TWI671174B - Cutting line forming method and cutting line forming device - Google Patents
Cutting line forming method and cutting line forming device Download PDFInfo
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- TWI671174B TWI671174B TW104125933A TW104125933A TWI671174B TW I671174 B TWI671174 B TW I671174B TW 104125933 A TW104125933 A TW 104125933A TW 104125933 A TW104125933 A TW 104125933A TW I671174 B TWI671174 B TW I671174B
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- 238000005520 cutting process Methods 0.000 title claims abstract description 399
- 238000000034 method Methods 0.000 title claims abstract description 128
- 239000012788 optical film Substances 0.000 claims abstract description 141
- 239000010408 film Substances 0.000 claims description 40
- 230000015572 biosynthetic process Effects 0.000 claims description 24
- 238000001514 detection method Methods 0.000 claims description 17
- 230000003287 optical effect Effects 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000004044 response Effects 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 8
- 238000003384 imaging method Methods 0.000 description 8
- 230000007547 defect Effects 0.000 description 5
- 239000003550 marker Substances 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/157—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis
- B26D1/18—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis mounted on a movable carriage
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Polarising Elements (AREA)
- Liquid Crystal (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Nonmetal Cutting Devices (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Making Paper Articles (AREA)
Abstract
提供一種切割線的形成方法及形成裝置,能夠於形成複數個切割線的各者時,總是將圓形刀具的相同位置抵住光學膜層積體的側端部而開始切割。 Provided is a method and a device for forming a cutting line, which can always start the cutting with the same position of a circular cutter against the side end portion of the optical film laminate when forming each of a plurality of cutting lines.
本方法,包含:令圓形刀具旋轉之工程;將圓形刀具的外周上的規定位置抵住光學膜層積體的側端部,開始光學膜層積體的切割之工程;令圓形刀具一面朝光學膜層積體的寬度方向移動,一面在光學膜層積體形成切割線之工程;將光學膜層積體搬運事先設定好的距離,以作為1個切割線與下一切割線之間的距離之工程。 This method includes: a process of rotating a circular cutter; a predetermined position on the outer periphery of the circular cutter against a side end portion of the optical film laminate, and a process of cutting the optical film laminate; starting a circular cutter The process of forming a cutting line in the optical film layer while moving toward the width direction of the optical film layer; transporting the optical film layer in a predetermined distance to serve as a cutting line and the next cutting line The distance between works.
Description
本發明係有關用來在光學膜(optical film)層積體上形成切割線之方法及裝置,更具體而言,係有關一種切割線的形成方法及形成裝置,能夠控制使得在複數個切割線的各者當中,在和光學膜層積體的側端部於寬度方向相距之距離為相同的位置,切割線的深度會成為相同深度。 The present invention relates to a method and a device for forming a cutting line on an optical film laminate, and more particularly, to a method and a device for forming a cutting line, which can be controlled so that a plurality of cutting lines are formed. Among each of them, at the same distance from the lateral end portion of the optical film layered body in the width direction, the depth of the cutting line becomes the same depth.
近年來,作為電視接收機等顯示器,市面上流通著在玻璃基板上貼合光學膜而成之液晶顯示裝置或有機EL顯示裝置等光學性顯示裝置。光學性顯示裝置的製造中,以往是運用個別貼附方式,即,將在光學性顯示裝置的製造工程之外從網狀光學膜事先切割出的莫大的張數的光學膜膜片,帶入光學性顯示裝置的製造工程,然後在製造工程中與另行帶入之矩形的面板構件依序貼合。 In recent years, as display devices such as television receivers, optical display devices such as a liquid crystal display device or an organic EL display device in which an optical film is bonded to a glass substrate have been marketed. In the manufacture of optical display devices, individual attaching methods have been used in the past, that is, a large number of optical film films cut in advance from the mesh optical film in addition to the manufacturing process of the optical display device are brought into the The manufacturing process of the optical display device is then sequentially laminated with the rectangular panel member brought in separately during the manufacturing process.
對於這樣的個別貼附方式,有人提出一種方式,是在光學性顯示裝置的製造工程中,僅將在長型網狀的離型膜上隔著黏著劑層而連續地受到支撐之複數個光學 膜的膜片當中不存在缺點的正常膜片連同黏著劑層一起從離型膜依序剝離,並隔著黏著劑層與面板構件貼合,藉此連續地製造光學性顯示裝置。用以實現這種方式之製造系統,例如如專利文獻1所記載。 Regarding such an individual attachment method, a method has been proposed in which, in the manufacturing process of an optical display device, a plurality of optical elements are continuously supported only through an adhesive layer on an elongated mesh-shaped release film through an adhesive layer. Among the film sheets, the normal film sheet having no defects is sequentially peeled from the release film together with the adhesive layer, and is bonded to the panel member via the adhesive layer, thereby continuously manufacturing an optical display device. The manufacturing system for realizing this method is described in Patent Document 1, for example.
專利文獻1記載之製造系統中,係使用一種長型的光學膜與長型的離型膜隔著黏著劑層而層積之光學膜層積體的料卷(roll)。對於從料卷退繞(unwind)之光學膜層積體,在依據事先實施的缺點檢査的結果而決定之位置,連續地埋入和光學膜層積體的長邊方向正交之寬度方向的切割線,藉此在於長邊方向鄰接的2個切割線之間,生成受到長型的離型膜連續地支撐之複數個光學膜的膜片。光學膜的膜片,會在受到長型的離型膜支撐之狀態下被送入貼合位置,從離型膜剝離後,貼合至面板構件。這種光學性顯示裝置的製造系統,為了和將事先切割出的光學膜膜片貼合至面板構件之上述個別貼合系統做出區別,而被稱為「連續貼附(RTP;Roll To Panel)」系統。 The manufacturing system described in Patent Document 1 uses a roll of an optical film laminate in which a long optical film and a long release film are laminated with an adhesive layer interposed therebetween. For optical film laminates that are unwinded from a roll, at positions determined based on the results of defect inspections performed in advance, the width direction orthogonal to the longitudinal direction of the optical film laminates is continuously embedded. The cutting line is formed between two cutting lines adjacent to each other in the longitudinal direction to generate a plurality of optical films that are continuously supported by a long release film. The film of the optical film is sent to a bonding position while being supported by a long release film, and is peeled off from the release film and then bonded to a panel member. This type of optical display device manufacturing system is called "continuous attach (RTP; Roll To Panel) in order to distinguish it from the above-mentioned individual bonding system for bonding an optical film film cut in advance to a panel member. )"system.
RTP系統中,會進行利用切割線形成手段,對光學膜層積體連續地形成切割線。切割線,是從層積有離型膜之側的相反側,切斷光學膜及黏著劑層而僅留下離型膜,藉此形成。作為用來將這種切割線形成於光學膜層積體之手段,一般而言係使用圓形刀具或雷射等。 In the RTP system, a cutting line formation method is used to continuously form a cutting line for the optical film laminate. The cutting line is formed by cutting the optical film and the adhesive layer from the side opposite to the side where the release film is laminated, leaving only the release film. As a means for forming such a cutting line in an optical film laminate, generally, a circular cutter or a laser is used.
有關切割線的形成,專利文獻2中提出一種切斷方法,其目的在於切斷光學膜而不引發外觀不良,且 當將光學膜的膜片連續地貼合至面板構件時不使光學膜破裂。該技術中,是藉由控制形成切割線之深度,來達成上述目的。 Regarding the formation of the cutting line, Patent Document 2 proposes a cutting method, which aims to cut the optical film without causing an appearance defect, and When the film of the optical film is continuously attached to the panel member, the optical film is not broken. In this technique, the above-mentioned purpose is achieved by controlling the depth of forming the cutting line.
但,當使用圓形刀具形成切割線的情形下,存在如下述般僅靠控制切割線的深度無法解決之問題。 However, when a cutting line is formed using a circular cutter, there is a problem that cannot be solved by controlling the depth of the cutting line as described below.
首先,當發生圓形刀具的刀尖的磨耗或缺損的情形下,可能會在光學膜發生該些原因所引起之切斷不良。發生切斷不良的部分,當將光學膜貼合至基板時,常導致氣泡的混入、黏著劑所致之污染等問題,因此必須盡早發現不良,並辨明其原因。但,若切斷不良在光學膜上不規則地發生,則難以發現切斷不良及辨明其原因。 First of all, when abrasion or defect of the cutting edge of a circular cutter occurs, cutting failure due to these reasons may occur in the optical film. When an optical film is bonded to a substrate where a defective cutting occurs, problems such as mixing of air bubbles and contamination caused by an adhesive are often caused. Therefore, it is necessary to find the defective as soon as possible and identify the cause. However, if the cutting failure occurs irregularly on the optical film, it is difficult to find the cutting failure and identify the cause.
此外,為了提高切割線的形成位置的精度,可能會進行下述工作,即,在光學膜層積體的側端部以光學相機等偵測切割線的位置,並依據與事先設定好的基準線之間的偏差量來修正下一切割線的形成位置(例如專利文獻3)。當運用這種修正技術時,可能會因為例如刀具本身的扭曲或刀具組裝至裝置的不良而造成刀尖發生振動,依該振動的量不同,可能會形成脫離光學相機等的視野而無法讀懂之切割線。若發生這樣的問題,則難以提高切割線的形成位置的精度。 In addition, in order to improve the accuracy of the formation position of the cutting line, the following work may be performed, that is, the position of the cutting line is detected by an optical camera or the like at the side end portion of the optical film layered body, and based on a reference set in advance The amount of deviation between the lines is used to correct the formation position of the next cutting line (for example, Patent Document 3). When using this correction technique, the tool tip may vibrate due to, for example, distortion of the tool or poor assembly of the tool to the device. Depending on the amount of the vibration, it may form a field of view that is out of the optical camera and cannot be understood. Of cutting lines. If such a problem occurs, it is difficult to improve the accuracy of the formation position of the cutting line.
又,若刀尖發生大幅的振動,則會形成延著搬運方向之側端部的長度有各種不同之光學膜膜片、或延著寬度方向之側端部的形狀有各種不同之光學膜膜片。但,若將各者不同形狀之複數個光學膜膜片連續地貼合至 面板構件,則難以穩定地達成特別是近年來的光學性顯示裝置中要求之高貼合精度。 In addition, if the blade sharply vibrates, a variety of optical film films having different lengths on the side end portions extending in the conveying direction, or a variety of optical film films having side end portions extending in the width direction may be formed. sheet. However, if a plurality of optical film diaphragms each having a different shape are continuously bonded to It is difficult for the panel member to stably achieve the high bonding accuracy required especially in recent optical display devices.
[專利文獻1]日本專利第4377964號公報 [Patent Document 1] Japanese Patent No. 4377964
[專利文獻2]日本特開2011-065174號公報 [Patent Document 2] Japanese Patent Application Laid-Open No. 2011-065174
[專利文獻3]日本特開2013-240841號公報 [Patent Document 3] Japanese Patent Laid-Open No. 2013-240841
本發明的目的在於提供一種切割線的形成方法及形成裝置,能夠於形成複數個切割線的各者時,總是將圓形刀具的相同位置抵住光學膜層積體的側端部而開始切割。 An object of the present invention is to provide a method and a device for forming a cutting line, which can always start the same position of a circular cutter against the side end portion of an optical film laminate when forming each of a plurality of cutting lines. Cutting.
按照本發明的一個態樣,本發明提供一種方法,係在含有離型膜之光學膜層積體,從層積有離型膜之側的相反側,連續地形成複數個切割線。本方法,包含:令圓形刀具旋轉之工程;將圓形刀具的外周上的規定位置抵住光學膜層積體的側端部,開始光學膜層積體的切割之工程;令圓形刀具一面朝光學膜層積體的寬度方向移動,一面在光學膜層積體形成切割線之工程;將光學膜層積體 搬運事先設定好的距離,以作為1個切割線與下一切割線之間的距離之工程。 According to one aspect of the present invention, the present invention provides a method for continuously forming a plurality of cutting lines on an optical film laminate including a release film from the side opposite to the side where the release film is laminated. This method includes: a process of rotating a circular cutter; a predetermined position on the outer periphery of the circular cutter against a side end portion of the optical film laminate, and a process of cutting the optical film laminate; starting a circular cutter A process of forming a cutting line in the optical film laminate while moving toward the width direction of the optical film laminate; The process of carrying a distance set in advance as a distance between one cutting line and the next cutting line.
一實施形態中,本方法較佳是,在令圓形刀具旋轉之工程之前,更包含將圓形刀具設為基準狀態之工程,該基準狀態是用來使得當圓形刀具開始光學膜層積體之切割時,規定位置總是會抵著光學膜層積體的側端部。 In one embodiment, the method preferably includes, before the process of rotating the circular cutter, the process of setting the circular cutter to a reference state, the reference state is used to enable the optical cutter to be laminated when the circular cutter starts. When the body is cut, the predetermined position always abuts the side end portion of the optical film laminate.
此處,所謂圓形刀具的基準狀態,係指一決定好的圓形刀具的姿勢,使得圓形刀具的圓周上的任意一點,在為了形成複數個切割線的各者而令圓形刀具旋轉之前,總是位於圓周方向的同一位置。將開始旋轉前的待命位置中的圓形刀具總是回復基準狀態,藉此,當形成複數個切割線的各者時,便能將圓形刀具的圓周上的規定位置總是抵住光學膜層積體F的例如右側端部FR。當形成複數個切割線的各者時抵著例如右側端部FR之規定位置,可和上述圓周上之任意一點相同,亦可相異。 Here, the reference state of the circular cutter refers to a determined posture of the circular cutter such that at any point on the circumference of the circular cutter, the circular cutter is rotated in order to form each of a plurality of cutting lines. Before, it was always in the same position in the circumferential direction. The circular cutter in the standby position before starting to rotate is always returned to the reference state, so that when each of a plurality of cutting lines is formed, the predetermined position on the circumference of the circular cutter can always be against the optical film. The laminated body F is, for example, a right end FR. When each of the plurality of cutting lines is formed, the predetermined position against the right end FR may be the same as any point on the circumference, or may be different.
一實施形態中,本方法能夠設計成,更包含:令已被設為基準狀態之圓形刀具旋轉,於形成切割線後令圓形刀具的旋轉停止,求出從基準狀態至旋轉停止為止的圓形刀具的旋轉數,利用旋轉數計算圓形刀具的基準狀態與旋轉停止時之狀態之間的偏差角度之工程,將圓形刀具設為基準狀態之工程,包含令圓形刀具旋轉偏差角度。另一實施形態中,本方法能夠設計成,更包含:令已被設為基準狀態之圓形刀具旋轉,於形成切割線後令圓形刀具的旋轉停止,求出從基準狀態至旋轉停止為止的圓形 刀具的旋轉數之工程,將圓形刀具設為基準狀態之工程,包含令圓形刀具逆旋轉旋轉數。 In one embodiment, the method can be designed to further include: rotating a circular cutter that has been set as a reference state, and stopping the rotation of the circular cutter after forming a cutting line, and obtaining a value from the reference state until the rotation is stopped. The number of rotations of a circular tool, the process of calculating the deviation angle between the reference state of the circular tool and the state when the rotation is stopped by the number of rotations, and the process of setting the circular tool as the reference state, including the deviation angle of the rotation of the circular tool . In another embodiment, the method can be designed to further include: rotating a circular cutter that has been set as a reference state, and stopping the rotation of the circular cutter after forming a cutting line, and determining from the reference state to the rotation stop Round The process of the number of rotations of the tool, the process of setting the circular tool as a reference state, includes the number of rotations of the circular tool in reverse rotation.
又另一實施形態中,能夠使用設有標記之圓形刀具。該實施形態中,能夠設計成,將圓形刀具設為基準狀態之工程,包含:當形成切割線後讀取圓形刀具旋轉停止時的標記的位置並記憶以作為現在位置,利用該現在位置和當圓形刀具處於基準狀態時的標記的事先記憶好的位置,計算圓形刀具的基準狀態與形成切割線後的旋轉停止時之狀態之間的偏差角度,令圓形刀具旋轉偏差角度。或是,能夠設計成,將圓形刀具設為基準狀態之工程,包含一面令圓形刀具旋轉一面讀取標記,並判定標記是否和當圓形刀具處於基準狀態時的標記的事先記憶好的位置一致。 In still another embodiment, a circular cutter provided with a mark can be used. In this embodiment, the process of setting the circular cutter to a reference state can be designed to include reading the position of the marker when the circular cutter has stopped rotating after forming the cutting line and memorizing it as the current position, and using the current position The deviation angle between the reference state of the circular cutter and the state when the rotation stops after the cutting line is formed is calculated from the previously memorized position of the mark when the circular cutter is in the reference state, and the circular cutter is rotated by the deviation angle. Or, it can be designed as a project that sets the circular cutter as the reference state, including reading the mark while rotating the circular cutter, and determining whether the mark is memorized in advance when the circular cutter is in the reference state. Location is consistent.
又另一實施形態中,能夠使用能藉由鎖定機構的作動而在基準狀態下令旋轉停止之圓形刀具。該實施形態中,能夠設計成,將圓形刀具設為基準狀態之工程,包含令鎖定機構作動,令圓形刀具旋轉,藉由鎖定機構令旋轉刀具在基準狀態下停止。 In still another embodiment, a circular cutter capable of stopping rotation in a reference state by actuation of a lock mechanism can be used. In this embodiment, the process of setting the circular cutter to the reference state can include designing a locking mechanism to operate, rotating the circular cutter, and stopping the rotary cutter in the reference state by the locking mechanism.
一實施形態中,能夠設計成,令圓形刀具旋轉之工程,包含令完成1個切割線的形成後之圓形刀具朝和形成1個切割線時的旋轉方向相反的方向旋轉之工程,形成切割線之工程,包含令圓形刀具一面朝和形成1個切割線時的方向相反的方向移動,一面在光學膜層積體形成下一切割線之工程。該實施形態中,複數個切割線,從光 學膜層積體的兩方的側端部形成。另一實施形態中,本方法能夠設計成,更包含令形成1個切割線後的圓形刀具於不接觸光學膜層積體的狀態下朝和形成1個切割線時的方向相反的方向移動之工程,令圓形刀具旋轉之工程,包含令圓形刀具朝和形成1個切割線時的旋轉方向相同的方向旋轉之工程,形成切割線之工程,包含令圓形刀具一面朝和形成1個切割線時的方向相同的方向移動,一面在光學膜層積體形成下一切割線之工程。該實施形態中,複數個切割線,僅從光學膜層積體的一方的側端部形成。 In one embodiment, the process of rotating the circular cutter can be designed to include the process of rotating the circular cutter after the formation of one cutting line is completed in the direction opposite to the direction of rotation when forming one cutting line. The cutting line process includes a process in which a circular cutter is moved in a direction opposite to that when forming one cutting line, and the next cutting line is formed in the optical film laminate. In this embodiment, a plurality of cutting lines The two side end portions of the film laminate are formed. In another embodiment, the method can be designed to further include moving the circular cutter after forming one cutting line in a state opposite to the direction when forming one cutting line without contacting the optical film laminate. The process of rotating the circular cutter includes the process of rotating the circular cutter in the same direction as the direction of rotation when forming a cutting line. The process of forming the cutting line includes the process of making the circular cutter facing and forming. One cutting line moves in the same direction, and the next cutting line is formed in the optical film laminate. In this embodiment, a plurality of cutting lines are formed from only one side end portion of the optical film laminate.
一實施形態中,較佳是,開始切割之工程,包含當圓形刀具的旋轉速度達到切割線形成時的規定速度以後才開始切割之工程。 In one embodiment, it is preferable that the process of starting cutting includes a process of starting cutting after the rotation speed of the circular cutter reaches a predetermined speed when the cutting line is formed.
按照本發明的另一個態樣,本發明提供一種裝置,係在含有離型膜之光學膜層積體,從層積有離型膜之側的相反側形成切割線。本裝置,具備:切斷單元,具有對光學膜層積體做切割之圓形刀具、及令該圓形刀具旋轉之第1驅動部;切斷單元移動機構,具有令切斷單元朝光學膜層積體的寬度方向移動之第2驅動部;控制部,控制第1驅動部及第2驅動部的動作。控制部,以正在旋轉的圓形刀具的外周上的規定位置會抵著光學膜層積體的側端部之方式,來控制第1驅動部及第2驅動部的動作。 According to another aspect of the present invention, the present invention provides a device for forming a cutting line on an optical film laminate including a release film from the side opposite to the side where the release film is laminated. This device includes a cutting unit having a circular cutter for cutting the optical film laminate, and a first driving unit for rotating the circular cutter; and a cutting unit moving mechanism having the cutting unit facing the optical film. A second drive unit that moves in the width direction of the laminated body; a control unit that controls the operations of the first drive unit and the second drive unit. The control unit controls the operations of the first driving unit and the second driving unit such that a predetermined position on the outer periphery of the rotating circular cutter abuts the side end portion of the optical film laminate.
按照本發明,在複數個切割線的各者中於寬 度方向距光學膜層積體的側端部的距離相同之位置,是藉由圓形刀具的同一處而形成切割線,故若出現不符同一切割線形狀樣式之切割線,藉此便可容易發現光學膜的切斷不良及辨明其原因,而能夠使得離型膜斷裂或光學膜對液晶顯示面板的貼附不良等這類問題的發生頻率降低。此外,由於能夠每次切斷時都將抵住光學膜層積體的側端部之圓形刀具的圓周上的位置設為相同位置,因此即使發生圓形刀具本身的扭曲或刀具組裝至裝置的不良之情形下,仍可調整切割開始位置而使得切割線總是落入光學相機等的視野,能夠更加提高切割線的形成位置的精度。又,對於複數個光學膜膜片的各者,能夠獲得相向之側端部的長度及形狀總是相同之膜片,因此能夠更穩定地提高光學膜膜片對面板構件之貼合精度。 According to the present invention, in each of the plurality of cutting lines, The position where the distance from the side of the optical film layered body in the same direction is the same as the cutting line is formed by the same place of the circular cutter, so if a cutting line that does not match the shape of the same cutting line appears, it can be easily done. It is found that the cutting failure of the optical film and the cause are identified, and the frequency of such problems as breakage of the release film or poor adhesion of the optical film to the liquid crystal display panel can be reduced. In addition, since the position on the circumference of the circular cutter which abuts the side end portion of the optical film laminate can be set to the same position each time it is cut, even if the circular cutter itself is twisted or the cutter is assembled to the device In the case of failure, the cutting start position can still be adjusted so that the cutting line always falls into the field of view of an optical camera or the like, which can further improve the accuracy of the position where the cutting line is formed. In addition, for each of the plurality of optical film films, a film having the same length and shape of the end portions facing each other can be obtained, so that the bonding accuracy of the optical film film to the panel member can be more stably improved.
F‧‧‧光學膜層積體 F‧‧‧Optical film laminate
FR‧‧‧一方的側端部(右側端部) FR‧‧‧ one side end (right end)
FL‧‧‧另一方的側端部(左側端部) FL‧‧‧ the other side end (left end)
F1‧‧‧光學膜 F1‧‧‧ Optical Film
F2‧‧‧黏著層 F2‧‧‧Adhesive layer
F3‧‧‧離型膜 F3‧‧‧ release film
CL1、CL2‧‧‧切割線 CL1, CL2‧‧‧‧cut line
FS1、FS2、FS3‧‧‧光學膜膜片 FS1, FS2, FS3‧‧‧Optical film diaphragm
L‧‧‧切割線間距離 L‧‧‧ Distance between cutting lines
1、1’、1”‧‧‧切割線形成裝置 1,1 ’, 1” ‧‧‧‧cut line forming device
10‧‧‧切斷單元 10‧‧‧ Cut-off unit
12‧‧‧圓形刀具 12‧‧‧ round cutter
14‧‧‧高度調整部 14‧‧‧ height adjustment department
16‧‧‧圓形刀具裝配部 16‧‧‧Circular Tool Assembly Department
18‧‧‧第1驅動部 18‧‧‧ 1st drive unit
19‧‧‧第1檢測部 19‧‧‧The first detection department
20‧‧‧切斷單元移動機構 20‧‧‧ cutting unit moving mechanism
22‧‧‧導軌 22‧‧‧rail
24‧‧‧滾珠螺桿機構 24‧‧‧ Ball screw mechanism
26‧‧‧第2驅動部 26‧‧‧ 2nd drive unit
28‧‧‧第2檢測部 28‧‧‧Second Detection Section
30a、30b‧‧‧支撐部 30a, 30b‧‧‧ support
32‧‧‧讀取部 32‧‧‧Reading Department
34‧‧‧照明 34‧‧‧lighting
35‧‧‧銷 35‧‧‧pin
36‧‧‧抵銷手段 36‧‧‧ Offset means
37‧‧‧驅動部 37‧‧‧Driver
40‧‧‧切斷承台 40‧‧‧cut-off platform
50‧‧‧控制部 50‧‧‧Control Department
52‧‧‧記憶部 52‧‧‧Memory Department
[圖1]示意藉由本發明之切割線形成方法及裝置而形成了切割線之光學膜層積體的模型立體圖。 [Fig. 1] A perspective view of a model of an optical film laminate in which a cutting line is formed by the cutting line forming method and device of the present invention.
[圖2]本發明第1實施形態之切割線形成裝置的構成示意概略側面圖。 Fig. 2 is a schematic side view showing a schematic configuration of a cutting line forming apparatus according to a first embodiment of the present invention.
[圖3]本發明第1實施形態之切割線形成裝置的構成示意概略俯視圖。 [FIG. 3] A schematic plan view of a configuration of a cutting line forming apparatus according to a first embodiment of the present invention.
[圖4]本發明第1實施形態之切割線形成裝置中的切割線形成動作的控制流程。 [Fig. 4] A control flow of a cutting line forming operation in the cutting line forming apparatus according to the first embodiment of the present invention.
[圖5]圓形刀具的旋轉速度與從旋轉開始起算之經過時間之間的關係示意圖。 [Fig. 5] A diagram showing the relationship between the rotation speed of a circular cutter and the elapsed time from the start of rotation.
[圖6]本發明第1實施形態之切割線形成裝置中的切割線形成動作的另一控制流程。 [Fig. 6] Another control flow of the cutting line forming operation in the cutting line forming apparatus according to the first embodiment of the present invention.
[圖7]本發明第2實施形態之切割線形成裝置的構成示意概略俯視圖。 [FIG. 7] A schematic plan view of the configuration of a cutting line forming apparatus according to a second embodiment of the present invention.
[圖8]本發明第2實施形態之切割線形成裝置中的切割線形成動作的控制流程。 [Fig. 8] A control flow of a cutting line forming operation in a cutting line forming apparatus according to a second embodiment of the present invention.
[圖9]本發明第2實施形態之切割線形成裝置中的切割線形成動作的另一控制流程。 [Fig. 9] Another control flow of the cutting line forming operation in the cutting line forming apparatus according to the second embodiment of the present invention.
[圖10]本發明第2實施形態之切割線形成裝置中的切割線形成動作的又另一控制流程。 [Fig. 10] Another control flow of the cutting line forming operation in the cutting line forming apparatus according to the second embodiment of the present invention.
[圖11]本發明第3實施形態之切割線形成裝置的構成示意概略俯視圖。 [FIG. 11] A schematic plan view of a configuration of a cutting line forming apparatus according to a third embodiment of the present invention.
[圖12]本發明第3實施形態之切割線形成裝置中的切割線形成動作的控制流程。 [Fig. 12] A control flow of a cutting line forming operation in a cutting line forming apparatus according to a third embodiment of the present invention.
以下參照圖面,詳細說明本發明的實施形態。本發明並非限定於該些實施形態。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to these embodiments.
圖1示意藉由本發明之切割線形成方法及裝置而形成了切割線之光學膜層積體F的模型立體圖。本發明之切割線形成方法及裝置,如圖1所示般,係用來在具有隔著黏著層F2而層積於長型的離型膜F3上的光學膜F1之光學 膜層積體F,形成複數個切割線CL1、CL2、CL3...,以便能夠用於劃分於長度方向連續地被支撐於離型膜F3上之複數個光學膜的膜片FS1、FS2、FS3...。若使用本發明之切割線形成方法及裝置,例如於切割線CL1,當在和光學膜層積體F的右側端部FR相距距離a1、a2、a3的位置,切斷深度有變異的情形下,於其他的切割線CL2、CL3...也能夠在相同位置同樣地使得切斷深度變異。這能夠藉由下述方式來達成,即,在形成切割線的各者CL1、CL2、CL3...時,總是將圓形刀具的規定位置抵住光學膜層積體F的右側端部FR而開始光學膜層積體的切割。 FIG. 1 is a schematic perspective view of a model of an optical film laminate F in which a cutting line is formed by the cutting line forming method and device of the present invention. As shown in FIG. 1, the cutting line forming method and device of the present invention are used for optically forming an optical film F1 having a long release film F3 laminated with an adhesive layer F2 interposed therebetween. The film laminate F forms a plurality of cutting lines CL1, CL2, CL3,... So as to be able to be used for dividing a plurality of optical films FS1, FS2, which are continuously supported on the release film F3 in the longitudinal direction. FS3 .... If the cutting line forming method and device of the present invention are used, for example, at the cutting line CL1, when the cutting depth varies from the right end FR of the optical film laminate F by a distance a1, a2, or a3, In other cutting lines CL2, CL3, etc., the cutting depth can also be varied in the same position. This can be achieved by, when forming each of the cutting lines CL1, CL2, CL3, ..., the predetermined position of the circular cutter is always pressed against the right end of the optical film laminate F The FR starts dicing of the optical film laminate.
RTP系統中,當使用運用了本發明的切割線形成方法之切割線形成裝置的情形下,例如如專利文獻1的說明書或圖面所揭示,能夠於切割線形成裝置的前工程,設置裝載長型的光學膜層積體的料卷之支架裝置、從料卷連續地退繞光學膜層積體之退繞裝置、調整膜的饋送速度之速度調整裝置等這類裝置。通過了該些裝置之光學膜層積體,會被送入切割線形成裝置。接著,光學膜層積體,從切割線形成裝置被送出至後工程。於切割線形成裝置的後工程,能夠設置調整膜的饋送速度之速度調整裝置、將存在缺點的光學膜的膜片從長型的離型膜排除之排除裝置、將不存在缺點的光學膜膜片從長型的離型膜剝離而貼合至面板構件之貼合裝置、捲繞長型的離型膜之捲繞驅動裝置等這類裝置。 In the RTP system, when a cutting line forming device using the cutting line forming method of the present invention is used, for example, as disclosed in the specification or drawings of Patent Document 1, it is possible to set a loading length before the cutting line forming device. Type optical film layered body roll support device, unwinding device for continuously unwinding the optical film layered body from the roll, speed adjustment device for adjusting the feeding speed of the film and the like. The optical film laminates that have passed these devices will be sent to the cutting line forming device. Next, the optical film layered body is sent out from the cutting line forming apparatus to a post process. In the post-process of the cutting line forming device, a speed adjustment device capable of adjusting the feed speed of the film, an exclusion device for excluding the defective optical film from the long release film, and an optical film without the defect can be provided. The sheet is peeled from the long release film and attached to a panel member, a laminating device for winding a long release film, and the like.
圖2為本發明第1實施形態之切割線形成裝置1的構成示意概略側面圖,圖3為切割線形成裝置1的構成示意概略俯視圖。本實施形態中,係藉由編碼器等檢測部來讀取圓形刀具12的旋轉數,並依據讀取之結果將圓形刀具12設定為基準狀態。切割線形成裝置1,具備對光學膜層積體F做切割之切斷單元10、及令切斷單元10朝光學膜層積體F的寬度方向(切割線形成方向)往復移動之切斷單元移動機構20。切割線形成裝置1,還具備供光學膜層積體F載置之切斷承台40。 FIG. 2 is a schematic side view showing a schematic configuration of a cutting line forming device 1 according to a first embodiment of the present invention, and FIG. 3 is a schematic top view showing a schematic configuration of a cutting line forming device 1. In this embodiment, the number of rotations of the circular cutter 12 is read by a detection unit such as an encoder, and the circular cutter 12 is set to a reference state according to the read result. The cutting line forming device 1 includes a cutting unit 10 that cuts the optical film laminate F, and a cutting unit that reciprocates the cutting unit 10 in the width direction (cut line formation direction) of the optical film laminate F. Moving mechanism 20. The cutting line forming apparatus 1 further includes a cutting base 40 on which the optical film layered body F is placed.
切斷單元10,具有圓形刀具12、及調整圓形刀具12相對於光學膜層積體F之高度方向的位置之高度調整部14、及令圓形刀具12旋轉之第1驅動部18。圓形刀具12,裝配於圓形刀具裝配部16,藉由令高度調整部14上下,能夠任意地設定切割線的深度。第1驅動部18,例如能夠設於圓形刀具裝配部16。作為第1驅動部18,較佳是使用可精密地控制圓形刀具12的旋轉數之驅動裝置,典型是使用伺服電動機。切割線形成裝置1,典型是具備能夠藉由個人電腦等汎用的電腦裝置來構成之控制部50。控制部50,能夠藉由控制訊號令第1驅動部18及高度調整部14作動。 The cutting unit 10 includes a circular cutter 12, a height adjustment unit 14 that adjusts the position of the circular cutter 12 with respect to the height direction of the optical film laminate F, and a first driving unit 18 that rotates the circular cutter 12. The circular cutter 12 is attached to the circular cutter mounting portion 16, and the depth of the cutting line can be arbitrarily set by raising and lowering the height adjustment portion 14. The first driving section 18 can be provided, for example, in the circular cutter mounting section 16. As the first driving unit 18, a driving device capable of precisely controlling the number of rotations of the circular cutter 12 is preferably used, and a servo motor is typically used. The cutting line forming apparatus 1 typically includes a control unit 50 that can be configured by a general-purpose computer device such as a personal computer. The control unit 50 can cause the first drive unit 18 and the height adjustment unit 14 to operate by a control signal.
切斷單元10,具有第1檢測部19。第1檢測部19,能夠檢測第1驅動部18的狀態,例如旋轉數或旋轉速度這類資訊,並送至控制部50。第1檢測部19,例 如能夠訂為編碼器,設於圓形刀具12的旋轉軸,在此情形下,能夠檢測圓形刀具12的旋轉數並送至控制部50。控制部50,能夠依據來自第1檢測部19的反饋資訊,控制第1驅動部18的動作。依此,圓形刀具12的旋轉速度及旋轉數,便能藉由控制部50自如地控制。例如,控制部50能夠自如地控制圓形刀具12形成切割線時之旋轉速度、從停止狀態到達至該旋轉速度之時間、切斷單元10移動一定的距離的期間之旋轉數等。 The cutting unit 10 includes a first detection unit 19. The first detection unit 19 can detect the state of the first drive unit 18, such as information such as the number of rotations and the rotation speed, and send it to the control unit 50. First detection unit 19, example If it can be ordered as an encoder, it is provided on the rotation axis of the circular cutter 12. In this case, the number of rotations of the circular cutter 12 can be detected and sent to the control unit 50. The control unit 50 can control the operation of the first drive unit 18 based on the feedback information from the first detection unit 19. Accordingly, the rotation speed and the rotation number of the circular cutter 12 can be freely controlled by the control unit 50. For example, the control unit 50 can freely control the rotation speed when the circular cutter 12 forms a cutting line, the time from the stopped state to the rotation speed, the number of rotations during which the cutting unit 10 moves a certain distance, and the like.
切斷單元10,能夠藉由切斷單元移動機構20而朝切割線形成方向(亦即光學膜層積體F的寬度方向)移動。切斷單元移動機構20,具有供切斷單元10走行之導軌22、及滾珠螺桿機構24,裝配於直立設於切斷承台40的寬度方向的兩外側之一對支撐部30a與30b之間。切斷單元10,裝配於切斷單元移動機構20,能夠藉由令滾珠螺桿機構24作動之第2驅動部26的驅動力,而沿著導軌22朝光學膜層積體F的寬度方向往復移動。第2驅動部26,係藉由從控制部50接收之控制訊號而作動。作為第2驅動部26,較佳是使用可精密地控制切斷單元10的移動速度之控制裝置,典型是使用伺服電動機。 The cutting unit 10 can be moved in the cutting line formation direction (that is, the width direction of the optical film laminate F) by the cutting unit moving mechanism 20. The cutting unit moving mechanism 20 includes a guide rail 22 and a ball screw mechanism 24 for the cutting unit 10 to travel, and is installed between one pair of support portions 30a and 30b standing upright on one of the two outer sides of the cutting base 40 in the width direction. . The cutting unit 10 is mounted on the cutting unit moving mechanism 20 and can reciprocate along the guide rail 22 in the width direction of the optical film layered body F by the driving force of the second driving portion 26 that operates the ball screw mechanism 24. . The second driving unit 26 is operated by a control signal received from the control unit 50. As the second driving unit 26, a control device capable of precisely controlling the moving speed of the cutting unit 10 is preferably used, and a servo motor is typically used.
切斷單元移動機構20,具有第2檢測部28。第2檢測部28,能夠檢測第2驅動部26的狀態,例如旋轉數及旋轉速度這類資訊,並送至控制部50。第2檢測部28,例如能夠訂為編碼器,設於令滾珠螺桿機構24的軸旋轉之旋轉軸,在此情形下,能夠檢測滾珠螺桿機構 24的軸的旋轉數並送至控制部50。控制部50,能夠依據來自第2檢測部28的反饋資訊,控制第2驅動部26的動作。依此,切斷單元10的移動速度,便能藉由控制部50自如地控制。 The cutting unit moving mechanism 20 includes a second detection unit 28. The second detection unit 28 can detect the state of the second drive unit 26, such as information such as the number of rotations and the rotation speed, and send it to the control unit 50. The second detection unit 28 can be, for example, an encoder and is provided on a rotation shaft that rotates the shaft of the ball screw mechanism 24. In this case, the ball screw mechanism can be detected The number of rotations of the shaft is sent to the control unit 50. The control unit 50 can control the operation of the second driving unit 26 based on the feedback information from the second detection unit 28. Accordingly, the moving speed of the cutting unit 10 can be freely controlled by the control unit 50.
接著,說明第1實施形態之切割線形成裝置1的切割線形成方法。圖4揭示該切割線形成方法100。第1實施形態中,採用下述構成,即,藉由設於切斷單元10之例如編碼器亦即第1檢測部19,而可檢測圓形刀具12的旋轉數。藉由此構成,方法100中,由圓形刀具12從基準狀態至切割線形成後停止旋轉為止所旋轉的次數亦即旋轉數,來事先求出在基準狀態時與停止旋轉時之間的圓形刀具12的圓周上的基準點的偏差角度θ,於形成複數個切割線的各者時,藉由將圓形刀具12的姿勢調整該偏差角度θ的量,便能總是將圓形刀具12的規定位置抵住光學膜層積體F的側端部。所謂圓形刀具的基準狀態,係指一決定好的圓形刀具的姿勢,使得圓形刀具的圓周上的任意之基準點,在為了形成複數個切割線的各者而令圓形刀具旋轉之前,總是位於圓周方向的同一位置。圓周上之基準點的位置,並不限定於特定的位置,能夠設定為任意的位置,例如能夠訂為停止中的圓形刀具12的圓周上的最下點。當形成複數個切割線的各者CL1、CL2、CL3...時抵著光學膜層積體F的右側端部FR之圓形刀具12的規定位置,可和上述圓周上之基準點相同,亦可相異。 Next, a cutting line forming method of the cutting line forming apparatus 1 according to the first embodiment will be described. FIG. 4 discloses the cutting line forming method 100. In the first embodiment, a configuration is adopted in which the number of rotations of the circular cutter 12 can be detected by, for example, the first detection unit 19 that is an encoder provided in the cutting unit 10. With this structure, in the method 100, the number of rotations, that is, the number of rotations of the circular cutter 12 from the reference state to the stop of rotation after the cutting line is formed, that is, the number of rotations, is used to obtain the circle between the reference state and the stop of rotation The deviation angle θ of the reference point on the circumference of the shape cutter 12, when forming each of a plurality of cutting lines, by adjusting the posture of the circle cutter 12 by the amount of the deviation angle θ, the circle cutter can always be The predetermined position of 12 abuts the side end portion of the optical film layered body F. The reference state of a circular cutter refers to a determined posture of the circular cutter such that an arbitrary reference point on the circumference of the circular cutter before the circular cutter is rotated in order to form each of a plurality of cutting lines , Always in the same position in the circumferential direction. The position of the reference point on the circumference is not limited to a specific position, and can be set to an arbitrary position. For example, it can be set to the lowest point on the circumference of the stopped circular cutter 12. When forming each of the plurality of cutting lines CL1, CL2, CL3,..., The predetermined position of the circular cutter 12 against the right end FR of the optical film laminate F may be the same as the reference point on the circumference, Can also be different.
方法100,能夠由2個工程群所構成。第1工 程群,為複數個工程S101~S112,係用來在使用新的圓形刀具12連續地進行複數個切割線CL1、CL2、CL3...之形成之前,求出基準狀態下圓形刀具12的圓周上的基準點與切割線形成後停止旋轉時之基準點之間的偏差角度θ。第2工程群,為複數個工程S113~S123,係每當形成複數個切割線的各者CL1、CL2、CL3...時,一面以藉由第1工程群S101~S112求出的偏差角度θ量來調整圓形刀具12的旋轉,亦即一面調整使得基準點於形成切割線的各者CL1、CL2、CL3...之前總是位於同一位置,一面連續地形成切割線CL1、CL2、CL3...。 The method 100 can be composed of two engineering groups. First job Cheng Qun, a plurality of projects S101 ~ S112, is used to find the circular cutter 12 in the reference state before forming a plurality of cutting lines CL1, CL2, CL3 ... successively using a new circular cutter 12. The deviation angle θ between the reference point on the circumference of the circle and the reference point when the rotation stops after the cutting line is formed. The second project group is a plurality of projects S113 to S123. Whenever each of the plurality of cutting lines CL1, CL2, CL3, ... is formed, the deviation angle obtained by the first project group S101 to S112 is used. The amount of θ is used to adjust the rotation of the circular cutter 12, that is, one side is adjusted so that the reference point is always located at the same position before each of the cutting lines CL1, CL2, CL3 ..., and the cutting lines CL1, CL2 are continuously formed on the side. CL3 ...
首先,將切斷單元10配置於待命位置,設定為圓形刀具12的基準狀態(S101)。切斷單元10的待命位置,為進行切割線之形成之前的切斷單元10的所在位置,能夠訂為切斷承台40的一方的端部(圖3中切斷承台40的右端部)與一方的支撐部30a之間的位置。基準狀態,例如能夠訂為圓形刀具12的圓周上的基準點位於最下方之狀態。記憶部52與控制部50建立關連,係將圓形刀具12處於基準狀態時之來自第1檢測部19的輸出值,記憶於記憶部52作為基準旋轉數(S102)。 First, the cutting unit 10 is placed at a standby position and set to a reference state of the circular cutter 12 (S101). The stand-by position of the cutting unit 10 is the position of the cutting unit 10 before the formation of the cutting line, and can be set to one end of the cutting base 40 (the right end of the cutting base 40 in FIG. 3). And one of the support portions 30a. The reference state can be set, for example, to a state where the reference point on the circumference of the circular cutter 12 is located at the bottom. The memory unit 52 is related to the control unit 50, and the output value from the first detection unit 19 when the circular cutter 12 is in the reference state is stored in the memory unit 52 as the reference rotation number (S102).
接著,控制部50,對第1驅動部18指示開始形成光學膜層積體F的切割線(S103),響應該指示,第1驅動部18令圓形刀具12的旋轉開始(S104)。控制部50所做的開始形成切割線之指示,也會送至第2驅動部26,第2驅動部26會和圓形刀具12的旋轉開始同時,或 緊接著旋轉開始,令切斷單元10的橫向移動開始(S104)。控制部50所做的開始形成切割線之指示,還會送至高度調整部14,圓形刀具12會下降至切割線的深度成為適當深度之位置。到達光學膜層積體F的右側端部FR之圓形刀具12,開始切割線之形成(S105)。此時,抵住右側端部FR之圓形刀具12的圓周上的位置,為第2工程群中當開始形成複數個切割線的各者CL1、CL2、CL3...時,總是抵著右側端部FR之位置(規定位置)。 Next, the control unit 50 instructs the first driving unit 18 to start the cutting line of the optical film laminate F (S103), and in response to the instruction, the first driving unit 18 starts the rotation of the circular cutter 12 (S104). The instruction from the control section 50 to start forming the cutting line will also be sent to the second driving section 26, and the second driving section 26 will start simultaneously with the rotation of the circular cutter 12, or Immediately after the rotation is started, the lateral movement of the cutting unit 10 is started (S104). The instruction from the control section 50 to start forming the cutting line is also sent to the height adjusting section 14, and the circular cutter 12 is lowered to a position where the depth of the cutting line becomes an appropriate depth. The circular cutter 12 reaching the right end portion FR of the optical film laminate F starts the formation of a cutting line (S105). At this time, the position on the circumference of the circular cutter 12 that abuts on the right end FR is always in the second engineering group when each of the plurality of cutting lines CL1, CL2, CL3, ... begins to form. Position (predetermined position) of the right end portion FR.
圓形刀具12完成切割線之形成(S106)後,控制部50對第1驅動部18、第2驅動部26及高度調整部14指示其停止(S107)。響應該指示,圓形刀具12的旋轉及切斷單元10的橫向移動停止,圓形刀具12的位置上昇(S108)。控制部50,接收圓形刀具12的旋轉停止時之第1檢測部19的輸出值,並記憶於記憶部52作為旋轉停止時的旋轉數(S109)。控制部50,對第2驅動部26指示往切斷單元10的待命位置移動(S110),切斷單元10於圓形刀具12不接觸光學膜層積體F的上面之狀態下,移動至待命位置(S111)。 After forming the cutting line of the circular cutter 12 (S106), the control section 50 instructs the first driving section 18, the second driving section 26, and the height adjustment section 14 to stop (S107). In response to this instruction, the rotation of the circular cutter 12 and the lateral movement of the cutting unit 10 are stopped, and the position of the circular cutter 12 is raised (S108). The control unit 50 receives the output value of the first detection unit 19 when the rotation of the circular cutter 12 is stopped, and stores it in the storage unit 52 as the number of rotations when the rotation is stopped (S109). The control unit 50 instructs the second driving unit 26 to move to the standby position of the cutting unit 10 (S110), and the cutting unit 10 moves to the standby state when the circular cutter 12 does not contact the upper surface of the optical film laminate F. Position (S111).
控制部50,由S102中記憶的基準旋轉數、及S109中記憶的停止時的旋轉數,來計算從圓形刀具12的基準狀態至停止時為止的旋轉數(S112)。控制部50,更由該旋轉數,求出基準狀態下圓形刀具12的圓周上的基準點與切割線形成後旋轉停止時的基準點之間的偏差角度θ。 The control unit 50 calculates the number of rotations from the reference state of the circular cutter 12 to the stop time from the reference number of rotations stored in S102 and the number of rotations when stopped in S109 (S112). The control unit 50 further determines the deviation angle θ between the reference point on the circumference of the circular cutter 12 in the reference state and the reference point when the rotation is stopped after the cutting line is formed from the number of rotations.
例如,當從圓形刀具12的基準狀態至旋轉停止時為止的旋轉數為100.25轉的情形下,偏差角度θ為90°,旋轉數為100.60轉的情形下,偏差角度θ為216°。 For example, when the number of rotations from the reference state of the circular cutter 12 to when the rotation is stopped is 100.25 revolutions, the deviation angle θ is 90 °, and when the number of revolutions is 100.60 revolutions, the deviation angle θ is 216 °.
藉由上述第1工程群S101~S112,便能求出每當在光學膜層積體F形成複數個切割線的各者CL1、CL2、CL3...時令圓形刀具12回到基準狀態所必須之旋轉角度。切割線形成裝置1,接著反覆第2工程群S113~S123,藉此在光學膜層積體F依序形成複數個切割線的各者CL1、CL2、CL3...。 With the above-mentioned first engineering group S101 to S112, each time a plurality of cutting lines CL1, CL2, CL3, ... are formed in the optical film laminate F, the circular cutter 12 is returned to the reference state. Necessary rotation angle. The cutting line forming device 1 then repeats the second engineering groups S113 to S123, thereby sequentially forming each of a plurality of cutting lines CL1, CL2, CL3, etc. in the optical film laminate F.
控制部50,對第1驅動部18指示令圓形刀具12旋轉求出的偏差角度θ量(S113)。藉由該指示,圓形刀具12進行旋轉角度的調整,回到基準狀態(S114)。例如,圓形刀具12被命令旋轉以使圓周上之基準點總是位於最下點。令圓形刀具12旋轉之方向並無特別限定。例如,將基準點位於最下點時訂為基準狀態的情形下,當圓形刀具12在基準點於旋轉方向比最下點超過了角度θ之位置停止時,能夠令圓形刀具12逆旋轉該角度θ量來回到基準狀態,也能令圓形刀具12正旋轉360°-θ量來回到基準狀態。 The control unit 50 instructs the first driving unit 18 on the amount of deviation angle θ obtained by rotating the circular cutter 12 (S113). By this instruction, the rotation angle of the circular cutter 12 is adjusted, and the reference state is returned (S114). For example, the circular cutter 12 is instructed to rotate so that the reference point on the circumference is always the lowest point. The direction in which the circular cutter 12 is rotated is not particularly limited. For example, when the reference point is set to the reference state when the reference point is at the lowest point, when the circular cutter 12 is stopped at a position where the reference point in the rotation direction exceeds the lowermost point by an angle θ, the circular cutter 12 can be reversely rotated The angle θ is returned to the reference state, and the circular cutter 12 can also be rotated 360 ° -θ to return to the reference state.
控制部50,對第1驅動部18指示開始形成光學膜層積體F的切割線(S115),響應該指示,第1驅動部18令圓形刀具12的旋轉開始(S116)。控制部50所做的開始形成切割線之指示,也會送至第2驅動部26,第2驅動部26會和圓形刀具12的旋轉開始同時,或緊接 著旋轉開始,令切斷單元10的橫向移動開始(S116)。控制部50所做的開始形成切割線之指示,還會送至高度調整部14,圓形刀具12會下降至規定的位置。到達光學膜層積體F的右側端部FR之圓形刀具12,會讓圓形刀具12的圓周上的規定位置抵著光學膜層積體F的右側端部FR,而開始切割線CL1之形成(S117)。 The control unit 50 instructs the first driving unit 18 to start forming a cutting line of the optical film laminate F (S115), and in response to the instruction, the first driving unit 18 starts rotation of the circular cutter 12 (S116). The instruction from the control section 50 to start forming the cutting line will also be sent to the second driving section 26, and the second driving section 26 will start at the same time as or immediately after the rotation of the circular cutter 12. As the rotation starts, the lateral movement of the cutting unit 10 is started (S116). The instruction from the control unit 50 to start forming the cutting line is sent to the height adjustment unit 14 and the circular cutter 12 is lowered to a predetermined position. The circular cutter 12 that has reached the right end FR of the optical film laminate F will cause a predetermined position on the circumference of the circular cutter 12 to abut the right end FR of the optical film laminate F and start cutting the line CL1. Formation (S117).
圓形刀具12完成對光學膜層積體F的切割線CL1之形成(S118)後,控制部50對第1驅動部18、第2驅動部26及高度調整部14指示其停止(S119)。響應該指示,圓形刀具12的旋轉及切斷單元10的橫向移動停止,圓形刀具12的位置上昇(S120)。控制部50,對第2驅動部26指示令切斷單元10移動至待命位置(S121)。切斷單元10,會朝向和形成切割線CL1時的方向相反的方向,亦即從光學膜層積體F的左側端部FL朝向右側端部FR的方向,於圓形刀具12不接觸光學膜層積體F之狀態下移動至待命位置(S122)。形成了切割線CL1之光學膜層積體F,會於長邊方向被搬運事先設定好的距離L,亦即切割線CL1與下一切割線CL2的形成預定位置之間的距離L,以作為鄰接之切割線之間的距離(S123)。 After the circular cutter 12 finishes forming the cutting line CL1 of the optical film laminate F (S118), the control unit 50 instructs the first driving unit 18, the second driving unit 26, and the height adjustment unit 14 to stop (S119). In response to this instruction, the rotation of the circular cutter 12 and the lateral movement of the cutting unit 10 are stopped, and the position of the circular cutter 12 is raised (S120). The control unit 50 instructs the second driving unit 26 to move the cutting unit 10 to the standby position (S121). The cutting unit 10 faces the direction opposite to the direction when the cutting line CL1 is formed, that is, the direction from the left end FL to the right end FR of the optical film laminate F, and the circular cutter 12 does not contact the optical film In the state of the laminated body F, it moves to the standby position (S122). The optical film layered body F where the cutting line CL1 is formed will be transported in the long-side direction in a predetermined distance L, that is, the distance L between the cutting line CL1 and a predetermined formation position of the next cutting line CL2 as the The distance between adjacent cutting lines (S123).
一旦切斷單元10移動至待命位置,控制部50會再次指示令圓形刀具12旋轉偏差角度θ量(S113)。藉由該指示,圓形刀具12進行旋轉角度的調整,回到基準狀態(S114)。接著,如同形成切割線CL1時般,控 制部50對第1驅動部18、第2驅動部26及高度調整部14發送切斷指示(S115),開始切割線之形成(S117)。在待命位置圓形刀具12會回到基準狀態,因此若從圓形刀具12的待命位置至形成切割線為止的旋轉數及橫方向的移動速度相同,則和當形成切割線CL1時抵著光學膜層積體F的右側端部FR之圓形刀具12的圓周上的位置相同之位置,亦即規定位置,於開始形成切割線CL2時也會抵著右側端部FR。其後,進行S118~S123,切割線CL2形成於光學膜層積體F。反覆S113~S123,依序形成複數個切割線CL3、CL4...。 Once the cutting unit 10 is moved to the standby position, the control unit 50 instructs the circular cutter 12 to rotate by the deviation angle θ again (S113). By this instruction, the rotation angle of the circular cutter 12 is adjusted, and the reference state is returned (S114). Then, as when the cutting line CL1 is formed, the control The control unit 50 sends a cutting instruction to the first driving unit 18, the second driving unit 26, and the height adjustment unit 14 (S115), and starts forming a cutting line (S117). At the stand-by position, the circular cutter 12 returns to the reference state. Therefore, if the number of rotations and the lateral movement speed from the stand-by position of the circular cutter 12 to the formation of the cutting line are the same, it will oppose the optical when the cutting line CL1 is formed. The circular blade 12 on the right end FR of the film laminate F has the same position on the circumference of the circular cutter 12, that is, a predetermined position, and it will also abut the right end FR when the cutting line CL2 starts to be formed. Thereafter, S118 to S123 are performed, and a cutting line CL2 is formed on the optical film layered body F. Repeat S113 ~ S123 to form a plurality of cutting lines CL3, CL4 ... in order.
此處,說明圓形刀具12的旋轉速度,與藉由圓形刀具12在光學膜層積體F開始形成切割線的時間點之間的關係。此關係在本說明書中記載之所有實施形態中皆共通。圖5為處於基準狀態之圓形刀具12開始旋轉起算至停止旋轉為止之經過時間,與圓形刀具12的旋轉速度之間的關係示意圖。圓形刀具12的旋轉速度,隨著時間經過而變快,在規定的旋轉速度穩定地旋轉後,旋轉速度逐漸降低而停止。具有圓形刀具12之切斷單元10,藉由控制第2驅動部26,能夠令其朝光學膜層積體F的寬度方向以所需的速度移動。 Here, the relationship between the rotation speed of the circular blade 12 and the time point at which the cutting line starts to be formed in the optical film laminate F by the circular blade 12 will be described. This relationship is common to all embodiments described in this specification. FIG. 5 is a schematic diagram showing the relationship between the elapsed time from the start of rotation of the circular cutter 12 in the reference state to the stop of the rotation, and the rotation speed of the circular cutter 12. The rotation speed of the circular cutter 12 becomes faster as time passes, and after a predetermined rotation speed is stably rotated, the rotation speed gradually decreases and stops. The cutting unit 10 having the circular cutter 12 can control the second driving unit 26 to move the cutting unit 10 at a desired speed in the width direction of the optical film laminate F.
例如,若控制圓形刀具12的旋轉及切斷單元10的移動使得在圓形刀具12的旋轉速度達到規定速度而穩定化之前的時間點(例如圖5的A位置)即開始形成切割線的情形下、或是若控制圓形刀具12的旋轉及切斷單 元10的移動使得在圓形刀具12的旋轉速度正在減速途中的時間點(例如圖5的D位置)即完成切斷切割線的情形下,由於圓形刀具12的旋轉速度的變動,會容易發生切斷不良或偏光元件的裂痕。是故,較佳是控制圓形刀具12的旋轉及切斷單元10的移動使得在圓形刀具12的旋轉達到規定速度而穩定之時間點(例如圖5的B位置)開始形成切割線,並且在令旋轉速度降低前之時間點(例如圖5的C位置)結束。 For example, if the rotation of the circular cutter 12 and the movement of the cutting unit 10 are controlled so that the time at which the rotation speed of the circular cutter 12 reaches a predetermined speed and stabilizes (for example, position A in FIG. 5), the cutting line starts to be formed. In the case, or if the rotation and cutting of the circular cutter 12 is controlled The movement of the element 10 makes it easy to cut the cutting line at a point in time when the rotation speed of the circular cutter 12 is decelerating (for example, position D in FIG. 5), because the rotation speed of the circular cutter 12 changes, it will be easy. Poor cutting or cracking of the polarizing element occurred. Therefore, it is preferable to control the rotation of the circular cutter 12 and the movement of the cutting unit 10 so that the cutting line starts to be formed at a time point when the rotation of the circular cutter 12 reaches a predetermined speed and is stable (for example, position B in FIG. 5), and The process ends at a time point before the rotation speed is reduced (for example, the C position in FIG. 5).
圓形刀具12的旋轉穩定化與切斷單元10的開始移動之間的關係並無特別限定。例如,在令圓形刀具12從待命位置移動至開始形成切割線之位置的期間,能夠令圓形刀具12的旋轉速度上昇至規定速度並令其穩定化。或是,亦可在待命位置令圓形刀具12的旋轉速度上昇至規定速度並令其穩定化後,再令圓形刀具12從待命位置移動至開始形成切割線之位置。或是,亦可在令圓形刀具12從待命位置移動至開始形成切割線之位置之後,再令圓形刀具12的旋轉速度上昇至規定速度並令其穩定化。 The relationship between the rotation stabilization of the circular cutter 12 and the start movement of the cutting unit 10 is not particularly limited. For example, while the circular cutter 12 is being moved from the standby position to the position where the cutting line starts to be formed, the rotation speed of the circular cutter 12 can be increased to a predetermined speed and stabilized. Alternatively, after the rotation speed of the circular cutter 12 is increased to a predetermined speed and stabilized at the standby position, the circular cutter 12 may be moved from the standby position to a position where a cutting line is started. Alternatively, after the circular cutter 12 is moved from the standby position to the position where the cutting line starts to be formed, the rotation speed of the circular cutter 12 may be increased to a predetermined speed and stabilized.
接著,說明第1實施形態之切割線形成裝置1的另一切割線形成方法。圖6揭示該切割線生成方法200。該方法200中,不同於圖4所示之方法100,係僅求出圓形刀具12從基準狀態至切割線形成後停止旋轉為止所旋轉之旋轉數並事先記憶,於形成複數個切割線的各者時,令圓形刀具12逆旋轉該旋轉數,藉此便能總是將 圓形刀具12的規定位置抵住光學膜層積體F的側端部而形成複數個切割線。 Next, another cutting line forming method of the cutting line forming apparatus 1 according to the first embodiment will be described. FIG. 6 discloses the cutting line generating method 200. This method 200 is different from the method 100 shown in FIG. 4 in that only the number of rotations of the circular cutter 12 from the reference state to the rotation of the cutting line after stopping the formation of the cutting line is calculated and stored in advance. In each case, the circular cutter 12 is rotated in reverse by the number of rotations, so that the A predetermined position of the circular cutter 12 abuts a side end portion of the optical film laminate F to form a plurality of cutting lines.
方法200,如同方法100般,能夠由2個工程群所構成。第1工程群,為複數個工程S201~S211,係用來在使用新的圓形刀具12連續地進行複數個切割線CL1、CL2、CL3...之形成之前,求出從基準狀態至切割線形成後停止旋轉時為止的圓形刀具12的旋轉數。第2工程群,為複數個工程S213~S223,係每當形成複數個切割線的各者CL1、CL2、CL3...時,一面令圓形刀具12逆旋轉藉由第1工程群S201~S211求出的旋轉數來調整圓形刀具12的旋轉角度,一面連續地形成複數個切割線CL1、CL2、CL3...。另,以下是以方法100及方法200中相異之工程為中心來說明,未說明之工程,係和方法100之情形相同。 Method 200, like method 100, can be composed of two engineering groups. The first project group is a plurality of projects S201 to S211, which are used to find out from the reference state to the cutting before the formation of the plurality of cutting lines CL1, CL2, CL3, ... using the new circular cutter 12 continuously. The number of rotations of the circular cutter 12 until the rotation is stopped after the line is formed. The second project group is a plurality of projects S213 to S223. Whenever each of the plurality of cutting lines CL1, CL2, CL3, ... is formed, the circular cutter 12 is reversely rotated by the first project group S201 to S201. The rotation number obtained in S211 is used to adjust the rotation angle of the circular cutter 12, and a plurality of cutting lines CL1, CL2, CL3, etc. are continuously formed on one side. In addition, the following description is centered on the different projects in the method 100 and the method 200. The unexplained projects are the same as those in the method 100.
首先,將切斷單元10配置於待命位置,設定為圓形刀具12的基準狀態(S201)。接著,對第1驅動部18、第2驅動部26及高度調整部14發送切斷開始之指示(S203)。圓形刀具12的圓周上的規定位置抵著光學膜層積體F的右側端部FR而形成切割線,當圓形刀具12的旋轉停止(S208)時,控制部50從第1檢測部19接收從圓形刀具12的旋轉開始至旋轉停止為止之旋轉數r,並記憶於記憶部52(S209)。 First, the cutting unit 10 is placed in a standby position and set to a reference state of the circular cutter 12 (S201). Next, an instruction to start cutting is sent to the first driving section 18, the second driving section 26, and the height adjusting section 14 (S203). A predetermined position on the circumference of the circular cutter 12 abuts a right end FR of the optical film laminate F to form a cutting line. When the rotation of the circular cutter 12 is stopped (S208), the control unit 50 moves from the first detection unit 19 The number of rotations r from the start of the rotation of the circular cutter 12 to the stop of the rotation is received and stored in the storage unit 52 (S209).
控制部50,對第1驅動部18指示令圓形刀具12逆旋轉旋轉數r(S213)。藉由該指示,圓形刀具12 進行旋轉角度的調整,回到基準狀態(S214)。其後,藉由S215~S223的工程,在光學膜層積體F形成切割線CL1。控制部50,對回到待命位置的圓形刀具12,再次指示其逆旋轉旋轉數r。像這樣,反覆S213~S223,依序形成複數個切割線CL2、CL3...。 The control unit 50 instructs the first driving unit 18 to rotate the circular cutter 12 in the reverse rotation number r (S213). With this instruction, the circular cutter 12 The rotation angle is adjusted to return to the reference state (S214). Thereafter, a cutting line CL1 is formed in the optical film layered body F by the processes of S215 to S223. The control unit 50 once again instructs the circular cutter 12 returned to the standby position to rotate counterclockwise. In this way, S213 to S223 are repeated, and a plurality of cutting lines CL2, CL3, ... are sequentially formed.
接著,說明本發明第2實施形態之切割線形成裝置1’。圖7為本發明第2實施形態之切割線形成裝置1’的構成示意概略俯視圖,圖8揭示第2實施形態之切割線形成方法300。本實施形態中,例如能夠藉由運用了相機等之讀取部來讀取附在圓形刀具12的側面的標記等,並依據讀取之結果將圓形刀具12設定為基準狀態。 Next, a cutting line forming apparatus 1 'according to a second embodiment of the present invention will be described. Fig. 7 is a schematic plan view showing a configuration of a cutting line forming apparatus 1 'according to a second embodiment of the present invention, and Fig. 8 shows a cutting line forming method 300 according to the second embodiment. In the present embodiment, for example, a reading section using a camera or the like can read a mark or the like attached to the side surface of the circular cutter 12 and set the circular cutter 12 to a reference state based on the reading result.
切割線形成裝置1’,基本的構成如同第1實施形態之切割線形成裝置1,但相異之處在於設有在待命位置可讀取附在圓形刀具12的側面的標記之讀取部32及照明34。標記因應裝置的條件等,例如能夠適當使用文字、圖形、凹陷、突起或識別碼等,讀取部32因應標記的種類,例如能夠適當使用相機或感測器等。以下說明中,說明藉由相機32讀取附在圓形刀具12的側面的標記之形態。照明34並無特別限定,能夠因應裝置的條件等而適當選擇,但典型而言較佳是使用能夠容易設置,可調整視角等之環狀照明。 The cutting line forming device 1 ′ has a basic configuration similar to that of the cutting line forming device 1 of the first embodiment, but is different in that it has a reading unit that can read the marks attached to the side of the circular cutter 12 at the standby position. 32 和 照明 34. The mark can appropriately use characters, graphics, depressions, protrusions, or identification codes according to the conditions of the device, and the reading unit 32 can appropriately use a camera or a sensor, etc., depending on the type of the mark. In the following description, the form in which the mark attached to the side surface of the circular cutter 12 is read by the camera 32 is demonstrated. The illumination 34 is not particularly limited and can be appropriately selected according to the conditions of the device and the like, but typically, it is preferable to use a ring-shaped illumination that can be easily set and can adjust the viewing angle.
接著,說明第2實施形態之切割線形成裝置 1’的切割線形成方法。圖8揭示切割線形成方法300。該方法300,為當讀取部(相機)34的拍攝視野是圓形刀具12的側面的一部分之情形下所使用之方法。首先,設定切斷單元10位於待命位置時的圓形刀具12的基準狀態(S301)。切斷單元10的待命位置,如同第1實施形態般,為進行切割線之形成之前的切斷單元10的所在位置,為切斷承台40的一方的端部(圖3中切斷承台40的右端部)與一方的支撐部30a之間的位置。基準狀態,能夠訂為附在圓形刀具12的側面的標記,和讀取部34的拍攝視野內中事先訂定好的位置一致之狀態。 Next, a cutting line forming apparatus according to a second embodiment will be described. 1 'cutting line forming method. FIG. 8 discloses a cutting line forming method 300. This method 300 is a method used when the imaging field of view of the reading section (camera) 34 is a part of the side surface of the circular cutter 12. First, a reference state of the circular cutter 12 when the cutting unit 10 is in the standby position is set (S301). The standby position of the cutting unit 10 is, as in the first embodiment, the position of the cutting unit 10 before the formation of the cutting line is the one end of the cutting base 40 (the cutting base in FIG. 3) 40 right end portion) and one of the support portions 30a. The reference state can be set to a state where a mark attached to the side surface of the circular cutter 12 matches a predetermined position in the imaging field of view of the reading unit 34.
控制部50,當切斷單元10位於待命位置(S302)時,對第1驅動部18及讀取部32指示讀取附在圓形刀具12的標記(S303)。響應標記之讀取指示,第1驅動部18令圓形刀具12旋轉(S304),讀取部32拍攝圓形刀具12的側面的一部分,將圖像送至控制部50(S305)。控制部50,當標記進入讀取部32的拍攝視野時能夠檢測標記(S306)。控制部50,一旦檢測到標記,便對第1驅動部18指示停止旋轉圓形刀具12(S307),並記憶標記的現在位置(S309)。 When the cutting unit 10 is in the standby position (S302), the control unit 50 instructs the first driving unit 18 and the reading unit 32 to read the mark attached to the circular cutter 12 (S303). In response to the reading instruction of the mark, the first driving unit 18 rotates the circular cutter 12 (S304), the reading unit 32 captures a part of the side surface of the circular cutter 12, and sends the image to the control unit 50 (S305). The control unit 50 can detect the mark when the mark enters the imaging field of view of the reading unit 32 (S306). When the control unit 50 detects the mark, it instructs the first driving unit 18 to stop rotating the circular cutter 12 (S307), and memorizes the current position of the mark (S309).
接著,控制部50在拍攝視野內,求出標記的現在位置與在拍攝視野內事先設定好的基準位置之間的偏差角度θ,並記憶求出的偏差角度θ(S310)。控制部50,對第1驅動部18指示令圓形刀具12旋轉求出的偏差角度θ(S311)。其結果,圓形刀具12進行旋轉角度的 調整,回到基準狀態(S312)。 Next, the control unit 50 obtains the deviation angle θ between the current position of the marker in the imaging field of view and the reference position set in advance in the imaging field of view, and memorizes the obtained deviation angle θ (S310). The control unit 50 instructs the first driving unit 18 on the deviation angle θ obtained by rotating the circular cutter 12 (S311). As a result, the circular cutter 12 performs a rotation angle Adjust and return to the reference state (S312).
控制部50,對第1驅動部18指示開始形成光學膜層積體F的切割線(S313),響應該指示,第1驅動部18令圓形刀具12的旋轉開始(S314)。控制部50所做的開始形成切割線之指示,也會送至第2驅動部26,第2驅動部26會和圓形刀具12的旋轉開始同時,或緊接著旋轉開始,令切斷單元10的橫向移動開始(S314)。控制部50所做的開始形成切割線之指示,還會送至高度調整部14,圓形刀具12會下降至規定的位置。 The control unit 50 instructs the first driving unit 18 to start forming the cutting line of the optical film laminate F (S313), and in response to the instruction, the first driving unit 18 starts the rotation of the circular cutter 12 (S314). The instruction from the control unit 50 to start forming the cutting line will also be sent to the second driving unit 26, and the second driving unit 26 will start the rotation of the circular cutter 12 at the same time, or immediately after the rotation starts, so that the cutting unit 10 The horizontal movement of S is started (S314). The instruction from the control unit 50 to start forming the cutting line is sent to the height adjustment unit 14 and the circular cutter 12 is lowered to a predetermined position.
到達光學膜層積體F的右側端部FR之圓形刀具12,開始切割線CL1之形成(S315)。於開始形成切割線CL1時抵著右側端部FR之圓形刀具12的圓周上的位置,為當開始形成切割線CL2、CL3...時也總是抵著右側端部FR之位置(規定位置)。 The circular cutter 12 that has reached the right end FR of the optical film laminate F starts the formation of the cutting line CL1 (S315). The position on the circumference of the circular cutter 12 that abuts the right end FR when the cutting line CL1 starts to be formed is the position that always abuts the right end FR when the cutting line CL2, CL3, ... is formed (specified position).
圓形刀具12完成對光學膜層積體F的切割線CL1之形成(S316)後,控制部50對第1驅動部18、第2驅動部26及高度調整部14指示其停止(S317)。響應該指示,圓形刀具12的旋轉及切斷單元10的橫向移動停止,圓形刀具12的位置上昇(S318)。控制部50,對第2驅動部26指示令切斷單元10移動至待命位置(S319)。切斷單元10,會朝向和形成切割線CL1時的方向相反的方向,亦即從光學膜層積體F的左側端部FL朝向右側端部FR的方向,於圓形刀具12不接觸光學膜層積體F之狀態下移動至待命位置(S320),以回到待命位 置(S302)。形成了切割線CL1之光學膜層積體F,會於長邊方向被搬運事先設定好的距離L,以作為鄰接之切割線之間的距離(S321)。其後,反覆S302~S321,依序形成切割線CL2、CL3...。 After the circular cutter 12 finishes forming the cutting line CL1 of the optical film laminate F (S316), the control section 50 instructs the first driving section 18, the second driving section 26, and the height adjustment section 14 to stop (S317). In response to this instruction, the rotation of the circular cutter 12 and the lateral movement of the cutting unit 10 are stopped, and the position of the circular cutter 12 is raised (S318). The control unit 50 instructs the second driving unit 26 to move the cutting unit 10 to the standby position (S319). The cutting unit 10 faces the direction opposite to the direction when the cutting line CL1 is formed, that is, the direction from the left end FL to the right end FR of the optical film laminate F, and the circular cutter 12 does not contact the optical film In the state of the laminated body F, move to the standby position (S320) to return to the standby position Set (S302). The optical film layered body F having the cutting lines CL1 formed thereon is transported in the long-side direction by a predetermined distance L as a distance between adjacent cutting lines (S321). Thereafter, S302 to S321 are repeated, and the cutting lines CL2, CL3, ... are sequentially formed.
接著,說明第2實施形態之切割線形成裝置1’的另一切割線形成方法。圖9揭示該切割線形成方法400。該方法400,為當讀取部34的拍攝視野是涵蓋圓形刀具12的側面全體之情形下所使用之方法。另,以下是以和方法300相異之工程為中心來說明,未說明之工程,係和方法300之情形相同。 Next, another cutting line forming method of the cutting line forming apparatus 1 'according to the second embodiment will be described. FIG. 9 discloses the cutting line forming method 400. This method 400 is a method used when the imaging field of view of the reading section 34 covers the entire side surface of the circular cutter 12. In addition, the following description is centered on the project that is different from the method 300. The unexplained project is the same as the method 300.
首先,如同方法300般,設定圓形刀具12的基準狀態(S401)。控制部50,當切斷單元10位於待命位置(S402)時,對讀取部32指示讀取附在圓形刀具12的標記(S403)。響應標記之讀取指示,讀取部32拍攝圓形刀具12的側面全體,將圖像送至控制部50(S404)。控制部50,依據送來的圖像,記憶標記的現在位置(S405)。 First, as in the method 300, a reference state of the circular cutter 12 is set (S401). When the cutting unit 10 is located at the standby position (S402), the control unit 50 instructs the reading unit 32 to read the mark attached to the circular cutter 12 (S403). In response to the read instruction of the mark, the reading section 32 captures the entire side surface of the circular cutter 12 and sends the image to the control section 50 (S404). The control unit 50 memorizes the current position of the marker based on the sent image (S405).
接著,控制部50求出標記的現在位置與在拍攝視野內事先設定好的基準位置之間的偏差角度θ,並記憶求出的偏差角度θ(S406)。控制部50,對第1驅動部18指示令圓形刀具12旋轉求出的偏差角度θ(S407)。其結果,圓形刀具12進行旋轉角度的調整,回到基準狀態(S408)。接下來工程S409~S417中,如同方法300中的工程S313~S321般,在光學膜層積體F形成切割線 CL1。其後,反覆S402~S417,依序形成切割線CL2、CL3...。 Next, the control unit 50 obtains a deviation angle θ between the current position of the marker and a reference position set in advance in the imaging field of view, and memorizes the obtained deviation angle θ (S406). The control unit 50 instructs the first driving unit 18 on the deviation angle θ obtained by rotating the circular cutter 12 (S407). As a result, the rotation angle of the circular cutter 12 is adjusted to return to the reference state (S408). In the next steps S409 to S417, like the steps S313 to S321 in the method 300, a cutting line is formed on the optical film layered body F. CL1. Thereafter, S402 to S417 are repeated, and the cutting lines CL2, CL3, ... are sequentially formed.
接著,說明第2實施形態之切割線形成裝置1’的又另一切割線形成方法。圖10揭示該切割線形成方法500。該方法500,為當讀取部34的拍攝視野無論是圓形刀具12的側面的一部分或是涵蓋全體之情形下皆能使用之方法。在拍攝視野內,事先訂定有標記的基準位置。另,以下是以和方法300相異之工程為中心來說明,未說明之工程,係和方法300之情形相同。 Next, another cutting line forming method of the cutting line forming apparatus 1 'according to the second embodiment will be described. FIG. 10 discloses the cutting line forming method 500. This method 500 is a method that can be used when the imaging field of view of the reading section 34 is a part of the side surface of the circular blade 12 or covers the entire area. In the shooting field of view, a reference position with a mark is predetermined. In addition, the following description is centered on the project that is different from the method 300. The unexplained project is the same as the method 300.
首先,如同方法300及方法400般,設定圓形刀具12的基準狀態(S501)。控制部50,當切斷單元10位於待命位置(S502)時,對第1驅動部18及讀取部32指示讀取附在圓形刀具12的標記(S503)。響應標記之讀取指示,第1驅動部18令圓形刀具12旋轉(S504),讀取部32拍攝圓形刀具12的側面的一部分或全體,將圖像送至控制部50(S505)。控制部50,依據送來的圖像,判定標記的位置是否和事先訂定好的位置一致(S506)。S504~S506之工程會反覆,直到標記的位置和事先訂定好的位置一致為止。當標記的位置和事先訂定好的位置一致時,控制部50指示第1驅動部18、第2驅動部26及高度調整部14開始形成切割線,圓形刀具12對光學膜層積體F開始形成切割線。當標記的位置和事先訂定好的位置一致時,亦可設計成暫且令圓形刀具12的旋轉停止,其後控制部50再發出S507的指示。接 下來工程S508~S515中,如同方法300中的工程S314~S321般,在光學膜層積體F形成切割線CL1。其後,反覆S502~S515,依序形成切割線CL2、CL3...。 First, like the method 300 and the method 400, the reference state of the circular cutter 12 is set (S501). When the cutting unit 10 is located at the standby position (S502), the control unit 50 instructs the first driving unit 18 and the reading unit 32 to read the mark attached to the circular cutter 12 (S503). In response to the read instruction of the mark, the first driving unit 18 rotates the circular cutter 12 (S504), the reading unit 32 captures a part or the entire side of the circular cutter 12, and sends the image to the control unit 50 (S505). The control unit 50 determines whether the position of the mark is consistent with a predetermined position based on the sent image (S506). The process from S504 to S506 will be repeated until the marked position is consistent with the predetermined position. When the position of the mark coincides with a predetermined position, the control section 50 instructs the first driving section 18, the second driving section 26, and the height adjusting section 14 to start forming a cutting line, and the circular cutter 12 starts the optical film laminate F. Form a cutting line. When the position of the mark is consistent with the position set in advance, it can also be designed to temporarily stop the rotation of the circular cutter 12, and the control unit 50 then issues an instruction of S507. Pick up In the following processes S508 to S515, as in the processes S314 to S321 in the method 300, a cutting line CL1 is formed on the optical film layered body F. Thereafter, S502 to S515 are repeated, and the cutting lines CL2, CL3, ... are sequentially formed.
接著,說明本發明第3實施形態之切割線形成裝置1”。圖11為本發明第3實施形態之切割線形成裝置1”的構成示意概略俯視圖,圖12揭示第3實施形態之切割線形成方法600。本實施形態中,是在切割線形成裝置1”設置機械性地限制圓形刀具12的旋轉之鎖定機構,藉此便能將圓形刀具12設定為基準狀態。 Next, a cutting line forming device 1 "according to a third embodiment of the present invention will be described. Fig. 11 is a schematic plan view of a configuration of a cutting line forming device 1" according to a third embodiment of the present invention, and Fig. 12 shows a cutting line formation according to the third embodiment. Method 600. In this embodiment, a lock mechanism for mechanically restricting the rotation of the circular cutter 12 is provided in the cutting line forming apparatus 1 ", whereby the circular cutter 12 can be set to a reference state.
切割線形成裝置1”,基本的構成如同第1實施形態之切割線形成裝置1,但相異之處在於設有用來機械性地限制圓形刀具12的旋轉之鎖定機構。鎖定機構,作為一例,如圖11所示般,能夠藉由:銷35,以朝垂直於圓形刀具12的側面之方向突出的方式裝配於該側面;及抵銷手段36,設於和圓形刀具12的側面相向之位置,在作動時會朝向該側面移動而與銷35卡合,藉此能夠令圓形刀具12的旋轉停止;及例如氣缸等驅動部37,令抵銷手段36移動;來構成。藉由鎖定機構而圓形刀具12停止時之圓形刀具12,為切斷單元12位於待命位置時之基準狀態。 The cutting line forming device 1 "has a basic structure similar to that of the cutting line forming device 1 of the first embodiment, but is different in that a locking mechanism for mechanically restricting the rotation of the circular cutter 12 is provided. The locking mechanism is an example. As shown in FIG. 11, the pin 35 can be mounted on the side of the circular cutter 12 so as to protrude in a direction perpendicular to the side of the circular cutter 12; and the offsetting means 36 is provided on the side of the circular cutter 12. The opposing position moves toward the side and engages with the pin 35 during operation, thereby stopping the rotation of the circular cutter 12; and the driving unit 37 such as an air cylinder moves the offsetting means 36; The circular cutter 12 when the circular cutter 12 is stopped by the lock mechanism is a reference state when the cutting unit 12 is in the standby position.
鎖定機構,並非限定於如圖11所示般由銷35、抵銷手段36及驅動部37所構成之機構。例如,亦可 採用下述這樣的機構,即,在圓形刀具12的側面設置開口,並將在作動時會朝向圓形刀具12的側面移動之銷插入至該開口,藉此令圓形刀具12的旋轉停止。 The locking mechanism is not limited to a mechanism composed of a pin 35, an offsetting means 36, and a driving unit 37 as shown in FIG. For example, A mechanism is provided in which an opening is provided on the side surface of the circular blade 12 and a pin that moves toward the side of the circular blade 12 during operation is inserted into the opening, thereby stopping the rotation of the circular blade 12. .
接著,說明第3實施形態之切割線形成裝置1”的切割線形成方法。圖12揭示切割線形成方法600。該方法600中,首先,設定切斷單元10位於待命位置時之圓形刀具12的基準狀態(S601)。切斷單元10的待命位置,如同第1實施形態般,為進行切割線之形成之前的切斷單元10的所在位置,為切斷承台40的一方的端部(圖11中切斷承台40的右端部)與一方的支撐部30a之間的位置。基準狀態,能夠訂為圓形刀具12藉由鎖定機構而停止時之狀態。 Next, a cutting line forming method of the cutting line forming apparatus 1 "according to the third embodiment will be described. Fig. 12 illustrates a cutting line forming method 600. In this method 600, first, a circular cutter 12 is set when the cutting unit 10 is in a standby position. Reference state (S601). The standby position of the cutting unit 10 is, as in the first embodiment, the position of the cutting unit 10 before the formation of the cutting line, and the end of one of the cutting bases 40 ( In Fig. 11, the position between the right end portion of the pedestal 40) and one of the support portions 30a. The reference state can be set to the state when the circular cutter 12 is stopped by the lock mechanism.
控制部50,當切斷單元10位於待命位置時(S602),指示抵銷手段36的驅動部37動作(S603),抵銷手段36移動至可與設於圓形刀具12的側面之銷35卡合之位置(S604)。控制部50,接著對第1驅動部18指示旋轉圓形刀具12(S605),圓形刀具12旋轉(S606)。一旦圓形刀具12的銷35抵住抵銷手段36,圓形刀具12停止(S607)。接著,控制部50指示驅動部37令抵銷手段36後退(S608),抵銷手段36後退至不與銷35卡合之位置(S609)。 When the cutting unit 10 is in the standby position (S602), the control unit 50 instructs the driving unit 37 of the offsetting means 36 to operate (S603), and the offsetting means 36 moves to a pin 35 provided on the side of the circular cutter 12 Engagement position (S604). The control unit 50 then instructs the first driving unit 18 to rotate the circular cutter 12 (S605), and the circular cutter 12 is rotated (S606). Once the pin 35 of the circular cutter 12 abuts the canceling means 36, the circular cutter 12 stops (S607). Next, the control unit 50 instructs the driving unit 37 to retract the offsetting means 36 (S608), and the offsetting means 36 is retracted to a position where it does not engage with the pin 35 (S609).
此時,圓形刀具12處於其基準狀態。 At this time, the circular cutter 12 is in its reference state.
接著,控制部50指示第1驅動部18、第2驅動部26及高度調整部14開始形成切割線,圓形刀具12 對光學膜層積體F開始形成切割線。 Next, the control section 50 instructs the first driving section 18, the second driving section 26, and the height adjusting section 14 to start forming a cutting line, and the circular cutter 12 A scribe line is formed in the optical film laminate F.
後續工程S610~S615中,在光學膜層積體F形成切割線CL1。又,反覆S602~S618,依序形成切割線CL2、CL3...。 In subsequent processes S610 to S615, a cutting line CL1 is formed in the optical film laminate F. Moreover, S602 to S618 are repeated, and the cutting lines CL2, CL3, ... are sequentially formed.
上述第1實施形態至第3實施形態中,皆是從光學膜層積體F的一方的側端部朝向另一方的側端部形成複數個切割線。也就是說,切斷單元10的待命位置位於裝置的一方的端部(例如面向圖1的右側的端部),每當1個切割線之形成完成,切斷單元10會在圓形刀具12不接觸光學膜層積體F的表面之狀態下,從裝置的另一方的端部(例如面向圖1的左側的端部)移動至一方的端部之待命位置,將圓形刀具12回復基準狀態後,形成下一切割線。 In the first to third embodiments described above, a plurality of cutting lines are formed from one side end portion of the optical film layered body F toward the other side end portion. In other words, the standby position of the cutting unit 10 is located at one end of the device (for example, the end facing the right side in FIG. 1). When the formation of a cutting line is completed, the cutting unit 10 Without touching the surface of the optical film layered body F, move from the other end of the device (for example, the end facing the left side in FIG. 1) to the standby position of one end, and return the circular cutter 12 to the reference After the state, the next cutting line is formed.
相對於此,第1實施形態至第3實施形態的任一者中,皆能構成為從光學膜層積體F的兩方的側端部形成切割線。也就是說,例如能夠設計成切割線CL1從光學膜層積體F的側端部FR朝向側端部FL形成後,下一切割線CL2是從光學膜層積體F的側端部FL朝向側端部FR形成,再下一切割線CL3如同切割線CL1般是從光學膜層積體F的側端部FR朝向側端部FL形成。為了像這樣實現從兩方向的切割線形成,切斷單元10的待命位置,不僅設於切斷承台40的寬度方向的一方的端部(例 如圖2中切斷承台40的右端)與一方的支撐部30a之間,還設於切斷承台40的寬度方向的另一方的端部(例如圖2中切斷承台40的左端)與另一方的支撐部30b之間。此處,將設於寬度方向的一端之待命位置稱為第1待命位置,設於寬度方向的另一端之待命位置稱為第2待命位置。 On the other hand, in any of the first embodiment to the third embodiment, a cutting line can be formed from both side end portions of the optical film layered body F. That is, for example, after the cutting line CL1 is formed from the side end portion FR to the side end portion FL of the optical film layered body F, the next cutting line CL2 may be formed from the side end portion FL of the optical film layered body F. The side end portion FR is formed, and the next cutting line CL3 is formed from the side end portion FR of the optical film laminate F toward the side end portion FL like the cutting line CL1. In order to achieve cutting line formation from two directions in this way, the stand-by position of the cutting unit 10 is not only provided at one end portion in the width direction of the cutting base 40 (for example, As shown in FIG. 2, the right end of the cutting base 40 is located between the one supporting portion 30 a and the other end of the cutting base 40 in the width direction (for example, the left end of the cutting base 40 in FIG. 2). ) And the other support portion 30b. Here, the standby position provided at one end in the width direction is referred to as a first standby position, and the standby position provided at the other end in the width direction is referred to as a second standby position.
例如圖1及圖2所示之切割線形成裝置1中,較佳是在切斷承台40與支撐部30b之間設置和切斷承台40與支撐部30a之間相同程度的空間,以便完成了1個切割線之形成的切斷單元10在第2待命位置待命。圖7所示之切割線形成裝置1’及圖11所示之切割線形成裝置1”亦同。切割線形成裝置1’的情形下,在第2待命位置亦設置讀取部32及照明34,切割線形成裝置1”的情形下,在第2待命位置亦設置抵銷手段36及驅動部37。 For example, in the cutting line forming apparatus 1 shown in FIG. 1 and FIG. 2, it is preferable to provide a space between the cutting base 40 and the support portion 30 b and the same degree of space between the cutting base 40 and the support portion 30 a so that The cutting unit 10 having completed the formation of one cutting line is on standby at the second standby position. The same applies to the cutting line forming device 1 ′ shown in FIG. 7 and the cutting line forming device 1 ″ shown in FIG. 11. In the case of the cutting line forming device 1 ′, a reading section 32 and an illumination 34 are also provided at the second standby position. In the case of the cutting line forming device 1 ", an offsetting means 36 and a driving portion 37 are also provided at the second standby position.
在從光學膜層積體F的寬度方向的兩側端部形成切割線之實施形態中,1個切割線CL1從光學膜層積體F的右端部FR朝向左端部FL形成後,圓形刀具12的旋轉停止,切斷單元10移動至第2待命位置。接著,在第2待命位置,圓形刀具12被回復基準狀態。在第2待命位置被回復了基準狀態之圓形刀具12,藉由從控制部50對第1驅動部18之指示,被賦予和形成切割線CL1時相反方向之旋轉,伴隨往切斷單元10的橫方向之移動,切割線CL2從光學膜層積體的側端部FL朝向側端部FR形成。 In the embodiment in which cutting lines are formed from both end portions in the width direction of the optical film layered body F, one cutting line CL1 is formed from the right end portion FR toward the left end portion FL of the optical film layered body F, and then a circular cutter is formed. The rotation of 12 is stopped, and the cutting unit 10 is moved to the second standby position. Next, at the second standby position, the circular cutter 12 is returned to the reference state. The circular cutter 12 returned to the reference state at the second standby position is given an instruction from the control unit 50 to the first driving unit 18, and is given a rotation in the opposite direction when the cutting line CL1 is formed, and is accompanied to the cutting unit 10 In the horizontal direction, the cutting line CL2 is formed from the side end portion FL toward the side end portion FR of the optical film laminate.
這樣的實施形態中,例如以切割線形成方法100為例來說明,則從光學膜層積體F的側端部FR朝向側端部FL形成切割線CL1(例如方法100的S117、S118),圓形刀具12的旋轉停止(S120)後,藉由控制部50所做的待命位置移動指示S121,切斷單元10會於S122移動至第2待命位置。圓形刀具10,在第2待命位置進行旋轉角度的調整,回復基準狀態(S114)。回復基準狀態後,圓形刀具10朝和形成切割線CL1時的旋轉方向相反之方向旋轉(S116),從光學膜層積體的側端部FL朝向側端部FR,形成切割線CL2(S117、S118)。 In this embodiment, for example, the cutting line forming method 100 is used as an example to describe, and the cutting line CL1 is formed from the side end portion FR of the optical film laminate F toward the side end portion FL (for example, S117 and S118 of the method 100). After the rotation of the circular cutter 12 is stopped (S120), the cutting unit 10 moves to the second standby position at S122 by the standby position movement instruction S121 made by the control unit 50. The circular cutter 10 adjusts the rotation angle at the second standby position, and returns to the reference state (S114). After returning to the reference state, the circular cutter 10 is rotated in the direction opposite to the rotation direction when the cutting line CL1 is formed (S116), and the cutting line CL2 is formed from the side end portion FL toward the side end portion FR of the optical film laminate (S117 , S118).
在從光學膜層積體F的兩方的側端部形成切割線之實施形態中,亦能設計成不設置第2待命位置之構成。在此構成的情形下,例如從光學膜層積體F的側端部FR朝向側端部FL形成切割線CL1後,將圓形刀具12的旋轉暫且停止。暫且停止時的圓形刀具12的基準點的位置不予規定。接下來,令圓形刀具12朝逆方向旋轉,從側端部FL朝向側端部FR形成切割線CL2。當形成切割線CL2時,圓形刀具12的旋轉數及移動速度,係被正確地控制成和形成切割線CL1時成為相同。完成了切割線CL2之形成的圓形刀具12,回到第1待命位置,被回復成基準狀態後,形成下一切割線CL3。 In the embodiment in which the cutting lines are formed from both side end portions of the optical film layered body F, a configuration in which the second standby position is not provided can also be designed. In the case of this configuration, for example, after the cutting line CL1 is formed from the side end portion FR toward the side end portion FL of the optical film laminate F, the rotation of the circular cutter 12 is temporarily stopped. The position of the reference point of the circular cutter 12 at the time of stopping is not specified. Next, the circular cutter 12 is rotated in the reverse direction to form a cutting line CL2 from the side end portion FL toward the side end portion FR. When the cutting line CL2 is formed, the number of rotations and the moving speed of the circular cutter 12 are accurately controlled to be the same as when the cutting line CL1 is formed. The circular cutter 12 having formed the cutting line CL2 is returned to the first standby position and returned to the reference state, and then the next cutting line CL3 is formed.
像這樣,從光學膜層積體F的兩方的側端部依序進行複數個切割線之形成,藉此,相較於僅從一方的側端部形成複數個切割線之情形下,能能令每單位時間可 形成之切割線的數量增加,其結果,會達成增加每單位時間形成之光學膜膜片。不過,在不設置第2待命位置,而是令圓形刀具12原原本本地正確地逆旋轉來形成切割線之實施形態中,所有切割線的切斷深度的樣式皆會相同,而在設置第2待命位置,於該第2待命位置將圓形刀具12回復基準狀態後再形成切割線之實施形態中,於鄰接之切割線例如CL1與CL2,即使在距側端部之距離為相同的位置,切割線的切斷深度也會相異。在距側端部之距離為相同的位置,和CL1成為相同切斷深度者為切割線CL3、CL5、CL7...,和CL2成為相同切斷深度者為切割線CL4、CL6、CL8...。這是因為,例如在形成切割線CL1的最後圓形刀具12從側端部FL離開時與側端部FL相接之圓形刀具12的圓周上的位置,會和在形成切割線CL2時抵住側端部FL之圓形刀具12的圓周上的位置相異的緣故。像這樣,在設置第2待命位置之實施形態中,切割線的切斷深度的樣式每隔1者會成為相同樣式,相較於複數個切割線中切斷深度不規則地相異之情形,其優點在於容易發現切斷不良或辨明其原因。 As described above, the formation of a plurality of cutting lines in order from the two side end portions of the optical film laminate F can sequentially reduce the number of cutting lines compared to a case where a plurality of cutting lines are formed from only one side end portion. Can make every unit of time The number of formed cutting lines increases, and as a result, an increase in the number of optical film films formed per unit time can be achieved. However, in the embodiment in which the second standby position is not set, but the circular cutter 12 is originally reversely rotated correctly to form the cutting line, the cutting depth pattern of all the cutting lines will be the same. In the standby position, in the second standby position, the circular cutter 12 is returned to the reference state and then the cutting line is formed. In adjacent cutting lines such as CL1 and CL2, even at the same distance from the side end, The cutting depth of the cutting line also varies. At the same distance from the side end, the cutting lines CL3, CL5, CL7 ... are the same cutting depth as CL1, and the cutting lines CL4, CL6, CL8 are the same cutting depth as CL2 ... .. This is because, for example, when the last circular cutter 12 forming the cutting line CL1 is separated from the side end FL, the position on the circumference of the circular cutter 12 that is in contact with the side end FL is abutted when the cutting line CL2 is formed. The circumferential positions of the circular cutters 12 on the side ends FL are different. In this way, in the embodiment in which the second standby position is provided, the pattern of the cutting depth of the cutting line becomes the same pattern every other one, compared with the case where the cutting depth is irregularly different in a plurality of cutting lines, This has the advantage that it is easy to find a bad cut or to identify the cause.
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| JP2011183514A (en) * | 2010-03-09 | 2011-09-22 | Nitto Denko Corp | Method and device of cutting laminate film, and method of manufacturing optical display device |
| JP2013240841A (en) * | 2012-05-18 | 2013-12-05 | Nitto Denko Corp | Cut-line formation device, and cut-line formation method |
| TW201403169A (en) * | 2012-03-30 | 2014-01-16 | 日東電工股份有限公司 | Method of manufacturing liquid crystal display device |
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| JP4878070B2 (en) * | 2010-10-29 | 2012-02-15 | 日東電工株式会社 | Manufacturing method of liquid crystal display element |
| JP5963073B2 (en) * | 2011-12-22 | 2016-08-03 | 住友化学株式会社 | Optical film cutting method and cutting apparatus |
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| JP2011183514A (en) * | 2010-03-09 | 2011-09-22 | Nitto Denko Corp | Method and device of cutting laminate film, and method of manufacturing optical display device |
| TW201403169A (en) * | 2012-03-30 | 2014-01-16 | 日東電工股份有限公司 | Method of manufacturing liquid crystal display device |
| JP2013240841A (en) * | 2012-05-18 | 2013-12-05 | Nitto Denko Corp | Cut-line formation device, and cut-line formation method |
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| TW201628811A (en) | 2016-08-16 |
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| CN105666557B (en) | 2019-06-18 |
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| CN105666557A (en) | 2016-06-15 |
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