TWI860491B - Chip testing device - Google Patents

Abstract

A chip testing device which is adapted to batch test a plurality of chips, including a tester and a connecting component, is provided. The tester is provided above the plurality of chips, and the connecting component is disposed between the tester and the plurality of chips, so that the plurality of chip and the tester are directly and electrically connected to each other. Connecting component includes an upper surface and a lower surface, the upper surface includes a plurality of first contacts, the lower surface includes a plurality of second contacts, a first linear distance between two of plurality of first contacts is larger than a second linear distance between two of plurality of second contacts. The plurality of first contacts is connected to the tester directly, the plurality of second contacts is connected to the chips directly.

Description

Chip inspection equipment

The present invention relates to a testing device, and more particularly to a wafer testing device for batch testing of wafers.

In recent years, due to the improvement of process technology, the speed of chip production has been effectively increased. These chips need to go through multiple inspection processes to screen out defective parts before they are put on the market. With the acceleration of production, it is necessary to increase the inspection speed to match the production efficiency. Therefore, how to effectively improve the chip inspection rate has become the most desired subject for chip-related manufacturers.

Taking the packaged chip 2 as an example, please refer to Figure 1. Since the contacts 21 of the chip 2 are closely arranged and the contacts 11 of the detector 1 are far apart, the two cannot directly correspond to each other. The chip detection device needs to connect the contacts 11 of the detector 1 and the contacts 21 of the chip 2 through the wires 3 (if the probe assembly contacts the contacts 21 of the chip 2, the probe assembly and the contacts 11 of the detector 1 still need to be connected by wires). When batch testing of chips is to be performed, a large number of wires 3 will be set up. The configuration of the device with wires 3 will occupy a lot of space of the testing device (for example, the space above the contact 21), so that the distance between the detector 1 and the chip 2 cannot be reduced (for example, the detector must be arranged on the left and right outer sides of the chip fixing place to cooperate with the layout of the wires and/or for more convenient connection, etc.), and due to interference from factors such as the characteristic impedance of the wires and signal attenuation, the testing speed of the testing device encounters a bottleneck and cannot be effectively further improved. In other words, the testing speed of such a testing device will be lower than the actual speed of the chip during operation (that is, the speed reduction test), and cannot meet the actual use of the chip.

In summary, there is a real need to improve chip inspection equipment.

It should be noted that the above technical contents are used to help understand the problems to be solved by the present invention, and they are not necessarily those that have been disclosed or known in the art.

One object of the present invention is to provide a chip testing device that can be directly electrically connected to a plurality of chips to increase the testing speed.

To achieve the above-mentioned purpose, the chip detection device provided by the present invention includes a tester and a connection assembly. The tester is arranged above a plurality of chips; the connection assembly is arranged between the tester and the plurality of chips, and is used to directly electrically connect the plurality of chips and the tester to each other. The connection assembly includes an upper side surface and a lower side surface opposite to the upper side surface, the upper side surface includes a plurality of first contacts, the lower side surface includes a plurality of second contacts, a first straight line distance between the plurality of first contacts is greater than a second straight line distance between the plurality of second contacts, and the plurality of first contacts are directly connected to the tester, and the plurality of second contacts are directly connected to the plurality of chips.

In one embodiment, the connection assembly of the chip detection device of the present invention includes a connector and a probe card, the connector is arranged above the probe card, a plurality of first contacts are arranged on a side of the connector, and a plurality of second contacts are arranged on a side of the probe card.

In one embodiment, the probe card of the chip detection device of the present invention includes a plurality of third contacts, which are arranged on the other side of the probe card, and a third straight line distance between the plurality of third contacts is greater than a second straight line distance between the plurality of second contacts.

In one embodiment, the plurality of third contacts of the probe card of the chip detection device of the present invention are evenly distributed on the other side of the probe card.

In one embodiment, the connection assembly of the chip testing device of the present invention further includes a test carrier disposed between the connector and the probe card.

In one embodiment, the test carrier of the chip testing device of the present invention comprises a plurality of fourth contacts, and a fourth straight line distance between the plurality of fourth contacts is greater than a third straight line distance between the plurality of third contacts.

In one embodiment, the plurality of fourth contacts of the test carrier of the chip testing device of the present invention are respectively arranged corresponding to the plurality of first contacts.

In one embodiment, the probe card of the chip testing device of the present invention is a micro-electromechanical probe card.

In one embodiment, the connector of the chip testing device of the present invention is locked on the test carrier.

In one embodiment, the test carrier and the probe card of the chip testing device of the present invention are fixed to each other by welding.

In one embodiment, the connector of the chip detection device of the present invention is a spring connector or a surface mount connector.

In order to make the above-mentioned objectives, technical features and advantages more clearly understood, the following is a detailed description with reference to preferred embodiments and the accompanying drawings.

The following will specifically describe specific embodiments of the present invention; however, without departing from the spirit of the present invention, the present invention can also be implemented in a variety of different forms of embodiments, and the protection scope of the present invention should not be interpreted as limited to what is described in the specification.

Unless the context clearly indicates otherwise, the singular forms "a", "the" and similar terms used herein also include the plural forms, and the terms "first", "second", etc. are used herein to describe various elements or components, not to indicate that these elements or components have a necessary order or priority. In addition, the directions (such as up, down, left, right, etc.) described are relative directions and can be defined according to the use status of the chip detection device. They do not indicate or imply that the chip detection device needs to be placed or constructed in a specific direction, nor can they be understood as limitations on the present invention. In the attached drawings, the size and relative size of the chip, tester, contact, test carrier, etc. may be exaggerated for the sake of clarity.

Please refer to FIG. 2, which is a schematic diagram of a chip detection device 10 of an embodiment of the present invention. The chip detection device 10 can be connected to an electronic device to send and receive signals and perform operations such as movement or analysis, but is not limited to this. The chip detection device 10 can be used to batch detect multiple chips 20, and the chips 20 can be packaged chips, such as flash memory chips. During the test, one or more chips 20 are placed on a carrier 30 and fixed, and the chip detection device 10 contacts the chip 20 from top to bottom. The chip detection device 10 includes a tester 100 and a connection assembly 200, and the technical content of each component is described as follows.

In this embodiment, the tester 100 is disposed above, for example, directly above, a plurality of chips 20 to be tested. The connection assembly 200 is disposed between the tester 100 and the plurality of chips 20 to be tested, so that the plurality of chips 20 to be tested are directly and electrically connected to the tester 100 through the connection assembly 200. The connection assembly 200 includes an upper surface 210 and a lower surface 220 opposite to the upper surface 210. The upper surface 210 includes a plurality of first contacts 211, and the lower surface 220 includes a plurality of second contacts 221. The first contacts 211 directly contact and electrically connect to the contacts 101 of the tester 100, and the second contacts 221 directly contact and electrically connect to the contacts 21 of the chip 20.

In detail, the connection assembly 200 may include a connector 300 and a probe card 400. The connector 300 is disposed above the probe card 400, for example, directly above the probe card 400. One side 310 of the connector 300 serves as the upper side 210 of the connection assembly 200, and one side 410 of the probe card 400 serves as the lower side 220 of the connection assembly 200.

Please also refer to FIG. 3A , the connector 300 may be, for example, a spring connector array (Pogo Pin Array), having a side surface 310 and another side surface 320 opposite to the side surface 310, and being provided with a plurality of through holes, a plurality of spring probes 311 are respectively provided in the through holes, each spring probe 311 comprises a needle (plunger), a tube (tube), a spring (spring) and other components, the spring probe 311 can be a double-headed spring probe, and its two ends 311a, 311b are exposed from the side surface 310 and the other side surface 320 respectively, and the two ends 311a, 311b can be respectively compressed and retracted towards the direction of the spring connector 300 (the end 311a retracts downward, and the end 311b retracts upward). The spring probes 311 shown on the side 310 are divided into two rectangular arrays, and the arrangement of the spring probes on the other side 320 may correspond thereto, but this is not a limitation. The positions of the ends 311a and 311b do not necessarily correspond to each other.

Please refer to FIG. 3B , the connector 300 may be, for example, a surface mount connector (SMD connector) 300'. The figure shows a schematic top view of the surface mount connector 300'. The surface mount connector 300' has a plurality of first connection points 312 located on an upper surface and a plurality of second connection points 313 located on a lower surface relative to the upper surface. The first connection point 312 is directly in contact with and electrically connected to the contact 101 of the tester 100, and the second connection point 313 is directly in contact with and electrically connected to the contact 21 of the chip 20. The surface mount connector 300' further includes a cover 314, so that the connector 300' can be moved mechanically during operation while avoiding the first connection point 312 from being squeezed or deformed during the process. The cover 314 can also be replaced by a Mylar patch, but this is not a limitation. When the surface mount connector 300' is used, the cover 314 or the Mylar patch will be removed. As shown in Figure 3C, another surface mount connector 300'' has a similar appearance to the surface mount connector 300', with a plurality of first connection points 312' on one surface and a plurality of second connection points 313' on the other surface. The first connection point 312' can be directly electrically connected to the contact 101, and the second connection point 313' can be directly electrically connected to the contact 21.

Please refer to FIG. 4, which is a schematic diagram of the side 410 of the probe card 400 of one embodiment of the present invention. The dotted line schematically shows the outer contour of the corresponding single chip (die) 20. In this embodiment, the probe card 400 can be a MEMS probe card. During the test, the plurality of chips 20 are aligned with each other. Since the contact 21 of the chip 20 is located on one side of the chip 20, the plurality of second contacts 221 included in the probe card 400 are respectively arranged on the side 410 corresponding to the contact 21.

Please refer to FIG. 5 , which is a schematic diagram of the other side 420 of the probe card 400. The other side 420 includes a plurality of third contacts 421, which are evenly distributed in the outer contour of the schematic single chip 20. The third contact 421 directly contacts and electrically connects to one end 311b of the probe 311 of the connector 300. The probe 311 is electrically conductive and connected to a contact 21 of the chip 20 via the third contact 421.

Please refer to FIG. 2 to FIG. 5 again, taking the connector 300 as a spring connector as an example, the plurality of first contacts 211 (the end 311a of the spring probe 311) have a first straight line distance D1 between each other (the adjacent first connection points 312 may have a straight line distance D1'; the adjacent first connection points 312' may have a straight line distance D1''), the plurality of second contacts 221 have a second straight line distance D2 between each other, and the plurality of third contacts 421 have a third straight line distance D3 between each other, wherein the third straight line distance D3 is greater than the second straight line distance D2. That is, the plurality of second contacts 221 are closely and clustered, and the plurality of third contacts 421 are relatively dispersed and evenly arranged. Thus, by disposing the second contact 221 and the third contact 421, the probe card 400 can initially guide the contacts 21 originally arranged densely to be dispersed and spaced apart, so as to correspond to the arrangement of the spring probe 311 of the connector 300, or the arrangement of the second connection points 313, 313'. Depending on the situation, the first straight line distance D1 (or straight line distance D1', D1'') is greater than the second straight line distance D2, and can be greater than the third straight line distance D3, so that the distance between the contacts is further increased, so as to facilitate the connection of the contacts 101 of the tester 100.

Please refer to FIG. 6 , in one embodiment of the present invention, the connection assembly 200 may further include a test board 500 (Load Board P.C.B.), which is disposed between the connector 300 and the probe card 400, and can be welded together with the probe card 400 to be fixed to each other, thereby enhancing the reliability of the probe card 400 under pressure, and can directly receive the tester 100. The connector 300 can be locked on the test board 500 (the locking point is not shown in the figure), but this is not a limitation. The test board 500 includes an upper side 510, and the upper side 510 has a plurality of fourth contacts 511, and the fourth contacts 511 are directly in contact with and electrically connected to one end 311b of the probe 311 of the connector 300. There is a fourth linear distance D4 between the plurality of fourth contacts 511. The fourth linear distance D4 may be equal to the third linear distance D3, or may be greater than the third linear distance D3, so as to further increase the distance between the contacts and more flexibly match the size of the connector 300, that is, match the setting distance between the spring probe 311 or the second connection points 313, 313' of the connector 300.

In summary, the connection assembly of the chip inspection device of the present invention can directly connect the contacts of the chip to be tested to the contacts of the tester, for example, directly and vertically in the vertical direction, through a probe card, a test carrier and/or a connector. This eliminates the need to set up missing wires when testing multiple chips in batches, thereby increasing the inspection speed of the measured chips, for example, from 800 megabytes per second (MB/s) to 1.2 gigabytes per second (GB/s), which is closer to or in line with the actual operating speed of chips on the market, and can also help improve the overall production speed of chips.

The above embodiments are only used to illustrate the implementation of the present invention and to explain the technical features of the present invention, and are not used to limit the scope of protection of the present invention. Any changes or equivalent arrangements that can be easily completed by those familiar with this technology are within the scope of the present invention, and the scope of protection of the present invention shall be based on the scope of the patent application.

1: Detector 2: Chip 3: Wire 10: Chip detection device 11: Contact 20: Chip 21: Contact 30: Carrier 100: Tester 101: Contact 200: Connection assembly 210: Upper side 211: First contact 220: Lower side 221: Second contact 300: Connector 300', 300'': Surface mount connector 310: Side 311: Spring probe 311a, 311b: End 312, 312': First connection point 313, 313': Second connection point 314: Cover 320: Other side 400: Probe card 410: side surface 420: other side surface 421: third contact point 500: test carrier 510: upper side surface 511: fourth contact point D1: first straight line distance D1’, D1’’: straight line distance D2: second straight line distance D3: third straight line distance D4: fourth straight line distance

FIG. 1 is a schematic diagram of a conventional method of connecting a detector to a chip;

FIG. 2 is a schematic side view of a chip inspection device according to an embodiment of the present invention;

FIGS. 3A to 3C are schematic diagrams of different types of connectors of a chip testing device according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of a side surface of a probe card of a chip detection device according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of another side of the probe card of the chip detection device according to an embodiment of the present invention; and

FIG6 is a side view schematic diagram of a chip inspection device according to another embodiment of the present invention.

10: Chip detection device

20: Chip

21: Contact

30: Passenger seat

100: Tester

101: Contact

200:Connection components

210: Upper side

211: First contact

220: Lower side

221: Second contact

300: Connector

310: Side

311: Spring probe

311a, 311b: end

320: The other side

400:Probe card

410: Side

420: The other side

421: Third contact

D1: First straight line distance

D2: Second straight line distance

D3: Third straight line distance

Claims (8)

A chip inspection device can batch inspect multiple chips, comprising: a tester, arranged above the chips, comprising a plurality of contacts; and a connection assembly, arranged between the tester and the chips, for directly electrically connecting the chips and the tester to each other, comprising an upper surface and a lower surface opposite to the upper surface, the upper surface comprising a plurality of first contacts, the lower surface comprising a plurality of second contacts, a first straight line distance between the first contacts being greater than a second straight line distance between the second contacts, and the first contacts being directly connected to the contacts of the tester, and the second contacts being directly connected to the chips; wherein the connection assembly further comprises A connector, a probe card and a test carrier, the connector is a spring connector or a surface mount connector and is disposed above the probe card, the first contacts are disposed on one side of the connector, the second contacts are disposed on one side of the probe card, the probe card includes a plurality of third contacts, the third contacts are disposed on the other side of the probe card, a third straight line distance between the third contacts is greater than the second straight line distance between the second contacts, the test carrier includes a plurality of fourth contacts and is disposed between the connector and the probe card, a fourth straight line distance between the fourth contacts is greater than the third straight line distance between the third contacts. A chip detection device as described in claim 1, wherein the third contacts are evenly distributed on the other side of the probe card. A chip detection device as described in claim 1, wherein the fourth contacts are respectively arranged corresponding to the first contacts. A chip inspection device as described in claim 1, wherein the probe card is a micro-electromechanical probe card. A chip inspection device as described in claim 1, wherein the connector is locked on the test carrier. A chip detection device as described in claim 1, wherein the surface mount connector includes a cover. A chip inspection device as described in claim 6, wherein the cover is a Mylar patch. A chip inspection device as described in claim 1, wherein the connector is a spring connector using a spring probe.

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