TWI696225B - Suction hand, conveying mechanism, resin molding device, conveying method, and method for manufacturing resin molded product - Google Patents

Abstract

The present invention provides an adsorption mechanism, an adsorption hand, a conveying mechanism, a resin molding device, a conveying method, and a method for manufacturing a resin molded article that can stably adsorb and hold an object to be adsorbed. The suction mechanism includes: a support portion provided with an internal space, a piston rod inserted in the internal space and movable in the axial direction, an elastic member between the piston rod and the bottom surface of the internal space, and an elastic member of the piston rod The side is the suction pad on the opposite side. A flow path that fluidly connects the space surrounded by the main body portion of the adsorption pad, the adsorption portion, and the wall portion to the internal space is provided. Before the suction of the object to be adsorbed, the restoring force of the elastic member allows the suction portion to contact the object to be adsorbed.

Description

Adsorption hand, conveying mechanism, resin molding device, conveying method and Manufacturing method of resin molded product

The invention relates to an adsorption mechanism, an adsorption hand, a conveying mechanism, a resin molding device, a conveying method, and a method of manufacturing a resin molded product.

For example, Japanese Patent Laid-Open No. 2013-42017 (Patent Document 1) discloses a resin mold device having a robot arm at three locations on the front end and the root side, the robot arm being formed to absorb a workpiece The suction hole on the outer periphery of the pump and the suction path connected to it.

In recent years, the surface of the object to be adsorbed such as a plate-shaped member (including a wafer) tends to be large in area, and therefore the amount of bending of the object to be adsorbed also tends to increase. However, according to the manipulator described in Patent Document 1, depending on the size of the bending of the object to be adsorbed, there may be cases where the object to be adsorbed cannot be stably adsorbed and held.

According to the embodiment disclosed herein, an adsorption mechanism may be provided, which includes: a support portion provided with an internal space, a piston rod inserted in at least a part of the internal space and movable in the axial direction, a piston rod and The elastic member between the bottom surfaces of the internal space, the suction pad of the piston rod on the side opposite to the elastic member side; and the suction pad includes: a body portion, which is connected to the suction object when adsorbing the suction object A suction part that touches, and a wall part that connects the main body part and the suction part; a flow path that fluidly connects the space surrounded by the main body part, the suction part, and the wall part to the internal space; and before the adsorption object is adsorbed, With the restoring force of the elastic member, the suction part can come into contact with the object to be suctioned. In addition, according to the embodiments disclosed herein, an adsorption mechanism may be provided, which includes: a support portion provided with an internal space, a piston rod inserted in at least a part of the internal space and movable in the axial direction, the piston rod and the internal space Between the bottom surface of the elastic member and the suction pad of the piston rod on the side opposite to the elastic member side; and the suction pad includes: a body portion, an adsorption portion that comes into contact with the suction object when the suction object is adsorbed, and A wall portion connecting the body portion and the suction portion; a flow path that fluidly connects the space surrounded by the body portion, the suction portion, and the wall portion to the internal space; and the area where the suction portion is projected on the bottom surface side of the internal space is greater than The bottom surface of the piston rod is projected onto the area of the bottom surface side of the internal space.

According to the embodiments disclosed herein, a suction hand may be provided, which includes the suction mechanism.

According to the embodiments disclosed herein, a conveying mechanism may be provided, which includes: a suction hand provided with the suction mechanism and a moving unit of the suction hand.

According to the embodiments disclosed herein, a resin molding apparatus may be provided, which includes the conveying mechanism and the resin molding mechanism.

According to the embodiments disclosed herein, a conveying method may be provided, which includes: a step of bringing the suction portion of the suction hand into contact with an object to be adsorbed, a step of adsorbing the object to be adsorbed, and a method of conveying the object to be adsorbed step.

According to the embodiments disclosed herein, a resin molded product can be provided The manufacturing method includes the steps of conveying the object to be adsorbed by the above-mentioned conveying method and the step of resin-sealing the object to be adsorbed.

These and other objects, features, viewpoints, and advantages of the present invention are made clear by the following detailed description of the present invention understood in connection with the accompanying drawings.

1: Adsorption mechanism

2: adsorption pad

2a: the first flow path

2b: Adsorption section

2c: Body part (absorption pad body part)

2d: upper end

2e: lower end

2f: space

2g: Wall

3: Piston rod

3a: intermediate flow path

3b: lower end (bottom)

3c: Body part (piston rod body part)

3d: upper end

3e: Flow path expansion section

3f: flange

4: Support

4a: interior space

4b: underside

4c: Second flow path

4d: recess

5: elastic member

5a: the other end

5b: one end

6: Sealing member

7: Bush

9: axis

10: Adsorption hand

11: Release film

12: box

13: Electronic components

14: Resin supply mechanism

15: Linear feeder

20: plate member

81: Sealing resin (resin molded body)

81a: granular resin

81b: molten resin

510: release film cutting mechanism

511: Membrane fixing table mounting mechanism

512: Roll release film

513: Membrane holder

520: Resin dispersion mechanism

521: Resin loader

522: Post-processing agency

523: Membrane fixed table moving mechanism

530: resin sealing mechanism

531: Lower die

531a: Side member

531b: bottom member

532: cavity

533: Elastic member

534: Lower mold bottom plate

535: Upper tray

535a: slit in the upper tray

536: Lower tray

536a: slit of lower tray

536b: Lower tray rail

537: Resin holding tray

540: transport mechanism

541: substrate loader

542: Plate-shaped member storage section after forming

543: Plate-shaped member storage portion before forming

544: Mobile unit

551: Upper die

X, Y: area

FIG. 1 is a schematic plan view of a suction hand of an embodiment.

FIG. 2 is a schematic cross-sectional view along II-II of FIG. 1.

3 is a schematic plan view of the resin molding apparatus of the embodiment.

4 is a schematic side view illustrating a part of the manufacturing steps of the manufacturing method of the resin molded article of the embodiment.

5 is a schematic cross-sectional view illustrating an example of a step of bringing the suction portion of the suction hand into contact with the object to be suctioned.

6 is a schematic cross-sectional view of the adsorption mechanism at the stage of the step shown in FIG. 5.

7 is a schematic cross-sectional view illustrating an example of a step of adsorbing an object to be adsorbed on an adsorption unit.

8 is a schematic cross-sectional view of the adsorption mechanism at the stage of the step shown in FIG. 7.

9 is a schematic side view illustrating a part of the manufacturing steps of the manufacturing method of the resin molded article of the embodiment.

10 is a schematic side view illustrating a part of the manufacturing steps of the manufacturing method of the resin molded article of the embodiment.

11 is a schematic cross-sectional view of the adsorption mechanism at the stage of the step shown in FIG. 10.

FIG. 12 is a schematic cross-sectional view of the adsorption mechanism at the stage of the step shown in FIG. 10.

13 is a schematic side view illustrating a part of the manufacturing steps of the manufacturing method of the resin molded article of the embodiment.

14 is a schematic side view illustrating a part of the manufacturing steps of the manufacturing method of the resin molded article of the embodiment.

15 is a schematic side view illustrating a part of the manufacturing steps of the manufacturing method of the resin molded article of the embodiment.

16 is a schematic side view illustrating a part of the manufacturing steps of the manufacturing method of the resin molded article of the embodiment.

FIG. 17(a) is a perspective view of the resin holding tray of the resin molded article of the embodiment, and FIG. 17(b) is a cross-sectional view of the resin holding tray of FIG. 17(a).

18 is a schematic side view illustrating a part of the manufacturing steps of the manufacturing method of the resin molded article of the embodiment.

FIG. 19 is a schematic side view illustrating a part of the manufacturing steps of the manufacturing method of the resin molded article of the embodiment.

20 is a schematic side view illustrating a part of the manufacturing steps of the manufacturing method of the resin molded article of the embodiment.

21 is a schematic side view illustrating a part of the manufacturing steps of the manufacturing method of the resin molded article of the embodiment.

22 is a schematic side view illustrating a part of the manufacturing steps of the manufacturing method of the resin molded article of the embodiment.

23 is a part of the manufacturing steps of the manufacturing method of the resin molded article of the embodiment Partially illustrated schematic side view.

24 is a schematic side view illustrating a part of the manufacturing steps of the manufacturing method of the resin molded article of the embodiment.

25 is a schematic plan view of a modification of the suction hand of the embodiment.

26 is a schematic plan view of a modification of the suction hand of the embodiment.

FIG. 27 is a schematic plan view of a modification of the resin molding apparatus of the embodiment.

Hereinafter, the embodiment will be described. In the drawings used in the description of the embodiments, the same reference symbols indicate the same parts or corresponding parts.

<adsorption hand>

FIG. 1 shows a schematic plan view of a suction hand 10 as an example of the suction mechanism of the present invention. The suction hand 10 of the embodiment has a quadruple-shaped suction mechanism 1, and the quadruple-shaped suction mechanism 1 has three suction pads 2 each. In addition, the shape of the suction hand 10 is of course not limited to the shape of the quadruple suction mechanism 1. In addition, the number of suction pads 2 is of course not limited to three each.

FIG. 2 shows a schematic cross-sectional view along II-II of FIG. 1. As shown in FIG. 2, the suction mechanism 1 includes a suction pad 2, a piston rod 3, a support portion 4, and an elastic member 5.

The adsorption pad 2 includes: a body portion (absorption pad body portion) 2c, which is a substantially cylindrical shape whose upper portion becomes thinner; an adsorption portion 2b, which is a portion that comes into contact with an object to be adsorbed described later during adsorption; and a wall portion 2g , Which extends diagonally upward from the body portion 2c, will The body portion 2c is connected to the suction portion 2b. The body portion 2c includes an upper end 2d and a lower end 2e, and a first flow path 2a is provided between the upper end 2d and the lower end 2e, and the first flow path 2a penetrates the body portion 2c between the upper end 2d and the lower end 2e. The first flow path 2a is for fluid communication with the space 2f so that gas can be communicated with the space 2f surrounded by the body portion 2c, the suction portion 2b, and the wall portion 2g.

The piston rod 3 includes a cylindrical body portion (piston rod body portion) 3c, and a flange 3f extending outward from the upper portion of the body portion 3c. The body portion 3c includes an upper end 3d and a lower end 3b, and an intermediate flow path 3a is provided between the upper end 3d and the lower end 3b. The intermediate flow path 3a is a through hole penetrating the body portion 3c. The suction pad 2 is attached to the upper end 3d of the body portion 3c. On the lower end 3b side of the body portion 3c of the intermediate flow path 3a, a flow path expansion portion 3e in which the flow path width is partially enlarged is provided. Between the first flow path 2a and the intermediate flow path 3a, and between the intermediate flow path 3a and the flow path expansion portion 3e, fluid connections are made so that the gases can communicate with each other.

Inside the support part 4 is provided an internal space 4a that is in fluid connection with the flow path expansion part 3e. At least a part of the piston rod 3 is inserted into the internal space 4a, and the piston rod 3 is movable in the direction of the shaft 9 (axis direction). A second flow path 4c that is fluidly connected to the internal space 4a is provided inside the support portion 4 to further discharge the gas in the internal space 4a to the outside of the adsorption mechanism 1 by using a suction mechanism (not shown). Thereby, the gas present in the space 2f surrounded by the body portion 2c, the adsorption portion 2b, and the wall portion 2g of the adsorption pad 2 can pass through the first flow path 2a, the intermediate flow path 3a, and the flow path expansion portion 3e. The internal space 4a and the second flow path 4c are sucked by the suction mechanism and discharged to the outside of the suction mechanism 1.

The elastic member 5 is a member that can expand and contract in the axial direction of the piston rod 3, and for example, a spring or the like can be used. By the expansion and contraction of the elastic member 5 in the axial direction, the piston rod 3 mounted on the elastic member 5 can also move in the axial direction, and the suction pad 2 on the piston rod 3 can also move in the axial direction. In the present embodiment, the configuration is as follows: one end 5b of the elastic member 5 is fitted into the flow path expansion portion 3e, and the other end 5a of the elastic member 5 is fitted into the concave portion 4d of the bottom surface 4b of the internal space 4a; The member that can move the suction pad 2 and the piston rod 3 in the axial direction between the rod 3 and the bottom surface 4b of the internal space 4a is not particularly limited.

In addition, a sealing member 6 is provided between the outer peripheral surface of the body portion 3c of the piston rod 3 and the inner space 4a of the support portion 4 to suppress air from the outer peripheral surface of the body portion 3c of the piston rod 3 and the inner space of the support portion 4 Leaked between 4a. In addition, a bush 7 is a cylindrical member for smoothly moving the piston rod 3 up and down.

The area X projecting the suction portion 2b on the bottom surface 4b side of the internal space 4a may be larger than the area Y projecting the bottom surface 3b of the piston rod 3 on the bottom surface 4b side of the internal space 4a. In this case, when the suction part 2b sucks the object to be adsorbed and transports it, for example, when the warping force acts on the object to be adsorbed to move the piston rod 3 up and down, the relationship between the area X and the area Y may be Since it is configured such that X>Y, the object to be adsorbed can be more effectively prevented from falling off from the adsorption pad 2. The relationship between the area X and the area Y can also be expressed as: projecting the outer edge of the suction portion 2b of the suction pad 2 on the plane orthogonal to the first direction (movement direction of the piston rod 3) in the first direction The relationship between the area X in the case and the area Y in the case where the bottom surface 3b of the piston rod 3 is projected in the first direction becomes X>Y.

In addition, the objects to be adsorbed include, for example, lead frames, substrates, interposers, semiconductor substrates (silicon wafers, etc.), metal substrates, glass substrates, ceramic substrates, and resin substrates , And plate-shaped members such as wiring boards. The shape can be round or quadrilateral. In addition, wiring may or may not be included in the suction object.

In addition, the object to be adsorbed includes, for example, a plate-like member used in a fan-out wafer level package (FO-WLP) or a fan-out panel level package (FO-PLP) Carrier.

In addition, the object to be adsorbed includes, for example, a glass substrate of a plate-like member used in a display panel such as a liquid crystal panel or an organic electroluminescence (EL) panel, and includes a driving element, an electrode, a color filter, etc. Glass substrate.

<resin molding device>

FIG. 3 shows a schematic plan view of a resin molding apparatus as an example of the resin molding apparatus of the present invention. In this embodiment, an example of a resin molding apparatus that manufactures a resin molded product by performing resin molding of the plate-shaped member 20 using, for example, a plate-shaped member 20 mounted with electronic components as an object to be adsorbed will be described.

As shown in FIG. 3, the resin molding apparatus of the embodiment includes a conveyance mechanism 540, a resin sealing mechanism 530, a resin dispersion mechanism 520, and a release film cutting mechanism 510. The resin molding apparatus of the embodiment is arranged on the transport mechanism 540.

The transport mechanism 540 is not particularly limited if it includes the above-mentioned suction hand 10 and the moving unit 544 that can move the suction hand 10, and the transport mechanism 540 of the embodiment In addition to the moving unit 544, a substrate loader 541, a plate-shaped member storage portion 542 after molding, and a plate-shaped member storage portion 543 before molding are included. The substrate loader 541 can hold the plate-shaped member 20 cut away from the suction hand 10 and move between the transfer mechanism 540, the resin sealing mechanism 530, the resin dispersion mechanism 520, and the release film cutting mechanism 510.

The plate-shaped member storage portion 542 after molding can house the plate-shaped member 20 after resin sealing. The plate-shaped member storage portion 543 before molding can store the plate-shaped member 20 before resin sealing. The moving unit 544 can move the suction hand 10.

The resin sealing mechanism 530 includes an upper mold (not shown) and a lower mold 531 including a mold cavity 532. The mold release film 11 may be provided on the mold cavity 532. The resin sealing mechanism 530 can perform resin sealing of the plate-shaped member 20 on which electronic components and the like are mounted.

The resin spreading mechanism 520 includes a resin loader 521, a post-processing mechanism 522, a film fixing table moving mechanism 523, a linear feeder 15, a linear feeder 15, a resin supply mechanism 14, and a frame 12. The resin dispersing mechanism 520 may use a resin loader 521, and after the release film 11 is adsorbed and fixed on the lower end surface of the frame 12 including, for example, a quadrangular frame, the granular resin is dispersed from the resin supply mechanism 14 through the linear feeder 15 to the release film 11 on. In addition, the frame 12 is not particularly limited to a quadrilateral frame, for example, it may be a circular frame.

The release film cutting mechanism 510 includes a roll-shaped release film 512, a film fixing table mounting mechanism 511, and a film gripper 513. In the release film cutting mechanism 510, the elongated release film 11 is drawn from the roll-shaped release film 512, and a part of it is set on a film fixing table (not shown) placed on the film fixing table mounting mechanism 511 ), cut it off With a quadrangular shape, a quadrangular release film 11 can be obtained. The film holder 513 can fix the front end of the release film 11 drawn from the roll-shaped release film 512, and can extract the release film 11 from the roll-shaped release film 512.

<Manufacturing method of resin molded product>

Hereinafter, referring to FIGS. 4 to 23, a method for manufacturing a resin molded product according to an embodiment as an example of the method for manufacturing a resin molded product of the present invention will be described. In the manufacturing method of the resin molded article of the embodiment, an example in which the plate-shaped member 20 mounted with electronic components or the like is used as the object to be adsorbed will be described.

First, as shown in FIG. 4, a suction hand 10 is inserted under the plate-shaped member 20 mounted with the electronic component 13 accommodated in the plate-shaped member storage portion 543 before molding, and the plate is suctioned on the suction pad 2 of the suction hand 10状member 20. For example, the interval between accommodating the plate-shaped member 20 on which the electronic component 13 is mounted in the plate-shaped member storage portion 543 before molding is narrow, and the suction hand 10 cannot be inserted between the plate-shaped member 20 and the plate-shaped member 20 In the case of, simply insert the suction hand 10 from below. The adsorption of the suction pad 2 by the plate-shaped member 20 can be performed, for example, by bringing the suction portion 2b of the suction pad 2 into contact with the plate-shaped member 20 and then suctioning the plate-shaped member 20.

For example, when the plate-shaped member 20 is bent within a certain allowable range, the contact between the suction portion 2b of the suction pad 2 and the plate-shaped member 20 can be performed by: The suction hand 10 is inserted into the lower side of the plate-shaped member 20 on which the electronic component 13 is mounted, and the suction hand 10 is moved toward the plate-shaped member 20, so that all the suction pads 2 are in contact with the plate-shaped member 20.

In the case where the plate-shaped member 20 is bent beyond a certain allowable range, for example By fixing the plate-shaped member 20, the suction hand 10 can be pressed against the plate-shaped member 20 to contact all the suction pads 2. Here, for example, as shown in FIGS. 5 and 6, when the plate-shaped member 20 is bent beyond a certain allowable range, in order to locate the plate-shaped member 20 farthest from the suction portion 2 b of the suction pad 2 and the suction portion 2 b When the suction hand 10 is pressed against the plate-shaped member 20, the plate-shaped member 20 pushes the piston rod 3 downward in the axial direction (internal space 4a) at all positions closer to the suction portion 2b than it is The direction of the bottom surface 4b side) is pressed down, and the plate-shaped member 20 is in contact with the suction portion 2b of the suction pad 2. At this time, the amount by which the plate-like member 20 presses the piston rod 3 downward in the axial direction is determined according to the magnitude of the force by which the plate-like member 20 presses down the piston rod 3, and the elastic member 5 is determined according to the amount Resilience in the axis direction. Then, at a position where the force by which the plate-like member 20 presses down the suction pad 2 and the restoring force of the elastic member 5 balance, the suction pad 2 stops. At the position where the suction pad 2 stops, the suction portion 2b suctions the plate-shaped member 20.

In the manipulator described in Patent Document 1, for example, when the plate-shaped member 20 is bent as shown in FIG. 5, for example, there is a portion where the plate-shaped member 20 is greatly bent, and the suction hole of the manipulator cannot communicate with the plate-shaped member 20 Contact situation. The suction holes that are not in contact with the plate-shaped member 20 cannot absorb the plate-shaped member 20. Therefore, in the manipulator described in Patent Literature 1, when the plate-shaped member 20 has a large curvature, the plate-shaped member 20 may not be stably attracted and held.

However, in this embodiment, before the adsorption of the plate-shaped member 20 as the object to be adsorbed, the restoring force of the elastic member 5 can be used to contact all of the adsorption portions 2b with the plate-shaped member 20. Therefore, it is described in Patent Document 1. Compared with the manipulator, it can absorb The object is adsorbed and held stably. In addition, in the present embodiment, since the restoring force of the elastic member 5 is used to contact the suction portion 2b with the plate-like member 20, it is not necessary to introduce a complicated control mechanism that controls the movement of each suction pad 2. In addition, the suction mechanism 1 of the present embodiment may be configured so as to use the restoring force of the elastic member 5 to bring the suction portion 2b into contact with the object to be adsorbed, and does not mean that the restoring force of the elastic member 5 must be used The adsorption part 2b is in contact with the object to be adsorbed.

Then, as shown in, for example, the schematic cross-sectional view of FIG. 7, the plate-shaped member 20 is attracted to the suction portion 2 b of the suction mechanism 1. The adsorption of the adsorption portion 2b by the plate-shaped member 20 is performed by, for example, as shown in the schematic cross-sectional view of FIG. 8, by suction by an unillustrated suction mechanism, drawing in the direction of the arrow in FIG. 8 The gas in the internal space 4a of the support part 4 is sucked. At this time, the suction portion 2b adheres to the plate-like member 20 by suction of the suction mechanism, and the gas present in the space 2f passes through the first flow path 2a, the intermediate flow path 3a, the flow path expansion portion 3e, and the internal space 4a. And the second flow path 4c is discharged to the outside of the suction mechanism 1. With this, the space 2f can be brought into a vacuum state.

Then, by further continuing the suction by the suction mechanism, the plate-like member 20 is further pressed against the suction portion 2b side, so the suction pad 2 and the piston rod 3 are pressed in the axial direction on the bottom surface 4b side of the internal space 4a Next, the elastic member 5 is contracted in the axial direction. Thereby, the plate-shaped member 20 is suction-held on the suction mechanism 1.

At this time, for example, after the suction pad 2 and the piston rod 3 are pushed down to the maximum on the bottom surface 4b side of the internal space 4a, as the suction portion 2b draws the plate-shaped member 20 closer, the bending of the plate-shaped member 20 is corrected, The plate-like member 20 can also be made nearly flat. In addition, for example, when the bending of the plate-like member 20 is corrected, the force in the bending direction (A force close to the original curved shape) When a part or all of the piston rod 3 moves upward on the plate-shaped member 20, as shown in FIG. 2, as long as the suction portion 2b is projected on the bottom surface 4b of the internal space 4a The area Y on the side can suppress the suction pad 2 from falling off the plate-shaped member 20. The reason for this is that since the suction force of the suction pad 2 is greater than the downward force of the piston rod 3, the piston rod 3 is preferentially moved upward.

Next, as shown in the schematic side view of FIG. 9, the plate-shaped member 20 adsorbed on the suction hand 10 is reversed, and the mounting side of the plate-shaped member 20 on the electronic component 13 is the lower side. Then, the suction unit 10 is moved by the moving unit 544. As shown in the schematic side view of FIG. 10, the mounting side of the electronic component 13 of the plate-shaped member 20 adsorbed on the suction hand 10 is taken as the lower side, and the plate-shaped member 20 is installed on the substrate loader 541, the suction of the plate-like member 20 is released, and the plate-like member 20 is separated from the suction hand 10.

At this time, for example, as shown in FIG. 11, as the elastic member 5 contracts, the suction pad 2 and the piston rod 3 pressed downward in the axial direction (the direction of the bottom surface 4b side of the internal space 4a) follow the elastic member When the contracted state of 5 is released, for example, as shown by the arrow in FIG. 12, the plate-shaped member 20 is separated by pressing upward in the axial direction (the direction opposite to the direction of the bottom surface 4b side of the internal space 4a).

Then, as shown in the schematic side view of FIG. 13, the substrate loader 541 provided with the plate-shaped member 20 is moved between the upper mold 551 and the lower mold 531 of the resin sealing mechanism 530. Then, with the mounting side of the electronic component 13 as the lower side, the plate-shaped member 20 is installed on the upper mold 551. The lower mold 531 includes a side member 531a, a bottom member 531b, an elastic member 533, and a lower mold bottom plate 534 that form a cavity 532.

Next, as shown in the schematic side view of FIG. 14, a plate-shaped member is provided Between the upper mold 551 and the lower mold 531 of 20, the release film 11 containing the granular resin 81a in the frame 12 is conveyed. The transfer of the release film 11 is performed by the resin loader 521. Although the particulate resin 81a is used in this embodiment, it is also possible to use a powdery resin or a liquid (fluidity) resin instead of the particulate resin 81a.

Then, as shown in the schematic side view of FIG. 15, the release film 11 provided with the particulate resin 81 a is provided on the cavity 532 of the lower mold 531. Then, as shown in the schematic side view of FIG. 16, the air in the mold cavity 532 is discharged from between the side member 531 a and the bottom member 531 b to adhere the release film 11 to the inner surface of the mold cavity 532. Thereby, the particulate resin 81a is supplied into the cavity 532. The method of supplying the resin material to the cavity 532 includes, for example, the following methods: As shown in FIGS. 17(a) and 17(b), for the cavity 532 of the lower mold 531 on which the release film 11 is disposed, the The resin holding tray 537 composed of the upper tray 535 and the lower tray 536 formed with a plurality of parallel slits is in the slit 535a of the upper tray with the rails 536b of the lower tray inserted into the slits 535a of the upper tray The resin material is supplied, the resin holding tray 537 is arranged on the mold cavity 532, and the upper tray 535 and the lower tray 536 slide relative to each other, whereby the resin material in the slit 535a of the upper tray passes through the slit 536a of the lower tray Drop into the mold cavity 532.

Then, as shown in the schematic side view of FIG. 18, by using a lower mold 531 heated by a heating unit (not shown), the particulate resin 81a in the cavity 532 is heated to be melted into molten resin 81b, so that The lower mold 531 rises. At this time (before the lower mold 531 is raised and the upper mold 551 and the lower mold 531 are in contact via the plate-like member 20 and the release film 11), the outside air blocking member (not shown) may also be used to block outside air from entering In the mold, a vacuum pump or the like is used to exhaust the air in the mold. Next, as shown in the schematic side view of FIG. 19, the upper mold 551 and the lower mold 531 are in contact via the plate-shaped member 20 and the release film 11, and then the lower mold 531 is raised, whereby the electrons on the plate-shaped member 20 The element 13 is immersed in the molten resin 81b, and after a certain period of time, the molten resin 81b is hardened to perform resin sealing of the electronic component 13.

Then, as shown in the schematic side view of FIG. 20, by moving the lower mold 531 downward, the release film 11 is peeled off from the cured sealing resin (resin molded body) 81. Next, as shown in the schematic side view of FIG. 21, the substrate loader 541 removes the plate member 20 sealed with the resin by the sealing resin (resin molded body) 81 from the upper mold 551 to mount the electronic component 13 The side is placed on the substrate loader 541 as the lower side. Then, the substrate loader 541 provided with the plate member 20 after resin sealing is moved from the resin sealing mechanism 530 to the transport mechanism 540.

Then, as shown in the schematic side view of FIG. 22, the resin-sealed plate-shaped member 20 is adsorbed on the suction pad 2 of the suction hand 10 with the mounting side of the electronic component 13 as the lower side. In addition, the suction of the plate-like member 20 by the suction pad 2 of the suction hand 10 can be performed in the same manner as described above. Then, as shown in the schematic side view of FIG. 23, the plate-shaped member 20 adsorbed on the suction pad 2 is reversed, and the mounting side of the plate-shaped member 20 on the electronic component 13 is taken as the upper side, and the suction is performed by the moving unit 544. Hand 10 moves.

Next, as shown in the schematic side view of FIG. 24, the suction mechanism 1 accommodates the plate-shaped member 20 in the cassette in the plate-shaped member storage portion 542 after molding, with the mounting side of the electronic component 13 as the upper side. After that, release the adsorption. Through the above, the actual The manufacturing method of the resin molded article of the embodiment and the subsequent storage of the plate-shaped member 20 are completed.

<Modified example of suction hand>

The suction hand 10 of the embodiment may change the arrangement of the suction pad 2 according to the shape of the suction object. For example, as shown in the schematic plan view of FIG. 25, when the plate-like member 20 as the suction target is bent from the center to the outside on the side opposite to the suction hand 10 side, the center of the suction hand 10 can be In other words, the arrangement of the suction pads 2 is changed so that the number of outer suction pads 2 increases. In addition, as shown in the schematic plan view of FIG. 26, when the plate-like member 20 as the object to be adsorbed is bent from the center to the outside, and the side of the suction hand 10 is bent, the center can be adsorbed more than the outside of the suction hand 10. The arrangement of the suction pad 2 is changed so that the number of pads 2 increases.

<Modification of Resin Molding Device>

FIG. 27 is a schematic plan view showing a modification of the resin molding apparatus of the embodiment. Although there are three resin sealing mechanisms 530 in the embodiment shown in FIG. 27, the number of resin sealing mechanisms 530 may be increased or decreased. Other than that, it has the same structure as the resin sealing device of the embodiment. In addition, for example, the suction mechanism 1 may be installed on the substrate loader 541. In addition, by installing the suction mechanism 1 on the conveying mechanism 540 that takes out the formed plate-shaped member 20 from the forming die and conveys it, not only can the warpage of the formed plate-shaped member 20 be suppressed, but also the plate-shaped member 20 for cooling and heating. In addition, by providing the suction mechanism 1 as a table-shaped unit such as an XY table or a fixed table, not only can the warpage of the plate-like member 20 be suppressed, but also inspection and processing can be performed.

As described above, the embodiments and the modified examples have been described, but it is initially planned to appropriately combine the configurations of the above-described embodiments and the modified examples.

The embodiment of the present invention has been described, but it should be considered that the embodiment disclosed this time is an example in all respects and is not limited. The scope of the present invention is shown by the scope of the patent application scope, and includes all modifications within the meaning and scope equivalent to the scope of the patent application scope.

1: Adsorption mechanism

2: adsorption pad

2a: the first flow path

2b: Adsorption section

2c: Body part

2d: upper end

2e: lower end

2f: space

2g: Wall

3: Piston rod

3a: intermediate flow path

3b: lower end (bottom)

3c: Body part

3d: upper end

3e: Flow path expansion section

3f: flange

4: Support

4a: interior space

4b: underside

4c: Second flow path

4d: recess

5: elastic member

5a: the other end

5b: one end

6: Sealing member

7: Bush

9: axis

X, Y: area

Claims (9)

An adsorption hand includes a plurality of adsorption mechanisms, wherein the adsorption mechanism includes: a supporting portion provided with an internal space; a piston rod inserted in the internal space and capable of moving in the axial direction, at least a portion of the piston rod, the piston rod having A cylindrical piston rod body portion and a flange extending outward from the upper portion of the piston rod body portion; an elastic member between the piston rod and the bottom surface of the internal space; and a An adsorption pad that is opposite to the elastic member side and that can move together with the piston rod; and the adsorption pad includes: an adsorption pad body portion that contacts the object to be adsorbed when the object to be adsorbed is adsorbed A suction portion of the suction pad and a wall portion connecting the suction pad body portion and the suction portion; providing a space surrounded by the suction pad body portion, the suction portion and the wall portion and the internal space A first flow path that is fluidly connected; and the area where the suction portion is projected on the bottom surface side of the internal space is larger than the area where the bottom surface of the piston rod is projected on the bottom surface side of the internal space, so The piston rod is provided with an intermediate flow path communicating with the first flow path of the suction pad. The suction hand according to item 1 of the patent application scope, wherein the piston rod moves on the bottom surface side of the internal space when the suction object is adsorbed. The suction hand as described in item 1 of the patent application further includes: a second flow path that fluidly connects the internal space with the suction mechanism. The suction hand according to any one of claims 1 to 3, wherein the arrangement of the suction mechanism can be changed according to the shape of the suction object. A conveying mechanism includes: the suction hand as described in any one of claims 1 to 4 and the moving unit of the suction hand. A resin molding device includes: a conveying mechanism as described in item 5 of the patent application scope, and a resin molding mechanism. A conveying method, comprising: the step of bringing the suction portion of the suction hand as described in any one of the patent application scopes from 1 to 4 into contact with the suction object; the step of suctioning the suction object ; And the step of transporting the object to be adsorbed. The conveying method according to item 7 of the patent application scope, wherein the step of adsorbing the object to be adsorbed on the adsorption unit further includes a step of correcting the curvature of the object to be adsorbed. A method for manufacturing a resin molded product, including: The step of conveying the object to be adsorbed and the step of resin-sealing the object to be adsorbed by the conveying method described in item 7 or 8 of the patent application scope.

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