TWI587967B - Automated assembly system - Google Patents

Description

Automated assembly system

The present invention relates to an assembly system, and more particularly to an automated assembly system.

In recent years, with the advancement of technology, the computing speed of electronic devices has become faster and faster. As the rate of operation increases, the accompanying heat increases. Therefore, the electronic device needs to add a heat dissipation module with better heat dissipation capability to quickly eliminate the heat of the heat generating component in the electronic device.

For example, the heat dissipation module may be a heat dissipation fin set that can be directly disposed on a heat generating component (for example, a wafer) on the substrate. The heat sink fin group can directly take away the heat of the heat generating component by heat conduction, and then the heat sink fin group exchanges heat with the air by heat convection to transfer heat to the surroundings. In this way, the heat sink fin group can perform heat removal work on the heat generating member.

When assembled, the heat sink fin set can be fixed to the heat generating component by various methods, such as sticking or locking. In recent years, the industry has developed the use of a push pin that allows the heat sink fin set to be fixed to the heat generating member in a manner that penetrates the heat sink fin group and the lower substrate of the heat generating member. Furthermore, the push pin is first fixed and penetrates through the heat sink fin set, and the assembler can press the push pin toward the substrate by using a press fixture to fix the heat sink fin set to the heat sink.

However, such a manual press-fitting method requires a large amount of positioning and assembly time, thus causing a problem of time consuming, and the heat-dissipating fin group may not be properly fixed to the heat-generating member due to human error. Therefore, the manufacturer must develop a device to improve the effectiveness and efficiency of the heat dissipation module fixed to the heat generating component.

In view of the above problems, the present invention discloses an automated assembly system for automatically assembling a heat dissipation module on a substrate to improve assembly efficiency and effectiveness.

An embodiment of the present invention provides an automated assembly system for automatically assembling at least one heat sink fin assembly on a substrate, including a shelf, a positioning fixture, an electronic arm, a tray, and an assembly module. The rack is used for the heat sink fin set. The positioning fixture is used to locate the heat sink fin set. The electronic arm is used to take the heat sink fin set to the positioning fixture from the rack. The tray is used to carry the substrate. The assembly module is configured to take the heat dissipation fin set from the positioning fixture and fix the heat dissipation fin set on the substrate.

In summary, according to an automated assembly system disclosed by the present invention, an electronic arm can automatically take a heat sink fin set to a positioning fixture, and the assembly module picks up and moves to a heat sink fin set on the lower positioning fixture, and then The positioning fixture is removed from the assembly module. The assembly module presses and fixes the heat sink fin group to the substrate on the tray below. In this way, the heat sink fin set can be automatically and accurately mounted on the substrate, and the assembler only needs to retrieve the mounted substrate from the tray and place another substrate to be assembled on the tray. Therefore, with the above automated assembly system, the heat dissipation fin set can be assembled correctly and quickly on the substrate, thereby improving the assembly effect and efficiency.

The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the principles of the invention.

1‧‧‧Automated assembly system

10‧‧‧ Pedestal

20‧‧‧Shelf

30‧‧‧ positioning fixture

31‧‧‧Positioning holes

40‧‧‧Electronic arm

41‧‧‧Placement agency

411‧‧ ‧ nozzle

42‧‧‧Support frame

43‧‧‧Slide rails

50‧‧‧Tray

60‧‧‧Assembly modules

61‧‧‧ ‧ frame

62‧‧‧Absorption and lowering mechanism

621‧‧‧Under the indenter

621a‧‧ ‧ nozzle

63‧‧‧First track

64‧‧‧second track

80‧‧‧Substrate

81, 82, 83, 84‧‧‧ electronic components

90‧‧‧Finishing fin housing box

91, 92, 93, 94‧‧ ‧ heat sink fin set

911‧‧‧ push pin

1 is a perspective view of a automated assembly system in a first perspective, in accordance with an embodiment of the present invention.

2 is a perspective view of a second assembly view of an automated assembly system in accordance with an embodiment of the present invention.

3 is a side elevational view of an automated assembly system in accordance with an embodiment of the present invention.

4 is a first actuating diagram of an automated group loading system in accordance with an embodiment of the present invention.

Figure 5 is a schematic illustration of a second actuation of an automated assembly system in accordance with an embodiment of the present invention.

Figure 6 is a schematic illustration of a third actuation of an automated assembly system in accordance with an embodiment of the present invention.

Figure 7 is a fourth actuating diagram of an automated assembly system in accordance with an embodiment of the present invention.

Figure 8 is a schematic illustration of a fifth operation of an automated assembly system in accordance with an embodiment of the present invention.

Figure 9 is a sixth illustration of an automated assembly system in accordance with an embodiment of the present invention. Schematic diagram.

Figure 10 is a diagram showing a seventh operation of the automated assembly system in accordance with an embodiment of the present invention.

Figure 11 is a diagram showing an eighth operation of the automated assembly system in accordance with an embodiment of the present invention.

The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

The invention discloses an automated assembly system for automatically assembling at least one heat dissipation module on a substrate. The heat dissipation module may be a heat dissipation fin set, and the substrate may be a printed circuit board of an electronic device, and at least one electronic component such as a wafer is disposed thereon. The heat sink fin set is assembled on the wafer. When the electronic device is in operation, the wafer is operated with heat generated. The heat sink fins heat away the heat generated by the wafer, reducing or stabilizing the temperature of the wafer to maintain proper operation of the overall electronic device and its wafer.

Hereinafter, an automated assembly system according to an embodiment of the present invention will be described. Referring to FIG. 1 and FIG. 2 and FIG. 3, FIG. 1 is an automated assembly system according to an embodiment of the present invention. Stereoscopic view of the angle of view, "2nd picture" 3 is a perspective view of an automated assembly system according to an embodiment of the present invention, and FIG. 3 is a side elevational view of an automated assembly system in accordance with an embodiment of the present invention.

An automated assembly system 1 according to an embodiment of the invention includes a shelf 20, a positioning fixture 30, an electronic arm 40, a tray 50, and an assembly module 60. In this embodiment and other partial embodiments, the automated assembly system 1 further includes a base 10, and the rack 20, the positioning fixture 30, the electronic arm 40, the tray 50, and the assembly module 60 are all disposed on the base 10. .

The rack 20 is used for a plurality of heat sink fin sets (for example, 91, 92, 93, and 94). In this embodiment and some other embodiments, the plurality of heat dissipation fin sets 91, 92, 93, and 94 are mounted on a heat dissipation fin receiving box 90 in an array manner (X axis and Y axis). The heat sink fin housing 90 is placed on the rack 20 for subsequent assembly. Each of the heat dissipation fin sets 91, 92, 93, and 94 may further be provided with a push pin or push-up pin (shown in FIG. 9), which is an automation according to an embodiment of the present invention. The sixth actuation diagram of the assembly system 1 is such that the push pins 911 respectively pass through the heat dissipation fin sets 91, 92, 93, 94 to sequentially fix the electronic components of the heat dissipation fin sets 91, 92, 93, 94 on the substrate 80, respectively. 81, 82, 83, 84. However, the number of push pins 911 on the heat dissipation fin sets 91, 92, 93, 94 of the present embodiment is not intended to limit the present invention, and the number thereof may be adjusted according to actual conditions. In other embodiments, the heat sink fin sets 91, 92, 93, 94 may be provided with one, three or more push pins 911.

The positioning fixture 30 is adjacent to the rack 20 for positioning the heat sink fin set 91, 92, 93, 94. In this embodiment and some other embodiments, the positioning fixture 30 further has a plurality of positioning holes 31 for inserting the push pin 911 to position the heat dissipation fin sets 91, 92, 93, 94 in the positioning fixture. 30 on.

The electronic arm 40 is located above the rack 20 and the positioning fixture 30 for taking the heat sink fin sets 91, 92, 93, 94 from the rack 20 to the positioning fixture 30. In this embodiment and some other embodiments, the electronic arm 40 further includes a placement mechanism 41, a support frame 42 and a slide rail 43. The slide rail 43 is fixedly disposed on the base 10, and the support frame 42 is movably disposed on the slide rail 43 to move the support frame 42 in the X-axis direction. The placement mechanism 41 is disposed on the support frame 42, and the placement mechanism 41 is movable along the support frame 42 (i.e., moved in the Y-axis direction). The placement mechanism 41 can take the heat dissipation fin sets 91, 92, 93, 94 toward the rack 20 and can place the heat dissipation fin sets 91, 92, 93, 94 on the positioning fixture 30 toward the positioning fixture 30 (ie, the treatment) Move in the Z axis direction). As such, the placement mechanism 41 is movable in the three-axis direction to take and place the heat dissipation fin sets 91, 92, 93, 94. Furthermore, the placement mechanism 41 of the electronic arm 40 further includes at least one suction nozzle 411 for sucking the push pin 911 on the heat dissipation fin sets 91, 92, 93, 94, respectively, to pick up the heat dissipation fins. Sheet sets 91, 92, 93, 94.

The tray 50 is used to carry the substrate 80. In detail, the assembler can place the substrate 80 to be processed (ie, the substrate 80 on which the heat dissipation fin sets 91, 92, 93, 94 have not been assembled) on the tray 50, or the assembled substrate 80 (ie, already The substrate 80) on which the heat radiation fin groups 91, 92, 93, 94 are assembled is taken out from the tray 50.

The assembly module 60 is configured to take the heat dissipation fin set from the positioning fixture 30 91, 92, 93, 94, and the heat dissipation fin sets 91, 92, 93, 94 are fixed to the substrate 80. In detail, in this embodiment and some other embodiments, the assembly module 60 includes a frame 61 and a suction and depression mechanism 62. The frame body 61 is fixed to the base 10, the suction lower pressing mechanism 62 is movably disposed on the frame body 61, and the suction lower pressing mechanism 62 is moved along the line with respect to the frame body 61 for moving relative to the frame body 61 to The heat sink fin sets 91, 92, 93, 94 are taken up and pressurized. Further, the suction lower pressing mechanism 62 may include a plurality of lower pressing heads 621, each lower pressing head 621 includes at least one suction nozzle 621a, and the suction nozzle 621a of the lower pressing head 621 is configured to suck the heat dissipation fin sets 91, 92, 93, 94. Therefore, the suction pressing mechanism 62 can simultaneously control the plurality of lower pressing heads 621 to take and place the plurality of heat dissipation fin sets 91, 92, 93, 94. The number and position of the suction nozzles 621a of each of the lower pressing heads 621 may correspond to the number and position of the pushing pins 911 of the respective heat radiation fin groups 91, 92, 93, and 94.

In this embodiment and some other embodiments, the assembly module 60 further includes a first rail 63 and a second rail 64. The first rail 63 and the second rail 64 are fixedly disposed on the frame body 61. In this embodiment, the first track 63 and the second track 64 all extend along the X axis and are spaced apart from the base 10 (ie, the first track 63 and the second track 64 are stacked on each other at different heights). However, this arrangement is not intended to limit the invention.

The positioning jig 30 is movably disposed on the first rail 63. As such, the positioning fixture 30 is movably disposed on the frame body 61. The positioning fixture 30 can be displaced relative to the frame 61 to have a placement position (as shown in FIG. 3) and a take-up position (as shown in FIG. 7), which is an automation according to an embodiment of the present invention. Assembly system The fourth actuation diagram of 1). In the placement position, the positioning jig 30 is interposed between the electronic arm 40 and the suction lower pressing mechanism 62; in the take-up position, the positioning jig 30 is located in the frame body 61 and below the suction lower pressing mechanism 62. The tray 50 is movably disposed on the second rail 64 such that the tray 50 is movably disposed on the frame body 61. In this manner, the tray 50 is movably disposed on the frame body 61, and the tray 50 is displaceable relative to the frame body 61 to have a first position (as shown in FIG. 3) and a second position (eg, FIG. 9). Shown). In the first position, the tray 50 is located outside the frame 61 for placement on the substrate 80 to be assembled; in the second position, the tray 50 is located within the frame 61. In more detail, the second position of the tray 50 is located below the suction lowering mechanism 62.

In addition, the automated assembly system 1 further includes a control module (not shown) for controlling the movement of the positioning fixture 30 and the tray 50, the moving path of the electronic arm 40, and the taking and placing of the heat dissipation fin sets 91, 92. The movement path and relative position of the 93, 94 and the movement path of the assembly module 60 for taking and placing the heat dissipation fin sets 91, 92, 93, 94. Before assembly, the assembler can adjust the relative positions of the heat dissipation fin sets 91, 92, 93, 94 to be placed on the substrate 80 in advance, and set their relative positions to the control module to facilitate the subsequent automated assembly work.

The flow of assembling the heat dissipation fin sets 91, 92, 93, 94 to the substrate 80 by the automated assembly system 1 will be described below. Please refer to "Figure 1" to "Figure 3". In this embodiment, the substrate 80 includes four electronic components 81, 82, 83, 84. This assembly process requires assembly of the heat dissipation fin sets 91, 92, 93, 94 to their corresponding electronic components 81, 82, 83, 84. on.

First, first place a plurality of heat sink fin sets 91, 92, 93, 94 The heat dissipation fin receiving box 90 is on the rack 20 . In detail, the heat sink fin housing 90 may include more than four heat sink fin arrays arranged in an array. As such, when a plurality of substrates 80 are to be sequentially assembled, the assembler does not need to replace the new heat sink fin housing 90 including the plurality of heat sink fin sets 91, 92, 93, 94 again to speed up the assembly time. However, the number of the electronic components 81, 82, 83, 84 on the substrate 80, the number of the heat dissipation fin sets 91, 92, 93, 94 assembled to the single substrate 80, and the heat dissipation fins on the heat dissipation fin housing 90 The total number of groups 91, 92, 93, 94 is not intended to limit the invention. In other embodiments, the number of the above electronic components and the heat sink fin group can be adjusted according to actual conditions. In addition, the substrate 80 to be assembled may be placed on the tray 50.

Please refer to FIG. 4, which is a first actuation diagram of the automated assembly system 1 in accordance with an embodiment of the present invention. Then, the electronic arm 40 can take (ie, pick up) the heat dissipation fin set 91 on the rack 20 in a three-axis movement manner.

Please refer to FIG. 5, which is a schematic diagram of a second operation of the automated assembly system 1 according to an embodiment of the invention. Then, the electronic arm 40 is moved to place the heat dissipating fin group 91 on the positioning jig 30 at the placement position.

Please refer to FIG. 1 and FIG. 6 , which are schematic diagrams of a third operation of the automated assembly system 1 according to an embodiment of the invention. Next, the electronic arm 40 repeats the above steps to sequentially take the heat dissipation fin sets 92, 93, 94 on the rack 20 and place them on the positioning jig 30. It should be noted that the positions of the heat dissipation fin sets 91, 92, 93, 94 positioned on the positioning jig 30 correspond to the positions of the electronic components 81, 82, 83, 84 of the substrate 80. Furthermore, the electronic arm 40 sequentially carries the shelf 20 The order in which the heat dissipating fin sets 91, 92, 93, and 94 are sequentially taken and the heat dissipating fin sets 91, 92, 93, and 94 are placed in the positioning jig 30 is not intended to limit the present invention.

Please refer to FIG. 7 , which is a schematic diagram of a fourth operation of the automated assembly system 1 according to an embodiment of the invention. Then, the positioning jig 30 is moved along the first rail 63 to the take-up position so that the positioning jig 30 is located below the suction lowering mechanism 62 of the assembly module 60.

Please refer to FIG. 1 and FIG. 8 , which are schematic diagrams of a fifth operation of the automated assembly system 1 according to an embodiment of the invention. The suction lower pressing mechanism 62 picks up (i.e., sucks) the heat radiating fin groups 91, 92, 93, 94 from the positioning jig 30 in the Z-axis direction, and the electronic arm 40 moves back above the rack 20. In the present embodiment, the suction lower pressing mechanism 62 simultaneously sucks a plurality of heat radiation fin sets 91, 92, 93, and 94.

Please refer to FIG. 1 and FIG. 9 , which are schematic diagrams of a sixth operation of the automated assembly system 1 according to an embodiment of the invention. Next, the suction lower pressing mechanism 62 picks up the heat radiation fin sets 91, 92, 93, 94 and returns to the home position along the Z axis, and the positioning jig 30 moves back along the first rail 63 to the placement position.

Please refer to FIG. 1 and FIG. 10, which are schematic diagrams of a seventh operation of the automated assembly system 1 according to an embodiment of the present invention. The tray 50 is moved along the second track 64 to a second position. The lower pressing mechanism 62 is then sucked down the Z-axis to fix the heat-dissipating fin sets 91, 92, 93, 94 to the substrate 80 on the tray 50. The position of the heat dissipation fin set 91, 92, 93, 94 positioned on the positioning fixture 30 corresponds to the relative position of the lower pressing head 621 of the suction pressing mechanism 62 and the electronic components 81, 82, 83 of the substrate 80, 84 location. Therefore, the suction pressing mechanism 62 only needs The push pin 911 of the heat radiating fin group 91, 92, 93, 94 is taken up and down along the Z axis to the substrate 80 on the tray 50.

In addition, when the positioning fixture 30 is moved back to the placement position, the electronic arm 40 can continue to place the other heat dissipation fin sets that are taken later on the positioning fixture 30, so that other heat dissipation fin sets (not shown) are automatically Assembled on the next substrate (not shown).

Please refer to FIG. 1 and FIG. 11 , which are diagrams showing an eighth operation of the automated assembly system 1 according to an embodiment of the invention. The suction lower pressing mechanism 62 returns to the original position along the Z-axis. The tray 50 can be moved back to the first position along the second rail 64, and the assembler can take out the substrate 80 of the assembled heat sink fin set 91, 92, 93, 94, and then place another substrate (not shown) to be assembled. On the tray 50, the assembly of the next substrate (not shown) is performed.

In other embodiments, the automated assembly system 1 can further include a conveyor mechanism (not shown) that connects the trays 50 for automated transport of the mounted and unmounted substrates 80 to other assembly lines.

According to the automated assembly system disclosed in the present invention, the electronic arm can automatically take the heat sink fin set to the positioning fixture, and the assembly module takes the heat sink fin group moved to the positioning fixture below it and presses it down. The heat sink fins are grouped on the substrate on the tray below it. In this way, the heat sink fin set can be automatically and accurately mounted on the substrate, and the assembler only needs to retrieve the mounted substrate and place the substrate to be assembled on the tray. Therefore, with the above automated assembly system, the heat dissipation fin set can be assembled correctly and quickly on the substrate, thereby improving the assembly effect and efficiency.

Although the present invention has been disclosed above in the preferred embodiment of the foregoing, It is not intended to limit the invention, and any skilled person in the art can make modifications and refinements without departing from the spirit and scope of the invention. The definition is final.

1‧‧‧Automated assembly system

10‧‧‧ Pedestal

20‧‧‧Shelf

30‧‧‧ positioning fixture

31‧‧‧Positioning holes

40‧‧‧Electronic arm

41‧‧‧Placement agency

42‧‧‧Support frame

43‧‧‧Slide rails

50‧‧‧Tray

60‧‧‧Assembly modules

61‧‧‧ ‧ frame

62‧‧‧Absorption and lowering mechanism

621‧‧‧Under the indenter

63‧‧‧First track

64‧‧‧second track

80‧‧‧Substrate

81, 82, 83, 84‧‧‧ electronic components

90‧‧‧Finishing fin housing box

91, 92, 93, 94‧‧ ‧ heat sink fin set

Claims (9)

An automated assembly system for automatically assembling at least one heat sink fin set on a substrate, comprising: a shelf for the at least one heat sink fin group to be placed; and a positioning fixture for positioning the at least one a heat dissipating fin set; an electronic arm for taking the at least one heat dissipating fin set from the rack to the positioning jig; a tray for carrying the substrate; and an assembly module for The positioning fixture takes the at least one heat dissipation fin set and fixes the at least one heat dissipation fin set on the substrate; wherein the assembly module further includes a first track, and the positioning fixture is movable The mode is set on the first track. The automated assembly system of claim 1, wherein the assembly module comprises a frame body and a suction and depression mechanism, the suction and depression mechanism is movably disposed on the frame body, and the suction and depression mechanism is configured to The frame is moved to pick up and pressurize the at least one heat sink fin set. The automated assembly system of claim 2, wherein the positioning fixture is movably disposed to the frame, the positioning fixture being displaceable relative to the frame and having a placement position and a picking position at the placement position The positioning fixture is disposed between the electronic arm and the suction and pressing mechanism, and the electronic arm places the at least one heat dissipation fin group on the positioning fixture. When the positioning position is located, the positioning fixture is located The suction lower pressing mechanism is configured to take the corresponding at least one heat dissipation fin set from the positioning fixture. An automated assembly system according to claim 3, wherein the tray is movably set In the frame body, the tray is displaceable relative to the frame body and has a first position and a second position. In the first position, the tray is located outside the frame and can be placed on the substrate to be assembled. In the second position, the tray is located in the frame for the suction pressing mechanism to assemble the at least one heat dissipating fin set on the substrate on the tray. The automated assembly system of claim 4, wherein the second location is below the suction lowering mechanism. The automated assembly system of claim 2, wherein the suction and depression mechanism moves relative to the frame along a line. The automated assembly system of claim 1, wherein the electronic arm has a nozzle for sucking a push pin of the at least one heat sink fin set. The automatic assembly system of claim 2, wherein the suction and depression mechanism has a plurality of nozzles, and the number of the at least one heat dissipation fin group is plural, and the suction nozzles respectively absorb the heat dissipation fin groups. Multiple push pins. The automated assembly system of claim 1, wherein the assembly module further comprises a second track, the tray being movably disposed on the second track.