surface 142 of the second substrate 140 is larger than that of the first substrate 110, when the second substrate 140 is placed on the structure as shown in FIG. The portion 144 ) protrudes from the sidewall 116 of the first substrate 110 . At this time, a part of the previously formed conductive member 156 is located just above the first bonding pad 124 , and the other part is located on the third surface 142 of the protruding portion 144 of the second substrate 140 . The third bonding pads 154 are also located on the third surface 142 of the protruding portion 144 of the second substrate 140 so as to be electrically connected to the pins on the circuit board in the subsequent process.

In Figure 9, the structure shown in Figure 8 is placed on the circuit board 160. The circuit board 160 includes a carrier board 162 . Since the area of the carrier board 162 is larger than that of the first substrate 110 , when the structure shown in FIG. The sidewall 116 of the first substrate 110 is protruded. The circuit board 160 further includes a circuit 170 connected to the first electrode pin 172 , the second electrode pin 174 and the shielding layer pin 176 . When the structure shown in FIG. 8 is placed, at least a part of the second bonding pads 128 are located directly above the second electrode pins 174 , and the first electrode pins 172 are located directly under the conductive member 156 , and the shielding layer pins 176 is located directly below the third bond pad 154 . Both the first electrode pins 172 and the shielding layer pins 176 in this step are located outside the sidewalls 116 of the first substrate 110 .

In FIG. 10 , the conductive adhesive 180 is coated on the third surface 142 of the protruding portion 144 of the second substrate 140 , and the coated conductive adhesive 180 contacts the conductive member 156 . In some embodiments, the conductive paste 180 also contacts the third bond pad 154 . After the conductive adhesive 180 is applied, the first substrate 110 , the second substrate 140 and the circuit board 160 are simultaneously pressed together by a pressing process LM. The structure after pressing is shown in Figure 11.

After the lamination process LM is completed, the touch panel 100 is formed. Due to the lamination process LM, the components on the protruding portion 144 of the second substrate 140 (eg, the conductive member 156 and the conductive adhesive 180 ) and the protruding portion 144 extend downward along the sidewall 116 of the first substrate 110 . In this way, the conductive adhesive 180 contacts the first electrode pin 172 and the shielding layer pin 176 , so that the conductive adhesive 180 is electrically connected to the first bonding pad 124 and the first electrode pin 172 through the conductive member 156 , and the conductive adhesive 180 The third bonding pads 154 are electrically connected to the shielding layer pins 176 . At the same time, the second bonding pads 128 also contact the second electrode pins 174 due to the lamination process LM. In other words, the lamination process LM simultaneously bonds the first bonding pads 124 to the first electrode pins 172 , bonds the second bonding pads 128 to the second electrode pins 174 , and bonds the third bonding pads 154 to the shielding layer at the same time Pin 176. In addition, after the lamination process LM, the shielding layer 152 can be embedded in the first insulating layer 132 to further provide a shielding effect against external interference. Since only a single lamination process can be used to complete the connection between all electrical components, the cost of the process can be reduced.

The process method of the present disclosure can also reduce the number of layers in the touch panel process. For example, the manufacturing process of some embodiments of the present disclosure includes three processes: the first process is to form the first electrode 122 and the second electrode 126 on the first substrate 110 ; the second process is to form the first electrode 122 The first insulating layer 132 and the second insulating layer 134 are respectively formed on the second electrode 126 ; the third process is to form the conductive member 156 and the shielding layer 152 on the second substrate 140 . After the third process is completed, the first substrate 110 and the second substrate 140 are placed on the circuit board 160 and pressed together to form the touch panel 100 . In this way, the complexity of the process can be reduced, thereby reducing the cost of the process. It should be noted that although FIGS. 6 to 11 illustrate the manufacturing process of the touch panel 100 , other suitable touch panels, such as the touch panel 200 , can also be manufactured by using the manufacturing process of FIGS. 6 to 11 .

In light of the above discussion, embodiments of the present disclosure provide advantages. For example, the embodiments of the present disclosure can simultaneously complete the connection between all electrical components in a single lamination process. In addition, the first electrode, the second electrode and the shielding layer can be electrically connected to the same circuit board through the conductive glue and the conductive member. In addition, the embodiments of the present disclosure can also reduce the process to 3 processes. According to the above advantages, the cost of the touch panel manufacturing process can be reduced.

Although the present disclosure has been disclosed as above in embodiments, it is not intended to limit the present disclosure. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the present disclosure protects The scope shall be determined by the scope of the appended patent application.

100: touch panel 110: The first substrate 112: First Surface 114: Second Surface 116: Sidewall 122: first electrode 124: First bond pad 126: Second electrode 128: Second bond pad 132: first insulating layer 134: Second insulating layer 140: Second substrate 142: Third Surface 144: Protrusion 152: Masking layer 154: Third bond pad 156: Conductive parts 160: circuit board 162: carrier board 164: Protrusion 166: Fourth Surface 170: Line 172: The first electrode pin 174: The second electrode pin 176: shielding layer pin 180: Conductive glue 200: touch panel 210: First substrate 212: First Surface 214: Second Surface 222: first electrode 224: First Bond Pad 226: Second electrode 232: first insulating layer 234: Second insulating layer 240: Second substrate 242: Third Surface 252: Masking layer 254: Third Bond Pad 256: Conductive parts 260: circuit board 262: carrier board 266: Fourth Surface 270:Line 272: The first electrode pin 276: shielding layer pin 280: Conductive glue A-A: Section B-B: Section LM: Lamination process x: direction y: direction z: direction

FIG. 1 illustrates a cross-sectional view of a touch panel according to some embodiments of the present disclosure. FIG. 2 is a perspective view of a touch panel according to other embodiments of the present disclosure. FIG. 3 is an exploded schematic view of the touch panel in FIG. 2 . FIG. 4 shows a cross-sectional view of the touch panel along the A-A section in FIG. 2 . FIG. 5 shows a cross-sectional view of the touch panel along the B-B section in FIG. 2 . FIGS. 6 to 11 illustrate a manufacturing process of a touch panel according to some embodiments of the present disclosure.

Domestic storage information (please note in the order of storage institution, date and number) none Foreign deposit information (please note in the order of deposit country, institution, date and number) none

100: touch panel

110: The first substrate

112: First Surface

114: Second Surface

116: Sidewall

122: first electrode

124: First bond pad

126: Second electrode

128: Second bond pad

132: first insulating layer

134: Second insulating layer

140: Second substrate

142: Third Surface

144: Protrusion

152: Masking layer

154: Third bond pad

156: Conductive parts

160: circuit board

162: carrier board

164: Protrusion

166: Fourth Surface

170: Line

172: The first electrode pin

174: The second electrode pin

176: shielding layer pin

180: Conductive glue

Claims (10)

A touch panel, comprising: a first substrate having an opposite first surface and a second surface; a first electrode located on the first surface of the first substrate; a first bonding pad located on the first surface on the first surface of the first substrate and connected to the first electrode; a second electrode on the second surface of the first substrate; and a second substrate on the first electrode and facing the a third surface of the first substrate; a conductive member located on the third surface of the second substrate; a carrier plate having a fourth surface facing the first substrate, wherein the second electrode is located on the carrier between the board and the first substrate; a first electrode pin located on the fourth surface of the carrier board; a conductive adhesive connecting the first bonding pad, the conductive member and the first electrode pin; a shield a layer on the third surface of the second substrate; and a third bonding pad on the third surface of the second substrate and connected to the shielding layer. The touch panel of claim 1, wherein the conductive member is located just above the first bonding pad and the first electrode pin. The touch panel of claim 1, further comprising: a second bonding pad located on the second surface of the first substrate and connected to the second electrode; and a second electrode pin located on the fourth surface of the carrier board and connected to the second bonding pad. The touch panel of claim 1, wherein the area of the third surface of the second substrate is larger than the area of the first surface of the first substrate. The touch panel of claim 1, further comprising: a shielding layer pin located on the fourth surface of the carrier and below the third bonding pad, wherein the conductive adhesive is further connected to the third bonding pad and the shielding layer pins. The touch panel of claim 1, further comprising: a first insulating layer located between the first substrate and the second substrate, wherein the shielding layer and the first electrode are both embedded in the first insulating layer middle. The touch panel of claim 1, wherein a protrusion of the second substrate protrudes from a side wall of the first substrate. The touch panel of claim 7, wherein a portion of the conductive member is located on the protruding portion of the second substrate. The touch panel of claim 1, wherein the carrier board has A protrusion protrudes from a side wall of the first substrate. The touch panel of claim 9, wherein the first electrode pins are located on the protruding portion of the carrier board.

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