JP2010140921A - Device and method for mounting ball, and apparatus for manufacturing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and method for mounting balls, compatible with small-lot production of a wide variety of products, and further which improves quality and productivity, and to provide an apparatus for manufacturing an electronic component. <P>SOLUTION: The ball mounting device 1 includes an array means 2 having an array mask 21 where array holes 22 through which balls 10 pass are arranged, a ball suction mask 31 where suction holes 32 for sucking arrayed balls 10 are arranged, a ball suction head 3 having a base 35 where the ball suction mask 31 is fitted, an elevation means 4, and a turning means 5 of turning the ball suction head 3 so that the ball suction head 3 in an upward state sucks a ball 10 and the ball suction head 3 in a downward state mounts the ball 10. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a ball mounting apparatus, a ball mounting method, and an electronic component manufacturing apparatus.

2. Description of the Related Art In recent years, in a process of mounting conductive balls (hereinafter appropriately abbreviated as “balls”) on connection terminals of a substrate or the like (for example, a bare chip substrate), the connection terminals have become narrower and have a larger number of pins due to miniaturization of packages. Progressing. For this reason, the balls to be mounted tend to be miniaturized, and the number of packages mounted tends to increase. That is, by mounting balls collectively (collectively) on a larger number of substrates, the number of balls mounted can be increased, but productivity can be greatly improved.
In addition, since the process of mounting the conductive ball is an extremely important process in manufacturing a semiconductor device (electronic component) such as a bare chip, various techniques have been developed.

(First conventional example)
FIG. 8 shows a schematic diagram for explaining a ball suction head of a ball mounting method according to a conventional example of the present invention, and (a) shows a schematic enlarged sectional view when the ball is sucked, b) shows a schematic enlarged cross-sectional view when the ball is placed.
In FIG. 8, a ball mounting apparatus 101 is a typical conventional ball mounting apparatus, and includes a ball tank 120, a ball suction head 130, and the like. The ball mounting apparatus 101 mounts a conductive ball 10 on a connection terminal (land 12) of a substrate 11 as a mounted body.

The ball tank 120 has a box shape and accommodates the conductive balls 10. The ball tank 120 blows air upward from the bottom and blows the ball 10 upward.
The ball suction head 130 is provided with a suction hole 131 on the lower surface thereof so as to correspond to the land 12 of the substrate 11, and the ball 10 is sucked into the suction hole 131 by sucking air from the suction hole 136. Is done.

  In the ball mounting apparatus 101, after the ball tank 120 blows up the ball 10 and the ball suction head 130 sucks the ball 10, the moving means (not shown) moves the ball suction head 130 above the substrate 11, The ball 10 is mounted on the land 12 of the substrate 11 by the adsorption breakage.

(Second conventional example)
FIG. 9 is a schematic enlarged cross-sectional view of the main part for explaining the apparatus for manufacturing a BGA product substrate according to Patent Document 1.
In FIG. 9, a BGA product substrate manufacturing apparatus 101a includes a solder ball alignment plate 121, a rotating means 150, and the like (see Patent Document 1).

The solder ball alignment plate 121 has a solder ball alignment hole 122 disposed on the upper surface, and the solder ball alignment hole 122 is formed by a solder ball alignment means (not shown) having a solder ball alignment mask and a solder ball storage squeegee. The balls 10 are aligned.
The substrate 11 is coated with flux (not shown) on the lands 12 by a flux mounting means (not shown).
Further, the rotating means 150 includes a rotating arm 151, a rotating shaft 152, and the like, and the substrate 11 coated with flux is detachably attached to the rotating arm 151.

  The BGA product substrate manufacturing apparatus 101 a rotates the rotary arm 151 by 180 degrees with the rotation shaft 152 as a starting point, and enters the land 12 of the substrate 11 attached to the rotary arm 151 and the solder ball alignment hole 122 of the solder ball alignment plate 121. The aligned balls 10 are brought into contact with each other so as to face each other, and the balls 10 are attached to the lands 12 through a flux (not shown). Thereafter, the ball 10 is mounted on the land 12 by rotating the rotary arm 151 to the original state.

In addition to the technique described above, as a technique related to the present invention, for example, Patent Document 2 discloses a technique of an arrangement mounting device for fine conductive balls. This array mounting apparatus includes an array head having an array plate in which suction holes are formed, an array plate support portion, and the like.
Further, Patent Document 3 describes an array substrate attached to a vacuum suction unit. A plurality of array holes are formed in the array substrate, and minute conductive balls are adsorbed to these array holes.

JP 2003-303926 A Japanese Patent Laid-Open No. 2005-044984 JP 09-275109 A

  However, the ball mounting apparatus 101 of the first conventional example requires a large amount of cost and days for manufacturing the ball suction head 130 for sucking the ball 10. Also, in general, due to the diversification of product types, a single product is not produced in large quantities but is produced in small quantities of various varieties. Therefore, the ball suction head 130 has to be manufactured for each type of product. In other words, the ball mounting device 101 requires a large amount of money and days to manufacture the ball suction head 130, and thus has a problem that it is not particularly suitable for high-mix low-volume production.

  Also, the BGA product substrate manufacturing apparatus 101a of the second conventional example rotates the substrate 11 until the land 12 is in the downward state, the substrate 11 is in contact with the ball 10, and the land 12 is in the upward state. During this time, the force for holding the ball 10 against the weight of the ball 10 was only the adhesive force of the flux (not shown). Further, depending on the parallelism and flatness of the substrate 11 and the solder ball alignment plate 121, it may be assumed that the flux on the land 12 and the ball 10 cannot all be in uniform contact. That is, there is a problem that the ball 10 may not be mounted on the land 12.

In particular, as described above, since the balls to be mounted are miniaturized and the number of batch mounting tends to increase, a large number of micronized balls are mounted in a batch with extremely high reliability. The technology to do is demanded.
In addition, the techniques of Patent Documents 2 and 3 have a problem that the above-mentioned request cannot be realized because the ball jumped in the air is adsorbed.

  The present invention has been proposed in order to solve the above-described problems, and can be applied to high-mix low-volume production, and can further improve quality and productivity. An object is to provide a method and an electronic component manufacturing apparatus.

  In order to achieve the above object, the ball mounting apparatus according to the present invention is provided with an alignment means having an alignment mask provided with alignment holes through which conductive balls pass, and an adsorption hole for adsorbing the aligned balls. The ball suction head having the base with the ball suction mask, the ball suction head and the alignment mask are moved closer to each other, and the ball suction head and the mounted object on which the ball is mounted are moved closer to each other. And means for rotating the ball adsorbing head so that the ball adsorbing is adsorbed with the ball adsorbing head facing upward and the ball adsorbing head is mounted with the ball adsorbing head facing downward.

  Further, the ball mounting method of the present invention includes a step of relatively approaching an alignment mask having an alignment hole through which a conductive ball passes in a state in which the ball suction head faces upward, and the alignment means includes a ball The ball suction head having a ball suction mask having the suction holes disposed therein is sucked into the alignment holes, and the ball suction head is relative to the mounted body on which the balls are mounted. And a step of rotating the ball suction head so as to be in a downward state and a step of mounting the sucked ball on the mounted body by the ball suction head.

  The electronic component manufacturing apparatus according to the present invention includes a flux application device that applies a flux to a land of a substrate, a ball mounting device that mounts a conductive ball on the land, and a heating device that joins the ball to the land by heating. In the electronic component manufacturing apparatus, the ball mounting device includes an alignment unit having an alignment mask provided with alignment holes through which the balls pass, and a ball suction mask provided with suction holes for sucking the aligned balls. A ball suction head having a base, a moving means for making the ball suction head and the alignment mask relatively close to each other, and for making the ball suction head and the mounted object to be mounted relatively close to each other; The ball suction head is rotated so that the ball is picked up with the head facing up and the ball is picked up with the ball suction head facing down. That a configuration equipped with a rotating means.

  According to the ball mounting apparatus, the ball mounting method, and the electronic component manufacturing apparatus of the present invention, it is possible to deal with a large variety of small-quantity production, and to improve quality and productivity.

[First Embodiment of Ball Mounting Device]
FIG. 1 is a schematic enlarged cross-sectional view of a main part for explaining the ball mounting apparatus according to the first embodiment of the present invention.
In FIG. 1, a ball mounting apparatus 1 according to this embodiment includes an aligning means 2, a ball suction head 3, an elevating means 4, a rotating means 5, and the like. In FIG. 1, for ease of understanding, the housing of the ball mounting device 1, the mounting table for the substrate 11, the suction means, the inspection means, the control means, and the like are omitted.
This ball mounting apparatus 1 mounts conductive balls 10 on a substrate 11 on which lands 12 are arranged.
The substrate 11 is usually a substrate such as a bare chip, BGA (ball grid array), or CSP (chip size package), but is not limited thereto. The ball 10 is usually a solder ball, but is not limited thereto.

(Alignment means)
The alignment means 2 includes an alignment mask 21 and a pair of ball squeegees 23.
The alignment mask 21 is usually a thin metal plate, and the thickness thereof is smaller than the diameter of the ball 10 (for example, 40 to 80% of the diameter of the ball 10). The alignment mask 21 is provided with a plurality of alignment holes 22 corresponding to the lands 12 of the substrate 11. Each alignment hole 22 is a circular hole, and the diameter of the alignment hole 22 is larger than the diameter of the balls 10 (for example, several% to several tens%). In this way, the balls 10 can smoothly pass through the alignment holes 22, and when aligning the balls 10, one ball 10 is accommodated in one alignment hole 22.

  Since the alignment mask 21 is manufactured using an etching technique or the like, the diameter of the alignment holes 22 is very small (for example, several tens of μm) or the number of the alignment holes 22 is large (for example, several hundreds). ˜several hundred thousand). Further, the manufacturing cost can be reduced, and the manufacturing cost can be shortened as compared with the case of manufacturing by mechanical processing.

  The pair of ball squeegees 23 are mounted above the alignment mask 21 so as to face each other, and a large number of balls 10 are movably accommodated between them. Further, the ball squeegee 23 is reciprocated in the horizontal direction on the alignment mask 21 by a ball squeegee moving means (not shown), whereby the ball 10 is transferred into the alignment hole 22 of the alignment mask 21.

The ball squeegee 23 is normally in a state of being floated by a minute distance from the alignment mask 21. This minute distance is shorter than the radius of the ball 10 and longer than the projection amount (projection height) of the ball 10 accommodated in the alignment hole 22 from the upper surface of the alignment mask 21. In this way, the ball squeegee 23 can reliably accommodate the ball 10. Further, since the lower end of the ball squeegee 23 does not come into contact with the balls 10 accommodated in the alignment holes 22, it is possible to avoid a problem that the balls 10 rub against the ball squeegee 23.
In the present embodiment, the ball 10 is swung into the alignment hole 22 of the alignment mask 21 using the ball squeegee 23 or the like, but the present invention is not limited to this.

(Ball suction head)
The ball suction head 3 includes a ball suction mask 31 and a base 35 as thin plates for sucking the balls.
The ball suction mask 31 is usually a metal thin plate, and the plate thickness is not particularly limited. However, for example, when adsorbing the ball 10, it is preferable that the ball 10 has a mechanical strength that does not substantially curve. If it does in this way, the reliability and durability of adsorption | suction can be improved. Further, when the ball 10 is mounted, the mounting position accuracy can be improved.

  The ball suction mask 31 is provided with a plurality of suction holes 32 corresponding to the lands 12 of the substrate 11. Each suction hole 32 is a circular hole, and the diameter of the suction hole 32 is smaller than the diameter of the ball 10 (for example, 30% to 80% of the diameter of the ball 10). In this way, the balls 10 aligned by the alignment mask 21 can be reliably adsorbed. Further, it is possible to avoid a problem that the ball 10 gets stuck in the suction hole 32 and is not separated from the suction hole 32 even if the suction is released.

  Since the ball suction mask 31 is manufactured using an etching technique or the like, when the diameter of the suction holes 32 is very small (for example, several tens of μm) or the number of the suction holes 32 is large (for example, several hundred to several hundreds). Even hundreds of thousands). Further, the manufacturing cost can be reduced, and the manufacturing cost can be shortened as compared with the case of manufacturing by mechanical processing.

The base 35 has a rectangular box shape, and an intake hole 36 is formed in the substantially central portion of the bottom plate. The base 35 has a ball suction mask 31 attached to the upper surfaces of the four side plates by bonding or the like. That is, the ball suction head 3 has an intake chamber formed by the base 35 and the ball suction mask 31. Although not shown, the intake chamber communicates with the intake means via a tube or the like. When the air is sucked from the air intake hole 36, the ball 10 is adsorbed to the adsorption hole 32. As will be described later, when the intake means releases the intake air, the ball 10 is mounted on the land 12.
In addition, the base 35 is joined to the rotating shaft 51 of the rotating means 5 via a fixing member 37 at the bottom plate.
The ball suction mask 31 and the base 35 are configured to be separately manufactured and assembled, but are not limited to this, and may be configured to be formed integrally, for example.

(Rotating means)
The rotation means 5 includes a rotation shaft 51 and a stepping motor connected to the rotation shaft 51, and rotates the ball suction head 3. That is, the rotating means 5 rotates the ball suction head 3 so that the ball 10 is sucked with the ball suction head 3 facing upward and the ball 10 is mounted with the ball suction head 3 facing downward.
The rotating means 5 of the present embodiment has a stepping motor, but is not limited to this configuration. For example, the rotating means 5 is configured to rotate the ball suction head 3 using an air cylinder or the like. Also good.
In addition, although not shown in the figure, an angle adjustment function for finely adjusting the parallelism with the alignment mask 21 and the substrate 11 may be employed.

(Elevating means)
Although not shown, the elevating means 4 includes a slide bearing, a ball screw, a stepping motor, and the like, and elevates and lowers the rotating means 5. That is, the lifting / lowering means 4 raises the rotation means 5 to bring the ball suction head 3 closer to the alignment mask 21, and lowers the rotation means 5 to bring the ball suction head 3 closer to the substrate 11. Let Normally, the ascending speed and the descending speed are controlled. For example, when the ball suction head 3 is positioned in the vicinity of the alignment mask 21 or the substrate 11, the speed is lowered.
In the present embodiment, when the ball suction head 3 is in the upward state, the alignment hole 22 of the alignment mask 21 is located at a position corresponding to the suction hole 32 of the ball suction mask 31, and the ball suction head 3 is In the downward state, the land 12 of the substrate 11 is located at a position corresponding to the suction hole 32 of the ball suction mask 31. As described above, since the structure can be simplified by using the moving means as the elevating means 4, the manufacturing cost can be reduced, the operation accuracy can be improved, and the quality is improved. Can be made.

The lifting / lowering means 4 is not limited to the above-described configuration, and moving means for relatively bringing the ball suction head 3 and the alignment mask 21 closer to each other and causing the ball suction head 3 and the substrate 11 to be relatively closer to each other. It is good to be.
Therefore, for example, the moving means of the present invention includes a first moving means for bringing the alignment means 2 close to the ball suction head 3 in the upward state and a second means for bringing the substrate 11 close to the ball suction head 3 in the downward state. It is good also as a structure which has a moving means. Moreover, the moving means of the present invention can normally move in the vertical direction and the horizontal direction.

Next, the operation of the ball mounting apparatus 1 having the above configuration will be described.
The ball mounting apparatus 1 is configured so that the ball suction mask 31 is substantially the same as the alignment mask 21 from a predetermined standby state (for example, the ball suction head 3 is positioned approximately halfway between the alignment means 2 and the substrate 11 in the upward state). The lifting / lowering means 4 raises the ball suction head 3 to a position where it comes into contact.

Next, the pair of ball squeegees 23 moves in the horizontal direction. By this movement, the balls 10 accommodated between the pair of ball squeegees 23 are transferred into the alignment holes 22 of the alignment mask 21.
At this time, intake by the intake means is not performed, and the balls 10 fall into the alignment holes 22 by the action of gravity. That is, since the balls 10 are accommodated in the alignment holes 22 using gravity, the balls 10 can be reliably aligned. Thereby, since one ball 10 is aligned in one alignment hole 22, it is possible to reliably prevent double ball defects (defects in which two balls 10 are mounted on one land 12).
Further, the present invention is not limited to this method. For example, the pair of ball squeegees 23 may be moved in the horizontal direction while the intake means is inhaling. According to this method, the balls 10 are accommodated in the alignment holes 22 by the action of adsorption force and gravity. That is, since the balls 10 are accommodated in the alignment holes 22 by using the adsorption force and the gravity without resisting the gravity, the balls 10 can be reliably aligned.

Although not shown, it may be inspected by using a camera or the like that all the balls 10 are aligned in the alignment hole 22. 10) and the reliability of quality against double ball defects can be improved.
Further, when an alignment leak occurs, the pair of ball squeegees 23 are moved again in the horizontal direction, and the balls 10 are aligned at the location where the alignment leak has occurred.
Furthermore, the inspection as described above can be appropriately performed in each step described later.

Next, as shown in FIG. 1, the suction means sucks air from the suction hole 36, and the ball 10 is sucked into the suction hole 32.
Note that, as described above, for example, when the pair of ball squeegees 23 are moved in the horizontal direction in a state where the intake means is inhaling, the balls 10 transferred to the alignment holes 22 are sequentially attracted by the suction holes 32. To be adsorbed. In this case, the intake force when the transfer of the ball 10 is completed may be made larger than the intake force (the vacuuming strength) when the ball squeegee 23 is moved. In this way, by controlling the intake force, the balls 10 can be more reliably aligned, and the balls 10 can be more reliably adsorbed. The reliability of quality can be further improved.
Therefore,

  Next, as shown in FIG. 2, the lifting / lowering means 4 lowers the ball suction head 3, and the rotation means 5 rotates the ball suction head 3 downward until it is approximately halfway between the alignment means 2 and the substrate 11. Further, the lifting / lowering means 4 lowers the ball suction head 3. At this time, the ball 10 is sucked into the suction hole 32.

  Subsequently, as shown in FIG. 3, the lifting means 4 lowers the ball suction head 3, and the height at which the sucked ball 10 contacts the land 12 of the substrate 11, or the ball 10 is a minute distance from the land 12. The ball suction head 3 stops at a height floating only upward. At this time, the ball 10 is attracted to the land 12 and is in contact with a flux (not shown) on the land 12.

Next, the suction means releases the suction, and the ball 10 is mounted on the land 12 of the substrate 11. At this time, when the ball 10 is released from the attraction force, it is reliably mounted on the land 12 by the action of gravity. That is, since the ball 10 is in contact with the flux (not shown) on the land 12, it does not easily shift in the horizontal direction due to its adhesive force. Further, when releasing the suction, vibration or impact may be applied to the ball suction head 3 by a vibration generating means (not shown), and in this way, mounting can be performed more reliably.
Subsequently, the lifting / lowering means 4 raises the ball suction head 3, and the rotation means 5 rotates the ball suction head 3 to the upward state almost halfway between the alignment means 2 and the substrate 11. Ends.

As described above, the ball mounting apparatus 1 according to the present embodiment reliably aligns the balls 10 with the alignment mask 21 and reliably adsorbs the balls 10 with the ball adsorbing mask 31 in an upward state where gravity can be used. Since the ball suction head 3 in the downward state mounts the ball 10 using gravity, the quality of the ball mounting can be greatly improved.
Furthermore, since the ball suction head 3 can be easily manufactured by using the ball suction mask 31, it is possible to cope with a large variety of small-quantity production and to reduce the manufacturing cost.

[Second Embodiment of Ball Mounting Device]
FIG. 4 is a schematic enlarged cross-sectional view of the main part for explaining the ball mounting apparatus according to the second embodiment of the present invention.
In FIG. 4, the ball mounting apparatus 1a of this embodiment is different from the ball mounting apparatus 1 of the first embodiment in that a rotation means 5a is provided instead of the rotation means 5. The other configuration of the ball mounting apparatus 1a is substantially the same as that of the ball mounting apparatus 1.
Therefore, in FIG. 4, the same components as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

The rotating means 5a has a rotating shaft 51a and a stepping motor connected to the rotating shaft 51a. The rotating shaft 51a is joined to the side plate of the base 35 via a fixing member 37a. Yes. That is, the rotation means 5a is configured to rotate the ball suction head 3 about the rotation shaft 51a located in the vicinity of the side plate of the base 35 as the rotation center.
In addition, the other structure and operation | movement of the ball mounting apparatus 1a are as substantially the same as the ball mounting apparatus 1 of 1st embodiment.

As described above, the ball mounting apparatus 1a of the present embodiment can achieve substantially the same effects as the ball mounting apparatus 1 of the first embodiment.
Furthermore, compared to the first embodiment, the ball 10 can be mounted on the land 12 by lowering the ball suction head 3 and then rotating it, so that the operation can be simplified. Note that the present invention is not limited to this operation. For example, the ball 10 may be mounted on the land 12 by lowering, rotating, and further lowering in substantially the same manner as in the first embodiment.

[Third embodiment of ball mounting apparatus]
FIG. 5 shows a schematic enlarged cross-sectional view of the main part for explaining the ball mounting apparatus according to the third embodiment of the present invention.
In FIG. 5, the ball mounting device 1 b of the present embodiment is configured to load the balls 10 on a plurality of substrates 11 in a single cycle as compared with the ball mounting device 1 of the first embodiment. The points are different. The other configuration of the ball mounting apparatus 1b is substantially the same as that of the ball mounting apparatus 1.
Therefore, in FIG. 5, the same components as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

The ball mounting apparatus 1b mounts the ball 10 on one substrate 11 in a mounting operation in m (m is a natural number of 2 or more) in the X direction × n (n is a natural number) in the Y direction.
For this reason, the alignment mask 21b of the alignment means 2b is provided with a plurality of alignment holes 22 corresponding to the lands 12 of the m × n substrates 11.
In the present embodiment, the plurality of mounted bodies are provided as m × n substrates 11, but the present invention is not limited to this. For example, the plurality of mounted bodies may include one piece before division. A wafer (not shown) is also included.

The ball suction head 3b includes a ball suction mask 31b and a base 35b.
The ball suction mask 31 b is provided with a plurality of suction holes 32 corresponding to the lands 12 of the m × n substrates 11.
The base 35b has a rectangular box shape, and a ball suction mask 31b is attached to the upper surfaces of the four side plates by bonding or the like.

Here, preferably, the base 35b may include a support portion 351 that supports the ball suction mask 31b at a position corresponding to the boundary between adjacent substrates 11. In this way, even when the ball suction mask 31b is enlarged (for example, when the length of one side is several tens of centimeters to several tens of centimeters), the flatness of the ball suction mask 31b can be improved. As a result, the ball 10 can be more reliably adsorbed and the ball 10 can be more reliably mounted.
The support portion 351 of the present embodiment protrudes in a lattice shape, and the ball suction mask 31b is attached to the upper surface thereof by adhesion or the like. However, the structure of the support part 351 is not limited to this, For example, it is good also as a structure where the columnar member was arrange | positioned.

  Further, the base 35b may have an intake chamber 352 having the support portion 351 as a side wall at a position corresponding to each substrate 11. That is, the ball suction head 3 b has m × n intake holes 36 formed in the bottom plate of the base 35 b, and can suck each ball 10 corresponding to each substrate 11. In this way, even when the number of balls 10 to be sucked together is large (for example, hundreds to hundreds of thousands), the suction force can be controlled with high accuracy, so the suction reliability is improved. Can be made.

  In the present embodiment, m × n intake chambers 352 are provided corresponding to each substrate 11, but the present invention is not limited to this. For example, a configuration in which n intake chambers 352 in the Y direction are communicated and m intake holes 36 are formed in the X direction (that is, a configuration in which m intake chambers 352 that are long in the Y direction are provided in the X direction) is also possible. Good. In this way, the m suction chambers 352 can be sequentially sucked in accordance with the movement of the ball squeegee 23, so that the reliability at the time of suction can be improved. In addition, when the ball 10 is mounted, the m intake chambers 352 can be released in order, so that the degree of freedom in the mounting procedure can be increased and a better mounting procedure is realized. can do.

The elevating means 4b and the rotating means 5b include a pair of the elevating means 4 and the rotating means 5 described above, and the elevating means 4 and the rotating means 5 are provided on both sides in the X direction of the base 35b. That is, both ends in the X direction of the bottom plate of the base 35 b are joined to the rotating shaft 51 of the rotating means 5 via the fixing member 37. In this way, the enlarged ball suction head 3b can be moved up and down and rotated smoothly and accurately.
The other configurations and operations of the ball mounting apparatus 1b are substantially the same as those of the ball mounting apparatus 1 of the first embodiment.

As described above, the ball mounting device 1b according to the present embodiment can achieve substantially the same effects as the ball mounting device 1 according to the first embodiment, and further, the balls 10 can be mounted collectively on the plurality of substrates 11. Therefore, productivity can be greatly improved.
Each of the above-described embodiments has various application examples.
Next, one of these application examples will be described with reference to the drawings.

<Application example of ball mounting device>
6A and 6B are schematic enlargements for explaining a ball suction mask according to an application example of the present invention, wherein FIG. 6A is a plan view, FIG. 6B is a cross-sectional view along AA, c) shows an enlarged view of part B.
In FIG. 6, a ball suction mask 31 ′ is used instead of the ball suction mask 31 of the ball mounting device 1 described above. The ball suction mask 31 ′ is provided with a plurality of outer surface recesses 321, suction holes 32 ′, and inner surface recesses 322 corresponding to the lands 12 of the substrate 11.

The outer surface concave portion 321 is formed around the suction hole 32 ′ on the outer surface of the ball suction mask 31 ′, and has a disk shape with a diameter of φd ₂ and a depth of t ₁ .
Further, the suction hole 32 ′ has a cylindrical shape with a diameter of φd ₁ and a depth of t ₂ .
Further, the inner surface recess 322 is formed around the suction hole 32 ′ on the inner surface of the ball suction mask 31 ′, and has a disk shape with a diameter of φd ₃ and a depth of t ₃ .
The diameter of the balls 10 is φd, the diameter of the alignment holes 22 of the alignment mask 21 is φD, and the plate thickness t of the ball suction mask 31 ′ is t = t ₁ + t ₂ + t ₃ . Further, as described above, the dimensions of the alignment hole 22 and the ball 10 are φD> φd, and the ball 10 can pass through the alignment hole 22.

The dimensions of the alignment hole 22, the outer surface recess 321, and the suction hole 32 ′ are φD> φd ₂ > φd _1. Touch. Further, the upper peripheral edge of the outer surface recess 321 does not contact the ball 10 but is close to the ball 10.
In this way, the ball suction mask 31 ′ can be brought into contact with the alignment mask 21. Therefore, when the ball squeegee 23 is moved, bending of the alignment mask 21 can be suppressed and the balls 10 can be more reliably transferred. it can. In addition, the upper peripheral edge of the outer surface recess 321 can guide the ball 10 so that the ball 10 slid into the alignment hole 22 is positioned directly above the suction hole 32 ′. The reliability of adsorption can be improved. Furthermore, when the ball 10 is mounted on the land 12, the peripheral edge portion above the outer surface recess 321 can suppress the movement of the ball 10 released from the attracting force in the horizontal direction. Can be improved.

Each dimension of the inner surface recess 322 and the suction hole 32 ′ is φd ₃ > φd _{2. When} the suction hole 32 ′ is a small diameter and deep hole, it has an effect of expanding the lower side of the suction hole 32 ′. That is, even if the plate thickness t is increased in order to increase the mechanical strength of the ball suction mask 31 ′, the risk of foreign matter clogging in the suction holes 32 ′ is reduced and the gas easily flows. The reliability of adsorption can be improved.
In the present embodiment, the outer surface recess 321, the suction hole 32 ′, and the inner surface recess 322 are disposed. However, only the outer surface recess 321 and the suction hole 32 ′ are disposed, or the suction hole Only the 32 ′ and the inner surface recess 322 may be provided.

As described above, according to this application example, substantially the same effect as that of the above-described embodiment can be obtained, and the reliability of the adsorption and mounting of the ball 10 can be improved.
In the illustrated shape, the corners are substantially perpendicular. However, when manufacturing the ball suction mask 31 ′, the corners may be rounded (chamfered) by adjusting etching conditions and the like. In this way, the operation of the ball 10 is smooth, and the suction and mounting reliability can be further improved.

[One Embodiment of Ball Mounting Method]
The present invention is also effective as an invention of a ball mounting method.
The ball mounting method of the present embodiment is a ball mounting method using the ball mounting apparatus 1 described above.
FIG. 7 is a schematic flowchart for explaining the ball mounting method according to the embodiment of the present invention.
In FIG. 7, in the ball mounting method of the present embodiment, first, the ball suction head 3 rises in an upward state and approaches the alignment mask 21 provided with the alignment holes 22 through which the conductive balls 10 pass. And stop (step S1).

Next, the alignment means 2 swings the balls 10 into the alignment holes 22, and the ball suction head 3 having the ball suction mask 31 provided with the suction holes 32 sucks the balls 10 that have been transferred (step S2). .
Here, as described above, since the balls 10 are accommodated in the alignment holes 22 by gravity or against the gravity, the balls 10 can be reliably aligned and aligned. The ball 10 can be reliably adsorbed.

  Next, the ball suction head 3 is lowered in an upward state, and is rotated to a downward state substantially in the middle between the alignment means 2 and the substrate 11, and further approaches the substrate 11 and stops (step S3).

  Next, the suction means releases the suction, and the ball suction head 3 mounts the sucked ball 10 on the land 12 of the substrate 11 (step S4). At this time, when the ball 10 is released from the attraction force, it is reliably mounted on the land 12 by the action of gravity.

As described above, according to the ball mounting method of the present embodiment, the balls 10 are surely aligned by the alignment mask 21, the balls 10 are reliably adsorbed by the ball suction mask 31 using gravity, and the gravity is used. And since the ball | bowl 10 is mounted in the state in which the ball | bowl adsorption head 3 faces downward, the quality of ball | bowl mounting can be improved.
Further, the ball mounting method of the present embodiment has various application examples. For example, the ball mounting method using the above-described ball mounting device 1b may be used. Since the ball 10 can be mounted, the productivity can be greatly improved.

[One Embodiment of Electronic Parts Manufacturing Apparatus]
The present invention is also effective as an invention of an electronic component manufacturing apparatus.
Although not shown in the drawings, the electronic component manufacturing apparatus of the present embodiment is a flux application device that applies flux to the lands of the substrate, a ball mounting device that mounts conductive balls on the lands, and the balls on the lands by heating. It has a heating device to be joined, and the ball mounting device is the above-described ball mounting device 1.

According to this electronic component manufacturing apparatus, the ball mounting apparatus 1 reliably aligns the balls 10 by the alignment mask 21, reliably adsorbs the balls 10 by the ball adsorption mask 31 using gravity, and uses gravity. Since the ball 10 is mounted with the ball suction head 3 facing downward, the quality of the ball mounting can be improved. Therefore, when manufacturing electronic parts such as BGA, quality can be improved.
In addition, the electronic component manufacturing apparatus according to the present embodiment has various application examples. For example, the ball mounting apparatus may include the above-described ball mounting apparatus 1b. Since the balls 10 can be collectively mounted on the substrate 11, productivity can be greatly improved.

The ball mounting apparatus, the ball mounting method, and the electronic component manufacturing apparatus according to the present invention have been described with reference to preferred embodiments and application examples. However, the ball mounting apparatus, the ball mounting method, and the electronic component manufacturing apparatus according to the present invention have been described. These are not limited to the above-described embodiments and application examples, and it goes without saying that various modifications can be made within the scope of the present invention.
For example, the ball suction mask 31 ′ in the application example of the ball mounting device is not limited to the case where it is used instead of the ball suction mask 31 of the ball mounting device 1. For example, the ball suction mask 31 b of the ball mounting device 1 b is used. It is good also as a structure used instead of. In this way, the ball adsorbing mask 31b having the outer surface concave portion 321 formed thereon can be brought into contact with the enlarged alignment mask 21b, so that the deflection of the alignment mask 21b when moving the ball squeegee 23 is effective. Therefore, the balls 10 can be aligned more reliably.

FIG. 1 is a schematic enlarged cross-sectional view of a main part for explaining the ball mounting apparatus according to the first embodiment of the present invention. FIG. 2 is a schematic enlarged cross-sectional view of the main part for explaining the operation of transporting the attracted ball of the ball mounting apparatus according to the first embodiment of the present invention. FIG. 3 is a schematic enlarged cross-sectional view of the main part for explaining the operation of mounting the adsorbed ball in the ball mounting apparatus according to the first embodiment of the present invention. FIG. 4 is a schematic enlarged cross-sectional view of the main part for explaining the ball mounting apparatus according to the second embodiment of the present invention. FIG. 5 shows a schematic enlarged cross-sectional view of the main part for explaining the ball mounting apparatus according to the third embodiment of the present invention. 6A and 6B are schematic enlargements for explaining a ball suction mask according to an application example of the present invention, wherein FIG. 6A is a plan view, FIG. 6B is a cross-sectional view along AA, c) shows an enlarged view of part B. FIG. 7 is a schematic flowchart for explaining the ball mounting method according to the embodiment of the present invention. FIG. 8 shows a schematic diagram for explaining a ball suction head of a ball mounting method according to a conventional example of the present invention, and (a) shows a schematic enlarged sectional view when the ball is sucked, b) shows a schematic enlarged cross-sectional view when the ball is placed. FIG. 9 is a schematic enlarged cross-sectional view of the main part for explaining the apparatus for manufacturing a BGA product substrate according to Patent Document 1.

Explanation of symbols

1, 1a, 1b, 1 'Ball mounting device 2, 2b Alignment means 3, 3b Ball suction head 4, 4b Lifting means 5, 5a, 5b Rotating means 10 Ball 11 Substrate 12 Land 21, 21b Alignment mask 22 Alignment hole 23 Ball squeegee 31, 31 b Ball suction mask 32, 32 ′ Suction hole 35, 35 b Base 36 Intake hole 37, 37 a Fixing member 51, 51 a Rotating shaft 101 Ball mounting device 101 a BGA product substrate manufacturing device 120 Ball tank 121 Solder Ball alignment plate 122 Solder ball alignment hole 130 Ball adsorption head 131 Adsorption hole 136 Intake hole 150 Rotating means 151 Rotating arm 152 Rotating shaft 321 Outer surface recess 322 Inner surface recess 351 Supporting portion 352 Intake chamber

Claims (10)

An alignment means having an alignment mask provided with alignment holes through which the conductive balls pass;
A ball suction head having a base provided with a ball suction mask provided with suction holes for sucking the aligned balls;
Moving means for relatively approaching the ball suction head and the alignment mask, and relatively approaching the ball suction head and the mounted body on which the ball is mounted;
Rotating means for rotating the ball adsorbing head so as to adsorb the ball with the ball adsorbing head facing up and mounting the ball with the ball adsorbing head facing down. A ball mounting device.   The ball mounting apparatus according to claim 1, wherein the moving unit is an elevating unit that moves the rotating unit up and down.   The ball suction mask is provided with the suction holes corresponding to the plurality of mounted bodies, and the alignment mask is provided with the alignment holes corresponding to the plurality of mounted bodies. The ball mounting apparatus according to claim 2.   The ball mounting apparatus according to claim 3, wherein the base has a support portion that supports the ball suction mask at a position corresponding to a boundary between the adjacent mounted bodies.   The ball mounting apparatus according to claim 4, wherein the base has an intake chamber having the support portion as a side wall at a position corresponding to one or two or more adjacent mounted bodies.   The ball mounting apparatus according to claim 2, wherein a recess is formed around at least one of the suction holes on the outer surface and the inner surface of the ball suction mask. A step of relatively approaching an alignment mask provided with alignment holes through which the conductive balls pass in a state in which the ball suction head faces upward;
An aligning unit swings the balls into the alignment holes, and the ball suction head having a ball suction mask provided with suction holes sucks the transferred balls;
A step of rotating the ball suction head so as to be relatively close to a mounted body on which the ball is mounted and to be in a downward state;
And a step of mounting the sucked ball on the mounted body.   The ball mounting method according to claim 7, wherein the ball adsorbing head is moved up to approach the alignment mask and is moved down to approach the mounted body. In a flux application apparatus for applying a flux to a land of a substrate, a ball mounting apparatus for mounting a conductive ball on the land, and an electronic component manufacturing apparatus having a heating apparatus for bonding the ball to the land by heating,
The ball mounting device is
Alignment means having an alignment mask provided with alignment holes through which the balls pass;
A ball suction head having a base provided with a ball suction mask provided with suction holes for sucking the aligned balls;
Moving means for relatively approaching the ball suction head and the alignment mask, and relatively approaching the ball suction head and the mounted body on which the ball is mounted;
Rotating means for rotating the ball adsorbing head so as to adsorb the ball with the ball adsorbing head facing up and mounting the ball with the ball adsorbing head facing down. An electronic component manufacturing apparatus.   The electronic component manufacturing apparatus according to claim 9, wherein the moving unit is an elevating unit that elevates and lowers the rotating unit.

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