TWI668061B - Foreign body removal device - Google Patents

Abstract

The present invention improves the cleanliness of the surface of the plate-shaped member being conveyed.

The present invention is a foreign matter removing device 100 including a rectangular parallelepiped cleaning head 20 including a slit 23 that sprays air on the surface of a substrate 13 conveyed in the X direction, and a rectangle that is disposed adjacent to the slit 23. Shaped suction port 24; and a driving portion 30 that moves the cleaning head 20 along the surface of the substrate 13 in the Y direction; and removes foreign matter on the surface of the substrate 13 so that the front surface 21a of the cleaning head 20 faces from the Y direction toward The inclination angle θ 1 is opposite to the conveying direction.

Description

Foreign body removal device

The present invention relates to a foreign material removing device, and more particularly to a structure of a foreign material removing device for removing foreign materials on the surface of a flat plate-shaped member such as a substrate to be transported.

In the manufacturing steps of electronic components such as ICs, a wire bonding device is used for bonding a semiconductor wafer cut out from a wafer to a substrate, and a wire bonding device for bonding the electrodes of the semiconductor wafer and the electrodes of the substrate by wires to the substrate. A plurality of devices, such as a flip chip mounting device, are formed in advance on the electrodes of the semiconductor wafer, the semiconductor wafer is inverted and fixed to the substrate, and the electrodes of the semiconductor wafer and the electrodes of the substrate are connected. Recently, a bonding apparatus for laminating and bonding a semiconductor wafer to a semiconductor wafer of a wafer has also been used.

In such a bonding device, a substrate or the like is transferred in one direction by a transfer device, while a semiconductor wafer is bonded to a basic specific position, or a substrate on which a semiconductor wafer is fixed on a surface is mounted, and electrodes of the semiconductor wafer and The electrodes of the substrate are connected by wires.

In such a device, if foreign matter such as dust adheres to the surface of a substrate or the like, the adhesive force of the adhesive may decrease. Moreover, if dust adheres to the surface of the electrode of a board | substrate or the electrode of a semiconductor wafer, a crack etc. may arise in a semiconductor wafer.

Therefore, a device has been proposed in which air is blown onto a substrate, and foreign matter adhering to the substrate is blown away, and the foreign matter that is blown away is sucked and recovered to remove the foreign matter (for example, refer to Patent Document 1).

[Prior technical literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2012-199458

The foreign material removing device described in Patent Document 1 is a person who moves a cleaning nozzle on a substrate moving in a conveying direction in a direction orthogonal to the substrate conveying direction to remove the foreign material on the surface of the substrate. In other words, when the substrate with the foreign matter passes through the moving area of the cleaning nozzle, the foreign matter on the surface of the substrate is removed, and the surface of the substrate on the downstream side in the conveying direction of the cleaning nozzle is clean.

However, in the cleaning nozzle of the conventional technology described in Patent Document 1, the air blown out from the air blowout port located on the downstream side of the conveyance direction may adhere to the air blowout ports arranged in a row in the conveyance direction. Foreign matter on the substrate is blown to the downstream side in the conveying direction. In this case, there is a case where foreign matter adheres to the substrate on the downstream side in the conveying direction that was once in a clean state, and the surface of the substrate cannot be sufficiently cleaned.

Therefore, an object of the present invention is to improve the cleanliness of the surface of a flat plate member to be conveyed.

The foreign matter removing device of the present invention includes a rectangular parallelepiped-shaped cleaning head including an ejection port for ejecting air in a band shape on a surface of a flat plate member conveyed in a horizontal direction, and a rectangular-shaped suction port arranged adjacent to the ejection port; And a driving unit that moves the cleaning head along the surface of the flat plate-shaped member in a direction orthogonal to the conveying direction; and removes foreign matter on the surface of the flat plate-shaped member, and the foreign matter removing device is characterized by the long side direction of the cleaning head The suction port side end surface is inclined from a direction orthogonal to the conveyance direction toward a direction opposite to the conveyance direction.

In the foreign matter removing device of the present invention, it is preferable that the ejection port is inclined with respect to the surface of the flat plate member and ejects air in a direction toward the suction port.

In the foreign matter removing device of the present invention, it is preferable that the ejection port is a linear slit.

In the foreign matter removing device of the present invention, it is preferable that the ejection ports are linearly arranged in a row of holes.

In the foreign matter removing device of the present invention, it is preferable that the length in the longitudinal direction of the suction port is longer than the length in the longitudinal direction of the ejection port.

In the foreign matter removing device of the present invention, it is preferable that the driving unit moves the cleaning head to a length set in accordance with a width in a direction orthogonal to the conveying direction of the flat plate-shaped member.

The present invention can improve the cleanliness of the surface of the plate-shaped member being conveyed.

11, 12‧‧‧ rail

13‧‧‧ substrate

20, 120‧‧‧Cleaning head

21, 121‧‧‧ Ontology

21a, 121a‧‧‧ front surface

21b, 121b‧‧‧ rear surface

22‧‧‧ cover

22a‧‧‧ flange

22b‧‧‧inclined

23‧‧‧Slit

24‧‧‧ Suction port

25‧‧‧Air inlet

26‧‧‧ Suction connection tube

27‧‧‧ connecting member

28‧‧‧ arm

29, 41‧‧‧jet head

29a‧‧‧concave

29b‧‧‧inclined

30‧‧‧Driver

42, 43‧‧‧ jet holes

91, 92‧‧‧ arrows

100, 200, 300‧‧‧‧ foreign matter removing device

A ~ C‧‧‧Area

FIG. 1 is a perspective view showing a foreign material removing device in an embodiment of the present invention.

FIG. 2 is a sectional view of a cleaning head of the foreign matter removing device shown in FIG. 1. FIG.

FIG. 3 is an explanatory perspective view showing the structure of the body and the cover of the cleaning head of the foreign matter removing device shown in FIG. 1 and the assembly with the cover to the body.

FIG. 4 is a diagram showing the suction port and the lower surface of the slit provided with the cleaning head shown in FIG. 1 as viewed from above, and is an explanatory view showing the operation of the foreign matter removing device according to the embodiment of the present invention.

Fig. 5 is a cross-sectional view of a cleaning head of a foreign material removing device according to another embodiment of the present invention.

FIG. 6 is a diagram illustrating the lower surface of the suction port and the ejection hole provided with the cleaning head shown in FIG. 5 as viewed from above, and is an explanatory view showing the operation of the foreign matter removing device according to another embodiment of the present invention.

Fig. 7 is a cross-sectional view of a cleaning head of a foreign matter removing device according to another embodiment of the present invention.

Hereinafter, the foreign matter removing apparatus 100 according to the embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, the foreign material removing device 100 includes a cleaning head 20 and a driving unit 30 that moves the cleaning head 20 in a direction orthogonal to the conveying direction. In FIG. 1, the conveying direction of the flat plate-like member that is guided by the guide rails 11 and 12 and is conveyed in the horizontal direction is the X direction, and the direction that is the same as the X direction and orthogonal to the X direction is set as In the Y direction, the direction perpendicular to the XY plane will be described as the Z direction.

As shown in FIG. 1, the cleaning head 20 is in the shape of a rectangular parallelepiped with a cover 22 mounted on the rear surface 21 b of the body 21, and an air inlet 25 for compressed air for removing foreign matter is mounted on the upper part, and a vacuum pump connected to a vacuum device (not shown) is installed. Suction connection tube 26. On the lower surface of the cleaning head 20, a slit 23, which is an ejection port for ejecting air in a band shape on the surface of the substrate 13, and a rectangular suction port 24 arranged adjacent to the slit 23 are provided. Moreover, in the following description, the longitudinal direction of the body 21 The front surface 21a of the main body 21 is the side where the suction port 24 exists and the direction perpendicular to the front surface 21a of the main body 21 is set to the P direction, the horizontal direction perpendicular to the P direction is set to the Q direction, and the PQ surface is leaded. The vertical direction will be described as the Z direction. The Q direction is a direction parallel to the surface of the main body 21 in a plan view. In addition, the description will be made assuming that the facing surface of the front surface 21a is the rear surface 21b and the surface in the short side direction is the side surface.

As shown in FIG. 1, one side of the cleaning head 20 is connected to the arm 28 via a wedge-shaped connecting member 27. The arm 28 is reciprocated in the Y direction by the driving unit 30. As shown in FIG. 2, there is a gap d between the surface of the substrate 13 and the lower surface of the cleaning head 20. The lower surface of the cleaning head 20 is moved on the upper side of the substrate 13 along the surface of the substrate 13. As shown in FIG. 1, the connecting member 27 has an inclination of an angle θ 1, and a side surface of the cleaning head 20 having a rectangular parallelepiped is fixed on one side, and a surface of an arm 28 extending in the Y direction is fixed on the opposite side. Therefore, as shown in FIG. 1, the front surface 21 a of the cleaning head 20 is inclined by an angle θ 1 from the Y direction toward a direction opposite to the conveying direction. Here, the angle θ 1 may be, for example, about 10 to 15 degrees, or may be about 15 to 45 degrees. The angle θ 1 is specifically 10, 11, 12, 13, 14, and 15 degrees, and may be a range between any two of these values. Further, the angle θ 1 is specifically a range of a positive integer of 15 to 45, and may also be a range between any two of these values.

Next, the structure of the cleaning head 20 of the foreign matter removing device 100 according to this embodiment will be described with reference to FIGS. 2, 3 (a), and 3 (b). As shown in FIGS. 2, 3 (a), and 3 (b), the cleaning head 20 includes a main body 21 and a cover 22 fixed to a rear surface 21 b of the main body 21.

As shown in FIG. 3 (a), a rectangular suction port 24 is dug into the lower surface of the body 21. Further, on the rear surface 21b of the main body 21, there is formed an ejection head holder 29 which will be described later. The recess 29a. The lower side of the recessed portion 29 a is an inclined surface 29 b that is inclined toward the suction port 24.

As shown in FIG. 3 (b), the cover 22 includes: a flange 22a, which is in close contact with the flat portion other than the recessed portion 29a of the rear surface 21b of the body 21; and a wedge-shaped inclined portion 22b, which is parallel to the inclined surface 29b of the body 21 . As shown in FIG. 3 (b), if the inclined portion 22b of the cover 22 is combined with the inclined surface 29b of the body and the flange 22a is screwed to the rear surface 21b, as shown in FIG. 2, the concave portion 29a of the body 21 and Between the flanges 22a of the cover 22, an ejection head base 29 extending linearly in the Q direction is formed. A slit 23 is formed between the inclined surface 29 b of the main body 21 and the inclined portion 22 b of the cover 22 to spray the air toward the surface of the substrate 13. As shown in FIG. 2, the slit 23 is inclined at an angle θ 2 with respect to the surface of the substrate 13. As shown in FIG. 4, the length in the Q direction of the suction port 24 is longer than the length in the Q direction of the slit 23, and extends until the slit 23 is closer to both sides of the cleaning head 20. 4 is a view of the lower surface of the suction port 24 and the slit 23 provided with the cleaning head 20 as viewed from above.

The operation of the foreign matter removing device 100 configured as described above will be described with reference to FIGS. 2 and 4. Compressed air flowing from the air inlet 25 shown in FIG. 2 enters the head holder 29, and is ejected in a strip shape from the head holder 29 through the slit 23 toward the suction port 24 toward the obliquely downward direction toward the surface of the substrate 13. .

The air sprayed obliquely downward from the surface of the slit 23 toward the substrate 13 moves toward the P direction inclined from the slit 23 in a direction opposite to the conveying direction as shown by arrow 91 in FIG. 4 and collides with the surface of the substrate 13. Then, the foreign matter adhering to the surface of the substrate 13 is blown away toward the P direction. The blown foreign matter is sucked into a rectangular suction port 24 adjacent to the P-direction side of the slit 23 and discharged to a vacuum device (not shown). If the driving unit 30 causes the cleaning head 20 to move back and forth in the Y direction by the width of the substrate 13, the area B of the substrate 13 shown in FIG. 4 that the cleaning head 20 passes through Foreign matter is removed. In addition, the area A on the downstream side in the conveying direction of the area B shown in FIG. 4 is the area where the foreign matter removal on the surface of the substrate 13 has been completed, and the area C on the upstream side in the conveying direction of the area B is the foreign material removal on the surface of the substrate 13 has not been performed. Area.

When removing the foreign matter in the area B of the substrate 13, the air ejected from the slit 23 is blown from the Y direction toward the P direction which is inclined in the direction opposite to the conveying direction. That is, air is blown from the area B toward the area C where the foreign matter on the substrate 13 is not removed. Therefore, foreign matter is not blown away by the sprayed air in the direction of the area A where the removal of the foreign matter is completed, and foreign matter can be prevented from adhering to the surface of the substrate 13 in the area A where the removal of the foreign matter is completed, thereby improving the cleanliness of the substrate 13.

As shown in FIG. 4, the length in the Q direction of the suction port 24 is longer than the length in the Q direction of the slit 23, and extends until the slit 23 is closer to both sides of the cleaning head 20. Therefore, even when the foreign object is blown away from the Y direction toward the X direction by the air ejected from the slit 23, the blown foreign object can be reliably sucked through the suction port 24. . Therefore, re-adhesion of foreign matter to the surface of the substrate 13 in the region A where the removal of the foreign matter is suppressed can be suppressed, and the cleanliness of the substrate 13 can be improved.

Furthermore, when blowing air from the slit 23, the air draws in the air on the side of the cover 22 of the cleaning head 20 and flows toward the suction port 24. Therefore, it is possible to suppress the air on the surface of the region A where the removal of the foreign matter in the region adjacent to the region B is sucked toward the suction port 24 and the foreign matter is scattered from the region B to the region A. Thereby, the foreign matter can be prevented from re-adhering to the surface of the substrate 13 in the region A where the removal of the foreign matter is completed, and the cleanliness of the substrate 13 can be improved.

In addition, the reciprocating movement of the cleaning head 20 in the Y direction may be performed simultaneously with the conveyance of the substrate 13, or the reciprocating movement of the cleaning head 20 may be temporarily stopped by the conveyance of the substrate 13. When the width in the Y direction of the substrate 13 is changed, the Y of the cleaning head 20 may be changed. The length of the reciprocating movement in the direction is set to a length set in accordance with the width in the Y direction of the substrate 13. With this, the foreign object removing device 100 of this embodiment can change the length of the Y-direction reciprocating movement of the cleaning head 20 to remove foreign objects of the substrate 13 having a plurality of Y-direction widths.

Next, referring to Figs. 5 and 6, another embodiment of the present invention will be described. The same parts as those described above with reference to FIGS. 1 to 4 are denoted by the same reference numerals, and description thereof will be omitted. As shown in FIG. 5 and FIG. 6, the foreign material removing device 200 of the present embodiment is configured by forming the slits 23 of the cleaning head 20 of the foreign material removing device 100 described above as rows of linearly arranged spray holes 42. .

As shown in FIG. 5, the body 121 of the cleaning head 120 of the foreign matter removing device 200 according to this embodiment includes a suction port 24 that is dug in from the lower side and a jet head holder 41 that is dug in from the upper side. A suction connection pipe 26 is installed above the suction port 24 and an air inlet 25 is installed above the ejection head seat 41. A spray hole 42 is formed in a portion adjacent to the suction port 24 on the lower surface of the main body 121 and penetrates to the spray head holder 41. The injection hole 42 is opened obliquely so that the angle with respect to the surface of the substrate 13 becomes θ 2. As shown in FIG. 4, the ejection holes 42 constitute a row of holes adjacent to the suction port 24 and aligned in a row in the Q direction.

Compressed air flowing from the air inlet 25 shown in FIG. 5 enters the head holder 41, and the head holder 41 passes through a plurality of injection holes 42 toward the suction port 24, and is slanted downward toward the surface of the substrate 13 and Squirting like a spit.

The air sprayed obliquely downward from the surface of the ejection hole 42 toward the substrate 13 advances toward the P direction inclined from the ejection hole 42 in a direction opposite to the conveying direction as shown by arrow 92 in FIG. 6 and collides with the surface of the substrate 13. Then, the foreign matter adhering to the surface of the substrate 13 is blown away toward the P direction. The blown-off foreign object is a rectangular suction port adjacent to the P-direction side of the injection hole 42 24 Suction and discharge to a vacuum device (not shown). When the driving unit 30 causes the cleaning head 20 to reciprocate the width of the substrate 13 in the Y direction, the foreign matter in the region B of the substrate 13 shown in FIG. 6 passing through the cleaning head 20 is removed. In addition, the area A on the downstream side in the conveyance direction of the area B shown in FIG. 6 is the area where the foreign matter removal on the surface of the substrate 13 has been completed, and the area C on the upstream side in the conveyance direction of the area B is the foreign material removal on the substrate 13 Area.

When foreign matter is removed from the surface of the substrate 13 in the area B, the air ejected from the ejection holes 42 is blown toward the P direction which is inclined from the Y direction to the direction opposite to the conveyance direction. That is, air is blown from the area B toward the area C where the foreign matter on the substrate 13 is not removed. Therefore, the foreign matter is not blown away by the sprayed air in the direction of the area A where the removal of the foreign matter is completed, and it is possible to suppress the foreign matter from adhering to the surface of the substrate 13 in the area A where the removal of the foreign matter is completed, thereby improving the cleanness of the substrate 13.

As shown in FIG. 6, the length in the Q direction of the suction port 24 is longer than the length in the Q direction of the row of the ejection holes 42 and extends to the vicinity of both sides of the cleaning head 120 with respect to the ejection holes 42. Therefore, even when the foreign object is blown away from the Y direction toward the X direction by the air ejected from the injection hole 42, the blown foreign object can be reliably sucked through the suction port 24. . Thereby, it is possible to suppress foreign matter from re-adhering to the surface of the substrate 13 in the region A where the removal of the foreign matter is completed, and to improve the cleanliness of the substrate 13.

Further, when blowing air from the spray holes 42, the air entrains the air on the rear surface 121 b side of the cleaning head 120 and flows toward the suction port 24. Therefore, it is possible to suppress the air on the surface of the region A where the removal of the foreign matter in the region adjacent to the region B is sucked toward the suction port 24 and the foreign matter is scattered from the region B to the region A. Thereby, the foreign matter can be prevented from re-adhering to the surface of the substrate 13 in the region A where the removal of the foreign matter is completed, and the cleanliness of the substrate 13 can be improved.

Next, referring to Fig. 7, another embodiment of the present invention will be described. The same components as those described above with reference to FIGS. 1 to 6 are denoted by the same reference numerals, and description thereof will be omitted. As shown in FIG. 7, the foreign material removing device 300 of this embodiment is constituted by setting the ejection holes 42 of the cleaning head 120 of the foreign object removing device 200 described above as vertical ejection holes 43.

The foreign material removing device 300 of this embodiment is also the same as the foreign material removing device 200 described above, and the air ejected from the injection hole 43 is blown in the P direction which is inclined in the direction opposite to the conveying direction. That is, air is blown from the area B toward the area C where the foreign matter on the substrate 13 is not removed. Therefore, the foreign matter is not blown away by the sprayed air in the direction of the area A where the removal of the foreign matter is completed, and it is possible to suppress the foreign matter from adhering to the surface of the substrate 13 in the area A where the removal of the foreign matter is completed, thereby improving the cleanness of the substrate 13. In addition, the length in the Q direction of the suction port 24 is longer than the length in the Q direction of the holes of the ejection holes 43 and extends to the vicinity of both sides of the cleaning head 120 with respect to the ejection holes 43. Therefore, even when the foreign object is blown away from the Y direction toward the X direction by the air ejected from the ejection hole 43, the blown foreign object can be reliably sucked through the suction port 24. . Thereby, it is possible to suppress foreign matter from re-adhering to the surface of the substrate 13 in the region A where the removal of the foreign matter is completed, and to improve the cleanliness of the substrate 13.

In each of the embodiments described above, an example has been described in which the plate-like member of the substrate 13 is transported. However, the foreign material removing devices 100, 200, and 300 of this embodiment can also be applied to, for example, semiconductor wafers or substrates. When a lead frame or the like of a semiconductor wafer is bonded. In addition, the foreign material removing apparatuses 100, 200, and 300 of each embodiment may be incorporated into, for example, an electronic component mounting apparatus such as a wafer bonding apparatus, a wire bonding apparatus, or a flip chip mounting apparatus. Furthermore, the foreign material removing apparatuses 100, 200, and 300 of this embodiment can also be applied to, for example, conveying glass and film. Remove foreign matter on the surface of the plate-like member when waiting.

Claims (5)

A foreign matter removing device includes a rectangular parallelepiped cleaning head including a spraying port that sprays air on a surface of a flat plate-shaped member conveyed in a horizontal direction, and a rectangular suction port disposed adjacent to the spraying port. And a driving unit that moves the cleaning head along the surface of the flat plate-shaped member in a direction orthogonal to the conveying direction; removes foreign matter on the surface of the flat plate-shaped member; and suctions the long side direction of the cleaning head. The mouth-side end surface is slightly inclined from a direction orthogonal to the conveying direction to a direction opposite to the conveying direction; the suction port is opened toward the surface of the flat plate-shaped member; the ejection port is only adjacent to the length on the conveying direction side The suction port side end surface in the lateral direction is arranged, and is slightly inclined toward the suction port with respect to the surface of the flat plate-shaped member. For example, the foreign matter removing device according to item 1 of the scope of patent application, wherein the above-mentioned ejection port is a linear slit. For example, the foreign matter removing device according to item 1 of the scope of the patent application, wherein the above-mentioned ejection port is a row of linearly arranged holes. For example, the foreign object removing device according to any one of claims 1 to 3, wherein the length in the long-side direction of the suction port is longer than the length in the long-side direction of the ejection port. For example, the foreign object removing device according to the first patent application range, wherein the driving unit moves the cleaning head to a length set in accordance with a width in a direction orthogonal to the conveying direction of the flat plate-shaped member.