TWI666741B - Package member, package substrate packaged with the package member, and manufacturing method thereof - Google Patents

Abstract

A packaging member 11 having a film-like or tray-like shape and at least a peripheral portion 13 containing a thermoplastic resin (copolymerized polyamine resin, etc.) covers the sealed area of the device 1; and inside the sealed area, With the package member 11 and the mounting members 3 a to 3 c of the device 1 in a free form, the peripheral edge portion 13 of the package member 11 and the substrate 2 of the device 1 are heat-bonded to manufacture the packaged area of the device 1 with the package member 11 covered. Packaged device. The copolymerized polyamidoamine-based resin may include a unit derived from a long-chain component having a C _8-16 alkylene group (such as a C _9-17 aminoamine and an amine C _9-17 alkanecarboxylic acid). This packaging member is a prescribed portion that can be selectively and efficiently packaged to protect the device.

Description

Package member, package substrate packaged with the package member, and manufacturing method thereof

The present invention relates to a packaging substrate that is useful for covering and packaging a substrate on which a component (electronic component, etc.) is mounted, and a packaging substrate that is encapsulated by the packaging component, and a method of manufacturing the same.

In order to protect against moisture, dirt, etc., precision components (or electronic devices) such as printed boards, semiconductor elements, and solar cells are placed in the mold cavity, and fluid resin is injected, and the precision components are encapsulated with resin.

As a representative method, a thermosetting resin (for example, epoxy resin) having low viscosity and high fluidity is used. However, because thermosetting resins are added with additives such as cross-linking agents or hardeners for hardening, it is considered that the quality control system of thermosetting resins is not only difficult due to the relationship with the working life, but also for the curing reaction. , And usually must be as long as several hours.

A method of injection molding a thermoplastic resin to encapsulate (or protect) a precision part is also known. However, as the package area becomes larger, the resin is required to have higher fluidity. Therefore, the molding conditions have to be set to higher temperatures and pressures, and the mounted precision parts may be damaged by heat or pressure. Japanese Patent Application Laid-Open No. 2000-133665 (Patent Document 1) discloses a method in which a printed circuit board on which electronic components are mounted in a mold cavity is heated, and a polyamide resin which is heated to 160 to 230 ° C. and melted is 2.5 A pressure of ~ 25 kg / cm ² is injected into the aforementioned mold cavity to package a printed substrate on which electronic components are mounted. The examples in this document describe that a polyimide resin is injected into a mold at a melting temperature of 190 ° C and a pressure of 20 kg / cm ² to encapsulate a printed circuit board. However, in this method, relatively high temperature and high pressure are applied to the electronic components, so the electronic components may be damaged. In particular, as the package area becomes larger, molding conditions at higher temperatures and pressures must be required, and the possibility of damage to electronic components becomes higher.

In addition, if the resin cannot be completely filled into each corner of the precision part, and small pores are generated, the electronic circuit may be corroded or short-circuited due to the influence of resin additives or low molecular weight components.

Furthermore, due to the expansion and contraction stress of the resin under the use conditions, there may be cases where fine cracks occur in the soldered portion where the electronic component is fixed to the substrate, and damage is caused. In this way, if the soldered portion is damaged, a failure of the electronic device may occur. In this way, the contact between the resin and the electronic component or its terminal, or incomplete packaging, may also be one of the causes of the metal whisker generated by the terminal of the electronic component, which has become a problem in recent years.

In order to avoid the adverse effects of heat or pressure during injection molding, there is also a proposal for powdering the resin and packaging it with powder. However, if powder is used, the aforementioned pores are more likely to be generated than in the case of injection molding, and damage to the welded portion due to the expansion and contraction stress of the resin is not removed. In addition, the powder is easily scattered, and it is difficult to efficiently package the desired place.

On the other hand, a method of packaging using a thin film has also been proposed. The condition of the thin film is to avoid the adverse effects of heat and pressure during injection molding, and to solve the problem of damage to the welded part due to its thin shape. Japanese Patent Application Laid-Open No. 2001-284779 (Patent Document 2) discloses that a circuit substrate including electronic components is inserted into a cylindrical film, and the openings on both sides of the cylindrical film are closed to package the circuit substrate. , A method of covering a region including the electronic component with a sheet film, a method of covering the front and back surfaces of the circuit board with two sheet films, and a method of wrapping the circuit board with the sheet film A method for forming an electronic circuit; it is also described that the film is covered with a softened film which is heated in advance, and the pressure between the film and the substrate is reduced to make the film conform to the component or the substrate. Japanese Patent Application Laid-Open No. 11-259021 (Patent Document 3) discloses a liquid crystal display panel member formed by coating and laminating a liquid crystal display panel member including a plurality of liquid crystal display panel members with a thin film. Polyamines are exemplified. However, these methods cannot protect or not protect only a specific part of the electronic device. For example, when an electronic device has a connector type that needs to be detached, even this connector portion is bundled. Therefore, the connector cannot be used as a component of a motor / electronic product, and it is not practical because it has no meaning of an electronic device. In addition, due to uneven contact with the mounted electronic components, etc., problems such as corrosion or short circuit of the electronic circuit still remain. Further, with the packaging of the thin film, it is a technical focus how to conform the thin film to the unevenness on the surface of the electronic device. Therefore, although vacuum forming is proposed, it is technically difficult to protect only a specific portion of the substrate by vacuum forming. And, with the base After the composite of the plates is completed, it is necessary to remove the outer edges of the unnecessary films.

In addition, Japanese Patent Application Laid-Open No. 2008-282906 (Patent Document 4) discloses a method for manufacturing a solar battery module in which a solar battery cell is encapsulated between a substrate and a film with a resin, and discloses that the substrate and the solar battery are A first encapsulating resin sheet covering substantially the entire surface of the substrate is disposed between the cells, and a second encapsulating resin sheet covering the substantially entire surface of the substrate is disposed between the film and the solar cell unit to produce a laminate and laminated A plurality of the laminated bodies and abutment plates are arranged on the outer side of the thin film of the uppermost laminated body, and the air between the substrate and the thin film is exhausted, and the resin is melted and cooled by heating to be sealed; the sealing resin is also described It is a resin selected from the group consisting of an ethylene-vinyl acetate copolymer, polyvinyl butyral, and polyurethane.

Furthermore, Japanese Patent Application Laid-Open No. 2009-99417 (Patent Document 5) discloses an organic electronic device packaging panel including a barrier film that encapsulates an organic electronic device formed on a substrate, and the organic electronic device and the foregoing A hot-melt type member is arranged between the barrier films, and it is described that the hot-melt type member is a thin film having a moisture trapping agent and wax, and the hot-melt type member has a thickness of 100 μm or less. Also, Japanese Patent Application Laid-Open No. 2009-99805 (Patent Document 6) discloses a hot-melt type member (a thin film, a plate, and an irregular shape) for an organic thin-film solar cell including a moisture trapping agent and a wax. ).

However, any of the technologies using these thin film encapsulants uses encapsulants to seal the parts or protected parts of electronic devices. This technology is based on the premise of close contact between areas. Therefore, such a method potentially or apparently has various problems that occur due to the close contact between the electronic device and the encapsulant, such as the effects on the encapsulated part or the protected area due to the expansion / contraction stress of the encapsulant. Adverse effects, problems caused by unintended pores or incomplete contact.

Japanese Patent Application Laid-Open No. 2012-87292 (Patent Document 7) describes that at least a part of the device is covered with a film-shaped encapsulant containing a copolymerized polyamine resin, the encapsulant is heated and melted and cooled, and the device is covered and sealed. . This thin film encapsulant has high compliance to the uneven portions of the device, prevents the generation of voids, and tightly encapsulates the details of the device. However, the technology of this patent document 7 is also a technology for encapsulating and protecting an electronic device and a sealing agent in a form in which the sealing agent is in close contact. Therefore, as in the foregoing, the method described in Patent Document 7 potentially or apparently has various problems that occur due to the close contact between the electronic device and the encapsulant, for example, due to the expansion / contraction stress of the encapsulant to the package to be encapsulated. The adverse effects of the site or the protected area, caused by unintended pores or incomplete contact.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2000-133665 (Scope of patent application, examples)

[Patent Document 2] Japanese Patent Laid-Open No. 2001-284779 (Scope of patent application)

[Patent Document 3] Japanese Unexamined Patent Publication No. 11-259021 (patent application Range, [0022])

[Patent Document 4] Japanese Patent Laid-Open No. 2008-282906 (Scope of patent application)

[Patent Document 5] Japanese Patent Laid-Open No. 2009-99417 (Scope of patent application, [0024])

[Patent Document 6] Japanese Patent Laid-Open No. 2009-99805 (Scope of patent application)

[Patent Document 7] Japanese Patent Application Publication No. 2012-87292 (Scope of Patent Application)

An object of the present invention is to provide a packaging member capable of selectively and efficiently packaging and protecting a prescribed portion of a substrate (mounting substrate, device) provided with components (mounting components such as electronic components); and a packaging member by this The covered and packaged mounting substrate (protective substrate), and its manufacturing method.

Another object of the present invention is to provide a packaging member capable of packaging a substrate (mounting substrate, device) provided with components (mounting components such as electronic components) with high-density bonding, and even if the temperature changes under the use conditions. A mounting substrate and a soldering portion can be effectively protected; a mounting substrate (protective substrate) packaged by the packaging member, and a manufacturing method thereof.

Still another object of the present invention is to provide a packaging member which is excellent in productivity, does not damage the mounted electronic components even if the packaging and protection area is large, and can prevent electronic electricity. Corrosion or short circuit of a road; a mounting substrate (protective substrate) packaged by the packaging member, and a manufacturing method thereof.

Another object of the present invention is to provide a packaging member that does not require the removal of the outer edge portion of the film even if it has a film-like form; a mounting substrate covered with the packaging member and packaged, and its manufacturing method.

As mentioned above, any of the methods so far has been based on the recognition that if there is a void between the substrate and / or the component and the sealing resin, moisture and gas intrude and the sealing performance is reduced, so that the sealing can be performed. It is premised that the resin is tightly adhered to the component and / or the substrate, and is sealed without forming voids. However, in this method, the components, substrates, and soldering parts are closely adhered to the sealing resin, and the expansion / contraction stress of the sealing resin will directly act on the components and soldering parts, and there will be cracks or cracks in the soldering. Partially generated possibilities. Furthermore, it is inevitable that there is a danger that pores may be generated.

In order to achieve the results of the in-depth discussion of the aforementioned problems, the present inventors have adopted a concept that the packaged area of the mounting substrate is tightly and completely sealed in a tightly integrated manner in accordance with the so-called conforming resin to the shape of the component and the substrate. The invention related to Patent Document 7 was further developed to complete the present invention. That is, it has been found that if only the peripheral edge portion of a packaging member in a predetermined form such as a film is thermally adhered to a predetermined portion of the device (peripheral edge portion of the packaged area), the device is mounted so that the inner area of the packaging member self-mounts the component. Free form covering can not only prevent the occurrence of voids, but also effectively prevent thermal expansion / contraction stress from acting on the mounting portion The components and soldering parts are tightly packed with high-density bonding force and can effectively protect the mounting substrate.

In the packaging device of the present invention, the packaged area of the device is packaged with a packaging member. This packaging device has a film-like or tray-like configuration, and at least a peripheral portion of the packaging member includes a thermoplastic resin; the packaging member and the device's mounting components are in a free form, and the peripheral portion of the packaging member is connected to the device. That is, inside the packaged area of the device, the package member is separated from the device (including the circuit and mounting components) to form a free space; the peripheral edge portion of the package member and the substrate of the device are then sealed in the device. A peripheral portion of the region forms a package portion that encapsulates the packaged region.

The encapsulating member includes at least a peripheral edge portion thereof with a thermally adhesive thermoplastic resin (for example, a copolymerized polyamide resin), and may have a film-like or tray-like form. Furthermore, only the peripheral edge portion of the package member and the substrate of the device may be thermally bonded.

Furthermore, the film-shaped or tray-shaped packaging member may have a peripheral edge portion capable of being brought into line or surface contact with the substrate of the device, or may include a copolymerized polyamidamine resin having at least one of the following characteristics.

(1) The melting point or softening point is about 75 to 160 ° C (for example, the melting point is 90 to 160 ° C); (2) It has crystallinity; (3) It has crystallinity and has a melting point of about 90 to 160 ° C.

Further, the encapsulating member may be a multi-component copolymer, such as a copolymerized polyamine resin of a binary copolymer to a quaternary copolymer (such as a binary or terpolymer), and the copolymerized polyamine resin may also be used. With At least 1 unit below.

(a) a unit derived from a long-chain component having a C _8-16 alkylene (for example, C _10-14 alkylene) (b) derived from a group selected from C _9-17 lactam and amine C The unit (c) of at least one component of the _9-17 alkanecarboxylic acid is derived from the unit of at least one component selected from laurylamine, aminoundecanoic acid, and aminododecanoic acid.

Further, the encapsulation member is not limited to a single-layer structure and may have a laminated structure. For example, the encapsulation member may include: an encapsulating layer containing a copolymerized polyamine resin; The protective layer. The heat-resistant resin system may have a melting point or a softening point of 170 ° C. or higher, for example, and the heat-resistant resin system may be at least one selected from a polyester resin, a polyamide resin, and a fluororesin. The thickness (the overall thickness) of the packaging member may be, for example, about 10 to 1000 μm. The packaging member of the present invention can also be applied to both sides of a device, but is useful for applying to one side of a device.

The present invention also includes a method for manufacturing a packaging device. The packaging device is a device in which a packaged area is packaged with a packaging component. In this method, a packaging member having a film-like or tray-like form and containing a thermoplastic resin at least at the peripheral portion is used. Then, the package member system and the device mounting component are separated from each other inside the packaged area, and the peripheral portion of the package member and the substrate (peripheral edge portion of the packaged area) of the device are connected to manufacture the packaged area system of the device. A device that is covered and sealed with a packaging member.

In the above manufacturing method, at least The edge portion is a packaging member (a film-shaped or tray-shaped packaging member) containing a copolymerized polyamide resin to cover the sealed area of the device, and the peripheral edge portion of the packaging member and the substrate of the device are thermally bonded and cooled.

Further, the present invention also includes a packaging member for packaging a packaged area of the device. This packaging member is formed into a film shape or a tray shape, and a peripheral portion includes a thermoplastic resin. In addition, the package member includes an internal region for forming a free space not to be separated from the device and a peripheral portion (a peripheral portion adjacent to the internal region) that can be attached to the substrate of the device. This packaging member may include a peripheral edge portion (adhesion portion) capable of being thermally bonded (or thermally welded) to the substrate of the device, or may include at least the peripheral edge portion including a copolymerized polyurethane resin.

In addition, in the present specification, the "copolymerized polyamide resin" is not only a copolymer of a plurality of amidine-forming components (copolymerization) of amidine-forming components that form homopolyamines or different carbon numbers. Amine) is used to mean a mixture including a plurality of copolymers (copolyamides) of different types formed by a plurality of amidine forming components.

The term “device” means a functional component (electrical or electronic component) that is required to be protected by a package. It refers to a substrate that includes electronic components such as functional elements, an electrical circuit (including a semiconductor circuit), and a mounted component. A substrate (such as an electronic component such as a functional element), for example, a printed wiring board on which an electronic component is mounted or mounted. The "device" usually has a flat portion.

The so-called "free" means that it is not substantially attached to the device, and the package member of the free space can also be physically contacted with the substrate according to the components or needs of the device.

In the present invention, the device is packaged in a form in which the package member inside the packaged region of the device is released (forms a free space) from the device (circuits, components, etc.), and the peripheral portion of the package member is attached to the base substrate of the packaged region. , The mounting parts and soldered parts are not packaged with a molding resin molding. Therefore, a predetermined portion of the device can be selectively and efficiently packaged and protected. In particular, since the bonding area of the package member with respect to the substrate is small, the occurrence of voids can be suppressed, and even if the temperature changes under the use conditions, stress does not act on the mounting parts and the soldered parts. Therefore, while preventing corrosion or short circuit of the circuit, it can protect the mounting parts and soldered parts from damage. In addition, since at least the peripheral portion of the packaging member contains a thermoplastic resin (especially, a thermo-adhesive thermoplastic resin such as a copolymerized polyamide resin), the peripheral portion of the sealed region can be sealed with high adhesion. Furthermore, even if the packaged area (encapsulation and protection area) is large, it will not damage the mounted electronic components, and it can prevent corrosion or short circuit of the electronic circuit. In addition, it is not necessary to melt or vacuum-form the entire film-like or powder-like resin, and since the bonding area of the packaging member with respect to the substrate can be substantially reduced, the productivity of the packaging device can also be improved. Furthermore, since only a packaging member having a size suitable for the area to be packaged is used, the cutting operation of the outer edge portion of the film is not necessary. In addition, even if it is packaged in the above-mentioned form, the mounting member and the soldered portion can be effectively protected by moisture through the packaging member of the thermoplastic resin. As described above, the present invention can protect the device simply and reliably with high reliability and effectiveness.

1‧‧‧ device

2‧‧‧ substrate

3a ~ 3c‧‧‧Electronic components

11, 21‧‧‧ package components

12, 22a, 22b‧‧‧Storage recess

13, 23‧‧‧ Peripheral

15, 25a, 25b ‧‧‧ Free space

FIG. 1 is a schematic side view showing an example of a packaging device of the present invention.

FIG. 2 is a schematic side view showing another example of the packaging device of the present invention.

Fig. 3 is a schematic plan view showing a test substrate used in the examples.

[Form of Implementing Invention]

[Package component]

The packaging member for packaging the packaged area of the device includes at least a peripheral portion containing a thermoplastic resin. In the present invention, the peripheral portion (or outer edge portion) of the packaging member is connected to the substrate of the packaged area of the device. Therefore, even if heat is applied, the damage to the device due to heat is small, and without being limited to a packaging member having a low melting point or a softening point, a thermoplastic resin having a relatively high melting point or a high softening point can be used. Therefore, the type of the thermoplastic resin is not particularly limited, and various thermoplastic resins can be used. For example, olefin-based resins [low density, medium density or high density polyethylene, linear low density polyethylene, polyethylene, ethylene-propylene, etc. can be used. Polyethylene resins such as copolymers, ethylene- (meth) acrylic copolymers, ethylene- (meth) acrylate copolymers, ethylene-vinyl acetate copolymers, and ethylene-based copolymers of ethylene and copolymerizable monomers; Polypropylene resins such as polypropylene and propylene-ethylene copolymers; cyclic olefin resins such as ethylene-norbornene copolymers, etc.], acrylic resins, styrene resins, polyester resins (ethylene terephthalate Esters, butylene terephthalate and other copolymerized polyesters containing alkylene arylate units), polyamide resins (copolymerized polymers Amine-based resin, etc.). These thermoplastic resins can be used alone or in combination of two or more.

The preferred thermoplastic resin is a heat-adhesive thermoplastic resin that can be firmly adhered at a relatively low temperature when the packaging member is thermally adhered to the substrate. It is a copolymerized polyamide resin from the viewpoints of film strength, chemical resistance, film-forming properties, and adhesiveness (weldability) with a substrate. In addition, an encapsulation member system containing a copolymerized polyamide resin can improve the adhesion to the device, can provide the device with high impact resistance and abrasion resistance, and can improve the protection effect on the device. The copolymerized polyamide resin contains a copolymerized polyamide (thermoplastic copolymerized polyamide) and a polyamide elastomer.

The thermoplastic copolymerized polyamide can also be an alicyclic copolymerized polyamide, and is usually mostly an aliphatic copolymerized polyamide. It can be formed by copolymerizing a polyamidoamine-based combination of a diamine component, a dicarboxylic acid component, a lactam component, and an aminocarboxylic acid component. In addition, the components of both the diamine component and the dicarboxylic acid component can form a fluorene bond of the copolymerized polyfluorene, and the lactam component and the aminocarboxylic acid component can respectively form a fluorene of the copolymerized polyamine. key. Therefore, the copolymerized polyamidoamine can be prepared by co-selecting a plurality of amido-forming components selected from a pair of components (a combination of two components of a diamine component and a dicarboxylic acid component), a lactam component, and an aminocarboxylic acid component. Obtained by polymerization. In addition, the copolymerized polyamine can be made of at least one type of amide forming component selected from the aforementioned pair of components, a lactam component, and an aminocarboxylic acid component, and a different type (or the same kind) as the amide forming component. It is obtained by copolymerization of fluorene amine-forming components. The so-called lactam component and aminocarboxylic acid component, If the carbon number and the branched structure are the same, they can also be treated as equivalent components.

Therefore, if a pair of components in which a diamine component and a dicarboxylic acid component are combined is a first amine-forming component, and a lactam component and an aminocarboxylic acid component are a second amine-forming component, the polyfluorene is copolymerized. The amine may be, for example, a copolymerized polyamine formed from the first amine forming component, and a component of at least one of the diamine component and the dicarboxylic acid component is a copolymer including a plurality of components having different carbon numbers. Polyamide; a copolymer of polyamine that is a first amine-forming component and a second amine-forming component (at least one selected from the group consisting of a lactam component and an aminocarboxylic acid component); a second amine-forming component The copolymerized polyamidoamine formed from (at least one component selected from the group consisting of a lactam component and an amine carboxylic acid component) is a component of one of the lactam component and the amine carboxylic acid component which contains different carbon numbers Copolymerized polyamines of a plurality of components; copolymerized polyamines of an internal amine component and an amine carboxylic acid component having the same carbon number or different from each other.

Examples of the diamine component include an aliphatic diamine or an alkylene diamine component (for example, tetramethylene diamine, hexamethylene diamine, hexamethylene diamine, octanediamine, dodecane diamine). C _4-16 butanediamine, etc.) and so on. These diamine components can be used alone or in combination of two or more. The preferred diamine component comprises at least dialkylene diamine (preferably C _6-14 dialkylene diamine, more preferably C _6-12 dialkylene diamine).

In addition, if necessary, a cycloaliphatic diamine component (diamine cycloalkane such as diaminocyclohexane (diamine C _5-10 cycloalkane etc.) may be used in combination; bis (4-aminocyclohexyl) ) Bis (aminocycloalkyl) alkanes such as methane, bis (4-amino-3-methylcyclohexyl) methane, 2,2-bis (4'-aminocyclohexyl) propane [bis (aminoC _5-8 cycloalkyl) C _1-3 alkanes, etc .; hydrogenated xylylene diamine, etc.), aromatic diamine components (m-xylylenediamine, etc.) as diamine components. The diamine component (for example, an alicyclic diamine component) may have a substituent such as an alkyl group (C _1-4 alkyl group such as a methyl group and an ethyl group).

Relative to the overall diamine component, the proportion of the alkylene diamine component may be 50 to 100 mole%, preferably 60 to 100 mole% (for example, 70 to 97 mole%), and more preferably 75 to 100 mole%. Ear% (for example, 80 to 95 mole%).

Examples of the dicarboxylic acid component include an aliphatic dicarboxylic acid or an alkylenedicarboxylic acid component (for example, adipic acid, pimelic acid, azelaic acid, sebacic acid, dodecanedioic acid, dimer acid, or the like). Dicarboxylic acids such as hydrides with 4 to 36 carbon atoms or C _4-36 alkanedicarboxylic acids). These dicarboxylic acid components can be used alone or in combination of two or more. A preferred dicarboxylic acid component is a C _6-36 alkane dicarboxylic acid (for example, a C _6-16 alkane dicarboxylic acid, preferably a C _8-14 alkane dicarboxylic acid, etc.). Further, if necessary, a cycloaliphatic dicarboxylic acid component (C _5-10 cycloalkane-dicarboxylic acid such as cyclohexane-1,4-dicarboxylic acid, cyclohexane-1,3-dicarboxylic acid, etc.) may be used in combination. Acids, etc.), aromatic dicarboxylic acids (terephthalic acid, isophthalic acid, etc.). Furthermore, as the diamine component and the dicarboxylic acid component, it is known to use the aliphatic diamine component and / or fat together with the alicyclic diamine component and / or the alicyclic dicarboxylic acid component. The alicyclic polyfluorene resin obtained from the dicarboxylic acid component of the family, the so-called transparent polyamine, has high transparency.

Relative to the dicarboxylic acid component, the proportion of the alkyldicarboxylic acid component may be 50 to 100 mole%, preferably 60 to 100 mole% (for example, 70 to 97 mole%), and more preferably 75 to 100 mole%. Ear% (for example, 80 to 95 mole%).

The diamine component can be used in the range of 0.8 to 1.2 mol, and preferably about 0.9 to 1.1 mol, with respect to 1 mol of the dicarboxylic acid component.

Examples of the lactamamine component include, for example, δ-valprolactam, ε-caprolactam, ω-heptalactam, ω-caprylamine, ω-caprylamine, and ω-undecyl. C _4-20 Lactam and the like such as Lactamine, ω-Lauryl Lactamine (or ω-Laurinlactam), and the like; Examples of the amine carboxylic acid component include ω-amine C _6-20 aminocarboxylic acids, such as decanoic acid, ω-aminoundecanoic acid, and ω-aminododecanoic acid. These lactam components and aminocarboxylic acid components may be used alone or in combination of two or more.

The preferred composition of lactam is C _6-19 lactam, preferably C _8-17 lactam, and more preferably C _10-15 lactam (laurolactam, etc.). In addition, a preferred aminocarboxylic acid system includes an amine _C6-19 alkanecarboxylic acid, preferably an amine C _8-17 alkanecarboxylic acid, and more preferably an amine _C10-15 alkanecarboxylic acid ( _{aminoundecane).} Acid, aminododecanoic acid, etc.).

In addition, the copolymerized polyamine may be a modified polyamine such as polyamine having a branched structure, using a small amount of a polycarboxylic acid component and / or a polyamine component.

The first amine forming component (combining the two components of the diamine component and the dicarboxylic acid component) and the second amine forming component (at least one type of amine forming component selected from the group consisting of a lactam component and an aminocarboxylic acid component) The ratio (molar ratio) can be selected from the range of the former / the latter = 100/0 ~ 0/100, for example, it can be 90/10 ~ 0/100 (for example, 80/20 ~ 5/95), preferably 75/25 to 10/90 (for example, 70/30 to 15/85), and more preferably about 60/40 to 20/80.

Further, it is preferable that the copolymerized polyamidoamine system contains a long-chain component (or a unit derived from a long-chain component) having a long-chain fatty chain (long-chain alkylene or alkenyl group) as a constituent unit. As such a long-chain component, a component containing a long-chain fatty chain or an alkylene group having a carbon number of about 8 to 36 (preferably C _8-16 alkylene group, more preferably C _10-14 alkylene group) . Examples of the long-chain component include: selected from C _8-18 alkane dicarboxylic acid (preferably C _10-16 alkane dicarboxylic acid, more preferably C _10-14 alkane dicarboxylic acid, etc.), C _9-17 Lactam (preferably C _11-15 Lactamine, such as lauryl lactam) and amine C _9-17 alkanecarboxylic acid (preferably amines such as amino undecanoic acid and amino dodecanoic acid) C11-15 alkylcarboxylic acid). These long-chain components can be used alone or in combination of two or more. Among these long-chain components, a lactamamine component and / or an aminoalkanecarboxylic acid component are mostly used, for example, at least one component selected from lauryllactam, aminoundecanoic acid and aminododecanoic acid. Copolymerized polyamines containing units derived from such components have high water resistance and are excellent in adhesion, abrasion resistance, and impact resistance to electronic devices, and can effectively protect electronic devices.

The proportion of the long-chain component may be 10 to 100 mole% (for example, 25 to 95 mole%), and preferably 30 to 90 mole% (for example, 40-85 mol%), more preferably about 50-80 mol% (for example, 55-75 mol%).

Further, the copolymerized polyamidoamine may be a multi-component copolymer of the aforementioned amimine-forming components, for example, a binary copolymer to a quaternary copolymer, etc., usually a binary copolymer to a quaternary copolymer, and particularly a binary copolymer. Substance or terpolymer.

Copolymerized polyamines are mostly selected as constituent units from polyamine 11, polyamine 12, polyamine 610, polyamine 612, and the like. And a fluorene-forming component (or a unit derived from the fluorene-forming component) of polyamine 1010. The copolymerized polyamine may also be a copolymer of these multiple amine-forming components, or may be one or more of the above-mentioned amine-forming components and other amine-forming components (selected from polyamine 6 and polyamine 66 at least one amine-forming component, etc.).

Specific examples of the copolymerized polyamide include: copolymer polyamide 6/11, copolymer polyamide 6/12, copolymer polyamide 66/11, copolymer polyamide 66/12, copolymer polyamide 610/11 , Copolymeramine 612/11, Copolymeramide 610/12, Copolymeramide 612/12, Copolymeramide 1010/12, Copolymeramide 6/11/610, Copolymeramide 6/11/612, Copolymeramide 6/12/610, Copolymer 6/12/612, etc. These copolymerized polyamines can be used alone or in combination of two or more kinds. In addition, in these copolymerized polyamides, the components separated by a slash "/" represent the polyamide-forming component.

As described above, the packaging member may include at least one unit as follows.

(a) Units derived from a long chain component having a C _8-16 alkylene group

(b) a unit derived from at least one component selected from the group consisting of C _9-17 lactam and amine C _9-17 alkanecarboxylic acid

(c) a unit derived from at least one component selected from laurylamine, aminoundecanoic acid, and aminododecanoic acid

In the case of a polyamide elastomer (polyamide block copolymer), as the polyamide segment containing a hard segment (or hard block) (derived from a material selected from, for example, polyamide 11, polyamine 12. Polyamide block copolymers of polyamide 610, polyamide 612 and polyamide 1010 (polyamide segments of polyamide-forming components) and soft segments (or soft blocks) of polyamines, including For example: polyamide-polyether block copolymer, polyamide-polyester block copolymer, polyamide-polycarbonate block copolymer, and the like. A typical polyamide elastomer is a polyamide-polyether block copolymer, and examples thereof include polyether amide [for example, a polyamide block having a diamine terminal and a dicarboxyl terminal Block copolymers of polyalkylene glycol blocks (or polyoxyalkylene blocks), polyamidoblocks with dicarboxyl termini and polyamines with diamine termini Block copolymers of alkylene glycol blocks (or polyoxyalkylene blocks), etc.], polyether ester amides [polyamide blocks with dicarboxyl termini and dihydroxy groups A block copolymer of a polyalkylene glycol block (or a polyoxyalkylene block) at the end] and the like. As the polyether (polyether block), for example, include: poly alkylene glycols (e.g. polyethylene glycol, polypropylene glycol, polytetramethylene glycol (polytetramethylene glycol) and the like extending poly C _2-6 alkyl Alkylene glycol, preferably poly (C _2-4 alkylene glycol) and the like. The polyamide elastomer may have an ester bond.

In the polyamide elastomer, the number average molecular weight of the soft segments (polyether blocks, etc.) may be selected from, for example, a range of about 100 to 10,000, preferably 300 to 6000 (for example, 300 to 5000), and more preferably 500 ~ 4000 (for example, 500 ~ 3000), especially about 1000 ~ 2000.

In the polyamide elastomer, the ratio (weight ratio) of the polyamide block (polyamide segment) to the soft segment (or block) may be, for example, the former / the latter = 75/25 ~ 10 / 90, preferably 70/30 to 15/85, and more preferably 60/40 to 20/80 (for example, 50/50 to 25/75).

These copolymerized polyamide resins can be used alone or in combination. the above. Among these copolymerized polyamide resins, from the standpoint of encapsulation of electronic devices, copolymerized polyamide (non-polyamide elastomer or polyamide random copolymer) is particularly preferred. It is a copolymerized polyamine containing a amide-forming component derived from polyamine 12 as a constituent unit.

The amine group concentration of the copolymerized polyamine resin is not particularly limited, and may be, for example, 10 to 300 mmol / kg, preferably 15 to 280 mmol / kg, and more preferably 20 to 250 mmol / kg. When the amine group concentration of the copolymerized polyamidoamine-based resin is high, it is advantageous when the other members (such as a protective layer described later) are laminated on the sealing member to improve the adhesion.

The carboxyl group concentration of the copolymerized polyamide resin is not particularly limited, and may be, for example, 10 to 300 mmol / kg, preferably 15 to 280 mmol / kg, and more preferably 20 to 250 mmol / kg. When the concentration of the terminal carboxyl group of the copolymerized polyamide resin is high, the thermal stability is high, and it is advantageous in terms of long-term stability (continuous processability).

The number average molecular weight of the copolymerized polyamide resin may be selected from, for example, a range of about 5000 to 200,000, for example, 6000 to 100,000, preferably 7000 to 70,000 (for example, 7,000 to 15,000), and more preferably 8,000 to 40,000 (for example, 8000 ~ 12000), usually about 8000 ~ 30,000. The molecular weight of the copolymerized polyamidoamine-based resin can be measured in terms of polymethyl methacrylate by gel permeation chromatography using HFIP (hexafluoroisopropanol) as a solvent.

The content of the amine bond of each copolymerized polyamine resin can be selected from a range of 100 units or less, and from 30 to 90 units from the viewpoint of the device's encapsulation. It is preferably 40 to 80 units, and more preferably 50 to 70 units (for example, 55 to 60 units). again The amine bond content can be calculated, for example, by dividing the number average molecular weight by the molecular weight of the repeating unit (1 unit).

The copolymerized polyamide resin may be amorphous or crystalline. The degree of crystallization of the copolymerized polyamide resin may be, for example, 20% or less (for example, 1 to 18%), preferably 15% or less (for example, 2 to 13%), and more preferably 10% or less (for example, 2 to 8). %). The degree of crystallization can be measured by a conventional method, for example, a measurement method based on density or heat of fusion, an X-ray diffraction method, an infrared absorption method, or the like.

In addition, the thermal melting property of the amorphous copolymerized polyamide resin can be measured at a softening temperature by a differential scanning calorimeter, and the melting point of the crystalline copolymerized polyamide resin can be determined by Differential scanning thermal card meter (DSC).

The melting point or softening point of the copolymerized polyamide resin (or copolymerized polyamide or polyamide elastomer) may be 75 to 160 ° C (for example, 80 to 150 ° C), preferably 90 to 140 ° C (for example, 95 ~ 135 ° C), more preferably about 100 to 130 ° C, and usually about 90 to 160 ° C (for example, 100 to 150 ° C). Since the copolymerized polyamide resin has a low melting point or a softening point and high adhesiveness, it can be melted at a relatively low temperature and be firmly adhered to the device surface (substrate). In addition, the melting point of the copolymerized polyamidoamine resin means that when the components are mutually soluble and a single peak is generated in DSC, it means the temperature corresponding to a single peak, and when the components are not mutually soluble, a plurality of DSCs are generated. The case of the peak means the temperature corresponding to the peak on the high temperature side among the plurality of peaks.

In addition, as described above, the copolymerized polyamide resin may have at least one of the following characteristics.

(1) Melting point or softening point is 75 ~ 160 ° C; (2) It has crystallinity; (3) It has crystallinity and has a melting point of 90 ~ 160 ° C.

In the present invention, since the peripheral edge portion of the packaging member is connected to the device, unlike conventional packaging methods, the thermoplastic resin does not necessarily have to have high melt flow characteristics. The melt flow rate (MFR) of a thermoplastic resin (for example, a copolymerized polyamide resin) may be 1 to 350 g / 10 minutes, preferably 3 to 300 g / 10 minutes at a temperature of 160 ° C and a load of 2.16 kg. More preferably, it is about 5 to 250 g / 10 minutes.

To the extent that the properties such as adhesion are not impaired, other resins such as homopolyamide (for example, from the components forming the copolymer polyamine) may be added to the thermoplastic resin (for example, copolymer polyamine resin). Into homopolyamines, etc.). Relative to 100 parts by weight of the copolymerized polyamide resin, the proportion of the homopolyamine may be 30 parts by weight or less (for example, 1 to 25 parts by weight), preferably 2 to 20 parts by weight, and more preferably 3 to 15 parts. About part by weight. Furthermore, in the copolymerized polyamidoamine resin in the form of a mixture, each polyamidoamine may have mutual solubility.

If necessary, the encapsulation member may also include the aforementioned other thermoplastic resins, such as an ethylene-vinyl acetate copolymer and the like. With respect to 100 parts by weight of the copolymerized polyamide resin, the proportion of other resins may be, for example, 100 parts by weight or less (for example, about 1 to 80 parts by weight), preferably 2 to 70 parts by weight, and more preferably 2 to 50 parts by weight. Parts, especially 30 parts by weight or less (for example, about 3 to 20 parts by weight).

Thermoplastic resins (e.g. copolymerized polyamide resins) can also contain various additives, such as fillers, stabilizers ( Heat-resistant stabilizers, weather-resistant stabilizers, etc.), colorants, plasticizers, lubricants, flame retardants, antistatic agents, heat transfer agents, etc. The additives may be used alone or in combination. Among these additives, stabilizers, heat transfer agents, and the like are widely used.

As described above, the encapsulating member of the present invention can be a copolymerized polyamide resin, a mixture of a plurality of copolymerized polyamide resins, or a copolymerized polyamide resin and other components (homopolyamide, additives). Etc.) to form a mixture (copolymerization of a polyamine resin composition).

The package member of the present invention is formed into a film shape (or sheet shape) or a tray shape (or box shape). In order to improve the bonding processability with a substrate, a film-shaped or tray-shaped packaging member may have a peripheral portion including the thermoplastic resin (thermoadhesive resin such as a copolymerized polyamide resin), and this peripheral portion may be used. It can be in line or surface contact with the substrate of the device. In addition, as long as at least the peripheral portion of the packaging member (particularly the contact portion with the substrate) is formed of the aforementioned thermoplastic resin, the peripheral portion of the packaging member (the contact portion with the substrate) may be formed with the coating film of the thermoplastic resin. However, in general, the entire packaging member including the peripheral portion contains the aforementioned thermoplastic resin.

The package member in this form includes an internal region for forming a free space that does not follow the device (circuits and mounting parts of the substrate), and a peripheral portion (adjacent to the internal region) that can adhere to the substrate of the device. Peripheral edge). In the free space, the packaging member is not attached to the device, and it is possible to prevent the stress caused by the packaging member from acting on the device (such as mounting parts in the free space). In addition, since only the peripheral edge portion of the packaging member can be connected to the substrate of the device, the occurrence of voids can be greatly reduced. Can effectively prevent circuit corrosion and short circuit. It is also possible to selectively package the packaging area of the device. That is, the peripheral portion of a desired packaging area (a specific part or all of the device) of the device can be sealed with a high-density adhesive force by using the thermoplastic resin of the packaging member.

The film-like (or sheet-like) packaging member may be an unstretched film or a stretched film (uniaxially or biaxially stretched film). The stretching ratio of the film may be, for example, about 1.2 to 10 times (preferably 1.5 to 7 times, more preferably 2 to 5 times) in one direction. The thin-film packaging member can be produced by a conventional thin-film film-forming method such as a casting method, an extrusion molding method, and a blow molding method. If necessary, it may be stretched at a predetermined magnification using a uniaxial or biaxial stretching machine.

The thickness of the single-layer film-like packaging member can be selected, for example, from a range of about 1 to 1000 μm, usually 5 to 500 μm (for example, 5 to 300 μm), preferably 10 to 250 μm (for example, 25 to 200 μm), and more preferably About 50 to 200 μm (for example, 75 to 150 μm). If the thickness is too small, the mounted components may not be effectively protected in the packaged area. If the thickness is too large, the sealing member may have a reduced adhesion to the substrate.

The water vapor permeability (40 ° C, 90% RH) of a single-layer thin-film encapsulation member is converted to a thickness of 1 mm, for example, 100 g / m ² / day or less, preferably 50 g / m ² / day or less (for example, 0.01 ~ 30g / m ² / day). In particular, the package member containing copolymerized polyamine has excellent water vapor barrier properties. The above water vapor permeability is converted to a thickness of 1 mm, for example, 0.01 to 2 g / m ² / day, and preferably 0.05 to 1.5 g / m ^2. / Day, more preferably about 0.1 to 1 g / m ² / day. The water vapor permeability can be measured by a conventional method, for example, the cup method of JIS Z0208.

In addition, the film-like packaging member may be a single-layer film or a laminated film (or a laminated sheet). The laminated film is not particularly limited as long as it has at least an encapsulating layer formed of the aforementioned thermoplastic resin (for example, an encapsulating layer formed of a copolymerized polyamide resin). For example, the laminated film may include the aforementioned thermoplastic resin ( A thermally adhesive thermoplastic resin such as a copolymerized polyamide resin, an encapsulation layer, and a protective layer (a heat-resistant resin layer) formed on one side of the encapsulation layer and formed of a heat-resistant resin (or a hydrophobic resin). Or hydrophobic resin layer). In addition, the protective layer may be an entire area layer of the encapsulation layer, or a protective layer may be laminated except the peripheral portion of the encapsulation layer (a portion corresponding to the peripheral edge portion of the encapsulation member) (that is, an inner region of the encapsulation layer). In the former laminated form, the protective layer may face the device on the opposite side and the peripheral edge portion of the packaging member may be attached to the device. In the latter laminated form, the protective layer may be placed on the device side and the peripheral edge portion of the packaging member may be attached to the device. Device.

Furthermore, a plurality of protective layers may be laminated on one side of the encapsulation layer. The protective layer is used to protect against external adverse factors such as self-heating and moisture. For example, a heat-resistant resin layer can prevent the film accompanying the peripheral edge from being damaged, and a hydrophobic resin layer can prevent it from being wet. Corrosion of the gas device can improve the durability of the device.

The heat-resistant resin is not particularly limited as long as it has heat resistance to the extent that it can withstand the bonding temperature (or thermal bonding temperature) of the packaging member. Examples include fluororesins and olefin-based resins (including cyclic olefin-based resins). Resin), styrenic resin, aromatic polyester resin, polycarbonate resin, polyurethane resin, polyamide resin, polymer Polyimide-based resins (polyamidide, imine, polyether, imine, etc.), polyacetal-based resins, polyphenylene ether-based resins, polyetherketone-based resins (such as polyetherketone (PEK), polyetherether Ketones (PEEK), etc.), polyphenylene sulfide-based resins, polyether fluorene-based resins, cellulose derivatives, aromatic epoxy resins, and the like.

These heat-resistant resins may be used alone or in combination of two or more. Among these heat-resistant resins, aromatic polyester resins, polycarbonate resins, polyamide resins (such as aromatic polyamines), polyphenylene ether resins, and polyphenylene sulfide resins are preferred. , Polyimide resin, fluororesin, etc. Particularly representative heat-resistant resins include polyester resins (such as aromatic polyesters), polyamide resins, and fluororesins. As the polyester-based resin, for example, a polyalkylene aryl ester-based resin [homogeneous polyester (for example, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate) Esters, such as poly (C _2-4 alkylene aryl esters), copolyesters (for example, copolyesters containing C _2-4 alkylene aryl ester units as the main component, etc.), etc.), polyarylate resins, liquid crystals Polyester, etc. The polyester-based resin also includes a polyester elastomer.

Examples of the polyester elastomer (polyester block copolymer) include a polyester insert containing an aromatic polyester as a hard segment (or hard block) and a soft segment (or soft block). Segment copolymers, such as: aromatic polyester-polyether block copolymers, aromatic polyester-aliphatic polyester block copolymers, and the like. The aromatic polyester segment (or block) may contain the aforementioned polyalkylene aryl resin (for example, poly C _2-4 alkylene terephthalate such as polybutylene terephthalate), and the soft The segment may include a polyether such as a polyether exemplified by the aforementioned polyamide elastomer (for example, polyC _2-6 alkylene glycol such as polytetramethylene glycol). In the polyester elastomer, the ratio of the aromatic polyester block (hard segment) to the full segment may be, for example, 25 to 95% by weight, preferably 30 to 90% by weight (for example, 50 to 85% by weight). %)about.

Examples of the polyamide resin include the aforementioned homopolyamines (for example, polyamine 11, polyamine 12, polyamine 610, polyamine 612, polyamine 1010, polyamine 1012, etc.), and The copolymerized polyamide resins contained in the sealing member are different types of copolymerized polyamide resins (and polyamide elastomers, etc.). The polyamide resin is usually a polyamide resin other than the copolymerized polyamide.

Examples of the fluororesin include individual polymers such as polyvinyl fluoride (PVF), polyvinylidene fluoride (PVDF), polytrifluoroethylene (PTrFE), polychlorotrifluoroethylene, polytetrafluoroethylene (PTFE), and ethylene. -Tetrafluoroethylene copolymer (ETFE), ethylene-chlorotrifluoroethylene copolymer, tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene-perfluoropropyl vinyl ether copolymer, etc.

In addition, the heat-resistant resin may be a highly hydrophobic resin, such as an olefin-based resin, a styrene-based resin, a fluororesin, and the like.

The melting point or softening point of the heat-resistant resin may be, for example, 160 ° C or higher (for example, about 165 to 250 ° C), and preferably 170 ° C or higher (for example, about 175 to 220 ° C). The melting point or softening point can be measured by a conventional method, for example, a differential scanning thermal card meter (DSC).

The heat distortion temperature of the heat-resistant resin can be selected from a range of, for example, 160 ° C or lower under the condition of high load (1.82 MPa) according to ISO75-1, and can be from 40 to 155 ° C, preferably from about 50 to 150 ° C.

The thickness of the protective layer (when a plurality of protective layers are formed, the total thickness of each protective layer) is not particularly limited as long as the peripheral edge portion of the laminated film can contact the device surface, and may be, for example, 1 to 800 μm (for example, 5 ~ 700 μm), preferably 10 to 600 μm (for example, 20 to 500 μm), It is more preferably about 30 to 400 μm (for example, 50 to 300 μm). If the thickness of the protective layer is too small, the function as a protective layer is liable to be broken and the protective layer is reduced. When a plurality of protective layers are formed, the thickness of each protective layer may be, for example, 1 to 100 μm, and preferably about 5 to 50 μm.

The laminated film is, for example, a laminated film in which a protective layer is directly formed on one side of the encapsulation layer, or a laminated film in which a protective layer is formed on one side of the encapsulation layer through an adhesive layer (intermediate layer). Moreover, if necessary, an intermediate layer (adhesive layer) may exist between a plurality of protective layers. The adhesive layer can also be used with conventional adhesives or adhesives, such as vinyl chloride-based adhesives, vinyl acetate-based adhesives, olefin-based adhesives, acrylic-based adhesives, polyester-based adhesives, and urethane-based adhesives. It is formed by an adhesive, an epoxy-based adhesive, a rubber-based adhesive, or the like. The thickness of the adhesion layer is not particularly limited, and may be, for example, 1 to 50 μm (for example, 3 to 30 μm), and preferably about 2 to 10 μm.

The laminated film is also included, and the thickness (the overall thickness) of the packaging member may be, for example, 10 to 1000 μm, preferably 30 to 800 μm, and more preferably about 50 to 500 μm.

The thickness ratio of the encapsulation layer and the protective layer (in the case of a plurality of protective layers and / or adhesive layers, the total thickness of each layer) can be selected from the former / the latter = 5/95 ~ 95/5 (for example, 10/90 ~ 90 / 10) The range is about 10/90 ~ 90/10 (for example, 10/90 ~ 80/20), preferably 15/85 ~ 70/30 (for example, 15/85 ~ 60/40), more preferably It is about 20/80 ~ 50/50 (for example, 20/80 ~ 40/60).

Compared with single-layer films, laminated films can improve heat resistance, chemical resistance, and water resistance. For example, thermal variation of laminated films The shape temperature (highest use temperature) is, for example, 160 to 300 ° C, preferably 170 to 280 ° C, and more preferably about 180 to 250 ° C. When the thermal deformation temperature of the single-layer film is 100, the thermal deformation temperature of the laminated film is, for example, 120 to 200, preferably 125 to 180, and more preferably about 130 to 160. In addition, the so-called thermal deformation temperature means the temperature at which the film is deformed by the heat treatment for 15 seconds.

In addition, the laminated film can improve chemical resistance to any one of organic components (for example, aliphatic hydrocarbons, aromatic hydrocarbons, alcohols, ketones, etc.) and inorganic components (for example, inorganic acids such as hydrochloric acid), and can particularly improve chemical resistance. Improves chemical resistance to alcohols such as methanol.

Laminated film can be used by conventional methods, such as lamination (thermal lamination, dry lamination, etc.), using a common mold with a feed block or a multi-manifold die, etc. It is prepared by a co-extrusion method, coating (including printing such as screen printing), and the like.

In the package of a device with a rough surface or an uneven surface, a preferable form of the package member is a tray shape. This tray-shaped packaging member generally includes a storage portion (receiving recessed portion) that can cover and accommodate the mounting component in accordance with the height of the mounting component of the device, and an outer peripheral portion (flange portion) extending from the storage portion. The storage section (receiving recessed section) may have various forms according to the mounting form of the component, such as a form that is bent and bulged (a form such as an inverted U-shaped cross section or a mountain shape), a cross section having a wall surface and a ceiling A letter shape, a trapezoidal shape, or the like; the packaging member may have a single storage portion (storage recessed portion), or it may have a plurality of storage portions (storage recessed portions) adjacent to or at a predetermined interval. Moreover, it is preferable that the peripheral edge part (flange part) of a package member can contact the board | substrate surface of a device. The peripheral edge portion of the film-shaped or tray-shaped packaging member may be adhered to the substrate with an adhesive as required, and is preferably adhered by thermal adhesion. In particular, the peripheral edge portion (flange portion) of the tray-shaped packaging member may be thermally adhered or thermally welded to the substrate of the device. In addition, as long as at least the peripheral portion of the packaging member is attached to the substrate of the device, the packaging member having the plurality of receiving recesses may be attached to the substrate of the device as needed.

The method of forming the packaging member into a tray shape is not particularly limited, and the tray-shaped packaging member can be formed by a conventional container molding method such as pressure forming ( Pressure forming), vacuum forming, and other forming methods to form into a predetermined shape. Furthermore, the tray-shaped packaging member does not necessarily have to follow the shape of the electronic component mounted on the electronic device.

The packaging member can be applied to both sides of the device as needed, but is usually applied to one side of the device.

[Packaging device]

In the packaging device of the present invention, although the packaged area of the device is packaged with the package member, the package member and the mounting member of the device are separated, and the peripheral portion of the package member is connected to the device. That is, inside the packaged area of the device (internal area), the aforementioned package members are separated from the device (circuits of the substrate and mounting parts, etc.) and a free space is formed; the periphery of the packaged area of the device is the aforementioned The peripheral edge portion of the packaging member and the substrate of the device are bonded to form a packaging portion. In such a package form, even in a free space, even if the package member and the mounting member are in physical contact, the package member and the mounting member The bonding strength of is substantially "0", and for the device in the free space, the stress of the package member is essentially ineffective. Furthermore, since the peripheral edge portion of the packaging member is in close contact with the substrate, the free space is formed as a buffer space filled with gas such as air, and the mounting components in the free space can be effectively protected by the gas buffering property. In particular, if a sealing member is formed of a flexible thermoplastic resin (especially a thermo-adhesive thermoplastic resin such as a copolymerized polyamide-based resin), it is possible to encapsulate the sealed region of the substrate as a balloon-shaped sealing member. Even if an external force is applied, the balloon-shaped packaging member and the buffer space can be used to protect the mounting components in the free space. In addition, since the peripheral portion of the package member is in contact with the substrate of the device, the occurrence of voids can be greatly reduced. Therefore, it is possible to effectively prevent the circuit from being corroded and short-circuited. In particular, when a heat-adhesive thermoplastic resin (such as the above-mentioned copolymerized polyamide-based resin) is used as the thermoplastic resin of the packaging member, the peripheral edge portion of a desired packaging region of the device can be bonded by the packaging member with high density. It is also possible to selectively package a predetermined portion (packaging area) of the device according to the mounting component and the mounting form of the component.

FIG. 1 is a schematic side view showing an example of a packaging device of the present invention.

In this example, a plurality of electronic components 3 a to 3 c are mounted or mounted on the substrate 2 to form the electronic device 1. On the other hand, the tray-shaped packaging member 11 is provided with a storage recess 12 that can cover and store a predetermined packaging area of the electronic device 1 and an opening peripheral edge of the storage recess to extend outward (side direction). A peripheral portion 13 that can be attached to the substrate 2 of the electronic device 1.

Then, the predetermined packaging area of the electronic device 1 is covered with a tray-shaped packaging member 11 provided with the opening portion facing the substrate, and the peripheral portion 13 of the packaging member 11 is thermally adhered to the substrate of the electronic device 1 throughout the entire circumference. 2, while encapsulating the packaging area. In such a packaging form, the mounting parts 3a to 3c of the electronic device 1 are housed in the housing recesses 12 of the packaging member 11, and the mounting parts 3a to 3c and the package including the substrate part 2 in the packaging area are included. A free space 15 is formed between the members 11.

FIG. 2 is a schematic side view showing another example of the packaging device of the present invention. In addition, the same components or elements as those in FIG. 1 will be described with the same reference numerals.

In this example, the package member 21 is provided in accordance with the mounting and arrangement forms of the plurality of electronic components 3a to 3c in the device 1: a plurality of storage recesses 22a, 22b having different depths and volumes; The substrate portion is bent or buckled to extend in a direction that contacts the substrate portion 2 of the device 1, and a contact portion 24 that can be brought into contact with the substrate 2 of the device 1; and a peripheral portion 23 that is formed on the outer peripheral portion and can contact the device 1. In such a packaging member 21, a plurality of packaged areas are covered with a plurality of storage recesses 22a, 22b, and a portion (contact portion) 24 between the peripheral edge portion 23 of the packaging member 21 and the plurality of storage recesses 22a, 22b can be achieved. Next, on the substrate 2 of the device 1, free spaces (or buffer spaces) 25 a and 25 b can be formed in each of the storage recesses 22 a and 22 b.

In this way, as long as at least the peripheral portion of the packaging member is attached to the substrate of the device, the packaging member is not limited to a packaging member having one or a plurality of storage recesses, and even a thin film packaging member may not be provided to the device as required. The range of adverse effects such as circuit and circuit, even in the inner area of the package member, can be spot-shaped or line-shaped (or band-shaped) followed by (or thermal Then) on the substrate.

Furthermore, in the packaging device, at least the peripheral edge portion of the packaging member is adhered to the substrate of the device, and a packaging portion closed in a frame shape (a frame shape such as a quadrangular frame, a polygonal frame, or a ring shape) is formed. (Closed package). In particular, in the packaging device of the present invention, in many cases, only the peripheral edge portion of the packaging member is bonded (or thermally bonded) to the substrate of the device. In addition, the peripheral portion of the packaging member may be packaged (or adhered) to the substrate with a predetermined width, or may be packaged (or adhered) to the substrate in a linear or tape-like form.

[Manufacturing method of packaging device]

In the method of the present invention, it is possible to cover a predetermined packaged area of the device with the package member and the mounting member of the packaged area of the device in a free form, and attach the peripheral edge portion of the package member to the substrate of the device. The packaged area of a manufacturing device is a device covered and sealed with a packaging member. That is, the method of the present invention includes a step of covering a predetermined packaged area of the device with a packaging member in a film-like (or sheet-like) or tray-like form, and a step of adhering a peripheral portion of the packaging member; The case where the peripheral edge portion of the package member is heated and melted and heat-sealed further includes a cooling step. By going through such a step, it is possible to manufacture the packaged area in a packaged form in which the package member and the mounting component are in a free form and packaged. The peripheral portion of the region is a packaging device that is packaged with a packaging member.

As the aforementioned device, various organic or inorganic devices can be exemplified, such as precision components such as semiconductor elements, electroluminescence (EL) elements, light-emitting diodes, solar cells, circuit boards on which circuits (including filter circuits, etc.) are formed, Equipped with various electronic components or electronic components (electrical Containers, filters, etc.) and other electronic components (particularly precision electronic components or electronic devices) such as printed circuit boards (printed substrates).

In the capping step, the packaged area of the device may be covered with a packaging member, or the entire area of one side of the device, or a specific area of the device (a region for mounting electronic components, a wiring area, etc.) may be covered. In this covering step, it is preferable that the peripheral edge portion of the packaging member is in line or surface contact with the substrate.

Furthermore, when the unevenness (or undulation) caused by the electronic components on the substrate is not so large, it is not formed into a tray shape or a box shape in advance. For example, only a thin film packaging member is superposed on the substrate and the packaging member is made. The peripheral edge portion (outer edge portion) is welded, and the electronic component and the soldered portion in the packaged area are not adhered to the package member, which can achieve the effect of the invention. On the other hand, when the unevenness (or undulation) caused by the electronic components on the substrate is large, it is preferable to cover the packaged area of the device with the packaging member that has been formed into a tray or a box shape in advance and use only the packaging member. The outer edge is welded.

In addition, the packaged area of the device is usually a vulnerable part, such as a mounting part for electronic components, a wiring part, and the like.

The most important point in the next step is the point where the bonding area (bonding portion) between the substrate and the packaging member is small and the peripheral edge portion (outer edge portion) of the packaging member is bonded to the substrate. The method of adhering it is not particularly limited, and examples thereof include heating by laser light, heating by a heat sealing device such as a heat sealer, and the like, and preferably a method of heating only the adhering portion and welding it. In the present invention, as long as only the bonding portion of the peripheral edge portion (outer edge portion) of the sealed area (protected area) can be welded by heat, Yes, so the damage to the electronic device is small. Therefore, it is possible to use a packaging member that is not as low in melting point as in the conventional technology.

Furthermore, the entire packaging member may be heated as required. However, if the entire packaging member is fused, the electronic component packaging member on the electronic device may be unevenly welded, or may be in contact with the soldered portion of the electronic component. The circuit part or the thickness of the package part due to the melting is thick and there are openings depending on the situation, which is not good. However, as long as such a problem does not occur, the package member may be preheated and adhered.

When a laser is used for welding, as in ordinary laser welding, a laser can be transmitted through the peripheral portion (or outer edge portion) of the package member to heat the substrate, and the heat can be used to melt the package member. A method of welding the peripheral portion, but the laser intensity may be adjusted according to the type of the device (for example, the color of the substrate, the presence or absence of an internal circuit of the substrate, etc.). For example, if a display portion capable of absorbing laser light (such as a dark-colored display character capable of absorbing laser light) is provided on the substrate, the laser absorption in the display portion becomes stronger, and more heat is generated than necessary. In extreme cases, there is a possibility of fire.

In the present invention, laser welding is different from ordinary thermoplastic resins, and it is not necessary to increase the temperature on the substrate side, as long as the peripheral portion of the packaging member is heated and melted. Therefore, it may be preferable to form a sealing member with a thermoplastic resin composition (laser-absorbing thermoplastic resin composition) containing a coloring agent (pigment such as carbon black and dye) capable of absorbing laser light and a thermoplastic resin. At least the peripheral edge portion, the thermoplastic resin of the peripheral edge portion (or outer edge portion) is directly heated by laser to melt it 接 的 方法。 Then the method. The laser-absorbing thermoplastic resin composition can form the entire packaging member, or only the peripheral edge portion (outer edge portion) of the packaging member. Moreover, in a laminated film or this tray-shaped molded body, the resin layer (sealing layer) which contacts a board | substrate may be formed with the said laser absorptive thermoplastic resin composition.

The heating temperature of the peripheral edge portion (outer edge portion) of the packaging member depends on the melting point or softening point of the thermoplastic resin of the packaging member, and may be, for example, 75 to 200 ° C, preferably 80 to 180 ° C, and more preferably 100 to 175. ℃ (for example, 110 ~ 150 ℃). Furthermore, in the laminated film, the heating temperature is above the melting point of the thermoplastic resin (for example, melting point + 5 ° C or higher, preferably melting point + 10 ° C or higher) and the melting point of the heat-resistant resin forming the protective layer + 10 ° C or lower (for example (Melting point + 5 ° C or lower, preferably below melting point) is preferred. In addition, the heating temperature may be equal to or higher than the glass transition temperature (preferably, the thermal deformation temperature or higher) of the heat-resistant resin that normally forms the protective layer. The heating system can be performed in air or in an inert gas environment. If necessary, they may be adhered under normal pressure, pressure, or reduced pressure. Further, if necessary, the heat can be repeated.

In the cooling step, the peripheral edge portion (outer edge portion) of the heat-sealed packaging member may be naturally cooled, or may be cooled stepwise or continuously or rapidly.

By going through such steps, it is possible to obtain a packaging device in which the peripheral edge portion (outer edge portion) of the packaging member is thermally fused to the substrate of the device.

In this method, unlike injection molding and the like, high temperature and high pressure do not act on the device, but only the peripheral edge portion of the package member is heated. , So the device will not be damaged. In addition, since it is not necessary to fill the components and soldered portions with resin, as long as only the peripheral edge portion of the packaging member is adhered, the occurrence of voids can be greatly reduced. Further, even if it is only a specific packaged area of the device, it can be packaged with high tightness and encapsulation. Further, since a thermally adhesive thermoplastic resin is used, the peripheral edge portion of the packaging member can be welded at a relatively low temperature, and thus there are few cases where the device is thermally damaged, and the reliability of the device can be improved. In addition, the device can be packaged with high reliability in a short time, which can greatly improve the productivity of the packaging device.

[Example]

Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited by these examples. In addition, in the following Examples and Comparative Examples, the same thermoplastic resin was used, and only the encapsulation and protection methods were changed for evaluation. The resins used in the examples and comparative examples and the evaluation methods for each evaluation item are as follows.

[Resin]

Resin A: copolymerized polyamide ("Vestamelt X1038P1" manufactured by EVONIK, containing C _10-14 alkylene, melting point 125 ° C)

Resin B: copolymerized polyamide ("Vestamelt X1051" manufactured by EVONIK, containing C _10-14 alkylene, melting point 130 ° C)

Resin C: copolymerized polyamide ("Vestamelt X1333P1" manufactured by EVONIK, containing C _10-14 alkylene, melting point 105 ° C)

Resin D: copolymerized polyamide ("Vestamelt 4680" manufactured by EVONIK, containing C _10-14 alkylene, melting point 105 ° C)

Resin E: copolymerized polyamide ("Vestamelt X7079" manufactured by EVONIK, containing C _10-14 alkylene, melting point 130 ° C)

Resin F: Two types of copolymerized polyamidoamine (containing a composition consisting of "Vestamelt X1038" and "Vestamelt Z2131" manufactured by EVONIK Co., Ltd. in a weight ratio of 1/1) were melt-kneaded and compounded by a two-axis extruder. Blend ("DAIAMID Z1117" manufactured by EVONIK, containing C _10-14 alkylene, melting point 130 ° C)

[Crack in welded part]

On a flat plate (100 mm in length, 100 mm in width, and 3 mm in thickness) formed of a polyetheretherketone resin ("VESTAKEEP-J ZV7403" manufactured by EVONIK) at four predetermined locations (both ends in the vertical and horizontal directions, respectively) Open the hole (diameter 2mm) in the four places intersected by a straight line extending in the vertical and horizontal directions at a distance of only 30mm on the inside. Insert copper wires (diameter 1mm, length 10mm) into this hole, and fix it with solder. A test substrate was prepared. The solder is a lead-free solder using a tin-copper-nickel alloy.

The obtained test substrates were packaged by the methods of Examples and Comparative Examples, and the presence or absence of cracks in the welded portion was observed with a fiber mirror.

[Electrical characteristics test]

A comb-shaped electrode portion was formed in a wiring room of a printed wiring board (when a wiring was attached to a glass epoxy substrate with copper foil), and a test substrate was prepared. In addition, as shown in FIG. 3, a pair of opposing electrode portions (width: 4.4 mm, length: 29 mm) 31a, 31b are formed on the test substrate (thickness: 1.5 mm): they are linearly spaced at intervals of 20.1 mm. It is formed on the ground and extends the electrode portion (width 3.5mm, length 10.5mm) 32a, 32b: from the end portions of the pair of opposite electrode portions linearly extending in a direction approaching each other, and connected to the electrode portion (width 4.4mm , Length 8.8mm) 33a, 33b: since then The end portions of the extended electrode portions extend in opposite directions to the pair of opposed electrode portions 31a and 31b at a distance of 7.8 mm; and the pair of opposed electrode portions 31a and 31b are opposed to each other. Comb-shaped electrode portions 34 a and 34 b extending alternately in a comb-tooth shape are formed in a direction to form a predetermined circuit. In addition, among the comb-shaped electrode portions 34a and 34b, among the comb teeth extending in the direction facing each other, the length (repetition width) W of the adjacent and repeated comb teeth is 16.5 mm. Moreover, in FIG. 3, the outer periphery of the film-shaped packaging member which encapsulated the test substrate is shown by the dotted line.

The obtained test pieces were packaged by the methods of Examples and Comparative Examples, and subjected to the following tests.

In addition, as the test substrate, a test substrate (Examples 1, 2, 5 and Comparative Examples 1 to 6, 13 to 15) formed with comb electrodes having a pitch (interval) of 0.4 mm was used. Test substrates for comb electrodes with a pitch of 0.25 mm (other examples and comparative examples).

(1) Moisture resistance test

At a temperature of 85 ° C and 85% RH, a DC voltage of 12 V was applied to the connection electrode portion of the test substrate that had been encapsulated with a resin, and the change in resistance was measured, and it was confirmed that the resistance was 1 × 10 ⁶ Ω or less. time. The change in resistance was confirmed to a maximum of 500 hours. The resistance value of the test substrate not encapsulated with a resin was 5 × 10 ⁸ Ω.

(2) Thermal shock test

After applying a DC voltage of 12 V to the connection electrode portion of the test substrate which has been encapsulated in a resin, it was held at -30 ° C for 1 hour, and then rapidly heated to 40 ° C, maintained at 90% RH for 1 hour, and then cooled again. The cycle to -30 ° C was set to one cycle, and the cycle was repeated to measure the change in resistance value during the cycle, and the number of times (cycle number) when the resistance value became 1 × 10 ⁶ Ω or less was confirmed. Changes in resistance were confirmed to a maximum of 500 cycles. The resistance value of the test substrate not encapsulated with a resin was 1.0 × 10 ⁹ Ω.

(Example 1)

The resin A was hot-pressed to prepare a film having a thickness of 100 μm. Then, the obtained film was cut into a size corresponding to the packaged area of each test substrate, and only the peripheral portion of the film of a predetermined size was welded to the substrate of the test substrate by a heat sealer to prepare a resin film. Encapsulated test strip.

In addition, in the evaluation of cracks in the welded part, the dimensions were 100 mm in length and 100 mm in width, and the test substrate was covered with the cut-out film-shaped packaging member. Section) The entire test piece was heat-sealed to the test substrate to prepare a test piece that had been sealed with a packaging member. The heat-sealed film-like packaging member is not in contact with the copper wire, and is not released from the test substrate, the soldered portion, and the copper wire except for the heat-sealed portion.

In the electrical characteristic test, the dimensions were 38 mm in length and 38 mm in width, and the opposite-shaped electrode portion and comb-shaped electrode portion (including at least the comb-shaped electrode) of one pair of test substrates were covered with the cut-out film-shaped packaging member. 3, in the area shown by the dashed line in FIG. 3), only the peripheral edge portion (outside edge portion with a width of about 3 mm) of the packaging member was heat-sealed to the substrate portion and the electrode portion of the test substrate, and the package was welded to prepare a test piece. In the test piece, the thin-film encapsulation member was released from the comb-shaped electrode portion and the substrate except for the heat-sealed portion.

(Comparative example 1)

Each test substrate was embedded in a vertical injection molding machine, and the cylinder temperature was 200 ° C and the injection pressure The test piece was overmolded with resin A under the conditions of 10 Mpa and a mold temperature of 30 ° C. to prepare a test piece that had been encapsulated with resin A. Furthermore, the thickness of the encapsulated resin is about 5 mm.

(Comparative example 2)

The powder of the resin A that was freeze-pulverized was spread on each of the test substrates and heated in an oven at 180 ° C. for 5 minutes to prepare a test piece sealed with the resin A. Furthermore, the thickness of the encapsulated resin is about 5 mm.

(Comparative example 3)

A film having a thickness of 100 μm obtained by hot-pressing the resin A was prepared. Then, the obtained film was cut into a size corresponding to the coating area of each test substrate, and a thin-film encapsulant was placed on the test substrate, and heated in an oven at 180 ° C. for 5 minutes to melt it, thereby encapsulating. A test piece was prepared.

(Examples 2 to 6)

Except that resin B (Example 2), resin C (Example 3), resin D (Example 4), resin E (Example 5), and resin F (Example 6) were used instead of resin A in Example 1. A test piece was prepared in the same manner as in Example 1.

(Comparative Example 4)

A test piece was prepared in the same manner as in Comparative Example 1 except that Resin B was used instead of Resin A in Comparative Example 1.

(Comparative example 5)

A test piece was prepared in the same manner as in Comparative Example 2 except that Resin B was used instead of Resin A in Comparative Example 2.

(Comparative Example 6)

A test piece was prepared in the same manner as in Comparative Example 3 except that Resin B was used instead of Resin A in Comparative Example 3.

(Comparative Example 7)

A test piece was prepared in the same manner as in Comparative Example 1 except that Resin C was used instead of Resin A in Comparative Example 1, and the cylinder temperature was 170 ° C.

(Comparative Example 8)

A test piece was prepared in the same manner as in Comparative Example 2 except that Resin C was used instead of Resin A in Comparative Example 2.

(Comparative Example 9)

A test piece was prepared in the same manner as in Comparative Example 3 except that Resin C was used instead of Resin A in Comparative Example 3.

(Comparative Example 10)

A test piece was prepared in the same manner as in Comparative Example 1 except that Resin D was used instead of Resin A in Comparative Example 1, and the cylinder temperature was 170 ° C.

(Comparative Example 11)

A test piece was prepared in the same manner as in Comparative Example 2 except that Resin D was used instead of Resin A in Comparative Example 2.

(Comparative Example 12)

A test piece was prepared in the same manner as in Comparative Example 3 except that Resin D was used instead of Resin A in Comparative Example 3.

(Comparative Example 13)

A test piece was prepared in the same manner as in Comparative Example 1 except that Resin E was used instead of Resin A in Comparative Example 1.

(Comparative Example 14)

A test piece was prepared in the same manner as in Comparative Example 2 except that Resin E was used instead of Resin A in Comparative Example 2.

(Comparative Example 15)

A test piece was prepared in the same manner as in Comparative Example 3 except that Resin E was used instead of Resin A in Comparative Example 3.

The results are shown in a table.

In the voltage application test, a test substrate having a comb electrode pitch of 0.4 mm was used.

In the humidity resistance test, in Examples 1 and 2, the time point at 500 hours was 5 × ^{10 8} Ω.

In the thermal shock test, in Example 1, Example 2, and Comparative Example 1, the time point of 500 cycles (500 times) was 1.0 × ^{10 9} Ω.

In the voltage application test, a test substrate having a comb electrode pitch of 0.25 mm was used.

In the moisture resistance test, in Examples 3 and 4, the time point at 500 hours was 5 × ^{10 8} Ω.

In the thermal shock test, in Example 3, Example 4, and Comparative Example 7, the time point of 500 cycles (500 times) was 1.0 × ^{10 9} Ω.

In the voltage application test, test substrates with a comb electrode spacing of 0.4 mm were used in Example 5 and Comparative Examples 13 to 15 series, and in Example 6, a test electrode with a comb electrode spacing of 0.25 mm was used. Substrate.

In the humidity resistance test, in Examples 5 and 6, the time point at 500 hours was 5 × ^{10 8} Ω.

In the thermal shock test, in Example 5, Example 6, and Comparative Example 13, the time point of 500 cycles (500 times) was 1.0 × ^{10 9} Ω.

As described above, any of the embodiments can be packaged with high-density contact force, and even if only the peripheral edge portion of the packaging member is adhered to the substrate, the packaged area of the substrate can be effectively protected.

[Industrial availability]

The present invention relates to electronic components or electronic components including various types of electronic components such as semiconductor elements, EL elements, and solar cells. It is useful for packaging such as printed circuit boards of electronic components.

Claims (10)

A packaging device is a packaging device in which a packaged area of the device is packaged with a packaging member. The packaging member does not include a conductive member, and has a film-like or tray-like shape. At least a peripheral portion of the packaging member includes a copolymerized polymer. Amine-based resin; this copolymerized polyamidoamine-based resin binary copolymer to quaternary copolymerized polyamidoamine, and (c) is derived from the selected from laurylamine and amino undecanoic acid And at least one component of aminododecanoic acid; and the packaging member and the mounting member of the device are in a free form, and the peripheral portion of the packaging member is connected to the device. The packaging device according to claim 1, wherein at least a peripheral portion of the packaging member includes a thermal adhesive copolymer polyamide resin, and only a peripheral portion of the packaging member is thermally bonded to a substrate of the device. The packaging device according to claim 1 or 2, wherein the film-shaped or tray-shaped packaging member has a peripheral portion capable of making line or surface contact with the substrate of the device, and includes a copolymerized polyamine system having at least one characteristic Resin: (1) melting point or softening point is 75 ~ 160 ° C; (2) has crystallinity; (3) has crystallinity, and has a melting point of 90 ~ 160 ° C. The packaging device according to claim 1 or 2, wherein the packaging member comprises: a packaging layer comprising a copolymerized polyamide resin, and a protective layer formed on one side of the packaging layer and formed of a heat-resistant resin. The package device according to claim 4, wherein the heat-resistant resin has a melting point or a softening point of 170 ° C or higher, and is at least one selected from the group consisting of a polyester resin, a polyamide resin, and a fluororesin. For example, the packaging device of claim 1 or 2, wherein the thickness of the packaging member is 10 to 1000 μm. A method for manufacturing a packaging device in which a packaged area of the device is packaged with a packaging member, the packaging member does not contain a conductive member, has a film-like or tray-like form, and at least a peripheral portion of the packaging member contains a copolymer Polyamide resin; this copolymerized polyamine resin-based quaternary copolymer is a copolymerized polyamine of quaternary copolymer, and has (c) derived from a compound selected from laurylamine and amine A unit of at least one component of alkanoic acid and aminododecanoic acid; the packaging member and the mounting member of the device are separated from each other inside the packaged area, and the peripheral edge portion of the packaging member is bonded to the substrate of the device to manufacture The packaged area of a device is a method of covering and sealing the device with a packaging component. The method according to claim 7, wherein at least the peripheral portion of the packaging member is a packaging member containing a copolymerized polyamide resin to cover the packaged area of the device, and the peripheral portion of the packaging member and the substrate of the device are thermally bonded and performed. cool down. A packaging member is used for packaging an enclosed area of a device. The packaging member does not contain a conductive member, is formed into a film shape or a tray shape, and a peripheral portion includes a copolymerized polyamine resin. Copolymerized polyamines of amine resin-based binary copolymers to quaternary copolymers, and (c) is derived from at least one selected from laurylamine, aminoundecanoic acid, and aminododecanoic acid. A component unit; the package member includes an internal region for forming a free space that does not adhere to a mounting component of the device, and a peripheral portion capable of adhering to a substrate of the device. The encapsulation member according to claim 9, further comprising a peripheral portion that can be thermally adhered to the substrate of the device, and at least the peripheral portion includes a copolymerized polyamide resin.