TWI681689B - 電子元件的製造方法及電子元件 - Google Patents
電子元件的製造方法及電子元件 Download PDFInfo
- Publication number
- TWI681689B TWI681689B TW105101612A TW105101612A TWI681689B TW I681689 B TWI681689 B TW I681689B TW 105101612 A TW105101612 A TW 105101612A TW 105101612 A TW105101612 A TW 105101612A TW I681689 B TWI681689 B TW I681689B
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- contact hole
- gas barrier
- barrier film
- substrate
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/103—Measuring devices for testing the shape, pattern, colour, size or movement of the body or parts thereof, for diagnostic purposes
- A61B5/107—Measuring physical dimensions, e.g. size of the entire body or parts thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/02—Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
- G01S13/06—Systems determining position data of a target
- G01S13/42—Simultaneous measurement of distance and other co-ordinates
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L27/00—Modulated-carrier systems
- H04L27/26—Systems using multi-frequency codes
- H04L27/2601—Multicarrier modulation systems
- H04L27/2647—Arrangements specific to the receiver only
- H04L27/2655—Synchronisation arrangements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L5/00—Arrangements affording multiple use of the transmission path
- H04L5/003—Arrangements for allocating sub-channels of the transmission path
- H04L5/0032—Distributed allocation, i.e. involving a plurality of allocating devices, each making partial allocation
- H04L5/0035—Resource allocation in a cooperative multipoint environment
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L5/00—Arrangements affording multiple use of the transmission path
- H04L5/003—Arrangements for allocating sub-channels of the transmission path
- H04L5/0048—Allocation of pilot signals, i.e. of signals known to the receiver
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L5/00—Arrangements affording multiple use of the transmission path
- H04L5/003—Arrangements for allocating sub-channels of the transmission path
- H04L5/0058—Allocation criteria
- H04L5/0073—Allocation arrangements that take into account other cell interferences
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/80—Constructional details
- H10K10/88—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Health & Medical Sciences (AREA)
- Radar, Positioning & Navigation (AREA)
- Life Sciences & Earth Sciences (AREA)
- Remote Sensing (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Biomedical Technology (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Heart & Thoracic Surgery (AREA)
- Pathology (AREA)
- Dentistry (AREA)
- Biophysics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015009110 | 2015-01-21 | ||
| JP2015-009110 | 2015-01-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201639409A TW201639409A (zh) | 2016-11-01 |
| TWI681689B true TWI681689B (zh) | 2020-01-01 |
Family
ID=56417076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105101612A TWI681689B (zh) | 2015-01-21 | 2016-01-20 | 電子元件的製造方法及電子元件 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20170315222A1 (ja) |
| JP (1) | JP6469728B2 (ja) |
| TW (1) | TWI681689B (ja) |
| WO (1) | WO2016117534A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020039864A1 (ja) * | 2018-08-24 | 2020-02-27 | 富士フイルム株式会社 | 有機薄膜トランジスタ、および、有機薄膜トランジスタの製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003084684A (ja) * | 2001-09-13 | 2003-03-19 | Sony Corp | ディスプレイ装置及びディスプレイ装置の製造方法、並びに電子機器 |
| JP2008033095A (ja) * | 2006-07-31 | 2008-02-14 | Toppan Printing Co Ltd | 表示装置 |
| US20110068682A1 (en) * | 2009-09-18 | 2011-03-24 | Satoshi Aiba | Method for bonding gas barrier film and electronic device, and electronic device and method for producing same |
| TW201248740A (en) * | 2011-03-30 | 2012-12-01 | Dainippon Printing Co Ltd | Laminate substrate for electron device, electron device, display apparatus for organic electroluminescence, electronic paper, and manufacturing method for laminate substrate for electron device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6111227A (ja) * | 1984-06-27 | 1986-01-18 | Fujikura Ltd | フレキシブルプリント配線板のカバ−レイの形成方法 |
| JPH04199773A (ja) * | 1990-11-29 | 1992-07-20 | Sharp Corp | フレキシブルプリント配線板の製造方法 |
| KR100630880B1 (ko) * | 1999-12-31 | 2006-10-02 | 엘지.필립스 엘시디 주식회사 | 엑스레이 영상 감지소자 및 그 제조방법 |
| JP2005234091A (ja) * | 2004-02-18 | 2005-09-02 | Hitachi Displays Ltd | 表示装置 |
| TWI427682B (zh) * | 2006-07-04 | 2014-02-21 | 半導體能源研究所股份有限公司 | 顯示裝置的製造方法 |
| KR20120047541A (ko) * | 2010-11-04 | 2012-05-14 | 삼성전자주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
| US9780075B2 (en) * | 2014-08-11 | 2017-10-03 | Massachusetts Institute Of Technology | Interconnect structures for assembly of multi-layer semiconductor devices |
-
2016
- 2016-01-19 JP JP2016570642A patent/JP6469728B2/ja not_active Expired - Fee Related
- 2016-01-19 WO PCT/JP2016/051380 patent/WO2016117534A1/ja not_active Ceased
- 2016-01-20 TW TW105101612A patent/TWI681689B/zh not_active IP Right Cessation
-
2017
- 2017-07-13 US US15/648,682 patent/US20170315222A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003084684A (ja) * | 2001-09-13 | 2003-03-19 | Sony Corp | ディスプレイ装置及びディスプレイ装置の製造方法、並びに電子機器 |
| JP2008033095A (ja) * | 2006-07-31 | 2008-02-14 | Toppan Printing Co Ltd | 表示装置 |
| US20110068682A1 (en) * | 2009-09-18 | 2011-03-24 | Satoshi Aiba | Method for bonding gas barrier film and electronic device, and electronic device and method for producing same |
| TW201248740A (en) * | 2011-03-30 | 2012-12-01 | Dainippon Printing Co Ltd | Laminate substrate for electron device, electron device, display apparatus for organic electroluminescence, electronic paper, and manufacturing method for laminate substrate for electron device |
Also Published As
| Publication number | Publication date |
|---|---|
| US20170315222A1 (en) | 2017-11-02 |
| WO2016117534A1 (ja) | 2016-07-28 |
| TW201639409A (zh) | 2016-11-01 |
| JPWO2016117534A1 (ja) | 2017-12-21 |
| JP6469728B2 (ja) | 2019-02-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9722146B2 (en) | Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing LED package and LED package manufactured thereby | |
| CN106103095B (zh) | 封装层压体、有机发光器件以及所述体和器件的制造方法 | |
| CN104167490B (zh) | 有机光电器件的封装方法及有机光电器件封装结构 | |
| TWI655797B (zh) | Laminated sheet for electronic component packaging and method of manufacturing electronic device | |
| DE102008031533B4 (de) | Organisches elektronisches Bauelement | |
| DE102013106855B4 (de) | Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement unter Verwendung einer flüssigen ersten Legierung | |
| US20110057332A1 (en) | Semiconductor chip with conductive adhesive layer and method of manufacturing the same, and method of manufacturing semiconductor device | |
| US20160343616A1 (en) | Semiconductor device including at least one element | |
| CN104332412A (zh) | 封装基板、封装结构以及封装基板的制作方法 | |
| JP5800640B2 (ja) | 発光ダイオード装置の製造方法 | |
| TWI681689B (zh) | 電子元件的製造方法及電子元件 | |
| WO2007099759A1 (ja) | 部品接合方法、部品積層方法および部品接合構造体 | |
| US20070052089A1 (en) | Adhesive film having multiple filler distribution and method of manufacturing the same, and chip stack package having the adhesive film and method of manufacturing the same | |
| US20190229291A1 (en) | Film structure, display device and method for fabricating the film structure | |
| TW201543506A (zh) | 異向性導電膜及其製造方法 | |
| JP2006173441A (ja) | 固体電解コンデンサの製造方法 | |
| CN107204332A (zh) | 半导体装置及其制造方法 | |
| WO2010140383A1 (ja) | 有機el表示装置 | |
| CN107910334A (zh) | 显示面板及其制造方法 | |
| CN103515257A (zh) | 高密度半导体封装结构的封装方法 | |
| JP2013251584A (ja) | 半導体チップの製造方法 | |
| TW201320281A (zh) | 記憶裝置、半導體裝置及半導體裝置之製造方法 | |
| KR20110118582A (ko) | 반도체 칩의 제조 방법 | |
| JP5902291B2 (ja) | 封止シートおよびその製造方法 | |
| Chen et al. | 33‐3: Study of Bonding Technology on Flexible Substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |