TWI765664B - Cutting line forming apparatus and cutting line forming method - Google Patents

Abstract

[Subject] To provide a dicing line forming apparatus and a dicing line forming method that can form a high-precision dicing line without adopting a large-scale and complicated structure. [Solution] To provide a dicing line forming apparatus for forming the length of the "optical film comprising an elongated net-shaped carrier film and an elongated net-shaped optical film laminated on the carrier film through an adhesive layer" A net-shaped optical film laminate is continuously formed with cutting lines extending in the width direction. The cutting line forming apparatus includes: a cutting line forming part; a conveying direction changing part; and a cutting line detecting part. The dicing line forming part forms a dicing line with respect to the optical film laminated body conveyed in the horizontal direction from the surface opposite to the carrier film. The conveyance direction changing unit is disposed on the downstream side in the conveyance direction of the scribe line forming unit, and changes the conveyance direction of the optical film laminate after the scribe line is formed at a predetermined angle. The cut line detection unit is disposed on the downstream side in the conveyance direction rather than the conveyance direction changing unit, and detects the cut line formed in the optical film laminate.

Description

Cutting line forming apparatus and cutting line forming method

The present invention relates to a dicing line forming apparatus for continuously forming dicing lines in an optical film laminate, and more particularly, to a dicing line forming apparatus and method which can form a dicing line along the After the optical film laminated body conveyed in the horizontal direction, the optical film laminated body is conveyed in the vertical direction, and the cutting line formation position of the optical film laminated body conveyed in the longitudinal direction is detected, thereby forming a high-precision cutting line.

In recent years, in the manufacturing process of optical display devices such as liquid crystal display devices, there has been proposed a method in which only a film sheet of a plurality of optical films continuously supported on a carrier film via an adhesive layer does not have defects The normal film sheet is sequentially peeled off from the carrier film together with the adhesive layer, and is bonded to the panel member via the adhesive layer, thereby continuously manufacturing an optical display device. A manufacturing system for realizing such a system is described in Patent Document 1, for example.

In the production system described in Patent Document 1, an elongated reticulated optical film laminate in which an elongated reticulated optical film and an elongated reticulated carrier film are laminated via an adhesive layer is used. The optical film laminate is continuously formed in the width direction by using a dicing line forming means arranged to face the pedestal at a position determined based on the result of the defect detection performed in advance. Thereby, a film sheet of a plurality of optical films continuously supported on the carrier film is formed between the two cutting lines adjacent to the longitudinal direction. The film sheet of the optical film is fed into the bonding apparatus in a state supported by the carrier film, and is bonded to the panel member after peeling off the carrier film together with the adhesive layer. The manufacturing system of such an optical display device is called "continuous lamination (RTP; Roll To") in order to distinguish it from an individual lamination system in which a pre-cut optical film sheet is attached to a panel member. Panel) system".

In recent years, optical display devices have gradually increased in size, and along with the increase in size, the size of a film or a panel member of an optical film to be used has also increased. At the same time, thinning and narrowing of the edge of the optical display device are also required, and along with this, it is required to bond the panel member and the film of the optical film with higher precision, which is also required in the large-scale optical display device. same. In order to realize high-precision bonding of a large-scale optical film and a panel member in an RTP system, it is necessary to continuously and accurately determine the cutting line formed continuously along the longitudinal direction of the optical film laminate during the manufacturing process. s position.

In the conventional RTP system, in order to continuously and accurately determine the position of the continuously formed cutting line, the cutting line detection means arranged on the downstream side of the cutting line forming means detects that the cutting line is formed by the cutting line. The cutting line formed by the means is obtained, and the position of the formed cutting line is obtained, and the cutting line forming means is controlled based on the result. For example, Patent Document 2 discloses a technique in which a detection camera for detecting a cutting line is provided on the downstream side of the cutting position of an optical member film, and a cutting device is moved according to the position of the detected cutting line. , thereby adjusting the distance between the cutting position and the detection position. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 4377964 [Patent Document 2] Japanese Patent Laid-Open No. 2013-114227

[Problems to be Solved by the Invention]

In the conventional RTP system, the optical film laminate is generally conveyed in the horizontal direction from the position where the dicing line is formed to the detection position of the formed dicing line, and no supporting optical film layer is disposed therebetween. Integral organization. Therefore, especially in the case of a large-sized optical film in which the distance between adjacent dicing lines is long, there is a case in which the optical film laminate itself is It flexes due to the weight, and an error occurs between the length between the adjoining cutting lines and the predetermined length of the optical film. If the tension of the optical film laminate is increased, the error can be resolved, but there is a possibility that the optical film laminate may be stretched or cracked by increasing the tension.

The technique disclosed in Patent Document 2 is configured such that the optical film laminate is vertically conveyed from the formation position of the dicing line to the detection position of the formed dicing line. In the case of such a configuration, since deflection of the optical film laminate does not occur between the formation position of the dicing line and the detection position, the length between the adjacent dicing lines is different from the predetermined optical film thickness. Differences between film lengths are difficult to produce. However, as disclosed in Patent Document 2, when a circular cutter that rotates around a vertical axis of rotation is used to form a dicing line on an optical film laminate conveyed in the vertical direction, the actual device configuration requires There is a problem that the cutting line forming means is difficult to handle due to its thickness, and there is also a problem that it is difficult to adjust the cutting line forming position and the mechanism for adjusting the cutting line position becomes large.

In a general RTP system, a dicing line forming unit (indicated by reference numeral 10 in FIG. 2 ) for forming dicing lines is provided with a circular cutter, which A rotation axis whose plane is horizontal (that is, the rotation surface of the circular cutter is orthogonal to the main surface of the optical film laminate); a drive mechanism including a motor for rotating the circular cutter; The thin film laminate is arranged on the opposite side to the circular cutter. The circular cutter and the drive mechanism can be moved in the direction orthogonal to the main surface of the optical film laminate by the first moving mechanism including the motor and the guide rail, and can be moved by the first moving mechanism including the motor and the guide rail. The second moving mechanism of the rail moves in a direction transverse to the main surface of the optical film laminate. The circular cutter, the driving mechanism, the first moving mechanism, and the second moving mechanism are supported by the support portion. This support part is comprised so that a circular cutter, a drive mechanism, a 1st moving mechanism, and a 2nd moving mechanism may be supported on the side surface of the support part. The position where the cutting line is formed on the optical film laminate can be adjusted, for example, by moving the support part together with the circular cutter and the drive mechanism in the conveying direction of the optical film laminate, or by fixing the support part and The roll-out amount of the optical film laminate is changed by moving a circular cutter and a moving mechanism, or by a film driving means such as a feed roller.

When a dicing line forming unit having such a structure is used to form a dicing line on the optical film layered body conveyed in the vertical direction, the support portion of the dicing line forming unit is arranged so that only one end portion thereof is fixed. In the "cantilever" state of a frame or the like extending vertically, it extends horizontally. The support portion in the cantilevered state may be deflected under the influence of the weight of the circular cutter, the drive mechanism, and the first and second moving mechanisms supported by the support portion. Although it is also considered to increase the rigidity so that the support portion does not flex, the weight of the cutting wire forming unit increases and the frame for supporting the heavy cutting wire forming unit must be reinforced, resulting in large-scale equipment and high cost. Furthermore, when moving the dicing line forming unit and adjusting the position where the dicing line is formed on the optical film laminate, it is necessary to move the support portion, which is a weight in a cantilever state, up and down. The moving mechanism that moves in the vertical direction becomes large, and it is difficult to finely adjust the position where the dicing line is formed.

The present invention aims to provide a dicing line forming apparatus and a dicing line forming method which can form a high-precision dicing line without adopting a large-scale and complicated structure. [means to solve the problem]

In one aspect of the present invention, there is provided a dicing line forming device for forming "a carrier film comprising an elongated net shape and an elongated net shape laminated on the carrier film through an adhesive layer. "Optical film" is an elongated net-shaped optical film laminate, and a cutting line extending in the width direction is continuously formed. The cutting line forming apparatus includes: a cutting line forming part; a conveying direction changing part; and a cutting line detecting part. The dicing line forming part forms a dicing line with respect to the optical film laminated body conveyed in the horizontal direction from the surface opposite to the carrier film. The conveyance direction changing unit is disposed on the downstream side in the conveyance direction of the optical film laminate from the scribe line forming portion, and changes the conveyance direction of the optical film laminate after the scribe line is formed at a predetermined angle. The cut line detection unit is disposed on the downstream side in the conveyance direction of the optical film laminate than the conveyance direction changing unit, and detects the cut line formed in the optical film laminate. It is preferable that the member which contacts with an optical film laminated body is not arrange|positioned between a dicing line formation part and a conveyance direction change part. Here, in the dicing line forming section, although dicing lines are formed in the optical film laminate conveyed in the horizontal direction, the horizontal conveying in this specification is not limited to the conveying direction of the optical film laminate. It is completely parallel to the horizontal plane (0° relative to the horizontal plane), as long as it is transported substantially horizontally. Specifically, the transport direction can include the case where the transport direction is inclined at -15° to the case where it is inclined at +15° with respect to the horizontal plane. .

In one embodiment, the predetermined angle is preferably 60° or more and 120° or less. Moreover, in one Embodiment, it is preferable that the distance between the dicing line formation part and the said conveyance direction changing part is 100 mm or more and 850 mm or less.

In another aspect of the present invention, there is provided a method for forming a dicing line, which is used for forming "a carrier film comprising an elongated net shape and an elongated net shape laminated on the carrier film through an adhesive layer. "The optical film" is an elongated network-shaped optical film laminate with continuous cutting lines extending in the width direction. A cutting line forming method includes: a cutting line forming step; a conveying direction changing step; and a cutting line detecting step. In the dicing line forming step, a dicing line is formed on the optical film laminate from the surface opposite to the carrier film. The conveyance direction changing step changes the conveyance direction of the optical film laminate after the scribe line is formed by a predetermined angle on the downstream side in the conveyance direction of the optical film laminate from the position where the scribe line is formed. The dicing line detection step detects the dicing line formed in the optical film laminate on the downstream side in the conveyance direction of the optical film laminate from the position where the conveyance direction is changed. [Effect of invention]

In the dicing line forming apparatus and the dicing line forming method of the present invention, the dicing line is formed in a state in which the conveyance direction of the optical film laminate is horizontal, and the dicing is performed in a state in which the conveying direction is upward or downward. In the detection of the line, the deflection of the optical film laminate is smaller when the cutting line is detected than when the detection is performed in a state where the conveyance direction is horizontal. Therefore, according to the dicing line forming apparatus and the dicing line forming method, the length between adjacent dicing lines, that is, the error between the length of the optical film sheet to be formed and the length of the optical film sheet set in advance can be made smaller than before, And can form high-precision cutting lines.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The cutting line forming apparatus and method of the present invention can be used to continuously form cutting lines for an elongated net-shaped optical film laminate, and the cutting lines are used to define a continuous support on the elongated net-shaped film. A plurality of optical film sheets on the carrier film. In the dicing line forming apparatus and the dicing line forming method of the present invention, the dicing line is formed in a state in which the conveyance direction of the optical film laminate is horizontal, and the dicing is performed in a state in which the conveying direction is upward or downward. In the detection of the line, the deflection of the optical film laminate is smaller when the cutting line is detected than when the detection is performed in a state where the conveying direction is horizontal. Therefore, as long as the dicing line forming apparatus and dicing line forming method are used, the length between adjacent dicing lines, that is, the error ratio between the length of the optical film sheet to be formed and the predetermined length of the optical film sheet set in advance can be obtained used to be small. The optical film sheet formed between the adjacent cutting lines can be transported to the bonding position with the panel member in the state supported on the elongated net-shaped carrier film, and released together with the adhesive layer. After the long net-shaped carrier film is peeled off, it is attached to the panel member with high accuracy.

When the dicing line forming apparatus and the dicing line forming method of the present invention are used in the RTP system, as disclosed in Patent Document 1, for example, an optical film in the form of an elongated mesh can be installed in a process prior to the dicing line forming apparatus. A stand device for a roll of a laminated body, a take-up device for continuously unwinding an optical film laminated body from a roll, a reading device for reading the coded defect information pre-recorded on the optical film laminated body, A device such as a speed adjustment device that adjusts the conveying speed of the film. The optical film laminate that has passed through these devices is sent to a dicing line forming device.

Next, the optical film laminate is sent out from the dicing line forming apparatus to the subsequent process. In the process after the dicing line forming device, a speed adjustment device for adjusting the conveying speed of the film, a removal device for removing the defective optical film sheet from the elongated mesh carrier film, and an optical film without defects can be installed. The film sheet is peeled off from the elongated net-shaped carrier film and attached to such devices as a bonding device for a panel member, a winding drive device for winding up an elongated net-shaped carrier film, and the like.

[Configuration of the cutting line forming apparatus] FIG. 1 is a side view showing a schematic configuration including a cutting line forming apparatus 1 according to an embodiment of the present invention, and for forming a cutting line. FIG. 2 is a side view showing a schematic configuration of a cutting line forming apparatus 1 including an embodiment of the present invention. The optical film laminate PL is transported in the direction indicated by the arrow D1 in FIG. 1 . This direction D1 is referred to as the "conveyance direction" of the optical film laminate PL.

The dicing line forming apparatus 1 is provided with: a dicing line forming part 10 for forming a dicing line; a support roller (transport direction changing part) 20 for changing the optical film lamination in which the dicing line is formed in the dicing line forming part 10 at a predetermined angle The conveyance direction of the body PL; and the cut line detection unit 30 detects the position of the cut line of the optical film laminated body PL whose conveyance direction has been changed. The operations of the cutting line forming part 10 and the cutting line detecting part 30 are controlled by a control means (not shown), and the control means is constituted by a general-purpose computer or the like.

The optical film laminate PL in which the dicing line is formed in the dicing line forming apparatus 1 can be set to "contain the elongated reticulated optical film OP and bonded to the elongated reticulated optical film OP via the adhesive layer A" The laminated body of the elongated mesh carrier film C". The elongated mesh optical film OP may be a single-layer film, or may be a multilayer film in which two or more types of optical films (for example, a polarizer and a retardation film) are bonded.

As shown in FIG. 1 , the optical film laminate PL is prepared as a roll R having a width corresponding to the length of one of the long sides and the short sides of the panel member. The optical film laminate PL unwound from the roll R is, for example, a film driving means D through a feed roll for unwinding the optical film laminate PL, and a dancer roller for adjusting the speed of film conveyance. It is sent to the cutting line forming apparatus 1 by the speed adjustment means S etc. of the same. A dicing line is formed in the optical film laminate PL sent into the dicing line forming apparatus 1 .

The cutting line is formed from the surface on the opposite side of the carrier film C to at least the depth of the surface of the adhesive layer A (that is, the boundary surface between the carrier film C and the adhesive layer A), and is formed toward the optical film layer. The width direction of the integrated body PL extends. When the dicing line is formed, the optical film laminate PL is transported to the downstream side in the conveying direction D1 by a predetermined distance, and the next dicing line is formed. This preset conveyance distance corresponds to the length of the other of the long side and the short side of the panel member W of the film sheet PS to which the optical film laminate PL is bonded. In this specification, the cutting line formed in the cutting line forming part 10 and located on the base 16 is set as the cutting line CL1, and the cutting line located on the downstream side in the conveying direction of the cutting line CL1 is set as a preceding cutting line Line CL2.

(cut line forming part) The dicing line forming part 10 includes: a circular blade 11 having a rotating shaft horizontal to the main surface of the optical film laminate PL; a driving part 12 including a shaft and a motor for rotating the circular blade 11; and a pedestal 13 is disposed on the opposite side of the circular blade 11 with the optical film laminate PL interposed therebetween; and the pressing member 14 presses the optical film laminate PL at the dicing line forming position to suppress the deflection of the optical film laminate PL bend or vibrate. The dicing line forming part 10 is further provided with: a first moving mechanism 15 including a rotating blade 11 and a driving part 12 for moving the rotary blade 11 and the driving part 12 in the up-down direction in FIG. ) to move the motor and guide; and the second moving mechanism 16, including the rotary cutter 11, the drive unit 12, and the first moving mechanism 15 in the direction perpendicular to the paper surface of FIG. 2 (in the width direction of the optical film laminate ) to move the motor and guide.

The circular cutter 11 , the driving portion 12 , the first moving mechanism 15 and the second moving mechanism 16 are supported by the support portion 17 . The support portion 17 supports the circular cutter 11 , the drive portion 12 , the first moving mechanism 15 and the second moving mechanism 16 on the side surface thereof. In one embodiment, the cutting line forming portion 10 is further provided with: a third moving mechanism (not shown) for moving the support portion 17 so that the position of the circular cutter 11 is along the optical film layer. The integrated body PL moves in the longitudinal direction (the left-right direction in FIG. 2 ). By operating the third moving mechanism, the positions at which the cutting lines CL1 and CL2 ･･･ are formed in the optical film laminate PL can be adjusted. In another embodiment, for example, without moving the first moving mechanism 15 , the second moving mechanism 16 , and the support portion 17 , only the circular cutter 11 and the drive portion 12 may be moved to adjust the formation of cutting in the optical film laminate PL. Location of lines CL1, CL2･･･. In another embodiment, for example, the circular cutter 11 and the drive unit 12, the first movement mechanism 15 and the second movement mechanism 16 may be moved to adjust the formation of the cutting lines CL1, CL2, etc. on the optical film laminate PL. ··s position.

The dicing line forming section 10 is controlled by a control means not shown, and operates so as to form dicing lines CL1 and CL2 ･･･ in the optical film laminate PL. Specifically, according to the control signal from the control means, the first moving mechanism 15 operates to lower the circular cutter 11 to a predetermined position, the driving unit 12 operates to rotate the circular cutter 11, and the second driving mechanism 16 operates It operates to move the circular blade 11 in the width direction of the optical film laminate PL.

(Transfer Direction Change Department) The dicing line forming part 10 is provided with a conveying direction changing part 20 on the downstream side in the conveying direction of the optical film laminate PL, and the conveying direction changing part 20 is used to change the formation of the dicing lines CL1 and CL2 ･･ ･The conveying direction of the optical film laminate PL. The conveying direction changing unit 20 can change the direction in which the optical film laminate PL is conveyed from the conveying direction (direction d1 shown in FIG. The direction of 0°) is changed at a predetermined angle θ to the upward direction or the downward direction (in the embodiment of FIG. 2 , the upward direction d2 ). In the present embodiment, the conveyance direction changing unit 20 includes a support roller 22 which is arranged to be at least longer than the width of the optical film laminate PL, and is arranged with any one of the two main surfaces of the optical film laminate PL. contact.

The distance between the dicing line forming part 10 and the conveying direction changing part 20 is, more specifically, the position where the conveyed optical film laminate PL comes into contact with the last in the dicing line forming part 10 (the most downstream part of the pedestal 13 ) The distance L between the first contact position in the conveyance direction changing section 20 (the contact section with the support roller 22 ) is to reduce the deflection of the optical film laminate PL as much as possible, preferably 850 mm or less, and 650 mm or less. More preferably, less than 350mm is more preferable. When the distance is more than 850 mm, there is a possibility that the optical film laminate may be largely deflected by its own weight. Although the conveyance direction changing part 20 is preferably as close as possible to the cutting line forming part 10 , various devices may be arranged between the cutting line forming part 10 and the conveying direction changing part 20 . Therefore, in order to secure a space for arranging various devices, the distance L between the dicing line forming portion 10 and the conveying direction changing portion 20 is preferably 100 mm or more, preferably 150 mm or more.

The conveyance direction d2 of the optical film laminated body PL changed by the conveyance direction changing part 20 may be an upward direction or a downward direction with respect to the conveyance direction d1 before the change. The predetermined angle θ between the direction parallel to the horizontal plane and the conveyance direction d2 is preferably 60° or more and 120° or less, and the closer it is to 90°, the better. As long as the predetermined angle θ is not less than 60° and not more than 120°, the optical film laminate PL after the conveying direction is changed will not be bent, or even if it occurs, it will not be detected by the cutting line detection unit 30 . The degree of deflection that affects the accuracy of the position of the wire.

From the viewpoint of preventing the deflection of the optical film layered body PL, it is also possible to arrange, for example, a roller that supports the optical film layered body PL from the lower main surface between the dicing line forming portion 20 and the conveyance direction changing portion 30. A support member, but it is preferable not to arrange such a support member. Even if the support member is arranged between the dicing line forming portion 10 and the conveyance direction changing portion 20, not only does it not provide a more effective contribution to resolving the deflection of the optical film laminate PL between these, but also when the support member contributes to the When the adjustment accuracy of the support height of the optical film layered body PL is poor, there is a fear that the linear accuracy may be lowered due to the support member pushing up the optical film layered body PL.

(cutting line detection section) The position in the conveyance direction of the cutting line CL1 formed by the cutting line forming part 10 is corrected using correction information. The correction information is generated based on the offset amount between the position where the preceding cutting line CL2 is formed detected by the cutting line detecting unit 30 and the predetermined cutting line forming reference position. Since the cutting line detection part 30 is arrange|positioned on the downstream side of the conveyance direction changing part 20, it can detect the position of a cutting line in the state which does not generate|occur|produce deflection of the optical film laminated body PL.

In the present embodiment, the cutting line detection unit 30 preferably uses the imaging means 32 as shown in FIG. 2 , but it is not limited to this, for example, edge sensing such as laser type and ultrasonic type may be used. The imaging means 32 can use a camera and illumination to capture an image of a predetermined range of the portion where the cutting line CL2 is formed. The predetermined range captured by the imaging means 32 is not limited as long as correction information for correcting the formation position of the next cutting line CL1 can be generated based on the position of the already formed cutting line CL2. The predetermined range can be appropriately set according to correction information to be generated, such as a range including only the dicing line CL2 or a range including the dicing line CL2 and one side edge of the optical film laminate PL.

[Cutting line forming method] Next, the dicing line forming method using the dicing line forming apparatus 1 according to one embodiment of the present invention will be described. FIG. 3 is a schematic flowchart showing a process of forming a dicing line by the dicing line forming apparatus 1 .

The process of forming a dicing line by the dicing line forming apparatus 1 is started by taking out the optical film layered body PL from the roll R of the optical film layered body PL (s1). The unwound optical film laminate PL is conveyed in the D1 direction shown in FIG. 1 , and is conveyed to the dicing line forming apparatus 1 ( s2 ) via, for example, the speed adjusting means S or the like.

In the dicing line forming apparatus 1, a dicing line CL2 (s3) having a depth from the surface on the opposite side of the carrier film C to at least the surface of the adhesive layer A is formed on the optical film laminate PL fed in ). The optical film laminate PL having the cut line CL2 formed thereon is further conveyed in the direction d1 in FIG. 2 , and the conveying direction is changed at a predetermined angle θ from the direction parallel to the horizontal plane by the support roller 22 located on the downstream side, and in the In this embodiment, it is conveyed in the d2 direction of FIG. 2 (s4). The portion where the cut line CL2 is formed reaches the cut line detection part 30 arranged on the downstream side of the support roller 22 (s5).

In addition, the optical film layered body PL after the dicing line CL2 is formed by the dicing line forming portion 10 is at the position where the optical film layered body PL comes into contact with the last in the dicing line forming portion 10 (the most downstream portion of the pedestal 13 ). It is preferable that it is conveyed without contacting other members with the position of the first contact with the backup roller 22 (the distance L between this is preferably 100 mm or more and 850 mm or less). Moreover, it is preferable to convey the optical film laminated body PL after changing the conveyance direction by the support roller 22, and its conveyance direction d2 with respect to the direction parallel to the horizontal plane is conveyed at an angle close to 90°. However, the angle θ is not limited to 90°, and the optical film laminate PL after changing the conveying direction may be 60° or more and 120° or less with respect to the direction parallel to the horizontal plane according to the necessity of the configuration of the apparatus, etc. angle for transport.

Next, the cutting line CL2 is detected by the imaging means 32 of the cutting line detection part 30 (s6). The cutting line CL2 is detected, for example, by searching for the brightness of the entire acquired image and identifying a place with a large contrast difference as a line. Check the deviation between the position where the detected cutting line CL2 is formed and the preset cutting line forming reference position (s7), and if there is a deviation, according to the correction information generated based on the calculated deviation, The support portion 17 of the dicing line forming portion 10 is moved in the longitudinal direction of the optical film laminate PL (s8). After adjusting the position of the circular blade 11 (that is, the formation position of the cutting line CL1 ) by moving the support portion 17 , the cutting line CL1 is formed ( s9 ). When there is no deviation between the position of the cutting line CL2 and the reference position, the cutting line CL1 can be formed without performing the process of s8 (s9). In addition, in this embodiment, although the formation position of the cutting line CL1 is adjusted by moving the support part 17, it is not limited to this, for example, the circular cutter 11 may be moved or a feed roller or the like may be used. The film driving means is used to adjust the way to change the unwinding amount of the optical film laminate.

When the above process is completed, the optical film laminate PL is transported again by a predetermined distance ( s10 ), and the processes s5 to s9 are repeated. In this way, the optical film sheet OP continuously formed on the optical film layered body PL (the film sheet defined between two adjacent dicing lines) can be conveyed to the lamination process with the panel member. Fits with panel components.

1: Cutting line forming device 10: Cutting line forming part 11: Round cutter 12: Drive Department 13: Pedestal 14: Press the member 15: 1st moving mechanism 16: 2nd moving mechanism 17: Support Department 20:Conveying direction change department 22: Support roller 30: Cutting line detection section 32: Camera means PL: Optical Film Laminate CL1, CL2: cutting lines

1 is a schematic side view showing a cutting line forming apparatus and a mechanism for forming cutting lines according to an embodiment of the present invention. [ Fig. 2] Fig. 2 is a schematic side view showing the configuration of a cutting line forming apparatus including a cutting line forming portion and a cutting line detecting portion according to an embodiment of the present invention. [ Fig. 3] Fig. 3 is a flowchart showing a process of forming a dicing line by the dicing line forming apparatus according to one embodiment of the present invention.

1: Cutting line forming device 10: Cutting line forming part 11: Round cutter 12: Drive Department 13: Pedestal 14: Press the member 15: 1st moving mechanism 16: 2nd moving mechanism 17: Support Department 20:Conveying direction change department 22: Support roller 30: Cutting line detection section 32: Camera means PL: Optical Film Laminate CL1: cutting line CL2: cutting line

Claims (8)

A dicing line forming device for forming an elongated reticulated optical film "comprising an elongated reticulated carrier film and an elongated reticulated optical film laminated on the carrier film through an adhesive layer" A laminate in which a dicing line extending in the width direction is continuously formed is characterized by comprising a dicing line forming portion for forming dicing from the surface opposite to the carrier film to the optical film laminate conveyed in the horizontal direction a line; a conveyance direction changing section arranged on the downstream side in the conveyance direction of the optical film laminate than the dicing line forming section, and changing the conveyance direction of the optical film laminate after the dicing line is formed at a predetermined angle; and The cut line detection unit is disposed on the downstream side in the conveyance direction of the optical film laminate than the conveyance direction changing unit, and detects a cut line formed in the optical film laminate. The dicing line forming apparatus according to claim 1, wherein a member contacting the optical film laminate is not disposed between the dicing line forming portion and the conveying direction changing portion. The cutting line forming apparatus according to claim 1 or 2, wherein the predetermined angle is not less than 60° and not more than 120°. The dicing line forming apparatus according to claim 1 or 2, wherein the distance between the dicing line forming portion and the conveying direction changing portion is 100 mm or more and 850 mm or less. A method for forming a dicing line for forming an elongated mesh optical film "comprising an elongated mesh carrier film and an elongated mesh optical film laminated on the carrier film through an adhesive layer" A laminate in which a dicing line extending in the width direction is continuously formed, comprising: a dicing line forming step of forming a dicing line from the surface opposite to the carrier film to the optical film laminate conveyed in the horizontal direction line; a conveying direction changing step of changing the conveying direction of the optical film laminate after the dicing line is formed by a predetermined angle on the downstream side in the conveying direction of the optical film laminate from the position where the dicing line is formed; and dicing The line detection step detects the cut line formed in the optical film laminate on the downstream side in the conveyance direction of the optical film laminate from the position where the conveyance direction is changed. The dicing line forming method according to claim 5, wherein the optical film laminate after the dicing line forming step is completed is conveyed to the conveying direction changing section without contacting any member. The cutting line forming method according to claim 5 or 6, wherein the predetermined angle is not less than 60° and not more than 120°. The dicing line forming method according to claim 5 or 6, wherein the changing of the conveying direction in the conveying direction changing step is performed at a position where the optical film laminate is conveyed 100 mm or more and 850 mm or less after the dicing line forming step. conduct.

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